Multilayer electronic component

Abstract

A multilayer electronic component is provided. The multilayer electronic component includes a main body including dielectric layers and internal electrodes alternately stacked, and a respective one of the dielectric layers is interposed between the internal electrodes, and an external electrode disposed on an outer surface of the main body and connected to the internal electrodes. At least one of the internal electrodes includes a plurality of conductive particles and a plurality of conductive nanowires having a shape different from a shape of the plurality of conductive particles in the conductive nanowires, and the conductive nanowires are connected to at least one of the plurality of conductive particles.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0149845, filed on November 11, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (a type of multilayer capacitor assembly) are chip capacitors mounted on printed circuit boards of various electronic products, such as image display devices (e.g., liquid crystal displays (LCDs) or plasma display panels (PDPs)), computers, smartphones, and cellular phones, for charging or discharging from them.

[0004] Multilayer ceramic capacitors are used as components in a wide variety of electronic devices due to their small size, high capacitance, and ease of mounting. In particular, the demand for miniaturized and high-capacitance multilayer ceramic capacitors has further increased due to the small size and high capacitance of various electronic devices such as computers and mobile devices.

[0005] To achieve the high capacitance of the multilayer ceramic capacitor described above, dielectric layers and internal electrodes with reduced thickness and multilayer structures have been actively developed. However, in the multilayer ceramic capacitors according to the prior art, the internal electrode is easily damaged, and the connection strength between the internal and external electrodes is weak. Therefore, there is a need for a technique for internal electrode paste that can form thin internal electrodes and ensure strong connection strength between the internal and external electrodes.

[0006] Furthermore, with the increasing interest in vehicle electrical components in industry, there is a growing demand for high reliability and strength in multilayer ceramic capacitors. Consequently, there is also a requirement for higher warp strength of the internal electrodes used in multilayer ceramic capacitors to resist external physical shocks. Summary of the Invention

[0007] One aspect of this disclosure provides a multilayer electronic component with an inner electrode that is less prone to damage and an improved connection strength between the inner and outer electrodes.

[0008] According to one aspect of this disclosure, a multilayer electronic component may include: a body comprising alternately stacked dielectric layers and inner electrodes, wherein respective dielectric layers are interposed between the inner electrodes; and an outer electrode disposed on an outer surface of the body and connected to the inner electrodes. At least one of the inner electrodes may include a plurality of conductive particles and a plurality of conductive nanowires, the conductive nanowires having a shape different from that of the plurality of conductive particles, and the conductive nanowires being connected to at least one of the plurality of conductive particles.

[0009] According to one aspect of this disclosure, a multilayer electronic component may include: a body comprising alternately stacked dielectric layers and inner electrodes, wherein respective dielectric layers are interposed between the inner electrodes; and an outer electrode disposed on an outer surface of the body and connected to the inner electrodes. At least one of the inner electrodes may include a conductive nanowire and a plurality of conductive particles connected to the conductive nanowire.

[0010] According to one aspect of this disclosure, a multilayer electronic component may include: a body comprising alternately stacked dielectric layers and inner electrodes, wherein respective dielectric layers are interposed between the inner electrodes; and an outer electrode disposed on an outer surface of the body and connected to the inner electrodes. At least one of the inner electrodes may include one or more conductive particles and conductive nanowires, the conductive nanowires connecting the one or more conductive particles to one of the outer electrodes. Attached Figure Description

[0011] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to exemplary embodiments of the present disclosure;

[0013] Figure 2 This is an exploded perspective view of a body in which a dielectric layer and an internal electrode are stacked, according to exemplary embodiments of the present disclosure.

