Apparatus for manufacturing display device and method of manufacturing display device

Abstract

The present invention relates to an apparatus for manufacturing a display device and a method of manufacturing a display device. The apparatus for manufacturing a display device includes a first stage including a plurality of grid cells each including a display cell including a display area and a pad area and a protection film cell attached to the display cell and including a display film portion corresponding to the display area and a pad film portion corresponding to the pad area, a second stage, and a transfer unit configured to transfer the grid cells from the first stage to the second stage and to peel the pad film portion. The transfer unit includes a main body member, a plurality of pins on a first surface of the main body member in a first direction, a plurality of suction cups on the first surface of the main body member in a second direction, and a reel member on a second surface of the main body member to supply a peeling tape to the first surface.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and interest in Korean Patent Application No. 10-2020-0145780, filed on November 4, 2020, and Korean Patent Application No. 10-2021-0016874, filed on February 5, 2021, the entire contents of each of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments of this disclosure relate to an apparatus for manufacturing a display device and a method for manufacturing the display device. More specifically, one or more embodiments of this disclosure relate to an apparatus for manufacturing a display device that can be used to remove a protective film and a method for manufacturing a display device using the apparatus. Background Technology

[0004] In recent years, various suitable types of panels, such as liquid crystal displays (LCDs), organic light-emitting diodes (OLEDs), and touch screen panels (TSPs), have been used in the field of manufacturing display devices.

[0005] The manufacturing process of a display device is performed while the device is moving through various processing spaces. A protective film is attached to the surface of the display device to prevent it from being contaminated or damaged during this process, and the film can be removed during the process of connecting internal wiring or pads. Therefore, a device for removing the protective film attached to the panel surface is desirable.

[0006] The information disclosed in this background section is intended to enhance understanding of the background of this disclosure, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0007] During the process of peeling off the protective film bonded to the pad area of ​​the display device, peeling off the protective film in grid units can take a lot of time, depending on the comparison peeling method, and defects may occur due to errors in the placement of the grids and variations in the width of the pad portions.

[0008] One or more embodiments of this disclosure relate to an apparatus for manufacturing display devices to reduce processing time.

[0009] One or more embodiments of this disclosure relate to a method of manufacturing a display device.

[0010] According to one or more embodiments of this disclosure, an apparatus for manufacturing a display device includes: a first unit comprising a plurality of grid cells defined by dividing a mother substrate and a working protective film attached to the mother substrate, each grid cell including a display unit and a protective film unit, the display unit including a display area and a pad area, the protective film unit being attached to the display unit and including a display film portion corresponding to the display area and a pad film portion corresponding to the pad area; a second unit for peeling off the pad film portions of the grid cells at the second unit; and a transfer unit configured to transfer the grid cells from the first unit to the second unit and peel off the pad film portions, the transfer unit including: a body member including a first surface and a second surface opposite to the first surface; a plurality of pins located on the first surface of the body member along a first direction; a plurality of suction cups located on the first surface of the body member along a second direction intersecting the first direction; and a reel member located on the second surface of the body member and configured to supply a peeling tape to the first surface of the body member.

[0011] In one embodiment, the pins may be arranged along multiple lines defined in the first direction and may be spaced apart from each other.

[0012] In an embodiment, each of the grid cells may correspond to at least one of the pins.

[0013] In an embodiment, the reel component may include a plurality of reel components, and the plurality of reel components may be arranged along the second direction and may be spaced apart from each other.

[0014] In an embodiment, each of the plurality of reel components may include: a first reel configured to supply the stripping tape; and a second reel facing the first reel and configured to wind up the stripping tape.

[0015] In one embodiment, the suction cup can be configured to adsorb the display film portion.

[0016] In an embodiment, at least two of the plurality of suction cups may be configured to adsorb one of the plurality of grid cells.

[0017] In an embodiment, each of the suction cups may include: a suction portion configured to adsorb a corresponding grid cell among the plurality of grid cells; a buffer portion connected to the suction portion; and a connecting portion connecting the suction portion and the main body member to each other. The suction portion and the buffer portion may include a rubber material.

[0018] In one embodiment, the suction portion may have vacuum suction.

[0019] In an embodiment, each of the pins may include: a contact portion that contacts the stripper tape; a support portion that extends from the contact portion and is located in a hole defined for passing through the body member; and a spring that contacts the contact portion and is located in the support portion.

[0020] In an embodiment, the pin can be configured to descend or ascend vertically concurrently.

[0021] In one embodiment, the device may further include a driver configured to drive the transmission unit.

[0022] In one embodiment, the second unit may include a fixing member configured to fix the grid unit.

[0023] According to one or more embodiments of this disclosure, a method of manufacturing a display device includes: providing a working substrate on a first table, the working substrate including: a mother substrate, the mother substrate including a plurality of display units, each display unit including a display area and a pad area; and a working protective film attached to the mother substrate and including a display film portion corresponding to the display area and a pad film portion corresponding to the pad area; cutting the working substrate to divide the working substrate into a plurality of grid units, each grid unit including one of the plurality of display units and a portion of the working protective film. A protective film unit, corresponding to one of the display units; a transfer unit is used to transfer the grid unit to a second unit, the transfer unit comprising: a main component; a plurality of pins located on a first surface of the main component along a first direction; and a plurality of suction cups located on the first surface of the main component along a second direction intersecting the first direction; a release tape is attached to the pad film portion of the grid unit by vertically lowering the pins; and the pad film portion of the grid unit attached to the release tape is peeled off by raising the transfer unit or the pins.

[0024] In one embodiment, transferring the grid unit to the second platform may include: adsorbing the display film portion of the grid unit using the suction cup; separating the grid unit from the suction cup on the second platform; and placing the grid unit on the second platform.

[0025] In an embodiment, the method may further include: after peeling off the pad film portion of the grid cell attached to the peeling tape, rotating a plurality of reel members to roll up the peeling tape, the plurality of reel members being located on the opposite side of the second surface of the body member relative to the first surface of the body member.

