Deposition mask for OLED pixel deposition

Abstract

A deposition mask is disclosed, comprising a metal plate including a deposition region and a non-deposition region disposed outside the deposition region. An opening for stretching the metal plate and a protrusion formed through the opening are formed in the non-deposition region. When the short width of the metal plate is defined as A and the number of protrusions is defined as Y, the value of Z in the following equation is expressed as a natural number, a decimal, or a natural number plus a decimal: [Equation] Z = A / (Y + Y - 1). The non-deposition region includes a first non-deposition region disposed at a first outer portion of the deposition region and a second non-deposition region disposed at a second outer portion thereon. The opening includes a first opening portion disposed facing each other at the end of the first non-deposition region and a second opening portion disposed at the end of the second non-deposition region. The protrusion includes a first protrusion disposed facing each other at the end of the first non-deposition region and a second protrusion disposed at the end of the second non-deposition region.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0160950 (filed on November 26, 2020) pursuant to 35U.SC119 and 35U.SC365, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The implementation relates to a deposition mask for organic light-emitting diode (OLED) pixel deposition. Background Technology

[0004] Display devices are used in a wide variety of devices. For example, they are used not only in small devices such as smartphones and tablets but also in large devices such as televisions, monitors, and public display (PD) systems. In particular, the demand for ultra-high definition (UHD) displays with 500 pixels per inch (PPI) or higher has recently increased, and high-resolution display devices are already being used in both small and large devices. Therefore, there is growing interest in technologies for achieving low power consumption and high resolution.

[0005] Commonly used display devices can be broadly classified into liquid crystal displays (LCDs), organic light-emitting diodes (OLEDs), etc., based on their driving methods.

[0006] An LCD is a display device driven by liquid crystal, and it has the following structure: a light source, including a cold cathode fluorescent lamp (CCFL) or a light-emitting diode (LED), is arranged in the lower part of the liquid crystal. An LCD is a display device driven by controlling the amount of light emitted from the light source using liquid crystal arranged on the light source.

[0007] Furthermore, OLEDs are display devices driven by organic materials and do not require a separate light source; the organic materials themselves can act as a light source and can be driven with low power consumption. Additionally, OLEDs have attracted attention as display devices that can exhibit infinite contrast, have a response time approximately 1000 times faster than LCDs, and offer excellent viewing angles compared to LCDs.

[0008] Specifically, organic materials, including those in the light-emitting layer of an OLED, can be deposited on a substrate using a deposition mask called a fine metal mask (FMM). The deposited organic material can be shaped into a pattern corresponding to the pattern formed on the deposition mask to serve as a pixel. The deposition mask is typically made of an Invar alloy metal plate containing iron (Fe) and nickel (Ni). In this case, through-holes can be formed on one and another surface of the metal plate, and these through-holes can be formed at positions corresponding to the pixel pattern. Therefore, organic materials, such as red, green, and blue organic materials, can be deposited on the substrate through the through-holes in the metal plate, and the pixel pattern can be formed on the substrate.

[0009] Meanwhile, in the Invar alloy metal sheet used for deposition masks, through holes can be formed in the metal sheet after a rolling process is performed to modify the thickness and surface of the metal sheet.

[0010] In this situation, when a rolling process is performed on a metal sheet, the sheet bends and the stress distribution within the sheet changes randomly, which can create ripples on the surface of the sheet. Therefore, the length of the sheet along its minor axis varies for each region, and the length along its major axis also changes, potentially reducing the flatness of the sheet.

[0011] Therefore, when using a deposition mask that produces ripples to deposit on a deposition target, the following problems exist: the vias are misaligned or organic material is deposited at a thin thickness in the deposition area of ​​the deposition target as a defect.

[0012] Therefore, a new deposition mask is needed that can control the bending and resulting waviness of the metal sheet caused by the rolling process. Summary of the Invention

[0013] Technical issues

[0014] The implementation aims to provide a deposition mask that can easily reduce the corrugation of the metal plate and has improved deposition efficiency.

