Multilayer ceramic electronic components

Abstract

This invention provides a multilayer ceramic electronic component. The multilayer ceramic electronic component includes: a ceramic body, comprising a dielectric layer and a first inner electrode and a second inner electrode, wherein the first inner electrode and the second inner electrode are stacked and the dielectric layer is located between the first inner electrode and the second inner electrode; a first outer electrode and a second outer electrode, disposed on the ceramic body. The first outer electrode includes a first substrate electrode layer configured to contact the ceramic body and a first resin electrode layer disposed on the first substrate electrode layer; the second outer electrode includes a second substrate electrode layer configured to contact the ceramic body and a second resin electrode layer disposed on the second substrate electrode layer; the width of the ceramic body in a second direction is less than 1.0 mm, and 0.4×ta≤tb≤0.5×ta, where ta is the average thickness of the first substrate electrode layer and tb is the average thickness of the first resin electrode layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0141216, filed on October 28, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer ceramic electronic component. Background Technology

[0003] In recent years, as the application areas of electronic products have expanded, so too has the technological field of using multilayer ceramic electronic components. In particular, when vehicles are digitized, electronic control units (ECUs) or transmission control units (TCUs) are used, either located in the engine compartment or directly attached to the transmission.

[0004] However, when existing multilayer ceramic electronic components are used in harsh environments such as high temperatures and high vibrations, continuous mechanical stress is caused by repeated expansion and contraction due to high / low temperature cycling. Furthermore, the application of continuous mechanical stress is a major cause of cracking in terminal electrodes or solder.

[0005] To address this problem, a method is used that absorbs external impacts or internal stresses by applying soft materials such as epoxy resin to the external electrodes. When such soft materials are applied, the elastic modulus of the matrix resin is higher than that of the metal, thereby mitigating cracking caused by mechanical stress.

[0006] However, when using soft materials, problems such as increased resistance or reduced electrode contact inevitably arise because the matrix resin is an insulating material. Therefore, research has been conducted in various fields to improve electrical properties while utilizing soft materials. Summary of the Invention

[0007] One aspect of this disclosure is to provide a multilayer ceramic electronic component that can prevent the degradation of electrical properties.

[0008] One aspect of this disclosure also provides a multilayer ceramic electronic component with improved equivalent series resistance (ESR) characteristics.

[0009] Another aspect of this disclosure is to provide a multilayer ceramic electronic component with external electrodes that have improved density while suppressing resistance increases.

[0010] According to one aspect of this disclosure, a multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being stacked in a third direction with the dielectric layer between the first inner electrode and the second inner electrode, and the ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in the third direction; a first outer electrode and a second outer electrode, the first outer electrode being disposed on the first surface of the ceramic body, and the second outer electrode being disposed on the second surface of the ceramic body. The first outer electrode may include a first substrate electrode layer configured to contact the ceramic body and a first resin electrode layer disposed on the first substrate electrode layer, the second outer electrode may include a second substrate electrode layer configured to contact the ceramic body and a second resin electrode layer disposed on the second substrate electrode layer, the width of the ceramic body in the second direction may be less than 1.0 mm, and 0.4×ta≤tb≤0.5×ta, where ta is the average thickness of the first substrate electrode layer and tb is the average thickness of the first resin electrode layer.

[0011] According to one aspect of this disclosure, a multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being stacked in a third direction with the dielectric layer between the first inner electrode and the second inner electrode, and the ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in the third direction; and a first outer electrode and a second outer electrode, the first outer electrode being disposed on the first surface of the ceramic body, and the second outer electrode being disposed on the second surface of the ceramic body. The first outer electrode may include a first substrate electrode layer configured to contact the ceramic body and a first resin electrode layer disposed on the first substrate electrode layer, the second outer electrode may include a second substrate electrode layer configured to contact the ceramic body and a second resin electrode layer disposed on the second substrate electrode layer, the width of the ceramic body in the second direction may be greater than or equal to 1.0 mm and less than 2.0 mm, and 0.3×ta≤tb≤0.4×ta, where ta is the average thickness of the first substrate electrode layer and tb is the average thickness of the first resin electrode layer.

