Cut and stick film with spacers

Abstract

The present invention provides a cut adhesive film with spacers, comprising: a laminate having an adhesive layer for bonding to an object and a spacer layer overlapping the adhesive layer; and a cutting strip overlapping the adhesive layer of the laminate and for holding the laminate, wherein the laminate has a flexural stiffness of 0.05 N·mm at room temperature. 2 above.

Description

Technical Field

[0001] The present invention relates to a spacer-type cut adhesive film used, for example, in the manufacture of semiconductor integrated circuits. Background Technology

[0002] The methods for manufacturing semiconductor integrated circuits generally include: a pre-processing step of forming a circuit surface on one side of a wafer using highly integrated electronic circuits, and a post-processing step of cutting chips from the wafer with the circuit surface formed and assembling them.

[0003] With the further development of integration technology in recent years, in later processes, NAND flash memory chips are sometimes stacked multiple times to assemble semiconductor integrated circuits. In this case, for example, a semiconductor integrated circuit with a structure in which multiple NAND flash memory chips are stacked on top of a controller chip for control is manufactured. In this structure, for example, a spacer layer is disposed between the controller chip and the nearest NAND flash memory chip.

[0004] To date, processing films used in the manufacture of semiconductor integrated circuits as described above are known. These processing films come in various types depending on their purpose and are used in the aforementioned subsequent processes according to their respective purposes.

[0005] As a processing film, dicing chip bonding films are known, for example, for attaching semiconductor chips to a substrate. A dicing chip bonding film comprises: a dicing tape having a substrate layer and an adhesive layer, and an adhesive layer laminated on the dicing tape for bonding the substrate to the substrate.

[0006] On the other hand, as a processing film, there is a known cutting adhesive film with spacers, which has the following components for bonding the spacer layer to the substrate: a spacer layer, an adhesive layer for bonding the spacer layer to the substrate, and a cutting strip overlapping the adhesive layer.

[0007] For example, in the later stages of semiconductor integrated circuit manufacturing, the first step is performed, in which a die bonding film having a dicing tape and a die bonding layer is used as the processing film, such as... Figure 1A As shown, a miniaturized controller chip w' for control is fixed to the surface of a substrate (wiring substrate Z, etc.) using a chip bonding film with a chip bonding layer d'. Next, a second process is performed, in which a cut-bond film with spacers, having a cutting strip, an adhesive layer, and a spacer layer, is used as the processing film. Figure 1B As shown, the miniaturized spacer layer is fixed to the surface of the substrate (wiring substrate) using the thin film via an adhesive layer. Next, a third process is performed, in which a die-cutting bonding film as described above is used as the processing film. Figure 1CAs shown, a miniaturized NAND chip w” for storage is fixed onto the spacer layer 10 using a chip bonding film with a chip bonding layer d”, and then the NAND chip w” for storage is overlapped in the same way.

[0008] These processes are used to manufacture semiconductor integrated circuits as described above.

[0009] In this second process, for example, a cut adhesive film with spacers formed from a thin silicon wafer is used and the following processes are performed: forming grooves in the spacers and adhesive layer by cutting with a blade or the like and cutting them into small pieces; peeling the small pieces of spacers with adhesive layers attached from the cut strip; and bonding the spacers with adhesive layers attached to the substrate (wiring substrate).

[0010] In this method of manufacturing semiconductor integrated circuits, as a spacer-bearing cut bonding film used in the second step, it is known to have a film having a spacer layer formed of metal foil instead of a spacer layer formed of silicon wafer (for example, Patent Document 1).

[0011] In detail, the spacer layer in the cut adhesive film with spacers described in Patent Document 1 is a metal foil such as rolled steel foil or stainless steel foil.

[0012] According to Patent Document 1, the spacer-supported dicing and bonding film, since the spacer layer is not a silicon wafer but a metal foil, can maintain a stable manufacturing supply without being affected by insufficient silicon wafer supply. Furthermore, since the back-side grinding process described above for thinning the silicon wafer is unnecessary, the manufacturing process of semiconductor integrated circuits can be simplified.

[0013] However, in order to ensure electrical insulation between the NAND chips used for storage and the wiring substrate superimposed on the spacer layer, materials with electrical insulation, such as resin, are more suitable as the material constituting the spacer layer than conductive metals.

[0014] Existing technical documents

[0015] Patent documents

[0016] Patent Document 1: Japanese Patent Application Publication No. 2007-220913 Summary of the Invention

[0017] The problem the invention aims to solve

[0018] Therefore, it is possible to use an electrically insulating resin or the like to make a spacer layer, and to use a cut adhesive film with spacers, which is a laminated sheet having the spacer layer and an adhesive layer bonded together, in the second step described above.

[0019] However, in the second process described above, when the simple laminated sheet with electrical insulation spacer and adhesive layer is diced on the cutting strip and peeled off from the cutting strip, sometimes it is impossible to pick up the diced laminated sheet due to poor peeling or other reasons.

[0020] To prevent such problems, it is desirable to use a spacer-based cutting adhesive film with good pick-up properties when peeling the aforementioned stacked sheets into smaller pieces from the cutting tape.

[0021] However, the study of spacer-bonded films with good pick-up properties when peeling the laminate of spacer and adhesive layers from the cutting tape has not been sufficiently conducted.

[0022] Therefore, the objective of this invention is to provide a cut-and-adhesive film with spacers that has good pick-up properties when the laminate of the spacer layer and the adhesive layer is peeled off from the cut tape.

[0023] Solution for solving the problem

[0024] To solve the above problems, the spacer-supported cut adhesive film of the present invention is characterized by comprising:

[0025] A laminated sheet having an adhesive layer for bonding to an object and a spacer layer overlapping one side of the adhesive layer; and

[0026] A cutting strip overlaps and holds the aforementioned laminated sheet on the other side of the aforementioned adhesive layer, the laminated sheet having a flexural stiffness of 0.05 N·mm at room temperature. 2 above.

[0027] According to the above scheme, the pick-up performance of the spacer layer and adhesive layer laminated sheet when peeling it from the cutting strip is improved.

[0028] Preferably, the elastic modulus of the aforementioned spacer-bonded film is 1 GPa or higher. This further improves the pick-up performance of the laminate when the spacer layer and adhesive layer are peeled off from the cutting strip.

[0029] For the aforementioned cut adhesive film with spacers, the peel force between the adhesive layer and the spacer layer can be 0.1 N / 20 mm or more.

[0030] For the aforementioned cut adhesive film with spacers, the thickness of the aforementioned spacer layer can be more than 3 μm and less than 300 μm.

[0031] For the aforementioned cut adhesive film with spacers, the thickness of the adhesive layer can be 10 μm or more and 200 μm or less.

[0032] This further improves the pick-up performance of the laminated sheet of spacer and adhesive layers when it is peeled off from the cutting strip.

[0033] Preferably, the spacer layer of the aforementioned cut adhesive film with spacers is made of at least one material selected from the group consisting of polyimide, polyamide-imide, polyester, polybenzimidazole, polyetherimide, polyphenylene sulfide, and polyetheretherketone. This further improves the pick-up performance when the laminate of the spacer layer and adhesive layer is peeled off from the cut strip.

[0034] The aforementioned spacer-lined cut adhesive film can be used to embed semiconductor chips when manufacturing chip-embedded semiconductor integrated circuits, or to ensure space for stacking storage semiconductor chips on control semiconductor chips when manufacturing buried wire type semiconductor integrated circuits. Attached Figure Description

[0035] Figure 1A This is a schematic cross-sectional view illustrating an intermediate process in an example of the manufacturing process of a semiconductor integrated circuit.

[0036] Figure 1B This is a schematic cross-sectional view illustrating an intermediate process in an example of the manufacturing process of a semiconductor integrated circuit.

[0037] Figure 1C This is a schematic cross-sectional view illustrating an intermediate process in an example of the manufacturing process of a semiconductor integrated circuit.

[0038] Figure 2 This is a schematic perspective view of the cut adhesive film with spacers according to this embodiment.

[0039] Figure 3 This is a cross-sectional view of the cut adhesive film with spacers in this embodiment cut along the thickness direction.

[0040] Figure 4A This is a cross-sectional view schematically illustrating a case (assembly) of cutting and bonding thin films with spacers in a semiconductor integrated circuit manufacturing process.

[0041] Figure 4B This is a schematic cross-sectional view illustrating the use of spacer-lined cutting of adhesive films in a semiconductor integrated circuit manufacturing process (blade cutting).

[0042] Figure 4C This is a schematic cross-sectional view illustrating the use of spacer-lined cutting of an adhesive film in a semiconductor integrated circuit manufacturing process (after blade cutting).

[0043] Figure 4D This is a schematic cross-sectional view illustrating the use of spacer-coated cutting and bonding films in a semiconductor integrated circuit manufacturing process (pickup).

[0044] Figure 5AThis is a cross-sectional view schematically illustrating other examples of semiconductor integrated circuits.

[0045] Figure 5B This is a cross-sectional view schematically illustrating other examples of semiconductor integrated circuits.

[0046] Figure 5C This is a cross-sectional view schematically illustrating other examples of semiconductor integrated circuits.

[0047] Figure 5D This is a cross-sectional view schematically illustrating other examples of semiconductor integrated circuits.

[0048] Figure 5E This is a cross-sectional view schematically illustrating other examples of semiconductor integrated circuits.

[0049] Figure 6A It is a schematic cross-sectional view illustrating the fabrication of a laminate with spacer layers and adhesive layers.