[0014] Figure 3 It is along Figure 1 A cross-sectional view taken from line I-I';

[0015] Figure 4 yes Figure 3 A schematic enlarged view of area "A";

[0016] Figure 5 yes Figure 3 A schematic enlarged view of area "B"; and

[0017] Figure 6A and Figure 6B This is a schematic diagram illustrating the manner in which particles grow around conductive nanowires according to exemplary embodiments of the present disclosure during the sintering of the inner electrode. Detailed Implementation

[0018] In the following, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0019] To clearly describe the exemplary embodiments in this disclosure, directions will be defined. In the accompanying drawings, the X, Y, and Z directions refer to the length, width, and thickness directions of the multilayer electronic assembly, respectively.

[0020] In this specification, the length direction may refer to the X direction or a first direction, the width direction may refer to the Y direction or a second direction, and the thickness direction may refer to the Z direction, a third direction, or the stacking direction.

[0021] Multilayer electronic components

[0022] Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to exemplary embodiments of the present disclosure. Figure 2 This is an exploded perspective view of a body in which a dielectric layer and an internal electrode are stacked, according to exemplary embodiments of the present disclosure. Figure 3 It is along Figure 1 A cross-sectional view taken from line I-I'. Figure 4 yes Figure 3 A schematic enlarged view of area "A". Figure 5 yes Figure 3 A schematic enlarged view of area "B".

[0023] In the following text, reference will be made to Figures 1 to 5 Describes a multilayer electronic assembly according to exemplary embodiments of the present disclosure.

[0024] A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure includes: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122; and outer electrodes 131 and 132 disposed on the outside of the body 110 and respectively connected to the inner electrodes 121 and 122, wherein the inner electrodes 121 and 122 include conductive particles P and conductive nanowires W.

[0025] The main body 110 includes a plurality of dielectric layers 111 and a plurality of internal electrodes 121 and 122 arranged alternately, and the corresponding internal electrode in the dielectric layer 111 is located between the internal electrodes 121 and 122.

[0026] The shape of the main body 110 is not particularly limited, and can be as follows: Figure 1The hexahedral shape or a shape similar to a hexahedron shown. Although the body 110 does not have a hexahedral shape with perfect straight lines due to the shrinkage of the ceramic powder included in the body 110 during the sintering process, the body 110 may have a generally hexahedral shape.

[0027] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in the thickness direction (Z direction), a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in the length direction (X direction), and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and are opposite to each other in the width direction (Y direction).

[0028] The multiple dielectric layers 111 forming the body 110 can be in a sintered state, and adjacent dielectric layers 111 can be integrated with each other, making it difficult to distinguish their boundaries without using a scanning electron microscope (SEM).

[0029] There are no particular restrictions on the raw materials of dielectric layer 111, as long as sufficient capacitance can be obtained. For example, the raw materials of dielectric layer 111 can be barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc.

[0030] Furthermore, according to the purpose of this disclosure, the dielectric layer 111 can be prepared by adding various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. to a powder such as barium titanate (BaTiO3) powder.

[0031] The main body 110 may include: a capacitor forming portion disposed in the main body 110 and including a first inner electrode 121 and a second inner electrode 122, the first inner electrode 121 and the second inner electrode 122 being arranged to face each other, and a corresponding inner electrode in the dielectric layer 111 being located between the first inner electrode 121 and the second inner electrode 122; and cover portions 112 and 113 formed above and below the capacitor forming portion.

[0032] The capacitor forming portion that contributes to the capacitance of the multilayer electronic component 100 can be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122, and each of the dielectric layers 111 is located between the first inner electrodes 121 and the second inner electrodes 122.

[0033] Cover portions 112 and 113 may include an upper cover portion 112 and a lower cover portion 113. The upper cover portion 112 and the lower cover portion 113 do not include an inner electrode, may be formed using the same material as the dielectric layer 111, and may substantially serve to prevent damage to the inner electrode due to physical or chemical stress. (See reference...) Figure 2The upper cover portion 112 can be formed by stacking a single dielectric layer, two dielectric layers, or more dielectric layers on the upper surface of the capacitor forming portion in the vertical direction (Z direction), and the lower cover portion 113 can be formed by stacking a single dielectric layer, two dielectric layers, or more dielectric layers on the lower surface of the capacitor forming portion in the vertical direction (Z direction).

