Display device

Abstract

This disclosure generally relates to display devices. According to one aspect of this disclosure, the display device includes: a display panel configured to display an image on its front surface; a digitizer layer disposed on a rear surface of the display panel and configured to generate a magnetic field through a first electrode pattern and a second electrode pattern; and an adhesive layer disposed between the display panel and the digitizer layer and comprising SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3.

Description

Technical Field

[0001] This disclosure relates to display devices and methods of manufacturing them. More specifically, this disclosure relates to display devices having increased display quality and methods of manufacturing them. Background Technology

[0002] With the advancement of information-oriented society, the demand for display devices in various electronic devices has increased. For example, display devices are used in smartphones, digital cameras, laptops, navigation devices, and smart TVs.

[0003] Recently, there has been a demand for flexible display devices that offer wide screens while also providing portability and increased space utilization. For example, bendable display devices, rollable display devices, and foldable display devices have been released.

[0004] Furthermore, recent display devices support touch input from a part of the user's body (e.g., a finger) and touch input using an electronic pen (e.g., a stylus). Touch input using an electronic pen allows the display device to detect touch input with increased sensitivity and accuracy compared to touch input using a part of the user's body. However, due to varying heights caused by circuit wiring in the digitizer layer, the protective film disposed on the digitizer layer used for detecting touch input using an electronic pen can have an uneven shape. Accordingly, when the display device is not displaying an image, and when high-intensity light shines on the front surface of the display device, the user can perceive the uneven shape of the protective film on the front surface of the display device due to the wiring of the digitizer layer. Summary of the Invention

[0005] This disclosure provides a display device capable of preventing the user from perceiving uneven shapes of a protective film on its front surface. The uneven shape of the protective film can be caused by stepped portions of wiring in a digitizer layer on which the protective film is disposed, wherein the digitizer layer is configured to detect touch input from an electronic pen.

[0006] However, the aspects of this disclosure are not limited to those set forth herein. These and other aspects will become more apparent to those skilled in the art upon reference to the detailed description of this disclosure given below.

[0007] According to the display device of the embodiment, a semi-cured first adhesive layer is used to bond the digitizer layer to the rear surface of the panel protective film, such that even if the electrode pattern of the digitizer layer has stepped portions, the front surface of the first adhesive layer does not have an uneven shape. Therefore, the protective film provided on the first adhesive layer also does not have an uneven shape. Accordingly, when the display device is not displaying an image and high-intensity light shines on the front surface of the display device, it is possible to prevent the user from perceiving the uneven shape of the protective film caused by the stepped portions of the wiring of the digitizer layer on the front surface of the display device.

[0008] According to one aspect of the present invention, a display device includes: a display panel configured to display an image on its front surface; a digitizer layer disposed on a rear surface of the display panel and configured to generate a magnetic field through a first electrode pattern and a second electrode pattern; and an adhesive layer disposed between the display panel and the digitizer layer and comprising SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3.

[0009] The adhesive layer may include a reaction delay agent, wherein the reaction delay agent may include any one of triphenylphosphine, tributylamine, tetramethylethylenediamine, benzotriazole, ethynylene glycol, peroxide compounds, and maleic acid.

[0010] The display device may further include a pressure-sensitive adhesive layer disposed between the display panel and the adhesive layer.

[0011] The pressure-sensitive adhesive layer can have a thickness of 10 μm or less.

[0012] The display panel may include a folding area, a first non-folding area disposed on one side of the folding area, and a second non-folding area disposed on the other side of the folding area, wherein the folding area is bendable such that the first non-folding area faces the second non-folding area without damaging the display panel.

[0013] The pressure-sensitive adhesive layer may include a first pressure-sensitive adhesive layer that overlaps with a first non-folded area in the thickness direction of the display panel; and a second pressure-sensitive adhesive layer that overlaps with a second non-folded area in the thickness direction of the display panel, wherein the gap between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer overlaps with the folded area in the thickness direction of the display panel, and wherein the gap between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer may be smaller than the width of the folded area.

[0014] The display device may further include a shielding member disposed on the rear surface of the digitizer layer to shield the magnetic field of the digitizer layer.

[0015] The digital converter layer may include a substrate layer having a first electrode pattern disposed on its top surface and a second electrode pattern disposed on its bottom surface, wherein each first electrode pattern extends in a first direction and each second electrode pattern extends in a second direction intersecting the first direction.

[0016] The adhesive layer can have a storage modulus of 0.2 MPa or less at -20°C.

[0017] The adhesive layer can have a storage modulus of 0.5 MPa or less at -50°C.

[0018] Details of other exemplary embodiments will be included in the detailed description of the invention and the accompanying drawings.

[0019] Other features and embodiments will become apparent from the following detailed description, drawings and claims. Attached Figure Description

[0020] The above aspects and features, as well as other aspects and features of this disclosure, will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, wherein:

[0021] Figure 1 and Figure 2 A perspective view illustrating the display device according to an embodiment;

[0022] Figure 3 and Figure 4 A perspective view illustrating the display device according to an embodiment;

[0023] Figure 5 To explain Figure 1 An exploded perspective view of an example display device;

[0024] Figure 6 For along Figure 5 A cross-sectional view of the display device taken by line A-A';

[0025] Figure 7 for Figure 6 A cross-sectional view of the display panel;

[0026] Figure 8 For from Figure 6 An exploded perspective view of the first adhesive layer and the digital converter layer of the display device;

[0027] Figure 9 For along Figure 8 A cross-sectional view taken from line B-B';

[0028] Figure 10 This shows an example reaction in the first adhesive layer when UV irradiation is applied;

[0029] Figure 11 For along Figure 8 A cross-sectional view of the first adhesive layer taken by line B-B';

[0030] Figure 12 To display Figure 1 An exploded perspective view of another example of a display device;

[0031] Figure 13 For along Figure 8 A cross-sectional view of the first comparative example of the first adhesive layer taken by line B-B';

[0032] Figure 14 For along Figure 8 A cross-sectional view of the second comparative example of the first adhesive layer taken by line B-B';

[0033] Figure 15 A flowchart illustrating the process of forming the first adhesive layer according to an embodiment; and

[0034] Figures 16 to 19 For along Figure 8 The cross-sectional view taken along line B-B' illustrates a method for manufacturing a display device according to an embodiment. Detailed Implementation

[0035] The invention will now be described more fully below with reference to the accompanying drawings, which illustrate various embodiments. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are given to provide a thorough and complete disclosure and to ensure that this disclosure will fully convey the scope of the invention to those skilled in the art. The same reference numerals throughout the drawings may refer to the same elements.

