Optimized low energy / high productivity deposition system

Abstract

An optimized low energy / high throughput deposition system. A mechanical indexer for a substrate processing tool includes a first arm and a second arm each having a first end effector and a second end effector. The first arm is configured to rotate on a first axis to selectively position the first end effector of the first arm at a plurality of processing stations of the substrate processing tool and to selectively position the second end effector of the first arm at the plurality of processing stations of the substrate processing tool. The second arm is configured to rotate on a second axis to selectively position the first end effector of the second arm at the plurality of processing stations of the substrate processing tool and to selectively position the second end effector of the second arm at the plurality of processing stations of the substrate processing tool. The first arm is configured to rotate independently of the second arm.

Description

[0001] This application is a divisional application of application No. 201810062008.9, filed on January 23, 2018, entitled "Optimized Low-Energy / High-Productivity Deposition System".

[0002] Cross-references to related applications

[0003] This application claims the benefit of U.S. Provisional Application No. 62 / 449,325, filed January 23, 2017. The entire disclosure of the above-cited application is incorporated herein by reference. Technical Field

[0004] This disclosure relates to the transfer of substrates within a processing module of a substrate processing system. Background Technology

[0005] The background description provided herein is for the purpose of generally presenting the background of this disclosure. The work of the inventors currently named, to the extent described in this background section and in aspects of this specification that would not otherwise be considered prior art at the time of application, is neither expressly nor implicitly acknowledged as prior art to this disclosure.

[0006] Substrate processing systems can be used to perform deposition, etching, and / or other processing on substrates such as semiconductor wafers. During processing, the substrate is placed on a substrate support within a processing chamber of the substrate processing system. A gas mixture comprising one or more precursors is introduced into the processing chamber, and plasma can be excited to activate a chemical reaction. The substrate processing system may include multiple substrate processing tools arranged within a fabrication chamber. Each substrate processing tool may include multiple processing modules.

[0007] Now for reference Figure 1 The diagram shows a top view of an example substrate processing tool 100. The substrate processing tool 100 includes a plurality of processing modules 104. Each of the processing modules 104 can be configured to perform one or more corresponding processes on a substrate. A substrate to be processed is loaded into the substrate processing tool 100 through an end port of a loading station of a device front end module (EFEM) 108, and then transferred to one or more of the processing modules 104. For example, the substrate can be transferred from EFEM 108 to a loading lock 112 via one or more EFEM robots 116. A vacuum transfer module (VTM) 120 includes one or more VTM robots 124 configured to transfer the substrate in and out of the processing modules 104. For example, the substrate can be continuously loaded into each of the processing modules 104.

[0008] In one example, processing module 104 corresponds to a four-station processing module (QSM). The QSM may include four processing stations 128 within a single chamber (i.e., within processing chamber 132 of processing module 104). Substrate 136 is loaded into processing module 104 via loading station 140. For example, substrate 136 is transferred between VTM 120 and loading station 140 via various slots 144 between VTM 120 and processing module 104. Mechanical transponders 148 (i.e., transposition mechanisms) sequentially rotate substrate 136 between processing stations 128. As shown, mechanical transponders 148 correspond to a cross-shaped axis. For example, substrate 136 may be transferred from VTM 120 to processing station 128 corresponding to loading station 140 (labeled "1"), sequentially rotated between processing stations 140 labeled "2", "3", and "4", and then returned to loading station 140 for removal from processing module 104. The system controller 152 can control various operations of the tool, including but not limited to the operation of the robotic arms 116 and 124, the rotation of the transducer 148, etc. Summary of the Invention

[0009] A mechanical positioner for a substrate processing tool includes a first arm and a second arm, each having a first end effector and a second end effector. The first arm is configured to rotate on a first axis to selectively position the first end effector of the first arm at a plurality of processing stations of the substrate processing tool, and to selectively position the second end effector of the first arm at the plurality of processing stations of the substrate processing tool. The second arm is configured to rotate on a second axis to selectively position the first end effector of the second arm at the plurality of processing stations of the substrate processing tool, and to selectively position the second end effector of the second arm at the plurality of processing stations of the substrate processing tool. At least one of the plurality of processing stations corresponds to a loading station of the substrate processing tool. The first arm is configured to rotate independently of the second arm such that while the first end effector or the second end effector of the second arm is positioned at the loading station, the first end effector or the second end effector of the first arm is also positioned at the loading station.

[0010] Among other features, the first axis and the second axis are coaxial. Each of the first arm and the second arm is configured to rise and fall relative to the plurality of processing stations of the substrate processing tool. The second axis is disposed within the first axis.

[0011] Among other features, the first arm and the second arm are rotatable into a first configuration. In this first configuration, the first end effector and the second end effector of the first arm are located at the first and third processing stations of the plurality of processing stations, respectively, and the first end effector and the second end effector of the second arm are located at the second and fourth processing stations of the plurality of processing stations, respectively. The first arm and the second arm are also rotatable into a second configuration. In this second configuration, the first end effector and the second end effector of the first arm are located at the first and third processing stations of the plurality of processing stations, respectively, and the first end effector and the second end effector of the second arm are located at the third and first processing stations of the plurality of processing stations, respectively.