[0034] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122, the first inner electrode 121 and the second inner electrode 122 being arranged to face each other and a corresponding inner electrode in the dielectric layer 111 being located between the first inner electrode 121 and the second inner electrode 122.

[0035] Reference Figure 2 The main body 110 can be formed by alternately stacking dielectric layers 111 on which a first internal electrode 121 is printed and dielectric layers 111 on which a second internal electrode 122 is printed in the thickness direction (Z direction), and then sintering the stacked dielectric layers 111.

[0036] The first inner electrode 121 and the second inner electrode 122 are electrically insulated from each other by a dielectric layer 111 disposed between the first inner electrode 121 and the second inner electrode 122.

[0037] Reference Figures 1 to 3 The first inner electrode 121 and the second inner electrode 122 can be exposed through the third surface 3 and the fourth surface 4 of the body 110, respectively. More specifically, the first inner electrode 121 is spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second inner electrode 122 is spaced apart from the third surface 3 and exposed through the fourth surface 4.

[0038] The first external electrode 131 may be disposed on the third surface 3 of the main body 110 and connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the main body 110 and connected to the second internal electrode 122.

[0039] Reference Figure 4 At least one of the internal electrodes 121 and 122 according to exemplary embodiments of the present disclosure includes a plurality of conductive particles P and a plurality of conductive nanowires W, each of the plurality of conductive nanowires W having a shape different from the shape of the plurality of conductive particles P and being connected to at least one of the plurality of conductive particles P.

[0040] Conductive particles P are included in the inner electrodes 121 and 122 to form a capacitor and can be used to electrically connect the inner electrodes 121 and 122 to the outer electrodes 131 and 132, respectively.

[0041] The conductive particle P may include particles of various shapes. For example, the conductive particle P may have the following characteristics: Figure 4The spherical shape shown. The spherical conductive particles P described above can be grown by bonding them around the conductive nanowires W during the sintering of the inner electrodes 121 and 122.

[0042] However, this is merely an example. The conductive particle P is not necessarily a spherical particle, but can be a flat and elongated sheet-shaped particle, or a mixture of spherical and sheet-shaped particles. Furthermore, the conductive particle P, which includes spherical particles, may also include particles that are not perfectly spherical.

[0043] Even in this case, the shape of the conductive particle P does not include fine wire shapes such as the conductive nanowire W. The size of the conductive particle P can vary, and the diameter of the conductive particle P can range from a few nanometers (nm) to a few micrometers (μm). The diameter of the conductive nanowire W can be less than or equal to 1 μm, and the length of the conductive nanowire W can be greater than or equal to 10 μm.

[0044] The conductive particle P may contain a conductive metal. The conductive metal contained in the conductive particle P may be any metal that is conductive, for example, one or more selected from the group consisting of nickel (Ni), copper (Cu) and their alloys.

[0045] The conductive nanowire W can have a fine wire shape that differs from that of the conductive particle P. The conductive nanowire W can have a diameter of several nanometers (nm) and a length of several micrometers (μm). In one example, the length of the conductive nanowire W can be greater than the diameter of the conductive particle P.

[0046] When the diameter of the conductive nanowire W is greater than or equal to 1 μm, or the length of the conductive nanowire W is less than 1 μm, and therefore there is no significant difference between the diameter and length, the shape difference between the conductive nanowire W and the conductive particle P becomes insignificant. In this case, the improvement in warpage strength and electrical connection strength achievable by including the conductive nanowire W is suppressed.

[0047] The conductive nanowire W reduces damage to the inner electrodes 121 and 122 by increasing the electrical connection strength in the electrodes. Simultaneously, the conductive nanowire W can improve the electrical connection strength between the first inner electrode 121 and the first outer electrode 131, and between the second inner electrode 122 and the second outer electrode 132.

