LED module and method of producing the same

Abstract

The application belongs to the field of LED, and specifically provides an LED module and a production method thereof. The LED module comprises a first plastic body, a second plastic body, a third plastic body and a waterproof adhesive layer, each plastic body is integrally injection molded, the first plastic body and the second plastic body are arranged at the first end and the second end of the shell respectively, the third plastic body is arranged at the middle part of the shell, the third plastic body is provided with a first connecting hole for connecting with a pin, the third plastic body is used for pressing the circuit board to the shell, and the waterproof adhesive layer covers each plastic body. The LED module of the application comprises each plastic body which can be integrally produced, wherein the first and second plastic bodies are used as plugs, the first connecting hole can be connected with the pin, and the third plastic body can press the circuit board to the shell, so that the plugs and the light-emitting diodes fixed on the circuit board do not need to be installed step by step, the production steps can be simplified, and the production efficiency is improved. In addition, the waterproof adhesive layer is used to cover each plastic body, so that the product has good waterproof performance.

Description

Technical Field

[0001] This invention belongs to the field of LED technology, and more specifically, relates to an LED module and its manufacturing method. Background Technology

[0002] An LED module consists of a housing and a circuit board. A certain number of light-emitting diodes are arranged on the circuit board in a regular manner, and then the circuit board and housing are encapsulated and waterproofed, thus forming a waterproof LED product.

[0003] In related technologies, a circuit board containing LEDs is typically placed on a housing first, and then the housing and the LED-containing circuit board are placed into an injection mold, and the LED module is formed in one injection molding process using an injection molding machine. Alternatively, the LED-containing circuit board is placed on the housing first, and plugs are placed at both ends of the housing to prevent leakage of highly fluid waterproof adhesive. Then, a hot melt machine is used to heat-melt and deform the leads of the LEDs to connect them to the circuit board, preventing them from loosening. Afterward, the housing and the LED-containing circuit board are placed into a jig, and waterproof adhesive is poured between the housing and the circuit board to form a waterproof adhesive layer, thus forming the LED module. From a material properties perspective, the waterproof performance of LED modules formed by plastic injection molding is worse than that of LED modules formed by waterproof adhesive. From a manufacturing perspective, the production steps of LED modules formed by one-time injection molding are simple and efficient, while the production steps of LED modules formed by waterproof adhesive are complex and inefficient. Current LED module technologies cannot simultaneously meet the dual requirements of superior waterproof performance and high-efficiency production. Summary of the Invention

[0004] The purpose of this invention is to provide an LED module and its manufacturing method to solve the technical problem that existing LED modules, whether injection molded in one step or molded with waterproof adhesive, cannot simultaneously meet the dual requirements of waterproof performance and efficient production.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: An LED module is provided, comprising a housing, a circuit board, and a light-emitting diode (LED). The circuit board is located in the middle of the housing, and the light-emitting portion of the LED is located on the side of the circuit board facing the housing. The leads of the LED extend in a direction away from the housing. The LED module also includes a waterproof adhesive layer, and integrally injection-molded first, second, and third plastic bodies. The first and second plastic bodies are correspondingly located at the first and second ends of the housing, respectively. The third plastic body is located in the middle of the housing and has a first connection hole for connecting with the leads. The third plastic body is used to press the circuit board tightly against the housing. The waterproof adhesive layer covers the first, second, and third plastic bodies.

[0006] In some embodiments, the third plastic body has a pressing portion for pressing the circuit board against the housing, and a first connection hole is provided in the pressing portion.

[0007] In some embodiments, the pressing part is a pressing groove provided on the side of the third plastic body facing the circuit board, the circuit board is embedded in the pressing groove, and the first connecting hole is provided on the bottom surface of the pressing groove.

[0008] In some embodiments, the side of the third plastic body facing away from the circuit board is further provided with a groove, which communicates with the pressure groove.

[0009] In some embodiments, the LED module further includes a connection structure, wherein the first plastic body and the second plastic body are respectively connected to the housing via the connection structure.

[0010] In some embodiments, the connection structure includes a locking groove and a locking block that engage with each other. The locking block protrudes from the first plastic body and the second plastic body, and the locking groove is located on the side wall of the outer shell at a position corresponding to the locking block.