[0036] It will be understood that when a component, such as a membrane, region, layer, or element, is referred to as being "on," "connected to," "attached to," or "adjacent to" another component, it may be directly on, connected to, attached to, or adjacent to the other component, or there may be intermediary components. It will also be understood that when a component is referred to as being "between" two components, it may be the only component between the two components, or there may be one or more intermediary components. It will also be understood that when a component is referred to as "covering" another component, it may be the only component covering the other component, or one or more intermediary components may also cover the other component. Furthermore, unless otherwise explicitly indicated, a covering component may partially, substantially, or completely cover the covered component. Other terms used to describe relationships between elements can also be interpreted in the same manner.

[0037] It will be further understood that, unless the context clearly indicates otherwise, the description of a feature or aspect in each embodiment may be used for other similar features or aspects in other embodiments.

[0038] In this article, unless the context clearly indicates otherwise, the description of a single component may also be applied to multiple identical components.

[0039] For ease of description, this document uses spatial relative terms such as “below,” “under,” “down,” “below,” “above,” “up,” etc., to describe the relationship between one element or feature and another element or feature illustrated in the figures. It will be understood that, in addition to the orientation depicted in the figures, spatial relative terms are also intended to encompass different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below,” “under,” or “below” other elements or features may then be oriented “above” other elements or features. Thus, the exemplary terms “below” and “below” can encompass both the above and below orientations. In this description, “when viewed in a plane” or “in a plan view” may be defined as viewed from a thickness direction (e.g., the “Z” direction); for example, “viewed from top to bottom.”

[0040] It will be understood that the terms “first,” “second,” “third,” etc., are used herein to distinguish one element from another, and the elements are not limited by these terms. Thus, an “first” element in one embodiment may be described as a “second” element in another embodiment.

[0041] In this document, when two or more elements or values ​​are described as substantially the same or approximately equal to each other, it should be understood that the elements or values ​​may be identical to each other, indistinguishable from each other, or distinguishable from each other but functionally identical as would be understood by one of ordinary skill in the art. Furthermore, it should be understood that although a parameter may be described herein as having “approximately” a certain value, depending on the implementation, the parameter may be precisely a certain value or approximately a certain value within a measurement error as would be understood by one of ordinary skill in the art.

[0042] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0043] Figure 1 and Figure 2 A perspective view illustrating a display device according to an embodiment. Figure 1 A perspective view illustrating a display device in its unfolded state according to an embodiment. Figure 2 A perspective view illustrating a display device in a folded state according to an embodiment.

[0044] exist Figure 1 and Figure 2In the first direction (e.g., the X-axis direction), there may be a direction parallel to a first side of the display device 10 in a plan view, and may be, for example, the horizontal direction of the display device 10. The second direction (e.g., the Y-axis direction) may be a direction parallel to a second side of the display device 10 that contacts the first side in a plan view, and may be, for example, the vertical direction of the display device 10. The first and second directions may intersect each other and cross a horizontal plane. For example, the first and second directions may be perpendicular to each other. The third direction (e.g., the Z-axis direction) may be the thickness direction of the display device 10.

[0045] In a plan view, the display device 10 may have a rectangular or square shape. In a plan view, the display device 10 may have a rectangular shape with right-angled corners or rounded corners. In a plan view, the display device 10 may include two short sides arranged in a first direction (e.g., the X-axis direction) and two long sides arranged in a second direction (e.g., the Y-axis direction).

[0046] The display device 10 includes a display area DA and a non-display area NDA. In a plan view, the shape of the display area DA may correspond to the shape of the display device 10. For example, in a plan view, when the display device 10 has a rectangular shape, the display area DA may also have a rectangular shape.

[0047] The display area DA may include multiple pixels to display an image. The multiple pixels may be arranged in a matrix along a first direction and a second direction. In a planar view, the multiple pixels may have rectangular, rhomboid, or square shapes, but their shapes are not limited to these. For example, the multiple pixels may have quadrilateral shapes other than rectangular, rhomboid, or square shapes; polygonal shapes other than quadrilateral shapes; circular shapes; or elliptical shapes.

[0048] The non-display area NDA may not contain pixels or display images. In a plan view, the non-display area NDA may be positioned around the display area DA. For example... Figure 1 and Figure 2 As shown, the non-display area NDA can surround the display area DA, but it is not limited to this. For example, the display area DA can be partially surrounded by the non-display area NDA.

[0049] The display device 10 may have a folded state and an unfolded state. For example... Figure 2 As shown, the display device 10 can be folded inwards, such that the display area DA is located on the inner side of the display device 10. For example, if the display device 10 is folded inwards, portions of the front surface of the display device 10 can face each other. Alternatively, the display device 10 can be folded outwards, such that the display area DA is located on the outer side. When the display device 10 is folded outwards, portions of the rear surface of the display device 10 can face each other.

[0050] The display device 10 may include a folding area FDA, a first non-folding area NFA1, and a second non-folding area NFA2. The folding area FDA may be an area in which the display device 10 is folded or bent, and the first non-folding area NFA1 and the second non-folding area NFA2 may be areas in which the display device 10 is not folded or bent.

[0051] The first non-folded region NFA1 may be defined on one side (e.g., the upper side) of the folded region FDA. The second non-folded region NFA2 may be defined on the other side (e.g., the lower side) of the folded region FDA. The folded region FDA, defined by the first fold line FL1 and the second fold line FL2, may be a curved region having a predetermined curvature in the folded state. The first fold line FL1 may be the boundary between the folded region FDA and the first non-folded region NFA1, and the second fold line FL2 may be the boundary between the folded region FDA and the second non-folded region NFA2.

[0052] like Figure 1 and Figure 2 As shown, the first fold line FL1 and the second fold line FL2 can extend in a first direction (e.g., the X-axis direction). In this case, the display device 10 can be folded in a second direction (e.g., the Y-axis direction). Accordingly, the length of the display device 10 in the second direction (e.g., the Y-axis direction) can be reduced to about half, providing increased portability and allowing the user to easily carry the display device 10.

[0053] like Figure 1 and Figure 2 As shown, when the first fold line FL1 and the second fold line FL2 extend in the first direction (e.g., the X-axis direction), the length of the folded region FDA in the second direction (e.g., the Y-axis direction) may be shorter than the length of the folded region FDA in the first direction (e.g., the X-axis direction). Furthermore, the length of the first non-folded region NFA1 in the second direction (e.g., the Y-axis direction) may be longer than the length of the first non-folded region NFA2 in the first direction (e.g., the X-axis direction). The length of the second non-folded region NFA2 in the second direction (e.g., the Y-axis direction) may be longer than the length of the second non-folded region NFA2 in the first direction (e.g., the X-axis direction). However, this disclosure is not limited to this, and the non-folded regions NFA1 and NFA2 may have substantially the same length in the first and second directions (e.g., the region may be square), or may have a longer length in the first direction than in the second direction.

