A testing device for a semiconductor laser chip assembly

Abstract

The application discloses a testing device for a semiconductor laser chip assembly, which comprises a chip carrier for placing a semiconductor laser chip assembly to be tested, an electrode for providing a testing signal for the semiconductor laser chip assembly to be tested, a transmission mechanism arranged on one side of the chip carrier, and the electrode is arranged on the side of the transmission mechanism close to the chip carrier, and the transmission mechanism is used for driving the electrode to move relative to the chip carrier, and a pressing rod arranged on the transmission mechanism and located on the side of the electrode away from the chip carrier, and used for pressing the electrode and the semiconductor laser chip assembly to be tested. The testing device for the semiconductor laser chip assembly can realize reliable elastic contact between the electrode and the semiconductor laser chip assembly to be tested, and can ensure good contact between the semiconductor laser chip assembly to be tested and the chip carrier to guarantee heat dissipation, so that a larger current (more than 30 A) can be injected without damage.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a testing device for semiconductor laser chip components. Background Technology

[0002] With the expanding applications of semiconductor lasers (LDs), such as LD-pumped solid-state lasers (DPLs), pump sources for various fiber lasers, laser cutting, welding, medical applications, and military laser applications, the requirements for the reliability of semiconductor lasers are also increasing. The semiconductor laser chip is the core component of a semiconductor laser, often referred to as its "CPU."

[0003] Rigorous performance characterization testing is essential to ensure the quality of semiconductor lasers. As the applications of semiconductor lasers expand, the requirements for their output power and reliability become increasingly stringent. Achieving non-destructive, reliable high-current injection while ensuring effective heat dissipation is crucial for reliable characterization testing of high-power semiconductor laser chips. With increasing semiconductor laser output power, the continuous current required for characterization testing is growing larger (>30A), making heat dissipation performance increasingly critical. Existing common testing equipment struggles to achieve reliable characterization testing, and the injected current is typically less than 30A. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a testing device for semiconductor laser chip components, which enables reliable elastic contact between the power supply electrode and the semiconductor laser chip component, while ensuring good contact between the semiconductor laser chip component under test and the chip stage to ensure heat dissipation, so as to achieve non-destructive injection of a large current.

[0005] To solve the above-mentioned technical problems, the technical solution provided in this application is: to provide a testing device for semiconductor laser chip components, the testing device comprising:

[0006] A chip stage, used to place the semiconductor laser chip assembly to be tested;

[0007] The electrode is used to provide a test signal to the semiconductor laser chip assembly under test.

[0008] A transmission mechanism is disposed on one side of the chip stage, and the power supply electrode is disposed on the side of the transmission mechanism close to the chip stage. The transmission mechanism is used to drive the power supply electrode to move relative to the chip stage.

[0009] A pressure bar, disposed on the transmission mechanism and located on the side of the power supply electrode away from the chip stage, is used to press the power supply electrode against the semiconductor laser chip assembly to be tested.

[0010] The transmission mechanism includes:

[0011] The base plate is connected to the chip carrier.

[0012] The handle is hinged to the base plate;

[0013] A transmission rod, one end of which is connected to the handle, moves along its axial direction under the action of the handle;

[0014] The first pressure block is connected to the other end of the transmission rod and is slidably connected to the base plate. The pressure rod is disposed on the side of the first pressure block near the chip stage.

[0015] The second pressure block is slidably connected to the base plate and abuts against the side of the first pressure block away from the transmission rod. The power supply electrode is fixedly disposed on the side of the second pressure block near the chip stage.

[0016] The transmission rod drives the first pressure block to approach the chip stage along the axial direction, and the first pressure block pushes the second pressure block to approach the chip stage along the axial direction, so that the power supply electrode contacts the semiconductor laser chip assembly to be tested, and the first pressure block drives the pressure rod to press against the power supply electrode.

