Display device

Abstract

A display device includes a display panel and at least one impact absorbing member, wherein the display panel includes a first area of a constant shape, the at least one impact absorbing member is located on a surface of the first area of the display panel, and the at least one impact absorbing member supports the display panel, wherein the at least one impact absorbing member includes a first member and a second member, wherein the first member is located on the first area of the display panel, and the second member faces the first member. The second member is connected to the first member and is disposed only on a portion of the first member.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0152283, filed on November 13, 2020, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments relate to a device, and to a display device. Background Technology

[0004] Mobile electronic devices have recently become widely used. Tablet PCs and small electronic devices such as mobile phones are now widely used as portable electronic devices.

[0005] Such portable electronic devices include display devices that support various functions and provide users with visual information such as images or videos. Recently, as the size of the components used to drive the display devices has decreased, the relevance of display devices in electronic devices has gradually increased, and structures that can be bent at predetermined angles from a flat state have been developed.

[0006] If the display device collides with another object, the display panel of the display device may be damaged.

[0007] It will be understood that this background section is partly intended to provide useful background for understanding the art. However, this background section may also include ideas, concepts, or knowledge that were not known or understood by one of ordinary skill in the art prior to the corresponding valid application date of the subject matter disclosed herein. Summary of the Invention

[0008] Typically, in the event of a collision between an object and the display panel of a display device, at least one pixel in the display panel may become a dark spot that may not function. One or more embodiments include a display device having a structure that absorbs the impact force during a collision with an object.

[0009] Other aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of the embodiments presented in this disclosure.

[0010] According to an embodiment, the display device may include a display panel and at least one shock absorber, wherein the display panel includes a first region of a constant shape, the at least one shock absorber is located on the surface of the first region of the display panel, the at least one shock absorber supports the display panel, and the at least one shock absorber may include a first member and a second member, wherein the first member is located on the first region of the display panel; the second member faces the first member, the second member is connected to the first member and is disposed only on a portion of the first member.

[0011] The display device may also include a heat sink disposed between at least one shock absorber and the display panel.

[0012] The heat sink and the first component of at least one impact absorber can be integral with each other.

[0013] The heat sink may include a first heat sink and a plurality of second heat sinks, wherein the first heat sink is disposed on the surface of the display panel, and the plurality of second heat sinks are spaced apart from each other and disposed on the first heat sink.

[0014] At least one shock absorber may include multiple shock absorbers, and the multiple shock absorbers may correspond to multiple second heat sinks respectively.

[0015] The first heat sink may include a deformable structure at the curved portion of the display panel.

[0016] At least one impact absorber may also include a third member facing the first member and the second member, the third member being connected to the second member.

[0017] At least one impact absorber may also include a spacer disposed on the surface of the first member.

[0018] In a plan view, the second component can be a closed loop.

[0019] The second component and the first component can be integrally formed, and the second component can be bent from the first component.

[0020] The surface of the first component can be spaced apart from the surface of the second component.

[0021] The second component may include a first side component and a second side component, wherein the first side component is located in a first direction, and the second side component is spaced apart from the first side component and is located in a second direction.

[0022] According to an embodiment, the display device may include a display panel, a heat sink, and an impact absorber. The heat sink is disposed on the surface of the display panel and connected to the display panel. The impact absorber faces the display panel and the heat sink is disposed between the impact absorber and the display panel. The impact absorber is disposed on the surface of the heat sink, and the surface of the heat sink may be different from the other surface of the heat sink that is connected to the display panel.

[0023] The display device may also include a panel protection component disposed between the heat sink and the display panel.

[0024] The display device may also include an optical functional layer disposed on the display panel.

[0025] The display device may also include a cover component disposed on the display panel.

[0026] The heat sink may include a first heat sink and a second heat sink, wherein the first heat sink is connected to the display panel, and the second heat sink is disconnected and separated at the bending axis region of the display device to be connected to the first heat sink.

[0027] The heat sink may include a deformable structure that can be folded or unfolded.

[0028] The impact-absorbing component can be designed not to overlap with the deformable structure of the heat sink.

[0029] The impact absorber may also include a first component and a second component, wherein the first component is located on a first area of ​​the display panel, the second component faces the display panel and the first component, the second component is connected to the first component and is disposed only on a portion of the first component.

[0030] According to an embodiment, the display device may include a display panel, a heat sink, and an impact absorber. The display panel includes an unfolded first region and a second region connected to the first region. The second region is foldable or rollable. The heat sink is connected to the display panel and includes a portion corresponding to the unfolded first region and a deformable structure corresponding to the second region. The impact absorber is located on the portion of the heat sink corresponding to the unfolded first region.

[0031] The unfolded first region may include two first regions spaced apart from each other, and a second region is disposed between the two first regions, and the impact absorber may be disconnected and correspond to the two first regions of the unfolded first region.

[0032] The shock absorber may include a portion corresponding to the boundary of the unfolded first region, which protrudes in a direction away from the display panel.

[0033] The shock absorber may include the space within the shock absorber.

[0034] The heat sink may include a first heat sink and a second heat sink, wherein the first heat sink is connected to the display panel, and the second heat sink is disconnected and separated at the region of the bending axis of the display device to be connected to the first heat sink.

[0035] The display device may also include a panel protection component disposed between the heat sink and the display panel.

[0036] The display device may also include a cover component disposed on the display panel.

[0037] Other aspects, features, and advantages of this disclosure will become more readily apparent from the accompanying drawings, claims, and detailed description. Attached Figure Description

[0038] The above and other aspects, features, and advantages of embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0039] Figure 1 This is a perspective view of the display device according to the embodiment;

[0040] Figure 2 This is an exploded perspective view of the display device according to the embodiment;

[0041] Figure 3A It is partially shown along the implementation method. Figure 1 A schematic cross-sectional view of the display device taken by line III-III';

[0042] Figure 3B It is partially shown along the implementation method. Figure 1 A schematic cross-sectional view of the display device taken by line III-III';

[0043] Figure 3C It is partially shown along the implementation method. Figure 1 A schematic cross-sectional view of the display device taken by line III-III';

[0044] Figure 3D It is partially shown along the implementation method. Figure 1 A schematic cross-sectional view of the display device taken by line III-III';

[0045] Figure 4A It is a plan view of a display panel according to one or more embodiments;

[0046] Figure 4B It is partially shown along Figure 4A The line IV-IV' intercepted Figure 4A A schematic cross-sectional view of the display panel;

[0047] Figure 5A and Figure 5B It is a driver Figure 4A and Figure 4B The equivalent circuit diagram of the pixel circuit of the sub-pixels in the display panel;

[0048] Figure 6A This is a perspective view of the impact-absorbing component according to the embodiment;

[0049] Figure 6B yes Figure 6A A schematic cross-sectional view of the impact-absorbing component;

[0050] Figure 7 This is a schematic cross-sectional view of the impact-absorbing member according to the embodiment;

[0051] Figure 8A This is a perspective view of the impact-absorbing component according to the embodiment;

[0052] Figure 8B yes Figure 8A A schematic cross-sectional view of the impact-absorbing component;

[0053] Figure 9A This is a perspective view of the impact-absorbing component according to the embodiment;

[0054] Figure 9B yes Figure 9A A schematic cross-sectional view of the impact-absorbing component;

[0055] Figure 9C This is a schematic cross-sectional view of the impact-absorbing member according to the embodiment;

[0056] Figure 10 This is a schematic cross-sectional view of the impact-absorbing member according to the embodiment;

[0057] Figure 11 This is a schematic cross-sectional view of the impact absorber according to the embodiment; and

[0058] Figure 12 This is a perspective view of the impact-absorbing component according to the embodiment. Detailed Implementation

[0059] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals always refer to the same elements. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only by reference to the accompanying drawings to explain the described aspects. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Throughout this disclosure, the expression “at least one of a, b, and c” means only a, only b, only c, or both a and b, both a and c, both b and c, or all of a, b, and c, or variations thereof.

[0060] The terms “and” and “or” can be used in the sense of combination or separation and can be understood as equivalent to “and / or”.

[0061] Because this disclosure takes into account various variations and many embodiments, the embodiments will be illustrated in the accompanying drawings and described in detail in the written description. Reference is made to the accompanying drawings, which are used to illustrate one or more embodiments, to obtain a full understanding of their advantages and the objects achieved by means of implementation. However, embodiments may take different forms and should not be construed as limited to the description set forth herein.

[0062] The embodiments will be described in more detail below with reference to the accompanying drawings. Unless otherwise specified in the drawing numbers, the same or corresponding components are given the same reference numerals, and redundant descriptions are omitted.

[0063] While terms such as "first," "second," etc., may be used to describe various components, these components should not be limited by the foregoing terms. The foregoing terms are used only to distinguish one component from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0064] Unless they have a distinctly different meaning in the context, a singular expression contains a plural expression.

[0065] In this specification, it will be understood that the terms “including,” “having,” and “comprising,” and variations thereof, are intended to indicate the presence of the features, figures, steps, actions, components, parts, or combinations thereof disclosed in the specification, and are not intended to exclude the possibility that one or more other features, figures, steps, actions, components, parts, or combinations thereof may be present or added.

[0066] It will be understood that when a layer, region, or component is referred to as being "formed" on another layer, region, or component, it can be formed directly or indirectly on that other layer, region, or component. That is, for example, there can be intermediate layers, regions, or components.

[0067] For ease of description, spatial relative terms such as “below,” “below,” “under,” “above,” and “upper” may be used herein to describe the relationship between one element or component and another, as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the spatial relative terms are intended to include different orientations of the device in use or operation. For example, in the case where the device shown in the drawings is flipped, a device located “below” or “under” another device may be placed “above” the other device. Thus, the exemplary term “below” can include both a lower position and an upper position. The device may also be oriented in other directions, and therefore, the spatial relative terms may be interpreted differently depending on the orientation.

[0068] The term "overlap" or "overlapped" means that a first object may be above or below a second object or on one side of a second object, and conversely, that a second object may be above or below a first object or on one side of a first object. Additionally, the term "overlap" may include layer, stack, face or facing, extend over, cover or partially cover, or any other suitable term as will be understood and appreciated by one of ordinary skill in the art.

[0069] When an element is described as “not overlapping” or “to not overlap” with another element, it may include elements spaced apart from each other, offset from each other, or set to be offset from each other, or any other suitable terminology as would be understood and appreciated by one of ordinary skill in the art.

[0070] The terms "face" and "facing" indicate that the first element can be directly or indirectly opposite the second element. In the case where a third element is inserted between the first and second elements, although the first and second elements still face each other, they can be understood as being indirectly opposite each other.