[0054] Each of the display area DA and the non-display area NDA may overlap with at least one of the folded area FDA, the first non-folded area NFA1, and the second non-folded area NFA2. For example... Figure 1 and Figure 2It explains that the display area DA and the non-display area NDA each overlap with the folded area FDA, the first non-folded area NFA1, and the second non-folded area NFA2.

[0055] Figure 3 and Figure 4 A perspective view illustrating a display device according to an embodiment. Figure 3 A perspective view illustrating a display device in its unfolded state according to an embodiment. Figure 4 A perspective view illustrating a display device in a folded state according to an embodiment.

[0056] Figure 3 and Figure 4 Implementation methods and Figure 1 and Figure 2 The difference in the implementation is that the first fold line FL1 and the second fold line FL2 extend in a second direction (e.g., the Y-axis direction) and the display device 10 is folded in a first direction (e.g., the X-axis direction). Figure 3 The folding of the display device 10 allows its length in the first direction (e.g., the X-axis direction) to be reduced by approximately half, providing increased portability and allowing the user to easily carry the display device 10. Therefore, [the following will be omitted]. Figure 3 and Figure 4 Description of the implementation method.

[0057] Figure 5 To explain Figure 1 An exploded perspective view of an example display device. Figure 6 For along Figure 5 A cross-sectional view of the display device taken by line A-A'.

[0058] refer to Figure 5 and Figure 6 The display device 10 according to the embodiment includes a display panel 100, a polarizing film 200, a window 300, a window protective film 400, a panel protective film 500, a first adhesive layer 600, a digital converter layer 700, a shielding member 800, and a heat dissipation member 900.

[0059] Display panel 100 may be an organic light-emitting display panel using organic light-emitting diodes, a quantum dot light-emitting display panel including a quantum dot light-emitting layer, an inorganic light-emitting display panel including inorganic semiconductors, or a micro light-emitting display panel using miniature light-emitting diodes (LEDs). The following description applies to embodiments in which display panel 100 is an organic light-emitting display panel, but this disclosure is not necessarily limited thereto. Reference will be made later. Figure 7 The display panel 100 is described in detail.

[0060] A polarizing film 200 may be disposed on the front surface of the display panel 100. The front surface of the display panel 100 may be a display surface on which an image is displayed. The polarizing film 200 may be bonded to the front surface of the display panel 100 by a first adhesive member AD1. The first adhesive member AD1 may be, or include, for example, an optically transparent adhesive (OCA) film or an optically transparent resin (OCR). The polarizing film 200 may include a phase retardation film, such as a linear polarizer and / or a quarter-wavelength (λ / 4) plate.

[0061] Window 300 may be disposed on the front surface of polarizing film 200. Window 300 may be bonded to the front surface of polarizing film 200 by means of second adhesive member AD2. Second adhesive member AD2 may be, or include, for example, an optically transparent adhesive film or an optically transparent resin. Window 300 may be made of a transparent material and may include, for example, glass or plastic. For example, window 300 may be, but is not necessarily, ultrathin glass (UTG) with a thickness of 0.1 mm or less, or a transparent polyimide film.

[0062] A window protective film 400 may be applied to the front surface of the window 300. The window protective film 400 may be bonded to the front surface of the window 300 by a third adhesive member AD3. The third adhesive member AD3 may be, for example, an optically transparent adhesive film or an optically transparent resin. The window protective film 400 may perform at least one of the following functions on the window 300: anti-scattering, shock absorption, scratch resistance, fingerprint resistance, and anti-glare.

[0063] A light-shielding layer 410 may be disposed on the rear surface of the window protective film 400. The light-shielding layer 410 may be disposed on the edge of the window protective film 400. The light-shielding layer 410 may include a light-blocking material capable of blocking visible light. For example, the light-shielding layer 410 may contain organic or inorganic black pigments, such as carbon black.

[0064] A panel protective film 500 may be applied to the rear surface of the display panel 100. The panel protective film 500 may be adhered to the rear surface of the display panel 100 via a fourth adhesive member AD4. The fourth adhesive member AD4 may be or include a pressure-sensitive adhesive (PSA). The panel protective film 500 may support the display panel 100 and protect the rear surface of the display panel 100. For example, the panel protective film 500 may prevent cracks or other structural damage to the display panel 100. The panel protective film 500 may be a glass or plastic film, such as polyethylene terephthalate (PET).

[0065] Despite Figure 5 and Figure 6 The present invention describes that the panel protective film 500 is disposed in the folding area FDA, but the present disclosure is not limited thereto. For example, the panel protective film 500 may be removed from the folding area FDA to facilitate the smooth folding of the display device 10.

[0066] A first adhesive layer 600 may be disposed between the panel protective film 500 and the digitizer layer 700. The first adhesive layer 600 may be bonded to the digitizer layer 700 and the panel protective film 500 via a UV curing step. For example, the first adhesive layer 600 may be liquid-coated onto the digitizer layer 700 and semi-cured by ultraviolet (UV) irradiation. The panel protective film 500 may then be bonded to the semi-cured first adhesive layer 600. (See later...) Figure 9 and Figures 15 to 18 Describes a first adhesive layer 600 and a method of bonding a digital converter layer 700 and a panel protective film 500 using the first adhesive layer 600.

[0067] A digital converter layer 700 may be disposed on the rear surface of the panel protective film 500. The digital converter layer 700 may be bonded to the rear surface of the panel protective film 500 by a first adhesive layer 600.

[0068] The digitizer layer 700 may include electrode patterns configured to detect the approach or contact of an electronic pen (such as a stylus supporting electromagnetic resonance (EMR)). The digitizer layer 700 may detect magnetic or electromagnetic signals emitted from the electronic pen based on the electrode patterns and determine the point where the detected magnetic or electromagnetic signal is strongest as the touch coordinate. For example, the location where contact occurs between the stylus and the display panel may have the strongest magnetic or electromagnetic signal. See below for further details. Figure 8 and Figure 9 Describes digital converter layer 700.

[0069] A shielding member 800 may be disposed on the rear surface of the digitizer layer 700. The shielding member 800 contains magnetic metal powder, and therefore allows magnetic fields or electromagnetic signals passing through the digitizer layer 700 to flow into the shielding member 800. Thus, the shielding member 800 can suppress the emission of magnetic fields or electromagnetic signals to the rear surface of the display device 10.

