A method for mini LED chip arrangement using an AOI transfer device with AI functionality
By using AI-enabled AOI transfer equipment for mini LED chip arrangement, the problems of circuit accuracy deviation and low production efficiency in the mini LED display process have been solved, achieving a high-precision and high-efficiency chip arrangement process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGSU LUOHUA NEW MATERIAL
- Filing Date
- 2020-11-25
- Publication Date
- 2026-07-17
AI Technical Summary
In the process of mini LED display, as the pitch decreases, the multi-layer stacking of the substrate leads to deviations in circuit accuracy, and the existing chip arrangement process is not fast enough, affecting production efficiency.
An AOI transfer device with AI functionality is used to identify and record the position using AI-AOI components. Combined with a high-precision transfer and arrangement component, precise alignment and welding of the substrate and the arrangement board are achieved.
This improved the precision and output efficiency of mini LED chip arrangement, reduced subsequent rework costs, and ensured the smooth progress of the processing.
Smart Images
Figure CN114551685B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of mini LEDs, and in particular to a method for arranging mini LEDs using an AOI transfer device with AI functionality. Background Technology
[0002] Mini LED, also known as Mini LED, is a backlight technology, or sub-millimeter light-emitting diode. Simply put, Mini LED is a display method between LED and Micro LED. Mini LED manufacturing often involves wafer arrangement, but existing wafer arrangement processes frequently encounter the following problems: 1. As the pitch of a mini LED display decreases, the substrate used is often multi-layered (potentially 8-10 layers). Due to the bonding stress of each layer, the substrate's scaling ratio varies, causing deviations in circuit accuracy (A) (different for each board). In the wafer-to-wafer bonding process, wafers are often arranged according to the original design, which can easily lead to deviations in the post-bonding position, increasing subsequent rework costs; 2. Existing wafer arrangement processes are slow, resulting in low product output efficiency and affecting the manufacturing process. Summary of the Invention
[0003] The main objective of this invention is to provide a method for mini LED arrangement using an AOI transfer device with AI functionality, which can effectively solve the problems in the background art.
[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:
[0005] A method for mini LED chip arrangement using an AI-enabled AOI transfer device includes an assembly table. An AI-AOI component and a transfer arrangement component are respectively arranged above the assembly table. The AI-AOI component is located to the left of the transfer arrangement component. A position discrimination area, a chip transfer area, and a bonding area are respectively arranged at the upper end of the assembly table. The position discrimination area is located to the left of the chip transfer area, and the chip transfer area is located to the left of the bonding area. The AI-AOI component and the transfer arrangement component are respectively located above the position discrimination area and above the chip transfer area. The chip arrangement method includes the following steps:
[0006] Step 1: Substrate feeding. Place the substrate to be assembled on the upper left of the assembly table, and gradually move the substrate horizontally to the right along the assembly table to realize the substrate feeding operation.
[0007] Step 2: The AI-AOI component performs position determination and recording. The substrate moves horizontally to the right along the assembly table. When the substrate moves to the position determination area on the assembly table, the AI-AOI component with artificial intelligence function above the position determination area performs position determination and recording on the substrate in the position determination area.
[0008] Step 3: Remove the substrate from the soldering stand. After the AI-AOI component in Step 2 determines and records the position of the substrate, remove the substrate from the position determination area on the assembly table and proceed with the soldering stand.
[0009] Step 4: The chip tray enters the assembly stage. After the substrate is removed from the soldering stand, the chip tray enters the chip transfer area on the assembly stage.
[0010] Step 5: Begin the transfer and arrangement of mini LED RGB chips. After the chip arrangement board is in place, begin the high-precision transfer and arrangement of mini LED RGB chips on the chip arrangement board.
[0011] Step 6: Transfer of the chip arrangement board and the corresponding substrate. The chip arrangement board with the arranged mini LED RGB chips is sent to the bonding area, and the corresponding substrate to be soldered in Step 3 is also sent to the bonding area, thereby realizing the transfer of the chip arrangement board with the arranged mini LED RGB chips and the corresponding substrate.
[0012] Step 7: Alignment and welding between the chip arrangement board and the corresponding substrate. The chip arrangement board and the corresponding substrate in the bonding area are welded together, and the chip arrangement board with the mini LED RGB chips is located on the top of the corresponding substrate.
[0013] Step 8: Product delivery. After the mini LED RGB chip arrangement board is soldered to the corresponding substrate, the soldered product is delivered. Then, the next substrate to be assembled is placed on the upper left of the assembly table, and the arrangement steps from Step 1 to Step 8 are repeated.
[0014] Preferably, the position discrimination area is the substrate placement area, the chip transfer area is the mini LED RGB chip transfer and arrangement area, and the bonding area is the welding area between the chip arrangement board and the corresponding substrate.
[0015] Preferably, in step five, the number of mini LED RGB chips arranged on the chip arrangement board is six.
