Light emitting device

Abstract

A light emitting device is provided. Compared with the case where mounting work is performed using an adhesive, improvement in workability is achieved. The light emitting device is provided with: an LPH (140) provided with a plurality of LED arrays arranged along a Z direction, the plurality of LED arrays emitting light to the same side as each other from both ends in the Z direction positioned at a predetermined position; a dynamic vibration absorber (50) having a counterweight (51) at a central portion in the Z direction of the LPH (140) and an elastic portion (53) supporting the counterweight (51) so as to be able to vibrate, the dynamic vibration absorber (50) being mounted to the LPH (140) and absorbing vibration of the LPH (140); and a mounting member (70) having a portion that enters a groove (55) formed by the elastic portion (53) of the dynamic vibration absorber (50), the dynamic vibration absorber (50) being mounted to the LPH (140) by the portion.

Description

Technical Field

[0001] This invention relates to light-emitting devices. Background Technology

[0002] For example, Japanese Patent Application Publication No. 2019-49686 discloses an exposure apparatus comprising: an exposure section having a plurality of light-emitting elements arranged along the axial direction of a rotating image holder, positioned relative to the image holder at both ends of the axial direction, and exposing the image holder by emitting light; a counterweight disposed opposite to the exposure section and having a predetermined mass; and an elastic section having elasticity and disposed between the exposure section and the counterweight, supporting the counterweight to be vibrating.

[0003] In the case where the elastic part is installed on the light-emitting part on the production line, for example, using an adhesive installation method, if there is a deviation in the installation strength, the adhesive part may peel off and the elastic part may fall off after leaving the factory. In order to suppress the deviation in installation strength caused by the adhesive, the operator's burden increases and it is difficult to improve workability. Summary of the Invention

[0004] The object of the present invention is to improve workability compared to installation work performed using adhesives.

[0005] According to a first aspect of the present invention, a light-emitting device is provided, comprising: a light-emitting part having a plurality of light-emitting elements arranged along one direction, the two ends of the light-emitting part being positioned at predetermined positions along the one direction, the plurality of light-emitting elements emitting light toward the same side; a dynamic vibration absorber having a counterweight and an elastic part, the counterweight being located at the center of the light-emitting part along the one direction, the elastic part supporting the counterweight to be able to vibrate, the dynamic vibration absorber being mounted on the light-emitting part and absorbing the vibration of the light-emitting part; and a mounting member having a portion that enters a groove formed in the elastic part of the dynamic vibration absorber, the dynamic vibration absorber being mounted on the light-emitting part through the portion.

[0006] According to a second aspect of the present invention, the grooves of the elastic portion are formed in a plurality of portions on both sides of one direction.

[0007] According to a third aspect of the invention, the spacing between adjacent slots in at least three slots formed on both sides of the one direction is different from that of each other.

[0008] According to a fourth aspect of the invention, the portion of the mounting component has an open shape with a cutout for the passage of the elastic portion of the dynamic vibration absorber.

[0009] According to a fifth aspect of the invention, the cutout of the mounting component is formed such that the elastic portion of the dynamic vibration absorber can pass through by deformation.

[0010] According to a sixth aspect of the present invention, the dynamic vibration absorber is mounted on the light-emitting part through a plurality of the cuts, and the plurality of cuts open in the same direction.

[0011] According to a seventh aspect of the present invention, the dynamic vibration absorber is mounted on the light-emitting part through a plurality of the cuts, and the plurality of cuts open in different directions.

[0012] (Effect)

[0013] According to the first solution mentioned above, workability can be improved compared to installation work using adhesives.

[0014] According to the second scheme mentioned above, versatility can be improved compared to the case with only one slot.

[0015] According to the third scheme mentioned above, by adopting a structure with multiple slots, it is possible to prevent a reduction in the ease of installation.

[0016] According to the fourth scheme mentioned above, compared with the case where the part entering the groove is not open, the ease of installation can be improved.

[0017] According to the fifth solution, compared with the case where a cut is provided that allows the elastic part to pass through without deformation, a more secure installation can be achieved.

[0018] According to the sixth solution mentioned above, the installation operation can be carried out more easily compared to the case where the mounting component has only one cut.

[0019] According to the seventh solution mentioned above, compared with the case where the mounting component has only one cut, the installation operation can be carried out more easily, and the detachment after installation can be prevented. Attached Figure Description

[0020] Figure 1 This is a diagram showing the overall structure of the image forming apparatus to which this embodiment is applied.

