Coil assembly

Abstract

A coil assembly includes a main body having a first surface and first and second end surfaces each connected to the first surface and opposite each other, a support substrate disposed in the main body, a coil unit including a first coil pattern, a first lead-out pattern, and a second lead-out pattern each disposed on the support substrate, first and second slot portions disposed in edge portions between the first end surface of the main body and the first surface of the main body and exposing the first and second lead-out patterns, respectively, and first and second external electrodes disposed in the first and second slot portions, respectively, and connected to the coil unit, wherein a ratio of a line width of any one of the first and second lead-out patterns to a line width of any one turn of the first coil pattern is in a range of 1 to 1.5.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0150604, filed on November 12, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field

[0002] The present invention relates to a coil assembly. Background Technology

[0003] An inductor (a type of coil assembly) is a typical passive electronic component used in electronic devices along with resistors and capacitors.

[0004] As electronic devices become increasingly capable and compact, a greater number of smaller electronic components are being used.

[0005] The external electrodes of a coil assembly are typically formed on two surfaces of the body that are opposite each other in the longitudinal direction. In this case, the total length or width of the coil assembly may increase due to the thickness of the external electrodes. Furthermore, when the coil assembly is mounted on a mounting plate, the external electrodes of the coil assembly may come into contact with other components disposed adjacent to the mounting plate, potentially causing a short circuit. Summary of the Invention

[0006] An example embodiment provides a coil assembly with improved inductance characteristics.

[0007] Example embodiments also provide a coil assembly that is easy to form a lower electrode structure.

[0008] According to an example embodiment, a coil assembly includes: a body having a first surface and a first end surface and a second end surface, the first end surface and the second end surface being connected to the first surface and opposite to each other; a support substrate disposed in the body; a coil unit including a first coil pattern, a first lead-out pattern and a second lead-out pattern both disposed on the first surface of the support substrate, the first surface of the support substrate being opposite to the first surface of the body; a first slot portion and a second slot portion, the first slot portion being formed in an edge portion between the first end surface of the body and the first surface of the body and exposing the first lead-out pattern, the second slot portion being formed in an edge portion between the second end surface of the body and the first surface of the body and exposing the second lead-out pattern; and a first external electrode and a second external electrode, respectively disposed in the first slot portion and the second slot portion and connected to the coil unit, wherein the ratio of the linewidth of any one of the first lead-out pattern and the second lead-out pattern to the linewidth of any turn of the first coil pattern is in the range of 1 to 1.5.

[0009] According to other example embodiments, a coil assembly includes: a body; a support substrate disposed in the body; a coil unit including a first coil pattern, a first lead-out pattern, and a second lead-out pattern disposed on a first surface of the support substrate, and a first dummy lead-out pattern disposed on a second surface of the support substrate opposite to the first surface of the support substrate, the first surface of the support substrate being opposite to the first surface of the body; a first slot and a second slot disposed in an edge portion of the first surface of the body, and exposing the first lead-out pattern and the second lead-out pattern, respectively; and a first external electrode and a second external electrode disposed on the first surface of the body, spaced apart from each other and connected to the coil unit, wherein 1 ≤ a / b ≤ 1.5, where a is the linewidth of any one of the first lead-out pattern, the second lead-out pattern, and the first dummy lead-out pattern, b is the linewidth of any turn of the first coil pattern, and the first lead-out pattern includes a via pad protruding outside the first lead-out pattern, and the first dummy lead-out pattern includes a via pad protruding outside the first dummy lead-out pattern.

[0010] According to other example embodiments, a coil assembly includes: a support substrate having a first surface and a second surface opposite to the first surface; a coil unit including a first coil pattern, a first lead-out pattern, and a second lead-out pattern disposed on the first surface of the support substrate, and a first dummy lead-out pattern disposed on the second surface of the support substrate and opposite to the first lead-out pattern; a body encapsulating the support substrate and the coil unit, the body having a mounting surface, a first end surface, and a second end surface, and a first slot and a second slot, the mounting surface being parallel to the first surface of the support substrate, the first end surface and the second end surface being opposite to each other and connected to the mounting surface, the first slot being disposed at an edge formed by the first end surface and the mounting surface, and the second slot being disposed at... At the edges formed by the second end surface and the mounting surface, the first slot and the second slot extend away from the mounting surface, passing through a portion of the first end surface and a portion of the second end surface, respectively, and exposing at least a portion of the first lead-out pattern and at least a portion of the second lead-out pattern, respectively; a first external electrode and a second external electrode are respectively disposed in the first slot and the second slot, and respectively contact the first lead-out pattern and the second lead-out pattern, wherein the first dummy lead-out pattern includes a via pad protruding from the first dummy lead-out pattern, the via penetrating the support substrate and connecting the via pad of the first dummy lead-out pattern and the via pad of the first lead-out pattern. Attached Figure Description

[0011] The above and other aspects, features and advantages of the present invention will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which:

[0012] Figure 1 This is a schematic diagram illustrating a coil assembly according to an exemplary embodiment of the concept of the present invention.

[0013] Figure 2 This is a bottom perspective view of a coil assembly according to an exemplary embodiment of the present invention.

[0014] Figure 3 This indicates an omission. Figure 2 A diagram showing the state of a portion of the third insulating layer.

[0015] Figure 4 This indicates an omission. Figure 3 A diagram showing the state of the remaining portion of the third insulating layer.

[0016] Figure 5 This indicates an omission. Figure 4 A diagram showing the state of the first and second insulating layers.

[0017] Figure 6 This indicates an omission. Figure 5 A diagram showing the state of the external electrode.

[0018] Figure 7 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0019] Figure 8 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0020] Figure 9 yes Figure 1 An exploded view of the coil unit.

[0021] Figure 10 and Figure 11 These are schematic diagrams illustrating modifications to coil assemblies according to exemplary embodiments of the present invention, corresponding to... Figure 7 .

[0022] Figure 12 This is a schematic diagram illustrating a coil assembly according to another exemplary embodiment of the concept of the present invention.

[0023] Figure 13 yes Figure 12 An exploded view of the coil unit. Detailed Implementation

[0024] In the accompanying drawings, L can be defined as a first direction or length direction, W can be defined as a second direction or width direction, and T can be defined as a third direction or thickness direction.

[0025] In the following description, an exemplary embodiment of a coil assembly according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the drawings, the same or corresponding components are indicated by the same reference numerals, and repeated descriptions thereof will be omitted.

[0026] Various types of electronic components are used in electronic devices, and various types of coil assemblies can be appropriately used among these electronic components to remove noise.

[0027] In other words, in electronic devices, coil assemblies can be used as power inductors, high-frequency inductors, ordinary ferrite beads, high-frequency ferrite beads (e.g., ferrite beads suitable for the GHz band), common-mode filters, etc.

[0028] Examples and modifications

[0029] Figure 1 This is a schematic diagram illustrating a coil assembly according to an exemplary embodiment of the concept of the present invention. Figure 2 This is a bottom perspective view of a coil assembly according to an exemplary embodiment of the present invention. Figure 3 This indicates an omission. Figure 2 A diagram showing the state of a portion of the third insulating layer. Figure 4 This indicates an omission. Figure 3 A diagram showing the state of the remaining portion of the third insulating layer. Figure 5 This indicates an omission. Figure 4 A diagram showing the state of the first and second insulating layers. Figure 6 This indicates an omission. Figure 5 A diagram showing the state of the external electrode. Figure 7 It is along Figure 1 The cross-sectional view taken from line I-I'. Figure 8 It is along Figure 1 The cross-sectional view taken from line II-II'. Figure 9 yes Figure 1 An exploded view of the coil unit.

