Chip pick-and-place transfer apparatus and method for positioning a chip placed thereby

Abstract

The present application provides a chip pick-and-place transfer device and a chip positioning method thereof. The chip pick-and-place transfer device comprises a pick-and-place transfer device, a chip setting device and an image capturing device connected with a control device. The pick-and-place transfer device comprises at least one chip setting area and at least one mark, and the at least one chip setting area comprises a texture. When the pick-and-place transfer device is located at an initial or pre-arrangement position, the image capturing device captures and transmits at least one initial image, at least one mark image and at least one pre-arrangement image of the at least one chip setting area to the control device. The control device obtains the position information of the chip setting area according to the images, and judges whether the initial image and the pre-arrangement image are consistent. When the initial image and the pre-arrangement image are consistent, the control device controls the chip setting device to set the chip in the at least one chip setting area. In this way, the errors of the pick-and-place transfer device and the chip setting device caused by temperature changes are avoided, and the quality and yield of electronic products are improved.

Description

Technical Field

[0001] This invention relates to a chip pick-and-place transfer device and a chip placement positioning method, particularly a chip pick-and-place transfer device and a chip placement positioning method that can reduce thermodynamic errors. Background Technology

[0002] With the advancement of technology, semiconductor electronic products have been widely used in all aspects of society and life, becoming an indispensable part of modern life.

[0003] In semiconductor wafer-level packaging processes, the wafer must be diced into multiple chips, and then the better-quality chips are selected and reconfigured onto a substrate for subsequent processing. However, during the chip reconfiguration process, due to the high precision required by subsequent processing steps, there are extremely strict requirements for the accuracy of chip placement and arrangement, generally requiring errors to be controlled to below micrometers, or even smaller.

[0004] In order to ensure high precision in chip placement, conventional chip placement equipment uses an image capture device to capture the state of the robotic arm after placing the calibration chip before chip placement. This is to record and correct the positional error of the chip on each substrate to be placed. The average error is obtained by taking the picture several times and then using the average error to compensate for the relative position of the chip and the substrate during actual chip placement.

[0005] However, after repeated die placement processes, conventional die placement equipment will experience deviations in the movement of the robotic arm and the pick-and-place transfer device. This results in the robotic arm placing the chip in a different position than in previous placements, leading to thermal errors and significantly reducing the quality and yield of semiconductor electronic products.

[0006] Furthermore, conventional die placement equipment uses a robotic arm to pick up a chip and place it in a position selected by a control device. This assembly method, which can only place one chip at a time, not only takes a lot of time but also increases assembly time costs, resulting in very limited efficiency. Summary of the Invention

[0007] The main objective of this invention is to provide a chip pick-and-place transfer device and a chip placement positioning method thereof, which can avoid thermal errors generated during repeated chip placement, make the chip placement position more accurate, and significantly improve the quality and yield of semiconductor electronic products.

[0008] Another objective of this invention is to provide a chip pick-and-place transfer device and a chip placement positioning method thereof, which can pick up multiple chips at once, saving assembly time and costs and improving production efficiency.

[0009] To achieve the aforementioned objectives, the present invention will provide a chip pick-and-place transfer device, including a control device, a pick-and-place transfer device, a chip placement device, and an image capturing device.

[0010] The pick-and-place transfer device is connected to the control device and includes at least one chip placement area and at least one mark, wherein the at least one chip placement area includes a texture.

[0011] The crystal placement device is connected to the control device.

[0012] The image capturing device is connected to the control device.

[0013] When the pick-and-place transfer device is in an initial position, the image capturing device captures at least an initial image of at least one chip placement area and at least one marker image of at least one marker in the pick-and-place transfer device at the initial position, and transmits them to the control device. The control device obtains the position information of at least one chip placement area based on the at least one initial image and at least one marker image.

[0014] When the pick-and-place transfer device moves to a pre-arranged position, the image capturing device captures at least one pre-arranged image of at least one chip placement area of ​​the pick-and-place transfer device at the pre-arranged position, and transmits the at least one pre-arranged image to the control device, and the control device determines whether the at least one initial image matches the at least one pre-arranged image.

[0015] When at least one initial image matches at least one pre-arranged image, the control device controls the crystal placement device to place a chip in the at least one chip placement area based on the position information of the at least one chip placement area.

[0016] Wherein, when the at least one initial image and the at least one pre-arranged image do not match, the control device obtains position information of an error value based on the at least one initial image and the at least one pre-arranged image, and the control device controls the pick-and-place transfer device to move to a position that matches the at least one initial image based on the position information of the error value.