[0071] For ease of illustration, the dimensions of the components in the accompanying drawings may be exaggerated. In other words, since the dimensions and thicknesses of the components in the accompanying drawings may be arbitrarily shown for illustrative purposes, the following embodiments are not limited thereto.

[0072] The phrase "in a plan view" means viewing an object from the top, and the phrase "in a schematic sectional view" means viewing a cross-section of an object cut vertically from the side.

[0073] It will be understood that, in the specification, when an element (or region, layer, part, etc.) is referred to as being "on", "connected to", or "attached to" another element, it may be directly disposed on, directly connected to, or directly attached to the other element mentioned above, or an intervening element may be disposed between the element (or region, layer, part, etc.) and the other element.

[0074] It will be understood that the terms “connected to” or “linked to” can include physical connections or linkages or electrical connections or linkages.

[0075] The X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0076] When implementation methods can be different, a given process sequence can be performed differently than the described sequence. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0077] As used herein, “about” or “approximately” includes the stated value and means within an acceptable range of deviation from a particular value determined by a person skilled in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0078] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0079] Figure 1 This is a perspective view of the display device 1 according to the embodiment. Figure 2 This is an exploded perspective view of the display device 1 according to the embodiment. Figure 3A It is shown along the embodiment. Figure 1 A schematic cross-sectional view of a portion of the display device 1, taken by line III-III'.

[0080] refer to Figures 1 to 3ADisplay device 1 is a device for displaying video or still images, and can be used, for example, as a portable electronic device such as a mobile phone, smartphone, tablet PC, mobile communication terminal, electronic notebook, e-book, portable multimedia player (PMP), navigation terminal, ultra-mobile PC (UMPC), and can also be used, for example, as a display screen in various products such as televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices. Furthermore, display device 1 can be used in wearable devices such as smartwatches, smartwatch phones, glasses-type displays, and head-mounted displays (HMDs). Display device 1 can be used in the dashboard of a vehicle, the central information display in the vehicle's central instrument cluster or dashboard, a rearview mirror display replacing the vehicle's side mirrors, and a display in the back of the front seats in a vehicle serving as entertainment for the rear seats. For ease of description, Figure 1 and Figure 2 The display device 1 is shown being used as a smartphone.

[0081] The display device 1 may include a cover member 10, a display panel 50, a display circuit board (not shown), a heat sink 70, a display driver (not shown), a touch sensor driver (not shown), a main circuit board (not depicted), a battery (not shown), a lower cover 20, and an impact absorber 90.

[0082] In the following text, "upper part" refers to the direction in which the cover member 10 is located or positioned relative to the display panel 50 (i.e., the +Z direction), and "lower part" refers to the direction in which the lower cover 20 is located or positioned relative to the display panel 50 (i.e., the -Z direction). Furthermore, "left," "right," "up," and "down" indicate the directions when the display panel 50 is viewed in a plan view. For example, the left direction represents the -X direction, the right direction represents the +X direction, the up direction represents the +Y direction, and the down direction represents the -Y direction.

[0083] In a plan view, display device 1 can have a substantially rectangular shape. For example, as shown... Figure 1 As shown, the display device 1 can have a substantially rectangular planar shape, which has a short side in a first direction (X direction) and a long side in a second direction (Y direction). The corner where the short side in the first direction (X direction) and the long side in the second direction (Y direction) intersect each other can be rounded to have curvature, or can be right-angled or substantially right-angled. The substantially planar shape of the display device 1 is not limited to a substantially rectangular shape, but can have other substantially polygonal shapes, substantially elliptical shapes, or non-limiting shapes.

[0084] The display device 1 described above can have various shapes. For example, the display device 1 can have a shape that may be immutable. In an embodiment, the display device 1 can be at least partially folded. The display device 1 can be an inward-folding type in which the display area of ​​the display panel 50 is folded into two halves and the two halves of the display area face each other when the display device 1 is folded, or an outward-folding type in which the display area of ​​the display panel 50 is exposed to the outside when the display device 1 is folded. In an embodiment, the display device 1 can have a partially rolled-up portion. The case where the display device 1 is of the inward-folding type will be described below.

[0085] In the above configuration, display device 1 can be folded around the bending axis BAX. When display device 1 is folded around the bending axis BAX, its size can be reduced. When display device 1 is fully unfolded, the display area forms a flat surface and displays images to achieve a large screen.

[0086] Here, the display device 1 may include a first region 1A and a second region 2A, wherein the first region 1A has a fixed or constant shape, and the second region 2A is connected to the first region 1A and is foldable or unfoldable. Here, the first region 1A and the second region 2A can display images. The first region 1A may not be bent, but can provide an image on a flat surface. Furthermore, the second region 2A is connected to the first region 1A and can be folded so that the first region 1A is on the opposite side. When the display device 1 is folded, an image can be provided from the opposite surface of the display device 1. Conversely, when the display device 1 is unfolded, the display device 1 can provide an image only on one of the opposite surfaces.

[0087] The cover member 10 can be disposed on the display panel 50 to cover or overlap the upper surface of the display panel 50. In this way, the cover member 10 can protect the upper surface of the display panel 50.

[0088] The cover member 10 may include a transmissive cover DA10 and a light-shielding cover NDA10, wherein the transmissive cover DA10 corresponds to the display panel 50, and the light-shielding cover NDA10 corresponds to other areas outside the display panel 50. The light-shielding cover NDA10 may include an opaque material that blocks light. The light-shielding cover NDA10 may include a pattern that can be seen by the user when no image is displayed.

[0089] The cover member 10 may include a cover window 11 and a protective member 12. The cover window 11 may include a transparent material. Here, for example, the cover window 11 may include glass or a synthetic resin including a transparent material. The cover window 11 may include at least one layer. The protective member 12 may be disposed on the upper surface of the cover window 11 to prevent scratches when force is applied to the cover window 11. An opaque layer 12-1 may be disposed in a portion of the protective member 12. The opaque layer 12-1 may be disposed at the edge of the protective member 12. The opaque layer 12-1 may block light and may include a light-blocking layer, which will be described later.

[0090] A display panel 50 may be disposed below or beneath the cover member 10. The display panel 50 may overlap with the transmissive cover DA10 of the cover member 10. The display panel 50 may include a first surface 50-1 and a second surface 50-2, wherein a display area may be positioned or disposed on the first surface 50-1, and the second surface 50-2 is opposite to the display area. Here, the first surface 50-1 may provide an image, and the second surface 50-2 may not provide an image. In an embodiment, the first surface 50-1 may provide an image on a large portion of the first surface 50-1 (e.g., about 50% or more of the area of ​​the first surface 50-1), and the second surface 50-2 may provide an image only on a portion of the second surface 50-2. In the following description, for ease of description, the case in which an image is provided only on the first surface 50-1 will be described.

[0091] Display panel 50 may include a display area DA and a peripheral area NDA. The display area DA may represent the area where an image is displayed, and the peripheral area NDA may represent the area within it where an image may not be displayed (see reference). Figure 4A ).

[0092] Display panel 50 may be a light-emitting display panel that includes light-emitting elements. For example, display panel 50 may include an organic light-emitting display panel that uses organic light-emitting diodes that include organic light-emitting layers, a micro-LED display panel that uses micro-LEDs, a quantum dot light-emitting display panel that uses quantum dot light-emitting diodes that include quantum dot light-emitting layers, or an inorganic light-emitting display panel that uses inorganic light-emitting devices that include inorganic semiconductors.

[0093] An optical functional layer 42 may be disposed on the touch screen layer of the display panel 50. The optical functional layer 42 may include an anti-reflective layer. The anti-reflective layer can reduce the reflectivity of light (external light) incident on the display device 1 from the outside.

[0094] In one embodiment, the anti-reflection layer may include a polarizing film. The polarizing film may include a linear polarizer and a phase retardation film such as a λ / 4 (quarter-wave) plate. The phase retardation film may be disposed on the touchscreen layer, and the linear polarizer may be disposed on the phase retardation film.

[0095] In an implementation, the anti-reflective layer may include a filter layer, wherein the filter layer includes a black matrix and color filters. Color filters may be arranged or configured taking into account the color of light emitted from each pixel in the display device 1. For example, the filter layer may include one or more red color filters, one or more green color filters, or one or more blue color filters.

[0096] In an implementation, the antireflective layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, can destructively interfere with each other, and therefore, the reflectivity of external light can be reduced.

[0097] A cover member 10 may be disposed on the optical functional layer 42. The cover member 10 may be attached to the optical functional layer 42 by means of a transparent adhesive member such as an optically transparent adhesive (OCA) film.

[0098] A panel protection member 41 may be disposed below or beneath the display panel 50. The panel protection member 41 may be attached to the lower surface of the display panel 50 by means of an adhesive member. The adhesive member may include a pressure-sensitive adhesive (PSA). The panel protection member 41 may include at least one of a light-absorbing layer 41-1, a pad layer 41-2, and a heat dissipation layer, wherein the light-absorbing layer 41-1 is used to absorb light incident from the outside, the pad layer 41-2 is used to absorb impacts from the outside, and the heat dissipation layer is used to effectively dissipate heat from the display panel 50.

[0099] The light-absorbing layer 41-1 may be disposed below or beneath the display panel 50. The light-absorbing layer 41-1 prevents light transmission, thus preventing components (e.g., display circuit boards, etc.) below or beneath the light-absorbing layer 41-1 from being visible from above the display panel 50. The light-absorbing layer 41-1 may comprise a light-absorbing material such as black pigment or black dye. In the following description, for ease of description, examples in which the panel protection member 41 may comprise a light-absorbing layer 41-1 and a padding layer 41-2 will be described in detail.

[0100] A first flexible film may be provided at one edge of the display panel 50 in the peripheral NDA area. The first flexible film may be substantially bent to the lower portion of the display panel 50, and a display circuit board may be disposed on the lower surface of the panel protection member 41. The display circuit board may be attached and fixed to the lower surface of the panel protection member 41. The adhesive component may include a pressure-sensitive adhesive.

[0101] A heat sink 70 may be disposed below or beneath the panel protection member 41. The heat sink 70 can transfer heat generated from at least one of the display panel 50 and the digitizer. The heat sink 70 may comprise a metal with good heat transfer efficiency.

[0102] The heat sink 70 may include a deformable structure 70-2. Here, the deformable structure 70-2 may be formed as a substantially convex-concave structure. In one embodiment, the deformable structure 70-2 may be of a chain type. In another embodiment, the deformable structure 70-2 may have a shape in which members having a substantially triangular cross-section can be connected to each other. The deformable structure 70-2 may include all kinds of foldable shapes. Here, the heat sink 70 may have a thin film shape including at least one of a metal with high thermal conductivity (e.g., copper, nickel, ferrite, silver, etc.), graphite, and carbon nanotubes.

