Method for manufacturing electronic devices

Abstract

The application provides a manufacturing method of an electronic device, comprising: providing a package, the package having a first side, the first side having a first region and a second region adjacent to each other; providing a carrier to carry the package; forming a first shielding layer in the second region, and forming the first shielding layer in the first region by blocking the first shielding layer through the carrier. The above technical scheme of the application can at least avoid damage of the shielding layer.

Description

Technical Field

[0001] This invention relates to the field of electronic product technology, and more specifically, to a method for manufacturing an electronic device. Background Technology

[0002] With the rise of wearable devices, existing wearable devices have gradually evolved from single-function devices to multi-functional applications. Most of these devices have intelligent communication connectivity capabilities (such as Bluetooth, Wi-Fi, etc.) for real-time data transmission. Therefore, it is necessary to integrate chips with different functions into the package. In terms of packaging, processes such as double-sided device placement, molding, and sputtering can give the package structure the advantages of miniaturization, thinness, and small size.

[0003] During miniaturization, as the devices within a package become increasingly closer together, electromagnetic interference between them becomes more severe. Therefore, a shielding layer is needed to reduce this interference. For example... Figure 1 As shown, a shielding layer 13 is formed on a portion of the surface of the encapsulation 10 of the wearable device. Furthermore, the encapsulation 10 utilizes a connector 12 to form an external connection; the connector 12 can be, for example, a board-to-board connector or a hot bar. Therefore, a mask is needed to shield the connector 12 to prevent the shielding layer 13 from contacting the connector 12 and causing a short circuit.

[0004] Furthermore, since the package 10 has devices on both its top and bottom sides, shielding layers 13 are required on both sides of the package 10 to reduce electromagnetic interference. In typical designs, the substrate 19 is relatively thick, which cannot meet the aspect ratio requirements of the sputtering process, making it impossible to simultaneously form shielding layers on both sides of the package 10 in a single sputtering operation. Figure 1 As shown, if the shielding layer 13 is first formed on one side of the package 10, and then the package 10 is flipped over by using the pick-up device 15 to perform bonding and debonding operations, the shielding layer 13 may be scratched. Summary of the Invention

[0005] In view of the above-mentioned problems in related technologies, the present invention proposes a method for manufacturing electronic devices that can avoid damage to the shielding layer.

[0006] According to an embodiment of the present invention, a method for manufacturing an electronic device includes: providing a package having a first side, the first side having an adjacent first region and a second region; providing a carrier to carry the package; forming a first shielding layer in the second region, and blocking the formation of the first shielding layer in the first region by the carrier.

[0007] In some embodiments, the manufacturing method further includes forming a second shielding layer on a second side of the package opposite to the first side.

[0008] In some embodiments, a first shielding layer and a second shielding layer are formed simultaneously in the second region on the first side and on the second side.

[0009] In some embodiments, before forming the first shielding layer and the second shielding layer, the method further includes: providing a mask that covers the first region on the second side so that the second shielding layer is formed in the second region on the second side.

[0010] In some embodiments, providing a mask includes: setting one end of the mask on the package and setting the other end of the mask above the carrier.

[0011] In some embodiments, the carrier defines an opening that exposes a second region on the first side.

[0012] In some embodiments, a second shielding layer is formed on the second side before the first shielding layer is formed in the second region on the first side.

[0013] In some embodiments, after the second shielding layer is formed, the package and the carrier are flipped together to form the first shielding layer.

[0014] In some embodiments, prior to forming the first shielding layer, the method further includes providing a mask that covers the first region on the second side to form the second shielding layer in the second region on the second side.

[0015] In some embodiments, providing a mask includes: setting one end of the mask on the package and setting the other end of the mask on the carrier.

[0016] In some embodiments, a first shielding layer and a second shielding layer are formed simultaneously using a sputtering process.

[0017] In some embodiments, the package has a first molding compound in a second region on the first side.

[0018] In some embodiments, an opening is defined by a carrier, the opening exposing a first molding compound; the distance from the first molding compound to the carrier is greater than the depth of the opening.

[0019] In some embodiments, the distance from the first molding compound to the carrier is greater than 0.65 micrometers.

[0020] In some embodiments, the thickness of the carrier is less than the thickness of the first molding compound.

