Load station for wafer annealing

Abstract

This invention discloses a support stage for wafer annealing. The wafer has a portion to be inspected. The support stage includes a body with at least one through-hole formed therein. The shape of the through-hole matches the shape of the portion to be inspected, and the periphery of each through-hole is used to support the edge portion of the portion to be inspected. The support stage for wafer annealing according to this invention can reduce the difference in heating rate between the edge and center portions of the portion to be inspected during annealing, ensuring the consistency of the annealing effect across the entire portion to be inspected.

Description

Technical Field

[0001] This invention relates to the field of wafer annealing technology, and in particular to a support stage for wafer annealing. Background Technology

[0002] Before testing parameters such as resistivity, wafers are typically annealed to eliminate thermal donor defects. However, in related technologies, there is a significant difference in the heating rate between the edge and center of the wafer during the annealing process. This results in a substantial difference in the annealing effect between the edge and center, leading to poor stability and accuracy in subsequent wafer testing. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a support stage for wafer annealing, which can reduce the difference in heating rate between the edge and center of the part to be tested during annealing, ensuring the consistency of the annealing effect of the entire part to be tested.

[0004] According to an embodiment of the present invention, a support stage for wafer annealing is provided, wherein the wafer has a portion to be inspected, and the support stage includes: a body having at least one through hole formed thereon, the shape of the through hole being adapted to match the shape of the portion to be inspected, and the periphery of each through hole being used to support the edge portion of the portion to be inspected.

[0005] According to an embodiment of the present invention, a support stage for wafer annealing is provided by setting the body of the support stage as a hollow structure, such that the body has at least one through hole, and the periphery of the through hole is used to support the edge of the part to be tested, so as to effectively reduce the difference in heating rate between the edge and the center of the part to be tested during rapid annealing of the part to be tested on the wafer, and ensure the consistency of the annealing effect of the entire part to be tested, thereby ensuring the stability and accuracy of subsequent testing of the part to be tested.

[0006] In some embodiments, there are multiple through holes, and at least two of the through holes have different shapes and sizes.

[0007] In some embodiments, there are multiple through holes, including a first through hole and a second through hole spaced apart, wherein both the first through hole and the second through hole are fan-shaped holes.

[0008] In some embodiments, the radius of the arc surface of the first through hole and the radius of the arc surface of the second through hole are equal.

[0009] In some embodiments, the central angle corresponding to the first through hole is smaller than the central angle corresponding to the second through hole.

[0010] In some embodiments, the through hole has a variable cross-section segment, the opening area of ​​which gradually increases in the direction away from the part to be detected.

[0011] In some embodiments, the peripheral wall of the through hole is formed with a support step, which is adapted to support the edge of the part to be detected.

[0012] In some embodiments, the support platform further includes a limiting buckle, which is disposed on the body and located radially outside the through hole. The limiting buckle is movable relative to the body between a stop position and a clearance position. In the stop position, the limiting buckle is used to stop on the side surface of the part to be tested facing away from the body. In the clearance position, the limiting buckle is used to release the stop on the part to be tested.

[0013] In some embodiments, the limiting buckle is rotatable relative to the body between the stop position and the avoidance position. The rotation axis of the limiting buckle is parallel to the central axis of the through hole. The limiting buckle has an avoidance portion and a stop portion, which are arranged sequentially around the rotation axis of the limiting buckle. The radial distance between the outer edge of the avoidance portion and the rotation axis is less than the radial distance between the outer edge of the stop portion and the rotation axis. In the stop position, the stop portion is used to stop on the side surface of the part to be detected facing away from the body. In the avoidance position, the avoidance portion is used to avoid the edge of the part to be detected.

[0014] In some embodiments, the limiting buckle can slide relative to the body along the axial direction of the limiting buckle between a mating position and a disengaged position. In the disengaged position, the stop portion is adapted to be spaced apart from the part to be tested along the axial direction of the limiting buckle. In the mating position, the stop portion is adapted to be flush with the part to be tested along the axial direction of the limiting buckle. The support platform further includes an elastic reset member connected between the limiting buckle and the body, and used to push the limiting buckle toward the mating position.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the support platform according to Embodiment 1 of the present invention;

[0018] Figure 2 yes Figure 1 A cross-sectional view of the support platform shown;

[0019] Figure 3 This is a schematic diagram of the support platform according to Embodiment 2 of the present invention;

[0020] Figure 4 This is a schematic diagram of the support platform according to Embodiment 3 of the present invention;

[0021] Figure 5 This is a schematic diagram of the support platform according to Embodiment 4 of the present invention;

[0022] Figure 6 yes Figure 5 The cross-sectional view of the support shown;

[0023] Figure 7 This is a schematic diagram of the support platform according to Embodiment 5 of the present invention;

[0024] Figure 8 This is a schematic diagram of the support platform according to Embodiment Six of the present invention;

[0025] Figure 9 This is a schematic diagram of the support platform according to Embodiment Seven of the present invention;

[0026] Figure 10 This is a schematic diagram of the support platform according to Embodiment 8 of the present invention;

