Method and apparatus for shielding a multi-layer multi-port connector assembly from electromagnetic interference

Abstract

A multilayer multi-connector assembly (1a) with high-speed, low-speed and power terminals that is immune to electromagnetic interference, wherein the assembly includes an electromagnetic shielding enclosure configured to protect a top port connector and be located above a bottom port connector to provide shielding for at least the top port connector and the bottom port connector against a range of electromagnetic interference (EMI), wherein when the electromagnetic shielding enclosure is located above the bottom port connector, at least a portion of the top port connector is located above the bottom port connector.

Description

[0001] Related applications

[0002] This application claims priority to U.S. Provisional Application US62 / 910462, filed October 4, 2019, which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to the field of connectors, and more specifically to connectors suitable for high data rate applications. Background Technology

[0004] This section provides information to facilitate a better understanding of various aspects of the invention. Therefore, the statements in this section should be interpreted in this light and should not be construed as an admission of what is prior art or what is not prior art.

[0005] To date, it has been a challenge to manufacture a connector assembly that includes multiple high-speed connectors in a compact manner while providing electromagnetic interference (EMI) shielding.

[0006] Accordingly, we hope to provide solutions to address this challenge. Summary of the Invention

[0007] The inventors have described various exemplary input / output (I / O) connector assemblies. Furthermore, this innovative assembly includes electromagnetic interference (EMI) protection.

[0008] In one embodiment, an innovative multi-level, multi-port connector assembly may include: an electromagnetic shielding enclosure configured to protect a top port connector and located above a bottom port connector to provide shielding for at least the top and bottom port connectors against a range of electromagnetic interference (EMI), wherein, when the electromagnetic shielding enclosure is located above the bottom port connector, at least a portion of the top port connector is located above the bottom port connector. In such a connector, each of the top and bottom port connectors may include a power conductor and a communication signal conductor, wherein the signal conductor is capable of transmitting at least a high-speed communication signal.

[0009] In an innovative connector assembly that includes top and bottom port connectors, the bottom port connector may include a surface mount technology (SMT) connector, while the top port connector may include a crimp connector. Alternatively, the top and bottom port connectors may be configured to use ball grid array, solder filling, crimping, SMT, or fiber optic connections.

[0010] In one embodiment, among other components, the enclosure may include a cover, an enclosure base, a top rear cover, a bottom rear cover, and a front shield, wherein the cover and the front shield may include one or more associated openings capable of allowing airflow into or out of the interior of the enclosure. Furthermore, for example, each of the openings may be configured to have a width and a depth to reduce the impact of EMI on components inside the assembly. Additionally, the innovative enclosure may also include an internal heat sink, a first fastening fastener, a top heat sink, and a second fastening fastener, wherein one embodiment of the internal heat sink may have a length substantially the same as the overall length of the cover.

[0011] In one embodiment, the innovative front-end shield may include a plurality of conductive deformable elements formed around a portion or substantially all of the periphery of the front-end shield, the plurality of elements including a portion of a grounded conductor, and the innovative first fastening fastener may include one or more deformable elements capable of applying force to the internal heat sink to contact a component within the shield.

[0012] For example, the top port connector or bottom port connector may include part of a bypass connector.

[0013] In addition to the aforementioned connection technologies, innovative components can be configured such that: a top port connector includes a high-speed communication signal terminal configured to be connected to a circuit board via a cable and a low-speed communication signal terminal or power terminal configured to be connected to the circuit board via a cable; and a bottom port connector includes a high-speed communication signal terminal configured to be directly connected to the circuit board and a low-speed communication signal terminal or power terminal configured to be directly connected to the circuit board.

[0014] Alternatively, an innovative connector assembly may be configured such that: a top port connector includes a high-speed communication signal terminal configured to be connected to a circuit board via a cable and a low-speed communication signal terminal or power terminal configured to be directly connected to the circuit board, and a bottom port connector includes a high-speed communication signal terminal configured to be connected to the circuit board via a cable and a low-speed communication signal terminal or power terminal configured to be directly connected to the circuit board.

[0015] As an alternative, the connector assembly may be configured such that: a top port connector includes a high-speed communication signal terminal configured to be connected to a circuit board via a cable and a low-speed communication signal terminal or power terminal configured to be directly connected to the circuit board, and a bottom port connector includes a high-speed communication signal terminal configured to be directly connected to the circuit board and a low-speed communication signal terminal or power terminal configured to be directly connected to the circuit board.

