Chip transfer device and transfer method

Abstract

The application provides a chip transfer device and a transfer method; the chip transfer device comprises a transfer plate and a plurality of transfer heads arranged on the transfer plate in an array; the plurality of transfer heads are arranged in a lifting or telescopic manner in a direction perpendicular to the transfer plate; and the chip transfer device captures and releases target chips through the transfer heads; by arranging a plurality of transfer heads on the transfer plate and arranging the transfer heads in a lifting manner in a direction perpendicular to the transfer plate, the chip transfer device can capture different color target chips on different original substrates in batches through lifting or telescopic adjustment of the transfer heads; after all the required target chips are captured, the target chips are released on a target substrate at one time, so that the number of times of releasing the target chips is reduced to one time, and the chip transfer efficiency is effectively improved.

Description

Technical Field

[0001] This application relates to the field of display panel manufacturing, specifically to a chip transfer apparatus and a transfer method. Background Technology

[0002] Micro LEDs (Micro Light Emitting Diodes) have become a key research focus in the field of display technology due to their high brightness, high contrast, high resolution, wide color gamut, and wide viewing angle. One of the challenges in developing micro LED technology is how to transfer micro LEDs onto corresponding pixels on an array substrate as needed.

[0003] Currently, mass transfer technology is commonly used to transfer miniature diodes. However, since LED chips of different colors are generally located on different original substrates, current transfer devices typically adhere and release one color chip, then repeat the adhesion and release process for the next color chip. This transfer method involves numerous adhesion and release operations, resulting in relatively low transfer efficiency. Summary of the Invention

[0004] This application provides a chip transfer apparatus and a transfer method to improve the technical problem of low transfer efficiency caused by the large number of chip adhesion and release operations in the current mass chip transfer process.

[0005] To solve the above-mentioned technical problems, the technical solution provided in this application is as follows:

[0006] This application provides a chip transfer apparatus, comprising:

[0007] Transfer board;

[0008] Multiple transfer heads are arrayed on the transfer plate;

[0009] The plurality of transfer heads are arranged to be raised, lowered, or extended in a direction perpendicular to the transfer plate, and the chip transfer device uses the transfer heads to grasp and release the target chip.

[0010] In the chip transfer apparatus of this application, in the top view direction of the transfer plate, the planar dimension of the transfer head is smaller than the planar dimension of the target chip.

[0011] In the chip transfer apparatus of this application, the number of transfer heads that adhere to the same target chip is greater than or equal to 1.

[0012] In the chip transfer apparatus of this application, the spacing between two adjacent transfer heads is the same in the first direction and the second direction;

[0013] The first direction is different from the second direction.

[0014] In the chip transfer apparatus of this application, in the first direction, the spacing between two adjacent transfer heads is the same as the width of the transfer head;

[0015] Furthermore, in the second direction, the spacing between two adjacent transfer heads is the same as the width of the transfer head.

[0016] In the chip transfer apparatus of this application, the first end of the transfer head is embedded in the transfer plate, the second end of the transfer head extends to the outside of the transfer plate, and the second end of the transfer head is provided with an adhesive layer;

[0017] The adhesiveness of the adhesive layer decreases as humidity increases.

[0018] In the chip transfer apparatus of this application, a buffer layer is further provided between the second end of the transfer head and the adhesive layer;

[0019] The buffer layer is a flexible or elastic material layer.

[0020] In the chip transfer device of this application, the chip transfer device further includes a barrier plate, and the barrier plate is provided with a plurality of slots corresponding to the transfer head;

[0021] The barrier plate is detachably disposed in the intervals between the plurality of transfer heads, and the transfer heads are embedded in the slots.

[0022] In the chip transfer apparatus of this application, in a direction perpendicular to the transfer plate, the height of the second end of the transfer head is greater than or equal to the surface height of the barrier plate on the side away from the transfer plate.

[0023] This application also proposes a chip transfer method, which utilizes the aforementioned chip transfer apparatus, including:

[0024] The transfer plate of the moving chip transfer device is placed above the original substrate;

[0025] The transfer head is adjusted in multiple stages to raise and lower the multiple transfer heads in batches, thereby adhering the target chip of different colors on the original substrate in multiple stages.

[0026] Move the transfer plate until the transfer head contacts the target substrate, and release all target chips into the corresponding pixel area on the target substrate.