[0050] Figure 6B It is a schematic cross-sectional view illustrating the fabrication of a laminate with spacer layers and adhesive layers.

[0051] Figure 7A This is a schematic cross-sectional view illustrating the intermediate process of manufacturing the spacer-lined cut adhesive film of this embodiment.

[0052] Figure 7B It is a schematic cross-sectional view showing a section cut along the length of a spacer-containing cut adhesive film during the manufacturing process.

[0053] Figure 8A This is a schematic cross-sectional view illustrating the intermediate process of manufacturing the spacer-lined cut adhesive film of this embodiment.

[0054] Figure 8B It is a schematic cross-sectional view showing a section cut along the length of a spacer-containing cut adhesive film during the manufacturing process.

[0055] Figure 8C It is a schematic cross-sectional view showing a section cut along the length of a spacer-containing cut adhesive film during the manufacturing process.

[0056] Figure 8D It is a schematic cross-sectional view showing a section cut along the length of a spacer-containing cut adhesive film during the manufacturing process.

[0057] Figure 9A This is a schematic cross-sectional view illustrating the intermediate process of manufacturing the spacer-lined cut adhesive film of this embodiment.

[0058] Figure 9B It is a schematic cross-sectional view showing a section cut along the length of a spacer-containing cut adhesive film during the manufacturing process.

[0059] Figure 9C It is a schematic cross-sectional view showing a section cut along the length of a spacer-containing cut adhesive film during the manufacturing process.

[0060] Figure 9D It is a schematic cross-sectional view showing a section cut along the length of a spacer-containing cut adhesive film during the manufacturing process.

[0061] Figure 10A This is a schematic cross-sectional view illustrating other examples of spacer-lined cut adhesive films according to this embodiment.

[0062] Figure 10B This is a schematic cross-sectional view illustrating another example of a spacer-filled cut adhesive film during the manufacturing process.

[0063] Explanation of reference numerals in the attached figures

[0064] 1: Cut and bonded film with spacers.

[0065] 10: Spacing layer,

[0066] 20: Adhesive layer,

[0067] 30: Cutting strip,

[0068] 31: Substrate layer; 32: Adhesive layer.

[0069] L: Bonding wire, Z: Substrate

[0070] d', d”: chip bonding layer; w', w”: semiconductor chip.

[0071] H: Release tape, T: Transfer tape. Detailed Implementation

[0072] Hereinafter, embodiments of the spacer-type cut adhesive film of the present invention will be described with reference to the accompanying drawings.

[0073] The spacer-supported cut adhesive film 1 in this embodiment is as follows: Figure 2 As shown, this is a long sheet, stored rolled up until used. (The text abruptly ends here.) Figure 2 A cross-sectional view cut along the thickness direction from line III-III is shown in Figure 3 .

[0074] like Figure 3As shown, the spacer-supported cut adhesive film 1 of this embodiment includes: a laminate having an adhesive layer 20 for bonding to an object and a spacer layer 10 overlapping one side of the adhesive layer 20; and

[0075] A cutting tape 30 overlaps on the other side of the adhesive layer 20 of the laminate and holds the laminate in place. The adhesive layer 20 will be bonded to the circuit board or semiconductor chip and other objects during the manufacture of semiconductor integrated circuits.

[0076] like Figure 2 and Figure 3 As shown, when the cut adhesive film 1 with spacers is viewed from one side of the thickness direction, the cut strip 30 is strip-shaped, and the spacer layer 10 and adhesive layer 20 are circular and arranged along the length direction of the cut strip 30.

[0077] The spacer-type cut adhesive film 1 of this embodiment can be used to bond the adhesive layer 20 to the substrate Z by embedding the controller chip w' for control using the adhesive layer 20. Furthermore, the spacer-type cut adhesive film 1 of this embodiment can be used to bond a NAND-type memory chip w' to the spacer layer 10 bonded to the substrate Z by means of the adhesive layer 20.

[0078] It should be noted that, as Figure 3 As shown, the spacer-lined cutting adhesive film 1 of this embodiment may further include a protective film (peel-off strip H) for protecting a portion of the surface of the spacer layer 10 and the surface of the adhesive layer 32 of the cutting strip 30.

[0079] <Spacer layer for cut adhesive films with spacers>

[0080] The thickness (average thickness) of the spacer layer 10 can be greater than 3 μm and less than 300 μm, or greater than 3 μm and less than 100 μm.

[0081] It should be noted that the thickness of spacer layer 10 is calculated by averaging the thickness measurements at at least five randomly selected locations. When spacer layer 10 is a laminate, the thickness of spacer layer 10 is the thickness of the laminate (the total thickness of spacer layer 10).

[0082] Spacer layer 10 is typically made of resin. Spacer layer 10 typically contains at least 50% by weight of resin. The material of spacer layer 10 is preferably selected from at least one of the group consisting of polyimide, polyamide-imide, polyester, polybenzimidazole, polyetherimide, polyphenylene sulfide and polyetheretherketone, more preferably at least one of polyimide and polyetherimide, and even more preferably polyimide.

[0083] In other words, the spacer layer 10 is preferably made of polyimide, polyamide-imide, polyester (such as polyethylene terephthalate), polybenzimidazole, polyetherimide, polyphenylene sulfide, polyetheretherketone, etc.

[0084] By using the aforementioned material for the spacer layer 10, it is advantageous that the spacer layer 10 possesses sufficient electrical insulation. Furthermore, when a reflow soldering process is performed in the manufacturing of semiconductor integrated circuits, it is advantageous that the spacer layer 10 possesses heat resistance to high temperatures, such as around 260°C.

[0085] <Adhesive layer of cut adhesive film with spacers>

[0086] The thickness (average thickness) of the adhesive layer 20 is not particularly limited, but may be, for example, 1 μm or more and 200 μm or less. Preferably, this thickness is 10 μm or more and 200 μm or less, more preferably 20 μm or more and 150 μm or less. It should be noted that when the adhesive layer 20 is a laminate, the thickness of the adhesive layer 20 is the thickness of the laminate (the total thickness of the adhesive layer 20).

[0087] The thickness of the adhesive layer 20 is calculated by averaging the thickness measurements at at least 10 randomly selected locations.

[0088] When the adhesive layer 20 is thicker, for example, 100 μm or more, it is suitable for use in the FOD application described later (for embedding semiconductor chips in the manufacture of chip-embedded semiconductor integrated circuits).

[0089] When the thickness of the adhesive layer 20 is relatively thin, for example less than 100 μm, it is suitable for the FOW application described later (the application of ensuring space for stacking storage semiconductor chips on control semiconductor chips when manufacturing buried wire type semiconductor integrated circuits).

[0090] Adhesive layer 20, for example Figure 3 As shown, a single-layer structure is possible. In this specification, a single layer refers to a layer consisting of only one layer formed from the same composition. A structure consisting of multiple layers formed from the same composition stacked together is also considered a single layer.

[0091] On the other hand, the adhesive layer 20 may, for example, have a multilayer structure formed by stacking layers of two or more different compositions.

[0092] The adhesive layer 20 may comprise at least one of a thermosetting resin and a thermoplastic resin. The adhesive layer 20 preferably comprises a thermosetting resin and a thermoplastic resin.

[0093] Examples of thermosetting resins include epoxy resins, phenolic resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting polyimide resins. One or more of these thermosetting resins may be used. Epoxy resins are preferred as thermosetting resins because they contain fewer ionic impurities that could cause corrosion of the semiconductor chip to which the chip is bonded. Phenolic resins are preferred as curing agents for epoxy resins.

[0094] Examples of epoxy resins mentioned above include: bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenolic varnish type, o-cresol phenolic varnish type, trihydroxyphenylmethane type, tetraphenylhydroxyethane type, hydantoin type, triglycidyl isocyanurate type, or glycidylamine type epoxy resins.

[0095] Phenolic resins can function as curing agents for epoxy resins. Examples of phenolic resins include: phenolic varnish-type phenolic resins, methyl phenolic resin-type phenolic resins, and polyoxystyrene, etc.

[0096] Examples of phenolic resins used in varnishes include: phenolic varnish resin, phenolic aralkyl resin, cresol varnish resin, tert-butylphenol varnish resin, and nonylphenol varnish resin.

[0097] The above-mentioned phenolic resin may be used in the form of only one type or in the form of two or more types.

[0098] In the adhesive layer 20, the hydroxyl groups of the phenolic resin are preferably 0.5 equivalents or more and 2.0 equivalents or less, more preferably 0.7 equivalents or more and 1.5 equivalents or less, relative to the epoxy groups of the epoxy resin. This allows for a sufficient curing reaction between the epoxy resin and the phenolic resin.

[0099] When the adhesive layer 20 contains a thermosetting resin, the content of the thermosetting resin in the adhesive layer 20 is preferably 5% by mass or more and 60% by mass or less, more preferably 10% by mass or more and 50% by mass or less, relative to the total mass of the adhesive layer 20. Therefore, the adhesive layer 20 can appropriately perform its function as a thermosetting adhesive.

[0100] Thermoplastic resins that may be included in the adhesive layer 20 include, for example: natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, 6-polyamide resin, 6,6-polyamide resin and other polyamide resins, phenoxy resins, acrylic resins, saturated polyester resins such as PET and PBT, polyamide-imide resins, fluoropolymers, etc.

[0101] Of the aforementioned thermoplastic resins, acrylic resins are preferred in that they have fewer ionic impurities and higher heat resistance, which further ensures the adhesion of the adhesive layer 20.