[0026] In an embodiment, each of the reel components may include: a first reel configured to supply the peeling tape; and a second reel facing the first reel and configured to wind up the peeling tape, wherein the first reel can rotate synchronously with the second reel that winds up the peeling tape.

[0027] In one embodiment, cutting the working substrate may include: cutting the working substrate along a first cutting line corresponding to the edge of each of the display units; and cutting the working protective film along a second cutting line corresponding to the boundary between the display area and the pad area of ​​the corresponding display unit.

[0028] In one embodiment, the second unit may include a fixing member for securing the grid unit.

[0029] In one embodiment, the transfer of the grid cell to the second unit and the attachment of the stripping tape to the pad film portion of the grid cell can be performed concurrently.

[0030] According to one or more embodiments of this disclosure, in the process of peeling off the protective film attached to the pad area of ​​a display device, the protective film can be peeled off using a peeling method performed on a substrate-by-substrate basis, instead of a comparative peeling method performed on a grid-by-grid basis. Therefore, processing time can be reduced, and defects that may arise due to errors in grid placement and variations in pad width can be reduced or prevented. Attached Figure Description

[0031] The above and other aspects and features of this disclosure will become clearer from the following detailed description of illustrative, non-limiting exemplary embodiments with reference to the accompanying drawings, in which:

[0032] Figure 1 This is a perspective view showing an apparatus for manufacturing a display device according to an embodiment of the present disclosure;

[0033] Figure 2 It is along Figure 1 A cross-sectional view taken by line aa′, and an apparatus for manufacturing a display device according to an embodiment of the present disclosure;

[0034] Figure 3 It is along Figure 1A cross-sectional view taken by line bb′, and an apparatus for manufacturing a display device according to an embodiment of the present disclosure;

[0035] Figure 4 This is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure;

[0036] Figure 5 This is a view illustrating a process for providing a parent substrate according to an embodiment of the present disclosure;

[0037] Figure 6 This is a plan view illustrating a display unit according to an embodiment of the present disclosure;

[0038] Figure 7 This is an equivalent circuit diagram showing pixels according to embodiments of the present disclosure;

[0039] Figure 8 This is a view showing a working substrate including a mother substrate on which a working protective film is attached, according to an embodiment of the present disclosure;

[0040] Figure 9 It is along Figure 8 A cross-sectional view taken by line II′, and showing a lattice cell according to an embodiment of the present disclosure;

[0041] Figure 10 This is a view illustrating a process of peeling off lattice cells by cutting along a first cutting line according to an embodiment of the present disclosure;

[0042] Figure 11 This is a plan view illustrating a lattice cell defined with a second cutting line according to an embodiment of the present disclosure;

[0043] Figure 12 This is a cross-sectional view showing a lattice cell defined with a second cutting line according to an embodiment of the present disclosure;

[0044] Figures 13-14 This is a side view illustrating the operation of an apparatus for manufacturing a display device according to an embodiment of the present disclosure;

[0045] Figure 15 This is a flowchart illustrating a method for peeling off the pad film portion of a lattice cell according to an embodiment of the present disclosure;

[0046] Figure 16 This is a side view illustrating the operation of an apparatus for manufacturing a display device according to an embodiment of the present disclosure; and

[0047] Figures 17-19 This is a front view illustrating the operation of an apparatus for manufacturing a display device according to an embodiment of the present disclosure. Detailed Implementation

[0048] In the following description, exemplary embodiments will be presented in more detail with reference to the accompanying drawings, in which the same reference numerals throughout refer to the same elements. However, this disclosure may be embodied in various different forms and should not be construed as being limited to the embodiments shown herein. Rather, these embodiments are provided as examples so that this disclosure will be thorough and complete, and will fully convey to those skilled in the art the aspects and features of this disclosure. Therefore, processes, elements, and techniques not essential for a person of ordinary skill in the art to fully understand the aspects and features of this disclosure may not be described. Unless otherwise stated, the same reference numerals denote the same elements throughout the drawings and written description, and therefore, their description need not be repeated.

[0049] When an embodiment can be implemented differently, a particular process sequence can be performed differently than the described sequence. For example, two consecutively described processes can be performed simultaneously or substantially simultaneously, or in the reverse order of the described sequence.

[0050] In the accompanying drawings, for clarity, the relative sizes of elements, layers, and regions may be exaggerated and / or simplified. For ease of interpretation, spatial relative terms such as “below,” “under,” “below,” “below,” “above,” and “above” may be used herein to describe the relationship of one element or feature to another shown in the drawings. It will be understood that, in addition to the orientations depicted in the drawings, the spatial relative terms are intended to cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as “below” or “below” or “below” other elements or features will subsequently be oriented “above” other elements or features. Thus, the example terms “below” and “below” can cover both the orientations of “above” and “below.” The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations) and the spatial relative terms used herein should be interpreted accordingly.

[0051] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the spirit and scope of this disclosure, the first element, first component, first region, first layer, or first part described below may be referred to as a second element, second component, second region, second layer, or second part.

[0052] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it may be directly on, connected to, or coupled to the other element or layer, or one or more intermediary elements or layers may exist. Similarly, when a layer, area, or element is referred to as being "electrically connected" to another layer, area, or element, it may be directly electrically connected to the other layer, area, or element, and / or indirectly electrically connected through one or more intermediary layers, areas, or elements therebetween. Furthermore, it should be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or one or more intermediary elements or layers may exist.

[0053] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting of this disclosure. As used herein, the singular forms “a” and “an” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “comprising,” “including,” and “having” specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. For example, the expression “A and / or B” means A, B, or A and B. Expressions such as “at least one of…” modify the entire list of elements when preceding the list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0054] As used herein, the terms “substantially,” “approximately,” and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for inherent biases in measured or calculated values ​​that will be recognized by one of ordinary skill in the art. Furthermore, the use of “may” in describing embodiments of this disclosure means “one or more embodiments of this disclosure.” As used herein, the term “use” may be considered synonymous with the term “utilize.” Additionally, the term “exemplary” is intended to refer to an example or illustration.