[0016] As another alternative, the connector assembly can be configured such that: a bottom port connector includes a low-speed communication signal terminal or a power terminal configured to be connected to a circuit board via a cable.

[0017] In addition to innovative connector assemblies, the inventors provide innovative EMI shielding for multi-layer, multi-port connector assemblies. One such method may include: attaching a bottom port connector to a circuit board; and protecting a top port connector and the attached bottom port connector with an electromagnetic shielding enclosure to provide shielding against a range of electromagnetic interference (EMI) for at least the top and bottom port connectors. Such a method may also include conducting at least high-speed communication signals and power from the top and bottom port connectors.

[0018] In another embodiment, mounting the bottom port connector may include connecting the bottom port connector using surface mount technology (SMT), and connecting the top port connector to the circuit board may also include using a crimp connection.

[0019] Other connection technologies may also be used. For example, a top port connector and a bottom port connector may be configured to be connected to the circuit board using, for example, SMT, crimp connection, ball grid array, solder filler, or fiber optic connection.

[0020] As previously described, in the exemplary method, the enclosure may include a cover, an enclosure base, a top rear cover, a bottom rear cover, and an EMI front shield.

[0021] The innovative method may further include additional features such as (1) allowing airflow into or out of the interior of the enclosure using one or more openings, wherein each of the one or more openings is configured to have a width and a depth that reduce the impact of EMI on the components inside the assembly, and (2) forming a ground conductor by a plurality of conductive deformable elements formed around part or substantially all of the periphery of a front shield.

[0022] Similarly, as previously mentioned, in each of the innovative methods, the top port connector or bottom port connector may include at least a portion of a bypass connector.

[0023] Innovative top and bottom port connectors may include a combination of high-speed, low-speed, and power terminals and can be connected to a circuit board in many ways.

[0024] For example, in one innovative approach, the top port connector may include high-speed communication signal terminals and low-speed communication signal terminals or power terminals. Such a method may involve connecting the two sets of terminals to a circuit board using a cable.

[0025] In another innovative approach, the bottom port connector includes high-speed communication signal terminals and low-speed communication signal terminals or power terminals. Such a method may involve directly connecting the two sets of terminals to a circuit board.

[0026] Another innovative method includes a top port connector comprising high-speed communication signal terminals and low-speed communication signal terminals or power terminals. Such a method may include connecting the high-speed communication signal terminals to the circuit board via cables and directly connecting the low-speed communication signal terminals or power terminals to the circuit board.

[0027] Another innovative approach includes a bottom port connector comprising high-speed communication signal terminals and low-speed communication signal terminals or power terminals. Such a method may further include connecting the high-speed communication signal terminals to a circuit board via cables and directly connecting the low-speed communication signal terminals or power terminals to the circuit board.

[0028] Two other innovative methods include (i) a top port connector comprising a high-speed communication signal terminal configured to be connected to the circuit board via a cable and a low-speed communication signal terminal or power terminal configured to be directly connected to the circuit board; and a bottom port connector comprising a high-speed communication signal terminal configured to be directly connected to the circuit board and a low-speed communication signal terminal or power terminal configured to be directly connected to the circuit board; and (ii) a bottom port connector comprising a low-speed communication signal terminal or power terminal. Such methods may include connecting the terminals to the circuit board via a cable. Attached Figure Description

[0029] The invention is illustrated by way of example and is not limited to the accompanying drawings, in which similar reference numerals denote similar parts, and in the drawings:

[0030] Figure 1 A perspective view of an exemplary innovative connector assembly according to an embodiment of the present invention is shown.

[0031] Figure 2A and Figure 2B A front view and a rear view of a component according to an embodiment of the present invention are shown respectively.

[0032] Figure 3 An exploded view shows an exemplary component that can be used to construct an exemplary shielding enclosure according to an embodiment of the present invention.

[0033] Figure 4 and Figure 5 An exemplary opening according to an embodiment of the present invention is shown.

[0034] Figure 6 This image shows a three-dimensional internal view of an exemplary connector assembly according to an embodiment of the present invention.

[0035] Figure 7 An exploded view of a portion of a top port connector of an exemplary connector assembly according to an embodiment of the present invention is shown.

[0036] Figure 8A and Figure 8B A side view of an exemplary connector according to an embodiment of the present invention is shown.

[0037] Figure 9 An illustrative view of the interior of an exemplary component according to an embodiment of the present invention is shown.

[0038] Figure 10 and Figure 11 An innovative component is shown in which a high-speed communication signal terminal and a low-speed or power terminal of a top port connector according to an embodiment of the present invention are connected to a circuit board.

