Display substrate and manufacturing method thereof, and display device

Abstract

The present disclosure provides a display substrate and a manufacturing method thereof, and a display device. In the display substrate, the packaging glue area includes: a corner packaging glue area located on the first side of the display area, an inlet packaging glue area and a first packaging glue area, and the corner packaging glue area is provided with a packaging substrate layer; the non-display area is provided with a second power line, a gate drive circuit and a plurality of first signal lines for providing signals to the gate drive circuit; the second power line includes a power corner part and a first power part, the first power part overlaps with the first packaging glue area, and the first power part extends along a first direction; the target part of each first signal line is at least located in the corner packaging glue area, and the target part extends along a second direction; the first direction intersects with the second direction; the orthographic projection of the target part on the substrate of the display substrate is located between the orthographic projection of the packaging substrate layer on the substrate and the orthographic projection of the first power part on the substrate.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a manufacturing method thereof, and a display device. Background Art

[0002] The metal layer and organic layer in the organic light-emitting diode (OLED) display device are extremely sensitive to water vapor and oxygen. When water vapor and oxygen penetrate into the interior of the display device, the metal layer and the organic layer will be oxidized, resulting in the shrinkage of the light-emitting area and the appearance of non-light-emitting parts. In addition, the non-light-emitting parts caused by water vapor and oxygen will become larger over time, accelerating the aging of the device and greatly shortening the service life of the display device. At present, in order to better prevent the interior of the display device from being corroded by water vapor and oxygen, the display device is generally packaged. There are many existing packaging methods, for example, using frame sealing glue (such as Frit glue) and packaging cover plate to package the display device. Summary of the invention

[0003] The purpose of the present disclosure is to provide a display substrate and a manufacturing method thereof, and a display device.

[0004] In order to achieve the above objectives, the present disclosure provides the following technical solutions:

[0005] A first aspect of the present disclosure provides a display substrate, comprising: a display area and a non-display area surrounding the display area, wherein the non-display area comprises a packaging glue area surrounding the display area; the packaging glue area comprises: a corner packaging glue area located on a first side of the display area, an incoming line packaging glue area and a first packaging glue area, wherein the first packaging glue area is located between the corner packaging glue area and the incoming line packaging glue area; the corner packaging glue area is provided with a packaging base layer; the non-display area is provided with a second power line, a gate driving circuit, and a plurality of first signal lines for providing signals to the gate driving circuit;

[0006] The second power line includes a power corner portion and a first power portion, the first power portion overlaps the first packaging glue area, and the first power portion extends along a first direction;

[0007] The target portion of each of the first signal lines is at least located in the corner packaging glue area, and the target portion extends along the second direction; the first direction intersects with the second direction; the orthographic projection of the target portion on the base of the display substrate is located between the orthographic projection of the packaging base layer on the base and the orthographic projection of the first power supply portion on the base.

[0008] Optionally, the power corner portion is arc-shaped away from the boundary of the display area, and along the curvature radius of the arc, the power corner portion has a corner width, and the corner width gradually decreases along the direction from the first packaging glue area to the corner packaging glue area.

[0009] Optionally, along the second direction, the width of the first power supply part is greater than the maximum value of the corner width.

[0010] Optionally, an orthographic projection of the package substrate layer on the substrate at least partially overlaps with an orthographic projection of the power source corner portion on the substrate.

[0011] Optionally, at least a portion of the gate driving circuit is located between the display area and the corner packaging glue area, and an orthographic projection of the target portion on the base of the display substrate at least partially overlaps with an orthographic projection of the power corner portion on the base.

[0012] Optionally, the non-display area is further provided with a driving chip; the first signal line further includes a first non-target portion and a second non-target portion, and the first non-target portion is connected to the target portion and the second non-target portion respectively;

[0013] The first non-target portion is located at a side of the first power supply portion facing away from the display area, the first non-target portion at least partially extends along the first direction, and the first non-target portion and the first power supply portion are provided in the same layer and the same material;

[0014] The second non-target portion is connected to the driving chip, and the second non-target portion and the first non-target portion are arranged in different layers.

[0015] Optionally, the second non-target portion and the target portion are both provided in the same layer and with the same material as the packaging base layer.

[0016] Optionally, the display substrate further includes a first gate metal layer, and the package base layer and the first gate metal layer are provided in the same layer and with the same material.

[0017] Optionally, the display substrate also includes a first gate metal layer and a second gate metal layer; among the multiple first signal lines, a portion of the first signal lines include a first target portion that is arranged in the same layer and material as the first gate metal layer, and another portion of the first signal lines include a second target portion that is arranged in the same layer and material as the second gate metal layer, and the orthographic projection of the first target portion on the base of the display substrate and the orthographic projection of the second target portion on the base are alternately arranged at intervals.

[0018] Optionally, the packaging glue area further includes a second packaging glue area, the second packaging glue area surrounds other sides of the display area except the first side, and the packaging base layer extends to cover the second packaging glue area.

[0019] Optionally, the display substrate further includes a base, and a first gate insulating layer, a second gate insulating layer and an interlayer insulating layer sequentially stacked on the base in a direction away from the base, and the encapsulation base layer is located between the first gate insulating layer and the second gate insulating layer;

[0020] A plurality of first via holes are arranged on the package substrate layer;

[0021] The display substrate is also provided with a plurality of groups of first sub-vias corresponding one-to-one to the plurality of first vias, each group of first sub-vias includes a plurality of first sub-vias, the orthographic projections of the plurality of first sub-vias on the substrate are located inside the orthographic projections of the corresponding first vias on the substrate, and each of the first sub-vias passes through the interlayer insulating layer, the second gate insulating layer and the first gate insulating layer.

[0022] Optionally, the second power line also includes a second power part, which is electrically connected to the power corner part, and the second power part surrounds other sides of the display area except the first side, and the orthographic projection of the second power part on the substrate overlaps with the orthographic projection of the encapsulation substrate layer on the substrate, and the second power part is electrically connected to the encapsulation substrate layer at the overlapping point.

[0023] Optionally, the packaging base layer located in the second packaging glue area includes a main body part and a plurality of conductive connection parts, the main body part surrounds the other sides of the display area except the first side, the plurality of conductive connection parts are electrically connected to the main body part respectively, the plurality of conductive connection parts are arranged at intervals along the extension direction of the main body part, and the orthographic projection of each of the conductive connection parts on the base of the display substrate overlaps with the orthographic projection of the second power supply part on the base, and the second power supply part is electrically connected to the corresponding conductive connection parts at each overlap.

[0024] Optionally, the main body portion and the plurality of conductive connection portions are formed into an integral structure.

[0025] Optionally, a plurality of second via holes are provided on the first power supply part.

[0026] Optionally, the non-display area is further provided with a first power line, and the first power line comprises: a transmission part and two first line inlet parts respectively connected to the transmission part;

[0027] The transmission part is located between the display area and the first power supply part, and the transmission part extends along the first direction; the two first incoming line parts are located on the side of the transmission part facing away from the display area, the first incoming line parts extend along the second direction, and at least part of the first incoming line parts is located in the incoming line packaging glue area.

[0028] Optionally, a plurality of third via holes are provided on a portion of the first line-in portion located in the line-in packaging glue area.

[0029] Based on the technical solution of the above-mentioned display substrate, a second aspect of the present disclosure provides a display device, comprising the above-mentioned display substrate.

[0030] Optionally, the display device further comprises a packaging cover plate arranged opposite to the display substrate, and the packaging cover plate and the display substrate are sealed by a frame sealing adhesive arranged in a packaging adhesive area.

[0031] Based on the technical solution of the display substrate, the third aspect of the present disclosure provides a method for manufacturing a display substrate, wherein the display substrate comprises: a display area and a non-display area surrounding the display area, wherein the non-display area comprises a packaging glue area surrounding the display area; the packaging glue area comprises: a corner packaging glue area located on a first side of the display area, an incoming line packaging glue area, and a first packaging glue area, wherein the first packaging glue area is located between the corner packaging glue area and the incoming line packaging glue area; the manufacturing method comprises:

[0032] Making a packaging base layer in the corner packaging glue area;

[0033] A second power supply line, a gate driving circuit, and a plurality of first signal lines for providing signals to the gate driving circuit are formed in the non-display area;

[0034] The second power line includes a power corner portion and a first power portion, the first power portion overlaps the first packaging glue area, and the first power portion extends along a first direction;

[0035] The target portion of each of the first signal lines is at least located in the corner packaging glue area, and the target portion extends along the second direction; the first direction intersects with the second direction; the orthographic projection of the target portion on the base of the display substrate is located between the orthographic projection of the packaging base layer on the base and the orthographic projection of the first power supply portion on the base. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The drawings described herein are used to provide a further understanding of the present disclosure and constitute a part of the present disclosure. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation on the present disclosure. In the drawings:

[0037] Figure 1 A first structural schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0038] Figure 2 for Figure 1 A first enlarged schematic diagram of the A1 portion;

[0039] Figure 3 for Figure 1 A second enlarged schematic diagram of the A1 portion;

[0040] Figure 4 A schematic diagram of a spacing area between a first line inlet and a second line inlet provided in an embodiment of the present disclosure;

[0041] Figure 5 A second structural schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0042] Figure 6 for Figure 5 A first enlarged schematic diagram of the portion A2;

[0043] Figure 7 for Figure 5 A second enlarged schematic diagram of the portion A2;

