Apparatus and method of manufacturing a display device

Abstract

The present application relates to an apparatus and a method of manufacturing a display apparatus. The apparatus for manufacturing a display apparatus includes a plurality of worktables, a plurality of arm modules, and a rotator. The plurality of worktables are spaced apart from each other in a first direction and configured to support target plates. The plurality of arm modules are arranged in the first direction and spaced apart from the plurality of worktables in a second direction intersecting the first direction. The rotator is connected to the plurality of arm modules and configured to rotate about a rotation axis extending in the first direction.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0165319, filed on December 1, 2020, with the Korean Intellectual Property Office, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The embodiments described herein relate to apparatus and methods for manufacturing display devices. Background Technology

[0004] Many types of displays have been developed. Examples include liquid crystal displays, plasma display panels, and organic light-emitting display devices. Some of these displays include flexible printed circuit boards attached to the display panel. This arrangement allows a portion of the display panel to be bent to overlap with another portion of the display panel in the thickness direction. Summary of the Invention

[0005] The described embodiments provide apparatus and methods for manufacturing display devices, which, for example, can reduce process time and improve equipment efficiency. It should be noted that the features described herein are not limited to the effects described above, and these or other effects can be achieved as described in the following specification.

[0006] According to one or more embodiments, an apparatus for manufacturing a display device includes: a plurality of worktables spaced apart from each other in a first direction, the plurality of worktables being configured to support a target plate; a plurality of arms arranged in the first direction and spaced apart from the plurality of worktables in a second direction intersecting the first direction; and a rotator connected to the plurality of arms and configured to rotate about a rotation axis extending in the first direction.

[0007] According to one or more embodiments, a method of manufacturing a display device includes: mounting at least one target plate on a plurality of worktables; using a plurality of adhesives to adsorb the target plate; and rotating a rotator connected to the plurality of adhesives to bend the target plate. Attached Figure Description

[0008] The above and other aspects and features of this disclosure will become clearer from the detailed description of embodiments thereof with reference to the accompanying drawings, in which:

[0009] Figure 1 An embodiment of a display device that can be manufactured by a display device manufacturing apparatus is shown according to the embodiment;

[0010] Figure 2 It shows along Figure 1 A sectional view taken by line A-A';

[0011] Figure 3 It shows along Figure 1 A sectional view taken by line B-B';

[0012] Figure 4 An embodiment of a display device manufacturing apparatus for manufacturing display devices is shown;

[0013] Figure 5 A perspective view of a display device manufacturing apparatus according to an embodiment, in which a target board is mounted, is shown;

[0014] Figure 6 It shows along Figure 5 A sectional view taken by line C-C';

[0015] Figure 7 An embodiment of the rotating member, the first arm module, and the second arm module according to an embodiment is shown;

[0016] Figure 8 An embodiment of a display device manufacturing apparatus in a bent state of the target plate is shown;

[0017] Figure 9 It shows along Figure 8 A sectional view taken by line D-D';

[0018] Figure 10 An embodiment of a display device manufacturing apparatus for manufacturing display devices is shown;

[0019] Figure 11 An embodiment of a display device manufacturing apparatus for manufacturing a display device is shown, with the target plate in a bent state; and

[0020] Figure 12 An embodiment of a method for manufacturing a display device is shown. Detailed Implementation

[0021] The invention will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the invention are illustrated. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals denote the same parts. In the drawings, the thickness of layers and regions is exaggerated for clarity.

[0022] It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on that other layer or substrate, or an intervening layer may be present. Conversely, when an element is referred to as being "directly" on another element, no intervening element is present.

[0023] In the following description, specific embodiments will be described with reference to the accompanying drawings.

[0024] Figure 1 This is a plan view of a display device 1 that can be manufactured by a display device manufacturing apparatus according to an embodiment. Figure 2 It is along Figure 1 The sectional view taken by line A-A', and Figure 3 It is along Figure 1 The sectional view taken by line B-B'.

[0025] refer to Figure 1 The display device 1 can be any of a variety of devices that display still images or videos. The display device 1 can be included, for example, in smartphones, mobile phones, tablet PCs, personal digital assistants (PDAs), portable multimedia players (PMPs), televisions, game consoles, wristwatch-type electronic devices, head-mounted displays, personal computer displays, laptop computers, car navigation systems, car dashboards, digital cameras, camcorders, external billboards, electronic signs, various medical devices, various examination devices, various household appliances (such as refrigerators or washing machines) including display units, Internet of Things devices, etc. However, this disclosure is not limited thereto.

[0026] For example, display device 1 can be manufactured using a display device manufacturing apparatus as described herein (e.g., Figure 4 The display device 1 can be manufactured using various embodiments of the methods described herein (10). However, the display device 1 can also be manufactured using apparatus and methods different from those described herein.

[0027] refer to Figure 1 and Figure 2 When viewed in a plane, the display device 1 may include a display panel 100 having a predetermined shape (e.g., a generally rectangular shape). In the plane, the corners of the display panel 100 may have one or more predetermined shapes, such as pointed shapes (e.g., adjacent sides are orthogonal to each other or join at another angle). In one embodiment, one or more corners may be rounded. In one embodiment, when viewed in a plane, the display panel 100 may have a shape corresponding to an L-shape. This shape may, for example, correspond to a corner adjacent to a portion to which a printed circuit board (e.g., 300) is connected. However, other shapes are also possible.

[0028] The display panel 100 is flexible and can be bent, and may be, for example, an organic light-emitting display panel. In another embodiment, the display panel 100 may be a different type of display panel. Examples include liquid crystal displays (LCDs), quantum dot organic light-emitting display panels (QD-OLEDs), quantum dot liquid crystal displays (QD-LCDs), quantum nano-light-emitting display panels (nano-NEDs), or micro-LEDs.

[0029] The display panel 100 includes a display area DA and a non-display area NDA disposed around the display area DA. The display area DA includes multiple pixels to display still images or videos, and may have a predetermined shape when viewed on a plane, such as a generally rectangular shape, a circular shape, an elliptical shape, or other shapes.

[0030] The non-display area NDA may not display images or video, and may correspond, for example, to the remaining area of ​​display device 1 other than the display area DA. The non-display area NDA may surround at least a portion of the display area DA. For example, as... Figure 1 As shown, the non-display area NDA can be a generally strip-shaped area surrounding the display area DA in a plane. However, this disclosure is not limited to this, and the non-display area NDA may be adjacent only to the two short sides or the two long sides of the display area DA. When the display area DA is not rectangular, the non-display area NDA may completely or partially surround one or more sides of the display area DA.

