Thermosyphon heat sink

Abstract

This invention discloses a thermosiphon radiator, comprising a substrate and a heat dissipation fin assembly. The substrate has at least a first receiving cavity, a second receiving cavity, and a first plate surface. The first plate surface has at least a first heat dissipation station and a second heat dissipation station. The heat dissipation fin assembly includes at least a first heat dissipation fin with a first gas-liquid channel and a second heat dissipation fin with a second gas-liquid channel. The projection of the first gas-liquid channel at least partially overlaps the first receiving cavity, and the projection of the second gas-liquid channel at least partially overlaps the second receiving cavity and partially overlaps the first receiving cavity. In the vertical direction of the substrate, the first receiving cavity and the first gas-liquid channel are offset, with the first gas-liquid channel located above the first receiving cavity. The second receiving cavity and the second gas-liquid channel are also offset, with the second gas-liquid channel located above the second receiving cavity. This solves the technical problem that thermosiphon radiators cannot achieve good heat dissipation when dissipating heat from multiple heat sources of different heights and deviating from the horizontal direction.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more particularly to a thermosiphon radiator. Background Technology

[0002] Over the past decade, with the rapid development of fields such as communication equipment, supercomputing, data mining, e-commerce, and artificial intelligence, the total demand for heat dissipation has increased dramatically. Device miniaturization has further increased power density, while also exacerbating the need for efficient cooling solutions.

[0003] In existing technologies, thermosiphon radiators can be used to dissipate heat from components with high heat flux density. However, when multiple heat sources of varying heights are placed off-center from the horizontal, especially when the heat sources are placed vertically, existing thermosiphon radiators cannot achieve good heat dissipation when dissipating heat sources of varying heights and off-center from the horizontal, which in turn affects the normal operating environment of the heat sources. Summary of the Invention

[0004] Therefore, it is necessary to propose a thermosiphon radiator to address the above problems and solve the technical problem that existing thermosiphon radiators cannot achieve good heat dissipation when dissipating heat from multiple heat sources of different heights and deviating from the horizontal direction.

[0005] Therefore, one embodiment provides a thermosiphon radiator, comprising:

[0006] The substrate has at least a first receiving cavity and a second receiving cavity spaced apart in a vertical direction, the first receiving cavity being filled with a first phase change working fluid and the second receiving cavity being filled with a second phase change working fluid; the substrate also has a first plate surface, the first plate surface being at least provided with a first heat dissipation station corresponding to the first receiving cavity and a second heat dissipation station corresponding to the second receiving cavity.

[0007] A heat dissipation fin assembly, comprising at least a first heat dissipation fin corresponding to the first receiving cavity and disposed on the substrate, and a second heat dissipation fin corresponding to the second receiving cavity and disposed on the substrate; the first heat dissipation fin has a first gas-liquid channel communicating with the first receiving cavity, and the second heat dissipation fin has a second gas-liquid channel communicating with the second receiving cavity; the projection of the first gas-liquid channel on the first plate surface at least partially overlaps the first receiving cavity, and the projection of the second gas-liquid channel on the first plate surface at least partially overlaps the second receiving cavity and partially overlaps the first receiving cavity; in the vertical direction of the substrate, the first receiving cavity and the first gas-liquid channel are offset and the first gas-liquid channel is located above the first receiving cavity, and the second receiving cavity and the second gas-liquid channel are offset and the second gas-liquid channel is located above the second receiving cavity.

[0008] In some embodiments of the thermosiphon radiator, the substrate is divided along a first direction into at least a first portion, a second portion, and a third portion arranged sequentially. The second receiving cavity is disposed in the first portion, the first receiving cavity is disposed in the second portion, the first heat dissipation fins are disposed in the third portion and can partially extend into the second portion, and the second heat dissipation fins are disposed in the second portion and can partially extend into the first portion.

[0009] In some embodiments of the thermosiphon radiator, it also includes at least a first heat source and a second heat source, wherein the first heat source is arranged at the first heat dissipation station, and the liquid level of the first phase change working fluid is higher than the top of the first heat source.

[0010] The second heat source is arranged on the second heat dissipation station, and the liquid level of the second phase change working fluid is higher than the top of the second heat source.

[0011] In some embodiments of the thermosiphon radiator, the projection of the first heat source on the first plate surface is located within the projection of the first phase change working fluid on the first plate surface.

[0012] The projection of the second heat source onto the first plate is located within the projection of the second phase change working fluid onto the first plate.

[0013] In some embodiments of the thermosiphon radiator, the substrate has a first connecting hole and a second connecting hole. The first connecting hole connects the first gas-liquid channel and the first receiving cavity, and the hole wall of the first connecting hole on the side near the first heat dissipation position is higher than or flush with the liquid surface of the first phase change working fluid. The second connecting hole connects the second gas-liquid channel and the second receiving cavity, and the hole wall of the second connecting hole on the side near the second heat dissipation position is higher than or flush with the liquid surface of the second phase change working fluid.

[0014] In some embodiments of the thermosiphon radiator, the substrate further has a second plate surface disposed opposite to the first plate surface, and both the first heat dissipation fins and the second heat dissipation fins are disposed on the second plate surface.