[0012] According to one aspect of this disclosure, a multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and a first inner electrode and a second inner electrode, the first inner electrode and the second inner electrode being stacked in a third direction with the dielectric layer between the first inner electrode and the second inner electrode, and the ceramic body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in the third direction; and a first outer electrode and a second outer electrode, the first outer electrode being disposed on the first surface of the ceramic body, and the second outer electrode being disposed on the second surface of the ceramic body. The first outer electrode may include a first substrate electrode layer configured to contact the ceramic body and a first resin electrode layer disposed on the first substrate electrode layer, the second outer electrode may include a second substrate electrode layer configured to contact the ceramic body and a second resin electrode layer disposed on the second substrate electrode layer, the width of the ceramic body in the second direction may be greater than or equal to 2.0 mm, and 0.25×ta≤tb≤0.4×ta, where ta is the average thickness of the first substrate electrode layer and tb is the average thickness of the first resin electrode layer. Attached Figure Description

[0013] The above and other aspects, features and other advantages of this disclosure will be more clearly understood by taking into account the accompanying drawings and the following detailed description, in which:

[0014] Figure 1 This is a schematic perspective view of a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure;

[0015] Figure 2 This is a perspective view schematically illustrating the ceramic body of a multilayer ceramic electronic component according to exemplary embodiments of the present disclosure;

[0016] Figure 3 It is along Figure 1 A cross-sectional view taken from line I-I'; and

[0017] Figure 4 yes Figure 3 A magnified view of region A. Detailed Implementation

[0018] Exemplary embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0019] In the accompanying drawings, the X direction can be defined as a first direction, the L direction, or the length direction; the Y direction can be defined as a second direction, the W direction, or the width direction; and the Z direction can be defined as a third direction, the T direction, or the thickness direction.

[0020] Figure 1 This is a schematic perspective view of a multilayer ceramic electronic assembly according to exemplary embodiments of the present disclosure. Figure 2 This is a perspective view schematically illustrating the ceramic body of a multilayer ceramic electronic component according to exemplary embodiments of the present disclosure. Figure 3 It is along Figure 1 The cross-sectional view taken by line I-I', and Figure 4 yes Figure 3 A magnified view of region A.

[0021] Reference Figures 1 to 4 A multilayer ceramic electronic component according to exemplary embodiments of the present disclosure may include: a ceramic body 110 including a dielectric layer 111 and a first inner electrode 121 and a second inner electrode 122, the first inner electrode 121 and the second inner electrode 122 being stacked in a third direction (Z direction) with the dielectric layer 111 between the first inner electrode 121 and the second inner electrode 122 and having a first surface S1 and a second surface S2 opposite to each other in a first direction (X direction), a third surface S3 and a fourth surface S4 opposite to each other in a second direction (Y direction), and a fifth surface S5 and a sixth surface S6 opposite to each other in a third direction (Z direction); a first outer electrode 131 and a second outer electrode 132, the first outer electrode 131 being disposed on the first surface S1 of the ceramic body 110 and the second outer electrode 132 being disposed on the second surface S2 of the ceramic body 110. The first external electrode 131 may include a first substrate electrode layer configured to contact the ceramic body and a first resin electrode layer disposed on the first substrate electrode layer, and the second external electrode may include a second substrate electrode layer configured to contact the ceramic body and a second resin electrode layer disposed on the second substrate electrode layer.

[0022] According to an exemplary embodiment, a multilayer ceramic electronic component 100 may include a ceramic body 110, the ceramic body 110 including a dielectric layer 111 and alternatingly stacked first internal electrodes 121 and second internal electrodes 122, and the dielectric layer 111 is located between the first internal electrodes 121 and the second internal electrodes 122.

[0023] According to the present disclosure, the ceramic body 110 of the multilayer ceramic electronic component 100 may include a dielectric layer 111, a first internal electrode 121, and a second internal electrode 122, wherein the first internal electrode 121 and the second internal electrode 122 are stacked in a third direction (Z direction) and the dielectric layer 111 is located between the first internal electrode 121 and the second internal electrode 122.

[0024] The specific shape of the ceramic body 110 is not particularly limited, but as shown, the ceramic body 110 may have a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder contained in the ceramic body 110 during the sintering process, the ceramic body 110 may have a generally hexahedral shape, but not a perfectly straight hexahedral shape. If desired, the ceramic body 110 may be rounded, such that the corners are not angled. Rounding may be, for example, tumble polishing, but is not limited to this.

