A method to improve die bonding speed and accuracy in miniLEDs

Abstract

The application discloses a kind of methods for solving the transfer speed and accuracy of die bonding on mini LED, including chip film and PCB board, transparent thimble and irradiation cylinder are respectively arranged above the chip film, the irradiation cylinder is vertically distributed between chip film, the lower end of the chip film is provided with chip body, the upper end of the PCB board is fixedly installed with circuit layer, the circuit layer is below chip body.The method for solving the transfer speed and accuracy of die bonding on mini LED, by the high-strength glass or quartz thimble of non-metal material, can avoid the scratch caused by metal thimble to chip body, and can realize the effective and uniform separation of chip body and chip film, so as to ensure the falling accuracy of chip;The addition of photolysis in the lower top equipment can avoid the adhesion of the lower end of the irradiation surface of the chip film to the upper end of the chip body, improve the transfer speed and accuracy of the chip, and the mutual vertical distribution between the irradiation cylinder and the chip film can complete the uniform light receiving of the chip film and ensure effective die bonding.

Description

Technical Field

[0001] This invention relates to the field of mini LED technology, and in particular to a method for solving the problem of die bonding transfer speed and accuracy on mini LEDs. Background Technology

[0002] Mini LED, also known as sub-millimeter light-emitting diode, is a backlight technology. Simply put, it's a display method between LED and Micro LED. In terms of picture quality, Mini LED offers stronger brightness, contrast, and color performance. It also helps alleviate the ghosting effect caused by insufficient frame rates in some TV panels. Users can cast their phone screen to the TV. To do this, both the phone and TV must be on the same local network. To do this, simply open your phone, find and open the Settings app, then open Connections & Sharing, and finally enable Screen Mirroring. Your phone will then automatically search for the TV; simply tap to cast. Secondly, users can also use third-party screen mirroring software. Simply download the same software on both your phone and TV, open the software, and select screen mirroring. In the manufacturing process of mini LEDs, chip installation is often achieved using a bottom-mounting device. However, existing processes often encounter the following problems: 1. Most existing bottom-mounting devices use metal pins, which easily damage the chip surface during the process and hinder effective separation of the chip from the film, affecting the chip's accuracy during descent; 2. Existing bottom-mounting devices often lack photolysis, making the connection between the chip film and the chip body prone to adhesion, hindering the chip's rapid, accurate, and effective descent and resulting in a low yield for die bonding, thus affecting the transfer speed and accuracy during descent; 3. A small number of existing bottom-mounting devices incorporate photolysis, but this is mostly done from the side, resulting in uneven energy distribution across the irradiated area, still failing to effectively bond the die. Summary of the Invention

[0003] The main objective of this invention is to provide a method for improving the speed and accuracy of die bonding transfer on mini LEDs, which can effectively solve the problems in the background art.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A method for improving the die bonding transfer speed and accuracy on mini LEDs includes a chip film and a PCB board. A transparent pin and an illumination tube are respectively disposed above the chip film, with the illumination tube and the transparent pin perpendicularly positioned to each other. A light source is emitted from the lower end of the illumination tube. A chip body is disposed at the lower end of the chip film. A circuit layer is fixedly mounted on the upper end of the PCB board, located below the chip body. The light source illuminates the upper end of the chip film, forming an illumination surface with uniform energy distribution within the illumination surface. The area illuminated by the light source is the light-receiving area. The chip film includes a first film body and a second film body, with the second film body located in the middle of the first film body and within the light-receiving area. The method for improving the die bonding transfer speed and accuracy on mini LEDs includes the following steps: Step 1: Illumination of the chip film. Place the irradiation tube above the chip film, with the irradiation tube and the chip film being perpendicular to each other. This allows the light source emitted from the irradiation tube to shine directly onto the upper end of the chip film, forming an irradiation surface on the upper end of the chip film. At this time, the energy distribution within the irradiation surface is uniform, thus completing the uniform illumination of the chip film. Step 2: Photolysis. When the energy distribution on the irradiated surface of the chip film is uniform, the irradiated surface of the chip film irradiated by the light source undergoes photolysis and pyrolysis reactions to avoid the lower end of the irradiated surface of the chip film sticking to the upper end of the chip body. Step 3: The transparent pin is pushed down. While the photolysis and pyrolysis reaction are taking place on the irradiated surface of the chip film, the transparent pin is placed on the upper end of the second film body on the chip film, and a downward pushing force is applied to the transparent pin. The transparent pin is made of non-metallic high-strength glass or quartz. Step 4: Separation between the chip film and the chip body. During the downward pushing process of the transparent ejector pin, the second film on the chip film is pushed down by the transparent ejector pin, achieving uniform and effective separation between the second film and the chip body. Step 5: Chip Drop. After the second membrane separates from the chip, the chip quickly falls onto the circuit layer of the PCB board, thus completing the chip installation. Step 6: Remove the transparent ejector pin. After the chip body is installed, apply an upward pulling force to the transparent ejector pin. At this time, the transparent ejector pin separates from the chip film, thus removing the transparent ejector pin. Step 7: Remove the irradiation tube. After the transparent pin is removed, remove the irradiation tube horizontally from above the chip film to stop the chip film from being irradiated by the light source and continuing to undergo photolysis and pyrolysis reactions.

