Display device

Abstract

A display apparatus is provided. The display apparatus includes a flexible circuit board including a plurality of flexible pads, a main circuit board including a plurality of main pads, and a display panel including a plurality of pixels connected to the flexible circuit board and configured to receive a signal from a driving chip. In each of the plurality of flexible pads and the plurality of main pads, a portion of the pad (i.e., the flexible pad and the main pad) is gradually inclined from a pad disposed at a center among the pads to a pad disposed at an outer side, and an inclination angle of the main pad disposed at an outermost side of the main circuit board is greater than an inclination angle of the flexible pad disposed at an outermost side of the flexible circuit board.

Description

[0001] Cross-references to related applications

[0002] This patent application claims priority to Korean Patent Application No. 10-2020-0165488, filed on December 1, 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to a display device, and more specifically, to a display device having a compensating pad structure and improved reliability. Background Technology

[0004] A display device is used to provide information to a user by displaying images, videos, and user interfaces. A display device may include a processor, memory, and a display assembly.

[0005] During the manufacturing of a display device, circuit boards are attached to the display panel after the display panel has been manufactured. For example, in the tape-on-board (TAB) mounting method, flexible circuit boards are bonded to the display panel using anisotropic conductive film (ACF).

[0006] However, in some conventional display devices, manufacturing and process errors can cause misalignment between bonding pads during pressure bonding. Therefore, research has been conducted on solutions to improve the reliability of these display devices. Summary of the Invention

[0007] This disclosure provides a display device that prevents contact failures between solder pads during the bonding process of a circuit board.

[0008] An embodiment of the present invention provides a display device, comprising: a flexible circuit board including a driver chip, and the flexible circuit board further comprising a plurality of flexible pads arranged in a first direction and extending in a second direction intersecting the first direction; a main circuit board including a plurality of main pads and partially overlapping the flexible circuit board such that corresponding plurality of flexible pads overlap with the main pads in a third direction perpendicular to the first and second directions; and a display panel including a plurality of pixels connected to the flexible circuit board and configured to receive signals from the driver chip, wherein, in each of the plurality of flexible pads and the plurality of main pads, a portion of the pads (i.e., flexible pads and main pads) gradually tilts from a central pad to an outer pad, and the tilt angle of the main pads located at the outermost edge of the main circuit board is greater than the tilt angle of the flexible pads located at the outermost edge of the flexible circuit board.

[0009] In an embodiment, each flexible pad may include a first central portion and a first outward tilted portion and a first inward tilted portion, the first outward tilted portion and the first inward tilted portion tilting from the first central portion at the same angle, and each main pad may include: a second central portion overlapping the first central portion; a second outward tilted portion overlapping the first inward tilted portion of the corresponding flexible pad; and a second inward tilted portion overlapping the first outward tilted portion of the corresponding flexible pad, wherein the second outward tilted portion and the second inward tilted portion tilt at the same angle.

[0010] In an embodiment, the tilt angle of each flexible pad can be defined as the angle at which each of the first outward tilt portion and the first inward tilt portion tilts from the first central portion, and the tilt angle of each main pad can be defined as the angle at which each of the second outward tilt portion and the second inward tilt portion tilts from the second central portion.

[0011] In an embodiment, the second inward tilt portion of each main pad can protrude from the first outward tilt portion of the corresponding flexible pad that contacts the second inward tilt portion, and the protrusion of the second inward tilt portion can be exposed to the outside of the flexible circuit board.

[0012] In an embodiment, the length of the second inwardly inclined portion protruding in the second direction may be less than half the length of the second central portion in the second direction.

[0013] In one embodiment, each of the first outwardly inclined portion and the first inwardly inclined portion can be inclined outward from the first central portion toward the outside of the flexible circuit board in an outward direction, and each of the second outwardly inclined portion and the second inwardly inclined portion can be inclined outward from the second central portion toward the outside of the main circuit board in an outward direction.

[0014] In one embodiment, each of the first outwardly inclined portion and the first inwardly inclined portion may be inclined in an inward direction toward the center of the flexible circuit board from the first central portion, and each of the second outwardly inclined portion and the second inwardly inclined portion may be inclined in an inward direction toward the center of the main circuit board from the second central portion.

[0015] In an embodiment, each master pad may have a larger area than the area to which it is connected to the corresponding flexible pad.

[0016] In an embodiment, the first central portion and the second central portion may have the same length.

[0017] In one embodiment, a plurality of flexible circuit boards may be provided, and these flexible circuit boards may be arranged on the display panel along a first direction. Attached Figure Description

[0018] The above and other aspects and features of this disclosure will become more apparent from the detailed description of its embodiments with reference to the accompanying drawings, in which:

[0019] Figure 1 This is a perspective view of a display device according to an embodiment of the concept of the present invention;

[0020] Figure 2A This is a plan view of a display device according to an embodiment of the concept of the present invention;

[0021] Figure 2B This is a cross-sectional view of a display device according to an embodiment of the present invention;

[0022] Figure 3A This is a cross-sectional view showing the display area of ​​a display panel according to an embodiment of the present invention;

[0023] Figure 3B This is a cross-sectional view showing the display area of ​​a display panel according to an embodiment of the present invention;

[0024] Figure 4 This is an enlarged view showing a region of a flexible circuit board according to an embodiment of the present invention;

[0025] Figure 5 This is an enlarged view showing a region of the main circuit board according to an embodiment of the concept of the present invention;

[0026] Figure 6 This is a plan view illustrating the coupling relationship between a flexible circuit board and a main circuit board according to an embodiment of the present invention;

[0027] Figure 7 This is a plan view illustrating the coupling relationship between the pads of the flexible circuit board and the main circuit board according to an embodiment of the present invention;

[0028] Figure 8 This is a plan view illustrating the coupling relationship between a portion of the display panel and the main circuit board according to an embodiment of the present invention;

[0029] Figure 9 This is a plan view illustrating the coupling relationship between a portion of a display panel, a flexible circuit board, and a main circuit board according to an embodiment of the present invention.

[0030] Figure 10 This is a plan view illustrating the coupling relationship between a flexible circuit board and a main circuit board according to an embodiment of the present invention;

[0031] Figure 11 This is a plan view illustrating the coupling relationship between a flexible circuit board and a main circuit board according to an embodiment of the present invention; and

[0032] Figure 12 This is a plan view illustrating the coupling relationship between a flexible circuit board and a main circuit board according to an embodiment of the present invention. Detailed Implementation

[0033] This disclosure can be modified and implemented in many different forms, and therefore specific embodiments will be shown in the accompanying drawings and described in detail below. However, this disclosure should not be limited to the specific form disclosed and should be construed as including all modifications, equivalents, or substitutions contained within the spirit and scope of this disclosure.

[0034] In this specification, it should also be understood that when a component (or region, layer, part, etc.) is referred to as "on another component", "connected to", or "coupled to" another component, it can be directly set / connected / coupled to a component or directly set / connected / coupled to a component, or there may be an intermediate third component.

[0035] The same reference numerals always refer to the same elements, and where descriptions of elements have been omitted, it is understood that the element is at least similar to the corresponding element described elsewhere in the specification. Furthermore, in the drawings, the thickness, proportions, and dimensions of components may be exaggerated for clarity.

[0036] The term “and / or” includes any and all combinations of one or more of the related listed items.

[0037] It will be understood that although the terms "first" and "second" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one component from others. For example, a first element referred to as a first element in one embodiment may be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless the context otherwise indicates, descriptions applied to elements in their singular form may also be applied to multiple identical elements.