[0015] In some embodiments of the thermosiphon radiator, the thermosiphon radiator further includes a heat dissipation component disposed corresponding to the second receiving cavity, the heat dissipation component being disposed on the second plate surface.

[0016] In some embodiments of the thermosiphon radiator, the projection of the second phase change working fluid onto the first plate surface at least partially overlaps with the projection of the heat sink onto the first plate surface.

[0017] In some embodiments of the thermosiphon radiator, the heat dissipation element is a blown plate fin or a solid fin.

[0018] In some embodiments of the thermosiphon radiator, the first heat dissipation fins have a first liquid injection hole communicating with the first gas-liquid channel; or, the substrate has a first liquid injection hole communicating with the first receiving cavity.

[0019] The second heat dissipation fin has a second liquid injection hole communicating with the second gas-liquid channel, or the substrate has a second liquid injection hole communicating with the second receiving cavity.

[0020] The embodiments of the present invention have the following beneficial effects:

[0021] The projection of the first gas-liquid channel on the first plate surface at least partially overlaps with the first receiving cavity, so that the first gas-liquid channel connects to the first receiving cavity. The gaseous first phase change working fluid formed by heating and evaporation diffuses into the first gas-liquid channel and condenses, releasing heat. The projection of the second gas-liquid channel on the first plate surface at least partially overlaps with the second receiving cavity, so that the second gas-liquid channel connects to the second receiving cavity. This allows the gaseous second phase change working fluid formed by heating and evaporation to diffuse into the second gas-liquid channel and condense, releasing heat. In the vertical direction of the substrate, the first receiving cavity and the first gas-liquid channel are offset, with the first gas-liquid channel located above the first receiving cavity. The second receiving cavity and the second gas-liquid channel are offset, with the second gas-liquid channel located above the second receiving cavity. Therefore, the first gas-liquid channel is higher than the first receiving cavity to prevent the first phase change working fluid from flowing into the first gas-liquid channel. The gas-liquid channel is higher than the second receiving cavity to prevent the second phase change working fluid from flowing into the second gas-liquid channel. Furthermore, in the vertical direction of the substrate, the projection of the second gas-liquid channel on the first plate surface at least partially overlaps with the first receiving cavity. This fully utilizes the space created by the misalignment of the first gas-liquid channel and the first receiving cavity to arrange the position of the second gas-liquid channel, ensuring that the relative positions of the first gas-liquid channel, the first receiving cavity, the second gas-liquid channel, and the second receiving cavity are compactly arranged along the height extension direction of the substrate. This allows for the dissipation of heat from multiple heat sources of varying heights that are deviated from the horizontal direction. The combined effect of two-phase heat exchange and vapor movement dissipates heat from the first heat source located at the first heat dissipation station and the second heat source located at the second heat dissipation station, thereby improving the heat dissipation effect of the thermosiphon radiator. In other words, this technical solution solves the technical problem in the prior art where thermosiphon radiators cannot achieve good heat dissipation when dissipating multiple heat sources of varying heights that are deviated from the horizontal direction. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] in:

[0024] Figure 1 A schematic diagram of the overall structure of a thermosiphon radiator provided according to the present invention is shown;

[0025] Figure 2 A left view of an embodiment of a thermosiphon radiator is shown;

[0026] Figure 3 A left view of another embodiment of a thermosiphon radiator is shown;

[0027] Figure 4 A schematic diagram of heat dissipation of a thermosiphon radiator provided according to an embodiment of the present invention is shown.

[0028] Explanation of key component symbols:

[0029] 100. Thermosiphon radiator; 10. Substrate; 11. First part; 12. Second part; 13. Third part; 10a. First receiving cavity; 10b. Second receiving cavity; 10c. First plate surface; 10d. Second plate surface; 10e. First connecting hole; 10f. Second connecting hole; 10g. First heat dissipation station; 10j. Second heat dissipation station; 21. First heat source; 22. Second heat source; 30. Heat dissipation fin assembly; 31. First heat dissipation fin; 311. First gas-liquid channel; 312. First inner bottom surface; 32. Second heat dissipation fin; 321. Second gas-liquid channel; 322. Second inner bottom surface; 40. Heat dissipation component. Detailed Implementation

[0030] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many other different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0031] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] See Figures 1-4 In this embodiment of the invention, a thermosiphon radiator 100 is provided. The thermosiphon radiator 100 cools power electronic devices by conducting and releasing heat, such as the central processing unit and chips of power electronic devices, to ensure that the power electronic devices work stably within the rated temperature range.

