Display device

Abstract

According to an exemplary embodiment of the disclosure, there is provided a display device more stable against permeation of moisture and oxygen, the display device including a panel including a display area, a camera hole area, and a non-display area disposed between the display area and the camera hole area; a light emitting element and a plurality of transistors disposed on the panel and in the display area; an encapsulation layer disposed on the light emitting element and the transistors; and at least one camera hole, at least one connection guard portion, and at least one dam portion disposed in the camera hole area, wherein a respective dam portion of the at least one dam portion is disposed between a respective connection guard portion of the at least one connection guard portion and a respective camera hole of the at least one camera hole.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0161267, filed with the Korean Intellectual Property Office on November 26, 2020, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to display devices, and more specifically, to display devices having a camera hole. Background Technology

[0004] In recent years, with the advent of the information age, the field of display, which visually expresses electrical information signals, has developed rapidly. As a result, various display devices with excellent performance such as thinness, light weight and low power consumption have been developed.

[0005] Specific examples of such display devices may include liquid crystal display (LCD) devices, organic light-emitting diode (OLED) display devices, quantum dot display devices, etc.

[0006] Display devices can also include a display panel and multiple components for providing various functions. For example, in existing display devices, cameras and various optical sensors are located on the exterior of the display panel and perform a variety of functions, such as shooting, facial recognition, and infrared distance measurement. However, generation after generation, as so-called bezel-less or borderless designs where the display area appears completely intact when the user views the display device have become increasingly popular, the placement of cameras and optical sensors has become difficult. To achieve these bezel-less or borderless designs, methods for moving cameras and optical sensors into the effective area of ​​the display panel have been investigated. As a result of this research, a technique called hole-in display has been developed to house cameras and optical sensors within holes formed in the display panel.

[0007] With the development of in-display punch-hole technology and the relocation of cameras and sensors from the existing bezel area to the interior of the display panel area, extreme bezel-less or borderless designs can be applied. Summary of the Invention

[0008] The inventors of this disclosure have recently conducted research on reducing the space used for mounting cameras and various sensors in smart devices. To mount cameras and sensors, a portion of the front display area of ​​a smart device needs to be allocated to them, resulting in a reduction in the display area of ​​the display panel. Furthermore, given the trend of mounting more types of cameras and sensors on the front surface of the display area, there is a need to further overcome the limitations of the display area. For example, various accessories such as front wide-angle cameras, depth cameras, facial recognition sensors, and infrared distance measurement sensors have already been able to be mounted on the front surface of display devices, and the resulting expansion of the non-display area has the side effect of reduced aesthetics from the user's perspective. To mount cameras and sensors on the front surface while maintaining the display area, in-display perforations have been developed, but these have also had side effects. The inventors recognize that to achieve in-display perforations, it is necessary to prevent cracking and moisture penetration in the camera hole area, and various techniques are required for this.

[0009] Therefore, the inventors of this disclosure have invented a novel structure and a method for manufacturing the same to suppress the permeation of moisture and oxygen through an organic light-emitting stack. Additionally, for example, this novel structure can block cracks caused by heat transfer that occurs when a substrate is laser-cut.

[0010] For example, it has been demonstrated that when a laser irradiates a cut portion of a substrate, heat energy is transferred through the substrate and may cause deformation of the organic and inorganic insulating films continuously disposed from the display area. The resulting deformation gradually increases due to stress concentration at the defective portion, eventually leading to cracks. These cracks readily propagate through the insulating films, particularly inorganic ones, and may extend to the display area of ​​the display panel, resulting in deterioration of display performance. For example, according to embodiments of this disclosure, to suppress cracks caused by such deformation, the area where the organic or inorganic insulating film is removed can be set at a predetermined distance from the laser irradiation area. Therefore, even when the substrate is removed by laser, the substrate, having low thermal conductivity, absorbs all the generated heat energy and does not transfer it to the organic or inorganic insulating films, thus suppressing cracks caused by deformation of the insulating films.

[0011] It has been confirmed that when moisture permeates through an organic light-emitting layer (OLED) exposed in the area forming the camera aperture, the moisture exhibits the characteristic of reacting and propagating along the OLED. This propagated moisture reaches the pixels in the display area of ​​the display panel, leading to a degradation of display performance. The inventors have proposed a novel structure to suppress moisture transmission through the OLED. For example, by utilizing the properties of the OLED formed by chemical deposition, a region of breakage in the OLED can be provided near the camera aperture area. Therefore, the transmission of moisture and oxygen introduced from the camera aperture area to the display area in the display panel can be suppressed from the region of breakage in the OLED. By providing a region of breakage in the OLED near the camera aperture area, the transmission of moisture and oxygen to the display area of ​​the display panel can be suppressed.

[0012] For example, in an encapsulation layer used to protect organic light-emitting elements, overflow of the foreign material compensation layer into the camera aperture area can be suppressed. Structures designed to block interference between the camera and sensor to be positioned in the camera aperture and the foreign material compensation layer are configured to reduce defects such as contamination or lifting in the camera when combined with an upper substrate.

[0013] For the design of display panels with fewer or no bezels, which is a trend in the development of display devices, the focus will be on methods to suppress the degradation of display quality even when holes for placing cameras and sensors are set in the display area.

[0014] According to one aspect of this disclosure, a display device is provided, the display device comprising: a panel including a display area, a camera hole area, and a non-display area disposed between the display area and the camera hole area; a light-emitting element and a plurality of transistors disposed on the panel and in the display area; an encapsulation layer disposed on the light-emitting element and the transistors; and at least one camera hole, at least one connection protection portion, and at least one dam disposed in the camera hole area, wherein a corresponding dam in the at least one dam may be disposed between a corresponding connection protection portion in the at least one connection protection portion and a corresponding camera hole in the at least one camera hole.

[0015] According to another aspect of this disclosure, a display device is provided, comprising: a light-emitting element and a plurality of transistors disposed on a panel and in a display area; an encapsulation layer disposed on the light-emitting element and the transistors; a camera hole disposed in a camera hole area; at least one connection protection portion and at least one dam having a closed-loop structure surrounding the camera hole; and power lines and signal lines disposed in a non-display area, wherein a corresponding dam in the at least one dam may be disposed between a corresponding connection protection portion in the at least one connection protection portion and a corresponding camera hole.

[0016] Further details of exemplary embodiments are included in the detailed description and accompanying drawings.

[0017] According to an exemplary embodiment of the present disclosure, a display device may be provided in which a camera hole may be disposed in the display area of ​​the display panel, and thus the appearance of the entire display panel has a thin or narrow bezel.

[0018] Therefore, users of display devices can use aesthetically pleasing devices with a screen that emits light on the front surface of the display device, and by using a compact module applied to a functional narrow bezel, users can be provided with a better grip and lighter weight.

[0019] According to an exemplary embodiment of this disclosure, by forming multiple protective portions in the peripheral portion of the camera aperture, the penetration of moisture and oxygen introduced from the camera aperture can be suppressed. For example, the protective portions can block the movement path of moisture and oxygen by disconnecting the organic common layer, i.e., the light-emitting stack of the light-emitting elements disposed on the front surface of the display panel.

[0020] For example, referencing the deposition direction of the organic material with straightness in the organic material deposition process used to form the luminescent stack, the vertical structure of the protective portion is enhanced, allowing the sides of the protective portion to be elongated or their width to vary. On the sides of the protective portion structure that are different from or perpendicular to the deposition direction of the organic material, the organic material is either not laminated or can only be laminated unevenly. As a result, on the sides of the protective portion structure, the materials constituting the luminescent stack are either not laminated or are laminated unevenly to achieve structural separation.

[0021] For example, multiple dams can be placed near the protective section to suppress the overflow of the organic insulating layer of the encapsulation layer into the camera aperture. Multiple dams can suppress contamination of the camera aperture area and interference between the camera to be placed in the camera aperture area that may occur when the organic insulating layer overflows into the camera aperture.