[0055] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms such as those defined in common dictionaries shall be interpreted as having the same meaning as they have in the relevant field and / or the context of this specification, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0056] Figure 1 This is a perspective view showing an apparatus for manufacturing a display device according to an embodiment of the present disclosure. Figure 2 It is along Figure 1 A cross-sectional view taken by line aa′, and an apparatus for manufacturing a display device according to an embodiment of the present disclosure. Figure 3 It is along Figure 1 A cross-sectional view taken by line bb′, and an apparatus for manufacturing a display device according to an embodiment of the present disclosure.

[0057] refer to Figure 1 The equipment for manufacturing the display device includes a first unit 1000, a second unit 2000, and a transmission unit (e.g., a transmission section or transmission device) TR. In this embodiment, the connection between the transmission unit TR and the driver 400 is schematically shown. The transmission unit TR can be connected to the driver 400 via a cable or a wireless communication module (e.g., a wireless communication device) to transmit and / or receive electrical signals together with the driver 400. The driver 400 can be implemented as a general-purpose or special-purpose processor, an integrated circuit (IC), an application-specific integrated circuit (ASIC), one or more field-programmable gate arrays (FPGAs), a set of processing components, or other suitable processing components.

[0058] refer to Figure 1 and Figure 8 Multiple grid cells (e.g., multiple grids or grid areas) CA can be formed in multiple rows and columns on the first unit 1000, each of the multiple grid cells including a pad area PA and a display area AA. The grid cells CA can be formed by cutting a working substrate 110, on which a working protective film 300 is attached. The working substrate 110 can be cut into grid cells CA by a laser process, but this disclosure is not limited thereto. As another example, the working substrate 110 can be cut by a scribing process.

[0059] The pad film portion located at the pad area PA of the grid cell CA (e.g., therein or on it) can be peeled off on the second unit 2000. In this case, the transfer unit TR can peel off the pad film portion of the grid cell CA after transferring the grid cell CA from the first unit 1000 to the second unit 2000 or at the same time as transferring the grid cell CA from the first unit 1000 to the second unit 2000.

[0060] The second unit 2000 may further include fixing members to secure the grid cell CA. For example, the grid cell CA may be secured by a fixing member that is in direct contact with the grid cell CA, or the grid cell CA may be secured by a fixing member for vacuum lifting the grid cell CA. With the second unit 2000 including fixing members, the grid cell CA can be stably secured to the second unit 2000 when the pad film portion of the grid cell CA is peeled off by the transfer unit TR.

[0061] refer to Figures 1 to 3 The transfer unit TR may include a main component BC, multiple pins 20, multiple suction cups 30, and reel components RCA and RCb.

[0062] The main component BC may have a cuboid structure, which has a first surface and a second surface opposite to the first surface.

[0063] Pin 20 may be arranged along a line defined on a first surface of the main body member BC along a first direction DR1. Suction cup 30 may be arranged on the first surface of the main body member BC along a second direction DR2 intersecting the first direction DR1.

[0064] The pins 20 may be arranged on the first surface of the main body member BC along multiple lines defined as being along the first direction DR1, and may be spaced apart from each other.

[0065] Each pin 20 may include a contact portion 21, a support portion 22, and a spring 23. The contact portion 21 may be located at the lowermost position of the pin 20 and contact the stripping tape PT. The support portion 22 may extend from the contact portion 21 and may be inserted into a hole defined to pass through the body member BC. The spring 23, as an elastic body, may be provided in the support portion 22.

[0066] Pin 20 may have a shape that extends in a direction (e.g., a third direction DR3) that is perpendicular or substantially perpendicular to (e.g., vertical or substantially vertical relative to the first direction DR1) the first direction DR1 in which the stripper band PT travels, and may move up or down in the direction of extension (e.g., the vertical direction or the third direction DR3).

[0067] The clamp 10 can be used as a drive source to move the pin 20 vertically upward or downward. For example, the spring 23 can be driven by the clamp 10 to apply a spring force in a direction away from the main body member BC to move the pin 20 vertically downward.

[0068] The clamp 10 may include a main body portion 12 of a spring 23 connected to a pin 20 and a pressing member 11 disposed on a second surface of the main body member BC to protrude outward from the main body portion 12 and to be connected to the main body portion 12.

[0069] Pin 20 may move downward or upward in the vertical direction concurrently or substantially concurrently (e.g., simultaneously or substantially simultaneously), but this disclosure is not limited thereto. In other words, in some embodiments, pin 20 may move downward or upward sequentially in the vertical direction.

[0070] Pin 20 can be moved vertically downwards to allow the release tape PT to adhere to the pad film portion of the grid cell CA. Because pin 20 is positioned on the release tape PT, the pad film portion of the grid cell CA can adhere to the adhesive surface of the release tape PT when pin 20 moves downwards in the vertical direction. In this case, each grid cell CA can be positioned on the first unit 1000 to correspond to at least one of pins 20.

[0071] The suction cup 30 may have a cylindrical shape; however, this disclosure is not limited thereto. As another example, the suction cup 30 may have a polygonal shape.

[0072] The suction cup 30 may include a rubber material. When the suction cup 30 includes a rubber material, damage to the upper surface of the grid cell CA can be prevented or substantially prevented when the suction cup 30 is lifted onto the grid cell CA.

[0073] The suction cup 30 can be connected to a vacuum pump. Therefore, the suction cup 30 can use vacuum suction to pick up and transport the grid unit CA.

[0074] Each suction cup 30 may include a suction portion 31, a buffer portion 32 connected to the suction portion 31, and a connecting portion 33 disposed on the buffer portion 32. The connecting portion 33 connects the buffer portion 32 to the first surface of the main body member BC of the transfer unit TR.