[0030] Reference Figures 1 to 9 According to an exemplary embodiment of the present invention, the coil assembly 1000 may include a body 100, a support substrate 200, a coil unit 300, external electrodes 400 and 500, and insulating layers 610, 620 and 630, and may also include an insulating film IF (see Figure 7 ).

[0031] The main body 100 forms the appearance of the coil assembly 1000 according to this example embodiment, and the coil unit 300 and the support substrate 200 are disposed in the main body 100.

[0032] The main body 100 can have a hexahedral shape as a whole.

[0033] As in Figure 5 and Figure 6 As shown, the body 100 includes a first surface 101 and a second surface 102 that are opposite each other in the length direction L, a third surface 103 and a fourth surface 104 that are opposite each other in the width direction W, and a fifth surface 105 and a sixth surface 106 that are opposite each other in the thickness direction T. Each of the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the body 100 corresponds to a wall surface of the body 100 that connects the fifth surface 105 and the sixth surface 106 of the body 100. In the following, the two end surfaces (the first end surface and the second end surface) of the body 100 may refer to the first surface 101 and the second surface 102 of the body, the two side surfaces (the first side surface and the second side surface) of the body 100 may refer to the third surface 103 and the fourth surface 104 of the body, one surface of the body 100 may refer to the sixth surface 106 of the body 100, and the other surface of the body 100 may refer to the fifth surface 105 of the body 100.

[0034] As an example, the body 100 may be configured such that the coil assembly 1000 according to this example embodiment, including external electrodes 400 and 500 and insulating layers 610, 620 and 630 (described later), has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. Furthermore, the above dimensions are merely design values ​​that do not reflect manufacturing errors, etc., and therefore it should be understood that dimensions within the allowable range of manufacturing errors fall within the scope of the inventive concept.

[0035] The length of the coil assembly 1000 may refer to the maximum length of a plurality of line segments parallel to the length direction L and connecting the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image of an optical microscope or scanning electron microscope (SEM) image based on the central portion of the coil assembly 1000 in the width direction W and the thickness direction L. Alternatively, the length of the coil assembly 1000 may refer to the arithmetic mean of the lengths of at least two line segments parallel to the length direction L and connecting the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image.

[0036] The thickness of the coil assembly 1000 may refer to the maximum length of a plurality of line segments parallel to the thickness direction T and connecting the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image of an optical microscope or SEM image based on the central portion of the coil assembly 1000 in the width direction W and the length direction L-thickness direction T. Alternatively, the thickness of the coil assembly 1000 may refer to the arithmetic mean of the lengths of at least two line segments parallel to the thickness direction T and connecting the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image.

[0037] The width of the coil assembly 1000 may refer to the maximum length of a plurality of line segments parallel to the width direction W and connecting the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image of the optical microscope or SEM image based on the central portion of the coil assembly 1000 in the length direction L. Alternatively, the width of the coil assembly 1000 may refer to the arithmetic mean of the lengths of at least two line segments parallel to the width direction W and connecting the outermost boundary line of the coil assembly 1000 shown in the cross-sectional image.

[0038] Optionally, the length, width, and thickness of the coil assembly 1000 can be measured using a micrometer. Using a micrometer, each of the length, width, and thickness of the coil assembly 1000 can be measured by setting a zero point using a micrometer with metrological repeatability and reproducibility (R&R), inserting the coil assembly 1000 according to this example embodiment into the tip of the micrometer, and rotating the measuring rod of the micrometer. When measuring the length of the coil assembly 1000 using a micrometer, the length of the coil assembly 1000 can refer to a single measurement or the arithmetic mean of multiple measurements. This can be applied equivalently to the width and thickness of the coil assembly 1000.

[0039] The body 100 may include a magnetic material and a resin. Specifically, the body 100 may be formed by stacking at least one magnetic composite sheet in which the magnetic material is dispersed in a resin. However, the body 100 may have a structure other than that in which the magnetic material is dispersed in a resin. For example, the body 100 may be formed using a magnetic material such as ferrite.

[0040] Magnetic materials can be ferrites or magnetic metal powders.

[0041] The ferrite can be at least one of the following: spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, or Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, or Ba-Ni-Co-based ferrites), garnet-type ferrites (such as Y-based ferrites), and Li-based ferrites.

[0042] Magnetic metal powders may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the magnetic metal powder may be at least one selected from pure iron powder, Fe-Si based alloy powder, Fe-Si-Al based alloy powder, Fe-Ni based alloy powder, Fe-Ni-Mo based alloy powder, Fe-Ni-Mo-Cu based alloy powder, Fe-Co based alloy powder, Fe-Ni-Co based alloy powder, Fe-Cr based alloy powder, Fe-Cr-Si based alloy powder, Fe-Si-Cu-Nb based alloy powder, Fe-Ni-Cr based alloy powder, and Fe-Cr-Al based alloy powder.

[0043] Magnetic metal powders can be amorphous or crystalline. For example, magnetic metal powders can be Fe-Si-B-Cr based amorphous alloy powders, but are not limited to this.

[0044] Both ferrite and magnetic metal powders can have an average diameter of about 0.1 μm to 30 μm, but are not limited to this. Furthermore, the average diameter of magnetic metal powders can refer to the particle size distribution expressed as D50 or D90.

[0045] The body 100 may include two or more types of magnetic materials dispersed in the resin. Here, different types of magnetic materials refer to magnetic materials dispersed in the resin that are distinguished from each other by any one of average diameter, composition, crystallinity, and shape.

[0046] Resins may include, but are not limited to, epoxy resins, polyimides, liquid crystal polymers, etc., alone or in mixtures.

[0047] The main body 100 includes a core 110 extending through the central portion of each of the support substrate 200 and the coil unit 300 (described later). The core 110 can be formed by filling the through-holes extending through the central portion of each of the coil unit 300 and the support substrate 200 with a magnetic composite sheet, but is not limited thereto.

[0048] The first slot S1 and the second slot S2 are respectively formed in the edge portions of each of the first surface 101 and the second surface 102 of the body 100 between the body 100 and the sixth surface 106 of the body 100. Specifically, the first slot S1 is formed at the edge portion between the first surface 101 and the sixth surface 106 of the body 100, and the second slot S2 is formed at the edge portion between the second surface 102 and the sixth surface 106 of the body 100. Furthermore, the first slot S1 and the second slot S2 may have a depth (the dimensions of the first slot and the second slot based on the thickness direction T) that exposes the lead-out patterns 331 and 332 (described later) to the inner surfaces of the first slot S1 and the second slot S2, respectively, but the first slot S1 and the second slot S2 do not extend to the fifth surface 105 of the body 100. That is, the first slot S1 and the second slot S2 do not penetrate the body 100 in the thickness direction T.

[0049] The first slot S1 and the second slot S2 both extend in the width direction W of the body 100 to the third surface 103 and the fourth surface 104 of the body 100. That is, the first slot S1 and the second slot S2 can have a slot shape formed along the entire width direction W of the body 100. The first slot S1 and the second slot S2 can be formed by pre-cutting one surface of the coil strip in the horizontal position of the coil strip (the state before each coil assembly is individualized), along the boundary line corresponding to the width direction of each coil assembly among the boundary lines that individualize each coil assembly. The depth during pre-cutting is adjusted to expose the lead-out patterns 331 and 332.

[0050] Furthermore, the inner surfaces (inner walls and bottom surfaces) of the slots S1 and S2 also constitute the surface of the main body 100, but in this disclosure, for ease of description, the inner surfaces of the slots S1 and S2 are distinguished from the surface of the main body 100. Additionally, in Figures 1 to 9 The diagram shows a first slot S1 and a second slot S2 having inner walls parallel to the first surface 101 and the second surface 102 of the body 100, and a bottom surface parallel to the fifth surface 105 and the sixth surface 106 of the body 100. However, this is for ease of description and the scope of this example embodiment is not limited thereto. As an example, the first slot S1 may have a curved inner surface that connects the first surface 101 and the sixth surface 106 of the body 100 with respect to a cross section (LT section) in the length direction L-thickness direction of the coil assembly 1000 according to this example embodiment. However, in the following description, for ease of description, it will be described that the slots S1 and S2 have inner walls and a bottom surface.