[0015] Technical solutions

[0016] According to an embodiment, a deposition mask includes a metal plate comprising a deposition region and a non-deposition region disposed outside the deposition region. An opening for stretching the metal plate and protrusions formed through the opening are formed in the non-deposition region. When the short width of the metal plate is defined as A and the number of protrusions is defined as Y, the Z value in the following equation is expressed as a natural number, a decimal, or a natural number plus a decimal. The non-deposition region includes a first non-deposition region disposed at a first outer portion of the deposition region and a second non-deposition region disposed at a second outer portion of the deposition region. The opening includes a first opening at the end of the first non-deposition region and a second opening at the end of the second non-deposition region. The protrusion includes a first protrusion at the end of the first non-deposition region and a second protrusion at the end of the second non-deposition region. The first opening and the second opening are arranged opposite each other, and the first protrusion and the second protrusion are arranged opposite each other.

[0017] [Equation]

[0018] Z = A / (Y + Y - 1)

[0019] Beneficial effects

[0020] According to the embodiment, the deposition mask can easily control the ripples randomly arranged on the surface of the deposition mask by making the width and distance between the first protrusion and the second protrusion the same.

[0021] In other words, after measuring the coordinates of the ripples formed on the surface of the deposition mask, the ripples of the deposition mask can be controlled by stretching the first and second protrusions according to the coordinates.

[0022] Furthermore, according to the embodiment, the deposition mask forms a first protrusion and a second protrusion such that the width and distance between the first protrusion and the second protrusion are natural numbers or natural numbers plus decimals, thereby accurately measuring the coordinates of the ripples formed on the surface of the deposition mask, and thus accurately controlling the ripples randomly arranged on the surface of the deposition mask. Attached Figure Description

[0023] Figure 1 This is a view illustrating an organic material deposition apparatus used with a deposition mask according to an embodiment.

[0024] Figure 2 This is a cross-sectional view illustrating the contact relationship between the metal plate of the deposition mask and the deposition substrate after the pretreatment process.

[0025] Figure 3 It is a planar diagram used to describe the ripples of a deposition mask.

[0026] Figure 4 It is a cross-sectional view used to describe the stretching direction of the deposition mask.

[0027] Figure 5 It is a cross-sectional view used to describe the contact relationship between the deposition mask and the substrate after the stretching process.

[0028] Figure 6 This is a plan view illustrating a deposition mask according to an embodiment. Detailed Implementation

[0029] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the present disclosure are not limited to the embodiments described, and may be implemented in various other forms. Furthermore, one or more elements of the embodiments may be selectively combined and substituted within the spirit and scope of the present disclosure. Additionally, unless explicitly defined and described otherwise, the terminology used in the embodiments of the present invention (including technical and scientific terms) is to be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and terms such as those defined in common dictionaries are to be interpreted as having a meaning consistent with their meaning in the context of the relevant art.

[0030] Furthermore, the terminology used in the embodiments of this disclosure is for the purpose of implementation and is not intended to limit the disclosure. In this specification, unless specifically stated in the phrase, the singular form may also include the plural form, and when described as “at least one (or more) of A, B, and C,” it may include at least one of all combinations that can be combined among A, B, and C.

[0031] Furthermore, when describing elements of embodiments of this disclosure, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish elements from other elements, and the terms do not limit the nature, order, or sequence of the elements.

[0032] In addition, when an element is described as “connected,” “linked,” or “connected” to another element, it can include not only cases where the element is directly “connected,” “linked,” or “connected” to another element, but also cases where the element is “connected,” “linked,” or “connected” to another element via another element.

[0033] Furthermore, when described as being formed or arranged “above” or “below” in each element, “above” or “below” can include not only cases where two elements are directly connected to each other, but also cases where one or more other elements are formed or arranged between the two elements.

[0034] Furthermore, when expressed as "above" or "below", based on a single element, it can include not only the direction above but also the direction below.

[0035] In the following description, the deposition mask according to the embodiments will be described with reference to the accompanying drawings.

[0036] Figure 1 This is a view illustrating an organic material deposition apparatus used with a deposition mask according to an embodiment.

[0037] Reference Figure 1 The organic material deposition apparatus 1000 may include a deposition mask 1100, a mask frame 1200, a deposition substrate 1300, an organic material deposition container 1400, and a vacuum chamber 1500.

[0038] The deposition mask 1100, mask frame 1200, deposition substrate 1300, and organic material deposition container 1400 can be housed in a vacuum chamber 1500. Therefore, the deposition process through the deposition mask 1100 can be performed in a vacuum environment.

[0039] The deposition substrate 1300 can be a substrate used to manufacture a display device. For example, the deposition substrate 1300 can be a substrate for depositing organic materials used to deposit OLED pixel patterns. Red (R), green (G), and blue (B) patterns can be formed on the deposition substrate 1300 to form pixels that are the three primary colors of light. That is, RGB patterns can be formed on the deposition substrate 1300.

