Rotary cable-type protection guide device
By using columnar sliding improvement rollers and track guide rollers in rotary cable protection and guidance devices, the space requirement problem caused by the increase in the outer diameter of the device is solved, achieving miniaturization and cost reduction.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2021-11-23
- Publication Date
- 2026-07-14
Smart Images
Figure CN114572760B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a rotary cable protection and guiding device for protecting and guiding cables, hoses and / or tubes (hereinafter also referred to as "cables"). Background Technology
[0002] In semiconductor manufacturing apparatuses, a large number of cables for supplying power or fluids (such as air or water) are typically built into the processing unit that performs the desired processing on the workpiece. Furthermore, in semiconductor manufacturing apparatuses, at least a portion of the processing unit is usually rotated during the processing of the workpiece.
[0003] When at least a portion of the processing unit is rotated, cables connected to the processing unit may become entangled. As a means to prevent such a problem, a rotating cable protection guide device is known (see Patent Document 1).
[0004] A known rotary cable protection and guiding device includes a cable protection and guiding component for protecting and guiding cables. One end of the cable protection and guiding component is connected to the inner circular wall of an outer peripheral guide drum component fixed to a mounting surface, and the other end of the cable protection and guiding component is connected to the outer circular wall of an inner peripheral guide drum component. Furthermore, these walls are arranged in a concentric circle shape.
[0005] Furthermore, the inner peripheral guide drum component can rotate around a straight line perpendicular to the mounting surface, passing through the center of the outer circular wall. In this device, the rotation of the inner peripheral guide drum component causes cable protection guide components to wrap around the wall of the inner peripheral guide drum component. By unwinding the cable protection guide components wrapped around the wall, the possibility of cable entanglement is reduced.
[0006] In addition, the device includes a guide frame (guide member) for stabilizing the track (bending track) of the cable protection guide member in the annular space between the wall of the outer peripheral guide drum member and the wall of the inner peripheral guide drum member. The guide frame has an arc-shaped wall that is concentric with the wall of the outer peripheral guide drum member, and the cable protection guide member is guided through this wall.
[0007] Patent Document 1: Japanese Patent Application Publication No. 2009-44809
[0008] In the aforementioned rotary cable protection and guiding device, a guide frame is provided in the annular space where the cable protection and guiding components are arranged, thus increasing the outer diameter of the device. If the outer diameter of the device is increased in this way, the required installation area for mounting the device also increases. For example, if this device is mounted in a semiconductor manufacturing apparatus, the semiconductor manufacturing apparatus itself must also be enlarged.
[0009] Semiconductor manufacturing facilities are typically housed in cleanrooms. Therefore, setting up a large semiconductor manufacturing facility requires either a large cleanroom or a significant portion of the cleanroom's space being allocated to the semiconductor manufacturing facility. In this case, the manufacturing and maintenance costs of the cleanroom increase, and its convenience may be reduced. Summary of the Invention
[0010] In view of this, the object of the present invention is to provide a small, rotating cable protection guide device that can stabilize the track of the cable protection guide component in an annular space in which the cable protection guide component is disposed.
[0011] According to one aspect of the present invention, a rotary cable protection guide device is provided, the rotary cable protection guide device having: an outer peripheral portion facing the outer surface of an annular space; an inner peripheral portion facing the inner surface of the annular space; and a cable protection guide member disposed in the annular space, and including a movable end capable of moving circumferentially along the annular space and a fixed end disposed at a predetermined position in the annular space, wherein a columnar track guide roller extending along a rotation axis direction perpendicular to the circumferential direction is disposed in the annular space, the track guide roller being moved by the movable end to contact and rotate the cable protection guide member.
[0012] Preferably, the outer periphery has a plurality of columnar outer sliding improvement rollers extending along the rotation axis and facing the outer surface of the annular space. The outer sliding improvement rollers move through the moving end to contact and rotate with the cable protection guide component.
[0013] Preferably, the inner circumference has a plurality of columnar inner sliding improvement rollers extending along the rotation axis and facing the inner surface of the annular space. These inner sliding improvement rollers move via the moving end to contact and rotate the cable protection guide component.
[0014] In this invention, a track guide roller is disposed in an annular space. The track guide roller moves through the moving end of the cable protection guide component to contact and rotate with the cable protection guide component. The track guide roller is a columnar structure extending along a rotation axis direction perpendicular to the circumference of the annular space.
[0015] When the cable protection guide component moves within the annular space and comes into contact with the track guide roller, the track guide roller rotates, thereby ensuring smooth movement of the cable protection guide component. Therefore, in this invention, the track guide roller can guide the cable protection guide component, thus stabilizing its track.
[0016] Furthermore, the installation area of such track guide rollers is smaller than that of the guide frame with its arc-shaped wall in conventional rotary cable protection guide devices. Therefore, in this invention, a smaller rotary cable protection guide device can be provided compared to conventional rotary cable protection guide devices. Attached Figure Description
[0017] Figure 1 (A) is a side view schematically illustrating an example of a cable protection guide device. Figure 1 (B) is a top view schematically illustrating an example of a cable protection guide device.
[0018] Figure 2 (A) and Figure 2 (B) is a top view schematically showing an example of a cable protection guide device in which the moving end of the cable protection guide component has been moved.
[0019] Figure 3 This is a block diagram schematically illustrating an example of the components of a semiconductor manufacturing apparatus.
[0020] Figure 4 It is a schematic perspective view showing a workpiece unit containing the workpiece.