[0051] The support substrate 200 is embedded in the main body 100. The support substrate 200 is configured to support the coil unit 300 (described later).

[0052] The support substrate 200 can be formed using an insulating material including thermosetting insulating resins (such as epoxy resins), thermoplastic insulating resins (such as polyimide), or photosensitive insulating resins, or it can be formed using an insulating material prepared by impregnating a reinforcing material (such as glass fiber or inorganic filler) in a thermosetting or thermoplastic insulating resin. For example, the support substrate 200 can be formed using insulating materials such as prepregs, Ajinomoto build-up film (ABF), FR-4, bismaleimide triazine (BT) resin, photosensitive dielectric (PID), etc., but is not limited thereto.

[0053] At least one of the following can be used as an inorganic filler: silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3).

[0054] When the support substrate 200 is formed using an insulating material including reinforcing material, the support substrate 200 can provide superior rigidity. If the support substrate 200 is formed using an insulating material that does not contain glass fiber, it is advantageous to reduce the thickness of the coil assembly 1000 according to this example embodiment. Furthermore, based on a body 100 of the same size, the volume occupied by the coil unit 300 and / or magnetic material can be increased, thereby improving assembly characteristics. When the support substrate 200 is formed using an insulating material including a photosensitive insulating resin, the number of processes used to form the coil unit 300 can be reduced, which is beneficial for reducing production costs and forming fine vias.

[0055] The coil unit 300 is disposed inside the main body 100 to exhibit the characteristics of a coil assembly. For example, when the coil assembly 1000 of this example embodiment is used as a power inductor, the coil unit 300 can be used to stabilize the power of an electronic device by storing an electric field as a magnetic field and maintaining an output voltage.

[0056] The coil unit 300 includes coil patterns 311 and 312, vias 321, 322 and 323, lead-out patterns 331 and 332, and dummy lead-out patterns 341 and 342. Specifically, refer to... Figure 1 , Figure 7 , Figure 8 and Figure 9In the direction of the first coil pattern 311, the first lead-out pattern 331, and the second lead-out pattern 332 are arranged on the lower surface of the support substrate 200 opposite to the sixth surface 106 of the main body 100, and the second coil pattern 312, the first dummy lead-out pattern 341, and the second dummy lead-out pattern 342 are arranged on the upper surface of the support substrate 200 opposite to the lower surface of the support substrate 200. On the lower surface of the support substrate 200, the first coil pattern 311 is spaced apart from the first lead-out pattern 331 and contacts and connects with the second lead-out pattern 332. On the upper surface of the support substrate 200, the second coil pattern 312 contacts and connects with the first dummy lead-out pattern 341 and is spaced apart from the second dummy lead-out pattern 342. A first via 321 passes through the support substrate 200 and contacts and connects with the inner end of each of the first coil pattern 311 and the second coil pattern 312. The second via 322 passes through the support substrate 200 and contacts and connects with the first lead-out pattern 331 and the first dummy lead-out pattern 341. The third via 323 passes through the support substrate 200 and contacts and connects with the second lead-out pattern 332 and the second dummy lead-out pattern 342. Therefore, the coil unit 300 can be used as a single coil as a whole.

[0057] Each of the first coil pattern 311 and the second coil pattern 312 may have a planar spiral shape in which at least one turn is formed around the core 110. For example, the first coil pattern 311 may have at least one turn formed around the core 110 on the lower surface of the support substrate 200.

[0058] The first lead-out pattern 331 and the second lead-out pattern 332 are exposed in the first slot portion S1 and the second slot portion S2, respectively. Specifically, the first lead-out pattern 331 is exposed on the inner surface of the first slot portion S1, and the second lead-out pattern 332 is exposed on the inner surface of the second slot portion S2. Since the connecting portions 410 and 510 (described later) of the outer electrodes 400 and 500 are provided in the first slot portion S1 and the second slot portion S2, the coil unit 300 contacts and connects with the outer electrodes 400 and 500, thereby forming the lower electrode structure of the coil assembly 1000. Furthermore, in the following text, for ease of description, as Figures 5 to 7 and Figure 9As shown, the first slot S1 and the second slot S2 are provided to extend to the inner side of at least a portion of each of the lead-out patterns 331 and 332, such that the lead-out patterns are exposed to the inner walls and bottom surfaces of the first slot S1 and the second slot S2, as an example. However, this is merely exemplary, and the scope of the exemplary embodiments of the invention is not limited thereto. That is, the depth of the first slot S1 and the second slot S2 can be adjusted such that the lead-out patterns 331 and 332 are exposed only to the bottom surfaces of the first slot S1 and the second slot S2. Furthermore, when the lead-out patterns 331 and 332 are exposed to both the bottom surfaces and the inner walls of the first slot S1 and the second slot S2, the contact area between the lead-out patterns 331 and 332 and the connection portions 410 and 510 of the external electrodes 400 and 500 can be increased, thereby increasing the bonding force between the coil unit 300 and the external electrodes 400 and 500.

[0059] The first surfaces of lead-out patterns 331 and 332 exposed to the inner surfaces of the first slot S1 and the second slot S2, respectively, may have a higher surface roughness than the other surfaces of lead-out patterns 331 and 332. For example, if the first slot S1 and the second slot S2 are formed after the lead-out patterns 331 and 332 are formed by electroplating, some of the lead-out patterns 331 and 332 may be removed during the slot formation process. Therefore, the first surfaces of lead-out patterns 331 and 332 exposed to the inner surfaces of the first slot S1 and the second slot S2 may have a higher surface roughness than the other surfaces of lead-out patterns 331 and 332 obtained by polishing the cut ends. As will be described later, the outer electrodes 400 and 500 are formed as thin films, therefore the bonding force between the outer electrodes 400 and 500 and the coil unit 300 may be relatively weak. However, since the outer electrodes 400 and 500 are in contact with and connected to the first surfaces of the lead-out patterns 331 and 332, which have relatively high surface roughness, the bonding force between the outer electrodes 400 and 500 and the lead-out patterns 331 and 332 can be improved.

[0060] Lead-out pattern 331, dummy lead-out pattern 341, lead-out pattern 332, and dummy lead-out pattern 342 are respectively exposed on the first surface 101 and the second surface 102 of the body 100. That is, the first lead-out pattern 331 is exposed on the first surface 101 of the body 100, and the second lead-out pattern 332 is exposed on the second surface 102 of the body 100. The first dummy lead-out pattern 341 is exposed on the first surface 101 of the body 100, and the second dummy lead-out pattern 342 is exposed on the second surface 102 of the body 100. Therefore, as... Figure 6As shown, the first lead-out pattern 331 is continuously exposed on the inner wall of the first slot S1, the bottom surface of the first slot S1 and the first surface 101 of the body 100, and the second lead-out pattern 332 is continuously exposed on the inner wall of the second slot S2, the bottom surface of the second slot S2 and the second surface 102 of the body 100.

[0061] At least one of the coil patterns 311 and 312, vias 321, 322 and 323, lead-out patterns 331 and 332, and dummy lead-out patterns 341 and 342 may include at least one conductive layer.