[0039] Figure 12 and Figure 13 An innovative component according to an embodiment of the present invention is shown.

[0040] Figures 14 to 17 An innovative component comprising multiple modular parts is shown according to an embodiment of the present invention.

[0041] Specific embodiments of the invention are disclosed below with reference to various accompanying drawings and sketches. The description and illustrations are provided to enhance understanding. For example, the dimensions of some components in the figures may be exaggerated relative to other components, and well-known components that are beneficial or even essential to commercially successful embodiments may not be shown, thereby achieving a less obstructive and clearer presentation of the embodiments.

[0042] Given what is known in the art, brevity in the illustrations and descriptions is sought to effectively enable those skilled in the art to make, use, and best practice the invention. Those skilled in the art will understand that various modifications and changes can be made to the specific embodiments described below without departing from the spirit and scope of the invention. Therefore, the specification and drawings should be considered illustrative and exemplary, not restrictive or all-encompassing, and all such modifications to the specific embodiments described below are intended to be included within the scope of the invention. Detailed Implementation

[0043] The following detailed description will illustrate exemplary embodiments and is not intended to limit one to the explicitly disclosed combinations. Therefore, unless otherwise stated, the features disclosed herein may be combined to form other combinations not shown for brevity.

[0044] The features provided herein are illustrated by means of preferred and exemplary embodiments thereof. Upon reading this invention, those skilled in the art will generate many other embodiments, modifications, and variations within the scope and concept of the appended claims.

[0045] The terms “comprises”, “comprising”, or any other variations thereof, as used herein and in the appended claims, are intended to refer to non-exclusive inclusion, meaning that a process, method, article, or apparatus that includes a list of elements does not include only those elements in the list, but may also include other elements not expressly listed in or inherent in such a process, method, article, or apparatus.

[0046] The terms “indefinite article (a) before a consonant” or “indefinite article (an) before a vowel” as used in this article are defined as one or more. The term “plurality” as used in this article is defined as two or more. The term “another” as used in this article is defined as at least a second or more.

[0047] Unless otherwise stated herein, the use of relational terms such as “first” and “second”, “top” and “bottom” (if any) is only for distinguishing one entity or action from another, and is not required to require or imply any actual such relationship, order or importance between these entities or actions.

[0048] The terms “including” and / or “having” as used herein are defined as including (i.e., open-ended). The term “coupled” as used herein is defined as connecting, although not necessarily directly or mechanically. The use of “or” or “and / or” in this document is defined as inclusive (A, B, or C refers to any one, any two, or all three letters) and not exclusive (unless explicitly stated otherwise); therefore, the use of “and / or” in certain circumstances should not be interpreted as implying that the use of “or” elsewhere implies that the use of “or” is exclusive. Terms derived from the word “indicating” (e.g., “indicates” and “indication”) are intended to encompass all the various techniques that can be used to express (communicate) or refer to the indicated object / information. Some, but not all, examples of techniques that can be used to express or reference the object / information shown include the conveyance of the object / information being represented, the conveyance of the identifier of the object / information being represented, the conveyance of information used to generate the object / information being represented, the conveyance of a part or portion of the object / information being represented, the conveyance of certain derivatives of the object / information being represented, and the conveyance of certain symbols representing the object / information being represented.

[0049] As used herein, the terms “high speed” and “high data rate” are synonymous unless the context or knowledge of a person skilled in the art indicates otherwise. Similarly, the terms “low speed” and “low data rate” are synonymous unless the context or knowledge of a person skilled in the art indicates otherwise.

[0050] As used herein, the phrase “operable to” means “function to”, unless the context or knowledge of a person skilled in the art indicates otherwise.

[0051] Now refer to Figure 1 A perspective view of an exemplary innovative multi-layer, multi-port connector assembly 1a is shown. As illustrated, according to one embodiment of the invention, assembly 1a may include a top port connector 3b configured to protect a top port connector 3b (hidden in the figure but see below). Figure 6 An electromagnetic shield 2 and a bottom port connector 3a, and a circuit board 4.

[0052] More in detail, Figure 1In the embodiment shown, the shield 2 is located above the bottom port connector 3a and provides shielding against a range of electromagnetic interference (EMI) for at least the top port connector, the bottom port connector (and other components within the shield), wherein at least a portion of the top port connector 3b (not shown again) is located above the bottom port connector 3a, and thus, the electromagnetic shield 2 is located above the bottom port connector 3a.

