Support unit and equipment for processing substrates

By designing support units for heating components, reflectors, and cooling plates in the substrate processing equipment, and combining them with inert gas supply and barrier structures, the problems of heat transfer, boiling of cooling fluid, and impurity entry are solved, thereby improving the stability and efficiency of the equipment.

CN114520168BActive Publication Date: 2026-05-26SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SYSTEM ENGINEERING MEGA SOLUTION CO LTD
Filing Date
2021-11-19
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing substrate processing equipment, the heat radiated by the lamps is transferred to the rotary drive device, causing the temperature to rise, which may lead to drive device failure. The cooling fluid boils severely, and the processing liquid or impurities can easily enter the chuck. The power terminal temperature rises excessively.

Method used

A support unit is designed, including a heating element, a reflector, and a cooling plate. The reflector reflects heat energy and forms a cooling flow path in the cooling plate. An inert gas is supplied by a gas supply line. A blocking protrusion prevents impurities from entering. The rotation drive unit is separated from the heating element, and the power terminal is combined with the cooling plate to reduce the temperature.

Benefits of technology

It effectively reduces the heat transferred to the rotary drive unit, reduces the boiling phenomenon of the cooling fluid, reduces the risk of the processed liquid entering the chuck, avoids excessive temperature rise of the power terminal, and improves the stability and efficiency of the equipment.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN114520168B_ABST
    Figure CN114520168B_ABST
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Abstract

A support unit for supporting a substrate is provided, the support unit comprising: a heating member configured to transfer heat energy to the supported substrate; a reflector disposed below the heating member and configured to reflect the heat energy generated by the heating member to the substrate; a cooling plate disposed below the reflector and forming a cooling flow path in which cooling fluid flows; and a gas supply line configured to supply gas to the space between the reflector and the cooling plate.
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