[0062] As an example, when the second coil pattern 312, dummy lead-out patterns 341 and 342, and vias 321, 322, and 323 are formed by plating the upper surface of the support substrate 200, the second coil pattern 312, dummy lead-out patterns 341 and 342, and vias 321, 322, and 323 may each include a seed layer and an electroplated layer. Here, the electroplated layer may have a single-layer structure or a multi-layer structure. The multi-layer electroplated layer may be formed according to a conformal film structure formed by one of the electroplated layers along the surface of any one of the electroplated layers, or it may be formed according to a shape in which one of the electroplated layers is stacked only on one surface of any one of the electroplated layers. The seed layer may be formed by an electroless plating method or a vapor deposition method (such as sputtering). The seed layer of the second coil pattern 312, the seed layer of the dummy lead-out patterns 341 and 342, and the seed layer of the vias 321, 322, and 323 may be formed integrally, such that no boundary is formed between them, but is not limited thereto.

[0063] As another example, when a coil unit 300 is formed by separately forming a first coil pattern 311, lead-out patterns 331 and 332 to be disposed on the lower surface side of the support substrate 200, and a second coil pattern 312, dummy lead-out patterns 341 and 342 to be disposed on the upper surface side of the support substrate 200, and then stacking the first coil pattern 311, lead-out patterns 331 and 332, the second coil pattern 312, and dummy lead-out patterns 341 and 342 together on the support substrate 200, the vias 321, 322, and 323 may include a high-melting-point metal layer and a low-melting-point metal layer, wherein the melting point of the low-melting-point metal layer is lower than that of the high-melting-point metal layer. Here, the low-melting-point metal layer may be formed using solder including lead (Pb) and / or tin (Sn). At least a portion of the low-melting-point metal layer may melt due to pressure and temperature during co-stacking to form an intermetallic compound (IMC) layer, for example, at the boundary between the low-melting-point metal layer and the second coil pattern 312.

[0064] like Figure 7 and Figure 8As shown, as an example, coil patterns 311 and 312, lead-out patterns 331 and 332, and dummy lead-out patterns 341 and 342 may be formed on the lower and upper surfaces of the support substrate 200, respectively, and protrude from the lower and upper surfaces of the support substrate 200. As another example, the first coil pattern 311 and lead-out patterns 331 and 332 may protrude from the lower surface of the support substrate 200, and the second coil pattern 312 and dummy lead-out patterns 341 and 342 may be embedded in the upper surface of the support substrate 200, with the upper surfaces of the second coil pattern 312 and dummy lead-out patterns 341 and 342 exposed to the upper surface of the support substrate 200. In this case, recesses may be formed on the upper surface of the second coil pattern 312 and / or the upper surfaces of the dummy lead-out patterns 341 and 342, such that the upper surface of the support substrate 200 and the upper surfaces of the second coil pattern 312 and / or the upper surfaces of the dummy lead-out patterns 341 and 342 may not be coplanar.

[0065] Coil patterns 311 and 312, vias 321, 322 and 323, lead patterns 331 and 332, and dummy lead patterns 341 and 342 may be formed using conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), or alloys thereof, but are not limited thereto.

[0066] The ratio of the line width 'a' of any one of the lead-out patterns 331 and 332 to the line width 'b' of any turn of the coil patterns 311 and 312 can satisfy a value between 1 and 1.5, that is, the ratio of a to b is in the range of 1 to 1.5. For example, refer to... Figure 7 and Figure 9The ratio of the line width 'a' of the first lead-out pattern 331 to the line width 'b' of any turn of the first coil pattern 311 can satisfy 1 to 1.5. As another example, the ratio of the line width of the second lead-out pattern 332 to the line width 'b' of any turn of the first coil pattern 311 can satisfy 1 to 1.5. As another example, the ratio of the line width of the first dummy lead-out pattern 341 to the line width 'b' of any turn of the first coil pattern 311 can satisfy 1 to 1.5. As another example, the ratio of the line width of the second dummy lead-out pattern 342 to the line width 'b' of any turn of the first coil pattern 311 can satisfy 1 to 1.5. As another example, the ratio of the line width 'a' of the first lead-out pattern 331 to the line width of any turn of the second coil pattern 312 can satisfy 1 to 1.5. As another example, the ratio of the line width of the second lead-out pattern 332 to the line width of any turn of the second coil pattern 312 can satisfy 1 to 1.5. As another example, the ratio of the linewidth of the first dummy lead-out pattern 341 to the linewidth of any turn of the second coil pattern 312 can satisfy 1 to 1.5. As another example, the ratio of the linewidth of the second dummy lead-out pattern 342 to the linewidth of any turn of the second coil pattern 312 can satisfy 1 to 1.5. Furthermore, in the case of this example embodiment, the ratio of the linewidth a of each of the first lead-out pattern 331 and the second lead-out pattern 332, as well as the first dummy lead-out pattern 341 and the second dummy lead-out pattern 342, to the linewidth b of any turn of the first coil pattern 311 satisfies 1 to 1.5, but the inventive concept is not limited thereto.

[0067] Here, the linewidth b of any turn of the first coil pattern 311 can refer to the dimension in the length direction L of any one of the multiple turns shown in the cross-sectional image of the first coil pattern 311, based on an optical microscope image or SEM image of a cross-section taken at the center portion of the width direction W of the coil assembly 1000 along the length direction L-thickness direction. Alternatively, the linewidth b of any one turn of the first coil pattern 311 can refer to the arithmetic mean of the dimensions in the length direction L of each of the multiple turns shown in the cross-sectional image of the first coil pattern 311. Furthermore, the above description can be equivalently applied to the method of calculating the linewidth of any one turn of the second coil pattern 312.

[0068] Here, the linewidth of lead-out patterns 331 and 332 may refer to: an optical microscope image or SEM image of a cross-section of the coil assembly 1000 at its central portion in the width direction W, along the length direction L and thickness direction T, showing the maximum value of the dimensions of lead-out patterns 331 and 332 in the length direction L. Alternatively, the linewidth of lead-out patterns 331 and 332 may refer to: the arithmetic mean of the dimensions of lead-out patterns 331 and 332 in the length direction L shown in the cross-sectional image. Alternatively, the linewidth of lead-out patterns 331 and 332 may refer to: the arithmetic mean of the dimensions of each of the first lead-out pattern 331 and the second lead-out pattern 332 in the length direction L shown in the cross-sectional image. Furthermore, the above description can be equivalently applied to the method of calculating the linewidth of each of the first dummy lead-out pattern 341 and the second dummy lead-out pattern 342.

[0069] Typically, the linewidth of the lead pattern of a coil unit is formed to be two or more times the linewidth of any turn of the coil pattern to prevent warping of the coil substrate on which the coil pattern is formed during the manufacturing process. In this case, based on the cross-sectional area of ​​the same body of a single component in the length-width direction, the area of ​​the effective region where the coil pattern can be formed (the region between the first lead pattern and the second lead pattern) is reduced. That is, due to the reduction in the effective area, there are limitations in increasing the total number of turns of the coil pattern and in increasing the cross-sectional area of ​​the core arranged in the center of the coil pattern. In this example embodiment, the above problems can be solved by limiting the ratio of the linewidth of any one of the lead patterns 331 and 332 to the linewidth of any turn of the coil patterns 311 and 312 to a range of 1 to 1.5. That is, the cross-sectional area of ​​the effective region where the coil pattern can be formed can be increased by satisfying the range of the above ratio. Therefore, the inductance characteristics can be improved by increasing the total number of turns of each of the coil patterns 311 and 312. Furthermore, the inductance characteristics can be improved by increasing the cross-sectional area of ​​the core 110 by the same amount as the reduction in the linewidth of the lead-out patterns 331 and 332.

