Detection device, processing system and delivery method

Abstract

The present application provides a detection device, a processing system, and a conveying method capable of positioning a conveying object without positioning means. A detection device of one embodiment of the present application is a detection device that detects a positional shift of a conveying object with respect to a conveying mechanism, and includes an image sensor that acquires an image including the conveying mechanism and the conveying object held by the conveying mechanism, and a calculation portion that calculates a positional shift amount of the conveying object including a positional shift amount in a horizontal direction and a rotational direction, on the basis of the image acquired by the image sensor.

Description

Technical Field

[0001] This invention relates to a detection device, a processing system, and a conveying method. Background Technology

[0002] A positioning device is known that is configured to detect the position of the periphery, the position of the orientation plane and the notch while rotating a semiconductor wafer, and to detect the offset of the wafer center relative to the rotation center for positioning (for example, see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2004-47654 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] This invention provides a technology for positioning transported objects without the need for a positioning device.

[0008] Technical solutions for solving technical problems

[0009] One aspect of the present invention is a detection device for detecting the positional offset of a transported object relative to a transport mechanism, comprising: an image sensor that acquires an image including the transport mechanism and the transported object held by the transport mechanism; and a calculation unit that calculates, based on the image acquired by the image sensor, a positional offset of the transported object, including positional offsets in the horizontal and rotational directions.

[0010] Invention Effects

[0011] According to the present invention, the object to be transported can be positioned without the need for a positioning device. Attached Figure Description

[0012] Figure 1 This is a diagram illustrating an example of a processing system for an implementation method.

[0013] Figure 2 yes Figure 1 A schematic cross-sectional view of an example of a connecting part in the processing system.

[0014] Figure 3 yes Figure 1 A schematic cross-sectional view of an example of a processing module in a processing system.

[0015] Figure 4 This is a diagram illustrating an example of a delivery method according to an implementation method.

[0016] Figure 5 This is a diagram used to illustrate the positional relationship between the fork-shaped component and the edge ring.

[0017] Figure 6 This is a diagram used to illustrate the positional relationship between the fork-shaped component and the edge ring.

[0018] Figure 7 This is a diagram used to illustrate the positional relationship between the fork-shaped component and the edge ring.

[0019] Figure 8 yes Figure 1 A schematic cross-sectional view of another example of a processing module in a processing system.

[0020] Figure 9 This is another example of a diagram showing the location of an image sensor.

[0021] Figure 10 This is another example of a diagram showing the location of an image sensor.

[0022] Explanation of reference numerals in the attached figures

[0023] 113 Edge ring

[0024] 114 Cover ring

[0025] CU Control Unit

[0026] IS Image Sensor

[0027] TR1 and TR2 conveyor robots

[0028] FK1 and FK2 fork-shaped components

[0029] W substrate. Detailed Implementation

[0030] Hereinafter, non-limiting exemplary embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, the same or corresponding parts or components are labeled with the same or corresponding reference numerals, and repeated descriptions are omitted.

[0031] (Processing System)

[0032] Reference Figure 1 , Figure 2 , Figure 9 and Figure 10 An example of the processing system of the embodiment will be described. The processing system PS of the embodiment is a system capable of performing various processes such as plasma processing on the substrate.

[0033] The processing system PS includes vacuum conveying modules TM1 and TM2, conveying intermediate chambers MM1 and MM2, processing modules PM1 to PM8, load locking modules LL1 and LL2, atmospheric conveying module LM, and control unit CU, etc.

[0034] Vacuum transport modules TM1 and TM2 each have a roughly hexagonal shape when viewed from above. Processing modules PM1 to PM4 are connected to two opposite sides of vacuum transport module TM1. Load locking modules LL1 and LL2 are connected to one side of another pair of opposite sides of vacuum transport module TM1, and transport intermediate chambers MM1 and MM2 are connected to the other side. The side of vacuum transport module TM1 connected to load locking modules LL1 and LL2 is angled to accommodate the two load locking modules LL1 and LL2. The side of vacuum transport module TM1 connected to transport intermediate chambers MM1 and MM2 is angled to accommodate the two transport intermediate chambers MM1 and MM2. Processing modules PM5 to PM8 are connected to two opposite sides of vacuum transport module TM2. Transport intermediate chambers MM1 and MM2 are connected to one side of another pair of opposite sides of vacuum transport module TM2. The side of vacuum transport module TM2 connected to transport intermediate chambers MM1 and MM2 is angled to accommodate the two transport intermediate chambers MM1 and MM2. Vacuum transport modules TM1 and TM2 are connected by two intermediate transport chambers MM1 and MM2. Vacuum transport modules TM1 and TM2 each have a vacuum chamber, inside which transport robots TR1 and TR2 are respectively installed. Furthermore, image sensors IS are installed in vacuum transport modules TM1 and TM2.