[0103] A digitizer (not shown) may be disposed below or beneath the display panel 50. Here, for example, the digitizer may include a patterned layer to sense signals input from an external electronic pen. For example, the digitizer may sense the intensity or direction of the signal input from the electronic pen. The digitizer may be electrically connected to the main circuit board. Here, when a digitizer is provided, it may be disposed between the heat sink 70 and the panel protection member 41.

[0104] When the digitizer is mounted on the display panel 50, a support (not depicted) for supporting the display panel 50 may be provided below or beneath the digitizer. The support may be made of plastic or metal, or both plastic and metal.

[0105] When the above-mentioned bracket is provided, a heat sink 70 can be provided on the bracket. Here, the heat sink 70 can be connected to or attached to the bracket, or the heat sink 70 and the bracket can be integrated with each other.

[0106] An impact absorber 90 may be provided below or beneath the heat sink 70. Here, the impact absorber 90 may be located only in or provided in the first region 1A. In the event, for example, an object falls onto the display panel 50, the impact absorber 90 may partially absorb the impact applied to the display panel 50.

[0107] Specifically, in cases such as when an object falls onto the display device 1 or when a user applies excessive force to the display device 1, an impact force may be applied to the display panel 50. For example, various electrodes, thin-film transistors, wiring, and various layers in the display panel 50 may be damaged. One or more pixels in the display panel 50 may not emit light and may not emit light to the outside according to a signal. For example, the display panel 50 may have dark spots on at least a portion of itself that may not emit light. To prevent dark spots, the impact absorber 90 partially absorbs the impact applied from the outside, and thus, the transmission of the impact to the display panel 50 can be prevented. Furthermore, for example, if the main circuit board is disposed on the bottom surface of the impact absorber 90, the impact absorber 90 can absorb the impact applied to the main circuit board.

[0108] The main circuit board and battery (not shown) may be disposed below or beneath the shock absorber 90 or the support. The main circuit board may include a printed circuit board or a flexible printed circuit board.

[0109] The main circuit board may include a main processor (not shown), a camera device (not shown), a main connector (not shown), and components (not shown). The main processor may include an integrated circuit. The camera device may be disposed on both the upper and lower surfaces of the main circuit board, and each of the main processor and the main connector may be disposed on one of the upper and lower surfaces of the main circuit board.

[0110] The main processor can control all functions of the display device 1. For example, the main processor can output digital video data to the display driver via the display circuit board, enabling the display panel 50 to display images. Furthermore, the main processor can receive sensing data input from the touch sensor driver. The main processor can determine whether a user has touched the device based on the sensing data and can perform operations corresponding to a direct or near touch. For example, the main processor can calculate the user's touch coordinates by analyzing the sensing data and can execute applications or perform operations indicated by the icon touched by the user. The main processor may include an application processor, a central processing unit, or a system-on-a-chip (SoC) including integrated circuits.

[0111] A camera device can process image frames of still images or moving pictures acquired by an image sensor in camera mode and output the processing results to a main processor. The camera device may include at least one of a camera sensor (e.g., CCD, CMOS, etc.), a light sensor (or image sensor), and a laser sensor. The camera device may be connected to the image sensor in areas where components overlap to process images input to the image sensor.

[0112] After passing through the cable hole in the bracket, the cable can be connected to the main connector, and thus the main circuit board can be electrically connected to the display circuit board.

[0113] In addition to the main processor, camera device, and main connector, the main circuit board may also include at least one wireless communication unit, at least one input unit, at least one sensor unit, at least one output unit, at least one interface unit, memory, and power supply.

[0114] The wireless communication unit may include a broadcast receiving module, a mobile communication module, a wireless Internet module, a short-range communication module, and a location information module.

[0115] The broadcast receiving module receives broadcast signals and / or broadcast-related information from an external broadcast management server via a broadcast channel. The broadcast channel may include satellite channels and terrestrial channels.

[0116] For example, a mobile communication module transmits wireless signals to at least one of a base station, an external terminal, and a server on a mobile communication network, or receives wireless signals from at least one of a base station, an external terminal, and a server on a mobile communication network, wherein the mobile communication network is established according to technical standards or communication methods used for mobile communication (e.g., Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), CDMA2000, Enhanced Voice Data Optimized or Enhanced Voice Data Only (EV-DO), Wideband CDMA (WCDMA), High-Speed ​​Downlink Packet Access (HSDPA), High-Speed ​​Uplink Packet Access (HSUPA), Long Term Evolution (LTE), Advanced Long Term Evolution (LED-A)). Wireless signals may include voice call signals, video call signals, or various types of data transmitted or received according to text or multimedia messages.

[0117] A wireless internet module refers to a module used for accessing the wireless internet. A wireless internet module can transmit or receive wireless signals in a communication network according to wireless internet technologies. For example, wireless internet technologies may include, for instance, Wireless LAN (WLAN), Wi-Fi, Wi-Fi Direct, and the Digital Living Network Alliance (DLNA).

[0118] Short-range communication modules can utilize technologies selected from Bluetooth. TMThe short-range communication module supports at least one of the following: Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee, Near Field Communication (NFC), Wi-Fi, Wi-Fi Direct, and Wireless Universal Serial Bus (USB). The short-range communication module can support wireless communication between display device 1 and a wireless communication system, between display device 1 and another electronic device, or between display device 1 and a network in which another electronic device (or an external server) can be located or configured. The wireless local area network may include a wireless personal area network. The other electronic device may include a wearable device that exchanges (or is linkable to) display device 1.

[0119] The location information module is used to obtain the location (or current location) of display device 1, and examples of the location information module may include a Global Positioning System (GPS) module or a Wi-Fi module. For example, when using a GPS module, display device 1 can obtain its location by utilizing signals transmitted from GPS satellites. Furthermore, when using a Wi-Fi module, display device 1 can obtain its location based on information from a wireless access point (AP) that transmits wireless signals to or receives wireless signals from the Wi-Fi module. The location information module can be used to obtain the location (or current location) of display device 1, and is not limited to modules used to directly calculate or obtain the location of display device 1.

[0120] The input unit may include an image input unit (such as a camera device) for inputting image signals, an audio input unit (such as a microphone) for inputting audio signals, and an input device for receiving information from a user.

[0121] For example, a camera device can process image frames, such as still images and moving pictures, acquired by an image sensor in video call mode or shooting mode. The processed image frames can be displayed on a display panel 50 or stored in memory.

[0122] The microphone processes external sound signals as electrical speech data. The speech data can be used differently depending on the function performed by display device 1 (or the application being executed). The microphone can use various noise cancellation algorithms to eliminate noise generated when receiving external sound signals.

[0123] The main processor can control the operation of the display device 1 to correspond to information input via an input device. The input device may include, for example, a mechanical input unit (such as a dome switch, a soft disk, a roller switch, or a button located on or disposed on the bottom or side surface of the display device 1) or a touch input unit. The touch input unit may include a touchscreen layer of the display panel 50.

[0124] The sensor unit may include one or more sensors that sense at least one of information in the display device 1, information about the peripheral environment of the display device 1, and user information, and generate a sensing signal corresponding to the sensed information. Based on the sensing signal, the main processor may control the driving or operation of the display device 1, process data, or perform functions or operations related to applications installed on the display device 1. The sensor unit may include at least one selected from proximity sensors, illuminance sensors, accelerometers, magnetometers, G-sensors, gyroscopes, motion sensors, RGB sensors, infrared (IR) sensors, fingerprint scanners, ultrasonic sensors, optical sensors, battery current meters, environmental sensors (e.g., barometers, hydrometers, thermometers, radiation detection sensors, thermal detection sensors, gas detection sensors, etc.) and chemical sensors (e.g., electronic noses, healthcare sensors, biosensors, etc.).

[0125] A proximity sensor is a sensor used to sense the presence of an object approaching or surrounding a predetermined detection surface without physical contact, by utilizing electromagnetic fields or infrared light. Examples of proximity sensors include transmissive photoelectric sensors, direct-reflective photoelectric sensors, specular-reflective photoelectric sensors, radio frequency oscillation proximity sensors, capacitive proximity sensors, magnetic proximity sensors, and infrared proximity sensors. In addition to proximity touch, a proximity sensor can also sense proximity touch patterns, such as proximity touch distance, proximity touch direction, proximity touch speed, proximity touch time, proximity touch position, and proximity touch movement. The main processor processes data (or information) corresponding to the proximity touch operation or proximity touch pattern sensed by the proximity sensor and can control the visual information corresponding to the processed data to be displayed on the display panel 50.

[0126] Ultrasonic sensors can identify the position of an object. The main processor can calculate the object's position using information sensed by optical sensors and multiple ultrasonic sensors. Since the speeds of light and ultrasound are different, the object's position can be calculated using the time it takes for light to reach the optical sensor and the time it takes for ultrasound waves to reach the ultrasonic sensor.

[0127] The output unit generates outputs related to vision, hearing, or touch, and may include at least one selected from the display panel 50, the sound output unit, the haptic module, and the optical output unit.

[0128] Display panel 50 displays (outputs) information processed in display device 1. For example, display panel 50 may display information about the execution screen of an application running on display device 1, or display user interface (UI) or graphical user interface (GUI) information based on the execution screen information. Display panel 50 may include a display layer and a touch screen layer, wherein the display layer is used to display images and the touch screen layer is used to sense touch input from the user. Accordingly, display panel 50 can be used as one of the input devices providing an input interface between display device 1 and the user, and simultaneously as one of the output units providing an output interface between display device 1 and the user.

[0129] For example, the sound output unit can output sound data received from the wireless communication unit or stored in the memory in call signal receiving, call mode, recording mode, voice recognition mode, or broadcast receiving mode. The sound output unit outputs sound signals related to the functions performed on the display device 1 (e.g., call signal receiving sound, message receiving sound, etc.). The sound output unit may include a receiver and a speaker. At least one of the receiver and speaker may be a sound generating device attached to the lower part of the display panel 50 to vibrate the display panel 50 and output sound. The sound generating device may include a piezoelectric element or piezoelectric actuator that contracts and expands according to an electrical signal, or an exciter that generates magnetic force by utilizing a voice coil to vibrate the display panel 50.

