A design layout defect repair method, storage medium and device

Abstract

The application relates to the technical field of figure repairing, and relates to a design layout defect repairing method, a storage medium and equipment, which comprise the following steps: providing a design layout and acquiring a mask layout through the design layout; acquiring defect information on the design layout; and repairing the mask layout according to the defect information and a preset repairing rule to obtain a repaired mask layout. The design layout defect repairing method, the storage medium and the equipment provided by the application solve the problem of long time consumption of the existing design layout repairing technology.

Description

[Technical Field]

[0001] This invention relates to the field of graphic restoration technology, and particularly to a method, storage medium, and device for repairing design layout defects. [Background Technology]

[0002] Existing graphic repair methods for design layouts rely heavily on engineers' experience, have low automation levels, and involve too many repair iterations, resulting in long repair cycles and high time consumption. [Summary of the Invention]

[0003] To address the problem of excessive time consumption in repairing design layouts, this invention provides a method, storage medium, and device for repairing design layout defects.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a design layout defect repair method, the method comprising the following steps: providing a design layout and obtaining a mask layout through the design layout; obtaining defect information on the design layout; and repairing the mask layout according to the defect information and preset repair rules to obtain a repaired mask layout.

[0005] Preferably, obtaining defect information on the design layout specifically includes the following steps: simulating the mask layout to obtain the initial exposure profile; and using photolithography rules to detect the exposure profile and the design layout to obtain the defect information.

[0006] Preferably, the defect information includes defect type information and defect location information, and the preset repair rule is a defect modification method corresponding to the defect type and defect location.

[0007] Preferably, repairing the design layout includes the following steps: repairing the mask layout includes the following steps: obtaining the defect edge of the mask layout corresponding to the defect based on the defect information; moving the defect edge according to the repair rules and the defect type information to obtain the repaired mask layout.

[0008] Preferably, obtaining the defect edge of the mask pattern corresponding to the defect based on the defect information includes the following steps: defining a marked area based on the defect location information; the edge of the mask pattern that at least partially falls within the marked area is the defect edge.

[0009] Preferably, the process of defining the marking area includes the following steps: obtaining the center point of the defect based on the defect location information; and defining the marking area according to a preset size, using the center point as a reference position.

[0010] Preferably, moving the defective edge according to the repair rule to obtain the repaired mask layout includes the following steps: determining the moving direction and moving distance of the defective edge according to the defect type information and the repair rule; moving the defective edge according to the moving direction and the moving distance.

[0011] Preferably, after repairing the defect, the method further includes the following steps: simulating and generating an exposure profile again on the repaired mask pattern and performing defect detection on the exposure profile; if the defect repair does not meet the preset conditions, then repairing the repaired mask pattern again.

[0012] Preferably, the mask pattern is a mask pattern that has undergone optical proximity correction (OPC), or a mask pattern that has not undergone OPC.

[0013] To solve the above-mentioned technical problems, the present invention provides another technical solution as follows: a computer-readable storage medium storing computer program instructions thereon, wherein the computer program instructions, when executed by a processor, implement the design layout defect repair method as described above.

[0014] To solve the above-mentioned technical problems, the present invention provides another technical solution as follows: a design layout defect repair device, the device comprising a device body and a device operating program, wherein the device body executes the device operating program to implement the design layout defect repair method as described above.

[0015] Compared with the prior art, the design layout defect repair method, storage medium, and device provided by the present invention have the following beneficial effects:

[0016] 1. The present invention provides a method for repairing defects in a design layout. The method includes the following steps: providing a design layout and obtaining a mask layout from the design layout; obtaining defect information on the design layout; and repairing the mask layout according to the defect information and preset repair rules to obtain a repaired mask layout. This method classifies and confirms defects in the design layout, can determine the type of defect, and, based on the preset repair rules for the defect type and the actual location of the defect, can quickly repair the defect. Overall, it can accurately determine defects in the design layout and quickly repair the mask layout, greatly reducing the time required for repairing design layout defects.