[0022] For example, the protective structure can be positioned in multiple locations to block moisture and oxygen from seeping through the camera aperture, and the protective structure can have a superior effect in blocking moisture and oxygen by applying the advantages and disadvantages of each structure by changing the protective structure (such as a cone or an inverted cone).

[0023] The effects of this disclosure are not limited to those described above, and other effects not mentioned above will be clearly understood by those skilled in the art from the following description.

[0024] The invention disclosed in the above technical objectives, technical solutions and effects does not specify the features required by the appended claims. Therefore, the scope of the claims is not limited to the matters described in the invention. Attached Figure Description

[0025] The above and other aspects, features and advantages of this disclosure will become more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0026] Figure 1 This is a view showing the front surface of a display panel according to an exemplary embodiment of the present disclosure;

[0027] Figure 2 By magnification Figure 1 Area A shows a plan view of the display area;

[0028] Figure 3 It is along Figure 2 A cross-sectional view of the sub-pixel intercepted by line I-I';

[0029] Figure 4 By magnification Figure 1 Area B shows a magnified plan view of the camera aperture;

[0030] Figure 5 By magnification Figure 4 Region C shows a plan view of the outer portion of the camera aperture;

[0031] Figure 6 It is along Figure 5 A cross-sectional view of the camera hole region intercepted by line II-II';

[0032] Figure 7A By magnification Figure 6 The cross-sectional view of the structure obtained from region D;

[0033] Figure 7B By magnification Figure 7A The cross-sectional view of the structure obtained from region F;

[0034] Figure 8A By magnification Figure 6 The cross-sectional view of the structure obtained from region E;

[0035] Figure 8B By magnification Figure 8A The cross-sectional view of the structure obtained from region F;

[0036] Figure 9 It is along Figure 5 A cross-sectional view of another exemplary embodiment, taken by line II-II'; and

[0037] Figure 10 It is along Figure 5 A cross-sectional view of another exemplary embodiment, taken by line II-II'. Detailed Implementation

[0038] The advantages and features of this disclosure, as well as methods for achieving such advantages and features, will become clear from the following detailed description of exemplary embodiments and the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. Exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure. Therefore, this disclosure will be limited only by the scope of the appended claims.

[0039] The shapes, dimensions, ratios, angles, numbers, etc., shown in the accompanying drawings to describe exemplary embodiments of the present disclosure are merely examples, and the present disclosure is not limited thereto. Throughout the specification, similar reference numerals generally denote similar elements. Furthermore, in the following description of the present disclosure, detailed descriptions of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the disclosure. Unless used herein in conjunction with the term "only," terms such as "comprising," "having," and "consisting of" are generally intended to allow for the addition of additional components. Unless otherwise expressly stated, any reference to the singular may include the plural.

[0040] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0041] When using terms such as “on,” “above,” “below,” and “next to” to describe the positional relationship between two parts, one or more parts may be located between the two parts unless the term is used with the terms “immediately adjacent” or “directly.”

[0042] When using terms such as “after,” “follow,” “next,” and “before,” to describe the temporal order between two or more events, the two or more events may be discontinuous unless these terms are used in conjunction with the terms “immediately following” or “directly.”

[0043] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, in the technical concept of this disclosure, the first component referred to below can be the second component.

[0044] In describing the elements of this disclosure, terms such as “first,” “second,” “A,” “B,” “(a),” and “(b)” may be used. These terms are used only to distinguish one element from other elements, and the nature, sequence, order, or number of the corresponding elements are not limited by these terms. It will be understood that when an element is described as being “connected,” “coupled,” or “adhered” to another element or layer, the element may be directly connected, coupled, or adhered to the other element or layer, but other elements or layers may be “disposed” between elements, or elements may be “connected,” “coupled,” or “adhered” to each other through other elements.

[0045] In this disclosure, "display device" can include, in a narrow sense, display devices such as liquid crystal modules (LCMs), OLED modules, and quantum dot modules, which include a display panel and a driver for driving the display panel. Additionally, display devices can include device-type display devices, which include: laptop computers, televisions, computer monitors that are complete products or end products including LCMs, OLED modules, QD modules, etc.; automotive displays or other displays for vehicles; and set electronic devices or set equipment for mobile electronic devices such as smartphones and tablets.

[0046] Therefore, the display devices in this article can include the display devices themselves in the narrow sense, such as LCM, OLED modules, QD modules, etc., as well as application products or unit devices including LCM, OLED modules, QD modules, etc., as final consumer devices.

[0047] Furthermore, in some cases, LCM, OLED, and QD modules, which consist of display panels, drivers, etc., are narrowly referred to as "display devices," and electronic devices that include LCM, OLED, and QD modules as complete products can be separately referred to as "unit devices." For example, a display device in the narrow sense includes a liquid crystal (LCD) display panel, an organic light-emitting diode (OLED) display panel, or a quantum dot display panel, as well as a source PCB that serves as a controller for driving the display panel. A unit device can also be a concept that includes a unit PCB, which is an electrical connection to the source PCB to control the entire unit device.

[0048] The display panel used in the exemplary embodiments can be any type of display panel, such as a liquid crystal display (LCD) panel, an organic light-emitting diode (OLED) display panel, a quantum dot (QD) display panel, and an electroluminescent display panel. The display panel is not limited to a specific display panel with a flexible substrate for an OLED display panel in the exemplary embodiments and a backplate support structure underneath, capable of having a bendable bezel. Furthermore, the display panel used in the display device according to the exemplary embodiments of this disclosure is not limited to the shape or size of the display panel.

[0049] More specifically, in the case of an OLED display panel, the display panel may include multiple gate lines and data lines, as well as pixels formed in the intersection regions of the gate lines and data lines. Furthermore, the display panel can be configured by including: an array comprising thin-film transistors as elements for selectively applying voltage to each pixel; an OLED layer on the array; an encapsulation substrate or encapsulation layer disposed on the array to cover the OLED layer, etc. The encapsulation layer can protect the thin-film transistors and the OLED layer from external impacts and can suppress moisture or oxygen permeation into the OLED layer. Additionally, the layers formed on the array may include inorganic light-emitting layers, such as nanoscale material layers, quantum dots, etc.

[0050] In this disclosure, Figure 1 An OLED display panel 100, which can also be integrated into a display device, is shown.

[0051] Figure 1 This is a view showing a plan view of a display panel 100 according to an exemplary embodiment of the present disclosure. Figure 1 An OLED display panel 100, which can also be integrated into a display device, is shown. (See reference...) Figure 1 In the OLED display panel 100, the aperture CH of the camera and sensor is set within the display area AA to reduce the bezel area that is a non-display area and increase the display area AA (e.g., to maximize the display area AA). Products with a design that increases the display area AA (e.g., to maximize the display area AA) may be aesthetically more preferable by improving the user's screen immersion (e.g., to maximize the user's screen immersion).

[0052] The aperture CH of the camera and sensor can be as follows: Figure 1 The image shows one hole, but is not limited to this, and the hole CH can be set differently. For example, one or two holes can be set inside the display area AA, wherein the camera can be set in the first hole, and the distance sensor or face recognition sensor and wide-angle camera can be set in the second hole.

[0053] Figure 2 By magnification Figure 1The planar shape of the sub-pixels set in the display area AA is shown in region A, which is a part of the display area AA of the display panel 100.

