A jamming device

Abstract

The application discloses an interference device. The interference device comprises a shell, the inside of the shell has a receiving space, and the outside of the shell has a first containing groove on one side, wherein the first containing groove is used for placing an electronic device; an interference signal generating module is used for emitting a first sound wave signal into the first containing groove, wherein the first sound wave signal comprises at least two first sound wave signals with different frequencies; a detection module is arranged in the receiving space and is used for detecting whether the electronic device is placed in the first containing groove; and a processing module is arranged in the receiving space and is used for controlling whether the interference signal generating module emits the first sound wave signal into the first containing groove according to the detection result output by the detection module. By using the interference device with the structure, the electronic device placed in the first containing groove can be prevented from being eavesdropped and recorded.

Description

Technical Field

[0001] This application belongs to the field of interference technology for electronic devices, and specifically relates to an ultrasonic interference device. Background Technology

[0002] In some important meetings or conversations, people may use their mobile phones to record the content of the meeting or conversation, or their mobile phones may be remotely eavesdropped on. Speakers do not want their speeches to be recorded or eavesdropped on, and they do not want their personal privacy or trade secrets to be leaked.

[0003] Currently, there is no jamming device on the market that can hold a mobile phone and prevent it from being recorded or eavesdropped on.

[0004] Application content

[0005] To address the aforementioned problems, the purpose of this application is to provide an interference device capable of housing electronic devices and preventing them from being recorded or eavesdropped on.

[0006] This application provides an interference device, including:

[0007] The housing has an internal receiving space and a first receiving groove on one side of the outer side of the housing, wherein the first receiving groove is used to place an electronic device;

[0008] An interference signal generating module is used to emit a first sound wave signal into the first accommodating slot, wherein the first sound wave signal includes at least two first sound wave signals of different frequencies, and the at least two first sound wave signals of different frequencies can generate a second sound wave signal that can be heard by the human ear after being mixed.

[0009] A detection module, disposed in the receiving space, is used to detect whether an electronic device is placed in the first receiving slot; and

[0010] A processing module, disposed in the receiving space, is used to control whether the interference signal generating module emits the first acoustic signal into the first receiving slot according to the detection result output by the detection module.

[0011] In some embodiments, when the detection module detects that an electronic device is placed in the first accommodating slot, the detection module sends a corresponding detection signal to the processing module. The processing module controls the interference signal generating module to start sending the first sound wave signal to the first accommodating slot according to the detection signal. The at least two first sound wave signals with different frequencies can generate a second sound wave signal that can be heard by the human ear after mixing, so as to perform audio interference on the electronic device in the first accommodating slot.

[0012] In some implementations, when the detection module does not detect that an electronic device is placed in the first receiving slot, the interference signal generating module does not emit the first acoustic signal.

[0013] In some embodiments, the processing module includes a processing unit connected to the detection module, which is used to send at least two square wave signals of different frequencies to the interference signal generation module when the detection signal is received, so as to control the interference signal generation module to send the first acoustic wave signal.

[0014] In some embodiments, the processing unit includes any one or more of a processor or an oscillating circuit, the processor or the oscillating circuit being used to generate the at least two square wave signals with different frequencies.

[0015] In some embodiments, the processing module further includes a driving unit connected between the processing unit and the interference signal generation module, for amplifying the at least two square wave signals of different frequencies and outputting the amplified square wave signals to the interference signal generation module, so as to drive the interference signal generation module to output the at least two first acoustic wave signals of different frequencies into the first accommodating slot.

[0016] In some embodiments, the interference device further includes a power management module connected to the processing unit and the driving unit respectively. The power management module is used to output a first power supply voltage to the processing unit and a second power supply voltage to the driving unit. When the processing unit receives a detection signal from the detection module, it controls the power management module to start outputting the second power supply voltage to the driving unit so that the driving unit starts working.

[0017] In some implementations, when the detection module does not detect that an electronic device is placed in the first receiving slot, the power management module does not output the second power supply voltage to the drive unit.

[0018] In some embodiments, the power management module is used to receive power voltage from an external source through a charging interface and convert the external power voltage into a first power voltage. When the power management module is working, it provides the first power voltage to the processing unit, and when the processing unit receives the detection signal, it starts to provide the second power voltage to the driving unit.

