A pick-up device for improving the reliability of semiconductor soldering

Abstract

The application discloses a kind of to improve the reliability of semiconductor welding material taking device, including graphite welding plate and material taking plate, graphite welding plate is set to material taking plate top, graphite welding plate is provided with several chip placement counterbore and several lead placement slot, graphite welding plate four corner positions are provided with pad high column, graphite welding plate left and right sides center are provided with guide hole, material taking plate is provided with several material taking ejector pin and several lead clearance hole, material taking plate four corner positions are provided with pad high column clearance hole, material taking plate left and right sides middle position is provided with guide column, the application is suitable for semiconductor processing technical field, can be several welding products are lifted once, improve production efficiency, reduce the mutual stress between chip and lead, reduce chip damage risk, improve product chip electrical property yield and improve product chip reliability.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing technology, specifically a material handling device for improving the reliability of semiconductor welding. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductors have wide applications in radios, televisions, and temperature measurement. For example, rectifier bridges are devices made of semiconductors. Semiconductors are materials whose conductivity can be controlled, ranging from that of insulators to conductors. From both a technological and economic development perspective, the importance of semiconductors is enormous. Today, most electronic products, such as computers, mobile phones, or digital recorders, have core components that are closely related to semiconductors. Common semiconductor materials include silicon, germanium, and gallium arsenide, among which silicon is the most influential in commercial applications.

[0003] Currently, rectifier bridges mostly use GPP chips and leads to be directly loaded into graphite welding molds for welding. After welding, the welded semi-finished products need to be removed from the graphite welding molds. At present, the mold removal process is mostly done manually. During manual material removal, due to uneven force, the chips and leads cannot be removed vertically from the graphite welding molds, resulting in stress between them. This can easily cause chip edge damage and internal stress loss, affecting the electrical yield and reliability of the product chips. At the same time, manual material removal is inefficient and increases working time. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a material handling device that improves the reliability of semiconductor welding.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A material handling device for improving the reliability of semiconductor soldering includes a graphite soldering plate and a material handling plate. The graphite soldering plate is disposed above the material handling plate. The graphite soldering plate is provided with a plurality of chip placement countersunk holes and a plurality of lead placement slots. Elevating posts are provided at the four corners of the graphite soldering plate. Guide holes are provided at the center of the left and right sides of the graphite soldering plate. The material handling plate is provided with a plurality of material handling pins and a plurality of lead clearance holes. Elevating posts and clearance holes are provided at the four corners of the material handling plate. Guide posts are provided at the center of the left and right sides of the material handling plate.

[0006] Preferably, a chip ejection hole is provided below the chip placement recess, and a lead placement hole is provided at the edge of the lead placement groove.

[0007] Preferably, the shim column and the graphite welding plate are connected by a threaded connection, and the length of the shim column is greater than the length of the lead wire exposed on the graphite welding plate.

[0008] Preferably, a plurality of the material-retrieving ejector pins are fixedly connected to the material-retrieving plate, and their positions correspond one-to-one with the positions of the plurality of material-retrieving ejector holes. Any material-retrieving ejector pin and its corresponding material-retrieving ejector hole are fitted with a clearance fit, and the length of the material-retrieving ejector pin is greater than the thickness of the graphite welding plate.

[0009] Preferably, a plurality of lead wire clearance holes penetrate the material receiving plate, and their positions correspond one-to-one with the positions of a plurality of lead wire placement holes, wherein the diameter of the lead wire clearance holes is larger than the diameter of the lead wire placement holes.

[0010] Preferably, the clearance hole of the shim column penetrates the material taking plate, and its position corresponds one-to-one with the shim column of the graphite welding plate. The clearance hole of any shim column and its corresponding shim column are fitted with a clearance fit.

[0011] Preferably, the guide post is threadedly connected to the material receiving plate, and its position corresponds one-to-one with the guide hole of the graphite welding plate. Each guide post and its corresponding guide hole are fitted with a clearance fit.

