Extension device and extension method

Abstract

Provided are an expanding apparatus and an expanding method that can suppress the possibility of creating an uncut region on a workpiece to a low level. The expanding apparatus cuts a workpiece by expanding an expanding sheet on which the workpiece having a modified layer serving as a cutting start point is attached, the expanding apparatus including: an expanding mechanism that expands the expanding sheet; and a cooling unit that cools in a manner such that the temperature of a region between an inner edge of a ring-shaped frame of the expanding sheet and an outer edge of the workpiece is lower than the temperature of a region of the expanding sheet that is inward of the outer edge of the workpiece.

Description

Technical Field

[0001] This invention relates to an expansion device and method for expanding a sheet of workpiece to form a dividing point, thereby dividing the workpiece. Background Technology

[0002] The following expansion device is used: an expansion sheet is attached to the back of the workpiece where a dividing start point is formed along a predetermined dividing line, and the workpiece is divided by expanding the expansion sheet (for example, see Patent Document 1).

[0003] When the workpiece contains a malleable material such as DAF (die bonding film) or metal film, the expansion device shown in Patent Document 1 cools the workpiece during expansion to improve slicing.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2019-186437

[0005] On the other hand, the expansion sheet adhered to the workpiece also has extensibility, which is suppressed due to cooling. If only the expansion sheet in the area where the workpiece is adhered is cooled, and the expansion sheet in the area outside the workpiece is not cooled, then the area of ​​the expansion sheet on the outer periphery of the workpiece is expanded, but the expansion sheet in the area where the workpiece is adhered is not sufficiently expanded, resulting in undivided areas in the workpiece. Summary of the Invention

[0006] Therefore, the object of the present invention is to provide an expansion device and expansion method that can suppress the possibility of generating undivided areas on the workpiece.

[0007] According to one aspect of the invention, an expansion device is provided for expanding a sheet to which a workpiece having a dividing start point is attached, thereby dividing the workpiece, wherein the expansion device comprises: an expansion mechanism for expanding the sheet; and a cooling unit for cooling the sheet such that the temperature of the area of ​​the sheet to which the workpiece is not attached is lower than the temperature of the area of ​​the sheet to which the workpiece is attached.

[0008] Preferably, the expansion mechanism comprises: a sheet clamping unit having a first clamping portion and a second clamping portion that are opposed to each other and clamp the sheet in a first direction across the workpiece, and a third clamping portion and a fourth clamping portion that are opposed to each other and clamp the sheet in a second direction perpendicular to the first direction across the workpiece; a first moving unit that moves the first clamping portion and the second clamping portion in a direction separating them in the first direction; and a second moving unit that moves the third clamping portion and the fourth clamping portion in a direction separating them in the second direction. The cooling unit moves in the direction of separation. It has a cooling worktable for cooling the sheet. The cooling worktable has a contact surface that abuts against the sheet held by the sheet clamping unit. The contact surface includes a first region and a second region. The first region corresponds to the region where the workpiece is attached. The second region surrounds the first region and corresponds to the region between the workpiece and the first clamping part, the second clamping part, the third clamping part, and the fourth clamping part. The first region is set to a first temperature, and the second region is set to a second temperature that is lower than the first temperature.

[0009] According to another aspect of the invention, an expansion method is provided for expanding a sheet to divide a workpiece having a dividing start point, wherein the expansion method comprises the following steps: a sheet cooling step, wherein the temperature of the area of ​​the sheet to which the workpiece is not attached is lower than the temperature of the area of ​​the sheet to which the workpiece is attached is lower; and a dividing step, wherein after the sheet cooling step is performed, the sheet is expanded to divide the workpiece.

[0010] Preferably, the sheet cooling step is performed by bringing a cooling worktable into contact with the sheet. The cooling worktable has an contact surface comprising a first region and a second region. The first region corresponds to the region where the workpiece is attached, and the second region surrounds the first region and corresponds to the region between the workpiece and the first, second, third, and fourth clamping parts. The first region is set to a first temperature, and the second region is set to a second temperature lower than the first temperature. In this splitting step, the first and second clamping parts, which are positioned opposite each other and clamp the sheet across the workpiece in a first direction, are moved in a direction of separation in the first direction. Furthermore, the third and fourth clamping parts, which are positioned opposite each other and clamp the sheet across the workpiece in a second direction perpendicular to the first direction, are moved in a direction of separation in the second direction, thereby expanding the sheet.

[0011] The present invention has the effect of reducing the possibility of producing undivided areas on the workpiece. Attached Figure Description

[0012] Figure 1This is a perspective view showing a structural example of the extension device according to the first embodiment.

[0013] Figure 2 It is shown by Figure 1 A perspective view of an example of a workpiece divided by an extension device.

[0014] Figure 3 It is shown by Figure 1 A perspective view of another example of a workpiece divided by an extension device.

[0015] Figure 4 This is a flowchart illustrating the process of the extended method of the first embodiment.

[0016] Figure 5 It is shown schematically. Figure 4 A cross-sectional view of the sheet cooling step in the extended method shown.

[0017] Figure 6 It is shown schematically. Figure 4 A cross-sectional view of the segmentation steps of the extended method shown.

[0018] Figure 7 This is a perspective view showing a structural example of the extension device according to the second embodiment.

[0019] Figure 8 It is shown Figure 7 Top view of the sheet clamping unit and cooling worktable of the extended device shown.

[0020] Figure 9 It is shown Figure 7 A cross-sectional view of the structure of the cooling workbench of the extended device shown.

[0021] Figure 10 This is a cross-sectional view schematically illustrating the cooling step of the extended method of the second embodiment.

[0022] Figure 11 This is a cross-sectional view schematically showing the state of the expansion piece before expansion in the segmentation step of the expansion method of the second embodiment.

[0023] Figure 12 This is a cross-sectional view schematically showing the state of the expanded sheet after the division step of the expansion method of the second embodiment.

[0024] Figure 13 This is a cross-sectional view schematically showing the cooling workbench after the division step of the extended method of the second embodiment.

[0025] Figure 14 This is a cross-sectional view showing the structure of the cooling workbench of the extended device of a modified example of the second embodiment.

[0026] Label Explanation

[0027] 1, 1-2: Expansion device; 10, 60: Expansion unit (expansion mechanism); 20, 40: Cooling unit; 41, 41-1: Cooling worktable; 42: Contact surface; 43: First area; 44: Second area; 61: Sheet clamping unit; 62-1: First clamping part; 62-2: Second clamping part; 62-3: Third clamping part; 62-4: Fourth clamping part; 71: First moving unit; 72: Second moving unit; 200: Workpiece; 201: Expansion sheet (sheet); 207: Modified layer (splitting start point); 212: First direction; 213: Second direction; 215, 218: Area (area where the workpiece is not attached); 216, 217: Area (area where the workpiece is attached); 1002: Sheet cooling step; 1003: Splitting step. Detailed Implementation

[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the structural elements described below include substantially the same structural elements that can be readily conceived by those skilled in the art. In addition, the structures described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications to the structure can be made without departing from the spirit of the present invention.