[0021] In some embodiments, the manufacturing method further includes providing a carrier to carry a carrier, wherein the carrier exposes a first molding compound of the package to simultaneously form a first shielding layer and a second shielding layer on a first side and a second side.

[0022] In some embodiments, the package has an external connector in a first region on the second side, and a second molding compound in a second region on the second side.

[0023] In some embodiments, the package further includes a reference line in a second region on the second side, and the second shielding layer is electrically connected to the reference line.

[0024] In some embodiments, the package is attached to the carrier by an adhesive layer.

[0025] In some embodiments, after the first shielding layer and the second shielding layer are formed, the carrier is removed; after the carrier is removed, the adhesive layer is removed.

[0026] The manufacturing method provided in the above embodiments of the present invention utilizes a carrier that supports the package as a mask to block the formation of the shielding layer. This eliminates the need for debonding after the formation of the single-sided shielding layer in existing processes, thus avoiding damage to the shielding layer. Attached Figure Description

[0027] The various aspects of the invention will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, according to standard industrial practice, the components are not drawn to scale. In fact, the dimensions of the components may be arbitrarily increased or decreased for clarity of discussion.

[0028] Figure 1 This is a schematic diagram of a shielding layer formed in the packaging structure of a wearable device in the prior art.

[0029] Figure 2 This is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0030] Figures 3a to 3f This is a schematic diagram of the various stages of an electronic device manufacturing method according to an embodiment of the present invention.

[0031] Figures 4a to 4e This is a schematic diagram of the various stages of an electronic device manufacturing method provided according to another embodiment of the present invention. Specific Implementation

[0032] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of elements and arrangements will be described below to simplify the invention. These are merely examples and are not intended to limit the invention. For example, in the following description, forming a first component above or on a second component can include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components such that the first and second components are not in direct contact. Furthermore, reference numerals and / or letters may be repeated throughout the various instances. Such repetition is for brevity and clarity only and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0033] This invention provides a method for manufacturing an electronic device. Figure 2 This is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present invention. Figure 2 As shown, the manufacturing method 20 of the electronic device includes step S22, providing a package having a first side. The first side has a first region and a second region disposed adjacent to each other. Then, the manufacturing method 20 proceeds to step S24, providing a carrier to carry the package. In step S26, a first shielding layer is formed in the second region of the first side, and the carrier prevents the first shielding layer from forming in the first region of the first side during the formation of the first shielding layer.

[0034] The manufacturing method provided in the above embodiments of the present invention utilizes a carrier that supports the package as a mask to block the formation of the shielding layer. This eliminates the need for debonding after the formation of the single-sided shielding layer in existing processes, thus avoiding damage to the shielding layer.

[0035] Figures 3a to 3f This is a schematic diagram of the various stages of an electronic device manufacturing method according to an embodiment of the present invention. Figures 3a to 3f The manufacturing method shown can be used to manufacture electronic devices including wearable devices, and can also be used to manufacture other types of electronic devices.

[0036] like Figure 3a As shown, Figure 3a Can correspond to Figure 2Step S22 of the manufacturing method in the present invention. A package 210 for an electronic device is provided. In some embodiments, the package 210 may be a package for a wearable device. The package 210 has a first side 220 (lower side) and a second side 250 (upper side) disposed opposite to the first side 220. The first side 220 includes a first region 222 and a second region 224 adjacent to each other. The first region 222 may be an edge region of the first side 220 and surrounds the second region 224. The second region 224 of the first side 220 corresponds to an area where a shielding layer is subsequently formed, and the first region 222 corresponds to an area where a shielding layer is not required. In other embodiments, the first region 222 and the second region 224 may have other suitable layouts.

[0037] The package 210 has a first molding compound 240 located in a second region 224 of a first side 220. An adhesive layer 235 may be provided at the edge of the first side 220. The adhesive layer 235 may be located in the first region 222. A portion of the adhesive layer 235 may also extend beyond the sidewall of the package 210. The adhesive layer 235 may be used for attachment to a subsequently provided carrier.

[0038] Furthermore, the second side 250 of the package 210 includes a first region 252 and a second region 254. The second region 254 of the second side 250 corresponds to the region where a shielding layer will be subsequently formed, and the first region 252 corresponds to the region where a shielding layer does not need to be formed. The first region 252 and the second region 254 may be arranged side-by-side adjacent to each other. The second region 254 may be located between two first regions 252 at their edges. The two first regions 252 may include opposing edge regions of the second side 250. In other embodiments, the first region 252 and the second region 254 may have other suitable layouts. In the illustrated embodiment, an external connector 265 is provided in the first region 252. In other embodiments, the first region 252 may have other types of components that do not require the formation of a shielding layer, or the first region 252 may not have any components.