[0044] Figure 8 for Figure 7 Schematic diagram of the cross section along the B1B2 direction;

[0045] Fig. 9 for Figure 5 a third enlarged schematic diagram of the middle A3 portion;

[0046] Fig.10 for Fig. 9 An enlarged schematic diagram of the vicinity of the first overlapping region;

[0047] Fig.11 for Fig.10 A schematic diagram of a first cross section along the C1C2 direction;

[0048] Fig.12 for Fig.10 A second cross-sectional schematic diagram along the C1C2 direction;

[0049] Fig.13 for Fig.10 A schematic diagram of a third cross section along the C1C2 direction;

[0050] Fig.14 Schematic diagram of short-circuiting VDD or VSS and fan-out line;

[0051] Fig.15 A schematic diagram of the overlap between the fan-out area and the first power line and the second power line;

[0052] Fig.16 for Fig.15 An enlarged schematic diagram of the fan-out line located in the A3 area;

[0053] Fig.17 A third structural schematic diagram of a display substrate provided in an embodiment of the present disclosure;

[0054] Fig.18 for Fig.17 A schematic diagram of the layout of the first power line and the second power line;

[0055] Fig.19 for Fig.17 An enlarged schematic diagram of the lower left frame;

[0056] Fig. 20 for Fig.19 A magnified schematic diagram of the A4 portion;

[0057] Fig.21 for Fig. 20 A schematic diagram of a second power line;

[0058] Fig. 22 for Fig.17 Schematic diagram of the cross section along the D1D2 direction;

[0059] Fig.23 is a schematic diagram of the layout of the first via and the first sub-via;

[0060] Fig.24 Schematic diagram of the layout of the second via. DETAILED DESCRIPTION

[0061] In order to further illustrate the display substrate and its manufacturing method, and the display device provided by the embodiments of the present disclosure, a detailed description is given below in conjunction with the accompanying drawings.

[0062] When the display device is packaged with Frit glue and a packaging cover, a Frit glue layer surrounding the display device is formed in the peripheral area of ​​the display device, and the packaging cover is placed on the display device. After a laser sintering process, the Frit glue is cured, and the functional structure in the display device is packaged between the substrate of the display device and the packaging cover. However, the laser sintering process will cause the Frit glue to narrow. If the narrowing is severe, it will affect the packaging effect of the OLED device, resulting in the Frit glue being unable to effectively block the corrosion of water vapor and oxygen to the display device.

[0063] See also Fig.17 , Fig.18 , Fig.19 and Fig. 20The embodiment of the present disclosure provides a display substrate, comprising: a display area 10 and a non-display area surrounding the display area 10, wherein the non-display area comprises a packaging glue area 20 surrounding the display area; the packaging glue area 20 comprises: a corner packaging glue area 201 located at a first side of the display area 10, an incoming line packaging glue area 202 and a first packaging glue area 203, wherein the first packaging glue area 203 is located between the corner packaging glue area 201 and the incoming line packaging glue area 202; the corner packaging glue area 201 is provided with a packaging base layer 21; the non-display area is provided with a second power line 40, a gate driving circuit GOA, and a plurality of first signal lines 70 for providing signals to the gate driving circuit GOA;

[0064] The second power line 40 includes a power corner portion 4011 and a first power portion 4012 , the first power portion 4012 overlaps the first packaging glue area 203 , and the first power portion 4012 extends along a first direction;

[0065] The target portion 701 of each of the first signal lines 70 is at least located at the corner packaging glue area 201, and the target portion 701 extends along the second direction; the first direction intersects with the second direction; the orthographic projection of the target portion 701 on the base of the display substrate is located between the orthographic projection of the packaging base layer 21 on the base and the orthographic projection of the first power supply portion 4012 on the base.

[0066] Specifically, the display substrate includes a display area 10 and a non-display area. Exemplarily, the display area 10 includes a rectangle, and the non-display area completely surrounds the display area 10 .

[0067] The non-display area includes a packaging glue area surrounding the display area, and the packaging glue area includes: two corner packaging glue areas 201, an incoming line packaging glue area 202, and two first packaging glue areas 203. The corner packaging glue area 201, the incoming line packaging glue area 202, and the first packaging glue area 203 are all located on the first side of the display area, and the first side is the side where the lower frame of the display substrate is located. Exemplarily, the incoming line packaging glue area 202 is located in the middle of the lower frame of the display substrate, the two corner packaging glue areas 201 are respectively located at the lower left corner and the lower right corner of the display substrate, and the two first packaging glue areas 203 are located one-to-one between the two corner packaging glue areas 201 and the incoming line packaging glue area 202.

[0068] It is worth noting that the packaging glue area also includes a second packaging glue area 204, and the second packaging glue area 204 surrounds the second side, the third side and the fourth side of the display area, the second side is opposite to the first side, and the third side is opposite to the fourth side. Exemplarily, the third side is located on the left side of the display area, and the fourth side is located on the right side of the display area.

[0069] The display substrate further includes a packaging base layer 21 . At least a portion of the packaging base layer 21 is located in the corner packaging glue area 201 . The packaging base layer 21 further includes a portion located in the second packaging glue area 204 .

[0070] The display substrate further includes a second power line 40. Exemplarily, the second power line 40 includes a negative power signal line VSS. Exemplarily, the second power line 40 includes two power corner portions 4011 and two first power portions 4012. The power corner portions 4011 are located in the corner packaging glue area 201 in a one-to-one correspondence, and the first power portions 4012 are located in the first packaging glue area 203 in a one-to-one correspondence. The second power line 40 further includes a second power portion 4013. The second power portion 4013 surrounds the second side, the third side, and the fourth side of the display area.

[0071] Exemplarily, the power corner portion 4011 overlaps with the corner packaging glue area 201; or Fig.17 , Fig. 20 and Fig.21 As shown, the power corner portion 4011 does not overlap with the corner packaging glue area 201 .

[0072] like Figure 1 As shown, illustratively, the second power line 40 includes a peripheral portion 401 and two second inlet portions 402, such as Fig.18 As shown, the peripheral portion 401 includes: two power corner portions 4011 , two first power portions 4012 and a second power portion 4013 .

[0073] The display substrate further includes a gate drive circuit GOA. Exemplarily, the gate drive circuit GOA includes a shift register unit corresponding to the gate lines in the display substrate, which is used to provide a scanning signal for the gate lines in the display substrate. The display substrate further includes a plurality of first signal lines 70 for providing signals to the gate drive circuit GOA. The specific types of the plurality of first signal lines 70 are various. Exemplarily, the plurality of first signal lines 70 include a frame start signal line, a clock signal line, a first level signal line, and a second level signal line. The gate drive circuit GOA is located on the left and right sides of the display area, and each of the first signal lines 70 is electrically connected to the gate drive circuit GOA and the driver chip in the display substrate, respectively.

[0074] The target portion 701 of each first signal line 70 is at least located in the corner packaging glue area 201, and the target portion 701 extends along the second direction. Exemplarily, the target portions 701 of the plurality of first signal lines 70 are arranged at intervals along the first direction.

[0075] According to the specific structure of the display substrate provided by the embodiment of the present disclosure, in the display substrate provided by the embodiment of the present disclosure, the orthographic projection of the target part 701 on the substrate is set to be located between the orthographic projection of the packaging substrate layer 21 on the substrate and the orthographic projection of the first power supply part 4012 on the substrate; so that in the corner packaging glue area 201 and the first packaging glue area 203, the packaging substrate layer 21, the target part 701 of the first signal line 70 and the first power supply part 4012 jointly serve as a packaging substrate in contact with the frame sealing glue, thereby effectively increasing the contact area between the frame sealing glue and the display substrate, improving the adhesion between the frame sealing glue and the display substrate, and ensuring a good packaging effect.

[0076] In addition, in the display substrate provided by the embodiment of the present disclosure, by arranging the corner packaging glue area 201 and the first packaging glue area 203, the packaging base layer 21, the target part 701 of the first signal line 70 and the first power supply part 4012 together serve as a packaging base in contact with the frame sealing glue, thereby avoiding the formation of a large area of ​​the packaging base layer 21 in the corner packaging glue area 201 and the first packaging glue area 203, thereby effectively saving the production cost of the display substrate.

[0077] like Fig.21 As shown, in some embodiments, the power corner portion 4011 is arc-shaped away from the boundary of the display area, and along the curvature radius of the arc, the power corner portion 4011 has a corner width e, and along the direction of the first packaging glue area 203 pointing to the corner packaging glue area 201, the corner width e gradually decreases.

[0078] Specifically, the orthographic projection of the power corner portion 4011 on the substrate overlaps with the orthographic projection portions of the plurality of first signal lines 70 on the substrate.

[0079] The above-mentioned setting is along the direction of the first packaging glue area 203 pointing to the corner packaging glue area 201, and the corner width e gradually becomes smaller, so that the overlapping area between the second power line 40 and the target part 701 of the first signal line 70 in the corner packaging glue area 201 gradually decreases, thereby better reducing the parasitic capacitance formed between the second power line 40 and the target part 701 of the first signal line 70, and improving the signal transmission stability of the first signal line 70.