[0025] In the ceramic body 110, dielectric layers 111, first internal electrodes 121, and second internal electrodes 122 can be stacked alternately. Dielectric layers 111, first internal electrodes 121, and second internal electrodes 122 can be stacked in the third direction (Z direction). Multiple dielectric layers 111 are in a sintered state, and adjacent dielectric layers 111 can be integrated such that their boundaries are indistinct without the use of a scanning electron microscope (SEM).

[0026] According to exemplary embodiments in this disclosure, dielectric layer 111 may include dielectric layers composed of (Ba 1-x Ca x (Ti) 1-y The component represented by (Zr,Sn,Hf)y)O3 (where 0 ≤ x ≤ 1 and 0 ≤ y ≤ 0.5) can be, for example, a compound in which Ca, Zr, Sn, and / or Hf are partially dissolved in BaTiO3. In the above composition, x can be greater than or equal to 0 and less than or equal to 1, and y can be greater than or equal to 0 and less than or equal to 0.5, but is not limited thereto. For example, when x is 0, y is 0, and z is 0 in the above composition, the component can be BaTiO3. Furthermore, for the purposes of this disclosure, various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc., can be added to this component.

[0027] The dielectric layer 111 can be formed by adding necessary additives to a slurry containing the above-described materials, coating the slurry onto a carrier film, and drying the slurry to prepare multiple ceramic sheets. The ceramic sheets can be formed by using a doctor blade to shape the slurry into sheets with a thickness of several micrometers, but are not limited to this method.

[0028] The ceramic body 110 can be formed by alternately stacking ceramic green sheets with a first internal electrode 121 printed thereon and ceramic green sheets with a second internal electrode 122 printed thereon in the third direction (Z direction). The printing method of the first internal electrode and the second internal electrode can be screen printing or gravure printing, but is not limited to these methods.

[0029] The first inner electrode 121 and the second inner electrode 122 can be stacked such that the cross-sections of the first inner electrode 121 and the second inner electrode 122 are respectively exposed at opposite ends of the ceramic body 110. Specifically, the first inner electrode 121 and the second inner electrode 122 can be respectively exposed on two opposite surfaces of the ceramic body 110 in a first direction (X direction), and in this case, the first inner electrode 121 can be exposed in the direction of the first surface S1 of the ceramic body 110, and the second inner electrode 122 can be exposed in the direction of the second surface S2 of the ceramic body 110.

[0030] The first internal electrode 121 and the second internal electrode 122 may comprise a conductive metal. The conductive metal may include, for example, one or more conductive metals selected from silver (Ag), nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The first internal electrode 121 and the second internal electrode 122 may be formed using a conductive paste containing a conductive metal.

[0031] The multilayer ceramic electronic assembly 100 according to this disclosure may include a first external electrode 131, which includes a first substrate electrode layer 131a and a first resin electrode layer 131b. The first substrate electrode layer 131a is connected to a first internal electrode 121 and configured to contact the ceramic body 110, and the first resin electrode layer 131b is disposed on the first substrate electrode layer 131a. Similar to the first external electrode 131, a second external electrode 132 includes a second substrate electrode layer and a second resin electrode layer. The second substrate electrode layer is connected to a second internal electrode 122 and configured to contact the ceramic body 110, and the second resin electrode layer is disposed on the second substrate electrode layer. The first substrate electrode layer 131a may be disposed on a first surface S1 of the ceramic body 110, and the second substrate electrode layer (having a structure corresponding to the first substrate electrode layer 131a) may be disposed on a second surface S2 of the ceramic body 110.

[0032] Figure 4 This is an enlarged view of the cross-section of the first external electrode of the multilayer ceramic electronic assembly according to this disclosure. Although Figure 4 Only the first external electrode is shown, but the description of the first external electrode can also be applied to the second external electrode. See reference... Figure 4According to this disclosure, the first external electrode of the multilayer ceramic electronic assembly may include a first substrate electrode layer 131a having an average thickness ta and a first resin electrode layer 131b disposed on the first substrate electrode layer 131a and having an average thickness tb. In this disclosure, the average thickness ta of the first substrate electrode layer and the second substrate electrode layer, and the average thickness tb of the first resin electrode layer and the second resin electrode layer, may respectively refer to the lengths of the first substrate electrode layer disposed on the first surface S1 of the ceramic body 110 and the second substrate electrode layer disposed on the second surface S2 of the ceramic body 110 in a first direction, and the lengths of the first resin electrode layer and the second resin electrode layer in a first direction, and may also refer to the average value measured from five specific points on the first surface S1 and the second surface S2 of the ceramic body 110 in a cross-section. In one example, the cross-section may be... Figure 3 The first direction is shown in a third-direction plane (e.g., the XZ plane). In one example, the cross-section may be formed by cutting through the central portion of the ceramic body 110 in a second direction (e.g., the Y direction). The cutting location of the cross-section is not limited to such an example, and those skilled in the art can cut at other locations in the ceramic body 110 if desired. In one example, an optical microscope or a scanning electron microscope (SEM) may be used for measurement, but this disclosure is not limited thereto. Other methods and / or tools understood by those skilled in the art may be used even if not described in this disclosure.