[0035] The conveying robots TR1 and TR2 are configured to rotate, extend, and lift freely. Conveying robot TR1 places the object to be conveyed on the fork-shaped component FK1 located at its front end, and conveys the object between the load locking modules LL1 and LL2, the intermediate conveying chambers MM1 and MM2, and the processing modules PM1 to PM4. Conveying robot TR2 places the object to be conveyed on the fork-shaped component FK2 located at its front end, and conveys the object between the intermediate conveying chambers MM1 and MM2 and the processing modules PM5 to PM8. The object to be conveyed includes a substrate and consumable components. The substrate may be, for example, a semiconductor wafer. The consumable components are components replaceably installed within the processing modules PM1 to PM8, and are consumed due to various processes such as plasma processing performed within the processing modules PM1 to PM8. Consumable components include, for example, the edge ring 113, the cover ring 114, and the top plate 121 of the upper electrode 12, described later. Furthermore, in Figure 1 In the middle, it indicates that the conveying robot TR1 places the edge ring 113 on the fork-shaped component FK1, and the conveying robot TR2 places the edge ring 113 on the fork-shaped component FK2.

[0036] Image sensor IS acquires images of the fork-shaped components FK1 and FK2 of the conveying robots TR1 and TR2, and the conveyed object held by the fork-shaped components FK1 and FK2. Image sensor IS sends the acquired images to control unit CU. Image sensor IS is positioned along the conveying path of the conveyed object. For example, image sensor IS is positioned near the load locking modules LL1 and LL2 of vacuum conveying module TM1, near the conveying intermediate chambers MM1 and MM2 of vacuum conveying module TM1, and near the conveying intermediate chambers MM1 and MM2 of vacuum conveying module TM2. Figure 1 However, the location and number of image sensors IS are not limited to this. For example, one image sensor IS can be installed on each of the vacuum transport modules TM1 and TM2. The image sensor IS can be mounted, for example, above the vacuum transport modules TM1 and TM2. Specifically, the image sensor IS is mounted above the light transmission window TW. Figure 2 The light transmission window TW is hermetically mounted via a sealing component (not shown) to an opening OP formed in a portion of the top of the vacuum transport modules TM1 and TM2. The image sensor IS captures images of the vacuum transport modules TM1 and TM2 through the light transmission window TW, obtaining images of the fork-shaped components FK1 and FK2 of the transport robots TR1 and TR2, and the transported objects held within these fork-shaped components FK1 and FK2. The image sensor IS can be, for example, a CCD camera or a CMOS camera.

[0037] In addition, for example, Figure 9As shown, the image sensor IS can also be located near the four gate valves G1 in the vacuum transport module TM1 and near the four gate valves G1 in the vacuum transport module TM2. In this case, the image sensor IS can acquire images including the fork-shaped components FK1 and FK2 and the transported object when transporting the object, and can also acquire images of the processing modules PM1 to PM8 when various processes are performed within them. Based on the acquired images of the processing modules PM1 to PM8, the state of the processing modules PM1 to PM8 during various processes can be determined. Furthermore, the gates G1 are closed when various processes are performed within the processing modules PM1 to PM8. Therefore, in order for the image sensor IS to acquire images of the processing modules PM1 to PM8 via the gates G1, a light transmission window such as a quartz window is provided on the gates G1, for example. However, when acquiring images of the processing modules PM1 to PM8 with the gates G1 open, a light transmission window may not be provided on the gates G1. Furthermore, the image sensor IS preferably has a variable shooting direction to acquire multiple images, including images containing the fork-shaped components FK1 and FK2 and the transported object, as well as images from the processing modules PM1 to PM8. However, the image sensor IS can also have a fixed shooting direction while being able to acquire multiple images, including images containing the fork-shaped components FK1 and FK2 and the transported object, as well as images from the processing modules PM1 to PM8, without changing the shooting direction.

[0038] Furthermore, the image sensor IS can also be configured to be movable. For example, the image sensor IS can be configured to move horizontally in accordance with the horizontal movement of the fork-shaped components FK1 and FK2. Thus, one image sensor IS can acquire images at multiple locations, thereby reducing the number of image sensors IS required.