[0070] A heat dissipation component 900 may be disposed on the rear surface of the shielding component 800. The heat dissipation component 900 may be or include a metal film with excellent thermal conductivity, such as a copper alloy, copper, nickel, ferrite, or silver. Accordingly, the heat generated by the display device 10 can be released to the outside through the heat dissipation component 900.

[0071] Figure 7 for Figure 6 A cross-sectional view of the display panel. Figure 7 An example of a cross-section of the display area of ​​a display panel is shown.

[0072] refer to Figure 7The first isolation layer BR1 can be disposed on the first substrate SUB1, the second substrate SUB2 can be disposed on the first isolation layer BR1, and the second isolation layer BR2 can be disposed on the second substrate SUB2.

[0073] The first substrate SUB1 and the second substrate SUB2 may each be made of an insulating material, such as a polymer resin. For example, the first substrate SUB1 and the second substrate SUB2 may be made of polyimide. The first substrate SUB1 and the second substrate SUB2 may each be a flexible substrate that can be bent, folded and rolled up without damage.

[0074] The first substrate SUB1 and the second substrate SUB2 are susceptible to moisture penetration. The first isolation layer BR1 and the second isolation layer BR2 protect the thin-film transistor ST and the light-emitting layer 172 of the light-emitting element 170 from moisture penetrating through the first substrate SUB1 and the second substrate SUB2. Each of the first isolation layer BR1 and the second isolation layer BR2 may include a plurality of inorganic layers stacked alternately. For example, each of the first isolation layer BR1 and the second isolation layer BR2 may include a multilayer in which one or more inorganic layers selected from silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide are stacked alternately.

[0075] A buffer layer BF may be disposed on the second isolation layer BR2. The buffer layer BF may include at least one inorganic layer. For example, the buffer layer BF may include one or more inorganic layers selected from silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide.

[0076] The thin-film transistor ST can be disposed on the buffer layer BF. The thin-film transistor ST may include an active layer ACT, a gate electrode G, a source electrode S, and a drain electrode D.

[0077] The active layer ACT, source electrode S, and drain electrode D may be disposed on the buffer layer BF. The active layer ACT may comprise polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or oxide semiconductor. The source electrode S and drain electrode D may be conductive by being formed from silicon semiconductor or oxide semiconductor doped with ions or impurities. The active layer ACT may overlap with the gate electrode G in a third direction (e.g., the Z-axis direction), and the source electrode S and drain electrode D may not overlap with the gate electrode G in a third direction (e.g., the Z-axis direction).

[0078] The gate insulating layer 130 may be disposed on the active layer ACT, source electrode S, and drain electrode D of the thin-film transistor ST. The gate insulating layer 130 may include an inorganic layer, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0079] The gate electrode G and the first capacitor electrode CAE1 may be disposed on the gate insulating layer 130. The gate electrode G may overlap with the active layer ACT in a third direction (e.g., the Z-axis direction). The first capacitor electrode CAE1 may overlap with the second capacitor electrode CAE2 in a third direction (e.g., the Z-axis direction). The gate electrode G and the first capacitor electrode CAE1 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0080] The first interlayer insulating layer 141 may be disposed on the gate electrode G and the first capacitor electrode CAE1. The first interlayer insulating layer 141 may include an inorganic layer, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating layer 141 may include multiple inorganic layers.

[0081] The second capacitor electrode CAE2 may be disposed on the first interlayer insulating layer 141. The second capacitor electrode CAE2 may overlap with the first capacitor electrode CAE1 in a third direction (e.g., the Z-axis direction). The first interlayer insulating layer 141 may have a predetermined dielectric constant, and as a result, a capacitor may be formed by the first capacitor electrode CAE1, the second capacitor electrode CAE2, and the first interlayer insulating layer 141 disposed between the first capacitor electrode CAE1 and the second capacitor electrode CAE2. The second capacitor electrode CAE2 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0082] The second interlayer insulating layer 142 may be disposed on the second capacitor electrode CAE2. The second interlayer insulating layer 142 may include inorganic layers, such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide. The second interlayer insulating layer 142 may include multiple inorganic layers.

[0083] The first anode connection electrode ANDE1 may be disposed on the second interlayer insulating layer 142. The first anode connection electrode ANDE1 may be connected to the drain electrode D via a first anode contact hole ANCT1 that penetrates the first interlayer insulating layer 141 and the second interlayer insulating layer 142 to expose the drain electrode D. The first anode connection electrode ANDE1 may overlap with the thin-film transistor ST portion in the thickness direction. The first anode connection electrode ANDE1 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0084] The first organic layer 160 can provide planarization and can be disposed on the first anode connection electrode ANDE1. The first organic layer 160 may include an organic layer, such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0085] The second anode connection electrode ANDE2 may be disposed on the first organic layer 160. The second anode connection electrode ANDE2 may be connected to the first anode connection electrode ANDE1 through a second anode contact hole ANCT2 that penetrates the first organic layer 160 to expose the first anode connection electrode ANDE1. The second anode connection electrode ANDE2 may partially overlap the first anode connection electrode ANDE1 in the thickness direction. The second anode connection electrode ANDE2 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys.

[0086] The second organic layer 180 may be disposed on the second anode connection electrode ANDE2. The second organic layer 180 may include an organic layer, such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0087] although Figure 7 This disclosure describes a top-gate method for forming a thin-film transistor (ST) where the gate electrode G is located above the active layer ACT, but the present disclosure is not limited to this. For example, the ST can be formed using a bottom-gate method where the gate electrode G is located below the active layer ACT, or a dual-gate method where the gate electrode G is located above and below the active layer ACT. For example, the implementation of the thin-film transistor can vary among embodiments of this disclosure depending on different manufacturing processes or display panel types.

[0088] The light-emitting element 170 and the dam 190 may be disposed on the second organic layer 180. Each light-emitting element 170 may include a first light-emitting electrode 171, a light-emitting layer 172, and a second light-emitting electrode 173.

[0089] The first light-emitting electrode 171 may be formed on the second organic layer 180. The first light-emitting electrode 171 may penetrate the second organic layer 180 and be connected to the second anode connection electrode ANDE2 via a third anode contact hole ANCT3 that exposes the second anode connection electrode ANDE2.

[0090] In the top-emitting structure in which light is emitted from the light-emitting layer 172 and the first light-emitting electrode 171 toward the second light-emitting electrode 173, the first light-emitting electrode 171 may include a metallic material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0091] A dam 190 may be formed on the second organic layer 180 to separate the first light-emitting electrode 171, thereby defining the emission regions RE, GE, and BE. The dam 190 may cover one or more edge portions of the first light-emitting electrode 171. The dam 190 may include an organic layer, such as an acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0092] Each of the emission regions RE, GE, and BE corresponds to a region in which the first light-emitting electrode 171, the light-emitting layer 172, and the second light-emitting electrode 173 are stacked sequentially, and in which holes from the first light-emitting electrode 171 and electrons from the second light-emitting electrode 173 combine with each other in the light-emitting layer 172 to emit light.