[0021] Figure 5 It is a schematic cross-sectional view showing the expansion unit, hot air jet unit, and cooling workbench.
[0022] Figure 6 It is a block diagram schematically showing the connection relationship between the cooling workbench and the drying gas supply unit, lifting unit, cooling unit and suction unit.
[0023] Label Explanation
[0024] 2: Cable protection and guiding device; 4: First plate (upper plate) (4a, 4b: openings); 6: Roller (outer sliding improvement roller); 8: Roller (inner sliding improvement roller); 10: Roller (track guide roller); 12: Second plate (lower plate) (12a, 12b: openings); 14: Cable protection and guiding component (14a: cable, 14b: moving end, 14c: fixed end); 16a, 16b: bracket; 18: Rotated object; 20: Power supply (power and fluid (air or water, etc.) supply source); 22: Rotating shaft; 24: Rotation drive source; 1: Workpiece unit; 11: Workpiece; 13: Pre-defined dividing line (spacer); 15: Semiconductor device; 17: Modified layer; 21: Adhesive film; 23: Extension sheet; 25: Frame; 30: Semiconductor manufacturing apparatus (extension device); 32: Extension unit; 34: Cylinder; 36 38: Piston rod; 40: Support worktable; 42: Fixing plate; 44: Drum; 46: Hot air jet unit; 48: Heating plate; 50: Hot air jet section; 52: Jet section body; 54: Coil heater; 56: Gate; 58: Rotation drive source (motor for gate rotation); 60: Opening; 62: Support rod; 64: Cooling worktable (64a: Abutment surface, 64b: Back surface, 64c: Outer peripheral surface); 66: Through hole; 68: Cover component (68a: Back cover, 68b: Opening; 68c: Outer peripheral cover, 68d: Connector insertion part); 70: Gap; 72, 74: Connector; 76: Dry gas supply unit; 78: Lifting unit; 80: Cooling unit; 82: Suction unit; 84, 86, 88: Valve; 90: Control unit; 92: Processing section; 94: Storage section; 96: Input unit. Detailed Implementation
[0025] The embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 (A) is a side view schematically illustrating an example of a cable protection guide device. Figure 1 (B) is a top view schematically illustrating an example of a cable protection guide device. Additionally, in Figure 1 In (A), for ease of explanation, the constituent elements associated with cable protection and guidance devices are depicted in boxes.
[0026] Figure 1 (A) and Figure 1 The cable protection guide device 2 shown in (B) includes a disc-shaped first plate (upper plate) 4 having one generally parallel surface (upper surface) and another surface (lower surface). A generally circular opening 4a extending from one surface to the other is provided in the central region of the first plate 4. In addition, an arc-shaped (C-shaped) opening 4b extending from one surface to the other along the outer periphery of the first plate 4 is provided on the first plate 4.
[0027] In the region near the outer edge of the first plate 4 (the region further outward than the opening 4b when viewed from the center of the first plate 4), one end of a plurality of rollers (outer sliding improvement rollers) 6 is connected. The plurality of rollers 6 are connected to the first plate 4 in a manner that allows them to rotate independently, and have a columnar shape that extends in a direction perpendicular to one and the other surfaces of the first plate 4.
[0028] Furthermore, multiple rollers 6 are arranged at approximately equal intervals along the circumference of the first plate 4. Additionally, in Figure 1 In (A), for ease of explanation, a portion of the multiple rollers 6 is omitted (specifically, the 5 rollers 6 that are in front when viewed from the side of the 12 rollers 6).
[0029] One end of a plurality of rollers (inner sliding improvement rollers) 8 is connected to the region near the opening 4a of the first plate 4. The plurality of rollers 8 are connected to the first plate 4 in a manner that allows them to rotate independently, and have a columnar shape that extends in a direction perpendicular to one and the other surfaces of the first plate 4.
[0030] Furthermore, the multiple rollers 8 are arranged at approximately equal intervals along the circumference of the opening 4a. In addition, the height of the rollers 8 (the length in the direction perpendicular to one face and the other face of the first plate 4) is approximately equal to the height of the rollers 6, and the width of the rollers 8 (the length in the direction parallel to one face and the other face of the first plate 4) is, for example, narrower than the width of the rollers 6.
[0031] One end of a roller (track guide roller) 10 is connected to the region between openings 4a and 4b of the first plate 4. The roller 10 is connected to the first plate 4 in a manner that allows it to rotate independently, and has a columnar shape extending in a direction perpendicular to one and the other surfaces of the first plate 4. In addition, the height of the roller 10 is approximately equal to the height of the rollers 6 and 8, and the width of the roller 10 is, for example, wider than the width of the rollers 6 and 8.
[0032] A disc-shaped second plate (lower plate) 12 is connected to the other ends of the plurality of rollers 6, the plurality of rollers 8, and the roller 10. The second plate 12 has a surface (upper surface) and a surface (lower surface) that are substantially parallel to one and another surface of the first plate 4. In addition, the plurality of rollers 6, the plurality of rollers 8, and the roller 10 are each connected to the second plate 12 in a manner that allows them to rotate independently.
[0033] A generally circular opening 12a is provided in the central region of the second plate 12, extending from one surface of the second plate 12 to the other. The outline of the opening 12a, when viewed from above, generally overlaps with the outline of the opening 4a of the first plate 4.