[0019] In some embodiments, the interference signal generating module is placed in the receiving space, which is connected to the first receiving slot, and the first acoustic signal emitted by the interference signal generating module can be emitted from the receiving space into the first receiving slot.

[0020] In some embodiments, the interference signal generating module emits first acoustic signals from opposite sides of the first receiving slot along its length into the first receiving slot.

[0021] In some embodiments, the receiving space includes a second receiving slot, the number of which is at least one, and the second receiving slot is disposed next to the first receiving slot. The first receiving slot is connected to the second receiving slot, and the first acoustic signal emitted by the interference signal generating module is emitted from the second receiving slot into the first receiving slot.

[0022] In some embodiments, the second receiving groove is higher than the bottom surface of the first receiving groove in the height direction, the bottom surface being one side surface of the housing for supporting the electronic device.

[0023] In some embodiments, the interference signal generating module is disposed in the second accommodating slot, and the side of the interference signal generating module that emits the first acoustic signal faces the first accommodating slot.

[0024] In some embodiments, the receiving space includes two second receiving slots, respectively disposed on opposite sides of the first receiving slot, and each of the second receiving slots is provided with an interference signal generating module.

[0025] In some embodiments, each of the interference signal generating modules includes at least two interference signal generators, which are used to convert electrical signals into a first acoustic signal, wherein the first acoustic signal is an acoustic signal with a preset frequency.

[0026] In some embodiments, the first acoustic signal emitted by the interference signal generating module is an ultrasonic signal.

[0027] In some embodiments, the detection module includes a capacitive detection module, which detects whether an electronic device is placed in the first accommodating slot by means of self-capacitance or mutual capacitance.

[0028] In some embodiments, the capacitive detection module includes a capacitance detection circuit and a detection electrode. The detection electrode is used to form a detection capacitance with the electronic device, and the capacitance detection circuit is connected to the detection electrode to drive the detection electrode to perform capacitance sensing.

[0029] In some embodiments, the housing includes an upper shell and a lower shell, which cooperate to form the receiving space. The first receiving groove is formed on the upper outer side of the upper shell, and the detection electrode is disposed on the inner surface of the upper shell.

[0030] In some embodiments, the interference device further includes a motherboard disposed in the receiving space, located between the upper shell and the lower shell. The motherboard includes the capacitance detection circuit and the processing module. The detection electrode is disposed on a flexible circuit board. One end of the flexible circuit board with the detection electrode is disposed on the inner surface of the upper shell, and the other end of the flexible circuit board is connected to the capacitance detection circuit on the side of the motherboard facing the lower shell.

[0031] In some embodiments, the upper shell has second receiving grooves formed at opposite ends and on the inner side facing the lower shell, and the first receiving groove is located between the oppositely arranged second receiving grooves.

[0032] In some embodiments, the electronic device placed in the first receiving slot is a mobile phone, and the interference device is used to perform audio interference on a single mobile phone.

[0033] In some embodiments, each of the interference signal generating modules includes four interference signal generators, which respectively emit first acoustic wave signals of different frequencies.

[0034] In some embodiments, a plurality of through holes are provided between the first receiving groove and the second receiving groove, and the first acoustic signal is emitted from the second receiving groove through the plurality of through holes into the first receiving groove.

[0035] In some embodiments, the upper shell includes a substrate, a top plate, an inner sidewall, and an outer sidewall. The inner sidewall extends from the edge of the substrate in a direction opposite to the lower shell. The outer sidewall is located around the inner sidewall. The top plate extends above the substrate in a height direction opposite to the lower shell and is located on opposite sides of the substrate, connecting the inner sidewall and the outer sidewall. The top plate forms a second receiving groove in the space below the lower shell facing the lower shell, and the substrate forms a first receiving groove in the space above the lower shell facing away from the lower shell.

[0036] In some embodiments, the substrate, top plate, inner sidewall, and outer sidewall are an integral structure.

[0037] In some embodiments, the interference device further includes a wireless charging module, a first indicator unit, and a second indicator unit. When the power management module is connected to an external power supply voltage, the first indicator unit issues a first indicator state. When the wireless charging module is working, the first indicator unit switches the first indicator state to a second indicator state. The second indicator unit issues a third indicator state after the processing unit receives the detection signal from the detection module.

