Substrate processing system

Abstract

A substrate processing system according to one embodiment can include: a front end module; a first process line including a first polishing line and a first cleaning line; a second process line including a second polishing line and a second cleaning line, and configured in parallel with the first process line; a first worktable between the first process line and the second process line; and a first transfer robot to transfer a substrate from the front end module to the first worktable.

Description

Technical Field

[0001] The following embodiments relate to a substrate processing system. Background Technology

[0002] In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) operations are required, including grinding, buffing, and cleaning. Semiconductor devices have a multilayer structure, with transistor elements having diffusion regions formed on a substrate layer. On the substrate layer, interconnecting metal lines are patterned and electrically connected to the transistor elements that form functional components. It is well known that the patterned conductive layers are insulated from other conductive layers by insulating materials such as silicon dioxide. The formation of more metal layers and associated insulating layers increases the necessity for flattening the insulating material. If not flattened, the fabrication of additional metal layers becomes substantially more difficult due to numerous variations in the flattening morphology. Furthermore, since the metal line patterns are formed from insulating materials, the metal CMP operation removes excess metal.

[0003] To increase the production efficiency of CMP processes and reduce waiting time between processes or transfers, various processes or transfers can be performed in parallel. For example, reducing the substrate transfer path and simultaneously transferring and polishing multiple substrates can increase the production efficiency of CMP processes.

[0004] The aforementioned background technology is technology that the inventor possessed or mastered in the process of deriving the disclosure of this application, and is not necessarily publicly known technology that was disclosed to the general public before this application. Summary of the Invention

[0005] One embodiment aims to provide a substrate processing system capable of simultaneously transferring and polishing multiple substrates in parallel.

[0006] One embodiment aims to provide a substrate processing system that can reduce substrate transfer paths and increase transfer efficiency.

[0007] According to one embodiment, a substrate processing system may include: a front-end module; a first process line including a first polishing line and a first cleaning line; a second process line including a second polishing line and a second cleaning line, and arranged in parallel with the first process line; a first worktable located between the first process line and the second process line; and a first transport robot that transfers the substrate from the front-end module to the first worktable.

[0008] It may also include a second transport robot that transports substrates between at least two locations of the first grinding line, the first cleaning line, the second grinding line, the second cleaning line, and the first worktable.

[0009] The first grinding line and the second grinding line may each include: a first rotating part that rotates to form a first transfer track along a circle and transfers a substrate between a first transfer position and a second transfer position; a second rotating part that rotates to form a second transfer track along a circle and transfers a substrate between a second transfer position and a grinding position; and a grinding pad that at least a portion of which rotates at a position overlapping with the grinding position.

[0010] The second transport robot can transfer the substrate before grinding from the first worktable to a first transfer position on either the first grinding line or the second grinding line.

[0011] The first rotating part may include at least one second worktable, which alternately resides in the first transfer position and the second transfer position.

[0012] The second rotating part may include at least one carrier head, which alternately positions itself at the second conveying position and the grinding position.

[0013] The first grinding line and the second grinding line may each include a loading section, which loads the substrate onto the carrier head or unloads the substrate from the carrier head at the second transfer position.

[0014] The loading unit may include a cleaning nozzle for cleaning the carrier head located at the second transfer position.

[0015] The second transport robot can transfer the polished substrate from either the first polishing line or the second polishing line to either the first cleaning line or the second cleaning line.

[0016] The first handling robot can transfer the cleaned substrate from either the first cleaning line or the second cleaning line to the front-end module.

[0017] The first cleaning line and the second cleaning line may each include: a chamber section comprising at least a portion of a plurality of cleaning chambers stacked in a vertical direction; and a third transport robot that transfers a substrate from at least any one of the plurality of cleaning chambers to another.

[0018] The chamber section includes: a first chamber section, which includes at least one cleaning chamber; a second chamber section, which includes at least one cleaning chamber, and is configured horizontally spaced from the first chamber section; and a third handling robot may be located between the first chamber section and the second chamber section.

[0019] The second transport robot can transfer the polished substrate from either the first polishing line or the second polishing line to the first chamber of either the first cleaning line or the second cleaning line.

[0020] The first handling robot can transfer the cleaned substrate from the second chamber of either the first or second cleaning line to the front-end module.

[0021] According to one embodiment, a substrate processing system may include: a front-end module configured along a first direction; a first process line including a first polishing line and a first cleaning line configured along a second direction perpendicular to the first direction; a second process line including a second polishing line and a second cleaning line configured along a third direction perpendicular to the first direction and parallel to the second direction; and a second transport robot configured between the first process line and the second process line to transport the substrate between at least two locations of the first polishing line, the first cleaning line, the second polishing line, and the second cleaning line.

[0022] The first grinding line and the second grinding line may each include: a first rotating part that rotates to form a first transfer track along a circle and transfers a substrate between a first transfer position and a second transfer position; a second rotating part that rotates to form a second transfer track along a circle and transfers a substrate between a second transfer position and a grinding position; and a grinding pad that at least a portion of which rotates at a position overlapping with the grinding position.

[0023] The first rotating part may include at least one second worktable, which alternately resides in the first transfer position and the second transfer position.

[0024] The second rotating part may include at least one carrier head, which alternately positions itself at the second conveying position and the grinding position.

[0025] The first grinding line and the second grinding line may each include a loading section, which loads the substrate onto the carrier head or unloads the substrate from the carrier head at the second transfer position.