[0027] Beneficial effects

[0028] This application provides a chip transfer device by setting multiple transfer heads on a transfer plate, with the transfer heads being vertically adjustable in a direction perpendicular to the transfer plate. This allows the chip transfer device to adjust the height of the transfer heads, enabling it to adhere target chips of different colors from different original substrates in batches. After all the required target chips have been adhered, all target chips are released onto the target substrate at once, thereby reducing the number of times the target chips are released to only one, which can effectively improve chip transfer efficiency. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of the chip transfer device described in this application when the target chip is adhered;

[0031] Figure 2 This is a schematic diagram of the structure of the chip transfer device described in this application when releasing the target chip;

[0032] Figure 3 This is a side view of the chip transfer apparatus described in this application;

[0033] Figure 4 This is a bottom view of the chip transfer apparatus described in this application;

[0034] Figure 5 This is a side view of the chip transfer device described in this application equipped with the barrier plate;

[0035] Figure 6 This is a flowchart of the chip transfer method described in this application.

[0036] Explanation of reference numerals in the attached figures:

[0037] Transfer plate 100, transfer head 200, target chip 300, original substrate 400, target substrate 500, adhesion layer 600, barrier plate 700, slot 710. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0039] Micro LEDs (Micro Light Emitting Diodes) have become a key research focus in the field of display technology due to their high brightness, high contrast, high resolution, wide color gamut, and wide viewing angle. One of the challenges in developing micro LED technology is how to transfer micro LEDs onto corresponding pixels on an array substrate as needed.

[0040] Currently, mass transfer technology is commonly used to transfer micro-diodes. However, even the relatively mature stamp transfer technology within mass transfer has the following technical drawbacks: since LED chips of different colors are generally located on different original substrates, current transfer devices typically adhere and release one color chip before repeating the adhesion and release process for the next color chip. This transfer method involves a large number of chip adhesion and release operations, resulting in low transfer efficiency. This application proposes the following solution to address these technical problems.

[0041] Please see Figures 1 to 6 This application provides a chip transfer device, including a transfer plate 100 and a plurality of transfer heads 200 arrayed on the transfer plate 100, wherein the plurality of transfer heads 200 are vertically or extendably arranged in a direction perpendicular to the transfer plate 100, and the chip transfer device uses the transfer heads 200 to grasp and release target chips 300.

[0042] This application provides multiple transfer heads 200 on a transfer plate 100, and the transfer heads 200 are vertically and vertically oriented in a direction perpendicular to the transfer plate 100. This allows the chip transfer device to adjust the transfer heads 200 to move up and down or extend and retract, enabling the chip transfer device to adhere target chips 300 of different colors on different original substrates 400 in batches. After all the required target chips 300 have been adhered, all the target chips 300 are released onto the target substrate 500 at once, thereby reducing the number of times the target chips 300 are released to only one, which can effectively improve the chip transfer efficiency.

[0043] The technical solution of this application will now be described in conjunction with specific embodiments. Detailed explanations will follow. It should be noted that the order of description of the embodiments below is not intended to limit the preferred order of the embodiments.

[0044] In this embodiment, the transfer plate 100 can be mounted on a moving device and / or a lifting device (not shown in the figure) to enable the transfer plate 100 to move and lift, thereby successfully completing the off-site transfer of the target chip 300. The transfer plate 100 and the moving device and / or the lifting device can be connected to an automated control system to achieve fully automatic control of the transfer plate 100 and the multiple transfer heads 200, thereby achieving a good collaborative working effect.

[0045] In this embodiment, the transfer plate 100 and the transfer head 200 can be made of stainless steel to reduce corrosion and achieve clean transfer.

[0046] In this embodiment, the plurality of transfer heads 200 can be disposed on the surface of the transfer plate 100 or partially embedded within the transfer plate 100. The plurality of transfer heads 200 can be controlled by the automated control system; that is, the automated control system can control the position and number of the transfer heads 200 that are raised, lowered, or extended. Furthermore, the automated control system can also adjust the height at which the transfer heads 200 are raised or the length at which they are extended, so that the chip transfer device can be adapted to the chip transfer requirements of various specifications.

