Packaging architecture of power semiconductor devices

Abstract

The power semiconductor device packaging architecture of this invention belongs to the technical field of semiconductor power device mounting structures, and at least solves the technical problem of low heat dissipation efficiency of power devices in existing leadless structures. It includes a packaging container and a heat sink partially embedded in the top of the packaging container. The packaging container contains a heat dissipation component that can clamp or wrap the power device, is electrically connected to the power device, and is in contact with the heat sink. The heat generated by the power device during operation is transferred to the heat sink via thermal conduction through the heat dissipation component to cool or dissipate heat from the power device.

Description

Technical Field

[0001] This invention belongs to the technical field of semiconductor power device mounting structures, and particularly relates to a packaging architecture for power semiconductor devices. Background Technology

[0002] During switching operation, the power circuit inductance of power semiconductor devices generates a large induced electromotive force due to the high di / dt, causing the power device to experience additional and significant voltage stress. Furthermore, the parasitic inductance of the power module and the junction capacitance of the power device are prone to resonance, resulting in severe EMI problems.

[0003] To reduce the power circuit inductance of power devices, such as power chips, existing products have introduced leadless device packaging solutions. These solutions bring out the power connection terminals from the bottom (or collector) of the chip and directly mount them to the PCB. This can reduce the electrical stress of the power device and optimize its EMI. However, this packaging method does not have an independent heat dissipation surface, resulting in poor heat dissipation and failing to fully utilize the power capability of the power device.

[0004] In view of this, the present invention is hereby proposed. Summary of the Invention

[0005] The purpose of this invention is to provide a packaging architecture for power semiconductor devices, at least solving the technical problem of low heat dissipation efficiency in power devices due to leadless designs in the prior art. The technical solution of this invention has many beneficial effects, as described below:

[0006] A packaging architecture for a power semiconductor device is provided, suitable for heat dissipation of the power device, including a packaging container and a heat sink partially embedded in the top of the packaging container. The packaging container contains a heat dissipation component capable of clamping or enclosing the power device, and is electrically connected to the power device and in contact with the heat sink, wherein:

[0007] The heat generated by the power device during operation is transferred to the heat sink through the heat dissipation component by thermal conduction, so as to cool or dissipate heat from the power device.

[0008] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0009] The component provided in this case addresses the problem of poor heat dissipation in traditional leadless packaged devices. By setting up a heat dissipation component, the power device, such as a power chip, is connected to an external heat sink, such as an air-cooled / water-cooled heat sink, through a heat dissipation assembly. This effectively reduces the thermal resistance of the chip and increases the power output capability of the power device. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the heat dissipation component of the present invention;

[0012] Figure 2 This is a schematic diagram of the copper-clad ceramic substrate provided in this invention;

[0013] in:

[0014] 1. First metal substrate; 2. Power device; 3. Solder layer; 4. Metal heat-conducting sheet; 5. Heat sink; 6. Metal connector; 7. Second metal substrate; 8. Packaging container; 9. Copper-clad ceramic substrate; 10. First layer; 11. Second layer; 13. Notch. Detailed Implementation

[0015] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0016] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this invention, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0017] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. The drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0018] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that aspects can be practiced without these specific details. To enable those skilled in the art to better understand the invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise stated, "a plurality of" means two or more.

[0019] like Figure 1 The illustrated power semiconductor device packaging architecture, suitable for heat dissipation of the power device, includes a packaging container 8 and a heat sink 5 partially embedded in the top of the packaging container 8. The packaging container 8 uses materials commonly used in packaging semiconductor devices, such as a plastic packaging medium. A heat dissipation assembly is provided within the packaging container 8. This assembly can clamp or wrap the power device 2, is electrically connected to the power device 2, and is in contact with the heat sink 5. The heat generated by the power device 2 during operation is transferred to the heat sink 5 via thermal conduction through the heat dissipation assembly to cool or dissipate heat from the power device 2.

[0020] The present invention effectively reduces the thermal resistance of the chip and increases the power output capability of the power device 2 by setting up a heat dissipation component to connect one electrode of the power chip to the external heat sink 5 of the packaging container 8, such as air-cooled / water-cooled heat sink.

[0021] As part of the implementation provided in this case, the external pins of the power device 2 are not connected to the package container 8, so as to avoid the parasitic inductance and the junction capacitance of the power device 2 from easily resonating, thereby causing a more serious EMI problem.

[0022] The specific structure of the heat dissipation component is as follows: the heat dissipation component includes a metal heat-conducting sheet 4, a metal connector 6, a first metal substrate 1 and a second metal substrate 7. The first metal substrate 1 and the second metal substrate 7 are respectively embedded in the bottom of the packaging container 8 and have protruding sections. The first metal substrate 1 and the second metal substrate 7 are adjacent but do not contact each other.