[0017] In one embodiment of the present invention, the texture is the material texture of the pick-and-place transfer device.

[0018] In one embodiment of the present invention, the pick-and-place transfer device includes multiple chip placement areas, and the textures of the chip placement areas are all different.

[0019] In one embodiment of the present invention, the material of the pick-up and transfer device is rubber or polymer.

[0020] In one embodiment of the present invention, at least one chip placement area includes at least one suction hole for picking up at least one chip.

[0021] In one embodiment of the present invention, at least one chip placement area includes an adhesive surface for attaching at least one chip.

[0022] In one embodiment of the present invention, at least one chip placement area includes at least one suction hole and an adhesive surface. The at least one suction hole is formed on the adhesive surface and is used to pick up at least one chip, while the adhesive surface is used to adhere at least one chip.

[0023] In one embodiment of the present invention, the pick-and-place transfer device further includes at least one body and a connecting structure, wherein at least one body is disposed on the connecting structure, at least one chip placement area is disposed on at least one body, and at least one marker is disposed on the connecting structure.

[0024] To achieve the aforementioned objectives, the present invention provides a method for positioning a placed chip in a chip pick-and-place transfer device, comprising the following steps:

[0025] A pick-and-place transfer device is located at an initial position, and an image capturing device captures at least an initial image of at least one chip placement area and at least one marker image of at least one marker of the pick-and-place transfer device at the initial position, wherein the at least one chip placement area includes a texture.

[0026] The image capturing device transmits at least one initial image and at least one marker image to a control device.

[0027] The control device obtains the position information of at least one chip placement area based on at least one initial image and at least one marker image.

[0028] The pick-and-place transfer device moves to a pre-arranged position, and the image capturing device captures at least one pre-arranged image of at least one chip placement area of ​​the pick-and-place transfer device at the pre-arranged position.

[0029] The image capturing device transmits at least one pre-arranged image to the control device.

[0030] The control device determines whether at least one initial image and at least one pre-arranged image match.

[0031] When at least one initial image and at least one pre-arranged image match, the control device controls a chip placement device to place a chip in the at least one chip placement area based on the position information of the at least one chip placement area.

[0032] In one embodiment of the present invention, the control device obtains the position information of at least one chip placement area based on at least one initial image and at least one marker image, including: the control device records the relative position between at least one chip placement area and at least one marker based on at least one initial image and at least one marker image to obtain the position information of at least one chip placement area.

[0033] In one embodiment of the present invention, after the control device determines whether at least one initial image and at least one pre-arranged image are consistent, the positioning method further includes: when at least one initial image and at least one pre-arranged image are inconsistent, the control device obtains position information of an error value based on at least one initial image and at least one pre-arranged image, and the control device controls the pick-and-place transfer device to move to a position consistent with at least one initial image based on the position information of the error value.

[0034] The advantage of this invention is that by capturing at least one initial image and at least one marker image of the pick-and-place transfer device at the initial position, and at least one pre-arranged image of the pick-and-place transfer device at the pre-arranged position, the image capturing device captures at least one initial image and at least one pre-arranged image, and the control device determines whether the at least one initial image and the at least one pre-arranged image match, so that the die placement device can be more accurate when placing at least one chip in at least one chip placement area, avoiding thermal errors generated during repeated die placement, and greatly improving the quality and yield of semiconductor electronic products.

[0035] Furthermore, by using a pick-and-place transfer device to pick up multiple chips at once, assembly time and costs can be saved, and production efficiency can be improved. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the chip pick-and-place transfer device according to the first embodiment of the present invention.

[0037] Figure 2 This is a block diagram of the chip pick-and-place transfer device according to the first embodiment of the present invention.

[0038] Figure 3 This is a perspective view of the chip pick-and-place transfer device of the first embodiment of the present invention.

[0039] Figure 4a This is a front view of the pick-and-place transfer device of the chip pick-and-place transfer apparatus according to the first embodiment of the present invention.

[0040] Figure 4b This is a front view of the pick-and-place transfer device of a chip pick-and-place transfer apparatus according to another embodiment of the present invention.

[0041] Figure 5 This is a schematic diagram of the image capturing device of the chip pick-and-place transfer device according to the first embodiment of the present invention.

[0042] Figure 6 This is a schematic diagram of the chip placement device of the chip pick-and-place transfer apparatus according to the first embodiment of the present invention.