[0031] Display panel 100 may include a main region MR, a curved region BR, and a sub-region SR. The main region MR may be a flat area that includes the display area DA, and may have a generally rectangular shape or other shape, for example, when viewed on a plane. The main region MR may include portions of the non-display area NDA.

[0032] The curved region BR and sub-region SR can be in the non-display region NDA and can be on one or more sides of the main region MR. In one embodiment, one side of the curved region BR can be connected to one side of the main region MR. Figure 1 As shown, in the plan view, one side of the main region MR can be the lower side of the main region MR. However, this disclosure is not limited thereto.

[0033] The sub-region SR can be located on the other side (or the other side) of the curved region BR. One side of the sub-region SR can be connected to the other side (or the other side) of the curved region BR. In one embodiment, the sub-region SR can be connected to the main region MR via the curved region BR. Figure 2As shown, the curved region BR can be bent such that the sub-region SR overlaps with the main region MR in the thickness direction. In this case, the printed circuit board 300 connected to the sub-region SR can also overlap with the main region MR in the thickness direction.

[0034] The display device 1 may also include an adhesive member CM between the main region MR and the sub-region SR. The main region MR and the sub-region SR can be attached to each other via the adhesive member CM.

[0035] refer to Figure 3 The display panel 100 includes a substrate SUB, a plurality of conductive layers 120, 130, 140 and 150 on the substrate SUB, a plurality of insulating layers 111, 112a, 113, VIA1 and VIA2 insulating the conductive layers 120, 130, 140 and 150, and a light-emitting layer EL. The substrate SUB may extend throughout the display area DA and the non-display area NDA. The substrate SUB may be a flexible substrate SUB comprising a flexible material (e.g., ductile glass, polyimide and / or another material).

[0036] A buffer layer (BFF) can be placed on the substrate SUB to prevent moisture and oxygen from penetrating through the substrate SUB from the outside. The buffer layer BFF can include, for example, silicon nitride (SiN). x ) film, silicon oxide (SiO2) film and silicon oxynitride (SiO2) film x N y One type of membrane.

[0037] The semiconductor layer 105 may be on the buffer layer BFF and may correspond, for example, to the channel of a thin-film transistor (TFT). The semiconductor layer 105 may be in a pixel of the display area DA, and in some cases, in the non-display area NDA. The semiconductor layer 105 may include, for example, polysilicon.

[0038] The first insulating layer 111 may be on the semiconductor layer 105 and on or above all or part of the substrate SUB. The first insulating layer 111 may serve as, for example, a gate insulating film with gate insulation function. The first insulating layer 111 may include a silicon compound, a metal oxide, or another material. For example, the first insulating layer 111 may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, or titanium oxide, or another material, used alone or in combination with each other.

[0039] The first conductive layer 120 may be on the first insulating layer 111 and may include the gate electrode GE of the thin-film transistor (TFT) and the first electrode CE1 of the storage capacitor. The first conductive layer 120 may include at least one of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). The first conductive layer 120 may be a single-layer film or a stacked film formed from one or more of the above materials.

[0040] The second insulating layer 112a may be on the first conductive layer 120 and may insulate the first conductive layer 120 from the second conductive layer 130. The second insulating layer 112a may comprise a material similar to, for example, those used for the first insulating layer 111.

[0041] The second conductive layer 130 may be on the second insulating layer 112a and may include the second electrode CE2 of the storage capacitor. The second conductive layer 130 may include a material similar to that of the first conductive layer 120. The storage capacitor may be formed by the first electrode CE1, the second electrode CE2, and the second insulating layer 112a between the first electrode CE1 and the second electrode CE2.

[0042] The third insulating layer 113 may be on the second conductive layer 130 and may include at least one of the materials of the first insulating layer 111 as described above. In one or more embodiments, the third insulating layer 113 may include, for example, an organic insulating material that may correspond to one of the materials used for the first via layer VIA1 described below.

[0043] The third conductive layer 140 may be on the third insulating layer 113 and may include a source electrode SE, a drain electrode DE, a high potential voltage electrode ELVDDE, and a signal line. The third conductive layer 140 may include at least one of molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). In one embodiment, the third conductive layer 140 may be a monolayer film formed from one or more of the aforementioned metals. In one embodiment, the third conductive layer 140 may include a stacked film. For example, the third conductive layer 140 may be formed as a stacked structure, such as, but not limited to, Ti / Al / Ti, Mo / Al / Mo, Mo / AlGe / Mo, and Ti / Cu. In one embodiment, the third conductive layer 140 may include Ti / Al / Ti.

[0044] The first via layer VIA1 may be on the third conductive layer 140 and may include an organic insulating material. The organic insulating material may include at least one selected from acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, unsaturated polyester resin, polyphenylene ether resin, polyphenylene sulfide resin, and benzocyclobutene (BCB).

[0045] The fourth conductive layer 150 may be on the first via layer VIA1 and may include a data line DL, a connection electrode CNE, and a high-potential voltage line ELVDDL. The data line DL may be electrically connected to the source electrode SE of the thin-film transistor TFT through contact holes penetrating the first via layer VIA1. The connection electrode CNE may be electrically connected to the drain electrode DE of the thin-film transistor TFT through contact holes penetrating the first via layer VIA1. The high-potential voltage line ELVDDL may be electrically connected to the high-potential voltage electrode ELVDDE through contact holes penetrating the first via layer VIA1. The fourth conductive layer 150 may include a material corresponding to the material of the third conductive layer 140.

[0046] The second via layer VIA2 may be on the fourth conductive layer 150 and may include at least one of the materials of the first via layer VIA1 described above.

[0047] The anode ANO can be on the second through-hole layer VIA2 and electrically connected to the connecting electrode CNE through a contact hole penetrating the second through-hole layer VIA2.

[0048] The dam bank may be on the anode (ANO) and may include contact holes that expose the anode (ANO). The dam bank may include organic or inorganic insulating materials. For example, the dam bank may be formed to include at least one of photoresist, polyimide resin, acrylic resin, silicone compound, and polyacrylic resin.

[0049] The light-emitting layer (EL) can be located on the upper surface of the anode (ANO) and in the opening of the dam layer (BANK). The cathode (CAT) is located on the light-emitting layer (EL) and the dam layer (BANK), and can be a common electrode arranged to cover multiple pixels.