[0047] In this embodiment, please refer to Figure 1 , Figure 1This is a schematic diagram of the overall structure of the chip transfer device described in this application. When the chip transfer device grips the target chip 300, the automatic control system can adjust the transfer head 200 corresponding to the target chip 300 to pop out (i.e., the transfer head 200 moves from the transfer plate 100 towards the side closer to the target chip 300), while the transfer heads 200 not corresponding to the target chip 300 remain in their initial state, thus allowing the transfer head 200 corresponding to the target chip 300 to grip the target chip 300. During the next chip gripping action, the automatic control system again controls the transfer heads 200 that have gripped the chip to retract or return to their original position towards the transfer plate 100, and causes another batch of transfer heads 200 to pop out (i.e., the transfer heads 200 move from the transfer plate 100 towards the side closer to the target chip 300), thereby completing the action of gripping the target chip 300 again. Repeat this process until all target chips 300 have been captured, and finally release all target chips 300 onto the target substrate 500 at once, completing the efficient transfer of a massive number of chips.

[0048] Please see Figure 1 and Figure 2 , Figure 2 This is a schematic diagram of the structure of the chip transfer device described in this application when releasing the target chip 300. In the chip transfer device of this application, in the top view direction of the transfer plate 100, the planar dimension of the transfer head 200 is smaller than the planar dimension of the target chip 300, so that when the transfer head 200 grasps the target chip 300, the target chip 300 can completely cover the transfer head 200, and one transfer head 200 can only adhere to one target chip 300, reducing the risk of positional displacement caused by adjacent target chips 300 adhering to the same transfer head 200.

[0049] Please see Figure 1 and Figure 2 In the chip transfer apparatus of this application, the number of transfer heads 200 that adhere to the same target chip 300 is greater than or equal to 1. That is, when the chip transfer apparatus performs a chip gripping action, a target chip 300 can be gripped by one or more of the transfer heads 200.

[0050] In this embodiment, through the above settings, each target chip 300 can be grasped by multiple transfer heads 200. Thus, according to the size specifications of the target chip 300, the position and number of transfer heads 200 grasping each target chip 300 can be set by the automatic control system, realizing the transfer function of chips of different sizes. Moreover, since it is not necessary to configure different transfer boards 100 and corresponding transfer heads 200 according to different chip sizes, the transfer cost can be effectively reduced, and the practicality of the chip transfer device is improved.

[0051] In this embodiment, when multiple transfer heads 200 grasp the same target chip 300, the multiple transfer heads 200 can achieve a more balanced and stable grasping effect on the target chip 300. Therefore, compared with a single transfer head 200 grasping the target chip 300, multiple transfer heads 200 grasping the same target chip 300 can achieve a smoother release process for the target chip 300, so that the target chip 300 can be placed in an ideal horizontal position on the target substrate 500. This can avoid or significantly reduce the problem of local force imbalance when the target chip 300 is released onto the target substrate 500, thereby further improving the uniform display effect of the display panel.

[0052] Please see Figure 3 and Figure 4 , Figure 3 This is a side view of the chip transfer apparatus described in this application. Figure 4 This is a bottom view of the chip transfer apparatus described in this application. In the first direction X and the second direction Y, the spacing between two adjacent transfer heads 200 is the same, and the first direction X and the second direction Y are opposite. In this embodiment, the first direction X can be the row / column direction of the array of transfer heads 200, and the second direction Y can be the column / row direction of the array of transfer heads 200. When multiple transfer heads 200 are arranged in a rectangular array, the first direction X can be perpendicular to the second direction Y.

[0053] In this embodiment, by setting the spacing of the multiple transfer heads 200 to be equal in both the row and column directions, the transfer heads 200 are evenly distributed on the transfer plate 100. Since a target chip 300 can be grasped by multiple transfer heads 200 in this embodiment, the evenly distributed transfer heads 200 ensure that the number of transfer heads 200 corresponding to each target chip 300 is the same, and that the relative positions of the transfer heads 200 and the target chip 300 are also the same. This ensures that each target chip 300 experiences the same force during the grasping and releasing process, thereby improving the transfer accuracy of a large number of target chips 300 during the transfer process.