[0034] Additionally, an opening 12b is provided on the second plate 12 in a region further outward than the plurality of rollers 8, extending from one surface of the second plate 12 to the other. When viewed from above, this opening 12b is positioned further inward than the opening 4b of the first plate 4. More specifically, when viewed from above, this opening 12b is positioned between the middle of the C-shaped opening 4b and openings 4a and 12a, that is, it is positioned closer to openings 4a and 12a than opening 4b.
[0035] In the cable protection and guiding device 2, an annular space A is formed by a first plate 4, multiple rollers 6, multiple rollers 8, and a second plate 12. Specifically, the first plate 4 and the second plate 12 face the upper and lower surfaces of the annular space A, respectively, the multiple rollers 6 face the outer surface of the annular space A, and the multiple rollers 8 face the inner surface of the annular space A.
[0036] A cable protection guide 14 is disposed in the annular space A. The cable protection guide 14 accommodates cables 14a that are bent along the circumferential direction B of the annular space A. The circumferential direction B is perpendicular to the upper and lower surfaces of the first plate 4 and the second plate 12. The cable protection guide 14 includes a moving end 14b and a fixed end 14c, both of which contain a housing for determining the orientation of the bent cables 14a in a direction perpendicular to the circumferential direction B of the annular space A.
[0037] When viewed from above, the movable end 14b overlaps with the opening 4b of the first plate 4. That is, the movable end 14b is exposed from the first plate 4 through the opening 4b. In addition, a bracket 16a is fixed to the side of the housing of the movable end 14b.
[0038] The bracket 16a has an L-shaped form and includes: a long side portion extending perpendicularly to the upper and lower surfaces of the first plate 4; and a short side portion having an end portion connected to one end of the long side portion, extending parallel to the upper and lower surfaces of the first plate 4. Furthermore, the long side portion of the bracket 16a is fixed to the side of the housing of the movable end 14b.
[0039] Furthermore, the long side of the bracket 16a extends upward toward the first plate 4 through the opening 4b, and the short side of the bracket 16a is fixed to the rotating object 18, which is located outside the cable protection guide device 2. The rotating object 18 is a rotatable component included in the processing unit that performs the desired processing on the object being processed. Therefore, when the rotating object 18 rotates, the moving end 14b, which is fixed to the rotating object 18 via the bracket 16a, also moves, and the relative position of the first plate 4 and the moving end 14b changes.
[0040] At least a portion of the fixed end 14c overlaps with the opening 12b of the second plate 12 when viewed from above. That is, at least a portion of the fixed end 14c is exposed from the second plate 12 through the opening 12b. In addition, a bracket 16b is fixed to the side of the housing of the fixed end 14c.
[0041] The bracket 16b has an L-shaped form and includes: a long side portion extending perpendicularly to the upper and lower surfaces of the second plate 12; and a short side portion having an end portion connected to one end of the long side portion, extending parallel to the upper and lower surfaces of the second plate 12. Furthermore, the long side portion of the bracket 16b is fixed to the side of the housing of the fixed end 14c.
[0042] Furthermore, the long side of the bracket 16b extends from the side of the housing of the fixed end 14c to one surface of the second plate 12, and the short side of the bracket 16b is fixed to the second plate 12. Therefore, the relative position of the second plate 12 and the fixed end 14c does not change.
[0043] Additionally, the cable type 14a bent at the moving end 14b is connected to the terminal of the processing unit containing the rotated object 18 through the opening 4b of the first plate 4. Furthermore, the cable type 14a bent at the fixed end 14c is connected to the terminal of the power supply type (power and fluid (air or water, etc.) source) 20 through the opening 12b of the second plate 12.
[0044] Furthermore, a rotating shaft 22 for rotating the rotating object 18 contained in the processing unit is inserted into the opening 4a of the first plate 4 and the opening 12a of the second plate 12. One end of the rotating shaft 22 is fixed to the center of the rotating object 18, and the other end of the rotating shaft 22 is connected to a rotation drive source 24 including an electric motor or the like.
[0045] Alternatively, the cable protection guide 2 may be supported, for example, by a support (not shown) connected to at least one of the first plate 4 and the second plate 12. Or, the cable protection guide 2 may be supported by the rotating shaft 22 via a bearing (not shown) disposed between at least one of the first plate 4 and the second plate 12 and the rotating shaft 22.
[0046] In the cable protection and guiding device 2, the short side of the bracket 16a fixed to the object to be rotated 18 is positioned away from the rotation axis 22. Therefore, when the rotation drive source 24 rotates the rotation axis 22, the moving end 14b moves in a manner that rotates around the rotation axis 22.
[0047] At this time, the cable type 14a disposed in the annular space A also moves along with the moving end 14b. Therefore, by providing the cable type protection and guiding device 2 between the power supply type 20 and the processing unit containing the object to be rotated 18, the object to be rotated 18 can be rotated while maintaining the state in which the cable type 14a is connected to the processing unit.
[0048] Specifically, the rotary drive source 24 can rotate the rotary shaft 22 180° along the circumferential direction B of the annular space A. When the rotary drive source 24 rotates the rotary shaft 22 in this way, the movable end 14b, which is fixed to the processing unit 18 via the bracket 16a, moves together with the object being rotated 18 along the circumferential direction B of the annular space A.
[0049] Figure 2 (A) is a top view schematically showing an example of a cable protection guide device 2 in which the movable end 14b has been moved by rotating 90° about the rotation axis 22. Figure 2 (B) is a top view schematically showing an example of a cable protection guide device 2 in which the movable end 14b is moved by rotating 180° around the rotation axis 22.