[0093] A light-emitting layer 172 is formed on the first light-emitting electrode 171 and the embankment 190. The light-emitting layer 172 may include an organic material that emits light of a predetermined color. For example, the light-emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer.

[0094] A second light-emitting electrode 173 is formed on the light-emitting layer 172. The second light-emitting electrode 173 may cover the light-emitting layer 172. The second light-emitting electrode 173 may be formed together in the emission regions RE, GE, and BE. A capping layer may be formed on the second light-emitting electrode 173.

[0095] In the top-emitting structure, the second light-emitting electrode 173 may include a transparent conductive material (TCO) capable of transmitting visible light, such as ITO or IZO; or a semi-transmissive conductive material, such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the second light-emitting electrode 173 is formed of a semi-transmissive conductive material, the luminous efficiency can be increased due to the microcavity effect.

[0096] An encapsulation layer TFE may be disposed on the second light-emitting electrode 173. The encapsulation layer TFE may include at least one inorganic layer to prevent oxygen or moisture from penetrating into the light-emitting element 170. In addition, the encapsulation layer TFE may include at least one organic layer to protect the light-emitting element 170 from foreign substances, such as dust. For example, the encapsulation layer TFE may include a first inorganic layer TFE1, an organic layer TFE2, and a second inorganic layer TFE3.

[0097] The first inorganic layer TFE1, the organic layer TFE2, and the second inorganic layer TFE3 can be disposed on the second light-emitting electrode 173. For example, the first inorganic layer TFE1 can be directly disposed on the second light-emitting electrode 173, the organic layer TFE2 can be directly disposed on the first inorganic layer TFE1, and the second inorganic layer TFE3 can be directly disposed on the organic layer TFE2. The first inorganic layer TFE1 and the second inorganic layer TFE3 may comprise one or more inorganic layers selected from silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide layers, stacked alternately, in a single layer or multiple layers. The organic layer TFE2 may comprise an organic layer, such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin.

[0098] Figure 8 for Figure 6 An exploded perspective view of the adhesive layer and the digital converter layer. Figure 9 For along Figure 8 A cross-sectional view taken from line B-B'.

[0099] refer to Figure 8 and Figure 9 According to the embodiments, the digital converter layer 700 may include a substrate layer 701, a first electrode pattern 702, a second electrode pattern 703, a first dummy pattern 704, a second dummy pattern 705, a second adhesive layer 706, a third adhesive layer 707, a first cover layer 708, and a second cover layer 709.

[0100] The substrate 701 may be elastic and may include an insulating material. For example, the substrate 701 may include polyimide.

[0101] The first electrode pattern 702 and the first dummy pattern 704 may be disposed on the front surface of the substrate layer 701. The second electrode pattern 703 and the second dummy pattern 705 may be disposed on the other surface of the substrate layer 701.

[0102] Each first electrode pattern 702 may extend along a first direction (e.g., the X-axis direction). Multiple first electrode patterns 702 may be arranged along a second direction (e.g., the Y-axis direction). In a plan view, each first electrode pattern 702 may have a ring-shaped structure.

[0103] Each second electrode pattern 703 may extend along a second direction (e.g., the Y-axis direction). Multiple second electrode patterns 703 may be arranged along a first direction (e.g., the X-axis direction). In a plan view, each second electrode pattern 703 may have a ring-shaped structure.

[0104] Each first electrode pattern 702 and each second electrode pattern 703 may intersect each other. Accordingly, the magnetic field or electromagnetic signal emitted from the electronic pen may be absorbed by the first electrode pattern 702 and the second electrode pattern 703, thereby allowing the display device 10 to determine the proximity position of the electronic pen relative to the digitizer layer 700.

[0105] Optionally, the first electrode pattern 702 and the second electrode pattern 703 can generate a magnetic field through an input current, and the generated magnetic field or electromagnetic signal can be absorbed by the electronic pen. The electronic pen can re-emit the absorbed magnetic field, and the magnetic field emitted by the electronic pen can be absorbed by the first electrode pattern 702 and the second electrode pattern 703. The first electrode pattern 702 and the second electrode pattern 703 can convert the magnetic field or electromagnetic signal output from the electronic pen into an electrical signal.

[0106] Each first dummy pattern 704 may extend in a first direction (e.g., the X-axis direction). Multiple first dummy patterns 704 may be arranged in a second direction (e.g., the Y-axis direction). The gap between the first dummy pattern 704 and the first electrode pattern 702 may be constant in the second direction (e.g., the Y-axis direction) of the first dummy pattern 704.

[0107] Each second dummy pattern 705 may extend in a second direction (e.g., the Y-axis direction). Multiple second dummy patterns 705 may be arranged in a first direction (e.g., the X-axis direction). The gap between the second dummy patterns 705 and the second electrode pattern 703 may be constant in the first direction (e.g., the X-axis direction) of the second dummy patterns 705.

[0108] The first electrode pattern 702, the first dummy pattern 704, the second electrode pattern 703, and the second dummy pattern 705 may contain metallic materials, such as copper (Cu), silver (Ag), nickel (Ni), or tungsten (W).

[0109] A second adhesive layer 706 may be disposed on the base layer 701, the first electrode pattern 702, and the first dummy pattern 704. A first cover layer 708 may be disposed on the second adhesive layer 706. The first cover layer 708 can be bonded to the base layer 701 via the second adhesive layer 706. The second adhesive layer 706 may be or include a pressure-sensitive adhesive. The first cover layer 708 may be elastic and may include an insulating material. For example, the first cover layer 708 may be polyimide.

[0110] A third adhesive layer 707 may be disposed on the base layer 701, the second electrode pattern 703, and the second dummy pattern 705. A second cover layer 709 may be disposed on the third adhesive layer 707. The second cover layer 709 may be bonded to the base layer 701 via the third adhesive layer 707. The third adhesive layer 707 may be or include a pressure-sensitive adhesive. The second cover layer 709 may be elastic and may include an insulating material. For example, the second cover layer 709 may be polyimide.

[0111] like Figure 8 According to Figure 8 and Figure 9 In one embodiment, the first adhesive layer 600 may be disposed on the first electrode pattern 702 and the first dummy pattern 704 of the digital converter layer 700. For example... Figure 9 As shown, the first adhesive layer 600 may be disposed on the first cover layer 708 of the digital converter layer 700.