[0048] That is, the conductive nanowire W is included in each of the inner electrodes 121 and 122 and serves as a bridge, thereby mitigating electrical disconnection between the conductive particles P dispersedly distributed in the inner electrodes 121 and 122.

[0049] In addition, the conductive nanowire W can absorb external physical shocks. That is, since the ductility of the inner electrodes 121 and 122 including the conductive nanowire W is higher than that of the inner electrodes 121 and 122 without the conductive nanowire W, the warpage strength of the multilayer electronic component 100 can be improved.

[0050] In particular, the stronger electrical connection strength in the inner electrodes 121 and 122 achieved by adding conductive nanowires W is based on the agglomeration of conductive particles P during the sintering of the inner electrodes 121 and 122, which will be described in detail below.

[0051] Figure 6A and Figure 6B This is a schematic diagram illustrating the manner in which particles grow around conductive nanowires according to exemplary embodiments of the present disclosure during the sintering of the inner electrode.

[0052] Reference Figure 6A and Figure 6B Conductive nanowires W can connect adjacent conductive particles in multiple conductive particles P. For example, as... Figure 6A As shown, the inner electrodes 121 and 122 can be formed by adding conductive powder particles CP and conductive nanowires W to a conductive paste for forming inner electrodes 121 and 122 and sintering the conductive paste. Here, the sintering temperature can be set below the melting point of the conductive nanowires W (e.g., about 1455°C in the case of nickel (Ni) nanowires).

[0053] In this scenario, during the sintering process, the conductive nanowire W retains its shape even after sintering, while the conductive powder particles CP, with melting points lower than those of the conductive nanowire W, adhere to the area surrounding the conductive nanowire W. That is, as... Figure 6B As shown, multiple conductive particles P can grow around each conductive nanowire W.

[0054] In this configuration, the conductive nanowire W and multiple conductive particles P grown around the conductive nanowire W can form a sintered body and maintain an electrically connected state. Furthermore, the individual sintered bodies can be adjacent to each other and spaced apart in the lateral direction.

[0055] Therefore, in multiple conductive particles P, the conductive particles connected to different conductive nanowires W can be adjacent to each other and spaced apart in the lateral direction. That is, as shown... Figure 4 The dashed lines indicate that a short lateral distance can be maintained between conductive particles P. However, conductive particles connected to different conductive nanowires W do not necessarily have to be spaced apart, and the distance between sintered bodies can be reduced due to particle growth during sintering, and the sintered bodies can come into contact with each other.

[0056] Therefore, when multiple conductive particles P are adjacent to each other in the lateral direction via conductive nanowires W, the electrical connection strength in the electrodes is increased, thereby reducing damage to the inner electrodes 121 and 122.

[0057] In addition, the conductive nanowire W can also connect multiple conductive particles P to the external electrodes 131 and 132.

[0058] For example, during the sintering of the inner electrodes 121 and 122 as described above, conductive powder particles CP also adhere to the conductive nanowires W located adjacent to the outer electrodes 131 and 132 (the conductive powder particles CP are adjacent to the conductive nanowires W). That is, as... Figure 5 As shown, multiple conductive particles P can be grown around each conductive nanowire W located adjacent to the outer electrodes 131 and 132.

[0059] In this configuration, the conductive nanowire W and the multiple conductive particles P grown around the conductive nanowire W can form a sintered body and maintain an electrically connected state. Furthermore, each sintered body can be adjacent to and spaced apart from the external electrodes 131 and 132.

[0060] Therefore, among the multiple conductive particles P, the conductive particles connected to the conductive nanowires W adjacent to the external electrodes 131 and 132 can be spaced apart from the external electrodes 131 and 132. That is, as... Figure 5 The dashed line indicates that a short distance is maintained between the outer electrode 132 and the conductive particles P included in the inner electrode 122.

[0061] However, the conductive particles connected to the conductive nanowires W are not necessarily spaced apart from the external electrodes 131 and 132, and the conductive particles P may form in the region in contact with the external electrodes 131 and 132 due to particle growth that occurs during sintering. In this case, one of the multiple conductive nanowires W can connect one or more of the multiple conductive particles P to one of the external electrodes 131 and 132.

