Wafer front side coating source device

Abstract

A wafer front surface source coating device, including a support frame, a rotating mechanism, a jacking mechanism, a protective cover, a correction mechanism and a scraping coating mechanism; the rotating mechanism is arranged on the support frame, including a rotating member and a fixed member, the rotating member is used to drive the fixed member to rotate, and the fixed member is used to place and fix the wafer; the jacking mechanism is arranged on the rotating mechanism; the protective cover is arranged on the support frame; the correction mechanism is arranged on the protective cover, so that the wafer rotates around its geometric center when the wafer rotates; the scraping coating mechanism is arranged on the protective cover and is used for the coating operation of the diffusion source. The wafer coating operation is facilitated, the coating is carried out by the slow coating method during the coating, so that the source liquid coating operation is facilitated when the viscosity of the source liquid is low, the waste amount of the source liquid can be reduced during the coating, the source liquid is uniformly coated on the wafer by adopting the inside-out scraping coating method during the coating, and the flatness of the diffusion film formed is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a wafer front coating source device. Background Technology

[0002] Diffusion processing in wafer fabrication involves doping the surface of a silicon wafer with trivalent or pentavalent elements to alter its conductivity and resistivity. Current methods for applying this type of diffusion source involve dripping the diffusion source solution onto the wafer surface and then slowly rotating the wafer. During rotation, the operator uses a scraper to apply the diffusion source to the front side of the wafer. This method is inefficient, resulting in poor flatness on the front side after coating and drying, which significantly impacts the wafer's surface polishing process. Of course, existing methods also use centrifugation for source coating. In this method, the diffusion source solution is dropped onto the wafer surface and then spread evenly on the wafer surface by high-speed rotation. However, it has been found that a large amount of source solution is thrown out during use, resulting in significant waste. Furthermore, the smoothness of the diffusion coating cannot be guaranteed during the source coating operation, and this method is not convenient when the viscosity of the source solution is low. Summary of the Invention

[0003] This invention provides a wafer front-side coating device to overcome the shortcomings of the prior art, facilitating wafer coating operations. The device employs a slow coating method, which is convenient even when the viscosity of the source solution is low, thus reducing source solution waste. Furthermore, the device uses an inside-out scraping method to uniformly coat the source solution onto the wafer, ensuring the flatness of the formed diffusion film. This invention has strong practicality.

[0004] In order to achieve the objectives of this invention, the following technologies are proposed: A wafer front coating source device includes a support frame, a rotating mechanism, a lifting mechanism, a protective cover, a straightening mechanism, and a coating mechanism. The support frame includes a base plate, and four support legs extend downward from the base plate; A rotating mechanism, mounted on a support frame, includes a rotating component and a fixed component. The rotating component drives the fixed component to rotate, and the fixed component is used to place and fix the wafer. A lifting mechanism, mounted on a rotating mechanism, is used to adjust the height of the fixed component; A protective cover is mounted on a support frame and covers the outside of the fixed component when the fixed component is at its lowest point. The correction mechanism, which is at least one pair, is located on the protective cover and causes the wafer to rotate about its geometric center when the wafer rotates; The coating mechanism, mounted on a protective cover, is used for coating operations on the diffusion source.

[0005] Furthermore, the rotating component includes a motor mounting plate installed on one side of the base plate, a rotating motor mounted on the motor mounting plate, a drive wheel connected to the output shaft of the rotating motor, a transmission belt sleeved on the drive wheel, a driven ring at the other end of the transmission belt, mounting seats arranged in a circular array around the geometric center of the base plate, a lower ring mounted on the upper end of the mounting seats, rotating recesses arranged in a circular array on the lower ring, the rotating recesses being sleeved on the inner side of the driven ring, an upper ring mounted on the upper end of the rotating recesses, and multiple balls rotatably provided on the inner wall of the rotating recesses, all of which are tangent to the outer wall of the driven ring, and a pair of symmetrically arranged connecting cylinders extending upward from the driven ring, each of which has a connecting rod passing through it.