[0017] The transmission mechanism further includes:

[0018] One end of the guide rod is fixedly connected to the second pressure block, and the other end is slidably connected to the first pressure block;

[0019] The first spring is sleeved on the outside of the guide rod, and its two ends abut against the first pressure block and the second pressure block, respectively.

[0020] The transmission mechanism further includes:

[0021] A guide block is fixedly mounted on the first pressure block and arranged with the first pressure block in a direction perpendicular to the axial direction. The guide block has a through hole on the side near the chip stage, and the end of the pressure rod away from the chip stage is embedded in the through hole.

[0022] The second spring is embedded in the end of the through hole that is away from the pressure rod.

[0023] A limiting plate is fixedly installed on the side of the guide block away from the pressure rod, and the projection of the limiting plate on the guide block covers the through hole.

[0024] Wherein, the inner diameter of the through hole in which the pressure rod is installed is smaller than the inner diameter of the through hole in which the second spring is installed.

[0025] The testing device further includes:

[0026] A guide assembly is connected to the chip stage and the transmission mechanism respectively, and is used to adjust the relative position of the transmission mechanism and the chip stage, so as to adjust the relative position of the power supply electrode and the chip stage.

[0027] The guiding component includes:

[0028] A first guide plate is slidably connected to the chip stage along a first direction;

[0029] The second guide plate is slidably connected to the first guide plate along the second direction;

[0030] The second guide plate is slidably connected to the base plate along the third direction;

[0031] Wherein, the first direction is perpendicular to the second direction and the third direction, the third direction is perpendicular to the second direction and parallel to the axis.

[0032] The first guide plate is provided with a first groove extending along the first direction, and the chip stage is provided with a connector, which is embedded in the first groove.

[0033] The second guide plate is provided with a second groove extending along the second direction, and the first guide plate is at least partially embedded in the first groove; the second guide plate is provided with a third groove extending along the third direction, and the bottom plate is at least partially embedded in the third groove.

[0034] The first pressure block has an opening, and the transmission mechanism further includes:

[0035] A limiting member is provided, wherein the other end of the transmission rod extends to the side of the first pressure block away from the handle, and the limiting member is disposed on the side of the first pressure block away from the handle and is fixedly connected to the other end of the transmission rod.

[0036] The radius of the transmission rod is smaller than the radius of the opening.

[0037] In the testing apparatus according to any one of the above claims, the chip stage is provided with positioning holes, and the testing apparatus further includes a support mechanism, the support mechanism comprising:

[0038] Support base;

[0039] A positioning pin is fixedly installed on the support base;

[0040] A heat insulation plate is disposed on the support, and the chip stage is disposed on the side of the heat insulation plate away from the support. The positioning pin is configured to cooperate with the positioning hole to fix the chip stage to the support.

[0041] Wherein, according to any one of the above-mentioned test apparatuses, the chip stage comprises:

[0042] A heat dissipation mechanism is provided, which has a positioning groove for accommodating the semiconductor laser chip assembly to be tested.

[0043] The beneficial effects of this application are as follows: Unlike the prior art, this application provides a testing device for semiconductor laser chip components. By providing a test signal to the semiconductor laser chip component under test through the electrode, current injection into the semiconductor laser chip component under test is achieved. At the same time, the pressure bar set on the transmission mechanism presses the electrode and the semiconductor laser chip component under test together after they come into contact. This not only enables reliable elastic contact between the electrode and the semiconductor laser chip component under test, but also ensures good contact between the semiconductor laser chip component under test and the chip stage to guarantee heat dissipation, thereby achieving non-destructive current injection and enabling large current injection (greater than 30A). Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0045] Figure 1 This is a schematic diagram of the structure of an embodiment of the testing apparatus for semiconductor laser chip components of this application;

[0046] Figure 2 yes Figure 1 A schematic diagram of the transmission mechanism, pressure rod, and guide assembly in the embodiment;