[0075] The suction portion 31 can be the part that directly contacts the lattice cell CA, and the lattice cell CA can be lifted using vacuum suction. The diameter (or width) of the lower part of the suction portion 31 can be larger than the diameter (or width) of the upper part of the suction portion 31.

[0076] The buffer portion 32 may have a bellows shape. Because the buffer portion 32 has a bellows shape, the buffer portion 32 can provide a buffering force (e.g., a predetermined buffering force) in the vertical direction (e.g., a third direction DR3 intersecting the first direction DR1 and the second direction DR2).

[0077] The reel assembly may include a first reel RCa for supplying the stripping tape PT and a second reel RCb for winding (e.g., for rolling up) the stripping tape PT. The first reel RCa and the second reel RCb may be positioned on opposite sides of a line defined on a second surface of the body member BC along a first direction DR1.

[0078] According to an embodiment, the transfer unit TR may include a plurality of reel components. In other words, a plurality of first reels RCa and a plurality of second reels RCb among the plurality of reel components may be positioned on opposite sides of a second surface of the main body member BC to correspond to a plurality of lines defined on the second surface of the main body member BC along a first direction DR1. The reel components are arranged along a second direction DR2 and spaced apart from each other. In this case, in each reel component, the first reel RCa may rotate synchronously with a second reel RCb arranged to face the first reel RCa.

[0079] The stripping tape PT can be supplied from the first spool RCA and can be wound (e.g., rolled up) onto the second spool RCb facing the first spool RCA after passing through the first surface of the body member BC. In other words, the stripping tape PT wound on the first spool RCA can be supplied to the second spool RCb by rotation of the first spool RCA and the second spool RCb.

[0080] Figure 4 This is a flowchart schematically illustrating a method for manufacturing a display device according to an embodiment of the present disclosure. Figure 5 This is a view illustrating the process of providing a mother substrate 100 according to an embodiment of the present disclosure. Figure 6 This is a plan view illustrating a display unit (e.g., a display or display device) 200 according to an embodiment of the present disclosure. Figure 7 This is an equivalent circuit diagram illustrating a pixel PXi according to an embodiment of the present disclosure.

[0081] refer to Figure 4 The method of manufacturing a display device includes: providing a working substrate, including a mother substrate on which a working protective film is attached, to a first stage (S100); dividing the working substrate into grid units (e.g., grids or grid areas) (S200); transferring the grid units to a second stage (S300); and peeling off the pad film portion of the grid units (S400).

[0082] Reference Figures 5 to 7 The process of providing a mother substrate 100 comprising multiple display units (e.g., a display or display device) 200 is described in more detail. Figure 5 As shown, a large-area mother substrate 100 can be prepared.

[0083] refer to Figure 5The display unit 200 can be formed on the parent substrate 100. More specifically, the parent substrate 100 can be a substrate of suitable size on which the display unit 200 can be formed (e.g., therein or on it). The parent substrate 100 can be formed of a glass material or a flexible plastic material. For example, the parent substrate 100 can include a plastic material such as polyimide, but this disclosure is not limited thereto.

[0084] The mother substrate 100 may include an active region 100-1 in which a plurality of display regions are defined, and a non-active region 100-2 corresponding to a portion other than (e.g., in addition to) the active region 100-1. The active region 100-1 of the mother substrate 100 may be a region in which (e.g., in or on) the display unit 200 is formed after some processes (e.g., deposition, patterning, forming a thin film layer, and etching) are completed, and the display units 200 may be formed concurrently (e.g., simultaneously or substantially simultaneously) with each other by the same or substantially the same processes.

[0085] Each display unit 200 may include a display area 210 and a pad area 220. The display units 200 may be arranged on the mother substrate 100 and may be spaced apart from each other.

[0086] In the following text, reference will be made to Figure 6 and Figure 7 A display unit 200 is described in more detail. Figure 6 The arrangement of the multiple lines SGL and multiple pixels PX contained in the display unit 200 is shown when viewed in a plane (e.g., in a plan view or from a view perpendicular to or substantially perpendicular to the top surface of the relevant element or layer (e.g., the top surface of display unit 200)).

[0087] refer to Figure 6 When viewed in a plane (e.g., in a planar view), the display area 210 of the display unit 200 may include a pixel area DA and a peripheral area NDA1. In this embodiment, the peripheral area NDA1 may be defined along the edge of the pixel area DA. In other words, the peripheral area NDA1 may at least partially surround the pixel area DA (e.g., around its periphery).

[0088] The display unit 200 may include a driving circuit GDC, multiple lines SGL, multiple signal pads PD, and multiple pixels PX. Pixels PX may be arranged at pixel region DA (e.g., therein or on it). Each pixel PX may include an organic light-emitting diode (OLED) and pixel driving circuitry connected to the OLED. The driving circuit GDC, lines SGL, and pixel driving circuitry may be included at circuit element layer CL (e.g., therein or on it), which will be described in more detail below (e.g., see reference). Figure 9 ).

[0089] The driving circuit GDC may include a scan driving circuit. The scan driving circuit can generate multiple scan signals and sequentially output these signals to multiple scan lines GL. The scan driving circuit can further output another control signal to the pixel driving circuit of pixel PX.

[0090] The scan driving circuit may include multiple thin-film transistors formed by the same or substantially the same process as the pixel driving circuit of the pixel PX (e.g., such as low-temperature polycrystalline silicon (LTPS) process or low-temperature polycrystalline oxide (LTPO) process).

[0091] The scan line SGL can include scan lines GL, data lines DL, power lines PL, and control signal lines CSL. Each scan line GL can be connected to a corresponding pixel PX in the pixel PX array, and each data line DL can be connected to a corresponding pixel PX in the pixel PX array. The power line PL can be connected to a pixel PX. The control signal line CSL can apply control signals to the scan drive circuit.

[0092] Line SGL can be connected to pixel region DA, peripheral region NDA1, and non-display region NDA2 corresponding to pad region 220 (see, for example, see...). Figure 9 Overlap. Each signal pad PD can be connected to the corresponding line in line SGL.