[0027] Figure 11 yes Figure 10 Another schematic diagram of the support platform shown;

[0028] Figure 12 This is an assembly diagram of a support platform and a part to be tested according to an embodiment of the present invention;

[0029] Figure 13 This is a schematic diagram of the assembly of a support platform assembly according to an embodiment of the present invention;

[0030] Figure 14 This is an assembly schematic diagram of a support platform assembly according to another embodiment of the present invention;

[0031] Figure 15 This is a schematic diagram showing the distribution of test points of multiple parts to be tested carried by the support platform in an embodiment of this application;

[0032] Figure 16 yes Figure 15 A schematic diagram of temperature changes at test points during the annealing process;

[0033] Figure 17 yes Figure 15 A schematic diagram of temperature changes at test points during the annealing process.

[0034] Figure label:

[0035] Support platform 1

[0036] Body 11, through hole 110, peripheral part 110a, supporting step 110b

[0037] First through hole F1, second through hole F2

[0038] Limiting buckle 12, rotation axis 120, clearance part 121, stop part 122

[0039] Elastic reset component 13

[0040] Support platform component 2

[0041] First support platform 21, second support platform 22

[0042] Section 3, to be tested. Detailed Implementation

[0043] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0044] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. Additionally, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0045] Hereinafter, with reference to the accompanying drawings, a support stage 1 for wafer annealing according to an embodiment of the present invention will be described.

[0046] The wafer has a test section 3, which can be understood as a part of the wafer or the entire wafer. Therefore, the shape of the test section 3 can be the same as or different from the shape of the entire wafer. For example, if the wafer is circular and the test section 3 is the entire wafer, then the test section 3 is circular. Alternatively, the test section 3 may be a portion of the wafer, such as a fan shape. The wafer can be a lightly doped silicon wafer.

[0047] Understandably, since the quality of a wafer is roughly symmetrical about its central axis, annealing can be performed on a fan-shaped area of ​​the wafer, such as half or a quarter, and then subsequent testing can be conducted. The test data can characterize the data of the entire wafer, which facilitates the flexible selection of the part to be tested 3.

[0048] like Figures 1-4 As shown, the support platform 1 includes a body 11, which has at least one through hole 110. The through hole 110 penetrates the opposite two side surfaces of the body 11. The shape of the through hole 110 matches the shape of the part to be tested 3. The peripheral portion 110a of each through hole 110 is used to support the edge portion of the part to be tested 3, so that the support platform 1 can stably support the part to be tested 3.

[0049] When the stage 1 is used for wafer annealing, the part to be tested 3 is placed on the stage 1. When the part to be tested 3 is rapidly heated, the heat is conducted from the edge of the part to be tested 3 toward the center of the part to be tested 3. Since the center of the part to be tested 3 is opposite to the through hole 110, the heating rate of the center of the part to be tested 3 can be increased. The maximum heating rate of the center of the part to be tested 3 can reach 90℃ / s, reducing the difference in heating rate between the edge and the center of the part to be tested 3. This makes the heating of the edge and the center of the part to be tested 3 more uniform, so that the heating rates of the edge and the center of the part to be tested 3 are consistent. This ensures that the annealing effect of the edge and the center of the part to be tested 3 is consistent, thereby better eliminating thermal donor defects in the part to be tested 3. This avoids thermal donor defects causing poor wafer electrical properties and ensures the stability and accuracy of subsequent tests on the part to be tested 3. For example, it can ensure the stability and accuracy of subsequent resistivity tests on the part to be tested 3.

[0050] The inventors of this application have discovered through research that in some technologies, the body of the support stage is a solid structure. When the wafer is placed on the body and rapidly heated, the heat is conducted from the edge of the wafer toward the center. Due to the obstruction and heat insulation of the body, the rate at which heat is conducted to the center of the wafer is slower. As a result, the heating rate of the center of the wafer is significantly lower than that of the edge of the wafer, causing a difference in the annealing effect between the center and the edge of the wafer during rapid thermal annealing (RTA), which affects the stability and accuracy of subsequent wafer testing. Moreover, due to the heat insulation effect of the body, the maximum heating rate of the center of the wafer during the annealing process is less than 40°C / s. This application addresses this by setting the body 11 of the support stage 1 to a hollow structure, forming at least one through hole 110 in the body 11, and using the periphery 110a of the through hole 110 to support the edge of the part to be tested 3, thereby avoiding the difference in the annealing effect between the edge and the center of the part to be tested 3 during rapid annealing.