[0062] Therefore, when multiple conductive particles P are adjacent to the outer electrodes 131 and 132 via conductive nanowires W, the electrical connection strength between the first inner electrode 121 and the first outer electrode 131, and between the second inner electrode 122 and the second outer electrode 132, can be improved.

[0063] The conductive nanowire W may contain a conductive metal. Here, the conductive metal contained in the conductive nanowire W may be any metal that is conductive, for example, one or more selected from the group consisting of nickel (Ni), copper (Cu) and their alloys.

[0064] The conductive particles P and the conductive nanowires W may contain the same conductive metal. As an example, the conductive particles P and the conductive nanowires W may contain nickel (Ni) as a common main component. As another example, the conductive particles P and the conductive nanowires W may contain copper (Cu) as a common main component.

[0065] During the sintering of inner electrodes 121 and 122, conductive particles P and conductive nanowires W can form multiple sintered bodies containing nickel (Ni) or copper (Cu) as the main components.

[0066] In the internal electrodes 121 and 122, the mass ratio of the conductive nanowire W to the conductive particle P and the mass of the conductive nanowire W can be greater than or equal to 0.1 wt% and less than or equal to 5 wt%.

[0067] When the mass ratio of the conductive nanowire W is less than 0.1 wt%, there is a possibility of insufficient improvement in warpage strength and electrical connection strength. Therefore, in the inner electrodes 121 and 122, the mass ratio of the conductive nanowire W to the sum of the mass of the conductive particle P and the conductive nanowire W can be greater than or equal to 0.1 wt%. More preferably, in the inner electrodes 121 and 122, the mass ratio of the conductive nanowire W to the sum of the mass of the conductive particle P and the conductive nanowire W can be greater than or equal to 1 wt%.

[0068] Furthermore, when the mass ratio of the conductive nanowire W to the combined mass of the conductive particles P and the conductive nanowire W exceeds 5 wt%, the dispersibility of the conductive paste used to form the inner electrodes 121 and 122 may deteriorate. Therefore, it may be difficult to further improve the electrical connection strength, and there is a possibility of cracks appearing in the body 110. Therefore, in the inner electrodes 121 and 122, the mass ratio of the conductive nanowire W to the combined mass of the conductive particles P and the conductive nanowire W can be less than or equal to 5 wt%.

[0069] The internal electrodes 121 and 122 can be formed by coating a conductive paste containing conductive powder particles CP and conductive nanowires W and then sintering the conductive paste.

[0070] However, the materials used to form the conductive paste for the internal electrodes 121 and 122 are not limited to these, and for example, the conductive paste may also contain noble metal materials, such as palladium (Pd) or palladium-silver (Pd-Ag) alloys. Furthermore, glass frit may be added to the conductive paste used for the internal electrodes 121 and 122.

[0071] The methods for printing conductive paste include screen printing, gravure printing, etc., but are not limited to these.

[0072] External electrodes 131 and 132 can be disposed on the main body 110 and can be connected to internal electrodes 121 and 122 respectively. For example... Figure 3As shown, the outer electrodes 131 and 132 may include a first outer electrode 131 connected to the first inner electrode 121 and a second outer electrode 132 connected to the second inner electrode 122.

[0073] In order to form a capacitor, the first external electrode 131 and the second external electrode 132 can be electrically connected to the first internal electrode 121 and the second internal electrode 122, respectively, and the second external electrode 132 can be connected to a potential different from that to which the first external electrode 131 is connected.

[0074] The first external electrode 131 may include a connecting portion disposed on the third surface 3 of the body 110 and a strip extending from the connecting portion to a portion of the first surface 1 and the second surface 2. Similarly, the second external electrode 132 may include a connecting portion disposed on the fourth surface 4 of the body 110 and a strip extending from the connecting portion to a portion of the first surface 1 and the second surface 2. Here, the strip may extend not only from the connecting portion to a portion of the first surface 1 and the second surface 2, but also from the connecting portion to a portion of the fifth surface 5 and the sixth surface 6.