[0050] When the movable end 14b is moved by rotating 90° around the rotation axis 22 (see reference) Figure 2 (A) The curvature of the curved cable protection guide 14 increases. Furthermore, when the moving end 14b moves, the cable protection guide 14 comes into contact with the roller 6. At this time, the roller 6 rotates due to the frictional force generated by its contact with the rotating cable protection guide 14.
[0051] When the movable end 14b is moved by rotating 180° around the rotation axis 22 (see reference) Figure 2 (B) The curvature of the curved cable protection guide 14 is further increased. Additionally, when the moving end 14b moves, the cable protection guide 14 comes into contact with the rollers 8 and 10. At this time, the rollers 8 and 10 rotate due to the frictional force generated by their contact with the rotating cable protection guide 14.
[0052] Additionally, the rotation drive source 24 can also rotate the rotation shaft 22 180° in the opposite direction of the circumferential direction B of the annular space A, so as to... Figure 2 The state shown in (B) returns to Figure 1 The state shown in (B).
[0053] In the cable protection and guiding device 2, a roller (track guide roller) 10 is arranged in the annular space A. The moving end 14b of the cable protection and guiding component 14 moves, so that the roller (track guide roller) 10 contacts and rotates with the cable protection and guiding component 14. The roller (track guide roller) 10 is a columnar structure extending in a direction perpendicular to the circumferential direction B of the annular space A (i.e., the direction of the rotation axis 22).
[0054] When the cable protection guide component 14 moves and comes into contact with the roller 10 in the annular space A, the roller 10 rotates, thereby allowing the cable protection guide component 14 to move smoothly. Therefore, in the cable protection guide device 2, the cable protection guide component 14 can be guided by the roller 10 to stabilize its track.
[0055] Furthermore, the installation area of roller 10 is smaller than that of the guide frame with an arc-shaped wall in conventional rotary cable protection guide devices. Therefore, the cable protection guide device 2 is a miniaturized device compared to conventional rotary cable protection guide devices.
[0056] Furthermore, the cable protection guide device 2 is one embodiment of the present invention, and within the scope of the present invention, devices having features different from those of the cable protection guide device 2 are also included. For example, in the present invention, multiple rollers 6 can be replaced with an outer wall and / or multiple rollers 8 can be replaced with an inner wall.
[0057] Specifically, in the cable protection and guiding device of the present invention, the outer wall can form an outer peripheral portion facing the outer side of the annular space A and / or the inner wall can form an inner peripheral portion facing the inner side of the annular space A.
[0058] However, as described above, the multiple rollers (outer sliding improvement rollers) 6 and the multiple rollers (inner sliding improvement rollers) 8 move through the moving end 14b to contact and rotate with the cable protection guide member 14. In this case, the proportion of the frictional force generated by the contact between the rollers 6, 8 and the cable protection guide member 14 that acts as resistance to the movement of the cable protection guide member 14 becomes smaller.
[0059] That is, in the presence of rollers 6 and 8, the movement of the cable protection guide member 14, which accompanies the movement of the moving end 14b, is hardly suppressed. Therefore, in this invention, it is preferable that the plurality of rollers 6 face the outer side of the annular space A and / or that the plurality of rollers 8 face the inner side of the annular space A.
[0060] Furthermore, in the cable protection guide device 2, an opening 4b is provided in an arc shape with a central angle of approximately 180°. Therefore, the moving end 14b of the cable protection guide component 14 can only rotate 180° around the rotation axis 22. However, in the cable protection guide device of the present invention, the range of movement of the moving end 14b is not limited to this.
[0061] Specifically, in the cable protection guiding device of the present invention, the movement range of the moving end of the cable protection guiding component can be further expanded by further increasing the central angle of the arc-shaped opening 4b. In this case, in order to stabilize the track of the cable protection guiding component, a plurality of rollers (track guiding rollers) 10 can be arranged in the annular space A.
[0062] In this case, it is preferable in terms of the wide applicability of cable protection and guiding devices. On the other hand, in the case where the moving end 14b, such as cable protection and guiding device 2, can only move 180° around the rotation axis 22, it is preferable in terms of reducing the possibility of cable 14a getting tangled.
[0063] In addition, in the cable protection guide device 2, the moving end 14b of the cable protection guide component 14 is located further away from the rotation axis 22 than the fixed end 14c. However, in the cable protection guide device of the present invention, the moving end of the cable protection guide component may also be located closer to the rotation axis 22 than the fixed end.
[0064] In addition, in the cable protection guide device 2, each roller 6, 8, 10 is rotatably connected to the first plate 4 and the second plate 12. However, in the cable protection guide device of the present invention, multiple shafts fixed to the first plate 4 and the second plate 12 may be provided and each roller 6, 8, 10 may be connected in a manner that allows rotation around each shaft.
[0065] In addition, Figure 1 In (A), a cable protection guide 2 is disposed below the processing unit containing the object to be rotated 18, but the cable protection guide 2 can also be disposed above the processing unit. Specifically, the cable protection guide 2 can be disposed above the processing unit with the first plate 4 as the lower side and the second plate 12 as the upper side. In this case, a rotation shaft fixed to the upper part of the object to be rotated contained in the processing unit is inserted into the opening 4a of the first plate 4 and the opening 12a of the second plate 12.