[0039] exist Figure 10 In the example, the vacuum transport module TM1 is equipped with guide rails GL11 and GL12 and image sensors IS11 and IS12, while the vacuum transport module TM2 is equipped with guide rails GL21 and GL22 and image sensors IS21 and IS22. The guide rails GL11 and GL12 and the image sensors IS11 and IS12 will be described below. However, the guide rails GL21 and GL22 and the image sensors IS21 and IS22 can also have the same structure.

[0040] A guide rail GL11 is positioned on top of the vacuum transport module TM1 along its long side. One end of the guide rail GL11 is located near the transport intermediate chamber MM1 of the vacuum transport module TM1, and the other end is located near the gate G2 of the vacuum transport module TM1. An image sensor IS11 is movably mounted on the guide rail GL11 and can move along the guide rail GL11 along the long side of the vacuum transport module TM1. A light transmission window (not shown) is formed on the top of the vacuum transport module TM1, corresponding to the movement range of the image sensor IS11. By moving to one end of the guide rail GL11, the image sensor IS11 acquires an image via the light transmission window of the transport object being transported between the vacuum transport module TM1 and the transport intermediate chamber MM1, and the fork-shaped component FK1 holding the transport object. Conversely, by moving to the other end of the guide rail GL11, the image sensor IS11 acquires an image via the light transmission window of the transport object being transported between the vacuum transport module TM1 and the load locking module LL1, and the fork-shaped component FK1 holding the transport object.

[0041] A guide rail GL12 is positioned on top of the vacuum transport module TM1 along its long side. One end of the guide rail GL12 is located near the transport intermediate chamber MM2 of the vacuum transport module TM1, and the other end is located near the gate G2 of the vacuum transport module TM1. An image sensor IS12 is movably mounted on the guide rail GL12 and can move along the guide rail GL12 along the long side of the vacuum transport module TM1. A light transmission window (not shown) is formed on the top of the vacuum transport module TM1, corresponding to the movement range of the image sensor IS12. By moving to one end of the guide rail GL12, the image sensor IS12 acquires an image via the light transmission window containing the transported object being transported between the vacuum transport module TM1 and the transport intermediate chamber MM2, and the fork-shaped component FK1 holding the transported object. Conversely, by moving to the other end of the guide rail GL12, the image sensor IS12 acquires an image via the light transmission window containing the transported object being transported between the vacuum transport module TM1 and the load locking module LL2, and the fork-shaped component FK1 holding the transported object.

[0042] The control unit CU, for example, moves the image sensors IS11 and IS12 by following the horizontal movement of the fork-shaped component FK1 based on the position information of the fork-shaped component FK1.

[0043] In addition, Figure 10In the example, the case where guide rails GL11 and GL12 and image sensors IS11 and IS12 are provided in the vacuum transport module TM1 is described, but it is not limited to this. For example, guide rails extending along the long and short sides of the vacuum transport module TM1 may also be provided in the vacuum transport module TM1, and one or more image sensors may be provided on the guide rails.

[0044] In addition, Figure 10 In the example described, the case where guide rails GL11 and GL12 and image sensors IS11 and IS12 are mounted on the top of the vacuum transport module TM1 is illustrated, but it is not a limitation. For example, guide rails GL11 and GL12 and image sensors IS11 and IS12 may also be mounted inside the vacuum transport module TM1.

[0045] Intermediate transport chambers MM1 and MM2 are positioned between vacuum transport modules TM1 and TM2. The interiors of each intermediate transport chamber MM1 and MM2 are connected to the interiors of vacuum transport modules TM1 and TM2 and are maintained under a vacuum atmosphere. Intermediate transport chambers MM1 and MM2 have a worktable SG disposed within them. The worktable SG can temporarily hold the transported object on its upper surface. Intermediate transport chambers MM1 and MM2 function as buffers for transferring substrates and consumable components between vacuum transport modules TM1 and TM2. For example, transport robot TR1 places a consumable component on the worktable SG within intermediate transport chamber MM1, and transport robot TR2 receives the consumable component placed on the worktable SG, thereby transporting the consumable component from vacuum transport module TM1 to vacuum transport module TM2. Alternatively, for example, transport robot TR2 places a consumable component on the worktable SG within intermediate transport chamber MM1, and transport robot TR1 receives the consumable component placed on the worktable SG, thereby transporting the consumable component from vacuum transport module TM2 to vacuum transport module TM1. Alternatively, a transport intermediate chamber MM2 can be used instead of the transport intermediate chamber MM1. Furthermore, the substrate can be transferred between the vacuum transport module TM1 and the vacuum transport module TM2 using the same method as for consumable components.