[0026] The loading unit may include a cleaning nozzle for cleaning the carrier head located at the second transfer position.

[0027] According to one embodiment of the substrate process system, multiple substrates are continuously and parallelly subjected to a grinding process, thereby improving production efficiency.

[0028] According to one embodiment, the substrate processing system is configured such that the loading / unloading of a second substrate can be performed during the grinding of a first substrate, thereby improving production efficiency.

[0029] According to one embodiment of the substrate process system, the substrate transfer path can be reduced and the transfer efficiency can be increased.

[0030] The effects of the substrate process system according to one embodiment are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0031] Figure 1 This is a schematic plan view of a substrate process system according to one embodiment.

[0032] Figure 2This is a schematic plan view of the first grinding line according to one embodiment.

[0033] Figure 3 This is a schematic side view of the first rotating part and the loading part in the first grinding line according to one embodiment.

[0034] Figure 4 This is a schematic perspective view of a first cleaning line according to one embodiment.

[0035] Figure 5 This is a schematic side view of a first cleaning line used to illustrate a cleaning process for a substrate according to one embodiment.

[0036] Figure 6 This is a schematic perspective view of the first chamber portion according to one embodiment.

[0037] Label Explanation

[0038] 1: Substrate processing system;

[0039] 11: Front-end module;

[0040] 12a: First process line;

[0041] 12b: Second process line;

[0042] 121a: First grinding line;

[0043] 121b: Second grinding line;

[0044] 122a: First cleaning line;

[0045] 122b: Second cleaning line;

[0046] 13: First workbench;

[0047] 14: The first transport robot;

[0048] 15: Second transport robot; Detailed Implementation

[0049] The embodiments will now be described in detail with reference to the accompanying drawings. However, various modifications may be made to the embodiments, and therefore the scope of the patent application is not limited or restricted by these embodiments. It should be understood that all changes, equivalents, and even substitutions to the embodiments are included within the scope of the claims.

[0050] The terminology used in the embodiments is for illustrative purposes only and should not be construed as limiting. Singular expressions include plural expressions unless there is an explicit difference in meaning in the text. In this specification, terms such as "comprising" or "having" are intended to specify the presence of features, numbers, steps, actions, constituent elements, components, or combinations thereof described in the specification, and should be understood as not precluding the presence or additional possibility of one or more other features, numbers, steps, actions, constituent elements, components, or combinations thereof.

[0051] Unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments pertain. It should be interpreted that terms such as those defined in commonly used dictionaries have meanings consistent with their literal meaning in the context of related art, and should not be construed as having ideal or overly formal meanings unless explicitly defined herein.

[0052] Furthermore, when describing the embodiments with reference to the accompanying drawings, the same constituent elements are assigned the same reference numerals regardless of the reference numerals, and repeated descriptions of these elements are omitted. When describing embodiments, if it is determined that a detailed description of related well-known technologies might unnecessarily obscure the essence of the embodiments, such detailed description is omitted.

[0053] Furthermore, when describing the constituent elements of the embodiments, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish one constituent element from other constituent elements, and the nature, order, or sequence of the corresponding constituent elements are not limited by these terms. The description of a constituent element being "connected," "combined," or "joined" with other constituent elements indicates that the constituent element may be directly connected or joined with other constituent elements, but it should be understood that it may also be "connected," "combined," or "joined" between constituent elements.

[0054] The constituent elements included in one embodiment and the constituent elements that share common functions are referred to by the same names and described in other embodiments. Unless otherwise stated, the description described in one embodiment is also applicable to other embodiments, and specific descriptions are omitted to the extent necessary for repetition.

[0055] Figure 1 This is a schematic plan view of a substrate process system according to one embodiment.

[0056] Reference Figure 1According to one embodiment, the substrate processing system 1 can be a system for processing the surface of a substrate. For example, the substrate processing system 1 can perform grinding and cleaning processes on the substrate. The substrate processed by the substrate processing system 1 can be a silicon wafer for semiconductor device manufacturing. However, the type of substrate is not limited to this. For example, the substrate may include glass for LCD (liquid crystal display), PDP (plasma display device), and FPD (flat panel display).

[0057] According to one embodiment, the substrate process system 1 may include a front-end module 11, a process line 12, a first workbench 13, a first handling robot 14, and a second handling robot 15.

[0058] In one embodiment, the front-end module 11 may be located on one side of the substrate process system 1 (e.g., the +x direction side). The front-end module 11 may be configured along a first direction L1. For example, with Figure 1 Based on this, the front-end module 11 can be configured in a length direction with the y-axis. For example, the front-end module 11 can be an equipment front-end module (EFEM). A cassette or a front-opening unified pod (FOUP) can be configured in the front-end module 11. The cassette or FOUP can hold the substrate to be processed and / or the processed wafers. A first handling robot 14 can be configured in the front-end module 11. The first handling robot 14 will be described later.