[0054] exist Figure 2 In the display panel 100, multiple anodes (or anode electrodes) 151 are disposed in the display area AA, and embankments 154 may fill the area between the anodes 151. The embankments 154 may be configured to cover the edge portions of the anodes 151 and may be used to define the light-emitting area of ​​a sub-pixel by contacting only the middle portion of the anodes 151 with the organic light-emitting stack. Spacers 155 may be disposed in a portion of the area where the embankments 154 are disposed. The spacers 155 may be configured to have a predetermined density throughout the display panel 100. The spacers 155 may be used to support a mask such that when a deposition process is performed to form the organic light-emitting stack, the deposition mask used to cover or expose the organic layer of each sub-pixel does not directly contact the display panel 100. Figure 2 The example shown is a pentile-type planar structure where subpixels are set in the form of points, but it is not limited to this, and a real-type planar structure can also be applied.

[0055] Figure 3 Show along Figure 2 The cross-sectional structure of the sub-pixel intercepted by line I-I'.

[0056] Reference Figure 3 The sub-pixel may include a substrate 101, a multiple buffer layer 102, and a lower buffer layer 103, and a first transistor 120 may be disposed on the lower buffer layer 103. A first semiconductor layer 123 constituting the first transistor 120 and a lower gate insulating film 104 for insulating from the first gate electrode 122 on the first semiconductor layer 123 may be disposed. A first lower interlayer insulating film 105 and a second lower interlayer insulating film 106 may be sequentially disposed on the first gate electrode 122, and an upper buffer layer 107 may be disposed.

[0057] The multiple buffer layer 102 can delay the diffusion of moisture or oxygen into the substrate 101, and can be formed by at least one alternating lamination of silicon nitride SiNx and silicon oxide SiOx.

[0058] The lower buffer layer 103 can protect the first semiconductor layer 123 and can perform the function of blocking various types of defects introduced from the substrate. The lower buffer layer 103 can be formed of amorphous silicon, silicon nitride (SiNx), silicon oxide (SiOx), etc.

[0059] The first semiconductor layer 123 of the first transistor 120, such as a thin-film transistor, may be formed of a polycrystalline semiconductor layer, and the first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0060] Polycrystalline semiconductor layers have higher mobility than amorphous semiconductor layers and oxide semiconductor layers, resulting in lower power consumption and superior reliability. Due to these advantages, polycrystalline semiconductor layers can be used in driving transistors.

[0061] The first gate electrode 122 can be disposed on the lower gate insulating film 104 and can be configured to overlap with the first semiconductor layer 123.

[0062] The second transistor 130 can be disposed on the upper buffer layer 107, and the light-shielding layer 136 can be disposed below the region corresponding to the second transistor 130. (Refer to...) Figure 3 A light-shielding layer 136 is disposed on a first lower interlayer insulating film 105 in the region corresponding to the second transistor 130, and a second semiconductor layer 133 of the second transistor 130 may be disposed on the second lower interlayer insulating film 106 and the upper buffer layer 107 to overlap with the light-shielding layer 136. An upper gate insulating layer 137 for insulating the second gate electrode 132 from the second semiconductor layer 133 may be disposed on the second semiconductor layer 133, and subsequently, an upper interlayer insulating film 108 may be disposed on the second gate electrode 132. The first gate electrode 122 and the second gate electrode 132 may be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys, but are not limited thereto.

[0063] The first lower interlayer insulating film 105 and the second lower interlayer insulating film 106 can be formed from inorganic films having a higher hydrogen particle content than the upper interlayer insulating film 108. For example, the first lower interlayer insulating film 105 and the second lower interlayer insulating film 106 are made of silicon nitride (SiNx) formed in a deposition process using NH3 gas, and the upper interlayer insulating film 108 can be formed from silicon oxide (SiOx). The hydrogen particles included in the first lower interlayer insulating film 105 and the second lower interlayer insulating film 106 diffuse into the polycrystalline semiconductor layer during a hydrogenation process to fill the voids in the polycrystalline semiconductor layer with hydrogen. Therefore, the polycrystalline semiconductor layer can be stabilized to suppress the degradation of the characteristics of the first transistor 120. After the activation and hydrogenation process of the first semiconductor layer 123 of the first transistor 120, the second semiconductor layer 133 of the second transistor 130 can be formed, wherein the second semiconductor layer 133 can be formed from an oxide semiconductor. The second semiconductor layer 133 is not exposed to the high-temperature atmosphere of the activation and hydrogenation process of the first semiconductor layer 123, thereby suppressing damage to the second semiconductor layer 133 and improving reliability. After the upper interlayer insulating film 108 is formed, the first source contact hole 125S and the first drain contact hole 125D are formed to correspond to the source region and drain region of the first transistor, respectively, and the second source contact hole 135S and the second drain contact hole 135D can be formed to correspond to the source region and drain region of the second transistor 130, respectively. (Refer to...) Figure 3 The first source contact hole 125S and the first drain contact hole 125D can be continuously formed from the upper interlayer insulating film 108 to the lower gate insulating film 104, and the second transistor 130 can also form the second source contact hole 135S and the second drain contact hole 135D. The first source electrode 121 and the first drain electrode 124 corresponding to the first transistor 120, and the second source electrode 131 and the second drain electrode 134 corresponding to the second transistor 130 can be formed simultaneously. As a result, the number of processes required to form the source and drain electrodes of each of the first transistor 120 and the second transistor 130 can be reduced.

[0064] The first source electrode 121, the first drain electrode 124, the second source electrode 131, and the second drain electrode 134 can be made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or their alloys, in a single layer or multiple layers, but are not limited thereto. The first source electrode 121, the first drain electrode 124, the second source electrode 131, and the second drain electrode 134 can be formed of a three-layer structure. For example, the first source electrode 121 can be composed of a first layer 121a, a second layer 121b, and a third layer 121c, and the other source electrodes and drain electrodes can also have the same structure.

[0065] The storage capacitor 140 can be disposed between the first transistor 120 and the second transistor 130. For example... Figure 3 As shown, the storage capacitor 140 can be formed by overlapping the storage lower electrode 141 and the storage upper electrode 142, wherein a first lower interlayer insulating film 105 is placed between the storage lower electrode 141 and the storage upper electrode 142.

[0066] The storage lower electrode 141 is located on the lower gate insulating film 104 and can be formed on the same layer as the first gate electrode 122 using the same material. The storage upper electrode 142 can be electrically connected to the pixel circuit via the storage power supply line 143. The storage upper electrode 142 can be formed on the same layer as the light-shielding layer 136 using the same material. Such a storage upper electrode 142 is exposed through a storage contact hole 144 penetrating the second lower interlayer insulating film 106, the upper buffer layer 107, the upper gate insulating layer 137, and the upper interlayer insulating film 108 to connect to the storage power supply line 143. On the other hand, as Figure 3 As shown, the storage upper electrode 142 is spaced apart from the light-shielding layer 136, but they can also be formed in an integrated form that is interconnected. The storage power supply line 143 can be formed on the same plane as the first source electrode 121 and the first drain electrode 124 using the same material, or it can be formed on the same plane as the second source electrode 131 and the second drain electrode 134 using the same material. As a result, the storage power supply line 143 can be formed simultaneously with the first source electrode 121 and the first drain electrode 124 or the second source electrode 131 and the second drain electrode 134 using the same masking process.

[0067] On a substrate 101 on which a first source electrode 121 and a first drain electrode 124, a second source electrode 131 and a second drain electrode 134, and a storage power supply line 143 are formed, an inorganic insulating material such as SiNx or SiOx is completely deposited to form a protective film 109. A first planarization layer 110 may be formed on the substrate 101 on which the protective film 109 is formed. In particular, on the substrate 101 on which the protective film 109 is formed, an organic insulating material such as acrylic resin may be completely coated to form the first planarization layer 110.

[0068] A protective film 109 and a first planarization layer 110 are provided, and a contact hole exposing the first source electrode 121 or the first drain electrode 124 of the first transistor 120 can be formed by photolithography. A connection electrode 145 made of any one of Mo, Ti, Cu, Al, Nd, Al and Cr or an alloy thereof can be disposed in the contact hole region exposing the first drain electrode 124.