[0011] In some embodiments, limiting blocks are protruding on opposite sides of the first plastic body and opposite sides of the second plastic body, and limiting grooves are provided on opposite inner sidewalls of the first end of the outer shell and opposite inner sidewalls of the second end of the outer shell. The two limiting blocks on the first plastic body are engaged with the two limiting grooves of the first end of the outer shell, and the two limiting blocks on the second plastic body are engaged with the two limiting grooves of the second end of the outer shell.

[0012] In some embodiments, the connection structure further includes a second connection hole, a third connection hole, and a connector. The first plastic body and the second plastic body are respectively provided with the second connection hole, and the outer shell is provided with a plurality of third connection holes. The second connection hole on the first plastic body is connected to one of the third connection holes on the outer shell through a connector, and the second connection hole on the second plastic body is connected to another third connection hole on the outer shell through another connector.

[0013] In some embodiments, both the second and third connecting holes are pin holes, and the connector is a pin;

[0014] Alternatively, both the second and third connecting holes can be threaded holes, and the connecting component can be a screw.

[0015] The LED module provided by this invention has at least one of the following technical effects: The LED module provided by this invention includes a first plastic body, a second plastic body, and a third plastic body that can be integrally produced using an injection molding machine. The first and second plastic bodies are correspondingly disposed at the first and second ends of the outer casing, serving as plugs to prevent leakage of waterproof adhesive during potting. During injection molding, the third plastic body forms a first connection hole covering the pins of the light-emitting diode, allowing the third plastic body to connect to the pins. Furthermore, the third plastic body presses the circuit board firmly onto the outer casing, preventing loosening between the light-emitting diode and the circuit board. Thus, it eliminates the need for step-by-step plug installation and the use of a hot melt machine to fix the light-emitting diode to the circuit board, simplifying the LED module production process and improving production efficiency. Furthermore, the LED module provided by this invention uses a waterproof adhesive layer to cover each plastic body, ensuring good waterproof performance of the LED module.

[0016] Another technical solution of the present invention is: providing a method for producing an LED module, used to produce the above-mentioned LED module, the method comprising the following steps:

[0017] S10: Place the light-emitting diode on the circuit board, and place the circuit board in the middle of the housing;

[0018] S20: A first plastic body and a second plastic body are injection molded at the first and second ends of the housing, and a third plastic body is injection molded in the middle of the housing, wherein a first connection hole for connecting with the pin is injection molded on the third plastic body at the position corresponding to the pin.

[0019] S30: Waterproof adhesive is injected between the first plastic body, the second plastic body and the third plastic body to form a waterproof adhesive layer.

[0020] The above-mentioned technical solutions in the LED module production method provided by the present invention have at least one of the following technical effects: The LED module production method provided by the present invention can use an injection molding machine to form the first plastic body and the second plastic body used as plugs, as well as the third plastic body used to connect the circuit board and the light-emitting diode in one step. It does not require separate production of plugs, nor does it require additional processes to fix the light-emitting diodes to the circuit board, thereby simplifying the production steps of the LED module and improving production efficiency. In addition, the LED module production method provided by the present invention uses waterproof glue to cover each plastic body, thereby ensuring that the LED module has good waterproof performance. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of an LED module provided in an embodiment of the present invention;

[0023] Figure 2 for Figure 1 An exploded view of the LED module shown;

[0024] Figure 3 This is a flowchart of a method for producing an LED module according to an embodiment of the present invention.

[0025] The following are the labeling elements in the figure:

[0026] 1. Outer casing; 11. Lens;

[0027] 2. Circuit board;

[0028] 3. Light-emitting diode; 31. Light-emitting part; 32. Pin;

[0029] 4. Cables;

[0030] 5. First plastic body;

[0031] 6. Second plastic body;

[0032] 7. Third plastic body; 71. First connecting hole; 72. Pressing part; 73. Groove;

[0033] 8. Waterproof adhesive layer;

[0034] 9. Connecting structure; 91. Limiting block; 92. Limiting groove; 93. Second connecting hole; 94. Third connecting hole; 95. Connecting piece. Detailed Implementation

[0035] To make the technical problem to be solved, the technical solution and the beneficial effects of the present invention clearer, the following description is provided in conjunction with the appendix. Figures 1 to 3 The present invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0036] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0037] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of the invention include a specific feature, structure, or characteristic described in connection with that embodiment. The phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0040] Please see Figure 1 and Figure 2 ,in, Figure 1 This is a schematic diagram of the overall structure of an LED module provided in an embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the LED module shown.