[0051] It should be noted that the shape of the through hole 110 matches the shape of the part to be tested 3. This can be understood as the through hole 110 having the same shape as the part to be tested 3, or the through hole 110 having a small difference from the part to be tested 3. For example, the part to be tested 3 is circular, and the through hole 110 is formed as a circular hole; or the part to be tested 3 is circular, and the through hole 110 is formed as a polygonal hole (e.g., a triangular hole, a quadrilateral hole, etc.). The peripheral portion 110a of the through hole 110 is used to support the edge portion of the part to be tested 3. It can be understood that the peripheral portion 110a of the through hole 110 supports at least a part of the edge portion of the part to be tested 3. Thus, the peripheral portion 110a of the through hole 110 can support only a part of the edge portion of the part to be tested 3, or the peripheral portion 110a of the through hole 110 can support the entire edge portion of the part to be tested 3. For example, if the part to be tested 3 is circular and the through hole 110 is formed as a circle, the peripheral portion 110a of the through hole 110 can support the entire edge portion of the part to be tested 3. When the part to be tested 3 is circular and the through hole 110 is formed as a polygon, the peripheral portion 110a of the through hole 110 can support a part of the edge portion of the part to be tested 3 or support the entire edge portion of the part to be tested 3, as long as the peripheral portion 110a of the through hole 110 stably supports the part to be tested 3.

[0052] It is understandable that if there is one through hole 110 in the body 11, the body 11 can be used to support one part 3 to be tested; if there are multiple through holes 110 in the body 11, the multiple through holes 110 are arranged at intervals, and the central axes of the multiple through holes 110 can be parallel to each other, or at least two through holes 110 can form an angle. Each through hole 110 can correspond to one part 3 to be tested. In this case, the body 11 can be used to support multiple parts 3 to be tested at the same time, so as to anneal multiple parts 3 to be tested at the same time and improve annealing capacity. The arrangement of the multiple through holes 110 can be specifically set according to actual needs.

[0053] Therefore, according to the embodiment of the present invention, the support stage 1 for wafer annealing is configured with a hollow structure in which at least one through hole 110 is formed in the body 11, and the peripheral portion 110a of the through hole 110 is used to support the edge portion of the part to be tested 3. This effectively reduces the difference in heating rate between the edge portion and the center portion of the part to be tested 3 during rapid annealing of the part to be tested on the wafer, ensuring the consistency of the annealing effect of the entire part to be tested 3, thereby ensuring the stability and accuracy of subsequent testing of the part to be tested 3, and improving the heating rate of the entire part to be tested 3, which is beneficial to saving annealing process time.

[0054] Optionally, when the through hole 110 is a circular hole, the diameter of the through hole 110 can be 75mm, 150mm, or 200mm, etc., to accommodate wafers of different sizes.

[0055] In some embodiments, such as Figure 9 As shown, there are multiple through holes 110. If at least two through holes 110 have different shapes and sizes, the following situations may occur: 1. At least two through holes 110 have different shapes; 2. At least two through holes 110 have different sizes; 3. At least two through holes 110 have different shapes and sizes respectively. Among them, for two through holes 110 with different shapes, the sizes of the two through holes 110 must also be different.

[0056] It should be noted that for a single through hole 110, the through hole 110 can have one or more dimensions. Two through holes 110 having different dimensions means that at least one of the corresponding dimensions of the two through holes 110 is different. For example, if both through holes 110 are circular holes, then the two through holes 110 having different dimensions means that the two through holes 110 have different diameters. As another example, if both through holes 110 are rectangular holes, then the two through holes 110 having different dimensions means that at least one of the length and width of the two through holes 110 is different.

[0057] The following description uses examples of at least two through holes 110 with different shapes. After reading the following technical solutions, those skilled in the art will easily understand other configurations of multiple through holes 110. There are two through holes 110, one of which is a circular hole and the other is a square hole; or, there are three through holes 110, two of which are circular holes and the other is a square hole; or, there are three through holes 110, one of which is a circular hole, another is a square hole, and the third is a hexagonal hole.

[0058] Of course, in other embodiments of this application, there are multiple through holes 110, and the shapes and sizes of the multiple through holes 110 are the same, which helps to simplify the processing steps of the body 11.

[0059] In some embodiments, such as Figure 9 As shown, there are multiple through holes 110. The multiple through holes 110 include a first through hole F1 and a second through hole F2 arranged at intervals. Both the first through hole F1 and the second through hole F2 are fan-shaped holes. Therefore, the parts to be tested 3 supported at the first through hole F1 and the second through hole F2 are both fan-shaped, which helps to save the area occupied by the first through hole F1 and the second through hole F2 and reduce the volume of the support platform 1.

[0060] Furthermore, since the quality of the wafer is roughly symmetrical about its central axis, annealing can be performed on a fan-shaped region of the wafer, such as half or a quarter, followed by subsequent inspections. The inspection data can then characterize the data of the entire wafer. Therefore, by setting the first through-hole F1 and the second through-hole F2 as fan-shaped holes, it is convenient to accommodate the fan-shaped inspection section 3, thus meeting various wafer inspection requirements.

[0061] Optionally, in Figure 9 In the example, at least a portion of the arc surface of the first through hole F1 is located on the side away from the center of the first through hole F1 and away from the second through hole F2, and at least a portion of the arc surface of the second through hole F2 is located on the side away from the center of the second through hole F2 and away from the first through hole F1, so that the center of the first through hole F1 and the center of the second through hole F2 are both located between the arc surfaces of the first through hole F1 and the second through hole F2, so as to further save the area occupied by the first through hole F1 and the second through hole F2.

