Wafer positioning apparatus, method, and semiconductor processing equipment

Abstract

The application discloses a wafer positioning device and method and a semiconductor process equipment, which comprises a rotating driving mechanism, a supporting mechanism and a wafer centering device. The supporting mechanism is supported on the rotating driving mechanism, and the wafer centering device comprises a lifting driving mechanism and a plurality of inclined centering blocks connected with the lifting driving mechanism. Each inclined centering block is supported on the peripheral area above the supporting mechanism by the lifting driving mechanism, and the lifting driving mechanism is used for driving the lifting of each inclined centering block. Wherein, the inclined sliding surface of each inclined centering block faces the supporting mechanism and has the same distance from the center of the supporting mechanism. The application simplifies the centering process, shortens the centering action time and improves the production capacity.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing, and more particularly to a wafer positioning device, method, and semiconductor process equipment. Background Technology

[0002] Regarding wafer alignment devices in semiconductor process equipment, existing technologies require the use of motors, cylinders, sensors, and other devices to perform multiple actions, including alignment and inspection, to complete the entire alignment process. This process is complex and time-consuming, impacting production efficiency and capacity. Summary of the Invention

[0003] In view of the above-mentioned problems in the prior art, embodiments of the present invention provide a wafer positioning device, method, and semiconductor process equipment.

[0004] In a first aspect, embodiments of the present invention provide a wafer positioning device, including a rotation driving mechanism, a supporting mechanism, and a wafer alignment device, wherein the supporting mechanism is supported on the rotation driving mechanism, and the wafer alignment device includes:

[0005] A lifting drive mechanism and a plurality of tilting centering blocks connected to the lifting drive mechanism support each tilting centering block in the outer region above the support mechanism via the lifting drive mechanism. The lifting drive mechanism is used to drive the lifting and lowering of each tilting centering block. The tilting sliding surface of each tilting centering block faces the center of the support mechanism and is at the same distance from the center of the support mechanism.

[0006] Optionally, the wafer alignment device includes three or more tilted alignment blocks, wherein each tilted alignment block is evenly distributed in the peripheral area above the support mechanism.

[0007] Optionally, the inclined sliding surface of the inclined centering block is specifically:

[0008] plane, or

[0009] A curved surface that conforms to the shape of the wafer edge.

[0010] Optionally, the tilt angle of the tilt sliding surface of the tilting centering block is in the range of 45 to 85 degrees.

[0011] Optionally, the lifting drive mechanism includes:

[0012] The unit comprises a lifting cylinder and multiple connecting rods. Each inclined centering block is connected to the lifting rod of the lifting cylinder through one end of the corresponding connecting rod. The other end of each connecting rod is provided with a fixed base, and the inclined centering block is installed on the corresponding fixed base.

[0013] Optionally, the installation position of the tilting centering block relative to the fixed base is adjustable in the vertical and / or horizontal directions.

[0014] In a second aspect, embodiments of the present invention provide a semiconductor process apparatus, including: an equipment compartment and a wafer positioning device located within the compartment, wherein the wafer positioning device is as described in any embodiment of the first aspect.

[0015] Thirdly, embodiments of the present invention provide a wafer positioning method based on the wafer positioning device described in the first aspect, comprising:

[0016] Control the lifting drive mechanism to rise, thereby driving each of the tilting centering blocks connected to the lifting drive mechanism to rise to the target high position.

[0017] The wafer is received in the target high position state, so that the wafer falls on the inclined sliding surface of the plurality of inclined centering blocks, and the wafer is aligned with the center of the support mechanism under the sliding action of the inclined sliding surface of each of the inclined centering blocks.

[0018] The lifting drive mechanism is controlled to descend, causing each of the tilting centering blocks connected to the lifting drive mechanism to descend, so as to transport the wafer onto the support mechanism until the descent is completed.

[0019] One or more technical solutions provided in the embodiments of the present invention achieve at least the following technical effects or advantages:

[0020] The wafer alignment device includes a lifting drive mechanism and multiple tilting alignment blocks connected to the lifting drive mechanism. This allows the received wafer to fall onto the tilting sliding surface of each tilting alignment block. Under the action of the tilting sliding surface of each tilting alignment block, the wafer can automatically align with the center of the support mechanism. This achieves automatic wafer alignment (i.e., center alignment between the wafer and the support mechanism) during the wafer transport process, eliminating the need to rely on precise instruments such as sensors for alignment and alignment detection. The alignment process is simplified, which helps to improve production efficiency and thus increase production capacity. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0022] Figure 1 This is a side view of the wafer positioning device in an embodiment of the present invention;

[0023] Figure 2 This is a top view of the wafer positioning device in an embodiment of the present invention;

[0024] Figure 3 for Figure 1 Enlarged view of part A of the wafer positioning device;

[0025] Figure 4 This is a schematic diagram of the tilted centering block in one embodiment of the present invention;