[0102] One or more thermoplastic resins may be used as the above-mentioned thermoplastic resins.

[0103] The aforementioned acrylic resin is preferably a polymer in which the (meth)acrylate alkyl ester constitutive unit is the most abundant by mass ratio among the constitutive units of the molecule. Examples of such (meth)acrylate alkyl esters include (meth)acrylate C2 to C4 alkyl esters in which the alkyl moiety (usually a saturated hydrocarbon) has 2 or more but less than 4 carbon atoms.

[0104] The aforementioned acrylic resins may contain constituent units derived from other monomeric components capable of copolymerizing with (meth)acrylate alkyl ester monomers.

[0105] Other monomeric components mentioned above include, for example, monomers containing carboxyl groups, acid anhydride monomers, monomers containing hydroxyl (hydroxyl) groups, monomers containing glycidyl groups, monomers containing sulfonic acid groups, monomers containing phosphate groups, acrylamide, acrylonitrile and other monomers containing functional groups, or various other multifunctional monomers.

[0106] In terms of being able to exert higher cohesive strength in the adhesive layer 20, the aforementioned acrylic resin is preferably a copolymer of alkyl (meth)acrylate (especially alkyl (meth)acrylate with 4 or fewer carbon atoms in the alkyl portion), carboxyl-containing monomers, nitrogen-containing monomers, and polyfunctional monomers (especially polyglycidyl polyfunctional monomers), and more preferably a copolymer of ethyl acrylate, butyl acrylate, acrylic acid, acrylonitrile, and poly(meth)acrylate.

[0107] When the adhesive layer 20 comprises both thermosetting resin and thermoplastic resin, the content ratio of the aforementioned thermoplastic resin in the adhesive layer 20 is preferably 5% by mass or more and 50% by mass or less, more preferably 10% by mass or more and 45% by mass or less, and even more preferably 20% by mass or more and 40% by mass or less, relative to the total mass of organic components other than fillers (e.g., thermosetting resin, thermoplastic resin, curing catalyst, silane coupling agent, dye). It should be noted that the elasticity and tackiness of the adhesive layer 20 can be adjusted by changing the content ratio of the thermosetting resin.

[0108] When the thermoplastic resin of the adhesive layer 20 has thermosetting functional groups, such a thermoplastic resin can be, for example, an acrylic resin containing thermosetting functional groups. This acrylic resin containing thermosetting functional groups preferably contains, in the largest possible mass proportion, constituent units derived from alkyl (meth)acrylates in its molecule. Examples of such alkyl (meth)acrylates include, for example, the alkyl (meth)acrylates exemplified above.

[0109] On the other hand, thermosetting functional groups in acrylic resins containing thermosetting functional groups include, for example, glycidyl groups, carboxyl groups, hydroxyl (hydroxyl) groups, isocyanate groups, etc.

[0110] The adhesive layer 20 preferably comprises an acrylic resin containing thermosetting functional groups and a curing agent. Examples of curing agents that can be included in the adhesive layer 32 include substances such as isocyanate compounds. When the thermosetting functional group in the acrylic resin is a glycidyl group, it is preferable to use a compound having multiple phenolic structures in its molecule as the curing agent. For example, various phenolic resins described above can be used as curing agents.

[0111] The adhesive layer 20 preferably contains filler. By changing the amount of filler in the adhesive layer 20, the elasticity and viscosity of the adhesive layer 20 can be more easily adjusted. Furthermore, the electrical conductivity, thermal conductivity, elastic modulus, and other physical properties of the adhesive layer 20 can be adjusted.

[0112] Inorganic and organic packing materials can be listed as packing materials. Inorganic packing materials are preferred.

[0113] Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, crystalline silicon dioxide, and amorphous silicon dioxide. Furthermore, materials used as inorganic fillers include elemental metals and alloys such as aluminum, gold, silver, copper, and nickel. Fillers can also include aluminum borate whiskers, amorphous carbon black, and graphite. The shape of the filler can be spherical, needle-like, flake-like, or various other shapes. One or more of the above-mentioned materials can be used as fillers.

[0114] When the adhesive layer 20 contains filler, the filler content ratio relative to the total mass of the adhesive layer 20 is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, and even more preferably 40% by mass or more and 55% by mass or less.

[0115] The adhesive layer 20 may contain other components as needed. Examples of such other components include: curing catalysts, flame retardants, silane coupling agents, ion scavengers, dyes, etc.

[0116] Examples of flame retardants include antimony trioxide, antimony pentoxide, and brominated epoxy resin.

[0117] Examples of silane coupling agents include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-epoxypropoxypropyltrimethoxysilane, and γ-epoxypropoxypropylmethyldiethoxysilane.

[0118] Examples of ion scavengers include hydrotalcite, bismuth hydroxide, and benzotriazole.

[0119] As other additives mentioned above, one or more may be used.

[0120] The adhesive layer 20 preferably comprises a thermoplastic resin (especially an acrylic resin), a thermosetting resin, and a filler, in order to easily adjust its elasticity and tack.

[0121] The ratio of thermoplastic resin and thermosetting resin relative to the total mass of adhesive layer 20 is preferably 20% by mass or more and 95% by mass or less, more preferably 30% by mass or more and 90% by mass or less, and even more preferably 40% by mass or more and 85% by mass or less.

[0122] When using the spacer-lined cut adhesive film 1 of this embodiment, the adhesive layer 20 can be cured by heat treatment or the like. For example, the adhesive layer 20 with spacer 10 can be bonded to the substrate Z in such a way that the adhesive layer 20 covers the controller chip w' for control on the substrate Z, and then heat treatment (e.g., curing at 70°C or higher and 150°C or lower) can be performed to cure the adhesive layer 20.

[0123] <Laminated sheets (spacer layer and adhesive layer) in cut adhesive films with spacers>

[0124] The laminate formed by the spacer layer 10 and the adhesive layer 20 has a flexural stiffness of 0.05 N·mm at room temperature. 2 The above. A more preferred bending stiffness is 0.10 N·mm. 2The above is further preferably 0.50 N·mm. 2 The above is particularly preferred, with a strength of 2.0 N·mm. 2 above.

[0125] Since the bending stiffness is 0.05 N·mm 2 The above, for example Figure 4D As shown, when the laminated sheets are lifted through the cutting strip 30, they easily peel off from the cutting strip 30. Specifically, this is because the bending stiffness is 0.05 N·mm. 2 This higher value prevents the laminate from deforming in accordance with the deformation of the cutting strip 30 when it is lifted as described above. Because the deformation of the laminate is suppressed, the force applied when lifting it is easily converted into a force for peeling. Therefore, pickup performance is improved.

[0126] It should be noted that the aforementioned bending stiffness can be 25.0 N·mm. 2 The following can also be 20.0 N·mm 2 the following.

[0127] Room temperature refers to a temperature between 20°C and 25°C; 25°C can be used as the room temperature.

[0128] The bending stiffness described above is calculated using the following equation (1). In equation (1), b represents the length of the rectangular spacer layer 10 (the size when it is used by cutting into smaller pieces) in the longitudinal direction (the length of one side in the case of a square), F represents the tensile modulus, h represents the thickness of the laminate, and λ represents the distance from the upper edge of the laminate to the neutral axis. In equation (1), the laminate is treated as a single layer for calculating the bending stiffness. Specifically, the bending stiffness described above is measured using the method described in the embodiments below.

[0129] It should be noted that the tensile modulus in equation (1) is determined by the method described later.

[0130]

[0131] Note) The laminate is calculated as a single layer.

[0132] As can be seen from equation (1), the aforementioned bending stiffness can be increased by further increasing the elastic modulus of at least one of the spacer layer 10 and the adhesive layer 20, and by further increasing the thickness of at least one of the spacer layer 10 and the adhesive layer 20. On the other hand, the aforementioned bending stiffness can be decreased by further decreasing the elastic modulus of at least one of the spacer layer 10 and the adhesive layer 20, and by further thinning the thickness of at least one of the spacer layer 10 and the adhesive layer 20.

[0133] The elastic modulus (tensile modulus) of the aforementioned laminated sheet is preferably 1 GPa or more, more preferably 1.5 GPa or more, and even more preferably 2 GPa or more. This results in better pick-up performance when the laminated sheet containing the spacer layer and adhesive layer is peeled off from the cutting strip 30.

[0134] It should be noted that the tensile modulus of the above-mentioned laminated sheets can be below 5 GPa or below 4 GPa.

[0135] The method for determining the tensile modulus is as follows: A sample with a length of 40 mm and a width of 10 mm is cut from a laminate formed by the spacer layer 10 and the adhesive layer 20. The tensile storage modulus from -30°C to 300°C is measured using a solid viscoelasticity measuring device. The measurement conditions are: frequency 1 Hz, heating rate 10°C / min, and chuck spacing 20.0 mm. Then, the measured value of the storage modulus at room temperature (preferably 25°C) is used as the tensile modulus.

[0136] The tensile modulus can be increased by using a material with a higher elastic modulus as the material constituting at least one of the spacer layer 10 and the adhesive layer 20, or by increasing the content of the material with a higher elastic modulus in at least one of the spacer layer 10 and the adhesive layer 20. On the other hand, the tensile modulus can be decreased by using a material with a lower elastic modulus as the material constituting at least one of the spacer layer 10 and the adhesive layer 20, or by increasing the content of the material with a lower elastic modulus in at least one of the spacer layer 10 and the adhesive layer 20.