[0059] In one embodiment, process line 12 may be a line for processing a substrate. Process line 12 may perform grinding and cleaning processes on the substrate. Process line 12 may be equipped with at least one or more. For example, process line 12 may include a first process line 12a and a second process line 12b. The first process line 12a and the second process line 12b may be arranged side by side. For example, the first process line 12a may be arranged along a second direction L2 perpendicular to a first direction L1. The second process line 12b may be arranged along a third direction L3 perpendicular to the first direction L1 and parallel to the second direction L2. For example, the first process line 12a may be arranged with a length direction parallel to the X-axis, and in order to make the second process line 12b parallel to the first process line 12a, the second process line 12b may also be arranged with a length direction parallel to the X-axis. That is, the first process line 12a and the second process line 12b may be arranged parallel to each other. The first process line 12a and the second process line 12b may be arranged apart from each other with a space formed in between. For example, a first workbench 13 and a second handling robot 15, described later, may be configured between the first process line 12a and the second process line 12b.

[0060] In one embodiment, the first process line 12a may include a first grinding line 121a and a first cleaning line 122a. The second process line 12b may include a second grinding line 121b and a second cleaning line 122b.

[0061] In one embodiment, the first polishing line 121a and the second polishing line 121b can perform a polishing process on the substrate. For example, the first polishing line 121a and the second polishing line 121b can perform a chemical mechanical polishing (CMP) process on the surface of the substrate. The first polishing line 121a and the second polishing line 121b can be located opposite the front-end module 11. For example, the first polishing line 121a and the second polishing line 121b can be located on the other side of the substrate process system 1 (e.g., the -x direction side).

[0062] In one embodiment, the first cleaning line 122a and the second cleaning line 122b can perform a cleaning process on a substrate. The cleaning process can be a concept that includes both a cleaning process and a drying process on the substrate. For example, the first cleaning line 122a and the second cleaning line 122b can perform a cleaning process on a polished substrate and a drying process on the cleaned substrate. The first cleaning line 122a and the second cleaning line 122b can each be arranged with a length direction parallel to the X-axis. For example, the first cleaning line 122a and the second cleaning line 122b can be arranged to be spaced apart from each other with a space formed in the middle. The first cleaning line 122a and the second cleaning line 122b can be respectively arranged between the first polishing line 121a and the front-end module 11, and between the second polishing line 121b and the front-end module 11.

[0063] In one embodiment, the first worktable 13 may be located between the first process line 12a and the second process line 12b. For example, the first worktable 13 may be located between the first cleaning line 122a and the second cleaning line 122b. For example, the first worktable 13 may be located between the front-end module 11 and the first polishing line 121a and the second polishing line 121b. The first worktable 13 may be disposed adjacent to the front-end module 11. The substrate to be processed (e.g., the substrate before polishing) may be placed on the first worktable 13.

[0064] In one embodiment, the first handling robot 14 can move along the length direction (e.g., the y-axis direction) of the front-end module 11. For example, the first handling robot 14 can move along a track 141 configured along the y-axis direction. For example, the first handling robot 14 can move between a first receiving position RP1 and a second receiving position RP2. The first receiving position RP1 may be a position adjacent to the first cleaning line 122a. The second receiving position RP2 may be a position adjacent to the second cleaning line 122b. For example, the first receiving position RP1 may be located at one end of the track 141 (e.g., the +y direction end), and the second receiving position RP2 may be located at the other end of the track 141 (e.g., the -y direction end). The first handling robot 14 can transfer the cleaned substrate from either the first cleaning line 122a or the second cleaning line 122b to the front-end module 11. For example, the first handling robot 14 can transfer the cleaned substrate from the second chamber portion (e.g., the second chamber portion) of either the first cleaning line 122a or the second cleaning line 122b. Figure 5 The second chamber 1220b) is transferred to the front-end module 11. For example, the first handling robot 14 can receive the cleaned substrate transferred from the first cleaning line 122a at the first receiving position RP1. The first handling robot 14 can receive the cleaned substrate transferred from the second cleaning line 122b at the second receiving position RP2. The first handling robot 14 can store the received cleaned substrate in a cartridge or FOUP.

[0065] In one embodiment, a supply position SP may be provided between the first receiving position RP1 and the second receiving position RP2. For example, the supply position SP may be located at an intermediate point between the first receiving position RP1 and the second receiving position RP2. At the supply position SP, the first handling robot 14 can transfer the substrate from the front-end module 11 to the first worktable 13. For example, at the supply position SP, the first handling robot 14 can transfer the substrate to be processed from the cartridge or FOUP of the front-end module 11 to the first worktable 13. The substrate to be processed is placed on the first worktable 13 and can then wait for transfer.

[0066] In one embodiment, the second handling robot 15 can transfer substrates between at least two locations among the first grinding line 121a, the first cleaning line 122a, the second grinding line 121b, the second cleaning line 122b, and the first worktable 13. For example, the second handling robot 15 can transfer substrates between at least two locations among the first grinding line 121a, the first cleaning line 122a, the second grinding line 121b, and the second cleaning line 122b. The second handling robot 15 can be located between the first process line 12a and the second process line 12b. For example, the second handling robot 15 can be located between the first cleaning line 122a and the second cleaning line 122b. For example, the second handling robot 15 can be located between the front-end module 11 and the first grinding line 121a and the second grinding line 121b. For example, with Figure 1 Based on this, the second handling robot 15 may be located to the left of the first worktable 13 (e.g., the -x direction side). The second handling robot 15 is configured to be rotatable and may include an extendable arm. The second handling robot 15 can freely approach in the circumferential direction.