[0026] Figure 5 This is a schematic flowchart of the wafer positioning method in an embodiment of the present invention. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Unless otherwise specified, the embodiments of the present invention and the technical features thereof can be combined with each other. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] In a first aspect, embodiments of the present invention provide a wafer positioning device, specifically a wafer positioning device for a single-wafer cleaning equipment. In specific implementations, this wafer positioning device can be, but is not limited to, applied to semiconductor cleaning processes, chemical mechanical planarization (CMP) processes, and deposition processes. (See reference...) Figures 1-4 As shown, the wafer positioning device includes: a rotation drive mechanism 1, a support mechanism 2, and a wafer alignment device. The support mechanism 2 is supported on the rotation drive mechanism 1. The wafer alignment device includes: a lifting drive mechanism 3 and a plurality of tilting alignment blocks 4 connected to the lifting drive mechanism 3. The lifting drive mechanism 3 supports each tilting alignment block 4 in the outer area above the support mechanism 2. The lifting drive mechanism 3 is used to drive the lifting and lowering of each tilting alignment block 4.

[0029] In this arrangement, the inclined sliding surface 4-1 of each inclined centering block 4 faces the center of the support mechanism 2, and the inclined sliding surface 4-1 of each inclined centering block 4 is at the same distance from the center of the support mechanism 2, so as to ensure that the received wafer 5 can be aligned with the center of the support mechanism 2 under the action of each inclined centering block 4.

[0030] With this wafer positioning device, the received wafer 5, after being placed between the tilting alignment blocks 4, is supported by the tilting sliding surface 4-1 of each tilting alignment block 4. This allows the wafer 5 to slide downwards under the action of the tilting sliding surface 4-1 of each tilting alignment block 4, automatically completing the center alignment between the wafer 5 and the supporting mechanism 2. Center alignment can be completed during the wafer 5 transport process without relying on precise instruments such as sensors to detect whether the center alignment is correct.

[0031] Specifically, the tilted alignment blocks 4 of the wafer alignment device are evenly distributed in the outer area above the support mechanism 2. Furthermore, in order to solve the contact error caused by the wafer 5 contacting the alignment block 4 due to the positioning edge or positioning angle, three or more tilted alignment blocks 4 need to be set.

[0032] Specifically, the tilting sliding surface 4-1 of the tilting centering block 4 is either a plane or a curved surface that conforms to the edge shape of the wafer 5. To increase the contact area between the tilting centering block 4 and the wafer 5, and to further improve the center alignment effect and stability during handling, the tilting sliding surface 4-1 of the tilting centering block 4 is a curved surface that conforms to the edge shape of the wafer 5. For example, refer to... Figure 4 The inclined centering block 4 shown in the figure has a shaded area that is the inclined sliding surface 4-1 that matches the edge shape of the wafer 5.

[0033] Specifically, the tilt angle range of the tilt sliding surface 4-1 of the tilt centering block 4 is 45 to 85 degrees.

[0034] The lifting drive mechanism 3 moves its lifting rod, causing the connected tilting alignment blocks 4 to move synchronously, thus ensuring that the wafer 5 remains centered during transport. The lifting drive mechanism 3 specifically includes a lifting cylinder 3-1 and multiple connecting rods 3-2, the number of which matches the number of tilting alignment blocks 4. Each tilting alignment block 4 is connected to the lifting rod of the lifting cylinder 3-1 at one end of its corresponding connecting rod 3-2. The other end of each connecting rod 3-2 is connected to a fixed base 6, on which the tilting alignment block 4 is mounted.

[0035] Specifically, the support mechanism 2 includes a vacuum suction cup 2-1 and a tray 2-2. The vacuum suction cup 2-1 is positioned above the tray 2-2, and both the tray 2-2 and the vacuum suction cup 2-1 are connected to the rotation shaft of the rotary drive mechanism 1. The rotation of the rotary drive mechanism 1 will cause the suction cup 2-1 and the tray 2-2 to rotate. The vacuum suction cup 2-1 is used to adsorb the transported wafer 5.

[0036] Specifically, the lifting drive mechanism 3 can be located below the supporting mechanism 2. Each connecting rod 3-2 connected to the lifting drive mechanism 3 passes through or around the tray 2-2, so that the end of the connecting rod 3-2 used to connect the inclined centering block 4 extends to the top of the tray 2-2. Thus, each inclined centering block 4 connected to each connecting rod 3-2 surrounds the vacuum suction cup 2-1, and the inclined sliding surface 4-1 of each inclined centering block 4 is at the same distance from the center of the vacuum suction cup 2-1.

[0037] Specifically, the rotary drive mechanism 1 can be a motor or other drive type, and the lifting drive mechanism 3 can be a cylinder or other type.

[0038] Furthermore, to accommodate wafers of different sizes, the vertical and / or horizontal orientation of the tilting centering block 4 relative to the fixed base 6 is adjustable. Specifically, the vertical distance between the tilting centering block 4 and the fixed base 6 is adjustable to change the vertical distance between the tilting centering block 4 and the support mechanism 2, thereby accommodating wafers 5 of different thicknesses. The horizontal distance between the tilting centering block 4 and the fixed base 6 is also adjustable to change the horizontal distance between the tilting centering block 4 and the center of the support mechanism 2, thereby accommodating wafers 5 of different diameters. For example, a slot is provided on the fixed base 6, and the tilting centering block 4 is fixed to a certain position on the slot of the fixed base 6 by bolts or other fasteners 7, thereby changing the horizontal distance between the tilting centering block 4 and the fixed base 6.