[0112] The first adhesive layer 600 can be liquid-coated onto the digital converter layer 700. The first adhesive layer 600 can be liquid-coated by various methods, such as inkjet printing, ink injection, die coating, and die printing.

[0113] Because the first adhesive layer 600 is liquid-coated onto the digitizer layer 700, the front surface of the first adhesive layer 600 can flatten after a predetermined time period. This predetermined time period can be approximately 1 to 5 minutes. Accordingly, even if the electrode pattern of the digitizer layer 700 has stepped portions, such as portions with uneven thickness, the first adhesive layer 600 may not have an uneven shape. Correspondingly, the panel protective film 500 disposed on the first adhesive layer 600 may also not have an uneven shape. Accordingly, when the display device 10 according to this disclosure is not displaying an image and high-intensity light irradiates the front surface of the display device 10, it is possible to prevent unevenness in the panel protective film 500 caused by stepped portions of the wiring of the digitizer layer 700. Since the panel protective film 500 can have a uniform shape, the user may not perceive irregularities on the front surface of the display device 10. Accordingly, the display device 10 according to the present invention can have improved display quality.

[0114] After a predetermined time has elapsed since the application of the liquid first adhesive layer 600, the first adhesive layer 600 can be semi-cured by ultraviolet (UV) irradiation and bonded to the first cover layer 708 of the digital converter layer 700.

[0115] The first adhesive layer 600 may contain vinyl silane, hydrogen-containing silane, and a reaction delay agent. For example... Figure 10The diagram shows that when ultraviolet (UV) rays are irradiated onto the first adhesive layer 600, vinyl silane and hydrogen-containing silane can bond to form SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3. For example, under UV light, the hydrogen atom of the hydrogen-containing silane can transfer to the CH=CH2 atom of the vinyl silane, thereby bonding the two compounds. Accordingly, the first adhesive layer 600 can be cured.

[0116] Reaction retarders are used to inhibit the SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3 bond between vinylsilanes and hydrogen-containing silanes. For example, reaction retarders may include at least one of triphenylphosphine, tributylamine, tetramethylethylenediamine, benzotriazole, ethynylene glycol, peroxide compounds, and maleic acid.

[0117] Because the first adhesive layer 600 contains a reaction delay agent, it remains semi-cured for approximately 30 minutes to 1 hour after exposure to ultraviolet radiation. The first adhesive layer 600 maintains its adhesive strength in this semi-cured state. Therefore, the semi-cured first adhesive layer 600 can bond the digital converter layer 700 to the rear surface of the panel protective film 500.

[0118] As described above, the first adhesive layer 600 can be applied to the rear surface of the panel protective film 500 in a semi-cured state. For example, even if ultraviolet light is irradiated before the panel protective film 500 is applied to the front surface of the first adhesive layer 600, the first adhesive layer 600 can remain incompletely cured due to the reaction delay agent. In other words, the first adhesive layer 600 is semi-cured.

[0119] When the first adhesive layer 600 is made of a silicone resin containing SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3, its storage modulus can be low when maintained at a relatively low temperature of -20°C to -50°C. Because vinyl silanes and hydrogen-containing silanes bond to form SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3 upon irradiation with ultraviolet rays, the first adhesive layer 600 can have a low storage modulus at a relatively low temperature of -20°C to -50°C. Storage modulus refers to the elastic component of a material whose strain energy is stored as stress.

[0120] At -20°C, the first adhesive layer 600 may have a storage modulus of 0.2 MPa or less. At -50°C, the first adhesive layer 600 may have a storage modulus of 0.5 MPa or less. Accordingly, even at the relatively low temperatures of -20°C to -50°C, the first adhesive layer 600 can maintain a low storage modulus and is easily bendable at temperatures of -20°C to -50°C. When the storage modulus of the first adhesive layer 600 exceeds 0.2 MPa at -20°C or exceeds 0.5 MPa at -50°C, the display device 10 is less prone to bending.

[0121] The thickness of the first adhesive layer 600 can be from 10 μm to 50 μm. When the thickness of the first adhesive layer 600 is less than 10 μm, uneven heights can be generated on the front surface of the first adhesive layer 600 due to the wiring of the digital converter layer 700. However, when the thickness of the first adhesive layer 600 is greater than 50 μm, although the unevenness on the surface is minimized, the display device 10 including the first adhesive layer 600 is not easily bent.

[0122] Figure 11 To display along Figure 8 Another example of a cross-sectional view of the first adhesive layer cut by line B-B'.

[0123] refer to Figure 11 Display device 10 and Figure 9 The implementation differs in that it may include a first adhesive layer 600' and an adhesive auxiliary component AD. (Refer to...) Figure 11 In the description of this embodiment, the main description will be related to... Figure 9 The different implementation methods.

[0124] Due to the description and reference of the first adhesive layer 600' Figure 9 and Figure 10 The descriptions are basically the same, so the main description will be... Figure 11 Zhongyu Figure 9 The different implementation methods.

[0125] An adhesive aid component AD can be disposed on the front surface of the first adhesive layer 600' to improve the adhesive strength of the first adhesive layer 600. Therefore, even after the first adhesive layer 600' has been fully cured by ultraviolet radiation, the digital converter layer 700 can still be bonded to the rear surface of the panel protective film 500. Accordingly, the first adhesive layer 600' may not contain a reaction delay agent, and the manufacturing process time of the display device 10 can be reduced.

[0126] The adhesive auxiliary component AD can be a pressure-sensitive adhesive. The thickness of the adhesive auxiliary component AD can be 10 μm or less. When the thickness of the adhesive auxiliary component AD exceeds 10 μm, the display device 10 is less prone to bending.

[0127] Figure 12 To display Figure 1 An exploded perspective view of another example of a display device.

[0128] Figure 12 The display device 10 and Figure 5 and Figure 11 The implementation differs in that the adhesive auxiliary component AD includes a first adhesive auxiliary component AD_1 and a second adhesive auxiliary component AD_2. (Refer to...) Figure 12 In the description of the implementation method, the main description will be related to Figure 5 and Figure 11 The different implementation methods.

[0129] refer to Figure 12 A first adhesive aid member AD_1 is disposed in the first non-folded region NFA1, and a second adhesive aid member AD_2 is disposed in the second non-folded region NFA2. In a second direction (e.g., the Y-axis direction), the gap between the first adhesive aid member AD_1 and the second adhesive aid member AD_2 may be smaller than the width of the folded region FDA. Accordingly, the folding stress of the display device 10 can be reduced, and the display device 10 can be compared to... Figure 11 The implementation method is easier to bend.