[0070] If the ratio of the linewidth of any one of the lead-out patterns 331 and 332 to the linewidth of any turn of the coil patterns 311 and 312 is less than 1, it may be difficult to process the coil substrate during the manufacturing process, and warping may occur, increasing the defect rate. If the ratio of the linewidth of any one of the lead-out patterns 331 and 332 to the linewidth of any turn of the coil patterns 311 and 312 exceeds 1.5, the effect of increasing the cross-sectional area of ​​the effective region may be minimal.

[0071] External electrodes 400 and 500 are spaced apart from each other on the sixth surface 106 of the body and extend toward the first slot S1 and the second slot S2, respectively, to contact the first lead-out pattern 331 and the second lead-out pattern 332, respectively. In this example embodiment, external electrodes 400 and 500 include: connecting portions 410 and 510 disposed in the slots S1 and S2 and contacting the lead-out patterns 331 and 332 exposed on the inner surfaces of the slots S1 and S2; and pad portions 420 and 520 disposed on the sixth surface 106 of the body 100. Specifically, the first external electrode 400 includes: a first connecting portion 410 disposed on the bottom surface and inner wall of the first slot S1 and contacting and connecting with the first lead-out pattern 331 of the coil unit 300; and a first pad portion 420 disposed on the sixth surface 106 of the body 100. The second external electrode 500 includes: a second connecting portion 510 disposed on the bottom surface and inner wall of the second slot portion S2, and in contact with and connected to the second lead-out pattern 332 of the coil unit 300; and a second pad portion 520 disposed on the sixth surface 106 of the main body 100. The first pad portion 420 and the second pad portion 520 are spaced apart from each other on the sixth surface 106 of the main body 100.

[0072] External electrodes 400 and 500 are formed on the bottom surface and inner wall of the slot portions S1 and S2, and on the sixth surface 106 of the main body 100, respectively. That is, external electrodes 400 and 500 are formed as conformal films on the inner surfaces of the slot portions S1 and S2 and on the sixth surface 106 of the main body 100. Connecting portions 410 and 510 of the external electrodes 400 and 500, as well as pad portions 420 and 520, are formed together using the same process and can be integrally formed on the inner surfaces of the slot portions S1 and S2 and on the sixth surface 106 of the main body 100. That is, no boundary is formed between the connecting portions 410 and 510 and the pad portions 420 and 520.

[0073] The external electrodes 400 and 500 can be formed by vapor deposition (such as sputtering) and / or plating, but the methods for forming the external electrodes 400 and 500 are not limited to these.

[0074] External electrodes 400 and 500 may be formed using conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but are not limited thereto. External electrodes 400 and 500 may have a single-layer or multi-layer structure. As an example, external electrodes 400 and 500 may also include a first layer and a second layer sequentially formed by plating pad portions 420 and 520. In this case, pad portions 420 and 520 may include copper (Cu), and the first and second layers may respectively include nickel (Ni) and tin (Sn), but the structure is not limited thereto.

[0075] Connecting portions 410 and 510 may be disposed at the central portion of the first slot S1 and the second slot S2, spaced apart from both the third surface 103 and the fourth surface 104 of the main body 100. That is, connecting portions 410 and 510 may be disposed at the central portion of the inner surface of the first slot S1 and the second slot S2 in the width direction W. Since the lead-out patterns 331 and 332 are exposed at the central portion of the inner surface of the first slot S1 and the second slot S2 in the width direction W, connecting portions 410 and 510 may be formed only in the areas where the lead-out patterns 331 and 332 are exposed on the inner surface of the first slot S1 and the second slot S2.

[0076] Pad portions 420 and 520 may be provided on the sixth surface 106 of the body 100 and spaced apart from each of the third surface 103 and the fourth surface 104 of the body 100. In this case, short circuits in the width direction W can be prevented between the coil assembly 1000 according to this example embodiment and other components mounted on the outside of the mounting plate, etc.

[0077] At least one of the distances from each of the third surface 103 and the fourth surface 104 of the body 100 to the pad portions 420 and 520 may be smaller than at least one of the distances from each of the third surface 103 and the fourth surface 104 of the body 100 to the connecting portions 410 and 510. For example, refer to Figure 4 The length d1 of the connecting portions 410 and 510 in the width direction W may be shorter than the length d2 of the pad portions 420 and 520 in the width direction W. The sixth surface 106 of the body 100 serves as a mounting surface when the coil assembly 1000 according to this example embodiment is mounted on a mounting plate, and the pad portions 420 and 520 of the outer electrodes 400 and 500 can be connected to the connecting pads of the mounting plate by bonding members such as solder. In this case, since the length d2 of the pad portions 420 and 520 in the width direction W is larger than the length d1 of the connecting portions 410 and 510 in the width direction W, the contact area between the pad portions 420 and 520 and the bonding members (such as solder) can be increased to improve the bonding force between the pad portions 420 and 520 and the mounting plate. Furthermore, since the length d1 of the connecting portions 410 and 510 in the width direction W is smaller than the length d2 of the pad portions 420 and 520 in the width direction W, short circuits with other components mounted adjacent to each other on the mounting plate in the length direction can be prevented. In other words, by reducing the size (length d1 in the width direction W) of the connecting portions 410 and 510 in the assemblies of the external electrodes 400 and 500, which are positioned to be closest to other components during installation, the possibility of short circuits with other components can be reduced.

[0078] An insulating film IF is disposed between the coil unit 300 and the body 100, and between the support substrate 200 and the body 100. The insulating film IF may be formed on the surfaces of lead-out patterns 331 and 332, coil patterns 311 and 312, the support substrate 200, and dummy lead-out patterns 341 and 342, but is not limited thereto. The insulating film IF is used to insulate the coil unit 300 and the body 100, and may include known insulating materials (such as parylene, etc.), but is not limited thereto. As another example, the insulating film IF may include insulating materials other than parylene (such as epoxy resin). The insulating film IF may be formed by vapor deposition, but is not limited thereto. As another example, the insulating film IF may be formed by stacking and curing an insulating film for forming the insulating film IF on both surfaces of the support substrate 200 where the coil unit 300 is formed, or by coating and curing an insulating paste for forming the insulating film IF on both surfaces of the support substrate 200 where the coil unit 300 is formed. Furthermore, for the reasons described above, the insulating film IF is a component that can be omitted in this example embodiment. In other words, if the main body 100 has sufficient resistance at the operating current and voltage of the coil assembly 1000 designed according to this example embodiment, the insulating film IF can be omitted in this example embodiment.

[0079] Insulating layers 610, 620, and 630 are disposed on the body 100, and at least some of the insulating layers 610, 620, and 630 fill at least a portion of the slot portions S1 and S2. In this example embodiment, the insulating layers 610, 620, and 630 include: a first insulating layer 610 disposed on the first slot portion S1 and the second slot portion S2 to isolate the connecting portions 410 and 510 from the third surface 103 and the fourth surface 104 of the body 100, respectively; a second insulating layer 620 disposed on the sixth surface 106 of the body 100 to expose the pad portions 420 and 520; and a third insulating layer 630 disposed on the first surface 101 and the second surface 102 of the body 100 and covering the connecting portions 410 and 510.

[0080] A first insulating layer 610 is provided in the first slot S1 and the second slot S2. An opening O that exposes the connecting portions 410 and 510 is formed in the first insulating layer 610. Specifically, refer to... Figure 4The first insulating layer 610 is formed to fill the first slot S1 and the second slot S2, and is separated from the inner surface of each of the first slot S1 and the second slot S2 by an opening O. Regarding the first insulating layer 610 disposed in the first slot S1 and the second slot S2, the distance from the first surface of the first insulating layer 610 that contacts the inner wall of the first slot S1 and the second slot S2 to the second surface of the first insulating layer 610 opposite to the first surface can correspond to the width of the first slot S1 and the second slot S2 (the distance in the length direction L from the first surface 101 and the second surface 102 of the body 100 to the inner wall of the first slot S1 and the second slot S2). As a result, the second surface of the first insulating layer 610 disposed on the slots S1 and S2 can be substantially coplanar with the first surface 101 and the second surface 102 of the body 100. Since the first insulating layer 610 is formed to fill the first slot S1 and the second slot S2, appearance defects of the coil assembly 1000 according to this example embodiment can be reduced compared to the case where the first insulating layer 610 is not formed in the first slot S1 and the second slot S2.