[0050] The thin-film encapsulation layer 170 can be on the cathode CAT and can cover the organic light-emitting device. In one embodiment, the thin-film encapsulation layer 170 can be a stacked film in which inorganic films and organic films are alternately stacked. For example, the thin-film encapsulation layer 170 may include a first encapsulating inorganic film 171, an encapsulating organic film 172, and a second encapsulating inorganic film 173 stacked in sequence.

[0051] The display panel 100 may include a panel undersheet CPNL on the lower surface of the substrate SUB. For example, the panel undersheet CPNL may include at least one functional layer, such as a digitizer, a heat dissipation component, a shielding component, and a buffer component.

[0052] Refer again Figure 1 and Figure 2 The display device 1 may also include a printed circuit board 300. One side of the printed circuit board 300 may be attached to the other sides of the sub-region SR. The printed circuit board 300 may be a flexible circuit board. The display device 1 may also include a main circuit board attached to the other sides of the printed circuit board 300.

[0053] Display device 1 may further include a driving component for driving multiple pixels in display area DA. The driving component may include a display driving integrated circuit. In plan view, the driving component may be mounted on a sub-region SR between the curved region BR and the flexible circuit board of display panel 100, or it may be mounted on the printed circuit board 300. The driving component may be attached to display panel 100 by means of a chip-on-plastic (COP), chip-on-glass (COG), or chip-on-film (COF) method.

[0054] As described above, the curved region BR of the display panel 100 can be bent such that the sub-region SR overlaps with the main region MR in the thickness direction. This bending can be achieved by a display device manufacturing apparatus, which will be described later (e.g., Figure 4 10) and the display device manufacturing method are executed.

[0055] Figure 4 This is a perspective view of an embodiment of a display device manufacturing apparatus 10 for manufacturing display devices. Figure 5 This is a perspective view of an embodiment of the display device manufacturing apparatus 10 with the target board installed. Figure 6 It is along Figure 5 A sectional view taken by line C-C'. Figure 7 It is a perspective view of an embodiment including a rotating component (or rotator) RM, a first arm module AR1, and a second arm module AR2.

[0056] In these figures, the first direction X, the second direction Y, and the third direction Z intersect in different directions. In one embodiment, the first direction X, the second direction Y, and the third direction Z may intersect each other perpendicularly. The first direction X may be horizontal, the second direction Y may be vertical, and the third direction Z may be a thickness direction. The first direction X, the second direction Y, and / or the third direction Z may include two or more directions. For example, the third direction Z may include an upward direction toward the upper side of the figure and a downward direction toward the lower side of the figure. In this case, one upward-facing surface of the component may be referred to as the upper surface, and the other downward-facing surfaces of the component may be referred to as the lower surfaces. However, these directions are illustrative and relative, and are not limited to the directions mentioned above.

[0057] refer to Figures 4 to 6The display device manufacturing apparatus 10 may include a first worktable PS1, a second worktable PS2, a rotating component (or rotator) RM, a first arm module AR1, and a second arm module AR2. Each of the first worktable PS1 and the second worktable PS2 may have a predetermined shape in a plane, for example, an approximately rectangular shape including a short side in the first direction X and a long side in the second direction Y. In another embodiment, the first worktable PS1 and the second worktable PS2 may have different shapes.

[0058] First worktable PS1 and second worktable PS2 can be arranged in a first direction X. First worktable PS1 and second worktable PS2 can be spaced apart from each other in the first direction X on a first unit ST1, which will be described later. First worktable PS1 and second worktable PS2 can be connected to each other via the first unit ST1. In one embodiment, first worktable PS1 and second worktable PS2 can be configured such that their respective long sides face each other. However, this disclosure is not limited thereto.

[0059] Each of the first worktable PS1 and the second worktable PS2 may be configured to be movable and / or rotatable in at least one direction. In one embodiment, each of the first worktable PS1 and the second worktable PS2 is movable in a first direction X, a second direction Y, and a third direction Z, and is rotatable about a rotation axis extending in the third direction Z. However, this disclosure is not limited thereto.

[0060] Each of the first worktable PS1 and the second worktable PS2 may include at least one servo motor that powers its movement and / or rotation. Each of the first worktable PS1 and the second worktable PS2 may include a linear stage and / or a UVW stage. In one embodiment, the first worktable PS1 and the second worktable PS2 may be configured as separate stages, and may have dimensions smaller than the first worktable ST1, and may be positioned above the first worktable ST1 for direct mounting of the target board.

[0061] The display device manufacturing apparatus 10 may further include a first ST1 supporting a first worktable PS1 and a second worktable PS2. The first ST1 may be disposed below the first worktable PS1 and the second worktable PS2. The first worktable PS1 and the second worktable PS2 may be mounted on the first ST1. The first ST1 may be connected to the first worktable PS1 and the second worktable PS2, and may move and / or rotate the first worktable PS1 and the second worktable PS2 in at least one direction. As described later, the first ST1 may move and / or rotate the first worktable PS1 and the second worktable PS2 integrally.

[0062] In one embodiment, a first ST1 can move a first worktable PS1 and a second worktable PS2 in at least one of a first direction X, a second direction Y, and a third direction Z, and rotate the first worktable PS1 and the second worktable PS2 about any axis extending in the third direction Z. However, this disclosure is not limited thereto. A drive that provides power for moving and / or rotating the first ST1 can be mounted on the first ST1. The first ST1 may include a linear stage and / or a UVW stage.

[0063] A rotating component (or rotator) RM can be located on one side of the first worktable PS1 and the second worktable PS2 and can extend in the first direction X. The rotating component RM can be positioned along one short side of the first worktable PS1 and one short side of the second worktable PS2 in the first direction X. The length of the rotating component RM in the first direction X can be greater than the sum of the lengths of one short side of the first worktable PS1 and one short side of the second worktable PS2. The rotating component RM can be configured to be rotatable about any axis in the first direction X.

[0064] The display device manufacturing apparatus 10 may further include a rotating component support portion RT_SP, a rotary driver RM_D, and a second unit ST2. The rotating component support portion RT_SP supports the rotating component RM such that the rotating component RM is positioned relative to the first worktable PS1 and the second worktable PS2 at a predetermined location. The rotating component support portion RT_SP can be connected to a corresponding side of the rotating component RM. Each of the corresponding sides of the rotating component RM can be rotatably connected to the rotating component support portion RT_SP. The rotating component support portion RT_SP can connect the rotating component RM and the second unit ST2. In one embodiment, the rotating component support portion RT_SP may be a frame having a "U" shape surrounding a portion of the rotating component RM; however, in another embodiment, the rotating component support portion RT_SP may have a different shape.

