Electronic device

Abstract

The present application relates to an electronic device. The electronic device includes a display panel including a first panel area, a bending area, and a second panel area, a support layer disposed under the first panel area of the display panel, a setting bracket disposed under the support layer, a first waterproof band disposed between the support layer and the setting bracket, the first waterproof band attached to the setting bracket, and a second waterproof band attached to the setting bracket. The bending area can be bendable, the second panel area can be disposed under the first panel area, the first waterproof band can be spaced apart from the second panel area in a thickness direction of the display panel, and the second waterproof band can overlap the second panel area.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0138269, filed on October 23, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of this disclosure described herein relate to electronic devices with improved product reliability. Background Technology

[0004] Electronic devices provide information to users by displaying various images on a screen. Typically, electronic devices display information within a dedicated screen. Recently, flexible electronic devices, including foldable flexible display panels, have been developed. Unlike rigid electronic devices, flexible electronic devices can be folded, rolled, or bent. Flexible electronic devices, whose shape can be changed in various ways, are portable, not limited by existing screen sizes, and thus improve user convenience.

[0005] It should be understood that this background section is intended to provide some useful context for understanding the art. However, this background section may also include ideas, concepts, or knowledge that were not known or understood by a person skilled in the art prior to the relevant valid application date of the subject matter disclosed herein. Summary of the Invention

[0006] Embodiments of this disclosure provide an electronic device with improved waterproof performance.

[0007] According to an embodiment, the electronic device may include: a display panel, including a first panel area, a curved area, and a second panel area; a support layer disposed below the first panel area of ​​the display panel; a mounting bracket disposed below the support layer; a first waterproof strip disposed between the support layer and the mounting bracket, the first waterproof strip being attached to the mounting bracket; and a second waterproof strip attached to the mounting bracket. The curved area may be curved, the second panel area may be disposed below the first panel area, the first waterproof strip may be spaced apart from the second panel area in the thickness direction of the display panel, and the second waterproof strip may overlap with the second panel area.

[0008] The thickness of the first waterproofing strip can be greater than the thickness of the second waterproofing strip.

[0009] The curved area can be curved relative to a curved axis extending in the first direction, and the second waterproof strip can extend in the first direction.

[0010] The first waterproof strip may include: a first portion extending in a first direction; a second portion extending from one end of the first portion in a second direction intersecting the first direction; and a third portion extending from the other end of the first portion in the second direction, and a portion of the second panel area may be disposed in the area surrounded by the first portion, the second portion and the third portion.

[0011] The electronic device may further include: a first gasket disposed between a second portion of the first waterproof strip and the second waterproof strip; and a second gasket disposed between a third portion of the first waterproof strip and the second waterproof strip.

[0012] The second panel area may include an edge adjacent to the first and second washers, and the edge of the second panel area may protrude more than the edge of the second waterproof strip.

[0013] A chip cover layer may be provided between the second panel area and the second waterproof strip, and the chip cover layer may have an edge adjacent to the first gasket and the second gasket, and the edge of the chip cover layer may protrude more than the edge of the second waterproof strip and less than the edge of the second panel area.

[0014] The electronic device may further include: a spacer disposed between the support layer and the second panel region, wherein the spacer may have an edge adjacent to the first gasket and the second gasket, and the edge of the spacer may protrude more than the edge of the second panel region and the edge of the second waterproof strip.

[0015] Spacers can be waterproof.

[0016] Spacers may include closed-cell foam.

[0017] The electronic device may also include: a cover layer disposed below the support layer; and a heat dissipation layer disposed below the cover layer, wherein a first waterproof strip may be attached to the heat dissipation layer.

[0018] The cover layer may have an edge adjacent to the first gasket and the second gasket, the edge of the cover layer may protrude more than the edge of the heat dissipation layer, and the edge of the heat dissipation layer may protrude more than the edge of the first waterproof strip.

[0019] Each of the first and second washers can be spaced apart from the edge of the support layer surrounded by the curved area.

[0020] Each of the first and second washers may have an increased width as it moves away from the support layer.

[0021] The first panel area may include a folded area, a first non-folded area, and a second non-folded area, wherein the folded area is disposed between the first non-folded area and the second non-folded area, the folded area may be foldable, the first waterproof strip and the second waterproof strip may overlap with the second non-folded area, and the opening in the support layer may be defined in the area of ​​the support layer that overlaps with the folded area.

[0022] At least one of the first and second waterproofing strips may include closed-cell foam.

[0023] According to an embodiment, the electronic device may include: a display panel; a circuit film disposed on the display panel; a first waterproof strip disposed on the display panel and adjacent to the circuit film; a second waterproof strip disposed on the display panel and adjacent to the circuit film; and a gasket disposed between the first waterproof strip and the second waterproof strip.

[0024] The display panel may include: a first panel area; a curved area extending from the first panel area and curved toward a surface of the first panel area; and a second panel area extending from the curved area and disposed below the first panel area, wherein a circuit film may be attached to the second panel area, and a second waterproof strip may overlap the second panel area.

[0025] The electronic device may further include: a support layer disposed below the first panel area; a spacer disposed below the support layer; a panel protective layer disposed below the spacer; and a chip cover layer disposed below the panel protective layer, wherein the second panel area may be disposed between the chip cover layer and the panel protective layer, and the second waterproof tape may be attached to the chip cover layer. A first distance may be defined between the edge of the contact gasket of the spacer and the first waterproof tape, a second distance may be defined between the edge of the contact gasket of the panel protective layer and the first waterproof tape, and a third distance may be defined between the edge of the contact gasket of the chip cover layer and the first waterproof tape. The first distance may be less than the second and third distances, and the second distance may be less than the third distance.

[0026] At least one of the spacer, the first waterproof strip, and the second waterproof strip may include closed-cell foam.

[0027] The display panel may include a folded area, a first non-folded area, and a second non-folded area, wherein the folded area is disposed between the first non-folded area and the second non-folded area, the folded area may be foldable, and the first waterproof strip, the second waterproof strip, and the gasket may overlap with the second non-folded area. Attached Figure Description

[0028] The above and other aspects and features of this disclosure will become apparent from the detailed description of embodiments thereof with reference to the accompanying drawings.

[0029] Figure 1A and Figure 1B This is a schematic perspective view of an electronic device according to an embodiment;

[0030] Figure 2 This is an exploded schematic perspective view of an electronic device according to an embodiment;

[0031] Figure 3 It is according to the implementation method along Figure 2 A schematic cross-sectional view of the display module taken by line I-I';

[0032] Figure 4 This is a schematic plan view of the display panel according to the embodiment;

[0033] Figure 5 It is according to the implementation method along Figure 4 A schematic cross-sectional view of the display device taken by line II-II';

[0034] Figure 6 This is a schematic cross-sectional view of a display device according to an embodiment;

[0035] Figure 7 This is a schematic rear view of a display device according to an embodiment;

[0036] Figure 8 It is according to the implementation method along Figure 7 A schematic cross-sectional view of the display device taken by line III-III';

[0037] Figure 9 This is a schematic cross-sectional view of the spacer according to the embodiment;

[0038] Figure 10 This is a schematic rear view of a display device according to an embodiment; and

[0039] Figure 11 It is according to the implementation method along Figure 10 A schematic cross-sectional view of the display device taken by line IV-IV'. Detailed Implementation

[0040] In this disclosure, when a component (or region, layer, part, etc.) is referred to as being “on”, “connected” or “linked” to another component, it should be understood that the former may be directly on, directly connected to or directly linked to the latter, or the former may also be on, connected to or linked to the latter via a third intermediary component.