[0066] Figure 3 This is a block diagram schematically illustrating an example of the constituent elements of a semiconductor manufacturing apparatus having a cable protection and guiding device 2. Specifically, Figure 3The semiconductor manufacturing apparatus 30 shown is an extension device for manufacturing semiconductor device chips by dividing a workpiece containing a workpiece on which a semiconductor device is formed on the front side by applying an external force to a workpiece unit 1. Hereinafter, an example of the workpiece unit 1 will be described first, and then the constituent elements of the semiconductor manufacturing apparatus 30 will be described.
[0067] Figure 4 This is a perspective view schematically showing a workpiece unit 1 containing workpieces divided by a semiconductor manufacturing apparatus 30. Figure 4 The workpiece unit 1 shown has a workpiece 11, which has a disk-shaped form. The workpiece 11 is, for example, a wafer formed from a semiconductor material such as silicon (Si).
[0068] The front side 11a of the workpiece 11 is divided into multiple regions by multiple intersecting predetermined dividing lines (spacers) 13, and semiconductor devices 15 such as IC (Integrated Circuit) and LSI (Large Scale Integration) are formed in each region.
[0069] Furthermore, there are no restrictions on the material, shape, structure, and size of the workpiece 11. For example, a substrate formed of other semiconductor, ceramic, resin, or metal materials can also be used as the workpiece 11. Similarly, there are no restrictions on the type, number, shape, structure, size, and arrangement of the semiconductor devices 15.
[0070] Additionally, a modified layer 17 is formed inside the workpiece 11 along the predetermined dividing line 13. The modified layer 17 is formed, for example, by irradiating the workpiece 11 with a laser beam having a wavelength that can penetrate the workpiece 11 and a focal point located inside the workpiece 11 along the predetermined dividing line 13.
[0071] An extension sheet 23 is attached to the back side 11b of the workpiece 11 through an adhesive film 21. The adhesive film 21 is typically a film-like adhesive called a die attach film (DAF) or similar material, and usually has a disc-shaped shape with a diameter larger than that of the workpiece 11.
[0072] The adhesive film 21 is formed, for example, using a resin that hardens by heat or light, and has the function of fixing the chip obtained by dividing the workpiece 11 to any object (e.g., other chips or substrates).
[0073] The extension piece 23, which is attached to the back surface 11b of the workpiece 11 through the adhesive film 21, is a resin film that stretches when force is applied, for example, having a disc-shaped shape with a diameter larger than that of the adhesive film 21. In addition, the outer peripheral portion of the extension piece 23 is attached to an annular frame 25 with an inner diameter larger than that of the workpiece 11 and the adhesive film 21.
[0074] exist Figure 4 In the workpiece unit 1 shown, the adhesive film 21 and the extension piece 23 are overlapped and adhered to the workpiece 11 in such a way that the adhesive film 21 contacts the back surface 11b of the workpiece 11. Furthermore, the outer periphery of the extension piece 23 is adhered to the frame 25 to seal the opening of the frame 25. Thus, the workpiece 11 is supported on the frame 25 by means of the adhesive film 21 and the extension piece 23.
[0075] Next, the constituent elements of the semiconductor manufacturing apparatus 30 will be described. The semiconductor manufacturing apparatus 30, as a processing unit that directly processes the workpiece unit 1, includes an expansion unit 32 and a hot air jetting unit 44 (see reference 1). Figure 3 In addition, the processing of the workpiece unit 1 by the extension unit 32 and the hot air jet unit 44 is carried out while the workpiece unit 1 is held on the cooling worktable 64.
[0076] In short, the expansion unit 32 expands the expansion piece 23 of the workpiece unit 1, thereby dividing the workpiece 11 and the adhesive film 21 along the predetermined dividing line 13. Additionally, the hot air jetting unit 44 jets hot air onto the expanded expansion piece 23, causing it to shrink.
[0077] Furthermore, the hot air jet unit 44 includes a rotatable heating plate, which is connected to the power supply 20 via a cable protection guide 2. In the semiconductor manufacturing apparatus 30, the heating plate of the hot air jet unit 44 is connected to... Figure 1 The object to be rotated shown in (A) corresponds to 18.
[0078] Figure 5 This is a schematic cross-sectional view showing the expansion unit 32, hot air jet unit 44, and cooling worktable 64 included in the semiconductor manufacturing apparatus 30. Additionally, in Figure 5 In the middle, for ease of explanation, the cable protection and guidance device 2 is depicted with a box.
[0079] The expansion unit 32 has a plurality (e.g., four) cylinders 34 respectively fixed to the housing (not shown) of the semiconductor manufacturing apparatus 30. The lower end of a piston rod 36 is inserted into the upper surface of the cylinder 34.
[0080] In addition, Figure 5The image shows a piston rod 36 positioned in a loading position, where the workpiece unit 1 can be loaded into the semiconductor manufacturing apparatus 30. Furthermore, the piston rod 36 can move upwards from the loading position.
[0081] A device capable of [acting on] the upper end of the piston rod 36 is fixed thereon. Figure 4 The workpiece unit 1 shown is supported by a ring-shaped support table 38. Additionally, a ring-shaped fixing plate 40 is disposed above the support table 38.
[0082] The fixing plate 40 is supported on the housing of the semiconductor manufacturing apparatus 30 in a manner that allows it to move upward. Specifically, the fixing plate 40 is supported on the housing of the semiconductor manufacturing apparatus 30 away from the support table 38 when the piston rod 36 is in the inserted position.