[0033] In a first exemplary embodiment of this disclosure, when the width of the ceramic body in the second direction is less than 1.0 mm, the average thickness ta of the first substrate electrode layer and the second substrate electrode layer, and the average thickness tb of the first resin electrode layer and the second resin electrode layer, can satisfy the relationship 0.4 × ta ≤ tb ≤ 0.5 × ta. That is, tb can be less than ta, and tb can be at least greater than or equal to 40% of ta. There is no particular limitation on the lower limit of the width of the ceramic body in the second direction in this exemplary embodiment, but it can be greater than or equal to 0.5 mm. When the above relationship between ta and tb is satisfied, the multilayer ceramic electronic component according to this disclosure can have sufficient electronic conduction paths and excellent corner coverage. If tb is greater than ta, the ESR may increase significantly due to excessively long electronic paths.

[0034] In the above exemplary embodiments, the average thickness ta of the first and second substrate electrode layers can be in the range of greater than or equal to 40 μm and less than or equal to 75 μm. The first and second substrate electrode layers are primarily electrically connected to the first and second inner electrodes, and simultaneously configured to contact the ceramic body to prevent the penetration of external moisture, etc. If the average thickness ta of the first and second substrate electrode layers is less than 40 μm, the first and second substrate electrode layers do not have sufficient thickness, resulting in a reduced density of the outer electrode at the corners of the ceramic body, and potentially causing see-through defects on the head surfaces of the ceramic body (e.g., the first surface S1 and / or the second surface S2). Furthermore, if the average thickness of the first and second substrate electrode layers is greater than 75 μm, adjusting the thickness of the outer electrode to satisfy the aforementioned relationship between ta and tb may result in insufficient electron pathways, thus potentially increasing ESR.

[0035] In a second exemplary embodiment of this disclosure, when the width of the ceramic body in the second direction is greater than or equal to 1.0 mm and less than 1.4 mm, the average thickness ta of the first substrate electrode layer and the second substrate electrode layer, and the average thickness tb of the first resin electrode layer and the second resin electrode layer, can satisfy the relationship 0.3 × ta ≤ tb ≤ 0.4 × ta. That is, tb can be less than ta, and tb can be at least greater than or equal to 30% of ta. When the above relationship between ta and tb is satisfied, the multilayer ceramic electronic component according to this disclosure can have sufficient electronic conduction paths and excellent corner coverage. If tb is greater than ta, the ESR may increase significantly due to excessively long electronic paths.

[0036] In the above exemplary embodiments, the average thickness ta of the first and second substrate electrode layers can be in the range of greater than or equal to 55 μm and less than or equal to 95 μm. If the average thickness ta of the first and second substrate electrode layers is less than 55 μm, the first and second substrate electrode layers do not have sufficient thickness, resulting in a reduced density of the external electrode at the corner of the ceramic body, and potentially causing see-through defects on the head surface of the ceramic body. Furthermore, if the average thickness of the first and second substrate electrode layers is greater than 95 μm, adjusting the thickness of the external electrode to satisfy the aforementioned relationship between ta and tb may result in insufficient electron pathways, thus potentially increasing ESR.

[0037] In a third exemplary embodiment of this disclosure, when the width of the ceramic body in the second direction is greater than or equal to 1.4 mm and less than 2.0 mm, the average thickness ta of the first substrate electrode layer and the second substrate electrode layer, and the average thickness tb of the first resin electrode layer and the second resin electrode layer, can satisfy the relationship 0.3 × ta ≤ tb ≤ 0.4 × ta. That is, tb can be less than ta, and tb can be at least greater than or equal to 30% of ta. When the above relationship between ta and tb is satisfied, the multilayer ceramic electronic component according to this disclosure can have sufficient electronic conduction paths and excellent corner coverage. If tb is greater than ta, the ESR may increase significantly due to excessively long electronic paths.