[0080] In addition, when the target portion 701 of the first signal line 70 is made of the same layer and material as the first gate metal layer in the display substrate, and the second power line 40 is made of the same layer and material as the first source-drain metal layer in the display substrate, the second power line 40 is located on the side of the target portion 701 of the first signal line 70 that faces away from the substrate. When the overlapping area of ​​the second power line 40 and the target portion 701 of the first signal line 70 is gradually reduced by setting the corner packaging glue area 201, the shielding area of ​​the target portion 701 of the first signal line 70 by the second power line 40 can be well reduced, and since the reflective performance of the target portion 701 of the first signal line 70 is better than that of the second power line 40, the above-mentioned setting method can effectively improve the speed of laser sintering during the packaging process.

[0081] like Fig.21 As shown, in some embodiments, along the second direction, the width of the first power supply portion 4012 is greater than the maximum value of the corner width e.

[0082] Specifically, since the first power supply part 4012 can be reused as a packaging substrate and in contact with the sealing glue, the above-mentioned setting of the width of the first power supply part 4012 is greater than the maximum value of the corner width, which can better improve the contact area between the first power supply part 4012 and the sealing glue, and is more conducive to enhancing the reflection effect of the laser during the packaging process and improving the packaging efficiency.

[0083] Furthermore, setting the width of the first power supply portion 4012 to be greater than the maximum value of the corner width is also beneficial to increasing the overall area of ​​the second power line 40 and reducing the voltage drop on the second power line 40 .

[0084] In some embodiments, an orthographic projection of the package substrate layer 21 on the substrate is arranged to at least partially overlap with an orthographic projection of the power corner portion 4011 on the substrate.

[0085] The above configuration can further reduce the flatness of the surface of the display substrate facing away from the base in the corner packaging glue area 201 , thereby better enhancing the bonding strength between the frame sealing glue and the display substrate, and effectively improving the packaging effect of the display substrate in the corner packaging glue area 201 .

[0086] like Fig.17 , Fig.19 and Fig. 20 As shown, in some embodiments, at least a portion of the gate drive circuit GOA is located between the display area and the corner packaging glue area 201, and the orthographic projection of the target portion on the base of the display substrate at least partially overlaps with the orthographic projection of the power corner portion 4011 on the base.

[0087] Specifically, at least part of the gate drive circuit GOA is located between the display area and the corner packaging glue area 201, one end of the first signal line 70 passes through the corner packaging glue area 201 and is electrically connected to the gate drive circuit GOA, and the other end of the first signal line 70 is electrically connected to the driving chip in the display substrate.

[0088] The target portion 701 of the first signal line 70 is located in the corner packaging glue area 201 , and the orthographic projection of the target portion on the base of the display substrate at least partially overlaps with the orthographic projection of the power corner portion 4011 on the base.

[0089] like Fig.19 As shown, in some embodiments, the non-display area is further provided with a driving chip IC; the first signal line 70 further includes a first non-target portion 702 and a second non-target portion 703, and the first non-target portion 702 is connected to the target portion 701 and the second non-target portion 703 respectively;

[0090] The first non-target portion 702 is located at a side of the first power supply portion 4012 facing away from the display area, the first non-target portion 702 at least partially extends along the first direction, and the first non-target portion 702 and the first power supply portion 4012 are provided in the same layer and material;

[0091] The second non-target portion 703 is connected to the driving chip IC, and the second non-target portion 703 and the first non-target portion 702 are arranged in different layers.

[0092] Specifically, the first signal line 70 includes a target portion 701, a first non-target portion 702 and a second non-target portion 703, the target portion 701 is electrically connected to the gate drive circuit GOA, the first non-target portion 702 is respectively connected to the target portion 701 and the second non-target portion 703, and the second non-target portion 703 is connected to the driver chip IC.

[0093] The first non-target portion 702 and the first power supply portion 4012 are arranged in the same layer and with the same material, so that the first non-target portion 702 and the first power supply portion 4012 can be formed in the same patterning process, thereby effectively simplifying the production process of the display substrate and saving production costs.

[0094] The second non-target portion 703 and the first non-target portion 702 are arranged in different layers, thereby avoiding a short circuit between the second non-target portion 703 and a functional layer (such as the first power line 30 and the second power line 40) in the display substrate that is arranged in the same layer and material as the first non-target portion 702.

[0095] In some embodiments, the second non-target portion 703 and the target portion 701 are both provided in the same layer and with the same material as the packaging substrate layer 21 .

[0096] The above arrangement ensures that when the target portion 701 is connected to the gate drive circuit GOA, the target portion 701 will not be short-circuited with the second power line 40. Moreover, the above arrangement ensures that both the second non-target portion 703 and the target portion can be formed in one patterning process with the encapsulation base layer 21, thereby effectively simplifying the manufacturing process of the display substrate and saving manufacturing costs.

[0097] In some embodiments, the display substrate further includes a first gate metal layer, and the package base layer 21 is provided in the same layer and with the same material as the first gate metal layer.

[0098] The packaging base layer 21 and the first gate metal layer are provided in the same layer and with the same material, so that the packaging base layer 21 and the first gate metal layer can be formed in the same patterning process, thereby effectively simplifying the manufacturing process of the display substrate and saving the manufacturing cost.

[0099] In addition, the metal material used for the first gate metal layer has a better reflective effect. Setting the package base layer 21 and the first gate metal layer in the same layer and with the same material is more conducive to accelerating the laser sintering process.

[0100] In some embodiments, the display substrate further includes a first gate metal layer and a second gate metal layer; among the multiple first signal lines 70, a portion of the first signal lines 70 includes a first target portion that is arranged in the same layer and material as the first gate metal layer, and another portion of the first signal lines 70 includes a second target portion that is arranged in the same layer and material as the second gate metal layer, and the orthographic projection of the first target portion on the base of the display substrate and the orthographic projection of the second target portion on the base are alternately arranged at intervals.

[0101] The first target portion and the first gate metal layer are provided in the same layer and with the same material, so that the first target portion and the first gate metal layer can be formed simultaneously in the same patterning process, thereby effectively simplifying the manufacturing process of the display substrate and saving the manufacturing cost.

[0102] The second target portion and the second gate metal layer are arranged in the same layer and with the same material, so that the second target portion and the second gate metal layer can be formed simultaneously in the same patterning process, thereby effectively simplifying the manufacturing process of the display substrate and saving the manufacturing cost.

[0103] The above-mentioned alternating and spacing of the orthographic projection of the first target part on the base of the display substrate and the orthographic projection of the second target part on the base further enhances the concavity of the surface of the display substrate in contact with the frame sealing glue in the corner packaging glue area 201, thereby effectively improving the packaging effect of the display substrate.

[0104] like Fig.17 As shown, in some embodiments, the packaging glue area further includes a second packaging glue area 204 , the second packaging glue area 204 surrounds other sides of the display area except the first side, and the packaging base layer 21 extends to cover the second packaging glue area 204 .

[0105] Specifically, the second packaging glue area 204 surrounds the second side, the third side and the fourth side of the display substrate. The above-mentioned setting of the packaging base layer 21 extends to cover the second packaging glue area 204, so that when the Frit glue is laser sintered, the packaging base layer 21 located in the second packaging glue area 204 can effectively reflect the laser, thereby better accelerating the sintering process.

[0106] like Fig.17 , Fig. 22 and Fig.23 As shown, in some embodiments, the display substrate further includes a base, and a first gate insulating layer 93, a second gate insulating layer 94 and an interlayer insulating layer 95 sequentially stacked on the base in a direction away from the base, and the encapsulation base layer 21 is located between the first gate insulating layer 93 and the second gate insulating layer 94;

[0107] The package base layer 21 is provided with a plurality of first via holes 210;

[0108] The display substrate is also provided with a plurality of groups of first sub-vias 220 corresponding one-to-one to the plurality of first vias 210, each group of first sub-vias 220 includes a plurality of first sub-vias 220, the orthographic projections of the plurality of first sub-vias 220 on the substrate are located inside the orthographic projections of the corresponding first vias 210 on the substrate, and each of the first sub-vias 220 penetrates the interlayer insulating layer 95, the second gate insulating layer 94 and the first gate insulating layer 93.

[0109] The display substrate also includes a barrier layer 91 and a buffer layer 92 located between the base and the first gate insulating layer 93. After the display substrate is manufactured and before packaging, the first sub-via 220 can expose the buffer layer 92, so that when the Frit glue is subsequently formed, the Frit glue can penetrate into the first sub-via 220 and contact the buffer layer 92. After laser sintering, the packaging cover plate and the display substrate can be firmly bonded together.

[0110] Furthermore, the plurality of first via holes 210 and the plurality of first sub-via holes 220 provided on the packaging base layer 21 effectively enhance the concavity of the surface where the display substrate contacts the frame sealant, thereby effectively improving the packaging effect of the display substrate.

[0111] like Fig. 22 As shown, in some embodiments, the second power line 40 also includes a second power portion 4013, the second power portion 4013 is electrically connected to the power corner portion 4011, the second power portion 4013 surrounds the other sides of the display area except the first side, the orthographic projection of the second power portion 4013 on the substrate overlaps with the orthographic projection of the encapsulation substrate layer 21 on the substrate, and the second power portion 4013 is electrically connected to the encapsulation substrate layer 21 at the overlapping portion.

[0112] Specifically, the second power line 40 further includes a second power portion 4013, which surrounds the second side, the third side and the fourth side of the display area. Both ends of the second power portion 4013 are electrically connected to the two power corner portions 4011 in a one-to-one correspondence.