[0038] In some embodiments, the at least two first sound wave signals with different frequencies are sound wave signals that are inaudible to the human ear, and after mixing, they can generate a second sound wave signal that is audible to the human ear.

[0039] The interference device of this application can not only be used to place electronic devices, but also to prevent eavesdropping and recording of the placed electronic devices. Furthermore, by setting up the detection module, interference is only initiated when an electronic device is detected placed on the interference device, thus saving power consumption and extending the lifespan of related product components. Attached Figure Description

[0040] Figure 1 A three-dimensional structural schematic diagram of the first embodiment of the interference device provided in this application.

[0041] Figure 2 for Figure 1 An exploded view of the interference device shown.

[0042] Figure 3 for Figure 2 A schematic diagram of the outer structure of the upper shell of the interference device shown.

[0043] Figure 4 for Figure 2 A schematic diagram of the inner structure of the upper shell of the interference device shown.

[0044] Figure 5 for Figure 2 A schematic diagram of the back structure of the lower shell of the interference device shown.

[0045] Figure 6 for Figure 2 A three-dimensional structural diagram of the interference signal generation module of the interference device shown.

[0046] Figure 7 for Figure 2 An exploded view of the interference signal generation module of the interference device shown.

[0047] Figure 8 for Figure 2 A three-dimensional structural diagram of the interference signal generation module of the interference device shown from another angle.

[0048] Figure 9 for Figure 2 A schematic diagram of a portion of the interference device at an angle.

[0049] Figure 10 for Figure 2 A schematic diagram of part of the interference device shown from another angle.

[0050] Figure 11 for Figure 1 A schematic diagram showing an electronic device placed in the first receiving slot of the interference device.

[0051] Figure 12 This is a structural block diagram of one embodiment of the interference device 1 of this application.

[0052] Figure 13 This is a structural block diagram of another embodiment of the interference device 1.

[0053] Figure 14 This is a three-dimensional structural diagram of the second embodiment of the interference device of this application.

[0054] Figure 15 for Figure 14 A schematic diagram of the exploded structure of the interference device. Figure 16 This is a three-dimensional structural diagram of the upper shell of the interference device.

[0055] Figure 16 This is a three-dimensional structural diagram of the upper shell of the interference device.

[0056] Figure 17 This is a partial structural diagram of the interference signal generation module.

[0057] Figure 18 This is a three-dimensional structural diagram of the third embodiment of the interference device of this application.

[0058] Figure 19 for Figure 18 The diagram shows the explosive structure of the interference device.

[0059] Figure 20 for Figure 18 A three-dimensional structural diagram of the upper shell of the interference device shown.

[0060] Figure 21 for Figure 18 The diagram shows the structure of the pressure plate of the interference device.

[0061] Figure 22 for Figure 18 The diagram shows the structure of the support pad for the interference device.

[0062] Figure 23This is a three-dimensional structural diagram of the fourth embodiment of the interference device of this application.

[0063] Figure 24 for Figure 22 The diagram shows the explosive structure of the interference device.

[0064] Figure 25 for Figure 23 A three-dimensional structural diagram of the upper shell of the interference device shown.

[0065] Figure 26 This is an exploded view of the fifth embodiment of the interference device of this application. Detailed Implementation

[0066] The embodiments of this application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. In the description of this application, it should be understood that the terms "first" and "second" are used only for description and should not be construed as indicating or implying relative importance or implicitly specifying the number or order of the indicated technical features. Thus, technical features defined with "first" and "second" may explicitly or implicitly include one or more of the stated technical features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0067] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integrated connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Furthermore, the terms "vertical," "lateral," "longitudinal," "front," "rear," "left," "right," "up," "down," and "horizontal," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are merely for the convenience of describing this application. They do not imply that the device or component referred to must have a specific orientation or position, and therefore should not be construed as a limitation of this application. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0068] The following disclosure provides many different implementations or examples for different structures of this application. To simplify the disclosure, only specific examples of components and settings are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for the purpose of simplifying and clearly describing this application and does not in itself indicate a specific relationship between the various implementations and / or settings discussed. Moreover, the various specific processes and materials provided in the following description are merely examples for implementing the technical solutions of this application; however, those skilled in the art should recognize that the technical solutions of this application can also be implemented using other processes and / or other materials not described below.