[0021] Figure 2 The diagram shows the exposure apparatus according to this embodiment, (a) is a perspective view, and (b) is a cross-sectional view of section IIB-IIB in (a).

[0022] Figure 3 The diagrams show the exposure apparatus of the application implementation method, (a) is a diagram showing the relationship between the position of the exposure apparatus in the Z direction and the displacement amount when the exposure apparatus vibrates, and (b) is a diagram showing the relationship between the position of the exposure apparatus in the Z direction and the displacement amount when the exposure apparatus vibrates. Figure 2 A diagram of the exposure apparatus viewed in direction IIIB in (a).

[0023] Figure 4 This is a diagram illustrating the structure of the dynamic vibration absorber using this embodiment.

[0024] Figure 5 The diagram illustrates the installation structure of the dynamic vibration absorber on the LPH. (a) is a perspective view showing the state before installation, and (b) is a projection view showing the state after installation.

[0025] Figure 6 The diagram illustrates the mounting structure of the dynamic vibration absorber on the LPH. (a) and (c) are perspective views of the individual mounting components, and (b) is a perspective view showing the engagement state of the dynamic vibration absorber when it is mounted on the mounting component.

[0026] Figure 7 These are diagrams illustrating other installation configurations; (a), (b), and (c) show installations in different locations.

[0027] Figure 8 (a) is a diagram illustrating the relationship between the spacing of the mounting components and the natural vibration frequency; (b) is a diagram illustrating the dimensions of the dynamic vibration absorber used to calculate the natural vibration frequency; and (c) is a table showing examples of the calculation results.

[0028] Figure 9 This is an explanation Figure 7 The diagram shows the installation structure.

[0029] Label Explanation:

[0030] 14: Exposure device; 50: Dynamic vibration absorber; 51: Counterweight; 53: Elastic part; 55, 56, 57: Groove; 70: Mounting component; 73: Cut-out part; 73a: Opening part; 74: Part; 140: LPH; 143: LED array. Detailed Implementation

[0031] In the following, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0032] Figure 1 This is a diagram showing the overall structure of the image forming apparatus 1 applied in this embodiment.

[0033] The image forming apparatus 1 is generally referred to as a tandem type image forming apparatus. The image forming apparatus 1 includes an image forming unit 10 that forms images corresponding to image data of each color, a control unit 5 that controls the overall operation of the image forming apparatus 1, and a paper holding unit 40 that holds the paper supplied to the image forming apparatus 1. Furthermore, the image forming apparatus 1 may include, for example, an image processing unit 6 that performs pre-defined image processing on image data received from a personal computer (PC) 2, an image reading device 3, etc.

[0034] The image forming unit 10 includes four image forming units 11Y, 11M, 11C, and 11K (also collectively referred to as "image forming units 11") arranged side by side at fixed intervals. Each image forming unit 11 includes: a photosensitive drum 12, which is an example of an image holder that forms an electrostatic latent image and holds a toner image; a charge carrier 13, which charges the surface of the photosensitive drum 12 with a predetermined potential; an exposure device 14, which exposes the photosensitive drum 12 charged by the charge carrier 13 based on color image data; a developer 15, which develops the electrostatic latent image formed on the photosensitive drum 12; and a drum cleaner 16, which cleans the surface of the photosensitive drum 12 after transfer.

[0035] Each image forming unit 11 has the same structure except for the toner stored in the developer 15, and forms toner images of yellow (Y), magenta (M), cyan (C), and black (K) respectively.

[0036] In addition, the image forming unit 10 includes: an intermediate transfer belt 20, which transfers multiple toner images formed on the photosensitive drums 12 of each image forming unit 11; and a primary transfer roller 21, which sequentially transfers the toner images formed on each image forming unit 11 onto the intermediate transfer belt 20. Furthermore, it includes: a secondary transfer roller 22, which transfers the toner images superimposed on the intermediate transfer belt 20 onto paper, which is the recording material; a belt cleaner 25, which cleans the surface of the intermediate transfer belt 20 after the secondary transfer; and a fixing device 30, which fixes the secondary transferred toner images onto the paper P.

[0037] In this image forming apparatus 1, image forming operations are performed in the image forming unit 10 based on various control signals supplied from the control unit 5. That is, under the control of the control unit 5, image data input from the PC 2 and the image reading device 3 is processed by the image processing unit 6 and provided to each image forming unit 11. Then, in each image forming unit 11, the photosensitive drum 12 is charged based on the charger 13, exposed based on the exposure device 14, and developed based on the electrostatic latent image of the developer 15, forming toner images of various colors on the surface of the photosensitive drum 12.