[0081] A second insulating layer 620 may be disposed on the sixth surface 106 of the main body 100, exposing the pad portions 420 and 520. The second insulating layer 620 is disposed on the exterior of both ends of the pad portions 420 and 520 in the width direction W, such that the pad portions 420 and 520 are spaced apart from the third surface 103 and the fourth surface 104 of the main body 100. The second insulating layer 620 prevents the coil assembly 1000 according to this exemplary embodiment from short-circuiting with other components mounted adjacent to it in the width direction W. Furthermore, when mounting the coil assembly 1000 according to this exemplary embodiment, the second insulating layer 620 prevents an increase in the effective mounting area occupied by the coil assembly 1000 in the mounting plate due to bonding members (such as solder).

[0082] The first insulating layer 610 and the second insulating layer 620 can be integrally formed with each other. As an example, the first insulating layer 610 and the second insulating layer 620 can be formed together in the same process using the same insulating material, thus no boundary is formed between them. As an example, the first insulating layer 610 and the second insulating layer 620 can be integrally formed by screen printing, inkjet printing, or the like using insulating paste. Furthermore, in this example embodiment, before forming the external electrodes 400 and 500, the first insulating layer 610 can be formed on the slot portions S1 and S2, and the second insulating layer 620 can be formed on the sixth surface 106 of the body 100. Therefore, when the external electrodes 400 and 500 are selectively formed on the sixth surface 106 of the body 100 and on the inner surfaces of the first slot portion S1 and the second slot portion S2, the first insulating layer 610 and the second insulating layer 620 can be used as a mask. As an example, the first insulating layer 610 and the second insulating layer 620 can be used as a plating resist when forming the external electrodes 400 and 500 by plating.

[0083] The first insulating layer 610 and the second insulating layer 620 can be jointly formed on each coil assembly at the coil strip level (the state before each coil assembly is individualized). That is, the process of forming the first insulating layer 610 and the second insulating layer 620 can be performed between the pre-cutting process and the individualization process (full cutting process) described above.

[0084] A third insulating layer 630 is disposed on the first surface 101 and the second surface 102 of the main body 100 and covers the connecting portions 410 and 510. In this example embodiment, the third insulating layer 630 includes: a cover layer 631 covering the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, and the fifth surface 105 of the main body 100; and a finishing layer 632 disposed on the first surface 101 and the second surface 102 to cover the connecting portions 410 and 510.

[0085] A cover layer 631 is disposed on the first surface 101, second surface 102, third surface 103, fourth surface 104, and fifth surface 105 of the body 100, and extends on the inner surfaces of the slots S1 and S2 to cover at least a portion of the first insulating layer 610 disposed on the inner surfaces of S1 and S2. The cover layer 631 does not extend to the second insulating layer 620 disposed on the sixth surface 106 of the body 100. Furthermore, the opening O may also extend to the cover layer 631 to expose the connections 410 and 510 to the outside. In this case, when the external electrodes 400 and 500 are selectively formed on the body 100, the cover layer 631 can be used as a mask together with the first insulating layer 610 and the second insulating layer 620. Therefore, the cover layer 631 can be formed in a process between the process of forming the first insulating layer 610 and the second insulating layer 620 and the process of forming the external electrodes 400 and 500. The cover layer 631 contacts each of the first surface 101, second surface 102, third surface 103, fourth surface 104, and fifth surface 105 of the body 100, and contacts the second surface of the first insulating layer 610 located on the inner walls of the slots S1 and S2. The process of forming the cover layer 631 is performed after the process of individualizing the coil strips is completed.

[0086] A finishing layer 632 is disposed on the first surface 101 and the second surface 102 of the body 100 to cover the cover layer 631 and the connecting portions 410 and 510, respectively. In this example embodiment, the first insulating layer 610 and the second insulating layer 620 may be formed on the surfaces of the body 100 other than the areas in which the connecting portions 410 and 510 and the pad portions 420 and 520 will be formed, and on the inner surfaces of the slot portions S1 and S2. Temporary members may be attached to the areas in which the connecting portions 410 and 510 and the pad portions 510 and 520 will be formed. The cover layer 631 may be formed on the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, and the fifth surface 105. The temporary members may be removed to expose the lead-out patterns 331 and 332 to the outside. Then, the connecting portions 410 and 510 and the pad portions 510 and 520 may be formed in the areas from which the temporary members have been removed. Therefore, the connecting portions 410 and 510 are exposed to the outside and are not covered by the covering layer 631. The finishing layer 632 is provided on each of the first surface 101 and the second surface 102 of the body 100 to cover the connecting portions 410 and 510 that are not covered by the covering layer 631.

[0087] Each of the insulating layers 610, 620, and 630 may comprise a thermoplastic resin (such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, acrylic, etc.), a thermosetting resin (such as phenol, epoxy resin, polyurethane, melamine, alkyd resin, etc.), a photosensitive resin, parylene, SiO2, etc. xor SiN x Each of the insulating layers 610, 620 and 630 may also include, but is not limited to, insulating fillers such as inorganic fillers.

[0088] Figure 10 and Figure 11 These are schematic diagrams illustrating modifications to coil assemblies according to exemplary embodiments of the present invention, corresponding to... Figure 7 .

[0089] Reference Figure 10 In the case of modifications to the exemplary embodiments of the present invention, the aforementioned third via 323 can be omitted. That is, referring to... Figure 9 The second dummy lead pattern 342 is unrelated to the electrical connection between the coil unit 300 and the external electrodes 400 and 500. Therefore, in this modification, the third via 323 for the connection between the second lead pattern 332 and the second dummy lead pattern 342 is omitted. However, in Figure 10 In the case of this modification shown, since the second dummy lead-out pattern 342 is not omitted, the warping of the support substrate 200 during the process can be minimized.

[0090] Reference Figure 11 In another modification to the exemplary embodiment of the present invention, it can be as follows: Figure 10 In the modification shown, the third via 323 is omitted, and the second dummy lead-out pattern 342 can also be omitted. Figure 11 In the modification shown, the effective volume of the magnetic material of the main body 100 can be increased to the volume corresponding to the volume of the second dummy lead-out pattern 342.

[0091] Other embodiments

[0092] Figure 12 This is a schematic diagram illustrating a coil assembly according to another exemplary embodiment of the concept of the present invention. Figure 13 yes Figure 12 An exploded view of the coil unit.

[0093] Reference Figures 1 to 9 as well as Figure 12 and Figure 13A coil assembly 2000 according to another exemplary embodiment of the present invention includes lead patterns 331 and 332 and dummy lead patterns 341 and 342 that are different from those of the lead patterns 331 and 332 and dummy lead patterns 341 and 342 of the coil assembly 1000 according to an exemplary embodiment of the present invention. Therefore, in describing the coil assembly 2000 of this exemplary embodiment, only lead patterns 331 and 332 and dummy lead patterns 341 and 342 that are different from those of the coil assembly 1000 of the exemplary embodiment of the present invention will be described. For the remaining components of the coil assembly 2000 of this exemplary embodiment, the descriptions of the corresponding components in the coil assembly 1000 of the exemplary embodiment of the present invention can be applied as is. Furthermore, modifications described in the coil assembly 1000 of the exemplary embodiment of the present invention can be applied as is to the coil assembly 2000 of this exemplary embodiment.