[0053] For example, connectors 3a and 3b may include an input / output (I / O) connector such as those for optical small form-factor pluggable applications or dual-density optical small form-factor pluggable applications. As constructed, the assembly may be referred to as a multi-port, multi-layer EMI-shielded connector.

[0054] More specifically, in some embodiments, connectors 3a and 3b may each be configured to transmit electrical signals or optical signals. In the latter case, each connector may include optoelectronic (O / E) or electro-optical (E / O) conversion circuitry. In other embodiments, connectors 3a and 3b may each include active electrical devices, such as amplifiers and retiming circuitry.

[0055] In many cases, O / E, E / O conversion circuits, active devices, and retiming circuits can generate a significant amount of heat during operation. Therefore, as further explained herein, each connector may include more than one heat sink.

[0056] Continuing, each connector 3a, 3b may include one or more independent power and communication signal conductors forming part of an independent power and communication signal path (i.e., typically, multiple ports are not electrically connected to each other). In some embodiments, at least exemplary high-speed communication signals up to and exceeding 112 gigabits per second (Gbps) may be transmitted by the signal conductors of connectors 3a, 3b of component 1a. In alternative embodiments, communication signals up to 160 Gbps may be transmitted by the conductors of connectors 3a, 3b of component 1a.

[0057] In one embodiment, for example, the bottom port connector 3a may be a surface mount technology (SMT) connector, which may first be mounted on the board 4, for example, using a soldering process. Subsequently, the top port connector 3b (again not shown) and the housing 2 may be press-fitted onto the board 4, such that the top port connector 3b and the housing 2 are as follows: Figure 2A and Figure 2B The shown location is above the bottom port connector 3a to form a multi-layer, multi-port connector assembly, wherein... Figure 2A Showing a front view Figure 2B A rear view of component 1a is shown. Positioned in this way, the enclosure 2 can be operated to provide shielding for the top port connector 3b and bottom port connector 3a against a range of electromagnetic interference (EMI), e.g., nominally covering 10MHz to 50GHz. In an alternative embodiment, the bottom port connector 3a and the enclosure 2 / attached top port connector 3b can be connected to the circuit board 4, for example, using a ball grid array, solder charge, crimping, SMT, a fiber optic technology, or a combination of these technologies. As a result, the mounted top port connector 3b and bottom port connector 3a are protected by the electromagnetically shielded enclosure 2 to shield at least the top port connector 3b and bottom port connector 3a against a range of electromagnetic interference (EMI).

[0058] Now refer to Figure 3 An exploded view of exemplary components that can be used to construct an exemplary shielding enclosure 2 is shown. As illustrated, enclosure 2 may include a conductive cover 20a on three sides (e.g., a top and two sides), an enclosure base 21, a top rear cover 22a, a bottom rear cover 23a, and an EMI front shield 24a. These components 20a, 21, 22a, 23a, and 24a may each be capable of being used as EMI shielding for components (such as a top connector, a bottom connector) that they respectively cover. In one embodiment, for example, components 20a, 21, 22a, 23a, and 24a may be made of a sufficiently conductive metal or a conductive plated plastic, although these are only two of many types of conductive materials that can be used.

[0059] The front shield 24a may include one or more associated openings, apertures, or orifices 24b (collectively, “apertures”) that can be used to allow airflow into and / or out of the interior of the housing 2 to reduce the temperature of components enclosed by the housing 2, such as the top port connector 3b and any components connected to the connector 3b. Furthermore, the front shield 24a may also include a plurality of conductive, deformable “fingers” or elements 240a-240n (collectively, “elements”, where “n” denotes the last element) that can be formed around a portion or substantially all of the periphery of the shield 24a. In one embodiment, other devices (e.g., paddle cards, see [link to relevant documentation]) having corresponding, opposing deformable elements (not shown) may also be included. Figure 9 Component 5) can be pushed onto and positioned on elements 240a-240n, so that other devices can be referred to as “insertion” assembly 1a. The opposing forces of the two sets of opposing deformable elements secure the other devices to assembly 1a. Furthermore, in one embodiment, because elements 240a-240n are conductive, an electrical grounding path can be established.

[0060] Continuing, the cover 2 may further include: a central portion 25a, which may include an internal radiator 25b and a first fastening fastener 25c; and a top radiator 26a and a second fastening fastener 26b, the latter two components being configured to be positioned above the cover 20a. Although Figure 3 The enclosure 2 is shown to include all the components just described, but it should be understood that other embodiments of the connector assembly may be conceived as including only a subset of these components. Furthermore, other embodiments may include, for example: (i) Figure 3 (2) Fewer components (i.e., not shown) Figure 3 (a subset of the components shown); and / or (iii) Figure 3 The components shown and Figure 3 A subset of other components not shown.