[0041] The same reference numerals denote the same components. Furthermore, in the accompanying drawings, the thickness, scale, and dimensions of components may be exaggerated for the purpose of effectively describing the technical content.

[0042] The term "and / or" includes one of the related listed items or all combinations of two or more related listed items. For example, "A and / or B" can be understood as meaning "A, B, or A and B". The terms "and" and "or" can be used in a combined or separate sense and can be understood as equivalent to "and / or".

[0043] In the specification and claims, for purposes of meaning and interpretation, the phrase “at least one of…” is intended to include the meaning of “at least one selected from the group of…”. For example, “at least one of A and B” can be understood to mean “A, B, or A and B”.

[0044] Terms such as “first” and “second” are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. For example, a first component may be designated as a second component, and vice versa, without departing from the spirit or scope of this disclosure. Unless otherwise stated, the singular form may include the plural form (and vice versa).

[0045] Furthermore, the terms "below," "under," "above," and "above" are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative concepts and can be described with reference to the directions indicated in the drawings.

[0046] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms, such as those defined in common dictionaries, shall be interpreted as having the same meaning as they have in the relevant field and in the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0047] The terms “include,” “comprise,” “has,” “have,” “including,” “comprising,” and “having” specify properties, fixed numbers, steps, processes, components, and / or combinations thereof, but do not exclude other properties, fixed numbers, steps, processes, components, and / or combinations thereof.

[0048] The term “overlap” or “overlapped” means that the first object may be above or below the second object, or on one side of the second object, and vice versa. Additionally, the term “overlap” may include layering, stacking, facing, extending above, extending below, covering or partially covering, or any other suitable term as will be understood and appreciated by one of ordinary skill in the art.

[0049] The terms "face" and "facing" mean that the first element can be directly or indirectly opposite the second element. When a third element is inserted between the first and second elements, the first and second elements can be understood as indirectly opposite each other, but still facing each other.

[0050] When an element is described as “not overlapping” or “to not overlap” with another element, this may include elements being spaced apart from each other, offset from each other, or separated from each other, or any other suitable terminology that will be understood and appreciated by one of ordinary skill in the art.

[0051] As used herein, “about” or “approximately” includes the value as well as the average of the values ​​within an acceptable range of deviations from the particular value, as determined by a person skilled in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the value.

[0052] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0053] Figure 1A and Figure 1B This is a schematic perspective view of an electronic device ED according to an embodiment. Figure 1A The deployed (or open) state of the electronic device ED is shown, and Figure 1B The folded state of the electronic device ED is shown.

[0054] refer to Figure 1A and Figure 1B According to an embodiment, the electronic device ED may include a display surface DS defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device ED can provide an image IM to a user through the display surface DS.

[0055] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image IM, and the non-display area NDA may not display an image IM. The non-display area NDA may surround the display area DA. However, this disclosure is not limited thereto, and the shapes of the display area DA and the non-display area NDA may be modified.

[0056] In the following text, a direction substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2 can be defined as the third direction DR3. Furthermore, in this disclosure, the expression "in a plan view" can be defined as the state observed from the third direction DR3. In the following text, the first direction DR1, the second direction DR2, and the third direction DR3, as well as the directions indicated from the first direction axis to the third direction axis, can refer to the same reference numerals.

[0057] The electronic device ED may include a folded region FA and non-folded regions NFA1 and NFA2. The non-folded regions NFA1 and NFA2 may include a first non-folded region NFA1 and a second non-folded region NFA2. In the second direction DR2, the folded region FA may be disposed between the first non-folded region NFA1 and the second non-folded region NFA2.

[0058] like Figure 1B As shown, the folding region FA can be folded around a folding axis FX parallel to the first direction DR1. The folding region FA can have a curvature and a radius of curvature. The first non-folding region NFA1 and the second non-folding region NFA2 can face each other, and the electronic device ED can be folded inward so that the display surface DS is not exposed to the outside.

[0059] In one embodiment, the electronic device ED can be folded outward, allowing the display surface DS to be exposed to the outside. In another embodiment, the electronic device ED can be configured to alternately repeat inward or outward folding operations from an unfolding operation, but this disclosure is not limited thereto. In yet another embodiment, the electronic device ED can be configured to select one of an unfolding operation, an inward folding operation, and an outward folding operation.

[0060] Figure 2 This is an exploded schematic perspective view of an electronic device ED according to an embodiment.

[0061] refer to Figure 2 The electronic device ED may include a display device DD, a setting bracket SBK, an electronic module EM, a power module PSM, and housings EDC1 and EDC2. Although in Figure 2 Not shown, but the electronic device ED may also include a mechanical structure for controlling the folding operation of the display device DD.

[0062] The display device DD can generate images and detect external input. The display device DD may include a window module WM and a display module DM. The window module WM provides the front surface of the electronic device ED.

[0063] The display module DM may include the display panel DP. Figure 2 The display module DM is the same as the display panel DP, but the display module DM can be a stacked structure in which components are stacked on top of each other. A detailed description of the stacked structure of the display module DM is given below.

[0064] The display module DM may include a display panel DP. The display panel DP may include a display area DA connected to the electronic device ED (reference). Figure 1A The corresponding display area DP-DA and the non-display area NDA of the electronic device ED (reference) Figure 1A The corresponding non-display area DP-NDA. In this disclosure, the phrase "area / part corresponds to another area / part" can mean that the areas / parts overlap each other, and is not limited to the interpretation that the areas / parts have the same size.

[0065] The display module DM may include a driver chip DIC disposed on the non-display area DP-NDA. The display module DM may also include a circuit film FCB electrically connected to the non-display area DP-NDA. The circuit film FCB may be flexible.

[0066] The driver chip (DIC) may include driving elements for driving the pixels of the display panel (DP), such as data driving circuitry. Figure 2 The diagram shows a structure in which the driver chip DIC is mounted on the display panel DP, but this disclosure is not limited thereto. For example, the driver chip DIC may be mounted on the circuit film FCB.

[0067] The connector DMC can be mounted on the circuit diaphragm FCB. The connector DMC can be electrically connected to the main controller, which will be described below.

[0068] The mounting bracket SBK can be positioned below the display device DD. The display device DD can be attached to the mounting bracket SBK. The mounting bracket SBK and the folding area FA (see reference) Figure 1A The corresponding part SBK-P can be formed of a flexible material. The bracket SBK can be set as two separate segments, similar to the housings EDC1 and EDC2.

[0069] The electronic module (EM) and power supply module (PSM) can be located below the mounting bracket (SBK). The electronic module (EM) may include at least a main controller. The electronic module (EM) may include a wireless communication module, a camera module, a proximity sensor module, an image input module, an audio input module, an audio output module, memory, and an external interface module. The electronic module (EM) can be electrically connected to the power supply module (PSM).

[0070] The main controller controls the overall operation of the electronic device ED. For example, the main controller can activate or deactivate the display device DD in response to user input. The main controller can control the operation of the display device DD and other modules. The main controller may include at least one microprocessor.

[0071] Housings EDC1 and EDC2 can accommodate the display module DM, the setting bracket SBK, the electronics module EM, and the power supply module PSM. (Although this is just an example...) Figure 2 Two separate housings, EDC1 and EDC2, are shown, but this disclosure is not limited thereto. Although in Figure 2 Not shown, but the electronic device ED may also include a hinge structure for connecting the two housings EDC1 and EDC2. Housings EDC1 and EDC2 may be combined with a window module WM. Housings EDC1 and EDC2 may protect components housed within housings EDC1 and EDC2, such as a display module DM, an electronic module EM, and a power module PSM.