[0043] Figure 7 This is a schematic diagram of the chip pick-and-place transfer device of the first embodiment of the present invention moving to the chip placement position.

[0044] Figure 8 This is a schematic diagram of the die bonding process of the chip pick-and-place transfer device according to the first embodiment of the present invention.

[0045] Figure 9 This is a perspective view of the pick-and-place transfer device of the chip pick-and-place transfer apparatus according to the second embodiment of the present invention.

[0046] Figure 10 This is a side view of the pick-and-place transfer device of the chip pick-and-place transfer apparatus according to the second embodiment of the present invention.

[0047] Figure 11 This is a perspective view of the chip pick-and-place transfer device of the fourth embodiment of the present invention.

[0048] Figure 12 This is a perspective view of the chip pick-and-place transfer device of the fifth embodiment of the present invention.

[0049] Figure 13 This is a block diagram of the chip pick-and-place transfer device according to the fifth embodiment of the present invention.

[0050] Figure 14 This is a flowchart of the chip placement and positioning method of the chip pick-and-place transfer device of the present invention.

[0051] Figure 15 This is a flowchart of sub-step S301 of step S3 in the chip placement positioning method of the chip pick-and-place transfer device of the present invention.

[0052] Explanation of reference numerals in the attached figures: 10, 10A, 10B, 10C - Pick-and-place transfer device; 11 - Body; 111 - Chip placement area; 112 - Suction hole; 12 - Marker; 13 - Frame; 14 - Texture; 15 - Adhesive surface; 20 - Crystal placement device; 30 - Image capturing device; 31 - Initial image; 32 - Marked image; 33 - Pre-arranged image; 40 - Control device; 41 - Position information; 42 - Position information of error value; 50 - Moving device; 60 - Alignment image capturing device; 910 - Chip; 920 - Substrate; H - Step. Detailed Implementation

[0053] The following description, in conjunction with the accompanying drawings and component symbols, provides a more detailed account of the embodiments of the present invention, enabling those skilled in the art to implement them after studying this specification.

[0054] This invention addresses the problem of thermomechanical errors that occur during repeated chip placement by providing a chip pick-and-place transfer device and a chip placement positioning method.

[0055] Figure 1 This is a schematic diagram of the chip pick-and-place transfer device according to the first embodiment of the present invention. Figure 2This is a block diagram of the chip pick-and-place transfer device according to the first embodiment of the present invention. Figure 1 and Figure 2 As shown, the present invention provides a chip pick-and-place transfer device, including a pick-and-place transfer device 10, a chip placement device 20, an image capturing device 30, and a control device 40. The following is a detailed explanation of each component.

[0056] Figure 3 This is a perspective view of the pick-and-place transfer device 10 of the chip pick-and-place transfer apparatus according to the first embodiment of the present invention; Figure 4a This is a front view of the pick-and-place transfer device 10 of the chip pick-and-place transfer apparatus according to the first embodiment of the present invention. Figure 3 and Figure 4a As shown, in the first embodiment of the present invention, the pick-and-place transfer device 10 includes a plurality of chip placement areas 111 and at least one mark 12; the plurality of chip placement areas 111 include at least one suction hole 112 and a texture 14, and the textures 14 in the plurality of chip placement areas 111 are all different.

[0057] Specifically, when at least one chip 910 is disposed in at least one chip placement area 111 or multiple chip placement areas 111, at least one suction hole 112 in the chip placement area 111 will pick up and fix the chip 910 to prevent the chip 910 from falling out. One chip placement area 111 can pick up more than one chip 910; however, the picking method is not limited to this, and multiple chip placement areas 111 can also pick up one chip 910 together.

[0058] Preferably, the pick-and-place transfer device 10 of the present invention includes a plurality of suction holes 112, which are arranged at equal distances from each other. However, the arrangement of the plurality of suction holes 112 is not limited to this, and the plurality of suction holes 112 can be arranged in a circular, elliptical or triangular manner as required.

[0059] Preferably, the texture 14 is the material texture of the pick-and-place transfer device 10; specifically, the pick-and-place transfer device 10 of the present invention is made of rubber or polymer material. When the rubber or polymer material pick-and-place transfer device 10 is formed, the texture of the material itself will be formed on the pick-and-place transfer device 10; wherein, the material texture is an unspecified texture, so the texture 14 in each chip placement area 111 is a unique feature and will not be repeated. The material of the pick-and-place transfer device 10 of the present invention is not limited to rubber or polymer material and can be adjusted and changed according to requirements.