[0067] In one embodiment, if the first handling robot 14 transfers the substrate to be processed (e.g., the substrate before grinding) to the first worktable 13, the second handling robot 15 can transfer the substrate before grinding placed on the first worktable 13 to either the first grinding line 121a or the second grinding line 121b. For example, the second handling robot 15 can transfer the substrate before grinding placed on the first worktable 13 to a first transfer position on the first grinding line 121a (e.g., ...). Figure 2 The first transfer position TP1) or the first transfer position TP1 of the second grinding line 121b.

[0068] In one embodiment, the second transport robot 15 can transfer the polished substrate from either the first polishing line 121a or the second polishing line 121b to either the first cleaning line 122a or the second cleaning line 122b. For example, the second transport robot 15 can transfer the polished substrate from the first polishing line 121a to the first cleaning line 122a, or it can transfer the polished substrate from the second polishing line 121b to the second cleaning line 122b. However, this is illustrative; the second transport robot 15 can also transfer the polished substrate from the first polishing line 121a to the second cleaning line 122b, or vice versa. With this configuration, if either the first cleaning line 122a or the second cleaning line 122b fails, the polished substrate can be transferred to another clean line that is not malfunctioning, thus increasing process flexibility.

[0069] Figure 2 This is a schematic plan view of the first grinding line according to one embodiment. Figure 3 This is a schematic side view of the first rotating part and the loading part in the first grinding line according to one embodiment.

[0070] Reference Figure 2 and Figure 3 In one embodiment, the first grinding line 121a may include a first rotating part 1211, a second rotating part 1212, a loading part 1213, and a grinding pad 1214.

[0071] In one embodiment, the first rotating part 1211 rotates about a first axis A1 perpendicular to the ground and can transport the substrate along a circular first transfer track TO1. The first rotating part 1211 can be transported by a second handling robot (e.g., a second handling robot). Figure 1 The second transport robot 15 receives the substrate in its pre-grinding state. The first rotating part 1211 can transfer the received substrate to the second rotating part 1212. Furthermore, the first rotating part 1211 receives the substrate in its post-grinding state transferred from the second rotating part 1212, and can transfer it to a post-grinding process (e.g., a cleaning process) via the second transport robot 15. The first rotating part 1211 can move the substrate along a circular track. The first rotating part 1211 can move multiple substrates simultaneously. For example, the transfer of substrates in their pre-grinding state and the transfer of substrates in their post-grinding state can be performed simultaneously.

[0072] In one embodiment, the first rotating part 1211 can rotate about a first axis A1 perpendicular to the ground. The first rotating part 1211 can rotate in one or two directions. The first rotating part 1211 may include a second worktable 12111.

[0073] In one embodiment, the second worktable 12111 is connected to and can rotate integrally with the first rotating part 1211. The second worktable 12111 can support the underside of the substrate. The second worktable 12111 forms a first transfer track TO1 as the first rotating part 1211 rotates, and can rotate about a first axis A1. The first transfer track TO1 can be formed as a circle. The second worktable 12111 rotates about the first axis A1 with the substrate placed on it, thereby transferring the substrate to a position on the first transfer track TO1 (e.g., a first transfer position TP1 or a second transfer position TP2).

[0074] In one embodiment, at least one second worktable 12111 may be provided. For example, multiple second worktables 12111 may be provided. For example, two second worktables 12111 may be provided. Multiple second worktables 12111 may be arranged at specified intervals centered on the first axis A1. For example, multiple second worktables 12111 may be arranged at the same angle centered on the first axis A1. Additionally, Figure 1 and Figure 2 The number of second worktables 12111 shown is for illustrative purposes only and is not limited thereto. The specific details of substrate transfer on the second worktables 12111 will be described later.

[0075] In one embodiment, the second rotating part 1212 rotates around a second axis A2 perpendicular to the ground and can transfer the substrate along a circular second transfer track TO2. The second rotating part 1212 can rotate in one or both directions. The second rotating part 1212 may include a carrier head 12121.

[0076] In one embodiment, the second rotating part 1212 can support the carrier head 12121 on its upper side and can move the carrier head 12121 along the second transfer track TO2 with the second axis A2 as the center. The substrate can be transferred by means of the second rotating part 1212 while being gripped by the carrier head 12121. The carrier head 12121 can grip the substrate by adsorption through a membrane (not shown). The transfer of the substrate between the second worktable 12111 and the carrier head 12121 can be performed by means of the loading part 1213 described later.

[0077] In one embodiment, the carrier head 12121 causes the polishing pad 1214 to contact and rub against the polishing surface of the substrate, thereby performing a polishing process. The carrier head 12121 and the polishing pad 1214 can polish the substrate at least through relative rotational motion. For example, for polishing the substrate, the carrier head 12121 can rotate and / or move in parallel (oscillation). In addition, for loading / unloading the substrate or for polishing the substrate, the carrier head 12121 can be driven to move vertically.

[0078] In one embodiment, multiple carrier heads 12121 may be provided. For example, two carrier heads 12121 may be provided. When multiple carrier heads 12121 are connected to the second rotating part 1212, the multiple carrier heads 12121 may be arranged at specified intervals with the second axis A2 as the center. For example, the multiple carrier heads 12121 may be arranged at the same angle with the second axis A2 as the center. However, this is an example, and the number of carrier heads 12121 is not limited thereto.