[0041] like Figure 1 and Figure 2As shown, one embodiment of the present invention provides an LED module, which includes a housing 1, a circuit board 2, a light-emitting diode 3, and a set of cables 4. The circuit board 2 is located in the middle of the housing 1. The light-emitting part 31 of the light-emitting diode 3 is located on the side of the circuit board 2 facing the housing 1, and the pins 32 of the light-emitting diode 3 extend in a direction away from the housing 1. The set of cables 4 is electrically connected to the two pins 32 of the light-emitting diode 3 to supply power to the light-emitting diode 3. A lens 11 is protruding on the side of the housing 1 away from the circuit board 2, and the light emitted by the light-emitting part 31 of the light-emitting diode 3 is emitted through the lens 11. Further, the LED module also includes a first plastic body 5, a second plastic body 6, a third plastic body 7, and a waterproof adhesive layer 8. The first plastic body 5, the second plastic body 6, and the third plastic body 7 are integrally injection molded. The first plastic body 5 and the second plastic body 6 are respectively disposed at the first end and the second end of the outer shell 1. The third plastic body 7 is disposed in the middle of the outer shell 1. The third plastic body 7 is provided with a first connection hole 71 for connecting with the pin 32. The third plastic body 7 is used to press the circuit board 2 to the outer shell 1. Each plastic body is disposed on the side of the outer shell 1 away from the lens 11. The waterproof adhesive layer 8 covers the first plastic body 5, the second plastic body 6, and the third plastic body 7.

[0042] The LED module provided in this embodiment includes a first plastic body 5, a second plastic body 6, and a third plastic body 7, which can be integrally produced using an injection molding machine. The first plastic body 5 and the second plastic body 6 are respectively disposed at the first and second ends of the outer casing 1, serving as plugs to prevent leakage of waterproof adhesive during potting. During injection molding, the third plastic body 7 forms a first connection hole 71 covering the pins 32 of the light-emitting diode 3, allowing the third plastic body 7 to connect with the pins 32. Furthermore, the third plastic body 7 can press the circuit board 2 firmly onto the outer casing 1, preventing loosening between the light-emitting diode 3 and the circuit board 2. Thus, the production process of the LED module is simplified, improving production efficiency, as it eliminates the need for step-by-step plug installation and the use of a hot melt machine to fix the light-emitting diode 3 to the circuit board 2. Further, the LED module provided in this embodiment uses a waterproof adhesive layer 8 to cover each plastic body, ensuring good waterproof performance of the LED module.

[0043] In addition, in related technologies, during potting, the waterproof adhesive has strong molecular fluidity, which can easily seep into the lens 11 through the gap between the circuit board 2 and the outer shell 1, thus affecting the optical performance and aesthetics of the lens 11. In this embodiment, the third plastic body 7 is used to cover the pin 32 of the light-emitting diode 3 and press the circuit board 2. Since the molecular fluidity of the plastic is worse than that of the waterproof adhesive, it can seal the gap between the circuit board 2 and the outer shell 1. During potting, the waterproof adhesive can be prevented from seeping into the lens 11, thereby ensuring the optical performance and aesthetics of the lens 11.

[0044] Please see Figure 2In another embodiment of the present invention, the third plastic body 7 has a pressing part 72 for pressing the circuit board 2 against the housing 1, and the first connecting hole 71 is provided in the pressing part 72. The pressing part 72 can be a planar or groove-shaped structure.

[0045] In practice, the circuit board 2 pre-installed with LEDs 3 is first installed in the middle of the housing 1, with the pins 32 of the LEDs 3 facing away from the housing 1. Then, when the third plastic body 7 is formed by injection molding on the side of the housing 1 facing away from the lens 11, the first connection hole 71 for covering and connecting the pins 32 of the LEDs 3 can be directly formed. The side of the third plastic body 7 facing the circuit board 2 can also directly form a plane that contacts the circuit board 2, or a groove structure for embedding the circuit board 2, which can press the circuit board 2 tightly against the housing 1, thereby indirectly fixing the relative position between the LEDs 3 and the circuit board 2.