[0060] Figure 4b This is a front view of the pick-and-place transfer device of a chip pick-and-place transfer apparatus according to another embodiment of the present invention. Figure 4bAs shown, the difference between this and the first embodiment of the present invention is that the texture 14 in the chip placement area 111 of the first embodiment of the present invention is different from the texture 14 in the chip placement area 111 of the other embodiment of the present invention; in other words, since the pick-and-place transfer device 10 is made of rubber or polymer material, even with the same shape and structure, the texture 14 in the multiple chip placement areas 111 on the pick-and-place transfer device 10 is still independent and different.

[0061] Preferably, the mark 12 of the present invention is cross-shaped and is disposed on the bottom surface of the pick-and-place transfer device 10. However, the shape of the mark 12 is not limited to this, and can be changed to other shapes such as circles, ovals or triangles as needed.

[0062] Preferably, the present invention has three markings 12, which are located at the three corners of the bottom surface of the pick-and-place transfer device 10. However, the location of the markings 12 is not limited to this. The markings 12 can be placed in one corner, two corners or distributed in four corners of the bottom surface of the pick-and-place transfer device 10 as needed to achieve better identification.

[0063] Please refer to Figure 1 and Figure 2 In the first embodiment of the present invention, the control device 40 is connected to the pick-and-place transfer device 10, the chip placement device 20, and the image capturing device 30; the control device 40 controls the chip placement device 20 to pick up and place at least one chip 910 in the at least one chip placement area 111 of the pick-and-place transfer device 10. Preferably, the chip placement device 20 is a suction-type robotic arm or a suction nozzle mechanism.

[0064] The image capturing device 30 is used to capture multiple images of multiple chip placement areas 111 of the pick-and-place transfer device 10, and to capture an image of at least one marker 12, and transmit the images to the control device 40. Specifically, when the pick-and-place transfer device 10 is in an initial position, the image capturing device 30 captures multiple initial images 31 of multiple chip placement areas 111 of the pick-and-place transfer device 10 in the initial position and at least one marker image 32 of at least one marker 12, and transmits them to the control device 40. Preferably, the image capturing device 30 is a camera configured with a charge-coupled device (CCD).

[0065] The control device 40 obtains position information 41 of multiple chip placement areas 111 based on multiple initial images 31 and at least one marker image 32. The control device 40 controls the chip placement device 20 to place at least one chip 910 in the multiple chip placement areas 111 based on the position information 41 of the multiple chip placement areas 111.

[0066] The chip pick-and-place transfer device of the present invention further includes a moving device 50; the moving device 50 is connected to the control device 40, and the moving device 50 is used to drive the pick-and-place transfer device 10 to move between an initial position, a pre-arrangement position and a chip placement position.

[0067] Please refer to Figure 2 and Figure 5 , Figure 5 This is a schematic diagram of the image capturing device 30 capturing image 31 in the chip pick-and-place transfer device according to the first embodiment of the present invention. When the pick-and-place transfer device 10 is in the initial position, the image capturing device 30 captures multiple initial images 31 of multiple chip placement areas 111 of the pick-and-place transfer device 10 in the initial position, and transmits the multiple initial images 31 to the control device 40. The image capturing device 30 also captures at least one marker image 32 of at least one marker 12 on the pick-and-place transfer device 10 in the initial position, and transmits the at least one marker image 32 to the control device 40. The control device 40 obtains position information 41 of the multiple chip placement areas 111 based on the relative positions between the multiple chip placement areas 111 and the at least one marker 12.

[0068] Please refer to Figure 2 and Figure 6 , Figure 6 This is a schematic diagram of the chip placement device 20 of the chip pick-and-place transfer device according to the first embodiment of the present invention, which places the chip 910. When the pick-and-place transfer device 10 moves to the pre-arrangement position, the image capturing device 30 captures multiple pre-arranged images 33 of multiple chip placement areas 111 of the pick-and-place transfer device 10 at the pre-arrangement position, and transmits the multiple pre-arranged images 33 to the control device 40.

[0069] The control device 40 determines whether the multiple initial images 31 and the multiple pre-arranged images 33 match.

[0070] When multiple initial images 31 match multiple pre-arranged images 33, the control device 40 controls the crystal placement device 20 to place at least one chip 910 in at least one chip placement area 111 based on the position information 41 of at least one chip placement area 111.

[0071] When chip 910 is placed in at least one chip placement area 111, at least one suction hole 112 in the at least one chip placement area 111 will pick up and fix at least one chip 910 to prevent chip 910 from falling.