[0039] Secondly, based on the same inventive concept, embodiments of the present invention provide a semiconductor process apparatus, including: an equipment compartment and a wafer positioning device located within the compartment, wherein the implementation details of the wafer positioning device can be referred to any embodiment of the first aspect.

[0040] Thirdly, based on the same inventive concept, embodiments of the present invention also provide a wafer positioning method implemented using the wafer positioning device described in the first aspect. (See reference...) Figures 1-5 As shown, the wafer positioning method includes the following steps:

[0041] S1. Control the lifting drive mechanism 3 to rise, causing each tilting centering block 4 connected to the lifting drive mechanism 3 to rise to the target high position. Specifically, the target high position is set according to the actual needs of the wafer 5 position, and is not specifically limited here.

[0042] S2. The wafer 5 is taken in the target high position, so that the wafer 5 falls on the inclined sliding surface of multiple inclined centering blocks 4. The wafer 5 slides down under the sliding action of the inclined sliding surface of each inclined centering block, so as to automatically align with the center of the support mechanism 2.

[0043] S3. Control the lifting drive mechanism 3 to descend, causing each tilting centering block 4 connected to the lifting drive mechanism 3 to descend, so as to transport the wafer 5 onto the support mechanism 2 until the descent is complete. After the descent is complete, the corresponding processing technology for the wafer 5 can begin.

[0044] Specifically, since wafer 5 automatically aligns with the center of support mechanism 2 under the sliding action of the inclined sliding surfaces of each inclined alignment block, there is no need to wait for detection by precision instruments such as sensors or repeated alignment actions. The lifting drive mechanism 3 can be controlled to descend immediately after receiving wafer 5. Alternatively, to further ensure the alignment effect, the lifting drive mechanism 3 can be controlled to descend after the preset time of step S2.

[0045] The technical solution provided by the embodiments of the present invention described above enables the received wafer to fall on the inclined sliding surface 4-1 of each inclined centering block. Under the action of the inclined sliding surface 4-1 of each inclined centering block, the wafer can automatically align with the center of the supporting mechanism. This achieves automatic alignment of the wafer during the wafer transport process, eliminating the need to rely on precise instruments such as sensors for alignment and center alignment detection. This simplifies the alignment action, shortens the action time, helps improve production efficiency, and thus increases production capacity.

[0046] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the invention.

[0047] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A wafer positioning device, characterized in that, The wafer alignment device includes a rotary drive mechanism, a support mechanism, and a wafer alignment device. The support mechanism is supported on the rotary drive mechanism, and the wafer alignment device includes: A lifting drive mechanism and a plurality of tilting centering blocks connected to the lifting drive mechanism support each tilting centering block in the outer region above the support mechanism via the lifting drive mechanism. The lifting drive mechanism is used to drive the lifting and lowering of each tilting centering block. The tilting sliding surface of each tilting centering block faces the center of the support mechanism and is at the same distance from the center of the support mechanism. The inclined sliding surface of the inclined centering block is specifically a curved surface that conforms to the shape of the wafer edge. The intersection of the curved surface and the horizontal plane is an arc, and the arc length of the arc gradually increases along the direction of free fall.

2. The wafer positioning device as described in claim 1, characterized in that, The wafer alignment device includes three or more tilted alignment blocks, wherein each tilted alignment block is evenly distributed in the peripheral area above the support mechanism.

3. The wafer positioning device as described in claim 1, characterized in that, The tilt angle of the tilted sliding surface of the tilted centering block ranges from 45 to 85 degrees.

4. The wafer positioning device as described in claim 1, characterized in that, The lifting drive mechanism includes: The unit comprises a lifting cylinder and multiple connecting rods. Each inclined centering block is connected to the lifting rod of the lifting cylinder through one end of the corresponding connecting rod. The other end of each connecting rod is provided with a fixed base, and the inclined centering block is installed on the corresponding fixed base.

5. The wafer positioning device as described in claim 4, characterized in that, The installation position of the tilting centering block relative to the fixed base is adjustable in the vertical and / or horizontal directions.

6. A semiconductor process apparatus, characterized in that, It includes: an equipment compartment and a wafer positioning device located within the compartment, wherein the wafer positioning device is as described in any one of claims 1-5.

7. A wafer positioning method based on the wafer positioning device according to any one of claims 1-5, characterized in that, include: Control the lifting drive mechanism to rise, thereby driving each of the tilting centering blocks connected to the lifting drive mechanism to rise to the target high position. The wafer is received in the target high position state, so that the wafer falls on the inclined sliding surface of the plurality of inclined centering blocks, and the wafer is aligned with the center of the support mechanism under the sliding action of the inclined sliding surface of each of the inclined centering blocks. The lifting drive mechanism is controlled to descend, causing each of the tilting centering blocks connected to the lifting drive mechanism to descend, so as to transport the wafer onto the support mechanism until the descent is completed.

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