[0038] Then, the toner images of each color formed on the photosensitive drum 12 are sequentially transferred to the intermediate transfer belt 20 by the primary transfer roller 21.

[0039] Then, as the intermediate transfer belt 20 moves, the synthetic toner image on the intermediate transfer belt 20 is conveyed to the secondary transfer section T, which is the area where the secondary transfer roller 22 is arranged. When the synthetic toner image is conveyed to the secondary transfer section T, paper is supplied from the paper holding section 40 to the secondary transfer section T at the corresponding moment. Then, in the secondary transfer section T, the synthetic toner image is electrostatically transferred onto the conveyed paper by the transfer electric field formed by the secondary transfer roller 22.

[0040] Next, the paper with the toner image transferred is conveyed to the fixing device 30, where it undergoes a fixing process using heat and pressure, thereby fixing the toner image onto the paper. Then, the paper with the toner image fixed is conveyed to the paper loading section provided in the discharge section of the image forming apparatus 1.

[0041] On the other hand, the toner adhering to the intermediate transfer belt 20 after the secondary transfer is completed is removed from the surface of the intermediate transfer belt 20 by the belt cleaner 25. In this way, image formation in the image forming apparatus 1 is repeatedly performed according to a cycle corresponding to the number of prints.

[0042] Next, the structure of the exposure apparatus 14 in this embodiment will be described. The exposure apparatus 14 is an example of a light-emitting device.

[0043] Figure 2 (a)~(b) and Figure 3 Figures (a) to (b) show the exposure apparatus 14 used in this embodiment. Figure 2 (a) is a perspective view of the exposure device 14. Figure 2 (b) is Figure 2 A cross-sectional view of section IIB-IIB in (a). Additionally, Figure 3 (a) is a graph showing the relationship between the position of the exposure device 14 in the Z direction (described later) and the amount of displacement when the exposure device 14 vibrates. Furthermore, Figure 3 (b) is a diagram illustrating the position of the dynamic vibration absorber 50, described later, within the exposure apparatus 14. Figure 2 Figure (a) shows the exposure apparatus 14 viewed in direction IIIB.

[0044] Exposure device 14 in Figure 1 The image forming apparatus 1 shown is positioned vertically below the photosensitive drum 12, and the photosensitive drum 12 is exposed from below. Figure 2 (a)~(b) Figure 3As shown in (b), the exposure apparatus 14 includes an LED (Light Emitting Diode) printhead (LPH) 140 and a dynamic vibration absorber 50 (described later) to reduce the vibration of the LPH 140.

[0045] The LPH140 includes a housing 141, an LED array 143 having multiple light-emitting elements, an LED circuit board 142 mounting the LED array 143 and a signal generation circuit (not shown) driving the LED array 143, a rod-shaped lens array 144 that images light emitted from the LED array 143 onto the surface of the photosensitive drum 12, and a frame 145 that reinforces the housing 141 and mounts the dynamic vibration absorber 50. Furthermore, the LPH140 has a first positioning portion 146 at both ends of the photosensitive drum 12 along the axial direction for positioning the LPH140 relative to the photosensitive drum 12 in the X direction, and a second positioning portion 147 for positioning the LPH140 in the Y direction. The LED array 143 is an example of a light-emitting element, and the LPH140 is an example of a light-emitting portion.

[0046] Additionally, in the following explanations, sometimes... Figure 2 (a)~(b) Figure 3 The optical axis direction of the rod lens array 144 in the LPH140 shown in (b) (the direction in which light is emitted from the light-emitting elements of the LED array 143) is referred to as the Y direction. Additionally, the main scanning direction, i.e., the photosensitive drum 12 (see reference 144), is sometimes referred to as the Y direction. Figure 1 The axis of the scanning direction is called the Z direction or a direction, the long side direction. Furthermore, the sub-scanning direction, that is, the direction orthogonal to both the Y and Z directions, is sometimes called the X direction.

[0047] The housing 141 is formed of resin material such as ABS and supports the LED circuit board 142 and the rod lens array 144.

[0048] The frame 145 is formed of a metal material such as steel or SUS, and is mounted on the side opposite to the rod-shaped lens array 144 relative to the housing 141. In addition, a dynamic vibration absorber 50 is mounted on the frame 145 via the mounting member 70 described later.