[0093] The line portion can essentially constitute most line SGLs and can be connected to a pixel PX. The line portion can be connected to a transistor of the pixel PX. The line portion can have a single-layer structure or a multi-layer structure, and the line portion can be provided as a single integral body, or can include two or more portions. The two or more portions can be disposed in different layers from each other (e.g., in or on), and can be connected to each other via contact holes defined to pass through an insulating layer disposed between the two or more portions.

[0094] Figure 7 The diagram shows the i-th pixel PXi in the pixel PX connected to the k-th data line DLk in the data line DL, where i and k are natural numbers greater than 0. The i-th pixel PXi is activated in response to the i-th scan signal Si applied to the i-th scan line GLi.

[0095] The i-th pixel PXi may include a pixel driving circuit for controlling an organic light-emitting diode (OLED). The pixel driving circuit may include seven thin-film transistors T1 to T7 and a capacitor Cst. However, as an example, a pixel driving circuit is provided comprising seven thin-film transistors T1 to T7 (e.g., first thin-film transistor T1, second thin-film transistor T2, third thin-film transistor T3, fourth thin-film transistor T4, fifth thin-film transistor T5, sixth thin-film transistor T6, and seventh thin-film transistor T7) and a capacitor Cst, and various modifications can be made to the pixel driving circuit to include, for example, any suitable number of transistors and any suitable number of capacitors.

[0096] The driving transistor controls the driving current supplied to the organic light-emitting diode (OLED). For example, the second transistor T2 can be a driving transistor. The output electrode of the second transistor T2 can be electrically connected to the OLED. The output electrode of the second transistor T2 can also be connected to the OLED via a sixth transistor T6.

[0097] The sixth transistor T6 is connected between the output electrode of the first transistor T1 and the anode electrode of the organic light-emitting diode (OLED). The control electrode of the sixth transistor T6 can be connected to the i-th light-emitting control line ELi.

[0098] The control electrode of the control transistor can receive control signals. The control signal applied to the i-th pixel PXi may include the (i-1)-th scan signal Si-1 applied to the (i-1)-th scan line GLi-1, the i-th scan signal Si applied to the i-th scan line GLi, the (i+1)-th scan signal Si+1 applied to the (i+1)-th scan line GLi+1, the data signal Dk applied to the k-th data line DLk, and the i-th light emission control signal Ei applied to the i-th light emission control line Eli. According to an embodiment, the control transistor may include a first transistor T1 and third to seventh transistors T3 to T7.

[0099] The first transistor T1 may include a sensing electrode connected to the k-th data line DLk, a control electrode connected to the i-th scan line GLi, and an output electrode connected to the output electrode of the second transistor T2. The first transistor T1 may be turned on in response to a scan signal Si (hereinafter referred to as the i-th scan signal) applied to the i-th scan line GLi, and may apply a data signal Dk applied to the k-th data line DLk to the storage capacitor Cst.

[0100] Figure 8 This is a view showing a working substrate 110 including a mother substrate 100 on which a working protective film 300 is attached, according to an embodiment of the present disclosure. Figure 9 It is along Figure 8A cross-sectional view taken from line II′, and showing the lattice cell CA according to an embodiment of the present disclosure. Figure 8 As shown, after the mother substrate 100 is formed, the working protective film 300 can be attached to the mother substrate 100 to provide the working substrate 110 (S100).

[0101] The working protective film 300 can be attached to the upper portion (e.g., the upper surface) of the mother substrate 100 where the display unit 200 is formed (e.g., therein or on it). Thus, a working substrate 110 can be formed including the mother substrate 100 to which the working protective film 300 is attached. In some embodiments, the working protective film 300 can be attached to the lower portion (e.g., the lower surface) of the mother substrate 100.

[0102] exist Figure 8 The diagram shows a working protective film 300 having a size smaller than the mother substrate 100; however, this disclosure is not limited thereto. For example, the size of the working protective film 300 is not particularly limited, as long as the working protective film 300 can protect the mother substrate 100. For example, the working protective film 300 may have the same or substantially the same size as the mother substrate 100.

[0103] The protective film 300 can prevent or substantially prevent external moisture and / or foreign matter from entering the display unit 200 (e.g., reference). Figure 5 This protective film can prevent or reduce cracking during the manufacturing process of the display device. The protective film 300 may include a flexible material such as a polymer resin.

[0104] The working protective film 300 may include regions that can be respectively connected to the active region 100-1 and the non-active region 100-2 (e.g., reference). Figure 5 The corresponding protective film unit (e.g., protective film portion) 300-1 and the non-active film region 300-C.

[0105] The protective film unit 300-1 may include a display area 210 and a pad area 220 that can be respectively connected to the display unit 200 (e.g., reference). Figure 5 The corresponding display film portion 310 and pad film portion 320. According to one or more embodiments of this disclosure, the pad film portion 320 can be removed during a stripping operation.

[0106] refer to Figure 9 A grid unit (e.g., a grid or a grid area) CA may include a display unit 200 and a protective film unit 300-1 disposed on the display unit 200. In some embodiments, a second protective film unit (e.g., a second protective film portion) may be further disposed below the display unit 200 (e.g., under), and a second adhesive layer may be further disposed between the second protective film unit and the display unit 200.

[0107] The protective film unit 300-1 can be connected to the top layer of the display unit 200 via the adhesive layer ADL (e.g., it can be coupled to it). The top layer of the display unit 200 may have a step difference in some areas.

[0108] The upper surface of the adhesive layer ADL attached to the protective film unit 300-1 can have a stronger adhesive force than the lower surface of the adhesive layer ADL attached to the thin film encapsulation layer TFE. Therefore, the adhesive layer ADL can be easily removed from the display unit 200 during the peeling operation.