[0062] Optionally, in Figure 9 In the example, the edge of the first through hole F1 corresponding to one of the radii of the corresponding sector and the edge of the second through hole F2 corresponding to one of the radii of the corresponding sector are arranged parallel to each other, so as to further reduce the area occupied by the first through hole F1 and the second through hole F2.

[0063] Optionally, such as Figure 9 As shown, the radius of the arc surface of the first through hole F1 is equal to the radius of the arc surface of the second through hole F2. This helps to avoid wasting the arrangement space on the support platform 1 due to the large size difference between the first through hole F1 and the second through hole F2, so as to make full use of the arrangement space of the support platform 1.

[0064] Of course, the radius of the arc surface of the first through hole F1 and the radius of the arc surface of the second through hole F2 can also be different.

[0065] Optionally, if the central angle corresponding to the first through hole F1 is smaller than the central angle corresponding to the second through hole F2, then the central angle of the part to be tested 3 corresponding to the first through hole F1 can be smaller than the central angle of the part to be tested 3 corresponding to the second through hole F2, so that the body 11 can adapt to parts to be tested 3 of different sizes, so as to simultaneously carry parts to be tested 3 of different sizes.

[0066] For example, in Figure 9 In the example, the central angle corresponding to the first through hole F1 is 90°, and the part to be detected 3 corresponding to the first through hole F1 can be one-quarter of the entire wafer. The central angle corresponding to the second through hole F2 is 180°, and the part to be detected 3 corresponding to the second through hole F2 can be one-half of the entire wafer.

[0067] In some embodiments, such as Figure 3 and Figure 4 As shown, the through hole 110 has a variable cross-section hole section. The opening area of ​​the variable cross-section hole section gradually increases in the direction away from the part to be tested 3. This is so that while ensuring that the periphery 110a of the through hole 110 stably supports the part to be tested 3, the heat transfer area can be appropriately increased. This is beneficial to further improve the heating rate of the center of the part to be tested 3 and reduce the difference in the heating rate of the entire part to be tested 3.

[0068] It is understood that at least a portion of the through hole 110 forms a variable cross-section segment, for example, a portion of the through hole 110 forms a variable cross-section segment (e.g. Figure 4 As shown), at this time, the opening area of ​​the remaining part of the through hole 110 can remain unchanged, or the opening area of ​​the entire through hole 110 can gradually increase in the direction away from the part to be detected 3 (e.g., Figure 3 (As shown).

[0069] Of course, in other embodiments, the opening area of ​​the through hole 110 can remain constant along the axial direction of the through hole 110 (e.g. Figure 2 (As shown).

[0070] In some embodiments, such as Figures 5-8As shown, a support step 110b is formed on the peripheral wall of the through hole 110. The support step 110b is suitable for supporting the edge of the part to be tested 3, so that at least part of the part to be tested 3 can be accommodated in the through hole 110. At this time, the support step 110b and part of the peripheral wall of the through hole 110 can jointly define a bearing groove. The peripheral wall of the bearing groove can play a certain radial limiting role for the part to be tested 3, which is beneficial to improving the stability of the placement of the part to be tested 3.

[0071] It is understandable that the support step 110b can be extended into a closed ring, so that the support step 110b supports the entire edge of the part to be tested 3, which makes it easier to ensure that the part to be tested 3 is subjected to balanced force; or, the support step 110b includes a plurality of step portions arranged circumferentially along the through hole 110, each step portion extending circumferentially along the through hole 110.

[0072] It is understandable that, along the axial direction of the through hole 110, the thickness of the supporting step 110b can be set according to actual needs; the shape of the supporting step 110b can be set according to the specific application; for example, the cross-sectional area of ​​the supporting step 110b can always remain unchanged (e.g., ...). Figure 6 (as shown), or the cross-sectional area of ​​the supporting step 110b can gradually decrease in the direction away from the part to be detected 3 (e.g. Figure 7 and Figure 8 As shown), for example, the longitudinal cross-sectional shape of the supporting step 110 can be trapezoidal, so as to save the amount of material used in the main body 11 and reduce the cost while ensuring the reliable load bearing of the supporting step 110b.

[0073] Optionally, the radial width x of the edge portion of the part to be inspected 3 supported by the peripheral portion 110a of the through hole 110 can satisfy 2mm ≤ x ≤ 3mm, for example, x can be 1mm, 2.5mm, 3mm, 4.6mm, or 5mm, etc. Alternatively, the radial width of the edge portion of the part to be inspected 3 supported by the peripheral portion 110a of the through hole 110 occupies 0.5% to 3% of the total diameter of the part to be inspected 3.

[0074] Optionally, in Figure 6 In the example, the depth z of the support step 110b relative to the surface of the body 11 satisfies 1mm≤z≤2mm. For example, z can be 1mm, 1.2mm, 1.5mm, or 2mm, etc. The distance between the bearing surface of the support step 110b and the upper surface of the body 11 is z, and the distance z is basically the same as the thickness of the part to be detected 3.