[0130] The haptic module generates various tactile effects that users can perceive. It can provide vibrations as tactile effects. The intensity and pattern of the vibrations generated by the haptic module can be controlled by user selection or settings of the main processor. For example, the haptic module can synthesize and output different vibrations, or output different vibrations sequentially. The haptic module can produce various tactile effects, such as the arrangement of pins moving vertically to contact the skin surface, air injection or suction through injection or suction ports, light touches on the skin surface, electrode contact, effects caused by electromagnetic excitation, and effects caused by reproducing cooling and heating sensations using heat-absorbing or heat-releasing elements. For example, in addition to tactile effects through contact or direct contact, the haptic module can also be implemented to allow users to perceive tactile effects through muscle sensation (such as fingers or arms).

[0131] The optical output unit outputs a signal to notify of an event by utilizing light from a light source. Examples of events occurring on display device 1 include message reception, call signal reception, missed calls, alarms, calendar notifications, email reception, and information reception via an application. The signal output of the optical output unit can be implemented when display device 1 emits light of a single or multiple colors through its front or bottom surface. The signal output can be terminated when display device 1 senses that the user has recognized the event.

[0132] The interface unit represents a path for electrical connection to various external devices of the display device 1. The interface unit may include at least one selected from a wired or wireless headset port, an external charger port, a wired or wireless data port, a memory card port, a port for electrical connection to a device including an identification module, an audio input / output (I / O) port, a video I / O port, and a headphone port. In response to the electrical connection between the external device and the interface unit, the display device 1 can perform appropriate control regarding the external device electrically connected to it.

[0133] The memory stores data supporting various functions of the display device 1. The memory may store multiple applications driven on the display device 1, data used to operate the display device 1, and instructions. At least one of the multiple applications can be downloaded from an external server via wireless communication. The memory may store applications used to operate the main processor and may temporarily store input or output data (e.g., data such as phone books, messages, still images, videos, etc.). Furthermore, the memory may store tactile data for vibrations of various patterns provided to the tactile module, and audio data regarding various sounds provided to the sound output unit. The memory may include at least one type of storage medium selected from flash memory, hard disk, solid-state drive (SSD), silicon disk drive (SSD), multimedia card micro, card type memory (e.g., SD or XD memory), random access memory (RAM), static RAM (SRAM), read-only memory (ROM), electrically erasable programmable ROM (EEPROM), programmable ROM (PROM), magnetic storage, magnetic disk, and optical disk.

[0134] Under the control of the main processor, the power supply supplies power to each of the components included in the display device 1 by receiving external and internal power. The power supply may include a battery. Furthermore, the power supply may include a connection port, and the connection port may be implemented as an example of an interface unit electrically connected to an external charger for supplying power to charge the battery. For example, the power supply may be implemented to charge the battery wirelessly without using the connection port. The battery may receive power from an external wireless power transmission device via at least one of an inductive coupling method based on magnetic induction and a magnetic resonance coupling method based on electromagnetic resonance. The battery may be configured not to overlap with the main circuit board in the third direction (Z direction). The battery may overlap with the battery hole of the bracket.

[0135] A lower cover 20 may be disposed below or beneath the main circuit board and battery. The lower cover 20 may be connected to or coupled to a bracket for fixation. The lower cover 20 may form the lower appearance of the display device 1. The lower cover 20 may include plastic, metal, or both plastic and metal. The lower cover 20 may include a foldable connecting structure 21 in the second region 2A. The connecting structure 21 may have various shapes. For example, the connecting structure 21 may be hinged to a portion of the lower cover 20 in the first region 1A. In embodiments, the connecting structure 21 may be rotatably connected to a portion of the lower cover 20 in the first region 1A. The connecting structure 21 is not limited to the above examples, and the connecting structure 21 may include all kinds of structures connecting a portion of the lower cover 20 in the first region 1A, such that the lower cover 20 is foldable.

[0136] The display device 1 described above may include an adhesive layer (not shown). For example, a first adhesive layer 81 may be present between the cover member 10 and the optical functional layer 42. A second adhesive layer (not shown) may be present between the display panel 50 and the panel protection member 41. A third adhesive layer (not shown) may be present between the panel protection member 41 and the heat sink 70. The third adhesive layer may be divided and separated. Here, the bending shaft BAX may be located in a separated portion of the third adhesive layer or in an area where the third adhesive layer may not be provided. Since the third adhesive layer may not be provided on the portion where the bending shaft BAX can be positioned or provided, the third adhesive layer may not interfere with the folding or unfolding of the display device 1.

[0137] Figure 3B It is shown along the embodiment. Figure 1 A schematic cross-sectional view of a portion of the display device 1, taken by line III-III'.

[0138] refer to Figure 3B Display device 1 can be with Figures 1 to 3A The display device 1 is similar. In the following description, the above references will be used. Figures 1 to 3AThe differences in the described display device 1.

[0139] The heat sink 70 may include a first heat sink 71 and a second heat sink 72.

[0140] The first heat sink 71 may be on the bottom surface of the panel protection member 41 or on the bottom surface of the digitizer (not shown). Here, the first heat sink 71 may have various structures depending on whether the display device 1 is folded and the type of folding of the display device 1. For example, if the display device 1 is not foldable, the first heat sink 71 may be plate-type, wherein the shape of the plate-type may be immutable. In an embodiment, if the display device 1 is foldable, the first heat sink 71 may include a deformable structure 71-1. If the display device 1 is foldable, the deformable structure 71-1 may have a variable shape or a variable length. For example, the deformable structure 71-1 may have a substantially convex-concave shape and linkages rotatably connected to each other. If the display device 1 is folded, the deformable structure 71-1 described above may be bent about a bending axis BAX. The deformable structure 71-1 described above may be symmetrical about the bending axis BAX. Apart from the deformable structure 71-1, the remaining portion of the first heat sink 71 may have a substantially plate-shaped shape, wherein the plate-shaped shape has a substantially flat surface.

[0141] The second heat sink 72 may be located on the lower surface of the first heat sink 71. Here, the second heat sink 72 may be in contact with or directly contact with the first heat sink 71, or it may be attached to the first heat sink 71 via an adhesive with good heat transfer efficiency. The second heat sink 72 may be disconnected. For example, the second heat sink 72 may be disconnected and separated at the area where the bending axis BAX is located. The second heat sink 72 may not interfere with the folding of the display device 1.

[0142] The first heat sink 71 and the second heat sink 72 may be made of different materials. For example, the first heat sink 71 may include graphite, carbon nanotubes, and the second heat sink 72 may include a thin film of metal such as copper, nickel, ferrite, and silver that can shield electromagnetic waves and has good thermal conductivity.

[0143] The bottom surface of the second heat sink 72 may have an impact absorber 90. Here, the impact absorber 90 may be located only in the first region 1A. The impact absorber 90 may be provided on the non-folded portion of the display device 1 to absorb impacts applied thereto. As described above, when an impact is applied to the display device 1, the impact absorber 90 partially absorbs the impact to prevent the display panel 50 from breaking or being damaged.

[0144] Figure 3C It is shown along the embodiment. Figure 1A schematic cross-sectional view of a portion of the display device 1, taken by line III-III'.

[0145] refer to Figure 3C Display device 1 can be with Figures 1 to 3A The display device 1 is similar. In the following description, the above references will be used. Figures 1 to 3A The differences in the described display device 1.

[0146] The heat sink 70 may include a heat sink body 70-1 and a deformable structure 70-2, wherein the heat sink body 70-1 is in a first region 1A and the deformable structure 70-2 is in a second region 2A. Here, the heat sink body 70-1 may have a substantially flat plate shape. The deformable structure 70-2 may have a structure that does not interfere with the movement of the display device 1 when it is rolled up. For example, the deformable structure 70-2 may include rods that are separated from each other. In an embodiment, the deformable structure 70-2 may have a shape in which structures with triangular cross-sections having sharp lower sides are connected to each other. Here, the deformable structure 70-2 is not limited to this and may include any type of structure that does not interfere with the movement of the display device 1 when the second region 2A of the display device 1 is rolled up. In an embodiment, although not shown in the figures, the display device 1 may have a structure in which the second region 2A is located on the opposite side of the first region 1A. The deformable structure 70-2 may be connected to the heat sink body 70-1 so as to extend from the opposite side of the heat sink body 70-1. However, for ease of description, an example in which the deformed structure 70-2 is connected to only one side of the heat sink body 70-1 will be described.

[0147] In the above case, the heat sink body 70-1 may have an impact absorption element 90. The impact absorption element 90 may correspond to the first region 1A.

[0148] In the display device 1 described above, although not shown in the accompanying drawings, the heat sink 70 may include a first heat sink (not shown) and a second heat sink. The first heat sink may have the same characteristics as... Figure 3C The heat sink 70 shown has a substantially the same shape, and the second heat sink may have the same shape as... Figure 3B The second heat sink 72 shown has a substantially the same shape. An impact absorber 90 may be provided on the bottom surface of the second heat sink 72. As described above, when an impact is applied to the display device 1, the impact absorber 90 partially absorbs the impact to prevent breakage or damage to the display panel 50.

[0149] Figure 3D It is shown along the embodiment. Figure 1 A schematic cross-sectional view of a portion of the display device 1, taken by line III-III'.

[0150] refer to Figure 3D Display device 1 can be with Figures 1 to 3A The display device 1 is similar. In the following description, the above references will be used. Figures 1 to 3A The differences in the described display device 1.

[0151] In the above-described manner, display device 1 can be in an unfolded state. For example, display device 1 may consist only of the first region 1A.

[0152] In the above case, a heat sink 70 may be provided on the bottom surface of the display panel 50. The heat sink 70 may be formed as a non-foldable plate.

[0153] In the above-described case, an impact-absorbing member 90 may be provided on the bottom surface of the heat sink 70. There may be one impact-absorbing member 90 corresponding to the first region 1A. In the embodiment, although not shown in the drawings, there may be two or more impact-absorbing members 90, and as... Figures 3A to 3C As shown, two or more impact absorbers 90 may be spaced apart from each other to correspond to the first region 1A. In the following description, for ease of description, the case of having only one impact absorber 90 will be described in detail.

[0154] As described above, when an impact is applied to the display device 1, the impact absorber 90 partially absorbs the impact in order to prevent the display panel 50 from breaking or being damaged.

[0155] Figure 4A yes Figure 2 A plan view of the display panel 50. Figure 4B It shows along Figure 4A The line IV-IV' intercepted Figure 4A A schematic cross-sectional view of a portion of the display panel 50.

[0156] refer to Figure 4A and Figure 4B The display panel 50 may include a rigid display panel that is not easily bent, or a flexible display panel that is easily bendable, foldable, and rollable. For example, the display panel 50 may include a foldable display panel, a curved display panel with a curved display surface, a curved display panel with a curved area outside the display surface, a rollable and expandable display panel, and a stretchable display panel.