[0005] Preferably, the second membrane has a downward protrusion structure in the middle, and at this time the transparent pin is located at the upper end of the second membrane, and the lower end of the second membrane is uniformly and effectively separated from the chip body.

[0006] Preferably, the transparent pin is made of high-strength glass or quartz, which is a non-metallic material.

[0007] Compared with the prior art, the present invention has the following beneficial effects: 1. In this invention, by setting the bottom transparent pin to a non-metallic high-strength glass or quartz material, scratches caused by metal pins to the chip surface can be avoided. Compared with the original traditional metal pins, the transparent pin can protect the chip surface and achieve effective and uniform separation of the chip body and the chip film, thereby ensuring the accuracy of chip drop.

[0008] 2. In this invention, photolysis is added to the lowering device. At this time, the light source irradiates the irradiated surface of the chip film to carry out photolysis and thermal decomposition reactions, avoiding the adhesion of the lower end of the irradiated surface of the chip film to the upper end of the chip body, realizing the chip falling quickly, accurately and effectively, avoiding the low yield of die bonding, thereby improving the chip transfer speed and accuracy.

[0009] 3. In this invention, by distributing the irradiation tube and the chip film perpendicularly to each other, the light source emitted from the irradiation tube is directed to the upper end of the chip film in a straight line, forming an irradiation surface on the upper end of the chip film. At this time, the energy distribution in the irradiation surface is uniform, and the chip film is uniformly illuminated. Compared with the traditional illumination tube with photolysis and pyrolysis functions added to the side, it can avoid uneven energy distribution in the irradiation area caused by non-linear irradiation, and can ensure effective crystal bonding. Attached Figure Description

[0010] Figure 1 This is an overall structural diagram of a method for solving the problem of die bonding transfer speed and accuracy on mini LEDs according to the present invention; Figure 2 This is a schematic diagram of the irradiation surface on the chip film of the method for solving the problem of die bonding transfer speed and accuracy on mini LEDs according to the present invention; Figure 3 This is a schematic diagram of the light-receiving area in a method for solving the die-bonding transfer speed and accuracy on mini LEDs according to the present invention. Figure 4 This is a schematic diagram of the structure during the separation of the chip film and the chip body in a method for solving the problem of die bonding transfer speed and accuracy on mini LEDs according to the present invention; Figure 5 This is a schematic diagram of the bottom-top structure of a mini LED chip without photolysis in traditional technology; Figure 6 This is a schematic diagram of the bottom-top structure of a mini LED chip with photolysis on the side in traditional technology.

[0011] In the diagram: 1. Irradiation tube; 2. Light source; 3. Chip film; 4. Chip body; 5. Transparent ejector pin; 6. Circuit layer; 7. PCB board; 8. Irradiation surface; 9. Light-receiving area; 10. Metal ejector pin; 11. Illumination tube; 31. Film body No. 1; 32. Film body No. 2. Detailed Implementation