[0061] More specifically, the first fastening fastener 25c may include one or more deformable elements 25e, which can be used to apply force to the internal heat sink 25b within the middle portion 25a of the housing. As a result of this force, the heat sink 25b contacts components within the housing 2, such as a plug module that inserts into the bottom port connector 3a. Turning to the second fastening fastener 26b, in one embodiment, for example, the fastener 26b may be used to apply force to the top heat sink 26a, thereby contacting the heat sink 26a with components surrounded by and within the housing 2, such as a plug module that inserts into the top port connector 3b, O / E and / or E / O conversion circuitry, active devices, and / or retiming circuitry.

[0062] In several embodiments of the invention, the innovative component 1a may include additional components besides the front shield 24a that can be used to reduce the temperature of the internal components of component 1a. For example, cover 20a (see...) Figure 1 Top rear cover 22a, bottom rear cover 23a (see...) Figure 2B ) and the middle part of the cover 25a (see Figure 3 Each of the following may include: one or more corresponding associated openings 20b, 22b, 23b, 25d, which can be used as a cover 2 to allow airflow into the interior in order to reduce the temperature of the component surrounded by the cover 2.

[0063] Depending on the embodiment, one or more of the above-mentioned openings can each be formed into a hexagon, such as... Figure 4The opening 6 is shown. Alternatively, one or more of the above openings may each be formed as a circle, to name only two of many different types of opening shapes that can be used but still allow the openings to serve to reduce the temperature of the components of the innovative component. Furthermore, for example, a given set of associated openings may include a subset of hexagonal openings and a subset of circular openings. In some embodiments, a surface area and / or structure of a component of the innovative component (e.g., components 20a, 22a, 23a, 25a) may allow to include more hexagonal openings than circular openings due to the size of the component and the openings (i.e., more hexagonal openings can be formed in a component than circular openings).

[0064] Furthermore, each opening (such as opening 20b) can be configured to have a width that depends on one or more frequencies for which attenuation is sought to reduce the impact of EMI on components inside component 1a, and can be configured to have an extruded depth that depends on the amount of attenuation required (e.g., in dB) for reducing the impact of EMI on internal components. For example, the smaller the width of the opening, the higher the upper cutoff frequency that can be attenuated, and the deeper the extruded depth of an opening, the more a given signal at a given frequency can be attenuated (i.e., the decibel level of the signal is reduced). In one embodiment, an opening used as part of an innovative component may have (i.e., its dimensions are set) a width and extruded depth corresponding to the amount of attenuation required.

[0065] Furthermore, in some embodiments, an opening of a given size within a set of openings may be repeated periodically to avoid opening-to-opening enhancement or "gain" at a given frequency or band at multiple frequencies.

[0066] An exemplary opening is shown in Figure 5 The apertures 40a, 40b, 40c, and 40d each have the same width and thus attenuate signals over a substantially similar frequency range. However, for example, because the exemplary apertures 40b, 40c, and 40d have a greater extrusion depth than aperture 40a, these apertures 40b, 40c, and 40d are more effective at attenuating a given signal at a given frequency (i.e., apertures 40b, 40c, and 40d are more effective at reducing a signal by a decibel level than aperture 40a).

[0067] For example Figure 5As shown, the thickness of the cover 20a can be set to achieve a desired EMI attenuation level. For example, a thin thickness 42 made of a given material can attenuate unwanted frequencies less than a thick thickness 43 of the same given material. Furthermore, the cover 20a may comprise multiple layers 44a-n of the same or different attenuating materials (e.g., some layers may be made of metallic materials while others may be made of other conductive materials such as coated plastics).

[0068] Figure 6 A perspective internal view of a connector assembly 1a according to an embodiment of the present invention is shown, wherein a top port connector 3b and a bottom port connector 3a are mounted on a circuit board 4. Referring now to... Figure 7 The diagram shows a partial exploded view of the top port connector 3b. As shown, connector 3b may include a bypass connector with multiple cables 3c (e.g., biaxial differential cables), each of which may be capable of transmitting high-speed (e.g., 112Gbps, up to 160Gbps) signals entering and exiting connector 3b. In this embodiment, the top port connector 3b may also include a high-speed wafer 3d, a centrally located low-speed / power wafer 3e, ground wafers 3f and 3g, and top and bottom bases 3h and 3i. The term "bypass connector" refers to a connector that is connected at one location to a circuit board and transmits signals to / from another location on the same circuit board, such as an application-specific integrated circuit (ASIC) (or other component), via connected wiring, thereby bypassing the intermediate conductive traces on the circuit board to reduce any signal loss, crosstalk, or other adverse effects associated with these traces.