[0012] Among other features, the first processing station corresponds to the loading station of the substrate processing tool. The first processing station and the third processing station are located at opposite corners of the substrate processing tool, while the second processing station and the fourth processing station are located at opposite corners of the substrate processing tool.

[0013] Among other features, the first arm and the second arm are rotatable into a first configuration. In this first configuration, the first end effector and the second end effector of the first arm are located at the first and fourth processing stations of the plurality of processing stations, respectively, and the first end effector and the second end effector of the second arm are located at the second and third processing stations of the plurality of processing stations, respectively. The first arm and the second arm are also rotatable into a second configuration. In this second configuration, the first end effector and the second end effector of the first arm are located at the first and fourth processing stations of the plurality of processing stations, respectively, and the first end effector and the second end effector of the second arm are located at the fourth processing station and the first processing station of the plurality of processing stations, respectively.

[0014] In other features, the first processing station and the fourth processing station are disposed on a first side of the substrate processing tool, and the second processing station and the third processing station are disposed on a second side of the substrate processing tool opposite to the first side. The first processing station and the fourth processing station correspond to loading stations of the substrate processing tool.

[0015] Among other features, a substrate processing tool includes: a vacuum transfer module and a plurality of processing modules coupled to the vacuum transfer module. At least one of the plurality of processing modules includes the mechanical transducer. The plurality of processing modules includes first and second processing modules coupled to a first side of the vacuum transfer module and third and fourth processing modules coupled to a second side of the vacuum transfer module.

[0016] Among other features, an adapter plate is disposed between the first side and the first and second processing modules. The adapter plate includes a flat side configured to mate with the first side of the vacuum transfer module and an angled side configured to mate with the first and second processing modules.

[0017] Among other features, the first and second sides of the vacuum transfer module are chamfered. An adapter plate is disposed between the first side and the first and second processing modules. The adapter plate includes an angled side configured to mate with the first side of the vacuum transfer module and a flat side configured to mate with the first and second processing modules.

[0018] Specifically, some aspects of the present invention can be described as follows:

[0019] 1. A mechanical transponder for a substrate processing tool, the mechanical transponder comprising:

[0020] A first arm having a first end effector and a second end effector, wherein the first arm is configured to rotate on a first axis to (i) selectively position the first end effector of the first arm at a plurality of processing stations of the substrate processing tool, and (ii) selectively position the second end effector of the first arm at the plurality of processing stations of the substrate processing tool; and

[0021] A second arm having a first end effector and a second end effector, wherein the second arm is configured to rotate on a second axis to (i) selectively position the first end effector of the second arm at the plurality of processing stations of the substrate processing tool, and (ii) selectively position the second end effector of the second arm at the plurality of processing stations of the substrate processing tool.

[0022] At least one of the plurality of processing stations corresponds to the loading station of the substrate processing tool, and

[0023] The first arm is configured to rotate independently of the second arm, such that while the first end effector or the second end effector of the second arm is positioned at the loading station, the first end effector or the second end effector of the first arm is also positioned at the loading station.

[0024] 2. The mechanical transducer according to Clause 1, wherein the first axis and the second axis are coaxial.

[0025] 3. The mechanical transponder according to Clause 1, wherein each of the first arm and the second arm is configured to raise and lower relative to the plurality of processing stations of the substrate processing tool.

[0026] 4. The mechanical transducer according to Clause 1, wherein the second shaft is disposed within the first shaft.

[0027] 5. The mechanical transducer as described in Clause 1, wherein:

[0028] The first arm and the second arm can rotate into a first configuration; and

[0029] In the first configuration, (i) the first end effector and the second end effector of the first arm are located at the first processing station and the third processing station of the plurality of processing stations, respectively, and (ii) the first end effector and the second end effector of the second arm are located at the second processing station and the fourth processing station of the plurality of processing stations, respectively.

[0030] 6. The mechanical transducer as described in Clause 5, wherein:

[0031] The first arm and the second arm can rotate into a second configuration; and

[0032] In the second configuration, (i) the first end effector and the second end effector of the first arm are located at the first processing station and the third processing station of the plurality of processing stations, respectively, and (ii) the first end effector and the second end effector of the second arm are located at the third processing station and the first processing station of the plurality of processing stations, respectively.

[0033] 7. The mechanical transducer according to Clause 6, wherein the first processing station corresponds to the loading station of the substrate processing tool.

[0034] 8. The mechanical transposer according to Clause 6, wherein (i) the first processing station and the third processing station are arranged at opposite corners of the substrate processing tool, and (ii) the second processing station and the fourth processing station are arranged at opposite corners of the substrate processing tool.