[0012] Preferably, the length of the guide post is greater than the length of the material-taking ejector pin.

[0013] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: In this invention, a number of material ejection holes and a number of material ejection pins are respectively provided on the graphite welding plate and the material ejection plate, and the material ejection holes and the material ejection pins correspond one-to-one, thereby enabling several welded products to be lifted at one time, thus improving production efficiency.

[0014] In this invention, guide holes and guide posts are respectively provided on the left and right sides of the graphite welding plate and the material picking plate, and the positions of the guide holes and guide posts correspond one-to-one. The guide posts enter the guide holes in advance as the main direction, so that the material picking pin can smoothly enter the material picking ejection hole. This ensures that the product being lifted is subjected to uniform vertical upward force, reducing the mutual stress between the chip and the lead wire, reducing the risk of chip damage, improving the electrical yield of the product chip, and improving the reliability of the product chip. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a top view of the material handling plate in this invention; Figure 3 This is a front view of the material handling plate in this invention; Figure 4 This is a top view of the welding mold in this invention; Figure 5 This is a schematic diagram of the chip placement via and lead wire placement groove structure in this invention; Figure 6 This is a front view of the welding mold in this invention; Reference numerals: 1. Graphite welding plate; 11. Chip placement countersunk hole; 111. Pickup ejection hole; 12. Lead placement groove; 121. Lead placement hole; 13. Elevator post; 14. Guide hole; 2. Pickup plate; 21. Pickup ejector pin; 22. Lead clearance hole; 23. Elevator post clearance hole; 24. Guide post. Detailed Implementation

[0016] The following is in conjunction with the appendix Figure 1-5 The following describes a specific embodiment of the material handling device for improving semiconductor welding reliability according to the present invention. The material handling device for improving semiconductor welding reliability according to the present invention is not limited to the description of the following embodiments.

[0017] Example 1: This embodiment provides a specific implementation of a material handling device for improving the reliability of semiconductor welding, such as... Figure 1-5 As shown, it includes a graphite welding plate 1 and a pick-up plate 2. The graphite welding plate 1 is positioned above the pick-up plate 2. The graphite welding plate 1 is provided with several chip placement countersunk holes 11 and several lead wire placement slots 12. Elevating posts 13 are provided at the four corners of the graphite welding plate 1. Guide holes 14 are provided at the center of the left and right sides of the graphite welding plate 1. The pick-up plate 2 is provided with several pick-up pins 21 and several lead wire clearance holes 22. Elevating posts clearance holes 23 are provided at the four corners of the pick-up plate 2. Guide posts 24 are provided at the center of the left and right sides of the pick-up plate 2.

[0018] Furthermore, a chip placement recess 11 is provided below the chip placement recess 11, and a lead wire placement hole 121 is provided at the edge of the lead wire placement groove 12.

[0019] Furthermore, the shim column 13 and the graphite welding plate 1 are connected by a threaded connection, and the length of the shim column 13 is greater than the length of the lead wire exposed on the graphite welding plate 1, so as to avoid bending and deformation of the exposed lead wire.

[0020] Furthermore, several material-retrieving ejector pins 21 are fixedly connected to the material-retrieving plate 2, and their positions correspond one-to-one with the positions of several material-retrieving ejection holes 111. Any material-retrieving ejector pin 21 and its corresponding material-retrieving ejection hole 111 are fitted with a clearance. The length of the material-retrieving ejector pin 21 is greater than the thickness of the graphite welding plate 1, which is conducive to the complete ejection of the product.

[0021] Furthermore, a number of lead wire clearance holes 22 penetrate the material taking plate 2, and their positions correspond one-to-one with the positions of a number of lead wire placement holes 121. The diameter of the lead wire clearance holes 22 is larger than the diameter of the lead wire placement holes 121.