[0023] The power device 2 is mounted on the top surface of the second metal substrate 7 and contacts the bottom surface of the heat sink 5 through the metal heat-conducting plate 4.

[0024] One end of the metal connector 6 is connected to the first metal substrate 1, and the other end is connected to the power device 2, for example, a metal connector strip or frame.

[0025] This configuration allows for heat dissipation from both sides of the power device 2. Figure 1 With the placement direction as a reference, the top surface of the power device 2 transfers heat from the power device 2 to the heat sink 5 through the metal heat-conducting sheet 4, and the bottom surface of the power device 2 dissipates heat through the first metal substrate 1 and the second metal substrate 7.

[0026] As part of the embodiments provided in this case, a method for fixing the power device 2 is provided. The heat dissipation assembly also includes a welding layer 3 or a sintering layer disposed on the upper and lower surfaces of the metal heat-conducting sheet 4, for fixing the metal heat-conducting sheet 4 to the bottom surface of the heat sink 5 and the power device 2 respectively.

[0027] Furthermore, the welded layer 3 or sintered layer on the bottom surface of the metal heat-conducting sheet 4 has a notch, which divides the welded layer 3 or sintered layer on the bottom surface of the metal heat-conducting sheet 4 into a first layer 10 and a second layer 11. The length of the second layer 11 is at least the same as the length or diameter of the metal heat-conducting sheet 4. One end of the metal connector 6 is connected to the first layer 10, and is conductive to the power device 2 through the first layer 10. The purpose of the notch is to insulate the second layer 11 from the power device 2, reduce the heat generated by the second layer 11 due to conductivity, and reduce the heat dissipation effect on the power device 2.

[0028] Among the real-time methods mentioned above, such as Figure 2 As shown, to further increase the heat conduction efficiency of the power device 2, a copper-clad ceramic substrate 9 is provided, specifically:

[0029] The copper-clad ceramic substrate 9 is placed between the second layer 11 and the metal heat-conducting sheet 4 to increase the heat conduction from the power device 2 to the metal heat-conducting sheet 4. The purpose is to increase the efficiency of heat transfer from the power device 2 to the metal heat-conducting sheet 4, and finally dissipate heat or cool down through the heat sink 5.

[0030] The aforementioned metal heat-conducting plate 4 is a thermally conductive copper pad or a thermally conductive copper sheet.

[0031] The product provided by this invention has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to the invention without departing from the principles of the invention, and these improvements and modifications also fall within the protection scope of the invention claims.

Claims

1. A packaging architecture for a power semiconductor device, adapted for heat dissipation from the power device, characterized in that, The application relates to a heat dissipation device, which comprises a packaging container and a heat sink partially embedded in the top end of the packaging container, wherein a heat dissipation assembly is arranged in the packaging container, the heat dissipation assembly can clamp or wrap a power device, can be in conduction with the power device and can be in contact with the heat sink, and no pin of the power device is arranged outside the packaging container; the heat dissipation assembly comprises a first metal substrate and a second metal substrate, which are embedded in the bottom of the packaging container respectively and have an extended section, and the first metal substrate and the second metal substrate are adjacent and not in contact. When the power device works, the heat generated by the power device is transmitted to the heat sink through the heat dissipation assembly in a heat conduction mode, so that the power device is cooled or radiated.

2. The package architecture of claim 1, wherein, The heat dissipation assembly further comprises a metal heat conduction sheet and a metal connecting piece. The power device is arranged on the top surface of the second metal substrate and is in contact with the bottom surface of the heat sink through the metal heat conduction sheet. One end of the metal connecting piece is connected with the first metal substrate, and the other end is connected with the power device.

3. The package architecture of claim 2, wherein, The heat dissipation assembly further comprises a welding layer or a sintering layer arranged on the upper and lower surfaces of the metal heat conduction sheet, which is used for fixing the metal heat conduction sheet to the bottom surface of the heat sink and the power device respectively.

4. The package architecture of claim 3, wherein, The welding layer or the sintering layer of the bottom surface of the metal heat conduction sheet is provided with an opening, the welding layer or the sintering layer of the bottom surface of the metal heat conduction sheet is divided into a first layer and a second layer by the opening, and the length of the second layer is at least the same as the length or diameter of the metal heat conduction sheet. One end of the metal connecting piece is connected with the first layer, and the metal connecting piece is in conduction with the power device through the first layer.

5. The package architecture of claim 4, wherein, A copper-clad ceramic substrate is further arranged between the second layer and the metal heat conduction sheet, which is used for increasing the conduction heat of the power device to the metal heat conduction sheet.

6. The package architecture of any one of claims 2-5, wherein, The metal heat conduction sheet is a heat-conducting copper pad.

7. The package architecture of claim 1, wherein, The packaging container is made of plastic.

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