[0109] A blank space can be defined between the adhesive layer ADL and the surface of the pad region 220, and this blank space can have a first thickness TH1. Because the display element layer OL may not be deposited at (e.g., where or on) the pad region 220, a step can be created at (e.g., where or on) the pad region 220, thereby forming a blank space with a first thickness TH1 at (e.g., where or on) the pad region 220. At (e.g., where or on) the pad region 220, the adhesive layer ADL and the protective film unit 300-1 can be stacked after patterning the circuit element layer CL to form a line SGL (e.g., reference). Figure 6 ).

[0110] The adhesive layer ADL may have a second thickness TH2 defined by the distance (e.g., minimum distance) from the upper surface of the adhesive layer ADL attached to the protective film unit 300-1 to the lower surface of the adhesive layer ADL attached to the thin film encapsulation layer TFE.

[0111] The second thickness TH2 of the adhesive layer ADL can be in the range of about 50 μm to about 75 μm and the first thickness TH1 can be in the range of about 30 nm to about 70 nm, thereby allowing the flat or substantially flat surface shape of the working protective film 300 to be unaffected by the blank space. For ease of illustration, the first thickness TH1 is shown as exaggerated when compared to the second thickness TH2.

[0112] The lattice unit CA may include a substrate layer BL, a circuit element layer CL, a display element layer OL, a thin film encapsulation layer TFE, an adhesive layer ADL, and a protective film unit 300-1. The circuit element layer CL, the display element layer OL, the thin film encapsulation layer TFE, the adhesive layer ADL, and the protective film unit 300-1 may be disposed on the substrate layer BL. In some embodiments, the lattice unit CA may further include various suitable functional layers, such as an anti-reflective layer and / or a refractive index control layer.

[0113] The substrate layer BL may include a synthetic resin film. This can be incorporated into the parent substrate 100 used to manufacture the display unit 200 (e.g., reference 100). Figure 5 A synthetic resin layer is formed on the substrate. Subsequently, a conductive layer and an insulating layer can be formed on the synthetic resin layer. The synthetic resin layer can be a polyimide resin layer; however, the material of the synthetic resin layer is not particularly limited. Additionally, the substrate layer BL can include a glass substrate, a metal substrate, or an organic / inorganic composite substrate.

[0114] The circuit element layer CL may include at least one intermediate insulating layer and circuit elements. The intermediate insulating layer may include at least one intermediate inorganic layer and at least one intermediate organic layer. The circuit elements may include a drive circuit GDC (e.g., reference...). Figure 6 ), Linear SGL (e.g., reference) Figure 6 ) and pixel driving circuit.

[0115] The circuit element layer CL can be formed by using coating and deposition processes to form an insulating layer, a conductive layer and / or a semiconductor layer, and by using photolithography to pattern the conductive layer and / or the semiconductor layer.

[0116] The display element layer OL may include light-emitting elements. The display element layer OL may include organic light-emitting diodes. The display element layer OL may further include, for example, an organic layer such as a pixel defining layer.

[0117] The thin-film encapsulation layer (TFE) can encapsulate the display element layer (OL). The TFE may include at least one insulating layer. According to an embodiment, the TFE may include at least one inorganic layer (hereinafter referred to as the encapsulation inorganic layer). According to an embodiment, the TFE may include at least one organic layer (hereinafter referred to as the encapsulation organic layer) and at least one encapsulation inorganic layer.

[0118] The encapsulating inorganic layer can protect the display element layer OL from moisture and / or oxygen, and the encapsulating organic layer can protect the display element layer OL from foreign matter such as dust particles. The encapsulating inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but this disclosure is not limited thereto. The encapsulating organic layer may include an acrylic organic layer, but this disclosure is not limited thereto.

[0119] Figure 10 This is a view illustrating the process (S200) of the separated lattice unit CA according to an embodiment of the present disclosure.

[0120] refer to Figure 10 The working substrate 110 may include lattice units CA. In other words, the lattice units CA may be defined as protective film units 300-1 (e.g., reference...). Figure 8The display unit 200 attached thereto (e.g., reference) Figure 5 ).

[0121] In the separation of lattice units CA (S200), the lattice units CA of the working substrate 110 can be cut and separated into multiple individual lattice units CA by the first device CT1. The first device CT1 can cut the lattice units CA along a first cutting line TL formed at the edge of the lattice units CA while moving in a first direction DR1 and a second direction DR2. Therefore, the lattice units CA formed on the working substrate 110 can be separated into multiple individual lattice units CA. As an example, the first device CT1 can irradiate a laser beam to cut the working substrate 110. For example, the first device CT1 may include a laser oscillation unit (e.g., a laser oscillator), a laser optics unit (e.g., a laser optical component), and a laser focusing unit (e.g., a laser concentrator).

[0122] Figure 11 This is a plan view illustrating a lattice cell (e.g., a lattice or lattice region) defined with a second cutting line HC according to an embodiment of the present disclosure.

[0123] The second dicing line HC can be formed along the boundary between the display film portion 310 and the pad film portion 320. The second dicing line HC can be formed using a second device CT2. The second device CT2 can use the same or substantially the same device as the first device CT1. In this case, the cutting depth of the dicing surface can be adjusted by adjusting the intensity of the laser beam. The second dicing line HC can be used as a reference line for the area to be stripped in a subsequent stripping process.

[0124] Figure 12 This is a cross-sectional view showing a lattice cell CA in which a second cutting line HC is defined, according to an embodiment of the present disclosure. For example, Figure 12 It can be along Figure 11 The cross-sectional view taken from line II-II′. Refer to the following text. Figure 12 The second cutting line HC is described in more detail.

[0125] The second cutting line HC can be defined by removing (e.g., completely removing) a portion of the protective film unit 300-1 in the thickness direction, thereby exposing a portion of the adhesive layer ADL disposed between the protective film unit 300-1 and the uppermost layer of the display unit 200 to the outside. The thickness of the adhesive layer ADL remaining in the region defining the second cutting line HC can be in the range of about 25 μm to about 40 μm. If the thickness of the adhesive layer ADL remaining in the region after defining the second cutting line HC is less than about 25 μm, the protective film unit 300-1 can be separated before the peeling process, and as a result, moisture from foreign matter can enter. If the thickness of the adhesive layer ADL remaining in the region after defining the second cutting line HC is greater than about 40 μm, defects may occur in the peeling process due to adhesive force (e.g., due to the adhesive strength of the adhesive layer ADL).