[0075] Optionally, in Figure 6In the example, the width y of the supporting step 110b in the radial direction of the through hole 110 satisfies 2mm ≤ y ≤ 5mm, for example, y can be 2mm, 1.6mm, 3mm, 4.2mm, or 5mm, etc. Further, 1mm ≤ y ≤ 1.5mm, for example, y can be 1mm, 1.3mm, or 1.5mm, etc. Where y ≥ x.

[0076] Optionally, in Figure 6 In the example, the depth of the support step 110b relative to the surface of the body 11 is z, and the width of the support step 110b in the radial direction of the through hole 110 is y, 1≤y / z≤5, so as to ensure that the support step 110b can be used to support various sizes of the part to be tested 3, and the support step 110b can avoid the generation of internal stress in the part to be tested 3 during the annealing process, thereby reducing the warpage of the part to be tested 3 during the annealing process.

[0077] Of course, the peripheral wall of the through hole 110 may not have a supporting step 110b formed. In this case, the limit of the part to be tested 3 can be achieved by other means such as a limit buckle.

[0078] In some embodiments, the body 11 is a graphite part, and the outer surface of the body 11 is coated with silicon carbide. Silicon carbide has good chemical stability, which can prevent the body 11 from being repeatedly heated, resulting in rapid aging and damage, thereby improving the service life of the support platform 1.

[0079] Compared to some technologies where the entire support platform 1 is made of graphite, this application can increase the lifespan of the support platform 1 to about four times that of the support platform in the above-mentioned technologies by applying a silicon carbide coating to the outer surface of the body 11.

[0080] In some embodiments, such as Figures 10-12 As shown, the support platform 1 also includes a limiting buckle 12. The limiting buckle 12 is disposed on the body 11 and is located on the radial outer side of the through hole 110. When the part to be tested 3 is placed at the through hole 110, the limiting buckle 12 can be located at the edge of the part to be tested 3. If there are multiple limiting buckles 12, the multiple limiting buckles 12 can be arranged sequentially along the circumference of the through hole 110. When the part to be tested 3 is placed at the through hole 110, the multiple limiting buckles 12 can be arranged sequentially along the edge of the part to be tested 3.

[0081] Among them, the limit buckle 12 can be in a stop position relative to the body 11 (e.g. Figure 11 and Figure 12 (as shown) and avoidance positions (such as) Figure 10The device moves between the two sides (as shown). In the stop position, the limit buckle 12 is used to stop the surface of the part to be tested 3 on the side opposite to the body 11, so that the limit buckle 12 can at least play an axial limiting role for the part to be tested 3. In the avoidance position, the limit buckle 12 is used to release the stop on the part to be tested 3, so the limit buckle 12 will not stop on the surface of the part to be tested 3 on the side opposite to the body 11, so that the limit buckle 12 releases the axial limiting of the part to be tested 3, and at this time the part to be tested 3 can be removed from the body 11.

[0082] It is understandable that, in the clearance position, the limiting buckle 12 releases its stop on the part to be inspected 3. This can include, but is not limited to, the limiting buckle 12 moving toward the side of the part to be inspected 3 facing away from the body 11, so that the portion of the limiting buckle 12 used to stop the part to be inspected 3 moves to a position spaced apart from the part to be inspected 3 axially in the through hole 110, thereby achieving the purpose of releasing the stop on the part to be inspected 3; or, the limiting buckle 12 moving toward the radially outward side of the through hole 110, so that the portion of the limiting buckle 12 used to stop the part to be inspected 3 moves to a position spaced apart from the part to be inspected 3 radially in the through hole 110, thereby achieving the purpose of releasing the stop on the part to be inspected 3. In other words, in the clearance position, the limiting buckle 12 only needs to not affect the placement of the part to be inspected 3 on the body 11 or the removal of the part to be inspected 3 from the body 11.

[0083] For example, when the support platform 1 is used to fix the part to be tested 3, the limit buckle 12 can be moved to the avoidance position, so that the part to be tested 3 can be quickly placed on the body 11; after the part to be tested 3 is placed, the limit buckle 12 can be moved to the stop position to stably limit the part to be tested 3 to the current placement position, so as to ensure that the part to be tested 3 is fixed reliably.

[0084] Among them, there are one or more limit buckles 12; when there are multiple limit buckles 12, each limit buckle 12 can move between the stop position and the avoidance position relative to the body 11. Then each limit buckle 12 can be used to stop on the side surface of the part to be tested 3 facing away from the body 11, or it can be used to release the stop of the part to be tested 3, so as to facilitate the picking and putting of the part to be tested 3 while ensuring that the limit of the part to be tested 3 is reliable.

[0085] Optionally, when there are multiple limit buckles 12, the multiple limit buckles 12 can be arranged symmetrically about the reference line. The reference line can extend radially along the through hole 110. If the limit buckle 12 applies a certain squeezing force to the part to be tested 3, it is easy to make the part to be tested 3 be subjected to balanced force, so that during the annealing process, the part to be tested 3 can avoid generating excessive internal stress and affecting the annealing effect.

