Packaging substrate and manufacturing method thereof

Abstract

The present invention provides a packaging carrier and a manufacturing method thereof. The packaging carrier includes a circuit structure layer and a heat conducting member. The circuit structure layer includes a notch portion. The heat conducting member includes a first heat conducting member and a second heat conducting member vertically connected to the first heat conducting member. The notch portion exposes the first heat conducting member, and the outer surface of the second heat conducting member is flush with the side surface of the circuit structure layer. The first heat conducting member of the heat conducting member of the present invention is embedded in the circuit structure layer, and the second heat conducting member is attached to one side of the circuit structure layer and is exposed to the outside world, which can increase the contact area with the outside world, so that the packaging carrier of the present invention can have better heat dissipation efficiency.

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