[0006] Furthermore, the fixing component includes a suction cup installed on the upper end of the connecting rod. The suction cup has a circular structure and is composed of two identical disc-shaped structures spliced ​​together. The suction cup has multiple straight holes along its radial direction. A hollow groove is provided at the geometric center of the suction cup. The inner ends of the straight holes are connected to the hollow groove. Each straight hole has a suction eye extending upwards. An outer annular groove is formed on the outer periphery of the suction cup. An arc-shaped annular groove is formed on the arc wall of the outer annular groove. Each straight hole is connected to the arc-shaped annular groove. A pair of outer arc plates are fitted around the outer periphery of the suction cup. The outer arc plates are fitted into the outer annular groove. The inner periphery of the outer arc plates is formed with outer arc annular grooves. A connecting tube is provided on one of the outer arc plates. Lugs are provided at both ends of the outer arc plates. The connecting tube is connected to the outer arc annular groove.

[0007] Furthermore, the lifting mechanism includes a mounting plate installed on the lower wall of the base plate. The mounting plate is equipped with a lifting motor. The output shaft of the lifting motor is connected to a drive bevel gear, which meshes with a driven bevel gear. The driven bevel gear is connected to a lifting screw. The lifting screw is equipped with a lifting column. The outer wall of the lifting column is provided with multiple guide grooves. A guide sleeve is fitted over the lifting column. Each side wall of the guide sleeve is equipped with a folded fixing foot. The lower end of each folded fixing foot is installed on an upper ring. The upper end of the lifting column is equipped with a lower plate. The upper end of the lower plate is equipped with a fixing ring. A rotating column is located inside the fixing ring. The upper end of the rotating column is equipped with a fixed lower plate. The fixed lower plate is installed on the lower wall of the suction cup.

[0008] Furthermore, the protective cover includes four support rods installed on the base plate. A lower liner ring is installed at the upper end of the support rods. The inner circumference of the lower liner ring is provided with an upwardly extending protruding edge. The lower liner ring has a conical structure and its outer circumference is inclined downward. An outer baffle plate is provided on the outer circumference of the lower liner ring. A pair of concave sleeves are provided on the inner wall of the outer baffle plate. Each pair of lugs passes through the same concave sleeve. A U-shaped hole is opened on the arc wall of the outer baffle plate. The connecting pipe passes through the U-shaped hole, and an arc-shaped baffle is installed on the outer end of the connecting pipe. L-shaped limiting plates are fitted on both sides of the arc-shaped baffle. The L-shaped limiting plates are all located on the outer baffle plate. The length of the arc-shaped baffle is longer than the height of the outer baffle plate.

[0009] Furthermore, the straightening mechanism includes an extended connecting plate installed on the outer wall of the outer retaining ring plate. A drive bearing seat is installed on the outer end of the extended connecting plate. A straightening motor is installed on the drive bearing seat. The output shaft of the straightening motor is connected to a straightening screw. A straightening internal thread post is provided on the straightening screw. A concave part is provided on the inner end of the straightening internal thread post. The concave part passes through the outer retaining ring plate. A straightening wheel is provided on the inner end of the concave part.

[0010] Furthermore, the scraping mechanism includes an extended base plate installed on the outer baffle plate. An adjustment hole is provided on the extended base plate. A pair of inner top bearing seats are installed on the upper wall of the extended base plate. An inner top motor is installed on the inner top bearing seat located at the outer end. The output shaft of the inner top motor is connected to an inner top screw. An inner top seat is provided on the inner top screw. The lower end of the inner top seat passes through the adjustment hole.

[0011] Furthermore, the coating mechanism also includes four guide columns, each with a movable bearing seat at both ends. An inner moving motor is installed on the outer movable bearing seat, and the output shaft of the inner moving motor is connected to an inner moving lead screw. An inner moving seat is provided on the inner moving lead screw, and the inner moving seat is located between the guide columns. Coating cylinders are installed on both sides of the inner moving seat, and a scraper is installed at the lower end of the coating cylinder. A limit frame is fitted on the guide column, and the limit frame is installed on the outer wall of the outer retaining ring plate, with the guide column passing through the limit frame.