[0072] Figure 3 It is according to the implementation method along Figure 2 A schematic cross-sectional view of the display module DM, taken by line I-I'.

[0073] refer to Figure 3 The display module DM may include a display panel DP, an input sensor IS disposed on the display panel DP, an optical film LF disposed on the input sensor IS, and a lower component LM disposed below the display panel DP. An adhesive layer may be disposed between the components as needed.

[0074] The display panel (DP) may include a base layer, a circuit element layer disposed on the base layer, a display element layer disposed on the circuit element layer, and a thin-film encapsulation layer disposed on the display element layer. The base layer may include a plastic film. For example, the base layer may include polyimide. Essentially, the shape of the base layer in a plan view may be as described below. Figure 4 The display panel DP shown in the plan view has the same shape.

[0075] The circuit element layer may include organic layers, inorganic layers, semiconductor patterns, conductive patterns, and signal lines. The organic, inorganic, semiconductor, and conductive layers can be formed on the base layer through coating and vapor deposition. Subsequently, the organic, inorganic, semiconductor, and conductive layers can be selectively patterned using photolithography, thus forming semiconductor patterns, conductive patterns, and signal lines.

[0076] Semiconductor patterns, conductive patterns, and signal lines can be formed as described below. Figure 4 The pixel driving circuit and signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2 and PL are shown for pixel PX. The pixel driving circuit may include at least one transistor.

[0077] The display element layer may include the components described below. Figure 4 The pixel PX shown is a light-emitting element. The light-emitting element may be electrically connected to at least one transistor. A thin-film encapsulation layer may be disposed on the display element layer to seal the display element layer. The thin-film encapsulation layer may include inorganic layers, organic layers, and inorganic layers stacked sequentially on top of each other. The stacking structure of the thin-film encapsulation layer is not limited thereto.

[0078] The input sensor IS may include sensing electrodes (not shown) for sensing external input, traces (not shown) electrically connected to the sensing electrodes, and inorganic and / or organic layers for insulating / protecting the sensing electrodes or traces. The input sensor IS may be a capacitive sensor, but this disclosure is not limited thereto.

[0079] The input sensor IS can be formed directly on the thin-film encapsulation layer during the manufacturing of the display panel DP using a continuous process. In this disclosure, the display panel DP integrated with the input sensor IS can be defined as an electronic panel. However, this disclosure is not limited to this, and the input sensor IS can be manufactured as a panel separate from the display panel DP, and can be attached to the display panel DP via an adhesive layer.

[0080] The sensing electrodes can be connected to the display area DP-DA (reference). Figure 4 The trace may overlap with the non-display area DP-NDA (reference). Figure 4 Overlap. The trace can pass through the curved region BA (reference). Figure 4 ) Towards the second panel area AA2 (reference) Figure 4 The lower end extends to match. Figure 4 The pads PD shown are adjacent. The traces and signal lines of the circuit element layer are SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2, and PL (reference). Figure 4 It can be set on different layers.

[0081] The trace can be electrically connected to the display panel's DP. Figure 4 The signal line (input signal line) set for the input sensor IS in the first panel area AA1 shown. The input signal line can be... Figure 4 The signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2, and PL shown are different signal lines, but the input signal lines and one of the signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2, and PL can be placed on the same layer. Each of the input signal lines can be electrically connected to the corresponding pad PD (see reference). Figure 4 Therefore, similar to the signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2, and PL of the circuit element layer, the traces can be electrically connected to the circuit film FCB (reference). Figure 4 ).

[0082] An optical film (LF) can reduce the reflectivity of external light. An optical film (LF) may include a phase retarder and / or a polarizer. An optical film (LF) may include at least one polarizing film.

[0083] The optical film LF according to the embodiment may include a color filter. The color filter may have an arrangement. The arrangement of the color filter may be determined taking into account the emission colors of the pixels PX included in the display panel DP. The optical film LF may also include a black matrix adjacent to the color filter.

[0084] The optical film LF according to the embodiment may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed in different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, can destructively interfere with each other, and thus can reduce the reflectivity of external light.

[0085] The lower component LM may include various functional components. The lower component LM may include a light-blocking layer that blocks light incident on the display panel DP, an impact-absorbing layer that absorbs external impacts, a support layer that supports the display panel DP, and a heat dissipation layer that dissipates heat generated by the display panel DP. A detailed description of the stacking structure of the lower component LM will be given below.

[0086] Figure 4 This is a schematic plan view of the display panel according to the embodiment.

[0087] refer to Figure 4The display panel (DP) can include a display area (DP-DA) and a non-display area (DP-NDA) surrounding the display area (DP-DA). The display area (DP-DA) and the non-display area (DP-NDA) can be determined based on the presence or absence of pixels (PX). Pixels (PX) can be located within the display area (DP-DA). The scan driver (SDV), data driver, and light-emitting driver (EDV) can be located within the non-display area (DP-NDA). The data driver can be some circuitry located within the driver chip (DIC).

[0088] The display panel DP may include a first panel area AA1, a second panel area AA2, and a curved area BA, which can be defined on the second direction DR2. The second panel area AA2 and the curved area BA can be areas outside the display area DP-NDA. The curved area BA can be located between the first panel area AA1 and the second panel area AA2.

[0089] The first panel area AA1 can be... Figure 1A The display surface DS corresponds to the area. The first panel area AA1 may include a first non-folding area NFA10, a second non-folding area NFA20, and a folding area FA0. The first non-folding area NFA10, the second non-folding area NFA20, and the folding area FA0 may respectively correspond to Figure 1A and Figure 1B The first non-folded region NFA1, the second non-folded region NFA2, and the folded region FA.

[0090] The length (or width) of the curved region BA and the second panel region AA2 in the first direction DR1 can be smaller than the length (or width) of the first panel region AA1 in the first direction DR1. The curved region BA can be bent around a bending axis extending in the first direction DR1, and the region of the curved region BA with a small length in the direction of extension parallel to the bending axis can be bent more easily.

[0091] The display panel DP may include pixels PX, scan lines SL1 to SLm, data lines DL1 to DLn, emission lines EL1 to ELm, first control line CSL1 and second control line CSL2, power line PL, and pads PD. Here, "m" and "n" can be integers. Pixels PX may be electrically connected to scan lines SL1 to SLm, data lines DL1 to DLn, and emission lines EL1 to ELm.

[0092] Scan lines SL1 to SLm can extend in the first direction DR1 and can be electrically connected to the scan driver SDV. Data lines DL1 to DLn can extend in the second direction DR2 and can be electrically connected to the driver chip DIC via the bend region BA. Emit lines EL1 to ELm can extend in the first direction DR1 and can be electrically connected to the light-emitting driver EDV.

[0093] The power line PL may include a portion extending in the second direction DR2 and a portion extending in the first direction DR1. The portions extending in the first direction DR1 and the portions extending in the second direction DR2 may be disposed in different layers. The portion of the power line PL extending in the second direction DR2 may extend to the second panel region AA2 via the bending region BA. The power line PL may provide a first voltage to the pixel PX.

[0094] The first control line CSL1 can be electrically connected to the scan driver SDV and can extend via the bend region BA toward the lower end of the second panel region AA2. The second control line CSL2 can be electrically connected to the light-emitting driver EDV and can extend via the bend region BA toward the lower end of the second panel region AA2.