[0029] [First Embodiment]

[0030] The extension device and extension method of the first embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view showing a structural example of the extension device according to the first embodiment. Figure 2 It is shown by Figure 1 A perspective view of an example of a workpiece divided by an extension device. Figure 3 It is shown by Figure 1 A perspective view of another example of a workpiece divided by an extension device. Figure 4 This is a flowchart illustrating the process of the extended method of the first embodiment.

[0031] Implementation Method 1 Figure 1 The extension device 1 shown is for attaching... Figure 2 The apparatus shown is used to expand the sheet 201 of the workpiece 200 to divide the workpiece 200 into individual chips 202. For example... Figure 2 As shown, the workpiece 200 that is the processing target of the extension device 1 in the first embodiment is a wafer such as a disc-shaped semiconductor wafer or optical device wafer that includes a substrate 203 formed of silicon, sapphire, gallium arsenide or SiC (silicon carbide).

[0032] In the first embodiment, such as Figure 2 As shown, the workpiece 200 has devices 206 formed in each region of the front side 204 of the substrate 203, which is divided by multiple intersecting predetermined dividing lines 205. The devices 206 are, for example, integrated circuits such as IC (Integrated Circuit) or LSI (Large Scale Integration), image sensors such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor).

[0033] The workpiece 200 has a modified layer 207 formed inside the substrate 203 along the predetermined dividing line 205, serving as the dividing starting point. Figure 2 (Represented by dashed lines). The modified layer 207 refers to a region whose density, refractive index, mechanical strength, and other physical properties differ from those of its surroundings. This includes melt-processed regions, cracked regions, regions with insulation failure, regions with refractive index changes, and regions where these regions coexist. In the first embodiment, the mechanical strength of the modified layer 207 is lower than that of other parts of the substrate 203.

[0034] Furthermore, in the first embodiment, such as Figure 2 As shown, the workpiece 200 has a DAF (Die Attach Film) 209 attached to the extension sheet 201 on the back side 208 side of the substrate 203. An annular frame 210 is mounted on the outer edge of the extension sheet 201, and the extension sheet 201 supports the workpiece 200 within an opening 211 on the inner side of the annular frame 210. With the DAF 209 and the extension sheet 201 attached to the back side 208 of the substrate 203, the workpiece 200 and the DAF 209 are separated into individual chips 202 along the modified layer 207 by the extension device 1.

[0035] Chip 202 has a portion of substrate 203 and a device 206 formed on the front side 204 of substrate 203, and a portion of DAF 209 is attached to the back side 208. DAF 209 is used to fix individual chips 202 divided from workpiece 200 to substrate, etc. In the first embodiment, DAF 209 is formed into a circular plate with a diameter larger than workpiece 200 and is attached to the back side 208 of substrate 203 and extension sheet 201.

[0036] The extended sheet 201 is elastic, for example, formed by extending a heated synthetic resin along a first direction 212 and extending it along a second direction 213 perpendicular to the first direction 212. The extended sheet 201 includes: a substrate layer made of an elastic synthetic resin; and an adhesive layer laminated on the substrate layer, also made of an elastic and adhesive synthetic resin. In the first embodiment, the first direction 212 is the so-called machine direction (MD), and the second direction 213 is the so-called transverse direction (TD). Furthermore, the elasticity of the extended sheet 201 decreases upon cooling, and its elongation decreases with decreasing temperature.

[0037] In addition, such as Figure 3 As shown, as Figure 1 The workpiece 200 processed by the extension device 1 shown can also be a wafer as follows: a metal film 214 is formed on the back surface 208 of the substrate 203, an extension piece 201 is attached to the metal film 214, an annular frame 210 is mounted on the outer edge of the extension piece 201, and the extension piece 201 is supported in the opening 211 on the inner side of the annular frame 210. Figure 3 In the workpiece 200 shown, with the extension sheet 201 attached to the metal film 214 on the back side 208 of the substrate 203, the substrate 203 and the metal film 214 are divided into individual chips 202 along the modified layer 207 by the extension device 1. Furthermore, in Figure 3 In the case of the workpiece 200 shown, the chip 202 has a portion of a substrate 203, a device 206 formed on the front side 204 of the substrate 203, and a portion of a metal film 214 formed on the back side 208. Figure 3 In the middle, to and Figure 2 Identical parts are labeled with the same number, and the description is omitted.

[0038] Figure 2 The workpiece 200 shown is less likely to be divided into individual chips 202 compared to a workpiece with a modified layer 207 formed along the predetermined dividing line 205 and without DAF 209 attached to the back side 208. Furthermore, Figure 3 The workpiece 200 shown is less likely to be divided into individual chips 202 compared to a workpiece with a modified layer 207 formed along the predetermined dividing line 205 and without a metal film 214 attached to the back surface 208. Thus, the workpiece 200 is representative of... Figure 2 The back side 208 shown has DAF 209 affixed to it or on Figure 3 The wafer shown has a metal film 214 formed on the back side 208, making it difficult to divide into chips 202.

[0039] In addition, in the first embodiment, the modified layer 207 is formed on the workpiece 200 as the starting point for the division, but it is not limited to the modified layer 207. For example, as the starting point for the division, a cutting groove formed by a cutting tool cutting from the front side 204 or a laser processing groove formed by irradiating a laser beam with a wavelength that is absorbent to the workpiece 200 from the front side 204 can also be formed on the workpiece 200.

[0040] The expansion device 1 of the first embodiment is an apparatus that expands an expansion sheet 201 to which a workpiece 200 having a modified layer 207 is attached, divides the workpiece 200 into individual chips 202, and divides the DAF 209 according to each chip 202. Figure 1 As shown, the expansion device 1 of the first embodiment includes an expansion unit 10, a cooling unit 20, and a control unit 30 as an expansion mechanism.

[0041] The expansion unit 10 expands the expansion piece 201. The expansion unit 10 has a disc-shaped base 11, a frame holding unit 12, an expansion drum 13, and a lifting unit 14.

[0042] The frame holding unit 12 holds the annular frame 210. The frame holding unit 12 has an annular frame holding member 15 disposed on the base 11 and a plurality of clamps 16 disposed on the outer edge of the frame holding member 15. The inner diameter of the frame holding member 15 is smaller than the inner diameter of the annular frame 210 and larger than the outer diameter of the workpiece 200. The outer diameter of the frame holding member 15 is equal to the outer diameter of the annular frame 210. The upper surface of the frame holding member 15 is a mounting surface 17 for placing the annular frame 210. The mounting surface 17 is flat in the horizontal direction. The clamps 16 clamp the annular frame 210 placed on the mounting surface 17, fixing the annular frame 210 to the frame holding member 15. In the first embodiment, four clamps 16 are arranged at equal intervals in the circumferential direction.