[0049] The rod lens array 144 is arranged along the Z direction, which is the axial direction of the photosensitive drum 12, and is formed to have a width in the X direction, which is the moving direction of the photosensitive drum 12. Furthermore, the rod lens array 144 is configured, for example, by arranging a plurality of refractive index distribution type lenses that form upright, equal-magnification real images along the axial direction of the photosensitive drum 12. The rod lens array 144 also causes light emitted from the LED array 143 to image onto the surface of the photosensitive drum 12.

[0050] An LED array 143 is mounted on an LED circuit board 142. The LED array 143 is composed of a plurality of LED chips, each having a light-emitting element (LED) and arranged in the Z direction. Thus, a plurality of light-emitting elements are arranged in the Z direction on the LED circuit board 142. Furthermore, each light-emitting element is arranged such that it emits light in the Y direction toward the photosensitive drum 12 side (the rod lens array 144 side). In addition, in the LED array 143 of this embodiment, the LED chips are arranged in a staggered pattern such that the light-emitting elements overlap each other in the Z direction at the boundaries between adjacent LED chips.

[0051] When the exposure apparatus 14 is disposed in the image forming apparatus 1, the first positioning part 146 and the second positioning part 147 abut against a housing member (not shown) that houses and supports the photosensitive drum 12 within the image forming apparatus 1. More specifically, the first positioning part 146 abuts against the housing member of the photosensitive drum 12 in the X direction, and the second positioning part 147 abuts against the housing member of the photosensitive drum 12 in the Y direction.

[0052] Thus, the LPH140 is positioned relative to the photosensitive drum 12 in both the X and Y directions using its two ends in the Z direction. Furthermore, the LPH140 is positioned such that the distance between the rod lens array 144 and the photosensitive drum 12 is equal to the focal length of the rod lens array 144.

[0053] In addition, in this embodiment, the central part in the Z direction of LPH140, that is, the area sandwiched between the first positioning part 146 and the second positioning part 147 located at both ends in the Z direction of LPH140, does not contact the photosensitive drum 12, but becomes a state of floating from the photosensitive drum 12.

[0054] Furthermore, as in this embodiment, the LPH140, which has a longer shape in the Z direction and is positioned at both ends in the Z direction relative to the photosensitive drum 12, sometimes vibrates due to flexing caused by external vibrations from the exposure apparatus 14. Specifically, the LPH140 has a central portion in the Z direction... Figure 2 The case of vibration along the Y direction or along the X direction in (a).

[0055] For example, when the LPH140 vibrates in the Y direction, the distance between the rod lens array 144 and the surface of the photosensitive drum 12 changes. Therefore, the size of the exposure point of the light emitted from the LPH140 changes. Furthermore, when the LPH140 vibrates in the X direction, the exposure point shifts in the X direction, causing distortion in the image. As a result, image defects such as stripes and color unevenness may occur in the formed image. In particular, the impact on the image tends to be greater when the LPH140 vibrates in the X direction.

[0056] Furthermore, as described above, in this embodiment, the LPH140 is positioned relative to the photosensitive drum 12 at both ends in the Z direction, and the central portion in the Z direction is in a state of floating above the photosensitive drum 12. Therefore, as Figure 3 As shown in (a), in LPH140, the vibration is more likely to increase the closer it is to the center in the Z direction.

[0057] Furthermore, when the frequency of external vibration input to the LPH140 is close to the inherent frequency of the LPH140, the LPH140 is prone to resonance with the external vibration. In this case, the vibration of the LPH140 becomes amplified, which can easily lead to image defects.

[0058] As a method for suppressing the vibration of the LPH140, in this embodiment, a dynamic vibration absorber is provided in the LPH140. The dynamic vibration absorber has a counterweight and an elastic part, and its natural vibration frequency is close to that of the LPH140. The natural vibration frequency of the dynamic vibration absorber is determined by the spring constant of the elastic part and the mass of the counterweight.

[0059] Figure 4 This diagram illustrates the structure of the dynamic vibration absorber 50 according to this embodiment, and is a perspective view of the dynamic vibration absorber 50. Furthermore, in Figure 4 The description of structures other than frame 145 in LPH140 is omitted here. The following also refers to the above. Figure 2 (a)~(b) Figure 3 Sections (a) to (b) provide a detailed description of the structure of the dynamic vibration absorber 50.