[0040] The deposition mask 1100 can be disposed on one surface of the deposition substrate 1300. More specifically, the deposition mask 1100 can be disposed on the deposition surface on both surfaces of the deposition substrate 1300 where the organic material is deposited, and the deposition mask 1100 can be fixed by the mask frame 1200.

[0041] Therefore, organic materials can pass through the vias TH formed in the deposition mask 1100 to deposit organic materials forming RGB patterns on the deposition surface of the deposition substrate 1300.

[0042] Figure 2 and Figure 3 This is a view used to describe the arrangement relationship between the deposition mask 1100 and the deposition substrate 1300.

[0043] Reference Figure 2 The deposition mask 1100 can be disposed on the deposition surface of the deposition substrate 1300, and the deposition mask 1100 can be disposed in contact with the deposition surface of the deposition substrate 1300.

[0044] The deposition mask 1100 can be formed by forming a plurality of vias TH in a metal plate 100 comprising iron and nickel. More specifically, the deposition mask 1100 can be formed by forming a plurality of vias TH formed by an etching process in a metal plate 100 comprising an Invar alloy containing iron and nickel.

[0045] In detail, the metal plate 100 may include a first surface 101 and a second surface 102 that are opposite to each other. A small surface hole V1 may be formed on the first surface 101 of the metal plate 100 and a large surface hole V2 may be formed on the second surface 102 of the metal plate 100.

[0046] The large surface aperture V2 can be arranged to face the organic material deposition container 1400, whereby the large surface aperture V2 can be a region in which the deposited material of the organic material deposition container 1400 is introduced, and the small surface aperture V1 can be a region in which the deposited material introduced from the large surface aperture V2 passes through.

[0047] Small surface holes V1 and large surface holes V2 can be formed to partially penetrate the metal plate 100. For example, the depth of the small surface hole V1 can be less than the depth of the large surface hole V2. In addition, the small surface holes V1 and large surface holes V2 can be arranged at one location so as to overlap each other in the thickness direction of the metal plate 100 and the small surface holes V1 and large surface holes V2 can be formed to communicate with each other.

[0048] Therefore, multiple through holes TH can be formed in the metal plate 100 by communicating with the small surface hole V1 and the large surface hole V2.

[0049] The deposition mask 1100 can be arranged such that the small surface aperture V1 of the deposition mask 1100 contacts the deposition surface of the deposition substrate 1300.

[0050] Before forming the through-hole TH, the metal plate 100 can be subjected to a pretreatment process to reduce its thickness and treat its surface. Therefore, the distribution of residual stress inside the metal plate 100, i.e., the distribution of tensile and compressive stress, is randomly varied by the pretreatment process, and the metal plate bends due to such stress distribution, and thus, corrugations formed by the pretreatment process can be formed on the surface of the metal plate.

[0051] In other words, the thickness of the metal sheet is reduced to a predetermined thickness through a rolling process in which the metal sheet 100 is inserted between two rolls, and the surface roughness of the first and second surfaces of the metal sheet changes. However, since such a rolling process is carried out in one direction, the stress distribution inside the metal sheet changes irregularly due to the pressure applied along the first and second surface directions of the metal sheet, and the metal sheet bends in an irregular direction due to this irregular residual stress distribution, thus forming corrugations on the surface of the metal sheet.

[0052] The length, width, and short width dimensions of the metal sheet can vary due to the corrugations. For example, refer to... Figure 3 The dimensions of the short width SW or long width LW of the metal sheet can vary randomly for each region of the metal sheet due to the corrugations. That is, the dimensions in the width direction and the length direction of the metal sheet can vary randomly for each region of the metal sheet due to the corrugations.

[0053] Therefore, when the deposition mask 1100 and the deposition substrate 1300 are in contact with each other, such as Figure 2 As shown, due to the corrugations formed on the deposition mask 1100, the contact surfaces of the deposition mask 1100 and the deposition substrate 1300 may not be in complete contact with each other, and gaps g may be formed in some areas to facilitate contact between them. The distribution and size of the gaps g can increase with the increase of corrugations.