[0046] Furthermore, such as Figure 2 As shown, in this embodiment, the pressing part 72 is a pressing groove provided on the side of the third plastic body 7 facing the circuit board 2, the circuit board 2 is embedded in the pressing groove, and the first connecting hole 71 is provided on the bottom surface of the pressing groove. The shape and size of the pressing groove are adapted to the shape and size of the circuit board 2.

[0047] In this embodiment, the pressing part 72 is configured as a pressing groove adapted to the shape and size of the circuit board 2, which can restrict the position of the third plastic body 7 on the outer shell 1 and prevent the third plastic body 7 from slipping during potting, thereby affecting the waterproof performance of the product.

[0048] Furthermore, such as Figure 2 As shown, in this embodiment, the side of the third plastic body 7 facing away from the circuit board 2 is also provided with a groove 73, and the groove 73 is connected to the pressure groove.

[0049] In practice, when injection molding each plastic body using an injection molding machine, pressure needs to be applied to each plastic body. When pressure is applied to the third plastic body 7, it is easy to damage the circuit board 2 below it and the components on the circuit board 2, thereby affecting the electrical performance of the LED module. In this embodiment, the groove 73 on the side of the third plastic body 7 away from the circuit board 2 is connected to the pressure groove on the side of the third plastic body 7 facing the circuit board 2, thereby forming a through slot. When pressure is applied to the third plastic body 7, it can avoid the circuit board 2 and the components on the circuit board 2, reducing the possibility of damage and ensuring a high yield rate.

[0050] Please see Figure 2 In another embodiment of the present invention, the LED module further includes a connection structure 9, wherein the first plastic body 5 and the second plastic body 6 are respectively connected to the outer shell 1 through the connection structure 9.

[0051] After the glue is applied, the waterproof adhesive layer 8 covers each plastic body, and the first plastic body 5 and the second plastic body 6 are respectively connected to the outer shell 1 through two connecting structures 9, so that the waterproof adhesive layer 8 and the third plastic body 7 are also indirectly connected to the outer shell 1, so that the product is tightly assembled.

[0052] Please see Figure 2 In another embodiment of the present invention, the connecting structure 9 includes a locking block 91 and a locking groove 92. The locking block 91 protrudes from the first plastic body 5 and the second plastic body 6, and the locking groove 92 is located on the side wall of the outer shell 1 at the position corresponding to the locking block 91.

[0053] When the first plastic body 5 and the second plastic body 6 are injection molded using an injection molding machine, the limiting block 91 can be injection molded simultaneously, which has the advantage of simple manufacturing. Furthermore, it can be immediately engaged with the limiting groove 92 on the outer shell 1 without separate assembly, offering the advantage of quick connection. In addition, after the limiting groove 92 and the limiting block 91 are properly engaged, it prevents the first plastic body 5 and the second plastic body 6 from slipping on the outer shell 1 during glue dispensing, thus preventing leakage of waterproof glue and contamination of the working environment.

[0054] Furthermore, such as Figure 2 As shown, in this embodiment, limiting blocks 91 are protruding from opposite sides of the first plastic body 5 and opposite sides of the second plastic body 6. Limiting grooves 92 are provided on opposite inner sidewalls at the first end of the outer shell 1 and opposite inner sidewalls at the second end of the outer shell 1. The two limiting blocks 91 on the first plastic body 5 are engaged with the two limiting grooves 92 at the first end of the outer shell 1, and the two limiting blocks 91 on the second plastic body 6 are engaged with the two limiting grooves 92 at the second end of the outer shell 1. Specifically, the two limiting blocks 91 on the first plastic body 5 and the two limiting blocks 91 on the second plastic body 6 are respectively arranged in a direction perpendicular to the line connecting the first and second ends of the outer shell 1.

[0055] Limiting blocks 91 are provided on opposite sides of the first plastic body 5 and on opposite sides of the second plastic body 6, enabling the first plastic body 5 and the second plastic body 6 to form multi-point connections with the outer shell 1, thereby improving the connection stability between each plastic body and the outer shell 1. Furthermore, the two limiting blocks 91 on the first plastic body 5 and the two limiting blocks 91 on the second plastic body 6 are also located on opposite sides, maximizing the distance between the two connection points and further improving the connection stability between each plastic body and the outer shell 1.

[0056] It is understandable that the first plastic body 5 and the second plastic body 6 can also be injection molded into limiting grooves 92 respectively. Then, the side wall of the outer shell 1 corresponding to the limiting groove 92 is set as a limiting block 91, thereby forming a connecting structure 9.