[0060] like Figure 4 As shown, the dynamic vibration absorber 50 includes: a counterweight 51, which is arranged opposite to the LPH140 and has a predetermined mass; and two elastic portions 53, which are made of viscoelastic material and support the counterweight 51. In the dynamic vibration absorber 50, the counterweight 51 and the elastic portions 53 are arranged in the Z direction. In other words, elastic portions 53 are respectively arranged at both ends of the counterweight 51 in the Z direction.

[0061] The counterweight 51 is a component that vibrates via the elastic part 53 when vibration is input to the LPH140 from the outside. The counterweight 51 is located at the center of the LED array 143 in one direction Z.

[0062] The counterweight 51 in this embodiment has a cylindrical shape with the Z-direction as its axis. Thus, as... Figure 2 As shown in (b), the cross section of the counterweight 51 on the plane perpendicular to the Z direction (XY plane) becomes circular.

[0063] In addition, the elastic part 53 is made of a viscoelastic material that has viscosity and elasticity, and is a component that supports the counterweight 51 so that it can vibrate relative to the LPH140.

[0064] Each elastic part 53 has a cylindrical shape with the Z direction as its axis. As a result, the cross-section of each elastic part 53 on the surface perpendicular to the Z direction (XY plane) becomes circular.

[0065] There are no particular limitations on the material used to constitute the counterweight 51, and any material that can achieve the target mass (M1 described later) can be selected. For example, materials with a higher density than the material constituting the elastic part 53 can be used as the material constituting the counterweight 51. Specifically, metal materials such as steel or SUS, resin materials, etc., can be used.

[0066] Furthermore, there are no particular limitations on the material constituting the elastic part 53; any material capable of achieving the target spring constant (K, described later) can be selected. Specifically, porous materials such as sponge, rubber, and resin can be used as the material constituting the elastic part 53.

[0067] Furthermore, the elastic portion 53 of the dynamic vibration absorber 50 is connected to the mounting member 70 located at the center of the frame 145 in the Z direction. Thus, the counterweight 51 and the elastic portion 53 of the dynamic vibration absorber 50 are mounted in a manner that forms a gap with the frame 145.

[0068] Mounting component 70 is an example of a mounting component that is mounted on the frame 145 of the LPH140 and holds the dynamic vibration absorber 50 opposite to the LPH140. Mounting component 70 is constructed of a component that will not elastically deform even when vibration is input to the exposure apparatus 14 from the outside. Mounting component 70 can be made of sheet metal such as steel or SUS. Alternatively, mounting component 70 can be integrated with the frame 145.

[0069] In this example, the mounting component 70 consists of two plate-shaped components arranged with a gap in the Z direction and extending from the frame 145 toward the upstream side in the Y direction (vertically below the exposure device 14).

[0070] In this embodiment, such as Figure 3 As shown in (a) to (b), the dynamic vibration absorber 50 is positioned at the location where the displacement is greatest when the LPH140 vibrates (hereinafter referred to as the maximum displacement position). More specifically, the counterweight 51 of the dynamic vibration absorber 50 is positioned at the maximum displacement position.

[0071] Thus, by setting the dynamic vibration absorber 50 at the maximum displacement position, compared to setting the dynamic vibration absorber 50 at a position other than the maximum displacement position, it is easier to absorb the vibration of LPH140 by setting the dynamic vibration absorber 50 at the maximum displacement position.

[0072] With the mass of counterweight 51 set to M and the spring constant of elastic part 53 set to K, the natural vibration frequency f of dynamic vibration absorber 50 is expressed by the following formula.

[0073]

[0074] Next, the function of the dynamic vibration absorber 50 will be explained.

[0075] As described above, in this embodiment, the natural vibration frequency f of the dynamic vibration absorber 50 is equal to the natural vibration frequency fa of the LPH140. Furthermore, when vibration is input to the exposure apparatus 14 from the outside, it is primarily the counterweight 51 of the dynamic vibration absorber 50 that vibrates in place of the LPH140. Additionally, the elastic portion 53 repeatedly deforms due to the vibration of the counterweight 51, and its viscosity attenuates the vibration. As a result, the vibration of the LPH140 is absorbed and attenuated by the dynamic vibration absorber 50.

[0076] Furthermore, as described above, the dynamic vibration absorber 50 is mounted on the frame 145 of the LPH140 via the mounting member 70, and is in a floating state without contacting the LPH140. Thus, for example, compared to the case where elastic members or the like are pressed onto the LPH140 to suppress vibrations, the load applied to the LPH140 can be suppressed.