[0047] Figure 3 yes Figure 1 A schematic diagram of the guide block, pressure rod, second spring, and limiting plate in the embodiment;

[0048] Figure 4 yes Figure 1 A schematic diagram of the chip stage in the embodiment;

[0049] Figure 5 yes Figure 1 A schematic diagram of the support mechanism in the embodiment. Detailed Implementation

[0050] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0051] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0052] This application first proposes a testing device for semiconductor laser chip components, such as... Figure 1 As shown, Figure 1 This is a schematic diagram of an embodiment of the testing apparatus for semiconductor laser chip components according to this application. The testing apparatus for semiconductor laser chip components provided in this application includes a chip stage 10, an electrode 11, a transmission mechanism 12, and a pressure rod 13; wherein, the chip stage 10 is used to place the semiconductor laser chip component to be tested; the electrode 11 is used to provide test signals to the semiconductor laser chip component to be tested; the transmission mechanism 12 is disposed on one side of the chip stage 10, and the electrode 11 is disposed on the side of the transmission mechanism 12 close to the chip stage 10, and the transmission mechanism 12 is used to drive the electrode 11 to move relative to the chip stage 10; the pressure rod 13 is disposed on the transmission mechanism 12 and located on the side of the electrode 11 away from the chip stage 10, and is used to press the electrode 11 and the semiconductor laser chip component to be tested together.

[0053] It should be noted that the shape and material of the power supply electrode 11 are not limited in this embodiment. Preferably, the power supply electrode 11 is a copper strip to achieve a larger current (greater than 30A) injection. Furthermore, the number of pressure rods 13 is not limited in this embodiment. Preferably, four pressure rods 13 are used to press the power supply electrode 11 against the semiconductor laser chip assembly to be tested.

[0054] In this embodiment, the semiconductor laser chip assembly to be tested is placed on the chip stage 10. The transmission mechanism 12 drives the electrode 11 to move, bringing it close to and contacting the semiconductor laser chip assembly to be tested, so that the electrode 11 can provide a test signal, i.e., inject current, to the semiconductor laser chip assembly to be tested. Furthermore, the transmission mechanism 12 can also drive the pressure rod 13, so that (after the electrode 11 contacts the semiconductor laser chip assembly to be tested) it presses the electrode 11 and the semiconductor laser chip assembly to be tested together, achieving reliable contact between the electrode 11 and the semiconductor laser chip assembly to be tested.

[0055] This embodiment provides a testing device for a semiconductor laser chip assembly. By providing a test signal to the semiconductor laser chip assembly under test through the electrode 11, current injection into the semiconductor laser chip assembly under test is achieved. At the same time, the pressure rod 13 set on the transmission mechanism 12 presses the electrode 11 and the semiconductor laser chip assembly under test together after they come into contact. This not only enables reliable elastic contact between the electrode 11 and the semiconductor laser chip assembly under test, but also enables non-destructive current injection, thereby enabling large current injection (greater than 30A).

[0056] Optionally, such as Figure 2 As shown, Figure 2 yes Figure 1 The embodiment shows a schematic diagram of the transmission mechanism, pressure rod, and guide assembly. The transmission mechanism 12 includes a base plate 121, a handle 122, a transmission rod 123, a first pressure block 124, and a second pressure block 125. The base plate 121 is connected to the chip stage 10; the handle 122 is hinged to the base plate 121; one end of the transmission rod 123 is connected to the handle 122 and can move axially under the action of the handle 122; the first pressure block 124 is connected to the other end of the transmission rod 123 and is slidably connected to the base plate 121; the pressure rod 13 is disposed on the side of the first pressure block 124 near the chip stage 10; the second pressure block 125 is slidably connected to the base plate 121 and abuts against the side of the first pressure block 124 away from the transmission rod 123; the electrode 11 is fixedly disposed on the side of the second pressure block 125 near the chip stage 10.