[0038] In addition, terms such as “below,” “under,” “above,” and “upper” are used to explain the relationship between components shown in the accompanying drawings. These terms can be relative concepts and are described based on the directions depicted in the drawings. However, when a component is described as “overlapping” with another component, this generally describes the relationship of the two components overlapping each other in the thickness (e.g., vertical or third) direction, unless otherwise specified or indicated by the drawings or context.

[0039] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and not as having an idealized or overly formal meaning, unless expressly defined herein.

[0040] The terms "comprising" or "including" specify an attribute, fixed value, step, operation, element, component, or combination thereof, but do not exclude other attributes, fixed values, steps, operations, elements, components, or combinations thereof. In the following description, embodiments of the inventive concept will be illustrated with reference to the accompanying drawings.

[0041] Figure 1 This is a perspective view of a display device according to an embodiment of the concept of the present invention. Figure 2A This is a plan view of a display device according to an embodiment of the concept of the present invention. Figure 2B This is a cross-sectional view of a display device according to an embodiment of the present invention. Figure 3A This is a cross-sectional view showing the display area of ​​a display panel according to an embodiment of the present invention. Figure 3B This is a cross-sectional view showing the display area of ​​a display panel according to an embodiment of the present invention.

[0042] refer to Figures 1 to 2B The display device DD may include a display panel DP, a flexible circuit board FPCB, and a main circuit board MPCB.

[0043] In this embodiment, the display panel DP can be a liquid crystal display panel, a plasma display panel, an electrophoretic display panel, a microelectromechanical system (MEMS) display panel, an electrowetting display panel, an organic light-emitting display panel, or a quantum dot display panel. When the display panel DP is a liquid crystal display panel, the display device DD may further include a backlight unit disposed below the display panel DP.

[0044] The display panel DP may include a first display substrate 100 and a second display substrate 200. The second display substrate 200 may face the first display substrate 100. A grayscale display layer for generating images may be disposed between the first display substrate 100 and the second display substrate 200. Depending on the type of display panel, the grayscale display layer may include a liquid crystal layer, an organic emitting layer, and / or an electrophoretic layer.

[0045] The display device DD may also include a window covering the display panel DP and a structural component or molded component coupled to the window to define the appearance of the display device DD.

[0046] like Figure 1As shown, the display panel DP can display an image via the display surface DP-IS. The display surface DP-IS is parallel to the surface defined by the first direction DR1 and the second direction DR2. The display surface DP-IS may include a display area DA and a non-display area NDA.

[0047] The non-display area NDA can be defined along the outer edge of the display surface DP-IS. The display area DA can be surrounded by the non-display area NDA. However, embodiments of the present invention are not necessarily limited to this. For example, the non-display area NDA can be located only in one area adjacent to the flexible circuit board FPCB.

[0048] The normal direction of the display surface DP-IS (e.g., the thickness direction of the display panel DP) can be a third direction DR3. The front (or top) and rear (or bottom) surfaces of some elements and / or layers, as described below, can be distinguished by a third direction DR3. However, the first direction DR1 to the third direction DR3 shown in this embodiment are merely examples.

[0049] Although a display panel DP with a planar display surface DP-IS is shown in the embodiments of the present invention, the display surface is not necessarily limited to this. The display device DD may include a curved display surface or a three-dimensional display surface. A three-dimensional display surface may include multiple display areas displayed in different directions.

[0050] The main circuit board (MPCB) can be spaced apart from the edge E-DP of the display panel (DP). The signal controller (SC) can be mounted on the main circuit board (MPCB). The signal controller (SC) is configured to receive image data and control signals from an external graphics controller. The signal controller (SC) can provide control signals to the display panel (DP).

[0051] The flexible printed circuit board (FPCB) electrically connects the display panel (DP) to the main circuit board (MPCB). The FPCB may include multiple flexible pads that are one-to-one connected to display pads located on the display pad area (PDA) of the display panel (DP). Additionally, the FPCB may include one-to-one connected to the main pad area (MDA) of the main circuit board (MPCB) (see [link to main pad area]). Figure 5 The main pads MP(1) to MP(m) on the ) (see Figure 5 Flexible pads FP(1) to FP(n) (see) Figure 4 For the sake of brevity, the flexible pads FP(1) to FP(n) and the main pads MP(1) to MP(m) are sometimes referred to as “pads” in this document.

[0052] Conductive bonding components can enable flexible pads FP(1) to FP(n) (see...) Figure 4Connect to the main pads MP(1) to MP(m) (see...) Figure 5 The conductive bonding component may include anisotropic conductive film (ACF). Hereinafter, the anisotropic conductive film (ACF) will be referred to as the conductive bonding component. Predetermined heat and pressure can be applied to the flexible printed circuit board (FPCB) using pressure bars to bond the pads together.

[0053] In some cases, when the pressure bar is pressed, the flexible circuit board (FPCB) or the main circuit board (MPCB) may tilt relative to the display panel (DP), causing misalignment between the pads.

[0054] The flexible printed circuit board (FPCB) may include a driver chip (DC). The driver chip DC can receive signals from the main printed circuit board (MPCB), and the display panel (DP) can receive signals from the driver chip DC. For example, the driver chip DC may be a data driving circuit. In embodiments of the present invention, the flexible printed circuit board (FPCB) can transmit signals provided from the signal controller (SC) to the display panel (DP).

[0055] In this embodiment, multiple flexible circuit boards (FPCBs) can be provided. For example, the flexible circuit boards may be spaced apart from each other in the first direction DR1. However, embodiments of the inventive concept are not necessarily limited to this. For example, the flexible circuit boards (FPCBs) may include two types of flexible circuit boards that at least partially overlap each other.

[0056] In this embodiment, the display pad area PDA is disposed on the first display substrate 100, but the embodiments of the present invention are not necessarily limited to this. In embodiments of the present invention, the display pad area PDA may be disposed on the second display substrate 200.

[0057] Figure 2A The arrangement of signal lines GL1 to GLn, DL1 to DLm, PL-G, and PL-D with pixels PX11 to PXnm is shown. Signal lines GL1 to GLn, DL1 to DLm, PL-G, and PL-D may include multiple gate lines GL1 to GLn, multiple data lines DL1 to DLm, and auxiliary signal lines PL-G and PL-D.

[0058] Multiple gate lines GL1 to GLn extend along a first direction DR1 and are arranged along a second direction DR2. Multiple data lines DL1 to DLm may intersect with and are insulated from the gate lines GL1 to GLn. The gate lines GL1 to GLn and the data lines DL1 to DLm may overlap with the display area DA. The auxiliary signal lines PL-G and PL-D may overlap with the non-display area NDA, and the auxiliary signal lines PL-G and PL-D are connected to the corresponding gate lines GL1 to GLn and the corresponding data lines DL1 to DLm.

[0059] The second auxiliary signal line PL-D, connected to the data lines DL1 to DLm, can be disposed on a different layer than the layer on which the multiple data lines DL1 to DLm are disposed. The data lines DL1 to DLm can be electrically connected to their corresponding second auxiliary signal lines PL-D via contact holes CH. The contact holes CH can penetrate at least one insulating layer disposed between the data lines DL1 to DLm and the second auxiliary signal line PL-D. Figure 2A In the example shown, two contact holes CH are illustrated.

[0060] In embodiments of the present invention, the contact hole CH can be omitted. Data lines DL1 to DLm and the second auxiliary signal line PL-D can be disposed on the same layer. For example, interconnected data lines DL1 to DLm and the second auxiliary signal line PL-D can be defined as a single signal line. Interconnected data lines and the second auxiliary signal line PL-D can be defined as different portions of a single signal line.