[0022] Furthermore, the clearance hole 23 of the shim column penetrates the material taking plate 2, and its position corresponds one-to-one with the shim column 13 of the graphite welding plate 1. The clearance hole 23 of any shim column and its corresponding shim column 13 are fitted with a clearance fit.

[0023] Furthermore, the guide post 24 is threadedly connected to the material taking plate 2, and its position corresponds one-to-one with the guide hole 14 of the graphite welding plate 1. Any guide post 24 and its corresponding guide hole 14 are fitted with a clearance fit.

[0024] Furthermore, the length of the guide post 24 is greater than the length of the picking pin 21. The guide post 24 enters the guide hole 14 for positioning in advance, which is conducive to the smooth entry of the picking pin 21 into the picking ejection hole 111 and avoids the picking pin 21 from bending and deforming.

[0025] Working principle: such as Figure 1-5 As shown, during use: place the graphite welding plate 1 containing the welded product directly above the pick-up plate 2, align the guide hole 14 and guide post 24, and then slowly lower the graphite welding plate 1. With the guide post 24 entering the guide hole 14 in advance as the main direction, the pick-up pins 21 smoothly enter the corresponding pick-up ejection holes 111. As the graphite welding plate 1 continues to fall, the product inside the graphite welding plate 1 will be pushed out by the uniform vertical upward force of the pick-up pins 21. This effectively reduces the mutual stress between the chip and the lead during pick-up, reduces the risk of chip damage, improves the electrical yield of the product chip, and enhances the reliability of the product chip.

[0026] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A material handling device for improving the reliability of semiconductor welding, characterized in that: The assembly includes a graphite welding plate (1) and a take-up plate (2). The graphite welding plate (1) is positioned above the take-up plate (2). The graphite welding plate (1) has several chip placement countersunk holes (11) and several lead wire placement slots (12). The graphite welding plate (1) has raised posts (13) at its four corners. The graphite welding plate (1) has guide holes (14) at the center of its left and right sides. The take-up plate (2) has several take-up pins (21) and several lead wire clearance holes (22). The take-up plate (2) has raised post clearance holes (23) at its four corners. The take-up plate (2) has guide posts (24) at the center of its left and right sides. The clearance hole (23) of the shim column penetrates the material taking plate (2), and its position corresponds one-to-one with the shim column (13) of the graphite welding plate (1). The clearance hole (23) of any shim column and its corresponding shim column (13) are fitted with a clearance. The guide post (24) is threadedly connected to the material taking plate (2), and its position corresponds one-to-one with the guide hole (14) of the graphite welding plate (1). Any guide post (24) and its corresponding guide hole (14) are fitted with a clearance fit. The length of the guide post (24) is greater than the length of the material taking pin (21).

2. The material handling device for improving semiconductor welding reliability as described in claim 1, characterized in that: The chip placement recess (11) is provided with a material ejection hole (111) below it, and the lead placement groove (12) is provided with a lead placement hole (121) at its edge.

3. The material handling device for improving semiconductor welding reliability as described in claim 1, characterized in that: The shim column (13) and the graphite welding plate (1) are connected by a threaded connection, and the length of the shim column (13) is greater than the length of the lead wire exposed on the graphite welding plate (1).

4. The material handling device for improving semiconductor welding reliability as described in claim 2, characterized in that: Several of the material picking pins (21) are fixedly connected to the material picking plate (2), and their positions correspond one-to-one with the positions of several material picking ejection holes (111). Any material picking pin (21) and its corresponding material picking ejection hole (111) are fitted with a clearance. The length of the material picking pin (21) is greater than the thickness of the graphite welding plate (1).

5. The material handling device for improving the reliability of semiconductor welding as described in claim 2, characterized in that: A plurality of lead wire clearance holes (22) penetrate the material taking plate (2), and their positions correspond one-to-one with the positions of a plurality of lead wire placement holes (121). The diameter of the lead wire clearance holes (22) is larger than the diameter of the lead wire placement holes (121).

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