[0034] The thermosiphon radiator 100 includes a substrate 10 and a heat dissipation fin assembly 30. The substrate 10 has at least a first receiving cavity 10a and a second receiving cavity 10b spaced apart along the vertical direction of the substrate 10. The first receiving cavity 10a is filled with a first phase change working medium (not shown in the figure), and the second receiving cavity 10b is filled with a second phase change working medium (not shown in the figure). The substrate 10 also has a first plate surface 10c. The first plate surface 10c is provided with at least a first heat dissipation station 10g corresponding to the first receiving cavity 10a and a second heat dissipation station 10j corresponding to the second receiving cavity 10b. The heat dissipation fin assembly 30 includes at least a first heat dissipation fin 31 corresponding to the first receiving cavity 10a and disposed on the substrate 10, and a second heat dissipation fin 32 corresponding to the second receiving cavity 10b and disposed on the substrate 10. The first heat dissipation fin 31 has a first gas-liquid channel 311 communicating with the first receiving cavity 10a, and the second heat dissipation fin 32 has a second gas-liquid channel 321 communicating with the second receiving cavity 10b. The projection of the first gas-liquid channel 311 on the first plate surface 10c at least partially overlaps with the first receiving cavity 10a, and the projection of the second gas-liquid channel 321 on the first plate surface 10c at least partially overlaps with the second receiving cavity 10b and partially overlaps with the first receiving cavity 10a. In the vertical direction of the substrate 10, the first receiving cavity 10a and the first gas-liquid channel 311 are offset and the first gas-liquid channel 311 is located on the upper side of the first receiving cavity 10a, and the second receiving cavity 10b and the second gas-liquid channel 321 are offset and the second gas-liquid channel 321 is located on the upper side of the second receiving cavity 10b.

[0035] It should be noted that the first phase change working fluid filled in the first receiving cavity 10a is in a state of saturated pressure and saturated temperature, and the second phase change working fluid filled in the second receiving cavity 10b is in a state of saturated pressure and saturated temperature.

[0036] Taking the first heat source 21 arranged on the first heat dissipation station 10g as an example to illustrate the heat dissipation process of the thermosiphon radiator 100, when the first phase change working medium is heated, it can evaporate from the liquid state to the gaseous state; when the first phase change working medium is cooled, the gaseous state can be transformed back into the liquid state. Therefore, after being heated by the first heat source 21, the first phase change working fluid in the first receiving cavity 10a will absorb the heat from the first heat source 21 through rapid vaporization and change from liquid to gas. The heated gaseous first phase change working fluid will diffuse into the first gas-liquid channel 311. The gaseous first phase change working fluid will condense on the inner wall surface of the first heat dissipation fin 31 and release a large amount of heat at the same time. The heat will then be transferred to the outer surface of the first heat dissipation fin 31 through the inner wall surface of the first heat dissipation fin 31. The heat on the outer surface of the first heat dissipation fin 31 will then be released into the environment through various heat exchange methods such as natural convection heat exchange, forced convection heat exchange, or evaporation heat exchange. The condensed liquid first phase change working fluid will flow back into the receiving cavity from the first gas-liquid channel 311 under the action of gravity to continue to be heated and evaporated, thereby completing the phase change cycle between the first receiving cavity 10a and the first gas-liquid channel 311 through the first phase change working fluid, and transferring heat from the first heat source 21 to the first heat dissipation fin 31. When a second heat source 22 is arranged on the second heat dissipation station 10j, the heat dissipation process of the second heat source 22 can be referred to the heat dissipation process of the first heat source 21, and will not be described again here.

[0037] It should be noted that there are multiple first heat dissipation fins 31 and second heat dissipation fins 32. Each first heat dissipation fin 31 has a first gas-liquid channel 311, and each second heat dissipation fin 32 has a second gas-liquid channel 321. This technical solution rapidly transfers heat to each first heat dissipation fin 31 and second heat dissipation fin 32 through the phase change heat transfer of the first and second phase change working fluids and the diffusion motion of vapor. The heat is then released into the environment through natural convection heat transfer. See details... Figure 3 Because phase change heat transfer can achieve a large heat exchange under a small temperature difference, and the vapor diffuses very quickly, the temperature difference between the heat source and the heat dissipation fin assembly 30 is very small, which greatly reduces the thermal resistance from the heat source to the heat dissipation fin assembly 30 and improves the heat exchange efficiency of the thermosiphon radiator 100.

[0038] In this invention, the projection of the first gas-liquid channel 311 on the first plate surface 10c at least partially overlaps with the first receiving cavity 10a, so that the first gas-liquid channel 311 connects to the first receiving cavity 10a, thereby allowing the gaseous first phase change working fluid formed by heating and evaporation to diffuse into the first gas-liquid channel 311 and condense and release heat; the projection of the second gas-liquid channel 321 on the first plate surface 10c at least partially overlaps with the second receiving cavity 10b, so that the second gas-liquid channel 321 connects to the second receiving cavity 10b, thereby allowing the gaseous second phase change working fluid formed by heating and evaporation to diffuse into the second gas-liquid channel 321 and condense and release heat; in the vertical direction of the substrate 10, the first receiving cavity 10a and the first gas-liquid channel 311 are offset and the first gas-liquid channel 311 is located above the first receiving cavity 10a, and the second receiving cavity 10b and the second gas-liquid channel 321 are offset and the second gas-liquid channel 321 is located above the second receiving cavity 10b. Therefore, the first gas-liquid channel 311 is higher than the first receiving cavity 10a to prevent the first phase change working fluid from flowing into the second receiving cavity 10b. A gas-liquid channel 311 and a second gas-liquid channel 321 are provided above the second receiving cavity 10b to prevent the second phase change working fluid from flowing into the second gas-liquid channel 321. Furthermore, in the vertical direction of the substrate 10, the projection of the second gas-liquid channel 321 on the first plate surface 10c at least partially overlaps with the first receiving cavity 10a. This fully utilizes the empty space formed by the misalignment of the first gas-liquid channel 311 and the first receiving cavity 10a in the substrate 10 to arrange the position of the second gas-liquid channel 321. This makes the relative positions of the first gas-liquid channel 311, the first receiving cavity 10a, the second gas-liquid channel 321, and the second receiving cavity 10b arranged compactly along the height extension direction of the substrate 10. This allows for the dissipation of heat from multiple heat sources of varying heights that deviate from the horizontal direction. The heat dissipation of the first heat source 21 arranged on the first heat dissipation station 10g and the second heat source 22 arranged on the second heat dissipation station 10j is achieved through the combined action of two-phase heat exchange and steam movement, thereby improving the heat dissipation effect of the thermosiphon radiator 100. This technical solution solves the problem that existing thermosiphon radiators cannot achieve good heat dissipation when dissipating heat from multiple heat sources of different heights and deviating from the horizontal direction.