[0065] The rotary driver RM_D can be connected to at least one of the two sides of the rotating member RM. The rotary driver RM_D can provide power for the rotation of the rotating member RM.

[0066] The first arm module AR1 and the second arm module AR2 can be connected to the rotating member RM. Although the first arm module AR1 and the second arm module AR2 can be connected to the middle of the rotating member RM extending in the first direction X, the first arm module AR1 and the second arm module AR2 can be respectively positioned at positions corresponding to the first worktable PS1 and the second worktable PS2.

[0067] like Figure 4As shown, when the first arm module AR1 and the second arm module AR2 are arranged in the first direction X, the first arm module AR1 can be positioned between the rotating member RM and the first worktable PS1, and the second arm module AR2 can be positioned between the rotating member RM and the second worktable PS2. In this case, on the plane, the first worktable PS1 and the first arm module AR1 can be arranged in the second direction Y, and the second worktable PS2 and the second arm module AR2 can also be arranged in the second direction Y. When the rotating member RM rotates, the first arm module AR1 and the second arm module AR2 can rotate together with the rotating member RM.

[0068] The display device manufacturing apparatus 10 may further include a second ST2, which may be connected to the rotating component support portion RT_SP and may move and / or rotate the rotating component support portion RT_SP in at least one direction. The second ST2 may move and / or rotate the rotating component support portion RT_SP such that the rotating component RM and the rotating component support portion RT_SP move and / or rotate as a unit.

[0069] In one embodiment, the second ST2 can move the rotating member support portion RT_SP in the first direction X, the second direction Y, and the third direction Z, and rotate the rotating member support portion RT_SP about any axis extending in the third direction Z. However, this disclosure is not limited thereto.

[0070] A drive that provides power for moving and / or rotating the second ST2 can be mounted on the second ST2. The second ST2 may include a linear stage and / or a UVW stage.

[0071] like Figure 5 As shown, the first target board T1 and the second target board T2 can be mounted on the display device manufacturing apparatus 10. The first target board T1 may include a first substrate T11 and a first flexible circuit board T12 connected to the first substrate T11. The second target board T2 may include a second substrate T21 and a second flexible circuit board T22 connected to the second substrate T21.

[0072] Each of the first substrate T11 and the second substrate T21 may be a flexible display panel 100 or a substrate SUB of the flexible display panel 100, and the first flexible circuit board T12 and the second flexible circuit board T22 may be printed circuit boards 300 connected to the flexible display panel 100. For example, the first substrate T11 and the second substrate T21 may be... Figures 1 to 3 The display panel 100, and the first flexible circuit board T12 and the second flexible circuit board T22 can be Figures 1 to 3The printed circuit board 300. In this case, the first target board T1 and the second target board T2 can be flipped and mounted such that the display area DA faces the first worktable PS1 or the second worktable PS2. However, the first target board T1 and the second target board T2 are not limited to Figures 1 to 3 The display panel 100 and the printed circuit board 300.

[0073] The first substrate T11 and the second substrate T21 can be mounted on the first worktable PS1 and the second worktable PS2, respectively. For example, the first worktable PS1 and the second worktable PS2 may include a position fixing unit, such as an electrostatic chuck, an adhesive chuck, and a vacuum chuck, and therefore, the relative position of the first substrate T11 or the second substrate T21 with respect to the first worktable PS1 or the second worktable PS2 can be fixed by the position fixing unit.

[0074] In one implementation, such as Figure 6 As shown, the first worktable PS1 may include at least one air hole AH_PS1, in which a negative pressure is provided. One side opening of the air hole AH_PS1 may be located on the upper surface of the first worktable PS1, thus allowing the first substrate T11 to be adsorbed and fixed onto the first worktable PS1. The second worktable PS2 may also include an air hole substantially the same as or similar to the air hole AH_PS1 of the first worktable PS1.

[0075] like Figure 5 and Figure 6 As shown, the first flexible circuit board T12 can be disposed on the first arm module AR1 and the rotating member RM, and the second flexible circuit board T22 can be disposed on the second arm module AR2 and the rotating member RM. The first flexible circuit board T12 can overlap with the first suction unit AS1 and the first pusher PSH1 in the thickness direction, and the second flexible circuit board T22 can overlap with the second suction unit AS2 and the second pusher PSH2 in the thickness direction.

[0076] The first arm module AR1, the second arm module AR2, and / or the module mounter MM are spaced apart from the first flexible circuit board T12 or the second flexible circuit board T22, and then, after the alignment of the first target board T1 and the second target board T2 is completed, the first arm module AR1, the second arm module AR2, and / or the module mounter MM can be in close contact with the first flexible circuit board T12 or the second flexible circuit board T22 (e.g., within a predetermined distance). However, this disclosure is not limited thereto. For example, the first flexible circuit board T12 and the second flexible circuit board T22 can be disposed only on the first arm module AR1 and the second arm module AR2, respectively, and even before the first target board T1 and the second target board T2 are aligned, the first arm module AR1 and the second arm module AR2 can be in close contact with the first flexible circuit board T12 or the second flexible circuit board T22 (e.g., within a predetermined distance).

[0077] One side of the first flexible circuit board T12 can be connected to the side of the first substrate T11 between the first worktable PS1 and the rotating member RM. The other sides of the first flexible circuit board T12 can be disposed on the rotating member RM. One side and the other sides of the second flexible circuit board T22 can also be disposed in a manner substantially the same as or similar to that of the first flexible circuit board T12.

[0078] like Figure 5 As shown, the first worktable PS1 and the second worktable PS2 can perform alignment operations that move and / or rotate in at least one direction. For example, the alignment operation can be performed before or after mounting the first target plate T1 and the second target plate T2 and / or before or after bending the first target plate T1 and the second target plate T2. Through the alignment operation, the first target plate T1 and the second target plate T2 can be aligned to a position suitable for bending and / or pressing. The display device manufacturing apparatus 10 may also include a controller for controlling the alignment operation.

[0079] The display device manufacturing apparatus 10 may further include at least one detector VC disposed above the first worktable PS1 and / or the second worktable PS2. Alignment operations can be performed based at least on the positional information of the first target board T1 and the second target board T2 obtained by the detector VC.