[0043] An expansion drum 13 is disposed on a base 11 and is formed into a cylindrical shape. The expansion drum 13 is located inside the frame holding member 15 and is coaxial with the frame holding member 15. The inner diameter and outer diameter of the expansion drum 13 are smaller than the inner diameter of the annular frame 210 and the frame holding member 15, and larger than the outer diameter of the workpiece 200.

[0044] The lifting unit 14 moves the frame holding unit 12 and the expansion drum 13 relative to each other in the vertical direction. In the first embodiment, the lifting unit 14 moves the frame holding unit 12 between a position where the mounting surface 17 is located on the same plane as the upper end of the expansion drum 13 and a position where the mounting surface 17 is lower than the upper end of the expansion drum 13. In the first embodiment, the lifting unit 14 is a cylinder having a cylinder 18 and a piston rod 19, the cylinder 18 being mounted on the base 11, the piston rod 19 being extendable and retractable from the cylinder 18 and having a frame holding member 15 mounted at its upper end. In the first embodiment, multiple lifting units 14 are provided at intervals around the base 11 in the circumferential direction.

[0045] Cooling unit 20 cools extension piece 201 so that the area 215 between the inner edge of the annular frame 210 and the outer edge of the workpiece 200 of the extension piece 201 adhered to by frame holding unit 12, where the workpiece 200 is not adhered, is cooled. Figure 2 and Figure 3 The temperature of the area where the workpiece 200 is attached to the extension sheet 201 (as shown) is higher than that of the area 216, which is closer to the inner edge of the workpiece 200 than the outer edge of the workpiece 200. Figure 2 and Figure 3 The temperature is low (as shown). In the first embodiment, the cooling unit 20 is formed as a disc with an outer diameter the same as the inner diameter of the frame holding member 15. In the first embodiment, the cooling unit 20 is disposed above the expansion drum 13 and the frame holding member 15 and is coaxial with the expansion drum 13 and the frame holding member 15.

[0046] The cooling unit 20 includes: a first cooling air ejection port 21, which is perpendicular to a region 216 of the extension piece 201 of the annular frame 210 held by the frame holding unit 12, located inside the outer edge of the workpiece 200, i.e., the workpiece 200 attached to the extension piece 201; and a second cooling air ejection port 22, which is perpendicular to a region 215 between the inner edge of the annular frame 210 of the extension piece 201 held by the frame holding unit 12 and the outer edge of the workpiece 200. Multiple first cooling air ejection ports 21 and multiple second cooling air ejection ports 22 are provided.

[0047] The first cooling air nozzle 21 sprays cooling air 23 at a first temperature lower than room temperature (for example, -5°C in the first embodiment) toward the region 216 of the extension piece 201 of the annular frame 210 held by the frame holding unit 12, which is inside the outer edge of the workpiece 200, i.e., the workpiece 200 attached to the extension piece 201. Figure 5(Indicated by arrows). The first cooling air jet 21 cools the region 216 of the extension piece 201 that is inside the outer edge of the workpiece 200 to the first temperature via the workpiece 200.

[0048] The second cooling air nozzle 22 sprays cooling air 24 at a second temperature (e.g., -10°C in the first embodiment) lower than the room temperature and the first temperature toward the region 215 between the inner edge of the annular frame 210 of the extended piece 201 held by the frame holding unit 12 and the outer edge of the workpiece 200. Figure 5 (Indicated by arrows). The second cooling air jet 22 cools the area 215 between the inner edge of the annular frame 210 of the extension piece 201 and the outer edge of the workpiece 200 to the second temperature.

[0049] The control unit 30 also controls each structural element of the expansion device 1, causing the expansion device 1 to perform the expansion operation of the expansion piece 201. Furthermore, the control unit 30 is a computer having a processing unit, a storage device, and an input / output interface device. The processing unit has a microprocessor such as a CPU (central processing unit), and the storage device has a memory such as ROM (read-only memory) or RAM (random access memory). The processing unit of the control unit 30 performs arithmetic processing according to the computer program stored in the storage device, and outputs control signals for controlling the expansion device 1 to each structural element of the expansion device 1 via the input / output interface device.

[0050] In addition, the control unit 30 is connected to a display unit (not shown) and an input unit (not shown). The display unit consists of a liquid crystal display device or the like that that displays the status of the processing operation, images, etc., and the input unit is used when the operator registers processing content information, etc. The input unit consists of at least one of an external input device such as a touch panel and a keyboard provided on the display unit.

[0051] Next, the expansion method of the first embodiment will be described. The expansion method of the first embodiment involves expanding an expansion sheet 201 to which a workpiece 200 with a modified layer 207 is attached, thereby dividing the workpiece 200 into individual chips 202. The expansion method of the first embodiment is implemented by controlling each structural element of the expansion device 1 via a control unit 30, such as… Figure 4 As shown, the extended method of the first embodiment includes a holding step 1001, a sheet cooling step 1002, and a dividing step 1003.

[0052] (Keep the steps)

[0053] The holding step 1001 is a step in which the outer edge of the expansion piece 201 to which the workpiece 200 is attached and the annular frame 210 attached to the outer edge of the expansion piece 201 are held by the frame holding unit 12 of the expansion device 1. In the holding step 1001, the expansion device 1 extends the piston rod 19 of the lifting unit 14 so that the mounting surface 17 of the frame holding member 15 and the upper end of the expansion drum 13 are arranged on the same plane.

[0054] In holding step 1001, the expansion device 1 places the annular frame 210, which is attached to the expansion piece 201, and the outer edge of the expansion piece 201 on the mounting surface 17 of the frame holding member 15. In holding step 1001, the expansion device 1 uses the clamp 16 to clamp the annular frame 210 and the outer edge of the expansion piece 201 attached to the frame holding member 15 on the mounting surface 17, thus fixing them to the frame holding member 15. At this time, the upper end of the expansion drum 13 abuts against the area 215 between the inner edge of the annular frame 210 of the expansion piece 201 held by the frame holding unit 12 and the outer edge of the workpiece 200.

[0055] (Sheet cooling step)

[0056] Figure 5 It is shown schematically. Figure 4 The diagram shows a cross-sectional view of the sheet cooling step in the extended method. The sheet cooling step 1002 is performed in such a way that the temperature of the region 215 between the inner edge of the annular frame 210 of the extended sheet 201 and the outer edge of the workpiece 200 is lower than the temperature of the region 216 of the extended sheet 201 that is closer to the outer edge of the workpiece 200.