[0054] Please see Figure 4 In the chip transfer apparatus of this application, in the top view of the transfer plate 100, the planar shape of the transfer head 200 can be square, rectangular, circular, etc. For example, as Figure 4 As shown, in the top view of the transfer plate 100, the planar shape of the transfer head 200 is square, and the plurality of transfer heads 200 are arranged in a rectangular array. The first direction X is the row direction in which the plurality of transfer heads 200 are arranged, and the second direction Y is the column direction in which the plurality of transfer heads 200 are arranged.

[0055] In this embodiment, in the first direction X, the distance d1 between two adjacent transfer heads 200 is the same as the width L1 of the transfer head 200. In the second direction Y, the distance d2 between two adjacent transfer heads 200 is the same as the width L2 of the transfer head 200. For example, in the first direction X and the second direction Y, the distance between two adjacent transfer heads 200 is 5 micrometers, and the transfer head 200 has a planar dimension of 5 micrometers × 5 micrometers in the top view of the transfer plate 100.

[0056] In this embodiment, by setting the dimensions of the transfer head 200 in the row and column directions to be equal to the spacing between two adjacent transfer heads 200, the distribution density and size of the transfer heads 200 on the transfer plate 100 can achieve a good match with the target chips 300 of different specifications and sizes, thereby further improving the practicality of the chip transfer device.

[0057] In the chip transfer apparatus of this application, the first end of the transfer head 200 can be embedded in the transfer plate 100, the second end of the transfer head 200 can extend to the outside of the transfer plate 100, and the end face of the second end of the transfer head 200 is provided with an adhesive layer 600, and the transfer head 200 adheres to the target chip 300 through the adhesive layer 600.

[0058] In this embodiment, the adhesiveness of the adhesive layer 600 decreases as humidity increases. The adhesive layer 600 can be prepared from a water vapor-sensitive polymer material, the adhesiveness of which changes with temperature.

[0059] In this embodiment, the water vapor-sensitive polymeric material includes a solvent and a water-soluble polymeric compound and reactants dispersed in the solvent. The water-soluble polymeric compound may include at least one of polypyrrolidone and polyvinylpyrrolidone, the reactants include a combination of at least one of citric acid and adipic acid with sodium bicarbonate, and the solvent includes dichloromethane and ethanol.

[0060] In this embodiment, after the transfer head 200 has adhered all the target chips 300 and the pixel areas of the transfer head 200 and the target substrate 500 have been aligned, the adhesion of the adhesive layer 600 is reduced by adjusting the ambient humidity of the chip transfer device, thereby automatically releasing the target chips 300 onto the target substrate 500, making the release of the target chips 300 quick and convenient.

[0061] In this embodiment, the adhesive layer 600 can be printed on the transfer head 200 by inkjet / spraying process. After the transfer head 200 completes one or more chip transfers, if the adhesiveness of the adhesive layer 600 is insufficient to meet the usage requirements, the original adhesive layer 600 can be removed from the transfer head 200, and a new adhesive layer 600 can be formed on the transfer head 200 by inkjet / spraying process.

[0062] In the chip transfer apparatus of this application, a buffer layer (not shown in the figure) may also be provided between the second end of the transfer head 200 and the adhesion layer 600, so that when the transfer head 200 adheres to the target chip 300, the buffer layer can play a buffering and protective role for the target chip 300, thereby avoiding or reducing the risk of damage to the target chip 300 when the transfer head 200 adheres to the target chip 300.

[0063] In this embodiment, the buffer layer can be a flexible or elastic material layer, such as elastic rubber material or photoresist material.

[0064] Please see Figure 5 , Figure 5 This is a side view of the chip transfer apparatus described in this application equipped with a barrier plate. In the chip transfer apparatus of this application, the chip transfer apparatus may further include a barrier plate 700, on which a plurality of slots 710 corresponding to the transfer head 200 are provided. In the top view of the transfer plate 100, the planar shape and planar dimensions of the slots 710 are the same as those of the transfer head 200.

[0065] In this embodiment, the barrier plate 700 is detachably disposed in the intervals between the plurality of transfer heads 200, and the transfer heads 200 are embedded in the slots 710.