[0038] In the above exemplary embodiments, the average thickness ta of the first and second substrate electrode layers can be in the range of greater than or equal to 65 μm and less than or equal to 110 μm. If the average thickness ta of the first and second substrate electrode layers is less than 65 μm, the first and second substrate electrode layers do not have sufficient thickness, resulting in a reduced density of the outer electrode at the corner of the ceramic body and the potential for see-through defects on the head surface of the ceramic body. Furthermore, if the average thickness of the first and second substrate electrode layers is greater than 110 μm, adjusting the thickness of the outer electrode to satisfy the aforementioned relationship between ta and tb may result in insufficient electron pathways, thus potentially increasing ESR.

[0039] In the fourth exemplary embodiment of this disclosure, when the width of the ceramic body in the second direction is greater than or equal to 2.0 mm, the average thickness ta of the first substrate electrode layer and the second substrate electrode layer, and the average thickness tb of the first resin electrode layer and the second resin electrode layer, can satisfy the relationship 0.25 × ta ≤ tb ≤ 0.4 × ta. That is, tb can be less than ta, and tb can be at least greater than or equal to 25% of ta. There is no particular upper limit to the width of the ceramic body in the second direction of this exemplary embodiment, but it can be less than or equal to 3.0 mm. When the above relationship between ta and tb is satisfied, the multilayer ceramic electronic component according to this disclosure can have sufficient electronic conduction paths and excellent corner coverage. If tb is greater than ta, the ESR may increase significantly due to excessively long electronic paths.

[0040] In the above exemplary embodiments, the average thickness ta of the first and second substrate electrode layers can be in the range of greater than or equal to 75 μm and less than or equal to 130 μm. If the average thickness ta of the first and second substrate electrode layers is less than 75 μm, the first and second substrate electrode layers do not have sufficient thickness, resulting in a reduced density of the outer electrode at the corner of the ceramic body and the potential for see-through defects on the head surface of the ceramic body. Furthermore, if the average thickness of the first and second substrate electrode layers is greater than 130 μm, adjusting the thickness of the outer electrode to satisfy the aforementioned relationship between ta and tb may result in insufficient electron pathways, thus potentially increasing ESR.

[0041] In exemplary embodiments of this disclosure, the first substrate electrode layer 131a and the second substrate electrode layer of the multilayer ceramic electronic assembly according to this disclosure may be sintered electrodes comprising a conductive metal and glass. The conductive metal may include, for example, at least one selected from nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), iron (Fe), gold (Au), silver (Ag), tungsten (W), titanium (Ti), lead (Pb), and alloys thereof. The glass may be a composition in which oxides are mixed. The glass may be at least one selected from the group consisting of silicon dioxide, boron oxide, aluminum oxide, transition metal oxides, alkali metal oxides, and alkaline earth metal oxides, but is not particularly limited thereto. Transition metals may be one or more selected from the group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe), and nickel (Ni); alkali metals may be one or more selected from the group consisting of lithium (Li), sodium (Na), and potassium (K); and alkaline earth metals may be one or more selected from the group consisting of magnesium (Mg), calcium (Ca), strontium (Sr), and barium (Ba).

[0042] As an example of a method for forming the first substrate electrode layer 131a and the second substrate electrode layer, the first substrate electrode layer 131a and the second substrate electrode layer can be formed by immersing a ceramic body in a conductive paste comprising a conductive metal and then sintering the ceramic body, or by printing the conductive paste onto the surface of the ceramic body using screen printing, gravure printing, or the like and then sintering the ceramic body. Alternatively, the first substrate electrode layer and the second substrate electrode layer can be formed by coating the conductive paste onto the surface of the ceramic body or by transferring a dry film obtained by drying the conductive paste onto the ceramic body and then sintering the ceramic body; however, the method for forming the first substrate electrode layer and the second substrate electrode layer is not limited to these methods. For example, in addition to the methods described above, the first substrate electrode layer and the second substrate electrode layer can be formed by forming a conductive paste on the ceramic body according to various methods and then sintering the ceramic body.