[0012] The advantages of the above technical solution are: This invention facilitates wafer coating operations through a support frame, a rotating mechanism, a lifting mechanism, a protective cover, a correction mechanism, and a scraping mechanism. The coating is performed using a slow-speed coating method, which is convenient even when the viscosity of the source solution is low, and reduces waste. Furthermore, the scraping method used from the inside out ensures uniform coating of the source solution onto the wafer, thereby ensuring the flatness of the formed diffusion film. The rotating mechanism facilitates the fixing and placement of the wafer during source coating and drives the fixed wafer to rotate, thereby enabling the diffusion source to be evenly coated on the wafer surface by the scraping mechanism. The lifting mechanism can drive the upper end of the rotating mechanism upward during wafer placement, thus facilitating the wafer placement operation. During source coating, it can drive the wafer downward and into the protective cover, thus facilitating the coating of the diffusion source on the wafer surface. At the same time, the protective cover can prevent the source liquid from splashing during coating, thus avoiding impact on the operating environment, and also facilitates the collection of the source liquid. The straightening mechanism limits the periphery of the wafer during source coating, thereby ensuring that the wafer can rotate around its axis and perform source liquid coating operation during rotation. This method significantly improves the accuracy of source liquid coating and avoids the phenomenon of missed coating. The scraping mechanism can move from the inside to the outside during source coating, and evenly coats the source liquid on the wafer surface during movement, which has strong practicality. Attached Figure Description

[0013] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will now be described in further detail with reference to the accompanying drawings. Wherein: Figure 1 A three-dimensional structure of one embodiment is shown. Figure 1 .

[0014] Figure 2 A three-dimensional structure of one embodiment is shown. Figure 2 .

[0015] Figure 3 A three-dimensional structure of one embodiment is shown. Figure 3 .

[0016] Figure 4 A front view of one embodiment is shown.

[0017] Figure 5 A top view of one embodiment is shown.

[0018] Figure 6 A cross-sectional view at point AA is shown.

[0019] Figure 7 A cross-sectional view at BB is shown.

[0020] Figure 8 A magnified view of point C is shown. Detailed Implementation

[0021] like Figures 1-8 As shown, a wafer front-side coating source apparatus includes a support frame 1, a rotating mechanism 2, a lifting mechanism 3, a protective cover 6, a straightening mechanism 4, and a coating mechanism 5. The support frame 1 includes a base plate 11 with four downwardly extending support legs 10. The rotating mechanism 2, mounted on the support frame 1, includes a rotating component and a fixing component. The rotating component drives the fixing component to rotate, and the fixing component is used to place and fix the wafer. The lifting mechanism 3, mounted on the rotating mechanism 2, is used to adjust the height of the fixing component. The protective cover 6, mounted on the support frame 1, covers the outside of the fixing component when it is at its lowest point. The straightening mechanism 4, at least one pair, is mounted on the protective cover 6 and rotates the wafer around its geometric center when it rotates. The coating mechanism 5, mounted on the protective cover 6, is used for coating the diffusion source.

[0022] In this embodiment, the lifting mechanism 3 drives the fixed component upward, and a robotic arm located on one side of the device transfers the wafer onto the fixed component. Then, the lifting mechanism 3 drives the wafer downward until it enters the protective cover 6. The wafer is then corrected by the correction mechanism 4, so that the center of rotation of the rotating component coincides with the center of the wafer. Next, the source liquid is dripped onto the center of the front side of the wafer by the automatic liquid injection system. Then, the scraping mechanism 5 moves inward, with its inner end positioned at the dripping source liquid. The rotating component drives the wafer to rotate slowly, while the inner end of the scraping mechanism 5 moves in a straight line, uniformly coating the front side of the wafer with the source liquid during the linear motion. Of course, to improve the uniformity of the source liquid coating, multiple coating operations can be performed by the scraping mechanism 5, and the thickness of the source liquid coating can be adjusted during the coating process. The above operation method basically realizes the automatic operation of the source liquid coating, while ensuring the uniformity of the source liquid coating and reducing the waste of source liquid.