[0113] Illustratively, on the second side, the third side and the fourth side, the orthographic projection of the second power supply part 4013 on the substrate overlaps with the orthographic projection of the packaging substrate layer 21 on the substrate, and at the overlap of the second side, the third side and the fourth side, the second power supply part 4013 is electrically connected to the packaging substrate layer 21.

[0114] The above-mentioned electrical connection of the second power supply part 4013 with the packaging base layer 21 not only provides the packaging base layer 21 with a voltage signal with a stable potential to prevent the packaging base layer 21 from being in a floating state; it also reduces the resistance of the second power line 40, effectively reducing the voltage drop of the second power line 40.

[0115] like Fig. 22 As shown, in some embodiments, the packaging base layer 21 located in the second packaging glue area 204 includes a main body part 230 and a plurality of conductive connection parts 240, the main body part 230 surrounds the other sides of the display area except the first side, the plurality of conductive connection parts 240 are electrically connected to the main body part 230, respectively, the plurality of conductive connection parts 240 are arranged at intervals along the extension direction of the main body part 230, and the orthographic projection of each of the conductive connection parts on the base of the display substrate overlaps with the orthographic projection of the second power supply part 4013 on the base, and the second power supply part 4013 is electrically connected to the corresponding conductive connection parts at each overlap.

[0116] In the display substrate provided in the above embodiment, the concavo-convexity of the surface of the display substrate in contact with the frame sealant at the edge of the second sealant area 204 is effectively enhanced, thereby effectively improving the packaging effect of the display substrate.

[0117] In some embodiments, the main body portion 230 and the plurality of conductive connection portions 240 are configured to form an integral structure.

[0118] The above arrangement enables the main body 230 and the plurality of conductive connection parts 240 to be formed in the same patterning process, which not only ensures the connection performance between the main body 230 and the plurality of conductive connection parts 240, but also simplifies the production process of the display substrate and reduces the production cost.

[0119] like Fig.24 As shown, in some embodiments, a plurality of second vias 4014 are provided on the first power supply portion 4012 .

[0120] Exemplarily, the plurality of second vias 4014 are distributed in an array and can be divided into a plurality of rows of second vias 4014 arranged along the second direction, each row of second vias 4014 includes a plurality of second vias 4014 spaced apart along the first direction, and the second vias 4014 in two adjacent rows are staggered in the second direction.

[0121] Exemplarily, the orthographic projection of the second via hole 4014 on the substrate is a rectangle, the size of the second via hole 4014 in the first direction is 45 μm, and the size of the second via hole 4014 in the second direction is 70 μm.

[0122] Exemplarily, in the first direction, the distance between adjacent second via holes 4014 is 45 μm.

[0123] In the display substrate, the first power supply part 4012 is located on the side of the interlayer insulating layer 95 facing away from the substrate, and the plurality of second vias 4014 provided on the first power supply part 4012 can expose the interlayer insulating layer 95, so that when the sealant is formed on the display substrate, the sealant can contact the interlayer insulating layer 95 through the plurality of second vias 4014, so that after laser sintering, the package cover plate and the display substrate can be firmly bonded together. Moreover, the first power supply part 4012 is made of metal material, which can effectively reflect the laser, thereby better accelerating the sintering process.

[0124] In some embodiments, a portion of the second line-inlet portion 402 located in the line-inlet packaging glue area 202 is provided with a plurality of second vias 4014 .

[0125] like Figure 1 and Fig.18 As shown, in some embodiments, the non-display area is further provided with a first power line 30, and the first power line 30 includes: a transmission part 301 and two first line inlet parts 302 respectively connected to the transmission part 301;

[0126] The transmission part 301 is located between the display area 10 and the first power supply part 4012, and the transmission part 301 extends along the first direction; the two first incoming line parts 302 are located on the side of the transmission part 301 facing away from the display area, and the first incoming line parts 302 extend along the second direction, and at least part of the first incoming line parts 302 is located in the incoming line packaging glue area 202.

[0127] Exemplarily, the first power line 30 includes a positive power signal line VDD.

[0128] The first power line 30 includes an electrically connected transmission part 301 and a first inlet part 302, wherein the transmission part 301 is located between the display area and the first inlet part 302, the transmission part 301 extends along a first direction, and at least a portion of the first inlet part 302 extends along a second direction; exemplarily, the first direction includes a horizontal direction, and the second direction includes a vertical direction. Exemplarily, the transmission part 301 is located on a first side of the display substrate, the transmission part 301 is located between the display area 10 and the first power part 4012, and the first inlet part 302 is located between the two second inlet parts 402.

[0129] Exemplarily, the first power cord 30 includes two first line inlet portions 302, each of which extends along the second direction, and the two first line inlet portions 302 are electrically connected to the transmission portion 301 respectively. The two first line inlet portions 302 are spaced apart along the first direction, and the two first line inlet portions 302 are located between the two second line inlet portions 402.

[0130] The portion of the first line feeder 302 located in the line feeder packaging glue area 202 can serve as a packaging substrate in contact with the frame sealing glue. Since the first line feeder 302 is made of metal material, it can effectively reflect the laser, thereby accelerating the sintering process.

[0131] like Fig.19 As shown, in some embodiments, a plurality of third vias 3020 are disposed on a portion of the first line-inlet portion 302 located in the line-inlet packaging glue area 202 .

[0132] Exemplarily, the plurality of third vias 3020 are distributed in an array and can be divided into a plurality of rows of third vias 3020 arranged along the second direction, each row of third vias 3020 includes a plurality of third vias 3020 spaced apart along the first direction, and the third vias 3020 in two adjacent rows are staggered in the second direction.

[0133] Exemplarily, the orthographic projection of the third via hole 3020 on the substrate is a rectangle, the size of the third via hole 3020 in the first direction is 45 μm, and the size of the third via hole 3020 in the second direction is 70 μm.

[0134] Exemplarily, in the first direction, the distance between adjacent third via holes 3020 is 45 μm.

[0135] In the display substrate, the first line feed portion 302 is located on the side of the interlayer insulating layer 95 facing away from the substrate, and the multiple third via holes 3020 arranged on the first line feed portion 302 can expose the interlayer insulating layer 95, so that when the frame sealing glue is formed on the display substrate, the frame sealing glue can contact the interlayer insulating layer 95 through the multiple third via holes 3020, so that after laser sintering, the packaging cover plate and the display substrate can be firmly bonded together.

[0136] An embodiment of the present disclosure further provides a display device, comprising the display substrate provided by the above embodiment.

[0137] In the display substrate provided by the above embodiment, the orthographic projection of the target part on the substrate is set to be located between the orthographic projection of the packaging substrate layer 21 on the substrate and the orthographic projection of the first power supply part 4012 on the substrate; so that in the corner packaging glue area 201 and the first packaging glue area 203, the packaging substrate layer 21, the target part of the first signal line 70, the power corner part 4011 and the first power supply part 4012 together serve as a packaging substrate in contact with the frame sealing glue, thereby effectively increasing the contact area between the frame sealing glue and the display substrate, improving the adhesion between the frame sealing glue and the display substrate, and ensuring a good packaging effect.

[0138] In addition, in the display substrate provided by the above embodiment, by arranging the corner packaging glue area 201 and the first packaging glue area 203, the packaging base layer 21, the target part of the first signal line 70, the power corner part 4011 and the first power part 4012 together serve as a packaging base in contact with the sealing frame glue, thereby avoiding the formation of a large area of ​​the packaging base layer 21 in the corner packaging glue area 201 and the first packaging glue area 203, thereby effectively saving the production cost of the display substrate.

[0139] Therefore, the display device provided by the embodiment of the present disclosure also has the above-mentioned beneficial effects when including the above-mentioned display substrate, which will not be described in detail here.

[0140] It should be noted that the display device may be any product or component with a display function, such as a television, a monitor, a digital photo frame, a mobile phone, and a tablet computer.

[0141] In some embodiments, the display device further includes a packaging cover plate disposed opposite to the display substrate, and the packaging cover plate and the display substrate are sealed by a frame sealant disposed in a packaging sealant area.

[0142] The embodiment of the present disclosure further provides a method for manufacturing a display substrate, which is used to manufacture the display substrate provided in the above embodiment, wherein the display substrate comprises: a display area and a non-display area surrounding the display area, wherein the non-display area comprises a packaging glue area surrounding the display area; the packaging glue area comprises: a corner packaging glue area 201 located on a first side of the display area, an incoming line packaging glue area 202, and a first packaging glue area 203, wherein the first packaging glue area 203 is located between the corner packaging glue area 201 and the incoming line packaging glue area 202; the manufacturing method comprises:

[0143] Making a packaging base layer 21 in the corner packaging glue area 201;

[0144] A second power line 40, a gate driving circuit GOA, and a plurality of first signal lines 70 for providing signals to the gate driving circuit GOA are formed in the non-display area;

[0145] The second power line 40 includes a power corner portion 4011 and a first power portion 4012 , the first power portion 4012 overlaps the first packaging glue area 203 , and the first power portion 4012 extends along a first direction;

[0146] The target portion of each of the first signal lines 70 is at least located at the corner packaging glue area 201, and the target portion extends along the second direction; the first direction intersects with the second direction; the orthographic projection of the target portion on the base of the display substrate is located between the orthographic projection of the packaging base layer 21 on the base and the orthographic projection of the first power supply portion 4012 on the base.