[0057] In the first embodiment, in the sheet cooling step 1002, as Figure 5 As shown, the cooling unit 20 of the extension device 1 sprays cooling air 23 at a first temperature for a predetermined time from the first cooling air ejection hole 21 toward the region 216 of the extension piece 201, which is attached to the annular frame 210 held by the frame holding unit 12, that is, the workpiece 200 attached to the extension piece 201, which is closer to the outer edge of the workpiece 200. In the first embodiment, in the sheet cooling step 1002, the extension device 1 cools the region 216 of the extension piece 201, which is closer to the outer edge of the workpiece 200, to the first temperature via the workpiece 200.

[0058] Furthermore, in the first embodiment, in the sheet cooling step 1002, as... Figure 5As shown, while the cooling unit 20 sprays cooling air 23 from the first cooling air outlet 21, the expansion device 1 sprays cooling air 24 at a second temperature for a predetermined time from the second cooling air outlet 22 toward the region 215 between the inner edge of the annular frame 210 of the expansion piece 201 held by the frame holding unit 12 and the outer edge of the workpiece 200. In the first embodiment, during the sheet cooling step 1002, the expansion device 1 cools the region 215 between the inner edge of the annular frame 210 of the expansion piece 201 and the outer edge of the workpiece 200 to a second temperature lower than the first temperature. Therefore, since the second temperature is lower than the first temperature, the region 216 of the expansion piece 201 that is closer to the outer edge of the workpiece 200 is more easily expanded than the region 215 between the inner edge of the annular frame 210 and the outer edge of the workpiece 200.

[0059] (Segmentation steps)

[0060] Figure 6 It is shown schematically. Figure 4 The diagram shows a cross-sectional view of the segmentation step in the expansion method. Segmentation step 1003 is the step of expanding the expansion sheet 201 and segmenting the workpiece 200 into individual chips 202 after the sheet cooling step 1002. In the first embodiment, in segmentation step 1003, the expansion device 1 stops the injection of cooling air 23, 24 from the cooling unit 20, as shown... Figure 6 As shown, the piston rod 19 of the lifting unit 14 is reduced, causing the frame holding unit 12 to descend, and the frame holding unit 12 and the expansion drum 13 to move relative to each other in the vertical direction.

[0061] Therefore, the region 215 between the inner edge of the annular frame 210 of the extension piece 201 held by the frame holding unit 12 and the outer edge of the workpiece 200 comes into contact with the upper end of the expansion drum 13, thus causing the extension piece 201 to expand in the planar direction. In the dividing step 1003, as a result of the expansion, a radial tensile force acts on the extension piece 201.

[0062] Thus, when a radial tensile force is applied to the extension piece 201, which is bonded to the back surface 208 side of the substrate 203 of the workpiece 200 via the DAF 209, since the second temperature is lower than the first temperature, the region 216 of the extension piece 201 that is inside the outer edge of the workpiece 200 expands more than the region 215 between the inner edge of the annular frame 210 of the extension piece 201 and the outer edge of the workpiece 200. In the first embodiment, in the dividing step 1003, as... Figure 6As shown, in the segmentation step 1003, since the workpiece 200 has a modified layer 207 along the predetermined segmentation line 205, each device 206 is segmented with the modified layer 207 as the fracture starting point, and each chip 202 is monolithized. The workpiece 200 fractures along the modified layer 207, so the DAF 209 also fractures along the modified layer 207.

[0063] Furthermore, in the first embodiment, the frame holding unit 12 is lowered in the segmentation step 1003 to expand the expansion piece 201. However, the present invention is not limited to this; the expansion drum 13 may also be raised. In short, it is sufficient to raise the expansion drum 13 relative to the frame holding unit 12 and lower the frame holding unit 12 relative to the expansion drum 13. Thus, in the first embodiment, the expansion piece 201 is expanded in the segmentation step 1003 to segment the workpiece 200 into individual chips 202.

[0064] As explained above, the expansion device 1 of the first embodiment includes a cooling unit 20, which cools the region 216 of the expansion piece 201 that is inside the outer edge of the workpiece 200 to a first temperature, and cools the region 215 between the inner edge of the annular frame 210 of the expansion piece 201 and the outer edge of the workpiece 200 to a second temperature lower than the first temperature. Therefore, the expansion device 1 of the first embodiment can cool the region 215 between the inner edge of the annular frame 210 of the expansion piece 201 and the outer edge of the workpiece 200 to a temperature lower than that of the region 216 of the expansion piece 201 that is inside the outer edge of the workpiece 200, and can expand the expansion piece 201 in a state where the elasticity of the region 215 between the inner edge of the annular frame 210 of the expansion piece 201 and the outer edge of the workpiece 200 is suppressed compared to the region 216 that is inside the outer edge of the workpiece 200.

[0065] As a result, the expansion device 1 of the first embodiment has the following effect: it can sufficiently expand the region 216 of the expansion piece 201 that is inside the outer edge of the workpiece 200, thereby reducing the possibility of generating undivided regions on the workpiece 200.

[0066] Furthermore, in the expansion method of the first embodiment, since the sheet cooling step 1002 is performed to cool the region 216 of the expansion sheet 201 that is inside the outer edge of the workpiece 200 to a first temperature, and to cool the region 215 between the inner edge of the annular frame 210 of the expansion sheet 201 and the outer edge of the workpiece 200 to a second temperature lower than the first temperature, the following effect is achieved: the region 216 of the expansion sheet 201 that is inside the outer edge of the workpiece 200 can be sufficiently expanded, thereby reducing the possibility of generating undivided regions on the workpiece 200.

[0067] [Second Implementation]

[0068] The extension device and extension method of the second embodiment of the present invention will be described with reference to the accompanying drawings. Figure 7 This is a perspective view showing a structural example of the extension device according to the second embodiment. Figure 8 It is shown Figure 7 Top view of the sheet clamping unit and cooling worktable of the extended device shown. Figure 9 It is shown Figure 7 A cross-sectional view of the structure of the cooling workbench of the extended device shown. Figure 10 This is a cross-sectional view schematically illustrating the cooling step of the extended method of the second embodiment.

[0069] Figure 11 This is a cross-sectional view schematically showing the state of the expansion piece before expansion in the segmentation step of the expansion method of the second embodiment. Figure 12 This is a cross-sectional view schematically showing the state of the expanded sheet after the division step of the expansion method of the second embodiment. Figure 13 This is a schematic cross-sectional view of the cooling workbench after the segmentation step of the extended method of the second embodiment. Additionally, in Figures 7 to 13 In this document, parts that are the same as those in the first embodiment are marked with the same reference numerals and their descriptions are omitted.