[0075] Additionally, this exemplary embodiment describes a structure in which a multilayer electronic component 100 includes two external electrodes 131 and 132, but the number, shape, etc. of the external electrodes 131 and 132 may be changed depending on the shape of the internal electrodes 121 and 122 or for other purposes.

[0076] There are no particular restrictions on the materials of the external electrodes 131 and 132. The external electrodes 131 and 132 can be formed using any conductive material (such as metal), and the specific material of each of the external electrodes 131 and 132 can be determined taking into account electrical properties, structural stability, etc. In addition, if necessary, the external electrodes 131 and 132 can have a multilayer structure.

[0077] The external electrodes 131 and 132 may each be a sintered electrode comprising a conductive metal and glass, or a resin-based electrode comprising a conductive metal and resin. Furthermore, the conductive metal contained in the external electrodes 131 and 132 may be a material with excellent conductivity, and there are no particular limitations. For example, the conductive metal may be at least one of nickel (Ni), copper (Cu), and alloys thereof.

[0078] Experimental Example

[0079] Table 1

[0080]

[0081] Table 1 shows the average porosity measured by sintering electrodes comprising copper (Cu) conductive particles P and copper (Cu) conductive nanowires W in different mass ratios, and then imaging the electrodes using SEM. Here, the average porosity can be measured by observing the five inner electrodes located at the center of a cross-section of the sample sheet taken along the X and Z directions at the center of the Y direction using SEM.

[0082] That is, Table 1 shows specific examples of internal electrodes 121 and 122 according to exemplary embodiments of the present disclosure, and shows the results obtained by using electrodes comprising copper (Cu) conductive particles P and copper (Cu) conductive nanowires W to conduct experiments on the effect of improving electrical connection strength.

[0083] Experimental Examples 2 to 4 in Table 1 are examples that include conductive particles P and conductive nanowires W together as in the exemplary embodiments of this disclosure, and Experimental Examples 1 and 5 (comparative examples) are added for comparison with the exemplary embodiments of this disclosure.

[0084] First, Experimental Example 2 shows the results obtained by sintering an electrode comprising copper (Cu) conductive particles P and copper (Cu) conductive nanowires W in a mass ratio of 99:1 (wt%).

[0085] In this case, such as Figure 4 As shown, multiple conductive particles P adjacent to the conductive nanowire W are bonded to and grown on the conductive nanowire W. Furthermore, as a result of analyzing the average porosity in Experimental Example 2, the measured average porosity was 7.92%.

[0086] Furthermore, Experimental Example 3 shows the results obtained by sintering an electrode comprising copper (Cu) conductive particles P and copper (Cu) conductive nanowires W in a mass ratio of 97:3 (wt%).

[0087] Similar to Experimental Example 2, multiple conductive particles P adjacent to the conductive nanowire W were bonded to and grown on the conductive nanowire W. Furthermore, as a result of analyzing the average porosity in Experimental Example 3, the measured average porosity was 6.34%.

[0088] Furthermore, Experimental Example 4 shows the results obtained by sintering an electrode comprising copper (Cu) conductive particles P and copper (Cu) conductive nanowires W in a mass ratio of 95:5 (wt%).

[0089] Similar to Experimental Example 2, multiple conductive particles P adjacent to the conductive nanowire W were bonded to and grown on the conductive nanowire W. Furthermore, as a result of analyzing the average porosity in Experimental Example 4, the measured average porosity was 4.07%.

[0090] In addition, referring to the comparative example, Experimental Example 1 shows the results obtained by sintering an electrode that includes only copper (Cu) conductive particles P (100 wt% by mass) and not copper (Cu) conductive nanowires W.

[0091] As a result of the analysis of the average porosity in Experiment Example 1, the measured average porosity was 15.95%.