[0046] Processing modules PM1 to PM8 each have a processing chamber and an internal worktable. After a substrate is placed on the worktable, the internal pressure of the processing modules PM1 to PM8 is reduced to introduce processing gas, and RF electrical power is applied to generate plasma. The plasma is then used to perform plasma treatment on the substrate. Vacuum transport modules TM1 and TM2 are separated from processing modules PM1 to PM8 by an openable and closable gate G1. An edge ring 113 and a cover ring 114 are provided on the worktable. An upper electrode 12 for applying RF electrical power is provided on the upper part opposite to the worktable.

[0047] Load locking modules LL1 and LL2 are configured between vacuum delivery module TM1 and atmospheric delivery module LM. Load locking modules LL1 and LL2 have variable internal pressure chambers capable of switching between vacuum and atmospheric pressure. Load locking modules LL1 and LL2 also have internal worktables. When feeding a substrate from atmospheric delivery module LM to vacuum delivery module TM1, load locking modules LL1 and LL2 maintain atmospheric pressure internally while receiving the substrate from atmospheric delivery module LM, and switch to vacuum internally while feeding the substrate into vacuum delivery module TM1. When feeding a substrate out of vacuum delivery module TM1 to atmospheric delivery module LM, load locking modules LL1 and LL2 maintain vacuum internally while receiving the substrate from vacuum delivery module TM1, and pressurize internally to atmospheric pressure before feeding the substrate into atmospheric delivery module LM. Load locking modules LL1 and LL2 and vacuum delivery module TM1 are separated by an openable and closable gate G2. Load locking modules LL1 and LL2 and atmospheric delivery module LM are separated by an openable and closable gate G3.

[0048] The atmospheric conveying module LM is configured opposite to the vacuum conveying module TM1. The atmospheric conveying module LM can be, for example, an EFEM (Equipment Front End Module). The atmospheric conveying module LM is cuboid in shape and has an FFU (Fan Filter Unit) and an atmospheric conveying chamber maintained at atmospheric pressure. Two load locking modules LL1 and LL2 are connected to one side of the atmospheric conveying module LM along its long side. Loading ports LP1 to LP5 are connected to the other side of the atmospheric conveying module LM along its long side. Containers (not shown) for holding the conveyed objects are placed in the loading ports LP1 to LP5. These containers may include, for example, containers for holding one or more substrates, or containers for holding one or more consumable parts. The container for holding substrates can be, for example, a FOUP (Front-Opening Unit). Pod: Front-opening wafer transfer box. Containers for storing consumable components include, for example, containers for storing edge rings 113, containers for storing cover rings 114, and containers for storing the top plate 121 of the upper electrode 12. A transport robot (not shown) is configured within the atmospheric transport module LM. The transport robot transports the object between the containers placed in loading ports LP1 to LP5 and the internal pressure variable chambers of load locking modules LL1 and LL2.

[0049] The control unit (CU) controls various components of the processing system, such as the conveying robots TR1 and TR2 in the vacuum conveying modules TM1 and TM2, the conveying robot in the atmospheric conveying module LM, and gates G1 to G4. Furthermore, the control unit (CU) controls various components of the processing system (PS) to execute the conveying method described later. The control unit (CU) includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and auxiliary storage devices. The CPU operates based on programs stored in the ROM or auxiliary storage devices, controlling various components of the processing system (PS).

[0050] (Plasma processing device)

[0051] Reference Figure 3 , for as Figure 1 An example of a plasma processing device used in the processing modules PM1 to PM8 of the PS processing system will be described.

[0052] The plasma processing device 1 includes a chamber 10, a gas supply unit 20, an RF power supply unit 30, an exhaust unit 40, a lifting mechanism 50, and a control unit 90.

[0053] The chamber 10 includes a support portion 11 and an upper electrode 12. The support portion 11 is disposed in the lower region of the processing space 10s within the chamber 10. The upper electrode 12 is disposed above the support portion 11 and functions as part of the top plate of the chamber 10.