[0039] It should be noted that, as Figure 1-2As shown, the first heat dissipation station 10g corresponds to the first receiving cavity 10a, and the second heat dissipation station 10j corresponds to the second receiving cavity 10b. This means that the first heat dissipation station 10g is disposed on the first plate surface 10c of the substrate 10 at the same position as the first receiving cavity 10a, and the second heat dissipation station 10j is disposed on the first plate surface 10c of the substrate 10 at the same position as the second receiving cavity 10b. In this way, the heat from the first heat source 21 on the first heat dissipation station 10g can be directly transferred to the first phase change working medium in the first receiving cavity 10a through the thin wall between the first plate surface 10c and the first receiving cavity 10a. Similarly, the heat from the second heat source 22 on the second heat dissipation station 10j can be directly transferred to the second phase change working medium in the second receiving cavity 10b through the thin wall between the first plate surface 10c and the second receiving cavity 10b. The first phase change working medium absorbs heat and vaporizes, thus carrying away the heat from the first heat source 21, and the second phase change working medium absorbs heat and vaporizes, thus carrying away the heat from the second heat source 22. Furthermore, the vertical direction of the substrate 10 described above is merely a reference direction for describing the misalignment of the first gas-liquid channel 311 with the first receiving cavity 10a and the second gas-liquid channel 321 with the second receiving cavity 10b. Figure 1-3 As shown, when the substrate 10 is placed vertically, the vertical direction of the substrate 10 is as follows: Figure 1 The Z-direction is the same as shown, and the first heat dissipation fin 314 is relative to the first receiving cavity 10a and the first heat source 21 on the first heat dissipation station 10g, as shown. Figure 1 As shown, the second heat dissipation fins 32 are offset in the Z direction, and the second heat dissipation fins 32 are positioned relative to the second receiving cavity 10b and the second heat source 22 on the second heat dissipation station 10j, as shown in the figure. Figure 1 The Z-direction is offset as shown; it can be understood that when the substrate 10 is placed horizontally, the vertical direction will also change accordingly, and the vertical direction will be the same as the horizontal direction; when the substrate 10 is placed at an angle, the vertical direction will also be tilted relative to the horizontal plane.

[0040] When dissipating heat from the first heat source 21 and the second heat source 22, which are at different heights and deviate from the horizontal direction, in order to prevent the first heat source 21 and the second heat source 22 from drying out, the first phase change working fluid must be in full contact with the entire first heat source 21, and the second phase change working fluid must be in full contact with the entire second heat source 22. However, the first receiving cavity 10a needs to be connected to the first gas-liquid channel 311 to diffuse the gaseous first phase change working fluid, and the second receiving cavity 10b needs to be connected to the second gas-liquid channel 321 to diffuse the gaseous second phase change working fluid. In order to ensure sufficient filling of the first and second phase change working fluids, the first phase change working fluid will flow into the first gas-liquid channel 311 and the second phase change working fluid will flow into the second gas-liquid channel 321. On the one hand, this will increase the filling of the first and second phase change working fluids, causing unnecessary waste. On the other hand, the first phase change working fluid flowing into the first gas-liquid channel 311 will occupy the space of the first gas-liquid channel 311, and the second phase change working fluid flowing into the second gas-liquid channel 321 will occupy the space of the second gas-liquid channel 321, reducing the condensation area of ​​the heated steam and limiting the heat exchange efficiency of the heat dissipation fin assembly 30. Therefore, in this technical solution, the first gas-liquid channel 311 is offset from the first phase change working medium, and the second gas-liquid channel 321 is offset from the second phase change working medium. That is, the first gas-liquid channel 311 is located directly above or to the side above the first phase change working medium, and the second gas-liquid channel 321 is located directly above or to the side above the second phase change working medium. This ensures sufficient contact between the heat source components to improve heat transfer efficiency, and also ensures space for steam condensation.

[0041] It should be noted that the substrate 10 of the thermosiphon radiator 100 can also be provided with three, four or more receiving cavities. The number of receiving cavities corresponds to the number of heat dissipation fins. The relative positions of the gas-liquid channels of the heat dissipation fins, the phase change working medium in the receiving cavity and the heat source are all set according to the structure of the thermosiphon radiator 100 with two receiving cavities, so as to realize heat dissipation of multiple heat sources at different heights, while ensuring a compact structure.