[0057] Please see Figure 1 and Figure 2 In another embodiment of the present invention, the connecting structure 9 further includes a second connecting hole 93, a third connecting hole 94 and a connector 95. The first plastic body 5 and the second plastic body 6 are respectively provided with the second connecting hole 93, and the outer shell 1 is provided with a plurality of third connecting holes 94. The second connecting hole 93 on the first plastic body 5 is connected to one of the third connecting holes 94 on the outer shell 1 through a connector 95, and the second connecting hole 93 on the second plastic body 6 is connected to another third connecting hole 94 on the outer shell 1 through another connector 95.

[0058] In this embodiment, a connector 95 is inserted between the second connecting hole 93 on the first plastic body 5 and the corresponding third connecting hole 94 on the outer shell 1, and another connector 95 is inserted between the second connecting hole 93 on the second plastic body 6 and the corresponding third connecting hole 94 on the outer shell 1, thereby connecting the first plastic body 5 and the second plastic body 6 to the outer shell 1 respectively. Furthermore, this connection method has the advantage of reliable connection.

[0059] Furthermore, such as Figure 1 and Figure 2 As shown, in this embodiment, the second connecting hole 93 and the third connecting hole 94 are both pin holes, and the connector 95 is a pin; or, the second connecting hole 93 and the third connecting hole 94 are both threaded holes, and the connector 95 is a screw.

[0060] In practice, threaded parts and pins are low-cost. Using threaded parts or pins to connect the first plastic body 5 and the second plastic body 6 to the outer shell 1 can effectively control the production cost of LED modules.

[0061] In some specific embodiments, such as Figure 1 and Figure 2 As shown, the first plastic body 5 and the second plastic body 6 are respectively provided with limiting blocks 91. The side wall of the outer shell 1 is provided with limiting grooves 92 corresponding to the positions of the limiting blocks 91. At the same time, the first plastic body 5 and the second plastic body 6 are respectively provided with second connecting holes 93, and the outer shell 1 is provided with multiple third connecting holes 94. In actual practice, through the matching and snapping between the limiting grooves 92 and the injection-molded limiting blocks 91, the slippage of the first plastic body 5 and the second plastic body 6 on the outer shell 1 can be prevented during the subsequent process of forming the waterproof adhesive layer 8, thereby preventing the waterproof adhesive from leaking out and polluting the working environment. After the waterproof adhesive layer 8 is formed by potting adhesive, the first plastic body 5 and the second plastic body 6 can be connected to the outer shell 1 respectively through the connectors 95, thereby improving the connection stability and strengthening the assembly strength.

[0062] Please see Figure 3 ,in, Figure 3 This is a flowchart of a method for producing an LED module according to an embodiment of the present invention.

[0063] like Figures 1 to 3 As shown, an embodiment of the present invention provides a method for producing an LED module, used to produce the LED module in the above embodiment. The method includes the following steps:

[0064] S10: The light-emitting diode 3 is placed on the circuit board 2, and the circuit board 2 is placed in the middle of the housing 1. The light-emitting part 31 of the light-emitting diode 3 is placed on the side of the circuit board 2 facing the housing 1, the pins 32 of the light-emitting diode 3 are placed away from the housing 1, and a set of cables 4 are electrically connected to the two pins 32 of the light-emitting diode 3.

[0065] S20: Using an injection molding machine, a first plastic body 5 and a second plastic body 6 are injection molded at the first and second ends of the housing 1, and a third plastic body 7 is injection molded in the middle of the housing 1. A first connection hole 71 for connecting with the pin 32 is injection molded on the third plastic body 7 at the position corresponding to the pin 32.

[0066] S30: Waterproof adhesive is injected between the first plastic body 5, the second plastic body 6 and the third plastic body 7 to form a waterproof adhesive layer 8.

[0067] The LED module production method provided in this embodiment can use an injection molding machine to mold the first plastic body 5 and the second plastic body 6, which serve as plugs, and the third plastic body 7, which connects the circuit board 2 and the light-emitting diode 3, in one step. It does not require separate production of plugs, nor does it require additional processes to fix the light-emitting diode 3 to the circuit board 2, thereby simplifying the LED module production steps and improving production efficiency. In addition, the LED module production method provided in this embodiment uses waterproof glue to cover each plastic body, thereby ensuring that the LED module has good waterproof performance.