[0130] Table 1 shows the test results obtained by manufacturing the display device 10 according to the first embodiment and the second embodiment, as well as the first comparative example and the second comparative example, of this specification. The test results in Table 1 are merely examples to facilitate understanding of this specification, and the scope of this disclosure is not limited thereto.

[0131] [Table 1]

[0132]

[0133] The first embodiment includes Figure 9 and Figure 10 The foldable display device 10 of the embodiment shown has a first adhesive layer 600. In the first embodiment, the thickness of the first adhesive layer 600 is set to 25 μm.

[0134] The second embodiment includes Figure 11 The foldable display device 10 is shown with a first adhesive layer 600'. In the second embodiment, the thickness of the first adhesive layer 600' is set to 25 μm, and the thickness of the adhesive auxiliary member AD is set to 5 μm.

[0135] The first comparative example includes, for example, Figure 13The foldable display device 10 shows the pressure-sensitive adhesive layer 600_1. In the first comparative example, the thickness of the pressure-sensitive adhesive layer 600_1 is set to 25 μm. However, in the first comparative example, the pressure-sensitive adhesive layer 600_1 differs from the first adhesive layer 600 of the first embodiment.

[0136] For example, the pressure-sensitive adhesive layer 600_1 can be a pressure-sensitive adhesive tape or a pressure-sensitive adhesive film. Therefore, due to the stepped portions of the electrode pattern in the digitizer layer 700, the pressure-sensitive adhesive layer 600_1 can be bonded in an uneven shape, and the panel protective film 500 disposed on the pressure-sensitive adhesive layer 600_1 can also have an uneven shape. Accordingly, when the display device 10 is not displaying an image and high-intensity light shines on the front surface of the display device 10, the uneven shape of the panel protective film 500 caused by the stepped portions of the wiring in the digitizer layer 700 on the front surface of the display device 10 can be visually perceived by the user.

[0137] like Figure 14 As shown in the figure, the second comparative example is a foldable display device 10 including a second addition-curable pressure-sensitive adhesive layer 600_2. In the second comparative example, the thickness of the second addition-curable pressure-sensitive adhesive layer 600_2 is set to 25 μm.

[0138] The second addition-curable pressure-sensitive adhesive layer 600_2 can be liquid-applied onto the digital converter layer 700. After the second addition-curable pressure-sensitive adhesive layer 600_2 is fully cured by irradiation with ultraviolet rays, it can be returned to a semi-cured state by thermal melting at a temperature of 80°C to 100°C. By applying the liquid second addition-curable pressure-sensitive adhesive layer 600_2 onto the digital converter layer 700, the front surface of the second addition-curable pressure-sensitive adhesive layer 600_2 can be flattened, similar to the first and second embodiments.

[0139] However, since the second addition-curable pressure-sensitive adhesive layer 600_2 has a storage modulus of 2 MPa (greater than 0.2 MPa) at temperatures of -20°C or lower, the display device 10 including the second addition-curable pressure-sensitive adhesive layer 600_2 is not easily bent when folded. Therefore, the second comparative example requires an additional pressure-sensitive adhesive to reduce the storage modulus at temperatures of -20°C or lower. Accordingly, according to Figure 14 The processing cost of the display device 10 in the second comparative example may increase.

[0140] Storage modulus was measured using a rheometer at -20°C and -50°C based on the shear rate of the adhesive layer.

[0141] The “Identification of Wiring” in Table 1 indicates whether the circuit wiring of the digital converter on the display surface of the display device is visually identifiable.

[0142] The surface quality of the front surface of the display device, indicating its flatness, was measured using Rhopoint Instruments' Optimap. Surface quality was measured as a curvature value K using a phase-stepped deflection (PSD) technique, which employs a white light source with wavelengths ranging from 1.0 mm to 3.0 mm. As the curvature value K decreases, the surface becomes flatter. A smaller curvature value K indicates a significantly reduced surface quality metric, suggesting a flatter surface.

[0143] In the folding test, the process of folding and unfolding the display device is defined as one cycle of the folding process, and the "folding frequency" is determined by performing the folding cycle until the display device's digital converter malfunctions.

[0144] Referring to Table 1, the first adhesive layer produced according to the first embodiment has a storage modulus of 0.1 MPa at -20°C and a storage modulus of 0.4 MPa at -50°C, and is therefore easily foldable. The display device produced according to the first embodiment is expected to be foldable approximately 400,000 times. Furthermore, there is no wiring identification that could occur due to the electrode pattern of the digitizer layer 700, and the surface quality is excellent.

[0145] The first adhesive layer produced according to the second embodiment has a storage modulus of 0.1 MPa at -20°C and a storage modulus of 0.4 MPa at -50°C, and is therefore easily foldable. Accordingly, the display device produced according to the second embodiment is expected to be foldable approximately 400,000 times. Furthermore, there is no wiring identification that could occur due to the electrode pattern of the digitizer layer 700, and the surface quality is increased.

[0146] Because the pressure-sensitive adhesive layer produced according to the first comparative example has a storage modulus of 2 MPa at -20°C and a storage modulus of 50 MPa at -50°C, the display device of the first comparative example is not easily bent. Accordingly, the display device produced according to the first comparative example is expected to be foldable approximately 200,000 times. Furthermore, due to the stepped portions of the wiring in the digitizer layer, the uneven shape of the panel protective film provided on the digitizer layer leads to wiring identification, and the surface quality is 1.8, which is 6 times greater than the surface quality of the first embodiment and the second embodiment; that is, the surface curvature is much greater than the surface curvature of the first embodiment and the second embodiment.

[0147] In the second comparative example, there is no wiring identification that could occur due to the electrode pattern of the digital converter layer, and the surface quality in the second comparative example is higher than that in the first comparative example. However, the second addition-curable pressure-sensitive adhesive layer produced according to the second comparative example has a storage modulus of 2 MPa at -20°C and a storage modulus of 38 MPa at -50°C, and is therefore not easily bent. Accordingly, the display device produced according to the second comparative example is expected to be foldable approximately 200,000 times.

[0148] As described with reference to Table 1, by applying a liquid first adhesive layer 600 onto the digitizer layer 700, the stepped portions on the front surface of the first adhesive layer 600, which can be generated by the stepped portions of the electrode pattern of the digitizer layer 700, can be flattened, thereby preventing uneven shapes of the panel protective film. Accordingly, wiring identification problems on the front surface of the display device 10 may be prevented. Furthermore, when SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3 is contained due to UV curing, the storage modulus is low at relatively low temperatures of -20°C to -50°C, and therefore, the display device can be easily bent when folded.