[0095] In the plan view, the pad PD can be positioned adjacent to the lower end of the second panel area AA2. The driver chip DIC, power line PL, first control line CSL1, and second control line CSL2 can be electrically connected to the pad PD respectively. The circuit film FCB can be electrically connected to the pad PD through an anisotropic conductive adhesive layer. The circuit film FCB can be attached to the second panel area AA2.

[0096] Figure 5 It is according to the implementation method along Figure 4 A schematic cross-sectional view of the display device DD taken from line II-II'. Figure 6 This is a schematic cross-sectional view of a display device DD according to an embodiment.

[0097] Figure 5 This illustrates the setting of the display device DD in the electronic device ED (reference). Figure 1A The previous display device DD's status, and Figure 6 The display device DD is shown in the electronic device ED (reference). Figure 1A The state in ).

[0098] refer to Figure 6 The display device DD is set in the electronic device ED (reference). Figure 1A In the case of ), the first panel area AA1 and the second panel area AA2 of the display panel DP can be set on different planes. The second panel area AA2 can be set below the first panel area AA1.

[0099] refer to Figure 5 and Figure 6 The window module WM may include an ultrathin glass substrate UTG, a plastic film PF disposed on the ultrathin glass substrate UTG, and a first adhesive layer AL1 that bonds the ultrathin glass substrate UTG to the plastic film PF.

[0100] The ultrathin glass substrate (UTG) can be chemically strengthened glass. Because an ultrathin glass substrate (UTG) can be used, wrinkles can be minimized even when the electronic device (ED) is repeatedly folded and unfolded. In some embodiments, a synthetic resin film can be used instead of the ultrathin glass substrate (UTG).

[0101] The plastic film PF may comprise polyimide, polycarbonate, polyamide, triacetyl cellulose, polymethyl methacrylate, polyethylene terephthalate, or combinations thereof. Although not shown separately in the accompanying drawings, at least one of a hard coating, an anti-fingerprint layer, and an anti-reflective layer may be disposed on the upper surface of the plastic film PF.

[0102] The first adhesive layer AL1 can be a pressure-sensitive adhesive (PSA) film or an optically transparent adhesive (OCA) film. The adhesive layer described below can also be the same as the first adhesive layer AL1 and can include a common adhesive.

[0103] The first adhesive layer AL1 can be separated from the ultrathin glass substrate UTG. Since the strength of the plastic film PF is lower than that of the ultrathin glass substrate UTG, scratches can occur relatively easily on the plastic film PF. After the first adhesive layer AL1 separates from the ultrathin glass substrate UTG, a new plastic film PF can be attached to the ultrathin glass substrate UTG.

[0104] In the plan view, the edges PE of the plastic film PF and A-E1 of the first adhesive layer AL1 can be aligned with each other. The plastic film PF and the first adhesive layer AL1 can have the same size and the same shape.

[0105] The window module WM and the shock-absorbing layer SAL can be bonded together via a second adhesive layer AL2. The second adhesive layer AL2 may include a transparent adhesive, such as a pressure-sensitive adhesive or an optically transparent adhesive.

[0106] In the plan view, the edges A-E2 of the second adhesive layer AL2 can overlap with the window module WM. For example, the edges A-E2 of the second adhesive layer AL2 can overlap with the ultrathin glass substrate UTG. In the process of attaching the window module WM to the display module DM, pressure can be applied to the second adhesive layer AL2. The second adhesive layer AL2 can be subjected to pressure and therefore can be stretched in a direction parallel to the second direction DR2 and the first direction DR1. Here, the area of ​​the second adhesive layer AL2 can be smaller than the area of ​​the ultrathin glass substrate UTG, so that the second adhesive layer AL2 does not protrude from the ultrathin glass substrate UTG.

[0107] The first adhesive layer AL1 and the second adhesive layer AL2 are attached to each other and the electronic device ED (reference) Figure 1A When folded, warping or cracking may occur in the ultrathin glass substrate UTG because it cannot slide. However, according to the embodiment, since the area of ​​the second adhesive layer AL2 can be smaller than the area of ​​the ultrathin glass substrate UTG, the first adhesive layer AL1 and the second adhesive layer AL2 can be unattached to each other. Therefore, the possibility of foreign matter adhering to the second adhesive layer AL2 can be reduced.

[0108] The shock absorbing layer SAL can be attached to the second adhesive layer AL2. The shock absorbing layer SAL can be a functional layer used to protect the display panel DP from external impacts. The shock absorbing layer SAL can be selected from films having an elastic modulus of 1 GPa or higher at room temperature. The shock absorbing layer SAL can be a stretched film with optical functions. For example, the shock absorbing layer SAL can be an optical axis control film.

[0109] Border pattern BP can be with Figure 1A The non-display area NDA is shown as overlapping. The border pattern BP can be formed by printing on the upper surface of the shock-absorbing layer SAL. This disclosure is not limited thereto, and the position of the border pattern BP can be modified in different ways. The border pattern BP can be a colored light-blocking film and can be formed by, for example, a coating method. The border pattern BP can include a base material and a dye or pigment mixed with the base material. The border pattern BP can have a closed line shape in a planar view.

[0110] The display module DM can be bonded to the shock-absorbing layer SAL via a third adhesive layer AL3. In an embodiment, the shock-absorbing layer SAL and the third adhesive layer AL3 can be omitted.

[0111] The display module DM may include an optical film LF, a display panel DP, a panel protective layer PPL, a barrier layer BRL, a buffer layer CUL, a support layer PLT, a cover layer SCV, a heat dissipation layer RHL, a graphite layer GS, a spacer SPC, a step compensation pattern CP, and four adhesive layers AL4, AL5, AL6, AL7, AL8, AL9, AL10, AL11, and AL12. The fourth adhesive layers AL4 to AL12 may include transparent adhesives, such as pressure-sensitive adhesives or optically transparent adhesives. Some of the components described above in the embodiments may be omitted. For example, the step compensation pattern CP and its associated eleventh and twelfth adhesive layers AL11 and AL12 may be omitted.

[0112] The optical film LF can be disposed in the first panel area AA1. The optical film LF can at least cover the display area DP-DA (reference). Figure 2 The third adhesive layer AL3 can be bonded to the optical film LF and the shock absorption layer SAL, and the fourth adhesive layer AL4 can be bonded to the optical film LF and the display panel DP. Although Figure 5 and Figure 6 Only the display panel DP is shown, but as Figure 3 As shown, the input sensor IS can be further disposed between the display panel DP and the fourth adhesive layer AL4.

[0113] A panel protective layer (PPL) can be disposed beneath the display panel (DP). The PPL protects the lower portion of the display panel (DP). The PPL may comprise a flexible plastic material. The PPL prevents scratches from occurring on the rear surface of the display panel (DP) during the manufacturing process. The PPL may be a colored polyimide film. For example, the PPL may be an opaque yellow film, but this disclosure is not limited thereto.

[0114] In this embodiment, the panel protective layer PPL may not be disposed in the bending region BA. The panel protective layer PPL may include a first panel protective layer PPL-1 protecting a first panel region AA1 in the display panel DP and a second panel protective layer PPL-2 protecting a second panel region AA2 in the display panel DP. When the bending region BA is bent, the second panel protective layer PPL-2, together with the second panel region AA2 of the display panel DP, may be disposed below the first panel region AA1 and the first panel protective layer PPL-1. The panel protective layer PPL may not be disposed in the bending region BA, and therefore the bending region BA can be bent more easily.