[0066] In this embodiment, the barrier plate 700 serves only as an intermediate auxiliary tool in conjunction with the transfer plate 100 and the transfer head 200. Its specific working principle and function are as follows: Before inkjet / spraying the second end of the transfer head 200 to form the adhesion layer 600, the barrier plate 700 is first embedded in the gap space between the multiple transfer heads 200. At this time, the barrier plate 700 just blocks the gap area of ​​the transfer heads 200. Then, inkjet / spraying is performed on the entire surface, so that the material of the adhesion layer 600 can be coated on the second end of the transfer head 200 and the barrier plate 700. Then, the barrier plate 700 is separated from the transfer plate 100, realizing the precise printing of the adhesion layer 600 material on the multiple transfer heads 200.

[0067] In this embodiment, the barrier plate 700 can be made of stainless steel. Furthermore, the surface of the barrier plate 700 can be polished to facilitate the application of the adhesive layer 600 material on the barrier plate 700.

[0068] Please see Figure 5 In the chip transfer apparatus of this application, in the direction perpendicular to the transfer plate 100, the height h1 of the second end of the transfer head 200 is greater than or equal to the surface height h2 of the barrier plate 700 on the side away from the transfer plate 100.

[0069] It should be noted that the "height of the second end of the transfer head 200" and the "surface height of the barrier plate 700 on the side away from the transfer plate 100" can be compared by setting the surface of the transfer plate 100 in contact with the barrier plate 700 as a reference plane. The height of this reference plane is zero. Then, the distance from a certain plane to this reference plane is the height value of the plane in the direction perpendicular to the transfer plate 100.

[0070] In other words, in a direction perpendicular to the transfer plate 100, when the barrier plate 700 is embedded in the gaps between the multiple transfer heads 200, the second end of the transfer head 200 can protrude from the surface of the barrier plate 700 away from the transfer plate 100, so that when the adhesive layer 600 is inkjet / sprayed, the material of the adhesive layer 600 can be fully coated on the end face of the transfer head 200, thereby improving the adhesion stability of the transfer head 200 to the target chip 300.

[0071] This application provides multiple transfer heads 200 on a transfer plate 100, and the transfer heads 200 are vertically movable in a direction perpendicular to the transfer plate 100. This allows the chip transfer device to adjust the height of the transfer heads 200, enabling it to adhere target chips 300 of different colors from different original substrates 400 in batches. After all the required target chips 300 have been adhered, all the target chips 300 are released onto the target substrate 500 at once, thereby reducing the number of times the target chips 300 are released to only one, which can effectively improve the chip transfer efficiency.

[0072] This application also provides a chip transfer method, applied to the chip transfer apparatus. Please refer to... Figure 6 The chip transfer method may include:

[0073] S100, the transfer plate 100 of the moving chip transfer device is placed above the original substrate 400.

[0074] S200: The transfer head 200 is adjusted multiple times so that the multiple transfer heads 200 are raised and lowered in batches, thereby adhering the target chip 300 of different colors on the original substrate 400 multiple times.

[0075] S300: Move the transfer plate 100 until the transfer head 200 contacts the target substrate 500, and release all target chips 300 to the corresponding pixel areas on the target substrate 500.

[0076] In this embodiment, step S100 may include:

[0077] The transfer plate 100 is moved above the original substrate 400 carrying the target chip 300 by controlling the moving and lifting devices through the automated control system.

[0078] In this embodiment, since a target chip 300 can be picked up by multiple transfer heads 200, the multiple transfer heads 200 on the transfer plate 100 do not need to correspond one-to-one with the target chip 300 on the original substrate 400, thereby reducing the alignment accuracy requirement and improving the transfer efficiency.

[0079] In this embodiment, the target chip 300 may include at least a red chip (R), a green chip (G), and a blue chip (B). Correspondingly, step S200 may include at least:

[0080] S210, the first adjustment of the transfer head 200 is to make the first batch of transfer heads 200 descend or extend in a direction away from the transfer plate 100, until the first batch of transfer heads 200 contact the first original substrate 400 and adhere all the red chips (R).

[0081] Then adjust the first batch of transfer heads 200 to make them rise or retract in the direction close to the transfer plate 100 until the first batch of transfer heads 200 leave the first original substrate 400.

[0082] S220, the second batch of transfer heads 200 are adjusted so that the second batch of transfer heads 200 descends or extends in a direction away from the transfer plate 100, until the second batch of transfer heads 200 contacts the second original substrate 400 and adheres all the green chips (G).