[0017] 2. The present invention provides a method for repairing design layout defects, which obtains defect information on the design layout. Specifically, it includes the following steps: simulating the mask layout to obtain the initial exposure contour; and performing photolithographic rule detection on the exposure contour and the design layout to obtain defect information. Simulating the mask layout to obtain the initial exposure contour, and then performing photolithographic rule detection on the exposure contour and the design layout to obtain defect information, allows for rapid acquisition of defect information. This facilitates subsequent defect classification and location based on the defect information, thereby reducing the time required for subsequent defect repair.

[0018] 3. The present invention provides a method for repairing design layout defects. The defect information includes defect type information and defect location information. The preset repair rule is a defect modification method corresponding to the defect type and defect location. By identifying the defect information on the design layout, subsequent steps can be facilitated based on the defect type and location. Identifying the type of design layout defect ensures that the subsequent repair method is corresponding. Determining the location of the design layout defect and the corresponding mask layout attributes facilitates the subsequent judgment, marking, and movement of the defect edges, improving the efficiency of design layout repair and reducing the time required.

[0019] 4. The present invention provides a method for repairing design layout defects, which includes the following steps: obtaining the defect edges of the mask layout corresponding to the defect based on defect information; moving the defect edges according to repair rules and defect type information to obtain a repaired mask layout. For different defects, the defect edges are moved directly according to preset repair rules based on the defect information to repair the defect, thus accelerating the defect repair process and reducing the time spent on defect repair.

[0020] 5. The design layout defect repair method provided by this invention, which obtains the defect edges of the mask layout corresponding to the defect based on defect information, includes the following steps: defining a marked area based on defect location information; edges of the mask layout that at least partially fall within the marked area are considered defect edges. Marking the defect location information based on the defect information facilitates subsequent defect edge determination. By defining the area, some edges of the mask layout fall within the defined area and are marked as defect edges. Determining defect edges through area identification facilitates subsequent defect repair and reduces the time spent on design layout defect repair.

[0021] 6. The present invention provides a method for repairing defects in a design layout, wherein defining a marked area includes the following steps: obtaining the center point of the defect based on the defect location information; and defining a marked area according to a preset size, using the center point as a reference position. Based on the type and location of the defect and the relationship with the marked edges, and simultaneously determining the movement direction of the edges through specific rules, defects in the design layout can be repaired more quickly, thereby reducing time consumption.

[0022] 7. The present invention provides a method for repairing design layout defects, which involves moving defective edges according to repair rules to obtain a repaired mask layout. The method includes the following steps: determining the moving direction and distance of the defective edge based on defect type information and repair rules; and moving the defective edge according to the moving direction and distance. By determining the moving direction and distance of the defective edge based on its type and location information, defects can be repaired more quickly and stably.

[0023] 8. The design layout defect repair method provided by the present invention further includes the following steps after defect repair: simulating and generating an exposure profile again on the repaired mask layout and performing defect detection on the exposure profile; if the defect repair does not meet a preset condition, then repairing the repaired mask layout again. By performing defect detection again on the simulated exposure profile generated from the repaired mask layout, it prevents the defect repair from failing to meet the preset condition. Repairing the repaired mask layout where the defect repair does not meet the preset condition continues, forming multiple iterations, until the final output repaired mask layout achieves the preset defect repair condition.

[0024] 9. The present invention provides a method for repairing design layout defects, wherein the mask layout is either a mask layout that has undergone optical proximity correction (OPC) or a mask layout that has not undergone OPC. Using a design layout that has undergone optical proximity correction can reduce design layout defects, thereby reducing the time required for design layout defect repair.

[0025] 10. The present invention provides a computer-readable storage medium having computer program instructions thereon, which, when executed by a processor, implement the above-described design layout defect repair method. This computer-readable storage medium has the same beneficial effects as the above-described design layout defect repair method, and will not be elaborated upon here.