[0126] In some embodiments, a process to weaken the adhesive strength of the edges of the peel target can be performed before proceeding with the peeling operation to reduce the likelihood of peeling operation failure. As an example, the peeling operation may be performed after hitting the edges of the peel target to weaken the adhesive strength of the adhesive layer ADL.

[0127] Figure 13 and Figure 14 This is a side view illustrating the operation of an apparatus for manufacturing a display device according to an embodiment of the present disclosure. In the following, in... Figure 13 and Figure 14 In the middle, it is not necessary to repeat the reference above. Figures 1 to 3 Redundant descriptions of components and layers that are identical or substantially the same.

[0128] refer to Figure 13 According to the driver 400 (e.g., reference...) Figure 1 The transfer unit TR can be installed on the first unit 1000, which includes the grid unit CA. When the transfer unit TR descends, the suction cup 30 can contact the display film portion 310 of the grid unit CA. Thereafter, the suction cup 30 can be driven to have vacuum suction by a vacuum pump connected to it. Therefore, the grid unit CA can be adsorbed (or lifted) onto the suction cup 30 by vacuum suction.

[0129] However, the actuation of the suction cup 30 is not limited to this. As another example, the suction cup 30 can be actuated to have vacuum suction before contacting the lattice cell CA, and the lattice cell CA can be adsorbed (or picked up) onto the suction cup 30.

[0130] According to an embodiment, at least two suction cups 30 can be disposed on a grid unit CA. Although Figure 13 and Figure 14The diagram shows a structure in which two suction cups 30 are disposed on a grid cell CA, but this disclosure is not limited thereto.

[0131] refer to Figure 14 As the conveyor TR rises, the grid unit CA, attached to the suction cup 30, can be lifted from the first unit 1000. Thereafter, the grid unit CA can be conveyed to and set in the second unit 2000 (e.g., reference...). Figure 1 )superior.

[0132] When the grid cell CA is attached to the chuck 30, the pin 20 can be lowered vertically to allow the release tape PT to adhere to the pad film portion 320 of the grid cell CA. For example, the grid cell CA is transferred to a second unit 2000 (e.g., reference...). Figure 1 The application of the stripping tape PT to the pad film portion 320 of the grid cell CA can be performed concurrently (e.g., simultaneously or substantially simultaneously), but this disclosure is not limited thereto. In other words, pin 20 can be vertically lowered so that the grid cell CA can be transferred to a second unit 2000 (e.g., reference 2000). Figure 1 After that, the stripping tape PT is attached to the pad film portion 320 of the grid cell CA.

[0133] When transmitting the lattice cell CA to the second 2000 (e.g., reference...), Figure 1 In the process of peeling off the pad film portion 320 of the grid cell CA by the stripping tape PT, the pad film portion 320 of the grid cell CA can be peeled off while being transferred to the second machine 2000, and thus, its processing time can be shortened.

[0134] In the following text, reference will be made to Figures 5 to 19 The peeling of the pad film portion 320 of the lattice cell CA according to the embodiment is described in more detail (S400).

[0135] Figure 15 This is a flowchart illustrating a method for stripping the pad film portion 320 of a lattice unit CA according to an embodiment of the present disclosure. Figure 16 This is a side view illustrating the operation of an apparatus for manufacturing a display device according to an embodiment of the present disclosure. Figures 17 to 19 This is a front view illustrating the operation of an apparatus for manufacturing a display device according to an embodiment of the present disclosure. Figures 15 to 19 In the middle, it is not necessary to repeat the reference above. Figures 1 to 3 Redundant descriptions of components and layers that are identical or substantially the same.

[0136] Figure 16 This is a side view showing the drive of the transfer unit TR on the second unit 2000 at the start of the stripping operation of the pad film portion 320 of the grid cell CA when viewed in the first direction DR1. Figures 17 to 19 This is a front view showing the drive of the transfer unit TR on the second 2000 during the stripping operation of the pad film portion 320 of the grid cell CA when viewed in the second direction DR2.

[0137] refer to Figure 15 The peeling operation (S400) of the pad film portion 320 of the grid cell CA may include: vertically lowering the pin 20 so that the peeling tape PT is attached to the pad film portion 320 of the grid cell CA (S401); raising the transfer unit TR or the pin 20 so that the pad film portion 320 of the grid cell CA is peeled off (S402); and rotating the reel member so that the peeling tape PT attached to the peeled pad film portion 320 of the grid cell CA is rolled up (e.g., wound) (S403).

[0138] refer to Figure 16 The transmission unit TR can be driven by a driver 400 (e.g., reference). Figure 1 The driver transmits the lattice cell CA to the second 2000.

[0139] According to an embodiment, transmitting the lattice cell CA to the second unit 2000 may further include transmitting it via the first unit 1000 (e.g., reference 1000). Figure 13 The suction cup 30 on the grid unit CA is used to adsorb (or pick up) the display film portion 310 of the grid unit CA, and to separate the grid unit CA from the suction cup 30 so as to place the grid unit CA on the second unit 2000.

[0140] refer to Figure 16 and Figure 17 After the grid cell CA is set on the second 2000, pin 20 can be lowered vertically to allow the stripping tape PT to adhere to the pad film portion 320 of the grid cell CA.

[0141] refer to Figure 17 and Figure 18 After the stripper tape PT is attached to the pad film portion 320 of the grid cell CA, the transfer unit TR can rise to strip the pad film portion 320 of the grid cell CA attached to the stripper tape PT.

[0142] Figure 18 The illustration shows a stripping operation of the pad film portion 320 of the grid cell CA by the rising of the transfer unit TR; however, the stripping operation of the pad film portion 320 is not limited to this. According to an embodiment, the pin 20 may move vertically upward before the transfer unit TR rises to strip the pad film portion 320 of the grid cell CA, or the transfer unit TR may rise after the pad film portion 320 of the grid cell CA has been stripped.