[0083] Then adjust the second batch of transfer heads 200 to make them rise or retract in the direction close to the transfer plate 100 until the second batch of transfer heads 200 leave the second original substrate 400.

[0084] S230, the third adjustment of the transfer head 200, causing the third batch of transfer heads 200 to descend or extend in a direction away from the transfer plate 100, until the third batch of transfer heads 200 contact the third original substrate 400 and adhere all the blue chips (B).

[0085] Then adjust the third batch of transfer heads 200 to make them rise or retract in the direction close to the transfer plate 100 until the third batch of transfer heads 200 leave the third original substrate 400.

[0086] In this embodiment, step S300 may include:

[0087] S310. The moving device and lifting device are controlled by the automated control system to move the transfer plate 100 above the target substrate 500, and to make the target chip 300 on the transfer plate 100 correspond to the position of each pixel area of ​​the target substrate 500.

[0088] S320. Adjust the transfer head 200 so that the transfer head 200 descends or extends in a direction away from the transfer plate 100 (i.e., the transfer head 200 descends or extends in a direction close to the target substrate 500) until the target chip 300 on the transfer head 200 contacts the target substrate 500.

[0089] S330, Adjust the ambient humidity until the adhesiveness of the adhesion layer 600 basically disappears, and then adjust all the transfer heads 200 to rise or retract in the direction close to the transfer plate 100 until the transfer heads 200 separate from the target substrate 500, thus completing the mass transfer process of all target chips 300.

[0090] In this embodiment, the chip transfer device can adhere target chips 300 of different colors on different original substrates 400 in batches through the chip transfer method described above, and then release the target chips 300 onto the target substrate 500 in one go, thereby eliminating the need for multiple intermediate steps of releasing the target chips 300 and effectively improving chip transfer efficiency.

[0091] The chip transfer apparatus and transfer method provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A chip transfer device, characterized in that, include: Transfer board; Multiple transfer heads are arrayed on the transfer plate; The plurality of transfer heads are arranged to be raised, lowered, or extended in a direction perpendicular to the transfer plate, and the chip transfer device uses the transfer heads to grasp and release the target chip; The first end of the transfer head is embedded in the transfer plate, and the second end of the transfer head extends to the outside of the transfer plate. An adhesive layer is provided on the second end of the transfer head, and the adhesive layer is a polymer material. The chip transfer device also includes a barrier plate, which is detachably disposed in the intervals between the plurality of transfer heads, and the material of the barrier plate is selected from stainless steel; In a direction perpendicular to the transfer plate, the height of the second end of the transfer head is greater than or equal to the surface height of the barrier plate on the side away from the transfer plate.

2. The chip transfer apparatus according to claim 1, characterized in that, In the top view direction of the transfer plate, the planar dimension of the transfer head is smaller than the planar dimension of the target chip.

3. The chip transfer apparatus according to claim 1, characterized in that, The number of transfer heads that adhere to the same target chip is greater than or equal to 1.

4. The chip transfer apparatus according to claim 1, characterized in that, In both the first and second directions, the spacing between two adjacent transfer heads is the same; The first direction is different from the second direction.

5. The chip transfer apparatus according to claim 4, characterized in that, In the first direction, the distance between two adjacent transfer heads is the same as the width of the transfer head; Furthermore, in the second direction, the spacing between two adjacent transfer heads is the same as the width of the transfer head.

6. The chip transfer apparatus according to claim 1, characterized in that, in, The adhesiveness of the adhesive layer decreases as humidity increases.

7. The chip transfer apparatus according to claim 6, characterized in that, A buffer layer is also provided between the second end of the transfer head and the adhesive layer; The buffer layer is a flexible or elastic material layer.

8. The chip transfer apparatus according to claim 6, characterized in that, The barrier plate is provided with multiple slots corresponding to the transfer head; The transfer head is embedded in the slot.

9. A chip transfer method, applied to the chip transfer apparatus as described in any one of claims 1 to 8, characterized in that, include: The transfer plate of the moving chip transfer device is placed above the original substrate; The transfer head is adjusted in multiple stages to raise and lower the multiple transfer heads in batches, thereby adhering the target chip of different colors on the original substrate in multiple stages. Move the transfer plate until the transfer head contacts the target substrate, and release all target chips into the corresponding pixel area on the target substrate.

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