[0061] Pixels PX11 to PXnm can be disposed on the display area DA. Pixels PX11 to PXnm may not be disposed on the non-display area NDA. Each pixel among PX11 to PXnm can be connected to a corresponding gate line among multiple gate lines GL1 to GLn and a corresponding data line among multiple data lines DL1 to DLm. Each pixel among PX11 to PXnm may include pixel driving circuitry and a display element.

[0062] exist Figure 2A In this example, although pixels PX11 to PXnm are arranged in a rectangular matrix, embodiments of the present invention are not necessarily limited to this. For example, pixels PX11 to PXnm can be arranged in a rhomboid shape. In this case, the arrangement structure of pixels PX11 to PXnm can be defined as a pentile structure.

[0063] The gate driver circuit (GDC) can be integrated with the display panel (DP) using either an silicon oxide gate driver circuit (OSG) or an amorphous silicon gate driver circuit (ASG) process. The first auxiliary signal line (PL-G) can receive the gate signal from the gate driver circuit (GDC).

[0064] refer to Figure 2BThe flexible circuit board (FPCB) can be bent with a predetermined curvature in the direction toward the rear surface DP-BS of the display panel (DP). In this case, the main circuit board (MPCB) can be disposed on or near the rear surface DP-BS of the display panel (DP). In this embodiment, the flexible circuit board (FPCB) may include a front surface FU and a rear surface FB. The driver chip DC may be mounted on the rear surface FB of the flexible circuit board (FPCB). The main circuit board (MPCB) may include a front surface MU and a rear surface MB. When the flexible circuit board (FPCB) bends toward the rear surface DP-BS of the display panel (DP), the rear surface MB of the main circuit board (MPCB) may face the rear surface DP-BS of the display panel (DP).

[0065] Figure 3A and Figure 3B This illustrates a display panel DP according to an embodiment of the concept of the present invention (see [reference]). Figure 1 The display area DA (see) Figure 1 Cross-sectional view of ). Figure 3A A cross-section corresponding to the pixels PX of the liquid crystal display panel is shown, and Figure 3B A cross section corresponding to the pixel PX of an organic light-emitting display panel is shown.

[0066] refer to Figure 3A The display panel DP according to an embodiment of the present invention (see Figure 1 The grayscale display layer of a display device (DD) may include a liquid crystal layer. For example, the display panel DP may be a liquid crystal display panel. When the display panel DP is a liquid crystal display panel, the display device DD (see...) Figure 1 It may also include a backlight unit located below the display panel (DP).

[0067] The pixels PX of a liquid crystal display panel may include transistors TR, liquid crystal capacitors Clc, and storage capacitors Cst.

[0068] The transistor TR includes a control electrode GE connected to the gate line, an active portion AL overlapping the control electrode GE in the thickness direction, an input electrode SE connected to the data line, and an output electrode DE spaced apart from the input electrode SE. The liquid crystal capacitor Clc includes a pixel electrode PE and a common electrode CE. The storage capacitor Cst includes a pixel electrode PE and a portion of the storage line STL overlapping the pixel electrode PE.

[0069] A control electrode GE and a storage line STL are disposed on one surface of a first substrate BS1. The first substrate BS1 may include a glass substrate, a plastic substrate, and / or a substrate comprising polyimide (PI). A first insulating layer 10 covering the control electrode GE and the storage line STL is disposed on one surface of the first substrate BS1. The first insulating layer 10 may include inorganic and / or organic materials.

[0070] An active portion AL overlapping the control electrode GE is disposed on the first insulating layer 10. The active portion AL may include a semiconductor layer SCL and an ohmic contact layer OCL. The semiconductor layer SCL is disposed on the first insulating layer 10, and the ohmic contact layer OCL is disposed on the semiconductor layer SCL.

[0071] The semiconductor layer SCL may include amorphous silicon or polycrystalline silicon. The semiconductor layer SCL may also include a metal oxide semiconductor. The ohmic contact layer OCL may include dopants doped at a higher density than the semiconductor layer. The ohmic contact layer OCL may include two portions spaced apart from each other; for example, the constituent portions of the ohmic contact layer OCL may be spaced apart from each other in the horizontal direction. In embodiments of the inventive concept, the ohmic contact layer OCL may have a monolithic shape.

[0072] Output electrode DE and input electrode SE are disposed on the active portion AL. Output electrode DE and input electrode SE are spaced apart from each other. A second insulating layer 20 covering the active portion AL, output electrode DE, and input electrode SE is disposed on the first insulating layer 10. A third insulating layer 30 is disposed on the second insulating layer 20. The second insulating layer 20 and the third insulating layer 30 may each comprise inorganic and / or organic materials. For example, the third insulating layer 30 may be a single organic layer providing a flat surface. In this embodiment, the third insulating layer 30 may include a plurality of color filters. A fourth insulating layer 40 is disposed on the third insulating layer 30. The fourth insulating layer 40 may be an inorganic layer that at least partially covers the color filters.

[0073] like Figure 3A As shown, the pixel electrode PE is disposed on the fourth insulating layer 40. The pixel electrode PE is connected to the output electrode DE through contact holes CH-L penetrating the second insulating layer 20, the third insulating layer 30, and the fourth insulating layer 40. An alignment layer LC covering the pixel electrode PE may be disposed on the fourth insulating layer 40.

[0074] The second substrate BS2 can be and / or includes a glass substrate, a plastic substrate, and a substrate including polyimide (PI). A black matrix layer BM is disposed on the bottom surface of the second substrate BS2. Openings corresponding to pixel regions can be defined in the black matrix layer BM. Spacers CS can overlap with the black matrix layer BM.

[0075] An insulating layer covering the black matrix layer BM is disposed on the bottom surface of the second substrate BS2. Figure 3A An example of a fifth insulating layer 50 providing a flat surface is shown. The fifth insulating layer 50 may include an organic material.

[0076] The common electrode CE can be disposed on the bottom surface of the fifth insulating layer 50. A common voltage can be applied to the common electrode CE. The common voltage and the pixel voltage can be different from each other.

[0077] Provided in Figure 3A The cross-section of pixel PX shown is for example. The first display substrate 100 and the second display substrate 200 can be in third-party orientation DR3 (see...). Figure 1 The color filter can be set on the second display substrate 200.

[0078] Although reference Figure 3A Liquid crystal display panels in vertical alignment (VA) mode have been described, but liquid crystal display panels in in-plane switching (IPS) mode, edge field switching (FFS) mode, plane-to-linear switching (PLS) mode, super vertical alignment (SVA) mode, or surface-stabilized vertical alignment (SS-VA) mode can be applied to embodiments of the present invention.

[0079] refer to Figure 3B The display panel DP according to an embodiment of the present invention (see Figure 1 The grayscale display layer of a display panel can include an organic emitting layer. For example, the display panel DP can be an organic light-emitting display panel.

[0080] The organic light-emitting display panel includes a display substrate 100 and an encapsulation substrate 200. The display substrate 100 includes a first substrate BS1, a circuit element layer DP-CL disposed on the first substrate BS1, a display element layer DP-OLED disposed on the circuit element layer DP-CL, and a cover layer CL disposed on the display element layer DP-OLED. The encapsulation substrate 200 may include a second substrate BS2, a black matrix layer BM disposed on the second substrate BS2, and a color control layer CCL.