[0043] In exemplary embodiments of this disclosure, the first resin electrode layer 131b and the second resin electrode layer of the multilayer ceramic electronic assembly 100 according to this disclosure may include a conductive agent and a matrix resin. That is, the first resin electrode layer 131b and the second resin electrode layer of this exemplary embodiment may be resin-based electrodes. The resin-based electrodes have a structure in which the conductive agent is dispersed in the matrix resin. Since the resin-based electrodes are manufactured in an environment at a lower temperature than that of sintered electrodes, the conductive agent may exist in particulate form within the matrix resin. In addition, when the first resin electrode layer 131b and the second resin electrode layer are respectively disposed outside the first matrix electrode layer 131a and the second matrix electrode layer, they can block physical stresses such as external impacts.

[0044] Conductivity imparting agents may include conductive metals and / or conductive polymers. Conductive metals may be, for example, one or more selected from, but not limited to, the group consisting of calcium (Ca), titanium (Ti), molybdenum (Mo), tungsten (W), iron (Fe), cobalt (Co), nickel (Ni), palladium (Pd), platinum (Pt), copper (Cu), silver (Ag), gold (Au), zinc (Zn), aluminum (Al), tin (Sn), lead (Pb), and alloys thereof.

[0045] Additionally, as a non-limiting example of a conductive polymer, the conductive polymer may include sulfur-containing (S) and / or nitrogen-containing (N) compounds, such as PT (poly(thiophene)), PEDOT (poly(ethylenedioxy)thiophene), PPS (poly(p-phenylene sulfide)), PANI (polyaniline), P3HT (poly(3-hexylthiophene-2,5-diyl)), polyTPD (poly(4-butylphenyldiphenylamine)), PSS (poly(4-butylphenyldiphenylamine)), PVK (poly(9-vinylcarbazole)), PDBT (poly(4,4'-dimethoxydithiophene)), polyaniline, or polypyrrole, as well as compounds that do not contain heteroatoms, such as poly(fluorine), polyphenylene, polypyrene, polyazine, polynaphthalene, PAC (poly(acetylene)), PPV (poly(p-phenylene vinylene), but not limited thereto.

[0046] If necessary, the first resin electrode layer 131b and the second resin electrode layer may include, but are not limited to, conductive fillers (including carbon fillers such as carbon nanotubes, graphene, fullerenes, etc. and / or spherical, elliptical, sheet-like, fibrous or dendritic alloy fillers).

[0047] The matrix resin included in the first resin electrode layer 131b and the second resin electrode layer can be, for example, a thermosetting resin. Specific examples of thermosetting resins include, but are not limited to, phenolic resins, urea resins, diallyl phthalate resins, melanin resins, guanidine resins, unsaturated polyester resins, polyurethane resins, epoxy resins, amino alkyd resins, melamine-urea cocondensation resins, silicone resins, polysiloxane resins, etc. When using thermosetting resins, crosslinking agents and curing agents such as polymerization initiators, polymerization accelerators, solvents, viscosity modifiers, etc., may be further added and used as needed.

[0048] According to exemplary embodiments of this disclosure, the first resin electrode layer 131b and the second resin electrode layer may be configured to cover the first substrate electrode layer 131a and the second substrate electrode layer. In this disclosure, configuring the first resin electrode layer 131b and the second resin electrode layer to cover the first substrate electrode layer 131a and the second substrate electrode layer means configuring the first resin electrode layer 131b and the second resin electrode layer such that the first substrate electrode layer 131a and the second substrate electrode layer are not exposed to the outside. When the resin electrode layers are configured to cover the substrate electrodes as described above, the first resin electrode layer 131b and the second resin electrode layer can block external contaminants and prevent external impacts from being transmitted to the interior.

[0049] There are no particular limitations on the method for forming the first resin electrode layer 131b and the second resin electrode layer. For example, the first resin electrode layer 131b and the second resin electrode layer can be formed by immersing a ceramic body in a conductive paste containing a matrix resin and a conductive agent, printing the conductive paste onto the surface of the ceramic body by screen printing or gravure printing, or by coating the conductive paste onto the surface of the ceramic body or transferring a dry film formed by drying the conductive paste onto the ceramic body. In other words, various methods can be used without limitation.