[0054] The support portion 11 supports the substrate W in the processing space 10s. The support portion 11 includes a lower electrode 111, an electrostatic chuck 112, an edge ring 113, a cover ring 114, an insulator 115, and a base 116. The electrostatic chuck 112 is disposed on the lower electrode 111. The electrostatic chuck 112 supports the substrate W on its upper surface. The edge ring 113 is an annular member disposed around the substrate W. The edge ring 113 protects the end of the electrostatic chuck 112 from the influence of plasma. In addition, the edge ring 113 reduces the non-uniformity of the etching characteristics of the outer periphery of the substrate W and improves the in-plane uniformity of the etching characteristics. The cover ring 114 is an annular member disposed around the edge ring 113. The cover ring 114 protects the upper surface of the insulator 115 from the influence of plasma. The insulator 115 is disposed on the base 116 in a manner that surrounds the lower electrode 111. The base 116 is fixed to the bottom of the chamber 10 to support the lower electrode 111 and the insulator 115.

[0055] The upper electrode 12, together with the insulating component 13, forms the chamber 10. The upper electrode 12 supplies one or more processing gases from the gas supply unit 20 into the processing space 10s. The upper electrode 12 includes a top plate 121 and a support body 122. The lower surface of the top plate 121 defines the processing space 10s. A plurality of gas release holes 121a are formed in the top plate 121. The plurality of gas release holes 121a penetrate the top plate 121 in the thickness direction (vertical direction). The support body 122 detachably supports the top plate 121. A gas diffusion chamber 122a is provided inside the support body 122. A plurality of vents 122b extend downward from the gas diffusion chamber 122a. The plurality of vents 122b communicate with the plurality of gas release holes 121a. A gas inlet 122c is formed in the support body 122. The upper electrode 12 supplies one or more processing gases from the gas inlet 122c through the gas diffusion chamber 122a, multiple gas holes 122b and multiple gas release holes 121a to the processing space 10s.

[0056] The gas supply unit 20 includes one or more gas sources 21 and one or more flow controllers 22. The gas supply unit 20 supplies one or more processing gases from each gas source 21 to the gas inlet 122c via their respective flow controllers 22. The flow controllers 22 may, for example, include mass flow controllers or pressure-controlled flow controllers. Furthermore, the gas supply unit 20 may also include one or more flow modulation devices that modulate or pulse the flow rate of one or more processing gases.

[0057] The RF power supply unit 30 includes two RF power supplies (first RF power supply 31a and second RF power supply 31b) and two matching circuits (first matching circuit 32a and second matching circuit 32b). The first RF power supply 31a supplies first RF power to the lower electrode 111 via the first matching circuit 32a. The frequency of the first RF power supply can be, for example, 3Hz to 3000GHz. The second RF power supply 31b supplies second RF power to the lower electrode 111 via the second matching circuit 32b. The frequency of the second RF power supply can be, for example, 400kHz to 13.56MHz. Alternatively, a DC power supply can be used instead of the second RF power supply 31b.

[0058] The exhaust section 40 is connected to the exhaust port 10e located at the bottom of the chamber 10. The exhaust section 40 includes a pressure valve, a vacuum pump, etc.

[0059] An inlet / outlet 10p is formed on the side wall of the chamber 10. The substrate W is transported between the processing space 10s and the outside of the chamber 10 via the inlet / outlet 10p. The inlet / outlet 10p is opened and closed by means of a gate G1.

[0060] The lifting mechanism 50 includes a first lifting mechanism 51 and a second lifting mechanism 52.

[0061] The first lifting mechanism 51 includes a plurality of support pins 511 and a motor 512. The plurality of support pins 511 are inserted through through holes H1 formed in the lower electrode 111 and the electrostatic chuck 112, allowing them to extend and retract relative to the upper surface of the electrostatic chuck 112. The plurality of support pins 511 support the substrate W by extending from the upper surface of the electrostatic chuck 112 and abutting their upper ends against the bottom surface of the substrate W. The motor 512 causes the plurality of support pins 511 to rise and fall. The motor 512 can be a DC motor, a stepper motor, a linear motor, a piezoelectric actuator, a pneumatic drive mechanism, etc. This first lifting mechanism 51, for example, causes the plurality of support pins 511 to rise and fall during the transfer of the substrate W between the transport robots TR1 and TR2 and the support portion 11.

[0062] The second lifting mechanism 52 includes a plurality of support pins 521 and a motor 522. The plurality of support pins 521 are inserted through through holes H2 formed in the insulator 115 and can extend and retract relative to the upper surface of the insulator 115. The plurality of support pins 521 support the edge ring 113 by extending from the upper surface of the insulator 115 and abutting their upper ends against the bottom surface of the edge ring 113. The motor 522 raises and lowers the plurality of support pins 521. The motor 522 can be a DC motor, a stepper motor, a linear motor, a piezoelectric actuator, a pneumatic drive mechanism, etc. This second lifting mechanism 52 raises and lowers the plurality of support pins 521, for example, when the edge ring 113 is transferred between the conveying robots TR1 and TR2 and the support portion 11.