[0026] 11. The present invention provides a design layout defect repair device, comprising a device body and a device operating program. When the device body executes the device operating program, it implements the aforementioned design layout defect repair method. This device has the same beneficial effects as the aforementioned design layout defect repair method, and will not be elaborated upon here. [Attached Image Description]

[0027] Figure 1 This is a flowchart of a design layout defect repair method provided in the first embodiment of the present invention.

[0028] Figure 2 This is a flowchart of step S0 of a design layout defect repair method provided in the first embodiment of the present invention.

[0029] Figure 3 This is a flowchart of step S2 of a design layout defect repair method provided in the first embodiment of the present invention.

[0030] Figure 4 This is a flowchart of step S3 of a design layout defect repair method provided in the first embodiment of the present invention.

[0031] Figure 5 This is a flowchart of step S31 of a design layout defect repair method provided in the first embodiment of the present invention.

[0032] Figure 6 This is a flowchart of step S311 of a design layout defect repair method provided in the first embodiment of the present invention.

[0033] Figure 7 This is a flowchart following step S312 of a design layout defect repair method provided in the first embodiment of the present invention.

[0034] Figure 8 This is a flowchart of step S4 of a design layout defect repair method provided in the first embodiment of the present invention.

[0035] Figure 9 This is a mask layout of an exemplary process for a design layout defect repair method provided in the first embodiment of the present invention.

[0036] Figure 10 This is an exemplary flow of a design layout defect repair method provided in the first embodiment of the present invention, showing a marked defect edge mask layout.

[0037] Figure 11 This is the mask layout after the 2nd to 5th iterations of an exemplary flow of a design layout defect repair method provided in the first embodiment of the present invention.

[0038] Figure 12 This is a schematic diagram of the structure of a computer-readable storage medium provided in the second embodiment of the present invention.

[0039] Figure 13 This is a schematic diagram of a design layout defect repair device provided in the third embodiment of the present invention.

[0040] Explanation of reference numerals in the attached diagram:

[0041] 100. Computer-readable storage media; 200. Design layout defect repair equipment;

[0042] 110. Computer program instructions; 210. Equipment body; 220. Equipment operating program.

Detailed Implementation Methods

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0044] As an explanation, the defects in this invention, namely the defects in the design layout, exist on the design layout itself. The defects in the mask layout obtained through the design layout originate from the defects in the design layout, rather than from defects caused by the process flow in obtaining the mask layout.

[0045] Please see Figure 1 The first embodiment of the present invention provides a method for repairing design layout defects, comprising the following steps:

[0046] S1: Provide the design layout and obtain the mask layout through the design layout;

[0047] S2: Obtain defect information on the design layout;

[0048] S3: Repair the mask pattern according to the defect information and the preset repair rules to obtain the repaired mask pattern.

[0049] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects. This method classifies and confirms the defects in the design layout, determines the type of defect, and repairs the defect quickly by using a preset repair rule based on the defect type and the actual location of the defect. Overall, it can accurately determine the defects in the design layout and quickly repair the mask layout, greatly reducing the time required to repair design layout defects.

[0050] Please see Figure 2 The first embodiment of the present invention provides a method for repairing design layout defects, which further includes the following steps after step S1:

[0051] S100: Perform optical proximity correction on the provided mask pattern.

[0052] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects. The mask layout is either a mask layout that has undergone optical proximity correction (OPC) or a mask layout that has not undergone OPC. Using a design layout that has undergone optical proximity correction can reduce design layout defects, thereby reducing the time required for design layout defect repair.

[0053] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects, which does not limit whether the mask layout obtained from the provided design layout has been repaired by OPC. As a preferred embodiment, the mask layout in this embodiment is the mask layout that has been repaired by OPC in step S0.

[0054] Please see Figure 3 The first embodiment of the present invention provides a method for repairing defects in a design layout. In step S2, defect information on the design layout is obtained, specifically including the following steps:

[0055] S21: Simulate the mask pattern to obtain the initial exposure profile;

[0056] S22: Defect information is obtained by detecting the exposed outline and design pattern using photolithography rules.