[0012] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0013] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0014] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0015] like Figure 1-6 As shown, a method for improving the speed and accuracy of die bonding transfer on mini LEDs includes a chip film 3 and a PCB board 7. A transparent ejector pin 5 and an irradiation tube 1 are respectively disposed above the chip film 3, with the irradiation tube 1 and the chip film 3 being vertically distributed. A light source 2 is emitted from the lower end of the irradiation tube 1. A chip body 4 is disposed at the lower end of the chip film 3. A circuit layer 6 is fixedly mounted on the upper end of the PCB board 7, located below the chip body 4. The light source 2 irradiates the upper end of the chip film 3, forming an irradiation surface 8. The energy distribution within the irradiation surface 8 is uniform, avoiding uneven energy distribution in the irradiated area due to non-linear irradiation, thus ensuring effective die bonding. The area irradiated by the light source 2 is the light-receiving area 9. The chip film 3 includes a first film body 31 and a second film body 32. The second film body 32 is located in the middle of the first film body 31 and is located inside the light-receiving area 9. The method for improving the speed and accuracy of die bonding transfer on mini LEDs includes the following steps: Step 1: The chip film 3 is exposed to light. The irradiation tube 1 is placed above the chip film 3, and the irradiation tube 1 and the chip film 3 are perpendicular to each other, so that the light source 2 emitted from the irradiation tube 1 shines directly on the upper end of the chip film 3, and forms an irradiation surface 8 on the upper end of the chip film 3. At this time, the energy distribution in the irradiation surface 8 is uniform, and the chip film 3 is uniformly exposed to light. Step 2: Photolysis. When the energy distribution in the irradiated surface 8 of the chip film 3 is uniform, the irradiated surface 8 of the chip film 3, which is irradiated by the light source 2, undergoes photolysis and thermal decomposition reactions to prevent the lower end of the irradiated surface 8 of the chip film 3 from sticking to the upper end of the chip body 4. Step 3: The transparent pin 5 is pushed down. While the photolysis and pyrolysis reaction are taking place on the irradiation surface 8 of the chip film 3, the transparent pin 5 is placed on the upper end of the second film body 32 on the chip film 3, and a downward pushing force is applied to the transparent pin 5. The transparent pin 5 is made of non-metallic high-strength glass or quartz. Step 4: Separation between chip film 3 and chip body 4. During the downward pushing process of transparent ejector pin 5, the second film 32 on chip film 3 is pushed down by transparent ejector pin 5, achieving uniform and effective separation between the second film 32 and chip body 4. Step 5: Chip Drop. After the second membrane 32 and the chip 4 are separated, the chip 4 falls quickly onto the circuit layer 6 of the PCB board 7, thus completing the chip 4's installation. Step 6: Remove the transparent ejector pin 5. After the chip body 4 is installed, apply an upward pulling force to the transparent ejector pin 5. At this time, the transparent ejector pin 5 separates from the chip film 3, thus removing the transparent ejector pin 5. Step 7: Remove the irradiation tube 1. After the transparent pin 5 is removed, remove the irradiation tube 1 horizontally from above the chip film 3 to stop the chip film 3 from being irradiated by the light source 2 and continuing to undergo photolysis and pyrolysis reactions.

[0016] The second membrane 32 has a downward protrusion structure in the middle, and the transparent pin 5 is located at the upper end of the second membrane 32. The lower end of the second membrane 32 is evenly and effectively separated from the chip body 4 to avoid the chip body 4 from shifting due to the deformation of the chip membrane 3. The transparent pin 5 is made of high-strength glass or quartz, which is a non-metallic material, and can avoid metal pins from scratching the surface of the chip body 4.

[0017] It should be noted that this invention is a method for improving the speed and accuracy of die bonding transfer on mini LEDs. When the LED is being pushed down, the irradiation tube 1 is placed above the chip film 3, with the irradiation tube 1 and the chip film 3 perpendicular to each other. This allows the light source 2 emitted from the irradiation tube 1 to directly irradiate the upper end of the chip film 3, forming an irradiation surface 8 on the upper end of the chip film 3. At this time, the energy distribution within the irradiation surface 8 is uniform, ensuring uniform light reception for the chip film 3. Compared with the traditional irradiation tube 11 with photolysis and pyrolysis functions added to the side, this avoids uneven energy distribution in the irradiated area caused by non-linear irradiation, ensuring effective die bonding. The irradiation surface 8 of the chip film 3, irradiated by the light source 2, undergoes photolysis and pyrolysis reactions, preventing the lower end of the irradiation surface 8 of the chip film 3 from sticking to the upper end of the chip body 4, resulting in the chip falling quickly, accurately, and effectively, avoiding a low yield of die bonding. Then, while the irradiation surface 8 of the chip film 3 is undergoing photolysis and pyrolysis reactions, a transparent push pin 5 is placed on the upper end of the second film body 32 on the chip film 3, and a downward pushing force is applied to the transparent push pin 5. The transparent ejector pin 5 is made of high-strength glass or quartz, a non-metallic material, which avoids scratching the surface of the chip body 4 caused by metal ejector pins. Compared with the traditional metal ejector pin 10, the transparent ejector pin 5 can protect the surface of the chip body 4 and achieve effective and uniform separation of the chip body 4 and the chip film 3. During the downward pushing process of the transparent ejector pin 5, the second film 32 on the chip film 3 is pushed down by the transparent ejector pin 5, achieving uniform and effective separation between the second film 32 and the chip body 4. After the second film 32 and the chip body 4 are separated, the falling chip body 4 quickly falls onto the circuit layer 6 of the PCB board 7, finally completing the installation of the chip body 4. After the chip body 4 is installed, an upward pulling force is applied to the transparent ejector pin 5. At this time, the transparent ejector pin 5 separates from the chip film 3, realizing the removal of the transparent ejector pin 5. Then, the irradiation tube 1 is removed horizontally from above the chip film 3 to prevent the chip film 3 from continuing to undergo photolysis and pyrolysis reactions under the irradiation of the light source 2.