[0137] The temperature at which the tensile modulus was measured was room temperature, the temperature at which the adhesive film 1 was cut using spacers. Specifically, the laminated sheet consisting of spacer layer 10 and adhesive layer 20 was cut into smaller pieces (see reference). Figure 4B , Figure 4C The miniaturized laminated sheets are peeled off and picked up between the adhesive layer 32 and the cutting strip 30 (see reference). Figure 4D The temperature at which the tensile modulus is measured is comparable to the temperature at which the tensile modulus is measured.

[0138] The peel force between the adhesive layer 20 and the spacer layer 10 is preferably 0.1 N / 20 mm or more. It should be noted that the peel force can be 0.5 N / 20 mm or less.

[0139] The peel force described above was measured at room temperature using a test sample with a length of 120 mm and a width of 25 mm. The peel force was measured under the following conditions: peel speed of 300 mm / min, peel angle of 90 degrees, and measurement temperature of 25°C. Specifically, the peel force was measured using the method described in the examples below.

[0140] To increase the peel force, for example, plasma surface treatment can be applied to the surface of the spacer layer 10, which is in direct contact with the adhesive layer 20, or a cleaning treatment based on wiping with alcohol or the like can be performed. On the other hand, to reduce the peel force, for example, a demolding treatment can be performed on the surface of the spacer layer 10 with silicone, and the demolded surface can be overlapped onto the adhesive layer 20.

[0141] The thickness (average thickness) of the laminate (spacer layer and adhesive layer) can be greater than 30 μm and less than 300 μm, or greater than 40 μm and less than 200 μm.

[0142] It should be noted that the thickness of the laminate is calculated by averaging the thickness measurements at at least five randomly selected locations.

[0143] In this embodiment, the spacer-lined cut adhesive film 1, before use, may have a peel strip covering one side of the spacer layer 10 (the side of the spacer layer 10 that does not overlap with the adhesive layer 20). The peel strip is used to protect the spacer layer 10, for example, by peeling it off just before use.

[0144] Next, the cutting strip 30 that is adhered to the adhesive layer 20 will be described in detail.

[0145] <Cutting tape with spacers for cutting adhesive film>

[0146] The aforementioned cutting strip 30 is typically strip-shaped and is stretched across an annular frame having an inner diameter slightly larger than that of the silicon wafer to be cut, for cutting and use.

[0147] The cutting strip 30 has a substrate layer 31 and an adhesive layer 32 overlapping the substrate layer 31.

[0148] The substrate layer 31 can be a single-layer structure or a multilayer structure.

[0149] The substrate layer 31 supports the adhesive layer 32. The substrate layer 31 contains resin. Examples of resins contained in the substrate layer 31 include: polyolefins (polypropylene (PP), high-density polyethylene (HDPE), low-density polyethylene (LDPE), α-olefins, etc.), ethylene-vinyl acetate copolymer (EVA), ethylene-methyl acrylate (EMA), ethylene-ethyl acrylate (EEA), ethylene-methyl methacrylate (EMMA), styrene-butadiene rubber (SBR), hydrogenated styrene thermoplastic elastomers (SEBS), styrene-ethylene-propylene-styrene block copolymers (SEPS), polyesters, polyurethanes, polycarbonates, polyetheretherketones, polyimides, polyetherimides, polyamides, fully aromatic polyamides, polyvinyl chloride, polyvinylidene chloride, polyphenylene sulfide, fluoropolymers, cellulose resins, silicone resins, and ionomer resins, etc.

[0150] The substrate layer 31 may contain one of the above-mentioned resins, or it may contain two or more of them.

[0151] It should be noted that, in the case where the adhesive layer 32 described below is a layer that is cured by ultraviolet light, the substrate layer 31 is preferably constructed in a manner that allows for ultraviolet light transmission.

[0152] The substrate layer 31 can be obtained by non-stretch forming or by stretch forming. Preferably, the substrate layer 31 is obtained by stretch forming.

[0153] The thickness (total thickness) of the substrate layer 31 is preferably 55 μm or more and 195 μm or less, more preferably 55 μm or more and 190 μm or less, even more preferably 55 μm or more and 170 μm or less, and most suitable is 60 μm or more and 160 μm or less.

[0154] The thickness of the substrate layer 31 can be determined, for example, by measuring the thickness at five randomly selected points using a dial indicator (manufactured by PEACOCK, model R-205) and taking the arithmetic mean of these thicknesses.

[0155] The substrate layer 31 is preferably composed of a resin film.

[0156] To improve the adhesion of the adhesive layer 32, the surface of the substrate layer 31 can be surface-treated. Examples of surface treatments include oxidation treatments based on chemical or physical methods, such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionizing radiation treatment. Alternatively, coating treatments based on coating agents such as anchoring agents, primers, and adhesives can be performed.

[0157] For the back side of the substrate layer 31 (the side that does not overlap the adhesive layer 32), in order to impart peelability, a release treatment can be performed, for example, by using a release agent (release agent) such as a silicone resin or a fluorine resin.

[0158] In terms of imparting active energy rays such as ultraviolet rays to the adhesive layer 32 from the back side, the substrate layer 31 is preferably a light-transmitting (ultraviolet-transmitting) resin film or the like.

[0159] In its pre-use state, the aforementioned cutting tape 30 may have a release tape covering one side of the adhesive layer 32 (the side of the adhesive layer 32 that does not overlap with the substrate layer 31). When the adhesive layer 20, which has an area smaller than the adhesive layer 32, is arranged to be contained within the adhesive layer 32, the release tape is arranged to cover both the adhesive layer 32 and the adhesive layer 20. The release tape serves to protect the adhesive layer 32 and is peeled off before the adhesive layer 20 is adhered to the adhesive layer 32.

[0160] As a release strip, for example, plastic films or paper that have been surface-treated with release agents such as silicon-based, long-chain alkyl-based, fluorine-based, or molybdenum sulfide can be used.

[0161] In addition, as a release strip, for example, films made of fluorinated polymers such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer can be used; films made of polyolefins such as polyethylene and polypropylene; and films made of polyesters such as polyethylene terephthalate (PET).

[0162] In addition, as a release strip, for example, plastic films or paper coated with release agents such as fluorine-based release agents or long-chain alkyl ester-based release agents can be used.

[0163] In this embodiment, the adhesive layer 32 may include, for example, an acrylic polymer, an isocyanate compound, and a polymerization initiator.

[0164] The adhesive layer 32 may have a thickness of 5 μm or more and 40 μm or less. The shape and size of the adhesive layer 32 are generally the same as those of the substrate layer 31.

[0165] The aforementioned acrylic polymers have at least three constituent units: alkyl (meth)acrylate units, hydroxyl-containing (meth)acrylate units, and polymerizable (meth)acrylate units in their molecules. The constituent unit is the unit that constitutes the main chain of the acrylic polymer. Each side chain in the aforementioned acrylic polymer is contained within each constituent unit constituting the main chain.

[0166] It should be noted that in this specification, the term "(meth)acrylate" refers to at least one of methacrylate and acrylate. Similarly, the term "(meth)acrylic acid" refers to at least one of methacrylic acid and acrylic acid.

[0167] In the acrylic polymer contained in the adhesive layer 32, the aforementioned constituent units can be... 1 H-NMR, 13 The results were confirmed by NMR analysis such as C-NMR, pyrolysis GC / MS analysis, and infrared spectroscopy. It should be noted that the molar proportions of the aforementioned constituent units in acrylic polymers are usually calculated based on the mixing amount (dosage) during the polymerization of the acrylic polymer.

[0168] The building blocks of the aforementioned alkyl methacrylates are derived from alkyl methacrylate monomers. In other words, the molecular structure of alkyl methacrylate monomers after polymerization is the building block of alkyl methacrylates. The designation "alkyl" indicates the hydrocarbon portion bonded to (meth)acrylic acid via ester bonds.

[0169] The hydrocarbon portion of the alkyl group in the constituent unit of (meth)acrylate can be either a saturated hydrocarbon or an unsaturated hydrocarbon.

[0170] It should be noted that the alkyl portion preferably does not contain polar groups such as oxygen (O) and nitrogen (N). This suppresses extreme polarity increases in the alkyl polymer. Therefore, excessive affinity of the adhesive layer 32 for the adhesive layer 20 can be prevented. Consequently, the cutting strip 30 can be more effectively peeled off from the adhesive layer 20. The alkyl portion can have 6 or more but less than 10 carbon atoms (C6 to 10 alkyl).

[0171] Examples of constituent units of (meth)acrylate alkyl esters include: (meth)acrylate hexyl ester, (meth)acrylate 2-ethylhexyl ester, (meth)acrylate n-nonyl ester or isononyl ester, (meth)acrylate decyl ester, etc.

[0172] Acrylic polymers have hydroxyl-containing (meth)acrylate building blocks, the hydroxyl groups of which readily react with isocyanate groups.

[0173] By allowing an acrylic polymer having hydroxyl-containing (meth)acrylate constituent units to coexist with an isocyanate compound in the adhesive layer 32, the adhesive layer 32 can be moderately cured. Therefore, the acrylic polymer can be fully gelled. Thus, the adhesive layer 32 can maintain its shape while exhibiting adhesive properties.

[0174] The constituent units of hydroxyl-containing (meth)acrylates are preferably C2-C4 alkyl esters of hydroxyl-containing (meth)acrylates. The designation "C2-C4 alkyl" indicates the number of carbon atoms in the hydrocarbon portion bonded to (meth)acrylate via an ester bond. In other words, a C2-C4 alkyl ester monomer of hydroxyl-containing (meth)acrylates refers to a monomer obtained by bonding (meth)acrylate with an alcohol (usually a dihydric alcohol) having 2 or more but less than 4 carbon atoms via an ester bond.