[0147] In the display substrate manufactured by the manufacturing method provided by the embodiment of the present disclosure, the orthographic projection of the target part on the substrate is set to be located between the orthographic projection of the packaging substrate layer 21 on the substrate and the orthographic projection of the first power supply part 4012 on the substrate; so that in the corner packaging glue area 201 and the first packaging glue area 203, the packaging substrate layer 21, the target part of the first signal line 70 and the first power supply part 4012 jointly serve as a packaging substrate in contact with the frame sealing glue, thereby effectively increasing the contact area between the frame sealing glue and the display substrate, improving the adhesion between the frame sealing glue and the display substrate, and ensuring a good packaging effect.

[0148] In addition, in the display substrate manufactured by the manufacturing method provided by the embodiment of the present disclosure, by arranging in the corner packaging glue area 201 and the first packaging glue area 203, the packaging base layer 21, the target part of the first signal line 70 and the first power supply part 4012 together serve as the packaging base in contact with the frame sealing glue, thereby avoiding the formation of a large area of ​​the packaging base layer 21 in the corner packaging glue area 201 and the first packaging glue area 203, thereby effectively saving the manufacturing cost of the display substrate.

[0149] like Figure 1 and Fig.17 As shown, in the display substrate provided by the present disclosure, on the side where the COF or the driver chip IC is set, the first power line 30 (such as the positive power line VDD) and the second power line 40 (such as the negative power line VSS) are led out from the pins (Pin) of the COF or IC to form an incoming line area. Due to the limitation of the size of the COF or IC, the distance between VDD and VSS near the incoming line area of ​​the display substrate is relatively close (such as Figure 2 and Figure 6The distance between the second line feeder 402 and the first line feeder 302 is relatively close, generally about 50 to 100 um, and there is no wiring between VDD and VSS, so that the surface of the base of VDD and VSS facing away from the display substrate near the line feeder area is relatively flat.

[0150] In order to save space on the lower frame of the display substrate (i.e., the frame where the line entry area is located), the VSS and VDD at the lower frame are generally used as the Frit packaging substrate at the same time. The distance between VDD and VSS near the line entry area is small, and the surface of the substrate of VDD and VSS near the line entry area facing away from the display substrate is relatively flat, so that the effective bonding width between the Frit glue between VDD and VSS near the line entry area and the display substrate is small. In this way, when the package is irradiated by laser, the Frit glue between VDD and VSS near the line entry area is severely narrowed, which can easily lead to water vapor and oxygen invading the inside of the device from this position, posing a risk of electrochemical corrosion to the display device.

[0151] See also Figure 1 , Figure 3 , Figure 4 , Figure 7 , Figure 8 and Fig.17 As shown, the embodiment of the present disclosure provides a display substrate, comprising: a display area 10 and a non-display area surrounding the display area 10; the non-display area comprises a packaging glue area 20, and the non-display area is provided with a first power line 30 and a second power line 40;

[0152] The first power line 30 includes: a transmission portion 301 and a first line inlet portion 302 connected to the transmission portion 301, the transmission portion 301 is located between the display area and the first line inlet portion 302, the transmission portion 301 extends along a first direction, at least a portion of the first line inlet portion 302 extends along a second direction, and the first direction intersects with the second direction;

[0153] The second power line 40 includes: a peripheral portion 401 and two second line inlet portions 402; the peripheral portion 401 surrounds the display area, the peripheral portion 401 has an opening, and two ends of the peripheral portion 401 at the opening are connected to the two second line inlet portions 402 in a one-to-one correspondence;

[0154] The first line entry portion 302 is located between the two second line entry portions 402; the second line entry portion 402 and the first line entry portion 302 include a first spacing area 51 and a second spacing area 52, the first spacing area 51 has a first distance d in the first direction, the second spacing area 52 has a second distance b in the first direction, the first spacing area 51 and the packaging glue area 20 have a first overlapping area, and the second spacing area 52 has no overlap with the packaging glue area 20; the first distance d is greater than the second distance b.

[0155] Specifically, the display substrate includes a display area and a non-display area. Exemplarily, the display area includes a circle and a rectangle, and the non-display area completely surrounds the display area.

[0156] The display substrate includes a first power line 30 and a second power line 40 . Exemplarily, the first power line 30 includes a positive power signal line VDD, and the second power line 40 includes a negative power signal line VSS.

[0157] The first power line 30 includes an electrically connected transmission part 301 and a first line input part 302. Exemplarily, the transmission part 301 is located between the display area and the first line input part 302, the transmission part 301 extends along a first direction, and at least a portion of the first line input part 302 extends along a second direction; exemplary, the first direction includes a horizontal direction, and the second direction includes a vertical direction.

[0158] It is worth noting that the specific shape and number of the first line inlet 302 are various, for example, Figure 1 As shown, the first power line 30 includes two first inlet portions 302, each of which extends along the second direction, and the two first inlet portions 302 are electrically connected to the transmission portion 301 respectively, and the two first inlet portions 302 are arranged at intervals along the first direction, and the two first inlet portions 302 are located between the two second inlet portions 402. For example, Figure 5 As shown, the first power line 30 includes a first line inlet portion 302 , which is formed into a gate-like structure, and a side of the first line inlet portion 302 close to the transmission portion 301 is electrically connected to the transmission portion 301 .

[0159] It should be noted that the display substrate may further include a power supply pattern located in the display area. Exemplarily, at least a portion of the power supply pattern extends along the second direction; the power supply pattern can be electrically connected to the transmission unit 301. Exemplarily, the first input line portion 302 is electrically connected to a pin bound to a flexible circuit board in the display substrate. The power supply pattern receives a first power supply signal transmitted by the first input line portion 302 and the transmission unit 301.

[0160] like Figure 1 As shown, the second power line 40 includes a peripheral portion 401 and two second inlet portions 402. The peripheral portion 401 surrounds the display area, and the peripheral portion 401 is electrically connected to the cathode in the display substrate. At least part of the second inlet portion 402 extends along the second direction. Exemplarily, the second inlet portion 402 is electrically connected to the pins of the display substrate that are bound to the flexible circuit board.

[0161] Taking a quadrilateral display substrate as an example, the display area is a quadrilateral, and the first side of the display area is defined as a side close to the binding chip, the second side of the display area is a side opposite to the first side, the third side and the fourth side of the display area are opposite, the third side is located on the left side of the display area, and the fourth side is located on the right side of the display area.

[0162] The peripheral portion 401 surrounds the second side, the third side, the fourth side, and part of the first side of the display area. The peripheral portion 401 has an opening on the first side. The peripheral portion 401 has two ends at the opening, and the two ends are respectively connected to the two second line inlet portions 402.

[0163] The transmission portion 301 is located at the first side of the display substrate, the transmission portion 301 is located between the display area 10 and the peripheral portion 401, and the first line inlet portion 302 is located between the two second line inlet portions 402. When the first power line 30 includes one first line inlet portion 302, each of the second line inlet portions 402 forms the first spacing area 51 and the second spacing area 52 with the first line inlet portion 302. When the first power line 30 includes two first line inlet portions 302, each of the second line inlet portions 402 forms the first spacing area 51 and the second spacing area 52 with the adjacent first line inlet portions 302.

[0164] like Figure 1 , Figure 3 and Figure 4As shown, the non-display area also includes a packaging glue area 20, and the packaging glue area 20 surrounds the display area and is used to form Frit glue. The first spacer area 51 has a first overlapping area with the packaging glue area 20, and the second spacer area 52 has no overlap with the packaging glue area 20. At any position of the first spacer area 51, the first spacer area 51 has a first distance d in the first direction. Exemplarily, the first distance d is the minimum distance of the first spacer area 51 in the first direction. The second spacer area 52 has a second distance b in the first direction. Exemplarily, the second distance b is the average distance of the second spacer area 52 in the first direction. Exemplarily, the second distance b is equal to 300um. The first distance d is greater than the second distance b.

[0165] According to the specific structure of the above-mentioned display substrate, in the display substrate provided by the embodiment of the present disclosure, a first spacing area 51 and a second spacing area 52 are provided between the second line feeder 402 and the first line feeder 302, the first spacing area 51 has a first distance d in the first direction, the second spacing area 52 has a second distance b in the first direction, the first spacing area 51 and the packaging glue area 20 have a first overlapping area, and the second spacing area 52 has no overlap with the packaging glue area 20; the first distance d is greater than the second distance b; the width between the second line feeder 402 and the first line feeder 302 in the first overlapping area is well increased, and the flatness of the surface of the display substrate facing away from the base in the first overlapping area is reduced, thereby enhancing the bonding area and bonding strength between the Frit glue and the display substrate, so that when the laser is irradiated for packaging, the effective bonding width of the Frit glue in the first overlapping area is guaranteed, the packaging effect is improved, and the occurrence of packaging failure is prevented. Therefore, in the display substrate provided in the embodiment of the present disclosure, the risk of water vapor and oxygen invading the interior of the device from near the first overlapping area and causing electrochemical corrosion to the display device is effectively reduced without adding a new film layer or changing the existing Frit packaging process.

[0166] like Figure 1 , Figure 3 , Fig.15 and Fig.16 As shown, in some embodiments, the non-display area further includes a fan-out area 60 , and the fan-out area 60 includes a plurality of fan-out lines 601 ; the first overlapping area at least partially overlaps with the fan-out area 60 .