[0115] The fifth adhesive layer AL5 bonds the panel protective layer PPL to the display panel DP. The fifth adhesive layer AL5 may include a first portion AL5-1 corresponding to the first panel protective layer PPL-1 and a second portion AL5-2 corresponding to the second panel protective layer PPL-2. The first portion AL5-1 bonds the first panel protective layer PPL-1 to the first panel area AA1 of the display panel DP, and the second portion AL5-2 bonds the second panel protective layer PPL-2 to the second panel area AA2 of the display panel DP.

[0116] The barrier layer BRL can be disposed below the panel protective layer PPL. The sixth adhesive layer AL6 can be disposed between the panel protective layer PPL and the barrier layer BRL, and can bond the barrier layer BRL to the panel protective layer PPL. The sixth adhesive layer AL6 can be attached to the upper surface of the barrier layer BRL, and the sixth adhesive layer AL6 can also be referred to as the upper adhesive layer.

[0117] A barrier layer (BRL) increases resistance to compressive forces caused by external pressure. Therefore, the barrier layer (BRL) prevents deformation of the display panel (DP). The barrier layer (BRL) can comprise flexible plastic materials such as polyimide or polyethylene terephthalate (PET).

[0118] The light-blocking layer (BRL) absorbs light incident from the outside. The BRL can comprise a light-blocking material or a colored film with low light transmittance. For example, the BRL can be a black plastic film, such as a black polyimide film. When viewing the display module DM from above the window module WM, components located beneath the BRL are not visually visible to the user.

[0119] The buffer layer CUL can be attached to the bottom of the barrier layer BRL. The buffer layer CUL absorbs external impacts and protects the display panel DP. The elastic modulus of the buffer layer CUL can be lower than that of the support layer PLT. The buffer layer CUL may include a resilient foam sheet. The buffer layer CUL may include sponge or polyurethane.

[0120] The support layer PLT can be disposed below the buffer layer CUL. The support layer PLT can be disposed below the first panel area AA1. The support layer PLT can overlap with the first panel area AA1.

[0121] The support layer PLT can comprise metallic or non-metallic materials. For example, the support layer PLT can comprise metallic materials such as stainless steel. For example, the support layer PLT can comprise SUS 304, but this disclosure is not limited thereto, and the support layer PLT can comprise various metallic materials. The support layer PLT can improve the heat dissipation performance of the display device DD. The support layer PLT can comprise non-metallic materials such as glass or plastic. For example, the support layer PLT can comprise polyethylene or polyimide, but this disclosure is not limited thereto, and the support layer PLT can comprise various non-metallic materials. The support layer PLT can comprise materials having an elastic modulus of about 60 GPa or higher. The support layer PLT can support the display panel DP.

[0122] The opening OP can be defined in the portion of the support layer PLT corresponding to the folded region FA0. The opening OP can improve the flexibility of the support layer PLT.

[0123] In a plan view, the area of ​​each of the barrier layer BRL and the buffer layer CUL can be smaller than the area of ​​the support layer PLT. In a plan view, the barrier layer BRL can overlap with a portion of the support layer PLT. Another portion of the support layer PLT may not overlap with the barrier layer BRL.

[0124] The seventh adhesive layer AL7 can be disposed between the buffer layer CUL and the support layer PLT. The seventh adhesive layer AL7 can bond the buffer layer CUL and the support layer PLT together. The seventh adhesive layer AL7 may include a first part AL7-1 and a second part AL7-2 that are spaced apart from each other.

[0125] The first part AL7-1 and the second part AL7-2 can be spaced apart from each other, and the opening OP is inserted between the first part AL7-1 and the second part AL7-2. In the plan view, the seventh adhesive layer AL7 may not overlap with the opening OP. Furthermore, in the plan view, the seventh adhesive layer AL7 may be spaced apart from the opening OP.

[0126] The first portion AL7-1 may overlap with the first non-folded region NFA10, and the second portion AL7-2 may overlap with the second non-folded region NFA20. Each of the first portion AL7-1 and the second portion AL7-2 may not overlap with the folded region FA0. The seventh adhesive layer AL7 may not be disposed in the region corresponding to the folded region FA0, thus improving the flexibility of the support layer PLT.

[0127] The buffer layer CUL can be separated from the support layer PLT in the area where it overlaps with the folded area FA0. For example, an empty space ES can be defined between the support layer PLT and the buffer layer CUL in the area where the buffer layer CUL overlaps with the folded area FA0. Air can be provided in the empty space ES.

[0128] In electronic devices ED (reference) Figure 1A When folded, because the empty space ES is confined between the buffer layer CUL and the support layer PLT, the shape of the opening OP confined in the support layer PLT is not visually apparent from the electronic device ED (see reference). Figure 1A External identification of ).

[0129] Because the barrier layer BRL comprises a light-blocking material, or a colored film with low light transmittance is used as the barrier layer BRL, the color difference in the support layer PLT may not be visually identifiable from the outside. For example, in the support layer PLT, the color difference between a first support region defining an opening OP and a second support region not defining an opening OP may not be visually identifiable from the outside. The first support region may be a region overlapping with the folded region FA0, and the second support region may be a region overlapping with the first non-folded region NFA10 and the second non-folded region NFA20.

[0130] The thickness of the seventh adhesive layer AL7 can be less than the thickness of the sixth adhesive layer AL6. For example, the thickness of the sixth adhesive layer AL6 can be about 25 μm, and the thickness of the seventh adhesive layer AL7 can be about 16 μm.

[0131] When the thickness of the seventh adhesive layer AL7 is reduced, the step caused by the seventh adhesive layer AL7 can be reduced. As the step becomes smaller, the step caused by the electronic device ED (reference) can be reduced. Figure 1A The deformation of the stacked structure caused by folding and unfolding of the ED (Electronic Device Equipment) may occur, but the opening OP may still be visually identifiable, or the seventh adhesive layer AL7 may peel off due to repeated folding operations. Increasing the thickness of the seventh adhesive layer AL7 may make the opening OP visually indistinguishable and increase the adhesion reliability of the seventh adhesive layer AL7, which is associated with repeated folding operations of the ED. However, increasing the thickness of the seventh adhesive layer AL7 may increase the step size. Therefore, considering folding reliability, adhesion reliability, and the visibility of the opening OP, the thickness of the seventh adhesive layer AL7 can be selected within an appropriate range.

[0132] The eighth adhesive layer AL8 can be disposed below the support layer PLT, and the cover layer SCV can be disposed below the eighth adhesive layer AL8. The support layer PLT and the cover layer SCV can be bonded to each other through the eighth adhesive layer AL8. The cover layer SCV can be manufactured in sheet form and can be attached to the support layer PLT.

[0133] The eighth adhesive layer AL8 and the cover layer SCV can cover the opening OP defined in the support layer PLT. Therefore, the cover layer SCV can prevent impurities from entering the opening OP. The cover layer SCV can have a lower elastic modulus than the support layer PLT. For example, the cover layer SCV can include thermoplastic polyurethane, rubber, silicone, or combinations thereof, but this disclosure is not limited thereto.

[0134] A ninth adhesive layer AL9 may be disposed below the cover layer SCV. The ninth adhesive layer AL9 may include a first cover portion AL9-1 and a second cover portion AL9-2. The first cover portion AL9-1 and the second cover portion AL9-2 may be spaced apart from each other. In a plan view, the first cover portion AL9-1 and the second cover portion AL9-2 may be spaced apart from each other, and an opening OP is inserted between the first cover portion AL9-1 and the second cover portion AL9-2. Each of the first cover portion AL9-1 and the second cover portion AL9-2 may not overlap with the folded area FA0.