[0035] 9. The mechanical transducer as described in Clause 1, wherein:

[0036] The first arm and the second arm can rotate into a first configuration; and

[0037] In the first configuration, (i) the first end effector and the second end effector of the first arm are located at the first processing station and the fourth processing station of the plurality of processing stations, respectively, and (ii) the first end effector and the second end effector of the second arm are located at the second processing station and the third processing station of the plurality of processing stations, respectively.

[0038] 10. The mechanical transducer as described in Clause 9, wherein:

[0039] The first arm and the second arm can rotate into a second configuration; and

[0040] In the second configuration, (i) the first end effector and the second end effector of the first arm are located at the first processing station and the fourth processing station of the plurality of processing stations, respectively, and (ii) the first end effector and the second end effector of the second arm are located at the fourth processing station and the first processing station of the plurality of processing stations, respectively.

[0041] 11. The mechanical transposer according to Clause 10, wherein (i) the first processing station and the fourth processing station are disposed on a first side of the substrate processing tool, and (ii) the second processing station and the third processing station are disposed on a second side of the substrate processing tool opposite to the first side.

[0042] 12. The mechanical transducer according to Clause 10, wherein the first processing station and the fourth processing station correspond to the loading station of the substrate processing tool.

[0043] 13. A substrate processing tool, comprising:

[0044] Vacuum transfer module; and

[0045] A plurality of processing modules are coupled to the vacuum transfer module, wherein at least one of the plurality of processing modules includes a mechanical transducer as described in Clause 1.

[0046] 14. The substrate processing tool according to Clause 13, wherein the plurality of processing modules includes first and second processing modules coupled to a first side of the vacuum transfer module and third and fourth processing modules coupled to a second side of the vacuum transfer module.

[0047] 15. The substrate processing tool according to Clause 14, further comprising an adapter plate disposed between (i) the first side and (ii) the first and second processing modules, wherein the adapter plate includes a flat side configured to dock with the first side of the vacuum transfer module and an angled side configured to dock with the first and second processing modules.

[0048] 16. The substrate processing tool according to Clause 14, wherein the first and second sides of the vacuum transfer module are chamfered.

[0049] 17. The substrate processing tool according to Clause 16, further comprising an adapter plate disposed between (i) the first side and (ii) the first and second processing modules, wherein the adapter plate includes an angled side configured to dock with the first side of the vacuum transfer module and a flat side configured to dock with the first and second processing modules.

[0050] Other applicable areas of this disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for illustrative purposes only and are not intended to limit the scope of this disclosure. Attached Figure Description

[0051] This disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0052] Figure 1 This is an example of a substrate processing tool.

[0053] Figure 2A A first exemplary processing module of a mechanical transducer with an X-shaped configuration is shown.

[0054] Figure 2B A first exemplary processing module with a mechanical transducer in a second configuration is shown.

[0055] Figure 2C This is a side view of the first exemplary processing module.

[0056] Figure 2D This is a side view of a mechanical transducer.

[0057] Figure 3A A second exemplary processing module with a mechanical transducer in an X-shaped configuration is shown.

[0058] Figure 3B A second exemplary processing module with a mechanical transducer in a second configuration is shown.

[0059] Figure 3C This is a side view of the second exemplary processing module.

[0060] Figure 3D The image shows a mechanical transducer with an X-shaped structure.

[0061] Figure 3E The second construction of the mechanical transducer is shown.

[0062] Figure 4A A first exemplary substrate processing tool is shown.

[0063] Figure 4B A second exemplary substrate processing tool is shown.

[0064] Figure 4C An exemplary transfer robot is shown.

[0065] Figure 4D An exemplary adapter board for a substrate processing tool is shown.

[0066] Figure 4E A third exemplary substrate processing tool is shown.

[0067] Figure 5 The steps of a first exemplary method for operating a mechanical transducer for a substrate processing tool are shown.

[0068] Figure 6 The steps of a second exemplary method for operating a mechanical transducer for a substrate processing tool are shown.

[0069] In the accompanying drawings, reference numerals may be used repeatedly to identify similar and / or identical elements. Detailed Implementation

[0070] The processing modules in a substrate processing tool can operate in a multi-station sequential processing mode. For example, only a portion of the entire processing can be performed on the substrate at each processing station within the processing module. As the processing time at each station decreases and / or the processing module performs a greater number of processes on the substrate, the delay associated with rotating and transferring the substrate via mechanical transponders becomes a larger portion of the total time each substrate is held in the processing module. In one example, the substrate is sequentially transferred to processing stations corresponding to loading stations. The transponder rotates after each transfer until the substrate is positioned on the transponder in each of the four processing stations. Processing can then be performed on each substrate.

[0071] The substrate processing and transfer system and method implementation according to the principles of this disclosure is configured as a transfer module (e.g., a vacuum transfer module or VTM), a processing module, and a mechanical transducer to reduce substrate transfer time. For example, the VTM is configured to load two or more (e.g., four) substrates into the processing module and retrieve two or more substrates from the processing module for each transfer.