[0068] Furthermore, such as Figure 2 As shown, in step S20, when the first plastic body 5 and the second plastic body 6 are injection molded, the pressure groove and the recess 73 in the above embodiment are simultaneously injection molded to prevent the third plastic body 7 from slipping during glue pouring, thereby affecting the waterproof performance of the product. In addition, when applying pressure during injection molding, the circuit board 2 and the components on the circuit board 2 can be avoided, reducing the possibility of damaging the circuit board 2 and the components on it. In addition, the limiting block 91 for fitting and engaging with the limiting groove 92 on the outer shell 1 is also simultaneously injection molded to prevent the first plastic body 5 and the second plastic body 6 from slipping on the outer shell 1, thereby causing the waterproof glue to leak out and pollute the working environment.

[0069] Furthermore, such as Figure 1 and Figure 2 As shown, the production method also includes the following steps:

[0070] S40: Using a drilling machine, drill a second connecting hole 93 and a third connecting hole 94 that are connected between the first plastic body 5 and the outer shell 1, and between the second plastic body 6 and the outer shell 1.

[0071] S50: A connector 95 is inserted between the corresponding second connecting hole 93 and the third connecting hole 94, thereby connecting the first plastic body 5 and the second plastic body 6 to the outer shell 1 respectively, which serves as a reinforcement.

[0072] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for producing an LED module, characterized in that: The method for producing LED modules includes the following steps: S10: The light-emitting diode is placed on the circuit board, the circuit board is placed in the middle of the housing, the light-emitting part of the light-emitting diode is placed on the side of the circuit board facing the housing, and the pins of the light-emitting diode extend in the direction away from the housing; S20: A first plastic body and a second plastic body are injection molded at the first and second ends of the housing, and a third plastic body is injection molded in the middle of the housing. The third plastic body presses the circuit board against the housing. A first connection hole for connecting with the pin is injection molded on the third plastic body at the position corresponding to the pin. S30: Waterproof adhesive is injected between the first plastic body, the second plastic body and the third plastic body to form a waterproof adhesive layer, wherein the waterproof adhesive layer covers the first plastic body, the second plastic body and the third plastic body; The third plastic body has a pressing part, which is used to press the circuit board against the outer shell, and the first connecting hole is provided in the pressing part; The pressing part is a pressing groove provided on the side of the third plastic body facing the circuit board, the circuit board is embedded in the pressing groove, and the first connecting hole is provided on the bottom surface of the pressing groove; The third plastic body also has a groove on the side facing away from the circuit board, and the groove is connected to the pressure groove.

2. The method for producing an LED module as described in claim 1, characterized in that: The LED module also includes a connection structure, through which the first plastic body and the second plastic body are respectively connected to the outer shell.

3. The method for producing an LED module as described in claim 2, characterized in that: The connection structure includes a locking groove and a locking block that engage with each other. The locking block protrudes from the first plastic body and the second plastic body, and the locking groove is located on the side wall of the outer shell at a position corresponding to the locking block.

4. The method for producing an LED module as described in claim 3, characterized in that: The limiting blocks are protruding on opposite sides of the first plastic body and opposite sides of the second plastic body. The limiting grooves are provided on opposite inner sidewalls of the first end of the outer shell and opposite inner sidewalls of the second end of the outer shell. The two limiting blocks on the first plastic body are engaged with the two limiting grooves of the first end of the outer shell, and the two limiting blocks on the second plastic body are engaged with the two limiting grooves of the second end of the outer shell.

5. The method for producing an LED module as described in claim 2, characterized in that: The connection structure further includes a second connection hole, a third connection hole, and a connector. The first plastic body and the second plastic body are respectively provided with the second connection hole, and the outer shell is provided with a plurality of the third connection holes. The second connection hole on the first plastic body is connected to one of the third connection holes on the outer shell through a connector, and the second connection hole on the second plastic body is connected to another third connection hole on the outer shell through another connector.

6. The method for producing an LED module as described in claim 5, characterized in that: Both the second connecting hole and the third connecting hole are pin holes, and the connector is a pin; Alternatively, both the second connecting hole and the third connecting hole may be threaded holes, and the connecting element may be a screw.

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