[0057] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects. The method simulates the mask layout to obtain the initial exposure profile, and performs photolithography rule detection on the exposure profile and the design layout to obtain defect information. This method can quickly obtain defect information, which facilitates subsequent classification and location of defects based on the defect information, thereby reducing the time required for subsequent defect repair.

[0058] Specifically, defect information includes defect type information and defect location information. Defect types can be categorized as EPE (Edge Placement Error), PINCH (Open Circuit), and BRIDGE (Short Circuit), etc. Defect location refers to the position of the defect in the design layout within its corresponding mask layout.

[0059] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects. By identifying defect information on the design layout, subsequent steps can be more conveniently performed based on the type and location of the defects. Identifying the type of design layout defect ensures that the subsequent repair method is corresponding. Determining the position of the design layout defect on the mask layout facilitates the subsequent identification, marking, and movement of the defect edges, improving the efficiency of design layout repair and reducing the time required.

[0060] Please see Figure 4 The first embodiment of the present invention provides a method for repairing design layout defects. Step S3, which repairs the design layout, includes the following steps:

[0061] S31: Obtain the defect edge of the mask pattern corresponding to the defect based on the defect information;

[0062] S32: Move the defect edges according to the repair rules and defect type information to obtain the repaired mask pattern.

[0063] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects. For different defects, the method directly moves the defect edge according to the defect information and preset repair rules to repair the defect, thereby speeding up the defect repair process and reducing the time spent on defect repair.

[0064] Specifically, the preset repair rules are based on the defect type and the corresponding defect modification method according to the defect location.

[0065] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects. Defects can be classified as EPE, PINCH, and BRIDGE, and the modification methods used vary depending on the type and location of the defect.

[0066] Please see Figure 5 The first embodiment of the present invention provides a method for repairing design layout defects, wherein step S31 includes the following steps:

[0067] S311: Define the marking area based on the defect location information;

[0068] S312: Edges of the mask pattern that fall at least partially within the marked area are defective edges.

[0069] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects. A defined region is formed using defect location information. Marking the defect location information based on the defect information facilitates subsequent determination of defect edges. The defined region ensures that some edges of the mask layout fall within it and are marked as defect edges. Determining defect edges through the region facilitates subsequent defect repair and reduces the time spent on design layout defect repair.

[0070] Please see Figure 6 The first embodiment of the present invention provides a method for repairing design layout defects. Step S311, which defines the calibration area, includes the following steps:

[0071] S311a: Obtain the center point of the defect based on the defect location information;

[0072] S311b: Using the center point as the reference position, define the marking area according to the preset size.

[0073] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects. A marked area is defined according to a preset size with the location of the defect as the center point, that is, a rectangular frame is formed with the defect as the center point. The area contained in the rectangular frame is the defined area. If the edge of the mask layout at the location of the defect is contained in the rectangular frame, or if the edge of the mask layout at the location of the defect coincides with or intersects with the boundary of the rectangular frame, then the edge of the mask layout inside the rectangular frame or the edge of the mask layout that intersects with or overlaps with the rectangular frame is determined to be a defect edge.

[0074] Please see Figure 7 The first embodiment of the present invention provides a method for repairing design layout defects, wherein step S312 further includes the following steps:

[0075] S313: Determine the direction and distance of movement of the defect edge based on the defect type information and repair rules;

[0076] S314: Move the defect edge according to the direction and distance of movement.

[0077] Understandably, the first embodiment of the present invention provides a method for repairing design layout defects. By moving the corresponding edge of the mask layout corresponding to the defect, i.e., the defect edge, until the defect reaches a preset state, the design layout defect can be repaired. By determining the movement direction and distance of the defect edge based on the defect type and location information, the defect can be repaired more quickly and stably.

[0078] For example, in step S311, a marking area is defined according to the defect type. Based on this marking area, the marked edges can be moved according to specific rules. For instance, for defects with a positive EPE value (i.e., edge placement error greater than 0), the marked edge should move inwards towards the marking area; conversely, for defects with a negative EPE value (i.e., edge placement error less than 0), the marked edge should move outwards towards the marking area. Edges marked by PINCH defects should move outwards towards the marking area, while edges marked by BRIDGE defects need to move inwards towards the marking area.