[0069] Figure 8A and Figure 8B Side views of connectors 3a and 3b are shown. As indicated, Figure 8B The view of connector 3b is a partial cross-sectional view according to an embodiment of the present invention. As shown, the conductor in the sheet 3e that can transmit low-speed or power signals can be connected to the circuit board 4, while the conductor in the sheet 3d that can transmit high-speed signals can be connected to the cable 3c (e.g., a biaxial cable).

[0070] Now refer to Figure 9 An illustrative view of the interior of component 1a is shown, with cover 20a removed. In one embodiment, the internal heat sink 25b may extend substantially the same length as the entire cover 20a. An overmold 7 covering the grounding sheet 3f (not visible) is also shown. In one embodiment, the overmold 7 may be made of, for example, plastic.

[0071] Now refer to Figure 10 and Figure 11 The innovative component 1a, shown as a high-speed communication signal terminal (e.g., 112 Gbps) and a low-speed (e.g., below 10 Gbps) or power terminal (e.g., 1.6 Amperes) of the top port connector 3b, can be configured to be connected to the circuit board 4 using their respective cables 30.

[0072] It will be understood that these speed and power levels are merely exemplary. For example, in an alternative embodiment, a connector may include: low-speed power conductors, wherein associated and designated ground contacts electrically isolate each conductor (i.e., conductor contacts) to increase the speed (i.e., data rate) to, for example, more than 10 Gbps. Furthermore, in an alternative embodiment, connectors 3a, 3b may include multiple parallel power terminals reaching power levels exceeding, for example, 1.6 amps.

[0073] exist Figure 11 In the middle, component 1a of cover 20a has been removed to allow the reader to see connectors 3a and 3b. For example, as shown, the high-speed communication signal terminals may be located on the left and right sides of the top port connector 3b, while the low-speed or power terminals may be centrally located between the high-speed communication signal terminals (not shown). In this embodiment, the high-speed communication signal terminals and low-speed / power terminals of the bottom port connector 3a may be configured to be directly connected to the circuit board 4 (i.e., without any cables).

[0074] Now refer to Figure 12 and Figure 13 The innovative component 1b is shown as a high-speed communication signal terminal configured as a top port connector 3b and a bottom port connector 3a, respectively connected to the circuit board 4 via their respective cables 30a and 30b. Figure 13 The cover 20aa of component 1b has been removed to allow the reader to see connectors 3aa and 3b. Figure 13 As shown, the high-speed communication signal terminals of connectors 3aa and 3b can be located on the left and right sides of their respective connectors. In this embodiment, the low-speed / power terminal (not shown) located centrally between the top and bottom port connectors 3aa and 3b can be configured to be directly connected to the circuit board 4 (i.e., without any cables).

[0075] exist Figures 1 to 13 In the illustrated embodiment, the low-speed / power terminals of the top port connector are shown configured to be directly connected to circuit board 4. In other embodiments, these terminals may be configured to be connected to circuit board 4 via their respective cables (e.g., discrete wires capable of transmitting low-speed signals, biaxial or other components).

[0076] For example, now refer to Figure 14In this embodiment, an innovative component 100 may include modular portions 100a, 100b, and 100c, and may be constructed, for example, by positioning portion 100b above portion 100c and portion 100a above portion 100b. Component 100 may include a bottom port 300a and a top port connector 300b, such as... Figure 15 As shown. In Figure 15 In this design, the covers of several modular sections have been removed to allow the reader to see connectors 300a and 300b. In one embodiment, the high-speed communication signal terminals and low-speed / power terminals of the top port connector 300b can be configured to be connected to circuit board 4 via respective cables 100d and 100e. For example, as Figure 15 As shown, the high-speed communication signal terminals can be located on the left and right sides of the top port connector 300b, while the low-speed or power terminals can be centrally located between the high-speed communication signal terminals.