[0092] In contrast, Experimental Example 5 shows the results obtained by sintering an electrode that consists only of copper (Cu) conductive nanowires W (100 wt% by mass) and does not include copper (Cu) conductive particles P.

[0093] As a result of the analysis of the average porosity in Experiment Example 5, the measured average porosity was 16.45%.

[0094] Understandably, the average porosity of the electrodes in Experimental Examples 2 through 4 is significantly lower than that in the comparative examples. In other words, it can be understood that the breaks between the conductive particles P included in the electrodes are reduced due to the addition of conductive nanowires W at a mass ratio of 0.1 wt% to 5 wt%.

[0095] Furthermore, when this result is applied to the multilayer electronic assembly 100 according to the present disclosure, damage to the inner electrodes 121 and 122 is reduced, and the electrical connection strength between the inner electrode 121 and the outer electrode 131 and between the inner electrode 122 and the outer electrode 132 is improved.

[0096] Therefore, based on such an experimental example, in the internal electrodes 121 and 122, the mass ratio of the conductive nanowire W to the conductive particle P and the mass of the conductive nanowire W can be greater than or equal to 0.1 wt% and less than or equal to 5 wt%.

[0097] For reference, Table 1 shows the average porosity in an experimental example where the metal content is approximately 80 wt% of the total mass of the electrodes. Therefore, the average porosity shown in Table 1 differs from the average porosity of the inner electrodes 121 and 122 of the multilayer electronic assembly 100. That is, compared to the experimental example in Table 1, the metal content contained in the inner electrodes 121 and 122 is typically relatively low (approximately 40 wt% to 50 wt%), and therefore, under normal circumstances, the average porosity of the inner electrodes 121 and 122 may be slightly higher than the average porosity shown in Table 1.

[0098] In the multilayer electronic assembly 100 according to an exemplary embodiment of the present disclosure, the average porosity of the inner electrodes 121 and 122 may be greater than or equal to 6% and less than or equal to 15%.

[0099] As described above, since the metal content of the internal electrodes 121 and 122 typically included in the multilayer electronic assembly 100 is relatively low, the average porosity does not reach 4.07% even when conductive nanowires W are included at a mass ratio of 5 wt%.

[0100] Here, when the metal content of the inner electrodes 121 and 122 is increased to about 80 wt% or more in order to reduce the average porosity to less than 6%, the dispersibility and adhesion of the inner electrodes may be degraded due to the reduced content of other components of the inner electrodes 121 and 122, such as glass and adhesive.

[0101] Furthermore, even with an average porosity exceeding 15% in the inner electrodes 121 and 122, numerous unconnected conductive particles P still exist. Therefore, it is difficult to conclude that the connection strength within the electrodes has increased.

[0102] As a result, when the average porosity of the inner electrodes 121 and 122 is greater than or equal to 6% and less than or equal to 15%, the electrical connection strength in the inner electrodes 121 and 122 can be improved, and at the same time, there are no negative effects such as deterioration of dispersibility and adhesion.

[0103] As described above, according to exemplary embodiments of this disclosure, since the mixture of conductive particles and conductive nanowires is included in the conductive paste used to form the inner electrode, the internal disconnection of the inner electrode is reduced after sintering, and the electrical connection strength between the inner electrode and the outer electrode is improved.

[0104] Additionally, according to exemplary embodiments in this disclosure, a multilayer electronic assembly may be provided including an internal electrode comprising conductive nanowires and thus having enhanced warp strength.

[0105] Although exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and changes may be made without departing from the spirit and scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body comprises alternately stacked dielectric layers and inner electrodes, wherein corresponding dielectric layers are interposed between the inner electrodes; and An external electrode is disposed on the outer surface of the body and connected to the internal electrode. Wherein, at least one of the internal electrodes comprises a plurality of conductive particles and a plurality of conductive nanowires, wherein the conductive nanowires have a shape different from that of the plurality of conductive particles, the conductive nanowires are connected to at least one of the plurality of conductive particles, the conductive nanowires comprise conductive metal, and the length of the conductive nanowires is greater than or equal to 10 μm.