[0086] It is understandable that if the number of limit buckles 12 is even, then each limit buckle 12 has another limit buckle 12 that is symmetrical about the reference line. If the number of limit buckles 12 is odd, then one of the limit buckles 12 can be symmetrical about the reference line, and each of the remaining limit buckles 12 has another limit buckle 12 that is symmetrical about the reference line.

[0087] In the description of this application, "multiple" means two or more; for example, in Figure 10 and Figure 11 In the example, there are four limit buckles 12, evenly spaced along the circumference of the through hole 110. Of course, there can also be two, three, five, etc., limit buckles 12.

[0088] In some embodiments, such as Figure 10 and Figure 11 As shown, the limit buckle 12 can rotate relative to the body 11 between the stop position and the avoidance position. The movement mode of the limit buckle 12 is simple, which helps to simplify the structure of the support platform 1.

[0089] Of course, the movement of the limit buckle 12 is not limited to this; for example, the limit buckle 12 can also move relative to the body 11 between the stop position and the avoidance position. For example, the limit buckle 12 can slide relative to the body 11 along the radial direction of the through hole 110. In the stop position, the limit buckle 12 can move radially inward along the through hole 110 so that at least a part of the limit buckle 12 is located on the side of the part to be detected 3 facing away from the body 11. In the avoidance position, the limit buckle 12 can move radially outward along the through hole 110 so that the limit buckle 12 completely avoids the part to be detected 3, so as to facilitate the picking and putting of the part to be detected 3.

[0090] Optionally, in Figure 12 In the example, the rotation axis 120 of the limit buckle 12 is parallel to the central axis of the through hole 110, which facilitates the operation of the operator. At the same time, it is convenient for the limit buckle 12 to rotate to the side of the part to be tested 3 facing away from the body 11 to play a stopping role. In addition, it is convenient for the operator to more intuitively judge whether the limit buckle 12 has rotated to the required position, thus improving the convenience of operation.

[0091] It is understandable that the rotation axis 120 of the limit buckle 12 can also extend in other directions.

[0092] In some embodiments, such as Figures 10-12 As shown, the limit buckle 12 has a clearance part 121 and a stop part 122. The clearance part 121 and the stop part 122 are arranged sequentially around the rotation axis 120 of the limit buckle 12. That is, the clearance part 121 and the stop part 122 are arranged sequentially along the circumference of the limit buckle 12. When the limit buckle 12 rotates around its rotation axis 120, the position of the clearance part 121 and the stop part 122 in the circumference of the limit buckle 12 can be adjusted.

[0093] The radial distance between the outer edge of the clearance portion 121 and the rotation axis 120 is less than the radial distance between the outer edge of the stop portion 122 and the rotation axis 120. In the stop position, the stop portion 122 is used to stop on the side surface of the part to be tested 3 facing away from the main body 11. In the clearance position, the clearance portion 121 is used to clearance the edge portion of the part to be tested 3. When the limit buckle 12 rotates to the point where the clearance portion 121 corresponds to the part to be tested 3, the outer edge of the clearance portion 121 and the edge portion of the part to be tested 3 are radially spaced along the through hole 110, and the clearance portion 121 is located radially to the part to be tested 3. On the outside, to avoid the part to be tested 3, that is, along the axial direction of the through hole 110, the orthographic projection of the avoidance part 121 is located radially outside the orthographic projection of the part to be tested 3; when the limit buckle 12 rotates to the point where the stop part 122 corresponds to the part to be tested 3, the stop part 122 is located on the side of the part to be tested 3 facing away from the body 11, and in the radial direction of the through hole 110, at least a portion of the stop part 122 is located radially inside the outer edge of the part to be tested 3 to stop the part to be tested 3, that is, along the axial direction of the through hole 110, the orthographic projection of the stop part 122 coincides with the orthographic projection of the part to be tested 3.

[0094] The radial distance between the outer edge of the clearance portion 121 and the rotation axis 120 can be understood as the maximum radial distance between the outer edge of the clearance portion 121 and the rotation axis 120; the radial distance between the outer edge of the stop portion 122 and the rotation axis 120 can be understood as the maximum radial distance between the outer edge of the stop portion 122 and the rotation axis 120.

[0095] Optionally, in Figures 10-12 In the example, the outer edge of the clearance portion 121 can be formed as a straight line, and the outer edge of the stop portion 122 can be formed as a curve protruding in a direction away from the rotation axis 120 of the limit buckle 12. Of course, the shapes of the clearance portion 121 and the stop portion 122 are not limited to this, as long as it is ensured that in the radial direction of the bearing portion 1a, when the clearance portion 121 rotates to the radial inner side of the limit buckle 12, the clearance portion 121 is completely located on the radial outer side of the portion to be detected 3, and when the stop portion 122 rotates to the radial inner side of the limit buckle 12, at least a portion of the stop portion 122 is located on the radial inner side of the outer edge of the portion to be detected 3.