[0023] The rotating component includes a motor fixing plate 20 mounted on one side of the base plate 11. A rotating motor 21 is mounted on the motor fixing plate 20. The output shaft of the rotating motor 21 is connected to a drive wheel 22. A transmission belt 23 is sleeved on the drive wheel 22. A driven ring 24 is provided at the other end of the transmission belt 23. Mounting seats 26 are mounted in a circular array around the geometric center of the base plate 11. A lower ring 25 is mounted on the upper end of the mounting seat 26. Rotating recesses 250 are mounted in a circular array on the lower ring 25. The rotating recesses 250 are sleeved on the inner side of the driven ring 24. An upper ring 251 is mounted on the upper end of the rotating recesses 250. Multiple balls are rotatably provided on the inner wall of the rotating recesses 250. The balls are all tangent to the outer wall of the driven ring 24. A pair of symmetrically arranged connecting cylinders 260 extend upward from the driven ring 24. A connecting rod 27 passes through each of the connecting cylinders 260. In this embodiment, during operation, the rotating motor 21 starts, driving the drive wheel 22 to rotate. The rotation of the drive wheel 22 drives the driven ring 24 to rotate via the transmission belt 23. The rotation of the driven ring 24 then drives the fixed component to rotate via a pair of symmetrically arranged connecting cylinders 260. The connecting cylinders 260, the main component driving the rotation of the fixed component, are cylindrical to facilitate the lifting operation of the fixed component. The rotating recess 250 serves to limit the rotation of the driven ring 24. To ensure rotational stability and reduce friction during rotation, multiple ball bearings are provided on the outer wall of the rotating recess 250, thereby improving the flexibility and stability of the driven ring 24's rotation. The upper ring 251 and lower ring 25 further enhance the stability of the rotating recess 250's fixed position, thus improving overall rotational stability.

[0024] The fixing component includes a suction cup 28 installed on the upper end of the connecting rod 27. The suction cup 28 has a circular structure and is composed of two identical disc-shaped structures spliced ​​together. The suction cup 28 has multiple straight holes 280 along its radial direction. A hollow groove is provided at the geometric center of the suction cup 28. The inner end of the straight holes 280 is connected to the hollow groove. Each straight hole 280 has a suction eye 281 extending upwards. An outer ring groove is formed on the outer periphery of the suction cup 28. An arc-shaped ring groove 282 is formed on the arc wall of the outer ring groove. Each straight hole 280 is connected to the arc-shaped ring groove 282. A pair of outer arc plates 283 are fitted on the outer periphery of the suction cup 28. The outer arc plates 283 are fitted into the outer ring groove. The inner periphery of the outer arc plates 283 is formed with an outer arc ring groove. A connecting tube 284 is provided on one of the outer arc plates 283. Lugs 285 are provided at both ends of the outer arc plates 283. The connecting tube 284 is connected to the outer arc ring groove. In this embodiment, the wafer is fixed by negative pressure suction. During operation, the suction device evacuates the suction cup 28 through the connecting pipe 284, and the suction holes 281 are used to suction and fix the wafer. To ensure the stability of suction, the suction holes 281 are evenly distributed on the suction cup 28. The straight holes 280 provide channels for gas extraction for the multiple suction holes 281. The cavity formed by the arc-shaped annular groove 282 and the outer arc annular groove allows the straight holes 280 to be connected together, so that the connecting pipe 284 and the suction holes 281 remain connected during rotation. The outer annular groove facilitates the sealing connection between the outer arc plate 283 and the suction cup 28.

[0025] The lifting mechanism 3 includes a mounting plate 30 installed on the lower wall of the base plate 11. The mounting plate 30 is equipped with a lifting motor 31. The output shaft of the lifting motor 31 is connected to a drive bevel gear 32. The drive bevel gear 32 meshes with a driven bevel gear 33. The driven bevel gear 33 is connected to a lifting screw 34. The lifting screw 34 is equipped with a lifting column 35. The outer wall of the lifting column 35 is provided with multiple guide grooves 350. The lifting column 35 is fitted with a guide sleeve 36. Each side wall of the guide sleeve 36 is equipped with a folded fixing foot 37. The lower end of the folded fixing foot 37 is installed on an upper ring 251. The upper end of the lifting column 35 is equipped with a lower plate 351. The upper end of the lower plate 351 is equipped with a fixing ring 352. The fixing ring 352 is equipped with a rotating column 353. The upper end of the rotating column 353 is equipped with a fixed lower plate 354. The fixed lower plate 354 is installed on the lower wall of the suction cup 28. In this embodiment, when adjusting the height of the fixed component, namely the suction cup 28, the lifting motor 31 drives the lifting screw 34 to rotate, and the rotation of the lifting screw 34 drives the lifting column 35 to move along the direction of the guide sleeve 36. The lifting column 35's lifting and lowering movement causes the suction cup 28 to move up and down. In order to ensure the stability of the guide, a guide groove 350 is opened on the outer wall of the lifting column 35, and a guide protrusion is correspondingly provided on the inner wall of the guide sleeve 36, and the guide protrusion passes through the guide groove 350. Since the lifting screw 34 is used to drive the adjustment of the height of the suction cup 28 in this embodiment, the adjustment accuracy and stability after adjustment are improved. The fixed ring 352 and the rotating column 353 set at the upper end of the lifting column 35 play a guiding role and ensure the stability of the rotation when the suction cup 28 rotates. Of course, in order to ensure the stability of the rotation, a bearing is set in the fixed ring 352 in actual operation, and the rotating column 353 is set on the bearing. When the suction cup 28 rotates, the connecting cylinder 260 drives the connecting rod 27 to rotate around the axis of the suction cup 28. This design makes it convenient to adjust the height of the suction cup 28.