[0175] The hydrocarbon portion of C2-C4 alkyl groups is typically a saturated hydrocarbon. For example, the hydrocarbon portion of C2-C4 alkyl groups is a straight-chain saturated hydrocarbon or a branched-chain saturated hydrocarbon. Preferably, the hydrocarbon portion of C2-C4 alkyl groups does not contain polar groups such as oxygen (O) or nitrogen (N).

[0176] Examples of hydroxyl-containing C2-C4 alkyl esters of (meth)acrylate include hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxy-n-butyl (meth)acrylate, and hydroxyisobutyl (meth)acrylate. It should be noted that in the hydroxybutyl (meth)acrylate unit, the hydroxyl group (-OH group) can be bonded to the terminal carbon (C) of the hydrocarbon moiety, or to any carbon (C) of the hydrocarbon moiety other than the terminal carbon.

[0177] The aforementioned acrylic polymers comprise (meth)acrylates containing polymerizable groups in their side chains, which are the building blocks of these polymeric unsaturated double bonds.

[0178] By incorporating (meth)acrylate constituent units containing polymerizable groups into the aforementioned acrylic polymers, the adhesive layer 32 can be cured by irradiation with active energy rays (such as ultraviolet light) before the pick-up process. Specifically, irradiation with active energy rays such as ultraviolet light generates free radicals from a photopolymerization initiator, which then induce a cross-linking reaction between the acrylic polymers. This reduces the adhesive strength of the adhesive layer 32 before irradiation. Furthermore, the adhesive layer 20 can be easily peeled off from the adhesive layer 32.

[0179] It should be noted that ultraviolet rays, radiation, and electron rays can be used as active energy rays.

[0180] Specifically, the constituent unit of (meth)acrylate containing polymerizable groups can be a molecular structure obtained by bonding the isocyanate group of the (meth)acrylate monomer containing isocyanate group to the hydroxyl group in the above-mentioned (meth)acrylate constituent unit containing hydroxyl group via a urethane bond.

[0181] The constituent units of (meth)acrylates containing polymerizable groups can be prepared after the polymerization of acrylic polymers. For example, the constituent units of (meth)acrylates containing polymerizable groups can be obtained by copolymerizing an alkyl methacrylate monomer with a hydroxyl-containing (meth)acrylate monomer, followed by a carbamate reaction of a portion of the hydroxyl-containing (meth)acrylate constituent unit with an isocyanate-containing polymerizable monomer.

[0182] The aforementioned isocyanate-containing (meth)acrylate monomer preferably has one isocyanate group and one (meth)acryloyl group in the molecule. For example, ethyl 2-isocyanate (meth)acrylate can be cited as such a monomer.

[0183] The adhesive layer 32 of the cutting strip 30 in this embodiment further comprises an isocyanate compound. A portion of the isocyanate compound may be in a state after a reaction, such as carbamate reaction.

[0184] The isocyanate compound has multiple isocyanate groups in its molecule. By having multiple isocyanate groups in the isocyanate compound, a cross-linking reaction between acrylic polymers in the adhesive layer 32 can be carried out. Specifically, a cross-linking reaction can be carried out using the isocyanate compound by reacting an isocyanate group on one side of the isocyanate compound with a hydroxyl group of an acrylic polymer, and by reacting an isocyanate group on the other side with a hydroxyl group of another acrylic polymer.

[0185] Examples of diisocyanates that are isocyanate compounds include, for example, aliphatic diisocyanates, alicyclic diisocyanates, or aromatic aliphatic diisocyanates.

[0186] Furthermore, examples of isocyanate compounds include: polymeric polyisocyanates such as dimers and trimers of diisocyanates, and polymethylene polyphenylene polyisocyanates.

[0187] Furthermore, examples of isocyanate compounds include polyisocyanates obtained by reacting an excess of the aforementioned isocyanate compound with a compound containing active hydrogen. Examples of compounds containing active hydrogen include low molecular weight compounds containing active hydrogen and high molecular weight compounds containing active hydrogen.

[0188] It should be noted that, as isocyanate compounds, urea-formate polyisocyanates, biuretized polyisocyanates, etc., can also be used.

[0189] The above-mentioned isocyanate compounds can be used alone or in combination of two or more.

[0190] As the aforementioned isocyanate compound, a reaction product of an aromatic diisocyanate and a low molecular weight compound containing active hydrogen is preferred. Because the isocyanate groups in the aromatic diisocyanate reaction product react slowly, over-curing of the adhesive layer 32 containing the reactant can be suppressed. As the aforementioned isocyanate compound, a substance having three or more isocyanate groups in its molecule is preferred.

[0191] The polymerization initiator contained in the adhesive layer 32 is a compound that can initiate a polymerization reaction by applying heat or light energy. By including a polymerization initiator in the adhesive layer 32, a cross-linking reaction between acrylic polymers can occur when heat or light energy is applied to the adhesive layer 32. Specifically, a polymerization reaction can be initiated between acrylic polymers having (meth)acrylate constituent units containing polymerizable groups, causing the adhesive layer 32 to cure. As a result, the adhesive strength of the adhesive layer 32 can be reduced, and the self-cured adhesive layer 32 of the adhesive layer 20 can be easily peeled off during the pick-up process.

[0192] As polymerization initiators, photopolymerization initiators or thermal polymerization initiators can be used, for example. Conventional commercially available products can be used as polymerization initiators.

[0193] The adhesive layer 32 may further contain other components besides those mentioned above. Examples of other components include, for instance, tackifiers, plasticizers, fillers, antioxidants, UV absorbers, light stabilizers, heat stabilizers, antistatic agents, surfactants, and light release agents. The types and amounts of these other components can be appropriately selected according to the intended purpose.

[0194] The spacer-based cut-and-adhesive film 1 of this embodiment is preferably used in the manufacture of a chip-embedded semiconductor integrated circuit (FOD [Film On Die] type semiconductor integrated circuit) to embed the semiconductor chip w' using the adhesive layer 20. More specifically, the spacer-based cut-and-adhesive film 1 is preferably used to bond the adhesive layer 20 to the substrate Z in a manner that the adhesive layer 20 is embedded in the semiconductor chip w' (see [reference]). Figure 1C , Figure 5A wait).

[0195] In this embodiment, since the spacer-bearing cut-and-bond film 1 having a spacer layer 10 made of resin or the like can be used in the above-described applications, the manufacturing process of semiconductor integrated circuits can be shortened compared to conventional processing films using Si wafers as spacers. Specifically, it is not necessary to perform a series of steps involving attaching a back-side grinding tape to the Si wafer and processing the Si wafer to the desired thickness via back-side grinding. Furthermore, the spacer layer can be fabricated without being affected by a shortage of Si wafers, and the spacer layer can be fabricated using a less expensive resin.

[0196] Alternatively, the spacer-lined cut adhesive film 1 of this embodiment can be used to adhere the adhesive layer 20 to the substrate Z during the manufacture of buried wire type semiconductor integrated circuits (FOW [Film On Wire] type semiconductor integrated circuits) in order to ensure space above the control NAND chip w' for the stacked storage NAND chip w' (see reference). Figures 5B to 5E(etc.). In this case, the spacer-filled cut adhesive film 1 can be used to bond the adhesive layer 20 to the substrate Z by embedding the bonding wire L in the adhesive layer 20. Therefore, for the same reasons as above, it has the advantage of shortening the manufacturing process of semiconductor integrated circuits, and also has the advantage of being able to fabricate the spacer layer without being affected by the shortage of Si wafers.

[0197] Next, the manufacturing method of the spacer-lined cut adhesive film 1 of this embodiment will be described.

[0198] <Method for manufacturing cut adhesive films with spacers>

[0199] The manufacturing method of the spacer-lined cut adhesive film 1 of this embodiment includes the following steps:

[0200] The process of making spacer layer 10,

[0201] The process of creating adhesive layer 20,

[0202] The process of making the cutting strip 30, and

[0203] The process of overlapping the manufactured spacer layer 10, adhesive layer 20 and cutting strip 30.

[0204] (The process of making the spacer layer)

[0205] The process of making spacer layer 10 may include, for example, the following steps: a resin composition preparation step for preparing a resin composition for forming spacer layer 10, and a spacer layer forming step for forming spacer layer 10 from the resin composition.

[0206] Alternatively, commercially available resin films can be used as the spacer layer 10.

[0207] (The process of creating the adhesive layer)

[0208] The process of making adhesive layer 20 includes the following steps:

[0209] The resin composition preparation process for preparing the resin composition used to form the adhesive layer 20, and

[0210] An adhesive layer forming process in which an adhesive layer 20 is formed from a resin composition.

[0211] The resin composition preparation process involves, for example, mixing epoxy resin, an epoxy resin curing catalyst, acrylic resin, phenolic resin, and a solvent, and dissolving each resin in the solvent to prepare the resin composition. The viscosity of the composition can be adjusted by changing the amount of solvent. It should be noted that commercially available products can also be used as these resins.

[0212] In the adhesive layer formation process, for example, the resin composition prepared as described above is coated onto the release sheet. There are no particular limitations on the coating method; conventional coating methods such as roller coating, screen coating, and gravure coating can be used. Next, as needed, the coated composition is cured through solvent removal treatment, curing treatment, etc., to form the adhesive layer 20.