[0042] It should be noted that the substrate 10 can be offset from the horizontal direction, that is, the substrate 10 can be vertically or tilted relative to the horizontal direction. Specifically, the substrate 10 also has a second plate surface 10d disposed opposite to the first plate surface 10c. The first heat dissipation fin 31 and the second heat dissipation fin 32 are both disposed on the second plate surface 10d of the substrate 10, so as to avoid the heat from the first heat source 21 and the first heat dissipation fin 31 interfering with the heat dissipation of the first heat dissipation fin 31 and the second heat dissipation fin 32 when the first heat source 21 and the first heat dissipation fin 31 are located on the same side, and the second heat source 22 and the second heat dissipation fin 32 are located on the same side, thus ensuring the heat exchange efficiency between the first heat dissipation fin 31, the second heat dissipation fin 32 and the environment.

[0043] The substrate 10 may be composed of two metal substrates 10 to ensure the thermal conductivity of the substrate 10, and the substrate 10 having a first receiving cavity 10a and a second receiving cavity 10b is formed by the two metal substrates 10.

[0044] Specifically, the substrate 10 is divided along a first direction into at least a first portion 11, a second portion 12, and a third portion 13 arranged sequentially. A second receiving cavity 10b is disposed in the first portion 11, a first receiving cavity 10a is disposed in the second portion 12, a first heat dissipation fin 31 is disposed in the third portion 13 and can partially extend into the second portion 12, and a second heat dissipation fin 32 is disposed in the second portion 12 and can partially extend into the first portion 11. The first direction is the same as the vertical direction of the substrate 10. In this embodiment, the first direction is... Figure 1 The Z direction is shown in the diagram.

[0045] The thermosiphon radiator 100 also includes at least a first heat source 21 and a second heat source 22. Preferably, the first heat source 21 is arranged on the first heat dissipation station 10g, and the liquid level of the first phase change working fluid is higher than the top of the first heat source 21. This ensures that the filling amount of the first phase change working fluid is sufficient, and prevents the remaining first phase change working fluid in the first receiving cavity 10a from not completely covering the first heat source 21 on the first heat dissipation station 10g due to the evaporation of a portion of the first phase change working fluid by heating, thereby avoiding partial dry burning of the first heat source 21.

[0046] The second heat source 22 is arranged on the second heat dissipation station 10j, and the liquid level of the second phase change working fluid is higher than the top of the second heat source 22. This ensures that the filling amount of the second phase change working fluid is sufficient, and prevents the remaining second phase change working fluid in the second receiving cavity 10b from not completely covering the second heat source 22 on the second heat dissipation station 10j due to the evaporation of some of the second phase change working fluid by heating, thus avoiding partial dry burning of the second heat source 22.

[0047] In one embodiment, the projection of the first heat source 21 on the first plate surface 10c is located within the projection of the first phase change working medium on the first plate surface 10c. Therefore, the first heat source 21 disposed on the first heat dissipation station 10g can be in sufficient indirect contact with the first phase change working medium, preventing the first heat source 21 and the substrate 10 from dry burning.

[0048] The projection of the second heat source 22 on the first plate surface 10c is located within the projection of the second phase change working medium on the first plate surface 10c. Therefore, the second heat source 22 disposed on the second heat dissipation station 10j can be in sufficient indirect contact with the second phase change working medium, preventing the second heat source 22 and the substrate 10 from dry burning.

[0049] In some specific embodiments, the bottom of the first heat source 21, arranged in the first heat dissipation station 10g, is flush with the bottom surface of the first phase change working medium. That is, while ensuring that the first phase change working medium fully covers the first heat source 21, the filling amount of the first phase change working medium can be reduced by further defining the specific relative positions of the first heat source 21 and the first phase change working medium.

[0050] The bottom of the second heat source 22, arranged in the second heat dissipation station 10j, is flush with the bottom surface of the second phase change working fluid. That is, while ensuring that the second phase change working fluid fully covers the second heat source 22, the filling amount of the second phase change working fluid can be reduced by further defining the specific relative position of the second heat source 22 and the second phase change working fluid.

[0051] In some specific embodiments, the bottom of the first heat source 21 arranged in the first heat dissipation station 10g is higher than the bottom surface of the first phase change working medium, which can ensure that the first phase change working medium conducts heat to the first heat source 21 arranged in the first heat dissipation station 10g as a whole.

[0052] The bottom of the second heat source 22, which is arranged in the second heat dissipation station 10j, is higher than the bottom surface of the second phase change working medium, which can ensure that the second phase change working medium conducts heat to the second heat source 22 arranged in the second heat dissipation station 10j as a whole.

[0053] like Figure 2 or Figure 3 As shown, the substrate 10 has a first connecting hole 10e that connects the first gas-liquid channel 311 and the first receiving cavity 10a. The liquid level of the first phase change working fluid can be higher than, lower than, or flush with the hole wall of the first connecting hole 10e on the side near the first heat dissipation station 10g. When the liquid level of the first phase change working fluid is higher than the hole wall of the first connecting hole 10e on the side near the first heat dissipation station 10g, that is, when the first phase change working fluid overflows into the first gas-liquid channel 311 through the first connecting hole 10e, the filling amount of the first phase change working fluid is ensured to be sufficient.