[0026] The protective cover 6 includes four support rods 65 installed on the base plate 11. A lower liner ring 60 is installed at the upper end of the support rods 65. The inner circumference of the lower liner ring 60 is provided with an upwardly extending protruding edge. The lower liner ring 60 has a conical structure and its outer circumference is inclined downward. An outer baffle plate 61 is provided on the outer circumference of the lower liner ring 60. A pair of concave sleeves 62 are provided on the inner wall of the outer baffle plate 61. Each pair of lugs 285 passes through the same concave sleeve 62. A U-shaped hole is opened on the arc wall of the outer baffle plate 61. A connecting pipe 284 passes through the U-shaped hole. An arc baffle 64 is installed on the outer end of the connecting pipe 284. L-shaped limiting plates 63 are fitted on both sides of the arc baffle 64. The L-shaped limiting plates 63 are all provided on the outer baffle plate 61. The length of the arc baffle 64 is longer than the height of the outer baffle plate 61. The outer baffle plate 61 in the protective cover 6 provided in this embodiment can prevent the source liquid from splashing during the coating process, thereby causing pollution to the operating environment. The lower liner ring 60 with a conical structure facilitates the collection of splashed source liquid. In order to prevent the collected source liquid from flowing out from the inner ring of the lower liner ring 60, the lower liner ring 60 is not only set as a conical structure, but also has an upper protruding edge on the inner circumference. The concave sleeve 62 therein plays a limiting role for the lug 285, preventing the outer arc plate 283 from moving when the suction cup 28 rotates, thereby avoiding affecting the connection effect between the connecting pipe 284 and the outer arc plate 283. Meanwhile, a U-shaped hole is provided to facilitate the extension of the connecting pipe 284 from the outer baffle plate 61. In order to prevent the source liquid from flying out of the U-shaped hole during the application of the source liquid, an arc-shaped baffle 64 is provided. In order to improve the sealing effect, L-shaped limiting plates 63 are provided on both sides of the arc-shaped baffle 64. In order to prevent the source liquid from flowing out when the suction cup 28 moves up and down, the length of the arc-shaped baffle 64 is set to be greater than the height of the outer baffle plate 61.

[0027] The straightening mechanism 4 includes an extended connecting plate 40 mounted on the outer wall of the outer baffle plate 61. A drive bearing seat 41 is mounted on the outer end of the extended connecting plate 40, and a straightening motor 42 is mounted on the drive bearing seat 41. The output shaft of the straightening motor 42 is connected to a straightening lead screw 43. A straightening internal thread post 44 is provided on the straightening lead screw 43, and a concave part 45 is provided on the inner end of the straightening internal thread post 44. The concave part 45 passes through the outer baffle plate 61, and a straightening wheel 46 is provided on the inner end of the concave part 45. In this embodiment, during source liquid coating, the position of the straightening wheel 46 is adjusted by moving the straightening internal thread post 44 driven by the straightening lead screw 43. This adjustment method has strong stability and high adjustment accuracy. By adjusting, the outer wall of the straightening wheel 46 is tangent to the outer wall of the wafer, ensuring that the wafer can rotate stably around its center, thereby avoiding the phenomenon of missed coating during source liquid coating.

[0028] The scraping mechanism 5 includes an extended base plate 50 installed on the outer baffle plate 61. An adjustment hole 500 is provided on the extended base plate 50. A pair of inner top bearing seats 51 are installed on the upper wall of the extended base plate 50. An inner top motor 52 is installed on the inner top bearing seat 51 located at the outer end. The output shaft of the inner top motor 52 is connected to an inner top screw 53. An inner top seat 54 is provided on the inner top screw 53. The lower end of the inner top seat 54 passes through the adjustment hole 500.