[0213] It should be noted that, in the adhesive layer forming process, the adhesive layer 20 overlapping the spacer layer 10 can also be formed by coating the resin composition prepared as described above onto the spacer layer 10.

[0214] (The process of making the cutting strip)

[0215] The process of manufacturing the cutting strip 30 includes the following steps:

[0216] The synthetic process for synthesizing acrylic polymers,

[0217] The adhesive layer manufacturing process involves evaporating the solvent from the adhesive composition comprising the aforementioned acrylic polymer, isocyanate compound, polymerization initiator, solvent, and other components added as appropriate for the purpose to create adhesive layer 32.

[0218] The substrate layer fabrication process for substrate layer 31, and

[0219] The bonding process of attaching the adhesive layer 32 to the substrate layer 31.

[0220] In the synthesis process, for example, acrylic polymer intermediates are synthesized by free radical polymerization of alkyl (meth)acrylate monomers with hydroxyl-containing (meth)acrylate monomers.

[0221] Free radical polymerization can be carried out using conventional methods. For example, acrylic polymer intermediates can be synthesized by dissolving the monomers mentioned above in a solvent, heating and stirring simultaneously, and adding a polymerization initiator. To adjust the molecular weight of the acrylic polymer, polymerization can be carried out in the presence of a chain transfer agent.

[0222] Next, a portion of the hydroxyl-containing (meth)acrylate building block in the acrylic polymer intermediate is bonded to the isocyanate group of the isocyanate-containing polymeric monomer via a carbamate reaction. Thus, a portion of the hydroxyl-containing (meth)acrylate building block becomes a building block of the polymeric (meth)acrylate containing a polymeric group.

[0223] Carbamate reactions can be carried out using conventional methods. For example, an acrylic polymer intermediate and an isocyanate-containing polymeric monomer can be heated and stirred in the presence of a solvent and a carbamate catalyst. This allows the isocyanate groups of the isocyanate-containing polymeric monomer to be bonded to a portion of the hydroxyl groups of the acrylic polymer intermediate via carbamate bonds.

[0224] In the adhesive layer fabrication process, an adhesive composition is prepared by dissolving an acrylic polymer, an isocyanate compound, and a polymerization initiator in a solvent. The viscosity of the composition can be adjusted by changing the amount of solvent. Next, the adhesive composition is coated onto a release sheet. Conventional coating methods such as roller coating, screen coating, and gravure coating can be used. The coated composition is then cured through solvent removal and curing processes to form the adhesive layer 32.

[0225] In the substrate layer fabrication process, the substrate layer 31 can be fabricated using conventional methods. Examples of film-forming methods include: calendering, casting in organic solvents, blow extrusion in a closed system, T-die extrusion, and dry lamination. Co-extrusion molding can also be used. It should be noted that commercially available films can also be used as the substrate layer 31.

[0226] In the bonding process, the adhesive layer 32, which overlaps with the release liner, is laminated with the substrate layer 31. It should be noted that the release liner may remain overlapping with the adhesive layer 32 until it is used.

[0227] It should be noted that, in order to promote the reaction between the crosslinking agent and the acrylic polymer, and in order to promote the reaction between the crosslinking agent and the surface portion of the substrate layer 31, a curing process can be carried out at 50°C for 48 hours after the bonding process.

[0228] These processes can be used to manufacture the cutting strip 30.

[0229] (The process of overlapping the adhesive layer with the spacer layer to the cutting strip)

[0230] In the process of overlapping the adhesive layer 20 with the cutting strip 30, the adhesive layer 20 is bonded to the adhesive layer 32 of the cutting strip 30 manufactured as described above.

[0231] In this bonding process, the release liner is peeled off from the adhesive layer 32 and the adhesive layer 20 of the cutting strip 30, respectively, and the two are bonded together by bringing the adhesive layer 20 into direct contact with the adhesive layer 32. For example, bonding can be performed by compression. The temperature during bonding is not particularly limited, but is preferably 30°C or higher and 50°C or lower, and more preferably 35°C or higher and 45°C or lower. The linear pressure during bonding is not particularly limited, but is preferably 0.1 kgf / cm or higher and 20 kgf / cm or lower, and more preferably 1 kgf / cm or higher and 10 kgf / cm or lower.

[0232] <Manufacturing method of cut adhesive film with spacers (specific example)>

[0233] The spacer-supported cut adhesive film 1 in this embodiment is as follows: Figure 2 and Figure 3 As shown, a stack of spacer layers 10 and adhesive layers 20 are overlapped on one side of a long, strip-shaped cutting strip 30. The stack of layers (spacer layers 10 and adhesive layers 20) overlapping the cutting strip 30 is circular when viewed in the thickness direction, and multiple stacks are arranged in a row along the length of the cutting strip 30. This type of spacer-supported cutting adhesive film 1 can be manufactured, for example, using a release belt H and a transfer belt T as follows.

[0234] For example, a cut adhesive film with spacers can be used as follows: Figure 7A , Figure 8A and Figure 9A The devices shown (I, I', I”) are used to manufacture it.

[0235] First, such as Figure 6A As shown, an adhesive layer 20 overlapping the spacer layer 10 is formed by coating the aforementioned resin composition onto the spacer layer 10 (e.g., a resin film) and allowing the solvent to evaporate from the resin composition. Next, a release tape H is adhered to the adhesive layer 20, as shown. Figure 6B As shown, a strip-shaped laminate with a release strip H is fabricated. It should be noted that the same laminate can also be fabricated by overlapping the spacer layer 10 with the adhesive layer 20, which is fabricated in the same manner by coating the release strip H with the above-described resin composition.

[0236] Next, the laminate of spacer layer 10 and adhesive layer 20 is installed as follows: Figure 7A The device shown. At this time, as... Figure 7B As shown, the laminate is positioned with the release belt H on the underside. While feeding the laminate into the apparatus, the transfer belt T is overlapped on the spacer layer 10. During this stage, the sheet formed by bonding the release belt H, spacer layer 10, adhesive layer 20, and transfer belt T is temporarily wound up.

[0237] Then, the temporarily fitted piece is installed on such Figure 8A The device shown. At this time, as... Figure 8B As shown, the transfer belt T is positioned on the lower side. While the laminated sheet is fed into the device, the release belt H and the laminated sheet are punched into a circle (a predetermined shape) by a punching process. Next, the release belt H (the peripheral portion of the release belt H excluding the circular portion) is removed by rolling it up. Then, while the remaining portion of the laminated sheet is moved downstream by the device, the removal belt S is applied. The unwanted portion of the laminated sheet is removed by rolling up the temporarily applied removal belt S, leaving a thin, circular laminated sheet on the transfer belt T (see reference). Figure 8C Next, cut strips 30 are overlapped on multiple thin spacer layers 10 in a manner that covers multiple layers of sheets arranged separately from each other (see reference). Figure 8D At this point, the adhesive layer 32 of the cutting tape 30 is bonded to the adhesive layer 20 in direct contact. During this stage, the sheet formed by bonding the spacer layer 10, the adhesive layer 20, and the transfer tape T is temporarily wound up. This results in a state where the transfer tape T is bonded to the cutting tape 30, the adhesive layer 20, and the spacer layer 10, forming a cut-adhesive film 1 with spacers. This state can be used as the final product, or the film can be temporarily wound up and the following operations can be performed to remove the transfer tape T.

[0238] Based on this, the temporarily wound, spacer-covered, cut adhesive film 1 (with transfer tape T) is mounted onto the... Figure 9A The device shown. At this time, as... Figure 9B As shown, the transfer belt T is positioned on the upper side, and the cutting belt 30 is positioned on the lower side. While feeding the cut adhesive film 1 with spacers into the device, the transfer belt T is removed (see reference). Figure 9C Furthermore, in order to protect the exposed spacer layer 10, the stripping band H can be overlapped onto the spacer layer 10 (see reference). Figure 9D ).

[0239] It should be noted that, in Figure 7A , Figure 8A and Figure 9A In this system, there are no particular limitations on the feeding direction when supplying long sheets to each device or the winding direction when retrieving long sheets. Specifically, the wound long sheets located at the upstream end of each device can be fed out with the inner circumferential side facing upwards or with the outer circumferential side facing upwards. Furthermore, the long sheets located at the downstream end of each device and to be wound can be retrieved with the upper side facing the inner circumferential side or with the upper side facing the outer circumferential side.

[0240] Furthermore, the spacer-lined cut adhesive film 1 manufactured by the apparatus described above can be further processed. For example, the spacer-lined cut adhesive film 1 can be subjected to a slitting process by removing the ends in both width directions according to the standard width of the product. Figure 10A Then, a pre-cutting process is performed using a punching device (not shown) to punch the cutting strip 30 into a specified shape from above with a size slightly larger than the circular punching portion (the punching portion of the adhesive layer 20 and the spacer layer 10) (e.g., more than 1.1 times and less than 1.4 times), and to remove the unwanted cutting strip 30. (See reference) Figure 10B ).

[0241] The spacer-lined cutting and bonding film 1 manufactured as described above is used, for example, as an auxiliary tool for manufacturing semiconductor integrated circuits. The spacer-lined cutting and bonding film 1 is particularly used in the second process described below. Specific examples of its use will be described below.

[0242] <Instructions for using spacer-lined cut and adhesive films in semiconductor integrated circuit manufacturing>

[0243] The methods for manufacturing semiconductor integrated circuits generally involve cutting chips from semiconductor wafers with circuit surfaces and assembling them.