[0054] When the liquid level of the first phase change working fluid is lower than the hole wall of the first connecting hole 10e on the side near the first heat dissipation station 10g, that is, when the hole wall of the first connecting hole 10e on the side near the first heat dissipation station 10g is higher than the liquid level of the first phase change working fluid, the liquid level of the first phase change working fluid in the first receiving cavity 10a is a certain distance away from the lower hole wall of the first connecting hole 10e. Therefore, the first phase change working fluid will not flow into the first gas-liquid channel 311 of the first heat dissipation fin 31, which can ensure the condensation area of ​​the first gas-liquid channel 311.

[0055] Preferably, the wall of the first connecting hole 10e on the side near the first heat dissipation station 10g is flush with the liquid surface of the first phase change working medium, that is, the liquid surface of the first phase change working medium is flush with the lower wall of the first connecting hole 10e. This ensures that the first phase change working medium will not overflow into the first gas-liquid channel 311 to prevent the condensation area from decreasing, and also ensures that the filling amount of the first phase change working medium is sufficient.

[0056] The substrate 10 also has a second connecting hole 10f that connects the second gas-liquid channel 321 and the second receiving cavity 10b. The liquid level of the second phase change working fluid can be higher than, lower than, or flush with the hole wall of the second connecting hole 10f on the side near the second heat dissipation station 10j. When the liquid level of the second phase change working fluid is higher than the hole wall of the second connecting hole 10f on the side near the second heat dissipation station 10j, that is, when the second phase change working fluid overflows into the second gas-liquid channel 321 through the second connecting hole 10f, the filling amount of the second phase change working fluid is ensured to be sufficient.

[0057] When the liquid level of the second phase change working fluid is lower than the hole wall of the second connecting hole 10f on the side near the second heat dissipation station 10j, that is, when the hole wall of the second connecting hole 10f on the side near the second heat dissipation station 10j is higher than the liquid level of the second phase change working fluid, the liquid level of the second phase change working fluid in the second receiving cavity 10b is a certain distance away from the lower hole wall of the second connecting hole 10f. Therefore, the second phase change working fluid will not flow into the second gas-liquid channel 321 of the second heat dissipation fin 32, which can ensure the condensation area of ​​the second gas-liquid channel 321.

[0058] Preferably, the wall of the second connecting hole 10f on the side near the second heat dissipation station 10j is flush with the liquid surface of the second phase change working fluid, that is, the liquid surface of the second phase change working fluid is flush with the lower wall of the second connecting hole 10f. This ensures that the second phase change working fluid will not overflow into the second gas-liquid channel 321 to prevent a reduction in the condensation area, and also ensures that the filling amount of the second phase change working fluid is sufficient.

[0059] In one embodiment, the thermosiphon radiator 100 further includes a heat dissipation component 40 disposed corresponding to the second receiving cavity 10b, the heat dissipation component 40 being disposed on the second plate surface 10d. The heat dissipation capacity of the thermosiphon radiator 100 is improved through thermal conduction between the heat dissipation component 40 and the substrate 10.

[0060] In some specific embodiments, the heat sink 40 is a blown plate fin, a solid fin, or other forms of heat sink fins. The heat sink 40 and the heat sink fins can be configured as an integral structure or as separate structures, see [reference needed]. Figure 2 and Figure 3 .

[0061] In one embodiment, the projection of the second phase change working fluid onto the first plate surface 10c at least partially overlaps with the projection of the heat sink 40 onto the first plate surface 10c. That is, the heat of the second phase change working fluid can be dissipated not only through steam but also through thermal conduction by the heat sink 40.

[0062] In some specific embodiments, the first heat dissipation fin 31 is flush with one end of the substrate 10, and the heat dissipation component 40 is flush with the other end of the substrate 10. That is, given a fixed space occupied by the thermosiphon radiator 100, the heat dissipation area of ​​the first heat dissipation fin 31 and the heat conduction area of ​​the heat dissipation component 40 are sufficiently increased to improve heat dissipation efficiency.

[0063] In some specific embodiments, the first heat dissipation fin 31 may protrude from one end of the substrate 10, and / or the heat dissipation element 40 may protrude from the other end of the substrate 10 to improve heat dissipation efficiency.

[0064] In some specific embodiments, refer to Figure 2 or Figure 3 The second receiving cavity 10b is formed in the first portion 11 of the substrate 10, and extends to the end of the first portion 11 away from the second portion 12, that is, the second receiving cavity 10b extends to the bottom end of the first portion 11, so as to make full use of the volume of the substrate 10, that is, the volume of the thermosiphon heat sink 100 can be reduced and its applicability can be improved. It should be noted that the position of the second receiving cavity 10b includes, but is not limited to, this. In the height extension direction of the substrate 10, the second gas-liquid channel 321 is always located above the first phase change working medium, and the first gas-liquid channel 311 is always located above the first phase change working medium.

[0065] In one embodiment, the first heat dissipation fin 31 and the second heat dissipation fin 32 are spaced apart. By spacing the first heat dissipation fin 31 and the second heat dissipation fin 32, their heat dissipation functions are relatively independent and do not interfere with each other. The spacing between the first heat dissipation fin 31 and the second heat dissipation fin 32 can be adjusted according to the compactness of the overall structure and heat dissipation performance of the thermosiphon radiator 100.