[0029] The scraping mechanism 5 also includes four guide columns 57. Each end of the guide column 57 is equipped with a movable bearing seat 55. The movable bearing seat 55 on the outer side is equipped with an inner moving motor 56. The output shaft of the inner moving motor 56 is connected to an inner moving screw 570. An inner moving seat 571 is provided on the inner moving screw 570. The inner moving seat 571 is located between the guide columns 57. Scraping cylinders 572 are installed on both sides of the inner moving seat 571. A scraper 573 is installed at the lower end of the scraping cylinder 572. A limiting frame 58 is sleeved on the guide column 57. The limiting frame 58 is installed on the outer wall of the outer baffle plate 61, and the guide column 57 passes through the limiting frame 58.

[0030] The first part of the components in this embodiment is mainly for overall adjustment to avoid affecting the wafer placement during wafer placement operations. The second part of the components is mainly for driving the scraper 573 to move from the inside out during the scraping process, and realizing the coating operation of the source liquid during the movement. At the same time, in order to facilitate the control of the source liquid coating thickness, a corresponding scraping cylinder 572 is set. The height of the scraper 573 is controlled by the scraping cylinder 572 to adjust the source liquid thickness. The scraper 573 can be set as an L-shaped structure. This structure can drive the source liquid to move from the inside out during the scraping process, and realize the coating operation of the source liquid during the movement.

[0031] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.

Claims

1. A wafer front-side coating source device, characterized in that, It includes a support frame (1), a rotating mechanism (2), a lifting mechanism (3), a protective cover (6), a straightening mechanism (4), and a scraping mechanism (5); The support frame (1) includes a base plate (11), and the base plate (11) is provided with four support legs (10) extending downward. The rotating mechanism (2) is mounted on the support frame (1) and includes a rotating component and a fixed component. The rotating component is used to drive the fixed component to rotate, and the fixed component is used to place and fix the wafer. The lifting mechanism (3) is mounted on the rotating mechanism (2) and is used to adjust the height of the fixed component; The protective cover (6) is mounted on the support frame (1) and covers the outside of the fixed component when the fixed component is at its lowest point. The correction mechanism (4), which is at least one pair, is located on the protective cover (6) to make the wafer rotate about its geometric center when the wafer rotates; The coating mechanism (5), which is mounted on the protective cover (6), is used for coating operations on the diffusion source; The straightening mechanism (4) includes an extended connecting plate (40) installed on the outer wall of the protective cover (6). A drive bearing seat (41) is installed on the outer end of the extended connecting plate (40). A straightening motor (42) is installed on the drive bearing seat (41). The output shaft of the straightening motor (42) is connected to a straightening screw (43). A straightening internal thread column (44) is provided on the straightening screw (43). A concave part (45) is provided on the inner end of the straightening internal thread column (44). The concave part (45) passes through the protective cover (6). A straightening wheel (46) is provided on the inner end of the concave part (45). The scraping mechanism (5) includes an extended base plate (50) installed on the protective cover (6). An adjustment hole (500) is provided on the extended base plate (50). A pair of inner top bearing seats (51) are installed on the upper wall of the extended base plate (50). An inner top motor (52) is installed on the inner top bearing seat (51) located at the outer end. The output shaft of the inner top motor (52) is connected to an inner top screw (53). An inner top seat (54) is provided on the inner top screw (53). The lower end of the inner top seat (54) passes through the adjustment hole (500). The scraping mechanism (5) also includes four guide columns (57). Both ends of the guide columns (57) are equipped with movable bearing seats (55). The movable bearing seats (55) on the outer side are equipped with an inner moving motor (56). The output shaft of the inner moving motor (56) is connected to an inner moving screw (570). An inner moving seat (571) is provided on the inner moving screw (570). The inner moving seat (571) is located between the guide columns (57). Scraping cylinders (572) are installed on both sides of the inner moving seat (571). A scraper (573) is installed at the lower end of the scraping cylinder (572). A limiting frame (58) is fitted on the guide column (57). The limiting frame (58) is installed on the outer wall of the protective cover (6), and the guide column (57) passes through the limiting frame (58).