[0244] This process includes, for example, the following steps:

[0245] In the first step, the controller chip w' for control is cut out from the semiconductor wafer (bare wafer) and fixed on the surface of the substrate Z;

[0246] In the second step, small pieces of the spacer layer 10, with the adhesive layer 20 attached, are cut from the laminated sheet containing the adhesive layer 20 and the spacer layer 10, and fixed to the surface of the substrate Z. The spacer layer 10 forms a base for stacking multiple NAND chips w” for storage.

[0247] In the third step, the NAND chip w” for storage is cut out from the semiconductor wafer (bare wafer), and multiple NAND chips w” for storage are stacked on the spacer layer 10.

[0248] The spacer-filled cut adhesive film 1 of this embodiment is used, for example, in the second step described above.

[0249] The first step, in order to fix the controller chip w' for control onto the surface of the substrate (substrate Z), includes, for example, the following steps: a step of forming trenches on the semiconductor wafer to process it into a chip w' (die) through a cutting process, followed by a step of thinning the semiconductor wafer by grinding; a step of fixing the semiconductor wafer to the cutting tape 30 by attaching one side of the thinned semiconductor wafer (e.g., the side opposite to the circuit surface) to the cutting tape 30; a step of miniaturizing the semiconductor wafer into a chip by increasing the spacing between the semi-cut semiconductor chips; a step of picking up the semiconductor chip w' (die) with the chip bonding layer d' adhered to it; and a step of bonding (chip bonding) the semiconductor chip w' (die) with the chip bonding layer d' adhered to the substrate (see reference). Figure 1A ).

[0250] When performing the following steps in the second step, the cutting strip 30 (cutting adhesive film with spacers) of this embodiment is used as a manufacturing aid.

[0251] The second step, in order to fix the spacer layer 10 and the adhesive layer 20 to the surface of the substrate (substrate Z), includes, for example, the following step: mounting the cutting ring R onto the cutting strip 30 of the cutting adhesive film 1 with the spacer (see...). Figure 4A The process of using a cutting saw B to cut the adhesive layer 20 and the spacer layer 10 into small pieces (die) (see reference). Figure 4B and Figure 4C The process of picking up the small, pieced spacer layer 10 with adhesive layer 20 attached, which is then peeled off from the adhesive layer 32 of the self-cutting tape 30 using an adsorption clamp J (see reference). Figure 4D The process of bonding the spacer layer 10, to which the adhesive layer 20 is adhered, to the substrate (substrate Z) (see reference). Figure 1B ).

[0252] In the third step, in order to repeatedly overlap the NAND chip w” for storage on the spacer layer 10, for example, the same as in the first step, the NAND chip w” for storage is picked up and attached to the substrate (spacer layer 10), and the NAND chip w” for storage is further overlapped (see reference). Figure 1C ).

[0253] In recent years, with the further development of integration technology in the semiconductor industry, the capacity per unit area of ​​NAND chips is increasing. Consequently, for the same capacity, the size of NAND chips is becoming smaller and smaller. For example, in a semiconductor integrated circuit where a storage NAND chip w” is stacked on top of a controller chip w’, if the size of the storage NAND chip w” becomes smaller, it may be difficult to embed the controller chip w’ into the storage NAND chip w”, thus making it difficult to assemble the semiconductor integrated circuit.

[0254] In order to ensure space for the NAND chip w” used for overlapping storage, the cut adhesive film 1 with spacers of this embodiment can be used.

[0255] The spacer-supported dicing bonding film 1 of this embodiment can be used, similarly to the dicing bonding film used when fabricating semiconductor chips from bare wafers, to miniaturize the aforementioned laminated wafers, peel the miniaturized laminated wafers from the dicing tape 30, and pick them up. Then, the picked-up laminated wafers are bonded to a substrate Z or other adhered object, and a NAND chip w for storage is superimposed on the spacer layer 10 of the laminated wafers.

[0256] It should be noted that the form of the manufactured semiconductor integrated circuits is not limited to that shown below. Figure 1C The shape shown can also be, for example, like... Figures 5A-5E The various forms shown.

[0257] The spacer-lined cut adhesive film of this embodiment is as illustrated above, but the present invention is not limited to the spacer-lined cut adhesive film illustrated above.

[0258] That is, various forms of conventional spacer-lined cut adhesive films can be used without compromising the effects of the present invention.

[0259] The contents disclosed in this specification include the following schemes.

[0260] (1) A cut-and-adhesive film with spacers, comprising:

[0261] A laminated sheet having an adhesive layer for bonding to an object and a spacer layer overlapping the adhesive layer; and

[0262] The cutting strip overlaps with and maintains the aforementioned adhesive layer of the laminated sheet.

[0263] The aforementioned laminate has a bending stiffness of 0.05 N·mm at room temperature. 2 above. (2)

[0265] According to the spacer-filled cut adhesive film described in (1) above, the elastic modulus of the aforementioned laminated sheet is 1 GPa or more. (3)

[0267] According to the cutting adhesive film with spacers described in (2) above, the peel force between the aforementioned adhesive layer and the aforementioned spacer layer is 0.1 N / 20 mm or more. (4)

[0269] The cut adhesive film with spacers according to any one of (1) to (3) above, wherein the thickness of the aforementioned spacer layer is 3 μm or more and 300 μm or less. (5)

[0271] The cut adhesive film with spacers according to any one of (1) to (4) above, wherein the thickness of the aforementioned adhesive layer is 10 μm or more and 200 μm or less. (6)

[0273] The spacer-lined cut adhesive film according to any one of (1) to (5) above, wherein the material of the aforementioned spacer layer is selected from at least one of the group consisting of polyimide, polyamide-imide, polyester, polybenzimidazole, polyetherimide, polyphenylene sulfide and polyether ether ketone. (7)

[0275] The cut adhesive film with spacers according to any one of (1) to (6) above, wherein the aforementioned adhesive layer comprises a thermosetting resin and a thermoplastic resin. (8)

[0277] The cut adhesive film with spacers described in (7) above, wherein the aforementioned adhesive layer further comprises filler. (9)

[0279] According to the spacer-filled cut adhesive film described in (8) above, in the aforementioned adhesive layer, the filler content ratio is 30% or more and 70% or less relative to the total mass of the adhesive layer. (10)

[0281] The cutting adhesive film with spacers according to any one of (1) to (9) above, wherein the adhesive layer of the aforementioned cutting strip comprises an acrylic polymer, an isocyanate compound and a polymerization initiator. (11)

[0283] According to the spacer-lined cut adhesive film described above (10), the aforementioned acrylic polymer contained in the aforementioned adhesive layer comprises (meth)acrylate constituent units having polymerizable unsaturated double bonds in the side chains. (12)

[0285] The spacer-bearing cut adhesive film according to any one of (1) to (11) above is used to embed a semiconductor chip when manufacturing a chip-embedded semiconductor integrated circuit, or to ensure space for stacking a storage semiconductor chip on a control semiconductor chip when manufacturing a buried wire type semiconductor integrated circuit.

[0286] Example

[0287] Next, the invention will be described in more detail through experimental examples, but the invention is not limited to them.

[0288] (Examples 1-6 and Comparative Example 1)

[0289] The following is a laminate of spacer and adhesive layers. Furthermore, the adhesive layer of this laminate is bonded to a cutting strip to manufacture cutting adhesive films with spacers as shown in Table 1.

[0290] <Interval Layer>

[0291] The following resin film was prepared as a spacer layer.

[0292] • Polyimide film A (75μm thickness)

[0293] (Manufactured by DU PONT-TORAY Co., Ltd., under the product name "Kapton 300V")

[0294] • Polyimide film B (25μm thickness)

[0295] (Manufactured by DU PONT-TORAY Co., Ltd., under the product name "Kapton 100H")

[0296] • Polyamide-imide film (4μm thickness)

[0297] (Product name "Mictron#4Y-GE10" manufactured by Toray Industries, Inc.)

[0298] Para-type aromatic polyamide (aramid) films

[0299] • Polyethylene terephthalate film A (50μm thick, single-sided silicone treatment)

[0300] (Adhere the untreated surface to the adhesive layer)

[0301] (Product name "DIAFOIL MRA50", manufactured by Mitsubishi Chemical Corporation)

[0302] • Polyethylene terephthalate film B (50μm thick, single-sided silicone treatment)

[0303] (The silicone-treated surface is adhered to the adhesive layer)

[0304] (Product name "DIAFOIL MRA50", manufactured by Mitsubishi Chemical Corporation)

[0305] <Preparation of the Adhesive Layer>

[0306] The following raw materials are added to methyl ethyl ketone and mixed to obtain an adhesive layer composition. Details of each raw material are shown below.

[0307] · 100 parts by weight of acrylate polymer solution

[0308] Product name: "Teisan Resin SG-70L" (solid content concentration: 12.8% by mass)

[0309] Nagase, manufactured by ChemteX Corporation, contains carboxyl and hydroxyl groups in its molecules.

[0310] · 1.7 parts by weight of epoxy resin

[0311] Product name "EPIKOTE YL980" manufactured by Mitsubishi Chemical Corporation.

[0312] · 13 parts by weight of epoxy resin

[0313] Product name "EPICLON N-665-EXP-S" manufactured by DIC Corporation.

[0314] · 15 parts by weight of phenolic resin (curing agent)

[0315] Product name "MEHC-7851SS" manufactured by Meiwa Kasei Corporation.

[0316] • 47 parts by weight of silica organic solvent slurry (containing 60% by weight of powder)

[0317] The product name is "SO-E2" (obtained by pre-dispersing powder in MEK).