[0050] In exemplary embodiments of this disclosure, the multilayer ceramic electronic assembly 100 according to this disclosure may include a first plating layer 131c disposed on a first resin electrode layer 131b and a second plating layer disposed on a second resin electrode layer. The first plating layer 131c and the second plating layer may be formed by sputtering or electrodeposition, but are not limited thereto. The materials used to form the first plating layer 131c and the second plating layer are not particularly limited and may include individual nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), or lead (Pb), or alloys including at least one of nickel (Ni), copper (Cu), tin (Sn), palladium (Pd), platinum (Pt), gold (Au), silver (Ag), tungsten (W), titanium (Ti), and lead (Pb). Furthermore, each of the first plating layer 131c and the second plating layer may be formed as a single layer, but may be formed by stacking two or more layers.

[0051] <Experimental Example>

[0052] External defects and ESR were tested using multilayer ceramic electronic component samples (temperature characteristics X7R) with external electrodes formed on the longitudinal surface of a ceramic body, manufactured in batches by Samsung Electro-Mechanics. These samples had external electrodes formed on the longitudinal surface of the ceramic body.

[0053] Table 1

[0054]

[0055] Referring to Table 1, it can be seen that when the 1608-sized sample has the same ta (40 μm), the ESR increases significantly when tb is 0.88 times ta, compared to when tb is 0.5 times ta. Furthermore, it can be seen that even when tb equals 35 μm, the ESR increases rapidly when tb is 0.88 times ta, compared to when tb is 0.47 times ta.

[0056] Furthermore, it can be seen that when the 2012-sized sample has the same ta (55 μm), the ESR increases significantly when tb is 0.82 times that of ta, compared to the case where tb is 0.36 times that of ta. It can also be seen that even when tb is similar to 40 μm and 45 μm, the ESR increases rapidly when tb is 0.82 times that of ta, compared to the case where tb is 0.42 times that of ta.

[0057] It can be seen that when the 3216-sized sample has the same ta (65 μm), the ESR increases significantly when tb is 0.77 times ta, compared to the case where tb is 0.38 times ta. Furthermore, it can be seen that even when tb is similar to 45 μm and 50 μm, the ESR also increases rapidly when tb is 0.77 times ta, compared to the case where tb is 0.41 times ta.

[0058] It can be seen that when the 3225 size sample has the same ta (75 μm), the ESR increases significantly when tb is 0.67 times ta compared to the case where tb is 0.4 times ta. It can also be seen that even when tb is equal to 50 μm, the ESR also increases rapidly when tb is 0.67 times ta compared to the case where tb is 0.38 times ta.

[0059] Therefore, it can be seen that the ESR of multilayer ceramic electronic components is affected by the values ​​of ta and tb and their ratio.

[0060] As described above, according to exemplary embodiments of the present disclosure, a multilayer ceramic electronic component capable of preventing degradation of electrical characteristics can be provided.

[0061] According to exemplary embodiments of the present disclosure, multilayer ceramic electronic components with improved ESR characteristics can be provided.

[0062] According to exemplary embodiments of the present disclosure, a multilayer ceramic electronic component with external electrodes having improved density while suppressing resistance increases can be provided.

[0063] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that variations and modifications may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, wherein the first inner electrode and the second inner electrode are stacked in a third-direction upward and the dielectric layer is located between the first inner electrode and the second inner electrode, and the ceramic body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in the third-direction upward. as well as A first external electrode and a second external electrode are disposed on the first surface of the ceramic body and the second external electrode is disposed on the second surface of the ceramic body. The first external electrode includes a first substrate electrode layer configured to contact the ceramic body and a first resin electrode layer disposed on the first substrate electrode layer. The second external electrode includes a second substrate electrode layer configured to contact the ceramic body and a second resin electrode layer disposed on the second substrate electrode layer. The width of the ceramic body in the second direction is less than 1.0 mm, and 0.4×ta≤tb≤0.5×ta, where ta is the average thickness of the first substrate electrode layer and tb is the average thickness of the first resin electrode layer. The average thickness ta of the first substrate electrode layer is greater than or equal to 40 μm and less than or equal to 75 μm.

2. The multilayer ceramic electronic component according to claim 1, wherein, 20μm≤tb≤65μm.

3. The multilayer ceramic electronic component according to claim 1, wherein, The first substrate electrode layer and the second substrate electrode layer are sintered electrodes comprising a first conductive metal and glass.