[0072] However, the setting method is not limited to this. If the size of the chip 910 is large, the chip placement device 20 will place the chip 910 in multiple chip placement areas 111 at one time, so that the suction holes 112 in the multiple chip placement areas 111 can pick up and fix the chip 910, thereby preventing the chip 910 from falling off.

[0073] Please refer to Figure 2 and Figure 7 , Figure 7 This is a schematic diagram showing the chip pick-and-place transfer device 10 of the chip pick-and-place transfer apparatus according to the first embodiment of the present invention being moved to the chip placement position. After at least one chip 910 or more chips 910 are placed in at least one chip placement area 111 or more chip placement areas 111, the control device 40 controls the moving device 50 to move the pick-and-place transfer device 10 from the pre-arranged position (i.e., Figure 7 The device (indicated by the dashed box in the middle) is moved to the die placement position so that the pick-and-place transfer device 10 is positioned above the substrate 920 for die bonding operations.

[0074] In the first embodiment of the present invention, a alignment image capturing device 60 may be further included. The alignment image capturing device 60 is electrically connected to the control device 40. The alignment image capturing device 60 is used to capture images (not shown) of the pick-and-place transfer device 10 and the substrate 920 that have moved to the placement position, and transmits the images of the pick-and-place transfer device 10 and the substrate 920 to the control device 40. The control device 40 obtains alignment position information (not shown) based on the images of the pick-and-place transfer device 10 and the substrate 920. The control device 40 controls the moving device 50 to align the pick-and-place transfer device 10 and the substrate 920 based on the alignment position information. However, the alignment method of the pick-and-place transfer device 10 and the substrate 920 is not limited to this. The designer can change the alignment method according to the requirements.

[0075] Please refer to Figure 2 and Figure 8 , Figure 8 This is a schematic diagram of the die bonding process of the chip pick-and-place transfer device according to the first embodiment of the present invention. After the pick-and-place transfer device 10 is aligned with the substrate 920, the control device 40 controls the moving device 50 to drive the pick-and-place transfer device 10 to place at least one chip 910 or more chips 910 on the substrate 920 for subsequent die bonding operations. The process performed by the pick-and-place transfer device 10 when moving to the die placement position is not limited to this; it can be changed to other processes of the die bonding operation as needed to perform die bonding.

[0076] It is worth mentioning that after the pick-and-place transfer device 10 places at least one chip 910 or multiple chips 910 on the substrate 920, the control device 40 controls the moving device 50 to drive the pick-and-place transfer device 10 back to the pre-arrangement position. When the pick-and-place transfer device 10 moves to the pre-arrangement position, the image capturing device 30 re-captures multiple pre-arranged images 33 of the multiple chip placement areas 111 of the pick-and-place transfer device 10 and transmits them to the control device 40. The control device 40 then re-determines whether the multiple initial images 31 and the multiple pre-arranged images 33 match. When it is determined that the multiple initial images 31 and the multiple pre-arranged images 33 match, the control device 40 controls the chip placement device 20 to place at least one chip 910 in the multiple chip placement areas 111.

[0077] When multiple initial images 31 do not match multiple pre-arranged images 33, the control device 40 obtains a position information 42 of an error value based on the multiple initial images 31 and multiple pre-arranged images 33. Based on the position information 42 of the error value, the control device 40 controls the moving device 50 to drive the pick-and-place transfer device 10 to move to a position that matches the multiple initial images 31, and then controls the crystal placement device 20 to place at least one chip 910 in the multiple chip placement areas 111.

[0078] Therefore, the chip pick-and-place transfer device of the present invention can avoid the problem of thermal error during multiple repeated chip placement processes, making the placement position of the chip 910 more accurate each time, and significantly improving the quality and yield of semiconductor electronic products. The thermal error refers to the error caused by temperature rise in the pick-and-place transfer device 10 and the chip placement device 20 during multiple repeated chip placement processes. When the temperature rises, the pick-and-place transfer device 10 and the chip placement device 20 will experience thermal expansion and contraction due to temperature differences, thus generating thermal error during movement, resulting in different chip 910 placement positions each time.

[0079] Figure 9 This is a perspective view of the pick-and-place transfer device 10A of the chip pick-and-place transfer apparatus according to the second embodiment of the present invention. Figure 9 As shown, in the second embodiment of the present invention, the difference from the first embodiment is that the pick-and-place transfer device 10A further includes at least one body 11 and a connecting structure 13; the connecting structure is a frame; at least one body 11 is disposed in the connecting structure 13, a plurality of chip placement areas 111 are disposed in at least one body 11, and at least one mark 12 is disposed in the connecting structure 13 or at least one body 11.