[0057] The transmission mechanism 12 in this embodiment further includes an L-shaped transmission member (not shown in the figure), the first end of the handle 122 is hinged to the base plate 121, the first end of the L-shaped transmission member is hinged between the first end of the handle 122 and the second end of the handle 122; the second end of the L-shaped transmission member is hinged to one end of the transmission rod 123, and the first pressure block 124 is connected to the other end of the transmission rod 123.

[0058] During use, the transmission rod 123 can be moved along its axial direction under the force of the handle 122 by operating the handle 122 (in this embodiment, it moves up and down).

[0059] Since the transmission rod 123 is connected to the first pressure block 124 and the second pressure block 125, and the first pressure block 124 and the second pressure block 125 are slidably connected to the base plate 121, the transmission rod 123 can drive the first pressure block 124 to move axially closer to the chip stage 10. Simultaneously, the first pressure block 124 can push the second pressure block 125 to move axially closer to the chip stage 10. The pressure rod 13 is disposed on the side of the first pressure block 124 near the chip stage 10, and the electrode 11 is fixedly disposed on the side of the second pressure block 125 near the chip stage 10. Therefore, when the first pressure block 124 and the second pressure block 125 move to a certain distance, the second pressure block 125 can drive the electrode 11 to contact the semiconductor laser chip assembly to be tested, and the first pressure block 124 can drive the pressure rod 13 to press against the electrode 11.

[0060] Under the action of the handle 122, the transmission rod 123 can drive the first pressure block 124 and the second pressure block 125 to move away from the chip stage 10, so as to lift the power supply electrode 11 and the pressure rod 13, making it easier to replace the semiconductor laser chip assembly to be tested.

[0061] It should be noted that this application does not limit the material of the first pressure block 124 and the second pressure block 125. Preferably, the second pressure block 125 can be made of aluminum alloy and hard anodized to achieve reliable insulation and good heat dissipation.

[0062] In this embodiment, by connecting the first pressure block 124 and the second pressure block 125 to the pressure rod 13 and the electrode 11 respectively, the pressure rod 13 can press the electrode 11 firmly while the electrode 11 contacts the semiconductor laser chip assembly under test, further ensuring reliable contact between the two. A handle 122 drives a transmission rod 123, which in turn moves the first pressure block 124 and the second pressure block 125. This design is simple and easy to operate.

[0063] Optionally, such as Figure 2As shown, the transmission mechanism 12 in this embodiment may further include a guide rod 126 and a first spring 127. One end of the guide rod 126 is fixedly connected to the second pressure block 125, and the other end is slidably connected to the first pressure block 124. The first spring 127 is sleeved on the guide rod 126, and its two ends abut against the first pressure block 124 and the second pressure block 125 respectively. This arrangement allows the first pressure block 124 to push the second pressure block 125 axially towards the chip stage 10, bringing the electrode 11 into contact with the semiconductor laser chip assembly to be tested. After the electrode 11 contacts the semiconductor laser chip assembly, the first pressure block 124 and the second pressure block 125 are in an elastically tensioned state under the action of the first spring 127. That is, when the second pressure block 125 is fixed, the first pressure block 124 can continue to push the pressure rod 13 to press the electrode 11 against the semiconductor laser chip assembly to be tested. At this time, the spring is in a compressed state.

[0064] In this embodiment of the application, by setting the guide rod 126 to connect the first pressure block 124 and the second pressure block 125 with the first spring 127, the first pressure block 124 and the second pressure block 125 are in a tensioned state, that is, the electrode 11 makes elastic contact with the semiconductor laser chip assembly to be tested.

[0065] Furthermore, the transmission mechanism 12 also includes a limiting member (not shown in the figure). The first pressure block 124 is provided with a through hole, and the other end of the guide rod 126 extends from the through hole to the side of the first pressure block 124 away from the first spring 127. The limiting member is fixedly connected to the end of the guide rod 126 extending from the first pressure block 124 to ensure that the first pressure block 124 and the first spring 127 will not detach from the guide rod 126.