[0135] The heat dissipation layer RHL can be disposed below the ninth adhesive layer AL9. The heat dissipation layer RHL can be a sheet with high thermal conductivity. The heat dissipation layer RHL can include metal or metal alloy, and for example, the heat dissipation layer RHL can include copper, copper alloy, graphite, or a combination thereof.

[0136] The heat dissipation layer RHL may include a first heat dissipation layer RHL-1 and a second heat dissipation layer RHL-2. The first heat dissipation layer RHL-1 and the second heat dissipation layer RHL-2 may be spaced apart from each other by a gap GP. The gap GP may be from about 0.4 mm to about 2.4 mm, but this disclosure is not limited thereto. The gap GP may correspond to the folded region FA0.

[0137] The first heat dissipation layer RHL-1 can be bonded to the cover layer SCV through the first covering portion AL9-1, and the second heat dissipation layer RHL-2 can be bonded to the cover layer SCV through the second covering portion AL9-2. In the plan view, the first heat dissipation layer RHL-1 can overlap with a portion of the folded region FA0 and the first non-folded region NFA10, and the second heat dissipation layer RHL-2 can overlap with another portion of the folded region FA0 and the second non-folded region NFA20.

[0138] In the plan view, a portion of the first heat dissipation layer RHL-1 may overlap with a portion of the opening OP, and a portion of the second heat dissipation layer RHL-2 may overlap with another portion of the opening OP. The first heat dissipation layer RHL-1 and the second heat dissipation layer RHL-2 can be used to support the support layer PLT. For example, the area of ​​the support layer PLT that defines the opening OP can be supported by the first heat dissipation layer RHL-1 and the second heat dissipation layer RHL-2. Therefore, the first heat dissipation layer RHL-1 and the second heat dissipation layer RHL-2 can also be referred to as the first lower support layer and the second lower support layer, respectively.

[0139] The tenth adhesive layer AL10 may be disposed below the heat dissipation layer RHL. The tenth adhesive layer AL10 may include a first portion AL10-1 corresponding to the first heat dissipation layer RHL-1 and a second portion AL10-2 corresponding to the second heat dissipation layer RHL-2. The first portion AL10-1 and the second portion AL10-2 may be spaced apart from each other by a gap GP.

[0140] The graphite layer GS can be disposed below the tenth adhesive layer AL10. The graphite layer GS can be a thermally conductive sheet with high thermal conductivity. The graphite layer GS can be a graphitized polymer film. The polymer film can be, for example, a polyimide film.

[0141] The graphite layer GS may include a first graphite layer GS-1 corresponding to the first portion AL10-1 and a second graphite layer GS-2 corresponding to the second portion AL10-2. The first graphite layer GS-1 and the second graphite layer GS-2 may be separated from each other by a gap GP. In a plan view, the gap GP between the first graphite layer GS-1 and the second graphite layer GS-2 may overlap with the folded region FA0. In a plan view, the first graphite layer GS-1 may overlap with a portion of the folded region FA0 and the first non-folded region NFA10, and the second graphite layer GS-2 may overlap with another portion of the folded region FA0 and the second non-folded region NFA20.

[0142] It can be omitted Figure 5 Some of the stacked structures shown can be modified, or other stacked structures can be added. The positions of the stacked structures can be changed. For example, in one embodiment, the graphite layer GS can be omitted. In another embodiment, the buffer layer CUL can be separated from the display panel DP, and the support layer PLT is inserted between the buffer layer CUL and the display panel DP. Here, since the buffer layer CUL is located below the heat dissipation layer RHL, which is stably supported by the support layer PLT, the shock absorption performance of the buffer layer CUL can be improved. In addition, an insulating layer can be provided below the graphite layer GS to prevent electrostatic inflow. The insulating layer can prevent electrical interference between the circuit film FCB and the components disposed on the insulating layer.

[0143] The surface of the step compensation pattern CP can be bonded to the support layer PLT via the eleventh adhesive layer AL11. The twelfth adhesive layer AL12 can be disposed on the other surface of the step compensation pattern CP. In the display device DD (reference...) Figure 2 ) and electronic devices ED (reference) Figure 2 When another component (e.g., the setting bracket SBK) is combined, the twelfth adhesive layer AL12 can be used.

[0144] refer to Figure 6 The curved region BA can be bent so that the second panel region AA2 is positioned below the first panel region AA1. Therefore, the driver chip DIC can be positioned below the first panel region AA1. For example, the first panel region AA1 and the second panel region AA2 can be positioned on different planes (or reference planes). In a cross-sectional view, the curved region BA can be bent to bulge in the horizontal direction. The curved region BA has a curvature and a radius of curvature. The radius of curvature can be from approximately 0.1 mm to approximately 0.5 mm.

[0145] The bending region BA can be bent into an edge PLT-E surrounding the support layer PLT. A portion of the support layer PLT can be disposed between the first panel region AA1 and the second panel region AA2.

[0146] A bending protection layer BPL may be disposed at least in the bending region BA. The bending protection layer BPL may overlap with the bending region BA, the first panel region AA1, and the second panel region AA2. The bending protection layer BPL may be disposed on a portion of the first panel region AA1, a portion of the second panel region AA2, and the bending region BA.

[0147] The Bending Protective Layer (BPL) can be bent together with the Bending Region BA. The BPL protects the Bending Region BA from external impacts and controls the neutral surface of the Bending Region BA. The BPL controls the stress in the Bending Region BA to allow the neutral surface to approach the signal lines arranged within the Bending Region BA.

[0148] The surface of the second portion of AL5-2, where the fifth adhesive layer AL5 is not attached, of the second panel protective layer PPL-2 can be attached to the spacer SPC. Although Figure 5 and Figure 6 The spacer SPC is shown as a single layer, but the spacer SPC can have a multi-layer structure. The spacer SPC may include layers with improved waterproof properties.

[0149] The chip overlay (CIC) can be attached to the second panel area AA2. The chip overlay (CIC) may include a first step compensation layer (DHC1), a second step compensation layer (DHC2), and an insulating tape (ITP).

[0150] Each of the first step compensation layer DHC1 and the second step compensation layer DHC2 may be defined as a double-sided adhesive tape. For example, each of the first step compensation layer DHC1 and the second step compensation layer DHC2 may include a flexible base layer, such as polyethylene terephthalate, and an adhesive disposed on the upper and lower surfaces of the base layer. The adhesive may include an acrylic adhesive. However, the materials of the base layer and the adhesive are not limited thereto.

[0151] The insulating tape ITP can cover the driver chip DIC. Figure 6 An insulating tape ITP as a single layer is shown, but this disclosure is not limited thereto. For example, the insulating tape ITP may have a multi-layer structure. The insulating tape ITP may include two insulating layers and a conductive strip disposed between the two insulating layers.

[0152] In foldable electronic devices ED (reference) Figure 1A At least some of the components used in the structure can slide. Therefore, warping in a particular layer can be prevented. For example, components disposed on the support layer PLT can slide, while components disposed below the support layer PLT (including the support layer PLT) can remain stationary.

[0153] Electronic Devices (ED) (Reference) Figure 1A The support layer PLT can be divided into a sliding region (SA) and a non-sliding region (NSA). When the electronic device ED (reference) Figure 1A When the device can be folded and unfolded, components arranged in the sliding area SA or on the support layer PLT can slide. Therefore, the dimensions of the components positioned in the sliding area SA can be determined by considering the area in which each component moves. For example, in a foldable electronic device ED (reference...) Figure 1A The area of ​​the ultra-thin glass substrate (UTG) used in the assembly can be smaller than the area of ​​the display panel (DP) in the assembled state. In electronic devices (ED, reference...) Figure 1A When submerged in water, water can flow into the driver chip DIC and circuit film FCB through areas not covered by the ultrathin glass substrate UTG.