[0069] Furthermore, the described features and structures can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced even without one or more of the specific details described, or with other structures, components, etc. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the focus of this application.

[0070] Firstly, this application primarily provides a novel jamming device with a first accommodating slot on one side of its outer casing. The first accommodating slot is used to house an electronic device. The casing of the jamming device has an internal receiving space for accommodating the electronic components of the jamming device. For example, the receiving space has a second accommodating slot located beside and connected to the first accommodating slot. An interference signal generating module of the jamming device is placed in the second accommodating slot. The interference signal generating module is used to emit a first signal towards the first accommodating slot to interfere with the electronic device. The electronic device is, for example, but not limited to, a mobile phone.

[0071] For example, but not limited to, the first signal includes at least two first sound wave signals of different frequencies, which, after mixing, can generate a second sound wave signal that is audible to the human ear, thereby enabling audio interference to be applied to an electronic device placed in the first receiving slot. The first sound wave signal may, for example, be a sound wave signal that is inaudible to the human ear.

[0072] The aforementioned novel jamming device can not only meet customized needs, but also interfere with specific electronic devices to achieve anti-recording and anti-eavesdropping functions.

[0073] Secondly, this application also provides an interference device with a detection module, wherein the detection module is used to detect whether an electronic device is placed in the first receiving slot of the interference device, and when an electronic device is detected in the first receiving slot, the processing module of the interference device controls the interference information generation module to send a first signal according to the detection result of the detection module.

[0074] Since the interference device has the detection module, the interference information generation module only starts to transmit the first signal when the detection module detects that an electronic device is placed in the first accommodating slot. Therefore, the power consumption of the interference device can be reduced, and the lifespan of the interference information generation module can also be extended.

[0075] This application describes various implementation methods for the aforementioned novel interference device and interference device with a detection module. The specific implementation methods of the interference device of this application are described below.

[0076] Please refer to the following: Figures 1 to 11 , Figure 1 A three-dimensional structural schematic diagram of the first embodiment of the interference device provided in this application. Figure 2 for Figure 1 The exploded view of the interference device shown is as follows. Figure 3 for Figure 2 A schematic diagram of the outer structure of the upper shell of the interference device shown. Figure 4 for Figure 2 A schematic diagram of the inner structure of the upper shell of the interference device shown. Figure 5 for Figure 2 A schematic diagram of the rear structure of the lower casing of the interference device shown. Figure 6 for Figure 2 A three-dimensional structural diagram of the interference signal generation module of the interference device shown. Figure 7 for Figure 2 An exploded view of the interference signal generation module of the interference device shown. Figure 8 for Figure 2 A three-dimensional structural diagram of the interference signal generation module of the interference device shown from another angle. Figure 9 for Figure 2 The diagram shows a partial structure of the interference device at one angle. Figure 10 for Figure 2 A schematic diagram of part of the interference device shown from another angle. Figure 11 for Figure 1The diagram shows an interference device with an electronic device placed in its first receiving slot. The interference device 1 includes a housing 10 and an interference signal generating module 20. The housing 10 has an internal receiving space 11, and a first receiving slot 12 on its external side. The first receiving slot 12 is connected to the receiving space 11, and is used to place an electronic device A. The interference signal generating module 20 is disposed in the receiving space 11. The interference signal generating module 20 is used to emit a first signal into the first receiving slot 12 to interfere with the electronic device A. The electronic device A is, for example, but not limited to, a mobile phone.

[0077] In some embodiments, the first signal may include, for example, at least two first sound wave signals of different frequencies, which, after mixing, can generate a second sound wave signal audible to the human ear. The second sound wave signal, generated after mixing and audible to the human ear, is used to interfere with the audio of the electronic device A. The first sound wave signal may be, for example, a sound wave signal that is not audible to the human ear. Specifically, the first sound wave signal may be, for example, but not limited to, a suitable sound wave signal such as ultrasound. However, alternatively, the first sound wave signal may also be, for example, a sound wave signal audible to the human ear.

[0078] Furthermore, the first signal generated by the interference signal generating module 20 is not limited to the first acoustic signal, but can also be other suitable signals, such as electromagnetic wave signals. As long as it can interfere with the electronic device A and achieve the function of preventing eavesdropping and recording, it should fall within the protection scope of this application.