[0094] Will Figure 1 and Figure 9 and Figure 12 and Figure 13 A comparison is made between the lead patterns 331 and 332 and the dummy lead patterns 341 and 342 of the coil assembly 2000 according to this example embodiment, each including via pads 331p, 332p, 341p, and 342p. A second via 322 passes through the support substrate 200 and contacts and connects to the via pad 331p of the first lead pattern 331 and the via pad 341p of the first dummy lead pattern 341. A third via 323 passes through the support substrate 200 and contacts and connects to the via pad 332p of the second lead pattern 332 and the via pad 342p of the second dummy lead pattern 342.

[0095] Via pads 331p, 332p, 341p, and 342p can be configured to protrude outwards from lead-in patterns 331 and 332 and dummy lead-in patterns 341 and 342, respectively. That is, as an example, the via pad 331p of the first lead-in pattern 331 can be configured to protrude from the first lead-in pattern 331 in the width direction W, and the via pad 332p of the second lead-in pattern 332 can be configured to protrude from the second lead-in pattern 332 in the width direction W. Via pads 331p, 332p, 341p, and 342p prevent degradation of the connection reliability between lead-in patterns 331 and 332 and dummy lead-in patterns 341 and 342 due to a reduction in the linewidth of lead-in patterns 331 and 332 and dummy lead-in patterns 341 and 342. In other words, as an example, when the second via 322 is formed in the overlapping area between the first lead-out pattern 331 and the first dummy lead-out pattern 341, it may be difficult to form the second via 322 in the overlapping area because the line widths of the first lead-out pattern 331 and the first dummy lead-out pattern 341 are relatively reduced. In this example embodiment, the lead patterns 331 and 332 and the dummy lead patterns 341 and 342 include via pads 331p, 332p, 341p and 342p formed to protrude outward from the lead patterns 331 and 332 and the dummy lead patterns 341 and 342 respectively. Therefore, the lead patterns 331 and 332 and the dummy lead patterns 341 and 342 can be connected by via pads 331p, 332p, 341p and 342p and vias 322 and 323 disposed outside the lead patterns 331 and 332 and the dummy lead patterns 341 and 342.

[0096] At least two of via pads 331p, 332p, 341p, and 342p may be formed at each of the lead-in patterns 331 and 332 and the dummy lead-in patterns 341 and 342. That is, as an example, the two via pads 331p of the first lead-in pattern 331 may be configured to protrude from one end of the first lead-in pattern 331 adjacent to the third surface 103 of the body 100 and the other end of the first lead-in pattern 331 adjacent to the fourth surface 104 of the body 100. The above description can also be applied to the first dummy lead-in pattern 341, and two second vias 322 may also be formed to correspond to the via pads 331p of the first lead-in pattern 331 and the via pads 341p of the first dummy lead-in pattern 341, to connect the first lead-in pattern 331 and the first dummy lead-in pattern 341. The above description can also be applied to the second lead pattern 332 and the second dummy lead pattern 342, and two third vias 323 can also be formed to correspond to the via pads 332p of the second lead pattern 332 and the via pads 342p of the second dummy lead pattern 342, so as to connect the second lead pattern 332 and the second dummy lead pattern 342.

[0097] Each of the via pads 331p, 332p, 341p, and 342p may have a complete circular cross-section, but the scope of the invention is not limited thereto. The diameter of at least one of the via pads 331p, 332p, 341p, and 342p may be larger than the linewidth of at least one of the lead-out patterns 331 and 332 and the dummy lead-out patterns 341 and 342. In this case, the reliability of the connection between the lead-out patterns 331 and 332 and the dummy lead-out patterns 341 and 342 can be improved by the second via 322 and the third via 323.

[0098] According to exemplary embodiments of the present invention, the inductance characteristics of a coil assembly can be improved.

[0099] Furthermore, according to exemplary embodiments conceived in this invention, the lower electrode structure of the coil assembly can be readily formed.

[0100] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the inventive concept as defined by the appended claims.

Claims

1. A coil assembly, comprising: The body has a first surface and a first end surface and a second end surface, wherein the first end surface and the second end surface are both connected to the first surface and are opposite to each other; A support substrate is disposed in the main body; The coil unit includes a first coil pattern, a first lead-out pattern, and a second lead-out pattern, all disposed on the first surface of the support substrate, wherein the first surface of the support substrate is opposite to the first surface of the main body. A first slot and a second slot, the first slot being disposed in the edge portion between the first end surface of the body and the first surface of the body and exposing the first lead-out pattern, the second slot being disposed in the edge portion between the second end surface of the body and the first surface of the body and exposing the second lead-out pattern. as well as The first external electrode and the second external electrode are respectively arranged in the first slot and the second slot, and are connected to the coil unit. The ratio of the linewidth of any one of the first lead-out pattern and the second lead-out pattern to the linewidth of any turn of the first coil pattern is in the range of 1 to 1.

5. The main body also includes a first side surface and a second side surface that connect the first end surface and the second end surface and are opposite to each other, and The first external electrode and the second external electrode include: A connecting portion, wherein the connecting portion of the first external electrode is disposed on the first slot portion, configured to contact the first lead-out pattern and spaced apart from the first side surface of the body; and a connecting portion of the second external electrode is disposed on the second slot portion, configured to contact the second lead-out pattern and spaced apart from the second side surface of the body; and The pad portions, the pad portions of the first external electrode and the pad portions of the second external electrode, are disposed on the first surface of the body and spaced apart from each other. The coil assembly also includes: A first insulating layer is disposed in the first slot and the second slot to isolate the connection portion of the first external electrode and the connection portion of the second external electrode from the first side surface and the second side surface of the main body. A second insulating layer is disposed on the first surface of the body, exposing the pad portions of the first external electrode and the pad portions of the second external electrode; and A third insulating layer is disposed on the first end surface and the second end surface of the main body, and covers the connection portion of the first external electrode and the connection portion of the second external electrode.

2. The coil assembly according to claim 1, wherein, The third insulating layer covers at least a portion of the first insulating layer disposed in the first slot and the second slot.

3. The coil assembly according to claim 1, wherein, The pad portion of the first external electrode and the pad portion of the second external electrode are both spaced apart from the first side surface and the second side surface of the main body.

4. The coil assembly according to claim 3, wherein, At least one of the distances from each of the first and second side surfaces of the body to the pad portion is shorter than the distance from each of the first and second side surfaces of the body to the connection portion.

5. The coil assembly according to any one of claims 1-4, wherein, The coil unit also includes: A second coil pattern is disposed on a second surface of the support substrate opposite to a first surface of the support substrate; and A first via hole passes through the support substrate and connects the inner ends of the first coil pattern and the second coil pattern, respectively. The first lead-out pattern is disposed on the first surface of the support substrate and spaced apart from the first coil pattern. The second lead-out pattern is disposed on the first surface of the support substrate and is in contact with the first coil pattern.

6. The coil assembly according to claim 5, wherein, The coil unit also includes: A first dummy lead-out pattern is disposed on the second surface of the support substrate and in contact with the second coil pattern; and The second via passes through the support substrate to connect the first lead-out pattern and the first dummy lead-out pattern.

7. The coil assembly according to claim 6, wherein, The first lead pattern includes a via pad configured to protrude from the first lead pattern and cover the second via, and the first dummy lead pattern includes a via pad configured to protrude from the first dummy lead pattern and cover the second via.

8. The coil assembly according to claim 6, wherein, The coil unit further includes a second dummy lead pattern, which is configured to be spaced apart from the second coil pattern and the first dummy lead pattern on the second surface of the support substrate.

9. The coil assembly according to claim 8, wherein, The coil unit further includes a third via that passes through the support substrate and connects the second lead-out pattern and the second dummy lead-out pattern.