[0081] The DP-CL circuit element layer may include multiple insulating layers, semiconductor patterns, conductive patterns, and signal lines. The insulating layers, semiconductor layers, and conductive layers can be formed through processes such as coating or deposition. Subsequently, the insulating layers, semiconductor layers, and conductive layers can be selectively patterned using photolithography. The semiconductor patterns, conductive patterns, and signal lines provided in the DP-CL circuit element layer and the DP-OLED display element layer can be formed through one or more of the methods described above.

[0082] The first substrate BS1 may include a synthetic resin film. Alternatively, the first substrate BS1 may include a glass substrate, a metal substrate, or an organic / inorganic composite substrate.

[0083] A buffer layer BFL is disposed on the first substrate BS1. The buffer layer BFL can improve the adhesion between the first substrate BS1 and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer. The silicon oxide layer and the silicon nitride layer may be stacked alternately.

[0084] A semiconductor pattern is disposed on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, embodiments of the present invention are not necessarily limited thereto. For example, the semiconductor pattern may include amorphous silicon or metal oxide.

[0085] Semiconductor patterns can include doped and undoped regions. Doped regions can be doped with N-type or P-type dopants. For example, a P-type transistor includes a doped region doped with P-type dopants.

[0086] Doped regions can have higher conductivity than undoped regions and can be used as electrodes or signal lines. Undoped regions can substantially correspond to the active region (or channel) of a transistor. For example, one part of a semiconductor pattern can be the active region of a transistor, another part can be the source or drain of a transistor, and yet another part can be a connection electrode or a connection signal line.

[0087] Transistor T1 is disposed on buffer layer BFL. The source S1, active region A1, and drain D1 of transistor T1 are formed by semiconductor patterns. Figure 3B A portion of the connection signal line SCL, formed by a semiconductor pattern, is shown. The connection signal line SCL can be connected on a plane to the drain D1 of the transistor TR.

[0088] First insulating layers 10 to sixth insulating layers 60 are disposed on buffer layer BFL. Each of the first insulating layers 10 to sixth insulating layers 60 can be an inorganic layer or an organic layer. Gate G1 is disposed on first insulating layer 10. Upper electrode UE can be disposed on second insulating layer 20. First connection electrode CNE1 can be disposed on third insulating layer 30. First connection electrode CNE1 can be connected to signal line SCL through contact hole CNT-1 penetrating first insulating layer 10 to third insulating layer 30. Second connection electrode CNE2 can be disposed on fifth insulating layer 50. Second connection electrode CNE2 can be connected to first connection electrode CNE1 through contact hole CNT-2 penetrating fourth insulating layer 40 and fifth insulating layer 50.

[0089] The light-emitting element OLED is disposed on the sixth insulating layer 60. The first electrode AE ​​is disposed on the sixth insulating layer 60. The first electrode AE ​​is connected to the second connecting electrode CNE2 through the contact hole CNT-3 penetrating the sixth insulating layer 60.

[0090] The display element layer of a DP-OLED includes an OLED light-emitting element and a pixel-defining layer (PDL). For example, the PDL can be an organic layer. The OLED light-emitting element may include a first electrode (AE), a hole control layer (HCL), an emission layer (EML), an electron control layer (ECL), and a second electrode (CE).

[0091] A pixel defining layer (PDL) is disposed on a sixth insulating layer 60. The pixel defining layer (PDL) includes an opening (OP) (hereinafter referred to as an emission opening OP). The emission opening OP of the pixel defining layer (PDL) can expose at least a portion of the first electrode AE. In embodiments of the inventive concept, the pixel defining layer (PDL) can be black. The pixel defining layer (PDL) can include a black colorant. For example, the pixel defining layer (PDL) can include a black dye and a black pigment mixed with a matrix resin.

[0092] Figure 3B The emitting region PXA and the non-emitting region NPXA adjacent to the emitting region PXA are shown. The emitting region PXA can substantially correspond to the portion of the first electrode AE ​​exposed by the emitting opening OP.

[0093] The hole control layer (HCL) can be commonly disposed on the emitter region (PXA) and the non-emitter region (NPXA). The HCL may include a hole transport layer and may also include a hole injection layer. The emitter layer (EML) is disposed on the HCL. The EML may be disposed in the region corresponding to the emitter opening (OP).

[0094] An electronic control layer (ECL) is disposed on the emitter layer (EML). The ECL may include an electron transport layer and may also include an electron injection layer. A second electrode (CE) is disposed on the ECL.

[0095] A capping layer CL is disposed on the second electrode CE. The capping layer CL may include multiple thin films. In this embodiment, the capping layer CL may include a sealing layer and a thin film encapsulation layer.

[0096] The second substrate BS2 may be spaced apart from the cover layer CL in the thickness direction. The second substrate BS2 may be and / or include a glass substrate, a plastic substrate, and a substrate including polyimide (PI).

[0097] The color control layer (CCL) can transmit a first color of light or convert the first color of light into a second or third color of light based on the color of light provided by the OLED light-emitting element. The color control layer (CCL) may include quantum dots. For example, the first color of light may be blue light.

[0098] The black matrix layer BM can overlap with the non-emissive region NPXA. The black matrix layer BM can be black. For example, the black matrix layer BM can include materials that substantially absorb visible light, but is not necessarily limited to this.

[0099] Figure 4 This is an enlarged view showing a region of a flexible circuit board according to an embodiment of the present invention. Figure 5 This is an enlarged view showing a region of the main circuit board according to an embodiment of the concept of the present invention. Figure 6 This is a plan view illustrating the coupling relationship between a flexible circuit board and a main circuit board according to an embodiment of the present invention. Figure 7 This is a plan view illustrating the coupling relationship between the pads of a flexible circuit board and a main circuit board according to an embodiment of the present invention.

[0100] Figure 4 Flexible pads FP(1) to FP(n) are shown on the flexible pad area FDA of a flexible circuit board FPCB according to an embodiment. The flexible pads FP(1) to FP(n) may be disposed on the rear surface FB of the flexible circuit board FPCB.

[0101] In the following description of the flexible pads FP(1) to FP(n) according to embodiments of the present invention, the flexible pads FP(1) to FP(n) can be arranged in a first direction DR1 based on a first flexible pad FP(1) disposed at the center of the flexible pads FP(1) to FP(n) and can also be horizontally symmetrical to each other. Therefore, the same reference numerals can be used for two pads symmetrically spaced around a central pad, and the same description can be applied to configurations assigned the same reference numerals.

[0102] In the flexible pads FP(1) to FP(n) according to an embodiment of the present invention, a portion of the flexible pads FP(1) to FP(n) may gradually tilt in a first direction DR1 from the first flexible pad FP(1) disposed at the center of the flexible circuit board FPCB toward the nth flexible pad FP(n) disposed on the outer side. For example, a portion of the flexible pad near any outer side of the flexible circuit board FPCB may have a more pronounced tilt compared to a portion of the flexible pad disposed near the center of the flexible circuit board FPCB.

[0103] Flexible pads FP(1) to FP(n) can be arranged along a first direction DR1, and each of the flexible pads FP(1) to FP(n) can extend substantially along a second direction DR2.

[0104] Each of the flexible pads FP(1) to FP(n) may include a first central portion FC, a first outward tilt portion FE, and a first inward tilt portion FI. Each of the first outward tilt portion FE and the first inward tilt portion FI may be tilted from the first central portion FC.

[0105] In the following text, since the angles of the first outwardly inclined portion FE and the first inwardly inclined portion FI, which are inclined from the first central portion FC, can be the same, the angle of the first inwardly inclined portion FI will be described.