[0066] The first pressure block 124 drives the second pressure block 125 to move axially away from the chip stage 10, so that the power supply electrode 11 and the pressure rod 13 are separated from the semiconductor laser chip assembly to be tested.

[0067] Optionally, see Figures 2 to 3 As shown, Figure 3 yes Figure 1The embodiment shows a schematic diagram of the guide block, pressure rod, second spring, and limiting plate. The transmission mechanism 12 may further include a guide block 128, a second spring 129, and a limiting plate 130. The guide block 128 connects the first pressure block 124 and the pressure rod 13. Specifically, the guide block 128 is fixedly mounted on the first pressure block 124 and arranged perpendicular to the axial direction with the first pressure block 124. Furthermore, the guide block 128 has a through hole on the side near the chip stage 10, and the end of the pressure rod 13 facing away from the chip stage 10 is embedded in the through hole. This embodiment of the application also includes a second spring 129 and a limiting plate 130. The second spring 129 is embedded in the end of the through hole away from the pressure rod 13. The limiting plate 130 is fixedly disposed on the side of the guide block 128 away from the pressure rod 13, and the projection of the limiting plate 130 on the guide block 128 covers the through hole. The limiting plate 130 can limit the second spring 129, so that the pressure rod 13 is in a spring-compressed state.

[0068] This application embodiment does not limit the shape and size of the through hole, as long as it can be used to connect the pressure rod 13 and keep the pressure rod 13 in a tensioned state. Preferably, the size of the through hole is such that the inner diameter of the hole segment of the pressure rod 13 is smaller than the inner diameter of the hole segment where the second spring 129 is installed, that is, the through hole is a stepped hole. This structure allows the second spring 129 to be fixed in the guide block 128 and always in a compressed state under the limiting action of the limiting plate 130, thereby increasing the thrust on the pressure rod 13. Through this structure, not only can the elastic contact between the pressure rod 13 and the semiconductor laser chip assembly to be tested be achieved, but the elastic pressure of the pressure rod 13 on the semiconductor laser chip assembly to be tested can also be increased.

[0069] Optionally, the testing apparatus for semiconductor laser chip components provided in this application may further include a guide component 15, wherein the guide component 15 is connected to the chip stage 10 and the transmission mechanism 12 respectively, and is used to adjust the relative position of the transmission mechanism 12 and the chip stage 10. Since the transmission mechanism 12 is provided with an electrode 11 and a pressure rod 13, the guide component 15 can be used to adjust the relative position of the electrode 11 and the pressure rod 13 with the chip stage 10 to achieve precise alignment between the two.

[0070] Optionally, such as Figure 2 As shown, the guide assembly 15 in this embodiment includes a first guide plate 151 and a second guide plate 152. The first guide plate 151 is slidably connected to the chip stage 10 along a first direction; the second guide plate 152 is slidably connected to the first guide plate 151 along a second direction; and the second guide plate 152 is slidably connected to the base plate 121 along a third direction. It should be noted that the first direction is perpendicular to the second direction and the third direction, and the third direction is perpendicular to the second direction and parallel to the axial direction. The guide assembly 15 allows for the adjustment of the three-dimensional positions of the electrode 11 and the pressure rod 13.

[0071] Specifically, the first guide plate 151 is slidably connected to the chip stage 10 along a first direction, i.e., back and forth, so as to realize back and forth sliding adjustment; the second guide plate 152 is slidably connected to the first guide plate 151 along a second direction, i.e. left and right, so as to realize left and right sliding adjustment; the second guide plate 152 is slidably connected to the base plate 121 along a third direction, i.e. up and down, so as to realize up and down adjustment. Through the above settings, the precise alignment of the electrodes and the chip stage 10 can be achieved.