10. The coil assembly according to claim 9, wherein, The second lead pattern includes a via pad configured to protrude from the second lead pattern and cover the third via, and the second dummy lead pattern includes a via pad configured to protrude from the second dummy lead pattern and cover the third via.

11. A coil assembly, comprising: The body has a first surface and a first end surface and a second end surface, wherein the first end surface and the second end surface are both connected to the first surface and are opposite to each other; A support substrate is disposed in the main body; The coil unit includes a first coil pattern, a first lead-out pattern, and a second lead-out pattern, all disposed on the first surface of the support substrate, wherein the first surface of the support substrate is opposite to the first surface of the main body. A first slot and a second slot, the first slot being disposed in the edge portion between the first end surface of the body and the first surface of the body and exposing the first lead-out pattern, the second slot being disposed in the edge portion between the second end surface of the body and the first surface of the body and exposing the second lead-out pattern. as well as The first external electrode and the second external electrode are respectively arranged in the first slot and the second slot, and are connected to the coil unit. The ratio of the linewidth of any one of the first lead-out pattern and the second lead-out pattern to the linewidth of any turn of the first coil pattern is in the range of 1 to 1.

5. The main body also includes a first side surface and a second side surface that connect the first end surface and the second end surface and are opposite to each other, and The first external electrode and the second external electrode include: A connecting portion, wherein the connecting portion of the first external electrode is disposed on the first slot portion, configured to contact the first lead-out pattern and spaced apart from the first side surface of the body; and a connecting portion of the second external electrode is disposed on the second slot portion, configured to contact the second lead-out pattern and spaced apart from the second side surface of the body; and The pad portions, the pad portions of the first external electrode and the pad portions of the second external electrode, are disposed on the first surface of the body and spaced apart from each other. The pad portion of the first external electrode and the pad portion of the second external electrode are both spaced apart from the first side surface and the second side surface of the main body. At least one of the distances from each of the first and second side surfaces of the body to the pad portion is shorter than the distance from each of the first and second side surfaces of the body to the connection portion.

12. The coil assembly according to claim 11, wherein, The coil unit also includes: A second coil pattern is disposed on a second surface of the support substrate opposite to a first surface of the support substrate; and A first via hole passes through the support substrate and connects the inner ends of the first coil pattern and the second coil pattern, respectively. The first lead-out pattern is disposed on the first surface of the support substrate and spaced apart from the first coil pattern. The second lead-out pattern is disposed on the first surface of the support substrate and is in contact with the first coil pattern.

13. The coil assembly according to claim 12, wherein, The coil unit also includes: A first dummy lead-out pattern is disposed on the second surface of the support substrate and in contact with the second coil pattern; and The second via passes through the support substrate to connect the first lead-out pattern and the first dummy lead-out pattern.

14. The coil assembly of claim 13, wherein, The first lead pattern includes a via pad configured to protrude from the first lead pattern and cover the second via, and the first dummy lead pattern includes a via pad configured to protrude from the first dummy lead pattern and cover the second via.

15. The coil assembly of claim 13, wherein, The coil unit further includes a second dummy lead pattern, which is configured to be spaced apart from the second coil pattern and the first dummy lead pattern on the second surface of the support substrate.

16. The coil assembly of claim 15, wherein, The coil unit further includes a third via that passes through the support substrate and connects the second lead-out pattern and the second dummy lead-out pattern.

17. The coil assembly of claim 16, wherein, The second lead pattern includes a via pad configured to protrude from the second lead pattern and cover the third via, and the second dummy lead pattern includes a via pad configured to protrude from the second dummy lead pattern and cover the third via.

18. A coil assembly, comprising: main body; A support substrate is disposed in the main body; The coil unit includes a first coil pattern, a first lead-out pattern, and a second lead-out pattern disposed on a first surface of the support substrate, and a first dummy lead-out pattern disposed on a second surface of the support substrate opposite to the first surface of the support substrate, wherein the first surface of the support substrate is opposite to the first surface of the body. The first slot and the second slot are disposed in the edge portion of the first surface of the body, and respectively expose the first lead-out pattern and the second lead-out pattern; as well as The first and second external electrodes are positioned spaced apart from each other on the first surface of the body and connected to the coil unit. Wherein, 1≤a / b≤1.5, where a is the linewidth of any one of the first lead-out pattern, the second lead-out pattern, and the first dummy lead-out pattern, b is the linewidth of any turn of the first coil pattern, and the first lead-out pattern includes via pads protruding outside the first lead-out pattern, and the first dummy lead-out pattern includes via pads protruding outside the first dummy lead-out pattern.

19. The coil assembly of claim 18, wherein, The via pads in each of the first lead-out pattern and the first dummy lead-out pattern are configured as a plurality of via pads spaced apart from each other, and The coil assembly further includes a plurality of vias that penetrate the support substrate and correspond to the plurality of via pads.

20. A coil assembly, comprising: A support substrate has a first surface and a second surface opposite to the first surface; The coil unit includes a first coil pattern, a first lead-out pattern and a second lead-out pattern disposed on a first surface of the support substrate, and a first dummy lead-out pattern disposed on a second surface of the support substrate and opposite to the first lead-out pattern. The body encloses the support substrate and the coil unit. The body has a mounting surface, a first end surface and a second end surface, and a first slot and a second slot. The mounting surface is parallel to the first surface of the support substrate. The first end surface and the second end surface are opposite to each other and connected to the mounting surface. The first slot is disposed at an edge formed by the first end surface and the mounting surface. The second slot is disposed at an edge formed by the second end surface and the mounting surface. The first slot and the second slot extend away from the mounting surface, pass through a portion of the first end surface and a portion of the second end surface, respectively, and expose at least a portion of the first lead-out pattern and at least a portion of the second lead-out pattern, respectively. The first external electrode and the second external electrode are respectively disposed in the first slot portion and the second slot portion, and respectively contact the first lead-out pattern and the second lead-out pattern. The first dummy lead pattern includes via pads protruding from the first dummy lead pattern, and the first lead pattern includes via pads protruding from the first lead pattern. The vias penetrate the support substrate and connect the via pads of the first dummy lead pattern and the via pads of the first lead pattern.

21. The coil assembly of claim 20, wherein, The first external electrode and the second external electrode each include: A first pad portion and a second pad portion are disposed on the mounting surface and spaced apart from each other, and A first connecting portion and a second connecting portion, wherein the first connecting portion connects the portion of the first lead-out pattern exposed through the first slot portion to the first pad portion, and the second connecting portion connects the portion of the second lead-out pattern exposed through the second slot portion to the second pad portion.

22. The coil assembly of claim 21, wherein, The main body also includes a first side surface and a second side surface that are opposite to each other and connected to the first end surface and the second end surface, as well as the mounting surface. The distance between each of the first side surface and the second side surface and each of the first connection portion and the second connection portion is greater than the distance between each of the first side surface and the second side surface and each of the first pad portion and the second pad portion.

23. The coil assembly of claim 20, wherein, The ratio of the linewidth of any one of the first lead-out pattern and the second lead-out pattern to the linewidth of any turn of the first coil pattern is in the range of 1 to 1.

5.

24. The coil assembly of claim 20, wherein, The first lead-out pattern has a first surface exposed to the first slot portion and having a surface roughness higher than that of the other surfaces of the first lead-out pattern, and the second lead-out pattern has a first surface exposed to the second slot portion and having a surface roughness higher than that of the other surfaces of the second lead-out pattern.

25. The coil assembly of claim 20, further comprising: A second coil pattern is disposed on the second surface of the support substrate; And a first via, penetrating the support substrate to connect the first coil pattern and the second coil pattern to each other.

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