[0157] The display panel 50 may be transparent, allowing objects or backgrounds positioned below or beneath the display panel 50 to be viewed from above it. For example, the display panel 50 may include a reflective display panel that can reflect objects or backgrounds above it.

[0158] The first flexible film 54 can be attached to the edge of the display panel 50. One side of the first flexible film 54 can be attached to one edge of the display panel 50 via an anisotropic conductive film. The first flexible film 54 can be bent.

[0159] A display driver 52 may be present on the first flexible film 54. The display driver 52 receives control signals and electrical voltages, and can generate and output signals and voltages for driving the display panel 50. The display driver 52 may include an integrated circuit (IC).

[0160] The display circuit board 51 can be attached to the opposite side of the first flexible film 54. The opposite side of the first flexible film 54 can be attached to the upper surface of the display circuit board 51. The display circuit board 51 may include a flexible printed circuit board (FPCB), a rigid printed circuit board (PCB) with little bending, or a composite printed circuit board including both a rigid PCB and an FPCB.

[0161] A touch sensor driver 53 may be present on the display circuit board 51. The touch sensor driver 53 may include an integrated circuit. The touch sensor driver 53 may be attached to the display circuit board 51. The touch sensor driver 53 may be electrically connected via the display circuit board 51 to touch electrodes in the touch screen layer of the display panel 50.

[0162] For example, the touchscreen layer of display panel 50 can sense touch input from a user by utilizing at least one of various touch methods, such as resistive overlay and capacitive overlay. For example, in the case where the touchscreen layer of display panel 50 senses touch input from a user using a capacitive overlay method, touch sensor driver 53 applies a drive signal to the drive electrode in the touch electrode and determines whether there is a touch from the user by sensing the voltage charged in the mutual capacitance between the drive electrode and the sensing electrode using the sensing electrode in the touch electrode. The user's touch can include a touch and a proximity touch. A touch can mean that the user's finger or an object such as a pen touches or directly contacts the cover member 10 on the touchscreen layer. A proximity touch can mean that the user's finger or an object such as a pen approaches the cover member 10 but does not directly contact the cover member 10; for example, it can mean hovering. Touch sensor driver 53 transmits sensor data to the main processor based on the sensed voltage, and the main processor analyzes the sensor data to calculate the touch coordinates where the touch input occurred.

[0163] Additionally, the display circuit board 51 may also have a power supply for supplying driving voltage, which is used to drive the pixels, scan drivers, and display driver 52 of the display panel 50. For example, the power supply may be integrated with the display driver 52, and the display driver 52 and the power supply may be configured as a single integrated circuit.

[0164] Substrate 100 may include insulating materials such as glass, quartz, and polymer resins. Substrate 100 may include a rigid substrate or a flexible substrate, wherein the flexible substrate may be bendable, foldable, and rollable. For example, substrate 100 may include polymer resins such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, and cellulose acetate propionate. Substrate 100 may have a multilayer structure comprising a layer including the polymer resins described above and an inorganic layer (not shown). For example, substrate 100 may include the two layers comprising polymer resins and an inorganic barrier layer disposed between the two layers.

[0165] A display layer may be present on the substrate 100. The display layer may include pixels and may display images. The display layer may include a circuit layer including thin-film transistors, a display element layer including display elements, and a packaging component for encapsulating the display element layer.

[0166] The display layer may include a display area DA and a peripheral area NDA. The display area DA may be an area in which pixels are set to display an image. The peripheral area NDA may be located outside the display area DA and may not display an image. The peripheral area NDA may surround or be adjacent to the display area DA. The peripheral area NDA may represent the area from the outside of the display area DA to the edge of the display panel 50. For example, in addition to pixels, the display area DA may also include pixel circuitry, scan lines, data lines, and power lines, wherein the pixel circuitry is used to drive the pixels, and the scan lines are electrically connected to the pixel circuitry. For example, the peripheral area NDA may include a scan driver and fan-out lines, wherein the scan driver is used to apply scan signals to the scan lines, and the fan-out lines electrically connect the data lines to the display driver.

[0167] A touchscreen layer may be present on the display layer. The touchscreen layer may include touch electrodes and may be a layer for sensing whether a user is touching the screen. The touchscreen layer may be disposed on or directly disposed on the encapsulation components of the display layer. For example, the touchscreen layer may be formed separately and may be attached or bonded to the encapsulation components of the display layer via an adhesive layer such as optically clear adhesive (OCA).

[0168] As described above, the display panel 50 may include a display area DA and a peripheral area NDA. Here, the display area DA contains sub-pixels to realize an image, and the peripheral area NDA may contain wiring. The display panel 50 may include a substrate 100, a buffer layer 111, a circuit layer PCL, and a display element layer EDL that can be stacked on top of each other.

[0169] As described above, substrate 100 may include insulating materials such as glass, quartz, and polymer resin. Substrate 100 may include a rigid substrate or a flexible substrate, wherein the flexible substrate may be bendable, foldable, and rollable.

[0170] A buffer layer 111 is disposed on the substrate 100 to reduce or prevent the penetration of impurities, moisture, or external air from the lower portion of the substrate 100, and to provide a flat surface on the substrate 100. The buffer layer 111 may comprise inorganic materials, organic materials, or inorganic-organic composite materials such as oxide or nitride materials, and may have a single-layer or multi-layer structure comprising inorganic and organic materials. A barrier layer (not shown) may also be disposed between the substrate 100 and the buffer layer 111 to prevent the penetration of external air. In embodiments, the buffer layer 111 may comprise silicon dioxide (SiO2) or silicon nitride (SiN). x The buffer layer 111 may include a first buffer layer 111a and a second buffer layer 111b laminated therein.

[0171] The circuit layer PCL can be disposed on the buffer layer 111 and may include a pixel circuit PC, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 115, and a planarization layer 117. The first gate insulating layer 112, the second gate insulating layer 113, and the interlayer insulating layer 115 can be collectively referred to as insulating layer IIL. The pixel circuit PC may include a thin-film transistor (TFT) and a storage capacitor Cst.

[0172] A thin-film transistor (TFT) may be disposed on the buffer layer 111. The TFT may include a first semiconductor layer A1, a first gate electrode G1, a first source electrode S1, and a first drain electrode D1. The TFT can be electrically connected to an organic light-emitting diode (OLED) and can drive the OLED.

[0173] The first semiconductor layer A1 is on the buffer layer 111 and may include polycrystalline silicon. In some embodiments, the first semiconductor layer A1 may include amorphous silicon. In some embodiments, the first semiconductor layer A1 may include an oxide of at least one selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The first semiconductor layer A1 may include a channel region and impurity-doped source and drain regions.

[0174] The first gate insulating layer 112 may cover the first semiconductor layer A1 or overlap with the first semiconductor layer A1. The first gate insulating layer 112 may include materials such as silicon dioxide (SiO2) and silicon nitride (SiN). x), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium dioxide (TiO2), tantalum pentoxide (Ta2O5), hafnium dioxide (HfO2), and zinc oxide (ZnO) x (It may be an inorganic insulating material, such as ZnO and / or ZnO2). The first gate insulating layer 112 may have a single-layer or multi-layer structure including the inorganic insulating material.

[0175] The first gate electrode G1 is located on the first gate insulating layer 112, overlapping the first semiconductor layer A1. The first gate electrode G1 may include, for example, molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may have a single-layer or multi-layer structure. As an example, the first gate electrode G1 may have a single layer including Mo.

[0176] The second gate insulating layer 113 may cover the first gate electrode G1 or overlap with the first gate electrode G1. The second gate insulating layer 113 may include materials such as silicon dioxide (SiO2) or silicon nitride (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium dioxide (TiO2), tantalum pentoxide (Ta2O5), hafnium dioxide (HfO2), and zinc oxide (ZnO) x (It can be an inorganic insulating material, such as ZnO and / or ZnO2). The second gate insulating layer 113 can have a single-layer or multi-layer structure including the inorganic insulating material.

[0177] The second gate insulating layer 113 may have a first upper electrode CE2 of a storage capacitor Cst.

[0178] In the display area DA, the first upper electrode CE2 may overlap with the first gate electrode G1 disposed below it. The first gate electrode G1 and the first upper electrode CE2, which overlap each other and have a second gate insulating layer 113 between them, can form a storage capacitor Cst. The first gate electrode G1 may be the first lower electrode CE1 of the storage capacitor Cst.

[0179] The first upper electrode CE2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu) in a single-layer or multi-layer structure.

[0180] The interlayer insulating layer 115 may cover the first upper electrode CE2 or overlap with it. The interlayer insulating layer 115 may include materials such as silicon dioxide (SiO2) or silicon nitride (SiN). x), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium dioxide (TiO2), tantalum pentoxide (Ta2O5), hafnium dioxide (HfO2), and zinc oxide (ZnO) x (It may be an insulating material of ZnO and / or ZnO2). The interlayer insulation layer 115 may have a single-layer or multi-layer structure including inorganic insulating materials.

[0181] An interlayer insulating layer 115 has a first source electrode S1 and a first drain electrode D1. The first source electrode S1 and the first drain electrode D1 may comprise conductive materials such as molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may have a single-layer or multi-layer structure comprising the aforementioned materials. For example, the first source electrode S1 and the first drain electrode D1 may each have a multi-layer structure comprising Ti / Al / Ti.

[0182] The planarization layer 117 may cover the first source electrode S1 and the first drain electrode D1, or overlap with the first source electrode S1 and the first drain electrode D1. The planarization layer 117 may have a flat upper surface, such that the pixel electrode 121 disposed or disposed thereon can be planarized.

[0183] Planarization layer 117 may comprise organic or inorganic materials and may have a single-layer or multi-layer structure. For example, planarization layer 117 may comprise general-purpose polymers (benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), or polystyrene (PS)), polymer derivatives having phenolic groups, acrylic acid-based polymers, imide-based polymers, aromatic ether-based polymers, amide-based polymers, fluoride-based polymers, p-xylene-based polymers, and vinyl alcohol-based polymers. Planarization layer 117 may comprise materials such as silicon dioxide (SiO2) and silicon nitrides (SiN). x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium dioxide (TiO2), tantalum pentoxide (Ta2O5), hafnium dioxide (HfO2), and zinc oxide (ZnO) x (It can be an inorganic insulating material, such as ZnO and / or ZnO2). In the case where a planarization layer 117 is formed, chemical and mechanical polishing can be performed on the upper surface of the layer after the layer is arranged to provide a flat upper surface.

[0184] The planarization layer 117 includes a via that exposes one of the first source electrode S1 and the first drain electrode D1 of the thin-film transistor TFT, and the pixel electrode 121 can make electrical contact with the first source electrode S1 or the first drain electrode D1 via the via to be electrically connected to the thin-film transistor TFT.