[0083] Furthermore, when the piston rod 36 is moved upward with the frame 25 of the workpiece unit 1 supported on the support table 38, the fixing plate 40 contacts the frame 25 and fixes the frame 25 to the support table 38. When the piston rod 36 moves further upward, the fixing plate 40 moves upward together with the support table 38 and the frame 25.
[0084] A cylindrical drum 42, which is fixed to the housing of the semiconductor manufacturing apparatus 30, is provided on the inner side of the fixing plate 40. The lower end of the drum 42 is located at approximately the same height as the lower surface of the fixing plate 40, for example, when the piston rod 36 is in the driven position.
[0085] exist Figure 5 In the extended unit 32 shown, the piston rod 36 can be moved upward while the frame 25 of the workpiece unit 1 is fixed between the support table 38 and the fixed plate 40. Furthermore, the extended unit 32 can maintain the position of the piston rod 36 when the cooling table 64 descends.
[0086] That is, the extension unit 32 enables the frame 25 of the workpiece unit 1 and the cooling worktable 64 to move relative to each other. Furthermore, by moving the cooling worktable 64 and the frame 25, which is in contact with the fixed plate 40, away from each other, the extension piece 23 of the workpiece unit 1 is extended.
[0087] Additionally, a hot air jet unit 44 is provided inside the support worktable 38. As described above, the hot air jet unit 44 has a heating plate 46. The heating plate 46 has a disc-shaped shape and is disposed inside the support worktable 38. Furthermore, the upper surface of the heating plate 46 is disposed below the lower surface of the support worktable 38.
[0088] Additionally, the upper end of the rotating shaft 22, which has the opening 4a of the first plate 4 and the opening 12a of the second plate 12 through the cable protection guide device 2, is fixed on the lower surface side of the heating plate 46 (see reference). Figure 1 (B) and the bracket 16a of the cable protection guide device 2 (refer to) Figure 1 (A) Furthermore, the lower end of the rotating shaft 22 is connected to the rotation drive source (motor for rotating the heating plate) 24. Therefore, when the rotation drive source 24 is activated, the heating plate 46 rotates together with the rotating shaft 22.
[0089] On the upper surface of the heating plate 46, there are a plurality (e.g., four) hot air jets 48 that spray hot air towards the extension plate 23 between the outer periphery of the workpiece 11 of the workpiece unit 1 and the inner periphery of the frame 25. Specifically, the plurality of hot air jets 48 are arranged at approximately equal intervals along the circumferential direction on the outer periphery of the upper surface of the heating plate 46.
[0090] The hot air jet section 48 includes: a bottomed cylindrical jet section body 50 with an open top; and a coil heater 52 housed within the jet section body 50. Furthermore, the hot air jet section 48 has terminals for connecting to cables that supply air into the jet section body 50 and terminals for connecting to cables that supply power to the coil heater 52. That is, these terminals are connected to the cable 14a (see reference 14a) bent at the moving end 14b of the cable protection guide member 14 of the cable protection guide device 2. Figure 1 (A)) connection.
[0091] A gate 54 is provided above the hot air jet section 48. The gate 54 has a disc-shaped shape with a diameter slightly shorter than the inner diameter of the support worktable 38, and is disposed on the inner side of the support worktable 38. In addition, the upper end of the rotating shaft 56 is fixed to the lower surface of the gate 54.
[0092] Furthermore, the lower end of the rotating shaft 56 is connected to the rotating drive source (gate rotation motor) 58. Therefore, when the rotating drive source 58 is activated, the gate 54 also rotates together with the rotating shaft 56. In addition, an opening 60 is provided on the outer periphery of the gate 54 to expose the hot air jet section 48.
[0093] Furthermore, a cylindrical support rod 62 made of metal or the like is disposed inside the drum 42. As described later, the support rod 62 is supported on the housing of the semiconductor manufacturing apparatus 30 in a height-adjustable manner. Additionally, the lower end of the support rod 62 is fixed to the cooling stage 64. Moreover, as described later, the support rod 62 also functions as a medium for absorbing heat from the cooling stage 64, thereby cooling the cooling stage 64.
[0094] The cooling worktable 64 is made of metal (e.g., aluminum (Al)) and has a disc-shaped form. Furthermore, the lower surface of the cooling worktable 64 becomes the contact surface (lower surface) 64a that abuts against the area of the extension piece 23 that is attached to the workpiece 11 by means of the adhesive film 21.
[0095] Furthermore, a plurality of through holes 66 are provided on the contact surface (lower surface) 64a. These through holes 66 extend from the back side (back side 64b) of the contact surface 64a to the contact surface 64a. Additionally, as described later, the through holes 66 function as either a supply path for providing dry gas to the contact surface 64a or a suction path for generating negative pressure on the contact surface 64a.
[0096] Additionally, a cover member 68 formed of resin or the like is fixed to the cooling worktable 64. The cover member 68 has a disc-shaped back cover portion 68a, which has a circular lower surface. The lower surface of the back cover portion 68a faces the back cover 64b of the cooling worktable 64 through a gap 70. An opening 68b penetrating the back cover portion 68a is provided in the central region of the back cover portion 68a along the thickness direction, and a support rod 62 is inserted into the opening 68b.
[0097] Multiple regions of the back cover portion 68a, located directly above the multiple through holes 66 of the cooling worktable 64, are provided with connector holes that penetrate the back cover portion 68a along the thickness direction. Furthermore, a cylindrical connector 72 is inserted into the connector hole, and the inner side of the connector 72 communicates with the through hole 66.