[0080] Since most of the known bodies 11 are made of rubber or polymer materials, it is relatively difficult to process the marking 12. Therefore, to facilitate the setting of the marking 12, at least one body 11 can be further disposed in the connecting structure 13, and the marking 12 can be disposed in the connecting structure 13. Preferably, the connecting structure 13 is an easily machinable metal structure such as aluminum, aluminum alloy, or steel, which facilitates the setting of the marking 12 on the connecting structure 13. Preferably, the texture 14 is the material texture of at least one body 11.

[0081] In the second embodiment of the present invention, the number of bodies 11 is one. However, the number of bodies 11 is not limited to this. The number of bodies 11 can be increased as needed, and multiple bodies 11 can be arranged in the connection structure 13.

[0082] Figure 10 This is a side view of the pick-and-place transfer device 10A of the chip pick-and-place transfer apparatus according to the second embodiment of the present invention. Figure 10 As shown, in the second embodiment of the present invention, at least one body 11 protrudes from the connecting structure 13, such that there is a difference H between the bottom surface of the at least one body 11 and the bottom surface of the connecting structure 13.

[0083] The step height H is used to prevent the connection structure 13 from directly touching the substrate 920.

[0084] However, the arrangement of at least one body 11 is not limited to this; the bottom surface of at least one body 11 may also be flush with the bottom surface of the connecting structure 13.

[0085] In the second embodiment of the present invention, the pick-and-place transfer device 10 further includes a support rod (not shown in the figure), at least one mark 12 is disposed on the support rod, and the body 11 is disposed on one side of the support rod; when the image capturing device 30 takes a picture, the image capturing device 30 can capture multiple initial images 31 and at least one mark image 32 on the support rod; wherein, the position of the support rod is not limited to this, and can be arbitrarily disposed around any position near the body 11, as long as the image capturing device 30 can capture multiple initial images 31 and at least one mark image 32 on the support rod when taking a picture.

[0086] Figure 11 This is a perspective view of the pick-and-place transfer device 10B of the chip pick-and-place transfer apparatus according to the third embodiment of the present invention. Figure 11 As shown, the difference between this embodiment and the first embodiment of the present invention is that the plurality of chip placement areas 111 of the third embodiment of the present invention include an adhesive surface 15, and the structure of the adhesive surface 15 is used to adhere at least one chip 910.

[0087] The adhesiveness of the adhesive surface 15 is a material characteristic of the pick-and-place transfer device 10. Specifically, the material itself is adhesive, so the surface of the pick-and-place transfer device 10 is also adhesive, and can pick up the chip 910 when it touches it. However, the structure of the adhesive surface 15 is not limited to this. The surface of the pick-and-place transfer device 10 can also be made adhesive through adhesive or other means to achieve the function of picking up the chip 910.

[0088] Figure 12 This is a perspective view of the pick-and-place transfer device 10C of the chip pick-and-place transfer apparatus according to the fourth embodiment of the present invention. Figure 12 As shown, the difference between the fourth embodiment and the first embodiment of the present invention is that the multiple chip placement areas 111 of the fourth embodiment of the present invention include multiple suction holes 112 and an adhesive surface 15. The multiple suction holes 112 are formed on the adhesive surface 15, and the structure of the adhesive surface 15 is used to adhere at least one chip 910, and the multiple suction holes 112 are used to pick up at least one chip.

[0089] In the fifth embodiment of the present invention, the plurality of chip placement areas 111 include a plurality of suction holes 112; however, the number of suction holes 112 is not limited thereto, and can be changed to at least one suction hole 112 as required.

[0090] Figure 13 This is a block diagram of the chip pick-and-place transfer device according to the fifth embodiment of the present invention, as shown below. Figure 13 As shown. In the fifth embodiment of the present invention, in addition to the moving device 50, the pick-and-place transfer device 10 itself may also have the function of moving, and the control device 40 can directly control the pick-and-place transfer device 10 to move between the initial position, the pre-arrangement position and the crystal placement position.