[0077] Figure 5 and Figure 6 This diagram illustrates the mounting configuration for installing the dynamic vibration absorber 50 onto the LPH140. Figure 5 (a) is a projection diagram showing the state before installation. Figure 5 (b) is a 3D view showing the installed state. Additionally, Figure 6 (a) and (c) are perspective views of the mounting component 70, and (b) is a perspective view showing the engaged state when the dynamic vibration absorber 50 is mounted on the mounting component 70. Additionally, Figure 5 and Figure 6 The positional relationship between LPH140 and dynamic vibration absorber 50 in the middle and Figures 1-4 On the contrary, but this is for the sake of explanation. (To be continued later...) Figure 7 The same applies to the middle.

[0078] like Figure 5 As shown in (a), a groove 55 extending circumferentially is formed on the elastic portion 53 of the dynamic vibration absorber 50. A counterweight 51 is located between two grooves 55. The groove 55 is formed throughout the entire circumference.

[0079] The dynamic vibration absorber 50 is mounted on the mounting component 70 in the direction of the arrow.

[0080] like Figure 5As shown in (b), the mounting member 70 has a portion 74 that enters the slot 55 of the dynamic vibration absorber 50. The dynamic vibration absorber 50 is held at two points by inserting the portion 74 of the mounting member 70 into the slot 55. In this way, the dynamic vibration absorber 50 is mounted on the mounting member 70 using the slot 55.

[0081] like Figure 6 As shown in (a), the mounting member 70 is formed in an L-shaped corner shape. The mounting member 70 has a mounting hole 71 for mounting to the dynamic vibration absorber 50, and a cutout 73 in the shape of a groove 55 that can receive the elastic part 53.

[0082] Multiple mounting holes 71 can be provided. In addition, they can be not only circular but also elliptical, which can be configured to allow for position adjustment.

[0083] In the cutout portion 73, an opening 73a is formed by cutting the end of the mounting member 70, and an arc-shaped portion 73b is formed on the inside of the opening 73. The opening 73a and the arc-shaped portion 73b are formed continuously. Thus, the cutout portion 73 has an open shape with a cut. The opening 73a of the cutout portion 73 is an example of a cut.

[0084] The opening width of the opening 73a is smaller than the outer diameter of the groove 55 of the elastic part 53, and the diameter of the arc-shaped part 73b corresponds to the outer diameter of the groove 55 of the elastic part 53. Therefore, the elastic part 53 can pass through the opening 73a by pressing and deforming. After passing through the opening 73a, the elastic part 53 returns to its pre-deformation state or a state where the deformation is smaller than when passing through the opening 73a, such as... Figure 6 As shown in (b), the elastic part 53 is held in contact with the periphery of the arc-shaped part 73b.

[0085] The dynamic vibration absorber 50 is held in a state that makes it difficult to detach from the mounting component 70. On the other hand, the elastic part 53 is deformed through the opening 73a, so that the dynamic vibration absorber 50 can be easily removed from the mounting component 70.

[0086] Furthermore, in this embodiment, the cutout 73 of the mounting member 70 is formed on the side opposite to the dynamic vibration absorber 50, and the dynamic vibration absorber 50 is positioned from the Y direction (for example, referring to...). Figure 4 The dynamic damper 50 may be mounted on the mounting component 70, but is not limited thereto. For example, it may also be considered to mount the dynamic damper 50 from the X direction (e.g., refer to...). Figure 4 The cutout 73 is formed on the mounting component 70 in such a way that it is mounted on the mounting component 70.

[0087] Furthermore, in this embodiment, the opening 73a of the cutout 73 is positioned such that it opens in the same direction (e.g., the Y direction) in both mounting members 70. However, it is not limited to this and can also be configured to open in different directions in the two mounting members 70. For example, using Figure 6 In the case of the mounting components 70 shown in (a) and (c), one of the two mounting components 70 is open in the Y direction (refer to (a) of the figure) and the other is open in the X direction (refer to (c) of the figure).

[0088] Additionally, as another example, both mounting components 70 are in the X direction (refer to (c) of the figure), with one and the other in opposite directions. The same component (refer to (c) of the figure) can be used as the mounting components 70 at both ends of the dynamic vibration absorber 50.

[0089] In addition, in this embodiment, notches 73 are formed in each of the two mounting members 70, but this is not a limitation. It is also possible to consider a mounting part with a structure in which a notch 73 is formed on one of the two mounting members 70, and a closed shape without an opening 73 is formed on the other mounting member 70 instead of the notch 73.