[0077] Now refer to Figure 16 Similar to component 100, an innovative component 1000 is shown. For example, component 1000 may include modular portions 1000a, 1000b, and 1000c, which can be constructed, for example, by positioning portion 1000b above portion 1000a and portion 1000c above portion 1000b. Component 1000 may include a bottom port 3000a and a top port connector 3000b, such as... Figure 17 As shown. In Figure 17 In this design, the covers of several modular sections have been removed to allow the reader to see connectors 3000a and 3000b. In one embodiment, the high-speed communication signal terminals and low-speed / power terminals of the top port connector 3000b are configurable to be connected to circuit board 4 via respective cables 1000d and 1000e. For example, as... Figure 17As shown, high-speed communication signal terminals may be located on the left and right sides of the top port connector 3000b, while low-speed or power terminals may be centrally located between the high-speed communication signal terminals. Additionally, in this embodiment, the high-speed communication signal terminals of the bottom port connector 3000a may also be configured to be connected to the circuit board 4 via cable 1000f. It should be understood that the bottom port connector described herein may be a bypass connector. Furthermore, although the low-speed or power terminals of the bottom port connector are shown in the figures as configured to be directly connected to the circuit board 4, in alternative embodiments, these terminals may be configured to be connected to the circuit board 4 using suitable low-speed components described above. In yet another embodiment, an innovative component may include one or more of the features described above, and may also include a top port connector comprising high-speed communication signal terminals configured to be connected to a circuit board via cable and low-speed communication signal terminals or power terminals configured to be directly connected to the circuit board. Furthermore, such a component may include a bottom port connector comprising high-speed communication signal terminals configured to be directly connected to the circuit board and low-speed communication signal terminals or power terminals configured to be directly connected to the circuit board.

[0078] It will be understood that the cable used to connect the terminals of the top or bottom port to another device, such as circuit board 4, does not need to be a biaxial cable. Other types of cables may also be used. Furthermore, optical fiber may be used instead of coaxial or copper cables. In the case of optical fiber, an innovative component may include the optoelectronic (or vice versa) conversion circuit described herein.

[0079] The following claims, in an expanded form (i.e., hierarchical from widest to narrowest), are incorporated herein by reference, wherein each possible combination indicated by reference in the multiple dependent claims is illustrated with a unique, independent embodiment.

[0080] Although the benefits, other advantages, and solutions to problems have been described above with reference to specific embodiments of the invention, these benefits, advantages, and solutions to problems, as well as any element that may cause or result in such benefits, advantages, or solutions, or make such benefits, advantages, or solutions more apparent, should not be construed as a critical or necessary feature or element of any or all claims.

Claims

1. A multi-layer, multi-port connector assembly, comprising: An electromagnetic shielding enclosure with an attached top port connector; as well as The bottom port connector is mounted on a circuit board and is separate from the electromagnetic shielding enclosure with an attached top port connector. The electromagnetic shielding enclosure provides shielding against a range of electromagnetic interference (EMI) for at least the top and bottom port connectors. Specifically, when the electromagnetic shielding housing with the attached top port connector is located above the bottom port connector, at least a portion of the top port connector is located above the bottom port connector. The electromagnetic shielding enclosure includes a cover, a base, a top rear cover, a bottom rear cover, and a front shield. The cover has a top surface and two side surfaces. Each of the cover, the front shield, the top rear cover, and the bottom rear cover includes one or more associated openings that allow airflow into or out of the enclosure. Each opening is configured to have a width and a depth to reduce the impact of electromagnetic interference (EMI) on internal components. The top port connector includes a high-speed communication signal terminal, a low-speed communication signal terminal, or a power terminal, wherein the high-speed communication signal terminal of the top port connector is configured to be connected to the circuit board via a cable; the bottom port connector includes a high-speed communication signal terminal, a low-speed communication signal terminal, or a power terminal.

2. The connector assembly according to claim 1, wherein, Each of the top port connector and the bottom port connector includes a power conductor and a communication signal conductor, wherein the signal conductor is capable of transmitting at least a high-speed communication signal.

3. The connector assembly according to claim 1, wherein, The bottom port connector includes a surface mount technology (SMT) connector.

4. The connector assembly according to claim 1, wherein The top port connector includes a crimp connector.

5. The connector assembly according to claim 1, wherein The top port connector and bottom port connector are configured to use ball grid array, solder filling, crimping, surface mount technology (SMT), or fiber optic connection.

6. The connector assembly according to claim 1, wherein, The front-end shield includes a plurality of conductive deformable elements formed around part or all of the periphery of the front-end shield, the plurality of conductive deformable elements including a portion of a grounded conductor.

7. The connector assembly according to claim 1, wherein, The cover also includes an internal radiator, a first fastening fastener, a top radiator, and a second fastening fastener.

8. The connector assembly according to claim 7, wherein The internal heat sink has the same length as the overall length of the cover.