[0054] Therefore, the first via TH formed in the deposition mask 100 can be arranged to be displaced relative to the deposition area to be deposited on the deposition substrate 300, thereby degrading the deposition efficiency after the deposition process. In addition, since the thickness of the organic material in the deposition area through the metal plate is different for each area, the following problem exists: the thickness of the organic material pattern deposited on the deposition substrate becomes uneven.

[0055] To address this issue, before the deposition mask 1100 contacts the deposition surface of the deposition substrate 1300, a stretching process along the long axis of the deposition mask 1100 is performed to reduce the size of the ripples formed in the deposition mask 1100, allowing the deposition mask 1100 to contact the deposition substrate 1300. Therefore, as... Figure 5 As described above, after the deposition mask 1100 comes into contact with the deposition substrate 1300, the size and distribution of the gap region generated at the contact surface are reduced, thereby improving the deposition efficiency.

[0056] However, as Figure 3 As shown, the ripples formed on the deposition mask are formed at random locations on the surface of the deposition mask, and the size of the ripples formed at each location may be different. That is, regions WA are formed at multiple locations in the deposition mask—where ripples are formed, and the sizes of the ripples may differ from one another.

[0057] Therefore, when the deposition mask is stretched along its long axis, the following problem arises: it is difficult to control the formation of ripples of different sizes at different locations.

[0058] Therefore, a deposition mask that can solve the above problems will be described below.

[0059] Figure 6 This is a plan view illustrating a deposition mask according to an embodiment.

[0060] Reference Figure 6 According to the embodiment, the deposition mask 1100 may include a deposition region DA and a non-deposition region NDA.

[0061] The deposition region DA can be a region used to form a deposition pattern. That is, the deposition material can be deposited on the deposition substrate through the deposition region DA via the deposition mask.

[0062] The deposition mask 1100 may include multiple deposition regions DA. For example, the deposition regions DA may include multiple active portions and inactive portions. Specifically, the deposition regions DA may include multiple active portions capable of forming multiple deposition patterns and inactive portions UA where no deposition patterns are formed. The aforementioned multiple through-holes TH may be formed in the active portions.

[0063] Multiple valid parts may include a first valid part AA1, a second valid part AA2 and a third valid part AA3, and the multiple valid parts may be separated from each other by separation regions IA1 and IA2.

[0064] In the case of small display devices such as smartphones, an effective portion of any one of the multiple deposition regions included in the deposition mask 1100 can be an effective portion for forming a display device. Alternatively, in the case of large display devices such as televisions, multiple effective portions included in a deposition mask 1100 can be a single portion for forming a display device. Therefore, a deposition mask 1100 can include multiple effective portions to simultaneously form multiple display devices. Thus, the deposition mask according to the embodiment can improve process efficiency.

[0065] Non-depositional area NDA can be arranged on two side portions in the longitudinal direction of depositional area DA.

[0066] The non-deposition region NDA may include frame fixing regions FA1 and FA2 for fixing the deposition mask 1100 to the mask frame 1200. In addition, the non-deposition region NDA may include etched portions HF1 and HF2, opening portions OA1 and OA2, and protrusions PA1 and PA2.

[0067] The deposition mask 1100 can be stretched by stretching the protrusions PA1 and PA2 formed by the openings OA1 and OA2 along the long axis of the metal plate 100. In this case, the stress generated by stretching is evenly distributed in the area of ​​the metal plate 100 by etching the portions HF1 and HF2, thereby preventing the deposition mask 1100 from being damaged due to stretching stress.

[0068] The etched portions HF1 and HF2 can be holes or grooves formed in the non-deposited region NDA of the metal plate. That is, the etched portions HF1 and HF2 can be formed to completely penetrate the metal plate or to partially penetrate the metal plate.

[0069] In other words, the deposition mask 1100 distributes the stress generated by stretching evenly in the area of ​​the metal plate 100 through holes or grooves, thereby preventing the deposition mask 1100 from being damaged due to tensile stress.

[0070] The deposition mask 1100 may include a first opening portion OA1 and a second opening portion OA2. Additionally, the deposition mask 1100 may include a first protrusion PA1 and a second protrusion PA2.

[0071] The first opening portion OA1 and the first protrusion PA1 can be arranged at one end of the deposition mask, and the second opening portion OA2 and the second protrusion PA2 can be arranged at the other end of the deposition mask.

[0072] That is, the first opening portion OA1 and the first protrusion PA1 can be arranged on the first outer part of the non-deposition area of ​​the deposition mask, and the second opening portion OA2 and the second protrusion PA2 can be arranged on the second outer part of the non-deposition area of ​​the deposition mask.