[0106] In an embodiment of the present invention, the angles of the first outwardly inclined portion FE and the first inwardly inclined portion FI, which are inclined from the first central portion FC, can correspond to the angles of the first outwardly inclined portion FE and the first inwardly inclined portion FI, which are inclined from the second extension line LF2 and the first extension line LF1, respectively.

[0107] exist Figure 4 In the diagram, the boundary between the first central portion FC and the first inwardly inclined portion FI of each of the flexible pads FP(1) to FP(n) is shown as a first extension line LF1. The boundary between the first central portion FC and the first outwardly inclined portion FE of each of the flexible pads FP(1) to FP(n) is shown as a second extension line LF2.

[0108] In this embodiment, each of the first outward tilted portion FE and the first inward tilted portion FI of each of the flexible pads FP(1) to FP(n) can tilt outward from the first central portion FC toward the outside of the flexible circuit board FPCB.

[0109] According to an embodiment of the present invention, the first angle α(1) at which each of the first outwardly tilted portion FE and the first inwardly tilted portion FI tilts from the first central portion FC of the first flexible pad FP(1) can be a right angle. For example, the angle α(1) between the first outwardly tilted portion FE and the first inwardly tilted portion FI of the first flexible pad FP(1) can be approximately 90°, which can correspond to zero tilt. In the following, when referring to multiple angles, the angle between the first inwardly tilted portion FI and the first outwardly tilted portion FE of the multiple flexible pads FP(1) to FP(n) can be summarized as "tilt angle". Moving outward from α(1) to other flexible pads FP(2), FP(n-2), FP(n-1), and FP(n), the nth angle α(n) can be greater than or equal to approximately 90 degrees and less than or equal to approximately 180 degrees.

[0110] According to an embodiment of the present invention, the tilt angle can be increased from a first angle α(1) to an nth angle α(n). According to the embodiment, the difference between adjacent angles can be the same (e.g., α(n-1)-α(n-2)=α(n)-α(n-1)). Therefore, the tilt angle can be increased equally from the first angle α(1) to the nth angle α(n).

[0111] According to the present invention, each of the first outwardly inclined portion FE and the first inwardly inclined portion FI can be inclined from the first central portion FC in a direction starting from the first flexible pad FP(1) and pointing towards the nth flexible pad FP(n). The angle α(n) of the first outwardly inclined portion FE of the nth flexible pad FP(n) located at the outermost edge from the first central portion FC can be greater than the angle of the first outwardly inclined portion FE of the other flexible pads from the first central portion FC. In other words, compared with the angles of the flexible pads located between the outermost flexible pads, the angle α(n) at the outermost flexible pad on each side can be the most severe (i.e., the most inclined).

[0112] However, embodiments of the present invention are not necessarily limited thereto. For example, the difference between adjacent angles can gradually increase from the first flexible pad FP(1) to the nth flexible pad FP(n) (e.g., α(n-1)-α(n-2)<α(n)-α(n-1)). Therefore, the tilt angle can gradually increase from the first angle α(1) to the nth angle α(n).

[0113] Figure 5 The main pads MP(1) to MP(m) disposed on the main pad area MDA of the main circuit board MPCB according to an embodiment are shown. Figure 5 As shown, the main pad area MDA can be provided in multiple areas on the main circuit board MPCB, and the number of main pad area MDAs is as follows: Figure 1 The number of flexible circuit boards (FPCBs) shown corresponds to this. In the following text, for ease of description, the main pads MP(1) to MP(m) set on a main pad area MDA connected to a main circuit board (MPCB) will be described.

[0114] The main pads MP(1) to MP(m) can be disposed on the front surface MU of the main circuit board MPCB. In the following, according to an embodiment of the present invention, the main pads MP(1) to MP(m) can be arranged in a first direction DR1 and are horizontally symmetrical to each other, based on a first main pad MP(1) disposed at the center of the main pads MP(1) to MP(m). For example, the main pads MP(1) to MP(m) can be arranged in the first direction DR1 with the first main pad MP(1) as the center, wherein the main pad numbers on each side are incremented. Therefore, for a pair of main pads symmetrical about the first main pad MP(1), the same reference numerals can be used, and the same description can be applied to configurations that assign the same reference numerals.

[0115] In the main pads MP(1) to MP(m) of the embodiment of the present invention, a portion of the main pads MP(1) to MP(m) may gradually tilt in the first direction DR1 from the first main pad MP(1) located at the center of the main circuit board MPCB toward the m-th main pad MP(m) located on the outer side.

[0116] The main pads MP(1) to MP(m) can be arranged on the first direction DR1, and each of the main pads MP(1) to MP(m) can extend substantially on the second direction DR2.

[0117] Each of the main pads MP(1) to MP(m) may include a second center portion MC, a second outward tilt portion ME, and a second inward tilt portion MI. Each of the second outward tilt portion ME and the second inward tilt portion MI may be tilted from the second center portion MC.

[0118] In the following text, since the angles of the second outwardly inclined portion ME and the second inwardly inclined portion MI, which are inclined from the second central portion MC, can be the same, the angles of the second outwardly inclined portion ME, which are inclined from the second central portion MC, will be described. Similar to the description above, these angles can generally be referred to as "inclination angles".

[0119] In an embodiment of the present invention, the angles of the second outwardly inclined portion ME and the second inwardly inclined portion MI, which are inclined from the second central portion MC, can correspond to the angles of the second outwardly inclined portion ME and the second inwardly inclined portion MI, which are inclined from the extension lines LM2 and LM1.

[0120] exist Figure 5 In the process, the boundary between the second center portion MC and the second inwardly inclined portion MI of each of the main pads MP(1) to MP(m) is a first extension line LM1. Furthermore, the boundary between the second center portion MC and the second outwardly inclined portion ME of each of the main pads MP(1) to MP(m) is a second extension line LM2.

[0121] In this embodiment, each of the second outward tilt portion ME and the second inward tilt portion MI of each of the main pads MP(1) to MP(m) can tilt outward from the second central portion MC toward the outside of the main circuit board MPCB.

[0122] According to an embodiment of the present invention, the first angle β(1) at which the second outward tilt portion ME and the second inward tilt portion MI tilt from the second central portion MC of the first main pad MP(1) can be a right angle. For example, the first angle β(1) can be approximately 90°, which can correspond to zero tilt. Moving outward from the first angle β(1), the m-th angle β(m) can be greater than or equal to approximately 90 degrees and less than or equal to approximately 180 degrees.

[0123] According to an embodiment of the present invention, the tilt angle can be increased from a first angle β(1) to the m-th angle β(m). According to the embodiment, the difference between adjacent angles can be the same (e.g., β(m-1)-β(m-2)=β(m)-β(m-1)). For example, the tilt angle can be increased equally from the first angle β(1) to the m-th angle β(m).

[0124] According to an embodiment of the invention, each of the second outward tilting portion ME and the second inward tilting portion MI can tilt from the second center portion MC in a direction starting from the first main pad MP(1) and pointing towards the m-th main pad MP(m). Here, compared with the tilt angles of the other main pads, the m-th angle β(m) tilted by the second outward tilting portion ME (second inward tilting portion MI) of the m-th main pad MP(m) located at the outermost position from the second center portion MC can be the largest. In other words, compared with the angles of the main pads located between the outermost main pads, the m-th angle β(m) corresponding to the two outermost main pads (i.e., the m-th main pad MP(m)) can be the most severe (i.e., the most tilted) angle.