[0098] Additionally, the cover member 68 has a cylindrical outer peripheral cover portion 68c extending downward from the outer periphery of the back cover portion 68a. The inner peripheral surface of the outer peripheral cover portion 68c faces the outer peripheral surface 64c between the contact surface 64a and the back surface 64b of the cooling worktable 64 through a gap 70.
[0099] Furthermore, the cover member 68 has a cylindrical connector insertion portion 68d extending upward from the inner periphery of the rear cover portion 68a. The upper part of the connector insertion portion 68d is fixed to the support rod 62 in a manner that closes the gap 70. In addition, a connector hole is provided in the connector insertion portion 68d, which extends radially through the connector insertion portion 68d. A cylindrical connector 74 is inserted into this connector hole, and the inner side of the connector 74 communicates with the gap 70.
[0100] Furthermore, the cooling workbench 64 is connected to the dry gas supply unit 76, the lifting unit 78, the cooling unit 80, and the suction unit 82 (see reference). Figure 3 ). Figure 6 This is a block diagram schematically showing the connection relationship between the cooling workbench 64 and the drying gas supply unit 76, the lifting unit 78, the cooling unit 80, and the suction unit 82.
[0101] The dry gas supply unit 76 is connected to the valve 84 and the connector 72 via cables. Therefore, by opening the valve 84, the dry gas supply unit 76 can supply dry gas to the contact surface 64a of the cooling workbench 64 via the valve 84, the connector 72 and the through hole 66.
[0102] Additionally, the dry gas supply unit 76 is connected to the valve 86 and the connector 74 via cables. Therefore, by opening the valve 86, the dry gas supply unit 76 can supply dry gas to the back surface 64b and the outer peripheral surface 64c of the cooling worktable 64 via the valve 86, the connector 74, and the gap 70.
[0103] The drying gas is adjusted to a dew point ratio that allows the expansion unit 32 to expand the expansion piece 23 of the workpiece unit 1 held by the contact surface 64a of the cooling worktable 64, causing the adhesive film 21 to break. This results in a cooling worktable 64 with a low temperature and a temperature higher than the dew point of the atmospheric gas. Furthermore, the drying gas supply unit 76 is composed, for example, of a gas cylinder containing a built-in drying gas and a compressor for adjusting the pressure of the drying gas.
[0104] The lifting unit 78 is connected to the cooling worktable 64 via the support rod 62. The lifting unit 78 lowers the cooling worktable 64 via the support rod 62, thereby allowing the contact surface 64a of the cooling worktable 64 to contact the extension piece 23 of the workpiece unit 1. Furthermore, the lifting unit 78 is, for example, composed of an electric motor and a ball screw driven by the electric motor.
[0105] The cooling unit 80 is connected to the cooling worktable 64 via the support rod 62. For example, the cooling unit 80 absorbs heat from the support rod 62 while the workpiece unit 1 is held on the contact surface 64a of the cooling worktable 64, thereby cooling the cooling worktable 64, and thus the adhesive film 21 can be cooled via the extension plate 23. In addition, the cooling unit 80 is, for example, composed of a piston cooler.
[0106] The suction unit 82 is connected to the valve 88 and the connector 72 via cables. Therefore, by opening the valve 88, the suction unit 82 can generate negative pressure on the contact surface 64a of the cooling worktable 64 via the valve 88, the connector 72, and the through hole 66. Furthermore, the suction unit 82 may be configured as, for example, an ejector.
[0107] The operation of the expansion unit 32, hot air injection unit 44, dry gas supply unit 76, lifting unit 78, cooling unit 80, and suction unit 82 is controlled by the control unit 90 (see reference). Figure 3The control unit 90, for example, has a processing unit 92 that generates signals for controlling the components of the semiconductor manufacturing apparatus 30, and a storage unit 94 that stores various information (data and programs, etc.) used in the processing unit 92.
[0108] The functions of the processing unit 92 are specifically implemented by a CPU (Central Processing Unit) or the like, which reads and executes programs stored in the storage unit 94. Furthermore, the functions of the storage unit 94 are specifically implemented by at least one of semiconductor memories such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), and NAND flash memory, and magnetic storage devices such as HDD (Hard Disk Drive).
[0109] Furthermore, the control unit 90 controls the operation of the components included in the semiconductor manufacturing apparatus 30 based on the signals input from the input unit 96. Additionally, the input unit 96 may be composed of at least one of, for example, a touch panel, keyboard, mouse, button, and microphone.
[0110] The input unit 96 can, for example, input a signal to the control unit 90 to suppress the generation of condensation based on the operator's operation before the workpiece unit 1 comes into contact with the contact surface 64a of the cooling worktable 64.
[0111] When the signal is input, the control unit 90 opens valves 84 and 86. Furthermore, the control unit 90 controls the drying gas supply unit 76 in a manner that supplies drying gas to the cooling workbench 64.
[0112] In this case, the dry gas supplied from the dry gas supply unit 76 is supplied to the contact surface 64a of the cooling worktable 64 via valve 84, connector 72 and through hole 66, and to the back surface 64b and outer peripheral surface 64c of the cooling worktable 64 via valve 86, connector 74 and gap 70.
[0113] In addition, the input unit 96 can input a signal to the control unit 90, according to the operator's operation, instructing the workpiece unit 1 to be held on the contact surface 64a of the cooling worktable 64 and the extension piece 23 to be extended.