[0079] Please see Figure 8 The first embodiment of the present invention provides a method for repairing design layout defects, which further includes the following steps after step S3:

[0080] S4: Simulate the repaired mask pattern again to generate the exposure profile and perform defect detection on the exposure profile. If the defect repair does not meet the preset conditions, repair the repaired mask pattern again.

[0081] Understandably, the first embodiment of the present invention provides a design layout defect repair method. By performing defect detection again on the repaired design layout, it is possible to prevent the defect repair from failing to meet the preset condition. The repaired mask layout that fails to meet the preset condition continues to be repaired, forming multiple iterations, until the final output repaired mask layout meets the preset condition for defect repair.

[0082] For example, provide a block such as Figure 9 The mask pattern shown is manually modified using OPC, which involves simulating to obtain the initial exposure profile. Defect detection is then performed on the initial exposure profile, and an EPE defect is detected. As shown in Figure 10, the EPE defect is marked with a defect edge. The mask pattern is then iteratively repaired multiple times until the EPE defect at that location is repaired.

[0083] Specifically, the steps are as follows:

[0084] S201: Simulate the mask pattern after the first OPC correction to obtain the exposure profile;

[0085] S202: Defect detection is performed on the exposure profile, and it is found that the simulated exposure profile has an EPE defect;

[0086] S203: Obtain the location information of the EPE defect;

[0087] S204: Using the location information of the EPE defect, a defined area is formed with the EPE defect as the center;

[0088] S205: Determine the defect edge of the mask pattern where the EPE defect is located by defining the region;

[0089] S206: Based on the position information of the EPE defect and the defect edge, move the defect edge to repair the EPE defect in the mask pattern;

[0090] S207: Perform defect detection on the repaired mask pattern. If the defect repair does not meet the preset conditions, repeat the above steps.

[0091] Specifically, Figure 11 The image shows the mask layout after the 2nd to 5th iterations. In this embodiment, the mask layout was repaired after five iterations.

[0092] In summary, the first embodiment of the present invention provides a design layout correction method, which provides a design layout and obtains a mask layout of the design layout. The mask layout is simulated to obtain an initial exposure profile. Photolithographic rule detection is performed on the exposure profile and the design layout to obtain defect information on the design layout. Based on the positional information on the mask layout corresponding to the defect information on the design layout, a marked area centered on the defect is defined. The defect edge is determined by the relationship between the marked area and the edge of the mask layout where the defect is located. The defect edge is moved according to the defect information and the positional relationship between the defect and the defect edge, so that the defect reaches a preset state, completing the defect repair of the design layout. The repaired mask layout is subjected to a second defect check on the simulated exposure profile generated by simulation. If the defect does not reach the preset state, repair is performed again, forming an iteration. Multiple iterations are performed until a mask layout with completely repaired defects is output.

[0093] Please see Figure 12 The second embodiment of the present invention provides a computer-readable storage medium 100 having computer program instructions 110 thereon, which, when executed by a processor, implement the above-described mask layout correction method.

[0094] Understandably, the computer-readable storage medium 100 in the second embodiment of the present invention stores computer program instructions 110, which can be called by a processor to execute the design layout defect repair method described in the first embodiment above. The computer-readable storage medium 100 has the same beneficial effects as the design layout defect repair method described above, which will not be repeated here.

[0095] Specifically, the computer-readable storage medium 100 may be an electronic storage device such as flash memory, EEPROM (Electrically Erasable Programmable Read-Only Memory), EPROM, hard disk, or ROM.

[0096] Optionally, the computer-readable storage medium 100 includes a non-volatile computer-readable medium.

[0097] Specifically, the computer-readable storage medium 100 has storage space for computer program instructions 110 that perform any of the method steps described above. These program instructions can be read from or written to one or more computer program products. Optionally, the computer program instructions 110 may be compressed in an appropriate form.