[0073] In detail, the metal plate may include a long side portion in the longitudinal direction and a short side portion in the width direction, and the first opening portion OA1, the second opening portion OA2, the first protrusion PA1 and the second protrusion PA2 may be arranged only at the end of the short side portion of the metal plate.

[0074] The first opening portion OA1, the second opening portion OA2, the first protrusion PA1, and the second protrusion PA2 are used to fix the deposition mask to the frame and then stretch the deposition mask in the longitudinal direction. The first opening portion OA1, the second opening portion OA2, the first protrusion PA1, and the second protrusion PA2 can be arranged only at the ends of the short sides of the metal plate to stretch the deposition mask in the longitudinal direction. In the following description, for ease of description, the first opening portion OA1 and the first protrusion PA1 will be described primarily, and the second opening portion PA2 and the second protrusion PA2 can be applied in the same manner as the description of the first opening portion OA1 and the first protrusion PA1 described below.

[0075] The first opening portion OA1 and the first protrusion PA1 can be arranged alternately.

[0076] The first opening portion OA1 can be formed by etching one end of the deposition mask 1100. That is, the first opening portion OA1 can be a removal area from which a region of one end of the deposition mask 1100 has been removed, and the first protrusion PA1 can be the remaining region of one end of the deposition mask 1100, which is retained due to the formation of the first opening portion OA1.

[0077] Each of the first opening portion OA1 and the first protrusion PA1 can be formed in multiples. Furthermore, the number of first protrusions PA1 can be greater than the number of first opening portions OA1. Specifically, when the number of first opening portions OA1 is limited to X, the number of first protrusions PA1 Y can be X+1.

[0078] The number of first protrusions PA1 can be five or more. That is, the number of first openings OA1 can be four or more, and the number of first protrusions PA1 can be five or more. For example, the number of first openings OA1 can be four, and the number of first protrusions PA1 can be five.

[0079] The first protrusion PA1 is a region to which the stretching device is fixed when the deposition mask 1100 is stretched. When the number of first protrusions PA1 is less than four, it may be difficult to precisely control the ripples with random positions and various sizes formed on the surface of the deposition mask.

[0080] Meanwhile, when the short width—which is the width of the metal plate along its short axis—is defined as A, in the deposition mask 1100, the value defined by the following equation can be expressed as a natural number, a decimal, or a natural number plus a decimal.

[0081] [Equation]

[0082] Z = A / (Y + Y - 1)

[0083] Here, decimals are defined as numbers whose place value is less than one's place and can refer to numbers such as 0.1, 0.2, 0.3, etc.

[0084] In addition, natural numbers plus decimals can refer to numbers such as 1.1, 1.2, 1.3, etc.

[0085] In other words, the Z value represented in the above equation can refer to the value of a natural number, a decimal, or a natural number plus a decimal when A is divided by (Y+Y-1).

[0086] For example, when the value of A is limited to 70, the value of Y can be determined such that the value of Z is represented as a natural number, a decimal, or a natural number plus a decimal. For example, the value of Y can be four, but not a value such as five or six.

[0087] In other words, the deposition mask according to the embodiment can vary the number of protrusions and / or the short width—which is the width of the metal plate in the direction of the short axis—so that the Z value becomes a value expressed as a natural number, a decimal, or a natural number plus a decimal.

[0088] In other words, the deposition mask according to the embodiment can: fix the short width of the metal plate and vary the number of protrusions; fix the number of protrusions and vary the short width of the metal plate; or simultaneously vary the short width of the metal plate and the number of protrusions, so that the Z value becomes a value expressed as a natural number, a decimal, or a natural number plus a decimal.

[0089] Furthermore, the width w1 of the first opening portion OA1 can be defined by the value of an equation. That is, when the short width—which is the width along the minor axis of the metal plate—is defined as A, and the number of first protrusions PA1 is defined as Y, the value of the equation can be a natural number or a natural number plus a decimal, and the value of the equation can be defined as the width w1 of the first opening portion OA1. Here, the width of the first opening portion OA1 can be defined as the maximum width of the first opening portion OA1.