[0167] Specifically, the fan-out area 60 includes a plurality of fan-out lines 601. Exemplarily, the display area is provided with a plurality of data lines. The plurality of fan-out lines 601 include a plurality of data line leads. The plurality of data line leads are electrically connected to the plurality of data lines in a one-to-one correspondence.

[0168] Exemplarily, the plurality of fan-out lines are provided in the same layer and with the same material.

[0169] Exemplarily, the multiple fan-out lines include multiple first fan-out lines 6011 and multiple second fan-out lines 6012, the multiple first fan-out lines 6011 are arranged on the same layer and the same material, the second fan-out lines 6012 are arranged on the same layer and the same material, the first fan-out lines 6011 and the second fan-out lines 6012 are arranged on different layers, and the orthographic projections of the multiple first fan-out lines 6011 on the base of the display substrate are alternately arranged with the orthographic projections of the multiple second fan-out lines 6012 on the base.

[0170] The above-mentioned setting that the first overlapping area and the fan-out area 60 are at least partially overlapped further reduces the flatness of the surface of the display substrate facing away from the base in the first overlapping area, thereby further enhancing the bonding area and bonding strength between the Frit glue and the display substrate, so that when the laser irradiation package is performed, the narrowing degree of the Frit glue located in the first overlapping area is effectively reduced, the effective bonding width of the Frit glue is ensured, the packaging effect is improved, and the occurrence of packaging failure is prevented.

[0171] In some embodiments, the orthographic projection of the first overlapping region on the base of the display substrate is set to be located inside the orthographic projection of the fan-out region 60 on the base.

[0172] The above-mentioned setting method minimizes the flatness of the surface of the display substrate facing away from the base in the first overlapping area, thereby further enhancing the bonding area and bonding strength between the Frit glue and the display substrate, so that when the laser irradiation package is performed, the narrowing degree of the Frit glue located in the first overlapping area is effectively reduced, the effective bonding width of the Frit glue is ensured, the packaging effect is improved, and the occurrence of packaging failure is prevented.

[0173] like Figure 1 , Fig.15 and Fig.16 As shown, in some embodiments, the multiple fan-out lines 601 include multiple target fan-out lines, and the first part 6010 of each target fan-out line is located in the packaging glue area 20, and the orthographic projection of the first part 6010 on the substrate overlaps with the orthographic projection of the first power line 30 on the substrate, and / or overlaps with the orthographic projection of the second power line 40 on the substrate; the spacing a between the orthographic projections of the first parts 6010 of two adjacent target fan-out lines on the substrate is greater than 1μm.

[0174] Exemplarily, the plurality of fan-out lines 601 are provided in the same layer and with the same material.

[0175] Exemplarily, the multiple fan-out lines 601 include multiple first fan-out lines 6011 and multiple second fan-out lines 6012, the multiple first fan-out lines 6011 are arranged on the same layer and the same material, the multiple second fan-out lines 6012 are arranged on the same layer and the same material, the first fan-out lines 6011 and the second fan-out lines 6012 are arranged on different layers, and the orthographic projections of the multiple first fan-out lines 6011 on the substrate are alternately arranged with the orthographic projections of the multiple second fan-out lines 6012 on the substrate.

[0176] Exemplarily, the spacing a between the orthographic projections of the first portions 6010 of adjacent target fan-out lines on the substrate is 1.5 μm.

[0177] like Fig.14 As shown, when the rigid OLED display substrate is frit-packaged, when the package cover plate 97 is attached to the display substrate, large foreign particles in the frit glue can easily press the first power line 30 and the second power line 40 into the fan-out line 601 (as shown in FIG. Fig.14 The first power line 30 and the second power line 40 are short-circuited with the fan-out line, resulting in an X-line defect.

[0178] In the display device provided by the above embodiment, by setting the spacing between the orthographic projections of the first parts 6010 of adjacent target fan-out lines on the substrate 90 to be greater than 1 μm, the line spacing between the first parts 6010 of adjacent target fan-out lines in the packaging glue area 20 is increased, thereby reducing the density of the target fan-out lines covered by the first power line 30 and / or the second power line 40 in the packaging glue area 20. In this way, when the packaging cover plate 97 is bonded to the display substrate, the probability of short circuit between the first power line 30 and the second power line 40 and the fan-out line due to large particles of foreign matter is reduced.

[0179] like Figure 1 , Fig.15 and Fig.16 As shown, in some embodiments, the multiple fan-out lines 601 include multiple target fan-out lines, and the first part 6010 of each target fan-out line is located in the packaging glue area 20, and the orthographic projection of the first part 6010 on the substrate overlaps with the orthographic projection of the first power line 30 on the substrate, and / or overlaps with the orthographic projection of the second power line 40 on the substrate; the spacing a between the orthographic projections of the first parts 6010 of two adjacent target fan-out lines on the substrate satisfies the following condition: a=(0.264~0.5)×k, k is the line width of the target fan-out line.

[0180] Specifically, a is 0.264 to 0.5 times of k. Exemplarily, the line width of the target fan-out line k is 3.8 μm.

[0181] like Figure 4 As shown, in some embodiments, the second inlet portion 402 includes a first inlet sub-pattern 4021, a second inlet sub-pattern 4022, and a third inlet sub-pattern 4023 electrically connected in sequence, and the first inlet sub-pattern 4021 is electrically connected to a corresponding end portion of the peripheral portion 401;

[0182] The first spacer 51 is provided between the first inlet sub-pattern 4021 and the first inlet portion 302;

[0183] The second spacing area 52 is defined between the second inlet sub-pattern 4022 and the first inlet portion 302 . Along the direction approaching the first spacing area 51 , the second distance b gradually increases until it becomes equal to the first distance d.

[0184] Exemplarily, the second distance b is between 30 μm and 290 μm, and the first distance d is between 150 μm and 600 μm.

[0185] Exemplarily, the first inlet sub-pattern 4021 and the third inlet sub-pattern 4023 both extend along the second direction, and the second inlet sub-pattern 4022 extends along the third direction.

[0186] Exemplarily, the first inlet sub-graphic 4021, the second inlet sub-graphic 4022, the third inlet sub-graphic 4023 and the peripheral portion 401 form an integrated structure.

[0187] The first input line sub-pattern 4021 is electrically connected to a corresponding end portion of the peripheral portion 401 , and the third input line sub-pattern 4023 is electrically connected to a driving chip in the display substrate.

[0188] In the above arrangement, the second distance b gradually increases along the direction approaching the first spacing area 51 until it is equal to the first distance d; so that along the direction approaching the packaging glue area 20, the distance between the second line feeder portion 402 and the first line feeder portion 302 gradually increases, thereby ensuring both the packaging performance and the stability of the signal transmission of the second power line 40.

[0189] like Figure 4 As shown, in some embodiments, the third feeder sub-pattern 4023 extends along the second direction, and a third distance c is provided between the third feeder sub-pattern 4023 and the first feeder portion 302 in the first direction, and the third distance c is equal to the minimum value of the second distance b.

[0190] Specifically, the third inlet sub-pattern 4023 extends along the second direction, the first inlet portion 302 extends along the second direction, and a third distance c is provided in the first direction between the third inlet sub-pattern 4023 and the first inlet portion 302. Exemplarily, the third distance is 80 μm.

[0191] Since the third incoming line sub-graphic 4023 and the first incoming line portion 302 are both electrically connected to the driver chip or flexible circuit board in the display substrate, and the size of the driver chip or the flexible circuit board is limited, the third distance c is set equal to the minimum value of the second distance b, so that the third incoming line sub-graphic 4023 and the first incoming line portion 302 have a closer distance, which is more conducive to reducing the difficulty of electrically connecting the third incoming line sub-graphic 4023 and the first incoming line portion 302 to the driver chip IC or the flexible circuit board in the display substrate.

[0192] like Figure 4 and Fig.19 As shown, in some embodiments, a second spacing area 52 is provided between the second inlet sub-pattern 4022 and the first inlet portion 302; a third spacing area 53 is provided between the third inlet sub-pattern 4023 and the first inlet portion 302;

[0193] The display substrate further includes a gate driving circuit GOA and a plurality of first signal lines 70 for providing signals to the gate driving circuit GOA. At least part of the first signal lines 70 is located in the second spacing area 52 and / or the third spacing area 53 .

[0194] Specifically, the display substrate further includes a gate driving circuit GOA. Exemplarily, the gate driving circuit GOA includes shift register units corresponding one-to-one to the gate lines in the display substrate, and is used to provide scanning signals for the gate lines in the display substrate.

[0195] The display substrate also includes a plurality of first signal lines 70 for providing signals to the gate drive circuit GOA. The specific types of the plurality of first signal lines 70 vary. Exemplarily, the plurality of first signal lines 70 include a frame start signal line, a clock signal line, a first level signal line, a second level signal line, and the like.

[0196] The gate driving circuit GOA is located at the left and right sides of the display area, and each of the first signal lines 70 is electrically connected to the gate driving circuit GOA and the driving chip IC in the display substrate respectively.

[0197] like Fig. 9 and Fig.10As shown, in some embodiments, the display substrate further includes a plurality of dummy signal lines 80; at least a portion of each of the dummy signal lines 80 is located in the first overlapping region.

[0198] Specifically, the display substrate further includes a plurality of dummy signal lines 80 arranged at intervals. The plurality of dummy signal lines 80 are in a floating state. At least a portion of each of the dummy signal lines 80 is located in the first overlapping region.