[0016] Preferably, in step eight, the arrangement steps from step one to step eight are repeated continuously, and the final arrangement of mini LEDs is a multi-layer structure.
[0017] Compared with the prior art, the present invention has the following beneficial effects:
[0018] 1. In this invention, by adding an AI-AOI component to a high-precision transfer and arrangement component, the AI-AOI component above the position discrimination area, which has artificial intelligence function, can discriminate and record the position of the substrate in the position discrimination area, and send the discriminated substrate and the arrangement board with mini LED RGB chips into the bonding area for soldering. This solves the problem of the line position accuracy of the PCB substrate, avoids arranging the chips according to the original position in the chip-to-chip soldering process, effectively improves the output accuracy, and reduces the investment in subsequent rework.
[0019] 2. In this invention, by adding an AOI component with artificial intelligence function to the high-precision transfer and arrangement component, the AOI component with artificial intelligence function can simultaneously improve the speed of the arrangement process, improve product output efficiency, and ensure the processing progress. Attached Figure Description
[0020] Figure 1 This is an overall structural diagram of a method for mini LED arrangement using an AOI transfer device with AI function according to the present invention.
[0021] Figure 2 This is a flowchart illustrating the process of a method for arranging mini LEDs using an AOI transfer device with AI functionality, according to the present invention.
[0022] In the diagram: 1. Assembly station; 2. Position discrimination area; 3. AI-AOI component; 4. Transfer and stacking component; 5. Chip transfer area; 6. Bonding area. Detailed Implementation
[0023] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.
[0024] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0025] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0026] like Figure 1-2 As shown, a method for mini LED chip arrangement using an AOI transfer device with AI functionality includes an assembly table 1. An AI-AOI component 3 and a transfer arrangement component 4 are respectively arranged above the assembly table 1. The AI-AOI component 3 is located to the left of the transfer arrangement component 4. A position discrimination area 2, a chip transfer area 5, and a bonding area 6 are respectively arranged on the upper end of the assembly table 1. The position discrimination area 2 is located to the left of the chip transfer area 5, and the chip transfer area 5 is located to the left of the bonding area 6. The AI-AOI component 3 and the transfer arrangement component 4 are respectively located above the position discrimination area 2 and above the chip transfer area 5. The chip arrangement method includes the following steps:
[0027] Step 1: Substrate feeding. Place the substrate to be assembled on the upper left of the assembly table 1, and gradually move the substrate horizontally to the right along the assembly table 1 to realize the substrate feeding operation.
[0028] Step 2: AI-AOI component 3 performs position determination and recording. The substrate moves horizontally to the right along the assembly table 1. When the substrate moves to the position determination area 2 on the assembly table 1, the AI-AOI component 3, which has artificial intelligence function, located above the position determination area 2, performs position determination and recording on the substrate in the position determination area 2.
[0029] Step 3: Remove the substrate from the soldering stand. After the AI-AOI component 3 in Step 2 determines and records the position of the substrate, remove the substrate from the position determination area 2 on the assembly table 1 and proceed with the soldering stand.
[0030] Step 4: The chip tray enters and after the substrate is removed from the soldering stand, the chip tray enters the chip transfer area 5 on the assembly station 1.
[0031] Step 5: Begin the transfer and arrangement of mini LED RGB chips. After the chip arrangement board is in place, begin the high-precision transfer and arrangement of mini LED RGB chips on the chip arrangement board.
[0032] Step 6: Transfer of the chip arrangement board and the corresponding substrate. The chip arrangement board with the arranged mini LED RGB chips is sent to bonding area 6, and the corresponding substrate to be soldered in step 3 is also sent to bonding area 6, thereby realizing the transfer of the chip arrangement board with the arranged mini LED RGB chips and the corresponding substrate.
[0033] Step 7: Alignment and welding between the chip arrangement board and the corresponding substrate. The chip arrangement board located in bonding area 6 and the corresponding substrate located in bonding area 6 are then welded together, and the chip arrangement board with the mini LED RGB chips arranged is located on the upper end of the corresponding substrate.
[0034] Step 8: Product delivery. After the mini LED RGB chip arrangement board is soldered to the corresponding substrate, the soldered product is delivered. Then, the next substrate to be assembled is placed on the upper left of the assembly table 1, and the arrangement steps from step 1 to step 8 are repeated.
[0035] Position discrimination area 2 is the substrate placement area, chip transfer area 5 is the mini LED RGB chip transfer and arrangement area, and bonding area 6 is the welding area between the chip arrangement board and the corresponding substrate, used to realize the alignment and welding work between the substrate and the chip arrangement board; in step five, the number of mini LED RGB chips arranged on the chip arrangement board is six; in step eight, the chip arrangement steps from step one to step eight are repeated continuously, and the final chip arrangement of mini LEDs is a multi-layer structure.