[0143] According to an embodiment, after the stripping operation of the pad film portion 320 of the grid cell CA, the first spool RCa and the second spool RCb can be rotated to roll up (e.g., wind) the stripping tape PT on which the pad film portion 320 of the grid cell CA is attached.

[0144] refer to Figure 18 and Figure 19 After the stripping tape PT attached to the pad film portion 320 of the grid unit CA is rolled up due to the rotation of the first reel RCa and the second reel RCb, the transfer unit TR can move to the first unit 1000 again and the above method can be repeated.

[0145] According to one or more embodiments of this disclosure, the stripping operation can be performed on a per-substrate basis 100. In other words, the stripping operation can be performed concurrently on multiple grid cells CA, rather than on one grid cell CA at a time. Therefore, the reliability of the display device can be improved because defects caused by errors in grid placement and variations in pad width, which may occur in comparative stripping methods performed on a per-grid basis, can be prevented or reduced.

[0146] Furthermore, since the stripping process is performed on a substrate-by-substrate basis, the manufacturing process can be simplified, and thus, manufacturing time can be reduced. In comparative stripping methods, the stripping process is performed on a grid-by-grid basis to peel off the protective film attached to the pad areas of the display device. As a result, peeling off the protective film can take a long time, which may lead to a deterioration in its productivity and efficiency. However, according to one or more embodiments of this disclosure, a substrate can be formed regardless of the size and / or number of grids, and the protective film attached to each grid cell can be peeled off concurrently (e.g., simultaneously or substantially simultaneously) on a substrate-by-substrate basis. Therefore, processing time can be reduced, and the productivity and efficiency of the method for manufacturing the display device can be improved.

[0147] Although exemplary embodiments have been described, it will be readily understood by those skilled in the art that various modifications can be made to the exemplary embodiments without departing from the spirit and scope of this disclosure. It will be understood that the description of features or aspects in each embodiment should generally be considered as applicable to other similar features or aspects in other embodiments, unless otherwise described. Therefore, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in connection with particular embodiments can be used alone or in combination with features, characteristics, and / or elements described in connection with other embodiments, unless specifically indicated otherwise. Accordingly, it should be understood that the foregoing is a description of various exemplary embodiments and should not be construed as limiting to the specific exemplary embodiments disclosed herein, and various modifications to the disclosed exemplary embodiments and other exemplary embodiments are intended to be included within the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An apparatus for manufacturing a display device, wherein the apparatus comprises: The first unit comprises a plurality of lattice units defined by dividing a mother substrate and a working protective film attached to the mother substrate, each of the lattice units comprising: A display unit, the display unit including a display area and a pad area; and A protective film unit is attached to the display unit and includes a display film portion corresponding to the display area and a pad film portion corresponding to the pad area. The second unit, at the second unit, peels off the pad film portion of the grid cell; and A transfer unit configured to transfer the grid cell from the first unit to the second unit and to peel off the pad film portion, the transfer unit comprising: A main component, the main component including a first surface and a second surface opposite to the first surface; Multiple pins, the multiple pins being located on the first surface of the main body member along a first direction; A plurality of suction cups, the plurality of suction cups being located on the first surface of the main body member along a second direction intersecting the first direction; and A reel member located on the second surface of the body member and configured to supply a peeling tape to the first surface of the body member.

2. The device of claim 1, wherein each of the grid cells corresponds to at least one of the pins.

3. The device of claim 1, wherein the reel member comprises a plurality of reel members, and the plurality of reel members are arranged along the second direction and spaced apart from each other.

4. The device of claim 3, wherein each of the plurality of reel components comprises: A first reel, configured to supply the peeling tape; as well as A second reel, facing the first reel and configured to wind up the stripping tape.

5. The device according to claim 1, wherein the suction cup is configured to adsorb the display film portion.

6. The device of claim 1, wherein each of the suction cups comprises: The suction portion is configured to adsorb a corresponding grid unit among the plurality of grid units; A buffer portion, which is connected to the suction portion; as well as The connecting portion connects the suction portion and the main body component to each other, wherein the suction portion and the buffer portion comprise rubber material.

7. The device of claim 1, wherein each of the pins comprises: The contact portion is in contact with the peeling strip; A support portion that extends from the contact portion and is located in a hole defined for passing through the body member; as well as A spring that contacts the contact portion and is located within the support portion.

8. A method of manufacturing a display device, wherein the method comprises: A working base is provided on the first machine, the working base comprising: A mother substrate, the mother substrate including a plurality of display units, each display unit including a display area and a pad area; and A working protective film is attached to the mother substrate and includes a display film portion corresponding to the display area and a pad film portion corresponding to the pad area; The working substrate is cut to divide it into multiple grid units. Each grid unit includes one of the multiple display units and a protective film unit of the working protective film, with the protective film unit corresponding to the one display unit. The grid unit is transferred to a second unit using a transfer unit, the transfer unit comprising: Main components; Multiple pins, the multiple pins being located on a first surface of the main body member along a first direction; and Multiple suction cups are located on the first surface of the main body component along a second direction intersecting the first direction; The stripping tape is attached to the pad film portion of the grid cell by vertically lowering the pin; and The pad film portion of the grid cell attached to the stripping tape is peeled off by raising the transfer unit or the pin.

9. The method of claim 8, wherein the method further comprises: After the pad film portion of the grid cell attached to the stripping tape is peeled off, a plurality of spool members are rotated to roll up the stripping tape, the plurality of spool members being located on the opposite side of the second surface of the body member, which is opposite to the first surface of the body member.

10. The method of claim 9, wherein each of the reel components comprises: A first reel, configured to supply the peeling tape; as well as A second reel, facing the first reel, is configured to wind up the peeling tape, and The first reel rotates synchronously with the second reel that rolls up the stripping tape.

Images