[0039] The package 210 may also have a second molding compound 270 located in a second region 254 of the second side 250. A reference line 275 may also be provided in the second region 254, embedded in the second side 250 of the package 210 and exposed externally from the second side 250. In some embodiments, the reference line 275 is a ground line (GND). The reference line 275 may be disposed adjacent to the second molding compound 270. The reference line 275 may be disposed adjacent to the first region 252. The reference line 275 may be located between the second molding compound 270 and the external connector 265 in the first region 252. The reference line may also be disposed at other suitable locations.

[0040] like Figure 3b As shown, Figure 3b Can correspond to Figure 2 Step S24 of the manufacturing method: A carrier 290 is provided to carry the package 210. The carrier 290 is attached to the edge of a first side 220 of the package 210 via an adhesive layer 235. The opposing inner walls of the carrier 290 and the adhesive layer 235 together define an opening 295 that exposes a second region 224 of the first side 220 and exposes the molding compound 270 in the second region 254.

[0041] In some embodiments, the thickness of the carrier 290 is less than the thickness of the first molding compound 240. The surface of the first molding compound 240 may protrude relative to the surface of the carrier 290. The distance from the first molding compound 240 to the carrier 290 is S, and in some embodiments, S is greater than 0.65 micrometers. The opening 295 has a depth T, which is equal to the sum of the thickness of the carrier 290 and the thickness of the adhesive layer 235, and is also equal to the surface of the carrier 290 furthest from the first side 220. Figure 3b The distance between the lower surface of the first molding compound 240 and the first side 220. In some embodiments, the distance S from the first molding compound 240 to the carrier 290 is greater than the depth T of the opening 295. In some embodiments, the ratio S / T between the distance S from the first molding compound 240 to the carrier 290 and the depth T of the opening 295 is greater than 2. By configuring the thickness of the carrier 290, the aspect ratio of the opening 295 is allowed to meet the requirements of the sputtering process, thereby allowing the carrier 290 to be used as a mask to shield the first region 222 where a shielding layer does not need to be formed. In other embodiments, other suitable configurations may be made of the thickness of the carrier 290 and the size of the opening 295 to meet the requirements of the sputtering process.

[0042] Furthermore, a mask 280 is disposed on the carrier 290, which can shield the two first regions 252 of the second side 250 and expose the second region 254. The mask 280 is configured to form a cavity 285 between itself and the second side 250 of the package 210, and the external connector 265 in the first region 252 is located within the cavity 285. One end of the mask 280 is disposed on the second side 250 of the package 210 and may be disposed adjacent to the boundary between the first region 252 and the second region 254. The mask 280 extends across the adjacent edge of the package 210 and over the carrier 290, such that the other end of the mask 280 is disposed over the carrier 290, thereby shielding the first region 252. In the illustrated embodiment, the other end of the mask 280 is located on the adhesive layer 235 above the carrier 290.

[0043] In some embodiments, to fix the positions of the package 210, mask 280, and carrier 290, the mask 280 and carrier 290 may have corresponding alignment holes and alignment pins. The adhesive layer 235 can be used first to fix the position, and then the alignment holes and alignment pins can be used to align the mask 280 and carrier 290. The adhesive layer 235, in addition to fixing the position, can also be used to prevent overspray in subsequent sputtering processes. In some embodiments, the mask 280 may be made of a metallic material. The carrier 290 may include a magnetic material to increase the adhesion between the mask 280 and carrier 290, and further prevent overspray in subsequent sputtering processes.

[0044] like Figure 3c As shown, Figure 3c Can correspond to Figure 2 Step S26 of the manufacturing method. The first shielding layer 230 and the second shielding layer 260 are formed simultaneously using, for example, a sputtering process. In the sputtering process, the carrier 290 can be used as a mask to form the first shielding layer 230, so that the first shielding layer 230 is formed on the first molding compound 240 in the second region 224.