9. The connector assembly of claim 7, wherein, The first fastening fastener includes one or more deformable elements capable of applying force to the internal heat sink to contact a component within the enclosure.

10. The connector assembly of claim 1, wherein, The top port connector or bottom port connector includes a portion of a bypass connector.

11. The connector assembly of claim 1, wherein, The low-speed communication signal terminal or the power terminal of the top port connector is configured to be connected to the circuit board via a cable; the high-speed communication signal terminal of the bottom port connector is configured to be directly connected to the circuit board, and the low-speed communication signal terminal or the power terminal of the bottom port connector is configured to be directly connected to the circuit board.

12. The connector assembly of claim 1, wherein, The low-speed communication signal terminal or the power terminal of the top port connector is configured to be directly connected to the circuit board; the high-speed communication signal terminal of the bottom port connector is configured to be connected to the circuit board via a cable, and the low-speed communication signal terminal or the power terminal of the bottom port connector is configured to be directly connected to the circuit board.

13. The connector assembly of claim 1, wherein, The low-speed communication signal terminal or power terminal of the top port connector is configured to be directly connected to the circuit board; the high-speed communication signal terminal of the bottom port connector is configured to be directly connected to the circuit board, and the low-speed communication signal terminal or power terminal of the bottom port connector is configured to be directly connected to the circuit board.

14. The connector assembly of claim 1, wherein, The low-speed communication signal terminal or the power terminal of the bottom port connector is configured to be connected to the circuit board via a cable.

15. A method for shielding a multilayer, multiport connector assembly from electromagnetic interference, comprising: Connect a bottom port connector to a circuit board; as well as The electromagnetic shielding housing with the attached top port connector is separated from the bottom port connector, and the electromagnetic shielding housing with the attached top port connector is positioned above the bottom port connector to provide shielding for at least the top port connector and the bottom port connector against a range of electromagnetic interference (EMI). The electromagnetic shielding enclosure includes a cover, a base, a top rear cover, a bottom rear cover, and a front shield. The cover has a top surface and two side surfaces. Each of the cover, the front shield, the top rear cover, and the bottom rear cover includes one or more associated openings that allow airflow into or out of the enclosure. Each opening is configured to have a width and a depth to reduce the impact of electromagnetic interference (EMI) on internal components. The top port connector includes a high-speed communication signal terminal, a low-speed communication signal terminal, or a power terminal, wherein the high-speed communication signal terminal of the top port connector is configured to be connected to the circuit board via a cable; the bottom port connector includes a high-speed communication signal terminal, a low-speed communication signal terminal, or a power terminal.

16. The method of claim 15, further comprising conducting at least high-speed communication signals and power from the top port connector and the bottom port connector.

17. The method of claim 15, wherein, Connecting the bottom port connector includes mounting the bottom port connector using surface mount technology (SMT).

18. The method of claim 15, further comprising connecting the top port connector to the circuit board using a crimp connection.

19. The method of claim 15, wherein, The top port connector and the bottom port connector are configured to be connected to the circuit board using surface mount technology (SMT), crimp connection, ball grid array, solder filling, or fiber optic connection.

20. The method of claim 15, further comprising forming a grounding conductor by a plurality of conductive, deformable elements formed around a portion or all of the periphery of a front-end shield.

21. The method of claim 15, wherein, The top port connector or bottom port connector includes at least a portion of a bypass connector.

22. The method of claim 15, wherein, The low-speed communication signal terminal or the power terminal of the top port connector is connected to the circuit board via a cable.

23. The method of claim 15, wherein, The high-speed communication signal terminal and the low-speed communication signal terminal of the bottom port connector, or the power terminal of the bottom port connector, are directly connected to the circuit board.

24. The method of claim 15, wherein, The low-speed communication signal terminal or the power terminal of the top port connector is directly connected to the circuit board.

25. The method of claim 15, wherein, The high-speed communication signal terminal of the bottom port connector is connected to the circuit board via a cable, and the low-speed communication signal terminal or the power terminal of the bottom port connector is directly connected to the circuit board.

26. The method of claim 15, wherein, The low-speed communication signal terminal or power terminal of the top port connector is configured to be directly connected to the circuit board; the high-speed communication signal terminal of the bottom port connector is configured to be directly connected to the circuit board, and the low-speed communication signal terminal or power terminal of the bottom port connector is configured to be directly connected to the circuit board.

27. The method of claim 18, wherein, The low-speed communication signal terminal or the power terminal of the bottom port connector is connected to the circuit board via a cable.

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