[0079] It should be noted that in this application, the first signal is mainly used as an example of a first acoustic signal for illustration, but this should not be construed as a limitation of this application.

[0080] Since the housing 10 of the interference device 1 of this application has the first receiving slot 12, and the first receiving slot 12 is connected to the receiving space 11 inside the housing 10, the interference signal generating module 20 located in the receiving space 11 can emit a first signal into the first receiving slot 12 to interfere with the audio of the electronic device A in the first receiving slot 12, so that the electronic device A records only noise when recording, or the electronic device A cannot hear the voice signal of the conversation when it is remotely eavesdropped.

[0081] It should be noted that the interference device 1 will not affect the normal telephone access of the electronic device A in the first receiving slot 12. When the call is connected, the user needs to pick up the electronic device A to make a normal call.

[0082] Optionally, the housing 10 has recesses B on the sidewalls 132 that form opposite sides of the first receiving groove 12. The first receiving groove 12 communicates with the outside of the housing 10 through the recesses B. However, in some other embodiments, the number of recesses B may be one, that is, a recess B may be provided on one of the sidewalls 132.

[0083] The side wall 132 can block the electronic device A, so that the electronic device A is housed in the first receiving slot 12. The recessed part B allows the user to observe at any time whether the electronic device A is placed in the first receiving slot 12 for anti-eavesdropping and anti-recording treatment, avoiding the problem of omission. In addition, it also allows the user to observe the status of the electronic device A at any time.

[0084] Optionally, the recess B is located at the middle of each sidewall 132, and the sidewalls 132 with the recess B are located on opposite sides of the housing 10 in the width direction. Further optionally, the height of the sidewalls 132 gradually decreases from both ends towards the middle.

[0085] In some embodiments, the receiving space 11 of the housing 10 includes a second receiving slot 110, and there is at least one second receiving slot 110, which is disposed beside the first receiving slot 12 in the longitudinal direction. The first receiving slot 12 is connected to the second receiving slot 110. A first signal emitted by the interference signal generating module 20 is emitted from the second receiving slot 110 into the first receiving slot 12.

[0086] Preferably, the second receiving groove 110 is higher than the bottom surface F1 of the first receiving groove 12 in the height direction. The bottom surface F1 is one side surface of the housing 10 and is used to support the electronic device A.

[0087] In this embodiment, the interference signal generating module 20 is disposed in the second receiving slot 110, and the side of the interference signal generating module 20 used to emit the first signal faces the first receiving slot 12.

[0088] Optionally, the receiving space 11 includes two second receiving slots 110, respectively disposed on opposite sides of the first receiving slot 12 in the length direction, and each second receiving slot 110 is provided with one of the interference signal generating modules 20. However, alternatively, in some embodiments, the interference signal generator 201 for emitting the first signal in the interference signal generating module 20 may not be disposed in the second receiving slot 110, for example, but not limited to, the technical solution described in the fifth embodiment of this application. Furthermore, it is also possible that all the interference signal generating modules 20 are not placed in the second receiving slots 110, thus saving the second receiving slots 110, which is also acceptable.

[0089] Since the first receiving slot 110 is provided on opposite sides of the first receiving slot 12, the direction of the first signal emission can be increased, enabling audio interference to be performed on electronic device A from multiple angles. In addition, it also allows the user to be less restricted by the direction in which electronic device A is placed, thus improving the user experience.

[0090] Specifically, in this embodiment, the housing 10 includes an upper shell 13 and a lower shell 14. The upper shell 13 and the lower shell 14 cooperate to form the receiving space 11. The first receiving groove 12 is formed on the side of the upper shell 13 opposite to the lower shell 14.

[0091] Optionally, the upper shell 13 includes a substrate 131, a sidewall 132, and a top plate 133. The substrate 131 includes a first surface F1 and a second surface F2. The first surface F1 is the outer surface of the substrate 131, facing away from the lower shell 14. The second surface F2 is the inner surface of the substrate 131, facing the lower shell 14. The sidewall 132 is located around the periphery of the substrate 131 and extends above the first surface F1 in the direction facing away from the lower shell 14. The top plate 133 is located on at least one side of the substrate 131 and extends above the first surface F1 in the direction facing away from the lower shell 14; the top plate 133 is connected to the sidewall 132. A first receiving groove 12 is formed on the side of the substrate 131 facing away from the lower shell 14. A second receiving groove 110 is formed on the side of the top plate 133 facing the lower shell 14.