[0079] In one embodiment, the loading unit 1213 can load a substrate in its pre-grinding state from the second worktable 12111 onto the carrier head 12121. The loading unit 1213 can also unload a substrate in its post-grinding state from the carrier head 12121 onto the second worktable 12111. The loading unit 1213 can load or unload the substrate through vertical lifting and lowering movements. During the loading or unloading process of the loading unit 1213, the first rotating unit 1211 (e.g., the second worktable 12111) can move vertically up and down. Alternatively, the loading unit 1213 can be integrated with the first rotating unit 1211. That is, the first rotating unit 1211 (e.g., the second worktable 12111) can load the substrate onto or unload it from the carrier head 12121 itself through vertical lifting and lowering movements, without the need for a separate loading unit.

[0080] The following is for reference Figure 2 and Figure 3 The first transfer track TO1 of the first rotating part 1211 will be described in detail.

[0081] In one embodiment, firstly, the second transport robot (e.g.: Figure 1 The second handling robot 15) can move the substrate before grinding from the first worktable (e.g.: Figure 1 The first rotating part 1211 can transfer the substrate from the second transport robot 15 to the second rotating part 12111 located at the first transfer position TP1 on the first transfer track TO1. The transferred substrate can be placed on the second rotating part 12111 located at the first transfer position TP1. In addition, the first rotating part 1211 can transfer the substrate from the first transfer position TP1 to the second transport robot 15. For example, the first rotating part 1211 can transfer the substrate in the post-grinding state to the next process (e.g., cleaning process) via the second transport robot 15 at the first transfer position TP1. That is, the substrate in the waiting-to-be-transferred state can be located at the first transfer position TP1. The second transport robot 15 can transfer the substrate in the pre-grinding state from the cassette or FOUP to the first rotating part 1211 at the first transfer position TP1, or transfer the substrate in the post-grinding state to the cleaning process (e.g., cleaning process) at the first transfer position TP1. Figure 1 The first cleaning line 1212a or the second cleaning line 1212b).

[0082] In one embodiment, the first transfer track TO1 and the second transfer track TO2 may overlap at the second transfer position TP2. At the second transfer position TP2, the substrate can move from the first rotating part 1211 to the second rotating part 1212. For example, the first rotating part 1211 may transfer (load) the substrate in its pre-grinding state to the second rotating part 1212 at the second transfer position TP2. At the second transfer position TP2, the substrate can move from the second rotating part 1212 to the first rotating part 1211. For example, the second rotating part 1212 may transfer (unload) the substrate in its post-grinding state to the first rotating part 1211 at the second transfer position TP2. At the second transfer position TP2, substrate transfer between the first rotating part 1211 and the second rotating part 1212 may be performed by means of the loading part 1213. For this purpose, the loading part 1213 may be disposed at the second transfer position TP2. The loading unit 1213 can load the substrate in the pre-grinding state from the second worktable 12111 located at the second transfer position TP2 to the carrier head 12121 located at the second transfer position TP2. The loading unit 1213 can unload the substrate in the post-grinding state from the carrier head 12121 located at the second transfer position TP2 to the second worktable 12111 located at the second transfer position TP2.

[0083] In one embodiment, the second worktable 12111 of the first rotating part 1211 can alternately be located at the first transfer position TP1 and the second transfer position TP2 while rotating along the first transfer track TO1. For example, when one second worktable 12111 is located at the first transfer position TP1, the other second worktable 12111 can be located at the second transfer position TP2. As the first rotating part 1211 rotates, if one second worktable 12111 moves from the first transfer position TP1 to the second transfer position TP2, the other second worktable 12111 can move. That is, while the first rotating part 1211 transfers the first substrate from the first transfer position TP1 to the second transfer position TP2, it can also transfer the second substrate from the second transfer position TP2 to the first transfer position TP1.

[0084] The following is for reference Figure 2 and Figure 3 The second transfer track TO2 of the second rotating part 1212 will be described in detail.

[0085] In one embodiment, the carrier head 12121 of the second rotating part 1212 can receive the substrate in its pre-grinding state, transferred (loaded) from the first rotating part 1211, at the second transfer position TP2. Once the substrate loading is complete, the carrier head 12121 can move to the grinding position PP by means of the rotation of the second rotating part 1212. The grinding position PP can be the location where the second transfer track TO2 and the grinding pad 1214 overlap. That is, at least a portion of the grinding pad 1214 can overlap with the grinding position PP. Grinding of the substrate can be performed at the grinding position PP. Specifically, the carrier head 12121 can grind the substrate in its pre-grinding state at the grinding position PP. Once the substrate grinding is complete, the carrier head 12121 can move back to the second transfer position TP2 by means of the rotation of the second rotating part 1212. The carrier head 12121 can then transfer (unload) the substrate in its post-grinding state from the second transfer position TP2 to the first rotating part 1211.

[0086] In one embodiment, while a substrate is being ground at the grinding position PP, another substrate can be moved (loaded) from the first rotating part 1211 to the second rotating part 1212, or moved (unloaded) from the second rotating part 1212 to the first rotating part 1211 at the second transfer position TP2. That is, while a substrate is being ground at one carrier head 12121, another substrate can be loaded or unloaded at another carrier head 12121.