[0318] Admatechs Co., Ltd. manufactures

[0319] · 0.085 parts by weight of curing catalyst

[0320] Product name "Curezol 2PHZ" manufactured by Shikoku Kasei Corporation.

[0321] • Dilute solvent 50 parts by weight of MEK (methyl ethyl ketone)

[0322] Next, the adhesive layer composition is applied to one side of the coating substrate using an applicator. The application is carried out to a thickness of 120 μm after drying, and then the solvent is evaporated from the adhesive layer composition by drying at 120°C for 2 minutes. Thus, an adhesive layer is obtained overlapping the coating substrate.

[0323] • Coating substrate (release sheet) product name "PET38" manufactured by Fujiko Co., Ltd.

[0324] The spacer layer is then pasted onto the exposed surface of the adhesive layer.

[0325] <Adhesive layer of the cutting tape>

[0326] (Preparation of adhesive layer (adhesive composition))

[0327] Prepare the following ingredients.

[0328] ·2EHA (2-ethylhexyl acrylate): 100 parts by weight

[0329] • HEA (2-hydroxyethyl acrylate): 20 parts by weight

[0330] • AIBN (2,2'-azobisisobutyronitrile): Appropriate amount

[0331] • Polymerization solvent (toluene): an amount that makes the above monomer concentration approximately 55% by mass.

[0332] The above-mentioned raw materials were added to a round-bottom detachable flask (1 L capacity), a thermometer, a nitrogen inlet tube, and a stirring device for a polymerization experimental apparatus. Nitrogen gas was introduced into the round-bottom detachable flask while stirring, and a polymerization reaction was carried out at 60°C for 10 hours to prepare an intermediate composition.

[0333] After cooling the intermediate composition to room temperature, add the following raw materials relative to 100 parts by weight of the intermediate composition.

[0334] 2-Methacryloxyethyl isocyanate

[0335] Raw material name "Karenz MOI", manufactured by Showa Denko Co., Ltd.: 1.4 parts by weight

[0336] • Dibutyltin dilaurate IV (manufactured by Wako Pure Chemical Industries, Ltd.): 0.1 parts by weight

[0337] An acrylic polymer composition was obtained by stirring at 50°C for 60 hours under atmospheric conditions.

[0338] Finally, relative to 100 parts by weight of the solid components of the above acrylic polymer composition, the following raw materials are added to obtain an adhesive composition for forming an adhesive layer.

[0339] Isocyanate compound (raw material name "CORONATE L", manufactured by Tosoh Corporation): 1.1 parts by weight

[0340] Photopolymerization initiator (raw material name "IRGACURE 184", manufactured by IGM Resins): 3 parts by weight

[0341] Toluene: the amount that makes the viscosity of the composition approximately 500 mPa·s

[0342] Prepare a PET film as a release sheet. Apply an adhesive composition to one surface of the PET film (after demolding) using an applicator, resulting in a dried thickness of 30 μm. Heat and dry at 120°C for 2 minutes to form an adhesive layer overlapping the PET film (release sheet).

[0343] <Making of Cutting Strips>

[0344] As the substrate layer, a polyethylene film with a thickness of 80 μm is prepared. This polyethylene film is then laminated to the adhesive layer on the PET film prepared as described above at room temperature using a laminator. This process is used to manufacture the cutting tape.

[0345] <Manufacturing of Cut Adhesive Films with Spacers>

[0346] A cutting adhesive film with spacers and a cutting strip is manufactured by bonding the adhesive layer of the cutting strip to an adhesive layer with a spacer layer attached at 70°C.

[0347] Specifically, a laminate was fabricated by bonding a spacer layer and an adhesive layer (120 μm thick) at 70°C. This laminate was then cut into circles with a diameter of 330 mm. Finally, the cut laminate was bonded to a diced tape at room temperature.

[0348] Following the method described above, cut adhesive films with spacers were manufactured for both the examples and comparative examples. Details regarding the composition of each film are shown in Table 1.

[0349] <Determination of the elastic modulus (tensile modulus) of spacers and adhesive layers (laminated sheets)>

[0350] Using a utility knife, the spacer layer and adhesive layer (laminated sheets) of each embodiment and comparative example were cut into strips with a length of 40 mm and a width of 10 mm. Next, the tensile storage modulus was measured from -30°C to 300°C using a solid viscoelasticity measuring apparatus (RSAIII, manufactured by Rheometric Scientific Inc.). The measurement conditions were a frequency of 1 Hz, a heating rate of 10°C / min, and a chuck spacing of 20.0 mm. The storage modulus value at 25°C was then recorded as the elastic modulus.

[0351] Calculation of flexural stiffness of spacer and adhesive layers (laminated sheets)

[0352] Based on the elastic modulus measured as described above and the above formula (1), the bending stiffness of the laminated sheets of each embodiment and comparative example is calculated.

[0353] It should be noted that, for example, in Example 1, the values ​​in Equation (1) are b = 12 [mm], F = 2300 [MPa], h = 0.195 [mm], and λ = 0.0975 [mm], respectively, to calculate the bending stiffness. b = 12 [mm] is equivalent to the length of the long side of the test sample in the performance test described later.

[0354] <Determination of peel force between spacer layer and adhesive layer>

[0355] Using a utility knife, the spacer layer and adhesive layer (laminated sheets) of each embodiment and comparative example were cut into strips 120 mm in length and 25 mm in width. Double-sided tape was applied to an SUS board, and the laminated sheets cut into strips were then adhered to the tape. The adhesive layer was then attached to the double-sided tape. Next, the peel force between the spacer layer and adhesive layer was measured using a precision universal testing machine, "Autograph AGS-J" (manufactured by Shimadzu Corporation). The testing conditions were a peel speed of 300 mm / min, a peel angle of 90 degrees, and a testing temperature of 25°C. The measured values ​​were then converted to a value relative to a width of 20 mm.

[0356] [Table 1]

[0357]

[0358] <Performance Evaluation>

[0359] The spacer-containing adhesive films were cut using a DFD6361 dicing machine manufactured by DISCO Corporation. The cutting was performed to miniaturize the films into chip-like spacer and adhesive layers (laminated sheets) measuring 6.0 mm × 12.0 mm. For the cutting blades, Z1 used 2030-SE 27HCDD, and Z2 used 2030-SE27 HCBB, performing stepped cuts. Regarding the blade height, the adhesive layer was partially cut using the Z1 blade, followed by a 20 μm cut into the cutting strip using the Z2 blade.

[0360] (Evaluation of pickup performance)

[0361] Using a DB830plus+ die bonding machine manufactured by FASFORD TECHNOLOGY Co., Ltd., 20 miniature stacked wafers were picked up at room temperature, and the success rate of the pick-up was calculated.

[0362] [Pickup Conditions]

[0363] Lifting clamp: Multi-stage pickup, Number of stages: 3, Clamp size: 6mm × 12mm

[0364] Lifting depth: Level 1 300μm, Level 2 600μm, Level 3 900μm

[0365] Lifting speed: 5mm / second

[0366] Expansion amount: 3mm

[0367] The results of performance evaluation (pickup performance) for the spacer-lined cut adhesive films of each embodiment and comparative example are shown in Table 1.

[0368] As can be seen from the above evaluation results, the spacer-filled cut adhesive film with the spacer layer of the embodiment has better pick-up performance than the spacer-filled cut adhesive film of the comparative example.

[0369] In the embodiment, the bending stiffness of the laminate (spacer layer and adhesive layer) at room temperature (25°C) is 0.05 N·mm. 2 above.

[0370] By using spacer-lined cut-bonded films with such physical properties in the manufacture of semiconductor integrated circuits, it is possible to efficiently manufacture so-called NAND flash memory and the like.

[0371] Industrial availability

[0372] The spacer-lined cutting and bonding film of the present invention is suitable for use as an auxiliary tool in the manufacture of semiconductor integrated circuits.

Claims

1. A cut adhesive film with spacers, comprising: A laminated sheet having an adhesive layer for bonding to an object and a spacer layer overlapping one side of the adhesive layer; and, A cutting strip that overlaps and holds the laminated sheet on the other side of the adhesive layer. The cutting strip has a substrate layer and an adhesive layer that overlaps one side of the substrate layer and is in contact with the adhesive layer. The flexural stiffness of the laminate at room temperature is 0.1 N·mm. 2 above, The peel force between the adhesive layer and the spacer layer is greater than 0.1 N / 20 mm. The thickness of the spacer layer is greater than 3 μm and less than 300 μm. During the picking process, the laminated sheet is separated from the cutting strip, while the adhesive layer and the spacer layer are not separated.

2. The spacer-supported cut adhesive film according to claim 1, wherein, The elastic modulus of the laminated sheet is above 1 GPa.

3. The spacer-supported cut adhesive film according to claim 1 or 2, wherein, The thickness of the adhesive layer is more than 10 μm and less than 200 μm.

4. The spacer-supported cut adhesive film according to claim 1 or 2, wherein, The material of the spacer layer is selected from at least one of the following groups: polyimide, polyamide-imide, polyester, polybenzimidazole, polyetherimide, polyphenylene sulfide, and polyetheretherketone.

5. The spacer-lined cut adhesive film according to claim 1 or 2, used for embedding semiconductor chips in the manufacture of chip-embedded semiconductor integrated circuits, or for ensuring space for stacking storage semiconductor chips on control semiconductor chips in the manufacture of buried wire type semiconductor integrated circuits.

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