[0098] Please see Figure 13 The third embodiment of the present invention provides a design layout defect repair device 200, including a device body 210 and a device running program 220. When the device body 210 executes the device running program 220, it implements the above-mentioned design layout defect repair method.

[0099] It is understood that when the design layout defect repair device 200 in the third embodiment of the present invention is running, the device body 210 can implement the method described in the first embodiment when executing the device running program 220. The device has the same beneficial effects as the above-described design layout defect repair method, which will not be elaborated here.

[0100] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0101] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0102] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0103] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0104] Compared with the prior art, the design layout defect repair method provided by the present invention has the following beneficial effects:

[0105] 1. The present invention provides a method for repairing defects in a design layout. The method includes the following steps: providing a design layout and obtaining a mask layout from the design layout; obtaining defect information on the design layout; and repairing the mask layout according to the defect information and preset repair rules to obtain a repaired mask layout. This method classifies and confirms defects in the design layout, can determine the type of defect, and, based on the preset repair rules for the defect type and the actual location of the defect, can quickly repair the defect. Overall, it can accurately determine defects in the design layout and quickly repair the mask layout, greatly reducing the time required for repairing design layout defects.

[0106] 2. The present invention provides a method for repairing design layout defects, which obtains defect information on the design layout. Specifically, it includes the following steps: simulating the mask layout to obtain the initial exposure contour; and performing photolithographic rule detection on the exposure contour and the design layout to obtain defect information. Simulating the mask layout to obtain the initial exposure contour, and then performing photolithographic rule detection on the exposure contour and the design layout to obtain defect information, allows for rapid acquisition of defect information. This facilitates subsequent defect classification and location based on the defect information, thereby reducing the time required for subsequent defect repair.

[0107] 3. The present invention provides a method for repairing design layout defects. The defect information includes defect type information and defect location information. The preset repair rule is a defect modification method corresponding to the defect type and defect location. By identifying the defect information on the design layout, subsequent steps can be facilitated based on the defect type and location. Identifying the type of design layout defect ensures that the subsequent repair method is corresponding. Determining the location of the design layout defect and the corresponding mask layout attributes facilitates the subsequent judgment, marking, and movement of the defect edges, improving the efficiency of design layout repair and reducing the time required.

[0108] 4. The present invention provides a method for repairing design layout defects, which includes the following steps: obtaining the defect edges of the mask layout corresponding to the defect based on defect information; moving the defect edges according to repair rules and defect type information to obtain a repaired mask layout. For different defects, the defect edges are moved directly according to preset repair rules based on the defect information to repair the defect, thus accelerating the defect repair process and reducing the time spent on defect repair.

[0109] 5. The design layout defect repair method provided by this invention, which obtains the defect edges of the mask layout corresponding to the defect based on defect information, includes the following steps: defining a marked area based on defect location information; edges of the mask layout that at least partially fall within the marked area are considered defect edges. Marking the defect location information based on the defect information facilitates subsequent defect edge determination. By defining the area, some edges of the mask layout fall within the defined area and are marked as defect edges. Determining defect edges through area identification facilitates subsequent defect repair and reduces the time spent on design layout defect repair.

[0110] 6. The present invention provides a method for repairing defects in a design layout, wherein defining a marked area includes the following steps: obtaining the center point of the defect based on the defect location information; and defining a marked area according to a preset size, using the center point as a reference position. Based on the type and location of the defect and the relationship with the marked edges, and simultaneously determining the movement direction of the edges through specific rules, defects in the design layout can be repaired more quickly, thereby reducing time consumption.

[0111] 7. The present invention provides a method for repairing design layout defects, which involves moving defective edges according to repair rules to obtain a repaired mask layout. The method includes the following steps: determining the moving direction and distance of the defective edge based on defect type information and repair rules; and moving the defective edge according to the moving direction and distance. By determining the moving direction and distance of the defective edge based on its type and location information, defects can be repaired more quickly and stably.