[0070] The expansion device 1-2 of the second embodiment expands the expansion sheet 201 to which the workpiece 200 is attached along the first direction 212 and the second direction 213, dividing the workpiece 200 into individual chips 202 and dividing the DAF 209 according to each chip 202. Furthermore, the expansion device 1-2 is also a device that, after expanding the expansion sheet 201 to divide the workpiece 200 into individual chips 202, attaches an annular frame 210 to the expansion sheet 201 and supports the workpiece 200 within the opening 211 of the annular frame 210.

[0071] like Figure 7As shown, the expansion device 1-2 includes a flat fixed base 31, a cooling unit 40, a workpiece conveying unit (not shown), an expansion unit 60 as an expansion mechanism, a frame conveying unit (not shown), a sheet cutting unit (not shown), and a control unit 100.

[0072] The cooling unit 40 has a cooling worktable 41 disposed at the center of the fixed base 31. For example... Figure 8 As shown, the cooling worktable 41 has a quadrilateral shape (square in the second embodiment), and an extension piece 201, which is held by the sheet clamping unit 61 of the expansion unit 60 and to which the DAF 209 is attached, is placed on the abutment surface 42, which is the upper surface. That is, the cooling worktable 41 has an abutment surface 42 that abuts against the extension piece 201 held by the sheet clamping unit 61. The cooling worktable 41 is configured to move freely in the vertical direction via a moving mechanism. The abutment surface 42 is formed flat in the horizontal direction, and the workpiece 200 can be placed on the abutment surface 42 with the extension piece 201 in between.

[0073] Furthermore, in the second embodiment, such as Figure 8 and Figure 9 As shown, the contact surface 42 of the cooling worktable 41 includes: a first region 43, which corresponds to the region where the workpiece 200 is attached to the expansion piece 201 held by the sheet clamping unit 61; and a second region 44, which surrounds the first region 43 and corresponds to the region between the workpiece 200 of the expansion piece 201 held by the sheet clamping unit 61 and the region between the first clamping part 62-1, the second clamping part 62-2, the third clamping part 62-3 and the fourth clamping part 62-4 of the sheet clamping unit 61 of the expansion unit 60.

[0074] Region 43 is the area 217 where the workpiece 200 is attached and overlapped with the extension sheet 201 held by the sheet clamping unit 61. Figure 8 In the second embodiment, the first region 43 is located at the center of the abutment surface 42 and has a planar shape that is quadrilateral (square in the second embodiment). Furthermore, the region 217 on which the workpiece 200 is attached to the extension sheet 201 held by the sheet clamping unit 61 corresponds to the region on which the workpiece 200 is attached to the extension sheet 201.

[0075] The second region 44 is the region 217 where the workpiece 200 is attached to the extended sheet 201 held by the sheet clamping unit 61 overlaps with the region 218 between the first clamping part 62-1, the second clamping part 62-2, the third clamping part 62-3, and the fourth clamping part 62-4 of the sheet clamping unit 61. Figure 8In the second embodiment, the second region 44 is located on the outer edge of the abutment surface 42, and its inner and outer edges are formed into a quadrilateral (square in the second embodiment) frame shape. Furthermore, the region 217 where the workpiece 200 is attached to the extension sheet 201 held by the sheet clamping unit 61, and the region 218 between the first clamping portion 62-1, the second clamping portion 62-2, the third clamping portion 62-3, and the fourth clamping portion 62-4 of the sheet clamping unit 61, is the region of the extension sheet 201 where the workpiece 200 is not attached.

[0076] In addition, such as Figure 9 As shown, the cooling worktable 41 includes: a worktable base 45; a first Peltier element layer 46-1 disposed on the worktable base 45; a second Peltier element layer 46-2 disposed on the worktable base 45 and surrounding the outer edge of the first Peltier element layer 46-1; and a cooling plate 47 disposed on the Peltier element layers 46-1 and 46-2. The planar shapes of the worktable base 45 and the cooling plate 47 are equal to the planar shape of the cooling worktable 41. The upper surface of the cooling plate 47 is the aforementioned abutment surface 42.

[0077] The first Peltier element layer 46-1 and the second Peltier element layer 46-2 have at least one Peltier element that receives power from the power supply circuit 48. The first Peltier element layer 46-1 is disposed below the first region 43 of the abutment surface 42, and the second Peltier element layer 46-2 is disposed below the second region 44 of the abutment surface 42.

[0078] The power supply circuit 48 has a pair of polarity switching sections 49-1 and 49-2. The polarity switching sections 49-1 and 49-2 have a DC power supply 50 and a switch 51. When the power supply circuit 48 supplies power from the DC power supply 50 of one polarity switching section 49-1 to the Peltier element layers 46-1 and 46-2, the contact surfaces 42, i.e., regions 43 and 44, are cooled to a temperature lower than room temperature. When the power supply circuit 48 supplies power from the DC power supply 50 of the other polarity switching section 49-2 to the Peltier element layers 46-1 and 46-2, the contact surfaces 42, i.e., regions 43 and 44, are heated to a temperature higher than room temperature.

[0079] A polarity switching unit 49-1 of the power supply circuit 48 supplying power to the first Peltier element layer 46-1 provides power at a first voltage to the first Peltier element layer 46-1, cooling the first region 43 to a first temperature. A polarity switching unit 49-1 of the power supply circuit 48 supplying power to the second Peltier element layer 46-2 provides power at a second voltage higher than the first voltage to the second Peltier element layer 46-2, cooling the second region 44 to a second temperature. Thus, the first region 43 of the contact surface 42 of the cooling worktable 41 is set to the first temperature, and the second region 44 is set to a second temperature lower than the first temperature.

[0080] The workpiece conveying unit is positioned above the sheet clamping unit 61 and holds the workpiece 200 on its lower surface. The workpiece conveying unit is configured to move freely in the vertical direction via a lifting unit and also freely in the horizontal direction via a horizontal moving unit. The workpiece conveying unit positions the workpiece 200 held on the lower surface at a position vertically opposite the first region 43 of the cooling worktable 41 via the horizontal moving unit. Furthermore, the workpiece conveying unit descends via the lifting unit, thereby attaching the workpiece 200 to the DAF 209 held by the sheet clamping unit 61 on the extension sheet 201.

[0081] The expansion unit 60 has a sheet clamping unit 61 for clamping the expansion piece 201 and a moving unit 70.

[0082] The sheet clamping unit 61 has a first clamping part 62-1, a second clamping part 62-2, a third clamping part 62-3, and a fourth clamping part 62-4. The first clamping part 62-1, the second clamping part 62-2, the third clamping part 62-3, and the fourth clamping part 62-4 clamp the outer periphery of the workpiece 200 to which the extension sheet 201 of the workpiece 200 is attached.