[0185] Pixel electrode 121 may include conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indium gallium oxide (IZO), or zinc aluminum oxide (AZO). Pixel electrode 121 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. For example, pixel electrode 121 may have a structure in which a film comprising ITO, IZO, ZnO, or In₂O₃ is disposed above, below, or beneath the aforementioned reflective layer. Pixel electrode 121 may include a stacked structure comprising ITO / Ag / ITO.

[0186] The pixel defining layer 119 may include a first opening OP1 on the planarization layer 117, the first opening OP1 exposing the central portion of the pixel electrode 121, and the pixel defining layer 119 may cover the edge of the pixel electrode 121 or overlap with the edge of the pixel electrode 121. The size and shape of the light-emitting area (i.e., sub-pixel) of the organic light-emitting diode OLED are defined by the first opening OP1.

[0187] The pixel defining layer 119 increases the distance between the edge of the pixel electrode 121 and the opposing electrode 123 on the pixel electrode 121 to prevent the generation of electric arc at the edge of the pixel electrode 121. The pixel defining layer 119 may comprise an organic insulating material such as polyimide, polyamide, acrylic resin, benzocyclobutene, hexamethyldisiloxane (HMDSO), and phenolic resin, and may be formed by spin coating.

[0188] The first emitting layer 122b is located in the first opening OP1 of the pixel defining layer 119 so as to correspond to the pixel electrode 121. The first emitting layer 122b may comprise a polymer material or a low molecular weight material and may emit red light, green light, blue light or white light.

[0189] An organic functional layer 122e may be disposed on or below the first emission layer 122b. The organic functional layer 122e may include a first functional layer 122a and / or a second functional layer 122c. The first functional layer 122a or the second functional layer 122c may be omitted.

[0190] The first functional layer 122a may be disposed below or beneath the first emitting layer 122b. The first functional layer 122a may have a single-layer or multi-layer structure comprising organic materials. The first functional layer 122a may include a hole transport layer (HTL) with a single-layer structure. For example, the first functional layer 122a may include a hole injection layer (HIL) and an HTL. The first functional layer 122a may be integrally configured to correspond to an organic light-emitting diode (OLED) in the display area DA.

[0191] The second functional layer 122c may be on the first emitting layer 122b. The second functional layer 122c may have a single-layer or multi-layer structure including organic materials. The second functional layer 122c may include an electron transport layer (ETL) and / or an electron injection layer (EIL). The second functional layer 122c may be integrally formed to correspond to an organic light-emitting diode (OLED) included in the display area DA.

[0192] A relative electrode 123 is present on the second functional layer 122c. The relative electrode 123 may comprise a conductive material having a low work function. For example, the relative electrode 123 may comprise a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. For example, the relative electrode 123 may also comprise a layer comprising ITO, IZO, ZnO, or In2O3 on a (semi-)transparent layer comprising the above-mentioned materials. The relative electrode 123 may be integrally formed to correspond to an organic light-emitting diode (OLED) included in the display area DA.

[0193] The layer from pixel electrode 121 to opposite electrode 123 in the display area DA can form an organic light-emitting diode (OLED).

[0194] A top layer 150 comprising an organic material may be present on the counter electrode 123. The top layer 150 may be configured to protect the counter electrode 123 and improve light extraction efficiency. The top layer 150 may comprise an organic material having a refractive index higher than that of the counter electrode 123. For example, the top layer 150 may comprise a stack of layers with different refractive indices. For example, the top layer 150 may be formed by stacking a high refractive index layer / a low refractive index layer / a high refractive index layer. The high refractive index layer may have a refractive index of about 1.7 or greater, and the low refractive index layer may have a refractive index of about 1.3 or less.

[0195] The upper layer 150 may additionally include LiF. For example, the upper layer 150 may additionally include materials such as silicon dioxide (SiO2) or silicon nitride (SiN). x The inorganic insulating material is used. The upper layer 150 can be omitted if necessary. However, for ease of description, the case where the upper layer 150 is present on the opposite electrode 123 will be described in detail below.

[0196] Although not shown in the accompanying drawings, the display panel 50 may include an encapsulation member (not shown) for shielding the upper layer 150. In an embodiment, the encapsulation member may include an encapsulation substrate (not shown) and a sealing member (not shown), wherein the encapsulation substrate faces the substrate 100, and the sealing member is located between the substrate 100 and the encapsulation substrate to shield the space between the substrate 100 and the encapsulation substrate from the outside.

[0197] In this embodiment, the encapsulation component may include a thin-film encapsulation layer. The thin-film encapsulation layer may be in contact with or directly contact the upper layer 150. Here, to prevent the infiltration of external moisture and oxygen, the thin-film encapsulation layer may partially cover the display area DA and the peripheral area NDA, or partially overlap with the display area DA and the peripheral area NDA. The thin-film encapsulation layer may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. Hereinafter, for ease of description, the case in which the thin-film encapsulation layer may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked sequentially on the upper layer 150 will be described in detail.

[0198] In the above configuration, the first inorganic encapsulation layer covers or overlaps with the opposing electrode 123, and may comprise silicon oxide, silicon nitride, and / or silicon nitride. The first inorganic encapsulation layer is formed along the underlying structure, and therefore has a non-uniform upper surface. The organic encapsulation layer covers or overlaps with the first inorganic encapsulation layer, and unlike the first inorganic encapsulation layer, the organic encapsulation layer may have a flat upper surface. Specifically, the organic encapsulation layer may planarize the upper surface of the portion corresponding to the display area DA. The organic encapsulation layer may comprise one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. The second inorganic encapsulation layer covers or overlaps with the organic encapsulation layer, and may comprise silicon oxide, silicon nitride, and / or silicon nitride.

[0199] The packaging component may have a touch screen layer.

[0200] Figure 5A and Figure 5B It is a driver Figure 4A and Figure 4B The equivalent circuit diagram of the pixel circuit PC of the sub-pixels in the display panel 50.

[0201] refer to Figure 5A and Figure 5BThe pixel circuit PC can be electrically connected to the light-emitting element ED to realize light emission from the sub-pixel. The pixel circuit PC may include a driving thin-film transistor T1, a switching thin-film transistor T2, and a storage capacitor Cst. The switching thin-film transistor T2 can be electrically connected to the scan line SL and the data line DL, and transmits the data signal Dm input through the data line DL to the driving thin-film transistor T1 according to the scan signal Sn input through the scan line SL.

[0202] The storage capacitor Cst can be electrically connected to the switching thin-film transistor T2 and the drive voltage line PL, and stores the voltage corresponding to the difference between the voltage transmitted from the switching thin-film transistor T2 and the drive voltage ELVDD supplied to the drive voltage line PL.

[0203] The driving thin-film transistor T1 can be electrically connected to the driving voltage line PL and the storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL to the light-emitting element ED in response to the voltage value stored in the storage capacitor Cst. The light-emitting element ED can emit light with a predetermined brightness according to the driving current.

[0204] Figure 5A An example is shown in which the pixel circuit PC may include two thin-film transistors and a storage capacitor, but one or more embodiments are not limited thereto.

[0205] refer to Figure 5B The pixel circuit PC may include a driving thin-film transistor T1, a switching thin-film transistor T2, a compensation thin-film transistor T3, a first initialization thin-film transistor T4, an operation control thin-film transistor T5, an emission control thin-film transistor T6, and a second initialization thin-film transistor T7.

[0206] exist Figure 5B In this embodiment, each pixel circuit PC may include signal lines SL, SL-1, SL+1, EL, and DL, an initialization voltage line VL, and a drive voltage line PL, but one or more embodiments are not limited thereto. In an embodiment, at least one of the signal lines SL, SL-1, SL+1, EL, and DL and / or the initialization voltage line VL may be shared by adjacent pixel circuits.

[0207] The drain electrode of the driving thin-film transistor T1 can be electrically connected to the light-emitting element ED via the emitter control thin-film transistor T6. The driving thin-film transistor T1 receives the data signal Dm according to the switching operation of the switching thin-film transistor T2 to supply driving current to the light-emitting element ED.

[0208] The gate electrode of the switching thin-film transistor T2 can be electrically connected to the scan line SL, and the source electrode of the switching thin-film transistor T2 can be electrically connected to the data line DL. The drain electrode of the switching thin-film transistor T2 can be electrically connected to the source electrode of the driving thin-film transistor T1, and can also be electrically connected to the driving voltage line PL via the operation control thin-film transistor T5.

[0209] The switching thin-film transistor T2 can be turned on according to the scan signal Sn received through the scan line SL, and perform a switching operation to transmit the data signal Dm transmitted through the data line DL to the source electrode of the driving thin-film transistor T1.

[0210] The gate electrode of the compensation thin-film transistor T3 can be electrically connected to the scan line SL. The source electrode of the compensation thin-film transistor T3 can be electrically connected to the drain electrode of the driving thin-film transistor T1, and simultaneously electrically connected to the pixel electrode of the light-emitting element ED via the emission control thin-film transistor T6. The drain electrode of the compensation thin-film transistor T3 can be electrically connected together with the source electrode of the first initialization thin-film transistor T4 and the gate electrode of the driving thin-film transistor T1 to one electrode of the storage capacitor Cst. The compensation thin-film transistor T3 can be turned on according to the scan signal Sn transmitted through the scan line SL, and the gate electrode and drain electrode of the driving thin-film transistor T1 are electrically connected to each other in a diode-connected manner to the driving thin-film transistor T1.

[0211] The gate electrode of the first initialization thin-film transistor T4 can be electrically connected to the previous scan line SL-1. The drain electrode of the first initialization thin-film transistor T4 can be electrically connected to the initialization voltage line VL. The source electrode of the first initialization thin-film transistor T4 can be electrically connected together with the drain electrode of the compensation thin-film transistor T3 and the gate electrode of the driving thin-film transistor T1 to one electrode of the storage capacitor Cst. The first initialization thin-film transistor T4 is turned on according to the previous scan signal Sn-1 transmitted through the previous scan line SL-1 to transmit the initialization voltage Vint to the gate electrode of the driving thin-film transistor T1 and perform an initialization operation to initialize the voltage at the gate electrode of the driving thin-film transistor T1.

[0212] The gate electrode of the operating control thin-film transistor T5 can be electrically connected to the emitter control line EL. The source electrode of the operating control thin-film transistor T5 can be electrically connected to the drive voltage line PL. The drain electrode of the operating control thin-film transistor T5 can be electrically connected to the source electrode of the driving thin-film transistor T1 and the drain electrode of the switching thin-film transistor T2.