[0080] The first worktable PS1 and the second worktable PS2 can perform alignment operations independently of each other. For example, the first worktable PS1 and the second worktable PS2 can perform alignment operations independently. When performing the alignment operation, the direction of movement and / or rotation of the first worktable PS1 may be different from the direction of movement and / or rotation of the second worktable PS2. In this case, the moving distance and / or rotation angle of the first worktable PS1 may be substantially the same as or different from the moving distance and / or rotation angle of the second worktable PS2. In one embodiment, when performing the alignment operation, the direction of movement and / or rotation of the first worktable PS1 may be substantially the same as the direction of movement and / or rotation of the second worktable PS2. The moving distance and / or rotation angle of the first worktable PS1 may be different from the moving distance and / or rotation angle of the second worktable PS2.

[0081] For example, the first worktable PS1 can move in a first direction X based on the position information of the first target plate T1, and the second worktable PS2 can move in a second direction Y, different from the first direction X, based on the position information of the second target plate T2. In one example, the first worktable PS1 can rotate clockwise about a third direction Z based on the position information of the first target plate T1, and the second worktable PS2 can rotate counterclockwise about a third direction Z based on the position information of the second target plate T2. The movements and rotations described above can be performed substantially simultaneously. However, this disclosure is not limited thereto.

[0082] Before and after installing the first target plate T1 and the second target plate T2 and / or before and after bending the first target plate T1 and the second target plate T2, the first ST1 and / or the second ST2 can perform alignment operations by movement and / or rotation in at least one direction. Similar to the first worktable PS1 and the second worktable PS2, the movement and / or rotation of the first ST1 and the second ST2 can be performed independently of each other.

[0083] In one embodiment, only the first worktable PS1 and the second worktable PS2 can perform alignment operations before and after mounting the first target plate T1 and the second target plate T2 and / or before and after bending the first target plate T1 and the second target plate T2. However, this disclosure is not limited thereto. The alignment operation of the first worktable ST1 or the second worktable ST2 can be performed substantially simultaneously with the alignment operation of the first worktable PS1 or the second worktable PS2, or the alignment operation of only the first worktable ST1 and / or the second worktable ST2 can be performed.

[0084] Further reference Figure 7The rotating component RM may include a first rotating plate RP1, a second rotating plate RP2, a connecting frame BF, and a module mounter MM. The first rotating plate RP1 and the second rotating plate RP2 may be arranged in a first direction X. A first arm module AR1 and a second arm module AR2 may be located between the first rotating plate RP1 and the second rotating plate RP2. Each of the first rotating plate RP1 and the second rotating plate RP2 may be formed, for example, by a plate-like component and may have a cross-section with an approximately circular, teardrop, or elliptical shape. However, this disclosure is not limited thereto.

[0085] The connecting frame BF may be composed of rod-like members extending in the first direction X. The connecting frame BF may have one side connected to the first rotating plate RP1 and the other side connected to the second rotating plate RP2.

[0086] The module mounter MM can be located between the first rotating plate RP1 and the second rotating plate RP2. The module mounter MM can be located on the side of the connecting frame BF facing the first worktable PS1 and the second worktable PS2. The module mounter MM can extend along one side of the connecting frame BF extending in the first direction X. The module mounter MM can mount the first arm module AR1 and the second arm module AR2.

[0087] The first arm module AR1 may include a first suction unit AS1, and the second arm module AR2 may include a second suction unit AS2. The first arm module AR1 may also include a first actuator PSH1, and the second arm module AR2 may also include a second actuator PSH2. The first suction unit AS1 and the second suction unit AS2 may be spaced apart from each other on the module mount MM and may be arranged in the first direction X. Figure 5 and Figure 6 As shown, the first flexible circuit board T12 and the second flexible circuit board T22 can be respectively mounted on the first adsorber AS1 and the second adsorber AS2.

[0088] The first suction cup AS1 and the second suction cup AS2 may include a positioning unit, such as an electrostatic suction cup, an adhesive suction cup, and a vacuum suction cup. Therefore, the relative position of the first flexible circuit board T12 or the second flexible circuit board T22 with respect to the first suction cup AS1 or the second suction cup AS2 can be fixed by the positioning unit. In one embodiment, after the first target board T1 and the second target board T2 are aligned, positioning of the first flexible circuit board T12 and the second flexible circuit board T22 can be performed using the first suction cup AS1 and the second suction cup AS2.

[0089] The first adsorber AS1 and the second adsorber AS2 can be controlled substantially simultaneously or individually. For example, depending on the process conditions, the first adsorber AS1 and the second adsorber AS2 can be driven cooperatively or independently of each other. For example, the first adsorber AS1 and the second adsorber AS2 can substantially simultaneously adsorb the first flexible circuit board T12 and the second flexible circuit board T22, or they can adsorb the first flexible circuit board T12 and the second flexible circuit board T22 at different times. In one example, the adsorption force of the first adsorber AS1 and the adsorption force of the second adsorber AS2 can be adjusted equally or differently.

[0090] In one implementation, such as Figure 6 As shown, the first adsorber AS1 may include an air hole AH_AS1 for adsorbing a first flexible circuit board T12 mounted on the first adsorber AS1. The second adsorber AS2 may also include an air hole that is substantially the same as or similar to the air hole AH_AS1 of the first adsorber AS1.

[0091] The first actuator PSH1 and the second actuator PSH2 can be located on the side of the module mount MM and / or the rotating component RM facing the first worktable PS1 and the second worktable PS2. The first actuator PSH1 and the second actuator PSH2 can be connected to the rotating component RM via the module mount MM.

[0092] like Figure 4 and Figure 6 As shown, the first actuator PSH1 can be located between the first adsorber AS1 and the first stage PS1, and the second actuator PSH2 can be located between the second adsorber AS2 and the second stage PS2. The first actuator PSH1 and the first adsorber AS1 can be arranged in the second direction Y, and the second actuator PSH2 and the second adsorber AS2 can be arranged in the second direction Y.

[0093] In one implementation, such as Figure 7 As shown, the first actuator PSH1 and the second actuator PSH2 can be configured to be movable in a third direction Z. For example, the third direction Z can include a vertical direction. In one example, the third direction Z can include a direction and other directions opposite to that direction. The one direction and the other directions can be closer to the first flexible circuit board T12 or the second flexible circuit board T22 and farther away from the first flexible circuit board T12 or the second flexible circuit board T22, respectively.

[0094] When the first substrate T11 and the second substrate T21 are bent, the first pusher PSH1 and the second pusher PSH2 press the first flexible circuit board T12 and the second flexible circuit board T22 respectively, thereby preventing the first target board T1 and the second target board T2 from warping. The first pusher PSH1 and the second pusher PSH2 may include at least one air hole for adsorbing the first flexible circuit board T12 or the second flexible circuit board T22.