[0125] However, embodiments of the present invention are not necessarily limited thereto. For example, the difference between adjacent angles can gradually increase from the first main pad MP(1) to the m-th main pad MP(m) (e.g., β(m-1)-β(M-2)<β(m)-β(m-1)). Therefore, the tilt angle can gradually increase from the first angle β(1) to the m-th angle β(n).

[0126] Figure 6 The diagram shows a flexible circuit board (FPCB) and a main circuit board (MPCB) connected to each other in one area. In this diagram, the main pads MP(1) to MP(m) of the main circuit board (MPCB) are shown with dashed lines, and the flexible pads FP(1) to FP(n) of the flexible circuit board (FPCB) are shown with shaded areas.

[0127] According to an embodiment of the present invention, the flexible pads FP(1) to FP(n) provided on the flexible circuit board FPCB and the main pads MP(1) to MP(m) provided on the main circuit board MPCB, which overlap each other on the third-party DR3, can overlap each other in a one-to-one manner.

[0128] In the following text, when the flexible pads FP(1) to FP(n) are described as overlapping with the main pads MP(1) to MP(m), the flexible pads FP(1) to FP(n) may overlap at least partially or substantially with the main pads MP(1) to MP(m). In other words, the shape of the flexible pads FP(1) to FP(n) may substantially follow the shape of the corresponding main pads MP(1) to MP(m), and in a planar view, the main pads MP(1) to MP(m) may completely overlap with the flexible pads FP(1) to FP(n).

[0129] For example, the first flexible pad FP(1) can overlap with the first main pad MP(1), and the second flexible pad FP(2) can overlap with the second main pad MP(2). In addition, the (n-1)th flexible pad FP(n-1) can overlap with the (m-1)th main pad MP(m-1), and the nth flexible pad FP(n) can overlap with the mth main pad MP(m).

[0130] According to an embodiment of the present invention, the first central portion FC provided in each of the flexible pads FP(1) to FP(n) can overlap with the second central portion MC of the corresponding main pads MP(1) to MP(m), and the first outwardly inclined portion FE provided in each of the flexible pads FP(1) to FP(n) can overlap with the second inwardly inclined portion MI of the corresponding main pads MP(1) to MP(m). Furthermore, the first inwardly inclined portion FI provided in each of the flexible pads FP(1) to FP(n) can overlap with the second outwardly inclined portion ME of the corresponding main pads MP(1) to MP(m).

[0131] According to an embodiment of the invention, the angles of the first outwardly inclined portion FE and the first inwardly inclined portion FI, which are inclined from the first central portion FC, can gradually increase from the first flexible pad FP(1) to the nth flexible pad FP(n). Similarly, the angles of the second outwardly inclined portion ME and the second inwardly inclined portion MI, which are inclined from the second central portion MC, can gradually increase from the first main pad MP(1) to the Mth main pad MP(m). Therefore, each of the flexible pads FP(1) to FP(n) can have a shape similar to that of the corresponding one of the main pads MP(1) to MP(m).

[0132] Figure 7 The main pads MP(1) to MP(m) and flexible pads FP(1) to FP(n) are schematically shown. (Reference) Figure 7 Each of the main pads MP(1) to MP(m) can have a larger area than the corresponding one of the flexible pads FP(1) to FP(n).

[0133] Each of the main pads MP(1) to MP(m) according to embodiments of the present invention may be longer than each of the flexible pads FP(1) to FP(n). For example, the first flexible pad FP(1) may have a first width FW in the first direction DR1, and the first main pad MP(1) may have a second width MW in the first direction DR1. The second width MW may be greater than the first width FW. This relationship between the first width FW and the second width MW can be applied to the flexible pads FP(1) to FP(n) and the main pads MP(1) to MP(m).

[0134] The nth flexible pad FP(n) may have a first length FL in the second direction DR2, and the mth main pad MP(m) may have a second length ML in the first direction DR2. The second length ML may be greater than the first length FL. This relationship between the first length FL and the second length ML can be applied to the flexible pads FP(1) to FP(n) and the main pads MP(1) to MP(m).

[0135] According to an embodiment of the present invention, the length of the first inwardly inclined portion FI of each of the flexible pads FP(1) to FP(n) in the second direction DR2 can be the same as or similar to the length of the second outwardly inclined portion ME of each of the main pads MP(1) to MP(m). Furthermore, the length of the first center portion FC of each of the flexible pads FP(1) to FP(n) in the second direction DR2 can be the same as or similar to the length of the second center portion MC of each of the main pads MP(1) to MP(m). However, although the above lengths can be similar to each other, the second length ML of a given main pad including the second outwardly inclined portion ME, the second inwardly inclined portion MI, and the second center portion MC can still be greater than the first length FL of the corresponding flexible pad.

[0136] The length of the first outwardly inclined portion FE of each of the flexible pads FP(1) to FP(n) in the second direction DR2 can be less than the length of the second inwardly inclined portion MI of each of the main pads MP(1) to MP(m). Therefore, when the flexible pads FP(1) to FP(n) and the main pads MP(1) to MP(m) are coupled to each other, a portion of the second inwardly inclined portion MI can be exposed through the first outwardly inclined portion FE.

[0137] According to an embodiment of the present invention, in the second inwardly inclined portion MI, the length WL of the protrusion exposed by the first outwardly inclined portion FE can be less than half the length BL of the second central portion MC.

[0138] According to an embodiment of the present invention, the difference between the first angle β(1) and the first angle α(1), the difference between the second angle β(2) and the second angle α(2), the difference between the (m-1)th angle β(m-1) and the (n-1)th angle α(n-1), and the difference between the mth angle β(m) and the nth angle α(n) can gradually increase from the pad located at the center of the pads to the pads located on the outer side. In other words, for α and β, the difference between the angle and the subsequently increasing angle can increase with each increment towards the outer side of the flexible circuit board and the main circuit board.

[0139] According to an embodiment of the present invention, the increment from the first angle β(1) to the m-th angle β(m) can be greater than the increment from the first angle α(1) to the n-th angle α(n).

[0140] Therefore, among the tilt angles of the connected pads, the tilt angle of each of the main pads MP(1) to MP(m) can be greater than the tilt angle of the corresponding one of the flexible pads FP(1) to FP(n). Therefore, the nth angle α(n) of the first outward tilting portion FI tilting from the first central portion FC of the nth flexible pad FP(n) located at the outermost position can be less than the mth angle β(m) of the second inward tilting portion ME tilting from the second central portion MC of the mth main pad MP(m) that overlaps with the nth flexible pad FP(n) and is also located at the outermost position.

[0141] Figure 8 This is a plan view illustrating the coupling relationship between a portion of a display panel and a main circuit board according to an embodiment of the present invention. Figure 9 This is a plan view illustrating the coupling relationship between a portion of a display panel, a flexible circuit board, and a main circuit board according to an embodiment of the present invention. Figure 10 This is a plan view illustrating the coupling relationship between a flexible circuit board and a main circuit board according to an embodiment of the present invention.

[0142] Figures 8 to 9 This illustrates connection types that may occur when a pressure bar is used to press down on the flexible circuit board (FPCB) and the main circuit board (MPCB), and... Figure 10 The coupling relationship between the flexible pad and the main pad is shown in an embodiment of the present invention.

[0143] refer to Figure 8 and Figure 9Each of the flexible circuit board (FPCB) and the main circuit board (MPCB) can be attached to each other by pressing with a pressure bar. The pressure bar can be provided as a single bar extending in the first direction DR1 to cover all the flexible circuit boards (FPCBs), or each flexible circuit board (FPCB) can be pressed separately by an individual pressure bar. In this case, errors may occur due to deformation of the main circuit board (MPCB-T), where a misalignment of up to a maximum first angle TA occurs in the main circuit board (MPCB-T) compared to a normally attached main circuit board (MPCB).