[0063] Additionally, although the illustration is omitted, a lifting mechanism for raising and lowering the cover ring 114 is provided in the support portion 11. This lifting mechanism includes a plurality of support pins located at positions that can abut against the bottom surface of the cover ring 114 and a motor for raising and lowering the plurality of support pins.

[0064] The control unit 90 controls various parts of the plasma processing apparatus 1. The control unit 90 includes, for example, a computer 91. The computer 91 includes, for example, a CPU 911, a storage unit 912, and a communication interface 913. The CPU 911 can be configured to perform various control operations based on programs stored in the storage unit 912. The storage unit 912 includes at least one memory type selected from auxiliary storage devices such as RAM, ROM, HDD (Hard Disk Drive), and SSD (Solid State Drive). The communication interface 913 can also communicate with the plasma processing apparatus 1 via a communication line such as a LAN (Local Area Network).

[0065] (Conveying method)

[0066] Reference Figure 4 Hereinafter, an example of the conveying method of the embodiment will be described. Figure 1 The following explanation will be based on the case where the edge ring 113 is transported to the processing module PM1, which does not have the edge ring 113 installed on the worktable, and is placed on the worktable.

[0067] In step S1, firstly, the control unit CU uses a conveying robot (not shown) within the atmospheric conveying module LM to deliver, for example, the edge ring 113 housed in a container placed in the loading port LP1. Next, the control unit CU opens the gate G3 between the atmospheric conveying module LM and the load locking module LL1. Then, the control unit CU uses the conveying robot to place the edge ring 113 onto a worktable within the load locking module LL1. Next, the control unit CU closes the gate G3, depressurizing the load locking module LL1 and switching it to a vacuum. Next, the control unit CU opens the gate G2 between the load locking module LL1 and the vacuum conveying module TM1. Then, the control unit CU uses the fork-shaped component FK1 of the conveying robot TR1 located within the vacuum conveying module TM1 to receive the edge ring 113 placed on the worktable within the load locking module LL1.

[0068] In step S2, firstly, the control unit CU controls the transport robot TR1 to move the fork-shaped component FK1, on which the edge ring 113 is mounted, to the imaging area of ​​any image sensor IS located in the vacuum transport module TM1. Next, the control unit CU controls the image sensor IS to acquire an image containing the fork-shaped component FK1 and the edge ring 113 mounted on it. Then, based on the image acquired by the image sensor IS, the control unit CU calculates the positional offset of the edge ring 113 relative to the fork-shaped component FK1, including positional offsets in the horizontal and rotational directions. In this embodiment, as... Figure 5 As shown, the center position C2 of the edge ring 113 is offset 3mm to the right (+X direction) relative to the center position C1 of the fork-shaped member FK1. Furthermore, the position N1 of the notch in the edge ring 113 is rotated 2° counterclockwise relative to the backward direction (-Y direction) of the fork-shaped member FK1. Therefore, the control unit CU calculates the left-right offset of the edge ring 113 as +3mm and the rotational offset as +2°.

[0069] In step S3, the control unit CU determines whether the position offset calculated in step S2 is within the allowable range. The allowable range is determined, for example, according to the specifications of the processing system PS. In step S3, if it is determined that the position offset is within the allowable range, the control unit CU causes the processing to proceed to step S4. On the other hand, if it is determined in step S3 that the position offset exceeds the allowable range, the control unit CU causes the processing to proceed to step S5.

[0070] In step S4, firstly, the control unit CU opens the gate G1 between the vacuum transport module TM1 and the processing module PM1. Next, the control unit CU controls the transport robot TR1 to transport the edge ring 113 into the processing module PM1 in an attitude corrected based on the position offset calculated in step S2, and then places it on the worktable. In this embodiment, as... Figure 6 As shown, the control unit CU controls the conveying robot TR1 to place the edge ring 113 onto the worktable inside the processing module PM1 in a first posture. The first posture is one in which the fork-shaped component FK1 is offset 3mm to the left (-X direction) from the reference position and offset 2° clockwise around the center position C1 of the fork-shaped component FK1. After step S4, the control unit CU ends the processing.