[0018] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A method for improving the speed and accuracy of die bonding transfer on mini LEDs, comprising a chip film (3) and a PCB board (7), characterized in that: A transparent pin (5) and an irradiation tube (1) are respectively arranged above the chip film (3). The irradiation tube (1) is perpendicular to the chip film (3), and the transparent pin (5) is also perpendicular to the chip film (3). A light source (2) is emitted from the lower end of the irradiation tube (1). A chip body (4) is arranged at the lower end of the chip film (3). A circuit layer (6) is fixedly installed on the upper end of the PCB board (7). The circuit layer (6) is located below the chip body (4). The light source (2) irradiates the upper end of the chip film (3) and forms an irradiation surface (8) on the upper end of the chip film (3). The energy distribution inside the irradiation surface (8) is uniform. The area irradiated by the light source (2) is the light-receiving area (9). The chip film (3) includes a first film body (31) and a second film body (32). The second film body (32) is located in the middle of the first film body (31), and the second film body (32) is located inside the light-receiving area (9). The method for improving the speed and accuracy of die bonding transfer on LEDs includes the following steps: Step 1: The chip film (3) is exposed to light. The irradiation tube (1) is placed above the chip film (3) and the irradiation tube (1) and the chip film (3) are perpendicular to each other, so that the light source (2) emitted from the irradiation tube (1) shines straight on the upper end of the chip film (3) and forms an irradiation surface (8) on the upper end of the chip film (3). At this time, the energy distribution in the irradiation surface (8) is uniform, and the chip film (3) is uniformly exposed to light. Step 2: Photolysis. When the energy distribution in the irradiated surface (8) of the chip film (3) is uniform, the irradiated surface (8) of the chip film (3) is irradiated by the light source (2) to carry out photolysis and thermal decomposition reactions, so as to avoid the lower end of the irradiated surface (8) of the chip film (3) from sticking to the upper end of the chip body (4). Step 3: The transparent pin (5) is pushed down. While the photolysis and pyrolysis reaction are carried out on the irradiated surface (8) of the chip film (3), the transparent pin (5) is placed on the upper end of the second film body (32) on the chip film (3), and a downward pushing force is applied to the transparent pin (5). The transparent pin (5) that is pushed down is made of quartz. Step 4: Separation between chip film (3) and chip body (4). During the downward pushing process of transparent pin (5), the second film body (32) on chip film (3) is pushed down by transparent pin (5) to achieve uniform and effective separation between the second film body (32) and chip body (4). Step 5: Chip drop. After the second film (32) and the chip (4) are separated, the chip (4) drops quickly onto the circuit layer (6) of the PCB board (7), and the chip (4) is finally dropped and installed. Step 6: Remove the transparent pin (5). After the chip body (4) is installed, apply an upward pulling force to the transparent pin (5). At this time, the transparent pin (5) separates from the chip film (3), thus removing the transparent pin (5). Step 7: Remove the irradiation tube (1). After the transparent pin (5) is removed, remove the irradiation tube (1) horizontally from above the chip film (3) to stop the chip film (3) from being irradiated by the light source (2) and continuing to undergo photolysis and pyrolysis reactions.

2. The method for solving the problem of die bonding transfer speed and accuracy on mini LEDs according to claim 1, characterized in that: The second membrane (32) has a downward protrusion structure in the middle, and at this time the transparent pin (5) is located at the upper end of the second membrane (32), and the lower end of the second membrane (32) is uniformly and effectively separated from the chip body (4).

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