[0144] In this case, the first angle TA can satisfy the following equation 1.

[0145] [Equation 1]

[0146] TA = sin -1 (2a / MX)

[0147] ("a" is the y-axis tolerance that may occur when the pressure bar is pressed in a fixed state, and "MX" is the length of the main circuit board MPCB in the first direction DR1).

[0148] Furthermore, during the pressing process using a pressure bar, errors may occur due to deformation of the flexible circuit board FPCB-T, where the flexible circuit board FPCB-T exhibits a misalignment of up to a maximum second angle TB compared to a normally attached flexible circuit board FPCB.

[0149] In this case, the second angle TB can satisfy the following equation 2.

[0150] [Equation 2]

[0151] TB = sin -1 (2b / FX)

[0152] (“b” is the y-axis tolerance that may occur when the pressure bar is used to press in the fixed state, and “FX” is the length of the flexible circuit board FPCB in the first direction DR1).

[0153] When the flexible circuit board FPCB-T and the main circuit board MPCB-T are misaligned, the maximum tilt angle that may occur can be limited to the sum of the absolute values ​​of the first angle TA and the second angle TB.

[0154] Figure 10 This illustrates the state where the flexible circuit board FPCB-T and the main circuit board MPCB-T are coupled to each other at the maximum tilt angle due to process errors.

[0155] According to an embodiment of the present invention, the flexible pads FP(1) to FP(n) of the flexible circuit board FPCB-T and the main pads MP(1) to MP(m) of the main circuit board MPCB-T each include inclined portions, which gradually slope from the pads located at the center to the pads located at the outer side, as described above.

[0156] According to an embodiment of the present invention, because the tilt angle of each of the main pads MP(1) to MP(m) from the second central portion MC to the second outward tilt portion ME is greater than the tilt angle of the corresponding one of the flexible pads FP(1) to FP(n) from the first central portion FC to the first inward tilt portion FI, even if the flexible circuit board FPCB-T and the main circuit board MPCB-T are connected at an angle due to process errors, the flexible pads FP(1) to FP(n) will not be separated from the main pads MP(1) to MP(m). Therefore, the flexible pads FP(1) to FP(n) can still be fully connected to the corresponding main pads MP(1) to MP(m). Therefore, even if the flexible circuit board FPCB-T or the main circuit board MPCB-T is coupled with the maximum process error, the pad structure that can compensate for process defects can provide a display device with improved reliability.

[0157] Figure 11 This is a plan view illustrating the coupling relationship between a flexible circuit board and a main circuit board according to an embodiment of the present invention. The same / similar reference numerals are used in conjunction with... Figures 4 to 10 The same / similar configurations are listed, and redundant descriptions are omitted.

[0158] refer to Figure 11 According to an embodiment of the present invention, the flexible circuit board FPCB-A may include flexible pads FA(1), FA(2), FA(3), ..., FA(n-2), FA(n-1) and FA(n) (hereinafter referred to as flexible pads FA(1) to FA(n)). The flexible pads FA(1) to FA(n) may be arranged along a first direction DR1, and each of the flexible pads FA(1) to FA(n) may extend substantially in a second direction DR2.

[0159] In the flexible pads FA(1) to FA(n) according to this embodiment, a portion of the flexible pads FA(1) to FA(n) may gradually tilt in the first direction DR1 from the first flexible pad FA(1) disposed at the center of the flexible circuit board FPCB-A toward the nth flexible pad FA(n) disposed on the outer side.

[0160] Each of the flexible pads FA(1) to FA(n) may include a first central portion FC, a first outwardly tilted portion FE, and a first inwardly tilted portion FI. Each of the first outwardly tilted portion FE and the first inwardly tilted portion FI may be tilted relative to the first central portion FC.

[0161] In this embodiment, the first outwardly inclined portion FE and the first inwardly inclined portion FI of each of the flexible pads FA(1) to FA(n) may be inclined from the first central portion FC toward the center of the flexible pads FA(1) to FA(n), respectively. This contrasts with the previous exemplary embodiments, in which the inclined portions FI and FE were inclined away from the center of the flexible pads FA(1) to FA(n), respectively.

[0162] The nth angle α(n) from which each of the first outwardly inclined portion FE and the first inwardly inclined portion FI tilts from the first central portion FC of the outermost nth flexible pad FA(n) can be the largest, and the angle from which each of the first outwardly inclined portion FE and the first inwardly inclined portion FI tilts from the first central portion FC can gradually decrease from the nth angle α(n) to the first angle α(1) from which each of the first outwardly inclined portion FE and the first inwardly inclined portion FI tilts from the first central portion FC of the first flexible pad FA(n).

[0163] The main circuit board MPCB-A according to an embodiment of the present invention may include main pads MA(1), MA(2), MA(3), ..., MA(m-2), MA(m-1) and MA(m) (hereinafter referred to as main pads MA(1) to MA(m)). The main pads MA(1) to MA(m) are arranged along a first direction DR1, and each of the main pads MA(1) to MA(m) may extend substantially along a second direction DR2.

[0164] In the main pads MA(1) to MA(m) of the embodiment of the present invention, a portion of the main pads MA(1) to MA(m) may gradually tilt in the first direction DR1 from the first main pad MA(1) located at the center of the main circuit board MPCB-A to the m-th main pad MA(m) located on the outer side.

[0165] Each of the main pads MA(1) to MA(m) may include a second center portion MC, a second outward tilt portion ME, and a second inward tilt portion MI. Each of the second outward tilt portion ME and the second inward tilt portion MI may tilt from the second center portion MC. The second outward tilt portion ME may overlap with the first inward tilt portion FI, the second center portion MC may overlap with the first center portion FC, and the second inward tilt portion MI may overlap with the first outward tilt portion FE.

[0166] In this embodiment, each of the second outward tilt portion ME and the second inward tilt portion MI of each of the main pads MA(1) to MA(m) can tilt from the second central portion MC toward the center of the main pads MA(1) to MA(m).

[0167] The angle β(m) at which each of the second outward tilted portion ME and the second inward tilted portion MI tilts from the second central portion MC of the outermost m-th main pad MA(m) can be the largest, and the angle at which each of the second outward tilted portion ME and the second inward tilted portion MI tilts from the second central portion MC can gradually decrease from the angle β(m) to the first angle β(1) at which each of the second outward tilted portion ME and the second inward tilted portion MI tilts from the second central portion MC of the m-th main pad MA(n).

[0168] According to an embodiment of the invention, the angle of each of the first outwardly inclined portion FE and the first inwardly inclined portion FI, which are inclined from the first central portion FC, can gradually increase from the first flexible pad FA(1) to the nth flexible pad FA(n), and similarly, the angle of the second outwardly inclined portion ME and the second inwardly inclined portion MI, which are inclined from the second central portion MC, can gradually increase from the first main pad MA(1) to the mth main pad MA(m). Therefore, each of the flexible pads FA(1) to FA(n) can have a shape similar to that of the corresponding one of the main pads MP(1) to MP(m).

[0169] In this embodiment, the tilt angle of each of the main pads MA(1) to MA(m) can be greater than the tilt angle of the corresponding one of the flexible pads FA(1) to FA(n).