[0071] In step S5, the control unit CU controls the conveying robot TR1 to convey the edge ring 113 to the conveying intermediate chamber MM1, which serves as a buffer, and places the edge ring 113 on the worktable SG inside the conveying intermediate chamber MM1. Alternatively, the control unit CU may convey the edge ring 113 to, for example, the conveying intermediate chamber MM2 instead of the conveying intermediate chamber MM1.

[0072] In step S6, the control unit CU controls the conveying robot TR1 to receive the edge ring 113, which is placed on the worktable SG inside the conveying intermediate chamber MM1 in an attitude corrected based on the position offset calculated in step S2. In this embodiment, as Figure 7 As shown, the control unit CU controls the conveying robot TR1 to receive the edge ring 113 placed on the worktable SG inside the conveying intermediate chamber MM1 in a second posture. The second posture is one in which the fork-shaped component FK1 is offset 3mm to the right (in the +X direction) from the reference position and offset counterclockwise by 2° with the center position C1 of the fork-shaped component FK1 as the rotation center. After step S6, the control unit CU returns the process to step S2.

[0073] According to the conveying method described above, the image sensor IS acquires an image including the fork-shaped component FK1 and the edge ring 113 placed on the fork-shaped component FK1, and the control unit CU calculates the position offset of the edge ring 113, including the position offset in the horizontal and rotational directions, based on the image. Therefore, the edge ring 113 can be positioned without the need for a positioning device such as an aligner. This reduces the footprint of the processing system PS.

[0074] Furthermore, according to the conveying method of the embodiment, the control unit CU controls the conveying robot TR1 to place the edge ring 113 onto the worktable inside the processing module PM1 in an attitude corrected based on the calculated position offset. This allows for high-precision automatic replacement of the edge ring 113 without opening the processing module PM1 to the atmosphere.

[0075] Furthermore, according to the conveying method of the embodiment, when the control unit CU determines that the positional offset calculated based on the image exceeds the allowable range, it controls the conveying robot TR1 to temporarily place the edge ring 113 on the worktable SG of the conveying intermediate chamber MM1. Then, the control unit CU controls the conveying robot TR1 to receive the edge ring 113 placed on the worktable SG in the conveying intermediate chamber MM1 with an attitude corrected based on the positional offset calculated based on the image. Thus, even if the positional offset of the edge ring 113 relative to the fork-shaped component FK1 is large, the position of the edge ring 113 can be corrected. As a result, even if the positional offset of the edge ring 113 relative to the fork-shaped component FK1 is large, the edge ring 113 can be automatically replaced with high precision without opening the atmospheric flow of the processing module PM1.

[0076] Furthermore, in the above-described embodiment, steps S5 to S6 describe the use of transport intermediate chambers MM1 and MM2 as a buffer portion for temporarily placing the edge ring 113, but the present invention is not limited to this. For example, as Figure 8 As shown, a mounting section BF1 capable of mounting the edge ring 113 can also be provided in the vacuum delivery module TM1, and the mounting section BF1 can be used as a buffer section for temporarily mounting the edge ring 113.

[0077] Furthermore, the conveying method described in the embodiment can also be applied to other processing modules PM2 to PM4 connected to the same vacuum conveying module TM1 as processing module PM1.

[0078] Furthermore, the conveying method described in the embodiment can also be applied to cases where the edge ring 113 is conveyed to processing modules PM5 to PM8 connected to a vacuum conveying module TM2 that is different from the processing module PM1. In this case, the conveying robot TR1, which receives the edge ring 113 placed on the worktable within the load locking module LL1, places the edge ring 113 onto the worktable SG within the conveying intermediate chambers MM1 and MM2. Then, the conveying robot TR2 receives the edge ring 113 placed on the worktable SG within the conveying intermediate chambers MM1 and MM2. Then, the image sensor IS installed in the vacuum conveying module TM2 acquires an image including the fork-shaped component FK2 of the conveying robot TR2 and the edge ring 113 placed on the fork-shaped component FK2. Then, the control unit CU calculates the positional offset of the edge ring 113, including the positional offset in the horizontal and rotational directions, based on the image, and conveys the edge ring 113 into the processing modules PM5 to PM8 in an attitude corrected based on the calculated positional offset, and places it onto the worktable. Furthermore, in this case, for example, it is also possible to... Figure 8 As shown, a mounting section BF2 capable of mounting the edge ring 113 is provided in the vacuum delivery module TM2, and the mounting section BF2 is used as a buffer section for temporarily mounting the edge ring 113.