[0114] When the signal is input, the control unit 90 controls the lifting unit 78 so that the contact surface 64a of the cooling worktable 64 abuts against the extension piece 23 of the workpiece unit 1. Then, the control unit 90 controls the cooling unit 80 to cool the cooling worktable 64. Thus, the circular area of the extension piece 23 that abuts against the contact surface 64a of the cooling worktable 64 is cooled.
[0115] In addition, in the semiconductor manufacturing apparatus 30, as described above, before the cooling worktable 64 is cooled, dry gas is supplied to the contact surface 64a, back surface 64b and outer peripheral surface 64c of the cooling worktable 64 in advance, thereby reducing the possibility of condensation occurring in the semiconductor manufacturing apparatus 30.
[0116] Next, the control unit 90 controls the expansion unit 32 and / or the lifting unit 78 in a manner that expands the expansion piece 23 of the workpiece unit 1. Specifically, the control unit 90 controls the expansion unit 32 and / or the lifting unit 78 in a manner that moves the piston rod 36 of the expansion unit 32 upward and / or lowers the cooling worktable 64. As a result, the workpiece 11 and the adhesive film 21 of the workpiece unit 1 are separated along the predetermined dividing line 13.
[0117] Furthermore, in the semiconductor manufacturing apparatus 30, as described above, before the expansion sheet 23 is expanded, the circular area of the expansion sheet 23 that abuts against the contact surface 64a of the cooling worktable 64 is pre-cooled, thereby suppressing the deformation of the adhesive film 21 during the expansion of the expansion sheet 23. As a result, the cutting of the workpiece 11 becomes easier.
[0118] Next, the control unit 90 closes valve 84 and opens valve 88. Furthermore, the control unit 90 controls the suction unit 82 to generate negative pressure on the contact surface 64a of the cooling worktable 64. This attracts the circular area of the extension piece 23 held by the contact surface 64a of the cooling worktable 64.
[0119] Next, the control unit 90 controls the hot air jet unit 44 in a manner that relaxes the annular region of the expansion plate 23 surrounding the circular region due to the expansion of the expansion plate 23. Specifically, the hot air jet unit 44 is operated in the following sequence.
[0120] First, the gate 54 is rotated by the rotation drive source 58 so that the opening 60 of the gate 54 is directly above the hot air jet section 48. Next, the cable 14a (see reference 14a) is guided by the cable protection guide member 14 housed in the cable protection guide device 2. Figure 1(A) etc.) and the power supply type 20 connected to the hot air jet section 48 supplies air to the jet section body 50 and power to the coil heater 52.
[0121] At this time, the air supplied to the main body 50 of the jet section is heated by the energized coil heater 52 and becomes hot air, which is then jetted upward through the opening 60 of the gate 54. As a result, hot air is jetted into the area of the extension piece 23 between the outer periphery of the workpiece 11 of the workpiece unit 1 and the inner periphery of the frame 25, which is located above the opening 60.
[0122] Next, hot air is jetted circumferentially along the expansion plate 23. The rotary drive source 24 rotates the heating plate 46 via the rotary shaft 22, and the rotary drive source 58 rotates the gate 54 via the rotary shaft 56. As a result, the annular region of the expansion plate 23, which has been jetted with hot air, is heated and contracts. That is, the relaxation caused by the expansion unit 32 expanding the expansion plate 23 is reduced.
[0123] In the semiconductor manufacturing apparatus 30, the supply of air to the jet body 50 and the supply of electricity to the coil heater 52 are provided via the cable type 14a housed in the cable type protection guide member 14 of the cable type protection guide device 2. Therefore, in the semiconductor manufacturing apparatus 30, the track of the cable type protection guide member 14 can be stabilized without increasing the size of the apparatus.
[0124] Furthermore, the semiconductor manufacturing apparatus 30 is an example of a semiconductor manufacturing apparatus having the cable protection and guiding device of the present invention, but the semiconductor manufacturing apparatus having the cable protection and guiding device of the present invention is not limited to the semiconductor manufacturing apparatus 30.
[0125] In addition, the structures and methods of the above-described embodiments and variations can be appropriately modified and implemented as long as they do not depart from the scope of the present invention.
Claims
1. A rotary cable protection and guiding device, the rotary cable protection and guiding device comprising: The outer periphery faces the outer surface of the annular space; The inner periphery faces the inner side of the annular space; A cable protection guiding component, disposed within the annular space, includes a movable end capable of circumferential movement along the annular space and a fixed end disposed at a predetermined position within the annular space; and A rotating shaft is inserted into the inner side of the inner circumference. Its features are, A columnar track guide roller is arranged in the annular space, extending along a rotation axis perpendicular to the circumference. The track guide roller moves through the moving end to contact and rotate the cable protection guide component. The movable end is positioned further away from the rotation axis than the fixed end.
2. The rotary cable protection and guiding device according to claim 1, wherein, The outer periphery has a plurality of columnar outer sliding improvement rollers extending along the rotation axis and facing the outer surface of the annular space. The outer sliding improvement roller moves through the moving end to contact and rotate the cable protection guide component.
3. The rotary cable protection and guiding device according to claim 1 or 2, wherein, The inner circumference has a plurality of columnar inner sliding improvement rollers extending along the rotation axis and facing the inner side of the annular space. The inner sliding improvement roller moves through the moving end to contact and rotate the cable protection guide component.