[0199] The above-mentioned setting arranges that at least a portion of each of the virtual signal lines is located in the first overlapping area, so that the surface of the display substrate facing away from the base in the first overlapping area is uneven, thereby further reducing the flatness of the surface of the display substrate facing away from the base in the first overlapping area, enhancing the bonding area and bonding strength between the Frit glue and the display substrate, so that when the laser is irradiated for packaging, the narrowing degree of the Frit glue located in the first overlapping area is effectively reduced, thereby ensuring the effective bonding width of the Frit glue, improving the packaging effect, and preventing the occurrence of packaging failure.

[0200] like Fig.11 As shown, in some embodiments, the display substrate further includes a first gate metal layer, and the virtual signal line 80 is provided in the same layer and with the same material as the first gate metal layer.

[0201] Specifically, the display substrate includes an active layer, a first gate insulating layer 93, a first gate metal layer, a second gate insulating layer 94, a second gate metal layer, an interlayer insulating layer 95 and a first source-drain metal layer which are stacked in sequence in a direction away from the substrate 90. The active layer is used to form active patterns of thin film transistors in the display substrate, as well as some conductive connection patterns, etc. The first gate metal layer is used to form the gate of the thin film transistor, as well as the gate line in the display substrate, etc. The second gate metal layer is used to form the plate of the capacitor in the display substrate, as well as the initialization signal line pattern, etc. The first source-drain metal layer is used to form the first power line 30, the second power line 40, the data line and some conductive connection parts in the display substrate.

[0202] The virtual signal line and the first gate metal layer are provided in the same layer and with the same material, so that the virtual signal line and the first gate metal layer can be formed in the same patterning process, thereby effectively simplifying the manufacturing process of the display substrate and saving the manufacturing cost.

[0203] like Fig.12 As shown, in some embodiments, the display substrate further includes a second gate metal layer, and the virtual signal line 80 is provided in the same layer and with the same material as the second gate metal layer.

[0204] The virtual signal line 80 and the second gate metal layer are provided in the same layer and with the same material, so that the virtual signal line and the second gate metal layer can be formed in the same patterning process, thereby effectively simplifying the manufacturing process of the display substrate and saving the manufacturing cost.

[0205] like Fig.13 As shown, in some embodiments, the display substrate also includes a first gate metal layer and a second gate metal layer; the multiple virtual signal lines include multiple first virtual signal lines 801 and multiple second virtual signal lines 802, the orthographic projections of the first virtual signal lines 801 on the base 90 of the display substrate and the orthographic projections of the second virtual signal lines 802 on the base 90 are alternately arranged at intervals, the first virtual signal lines 801 are arranged in the same layer and material as the first gate metal layer, and the second virtual signal lines 802 are arranged in the same layer and material as the second gate metal layer.

[0206] The first virtual signal line 801 is set at the same layer and material as the first gate metal layer, and the second virtual signal line 802 is set at the same layer and material as the second gate metal layer, so that the first virtual signal line 801 and the first gate metal layer can be formed in the same patterning process, and the second virtual signal line 802 and the second gate metal layer can be formed in the same patterning process, thereby effectively simplifying the production process of the display substrate and saving production costs.

[0207] In some embodiments, the virtual signal line 80 extends along the first direction; or, the virtual signal line extends along the second direction.

[0208] Specifically, the extension direction of the virtual signal line can be set according to actual needs, and can specifically extend along the first direction, the second direction or a third direction, and the third direction intersects both the first direction and the second direction.

[0209] like Fig. 9 As shown, in some embodiments, the first overlapping area is filled with the virtual signal lines 80 .

[0210] The virtual signal lines 80 are fully distributed in the first overlapping area, so that the surface of the display substrate facing away from the base 90 in the entire first overlapping area is uneven, thereby greatly reducing the flatness of the surface of the display substrate facing away from the base 90 in the first overlapping area, enhancing the bonding area and bonding strength between the Frit glue and the display substrate, so that when the laser is irradiated for packaging, the narrowing degree of the Frit glue located in the first overlapping area is effectively reduced, the effective bonding width of the Frit glue is guaranteed, the packaging effect is improved, and the occurrence of packaging failure is prevented.

[0211] like Figure 7and Fig.19 As shown, in some embodiments, the display substrate further includes a packaging base layer 21 located in the packaging glue area 20 , the packaging base layer 21 surrounds the display area, and is disconnected at one side of the display area close to the first line feed portion 302 .

[0212] In the display substrate provided by the above embodiment, the packaging base layer 21 is disposed in the packaging glue area 20, so that when the Frit glue is laser sintered, the packaging base layer 21 can effectively reflect the laser, thereby accelerating the sintering process.

[0213] In some embodiments, the display substrate further includes a first gate metal layer, and the package base layer 21 is provided in the same layer and with the same material as the first gate metal layer.

[0214] The packaging base layer 21 and the first gate metal layer are provided in the same layer and with the same material, so that the packaging base layer 21 and the first gate metal layer can be formed in the same patterning process, thereby effectively simplifying the manufacturing process of the display substrate and saving the manufacturing cost.

[0215] In addition, the metal material used for the first gate metal layer has a better reflective effect. Setting the package base layer 21 and the first gate metal layer in the same layer and with the same material is more conducive to accelerating the laser sintering process.

[0216] like Figure 7 , Fig.19 , Fig. 20 and Fig.23 As shown, in some embodiments, the display substrate further includes a base 90, and a first gate insulating layer 93, a second gate insulating layer 94 and an interlayer insulating layer 95 sequentially stacked on the base 90 in a direction away from the base 90, and the encapsulation base layer 21 is located between the first gate insulating layer 93 and the second gate insulating layer 94;

[0217] The package base layer 21 is provided with a plurality of first via holes 210;

[0218] The display substrate is also provided with a plurality of groups of first sub-vias 220 corresponding one-to-one to the plurality of first vias 210, each group of first sub-vias 220 includes a plurality of first sub-vias 220, the orthographic projections of the plurality of first sub-vias 220 on the substrate 90 are located inside the orthographic projections of the corresponding first vias 210 on the substrate 90, and each of the first sub-vias 220 penetrates the interlayer insulating layer 95, the second gate insulating layer 94 and the first gate insulating layer 93.

[0219] Exemplarily, the first via 210 and the first sub-via 220 are both rectangular vias, the size of the first via 210 is 40 μm*40 μm, the size of the first sub-via 220 is 6 μm*6 μm, and in a group of first sub-vias 220, the multiple first sub-vias 220 are distributed in an array, and the spacing between adjacent first sub-vias 220 is 3.5 μm.

[0220] The display substrate also includes a barrier layer 91 and a buffer layer 92 located between the base 90 and the first gate insulating layer 93. After the display substrate is manufactured and before packaging, the first sub-via 220 can expose the buffer layer 92, so that when the Frit glue is subsequently formed, the Frit glue can penetrate into the first sub-via 220 and contact the buffer layer 92. After laser sintering, the packaging cover plate 97 and the display substrate can be firmly bonded together.

[0221] Furthermore, the plurality of first via holes 210 and the plurality of first sub-via holes 220 provided on the packaging base layer 21 effectively enhance the concavity of the surface where the display substrate contacts the frame sealant 96 , thereby effectively improving the packaging effect of the display substrate.

[0222] An embodiment of the present disclosure further provides a display device, comprising the display substrate provided by the above embodiment.

[0223] Exemplarily, the display device comprises a rigid OLED display device.

[0224] Exemplarily, the display device includes a package of an OLED rigid watch and an OLED rigid bracelet screen.

[0225] In the display substrate provided by the above embodiment, a first spacing area 51 and a second spacing area 52 are provided between the second line feeder 402 and the first line feeder 302, the first spacing area 51 has a first distance d in the first direction, the second spacing area 52 has a second distance b in the first direction, the first spacing area 51 and the packaging glue area 20 have a first overlapping area, and the second spacing area 52 and the packaging glue area 20 have no overlap; the first distance d is greater than the second distance b; the width between the second line feeder 402 and the first line feeder 302 in the first overlapping area is well increased, and the flatness of the surface of the display substrate facing away from the base in the first overlapping area is reduced, thereby enhancing the bonding area and bonding strength between the Frit glue and the display substrate, so that when the laser is irradiated for packaging, the effective bonding width of the Frit glue in the first overlapping area is guaranteed, the packaging effect is improved, and the occurrence of packaging failure is prevented. Therefore, in the display substrate provided in the embodiment of the present disclosure, the risk of water vapor and oxygen invading the interior of the device from near the first overlapping area and causing electrochemical corrosion to the display device is effectively reduced without adding a new film layer or changing the existing Frit packaging process.

[0226] The display device provided by the embodiment of the present disclosure also has the above-mentioned beneficial effects when it includes the above-mentioned display substrate, which will not be described in detail here.

[0227] It should be noted that the display device may be any product or component with a display function, such as a television, a monitor, a digital photo frame, a mobile phone, and a tablet computer.

[0228] In some embodiments, the display device further includes a packaging cover plate 97 disposed opposite to the display substrate, and the packaging cover plate 97 and the display substrate are sealed by a sealing glue 96 disposed in the packaging glue area 20 .