[0045] A second shielding layer 260, formed through a mask 280 disposed on the second side 250, covers the second molding compound 270. The second shielding layer 260 also extends continuously to the exposed surface of the reference route 275, covering and being physically and electrically connected to the reference route 275. In some embodiments, the second shielding layer 260 may not extend to the exposed surface of the reference route 275. In some embodiments, the second shielding layer 260 partially covers the exposed surface of the reference route 275. The second shielding layer 260 stops forming near the mask 280 and does not contact the mask 280. Because the mask 280 shields the external connector 265, it prevents the second shielding layer 260 from contacting the external connector 265 and causing a short circuit.

[0046] Optional, such as Figure 3d As shown, in some embodiments, a carrier 400 is provided to carry the carrier 290. Because the prior art does not require forming a shielding layer on the downward-facing side, the carrier will be thicker than the molding compound on the lower side, and the carrier for carrying the carrier will obscure the molding compound. In contrast to the prior art, the first molding compound 240 of the first side 220 of the package 210 can be fully exposed through the carrier 400. The opening width defined by the inner sidewall of the carrier 400 is greater than the width of the opening 395.

[0047] like Figure 3e As shown, after the first shielding layer 230 and the second shielding layer 260 are formed simultaneously, the mask 280 and the carrier 290 are removed. Then, as... Figure 3f As shown, remove the adhesive layer 235. Then perform FVI (finished visual inspection) to obtain the final electronic device.

[0048] Figures 4a to 4e This is a schematic diagram of the various stages of an electronic device manufacturing method provided according to another embodiment of the present invention.

[0049] like Figure 4a As shown, Figure 4a Can correspond to Figure 2 Step S22 of the manufacturing method in the present invention involves providing a package 310 for an electronic device. The package 310 has a first side 320 (lower side) and a second side 350 (upper side) disposed opposite to the first side 320. The first side 320 includes a first region 322 and a second region 324 adjacent to each other. The package 310 has a first molding compound 340 located in the second region 324. An adhesive layer 335 may be provided at the edge of the first side 320. Furthermore, the second side 350 of the package 310 includes a first region 352 and a second region 354. The second region 324 of the first side 320 and the second region 354 of the second side 350 correspond to regions where a shielding layer is to be subsequently formed, and the first region 322 of the first side 320 and the first region 352 of the second side 350 correspond to regions where a shielding layer does not need to be formed.

[0050] In the illustrated embodiment, an external connector 365 is provided in the first region 352. The package 310 may also have a second molding compound 370 located in the second region 354. A reference route 375 may also be provided in the second region 354, which is embedded in and exposed from the second side 350 of the package 310. Figure 4a Other aspects of the structure shown can be similar to those regarding... Figure 3a The description content.

[0051] like Figure 4b As shown, Figure 4b Can correspond to Figure 2 Step S24 of the manufacturing method: A carrier 390 is provided to carry the package 310. The carrier 390 is attached to the edge of the first side 320 of the package 310 via an adhesive layer 335. A mask 380 is disposed on the carrier 390, which can shield the two first regions 352 of the second side 350 and expose the second region 354. An external connector 365 is located below the mask 380. Figure 4b Other aspects of the structure shown can be similar to those regarding... Figure 3b The description content.

[0052] and Figures 3a to 3fUnlike the method described in which the first shielding layer 230 and the second shielding layer 260 are formed simultaneously, in this embodiment, the shielding layers on both sides are formed by performing two separate sputtering processes. Figure 4c As shown, a second shielding layer 360 is formed in a second region 354 of the second side 350 using, for example, a sputtering process, and a mask 380 is used to prevent the second shielding layer 360 from forming in the first region 352. The second shielding layer 360 is formed on the surface of the second molding compound 370 and extends along the surface of the second shielding layer 360 to the exposed surface of the reference line 375 for electrical connection. In some embodiments, the second shielding layer 360 may not be formed on the exposed surface of the reference line 375. The mask 380 prevents the second shielding layer 360 from contacting the external connector 365 and causing a short circuit.

[0053] refer to Figure 4d As shown, after the second shielding layer 360 is formed on the second side 350, the package 310 and the carrier 390 are flipped together, so that the first side 320 of the package 310 faces upward and the second side 350 faces downward. After flipping, the surface of the mask 380 away from the second side 350 protrudes relative to the surfaces of the second molding compound 370 and the second shielding layer 360. The mask 380 can be used to support the package 310.