[0087] In one embodiment, the carrier head 12121 of the second rotating part 1212 can alternately be located at the second transfer position TP2 and the polishing position PP while rotating along the second transfer track TO2. For example, when one carrier head 12121 is located at the second transfer position TP2, the other carrier head 12121 can be located at the polishing position PP. As the second rotating part 1212 rotates, if one carrier head 12121 moves from the second transfer position TP2 to the polishing position PP, the other carrier head 12121 can move from the polishing position PP to the second transfer position TP2. That is, while the second rotating part 1212 transfers one substrate from the polishing position PP to the second transfer position TP2, it can also transfer another substrate from the second transfer position TP2 to the polishing position PP.

[0088] The following is for reference Figure 2 and Figure 3 The loading section 1213 will be described below.

[0089] In one embodiment, the loading unit 1213 may be located at the second transfer position TP2. At the second transfer position TP2, the loading unit 1213 can load the substrate from the second worktable 12111 to the carrier head 12121, or unload the substrate from the carrier head 12121 to the second worktable 12111. For this purpose, the loading unit 1213 may be configured to be vertically movable.

[0090] In one embodiment, the loading unit 1213 may further include a cleaning nozzle 12131. The cleaning nozzle 12131 sprays cleaning fluid to clean the carrier head 12121 located at the second transfer position TP2. For example, with the loading unit 1213 encasing the carrier head 12121 at the second transfer position TP2, cleaning fluid is sprayed from the cleaning nozzle 12131 to clean the carrier head 12121. At this time, the carrier head 12121 may not be gripping the substrate. The film (not shown) of the carrier head 12121 can be cleaned by the cleaning fluid sprayed from the cleaning nozzle 12131. Therefore, the phenomenon of abrasive particles adhering to the film can be prevented. Furthermore, cleaning the carrier head 12121 by operating the loading unit 1213 while the carrier head 12121 is located at the second transfer position TP2 saves space in this respect. In addition, while one carrier head 12121 is polishing the substrate at the polishing position PP, the other carrier head 12121 can be cleaned at the second transfer position TP2, thus saving time.

[0091] In one embodiment, an additional spray nozzle (not shown) may be provided at the first transfer position TP1. When the substrate is placed on the second worktable 12111 at the first transfer position TP1, the spray nozzle may spray pure water or the like to prevent the substrate from drying while waiting.

[0092] Furthermore, the second polishing line 121b is a configuration corresponding to the first polishing line 121a, and can be understood as being connected through... Figure 2 and Figure 3 The first polishing line 121a described is substantially the same. Therefore, the description of the second polishing line 121b refers to the description of the first polishing line 121a.

[0093] Figure 4 This is a schematic perspective view of a first cleaning line according to one embodiment.

[0094] Reference Figure 4 According to one embodiment, a first cleaning line 122a can perform a cleaning process for cleaning and polishing substrates. The first cleaning line 122a may include a chamber portion 1220 and a third handling robot 1221.

[0095] In one embodiment, chamber portion 1220 provides space for performing a cleaning process on a substrate. In one embodiment, chamber portion 1220 may be formed in multiple ways. For example, chamber portion 1220 may include a first chamber portion 1220a and a second chamber portion 1220b disposed horizontally spaced from the first chamber portion 1220a. However, this is an example, and the number of chamber portions 1220 is not limited thereto.

[0096] In one embodiment, the chamber portion 1220 may include a cleaning chamber for cleaning a substrate. A nozzle may be provided inside the cleaning chamber to supply cleaning fluid for cleaning the substrate. In one embodiment, multiple cleaning chambers may be formed. For example, the chamber portion 1220 may include a first cleaning chamber 12201, a second cleaning chamber 12202, a third cleaning chamber 12203, a fourth cleaning chamber 12204, and a fifth cleaning chamber 12205. Furthermore, the first cleaning chamber 12201, the second cleaning chamber 12202, the third cleaning chamber 12203, the fourth cleaning chamber 12204, and the fifth cleaning chamber 12205 may each be equipped with nozzles for supplying different types of cleaning fluid. At least a portion of the first cleaning chamber 12201, the second cleaning chamber 12202, the third cleaning chamber 12203, the fourth cleaning chamber 12204, and the fifth cleaning chamber 12205 may be chambers for performing the process of cleaning the substrate, and the other portions may be chambers for performing the process of drying the cleaning solution.

[0097] In one embodiment, the first chamber portion 1220a may include a first cleaning chamber 12201, a second cleaning chamber 12202, and a third cleaning chamber 12203, and the second chamber portion 1220b may include a fourth cleaning chamber 12204 and a fifth cleaning chamber 12205. However, this is merely an example, and the number and arrangement of chambers are not limited thereto.

[0098] In one embodiment, multiple cleaning chambers can be stacked vertically. For example, the first cleaning chamber 12201, the second cleaning chamber 12202, and the third cleaning chamber 12203 of the first chamber section 1220a can be stacked sequentially from bottom to top (e.g., in the +z-axis direction) with the ground as a reference. Furthermore, the fourth cleaning chamber 12204 and the fifth cleaning chamber 12205 of the second chamber section 1220b can be stacked sequentially from top to bottom (e.g., in the -z-axis direction) with the ground as a reference.

[0099] In one embodiment, the third handling robot 1221 can move, remove, or transfer substrates into, out of, or to multiple cleaning chambers. In one embodiment, the third handling robot 1221 can support the underside of the substrate. For example, the third handling robot 1221 may include a gripping part for gripping the substrate and transferring it stably. In one embodiment, the third handling robot 1221 may be configured between the first chamber portion 1220a and the second chamber portion 1220b. For example, the first chamber portion 1220a, the third handling robot 1221, and the second chamber portion 1220b may be configured along a straight line in the x-axis direction. However, this is an example, and the configuration of the chamber portions 1220 and the third handling robot 1221 is not limited thereto. For example, if there are multiple chamber portions 1220, the multiple chamber portions 1220 may be spaced apart along the periphery of the third handling robot 1221.