[0072] In one example, the mechanical transducer includes two independently rotatable arms, each having a first end and a second end (e.g., an end effector). The transducer can be selectively arranged in a first “X” configuration. In the X configuration, each end can be aligned with a corresponding processing station in the processing module. For example, the first and second ends of the first arm can be aligned with diagonally opposite processing stations 1 and 3 (or 2 and 4), while the first and second ends of the second arm can be aligned with diagonally opposite processing stations 2 and 4 (or 1 and 3). In a second configuration, one arm is raised and rotated such that the first and second arms are aligned. In the second configuration, the first and second ends of each arm are aligned with stations 1 and 3 or stations 2 and 4. In other words, in the second configuration, the corresponding ends of the two arms can be vertically stacked on either processing station. In particular, the corresponding ends of the two arms can be aligned with a loading station.

[0073] Therefore, in this example, two substrates can be transferred to and / or from the processing module (e.g., using a VTM robot with end effectors configured to transfer two substrates at a time in a vertically stacked configuration). The two arms can be rotated such that the opposite ends of each arm are aligned with loading stations to transfer two additional substrates to and / or from the processing module. The mechanical transponder can then be arranged in a first X-shaped configuration such that each of the four substrates is aligned with a different processing station.

[0074] In another example, the processing module may include two loading stations. For example, the loading station may correspond to a processing station adjacent to the VTM. In this example, the mechanical transducer includes first and second V-arms. The transducer may be arranged in a first X-shaped configuration. In the X-shaped configuration, the first and second ends of the first V-arm may be aligned with processing stations 1 and 4 (or processing stations 2 and 1, 3 and 2, or 4 and 3), while the first and second ends of the second V-arm may be aligned with processing stations 2 and 3 (or processing stations 3 and 4, 4 and 1, or 1 and 2). In a second configuration, one arm is raised and rotated such that the first and second arms are aligned. In the second configuration, the first and second ends of each arm are aligned with, for example, stations 1 and 4, which may correspond to loading stations. In other words, in the second configuration, the respective ends of the two arms may be stacked vertically in the loading station.

[0075] Therefore, in this example, four substrates can be transferred to and / or from the processing module (e.g., using two VTM robots, each with end effectors configured to transfer two substrates at a time in a vertically stacked manner). The mechanical transponder can then be arranged in a first X-shaped configuration such that each of the four substrates is aligned with a different processing station.

[0076] As described in more detail below, the substrate processing and transfer system and method according to this disclosure can reduce energy consumption, reduce overhead time associated with substrate processing, increase processing throughput, increase the number of processing modules per tool, etc. Although described with respect to a processing module having four processing stations, the principles of this disclosure can also be implemented in processing modules having other numbers of processing stations (e.g., two, three, five, six, seven, eight, etc.).

[0077] Now refer to Figure 2A , 2B Images 2C and 2D illustrate an exemplary processing module 200 including a mechanical transducer 204 according to the principles of this disclosure. In this example, the mechanical transducer 204 includes two independently rotatable arms 208 and 212, each arm having a first end and a second end (e.g., end actuators 216, 220, 224, and 228). The transducer 204 in Figure 2A The first X-shaped structure is arranged in the middle, while Figure 2B The second configuration is arranged in the middle. In the X-shaped configuration, the end effectors 216 and 220 of the first arm 208 are located above processing stations 1 and 3, respectively, while the end effectors 224 and 228 are located above processing stations 2 and 4, respectively. Processing station 1 may correspond to loading station 232, which can be accessed through slot 236.

[0078] In the second configuration, the second arm 212 can be raised and rotated so that the first arm 208 and the second arm 212 are aligned. For example, the first arm 208 can be coupled to the first shaft 240, and the second arm 212 can be coupled to the second shaft 244, as shown. Figure 2D As shown. The second shaft 244 is enclosed within the first shaft 240 and is configured to be selectively raised and lowered within the first shaft 240. Thus, raising the second shaft 244 raises the second arm 212 relative to the first arm 208, thereby allowing the second arm 212 to rotate independently of the first arm 208. In this way, the end effectors 216, 220, 224, and 228, and their respective substrates 248, can be positioned above / below each other in any of the loading station 232 or processing stations 1-4.

[0079] For example, the second arm 212 can be rotated such that the first arm 208 and the second arm 212 are arranged in... Figure 2B In the second configuration shown, end effectors 216 and 228 are both located in loading station 232. In other words, in the second configuration, end effectors 216 and 228 are vertically stacked in loading station 232. Therefore, substrate 248 disposed on end effectors 216 and 228 can be retrieved from processing module 200 and / or new (i.e., unprocessed) substrates can be loaded onto end effectors 216 and 228 through slot 236.

[0080] In an example transfer sequence, each of the first arm 208 and the second arm 212 is raised to a first height to lift the substrate 248 from the respective processing stations 1-4. For example, end effectors 216, 220, 224, and 228 may be located at processing stations 1, 2, 3, and 4, respectively. The second arm 212 may be further raised to a second height above the first height. Therefore, the second arm 212 can be rotated (e.g., as...). Figure 2B As shown in the diagram, the end effector 228 is positioned at processing station 1 (i.e., loading station 332) at approximately 90 degrees clockwise. A VTM robot outside processing module 200 can then retrieve the substrate 248 disposed on each of end effectors 216 and 228. In some examples, the VTM robot exchanges the processed substrate 248 with an unprocessed substrate.