[0069] The second planarization layer 111 can be disposed on the connecting electrode 145, and a contact hole for exposing the connecting electrode 145 is formed in the second planarization layer 111, and a light-emitting element 150 connected to the first transistor 120 can be disposed thereon.

[0070] The light-emitting element 150 may include an anode electrode 151 connected to the first drain electrode 124 of the first transistor 120, at least one light-emitting stack 152 formed on the anode electrode 151, and a cathode electrode 153 formed on the light-emitting stack 152.

[0071] The light-emitting stack 152 may include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer, and in a series structure where multiple light-emitting layers overlap each other, charge generation layers may also be disposed between the light-emitting layers. In the case of the light-emitting layers, it is possible to emit different colors of light for each sub-pixel. For example, a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer may be formed for each sub-pixel separately. However, a common light-emitting layer is formed to emit white light, without color segmentation for each pixel, and color filters for separating colors may also be set separately. This can be divided into RGB type (real RGB type) and white OLED (WOLED). The light-emitting layers can be formed separately, but the injection layer or transport layer is set as a common layer and can be set equally for each sub-pixel.

[0072] The anode electrode 151 can be connected to the connection electrode 145 exposed through a contact hole penetrating the second planarization layer 111. The anode electrode 151 can be formed of a multilayer structure including an opaque conductive film and a transparent conductive film with high reflectivity. The transparent conductive film is made of a material with a relatively high work function, such as indium tin oxide (ITO) or indium zinc oxide (IZO), while the opaque conductive film is formed of a single-layer or multilayer structure including Al, Ag, Cu, Pb, Mo, Ti, or alloys thereof. For example, the anode electrode 151 can be formed in a structure in which the transparent conductive film, the opaque conductive film, and the transparent conductive film are sequentially stacked, or it can be formed in a structure in which the transparent conductive film and the opaque conductive film are sequentially stacked. Such an anode electrode 151 is disposed on the second planarization layer 111 so as to overlap not only with the light-emitting area disposed through the embankment 154, but also with the pixel circuit area in which the first transistor 120 and the second transistor 130 and the storage capacitor 140 are disposed, thereby increasing the light-emitting area.

[0073] The light-emitting stack 152 can be formed on the anode electrode 151 by sequentially or in reverse stacking the hole transport layer, the organic light-emitting layer, and the electron transport layer. In addition, the light-emitting stack 152 may also include a charge-generating layer and a first light-emitting stack and a second light-emitting stack facing each other, wherein the charge-generating layer is disposed between the first light-emitting stack and the second light-emitting stack.

[0074] The dam 154 can be formed to expose the anode electrode 151. The dam 154 can be formed of an organic material such as photoacrylic, but it can also be a translucent material, but is not limited thereto, and the dam 154 can be formed of an opaque material to suppress light interference between sub-pixels.

[0075] The cathode electrode 153 can be formed on the upper surface of the light-emitting stack 152 facing the anode electrode 151, wherein the light-emitting stack 152 is positioned between the cathode electrode 153 and the anode electrode 151. When the cathode electrode 153 is applied to a front-emitting type OLED display device, the cathode electrode 153 can be formed from a transparent conductive film by thinly forming indium tin oxide (ITO), indium zinc oxide (IZO), or magnesium silver (Mg-Ag).

[0076] An encapsulation layer 170 for protecting the light-emitting element 150 may be formed on the cathode electrode 153. Due to the properties of the organic material of the light-emitting stack 152, the light-emitting element 150 may react with external moisture or oxygen, potentially resulting in dark spots or pixel shrinkage. To suppress this problem, the light-emitting element 150 may be disposed on the cathode electrode 153. The encapsulation layer 170 may be configured with a first inorganic insulating film 171 (an example of a first inorganic insulating layer), a foreign matter compensation layer (e.g., an organic insulating film) 172 (an example of an organic insulating layer), and a second inorganic insulating film 173 (an example of a second inorganic insulating layer).

[0077] The touch portion 180 may be disposed on the upper part of the substrate 101 on which the encapsulation layer 170 is formed. The touch portion 180 may include a first touch planarization layer 181, a touch electrode 182, and a second touch planarization layer 183. The first touch planarization layer 181 and the second touch planarization layer 183 may be configured to remove the step at the point where the touch electrode 182 is disposed, and may be configured to be well electrically insulated from each other.

[0078] Figure 4 Is it magnification and Figure 1 A plan view of region B corresponding to the camera aperture region CHA. (Refer to...) Figure 4A large camera aperture CH for mounting the camera is located at the center, and the camera module can be housed within the camera aperture CH. The camera aperture region CHA can include the entire area surrounding the circular camera aperture CH, where the dam structure 300, connecting protection portion 200, etc., are disposed. The camera aperture CH can be removed using a laser during panel finishing steps. A non-display area NA can be positioned between the camera aperture region CHA and the display area AA, and can be provided with high-potential power lines PL, gate lines SL, etc. Specifically, the high-potential power lines PL and SL can be configured to surround at least a portion of the connecting protection portion 200 and the dam structure 300. When the camera aperture CH has a circular shape, the high-potential power lines PL and SL can have curved portions surrounding the dam structure 300 and the connecting protection portion 200. The dam structure 300 and the connecting protection portion 200 can be disposed around the camera aperture CH. (See reference...) Figure 4 The dam structure 300 can be composed of a first dam section 301 and a second dam section 302, and the connecting protective portion 200 can be composed of a first protective portion 210 and a second protective portion 220. The first dam section 301, the first protective portion 210, the second dam section 302, and the second protective portion 220 can be sequentially arranged around the camera hole CH. For example, the camera hole CH corresponding to the first dam section 301, the first protective portion 210, the second dam section 302, and the second protective portion 220, i.e., the camera hole CH arranged around the first dam section 301, the first protective portion 210, the second dam section 302, and the second protective portion 220, can be referred to as a "corresponding camera hole". Furthermore, for example, the protective portion corresponding to the dam section, i.e., the protective portion of the dam section arranged between the corresponding camera hole and the dam section, can be referred to as a "corresponding connecting protective portion" or "corresponding connecting protective portion", and correspondingly, the aforementioned dam section can be referred to as a "corresponding dam section" or "corresponding dam section". For example, a corresponding dam (e.g., a first dam 301 or a second dam 302) can be provided between a corresponding connecting protective portion (e.g., a first protective portion 210 or a second protective portion 220) and a corresponding camera hole CH. Typically, the dam structure can prevent the foreign matter compensation layer 172, which is part of the encapsulation layer outside the display panel 100, from flowing downwards to the outer end of the display panel 100, thereby maintaining adhesion between the upper and lower substrates constituting the display panel 100. The dam structure 300 of the camera hole region CHA can also be formed as multiple structures, such as a first dam 301 and a second dam 302, to prevent the foreign matter compensation layer 172 of the encapsulation layer 170 from intruding into or leaking into the camera hole region CHA, for the purpose of protecting the light-emitting element 150. The connecting protective portion 200 can be formed to suppress the penetration of moisture and oxygen by disconnecting the light-emitting stack 152. This disclosure proposes two dams, but is not limited thereto, and additional dams can be further provided depending on the spatial arrangement. (Refer to...) Figure 4The first protective portion 210 and the second protective portion 220 can be disposed inside the first dam portion 301 and the second dam portion 302. The first protective portion 210 and the second protective portion 220 can be disposed to protect the light-emitting element 150 in the display area from moisture and oxygen that may be introduced from the camera aperture CH. The light-emitting stack 152 for the light-emitting element 150 can be deposited on the front surface of the display panel 100, and can even be uniformly deposited in the camera aperture region CHA. Because of the high reactivity and dispersibility of the organic material to moisture and oxygen, the light-emitting stack 152 can transfer moisture and oxygen to the light-emitting element 150 in the display area AA. To suppress this problem, the first protective portion 210 and the second protective portion 220 can allow the light-emitting stack 152 to be partially disconnected. A detailed description of this will be given below. Figures 6 to 8B As described in the disclosure. Two disconnection structures have been described in this disclosure, but are not limited thereto.