[0092] In this embodiment, the substrate 131, sidewall 132, and top plate 133 are an integral structure.

[0093] Optionally, the sidewall 132 of the upper shell 13 includes an inner sidewall 1321 and an outer sidewall 1322, with the outer sidewall 1322 located around the inner sidewall 1321. The inner sidewall 1321 extends upward from the substrate 131 in a direction opposite to the lower shell 14. The first surface F1 of the substrate 131 and the inner sidewall 1321 form the first receiving groove 12. The top plate 133 connects the inner sidewall 1321 and the outer sidewall 1322. The top plate 133, the outer sidewall 1322, and the inner sidewall 1321 form the second receiving groove 110.

[0094] Optionally, the outer sidewall 1322 includes a first portion B1 and a second portion B2 connected to each other. The first portion B1 is the part that protrudes above the first surface F1 in the direction opposite to the lower shell 14, and the second portion B2 is the part that protrudes above the second surface F2 in the direction facing the lower shell 14. The second portion B2 is used to cooperate with the lower shell 14 to form the receiving space 11. The first portion B1 is used to cooperate with the top plate 133 and the base plate 131 to form the first receiving groove 12 and the second receiving groove 110. In this embodiment, optionally, the lower shell 14 has no sidewalls. Of course, the lower shell 14 may also have sidewalls.

[0095] However, alternatively, in some embodiments, the outer sidewall 1322 does not have the second portion B2, and the lower shell 14 is correspondingly provided with a sidewall 149 extending toward the upper shell 13 to cooperate with the upper shell 13 to form the receiving space 11. For example, see the technical solution described in the third embodiment.

[0096] Optionally, in this embodiment, an opening K is provided on the inner sidewall 1321 between the first receiving groove 12 and the second receiving groove 110, so that the first receiving groove 12 and the second receiving groove 110 are connected. The interference signal generating module 20 is exposed at the opening K, and a partition 202 is provided on the interference signal generating module 20. The partition 202 includes a plurality of through holes K1 for emitting a first signal. Thus, the first signal emitted by the interference signal generating module 20 can be emitted from the second receiving groove 110 into the first receiving groove 12.

[0097] However, alternatively, in other embodiments, the inner sidewall 1321 has a plurality of through holes K1, and the interference signal generating module 20 is disposed behind the inner sidewall 1321. The interference signal generating module 20 may not have a partition 202 with a plurality of through holes K1, for example, see the technical solution described in the third embodiment.

[0098] Optionally, a positioning post 1101 is provided in the second receiving groove 110 to cooperate with the positioning hole 208 on the interference signal generating module 20, and after the screw 209 passes through the positioning hole 208, it cooperates with the locking hole in the positioning post 1101, thereby fixing the interference signal generating module 20 in the second receiving groove 110.

[0099] Optionally, the interference signal generating module 20 includes at least two interference signal generators 201 and a partition 202. The interference signal generators 201 are used to emit the first signal; for example, but not limited to, the interference signal generators 201 are used to convert an electrical signal into a first acoustic signal, the first acoustic signal being an acoustic signal with a preset frequency. The preset frequency is, for example, but not limited to, any value within the frequency range of 40 to 40.3 kHz. The partition 202 has multiple through holes K1. The partition 202 is exposed at the openings K. The first signal is emitted into the first receiving groove 12 through the multiple through holes K1 on the partition 202.

[0100] In this embodiment, each interference signal generating module 20 includes four interference signal generators 201, which are used to emit first acoustic wave signals of different frequencies. The first acoustic wave signal is, for example, but not limited to, an ultrasonic signal. The interference signal generator 201 is, for example, but not limited to, an ultrasonic transducer. However, in other embodiments, the number of interference signal generators 201 may be two, three, five, or even more. In addition, the first signal generated by the interference signal generator 201 is not limited to the first acoustic wave signal, but may be other suitable signals, such as electromagnetic wave signals, as long as they can interfere with the electronic device A and achieve the function of preventing eavesdropping and recording, they should fall within the protection scope of this application. In this application, the first signal is mainly described as the first acoustic wave signal, but it should not be construed as a limitation of this application.