[0090] Furthermore, the width w2 of the first protrusion PA1 can be defined as the value of an equation. That is, when the short width—which is the width along the minor axis of the metal plate—is defined as A, and the number of first protrusions PA1 is defined as Y, the value of the equation can satisfy a natural number or a natural number plus a decimal, and the value of the equation can be defined as the width w2 of the first protrusion PA1. Here, the width of the first protrusion PA1 can be defined as the maximum width of the first opening portion OA1.

[0091] In other words, the width w1 of the first opening portion OA1 can be the same as the width w2 of the first protrusion PA1.

[0092] Therefore, when using the first protrusion PA1 as a reference, the first protrusion PA1 located at one end of the deposition mask 1100 can be arranged to be spaced apart at equal distances. That is, the first protrusion PA1 can be arranged to be spaced apart at equal distances such that the width w2 of the first protrusion PA1 is the same as the distance between the first protrusion PA1.

[0093] In other words, the width W2 of the first protrusion PA1 can be a natural number or a natural number plus a decimal; the distance of the first protrusion PA1 can be a natural number or a natural number plus a decimal, and the width w2 of the first protrusion PA1 and the distance of the first protrusion PA1 can be the same.

[0094] Meanwhile, the second protrusion PA2 and the second opening OA2 can be the same as the first protrusion PA1 and the first opening OA1 described above.

[0095] In other words, the width w4 of the second protrusion PA2 can be a natural number or a natural number plus a decimal; the distance of the second protrusion PA2 can be a natural number or a natural number plus a decimal, and the width w4 of the second protrusion PA2 and the distance of the second protrusion PA2 can be the same.

[0096] The first opening portion OA1 and the second opening portion OA2 can be arranged opposite each other. That is, multiple first opening portions OA1 can be arranged opposite to multiple second opening portions OA2.

[0097] In detail, the number of the first opening portion OA1 and the second opening portion OA2 can be the same and they can be arranged opposite each other.

[0098] Furthermore, the first protrusion PA1 and the second protrusion PA2 can be arranged opposite each other. That is, a plurality of first protrusions PA1 can be arranged opposite to a plurality of second protrusions PA2.

[0099] In detail, the number of the first protrusion PA1 and the second protrusion PA2 can be the same and they can be arranged opposite each other.

[0100] For example, the first protrusion PA1 may include a first-first protrusion PA1-1, a first-second protrusion PA1-2, a first-third protrusion PA1-3, a first-fourth protrusion PA1-4, and a first-fifth protrusion PA1-5, and the second protrusion PA2 may include a second-first protrusion PA2-1, a second-second protrusion PA2-2, a second-third protrusion PA2-3, a second-fourth protrusion PA2-4, and a second-fifth protrusion PA2-5, and in this case, the first- The first protrusion PA1-1 can be arranged opposite to the second protrusion PA2-1, the first protrusion PA1-2 can be arranged opposite to the second protrusion PA2-2, the first protrusion PA1-3 can be arranged opposite to the second protrusion PA2-3, the first protrusion PA1-4 can be arranged opposite to the second protrusion PA2-4, and the first protrusion PA1-5 can be arranged opposite to the second protrusion PA2-5.

[0101] In addition, the width w1 of the first opening portion OA1 and the width w3 of the second opening portion OA2 can be the same, and the width w2 of the first protrusion PA1 and the width w4 of the second protrusion PA2 can be the same.

[0102] In other words, the first opening portion OA1 and the first protrusion PA1 arranged on the first outer side of the non-deposition area of ​​the deposition mask 1100 can be symmetrically formed with the second opening portion OA2 and the second protrusion PA2 arranged on the second outer side.

[0103] Therefore, the corrugations of the deposition mask 1100 can be easily controlled. As described above, the corrugations of the deposition mask 1100 can be controlled by stretching the protrusions arranged on the two outer sides of the non-deposition area.

[0104] In this case, the deposition mask 1100 according to the embodiment can easily control the ripples randomly arranged on the surface of the deposition mask 1100 by making the width and distance of the first protrusion and the second protrusion the same.

[0105] In other words, after measuring the coordinates of the ripples formed on the surface of the deposition mask 1100, the ripples of the deposition mask 1100 can be controlled by stretching these first and second protrusions according to the coordinates.

[0106] In detail, after measuring the coordinates of the ripples formed on the surface of the deposition mask 1100, the ripples of the deposition mask 1100 can be controlled by stretching the first protrusion of any one of the first-first protrusion, the first-second protrusion, the first-third protrusion, and the first-fourth protrusion, as well as the second protrusion of any one of the second-first protrusion, the second-second protrusion, the second-third protrusion, and the second-fourth protrusion, corresponding to the coordinates.