[0229] The embodiment of the present disclosure further provides a method for manufacturing a display substrate, which is used to manufacture the display substrate provided in the above embodiment, wherein the display substrate includes a display area and a non-display area surrounding the display area, wherein the non-display area includes a packaging glue area 20; the manufacturing method includes:

[0230] Making a first power line 30 and a second power line 40 in the non-display area;

[0231] The first power line 30 includes: a transmission portion 301 and a first line inlet portion 302 connected to the transmission portion 301, the transmission portion 301 is located between the display area and the first line inlet portion 302, the transmission portion 301 extends along a first direction, at least a portion of the first line inlet portion 302 extends along a second direction, and the first direction intersects with the second direction;

[0232] The second power line 40 includes: a peripheral portion 401 and two second line inlet portions 402; the peripheral portion 401 surrounds the display area, the peripheral portion 401 has an opening, and two ends of the peripheral portion 401 at the opening are connected to the two second line inlet portions 402 in a one-to-one correspondence;

[0233] The first line entry portion 302 is located between the two second line entry portions 402; the second line entry portion 402 and the first line entry portion 302 include a first spacing area 51 and a second spacing area 52, the first spacing area 51 has a first distance d in the first direction, the second spacing area 52 has a second distance b in the first direction, the first spacing area 51 and the packaging glue area 20 have a first overlapping area, and the second spacing area 52 has no overlap with the packaging glue area 20; the first distance d is greater than the second distance b.

[0234] In the display substrate manufactured by the manufacturing method provided by the embodiment of the present disclosure, a first spacing area 51 and a second spacing area 52 are provided between the second line feeder 402 and the first line feeder 302, the first spacing area 51 has a first distance d in the first direction, the second spacing area 52 has a second distance b in the first direction, the first spacing area 51 and the packaging glue area 20 have a first overlapping area, and the second spacing area 52 and the packaging glue area 20 have no overlap; the first distance d is greater than the second distance b; the width between the second line feeder 402 and the first line feeder 302 in the first overlapping area is well increased, and the flatness of the surface of the display substrate facing away from the base in the first overlapping area is reduced, thereby enhancing the bonding area and bonding strength between the Frit glue and the display substrate, so that when the laser is irradiated for packaging, the effective bonding width of the Frit glue in the first overlapping area is guaranteed, the packaging effect is improved, and the occurrence of packaging failure is prevented. Therefore, in the display substrate provided in the embodiment of the present disclosure, the risk of water vapor and oxygen invading the interior of the device from near the first overlapping area and causing electrochemical corrosion to the display device is effectively reduced without adding a new film layer or changing the existing Frit packaging process.

[0235] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the method embodiment, since it is basically similar to the product embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiment.

[0236] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect", "couple" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0237] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0238] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0239] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display substrate, comprising: A display area and a non-display area surrounding the display area, wherein the non-display area includes a packaging glue area surrounding the display area; The packaging glue area includes: a corner packaging glue area, an incoming line packaging glue area and a first packaging glue area located on a first side of the display area, wherein the first packaging glue area is located between the corner packaging glue area and the incoming line packaging glue area; the corner packaging glue area is provided with a packaging substrate layer; the non-display area is provided with a second power line, a gate driving circuit, and a plurality of first signal lines for providing signals to the gate driving circuit; The second power line includes a power corner portion and a first power portion, the first power portion overlaps the first packaging glue area, and the first power portion extends along a first direction; The target portion of each of the first signal lines is at least located in the corner packaging glue area, and the target portion extends along the second direction; the first direction intersects with the second direction; the orthographic projection of the target portion on the base of the display substrate is located between the orthographic projection of the packaging base layer on the base and the orthographic projection of the first power supply portion on the base.

2. The display substrate according to claim 1, wherein: The power corner portion is arc-shaped away from the boundary of the display area. Along the curvature radius of the arc, the power corner portion has a corner width. Along the direction from the first packaging glue area to the corner packaging glue area, the corner width gradually decreases.

3. The display substrate according to claim 2, wherein: Along the second direction, a width of the first power supply portion is greater than a maximum value of the corner width.

4. The display substrate according to claim 1, wherein: An orthographic projection of the package substrate layer on the substrate at least partially overlaps with an orthographic projection of the power corner portion on the substrate.

5. The display substrate according to claim 1, wherein: At least a portion of the gate driving circuit is located between the display area and the corner packaging glue area, and an orthographic projection of the target portion on the base of the display substrate at least partially overlaps with an orthographic projection of the power corner portion on the base.

6. The display substrate according to claim 5, wherein: The non-display area is also provided with a driving chip; the first signal line further includes a first non-target portion and a second non-target portion, the first non-target portion is connected to the target portion and the second non-target portion respectively; The first non-target portion is located at a side of the first power supply portion facing away from the display area, the first non-target portion at least partially extends along the first direction, and the first non-target portion and the first power supply portion are provided in the same layer and the same material; The second non-target portion is connected to the driving chip, and the second non-target portion and the first non-target portion are arranged in different layers.

7. The display substrate according to claim 6, wherein: The second non-target portion and the target portion are both provided in the same layer and with the same material as the packaging base layer.

8. The display substrate according to claim 6, wherein: The display substrate further includes a first gate metal layer, and the package base layer and the first gate metal layer are provided in the same layer and with the same material.

9. The display substrate according to claim 6, wherein: The display substrate also includes a first gate metal layer and a second gate metal layer; among the multiple first signal lines, a portion of the first signal lines includes a first target portion that is arranged in the same layer and material as the first gate metal layer, and another portion of the first signal lines includes a second target portion that is arranged in the same layer and material as the second gate metal layer, and the orthographic projection of the first target portion on the base of the display substrate and the orthographic projection of the second target portion on the base are alternately arranged.

10. The display substrate according to claim 1, wherein: The packaging glue area further includes a second packaging glue area, the second packaging glue area surrounds the other sides of the display area except the first side, and the packaging base layer extends to cover the second packaging glue area.

11. The display substrate according to claim 10, wherein: The display substrate further comprises a base, and a first gate insulating layer, a second gate insulating layer and an interlayer insulating layer sequentially stacked on the base in a direction away from the base, wherein the encapsulation base layer is located between the first gate insulating layer and the second gate insulating layer; A plurality of first via holes are arranged on the package substrate layer; The display substrate is also provided with a plurality of groups of first sub-vias corresponding one-to-one to the plurality of first vias, each group of first sub-vias includes a plurality of first sub-vias, the orthographic projections of the plurality of first sub-vias on the substrate are located inside the orthographic projections of the corresponding first vias on the substrate, and each of the first sub-vias passes through the interlayer insulating layer, the second gate insulating layer and the first gate insulating layer.

12. The display substrate according to claim 10, wherein: The second power line also includes a second power part, which is electrically connected to the power corner part. The second power part surrounds the other sides of the display area except the first side. The orthographic projection of the second power part on the substrate overlaps with the orthographic projection of the encapsulation substrate layer on the substrate, and the second power part is electrically connected to the encapsulation substrate layer at the overlapping point.

13. The display substrate according to claim 12, wherein: The packaging base layer located in the second packaging glue area includes a main body part and a plurality of conductive connection parts, the main body part surrounds the other sides of the display area except the first side, the plurality of conductive connection parts are electrically connected to the main body part respectively, the plurality of conductive connection parts are arranged at intervals along the extension direction of the main body part, the orthographic projection of each of the conductive connection parts on the base of the display substrate overlaps with the orthographic projection of the second power supply part on the base, and the second power supply part is electrically connected to the corresponding conductive connection part at each overlap.

14. The display substrate according to claim 13, wherein: The main body portion and the plurality of conductive connection portions are formed into an integral structure.

15. The display substrate according to claim 1, wherein: A plurality of second via holes are disposed on the first power supply portion.

16. The display substrate according to claim 1, wherein: The non-display area is further provided with a first power line, wherein the first power line comprises: a transmission part and two first line-inlet parts respectively connected to the transmission part; The transmission part is located between the display area and the first power supply part, and the transmission part extends along the first direction; the two first incoming line parts are located on the side of the transmission part facing away from the display area, the first incoming line parts extend along the second direction, and at least part of the first incoming line parts is located in the incoming line packaging glue area.

17. The display substrate according to claim 16, wherein: A plurality of third via holes are arranged on a portion of the first line-inlet portion located in the line-inlet packaging glue area.

18. A display device comprising the display substrate according to any one of claims 1 to 17.

19. The display device according to claim 18, wherein: The display device further comprises a packaging cover plate arranged opposite to the display substrate, and the packaging cover plate and the display substrate are sealed by a frame sealant arranged in a packaging sealant area.

20. A method for manufacturing a display substrate, the display substrate comprising: A display area and a non-display area surrounding the display area, wherein the non-display area includes a packaging glue area surrounding the display area; The packaging glue area includes: a corner packaging glue area located on a first side of the display area, an incoming line packaging glue area and a first packaging glue area, wherein the first packaging glue area is located between the corner packaging glue area and the incoming line packaging glue area; the manufacturing method includes: Making a packaging base layer in the corner packaging glue area; A second power supply line, a gate driving circuit, and a plurality of first signal lines for providing signals to the gate driving circuit are formed in the non-display area; The second power line includes a power corner portion and a first power portion, the first power portion overlaps the first packaging glue area, and the first power portion extends along a first direction; The target portion of each of the first signal lines is at least located in the corner packaging glue area, and the target portion extends along the second direction; the first direction intersects with the second direction; the orthographic projection of the target portion on the base of the display substrate is located between the orthographic projection of the packaging base layer on the base and the orthographic projection of the first power supply portion on the base.

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