[0072] It should be noted that this application does not limit the sliding connection structure between the above-mentioned guide components 15 or between the guide components 15 and the chip stage 10 and the base plate 121.

[0073] Preferably, the first guide plate 151 is provided with a first groove extending along a first direction, and the chip stage 10 is provided with a connector (see reference). Figure 4 The first guide plate 151 is at least partially embedded in the first guide plate 151, which is provided with a second guide plate 152 extending in a second direction; the second guide plate 152 is provided with a third guide plate extending in a third direction, and the base plate 121 is at least partially embedded in the third guide plate 121. In this embodiment, by providing the guide plate 152, the connection between the first guide plate 151 and the second guide plate 152, between the first guide plate 151 and the chip stage 10, and between the second guide plate 152 and the base plate 121 can be made smoother, which is convenient for adjusting the relative positions of the power supply electrode 11 and the pressure rod 13 with the chip stage 10.

[0074] It should be noted that this application does not limit the shape and number of the grooves, but preferably, the grooves can be U-shaped holes, etc.

[0075] Optionally, such as Figure 2 As shown, the first pressure block 124 may also have an opening, and the transmission mechanism 12 may further include a limiting member 131, wherein the outer diameter of the limiting member 131 is larger than the radius of the opening. The other end of the transmission rod 123 extends to the side of the first pressure block 124 opposite to the handle 122, and the limiting member 131 is disposed on the side of the first pressure block 124 opposite to the handle 122 and is fixedly connected to the other end of the transmission rod 123; the radius of the transmission rod 123 is smaller than the radius of the opening.

[0076] In this way, the transmission rod 123 is not fixedly connected to the first pressure block 124, and the transmission rod 123 can move appropriately within the opening of the first pressure block 124, which can effectively prevent the first pressure block 124 from jamming during movement.

[0077] Optionally, see Figure 4 and Figure 5 , Figure 4 yes Figure 1A schematic diagram of the chip stage in the embodiment. Figure 5 yes Figure 1 A schematic diagram of the support mechanism in the embodiment. The testing device for the semiconductor laser chip assembly proposed in this application may further include a support mechanism 16, and the chip stage 10 may also be provided with positioning holes. The support mechanism 16 includes a support base 161, a positioning pin 162, and a heat insulation plate 163.

[0078] Specifically, the positioning pin 162 is fixedly mounted on the support base 161, the heat insulation plate 163 is mounted on the support base 161, and the chip stage 10 is mounted on the side of the heat insulation plate 163 away from the support base 161. By cooperating with the positioning hole, the positioning pin 162 can be fixedly connected to the support base 161, and at the same time, it can realize the rapid testing and switching of semiconductor laser chip components of different specifications.

[0079] Furthermore, the support mechanism 16 also includes a base plate, a vertical plate, and a horizontal plate. The vertical plate connects the base plate and the horizontal plate. The chip stage 10, the positioning pin 162, and the heat insulation plate 163 are disposed on the horizontal plate. A space is formed under the horizontal plate to improve heat dissipation. The support mechanism 16 includes two heat insulation plates 163, which are spaced apart to form a space between the chip stage 10 and the horizontal plate to improve heat dissipation.

[0080] Optionally, please refer to Figure 4 The chip stage 10 includes a heat dissipation mechanism 101, wherein the heat dissipation mechanism 101 is provided with a positioning groove 102, which can be used to accommodate the semiconductor laser chip assembly to be tested, so as to test the semiconductor laser chip assembly.

[0081] The heat dissipation mechanism 101 may also include a water tank body, a water tank sealing plate, a heat dissipation plate, and a connector. Specifically, a sealing ring may be provided between the water tank body and the water tank sealing plate structure, and a sealed water tank may be formed by fastening with screws; the heat dissipation plate may be provided above the water tank sealing plate by screws; furthermore, a cooling fin may be provided between the heat dissipation plate and the water tank sealing plate, which can be used to control the temperature of the heat dissipation plate to prevent the heat dissipation plate from being too hot and affecting the test results; a heat dissipation plate limiting insulating post may also be tightly fitted and embedded on the heat dissipation plate; the connector may be provided to be connected to the water tank body by pipe threads.