[0095] like Figure 4 and Figure 6 As shown, before rotating the rotating member RM for bending the first target plate T1, the first worktable PS1, the first pusher PSH1, and the first suction unit AS1 can be arranged sequentially in the second direction Y. The second worktable PS2, the second pusher PSH2, and the second suction unit AS2 can also be arranged sequentially in the second direction Y. In this case, the first suction unit AS1, the module mounter MM, and the first pusher PSH1 can be located between the connecting frame BF and the first worktable PS1, and the second suction unit AS2, the module mounter MM, and the second pusher PSH2 can be located between the connecting frame BF and the second worktable PS2.

[0096] The first worktable PS1 can support the lower surface of the first substrate T11, and the connecting frame BF, the first arm module AR1, and the module mounter MM can support the lower surface of the first flexible circuit board T12. The second substrate T21 and the second flexible circuit board T22 can also be supported by the second worktable PS2, the connecting frame BF, the second arm module AR2, and the module mounter MM in a manner substantially the same or similar to that of the first substrate T11 and the first flexible circuit board T12.

[0097] Before the first target plate T1 and the second target plate T2 are bent, the first actuator PSH1 and the second actuator PSH2 may be spaced apart from the first target plate T1 or the second target plate T2. However, this disclosure is not limited thereto.

[0098] Figure 8 This is a perspective view of an embodiment of a display device manufacturing apparatus 10 for manufacturing display devices, with the target plate in a bent state. Figure 9 It is along Figure 8 A sectional view taken by line D-D'.

[0099] refer to Figures 4 to 9 The first target plate T1 and the second target plate T2 can be bent by rotating the rotating member RM. The bending of the first target plate T1 and the second target plate T2 can be performed after they are in place and / or aligned.

[0100] refer to Figure 8 and Figure 9As described above, the rotating member RM can rotate about any rotation axis extending in the first direction X. The rotation axis can pass through the rotating member RM or can be located outside the rotating member RM. The rotation axis can be an actual axis provided by a shaft or the like, or it can be a virtual axis. When the rotating member RM rotates, the first arm module AR1 and the second arm module AR2 connected to the rotating member RM can also rotate together. Therefore, when the rotating member RM rotates, the first target plate T1 and the second target plate T2 can bend substantially simultaneously.

[0101] like Figure 9 As shown, the rotating member RM can rotate in the direction in which the first target plate T1 and the second target plate T2 are mounted, for example, it can rotate counterclockwise. However, this disclosure is not limited thereto.

[0102] For example, when the rotating member RM rotates, the first suction unit AS1 suctions the first flexible circuit board T12 and rotates together with the rotating member RM, thus allowing the first substrate T11 to bend. Figure 9 As shown, for example, the first substrate T11 can be bent into a cross-section with a "U" shape. When the first substrate T11 is bent, the connecting frame BF, the first suction device AS1, and the first pusher PSH1 can overlap with the first substrate T11 in the thickness direction.

[0103] like Figure 9 As shown, when the first substrate T11 is bent, a portion of the first flexible circuit board T12 and the first substrate T11 connected to the first flexible circuit board T12 can overlap with another portion of the first substrate T11 in the thickness direction. For example, a portion of the first substrate T11, another portion of the first substrate T11, and the bent portion between the portion of the first substrate T11 and the other portion of the first substrate T11 can be respectively... Figure 1 and Figure 2 The sub-region SR, the main region MR, and the curved region BR.

[0104] like Figure 9 As shown, the adhesive member CM can be inserted between a portion of the first substrate T11 and another portion of the first substrate T11. Similarly, the adhesive member CM can also be inserted between a portion of the second substrate T21 and another portion of the second substrate T21.

[0105] Similarly, such as Figure 8 As shown, the second substrate T21 of the second target plate T2 can also be bent in a manner substantially the same as or similar to that of the first substrate T11 by rotating the second suction unit AS2 and the rotating member RM. When the second substrate T21 bends, it is similar to... Figure 9Similar to the first substrate T11, the second substrate T21 has a cross-section with a "U" shape, and the connecting frame BF, the second adsorber AS2 and the second pusher PSH2 can overlap with the second substrate T21 in the thickness direction.

[0106] As described above, when the first substrate T11 and the second substrate T21 are bent, the first stage PS1 and / or the second stage PS2 can perform alignment operations involving movement and / or rotation in at least one direction. As described above, the alignment operations of the first stage PS1 and the second stage PS2 can be performed independently of each other. When the first stage PS1 and / or the second stage PS2 perform alignment operations, the first stage ST1 and / or the second stage ST2 can perform additional alignment operations. However, this disclosure is not limited thereto.

[0107] When the first substrate T11 and the second substrate T21 are bent, the first actuator PSH1 and the second actuator PSH2 can move toward the first flexible circuit board T12 and the second flexible circuit board T22, respectively. For example, as Figure 8 and Figure 9 As shown, the first actuator PSH1 and the second actuator PSH2 can be lowered in the third direction Z. The first actuator PSH1 and the second actuator PSH2 can respectively make close contact with the first flexible circuit board T12 and the second flexible circuit board T22 to prevent the first flexible circuit board T12 or the second flexible circuit board T22 from warping.

[0108] The first actuator PSH1 and the second actuator PSH2 can be controlled substantially simultaneously or individually. For example, depending on the process conditions, the first actuator PSH1 and the second actuator PSH2 can be driven cooperatively or independently of each other. For example, the first actuator PSH1 and the second actuator PSH2 can move substantially the same distance or different distances. As another example, the first actuator PSH1 and the second actuator PSH2 can move substantially simultaneously or can move at different times. Each of the first actuator PSH1 and the second actuator PSH2 can be implemented by a linear guide, which includes a servo motor or a cylinder configured to be telescopic. However, this disclosure is not limited thereto.

[0109] refer to Figure 8 and Figure 9 When the first substrate T11 and the second substrate T21 are bent and / or aligned, the first pressing member FAM1 and the second pressing member FAM2 can descend toward the first target plate T1 and the second target plate T2, respectively. The first pressing member FAM1 can press a portion of the first substrate T11 toward another portion of the first substrate T11, and the second pressing member FAM2 can press a portion of the second substrate T21 toward another portion of the second substrate T21.

[0110] A portion of the first substrate T11 may refer to the portion connected to the first flexible circuit board T12 and the portion adjacent to the first flexible circuit board T12, and a portion of the second substrate T21 may refer to the portion connected to the second flexible circuit board T22 and the portion adjacent to the second flexible circuit board T22.