[0054] refer to Figure 4e , Figure 4e Can correspond to Figure 2 Step S26 of the manufacturing method. For example, a first shielding layer 330 is formed in a second region 324 of a first side 320 of a package 310 by a sputtering process. The first shielding layer 330 is formed on the surface of a first molding compound 340. A carrier 390 can be used as a mask for forming the first shielding layer 330, such that the first shielding layer 330 is formed on the first molding compound 340 in the second region 324.

[0055] In the manufacturing method of the electronic device provided in this embodiment of the invention, during the formation of the first shielding layer and the second shielding layer, the carrier is configured with a suitable thickness to meet the requirements of the sputtering process, so that the first shielding layer and the second shielding layer can be formed simultaneously. Furthermore, during the formation of the first shielding layer 260, the carrier 290 can also serve as a mask. This improves equipment utilization, saves production time, and increases production capacity.

[0056] The foregoing summary outlines features of several embodiments that enable those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art should understand that other processes and structures can be readily designed or modified based on this invention to achieve the same objectives and / or benefits as the embodiments described herein. Those skilled in the art should also recognize that these equivalent structures do not depart from the spirit and scope of the invention, and that various changes, substitutions, and modifications can be made without departing from the spirit and scope of the invention.

Claims

1. A method for manufacturing an electronic device, characterized in that, include: A package is provided having a first side having adjacent first and second regions, wherein the second region is disposed between the two first regions; A carrier is provided to carry the package, wherein the package has a first molding compound in the second region on the first side; A first shielding layer is formed in the second region, and the carrier prevents the first shielding layer from forming in the first region; and A second shielding layer is formed on the second side of the package opposite to the first side. The carrier defines an opening that exposes a first molding compound. The distance from the first molding compound to the carrier is greater than the depth of the opening. The first shielding layer and the second shielding layer are formed simultaneously using a sputtering process. Furthermore, the package also has a reference path in the second region on the second side. The second shielding layer extends continuously to the surface of the exposed reference path, covering and physically and electrically connecting to the reference path. The method further includes, prior to forming the first and second shielding layers, providing a mask that shields the first region on the second side to allow the second shielding layer to be formed in the second region on the second side. Providing the mask includes: setting one end of the mask on the package and setting the other end of the mask above the carrier. The mask can shield two first regions on the second side and expose the second region, and the mask is configured to form a cavity between itself and the second side of the package, with external connectors in the first regions located within the cavity. Wherein, the ratio between the distance from the first molding compound to the carrier and the depth of the opening is greater than 2.

2. The manufacturing method according to claim 1, characterized in that, The carrier defines an opening that exposes the second region on the first side.

3. The manufacturing method according to claim 1, characterized in that, Also includes: A carrier is provided to carry the carrier, wherein the carrier exposes the first molding compound of the package to simultaneously form the first shielding layer and the second shielding layer on the first side and the second side.

4. The manufacturing method according to claim 1, characterized in that, The package has an external connector in the first region on the second side, and the package has a second molding compound in the second region on the second side.

5. A method for manufacturing an electronic device, characterized in that, include: A package is provided, the package having a first side having an adjacent first region and a second region; A carrier is provided to carry the package, wherein the package has a first molding compound in the second region on the first side; A first shielding layer is formed in the second region, and the carrier prevents the first shielding layer from forming in the first region; and A second shielding layer is formed on the second side of the package opposite to the first side. The carrier defines an opening that exposes a first molding compound. The distance from the first molding compound to the carrier is greater than the depth of the opening. The method further includes, prior to forming the first shielding layer and the second shielding layer, providing a mask that shields the first region on the second side to allow the second shielding layer to be formed in the second region on the second side. Providing the mask includes: setting one end of the mask on the package and setting the other end of the mask above the carrier. The mask can shield two first regions on the second side and expose the second region, and the mask is configured to form a cavity between itself and the second side of the package, with external connectors in the first regions located within the cavity. Wherein, the ratio between the distance from the first molding compound to the carrier and the depth of the opening is greater than 2. The package further includes a reference path in the second region on the second side, and a second shielding layer continuously extends to the exposed surface of the reference path, covering the reference path and being physically and electrically connected to it. Specifically, before forming the first shielding layer in the second region on the first side, the second shielding layer is formed on the second side, and after forming the second shielding layer, the package and the carrier are flipped together to form the first shielding layer.

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