[0083] The first clamping part 62-1 and the second clamping part 62-2 are positioned opposite each other across the workpiece 200 in the first direction 212 of the extension piece 201. The third clamping part 62-3 and the fourth clamping part 62-4 are positioned opposite each other across the workpiece 200 in the second direction 213 of the extension piece 201. The structures of the first clamping part 62-1, the second clamping part 62-2, the third clamping part 62-3, and the fourth clamping part 62-4 are substantially the same, therefore, the same reference numerals are used to describe the same parts.

[0084] The first clamping part 62-1, the second clamping part 62-2, the third clamping part 62-3, and the fourth clamping part 62-4 each have: a columnar movable base 63 disposed on a fixed base 31; a pair of clamping members 64 which are movably disposed on the movable base 63 in a vertical direction; and a moving mechanism 65 which moves the pair of clamping members 64 toward each other and toward each other.

[0085] A moving mechanism 65 is mounted on a moving base 63. The moving mechanism 65 includes: an electric motor that freely moves a pair of clamping members 64 in a vertical direction; a ball screw that rotates about an axis via the electric motor; and a nut that engages with the ball screw and is connected to the pair of clamping members 64 via a support arm 66. The moving mechanism 65 rotates the ball screw about an axis via the electric motor, causing the nut, support arm 66, and clamping members 64 to move in a vertical direction.

[0086] The moving mechanism 65 rotates the ball screw around its axis via a motor, thereby moving a pair of clamping members 64 toward each other and clamping the extension piece 201 between them. Alternatively, the moving mechanism 65 can also rotate the ball screw around its axis via a motor, thereby moving the pair of clamping members 64 toward each other and releasing the clamping of the extension piece 201 between them. Furthermore, the moving mechanism 65 can also rotate the ball screw around its axis via a motor, thereby moving the pair of clamping members 64 in the same direction in the vertical direction. Additionally, the moving base 63 of each clamping part 62-1, 62-2, 62-3, and 62-4, which houses a pair of clamping members 64 and the moving mechanism 65, is movably mounted on the fixed base 31 along either the first direction 212 or the second direction 213.

[0087] The moving unit 70 has a first moving unit 71 and a second moving unit 72.

[0088] The first moving unit 71 moves the movable base 63 of the first clamping part 62-1 and the movable base 63 of the second clamping part 62-2 along the first direction 212, thereby moving the movable base 63 of the first clamping part 62-1 and the movable base 63 of the second clamping part 62-2 in directions away from each other and in directions close to each other in the first direction 212. The first moving unit 71 also moves the movable base 63 of the first clamping part 62-1 and the movable base 63 of the second clamping part 62-2 along the first direction 212, thereby moving the clamping member 64 of the first clamping part 62-1 and the clamping member 64 of the second clamping part 62-2 in a manner that allows them to move closer and further apart in the first direction 212. The first moving unit 71 includes: a first moving mechanism 73-1 that moves the moving base 63 of the first clamping part 62-1 along the first direction 212; and a second moving mechanism 73-2 that moves the moving base 63 of the second clamping part 62-2 along the first direction 212.

[0089] The second moving unit 72 moves the moving base 63 of the third clamping part 62-3 and the moving base 63 of the fourth clamping part 62-4 along the second direction 213, thereby moving the moving base 63 of the third clamping part 62-3 and the moving base 63 of the fourth clamping part 62-4 in a direction of separation and a direction of approach in the second direction 213. The second moving unit 72 also moves the moving base 63 of the third clamping part 62-3 and the moving base 63 of the fourth clamping part 62-4 along the second direction 213, thereby moving the clamping member 64 of the third clamping part 62-3 and the clamping member 64 of the fourth clamping part 62-4 in a manner that allows them to approach and move away in the second direction 213. The second moving unit 72 includes: a third moving mechanism 73-3 that moves the moving base 63 of the third clamping part 62-3 along the second direction 213; and a fourth moving mechanism 73-4 that moves the moving base 63 of the fourth clamping part 62-4 along the second direction 213.

[0090] The structures of the first moving mechanism 73-1, the second moving mechanism 73-2, the third moving mechanism 73-3, and the fourth moving mechanism 73-4 are roughly the same, so the same numbers are used to describe the same parts.

[0091] The first moving mechanism 73-1, the second moving mechanism 73-2, the third moving mechanism 73-3, and the fourth moving mechanism 73-4 each have: an electric motor that enables the moving base 63 of the clamping portions 62-1, 62-2, 62-3, and 62-4 to move along a first direction 212 or a second direction 213; and a ball screw that causes the moving base 63 to move along a first direction 212 or a second direction 213 by rotating the electric motor about its axis.

[0092] The first moving mechanism 73-1, the second moving mechanism 73-2, the third moving mechanism 73-3, and the fourth moving mechanism 73-4 expand the extension piece 201 held by the clamping parts 62-1, 62-2, 62-3, and 62-4 by moving the clamping parts 62-1, 62-2, 62-3, and 62-4 in a direction that separates them from each other.

[0093] A frame conveying unit is positioned above the sheet clamping unit 61, holding the annular frame 210 on its lower surface. The frame conveying unit is configured to move freely in the vertical direction via a lifting unit and also freely in the horizontal direction via a horizontal moving unit (not shown). The frame conveying unit positions the annular frame 210 so that its opening 211, held on the lower surface, is vertically opposite to the workpiece 200 attached to the extension sheet 201 placed on the cooling worktable 41. Furthermore, the frame conveying unit descends via the lifting unit, thereby attaching the annular frame 210 to the extension sheet 201.

[0094] The sheet cutting unit cuts the extension piece 201, which is attached to the annular frame 210, along the annular frame 210. After attaching the annular frame 210 to the extension piece 201, the sheet cutting unit cuts the extension piece 201 between the inner and outer edges of the annular frame 210.

[0095] The control unit 100 controls the various structural elements of the expansion device 1-2, enabling the expansion device 1-2 to perform actions such as pasting the workpiece 200 relative to the expansion piece 201, expanding the expansion piece 201, and pasting the annular frame 210 relative to the expansion piece 201. Furthermore, the control unit 100 is a computer having a processing unit, a storage device, and an input / output interface device. The processing unit has a microprocessor such as a CPU (central processing unit), and the storage device has a memory such as ROM (read-only memory) or RAM (random access memory). The processing unit of the control unit 100 performs calculations according to the computer program stored in the storage device, and outputs control signals for controlling the expansion device 1-2 to the various structural elements of the expansion device 1-2 via the input / output interface device.

[0096] In addition, the control unit 100 is connected to a display unit (not shown) and an input unit (not shown). The display unit is composed of a liquid crystal display device or the like that that displays the status of the processing operation, images, etc., and the input unit is used when the operator registers processing content information, etc. The input unit is composed of at least one of an external input device such as a touch panel and a keyboard provided on the display unit.