[0079] Due to the arrangement of the camera aperture region CHA, the light-emitting elements 150 and pixel circuits in the corresponding area have been removed. However, the light-emitting elements 150 and pixel circuits located at the top, bottom, left, and right sides of the camera aperture region CHA need to be electrically connected to each other. Therefore, in the non-display area NA surrounding the camera aperture region CHA, high-potential power lines PL, gate lines SL, etc., can be configured to be connected to each other vertically and horizontally by bypassing the camera aperture region CHA.

[0080] Figure 5 It is magnification Figure 4 A plan view of region C in the camera aperture region CHA. (Refer to...) Figure 5 The first protective portion 210 can be disposed between the first dam section 301 and the second dam section 302, and the second protective portion 220 can be disposed on the side of the second dam section 302 opposite to the first protective portion 210 (e.g., Figure 5 (Left side of the image). The first protective portion 210 includes a first structure 211, a second structure 212, a third structure 213, and a fourth structure 214, and the second protective portion 220 may include a fifth structure 221, a sixth structure 222, a seventh structure 223, and an eighth structure 224. (See reference...) Figure 4 and Figure 5As can be seen, the first dam section 310, the second dam section 302, the first protective section 210, and the second protective section 220 are arranged in a closed loop around the camera aperture region CHA. Therefore, one or more of the first dam section 310, the second dam section 302, the first protective section 210, and the second protective section 220 can be formed continuously around the camera aperture CH without gaps, forming a closed loop when the camera aperture CH is circular. The reason for the closed loop arrangement of the first dam section 301, the second dam section 302, the first protective section 210, and the second protective section 220 is that if any part is penetrated, moisture and oxygen can permeate from the outside into the display area AA; or conversely, the foreign matter compensation layer 172 may overflow from the inside into the camera aperture region CHA, and further into the camera aperture CH. (Refer to...) Figure 5 The first protective portion 210 and the second protective portion 220 may each consist of four structures, but are not limited thereto. For example, the first protective portion 210 and the second protective portion 220 may each consist of five or more structures, and in addition to the first protective portion 210 and the second protective portion 220, other protective portions may be provided on the side of the first dam section 301 opposite to the first protective portion 210 (e.g., Figure 5 (the right side of the area), that is, the part adjacent to the camera aperture area CHA. In addition to the first dam 301 and the second dam 302, another dam may be provided on the side of the second protective portion 220 opposite to the second dam 302 (e.g., Figure 5 The non-display area NA (on the left side of the image). The first to eighth structures 211, 212, 213, 214, 221, 222, 223 and 224 included in the first and second protective portions may have linewidths of approximately 3 μm to 10 μm, but are not limited thereto.

[0081] Figure 6 It is shown Figure 5 A cross-sectional view of the structure of the camera aperture region CHA II-II'. A first dam 301 and a second dam 302 are arranged in a closed loop around the camera aperture region CHA. A first protective portion 210 is disposed between the first dam 301 and the second dam 302, and correspondingly, a second protective portion 220 may be arranged in a closed loop on the other side surface of the second dam 302. (Refer to...) Figure 6The camera aperture CH can be located on the right side of the first dam portion 301. The camera aperture region CHA can include at least one connecting protective portion having one or more structures, each structure having a first portion and a second portion above the first portion, the first portion having a first width and the second portion having a second width greater than the first width. Due to the structure of at least one connecting protective portion, the display device can include a first portion of a light-emitting stack 152 disposed adjacent to the side surface of the connecting protective portion and a second portion of the light-emitting stack 152 disposed on the top surface of the connecting protective portion, wherein the first portion and the second portion are disconnected.

[0082] Specifically, such as Figure 6As shown, the first protective portion 210 may include a first structure 211 to a fourth structure 214. The first structure 211 to the fourth structure 214 may be formed as a two-tiered structure for disconnecting the upper and lower portions of the light-emitting stack 152, which may be a permeation path for moisture from the side and upper portions through the camera aperture CH, and an undercut structure may be formed on the side surface of the upper portion. Specifically, the upper portion of the first structure 211 to the fourth structure 214 may be configured with a tapered trapezoidal cross-section, and the lower portion of the first structure 211 to the fourth structure 214 may be configured with a quadrilateral cross-section having a predetermined height close to the tapered or vertical side surface. As a result, the width or area between the lower surface of the upper portion and the upper surface of the lower portion, which is the point where the upper and lower portions meet, may differ. Since the upper surface of the lower portion may be narrower than the lower surface of the upper portion, an undercut structure in which a portion of the lower surface of the upper portion is exposed can be formed. As a result, the undercut structure of the upper tip side surface of the first structure 211 to the fourth structure 214 can disconnect the light-emitting stack 152 deposited on the front surface of the display panel 100. The second protective portion 220 may include the fifth structure 221 to the eighth structure 224. The fifth structure 221 to the eighth structure 224 constituting the second protective portion 220 may be formed as a two-tiered structure with an upper and a lower part, just like the first structure 211 to the fourth structure 214. Due to the organic insulating film 172 disposed on the second protective portion 220, it is difficult for moisture and oxygen to penetrate from the upper part, and in order to mainly block the path of penetration from the side part forming the camera hole CH or the first protective portion 210, the fifth structure 221 to the eighth structure 224 may be formed as an inverted conical structure. In particular, the lower part of the fifth structure 221 to the eighth structure 224 is provided with a trapezoidal cross section including a conical side surface, and the upper part of the fifth structure 221 to the eighth structure 224 may be provided with a structure that reverses the lower cross section by including an inverted conical side surface. When the upper surface of the lower part and the lower surface of the upper part may be similar to each other in width or area, as a result, the fifth structure 221 to the eighth structure 224 can have a structure that resembles a large mortar or hourglass in cross-section. Due to the arrangement of the first protective portion 210 and the second protective portion 220, moisture and oxygen can be blocked from penetrating through the light-emitting stack 152 to the light-emitting element 150 of the active region AA in the camera hole region CHA. The camera hole region CHA can vary depending on the size of the camera applied to the product, and the corresponding area is shown as an empty space, but some insulating film or wiring structure can be provided. However, since the camera hole region is a pseudo-region that is not retained in the finished product when the camera hole region CHA is removed using a laser, it is omitted from separate representation. The laser can irradiate along the shape of the camera hole region CHA in a circular or elliptical manner, and all areas including the upper part of the substrate 101 can be removed by laser irradiation.The actual camera aperture region (CHA) and the laser irradiation area can be different from each other; for example, the laser irradiation area within the camera aperture region (CHA) can be an internal region of approximately 100 μm. Therefore, the insulating layer of the camera aperture region (CHA) will not be damaged during laser irradiation only when a difference exists between the laser irradiation area and the camera aperture region (CHA). The laser can be a picosecond laser or a femtosecond laser, but is not limited to these. Lasers use light that is amplified by adding energy to a specific material, and due to the directionality of monochromatic light and properties such as propagation, lasers have been used for communication, medical, and industrial applications. When using a laser, patterns can be formed in a desired area or specific areas can be easily removed. Lasers use energy to form or remove patterns, and when the laser energy irradiates an object, the object is thermally melted to form a pattern. As the laser irradiation time increases, a thermal effect may occur near the area where the pattern is formed. Under such a thermal effect, heat accumulates around the laser irradiation area of ​​the object, and therefore, surrounding areas larger than the set pattern may burn or deform due to heat. Due to the characteristics of such lasers, if the laser irradiation area overlaps with or is adjacent to the insulating film, the thermal energy of the laser may even cause deformation within the insulating film. Cracks may form due to this deformation, and these cracks can propagate through the insulating film, potentially resulting in delamination or the penetration of moisture and oxygen. For example, to suppress deformation or delamination on insulating films such as the multi-buffer layer 102, lower buffer layer 103, first lower interlayer insulating film 105, second lower interlayer insulating film 106, upper buffer layer 107, and upper interlayer insulating film 108, the insulating film can be completely removed at a distance of approximately 100 μm from the laser irradiation location. When the insulating film is completely removed, the insulating film and the side surfaces of the substrate 101 may be exposed, but the first inorganic insulating film 171 and the second inorganic insulating film 173 of the encapsulation layer 170 can cover the side surfaces. See reference. Figure 6The total width of the first dam section 301 and the second dam section 302 can be approximately 50 μm, and can have a cap-like structure in which the left and right surfaces have gentle slopes, but the core area has a steep slope. For example, the width of the dam section can be approximately 30 μm to 60 μm, but is not limited to this. In this case, the width of the core area with the steep slope can be approximately 25 μm, but is not limited to this. The first dam section 301 and the second dam section 302 can be formed by stacking the second leveling layer 111, the embankment 154 and the spacer 155, but is not limited to this, and may also include the first leveling layer 110 or other layers. The first to fourth structures 211, 212, 213 and 214 constituting the first protective part 210 can be made of organic or inorganic materials. For example, the upper portion 211a of the first structure 211 can be made of the same material as the first planarization layer 110 or the second planarization layer 111, and the lower portion 211b of the first structure 211 can be made of the same material as the upper interlayer insulating film 108. The fifth to eighth structures 221, 222, 223, and 224 constituting the second protective portion 220 can be made of organic or inorganic materials. For example, the upper portion 221a of the fifth structure 221 can be made of the embankment 154 or a separate organic material, and the lower portion 221b of the fifth structure 221 can be made of the same material as the upper interlayer insulating film 108.