[0154] According to the implementation, to protect the driver chip DIC and circuit film FCB from water, a waterproof tape WP can be used in the non-slip area NSA. For example, the waterproof tape WP can be attached around the area where the driver chip DIC and circuit film FCB can be mounted. The waterproof tape WP can be attached to the mounting bracket SBK. Even in electronic devices ED (reference) Figure 1A In the event of immersion in water, the risk of water immersion in the driver chip (DIC) can also be minimized.

[0155] Figure 7 This is a schematic rear view of a display device DD according to an embodiment. Figure 8It is according to the implementation method along Figure 7 A schematic cross-sectional view of the display device DD taken from line III-III'.

[0156] refer to Figure 7 and Figure 8 The first waterproof strip WP1 and the second waterproof strip WP2 can be disposed below the support layer PLT. The first waterproof strip WP1 can be disposed between the support layer PLT and the mounting bracket SBK, and can be attached to the mounting bracket SBK. The second waterproof strip WP2 can be disposed between the chip cover layer CIC and the mounting bracket SBK, and can be attached to the mounting bracket SBK. The thickness WPT1 of the first waterproof strip WP1 can be greater than the thickness WPT2 of the second waterproof strip WP2.

[0157] When viewed in the thickness direction of the display panel DP (e.g., on the third-direction DR3), the first waterproof band WP1 can be separated from the second panel area AA2. When viewed on the third-direction DR3, the second waterproof band WP2 can overlap with the second panel area AA2. The first waterproof band WP1 and the second waterproof band WP2 can also overlap with the second non-folded area NFA20 (see reference). Figure 4 )overlapping.

[0158] The first waterproof strip WP1 may include a first portion WP11 extending in a first direction DR1, a second portion WP12 extending in a second direction DR2 from one end of the first portion WP11, and a third portion WP13 extending in the second direction DR2 from the other end of the first portion WP11. A portion of the second panel area AA2 may be located in the area surrounded by the first portion WP11, the second portion WP12, and the third portion WP13.

[0159] The second waterproof strip WP2 can extend along the first direction DR1. A first washer GK1 can be disposed between the second portion WP12 of the first waterproof strip WP1 and the second waterproof strip WP2, and the second washer GK2 can be disposed between the third portion WP13 of the first waterproof strip WP1 and the second waterproof strip WP2. (Driver chip DIC - reference) Figure 2 A portion of the circuit membrane FCB and a portion of the circuit membrane FCB may be surrounded by a first waterproof tape WP1, a second waterproof tape WP2, a first gasket GK1, and a second gasket GK2.

[0160] The first washer GK1 and the second washer GK2 can fill the gap between the first waterproof strip WP1 and the second waterproof strip WP2. The first washer GK1 and the second washer GK2 can be made of curable resin. In the area surrounded by the first waterproof strip WP1 and the second waterproof strip WP2, the waterproof reliability can be further improved by the first washer GK1 and the second washer GK2.

[0161] According to the embodiment, the regions where the first washer GK1 and the second washer GK2 are to be formed can each have a stepped structure. The first washer GK1 and the second washer GK2 can be inserted in the direction from the second waterproof strip WP2 to the support layer PLT. In the above direction, the width of the region where each of the first washer GK1 and the second washer GK2 is to be formed can gradually decrease, and therefore the region where the first washer GK1 and the second washer GK2 are to be formed can be defined as a stepped structure.

[0162] The edge CIC-E of the chip cover layer CIC can protrude more than the edge WP2-E of the second waterproof strip WP2, and the edge DP-E of the second panel area AA2 of the display panel DP can protrude more than the edge CIC-E of the chip cover layer CIC. The edge CIC-E of the chip cover layer CIC can protrude less than the edge DP-E of the second panel area AA2, and can protrude more than the edge WP2-E of the second waterproof strip WP2. The edge SPC-E of the spacer SPC can protrude more than the edge DP-E of the second panel area AA2.

[0163] A first distance GDT1 can be defined between the edge SPC-E of the spacer SPC contacting the second gasket GK2 and the first waterproof tape WP1; a second distance GDT2 can be defined between the edge GPC-E of the second panel protective layer PPL-2 contacting the second gasket GK2 and the first waterproof tape WP1; and a third distance GDT3 can be defined between the edge CIC-E of the chip cover layer CIC and the first waterproof tape WP1. The first distance GDT1 can be smaller than the second distance GDT2 and the third distance GDT3, and the second distance GDT2 can be smaller than the third distance GDT3.

[0164] Because the sidewalls (or edges) of the regions where the first gasket GK1 and the second gasket GK2 are to be formed have a positive step structure, the possibility that the regions will not be filled by the first gasket GK1 and the second gasket GK2 can be reduced. Therefore, the driver chip DIC (reference) can be minimized. Figure 2 The risk of water immersion.

[0165] The first washer GK1 and the second washer GK2 can be spaced apart from the edge PLT-E of the support layer PLT by a distance DT-S. The edge PLT-E of the support layer PLT can be a side surface of the support layer PLT extending in the first direction DR1, and can be the curved area BA of the display panel DP (refer to...). Figure 6 )around.

[0166] With the bending region BA (reference) Figure 6 The adjacent second panel area AA2 can be affected by the bending area BA (refer to...). Figure 6The warping is caused by the repulsive force of the first washer GK1 and the second washer GK2. If the first washer GK1 and the second washer GK2 are inserted into the warped portion, the warping may be exacerbated. Therefore, the first washer GK1 and the second washer GK2 can be spaced apart from the edge PLT-E of the support layer PLT by a distance DT-S, thus minimizing the risk of warping and water immersion.

[0167] Figure 9 This is a schematic cross-sectional view of the spacer SPC according to the embodiment.

[0168] refer to Figure 9 The spacer SPC may have waterproof properties. For example, the spacer SPC may include a first adhesive layer AAH1 and a second adhesive layer AAH2, a base layer BBC, and a closed-cell foam CCH. The base layer BBC and the closed-cell foam CCH may be disposed between the first adhesive layer AAH1 and the second adhesive layer AAH2.

[0169] According to this disclosure, since the spacer SPC has a waterproof structure, the risk of water immersion can be minimized. The aforementioned first waterproof strip WP1 (reference) Figure 8 ) and second waterproof tape WP2 (reference) Figure 8 At least one of them can also have the same as Figure 9 The stacking structure shown is essentially the same as the stacking structure.

[0170] Figure 10 This is a schematic rear view of a display device DD according to an embodiment. Figure 11 It is according to the implementation method along Figure 10 A schematic cross-sectional view of the display device DD taken by line IV-IV'.

[0171] exist Figure 10 and Figure 11 In the description, the same reference numerals are used with respect to the reference numerals. Figure 7 and Figure 8 The components described are essentially the same as those described, and their descriptions will be omitted.

[0172] refer to Figure 10 and Figure 11 The first waterproof strip WP1a may include a first portion WP11a extending in the first direction DR1, a second portion WP12a extending from one end of the first portion WP11a in the second direction DR2, and a third portion WP13a extending from the other end of the first portion WP11a in the second direction DR2. A portion of the second panel area AA2 may be located in the area surrounded by the first portion WP11a, the second portion WP12a, and the third portion WP13a.