[0079] Furthermore, in the above-described conveying method, the case in which the edge ring 113 is conveyed in the processing module PM1 and placed on the worktable is described when the worktable in the processing module PM1 does not have the edge ring 113 placed on it, is described. However, the present invention is not limited to this.

[0080] For example, the conveying method described in this embodiment can also be applied to replacing a used edge ring 113 on a worktable placed within the processing module PM1 with a new edge ring 113. In this case, the control unit CU controls each part of the processing system PS to deliver the used edge ring 113 from the worktable placed within the processing module PM1, and then implements the conveying method described above, thereby enabling the replacement of the edge ring 113. The used edge ring 113 is delivered, for example, in the following manner.

[0081] First, the control unit CU opens the gate G1 between the vacuum transport module TM1 and the processing module PM1, and the gate G2 between the load locking module LL1 and the vacuum transport module TM1. Next, the control unit CU controls the transport robot TR1 to receive the used edge ring 113 placed on the worktable inside the processing module PM1, and places the edge ring 113 onto the worktable inside the load locking module LL1. Next, the control unit CU closes the gate G1 between the vacuum transport module TM1 and the processing module PM1, and the gate G2 between the load locking module LL1 and the vacuum transport module TM1. Next, the control unit CU switches the pressure inside the load locking module LL1 from vacuum to atmospheric pressure. Next, the control unit CU opens the gate G3 between the atmospheric transport module LM and the load locking module LL1. Next, the control unit CU uses the transport robot located in the atmospheric transport module LM to receive the used edge ring 113 placed on the worktable inside the load locking module LL1. Next, the control unit CU uses the transport robot to store the edge ring 113 in a container, for example, placed in the loading port LP1.

[0082] In addition, for example, the conveying method of the embodiment can also be applied to other consumable components and substrates such as the cover ring 114 and the top plate 121 of the upper electrode 12.

[0083] Furthermore, in the above embodiments, the conveying robots TR1 and TR2 are examples of conveying mechanisms.

[0084] The embodiments of the present invention are illustrative in all respects and should not be considered limiting. The above embodiments can be omitted, substituted, or modified in various ways without departing from the claims and their spirit.

Claims

1. A processing system, characterized in that, include: A chamber capable of conveying objects; A buffer section capable of temporarily holding the transported object; A conveying mechanism for conveying the object to the chamber; An image sensor that acquires images including the conveying mechanism and the conveyed object held by the conveying mechanism; as well as The computing unit calculates, based on the image acquired by the image sensor, the positional offset of the transported object relative to the transport mechanism, including the positional offset in the horizontal and rotational directions. The object to be transported is a ring-shaped component positioned around the substrate during plasma processing. The conveying mechanism stores the transport object, whose image has been acquired by the image sensor, in the buffer section, and the conveying mechanism receives the transport object from the buffer section in an attitude corrected based on the position offset calculated by the calculation unit.

2. The processing system as described in claim 1, characterized in that: The image sensor is positioned on the transport path of the transported object.

3. The processing system as described in claim 1 or 2, characterized in that: The conveying mechanism conveys the object into the cavity in an attitude corrected based on the position offset calculated by the calculation unit.

4. The processing system as described in claim 1 or 2, characterized in that: If the positional offset calculated by the calculation unit is within an acceptable range, the conveying mechanism conveys the object to be transported into the chamber in an orientation corrected based on the positional offset. If the position offset calculated by the calculation unit exceeds the allowable range, the conveying mechanism stores the conveying object of the image acquired by the image sensor in the buffer section, and the conveying mechanism receives the conveying object from the buffer section in an attitude corrected based on the position offset calculated by the calculation unit.

5. A method for conveying an object to a chamber using a conveying mechanism, characterized in that, include: The step of receiving the transported object using the conveying mechanism; The step of acquiring an image including the conveying mechanism and the conveyed object held by the conveying mechanism; Based on the acquired image, the step of calculating the positional offset of the transported object relative to the transport mechanism, including the positional offset in the horizontal and rotational directions; The step of housing the transported object held by the transport mechanism in the buffer section; and The conveying mechanism receives the conveyed object from the buffer section in an attitude corrected based on the position offset calculated in the step of calculating the position offset. The object to be transported is an annular component disposed around the substrate during plasma processing.

6. The conveying method as described in claim 5, characterized in that: It also includes the step of transporting the object to be transported into the cavity using the conveying mechanism in an attitude corrected based on the position offset calculated in the step of calculating the position offset.

Images