[0082] The positioning groove 102 is provided on the heat sink plate, and the heat sink plate is also provided with an insulating column for supporting the second pressure block 125.

[0083] When it is necessary to test the semiconductor laser chip assembly, the handle 122 is applied, and the power supply electrode 11 and the pressure rod 13 are lifted through the transmission mechanism 12. The semiconductor laser chip assembly to be tested is placed in the positioning groove 102 on the chip stage 10 using tweezers. The action applied to the handle 122 causes the first pressure block 124 and the second pressure block 125 to move axially toward the chip stage 10 via the transmission rod 123. When the second pressure block 125 contacts the insulating post of the heat sink, the electrode 11 contacts the semiconductor laser chip assembly to be tested. The action applied to the handle 122 continues, the second pressure block 125 remains stationary, and the first pressure block 124 continues to move axially toward the chip stage 10. The first spring 127, whose two ends abut against the first pressure block 124 and the second pressure block 125, is in a compressed state. When the first pressure block 124 moves to the point where the pressure rod 13 contacts the electrode 11, the action applied to the handle 122 continues, causing the first pressure block 124 to continue moving axially toward the chip stage 10. At this time, the pressure rod 13 remains stationary, and the second spring 129 continues to compress, causing the pressure rod 13 to press the electrode 11 against the semiconductor laser chip assembly to be tested.

[0084] Unlike existing technologies, this application provides a testing device for semiconductor laser chip components. By providing a test signal to the semiconductor laser chip component under test through an electrode, current injection is achieved into the semiconductor laser chip component under test. Simultaneously, a pressure bar mounted on a transmission mechanism presses the electrode and the semiconductor laser chip component under test together after they come into contact. This not only ensures reliable elastic contact between the electrode and the semiconductor laser chip component under test, but also ensures good contact between the semiconductor laser chip component and the chip stage to guarantee heat dissipation, thereby achieving non-destructive current injection and enabling high current injection (greater than 30A).

[0085] The semiconductor laser chip assembly of this application can be a package in which the semiconductor laser chip is directly encapsulated on a heat sink with high thermal conductivity (Chip On Submount, COS).

[0086] It should be noted that the various optional implementation methods described in the embodiments of this application can be combined with each other or implemented individually, and the embodiments of this application do not limit this.

[0087] In the description of this application, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on this application. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0088] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," etc., should be understood in a literal sense. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0089] The above embodiments are other different forms and embodiments described with reference to the accompanying drawings. These are also feasible without departing from the principles of this application, and therefore this application should not be construed as limiting the embodiments set forth herein. Rather, these embodiments are provided to make this application complete and perfect, and to convey the scope of this application to those skilled in the art. In the drawings, component dimensions and relative dimensions may be exaggerated for clarity. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. The terms "comprising" and / or "including" are used in this specification to indicate the presence of said features, integers, components, and / or components, but do not exclude the presence or addition of one or more other features, integers, components, components, and / or groups thereof. Unless otherwise shown, a range of values ​​is expressed to include the upper and lower limits of the range and any subranges therebetween.

[0090] The above describes the preferred embodiments of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principles described in this application, and these improvements and modifications are also within the protection scope of this application.