[0081] After unloading substrate 248 and / or loading untreated substrate onto end effectors 216 and 228, the entire transducer 204 (i.e., both the first arm 208 and the second arm 212) can be rotated approximately 180 degrees while maintaining the corresponding first and second heights of the first arm 208 and the second arm 212. Thus, the transducer 204 is rotated such that end effectors 220 and 224 are positioned at loading station 232. The VTM robot can then retrieve the treated substrate 248 from end effectors 220 and 224 and / or load untreated substrate onto end effectors 220 and 224. The second arm 212 can then be rotated relative to arm 208 (e.g., approximately 90 degrees clockwise) to position end effectors 224 and 228 at processing stations 2 and 4, respectively, while end effectors 216 and 220 remain at processing stations 3 and 1, respectively. Each of the first arm 208 and the second arm 212 can then be lowered to position the unprocessed substrate in the corresponding processing station 1-4. Other exemplary transfer sequences can be implemented.

[0082] Now for reference Figure 3A , 3B Images 3C, 3D, and 3E illustrate another exemplary processing module 300 including a mechanical transducer 304, according to the principles of this disclosure. In this example, the processing module 300 includes two loading stations 308 and 312 and corresponding slots 316 and 320. The transducer 304 includes first and second V-arms 324 and 328, each V-arm having first and second ends (e.g., end actuators 332, 336, 340, and 344). The transducer 304 in Figure 3A and 3D The first "X" shaped structure is arranged in the middle, while Figure 3B and 3EThe second configuration is arranged in the middle. In the X-shaped configuration, end effectors 332 and 336 are located above processing stations 1 and 4, respectively, while end effectors 340 and 344 are located above processing stations 2 and 3, respectively. Processing stations 1 and 4 correspond to loading stations 308 and 320, respectively.

[0083] In the second configuration, the second arm 328 can be raised and rotated such that the first arm 324 and the second arm 328 are aligned. For example, the first arm 324 and the second arm 328 can be coupled to independently rotatable shafts 348 and 352, which are configured to... Figure 2D The operation is similar to that described in the section on operating the first and second axes 240 and 244. Accordingly, the second arm 328 can be rotated such that the first arm 324 and the second arm 328 are arranged in a manner similar to that described in the section. Figure 3B In the second configuration shown, end effectors 332 and 344 are each located in loading station 308, and end effectors 336 and 340 are each located in loading station 312. For example, end effectors 332 and 344, along with their respective substrates 356 disposed thereon, are vertically stacked in loading station 308. Conversely, end effectors 336 and 340, along with their respective substrates 356 disposed thereon, are vertically stacked in loading station 312. Thus, substrate 356 can be retrieved from processing module 300 and / or new (i.e., unprocessed) substrates can be loaded onto end effectors 332, 344 and 336, 340 via corresponding slots 316 and 320.

[0084] In an exemplary transfer sequence, each of the first arm 324 and the second arm 328 is raised to a first height to lift the substrate 356 from the respective processing station 1-4. For example, end effectors 332, 340, 344, and 336 may be located at processing stations 1, 2, 3, and 4, respectively. The second arm 328 may be further raised to a second height above the first height. Therefore, the second arm 328 can be rotated (e.g., as...). Figure 3B (Approximately 180 degrees as shown), such that end effectors 344 and 340 are positioned at processing stations 1 and 2 (i.e., loading stations 308 and 312), respectively. A VTM robot outside the processing module 300 can then retrieve substrate 356 arranged on each of the end effectors 332, 340, 344, and 336. In some examples, the VTM robot exchanges the processed substrate 356 with an unprocessed substrate.

[0085] After unloading substrate 356 and / or loading unprocessed substrate onto end effectors 332, 340, 344, and 336, the second arm 328 is rotated approximately 180 degrees to return transducer 304 to the X-shaped configuration, while maintaining the first and second heights of the first arm 324 and the second arm 328, respectively. Thus, end effectors 332, 340, 344, and 336 are located at processing stations 1, 2, 3, and 4, respectively. The first arm 324 and the second arm 328 can then be lowered onto their respective processing stations 1-4. Other exemplary transfer sequences can be implemented.

[0086] Now for reference Figure 4A , 4B Figures 4C and 4C show top views of exemplary substrate processing tools 400 and 404 having exemplary transfer robots 408-1, 408-2, and 408-3 (collectively referred to as transfer robot 408). For illustrative purposes, processing tools 400 and 404 are shown, but mechanical transponders are not shown. For example, as described above, the respective processing module 412 of each of tools 400 and 404 may include either mechanical transponder 204 or mechanical transponder 304.