[0213] The gate electrode of the emitter control thin-film transistor T6 can be electrically connected to the emitter control line EL. The source electrode of the emitter control thin-film transistor T6 can be electrically connected to the drain electrode of the driving thin-film transistor T1 and the source electrode of the compensation thin-film transistor T3. The drain electrode of the emitter control thin-film transistor T6 can be electrically connected to the pixel electrode of the light-emitting element ED. The operation control thin-film transistor T5 and the emitter control thin-film transistor T6 are simultaneously turned on according to the emitter control signal En transmitted through the emitter control line EL to transmit the driving voltage ELVDD to the light-emitting element ED, and the driving current flows through the light-emitting element ED.

[0214] The gate electrode of the second initialization thin-film transistor T7 can be electrically connected to the next scan line SL+1. The source electrode of the second initialization thin-film transistor T7 can be electrically connected to the pixel electrode of the light-emitting element ED. The drain electrode of the second initialization thin-film transistor T7 can be electrically connected to the initialization voltage line VL. The second initialization thin-film transistor T7 is turned on according to the next scan signal Sn+1 transmitted through the next scan line SL+1, so as to initialize the pixel electrode of the light-emitting element ED.

[0215] Figure 5B An example is shown in which the first initialization thin-film transistor T4 and the second initialization thin-film transistor T7 are electrically connected to the previous scan line SL-1 and the next scan line SL+1, respectively, but one or more embodiments are not limited thereto. In an embodiment, both the first initialization thin-film transistor T4 and the second initialization thin-film transistor T7 may be electrically connected to the previous scan line SL-1 to operate according to the previous scan signal Sn-1.

[0216] The other electrode of the storage capacitor Cst can be electrically connected to the drive voltage line PL. One electrode of the storage capacitor Cst can also be electrically connected to the gate electrode of the driving thin-film transistor T1, the drain electrode of the compensation thin-film transistor T3, and the source electrode of the first initialization thin-film transistor T4.

[0217] The opposite electrode (e.g., the cathode) of the light-emitting element ED can receive a supply of a common voltage ELVSS. After receiving a drive current from the driving thin-film transistor T1, the light-emitting element ED emits light.

[0218] Pixel circuit PC is not limited to reference Figure 5A and Figure 5B The number of thin-film transistors and storage capacitors and the circuit design are shown, and the number and circuit design can be changed.

[0219] Figure 6A This is a perspective view of the impact-absorbing member 90 according to the embodiment. Figure 6B yes Figure 6A A schematic cross-sectional view of the impact absorber 90.

[0220] refer to Figure 6A and Figure 6B The impact absorber 90 can be disposed on the surface of the heat sink 70. For example, the impact absorber 90 may include a first component 91, a second component 92, and a third component 93.

[0221] The first component 91 may be disposed on the surface of the heat sink 70. The first component 91 may comprise the same or similar material as the heat sink 70 and may be integrally disposed with the heat sink 70. In one embodiment, the first component 91 may comprise the same or similar material as the heat sink 70 and may be formed to be separable from and then connected to or coupled to the heat sink 70. In another embodiment, the first component 91 may comprise a material different from the heat sink 70 and may be separable from the heat sink 70. The first component 91 may comprise at least one of metal, carbon fiber reinforced plastic (CFRP), glass, and ceramic. The first component 91 may have a substantially plate-shaped form and may substantially correspond to a portion or an entire portion of the first region 1A. Hereinafter, for ease of description, the case in which the first component 91 may comprise a material different from the heat sink 70 and may be separable from the heat sink 70 will be described in detail.

[0222] In the case of a heat sink 70, the first component 91 can be located on the bottom surface of the heat sink 70 in the first region 1A. Figure 3B and Figure 3C In the case where the heat sink 70 shown may include a first heat sink (not shown) and a second heat sink (not shown), the heat sink 70 may be located on the bottom surface of the second heat sink. There may be a plurality of first components 91, and the plurality of first components 91 may be separable from each other.

[0223] The second member 92 may be on the bottom surface of the first member 91. Here, the second member 92 may protrude from the first member 91 in a direction away from the display panel 50. The second member 92 may include a hollow central portion, but may have a substantially annular shape with a space 92a at the center. In an embodiment, the second member 92 may have a substantially plate-shaped shape in which no space is provided. In an embodiment, the second member 92 may have a substantially rod-shaped shape, and a plurality of second members 92 may be configured to be separate from each other. In the above cases, the second member 92 may include at least one of polyethylene terephthalate and metal. Here, the second member 92 may include a material with a certain degree of elasticity and may be attached to the first member 91 by welding or by adhesive. Hereinafter, for ease of description, the case in which the second member 92 is joined to the first member 91 and has a substantially closed annular shape with a hollow center will be described in detail.

[0224] The second component 92, as described above, can be coupled to the edge of the first region 1A (e.g., Figures 3A to 3D Corresponding to 1A-1). For example, the second member 92 does not support the central portion of the first region 1A, but can support the boundary region of the first region 1A (e.g., Figures 3A to 3D (1A-1). On the bottom surface at the center of the first region 1A, a space 92a may be provided due to the second member 92. Furthermore, at least a portion of the second member 92 may be on the lower surface of the peripheral region NDA in the first region 1A.

[0225] The third component 93 may be arranged or disposed facing the first component 91, and may be connected or coupled to the second component 92. The third component 93 may have a substantially plate-shaped form, and the first component 91, the second component 92, and the third component 93 may completely shield the central portion of the second component 92 from the outside. Here, the third component 93 may have a substantially thin plate-shaped form including at least one of metal and synthetic resin.

[0226] The impact absorber 90 described above can withstand forces applied to it from the outside to a certain extent. Specifically, in the event of an impact from the outside, at the center of the first region 1A, the first member 91 or the third member 93 is pulled into the space 92a formed in the impact absorber 90 to absorb the impact. Furthermore, when an impact is applied to the portion where the second member 92 is located or disposed, the impact can be partially absorbed by the second member 92 due to the elasticity of the second member 92.

[0227] Furthermore, the third component 93 can prevent other components on the bottom surface of the third component 93 (e.g., circuit boards, devices on the circuit boards, protrusions of the lower cover, etc.) from entering the space 92a in the impact absorber 90, and thus can prevent damage to the first component 91. The third component 93 can prevent the deformation space of the first component 91 from being narrowed due to other components.

[0228] Figure 7 This is a schematic cross-sectional view of the impact absorber 90 according to the embodiment.

[0229] refer to Figure 7 The impact absorber 90 may include a first member 91 and a second member 92. Here, the second member 92 may include a space 92a at its center. In embodiments, the second member 92 may have a substantially rod-shaped form, and a pair of second members 92 may be disposed on the bottom surface of the first member 91, separated from each other. The pair of second members 92 may be arranged or disposed parallel to each other, such that the bottom surface of the first member 91 between the second members 92 may be spaced apart from the bottom surface of the second member 92. The pair of second members 92 may be located or disposed at the outermost boundary portion of the first member 91.

[0230] In the above-described configuration, the second component 92 can be supported by contact with the lower cover (not shown) or a circuit board. The second component 92 can separate the bottom surface of the first component 91 from one surface of the lower cover or circuit board.

[0231] In the above case, the impact absorber 90 ensures space for deformation with the display panel 50 relative to the impact force applied from the upper surface of the first member 91, and therefore the impact force applied to the display panel 50 can be reduced or absorbed.

[0232] In addition, a space 92a can be provided to accommodate the deformation of the lower cover or the circuit board relative to the impact force applied from the surface of the lower cover or the surface of the circuit board, so as to prevent the impact force from being directly transmitted to the display panel 50.

[0233] Figure 8A This is a perspective view of the impact-absorbing member 90 according to the embodiment. Figure 8B yes Figure 8A Schematic cross-sectional view of the impact absorber 90

[0234] refer to Figure 8A and Figure 8B The impact-absorbing component 90 may include a first component 91 and a third component 93.

[0235] Here, the first component 91 may have a curved boundary. In detail, the first component 91 may include a first component body 91-1, a first side portion 91-2, and a second side portion 91-3, wherein the first component body 91-1 is substantially plate-shaped, the first side portion 91-2 is curved from the first component body 91-1, and the second side portion 91-3 is curved from the first component body 91-1 and arranged or positioned in a different direction from the first side portion 91-2.

[0236] In the above configuration, the first side portion 91-2 may face the bottom surface of the first component body 91-1. The first side portion 91-2 may be bent from the first component body 91-1. The upper surface of the first side portion 91-2 may be spaced apart from the lower surface of the first component body 91-1. The second side portion 91-3 may be bent from the first component body 91-1 and may protrude toward the third component 93. The first component 91 may have a space, hole, or cavity 91-4 therein.

[0237] The third component 93 may be configured to be substantially plate-shaped and connected or joined to the first component 91. Here, the first component 91 and the third component 93 may be made of the same or similar materials, or different materials. The first component 91 and the third component 93 may be connected or joined to each other by adhesive or by welding.

[0238] The impact absorber 90 can operate in a manner similar to that described above. Here, when an impact force is applied from the outside, the impact absorber 90 can absorb the impact force via the elastic force generated by the shape of the first side portion 91-2 and the first member body 91-1. In addition, the impact absorber 90 may include a space 91-4 to provide space that will deform in the event of deformation of the first member body 91-1 and the third member 93.

[0239] Therefore, when various impact forces are applied to the display device, the impact absorber 90 can reduce the impact applied to the display panel 50.

[0240] Figure 9A This is a perspective view of the impact-absorbing member 90 according to the embodiment. Figure 9B yes Figure 9A A schematic cross-sectional view of the impact absorber 90.

[0241] refer to Figure 9A and Figure 9B The impact-absorbing member 90 may include a first member 91, a third member 93, and a spacer 94. The third member 93 is referenced above. Figure 8A and Figure 8B The third component 93 described is the same as or similar to the one described above, and its detailed description is omitted.

[0242] The first component 91 may include a first component body 91-1 and a first side portion 91-2. Here, the first component body 91-1 and the first side portion 91-2 are... Figure 8A and Figure 8B The first component body 91-1 and the first side part 91-2 are the same or similar, and their detailed description is omitted.

[0243] In the above configuration, the first member 91 may have a partially open side. Furthermore, the first member body 91-1 may be spaced apart from the third member 93 by the first side portion 91-2, and a space 91-4 may be created between the first member body 91-1 and the third member 93. The space 91-4 may communicate with the outside.

[0244] The spacer 94 can be located within the space 91-4 of the impact absorber 90. The spacer 94 can have a portion of a substantially elliptical shape, a substantially hemispherical shape, or a substantially spherical shape. There can be multiple spacers 94, and the multiple spacers 94 can be spaced apart from each other. In an embodiment, when there is only one spacer 94, the spacer 94 can be located at a point on the bottom surface of the first member body 91-1.