[0090] Furthermore, in this embodiment, by using two mounting parts 70, it is set as two parts, which makes it easier to develop a model that changes the interval between the two mounting parts 70 according to the inherent vibration frequency, but it is also possible to consider using only one part.

[0091] Figure 7 The diagrams (a), (b), and (c) illustrate other installation configurations, showing installations in different locations.

[0092] exist Figure 7 In the installation configuration shown, in addition to the groove 55, grooves 56 and 57 are formed on each elastic part 53 located at the end of the dynamic vibration absorber 50. The groove 56 is formed on the side of the counterweight 51 of the groove 55, and the groove 57 is formed on the opposite side, that is, on the end side of the groove 55.

[0093] The left and right slots 55 are located at equal distances from the center of the dynamic shock absorber 50. In other words, the slots 55 are formed such that the center position of the separation distance between the slots 55 overlaps with the center position of the length of the counterweight 51.

[0094] The center position of the separation distance of the left and right slots 56 is the same as the center position of the separation distance of the left and right slots 55, and the center position of the separation distance of the left and right slots 57 is the same as the center position of the separation distance of the left and right slots 55.

[0095] Thus, multiple grooves 55-57 are formed symmetrically on both sides of the dynamic vibration absorber 50 in one direction Z. Furthermore, in Figure 7 In the example, there are 3 slots 55-57, but it can also be 2 slots, or more than 4 slots.

[0096] exist Figure 7 In the case of the installation structure, the interval of the installation components 70 can be changed.

[0097] Using Figure 7 In the mounting position of slot 55 shown in (a), the spacing of the mounting components 70, including the plate thickness of the mounting component 70, is dimension L1. In the mounting position of slot 56 shown in (b) of the same figure, the spacing of the mounting components 70, including the plate thickness of the mounting component 70, is dimension L2. In the mounting position of slot 57 shown in (c) of the same figure, the spacing of the mounting components 70, including the plate thickness of the mounting component 70, is dimension L3.

[0098] By employing a structure that forms multiple grooves 55-57 on the dynamic vibration absorber 50, it is possible to cope with situations where the spacing of the mounting components 70 is different.

[0099] Figure 8 (a) is a diagram illustrating the relationship between the spacing of the mounting components 70 and the natural vibration frequency; (b) is a diagram illustrating the dimensions of the dynamic vibration absorber 50 used to calculate the natural vibration frequency; and (c) is a table showing examples of the calculation results.

[0100] exist Figure 8 In the dynamic vibration absorber 50 shown in (a), if the length of the part located between the two mounting parts 70 is set as M, the length of the counterweight 51 in the length M is set as M1, and the length of the elastic part 53 is set as M2, then M = M1 + 2 × M2.

[0101] In addition, if the thickness of the plate of the mounting component 70 is t, then the total length L is L=2×t+M1+2×M2.

[0102] exist Figure 8 In the table shown in (b), the entries from left to right are M1 (mm), M2 (mm), s (mm), t (mm), L (mm), f ave (Hz). Here, 's' refers to the elastic engagement amount (deformation amount) of the elastic part 53 when the mounting component 70 is fitted into the groove 55 of the elastic part 53, and 'f' refers to the elastic engagement amount (deformation amount) of the elastic part 53. ave It is the calculated natural vibration frequency (average value).

[0103] With a total length L of 58 mm, the natural vibration frequency f ave The frequency is 133.5 Hz. With a total length L of 55 mm, the natural vibration frequency f is...ave The natural vibration frequency f is 151.3 Hz, with a total length L of 52 mm. ave It is 169Hz.

[0104] Thus, if the total length L increases, the natural vibration frequency f ave If the overall length L decreases, the natural vibration frequency f will increase. ave It gets lower.

[0105] In addition, the natural vibration frequency f ave It also varies depending on the thickness t of the plate of the mounting component 70; if it becomes thicker, it rises, and if it becomes thinner, it falls.

[0106] In this way, the natural vibration frequency f can be designed according to the dimensions of the dynamic vibration absorber 50, including the spacing of the slots 55, and the mounting components 70. ave Therefore, by providing not only slot 55 but also other slots 56 and 57 in the dynamic vibration absorber 50, it can be used for multiple LPH140s with different natural vibration frequencies, thereby improving versatility.

[0107] Here, by providing multiple slots 55, 56, and 57 at each end of the dynamic vibration absorber 50, during the installation of the dynamic vibration absorber 50 onto the LPH140, it is possible to make an installation error by inserting the mounting component 70 into a slot other than the intended slot among the multiple slots at each end of the dynamic vibration absorber 50. The more slots there are, the higher this possibility becomes.