[0083] The first protective portion 210 and the second protective portion 220 are structurally different to compensate for the advantages and disadvantages of each. The first protective portion 210 can be configured as a conical structure, wherein the upper edge of this structure can be extended to block moisture and oxygen from above, even without the camera aperture CH or the organic insulating film 172. The upper part of the second protective portion 220 can be formed as an inverted conical structure to effectively block the penetration path from the camera aperture CH or the first protective portion 210, even without a moisture or oxygen penetration path at the upper side due to the organic insulating film 172 disposed on the upper part of the second protective portion 220. Figure 7A , Figure 7B , Figure 8A and Figure 8B Describe the advantages and disadvantages of these structures in more detail.

[0084] The encapsulation layer 170 can be disposed in the same manner as the display area AA on the area in which the first dam 301, the second dam 302, and the first protective portion 210 are disposed, and can include a first inorganic insulating film 171, a foreign matter compensation layer 172, and a second inorganic insulating film 173. However, the foreign matter compensation layer 172 can be disposed only in a portion of the area surrounding the second dam 302, and may not be disposed in the area reaching the first dam 301.

[0085] The first touch planarization layer 181 and the second touch planarization layer 183 can be disposed on the encapsulation layer 170.

[0086] Figure 7A Yes Figure 6 An enlarged cross-sectional view of region D of the first protective portion 210. The first protective portion 210 may include first structures 211 to fourth structures 214, and each structure may be formed by combining upper and lower structures. For example, the upper portion of the first structure 211 may refer to a first upper portion 211a, and the lower portion of the first structure 211 may refer to a first lower portion 211b. The upper and lower portions of the first structures 211 to fourth structures 214 are configured to have a trapezoidal cross-section including tapered side surfaces, so as to have a width difference or area difference on the lower surface of the upper portion and the upper surface of the lower portion at the point where the upper and lower portions meet. For example, the lower portion may have a first tapered shape in which the width of the lower portion gradually increases or gradually increases toward the substrate, and the upper portion may have a second tapered shape in which the width of the upper portion gradually increases or gradually increases toward the lower portion. For example, at least one of the first structures 211 to fourth structures 214 may have a lower portion and an upper portion located on the lower portion, wherein the side surface of the upper portion protrudes beyond the side surface of the lower portion. Because the upper surface of the lower part can be narrower than the lower surface of the upper part, the protruding side surface of the upper part can form an undercut structure in which a portion of the lower surface of the upper part is exposed. However, the structure of the lower part is not limited to a tapered shape and can also be a vertical structure without a tapered shape. (See reference...) Figure 7A As can be seen, the light-emitting stack 152 deposited on the front surface of the display panel 100 is disconnected from the upper tip side surfaces of the first structure 211 to the fourth structure 214, and the light-emitting stack 152 is formed around the lower side surfaces of the first structure 211 to the fourth structure 214. The light-emitting stack 152 is formed on the front surface of the display panel 100 by a chemical deposition method, wherein the chemical deposition method is a method of deposition based on the flatness of the organic material. Due to the characteristic of the light-emitting stack 152 having poor step coverage, in places where there is an undercut structure due to the width difference or area difference between the upper lower surface and the lower upper surface, there may be spaces in a portion of the upper lower surface and the lower side surface where the light-emitting stack 152 may not be deposited. Due to such spaces, the light-emitting stack 152 and the first inorganic insulating film 171 of the encapsulation layer 170 encapsulating the light-emitting stack 152 can be disconnected together. Generally, compared to the light-emitting stack 152, the first inorganic insulating film 171 has better step coverage to better cover the sidewalls; however, in the undercut structure of the first protective portion 210, the light-emitting stack 152 may be interrupted due to the empty space on the upper lower surface. The space where the light-emitting stack 152 may not be deposited will be in the lower... Figure 7B As described in the text.

[0087] Figure 7BIt is shown by acting as Figure 7A A photograph of the actual cross-sectional structure obtained by magnifying a portion of F in the fourth structure 214. Figure 7B This is an example of a suitable structure tested by the inventors to design the first protective portion 210. The fourth structure 214 may include a fourth upper portion 214a and a fourth lower portion 214b. On the lower surface of the fourth upper portion 214a, the undercut distance Δx between the fourth lower portion 214b and the side surface of the fourth upper portion 214a and the side surface height Δh of the fourth lower portion 214b are shown. Empty spaces without the light-emitting stack 152 or the first inorganic insulating film 171 may be formed on the lower surface of the fourth upper portion 214a and the side surface of the fourth lower portion 214b. The undercut distance Δx may also be expressed as the eaves length. Furthermore, it can be seen that a portion of the first inorganic insulating film 171 is cracked around the side surface of the fourth upper portion 214a to the inside of the first inorganic insulating film 171. This crack may lead to potential defects in the first inorganic insulating film 171. The reason for such cracks is that the gap between the eaves end of the fourth upper portion 214a and the location where the light-emitting stack 152 forms a film is formed such that the first inorganic insulating film 171 is not sufficiently formed horizontally. This film is formed such that a portion of the first inorganic insulating film 171 extends along the light-emitting stack 152 to the fourth lower portion 214b side, and other portions of the first inorganic insulating film 171 extend along the lower surface of the fourth upper portion 214a side, thus easily separating from the undercut space. Due to the phenomenon of gradual stress concentration, cracks in the first inorganic insulating film 171 may become cracks penetrating the first inorganic insulating film 171 along the dotted line. A disadvantage is that cracks in the first inorganic insulating film 171 may be a major permeation path for moisture or oxygen. However, this is one of the characteristics of the first protective portion 210, and all of the first protective portions 210 do not cause cracks in the first inorganic insulating film 171. This can be referred to as the importance of describing the first distance Δx and the first height Δh of the first protective portion 210. Among these advantages and disadvantages of the first protective portion 210, a potential advantage is that the light-emitting stack 152 can be clearly broken due to the undercut structure of the fourth upper portion 214a, and can be formed by materials used in related technologies through a relatively easy process. However, a potential disadvantage is that the first inorganic insulating film 171 of the encapsulation layer 170 may break when the undercut distance Δx of the fourth upper portion 214a and the side surface height Δh of the fourth lower portion 214b increase significantly. In the exemplary embodiment, the first protective portion 210 has been described as a combination of four structures, but is not limited thereto.