[0100] In one embodiment, the third handling robot 1221 can move in both vertical and horizontal directions and can rotate about an axis perpendicular to the ground. Therefore, the third handling robot 1221 can freely access the plurality of cleaning chambers stacked vertically and freely access the first chamber portion 1220a and the second chamber portion 1220b arranged horizontally spaced apart.

[0101] Figure 5 This is a schematic side view illustrating a first cleaning line of a cleaning process for a substrate according to one embodiment.

[0102] Reference Figure 5 According to one embodiment, the first cleaning line 122a can use a third handling robot 1221 to clean substrates from multiple chamber sections 1220.

[0103] In one embodiment, the cleaning chamber has an entrance / exit (not shown) in at least one direction to allow the substrate to enter and exit. In one embodiment, the third handling robot 1221 can move the substrate into any one of the first cleaning chamber 12201, the second cleaning chamber 12202, the third cleaning chamber 12203, the fourth cleaning chamber 12204, and the fifth cleaning chamber 12205. Furthermore, the third handling robot 1221 can wait while cleaning the substrate within the cleaning chamber. And, when the cleaning of the substrate is completed within the cleaning chamber, the third handling robot 1221 can remove the substrate and transfer it to another location among the first cleaning chamber 12201, the second cleaning chamber 12202, the third cleaning chamber 12203, the fourth cleaning chamber 12204, and the fifth cleaning chamber 12205. For example, as... Figure 5 As shown in (a), the third handling robot 1221 can transfer the substrate in the order of the first cleaning chamber 12201, the second cleaning chamber 12202, the third cleaning chamber 12203, the fourth cleaning chamber 12204, and the fifth cleaning chamber 12205. Furthermore, as... Figure 5 As shown in (b), the first handling robot 1221 can transfer the substrate in the order of the first cleaning chamber 12201, the third cleaning chamber 12203, the second cleaning chamber 12202, the fourth cleaning chamber 12204, and the fifth cleaning chamber 12205. Therefore, even if the order of the cleaning liquid exposed on the substrate changes with the cleaning process, the cleaning process can be performed by changing the path of the substrate transfer without changing the position of the cleaning chambers or the cleaning liquid, thus increasing the degree of process flexibility. However, Figure 5The embodiments in (a) and (b) are merely illustrative and not intended to be limiting. For example, the third handling robot 1221 can pass through multiple cleaning chambers in various sequences. Furthermore, the positions of the cleaning chambers at the start and end of the cleaning process can be fixed. For example, the cleaning process can begin in the first cleaning chamber 12201 and end in the fifth cleaning chamber 12205. For example, the substrate cleaned in the fifth cleaning chamber 12205 can be received using a device located at the first receiving position (e.g., ...). Figure 1 The first receiving position RP1) of the first transport robot (e.g.: Figure 1 The first transport robot 14) delivers the cartridge or FOUP located in the front-end module 11.

[0104] Figure 6 This is a schematic perspective view of the first chamber portion according to one embodiment.

[0105] Reference Figure 6 According to one embodiment, the first chamber portion 1220a can be transferred by the second handling robot 15 after grinding.

[0106] In one embodiment, the second handling robot 15 can transfer the polished substrate from the first polishing line 121a or the second polishing line 121b to any one of the multiple cleaning chambers of the first cleaning line 122a or the second cleaning line 122b. For example, the second handling robot 15 can transfer the substrate placed on the second workbench (e.g.: Figure 2 The polished substrate from the second worktable 12111 is transferred to any one of the multiple cleaning chambers of the first cleaning line 122a or the second cleaning line 122b, wherein the second worktable is located at the first transfer position (e.g.: Figure 2 The first transfer position TP1). For example, the second handling robot 15 can transfer the polished substrate from either the first polishing line 121a or the second polishing line 121b to the first chamber portion 1220a of either the first cleaning line 122a or the second cleaning line 122b.

[0107] In one embodiment, such as Figure 6 As shown in (a), the second transport robot 15 can transfer the polished substrate from the first transfer position TP1 to the first cleaning chamber 12201 of the first chamber section 1220a. However, Figure 6 (a) This is an example for ease of understanding and does not imply that the substrate is transferred from the second handling robot 15 to the first cleaning chamber 12201. For example, the second handling robot 15 may also transfer the substrate to the second cleaning chamber 12202 or the third cleaning chamber 12203.

[0108] In one embodiment, the first cleaning line 122a may further include a transfer table 1222. A second handling robot 15 can transfer the polished substrate from a first transfer position TP1 to the transfer table 1222. The transfer table 1222 may be disposed adjacent to a cleaning chamber. Furthermore, the transfer table 1222 may be located between two adjacent cleaning chambers in a plurality of cleaning chambers. For example, in... Figure 6 In (b), the transfer worktable 1222 can be located between the first cleaning chamber 12201 and the second cleaning chamber 12202. However, Figure 6 (b) This is merely an illustrative example for ease of understanding and does not imply that the transfer stage 1222 is located between the first cleaning chamber 12201 and the second cleaning chamber 12202. For example, the transfer stage 1222 may also be located below the first cleaning chamber 12201 or between the second cleaning chamber 12202 and the third cleaning chamber 12203. If the second handling robot 15 transfers the polished substrate to the transfer stage 1222, then the third handling robot 1221 may transfer the substrate transferred to the transfer stage 1222 to any one of the plurality of cleaning chambers.