[0036] It should be noted that this invention is a method for mini LED chip arrangement using an AI-enabled AOI transfer device. First, the substrate to be assembled is placed on the upper left of the assembly table 1, and then gradually moved horizontally to the right along the assembly table 1. When the substrate moves to the position discrimination area 2 on the assembly table 1, the AI-AOI component 3, located above the position discrimination area 2, performs position discrimination and recording on the substrate within the position discrimination area 2. After the AI-AOI component 3 has performed position discrimination and recording in step two, the substrate is removed from the position discrimination area 2 on the assembly table 1 and is ready for soldering. Then, the chip arrangement board enters the chip transfer area 5 on the assembly table 1. After the chip arrangement board has entered, high-precision transfer and arrangement of mini LED RGB chips begins on the chip arrangement board. Then, the chip arrangement board with the arranged mini LED RGB chips is sent to the bonding area 6, and the corresponding substrate to be soldered is also sent to the bonding area 6, thereby achieving the arrangement of mini LEDs. The process involves transferring the RGB chip arrangement board to its corresponding substrate. Then, the arrangement board and its corresponding substrate within bonding area 6 are soldered together, with the arrangement board containing the mini LED RGB chips positioned on top of the corresponding substrate. After the arrangement board and corresponding substrate are soldered together, the soldered product is sent out. The next substrate to be assembled is then placed on the upper left side of assembly table 1 to complete the chip arrangement process, ultimately achieving a multi-layer chip arrangement structure for mini LEDs.
[0037] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.
Claims
1. A method for arranging mini LEDs using an AOI transfer device with AI functionality, comprising an assembly table (1), characterized in that: The assembly table (1) is provided with an AI-AOI component (3) and a transfer arrangement component (4) above it. The AI-AOI component (3) is located to the left of the transfer arrangement component (4). The upper end of the assembly table (1) is provided with a position discrimination area (2), a chip transfer area (5) and a bonding area (6). The position discrimination area (2) is located to the left of the chip transfer area (5). The chip transfer area (5) is located to the left of the bonding area (6). The AI-AOI component (3) and the transfer arrangement component (4) are located above the position discrimination area (2) and above the chip transfer area (5) respectively. The arrangement method includes the following steps: Step 1: Substrate feeding. Place the substrate to be assembled on the upper left of the assembly table (1) and gradually move the substrate horizontally to the right along the assembly table (1) to realize the substrate feeding operation. Step 2: The AI-AOI component (3) performs position discrimination and recording. The substrate moves horizontally to the right along the assembly table (1). When the substrate moves to the position discrimination area (2) on the assembly table (1), the AI-AOI component (3) with artificial intelligence function above the position discrimination area (2) performs position discrimination and recording on the substrate in the position discrimination area (2). Step 3: Remove the substrate from the soldering stand. After the AI-AOI component (3) in Step 2 determines the position of the substrate and records it, remove the substrate from the position determination area (2) on the assembly table (1) and put it into the soldering stand. Step 4: The chip tray enters and after the substrate is removed from the soldering stand, the chip tray enters the chip transfer area (5) on the assembly station (1). Step 5: Begin the transfer and arrangement of mini LED RGB chips. After the chip arrangement board is in place, begin the high-precision transfer and arrangement of mini LED RGB chips on the chip arrangement board. Step 6: Transfer of the chip arrangement board and the corresponding substrate. The chip arrangement board with the arranged mini LED RGB chips is sent to the bonding area (6), and the corresponding substrate to be soldered in step 3 is also sent to the bonding area (6), thereby realizing the transfer of the chip arrangement board with the arranged mini LED RGB chips and the corresponding substrate. Step 7: Alignment and welding between the chip arrangement board and the corresponding substrate. Align the chip arrangement board in the bonding area (6) and the corresponding substrate in the bonding area (6) and then weld them together. The chip arrangement board with the mini LED RGB chips is located on the upper end of the corresponding substrate. Step 8: Product delivery. After the mini LED RGB chip arrangement board is soldered to the corresponding substrate, the soldered product is delivered. Then, the next substrate to be assembled is placed on the upper left of the assembly table (1) and the arrangement steps from step 1 to step 8 are repeated.
2. The method for mini LED arrangement using an AOI transfer device with AI function according to claim 1, characterized in that: The position discrimination area (2) is the substrate placement area, the chip transfer area (5) is the mini LED RGB chip transfer and arrangement area, and the bonding area (6) is the welding area between the chip arrangement board and the corresponding substrate.
3. The method for mini LED arrangement using an AOI transfer device with AI function according to claim 1, characterized in that: In step five, the number of mini LED RGB chips arranged on the chip tray is six.
4. A method for mini LED arrangement using an AOI transfer device with AI function according to claim 1, characterized in that: In step eight, the arrangement steps from step one to step eight are repeated continuously, and the final arrangement of mini LEDs is a multi-layer structure.