[0088] Figure 8A Yes Figure 6 An enlarged cross-sectional view of region E of the second protective section 220. (Refer to...) Figure 8AThe second protective portion 220 may include fifth structures 221 to eighth structures 224. Like the first structures 211 to fourth structures 214, the fifth structures 221 to eighth structures 224 may be formed as a two-tiered structure with an upper and a lower portion. For example, the upper portion of the fifth structure 221 may refer to the fifth upper portion 221a, and the lower portion of the fifth structure 221 may refer to the fifth lower portion 221b.

[0089] Reference Figure 8A The upper sidewall can be formed as an inverted conical structure in which the width of the upper part gradually increases or gradually increases with distance from the substrate. Specifically, the lower part of the fifth structure 221 to the eighth structure 224 is configured with a trapezoidal cross-section including a conical side surface, and the upper part of the fifth structure 221 to the eighth structure 224 can be configured with a structure that reverses the lower cross-section by including an inverted conical side surface. However, the lower structure is not limited to a conical shape and can be a vertical structure without a conical shape. The upper part can be formed from the embankment 154 or other organic material and formed by an over-etching process so that the side surface is an inverted conical shape. When the upper surface of the lower part and the lower surface of the upper part are similar to each other in width or area, as a result, the fifth structure 221 to the eighth structure 224 can have a structure similar in cross-section to a large mortar or hourglass. (Refer to...) Figure 8A As can be seen, the light-emitting stack 152 deposited on the front surface of the display panel 100 is disconnected from the upper tip side surfaces of the fifth structure 221 to the eighth structure 224, and the light-emitting stack 152 is formed around the lower side surfaces of the fifth structure 221 to the eighth structure 224. The light-emitting stack 152 is formed on the front surface of the display panel 100 by a chemical deposition method, wherein the chemical deposition method is a method of deposition based on the flatness of the organic material. Due to the poor step coverage and large width of the upper surface, there may be spaces in the upper and lower side surfaces where the light-emitting stack 152 may not be deposited. The upper inverted conical structure of the second protective portion 220 has a longer protective portion than the upper conical structure of the first protective portion 210, to further increase the effect of blocking the penetration of moisture and oxygen due to the disconnection of the light-emitting stack 152. As a result, the light-emitting stack 152 can be disconnected. On the other hand, the first inorganic insulating film 171 of the encapsulation layer 170 has better step coverage than the light-emitting stack 152, to better cover the side surfaces of the second protective portion 220.

[0090] Figure 8B Through the Figure 8A The cross-section of the eighth structure 224 is enlarged to show the diagram of F. (Refer to...) Figure 8B The light-emitting stack 152 is disposed on the upper surface of the eighth upper part 224a of the eighth structure 224, and may be disposed near the eighth lower part 224b of the eighth structure 224.

[0091] On the other hand, it can be seen that the first inorganic insulating film 171 is configured to cover the side and top surfaces near the eighth structure 224 without being broken. Since the eighth upper portion 224a has an inverted conical structure, the first inorganic insulating film 171 can have spatial edges that can be formed relatively easily on the side surfaces of the eighth structure 224. Among the advantages of the second protective portion 220, firstly, the first inorganic insulating film 171 of the encapsulation layer 170 can be formed without breaking when the light-emitting stack 152 is clearly broken due to the inverted conical shape of the eighth upper portion 224a. However, there may be a disadvantage that an over-etching process using a separate material is required to form the inverted conical structure of the eighth upper portion 224a.

[0092] In an exemplary embodiment, the first protective portion 210 and the second protective portion 220 are combined to have a hybrid form that minimizes the disadvantages of each structure and maximizes the advantages of each structure.

[0093] Figure 9 It is shown Figure 6 A cross-sectional view of another exemplary embodiment of the camera aperture region CHA. (Refer to...) Figure 9 It can be seen that, with Figure 6 Compared to the exemplary implementation, the configuration of the first protective portion 210 and the second protective portion 220 is simplified. In particular, since the number of structures constituting the first protective portion 210 is reduced to two, this is... Figure 6 Compared to the exemplary implementation, it is only half the number, and the number of structures constituting the second protective part 220 is reduced to two, which is... Figure 6 Compared to the exemplary implementation, only half is shown, so a structure with two structures is illustrated. Figure 9 In an exemplary implementation, with Figure 6 Compared to the exemplary implementation, the space of the camera hole region CHA can be reduced by approximately 26%, and the structures of the first protective portion 210 and the second protective portion 220 are used in combination to be optimized to suppress the penetration of moisture and oxygen.

[0094] Figure 10 It is shown Figure 6 and Figure 9 A cross-sectional view of another exemplary embodiment of the camera aperture region CHA. (Refer to...) Figure 10 Through with Figure 6 Compared to the exemplary implementation that completely removes the first protective portion 210 and as Figure 9 The exemplary implementation applies only half of the structure of the second protective portion 220, as seen in the example of a camera aperture area reduced to its limit. When applied... Figure 10 When the structure is similar to Figure 6 Compared to the previous structure, this can reduce space by approximately 43%. Figure 10 In order to maximize space saving in the camera aperture area CHA, it can be seen that only a second protective section 220, which has disadvantages in terms of manufacturing process, is formed. Figure 10 In this context, the structure of the second protective part 220 is represented by the fifth structure 221 and the sixth structure 222, but it is not necessarily limited to these and can form other structures.

[0095] According to an exemplary embodiment of this disclosure, a novel structure is proposed to suppress the permeation of moisture and oxygen through the organic light-emitting stack, while blocking cracks caused by heat transfer that occurs when the substrate is laser-cut.

[0096] Display devices according to exemplary embodiments of the present disclosure include liquid crystal display (LCD) devices, field emission display (FED) devices, organic light-emitting diode (OLED) devices, and quantum dot display devices.

[0097] Furthermore, the display device according to the exemplary embodiments of this disclosure may include a device-type display device, which includes laptop computers, televisions, computer monitors, automotive display devices or other displays for vehicles, etc., which are complete products or end products including LCM, OLED modules, etc., as well as unit electronic devices or unit devices or unit equipment such as smartphones, electronic tablets, etc.

[0098] Exemplary embodiments of this disclosure can also be described as follows:

[0099] According to one aspect of this disclosure, a display device includes: a panel including a display area, a camera hole area, and a non-display area disposed between the display area and the camera hole area; a light-emitting element and a plurality of transistors disposed on the panel and in the display area; an encapsulation layer disposed on the light-emitting element and the transistors; and at least one camera hole, at least one connection protection portion, and at least one dam portion disposed in the camera hole area, wherein a corresponding dam portion of the at least one dam portion is disposed between a corresponding connection protection portion of the at least one connection protection portion and a corresponding camera hole of the at least one camera hole.

[0100] At least one connection protection portion may include a lower portion having a tapered shape and an upper portion having an inverted tapered shape.

[0101] At least one connection protection portion may include a first protection portion and a second protection portion, the first protection portion being adjacent to a corresponding camera hole, and the second protection portion being adjacent to a display area.

[0102] At least one dam section may include a first dam section and a second dam section, wherein the first dam section is disposed between the first protective portion and the corresponding camera hole, and the second dam section is disposed between the first protective portion and the second protective portion.

[0103] The first protective portion may include a tapered upper portion, and the second protective portion includes a tapered upper portion.