[0111] refer to Figure 9 The portion of the first substrate T11 pressed by the first pressing member FAM1 can overlap with the adhesive member CM. Similarly, the portion of the second substrate T21 pressed by the second pressing member FAM2 can overlap with the adhesive member CM.

[0112] After pressing is completed, the first pressing member FAM1 and the second pressing member FAM2 move away from the first target plate T1 and the second target plate T2, and the first target plate T1 and the second target plate T2 can be unloaded from the first worktable PS1 and the second worktable PS2. For example, through the above process, the display device 1 can be manufactured to include a device in which the following are formed: Figure 2 The curved area BR shown is the display panel 100 (and the printed circuit board 300 is connected to the display panel 100).

[0113] exist Figures 4 to 9 The diagram shows two target boards, two worktables, and two arm modules. However, the number of target boards, worktables, and arm modules is not limited to this. The display device manufacturing apparatus 10 may include three or more worktables and three or more arm modules.

[0114] Only one first target plate T1 can be mounted on the first worktable PS1 and bent, or only one second target plate T2 can be mounted on the second worktable PS2 and bent. In this case, only one of the first arm module AR1 and the second arm module AR2 can be operated. For example, when only the first target plate T1 is mounted, only the first suction unit AS1 and the first pusher PSH1 can be operated. When only the second target plate T2 is mounted, only the second suction unit AS2 and the second pusher PSH2 can be operated.

[0115] Figure 10 This is a perspective view of an embodiment of a display device manufacturing apparatus 10a for manufacturing display devices. Figure 11 This is under the condition that the target plate is bent. Figure 10 A perspective view of the display device manufacturing apparatus 10a.

[0116] refer to Figure 10 and Figure 11 ,and Figures 4 to 9The implementation methods differ; only one third target board T3 can be mounted on the first workbench PS1 and the second workbench PS2. The third target board T3 can have a... Figures 4 to 9 The first target plate T1 and the second target plate T2 have larger dimensions. The third target plate T3 can be made with... Figures 4 to 9 The first target plate T1 and / or the second target plate T2 are bent and pressed in a generally similar or identical manner.

[0117] The third target board T3 may include a third substrate T31 and a third flexible circuit board T32. For example, the third substrate T31 and the third flexible circuit board T32 may be respectively Figures 1 to 3 The display panel 100 and the printed circuit board 300. However, this disclosure is not limited thereto.

[0118] like Figure 10 and Figure 11 As shown, the third substrate T31 can be disposed on the first worktable PS1 and the second worktable PS2. The third flexible circuit board T32 can be disposed on the arm module AR.

[0119] refer to Figure 9 and Figure 11 The third flexible circuit board T32 can be adsorbed by the first adsorber AS1 and the second adsorber AS2. When the rotating component RM rotates, it... Figure 9 Similar to the first substrate T11 shown, the third substrate T31 can be bent into a cross-section with a "U" shape.

[0120] When the third substrate T31 is bent, with Figure 9 Similarly, in another implementation, the first actuator PSH1 and the second actuator PSH2 can descend toward the third flexible circuit board T32. The first actuator PSH1 and the second actuator PSH2 can be in close contact with the third flexible circuit board T32 (e.g., within a predetermined distance) to prevent the third flexible circuit board T32 from warping.

[0121] When the third substrate T31 is bent, with Figure 9 The implementation method is similar, with the pressing member FAM descending towards the third target plate T3, and thus a portion of the third target plate T3 can press against another portion of the third target plate T3. Although in Figure 11 One pressing member FAM is shown, but the number of pressing members FAM is not limited to this.

[0122] As described above, the first adsorber AS1 and the second adsorber AS2 can be controlled substantially simultaneously or individually. Similarly, the first actuator PSH1 and the second actuator PSH2 can be controlled substantially simultaneously or individually.

[0123] Before and after installing and / or bending the third target plate T3 (third substrate T31), the first ST1 and / or the second ST2 can perform alignment operations involving movement and / or rotation in at least one direction. Therefore, the position of the third target plate T3 can be appropriately adjusted to a position suitable for bending and / or joining. During the alignment operation of the first ST1, the first worktable PS1 and the second worktable PS2 connected to the first ST1 can move and / or rotate integrally.

[0124] For example, in a first mode where the first target plate T1 and the second target plate T2 are respectively mounted on the first worktable PS1 and the second worktable PS2, the first worktable PS1 and / or the second worktable PS2 can move and / or rotate when the first target plate T1 and the second target plate T2 are aligned. Furthermore, in a second mode where the third target plate T3 is mounted on the first worktable PS1 and the second worktable PS2, the first worktable ST1 and / or the second worktable ST2 can move and / or rotate when the third target plate T3 is aligned. Besides the third target plate T3, Figure 10 and Figure 11 The implementation method can be with Figures 4 to 9 The implementation methods are generally the same or similar.

[0125] Figure 12 This is a flowchart illustrating an embodiment of a method for manufacturing a display device. For illustrative purposes, the display device is described as... Figures 1 to 3 The display device 1 corresponds to it, and the method can be made by Figures 4 to 11 The display device manufacturing apparatuses 10 and 10a are used for this purpose. However, in other embodiments, the display device and the display device manufacturing apparatus may differ from those described above.

[0126] refer to Figure 12 The method may include operations such as mounting at least one target plate on multiple worktables PS1 and PS2 (1210), adsorbing the target plate using multiple adsorbers AS1 and AS2 (1220), and bending the target plate by rotating a rotating member RM connected to the multiple adsorbers AS1 and AS2 (1230). At least one target plate may be... Figures 4 to 11 At least one of the first target plate T1, the second target plate T2, and the third target plate T3.

[0127] At point 1210, the operation of mounting at least one target board on multiple worktables PS1 and PS2 may include the operation of mounting one target board on multiple worktables PS1 and PS2. The method may also include the operation of aligning the target board, which may include at least one of the operations of individually moving multiple worktables PS1 and PS2 and individually rotating multiple worktables PS1 and PS2. The display device manufacturing method is not limited to the above examples, and at least some operations may be omitted, or at least one other operation may be included with reference to other descriptions herein.

[0128] refer to Figure 5 The operation of mounting at least one target board on multiple workbenches PS1 and PS2 can include the operation of mounting one of a plurality of target boards on each of the multiple workbenches PS1 and PS2. For example, firstly, a first target board T1 and a second target board T2 can be prepared. For example, the first target board T1 and the second target board T2 can be transferred from the outside via a transfer unit such as a transfer robot. As described above, the transferred first target board T1 and the second target board T2 can be mounted on the first workbench PS1 and the second workbench PS2, respectively.