[0091] Preferably, the control device 40 can first drive the pick-and-place transfer device 10 to move between the initial position, the pre-arrangement position and the chip placement position through the moving device 50. When the pick-and-place transfer device 10 moves to the required position, if the initial image 31 and the pre-arrangement image 33 of at least one chip placement area 111 of the pick-and-place transfer device in the pre-arrangement position do not match, the control device 40 can obtain a position information 42 of an error value based on the initial image 31 and the pre-arrangement image 33. The control device 40 controls the pick-and-place transfer device 10 to move to a position that matches the initial image 31 based on the position information 42 of the error value, so that the position of the pick-and-place transfer device 10 is more accurate.

[0092] However, the movable structure is not limited to this, and may only have a pick-and-place transfer device 10 with its own movable function; the control device 40 can directly control the pick-and-place transfer device 10 to move between the initial position, the pre-arrangement position and the chip placement position, and control the pick-and-place transfer device 10 to move to a position that matches the image of at least one chip placement area 111 according to the position information 42 of the error value, and then control the chip placement device 20 to place at least one chip 910 in multiple chip placement areas 111.

[0093] Figure 14 This is a flowchart illustrating the chip placement and positioning method of the chip pick-and-place transfer device of the present invention. Figure 14 As shown, the present invention will provide a method for positioning a placed chip in a chip pick-and-place transfer device, comprising the following steps: Step S1: A pick-and-place transfer device 10 is located in an initial position, and an image capturing device 30 captures at least one initial image 31 of at least one chip placement area 111 of the pick-and-place transfer device 10 and at least one marker image 32 of at least one marker 12. The at least one chip placement area 111 includes a texture 14.

[0094] Step S2: The image capturing device 30 transmits at least one initial image 31 and at least one marker image 32 to a control device 40.

[0095] Step S3: The control device 40 obtains the position information 41 of multiple chip placement areas 111 based on at least one initial image 31 and at least one marker image 32.

[0096] Step S4: The pick-and-place transfer device 10 moves to a pre-arranged position, and the image capturing device 30 captures at least one pre-arranged image 33 of at least one chip placement area 111 of the pick-and-place transfer device 10 at the pre-arranged position.

[0097] Step S5: The image capturing device 30 transmits at least one pre-arranged image 33 to the control device 40.

[0098] Step S6: The control device 40 determines whether the initial image 31 and at least one pre-arranged image 33 match.

[0099] Step S7: When the initial image 31 and at least one pre-arranged image 33 match, the control device 40 controls a chip placement device 20 to place a chip 910 in the at least one chip placement area 111 according to the position information 41 of the at least one chip placement area 111.

[0100] Preferably, the number of chip placement areas 111 of the present invention can be adjusted as needed, so that the pick-and-place transfer device 10 has multiple chip placement areas 111, and the multiple textures 14 of the multiple chip placement areas 111 are all different.

[0101] Figure 15 This is a flowchart of sub-step S301 of step S3 in the chip placement and positioning method of the chip pick-and-place transfer device of the present invention. Figure 15 As shown, step S3 further includes the following sub-step S301, whereby the control device 40 records the relative positions between multiple chip placement areas 111 and at least one marker 12 based on at least one initial image 31 and at least one marker image 32, so as to obtain position information 41 of multiple chip placement areas 111.

[0102] Please refer to Figure 14 The chip placement and positioning method of the chip pick-and-place transfer device of the present invention further includes the following step S8: when at least one initial image 31 and at least one pre-arranged image 33 do not match, the control device 40 obtains a position information 42 of an error value based on at least one initial image 31 and at least one pre-arranged image 33, and the control device 40 controls the pick-and-place transfer device 10 to move to a position that matches at least one initial image 31 based on the position information 42 of the error value.

[0103] The advantage of this invention is that by capturing multiple initial images 31 of multiple chip placement areas 111 of the pick-and-place transfer device 10 at the initial position, at least one marker image 32 of at least one marker 12, and multiple pre-arranged images 33 of at least one chip placement area 111 of the pick-and-place transfer device 10 at the pre-arranged position, and by determining whether the multiple initial images 31 and multiple pre-arranged images 33 at the initial position and the pre-arranged position match, the chip placement device 20 can be more accurate when placing at least one chip 910 in multiple chip placement areas 111, avoiding thermal errors generated during repeated chip placement, and greatly improving the quality and yield of semiconductor electronic products.

[0104] Furthermore, by using the pick-and-place transfer device 10 to pick up multiple chips 910 at once, assembly time and costs can be saved, and production efficiency can be improved.

[0105] The above description is merely for explaining preferred embodiments of the present invention and is not intended to limit the present invention in any way. Therefore, any modifications or changes made to the present invention under the same inventive spirit should still be included within the scope of protection intended by the present invention.