[0096] Optionally, in Figures 10-12 In the example, the avoidance part 121 and the stop part 122 are arranged opposite each other radially along the limit buckle 12, so the limit buckle 12 can be rotated approximately 180° to switch between the stop position and the avoidance position, which is convenient to operate.

[0097] It should be noted that, in the description of this application, the axial direction of the limit buckle 12 is the extension direction of the rotation axis 120 of the limit buckle 12, the circumferential direction of the limit buckle 12 is the direction around the rotation axis 120 of the limit buckle 12, and the radial direction of the limit buckle 12 is perpendicular to the axial direction and the circumferential direction of the limit buckle 12, respectively.

[0098] In some embodiments, such as Figure 12 As shown, the limiting buckle 12 can slide relative to the body 11 along the axial direction of the limiting buckle 12 between the mating position and the disengaged position, that is, the limiting buckle 12 and the body 11 slide and fit together along the axial direction of the limiting buckle 12, and the limiting buckle 12 and the body 11 slide and fit together along the axial direction of the through hole 110. In the separated position, the stop part 122 is adapted to be spaced apart from the part to be tested 3 in the axial direction of the limit buckle 12. That is, the stop part 122 is adapted to be spaced apart from the part to be tested 3 in the axial direction of the limit buckle 12. At this time, no matter how the limit buckle 12 is rotated, the limit buckle 12 cannot stop or limit the part to be tested 3, so as to facilitate the picking and placing of the part to be tested 3. In the mating position, the stop part 122 is adapted to be flush with the part to be tested 3 in the axial direction of the limit buckle 12. At this time, if the limit buckle 12 is rotated until the stop part 122 is aligned with the part to be tested 3, the stop part 122 can achieve the function of limiting and stopping the part to be tested 3. Of course, the limit buckle 12 can also be rotated until the clearance part 121 is aligned with the part to be tested 3, so that the clearance part 121 can achieve clearance of the part to be tested 3, which facilitates the picking and placing of the part to be tested 3.

[0099] like Figure 12 As shown, the support platform 1 also includes an elastic reset member 13. The elastic reset member 13 is connected between the limit buckle 12 and the body 11. The elastic reset member 13 is used to push the limit buckle 12 to move toward the mating position. The elastic reset member 13 always applies an elastic force to the limit buckle 12, so that the limit buckle 12 has a tendency to move toward the mating position. Thus, when the stop part 122 corresponds to the part to be tested 3, the limit buckle 12 can stably squeeze the part to be tested 3 under the action of the elastic reset member 13, so as to improve the limiting stability of the part to be tested 3.

[0100] It is understandable that the setting of the elastic reset member 13 relative to the limit buckle 12 can be set according to the actual application. For example, the two ends of the elastic reset member 13 are respectively connected to the wall of the slide groove of the limit buckle 12 and the body 11. The elastic reset member 13 can be in a stretched state to pull the limit buckle 12 toward the body 11. Of course, the elastic reset member 13 can also be in a compressed state.

[0101] Optionally, there are multiple elastic reset members 13 and multiple limit buckles 12, with each limit buckle 12 corresponding to one elastic reset member 13. The multiple limit buckles 12 can be arranged symmetrically about the reference line, and the multiple elastic reset members 13 can also be arranged symmetrically about the reference line, which extends radially along the through hole 110. If the limit buckle 12 applies a certain squeezing force to the part 3 to be tested under the action of the elastic reset member 13, it is easy to make the part 3 to be tested be subjected to balanced force, thereby avoiding the generation of excessive internal stress in the part 3 to be tested during the annealing process, which would affect the annealing effect.

[0102] Furthermore, the inventors used the bearing platform 1 in this application for annealing testing of the parts to be tested 3, and used a paperless temperature recording module to test 9 parts to be tested 3 ( Figure 14 The image shows four parts to be tested (3) for multi-point temperature measurement (e.g., ...). Figure 11 The test points shown were used to test the heating rate of the center and edge of each part 3 to be tested, and the results are as follows: Figure 16 and Figure 17 As shown in the figure, the horizontal axis represents time (in seconds), and the vertical axis represents temperature (in degrees Celsius). Figure 16 The middle part shows the temperature changes at multiple selected test points. Figure 17 The temperature changes of the nine test sections 3 are shown; it can be seen that the temperature of the center and edge of each test section 3 remains basically consistent throughout the annealing process, and the temperature of the entire test section 3 is relatively uniform.

[0103] According to the second aspect of the present invention, the support platform assembly 2, such as Figure 13 and Figure 14 As shown, the assembly includes a first support platform 21 and a second support platform 22. Both the first support platform 21 and the second support platform 22 are support platforms 1 for wafer annealing according to the first aspect embodiment of the present invention. The first support platform 21 is adapted to be inserted into the through hole 110 of the second support platform 22, and the first support platform 21 and the through hole 110 of the second support platform 22 are separable. That is, for the support platform assembly 2, the first support platform 21 and the second support platform 22 can be separated, in which case the first support platform 21 and the second support platform 22 can be used separately, or the first support platform 21 can be inserted into the through hole 110 of the second support platform 22, in which case the first support platform 21 and the second support platform 22 can be used in combination.