[0104] The encapsulation layer may include a first inorganic insulating layer, an organic insulating layer, and a second inorganic insulating layer, wherein the organic insulating layer overlaps with the second protective portion.

[0105] The first inorganic layer may cover the upper surface (e.g., the front surface) of the second protective portion.

[0106] An organic insulating layer may cover a portion of the upper surface and side surfaces of at least one dam section.

[0107] The side surface of the first dam section adjacent to the corresponding camera hole can expose the upper surface of the panel, and the other side surface of the first dam section can be adjacent to the side surface of the first protective part.

[0108] The display device may also include power lines and signal lines disposed in a non-display area, wherein at least one connection protection portion and at least one dam have a closed-loop structure surrounding a corresponding camera hole in the at least one camera hole, and the power lines and signal lines surround at least one connection protection portion and at least one dam on the outside.

[0109] In at least one connection protection section, the light-emitting layer included in the light-emitting element can be disconnected.

[0110] According to another aspect of this disclosure, a display device includes: a panel including a display area, a camera hole area, and a non-display area disposed between the display area and the camera hole area; a light-emitting element and a plurality of transistors disposed on the panel and in the display area; an encapsulation layer disposed on the light-emitting element and the transistors; a camera hole disposed in the camera hole area; at least one connection protection portion and at least one dam having a closed-loop structure surrounding the camera hole; and power lines and signal lines disposed in the non-display area, wherein a corresponding dam in the at least one connection protection portion is disposed between a corresponding connection protection portion in the at least one connection protection portion and a corresponding camera hole.

[0111] Power lines and signal lines may be arranged around the perimeter of at least one connecting protective section and at least one dam section.

[0112] At least one connection protection portion may include a first protection portion and a second protection portion, the first protection portion being adjacent to a corresponding camera hole, and the second protection portion being adjacent to a display area.

[0113] The encapsulation layer may include a first inorganic insulating layer, an organic insulating layer, and a second inorganic insulating layer, wherein the organic insulating layer overlaps with the second protective portion.

[0114] The first protective portion may include a tapered upper portion, and the second protective portion may include an inverted tapered upper portion.

[0115] The encapsulation layer may include a first inorganic insulating layer, an organic insulating layer, and a second inorganic insulating layer. At least one connection protection portion includes an upper portion having an inverted conical shape and a lower portion having a conical shape or not having a conical shape, and the upper surface (e.g., the front surface) of at least one connection protection portion is covered by the first inorganic insulating layer.

[0116] In at least one connection protection section, the light-emitting layer included in the light-emitting element can be disconnected.

[0117] According to another aspect of this disclosure, a display device includes: a panel, the panel including a display area, a camera hole area and a non-display area disposed between the display area and the camera hole area; a light-emitting element and a plurality of transistors disposed on the panel and in the display area; and a camera hole, a connection protection portion and a dam portion disposed in the camera hole area, wherein the dam portion is disposed between the connection protection portion and the camera hole; and wherein, in the connection protection portion, a light-emitting layer included in the light-emitting element can be disconnected.

[0118] The connecting protective portion may include an upper part with an inverted cone shape and a lower part with a cone shape.

[0119] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within the equivalent scope thereof should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: A panel, the panel including a display area, a camera hole area, and a non-display area disposed between the display area and the camera hole area; Light-emitting elements and multiple transistors disposed on the panel and in the display area; An encapsulation layer disposed on the light-emitting element and the transistor; as well as At least one camera hole, at least one connecting protective part, and at least one dam are provided in the camera hole area. Specifically, a corresponding dam section in the at least one dam section is disposed between a corresponding connecting protective portion in the at least one connecting protective portion and a corresponding camera hole in the at least one camera hole. The at least one connection protection part includes a first protection part and a second protection part. The first protective portion is adjacent to the corresponding camera aperture. The second protective portion is adjacent to the display area. The at least one dam section includes a first dam section and a second dam section. The first dam section is positioned between the first protective section and the corresponding camera hole, and The second dam section is located between the first protective section and the second protective section.

2. The display device according to claim 1, in, The at least one connection protection portion includes a lower portion having a conical shape and an upper portion having an inverted conical shape.

3. The display device according to claim 1, in, The first protective portion includes a tapered upper portion, and The second protective part includes an upper part with an inverted cone shape.

4. The display device according to claim 1, in, The encapsulation layer includes a first inorganic insulating layer, an organic insulating layer, and a second inorganic insulating layer, and The organic insulating layer overlaps with the second protective portion.

5. The display device according to claim 4, in, The first inorganic insulating layer covers the upper surface of the second protective portion.

6. The display device according to claim 4, in, The organic insulating layer covers a portion of the upper surface and side surface of the at least one dam.

7. The display device according to claim 1, in, The side surface of the first dam adjacent to the corresponding camera hole exposes the upper surface of the panel, and the other side surface of the first dam is adjacent to the side surface of the first protective portion.

8. The display device according to claim 1, further comprising: Power lines and signal lines are located in the non-display area. Wherein, the corresponding connecting protection portion in the at least one connecting protection portion and the corresponding dam portion in the at least one dam portion have a closed-loop structure surrounding the corresponding camera hole in the at least one camera hole, and The power line and the signal line surround the at least one connection protection section and the at least one dam section on the outside.

9. The display device according to any one of claims 1 to 8, wherein, In the at least one connection protection portion, the light-emitting layer in the light-emitting element is disconnected.

10. A display device, comprising: A panel, the panel including a display area, a camera hole area, and a non-display area disposed between the display area and the camera hole area; Light-emitting elements and multiple transistors disposed on the panel and in the display area; An encapsulation layer disposed on the light-emitting element and the transistor; A camera hole is provided in the camera hole area; It has at least one connecting protective portion and at least one dam portion having a closed-loop structure surrounding the camera aperture; as well as Power lines and signal lines are located in the non-display area. Specifically, the corresponding dam section in the at least one dam section is disposed between the corresponding connecting protective section in the at least one connecting protective section and the corresponding camera hole. The at least one connection protection part includes a first protection part and a second protection part. The first protective portion is adjacent to the corresponding camera aperture. The second protective portion is adjacent to the display area. The at least one dam section includes a first dam section and a second dam section. The first dam section is positioned between the first protective section and the corresponding camera hole, and The second dam section is located between the first protective section and the second protective section.

11. The display device according to claim 10, in, The power lines and the signal lines are arranged to surround the periphery of the at least one connecting protective section and the at least one dam section.

12. The display device according to claim 10, in, The encapsulation layer includes a first inorganic insulating layer, an organic insulating layer, and a second inorganic insulating layer, and The organic insulating layer overlaps with the second protective portion.

13. The display device according to claim 10, in, The first protective portion includes a tapered upper portion, and the second protective portion includes an inverted tapered upper portion.

14. The display device according to claim 10, in, The encapsulation layer includes a first inorganic insulating layer, an organic insulating layer, and a second inorganic insulating layer. The at least one connection protection portion includes an upper part with an inverted conical shape and a lower part with or without a conical shape, and The upper surface of at least one connection protection portion is covered by the first inorganic insulating layer.

15. The display device according to any one of claims 10 to 14, wherein, In the at least one connection protection part, the light-emitting layer included in the light-emitting element is disconnected.

16. A display device, comprising: A panel, the panel including a display area, a camera hole area, and a non-display area disposed between the display area and the camera hole area; Light-emitting elements and multiple transistors disposed on the panel and in the display area; as well as The camera hole, the first protective part, the second protective part, the first dam section, and the second dam section are arranged in the camera hole area. In both the first and second protective portions, the light-emitting layer within the light-emitting element is disconnected. The first dam section is positioned between the first protective section and the camera hole, and The second dam section is located between the first protective section and the second protective section.

17. The display device according to claim 16, At least one of the first protective portion and the second protective portion includes an upper portion having an inverted cone shape and a lower portion having a cone shape.

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