Claims

1. A chip pick-and-place transfer device, characterized in that, include: A control device; A pick-and-place transfer device, connected to the control device, includes at least one chip placement area and at least one mark, wherein the at least one chip placement area includes a texture; A crystal placement device, connected to the control device; and An image capturing device is connected to the control device; When the pick-and-place transfer device is in an initial position, the image capturing device captures at least one initial image of the at least one chip placement area of ​​the pick-and-place transfer device and at least one marker image of the at least one marker at the initial position, and transmits them to the control device. The control device obtains the position information of the at least one chip placement area based on the at least one initial image and the at least one marker image. When the pick-and-place transfer device moves to a pre-arranged position, the image capturing device captures at least one pre-arranged image of the at least one chip placement area of ​​the pick-and-place transfer device at the pre-arranged position, and transmits the at least one pre-arranged image to the control device. The control device determines whether the at least one initial image matches the at least one pre-arranged image; and Wherein, when the at least one initial image matches the at least one pre-arranged image, the control device controls the crystal placement device to place a chip in the at least one chip placement area based on the position information of the at least one chip placement area; Wherein, when the at least one initial image and the at least one pre-arranged image do not match, the control device obtains position information of an error value based on the at least one initial image and the at least one pre-arranged image, and the control device controls the pick-and-place transfer device to move to a position that matches the at least one initial image based on the position information of the error value.

2. The chip pick-and-place transfer device according to claim 1, characterized in that, The texture is the material texture of the pick-and-place transfer device.

3. The chip pick-and-place transfer device according to claim 2, characterized in that, The pick-and-place transfer device includes multiple chip placement areas, and the textures of the multiple chip placement areas are all different.

4. The chip pick-and-place transfer device according to claim 2 or 3, characterized in that, The material of the pick-and-place transfer device is a polymer material.

5. The chip pick-and-place transfer device according to claim 2 or 3, characterized in that, The material of the pick-and-place transfer device is rubber.

6. The chip pick-and-place transfer device according to claim 1, characterized in that, The at least one chip placement area includes at least one suction hole for picking up at least one chip.

7. The chip pick-and-place transfer device according to claim 1, characterized in that, The at least one chip placement area includes an adhesive surface for attaching at least one chip.

8. The chip pick-and-place transfer device according to claim 1, characterized in that, The at least one chip placement area includes at least one suction hole and an adhesive surface. The at least one suction hole is formed on the adhesive surface and is used to pick up at least one chip. The adhesive surface is used to adhere the at least one chip.

9. The chip pick-and-place transfer device according to claim 1, characterized in that, The pick-and-place transfer device further includes at least one body and a connecting structure, wherein the at least one body is disposed on the connecting structure, the at least one chip placement area is disposed on the at least one body, and the at least one mark is disposed on the connecting structure.

10. A method for positioning a placed chip in a chip pick-and-place transfer device, characterized in that, Includes the following steps: A pick-and-place transfer device is located at an initial position, and an image capturing device captures at least an initial image of at least a chip placement area of ​​the pick-and-place transfer device at the initial position and at least a marker image of at least a marker, wherein the at least a chip placement area includes a texture. The image capturing device transmits the at least one initial image and the at least one marked image to a control device; The control device obtains the position information of the at least one chip placement area based on the at least one initial image and the at least one marked image; The pick-and-place transfer device moves to a pre-arranged position, and the image capturing device captures at least one pre-arranged image of the at least one chip placement area of ​​the pick-and-place transfer device at the pre-arranged position; The image capturing device transmits the at least one pre-arranged image to the control device; The control device determines whether the at least one initial image and the at least one pre-arranged image match; When the at least one initial image and the at least one pre-arranged image match, the control device controls a chip placement device to place a chip in the at least one chip placement area based on the position information of the at least one chip placement area. After the control device determines whether the at least one initial image and the at least one pre-arranged image match, the positioning method further includes: When the at least one initial image and the at least one pre-arranged image do not match, the control device obtains position information of an error value based on the at least one initial image and the at least one pre-arranged image, and the control device controls the pick-and-place transfer device to move to a position that matches the at least one initial image based on the position information of the error value.

11. The chip placement and positioning method of the chip pick-and-place transfer device according to claim 10, characterized in that, The control device obtains the position information of the at least one chip placement area based on the at least one initial image and the at least one marked image, including: The control device records the relative position between the at least one chip placement area and the at least one marker based on the at least one initial image and the at least one marker image, so as to obtain the position information of the at least one chip placement area.

Images