Claims

1. A testing device for semiconductor laser chip components, characterized in that, include: A chip stage, used to place the semiconductor laser chip assembly to be tested; The electrode is used to provide a test signal to the semiconductor laser chip assembly under test. A transmission mechanism is disposed on one side of the chip stage, and the power supply electrode is disposed on the side of the transmission mechanism close to the chip stage. The transmission mechanism is used to drive the power supply electrode to move relative to the chip stage. A pressure bar is disposed on the transmission mechanism and located on the side of the power supply electrode away from the chip stage, for pressing the power supply electrode against the semiconductor laser chip assembly to be tested; The transmission mechanism includes: a base plate connected to the chip stage; a handle hinged to the base plate; a transmission rod, one end of which is connected to the handle and moves axially under the action of the handle; a first pressure block connected to the other end of the transmission rod and slidably connected to the base plate, the pressure rod being disposed on the side of the first pressure block near the chip stage; and a second pressure block slidably connected to the base plate and abutting against the side of the first pressure block away from the transmission rod, the power supply electrode being fixedly disposed on the side of the second pressure block near the chip stage. The transmission rod drives the first pressure block to approach the chip stage along the axial direction, and the first pressure block pushes the second pressure block to approach the chip stage along the axial direction, so that the power supply electrode contacts the semiconductor laser chip assembly to be tested, and the first pressure block drives the pressure rod to press against the power supply electrode.

2. The test device of claim 1, wherein, The transmission mechanism further includes: One end of the guide rod is fixedly connected to the second pressure block, and the other end is slidably connected to the first pressure block; The first spring is sleeved on the outside of the guide rod, and its two ends abut against the first pressure block and the second pressure block, respectively.

3. The test device of claim 1, wherein, The transmission mechanism further includes: A guide block is fixedly mounted on the first pressure block and arranged with the first pressure block in a direction perpendicular to the axial direction. The guide block has a through hole on the side near the chip stage, and the end of the pressure rod away from the chip stage is embedded in the through hole. The second spring is embedded in the end of the through hole that is away from the pressure rod. A limiting plate is fixedly installed on the side of the guide block away from the pressure rod, and the projection of the limiting plate on the guide block covers the through hole.

4. The test device of claim 3, wherein, The inner diameter of the through hole for the pressure rod is smaller than the inner diameter of the through hole for the second spring.

5. The test device of claim 1, wherein, Further includes: A guide assembly is connected to the chip stage and the transmission mechanism respectively, and is used to adjust the relative position of the transmission mechanism and the chip stage, so as to adjust the relative position of the power supply electrode and the chip stage.

6. The test device of claim 5, wherein, The guiding component includes: A first guide plate is slidably connected to the chip stage along a first direction; The second guide plate is slidably connected to the first guide plate along the second direction; The second guide plate is slidably connected to the base plate in a third direction; Wherein, the first direction is perpendicular to the second direction and the third direction, the third direction is perpendicular to the second direction and parallel to the axis.

7. The test device of claim 6, wherein, The first guide plate is provided with a first groove extending along the first direction, and the chip stage is provided with a connector, which is embedded in the first groove; The second guide plate is provided with a second groove extending along the second direction, and the first guide plate is at least partially embedded in the second groove; the second guide plate is provided with a third groove extending along the third direction, and the bottom plate is at least partially embedded in the third groove.

8. The test device of claim 1, wherein, The first pressure block has an opening, and the transmission mechanism further includes: A limiting member is provided, wherein the other end of the transmission rod extends to the side of the first pressure block away from the handle, and the limiting member is disposed on the side of the first pressure block away from the handle and is fixedly connected to the other end of the transmission rod. The radius of the transmission rod is smaller than the radius of the opening.

9. The test device according to any one of claims 1 to 8, characterized in that The chip stage is provided with positioning holes, and the testing device further includes a support mechanism, the support mechanism comprising: Support base; A positioning pin is fixedly installed on the support base; A heat insulation plate is disposed on the support base, and the chip stage is disposed on the side of the heat insulation plate away from the support base. The positioning pin is configured to cooperate with the positioning hole to fix the chip stage to the support base.

10. The test device according to any one of claims 1 to 8, characterized in that The chip platform includes: A heat dissipation mechanism is provided, which has a positioning groove for accommodating the semiconductor laser chip assembly to be tested.

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