4. The multilayer ceramic electronic component according to claim 1, wherein, The first resin electrode layer and the second resin electrode layer include a conductive agent and a matrix resin.

5. The multilayer ceramic electronic component according to claim 1, wherein the multilayer ceramic electronic component further comprises a plating layer disposed on the first resin electrode layer and the second resin electrode layer.

6. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, wherein the first inner electrode and the second inner electrode are stacked in a third-direction upward and the dielectric layer is located between the first inner electrode and the second inner electrode, and the ceramic body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in the third-direction upward. as well as A first external electrode and a second external electrode are disposed on the first surface of the ceramic body and the second external electrode is disposed on the second surface of the ceramic body. The first external electrode includes a first substrate electrode layer configured to contact the ceramic body and a first resin electrode layer disposed on the first substrate electrode layer. The second external electrode includes a second substrate electrode layer configured to contact the ceramic body and a second resin electrode layer disposed on the second substrate electrode layer. The width of the ceramic body in the second direction is greater than or equal to 1.0 mm and less than 2.0 mm, and 0.3×ta≤tb≤0.4×ta, where ta is the average thickness of the first substrate electrode layer and tb is the average thickness of the first resin electrode layer. The average thickness ta of the first substrate electrode layer is greater than or equal to 55 μm and less than or equal to 110 μm.

7. The multilayer ceramic electronic component according to claim 6, wherein, The width of the ceramic body in the second direction is greater than or equal to 1.0 mm and less than 1.4 mm.

8. The multilayer ceramic electronic component according to claim 7, wherein, The average thickness ta of the first substrate electrode layer is greater than or equal to 55 μm and less than or equal to 95 μm.

9. The multilayer ceramic electronic component according to claim 6, wherein, The width of the ceramic body in the second direction is greater than or equal to 1.4 mm and less than 2.0 mm.

10. The multilayer ceramic electronic component according to claim 9, wherein, The average thickness of the first substrate electrode layer and the second substrate electrode layer is greater than or equal to 65 μm and less than or equal to 110 μm.

11. The multilayer ceramic electronic component according to claim 6, wherein, The first substrate electrode layer and the second substrate electrode layer are sintered electrodes comprising a first conductive metal and glass.

12. The multilayer ceramic electronic component according to claim 6, wherein, The first resin electrode layer and the second resin electrode layer include a conductive agent and a matrix resin.

13. The multilayer ceramic electronic component according to claim 6, wherein the multilayer ceramic electronic component further comprises a plating layer disposed on the first resin electrode layer and the second resin electrode layer.

14. A multilayer ceramic electronic component, comprising: A ceramic body includes a dielectric layer and a first inner electrode and a second inner electrode, wherein the first inner electrode and the second inner electrode are stacked in a third-direction upward and the dielectric layer is located between the first inner electrode and the second inner electrode, and the ceramic body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in the third-direction upward. as well as A first external electrode and a second external electrode are disposed on the first surface of the ceramic body and the second external electrode is disposed on the second surface of the ceramic body. The first external electrode includes a first substrate electrode layer configured to contact the ceramic body and a first resin electrode layer disposed on the first substrate electrode layer. The second external electrode includes a second substrate electrode layer configured to contact the ceramic body and a second resin electrode layer disposed on the second substrate electrode layer. The width of the ceramic body in the second direction is greater than or equal to 2.0 mm, and 0.25×ta≤tb≤0.4×ta, where ta is the average thickness of the first substrate electrode layer and tb is the average thickness of the first resin electrode layer. Wherein, the average thickness ta of the first substrate electrode layer is greater than or equal to 75 μm and less than or equal to 130 μm, and 30 μm ≤ tb ≤ 90 μm.

15. The multilayer ceramic electronic component according to claim 14, wherein, 30μm≤tb≤50μm.

16. The multilayer ceramic electronic component according to claim 14, wherein, The first substrate electrode layer and the second substrate electrode layer are sintered electrodes comprising a first conductive metal and glass.

17. The multilayer ceramic electronic component according to claim 14, wherein, The first resin electrode layer and the second resin electrode layer include a conductive agent and a matrix resin.

18. The multilayer ceramic electronic component according to claim 14, wherein the multilayer ceramic electronic component further comprises a plating layer disposed on the first resin electrode layer and the second resin electrode layer.

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