[0104] Therefore, when in use, the support platform assembly 2 can use the first support platform 21 alone to support the part to be tested 3 of the corresponding shape and size, or use the second support platform 22 alone to support the part to be tested 3 of the corresponding shape and size, or combine the first support platform 21 and the second support platform 22 to support the part to be tested 3 of the corresponding shape and size, so that the support platform assembly 2 can adapt to the part to be tested 3 of different shapes and sizes, and adapt to the heating chamber of the annealing device of different sizes.

[0105] It is understandable that the test part 3 carried by the first support platform 21 when used alone and the test part 3 carried by the first support platform 21 and the second support platform 22 when used in combination are the same in shape and size. However, the first support platform 21 and the combination of the first support platform 21 and the second support platform 22 occupy different spaces. At this time, a suitable support device can be selected according to the size of the heating cavity, etc.

[0106] According to the embodiment of the present invention, the carrier platform assembly 2, by setting a first carrier platform 21 and a second carrier platform 22, facilitates the flexible use of the carrier platform assembly 2 while ensuring the annealing effect of the entire test part 3.

[0107] An annealing apparatus according to a third aspect of the present invention includes a cavity, a heating device, and a support device. A heating chamber is defined within the cavity. The heating device is disposed within the cavity and is used to heat the heating chamber. The support device is used to support a part 3 to be tested and is adapted to be placed within the heating chamber to achieve rapid annealing of the part 3 to be tested. The support device includes a support stage 1 for wafer annealing according to the first aspect of the present invention and / or a support stage assembly 2 according to the second aspect of the present invention.

[0108] It should be noted that, in the description of this application, "and / or" means including three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution that satisfies both A and B. Therefore, the carrier device may include the aforementioned carrier stage 1 for wafer annealing, or the carrier device may include the aforementioned carrier stage assembly 2, or the carrier device may include the aforementioned carrier stage 1 and carrier stage assembly 2 for wafer annealing.

[0109] When the test section 3 needs to be annealed, or after the test section 3 has been annealed, the support device can be moved out of the heating chamber to facilitate the quick loading and unloading of the test section 3.

[0110] According to the annealing apparatus of the present invention, by employing the aforementioned support platform 1 and / or support platform assembly 2, it is convenient to ensure the consistency of the annealing effect of the entire part to be tested, thereby ensuring the stability and accuracy of subsequent testing of the part to be tested.

[0111] In some embodiments, the heating device is a halogen lamp, which results in a simple structure, low cost, and long service life. Of course, the heating device is not limited to this.

[0112] Other configurations and operations of the annealing apparatus according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0113] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0114] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0115] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0116] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A support stage for wafer annealing, characterized in that, The wafer has a section to be inspected, and the support stage includes: The body has at least one through hole, the shape of which is adapted to match the shape of the part to be detected, the periphery of each through hole is used to support the edge of the part to be detected, and the through hole has a variable cross-section hole segment, the opening area of ​​which gradually increases in the direction away from the part to be detected. A limiting buckle is disposed on the body and located radially outside the through hole. The limiting buckle can rotate relative to the body between a stop position and a clearance position. The rotation axis of the limiting buckle is parallel to the central axis of the through hole. The limiting buckle has a clearance part and a stop part, which are arranged sequentially around the rotation axis of the limiting buckle. The radial distance between the outer edge of the clearance part and the rotation axis is less than the radial distance between the outer edge of the stop part and the rotation axis. In the stop position, the stop part is used to stop on the side surface of the part to be tested facing away from the body. In the clearance position, the clearance part is used to avoid the edge of the part to be tested. The limiting buckle can also slide relative to the body along the axial direction of the limiting buckle between a mating position and a disengaged position. In the disengaged position, the stop part is adapted to be spaced apart from the part to be tested in the axial direction of the limiting buckle. In the mating position, the stop part is adapted to be flush with the part to be tested in the axial direction of the limiting buckle. An elastic reset member is connected between the limiting buckle and the body, and is used to push the limiting buckle toward the mating position.

2. The support stage for wafer annealing according to claim 1, characterized in that, There are multiple through holes, and at least two of the through holes have different shapes and sizes.

3. The support stage for wafer annealing according to claim 1, characterized in that, The through holes are multiple, including a first through hole and a second through hole arranged at intervals, and both the first through hole and the second through hole are fan-shaped holes.

4. The support stage for wafer annealing according to claim 3, characterized in that, The radius of the arc surface of the first through hole is equal to the radius of the arc surface of the second through hole.

5. The support stage for wafer annealing according to claim 3, characterized in that, The central angle corresponding to the cross-section of the first through hole is smaller than the central angle corresponding to the cross-section of the second through hole.

6. The support stage for wafer annealing according to any one of claims 1-5, characterized in that, The peripheral wall of the through hole is formed with a support step, which is adapted to support the edge of the part to be detected.

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