[0112] 8. The design layout defect repair method provided by the present invention further includes the following steps after defect repair: simulating and generating an exposure profile again on the repaired mask layout and performing defect detection on the exposure profile; if the defect repair does not meet a preset condition, then repairing the repaired mask layout again. By performing defect detection again on the simulated exposure profile generated from the repaired mask layout, it prevents the defect repair from failing to meet the preset condition. Repairing the repaired mask layout where the defect repair does not meet the preset condition continues, forming multiple iterations, until the final output repaired mask layout achieves the preset defect repair condition.

[0113] 9. The present invention provides a method for repairing design layout defects, wherein the mask layout is either a mask layout that has undergone optical proximity correction (OPC) or a mask layout that has not undergone OPC. Using a design layout that has undergone optical proximity correction can reduce design layout defects, thereby reducing the time required for design layout defect repair.

[0114] 10. The present invention provides a computer-readable storage medium having computer program instructions thereon, which, when executed by a processor, implement the above-described design layout defect repair method. This computer-readable storage medium has the same beneficial effects as the above-described design layout defect repair method, and will not be elaborated upon here.

[0115] 11. The present invention provides a design layout defect repair device, comprising a device body and a device operating program. When the device body executes the device operating program, it implements the aforementioned design layout defect repair method. This device has the same beneficial effects as the aforementioned design layout defect repair method, and will not be elaborated upon here.

[0116] The foregoing has provided a detailed description of a design layout defect repair method, storage medium, and device disclosed in the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for repairing defects in a design layout, characterized in that: The method includes the following steps: Provide the design layout and obtain the mask layout from the design layout; Obtain defect information on the design layout; The mask pattern is repaired according to the defect information and the preset repair rules to obtain the repaired mask pattern; Obtaining defect information on the design layout specifically includes the following steps: The initial exposure profile is obtained by simulating the mask pattern. The defect information is obtained by photolithographic rule detection of the exposure contour and the design pattern; The defect information includes defect type information and defect location information. The defect location is the position of the defect in the design layout within the mask layout. The preset repair rule is the defect modification method based on the defect type and defect location.

2. The design layout defect repair method as described in claim 1, characterized in that: Repairing the mask pattern includes the following steps: Obtain the defect edge of the mask layout corresponding to the defect based on the defect information; The repaired mask pattern is obtained by moving the defect edges according to the repair rules and the defect type information.

3. The design layout defect repair method as described in claim 2, characterized in that: Obtaining the defect edge of the mask pattern corresponding to the defect based on the defect information includes the following steps: The marked area is defined based on the defect location information; The edges of the mask pattern that at least partially fall within the marked area are the defect edges.

4. The design layout defect repair method as described in claim 3, characterized in that: The process of defining the marked area includes the following steps: The center point of the defect is obtained based on the defect location information; The marking area is defined according to a preset size, with the center point as the reference position.

5. The design layout defect repair method as described in claim 3, characterized in that: The process of moving the defective edge according to the repair rules to obtain the repaired mask pattern includes the following steps: The direction and distance of movement of the defective edge are determined based on the defect type information and the repair rules. The defective edge is moved according to the moving direction and the moving distance.

6. The design layout defect repair method as described in claim 2, characterized in that: After fixing the defect, the following steps are also included: The repaired mask pattern is then simulated again to generate an exposure profile, and defects are detected in the exposure profile. If the defect repair does not meet the preset requirements, the repaired mask pattern will be repaired again.

7. The design layout defect repair method as described in claim 1, characterized in that: The mask pattern is either a mask pattern that has undergone optical proximity correction (OPC) or a mask pattern that has not undergone OPC.

8. A computer-readable storage medium storing computer program instructions thereon, characterized in that: When the computer program instructions are executed by the processor, they implement the method as described in any one of claims 1-7.

9. A design layout defect repair device, characterized in that: The device includes a device body and a device operating program, wherein the device body executes the device operating program to implement the method as described in any one of claims 1-7.

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