[0129] refer to Figure 5 The display device manufacturing method may further include an operation to align a target plate, and this alignment operation may include at least one of the following: individually moving multiple worktables PS1 and PS2, and individually rotating multiple worktables PS1 and PS2. For example, after the first target plate T1 and the second target plate T2 are installed, the first worktable PS1 and the second worktable PS2 can perform an alignment operation. Therefore, the first target plate T1 and the second target plate T2 can be aligned to the appropriate position for bending.

[0130] After aligning the first target board T1 and the second target board T2, the first arm module AR1 can attach the first flexible circuit board T12, and the second arm module AR2 can attach the second flexible circuit board T22. In one embodiment, when mounting the first target board T1 and the second target board T2, the first arm module AR1 and the second arm module AR2 can be moved to space them apart from the first flexible circuit board T12 and the second flexible circuit board T22.

[0131] Then, at 1220, multiple adsorbers AS1 and AS2 are used to adsorb the first flexible circuit board T12 and the second flexible circuit board T22. For example, the first arm module AR1 and the second arm module AR2 can move toward the first flexible circuit board T12 and the second flexible circuit board T22 and come into close proximity with them. However, this disclosure is not limited thereto.

[0132] refer to Figure 8and Figure 9 At 1230, the operation of bending the target plate by rotating the rotating member RM connected to the multiple adsorbers AS1 and AS2 can include the operation of bending multiple target plates substantially simultaneously. For example, at 1230, after the alignment and adsorption of the first target plate T1 and the second target plate T2 are completed, the rotating member RM can be rotated to bend the first target plate T1 and the second target plate T2.

[0133] After the first target plate T1 and the second target plate T2 are bent, the first worktable PS1 and the second worktable PS2 can perform the alignment operation again. Therefore, the first target plate T1 and the second target plate T2 can be aligned to the appropriate position for pressing.

[0134] After aligning the first target plate T1 and the second target plate T2, the first pressing member FAM1 and the second pressing member FAM2 can descend toward the first target plate T1 and the second target plate T2 respectively to press the first target plate T1 and the second target plate T2.

[0135] After pressing the first target plate T1 and the second target plate T2, the first pressing member FAM1 and the second pressing member FAM2 can be raised, and the first target plate T1 and the second target plate T2 can be unloaded from the first worktable PS1 and the second worktable PS2, respectively.

[0136] refer to Figure 10 and Figure 11 The operation of mounting at least one target plate on multiple worktables PS1 and PS2 can include the operation of mounting a single target plate on multiple worktables PS1 and PS2. For example, only one third target plate T3 can be mounted on the first worktable PS1 and the second worktable PS2. As described above, by rotating the rotating member RM, the third target plate T3 can be bent and pressed in a manner substantially the same or similar to that of the first target plate T1 and the second target plate T2.

[0137] However, when aligning with the third target plate T3, the first worktable PS1 and the second worktable PS2 do not need to perform separate alignment operations, and the first ST1 can perform the alignment operation, causing the first worktable PS1, the second worktable PS2, and the third target plate T3 mounted on the first worktable PS1 and the second worktable PS2 to move and / or rotate as a whole. In this case, the second ST2 can also perform the alignment operation, causing the rotating component RM, the first arm module AR1, and the second arm module AR2 to move and / or rotate as a whole.

[0138] A first target board T1 can be mounted on either a first worktable PS1 or a second worktable PS2. In this case, among the first worktable PS1, the second worktable PS2, the first arm module AR1, and the second arm module AR2, only the first worktable PS1 and the first arm module AR1 can be driven, or only the second worktable PS2 and the second arm module AR2 can be driven.

[0139] According to one or more embodiments of the apparatus and method for manufacturing display devices, one or more display panels can be selectively mounted on multiple worktables for bending and joining the display panels. Therefore, process time can be reduced, equipment efficiency improved, and design changes can be flexibly responded to.

[0140] Those skilled in the art will understand that many variations and modifications can be made to the preferred embodiments without substantially departing from the principles of the invention. Therefore, the preferred embodiments disclosed herein are used in a general and descriptive sense only and not for limiting purposes. Embodiments can be combined to form other embodiments.

Claims

1. An apparatus for manufacturing a display device, comprising: Multiple worktables are spaced apart from each other in a first direction, and the multiple worktables are configured to support the target plate; Multiple arms are arranged in the first direction and spaced apart from the multiple worktables in a second direction intersecting the first direction; as well as A rotator, connected to the plurality of arms and configured to rotate about a rotation axis extending in the first direction, The rotator includes: First rotating plate, The second rotating plate faces the first rotating plate. A connecting frame connects the first rotating plate and the second rotating plate to each other, and The mounting device, on which the plurality of arms are mounted, and The installer is configured to extend in the first direction between the plurality of workbenches and the connecting frame, and The plurality of arms are arranged on the mounter in the first direction.

2. The apparatus according to claim 1, wherein, Each of the plurality of worktables is configured to be movable in the first and second directions and to rotate about a rotation axis extending upward in a third direction intersecting the first and second directions. The plurality of worktables are configured to move and rotate independently of each other.

3. The apparatus according to claim 1, wherein, Each of the plurality of worktables includes at least one air vent configured with negative pressure, and Each of the plurality of arms includes an adsorber configured to adsorb the target plate.

4. The apparatus according to claim 3, wherein, The adsorber includes at least one air hole configured with negative pressure. The adsorbers of the plurality of arms are configured to be controlled independently of each other, and Each of the plurality of arms includes a pusher configured to press the target plate when the target plate is bent.

5. The apparatus according to claim 1, wherein, The plurality of worktables includes a first worktable and a second worktable spaced apart from the first worktable in the first direction, and the target plate includes a first target plate mounted on the first worktable and a second target plate mounted on the second worktable.

6. The apparatus according to claim 1, wherein: The plurality of worktables includes a first worktable and a second worktable spaced apart from the first worktable in the first direction, and The target board is mounted on the first workbench and the second workbench.

7. A method for manufacturing a display device using the apparatus according to any one of claims 1-6, the method comprising: Install at least one target board on multiple workbenches; The target plate is adsorbed using multiple arms; as well as Rotate the rotator connected to the plurality of arms to bend the target plate.

8. The method according to claim 7, further comprising: Align with the target plate. Aligning the target plate includes at least one of individually moving the plurality of worktables and individually rotating the plurality of worktables.

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