[0087] The Vacuum Transfer Module (VTM) 416 and the Equipment Front End Module (EFEM) 420 may each include one of the transfer manipulators 408. Transfer manipulators 408-1 and 408-2 may have the same or different constructions. For example only, transfer manipulator 408-1 includes a single arm with two vertically stacked end effectors. Conversely, transfer manipulator 408-2 is shown as having two arms, each with two vertically stacked end effectors, such as... Figure 4C As shown. The VTM 416's robot arm 408 selectively transports the substrate to and from the loading lock 424 and between processing modules 412. The EFEM 420's robot arm 408-3 transports the substrate in and out of the EFEM 420 and to and from the loading lock 424. By way of example only, the robot arm 408-3 may have two arms, each with a single end effector or two vertically stacked end effectors.

[0088] Tool 400 is configured to interface with, for example, four processing modules 412, each having a single loading station accessible via a corresponding slot 428. Conversely, tool 404 is configured to interface with three processing modules 412, each having two loading stations accessible via corresponding slots 432 and 436. As shown, the side 440 of VTM 416 may be angled (e.g., chamfered) to facilitate coupling with different arrangements (e.g., different amounts, spacings, etc.) of the processing modules 412.

[0089] For example, such as Figure 4AAs shown, the VTM is coupled to two processing modules 412 on each side 440. Conversely, the shape of the VTM 416 also allows for the connection of processing modules 412 with two loading stations. For example, an adapter board 444 with two slots 432 and 436 can be provided to accommodate a single processing module 412 with two loading stations, such as... Figure 4B As shown, the adapter board 444 has a first angled side configured to mate with an angled side 440 of the VTM 416 and a second non-angled (i.e., straight or flat) side configured to mate with the processing module 412. Therefore, the VTM 416 provides the flexibility to connect a larger number of processing modules 412 with a single loading station (i.e., increasing the number of processing stations per unit area of ​​the tool 400), while also allowing the use of modules with features such as... Figure 4A The image shows only one loading station or as shown. Figure 4B The processing module 412 of the two loading stations shown offers flexibility. In other examples, the sides of VTM 416 can be non-angled (i.e., straight or flat). In these examples, tool 400 may include adapter board 446, such as Figure 4D As shown, adapter board 446 is configured to interface with two processing modules 412, each having a single loading station. In other words, instead of converting the angled side 440 of VTM 416 to a non-angled side, adapter board 446 converts the non-angled side of VTM 416 to an angled side.

[0090] The VTM 416's robotic arm 408-2 includes two arms 448 and 452, each arm comprising two vertically stacked end effectors 456, for a total of four end effectors 456. Therefore, each arm 448 and 452 is configured to simultaneously transfer and / or transfer two substrates to and / or from a corresponding one of the processing modules 412, loading locks 424, etc. Figure 4A In the example shown, robot 408-1 can retrieve two substrates from processing module 412 and load two substrates into processing module 412 in a given transfer. Conversely, robot 408-2 can retrieve four substrates from processing module 412 and load four substrates into processing module 412 in a given transfer.

[0091] The system controller 460 can control various operations of the substrate processing tools 400 and 404, including but not limited to the operation of the robot arm 408, the rotation of the corresponding transducers of the processing module 412 (e.g., transducers 204 and 304 corresponding to FIG. 2 and FIG. 3), etc.

[0092] exist Figure 4EIn another example shown, the substrate processing tool 464 includes transfer robots 468-1 and 468-2 (collectively referred to as transfer robot 468). For illustrative purposes, the processing tool 464 is shown, but the mechanical transducers are not shown. For example, the corresponding processing module 472 of the tool 464 may include either the mechanical transducer 204 or the mechanical transducer 304 as described above.

[0093] VTM 476 and EFEM 480 may each include one of the transfer manipulators 468. Transfer manipulators 468-1 and 468-2 may have the same or different constructions. For example only, transfer manipulator 468-1 is shown as having two arms, each arm having two vertically stacked end effectors, such as... Figure 4C As shown. The VTM 476's robotic arm 468-1 selectively transports the substrate to and from EFEM 480 and between processing modules 472. The EFEM 480's robotic arm 468-2 transports the substrate in and out of EFEM 480. By way of example only, robotic arm 468-2 may have two arms, each with a single end effector or two vertically stacked end effectors.

[0094] Tool 464 is configured to dock with, for example, four of the processing modules 472, each having a single loading station accessible via a corresponding slot 484. In this example, the sides 488 of the VTM 476 are not angled (i.e., the sides 488 are substantially straight or flat). In this way, two processing modules 472 (each with a single loading station) can be coupled to each side 488 of the VTM 476. Therefore, the EFEM 480 can be arranged at least partially within two processing modules 472 to reduce the footprint of tool 464.