[0173] The eighth adhesive layer AL8a, the cover layer SCVa, the ninth adhesive layer AL9a, and the heat dissipation layer RHLa can be extended (or expanded) to overlap with the second portion WP12a and the third portion WP13a of the first waterproof tape WP1a.

[0174] The eighth adhesive layer AL8a, the cover layer SCVa, the ninth adhesive layer AL9a, and the heat dissipation layer RHLa can be sequentially disposed between the support layer PLT and the first waterproof strip WP1a. The cover layer SCVa can be disposed below the support layer PLT, the heat dissipation layer RHLa can be disposed below the cover layer SCVa, and the first waterproof strip WP1a can be attached to the heat dissipation layer RHLa.

[0175] According to the embodiment, the sidewall defining the area where the first gasket GK1a and the second gasket GK2a are to be formed can have a stepped structure. The edge RHLa-E of the heat dissipation layer RHLa can protrude more than the edge WP1a-E of the first waterproof strip WP1a, and the edge SCVa-E of the cover layer SCVa can protrude more than the edge RHLa-E of the heat dissipation layer RHLa.

[0176] Because the sidewalls (or edges) of the area defining the region where the first washer GK1a and the second washer GK2a are to be formed have a positive step structure, the possibility that this area will not be filled by the first washer GK1a and the second washer GK2a can be reduced. Therefore, the driver chip DIC (reference) can be minimized. Figure 2 The risk of water immersion.

[0177] Based on the above, the waterproof tape can be attached to the periphery of the area where the driver chip and circuit film are mounted, as well as to the mounting bracket. In the event of water immersion in the electronic device, the possibility of the driver chip being submerged can be reduced because the area where the driver chip is mounted can be surrounded by the waterproof tape.

[0178] The waterproofing strip can be configured as waterproofing strip sheets, and gaskets can be placed in the gaps between the waterproofing strip sheets to fill the gaps. The sidewalls (or edges) defining the area where the gasket is to be formed can have a stepped structure. Therefore, the possibility of the gasket not filling the gap can be reduced. The waterproofing reliability of the area surrounded by the gasket and waterproofing strip sheets can be further improved.

[0179] Although this disclosure has been described with reference to embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of this disclosure. Therefore, the subject matter disclosed should not be limited to any single embodiment described herein, and the scope of this disclosure should be determined by the appended claims (including their equivalents).

Claims

1. Electronic devices, including: The display panel includes a first panel area, a curved area, and a second panel area; A support layer is disposed below the first panel area of ​​the display panel; A bracket is provided, positioned below the support layer; A first waterproof strip is disposed between the support layer and the set bracket, and the first waterproof strip is attached to the set bracket; as well as The second waterproof strip is attached to the designated bracket, wherein... The curved region is curved. The second panel area is located below the first panel area. The first waterproof strip is spaced apart from the second panel area in the thickness direction of the display panel, and The second waterproof strip overlaps with the second panel area.

2. The electronic device according to claim 1, wherein, The thickness of the first waterproof tape is greater than the thickness of the second waterproof tape.

3. The electronic device according to claim 1, wherein, The curved region bends relative to a bending axis extending in a first direction, and The second waterproof strip extends in the first direction.

4. The electronic device according to claim 1, wherein, The first waterproof strip includes: The first part extends in the first direction. The second part extends from one end of the first part in a second direction intersecting the first direction; and The third part extends from the other end of the first part in the second direction, and A portion of the second panel area is disposed in the area surrounded by the first portion, the second portion, and the third portion.

5. The electronic device according to claim 4, further comprising: A first washer is disposed between the second portion of the first waterproof strip and the second waterproof strip; as well as The second washer is disposed between the third portion of the first waterproof strip and the second waterproof strip.

6. The electronic device according to claim 5, wherein, The second panel area includes an edge adjacent to the first washer and the second washer, and The edge of the second panel area protrudes more than the edge of the second waterproof strip.

7. The electronic device according to claim 6, wherein, A chip cover layer is disposed between the second panel area and the second waterproof strip, and the chip cover layer has an edge adjacent to the first gasket and the second gasket, and The edge of the chip cover layer protrudes more than the edge of the second waterproof strip and less than the edge of the second panel region.

8. The electronic device according to claim 6, further comprising: A spacer is disposed between the support layer and the second panel area, wherein, The spacer has an edge adjacent to the first washer and the second washer, and The edge of the spacer protrudes more than the edge of the second panel region and the edge of the second waterproof strip.

9. The electronic device according to claim 8, wherein, The spacer is waterproof.

10. The electronic device according to claim 8, wherein, The spacer includes closed-cell foam.

11. The electronic device according to claim 5, further comprising: A cover layer is disposed below the support layer; as well as A heat dissipation layer is disposed beneath the cover layer. The first waterproof strip is attached to the heat dissipation layer.

12. The electronic device according to claim 11, wherein, The cover layer has an edge adjacent to the first washer and the second washer. The edge of the cover layer protrudes more than the edge of the heat dissipation layer, and The edge of the heat dissipation layer protrudes more than the edge of the first waterproof strip.

13. The electronic device according to claim 5, wherein, Each of the first and second washers is spaced apart from the edge of the support layer surrounded by the curved region.

14. The electronic device according to claim 5, wherein, Each of the first and second washers has a width that increases with distance from the support layer.

15. The electronic device according to claim 1, wherein, The first panel area includes a folded area, a first non-folded area, and a second non-folded area, wherein, The folding region is located between the first non-folding region and the second non-folding region, and the folding region is foldable. The first waterproof strip and the second waterproof strip overlap with the second non-folded area, and The opening in the support layer is defined in the area of ​​the support layer that overlaps with the folded area.

16. The electronic device according to claim 1, wherein, At least one of the first waterproofing strip and the second waterproofing strip comprises closed-cell foam.

17. Electronic devices, including: Display panel; A circuit film is disposed on the display panel; A first waterproof strip is disposed on the display panel and adjacent to the circuit film; A second waterproof strip is disposed on the display panel and adjacent to the circuit film; as well as A gasket is disposed between the first waterproof strip and the second waterproof strip. The display panel includes: First panel area; A curved region extending from the first panel region and curved toward a surface of the first panel region; and The second panel area extends from the curved area and is disposed below the first panel area. The circuit film is attached to the second panel area, and The second waterproof strip overlaps with the second panel area.

18. The electronic device of claim 17, further comprising: A support layer is disposed below the first panel area; Spacers are disposed below the support layer; A panel protective layer is disposed below the spacer; as well as A chip overlay layer is disposed beneath the panel protective layer, wherein... The second panel area is disposed between the chip cover layer and the panel protective layer. The second waterproof tape is attached to the chip cover layer. A first distance is defined between the edge of the spacer that contacts the gasket and the first waterproof strip. A second distance is defined between the edge of the panel protective layer that contacts the gasket and the first waterproof strip. A third distance is defined between the edge of the gasket that contacts the chip cover layer and the first waterproof tape. The first distance is less than the second distance and the third distance, and The second distance is less than the third distance.

19. The electronic device according to claim 18, wherein, At least one of the spacer, the first waterproof strip, and the second waterproof strip comprises closed-cell foam.

20. The electronic device according to claim 17, wherein, The display panel includes a foldable area, a first non-foldable area, and a second non-foldable area, wherein... The folded area is located between the first non-folded area and the second non-folded area. The folding area is foldable, and The first waterproof strip, the second waterproof strip, and the gasket overlap with the second non-folded area.

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