[0097] The second embodiment of the expansion method involves expanding an expansion sheet 201 to which a workpiece 200 with a modified layer 207 is attached, thereby dividing the workpiece 200 into individual chips 202. The second embodiment of the expansion method is implemented by controlling the structural elements of the expansion devices 1-2 via a control unit 100, and similarly includes a holding step 1001, a sheet cooling step 1002, and a dividing step 1003, as in the first embodiment.

[0098] In the second embodiment, the holding step 1001 is the step of clamping and holding the extension piece 201 using the sheet clamping unit 61 of the extension device 1-2. In the second embodiment, in the holding step 1001, the extension piece 201 with DAF 209 attached is placed on the abutment surface 42 of the cooling worktable 41, and the extension device 1-2 uses the clamping portions 62-1, 62-2, 62-3, and 62-4 of the sheet clamping unit 61 to clamp the extension piece 201 placed on the abutment surface 42 of the cooling worktable 41. In the second embodiment, in the holding step 1001, the workpiece 200 is attached to the DAF 209 of the extension piece 201 clamped by the clamping portions 62-1, 62-2, 62-3, and 62-4 of the sheet clamping unit 61 using the workpiece transport unit.

[0099] In the second embodiment, the sheet cooling step 1002 is performed by bringing the extended sheet 201 into contact with the contact surface 42 of the cooling worktable 41. In the second embodiment, in the sheet cooling step 1002, as... Figure 10 As shown, a polarity switching unit 49-1 of the power supply circuit 48 of the extension device 1-2 provides power of a first voltage to the first Peltier element layer 46-1, cooling the first region 43 to a first temperature. A polarity switching unit 49-1 of the power supply circuit 48 provides power of a second voltage to the second Peltier element layer 46-2, cooling the second region 44 to a second temperature.

[0100] Thus, in the second embodiment, during the sheet cooling step 1002, the extending device 1-2 sets the first region 43 of the contact surface 42 to a first temperature, sets the second region 44 to a second temperature, cools the region 217 of the extending sheet 201 held by the sheet clamping unit 61 where the workpiece 200 is attached to to the first temperature, and cools the region 218 between the region 217 of the extending sheet 201 held by the sheet clamping unit 61 where the workpiece 200 is attached and the clamping portions 62-1, 62-2, 62-3, and 62-4 to the second temperature. Thus, in the second embodiment, during the sheet cooling step 1002, the extension device 1-2 cools the area 217 of the extension piece 201 held by the sheet clamping unit 61 where the workpiece 200 is attached and the area 218 between the clamping portions 62-1, 62-2, 62-3, and 62-4 are held in a manner that is lower than the temperature of the area 217 of the extension piece 201 held by the sheet clamping unit 61 where the workpiece 200 is attached.

[0101] In the second embodiment, in the segmentation step 1003, in Figure 11In the state shown, the expansion device 1-2 moves the first clamping part 62-1 and the second clamping part 62-2 in the first direction 212 in a direction of separation from each other by the first moving unit 71, thereby expanding the expansion piece 201 in the first direction 212. And the second moving unit 72 moves the third clamping part 62-3 and the fourth clamping part 62-4 in the second direction 213 in a direction of separation from each other, thereby expanding the expansion piece 201 in the second direction 213.

[0102] Therefore, in the segmentation step 1003, as a result of expansion, a radial tensile force is applied to the extension piece 201. Since the second temperature is lower than the first temperature, the region 217 of the extension piece 201 where the workpiece 200 is attached expands beyond the region 217 of the extension piece 201 where the workpiece 200 is attached and the region 218 between the clamping portions 62-1, 62-2, 62-3, and 62-4 of the extension piece 201. In the second embodiment, in the segmentation step 1003, since the workpiece 200 has a modified layer 207 formed along the predetermined segmentation line 205, each device 206 is segmented with the modified layer 207 as the fracture starting point, and each chip 202 is monolithized. The workpiece 200 fractures along the modified layer 207, and therefore the DAF 209 also fractures along the modified layer 207.

[0103] After the segmentation step 1003, the expanding device 1-2 attaches the annular frame 210 to the expanded sheet 201, which has been expanded by the frame conveying unit. The sheet cutting unit then cuts the annular frame 210 between the inner and outer edges of the expanded sheet 201, and the workpiece 200 is moved out together with the expanded sheet 201 and the annular frame 210. After the workpiece 200 is moved out, as... Figure 13 As shown, the other polarity switching part 49-2 of the power supply circuit 48 of the extension device 1-2 supplies power to the first Peltier element layer 46-1 to heat the first region 43 to room temperature, and the other polarity switching part 49-2 of the power supply circuit 48 supplies power to the second Peltier element layer 46-2 to heat the second region 44 to room temperature.

[0104] The expansion device 1-2 of the second embodiment includes a cooling unit 40, which cools the area 217 of the expansion piece 201 where the workpiece 200 is attached to it to a first temperature, and cools the area 218 between the area 217 of the expansion piece 201 where the workpiece 200 is attached and the clamping portions 62-1, 62-2, 62-3, 62-4 to a second temperature lower than the first temperature. Therefore, the expansion device 1 of the second embodiment can cool the area between the area of ​​the expansion piece 201 where the workpiece 200 is attached and the clamping portions 62-1, 62-2, 62-3, 62-4 to a temperature lower than that of the area of ​​the expansion piece 201 where the workpiece 200 is attached.

[0105] As a result, similar to the first embodiment, the expansion device 1-2 of the second embodiment has the following effect: it can sufficiently expand the area 217 of the expansion piece 201 where the workpiece 200 is attached, thereby reducing the possibility of generating undivided areas on the workpiece 200.

[0106] Furthermore, in the extended method of the second embodiment, a sheet cooling step 1002 is performed, in which the area 217 of the extended sheet 201 where the workpiece 200 is attached is cooled to a first temperature, and the area 218 between the area 217 of the extended sheet 201 where the workpiece 200 is attached and the clamping portions 62-1, 62-2, 62-3, and 62-4 is cooled to a second temperature lower than the first temperature. Therefore, the following effect is achieved: the area of ​​the extended sheet 201 where the workpiece 200 is attached can be sufficiently expanded, thereby reducing the possibility of undivided areas being generated on the workpiece 200.

[0107] [Variation Example]

[0108] The extended device of the second embodiment of the present invention will be described with reference to the accompanying drawings. Figure 14 This is a cross-sectional view showing the structure of the cooling workbench of the extended device in a modified example of the second embodiment. Additionally, in Figure 14 In this document, parts that are the same as those in the second embodiment are marked with the same reference numerals and their descriptions are omitted.