[0170] Figure 12 This is a plan view illustrating the coupling relationship between a flexible circuit board and a main circuit board according to an embodiment of the present invention. The same / similar reference numerals are used in conjunction with... Figures 4 to 10The same / similar configurations are used, and redundant descriptions are omitted. Compared with the previously described embodiments, the main pads MB(1) to MB(m) and the flexible pads FB(1) to FB(n) may be missing the second center portion and the first center portion, respectively.

[0171] refer to Figure 12 According to an embodiment of the present invention, the flexible circuit board FPCB-B may include flexible pads FB(1), FB(2), FB(3), ..., FB(n-2), FB(n-1) and FB(n) (hereinafter referred to as flexible pads FB(1) to FB(n)). The flexible pads FB(1) to FB(n) may be arranged along a first direction DR1, and each of the flexible pads FB(1) to FB(n) may extend substantially along a second direction DR2.

[0172] In the flexible pads FB(1) to FB(n) according to this embodiment, a portion of the flexible pads FB(1) to FB(n) may gradually tilt in the first direction DR1 from the first flexible pad FB(1) disposed at the center of the flexible circuit board FPCB-B toward the nth flexible pad FB(n) disposed on the outer side.

[0173] Each of the flexible pads FB(1) to FB(n) may include a first outwardly inclined portion FE and a first inwardly inclined portion FI. The first outwardly inclined portion FE and the first inwardly inclined portion FI may be inclined relative to each other at the boundary.

[0174] In this embodiment, the first outwardly inclined portion FE and the first inwardly inclined portion FI of each of the flexible pads FB(1) to FB(n) can be inclined from the first flexible pad FB(1) located at the center to the nth flexible pad FB(n) located on the outer side. In other words, the first inwardly inclined portion FI and the first outwardly inclined portion FE can be inclined outward toward the outer edge of the flexible circuit board FPCB-B. The angle defined by the first outwardly inclined portion FE and the first inwardly inclined portion FI can gradually increase from the center outward.

[0175] According to this embodiment, the main circuit board MPCB-B may include main pads MB(1), MB(2), MB(3), ..., MB(m-2), MB(m-1) and MB(m) (hereinafter referred to as main pads MB(1) to MB(m)). The main pads MB(1) to MB(m) may be arranged along a first direction DR1, and each of the main pads MB(1) to MB(m) may extend in a second direction DR2.

[0176] Each of the main pads MB(1) to MB(m) may include a second outwardly inclined portion ME and a second inwardly inclined portion MI. The second outwardly inclined portion ME and the second inwardly inclined portion MI may be inclined relative to each other at their boundaries.

[0177] According to this embodiment, each of the main pads MB(1) to MB(m) can have a shape similar to that of the corresponding one of the flexible pads FB(1) to FB(n).

[0178] In this embodiment, the second outward tilting portion ME and the second inward tilting portion MI of each of the main pads MB(1) to MB(n) can tilt from the second main pad MB(1) located at the center of the main pads MB(1) to the m-th main pad MB(m) located on the outer side. In other words, the second inward tilting portion MI and the second outward tilting portion ME can tilt outward toward the outer edge of the main circuit board. The angle defined by the second outward tilting portion ME and the second inward tilting portion MI can gradually increase from the center outward. Furthermore, the angle defined by the second outward tilting portion ME and the second inward tilting portion MI can be greater than the angle defined by the first outward tilting portion FE and the first inward tilting portion FI, which overlap with the second inward tilting portion MI and the second outward tilting portion ME, respectively.

[0179] According to an embodiment of the present invention, since the slope of the outwardly inclined portion sloping from the center of each main pad is greater than the slope of the inwardly inclined portion of the center of the flexible pad corresponding to the main pad, even if the flexible circuit board and the main circuit board are connected and tilted due to process errors, the flexible pad can not be separated from the main pad and can be connected to the corresponding main pad.

[0180] Therefore, even if the flexible circuit board or the main circuit board is coupled with process errors, the pad structure of this invention, which can compensate for process defects, can provide a display device with improved reliability.

[0181] It will be apparent to those skilled in the art that various modifications and variations can be made within the scope of the inventive concept. Therefore, this disclosure is intended to cover modifications and variations of the invention, provided that such modifications and variations are within the scope of the claims and their equivalents.

[0182] Therefore, the technical scope of this invention should not be limited to what is described in the detailed description of the specification, but should be determined by the scope of the claims.

Claims

1. A display device, wherein, The display device includes: The flexible circuit board includes a driver chip and also includes a plurality of flexible pads arranged in a first direction and extending in a second direction intersecting the first direction. The main circuit board includes a plurality of main pads that are connected to corresponding flexible pads in a third direction perpendicular to the first direction and the second direction; The display panel includes a plurality of pixels connected to the flexible circuit board, wherein the plurality of pixels are configured to receive signals from the driver chip. In each of the plurality of flexible pads and the plurality of main pads, a portion of each main pad slopes outward from the center of the main pad toward the outer side of the main circuit board, and a portion of each corresponding flexible pad slopes outward from the center of the corresponding flexible pad toward the outer side of the flexible circuit board. The tilt angle of the main pad located at the outermost edge of the main circuit board is greater than the tilt angle of the corresponding flexible pad located at the outermost edge of the flexible circuit board. The tilt angle of the main pad is defined as the angle at which a portion of the main pad tilts from the center of the main pad, and the tilt angle of the corresponding flexible pad is defined as the angle at which a portion of the corresponding flexible pad tilts from the center of the corresponding flexible pad.

2. The display device according to claim 1, wherein, Each of the flexible pads includes a first central portion, a first outwardly inclined portion, and a first inwardly inclined portion, and Each of the main pads includes: a second central portion overlapping the first central portion of a corresponding flexible pad; a second outwardly inclined portion overlapping the first inwardly inclined portion of the corresponding flexible pad; and a second inwardly inclined portion overlapping the first outwardly inclined portion of the corresponding flexible pad, wherein... Both the first outwardly inclined portion and the first inwardly inclined portion are inclined at the same angle from the first central portion toward the outer side of the flexible circuit board in the outward direction, and both the second outwardly inclined portion and the second inwardly inclined portion are inclined at the same angle from the second central portion toward the outer side of the main circuit board in the outward direction.

3. The display device according to claim 2, wherein, The tilt angle of each main pad from the second center portion to the second outward tilt portion is greater than the tilt angle of each corresponding flexible pad from the first center portion to the first inward tilt portion, and the tilt angle of each main pad from the second center portion to the second inward tilt portion is greater than the tilt angle of each corresponding flexible pad from the first center portion to the first outward tilt portion.

4. The display device according to claim 2, wherein, The second inwardly inclined portion of each of the main pads protrudes from the first outwardly inclined portion of the corresponding flexible pad and is exposed to the outside of the flexible circuit board.

5. The display device according to claim 4, wherein, The length of the second inwardly inclined portion protruding in the second direction is less than half the length of the second central portion in the second direction.

6. The display device according to claim 3, wherein, The difference between the tilt angle of the main pad and the tilt angle of the corresponding flexible pad gradually increases from the main pad and the corresponding flexible pad located at the center to the main pad and the corresponding flexible pad located on the outer side.

7. The display device according to claim 1, wherein, Each of the main pads has a larger area than the corresponding flexible pad connected to the main pad.

8. The display device according to claim 2, wherein, The first central portion and the second central portion have the same length in the second direction.

9. The display device according to claim 2, wherein, The flexible circuit board is provided as a plurality of flexible circuit boards, and The plurality of flexible circuit boards are arranged on the display panel along the first direction.

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