[0109] Furthermore, the second cleaning line 122b, as a configuration corresponding to the first cleaning line 122a, can be understood as being connected to the first cleaning line 122a. Figures 4 to 6 The description of the first cleaning line 122a is substantially the same. Therefore, the description of the second cleaning line 122b refers to the description of the first cleaning line 122a.

[0110] While embodiments have been described above with reference to the accompanying drawings, various technical modifications and variations can be applied to those skilled in the art based on the description. For example, appropriate results can be achieved by performing the described techniques in a different order than the described method, and / or by combining or integrating the described system, structure, device, circuit, and other constituent elements in a different form than the described method, or by substituting or replacing them with other constituent elements or equivalents.

[0111] Therefore, other implementations, other embodiments, and matters equivalent to those in the claims also fall within the scope of the claims.

Claims

1. A substrate processing system, characterized in that, include: Front-end module; The first process line includes a first grinding line and a first cleaning line; The second process line includes a second grinding line and a second cleaning line, and is arranged in parallel with the first process line; The first workbench is located between the first process line and the second process line; as well as The first transport robot moves the substrate from the front-end module to the first worktable; It also includes a second transport robot that transports substrates between at least two locations among the first grinding line, the first cleaning line, the second grinding line, the second cleaning line and the first worktable; The first polishing wire and the second polishing wire each include: A first rotating part rotates to form a first transfer track along a circle, and transfers a substrate between a first transfer position and a second transfer position; wherein, the first rotating part includes at least one second worktable, which is alternately located at the first transfer position and the second transfer position; A second rotating part, as it rotates, forms a second transfer track along a circle, transferring a substrate between a second transfer position and a grinding position; wherein the second rotating part includes at least one carrier head, which alternately positions itself at the second transfer position and the grinding position; and A grinding pad, at least a portion of which rotates at a position overlapping with the grinding location.

2. The substrate processing system according to claim 1, characterized in that, The second transport robot moves the substrate from the first worktable to a first transfer position on either the first grinding line or the second grinding line.

3. The substrate processing system according to claim 1, characterized in that, The first grinding line and the second grinding line each also include a loading section, which loads the substrate onto the carrier head or unloads the substrate from the carrier head at the second transfer position.

4. The substrate processing system according to claim 3, characterized in that, The loading unit includes a cleaning nozzle for cleaning the carrier head located at the second transfer position.

5. The substrate processing system according to claim 1, characterized in that, The second transport robot will transfer the polished substrate from either the first polishing line or the second polishing line to either the first cleaning line or the second cleaning line.

6. The substrate processing system according to claim 5, characterized in that, The first handling robot will transfer the cleaned substrate from either the first cleaning line or the second cleaning line to the front-end module.

7. The substrate processing system according to claim 1, characterized in that, The first cleaning line and the second cleaning line each include: A chamber section, comprising at least a portion of a plurality of cleaning chambers stacked vertically; and The third transport robot moves the substrate from at least one of the multiple cleaning chambers to another.

8. The substrate processing system according to claim 7, characterized in that, The chamber section includes: The first chamber section includes at least one cleaning chamber; The second chamber section includes at least one cleaning chamber, which is horizontally spaced from the first chamber section. The third transport robot is located between the first and second chambers.

9. The substrate processing system according to claim 8, characterized in that, The second transport robot will transfer the polished substrate from either the first polishing line or the second polishing line to the first chamber of either the first cleaning line or the second cleaning line.

10. The substrate processing system according to claim 9, characterized in that, The first transport robot transfers the cleaned substrate from the second chamber of either the first or second cleaning line to the front-end module.

11. A substrate processing system, characterized in that, include: The front-end module is configured along the first direction; The first process line includes a first grinding line and a first cleaning line, which are arranged along a second direction perpendicular to the first direction. The second process line includes a second grinding line and a second cleaning line, which are arranged along a third direction that is perpendicular to the first direction and parallel to the second direction; as well as The second handling robot is configured between the first process line and the second process line to transfer the substrate between at least two positions in the first grinding line, the first cleaning line, the second grinding line and the second cleaning line. The first polishing wire and the second polishing wire each include: A first rotating part rotates to form a first transfer track along a circle, and transfers a substrate between a first transfer position and a second transfer position; wherein, the first rotating part includes at least one second worktable, which is alternately located at the first transfer position and the second transfer position; A second rotating part, as it rotates, forms a second transfer track along a circle, transferring a substrate between a second transfer position and a grinding position; wherein the second rotating part includes at least one carrier head, which alternately positions itself at the second transfer position and the grinding position; and A grinding pad, at least a portion of which rotates at a position overlapping with the grinding location.

12. The substrate processing system according to claim 11, characterized in that, The first grinding line and the second grinding line each also include a loading section, which loads the substrate onto the carrier head or unloads the substrate from the carrier head at the second transfer position.

13. The substrate processing system according to claim 12, characterized in that, The loading unit includes a cleaning nozzle for cleaning the carrier head located at the second transfer position.

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