[0095] like Figure 5 As shown, a first example method 500 for operating a mechanical transponder for a substrate processing tool begins at 504 (e.g., as...). Figure 2A , 2B The mechanical transducer 204 is shown in 2C and 2D. By way of example only, the operation of the mechanical transducer can be controlled by a controller such as system controller 460. At 508, the mechanical transducer is arranged in a first X-shaped configuration, wherein the first and second ends of the first arm are positioned at the first and third processing stations, while the first and second ends of the second arm are located at the second and fourth processing stations (e.g., as shown in 2C and 2D). Figure 2A (As shown). Each end of the first and second arms can be positioned to retrieve the corresponding processed substrate. At 512, the first and second arms are raised on their respective axes to lift the substrate from the processing station. At 516, the second arm is rotated (e.g., as shown). Figure 2B(As shown, rotated 90 degrees clockwise) so that the second end of the second arm is located at the first processing station, which corresponds to the loading station. At 520, the robot retrieves the processed substrate from the first end of the first arm and the second end of the second arm located at the first processing station.

[0096] At 524, the robot arm transfers the untreated substrate to the first end of the first arm and the second end of the second arm at the first processing station. At 528, the first and second arms are rotated (e.g., rotated 180 degrees) such that the second end of the first arm and the first end of the second arm are each positioned at the first processing station. At 532, the robot arm retrieves the treated substrate from the first end of the first arm and the second end of the second arm. At 536, the robot arm transfers the untreated substrate to the second end of the first arm and the first end of the second arm at the first processing station. At 540, the second arm is rotated (e.g., rotated 90 degrees clockwise) such that the first end of the second arm and the second end of the second arm are positioned at the second and fourth processing stations (i.e., the mechanical transponder returns to the first X-shaped configuration). At 544, the first and second arms are lowered to position the untreated substrate onto the corresponding processing stations. Method 500 ends at 548.

[0097] like Figure 6 As shown, a first example method 600 for operating a mechanical transponder for a substrate processing tool begins at 604 (e.g., as...). Figure 3A , 3B The mechanical transducer 304 is shown in 3C, 3D, and 3E. By way of example only, the operation of the mechanical transducer can be controlled by a controller such as system controller 460. At 608, the mechanical transducer is arranged in a first X-shaped configuration, wherein the first and second ends of the first arm are positioned at the first and fourth processing stations, while the first and second ends of the second arm are positioned at the second and third processing stations (e.g., as shown in 3C, 3D, and 3E). Figure 3A (As shown). Each end of the first and second arms can be positioned to retrieve the corresponding processed substrate. At 612, the first and second arms are raised on their respective axes to lift the substrate from the processing station. At 616, the second arm is rotated (e.g., as shown). Figure 3B (as shown, rotated 180 degrees clockwise) such that the first and second ends of the second arm are located at the fourth and first processing stations, respectively, which correspond to the loading stations. At 620, one or more robotic arms retrieve the processed substrate from the first and second ends of the first arm and the first and second ends of the second arm located at the first and fourth processing stations.

[0098] At 624, the robotic arm transfers the untreated substrate to the first and second ends of the first arm and the first and second ends of the second arm, located at the first and fourth processing stations. At 628, the second arm is rotated (e.g., 180 degrees) such that the first and second ends of the second arm are positioned at the second and third processing stations (i.e., the mechanical transponder returns to the first X-shaped configuration). At 632, the first and second arms are lowered to position the untreated substrate onto the respective processing stations. Method 600 ends at 636.

[0099] The foregoing description is merely illustrative in nature and is in no way intended to limit this disclosure, its application, or its use. The broad teachings of this disclosure can be implemented in various forms. Therefore, although this disclosure includes specific examples, its true scope should not be so limited, as other modifications will become apparent upon examination of the drawings, description, and appended claims. It should be understood that one or more steps in the method may be performed in different orders (or simultaneously) without altering the principles of this disclosure. Furthermore, while each embodiment is described above as having certain features, any one or more of those features described with respect to any embodiment of this disclosure may be implemented in any other embodiment and / or combined with features of any other embodiment, even if such combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and substitution of one or more embodiments for each other remains within the scope of this disclosure.

[0100] Various terms, including “connection,” “joint,” “coupled,” “adjacent,” “near,” “above,” “under,” and “set,” are used to describe spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.). Unless explicitly described as “direct,” the relationship between the first and second elements described in the foregoing disclosure can be a direct relationship in which no other intermediate element exists between the first and second elements, or an indirect relationship in which one or more intermediate elements exist between the first and second elements (spatially or functionally). As used herein, the phrase “at least one of A, B, and C” should be interpreted as meaning the use of a non-exclusive logical OR (A or B or C) and should not be interpreted as meaning “at least one of A, at least one of B, and at least one of C.”

[0101] In some implementations, the controller is part of a system, which may be part of the examples described above. Such a system may include a semiconductor processing apparatus comprising one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (wafer pedestals, airflow systems, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after the processing of a semiconductor wafer or substrate. The electronics may be referred to as a “controller”, which can control various components or sub-components of one or more systems. Depending on the processing requirements and / or system type, the controller may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transport tools and other transport tools, and / or loading locks connected to or interfacing with a specific system.