[0109] The extension device 1-2 in the second embodiment is the same as that in the second embodiment, except that the structure of the cooling workbench 41-1 is different. Figure 14 As shown, in the second embodiment, the cooling workbench 41-1 of the extension device 1-2 has only one Peltier element layer 46 on the workbench base 45, which has at least one Peltier element that is powered by the power supply circuit 48, and the cooling plate 47 is composed of the first cooling plate 47-1 and the second cooling plate 47-2.

[0110] The planar shape of the Peltier element layer 46 is equal to the planar shape of the cooling worktable 41-1. Similar to the second embodiment, the power supply circuit 48 has a pair of polarity switching sections 49-1 and 49-2.

[0111] The upper surface of the first cooling plate 47-1 is the first region 43, and the first cooling plate 47-1 is made of resin. The upper surface of the second cooling plate 47-2 is the second region 44, and the second cooling plate 47-2 is made of a metal, a material with a higher thermal conductivity than the material constituting the first cooling plate 47-1, i.e., resin (i.e., easier to transfer heat).

[0112] When the power supply circuit 48 supplies power from the DC power supply 50 of one polarity switching unit 49-1 to the Peltier element layer 46, the cooling worktable 41-1 cools the contact surface 42, i.e. regions 43 and 44, to a temperature lower than room temperature. When the DC power supply 50 of the other polarity switching unit 49-2 supplies power to the Peltier element layers 46-1 and 46-2, the contact surface 42, i.e. regions 43 and 44, is heated to a temperature higher than room temperature.

[0113] Additionally, when the power supply circuit 48 supplies power from the DC power supply 50 of a polarity switching unit 49-1 to the Peltier element layer 46, the cooling stage 41-1 cools the first region 43 to a first temperature and the second region 44 to a second temperature. Thus, Figure 14 The first region 43 of the contact surface 42 of the cooling workbench 41-1 shown is set to a first temperature, and the second region 44 is set to a second temperature that is lower than the first temperature.

[0114] The modified extension device 1-2 has a cooling unit 40, which cools the area 217 of the extension piece 201 where the workpiece 200 is attached to to a first temperature, and cools the area 218 between the area 217 of the extension piece 201 where the workpiece 200 is attached to and the clamping portions 62-1, 62-2, 62-3, 62-4 to a second temperature lower than the first temperature. Therefore, it has the same effect as the second embodiment in suppressing the possibility of undivided areas being generated on the workpiece 200.

[0115] In addition, in this invention, the cooling workbench 41-1 of the modified example may also be configured to have the same cooling plate 47 as in the first embodiment, with heat insulation material provided between the cooling plate 47 and the Peltier element layer 46 in the first region 43, and without heat insulation material provided between the cooling plate 47 and the Peltier element layer 46 in the second region 44.

[0116] Furthermore, the present invention is not limited to the embodiments described above. That is, various modifications can be made without departing from the spirit of the present invention. In the embodiments described above, the workpiece 200 on which the DAF 209 is attached to the back surface 208 or the workpiece 200 on which the metal film 214 is formed is divided into individual chips 202, but it is not limited thereto. For example, the present invention may also pre-divide the workpiece 200 attached to the extension sheet 201 into individual chips 202 and attach the DAF 209 to the back surface 208, and expand the extension sheet 201 to divide the DAF 209 according to each chip 202.

Claims

1. An expansion device for expanding a sheet to which a workpiece having dividing starting points is adhered, thereby dividing the workpiece, wherein, The extension device has: An expansion mechanism that expands the sheet; as well as The cooling unit cools the sheet in such a way that the temperature of the area of ​​the sheet where the workpiece is not attached is lower than the temperature of the area of ​​the sheet where the workpiece is attached. The expansion mechanism has: A sheet clamping unit has a first clamping portion and a second clamping portion that are opposite each other and clamp the sheet in a first direction with respect to the workpiece, and a third clamping portion and a fourth clamping portion that are opposite each other and clamp the sheet in a second direction perpendicular to the first direction with respect to the workpiece. The first moving unit causes the first clamping part and the second clamping part to move in a direction that separates them from each other in the first direction; as well as The second moving unit causes the third and fourth clamping parts to move in a direction of separation from each other in the second direction. The cooling unit has a cooling worktable for cooling the sheet, and the cooling worktable has a contact surface that abuts against the sheet held by the sheet clamping unit. The contact surface includes a first region and a second region. The first region corresponds to the area where the workpiece is attached, and the second region surrounds the first region and corresponds to the area between the workpiece and the first, second, third, and fourth clamping parts. The cooling workbench has a first Peltier element layer and a second Peltier element layer. The first Peltier element layer overlaps with the first region, and the second Peltier element layer overlaps with the second region and is independently powered from the first Peltier element layer. A first voltage is supplied to the first Peltier element layer, and the first region is set to a first temperature. A second voltage higher than the first voltage is supplied to the second Peltier element layer, and the second region is set to a second temperature lower than the first temperature.

2. The extension device according to claim 1, wherein, The second Peltier element layer is arranged around the outer edge of the first Peltier element layer, and a cooling plate is arranged on the first Peltier element layer and the second Peltier element layer, the upper surface of the cooling plate forming the contact surface.

3. An expansion method for dividing a sheet of workpiece to which a dividing point is attached by expanding the sheet, wherein... This extension method includes the following steps: The sheet cooling step involves cooling the sheet in such a way that the temperature of the area of ​​the sheet where the workpiece is not attached is lower than the temperature of the area of ​​the sheet where the workpiece is attached; and The slitting step involves expanding the sheet after the sheet cooling step to slit the workpiece. The sheet cooling step is performed by bringing the cooling worktable into contact with the sheet. The cooling worktable has a contact surface comprising a first region and a second region. The first region corresponds to the area where the workpiece is attached, and the second region surrounds the first region and corresponds to the area between the workpiece and the first, second, third, and fourth clamping parts. The cooling workbench has a first Peltier element layer and a second Peltier element layer. The first Peltier element layer overlaps with the first region, and the second Peltier element layer overlaps with the second region and is supplied with power independently of the first Peltier element layer. A first voltage of electricity is supplied to the first Peltier element layer, and the first region is set to a first temperature. A second voltage of electricity, higher than the first voltage, is supplied to the second Peltier element layer, and the second region is set to a second temperature, lower than the first temperature. In this splitting step, the first clamping part and the second clamping part, which are opposite each other and clamp the sheet in the first direction with respect to the workpiece, are moved in the first direction toward a direction of separation from each other, and the third clamping part and the fourth clamping part, which are opposite each other and clamp the sheet in the second direction with respect to the workpiece and perpendicular to the first direction, are moved in the second direction toward a direction of separation from each other, thereby expanding the sheet.

4. The extension method according to claim 3, wherein, The second Peltier element layer is arranged around the outer edge of the first Peltier element layer, and a cooling plate is arranged on the first Peltier element layer and the second Peltier element layer, the upper surface of the cooling plate forming the contact surface.

Images