[0066] In some specific embodiments, there are multiple first heat dissipation fins 31 and multiple second heat dissipation fins 32. The multiple first heat dissipation fins 31 are all connected to the first receiving cavity 10a, that is, the multiple first heat dissipation fins 31 are interconnected through the first receiving cavity 10a. The multiple second heat dissipation fins 32 are all connected to the first receiving cavity 10a, that is, the multiple second heat dissipation fins 32 are interconnected through the second receiving cavity 10b. Therefore, the vapor formed by the heating and evaporation of the first phase change working fluid in the first receiving cavity 10a can be quickly diffused into the first gas-liquid channel 311 of each first heat dissipation fin 31, and the vapor formed by the heating and evaporation of the second phase change working fluid in the second receiving cavity 10b can be quickly diffused into the second gas-liquid channel 321 of each second heat dissipation fin 32. This fully utilizes all the first heat dissipation fins 31 and the second heat dissipation fins 32 for heat dissipation to improve heat dissipation efficiency. Meanwhile, multiple first heat dissipation fins 31 are spaced apart and arranged in parallel, and multiple second heat dissipation fins 32 are spaced apart and arranged in parallel. Therefore, the outer surfaces of each first heat dissipation fin 31 and each second heat dissipation fin 32 can fully and evenly exchange heat with the environment, ensuring the heat dissipation effect of the heat dissipation fin assembly 30. This solves the problem in the prior art where, when the heat source size is small, the weak diffusion capacity of the substrate 10 of the traditional heat sink makes it impossible to utilize the entire heat sink for heat dissipation.

[0067] The first heat dissipation fin 31 may be rectangular in shape. The first heat dissipation fin 31 has a first inner bottom surface 312 forming a first gas-liquid channel 311. The first heat dissipation fin 31 has a third connecting hole that connects the first gas-liquid channel 311 and the first connecting hole 10e. That is, the first gas-liquid channel 311 and the first receiving cavity 10a are connected through the first connecting hole 10e and the third connecting hole. The hole wall of the third connecting hole is in contact with the first inner bottom surface 312 and the second connecting hole 10f, so that the condensed first phase change working fluid can flow back into the first receiving cavity 10a through the first inner bottom surface 312, the third connecting hole, and the first connecting hole 10e. It should be noted that the shape of the first heat dissipation fin 31 includes, but is not limited to, this. For example, the first inner bottom surface 312 of the first heat dissipation fin 31 used to form the first gas-liquid channel 311 can be set as an inclined surface or an arc-shaped inclined surface, etc., so that the inclined surface or arc-shaped inclined surface is in contact with the hole wall of the third connecting hole of the first heat dissipation fin 31, so that the condensed liquid can flow through the inclined surface or arc-shaped inclined surface and then flow back to the first receiving cavity 10a.

[0068] The second heat dissipation fin 32 can be rectangular in shape. It has a second inner bottom surface 322 forming a second gas-liquid channel 321. The second heat dissipation fin 32 has a fourth connecting hole that connects the second gas-liquid channel 321 and the second connecting hole 10f. The wall of the fourth connecting hole is in contact with the wall of the second inner bottom surface 322 and the second connecting hole 10f, allowing the condensed second phase change working fluid to flow back into the second receiving cavity 10b through the second inner bottom surface 322, the fourth connecting hole, and the second connecting hole 10f. It should be noted that the shape of the second heat dissipation fin 32 includes, but is not limited to, this. For example, the second inner bottom surface 322 of the second heat dissipation fin 32, which forms the second gas-liquid channel 321, can be configured as an inclined surface or an arc-shaped inclined surface, such that the inclined surface or arc-shaped inclined surface is in contact with the wall of the fourth connecting hole of the second heat dissipation fin 32, so that the condensed liquid can flow back into the second receiving cavity 10b after passing through the inclined surface or arc-shaped inclined surface.

[0069] In addition, the heat dissipation fin assembly 30 is fixed to the substrate 10 by welding to ensure relative stability between the heat dissipation fin assembly 30 and the substrate 10.

[0070] In one embodiment, the first heat dissipation fin 31 has a first injection hole (not shown in the figure) communicating with the first gas-liquid channel 311. The first injection hole can be opened at the end of the first heat dissipation fin 31 away from the first receiving cavity 10a, that is, the first injection hole is opened at the top of the first heat dissipation fin 31. The first phase change working fluid is injected into the first gas-liquid channel 311 through the first injection hole. The first phase change working fluid flows sequentially through the first inner bottom surface 312, the third connecting hole, and the first connecting hole 10e under the action of gravity, and is then stored in the first receiving cavity 10a.

[0071] The second heat dissipation fin 32 has a second liquid injection hole (not shown in the figure) that communicates with the second gas-liquid channel 321. The second liquid injection hole can be opened at the end of the second heat dissipation fin 32 away from the second receiving cavity 10b, that is, the second liquid injection hole is opened at the top of the second heat dissipation fin 32. The second phase change working fluid is injected into the second gas-liquid channel 321 through the second liquid injection hole. The second phase change working fluid flows through the second inner bottom surface 322, the fourth connecting hole, and the second connecting hole 10f in sequence under the action of gravity, and is then stored in the second receiving cavity 10b.