[0108] To prevent this installation error, the spacing between adjacent slots in slots 55, 56, and 57 should be different. This will be explained in detail below.

[0109] Figure 9 This is an explanation Figure 7 The diagram shows the installation structure.

[0110] like Figure 9 As shown, in the elastic part 53 of the dynamic vibration absorber 50, the length a1 of the portion 58 between the grooves 55 and 56 is different from the length a2 of the portion 59 between the grooves 55 and 57.

[0111] Therefore, when the dynamic vibration absorber 50 is installed to the mounting component 70 using the left slot 55 and the right slot 55, since the length a1 of part 58 is different from the length a2 of part 59, it is difficult to install it to the mounting component 70 using the left slot 57 and the right slot 56 (refer to the dotted line), thus preventing installation errors during assembly.

[0112] Here, various application examples, such as direct drawing onto a printed circuit board, are considered in relation to this embodiment.

[0113] For example, the LPH140 of this embodiment can be used as a flat-plate exposure apparatus having a flat platform for adsorbing and holding sheet-like recording material or photosensitive material (e.g., printed circuit board) on its surface, or it can be a so-called external drum type exposure apparatus having a drum on which recording material or photosensitive material (e.g., flexible printed circuit board) is wound. The LPH140 described above (e.g., refer to...) Figure 2 This device is used to position a rotating drum holding photosensitive material along its axial direction (sub-scanning direction), and the drum can rotate circumferentially (main scanning direction) by means of a drive mechanism rotating around its axis. Thus, the LPH140 can also be used as an exposure device for CTP (Computer To Plate) where the plate is directly exposed.

[0114] The aforementioned LPH140 (e.g., refer to...) Figure 2 For example, it can be used for the exposure of dry film resist (DFR) in the manufacturing process of printed wiring board (PWB), the formation of color filters in the manufacturing process of liquid crystal display (LCD), the exposure of DFR in the manufacturing process of TFT, and the exposure of DFR in the manufacturing process of plasma display panel (PDP).

[0115] Furthermore, the LPH140 described above can utilize either a photonic mode photosensitive material that records information directly through exposure or a thermal mode photosensitive material that records information through heat generated by exposure. When using a photonic mode photosensitive material, the laser device can employ a GaN-based semiconductor laser, a wavelength-converting solid-state laser, or the like. When using a thermal mode photosensitive material, the laser device can employ an AlGaAs-based semiconductor laser (infrared laser) or a solid-state laser.

[0116] The LPH140 of this embodiment can be applied to the construction of light-emitting devices other than exposure devices, and can be used as a light source for display devices used in vibration environments, such as vehicle-mounted projectors.

Claims

1. A light-emitting device, comprising: The light-emitting part has a plurality of light-emitting elements arranged along one direction, and the two ends of the light-emitting part along that one direction are positioned at predetermined positions, and the plurality of light-emitting elements emit light to the same side as each other; A dynamic vibration absorber having a counterweight and an elastic portion, the counterweight being located at the center in one direction of the light-emitting portion, the elastic portion supporting the counterweight to allow vibration, the dynamic vibration absorber being mounted on the light-emitting portion and absorbing the vibration of the light-emitting portion; and The mounting component has a portion that enters a groove formed in the elastic part of the dynamic vibration absorber, through which the dynamic vibration absorber is mounted to the light-emitting part. The elastic portion has multiple grooves formed on both sides of one direction.

2. The light-emitting device according to claim 1, wherein, The spacing between adjacent slots in at least three slots formed on both sides of the one direction is different.

3. A light-emitting device, comprising: The light-emitting part has a plurality of light-emitting elements arranged along one direction, and the two ends of the light-emitting part along that one direction are positioned at predetermined positions, and the plurality of light-emitting elements emit light to the same side as each other; A dynamic vibration absorber having a counterweight and an elastic portion, the counterweight being located at the center in one direction of the light-emitting portion, the elastic portion supporting the counterweight to allow vibration, the dynamic vibration absorber being mounted on the light-emitting portion and absorbing the vibration of the light-emitting portion; and The mounting component has a portion that enters a groove formed in the elastic part of the dynamic vibration absorber, through which the dynamic vibration absorber is mounted to the light-emitting part. The portion of the mounting component has an open shape with a cutout for the elastic portion of the dynamic vibration absorber to pass through. The dynamic vibration absorber is installed on the light-emitting part through multiple cuts. The multiple cuts open in different directions.

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