2. The wafer front-side coating source apparatus according to claim 1, characterized in that, The rotating component includes a motor mounting plate (20) mounted on one side of the base plate (11), a rotating motor (21) mounted on the motor mounting plate (20), a drive wheel (22) connected to the output shaft of the rotating motor (21), a transmission belt (23) sleeved on the drive wheel (22), a driven ring (24) provided at the other end of the transmission belt (23), and mounting seats (26) arranged in a circular array around the geometric center of the base plate (11), with a lower ring (25) mounted on the upper end of the mounting seats (26). The lower ring (25) is equipped with rotating recesses (250) arranged in a circular array. The rotating recesses (250) are fitted on the inner side of the driven ring (24). The upper end of the rotating recesses (250) is equipped with an upper ring (251). The inner wall of the rotating recesses (250) is provided with multiple balls that can be rotated. The balls are tangent to the outer wall of the driven ring (24). The driven ring (24) extends upward with a pair of symmetrically arranged connecting cylinders (260). Each connecting cylinder (260) has a connecting rod (27) inserted inside it.

3. The wafer front-side coating source apparatus according to claim 2, characterized in that, The fixing component includes a suction cup (28) connected to the upper end of the rotating component. The suction cup (28) has a circular structure and is composed of two identical disc-shaped structures joined together. The suction cup (28) has multiple straight holes (280) along its radial direction. A hollow groove is provided at the geometric center of the suction cup (28). The inner ends of the straight holes (280) are connected to the hollow groove. Each straight hole (280) has an upward-through suction eye (281). An outer annular groove is formed on the outer periphery of the suction cup (28). An arc-shaped annular groove (282) is formed on the arc wall, and each straight hole (280) is connected to the arc-shaped annular groove (282). A pair of outer arc plates (283) are fitted on the outer periphery of the suction cup (28). The outer arc plates (283) are fitted into the outer annular groove. The inner periphery of the outer arc plates (283) is formed with an outer arc annular groove. A connecting pipe (284) is provided on one of the outer arc plates (283). Both ends of the outer arc plates (283) are provided with lugs (285). The connecting pipe (284) is connected to the outer arc annular groove.

4. The wafer front-side coating source apparatus according to claim 1, characterized in that, The lifting mechanism (3) includes a mounting plate (30) installed on the lower wall of the base plate (11). A lifting motor (31) is mounted on the mounting plate (30). The output shaft of the lifting motor (31) is connected to a drive bevel gear (32). The drive bevel gear (32) meshes with a driven bevel gear (33). The driven bevel gear (33) is connected to a lifting screw (34). A lifting column (35) is provided on the lifting screw (34). Multiple guide grooves (350) are provided on the outer wall of the lifting column (35). The outer sleeve is provided with a guide sleeve (36), and each side wall of the guide sleeve (36) is equipped with a folded fixing foot (37). The lower end of the folded fixing foot (37) is installed on the lower end of the rotating component. The upper end of the lifting column (35) is provided with a lower plate (351), and the upper end of the lower plate (351) is provided with a fixing ring (352). The fixing ring (352) is provided with a rotating column (353), and the upper end of the rotating column (353) is provided with a fixed lower plate (354). The fixed lower plate (354) is installed on the fixed component.

5. The wafer front-side coating source apparatus according to claim 3, characterized in that, The protective cover (6) includes four support rods (65) installed on the base plate (11). The upper end of the support rod (65) is equipped with a lower liner ring (60). The outer periphery of the lower liner ring (60) is provided with an outer baffle plate (61). The inner wall of the outer baffle plate (61) is provided with a pair of concave sleeves (62). Each pair of lugs (285) passes through the same concave sleeve (62).

6. The wafer front-side coating source apparatus according to claim 5, characterized in that, The inner circumference of the lower liner (60) is provided with an upper protruding edge. The lower liner (60) has a conical structure and its outer circumference is inclined downward.

7. The wafer front-side coating source apparatus according to claim 5, characterized in that, A U-shaped hole is provided on the arc wall of the outer baffle plate (61), the connecting pipe (284) passes through the U-shaped hole, and an arc baffle (64) is installed on the outer end of the connecting pipe (284). An L-shaped limiting plate (63) is fitted on both sides of the arc baffle (64). The L-shaped limiting plate (63) is provided on the outer baffle plate (61), and the length of the arc baffle (64) is longer than the height of the outer baffle plate (61).

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