[0107] Furthermore, according to the embodiment, the deposition mask 1100 is formed such that the width and distance between the first protrusion and the second protrusion are natural numbers or natural numbers plus decimals, thereby accurately measuring the coordinates of the ripples formed on the surface of the deposition mask 1100, and thus accurately controlling the ripples randomly arranged on the surface of the deposition mask 1100.

[0108] Furthermore, according to the embodiment, the deposition mask 1100 limits the width and distance of the protrusions to be realized by the equation to be natural numbers or natural numbers plus decimals based on the short width of the deposition mask, and therefore, regardless of the number of protrusions, these protrusions can be formed to have the same distance and the same width.

[0109] Therefore, the deposition mask 1100 according to the embodiment can easily and accurately reduce the ripples formed on the surface of the deposition mask 1100, thereby improving the deposition efficiency and deposition accuracy of the deposition mask 1100.

[0110] The features, structures, and effects described in the above embodiments are included in at least one embodiment, but are not limited to one embodiment. Furthermore, those skilled in the art can combine or modify the features, structures, and effects shown in each embodiment for other embodiments. Therefore, it should be understood that anything related to such combinations and modifications is included within the scope of this disclosure.

[0111] Furthermore, while most of the embodiments have been described above, these embodiments are merely examples and do not limit the scope of this disclosure. Those skilled in the art will understand that numerous variations and applications not presented above can be made without departing from the essential characteristics of the embodiments. For example, each component specifically represented in the embodiments may be varied. Additionally, it should be understood that differences associated with such variations and applications are included within the scope of this disclosure as defined in the following claims.

Claims

1. A deposition mask, comprising: A metal plate, comprising a deposition region and a non-deposition region disposed outside the deposition region, An opening and a protrusion formed through the opening are formed in the non-deposition area. When the short width of the metal plate is defined as A and the number of protrusions is defined as Y, The Z-value in the following equations is expressed as a natural number or a decimal. [Equation] Z = A / (Y + Y - 1) The non-deposition area includes a first non-deposition area located at a first outer portion of the deposition area and a second non-deposition area located at a second outer portion of the deposition area. The opening includes a first opening at the end of the first non-deposition region and a second opening at the end of the second non-deposition region. The protrusion includes a first protrusion disposed at the end of the first non-deposition region and a second protrusion disposed at the end of the second non-deposition region. The first opening and the second opening are arranged opposite each other, and The first protrusion and the second protrusion are arranged opposite each other. The width of each protrusion, the width of each opening, and the spacing between adjacent protrusions are all the same and uniformly defined by the Z value to form an equal-spaced structure based on an equation in the non-deposition region.

2. The deposition mask of claim 1, wherein, The number of protrusions is five or more, and The width of the protrusion and the width of the opening are defined by the values ​​of the above equation. After measuring the coordinates of the surface ripples formed on the metal plate, protrusions corresponding to the measured coordinates are selectively stretched from a plurality of protrusions arranged in the first and second non-deposition areas to locally control the ripples at the measurement location.

3. The deposition mask of claim 2, wherein, The number of protrusions is five and the number of openings is four.

4. The deposition mask of claim 1, wherein, The metal plate includes a long side portion in the longitudinal direction and a short side portion in the width direction. The first opening portion, the second opening portion, the first protrusion, and the second protrusion are arranged only at the ends of the short side portion of the metal plate.

5. The deposition mask of claim 1, wherein, The width of the first protrusion is the same as the width of the first opening, and The width of the second protrusion is the same as the width of the second opening.

6. The deposition mask of claim 5, wherein, The width of the first opening is the same as the width of the second opening, and The width of the first protrusion is the same as the width of the second protrusion.

7. The deposition mask of claim 6, wherein, The number of the first opening portions is the same as the number of the second opening portions, and The number of the first protrusions is the same as the number of the second protrusions.

8. The deposition mask of claim 1, wherein, The metal plate includes small surface holes formed on one surface of the metal plate and a plurality of through holes formed by communicating with large surface holes formed on the other surface of the metal plate.

9. The deposition mask of claim 1, wherein, The deposition area comprises multiple effective portions, and The etched portion, arranged between the effective portion and the opening portion, is arranged in the non-deposition area.

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