[0149] Figure 15 A flowchart illustrating the process of forming the first adhesive layer according to an embodiment. Figures 16 to 19 For along Figure 8 The cross-sectional view taken along line B-B' illustrates the method of manufacturing the display device according to the embodiment. Reference will be made below. Figures 16 to 19 Detailed description Figure 15 The process of forming the first adhesive layer.

[0150] First, such as Figure 16 The diagram shows that a liquid binder material 600F containing vinyl silane, hydrogen-containing silane, and a reaction retarder can be coated onto the digital converter layer 700. Figure 15 Step S110 in the process.

[0151] Second, such as Figure 17 As shown, because the adhesive material 600F is applied in liquid form onto the digital converter layer 700, the front surface of the first adhesive layer 600 can become flat over a predetermined period of time. The predetermined period of time can be approximately 1 to 5 minutes. Figure 15 Step S120 in the process.

[0152] Third, such as Figure 18The diagram shows that when ultraviolet rays irradiate the first adhesive layer 600, a reaction occurs between vinyl silane and hydrosilane, producing SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3. Accordingly, the first adhesive layer 600 can be cured. However, because the first adhesive layer 600 contains a reaction retarder, it can remain in a semi-cured state for 30 minutes to 1 hour after ultraviolet irradiation. Figure 15 Step S130 in the process.

[0153] Fourth, such as Figure 19 As shown, the panel protective film 500 can be disposed on the first adhesive layer 600. The panel protective film 500 can be disposed on the first adhesive layer 600 approximately 30 minutes to 1 hour after ultraviolet radiation has irradiated it. For example, the panel protective film 500 can be disposed on the first adhesive layer 600 in a semi-cured state before the first adhesive layer 600 is fully cured, so that the panel protective film 500 can adhere to the first adhesive layer 600. Figure 15 Step S140 in the process.

[0154] like Figures 15 to 19 As shown, a first adhesive layer 600 is liquid-coated onto a digitizer layer 700, allowing the front surface of the first adhesive layer 600 to flatten over a predetermined time period. When the first adhesive layer 600 is made of a silicone resin containing SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3 and further contains a reaction retarder, the first adhesive layer 600 can remain in a semi-cured state for approximately 30 minutes to 1 hour after irradiation with ultraviolet rays. Therefore, after the front surface of the first adhesive layer 600 flattens, the front surface of the first adhesive layer 600 can be bonded to the panel protective film 500. Thus, even if the electrode pattern of the digitizer layer 700 has stepped portions, the first adhesive layer 600 can remain free of unevenness. Correspondingly, the panel protective film 500 disposed on the first adhesive layer 600 can also remain free of unevenness. As a result, when the display device 10 does not display an image and high-intensity light shines on the front surface of the display device 10, it is possible to prevent the uneven shape of the panel protective film 500 caused by the stepped portion of the wiring of the digital converter layer 700 from being recognized by the user on the front surface of the display device 10.

[0155] Furthermore, when the first adhesive layer 600 is made of a silicone resin containing SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3, the first adhesive layer 600 can have a low storage modulus at a relatively low temperature of -20°C to -50°C. The first adhesive layer 600 can even maintain a low storage modulus at a relatively low temperature of -20°C to -50°C, making it easy to fold at this temperature range.

[0156] When a liquid first adhesive layer 600 is disposed between the digitizer layer 700 and the panel protective film 500 and cured by irradiation with ultraviolet rays, the digitizer layer 700 disposed on the bottom surface of the first adhesive layer 600 needs to be transparent to transmit ultraviolet rays. Furthermore, the panel protective film 500 disposed on the top surface of the first adhesive layer 600 and the display panel 100 needs to be transparent to transmit ultraviolet rays.

[0157] However, when the first adhesive layer 600 is made of a silicone resin containing SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3, the first adhesive layer 600 can remain in a semi-cured state for approximately 30 minutes to 1 hour after irradiation with ultraviolet rays because it contains a reaction delay agent. In this case, the panel protective film 500 can be bonded after the first adhesive layer 600 is liquid-coated onto the digitizer layer 700 and then semi-cured by irradiation with ultraviolet rays. Therefore, the digitizer layer 700 or the panel protective film 500 and the display panel 100 can be made of an opaque material that does not transmit ultraviolet rays.

[0158] Although the inventive concept has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of the inventive concept set forth in the appended claims.

Claims

1. A display device, the display device comprising: A display panel configured to display an image on its front surface; A digital converter layer is disposed on the rear surface of the display panel, wherein the digital converter layer is configured to generate a magnetic field using a first electrode pattern and a second electrode pattern; and An adhesive layer is disposed between the display panel and the digital converter layer, wherein the adhesive layer comprises SiOCH3CH3-CH2-CH2-SiCH3OCH3OCH3.

2. The display device according to claim 1, wherein the adhesive layer comprises a reaction delay agent, and The reaction delay agent mentioned above includes any one of triphenylphosphine, tributylamine, tetramethylethylenediamine, benzotriazole, ethynyl glycol, peroxide compounds, and maleic acid.

3. The display device according to claim 1, further comprising a pressure-sensitive adhesive layer between the display panel and the adhesive layer.

4. The display device according to claim 3, wherein the pressure-sensitive adhesive layer has a thickness of 10 μm or less.

5. The display device according to claim 3, wherein the display panel includes a folding area, a first non-folding area disposed on one side of the folding area, and a second non-folding area disposed on the other side of the folding area, wherein the folding area is bendable such that the first non-folding area faces the second non-folding area without damaging the display panel.

6. The display device according to claim 5, wherein the pressure-sensitive adhesive layer comprises: A first pressure-sensitive adhesive layer overlaps with the first non-folded area in the thickness direction of the display panel, and A second pressure-sensitive adhesive layer overlaps with the second non-folded area in the thickness direction of the display panel. The gap between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer overlaps with the folded area in the thickness direction of the display panel, and The gap between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is smaller than the width of the folded area.

7. The display device according to claim 1, further comprising a shielding member disposed on the rear surface of the digital converter layer to shield the magnetic field of the digital converter layer.

8. The display device of claim 1, wherein the digital converter layer comprises a substrate layer having a first electrode pattern disposed on its top surface and a second electrode pattern disposed on its bottom surface, and Each of the first electrode patterns extends in a first direction, and each of the second electrode patterns extends in a second direction intersecting the first direction.

9. The display device according to claim 8, wherein the adhesive layer has a storage modulus of 0.2 MPa or less at -20°C.

10. The display device according to claim 9, wherein the adhesive layer has a storage modulus of 0.5 MPa or less at -50°C.

Images