[0245] The spacer 94 can be fixed to at least one of the bottom surface of the first component body 91-1 and the third component 93. For example, the spacer 94 can be fixed only to the bottom surface of the first component body 91-1. In an embodiment, the spacer 94 can be fixed only to the upper surface of the third component 93. In an embodiment, the spacer 94 can be fixed to both the bottom surface of the first component body 91-1 and the upper surface of the third component 93.

[0246] For example, spacer 94 may include elastic materials such as rubber, silicone, synthetic resin and soft metal.

[0247] Although not shown in the accompanying drawings, the impact absorber 90 may include a first member 91, a second member 92, a third member 93, and a spacer 94. The spacer 94 may have, for example, a first member 91, a second member 92, a third member 93, and a spacer 94. Figure 6A The impact absorber 90 is shown in the shape shown.

[0248] Although not shown in the accompanying drawings, the impact absorber 90 may include a first member 91, a second member 92, and a spacer 94. The spacer 94 may have, for example, a first member 91, a second member 92, and a spacer 94. Figure 7 The bottom surface of the first member 91 in the impact absorber 90 of the shape shown.

[0249] Figure 9C This is a schematic cross-sectional view of the impact absorber 90 according to the embodiment.

[0250] refer to Figure 9C The impact-absorbing member 90 may include a first member 91, a third member 93, and a spacer 94. Here, the first member 91 and the third member 93 are connected to... Figure 9A and Figure 9B The first component 91 and the third component 93 are the same or similar, and their detailed descriptions are omitted.

[0251] Spacer 94 can have the same Figure 9A and Figure 9B The spacer 94 has a similar shape. Here, the spacer 94 may have a substantially polygonal prism shape. In an embodiment, the spacer 94 may have a substantially polyhedral pyramid shape.

[0252] In the above-described case, for example, the spacer 94 may have a height direction relative to the impact absorber 90 (e.g., Figure 9C A cross section parallel to the Z-axis direction, wherein the cross section may have a substantially polygonal shape, such as a substantially triangular shape, a substantially quadrilateral shape, and a substantially trapezoidal shape.

[0253] Figure 10 This is a schematic cross-sectional view of the impact absorber 90 according to the embodiment.

[0254] refer to Figure 10 The impact-absorbing member 90 may include a first member 91. Here, the first member 91 may be connected to... Figure 8A or Figure 9A The first component 91 shown has the same or similar shape. In the following description, for ease of description, the first component 91 will be described in detail as follows... Figure 9A The first component 91 is the same as the case.

[0255] In the above-described manner, the impact absorber 90 can absorb externally applied impacts via the first component body 91-1 and the first side portion 91-2. Specifically, externally applied impacts can be transmitted to the impact absorber 90 from either the front or rear surface of the display device 1. In the case of an impact applied from the front surface of the display device 1, the impact is transmitted to the first component body 91-1 and can be absorbed by deformation of the first component body 91-1 or by a change in the spacing between the first component body 91-1 and the first side portion 91-2. Furthermore, impacts transmitted from the rear surface of the display device 1 can be absorbed by a change in the spacing between the first component body 91-1 and the first side portion 91-2 or by a change in a portion of the rear surface of the display device 1.

[0256] Therefore, the shock absorber 90 can effectively reduce the impact applied to the display device 1 from the outside.

[0257] Figure 11 This is a schematic cross-sectional view of the impact absorber 90 according to the embodiment.

[0258] refer to Figure 11 The impact-absorbing member 90 may include a first member 91 and a spacer 94. Here, the first member 91 may be connected to... Figures 8A to 9C The first component 91 is the same as or similar to it. The spacer 94 may be... Figures 9A to 9C The spacer 94 is the same as or similar to the spacer 94. In the following text, for ease of description, the first member 91 will be described in detail as... Figure 8A The first component 91 is the same as the case.

[0259] The spacer 94 may protrude from the bottom surface of the first member body 91-1. At least one spacer 94 may be provided. Although not shown in the figures, in the case of one spacer 94, the spacer 94 may be located on the bottom surface of the first member body 91-1 at the portion where the first side portion 91-2 is not present. However, for ease of description, the case where multiple spacers 94 are provided will be described in detail.

[0260] With the spacer 94 present, the spacer 94 can prevent excessive deformation of the first component body 91-1. For example, in the event of an external impact, excessive deformation of the first component body 91-1 may cause excessive bending of a given portion of the display panel 50, and therefore, the spacer 94 can prevent damage to the display panel 50.

[0261] Figure 12 This is a perspective view of the impact-absorbing member 90 according to the embodiment.

[0262] refer to Figure 12 The impact-absorbing member 90 may include a first member 91 and a second member 92. Here, the first member 91 may have the features described above. Figure 6A and Figure 6B The shape described is basically plate-shaped.

[0263] Multiple second members 92 can be provided. Here, the second members 92 can have a substantially rod-shaped form, and the multiple second members 92 can be separated from each other. Adjacent second members 92 are not connected to each other but are separated, and if each of the second members 92 is fixed to the first member 91, the second members 92 may not be connected to each other. The second members 92 can remain separated from each other. The second member 92 may include a first side member 92-1 and a second side member 92-2, wherein the first side member 92-1 is arranged or positioned in a first direction (e.g., Figure 12 The second side member 92-2 is arranged or positioned in one of the X-axis and Y-axis directions (e.g., in the second direction). Figure 12 (In the X-axis direction and the other of the Y-axis directions). The end of the first side member 92-1 can be separated from the side surface of the second side member 92-2. In addition, there can be a plurality of first side members 92-1 and a plurality of second side members 92-2 that are separated from each other as described above.

[0264] In the above situation, the first component 91 can deform within a given range without being restricted by the second component 92.

[0265] Therefore, the shock absorber 90 can effectively reduce the impact applied from the outside and protect the display panel 50.

[0266] Although the shape of the second component 92 is not shown in the accompanying drawings, the shape of the second component 92 can be applied to... Figures 6A to 7 The implementation shown is illustrated.

[0267] The display device according to one or more embodiments may not break or be damaged in the event of a collision with an object. Furthermore, the display device according to one or more embodiments can perform normal operation even in the event of a collision. The display device according to one or more embodiments can effectively absorb external impacts through one or more structures described herein.

[0268] It should be understood that the embodiments described herein are to be considered descriptive only and not for limiting purposes. Descriptions of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. A display device, including: The display panel includes a first region of constant shape; as well as At least one impact absorber is located on the surface of the first region of the display panel, and the at least one impact absorber supports the display panel. Wherein, the at least one impact-absorbing element includes: A first component is located on the first area of ​​the display panel; and The second component faces the first component, is connected to the first component, and is disposed on only a portion of the first component in the first region.

2. The display device according to claim 1 further includes a heat sink disposed between the at least one shock absorber and the display panel.

3. The display device according to claim 2, wherein, The heat sink and the first component of the at least one impact absorber are integral with each other.

4. The display device according to claim 2, wherein, The heat sink includes: A first heat sink is disposed on the surface of the display panel; and Multiple second heat sinks are spaced apart from each other and disposed on the first heat sink.

5. The display device according to claim 4, wherein, The at least one impact absorber includes a plurality of impact absorbers, and The plurality of impact-absorbing components correspond to the plurality of second heat dissipation plates respectively.

6. The display device according to claim 4, wherein, The first heat sink includes a deformable structure at the curved portion of the display panel.

7. The display device according to claim 1, wherein, The at least one impact absorber further includes a third member facing the first member and the second member, the third member being connected to the second member.

8. The display device according to claim 1, wherein, The at least one impact-absorbing element further includes a spacer disposed on the surface of the first member.

9. The display device according to claim 1, wherein, The second component is a closed loop in the plan view.

10. The display device according to claim 1, wherein, The second component and the first component are integral with each other, and The second component bends from the first component.

11. The display device according to claim 1, wherein, The surface of the first component is spaced apart from the surface of the second component.

12. The display device according to claim 1, wherein, The second component includes: The first side member is located in the first direction; and The second side member is spaced apart from the first side member and is located in the second direction.

13. A display device, including: The display panel includes a first region of constant shape; A heat sink is disposed on the surface of the display panel and connected to the display panel; as well as An impact-absorbing component faces the display panel, and a heat sink is disposed between the impact-absorbing component and the display panel. The impact-absorbing component is disposed on the surface of the heat sink, wherein the surface of the heat sink is different from another surface of the heat sink that connects to the display panel. The impact-absorbing element includes: A first component is located on the first area of ​​the display panel; and The second component is disposed on only a portion of the first component in the first region.

14. The display device according to claim 13, further comprising a panel protection member disposed between the heat sink and the display panel.

15. The display device according to claim 13, further comprising an optical functional layer disposed on the display panel.

16. The display device according to claim 13, further comprising a cover member disposed on the display panel.

17. The display device according to claim 13, wherein, The heat sink includes: A first heat sink is connected to the display panel; and The second heat sink is disconnected and separated at the region of the bending axis of the display device to connect to the first heat sink.

18. The display device according to claim 13, wherein, The heat sink includes a deformable structure that can be folded or unfolded.

19. The display device according to claim 18, wherein, The impact-absorbing component does not overlap with the deformable structure of the heat sink.

20. The display device according to claim 13, wherein, The second component faces the display panel and the first component, and is connected to the first component.

21. A display device, including: The display panel includes: The first area unfolded; and A second region, connected to the first region, is foldable or rollable; A heat sink, connected to the display panel, the heat sink including a portion corresponding to the unfolded first region and a deformable structure corresponding to the second region; and An impact-absorbing component is located on the portion of the heat sink corresponding to the unfolded first region. The impact-absorbing element includes: A first component is located on the unfolded first area of ​​the display panel; and The second component is disposed on only a portion of the first component in the unfolded first region.

22. The display device according to claim 21, wherein, The unfolded first region includes two first regions spaced apart from each other, and the second region is disposed between the two first regions. The impact-absorbing element is disconnected and corresponds to the two first regions of the unfolded first region.

23. The display device according to claim 21, wherein, The second component corresponds to the boundary of the unfolded first region and protrudes in a direction away from the display panel.

24. The display device according to claim 21, wherein, The impact absorber includes a space within the impact absorber.

25. The display device according to claim 21, wherein, The heat sink includes: A first heat sink is connected to the display panel; and The second heat sink is disconnected and separated at the region of the bending axis of the display device to connect to the first heat sink.

26. The display device according to claim 21 further includes a panel protection member disposed between the heat sink and the display panel.

27. The display device according to claim 21, further comprising a cover member disposed on the display panel.

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