[0072] In one embodiment, the substrate 10 has a first injection hole (not shown in the figure) communicating with the first receiving cavity 10a, through which a first phase change working fluid is injected into the first receiving cavity 10a.

[0073] The substrate 10 also has a second injection hole (not shown in the figure) that communicates with the second receiving cavity 10b, through which the second phase change working fluid is injected into the second receiving cavity 10b.

[0074] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] It is worth noting that there can be multiple first heat dissipation stations 10g and second heat dissipation stations 10j, with the multiple first heat dissipation stations 10g and the multiple second heat dissipation stations 10j all spaced apart along the width direction of the substrate 10. Furthermore, the above embodiment only addresses the case with only two receiving cavities and two heat dissipation stations. In other embodiments, the thermosiphon radiator 100 may also have third, fourth, and fifth receiving cavities spaced apart in the vertical direction of the substrate, and multiple third, fourth, and fifth heat dissipation stations, etc. These multiple third, fourth, and fifth heat dissipation stations correspond to the third, fourth, and fifth receiving cavities, respectively. The number of heat dissipation stations and receiving cavities can be selected according to actual needs to adapt to different heat dissipation requirements.

[0076] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A thermosiphon heat spreader, comprising: include: The substrate has at least a first receiving cavity and a second receiving cavity spaced apart in a vertical direction, the first receiving cavity being filled with a first phase change working fluid and the second receiving cavity being filled with a second phase change working fluid; the substrate also has a first plate surface, the first plate surface being at least provided with a first heat dissipation station corresponding to the first receiving cavity and a second heat dissipation station corresponding to the second receiving cavity. A heat dissipation fin assembly, comprising at least a first heat dissipation fin corresponding to the first receiving cavity and disposed on the substrate, and a second heat dissipation fin corresponding to the second receiving cavity and disposed on the substrate; the first heat dissipation fin has a first gas-liquid channel communicating with the first receiving cavity, the second heat dissipation fin has a second gas-liquid channel communicating with the second receiving cavity, the projection of the first gas-liquid channel on the first plate surface at least partially overlaps the first receiving cavity, and the projection of the second gas-liquid channel on the first plate surface at least partially overlaps the second receiving cavity and partially overlaps the first receiving cavity; In the vertical direction of the substrate, the first receiving cavity is offset from the first gas-liquid channel and the first gas-liquid channel is located above the first receiving cavity, and the second receiving cavity is offset from the second gas-liquid channel and the second gas-liquid channel is located above the second receiving cavity.

2. The thermosiphon heat spreader of claim 1, wherein, The substrate is divided into at least a first part, a second part, and a third part arranged sequentially along a first direction. The second receiving cavity is disposed in the first part, the first receiving cavity is disposed in the second part, the first heat dissipation fin is disposed in the third part and can partially extend into the second part, and the second heat dissipation fin is disposed in the second part and can partially extend into the first part.

3. The thermosiphon heat spreader of claim 1, wherein, It also includes at least a first heat source and a second heat source, the first heat source being arranged at the first heat dissipation station, and the liquid level of the first phase change working fluid being higher than the top of the first heat source; The second heat source is arranged on the second heat dissipation station, and the liquid level of the second phase change working fluid is higher than the top of the second heat source.

4. The thermosiphon heat spreader of claim 3, wherein, The projection of the first heat source on the first plate surface is located within the projection of the first phase change working fluid on the first plate surface; The projection of the second heat source onto the first plate is located within the projection of the second phase change working fluid onto the first plate.

5. The thermosiphon heat spreader of claim 1, wherein, The substrate has a first connecting hole and a second connecting hole. The first connecting hole connects the first gas-liquid channel and the first receiving cavity, and the hole wall of the first connecting hole near the first heat dissipation position is higher than or flush with the liquid surface of the first phase change working medium. The second connecting hole connects the second gas-liquid channel and the second receiving cavity, and the hole wall of the second connecting hole near the second heat dissipation position is higher than or flush with the liquid surface of the second phase change working medium.

6. The thermosiphon heat spreader of any of claims 1-5, wherein, The substrate also has a second plate surface disposed opposite to the first plate surface, and both the first heat dissipation fins and the second heat dissipation fins are disposed on the second plate surface.

7. The thermosiphon heat spreader of claim 6, wherein, The thermosiphon radiator also includes a heat dissipation component disposed corresponding to the second receiving cavity, the heat dissipation component being disposed on the second plate surface.

8. The thermosiphon heat spreader of claim 7, wherein, The projection of the second phase change working fluid onto the first plate surface at least partially overlaps with the projection of the heat sink onto the first plate surface.

9. The thermosiphon heat spreader of claim 8, wherein, The heat dissipation component is a blown plate fin or a solid fin.

10. The thermosiphon heat spreader of claim 9, wherein, The first heat dissipation fin has a first liquid injection hole communicating with the first gas-liquid channel; or, the substrate has a first liquid injection hole communicating with the first receiving cavity; The second heat dissipation fin has a second liquid injection hole communicating with the second gas-liquid channel, or the substrate has a second liquid injection hole communicating with the second receiving cavity.

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