2. The multilayer electronic component according to claim 1, wherein, The conductive nanowires connect adjacent conductive particles among the plurality of conductive particles.

3. The multilayer electronic component according to claim 2, wherein, Among the plurality of conductive particles, the conductive particles, which are respectively connected to different conductive nanowires, are adjacent to each other and spaced apart from each other.

4. The multilayer electronic component according to claim 1, wherein, The plurality of conductive nanowires includes conductive nanowires that connect one or more of the plurality of conductive particles to one of the external electrodes.

5. The multilayer electronic component according to claim 4, wherein, The one or more conductive particles are spaced apart from the one of the external electrodes.

6. The multilayer electronic assembly according to claim 1, wherein, The conductive nanowires comprise one or more conductive metals selected from the group consisting of nickel, copper, and their alloys.

7. The multilayer electronic assembly according to claim 1, wherein, The conductive particles are spherical particles, and the conductive nanowires have a fine wire shape that is different from the shape of the conductive particles, and the diameter of the conductive nanowires is less than or equal to 1 μm.

8. The multilayer electronic component according to claim 1, wherein, The conductive particles and the conductive nanowires contain the same conductive metal.

9. The multilayer electronic component according to claim 1, wherein, In the internal electrode, the mass ratio of the conductive nanowire to the combined mass of the conductive particles and the conductive nanowire is greater than or equal to 0.1 wt% and less than or equal to 5 wt%.

10. The multilayer electronic assembly according to claim 1, wherein, The average porosity of at least one of the inner electrodes is greater than or equal to 6% and less than or equal to 15%.

11. A multilayer electronic component, comprising: The body comprises alternating stacked dielectric layers and inner electrodes, wherein corresponding dielectric layers are located between the inner electrodes; as well as An external electrode is disposed on the outer surface of the body and connected to the internal electrode. In this embodiment, at least one of the internal electrodes comprises a conductive nanowire and a plurality of conductive particles connected to the conductive nanowire, wherein the conductive nanowire comprises a conductive metal and the length of the conductive nanowire is greater than or equal to 10 μm.

12. The multilayer electronic assembly according to claim 11, wherein, The length of the conductive nanowire is greater than the diameter of the conductive particle.

13. The multilayer electronic assembly according to claim 11, wherein, The conductive nanowires comprise one or more conductive metals selected from the group consisting of nickel, copper, and their alloys.

14. The multilayer electronic assembly according to claim 11, wherein, The conductive nanowires and the plurality of conductive particles contain the same conductive metal.

15. The multilayer electronic assembly according to claim 11, wherein, The average porosity of at least one of the inner electrodes is greater than or equal to 6% and less than or equal to 15%.

16. A multilayer electronic component, comprising: The body comprises alternately stacked dielectric layers and inner electrodes, wherein corresponding dielectric layers are interposed between the inner electrodes; and An external electrode is disposed on the outer surface of the body and connected to the internal electrode. Wherein, at least one of the inner electrodes comprises one or more conductive particles and conductive nanowires, the conductive nanowires connecting the one or more conductive particles to one of the outer electrodes, the conductive nanowires comprising conductive metals, and the length of the conductive nanowires being greater than or equal to 10 μm.

17. The multilayer electronic assembly according to claim 16, wherein, The length of the conductive nanowire is greater than the diameter of the conductive particle.

18. The multilayer electronic assembly according to claim 16, wherein, The conductive nanowires comprise one or more conductive metals selected from the group consisting of nickel, copper, and their alloys.

19. The multilayer electronic assembly according to claim 16, wherein, The conductive nanowires and the one or more conductive particles contain the same conductive metal.

20. The multilayer electronic assembly according to claim 16, wherein, The average porosity of at least one of the inner electrodes is greater than or equal to 6% and less than or equal to 15%.

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