[0102] Broadly speaking, a controller can be defined as an electronic device having various integrated circuits, logic, memory, and / or software that have functions such as receiving instructions, issuing instructions, controlling operations, enabling cleaning operations, and enabling endpoint measurements. Integrated circuits can include chips in the form of firmware storing program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions can be instructions transmitted to the controller in the form of various individual settings (or program files), which define operating parameters for performing specific processes on a semiconductor substrate or for a semiconductor wafer or system. In some embodiments, operating parameters can be part of a recipe defined by a process engineer to complete one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0103] In some implementations, the controller may be part of or coupled to a computer that is integrated with, coupled to, or otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or in all or part of a wafer fab (fab) host computer system, enabling remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of fabrication operations, study the history of past fabrication operations, study trends or performance standards from multiple fabrication operations, change parameters of the current process, set processing steps after the current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide process recipes to the system via a network (which may include a local network or the Internet). The remote computer may include a user interface that enables input or programming of parameters and / or settings, which are then transmitted from the remote computer to the system. In some examples, the controller receives instructions in the form of data specifying parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of processing to be performed and the type of tool that is interfaced with or controlled by the controller. Therefore, as described above, the controller can be distributed, for example, by comprising one or more discrete controllers networked together and operating toward a common purpose (e.g., the processing and control described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a room that communicate with one or more integrated circuits located remotely (e.g., at the platform level or as part of a remote computer), which combine to control processing on the room.

[0104] Exemplary systems may include, but are not limited to, plasma etching chambers or modules, deposition chambers or modules, rotary rinsing chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfering edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, orbital chambers or modules, and any other semiconductor processing systems that may be associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0105] As described above, depending on one or more process steps to be performed by the tool, the controller may communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the plant, a host computer, another controller, or tools used in the transport of materials in a semiconductor manufacturing plant to and from the tool location and / or to the loading end port.

Claims

1. A processing module for a substrate processing tool, the processing module comprising: Multiple processing stations, each configured to perform processing on a substrate; as well as A mechanical transducer is arranged within the processing module, wherein the mechanical transducer comprises a plurality of arms, each of the plurality of arms having at least one end effector, wherein Each of the at least one end effector extends radially from the central axis of the mechanical transducer and is configured to rotate about the central axis within the processing module. The mechanical transducer is configured to position each of the at least one end effector at any one of the plurality of processing stations within the processing module, and The mechanical transducer is configured to simultaneously position more than one of the at least one end effector at the same processing station among the plurality of processing stations.

2. The processing module of claim 1, wherein at least one of the plurality of processing stations corresponds to a loading station of the processing module, and the mechanical transducer is configured to simultaneously position each of the at least one end effector at the loading station of the processing module.

3. The processing module of claim 2 further includes a first slot aligned with the loading station, wherein the first slot allows access to the loading station from a vacuum transfer module outside the processing module.

4. The processing module of claim 3, wherein the mechanical transducer is configured to simultaneously receive at least two substrates passing through the first groove.

5. The processing module according to claim 2, wherein two of the plurality of processing stations correspond to the loading station of the processing module, and the processing module further comprises: A first slot aligned with the first one in the loading station, wherein the first slot allows access to the loading station from a vacuum transfer module outside the processing module; as well as A second slot aligned with the second in the loading station, wherein the second slot allows access to the loading station from the vacuum transfer module.

6. The processing module of claim 5, wherein the mechanical transducer is configured to simultaneously receive two substrates passing through the first slot and two substrates passing through the second slot.

7. The processing module according to claim 1, wherein: The mechanical transducer includes a first arm, the first arm comprising a first end effector and a second end effector; and The mechanical transducer includes a second arm, which comprises a third end actuator and a fourth end actuator. The mechanical transducer is configured as follows: The first and second arms are rotated into an X-shaped configuration, such that each of the first, second, third, and fourth end effectors is positioned at a different processing station among the plurality of processing stations. Rotate the first arm and the second arm such that at least two of the first end effector, the second end effector, the third end effector and the fourth end effector are vertically stacked at the same processing station among the plurality of processing stations.

8. The processing module of claim 7, wherein the same processing station of the plurality of processing stations corresponds to a loading station aligned with a slot, the slot allowing access to the loading station from a vacuum transfer module outside the processing module.

9. The processing module according to claim 7, wherein: Each of the first arm and the second arm is V-shaped; Two of the plurality of processing stations correspond to loading stations aligned with corresponding slots, the slots allowing access to the loading stations from a vacuum transfer module outside the processing module; as well as The mechanical transducer is configured to rotate the first arm and the second arm such that (i) each of the first end effector and the third end effector is positioned at the first loading station in the loading station, while (ii) each of the second end effector and the fourth end effector is positioned at the second loading station in the loading station.

10. The processing module of claim 1, wherein the number of the at least one end effector in the processing module is the same as the number of the plurality of processing stations.

11. The processing module according to claim 1, wherein the at least one end actuator is composed of a first end actuator, a second end actuator, a third end actuator and a fourth end actuator, and the plurality of processing stations are composed of four processing stations.

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