[0101] Based on acoustic mixing technology, four interference signal generators 201 send first acoustic signals with frequencies of F1, F2, F3, and F4. These first acoustic signals with frequencies of F1, F2, F3, and F4 are acoustic signals that are inaudible to the human ear. These four first acoustic signals will generate a mixing effect at the microphone circuit of electronic device A, generating second acoustic signals with frequencies of |F1-F2|, |F1-F3|, |F1-F4|, |F2-F3|, |F2-F4|, and |F3-F4|. These second acoustic signals with frequencies of |F1-F2|, |F1-F3|, |F1-F4|, |F2-F3|, |F2-F4|, and |F3-F4| are acoustic signals that are audible to the human ear. Electronic device A will record these acoustic signals, while the actual voice conversation will be blocked, effectively protecting personal privacy.

[0102] In this application, two interference signal generation modules 20 are used. Each interference signal generation module 20 includes four interference signal generators 201, which simultaneously emit four first sound wave signals of different frequencies into the first accommodating slot 12. After generating a mixing effect at the microphone circuit of electronic device A, multiple second sound wave signals of different frequencies that can be heard by the human ear are generated, thus achieving a better audio interference effect on electronic device A.

[0103] Please refer to the details together. Figures 6 to 8 Optionally, the interference signal generating module 20 further includes a sub-board 205, a positioning frame 203, and a mesh 204. The at least two interference signal generators 201 are disposed on the sub-board 205 and electrically connected to it. The sub-board 205 is, for example, but not limited to, a printed circuit board. The positioning frame 203 includes at least two through holes K2. Each interference signal generator 201 is disposed in one of the through holes K2 in the positioning frame 203. The positioning frame 203 is located on the side of the partition 202 opposite to the first receiving groove 12. The mesh 204 is disposed between the partition 202 and the positioning frame 203.

[0104] The interference signal generating module 20 is an independent modular structure, which is convenient to install and disassemble. The partition 202 is made of metal, which has a good appearance. The positioning frame 203 and the mesh screen 204 not only prevent users from directly viewing the internal structure of the interference signal generator 201 and the sub-board 205, but also serve to prevent dust and improve aesthetics.

[0105] In some embodiments, one or more of the partition 202, positioning frame 203, and mesh screen 204 may be omitted.

[0106] Alternatively, in this embodiment, the side of the interference signal generator 201 that emits the first signal is positioned directly opposite the first receiving slot 12.

[0107] However, alternatively, in some other embodiments, the side of the interference signal generator 201 used to emit the first signal may also be directed towards the centerline L-L' of the first receiving groove 12 along its length (see...). Figure 17 The interference signal generator 201 is tilted, with the tilt angle ranging from, but not limited to, 15 degrees to 30 degrees. This increases the radiation range of the first signal, prevents dead zones, and, in addition, the superposition of the first signals can increase the amplitude of the first signal and concentrate its energy. Optionally, the tilt angle is, for example, 15 degrees. That is, the interference signal generator 201 is tilted along the center line L1-L1' in the height direction (see...). Figure 17 The acute angle between the first receiving groove 12 and its centerline L-L' along the length direction is 15 degrees. For example, see... Figure 17 The technical solution shown is as follows. It should be noted that, in order to better illustrate the tilt angle, the center line L-L' of the first receiving groove 12 along the length direction has been translated accordingly.

[0108] Optionally, the upper shell 13 further includes a groove 135 on the first surface F1. A support structure 136 is provided within the groove 135. The support structure 136 serves to support and / or prevent slippage of the electronic device A placed in the first receiving groove 12.

[0109] The support structure 136 includes a support pad 1361. Optionally, a slit is formed in the support pad 1361. The slit can, for example, allow the first acoustic signal to pass through, thereby achieving audio interference to the microphones in various directions of the electronic device A. The support pad 1361 has a awn-like structure (see...). Figure 22 The first signal can pass through the gaps in the awn structure or the rubber pad. For example, if the awn structure is arranged in an array, the first signal will pass through more effectively, thus achieving a better interference effect on electronic device A. The awn structure provides support and balance for electronic device A and is suitable for electronic devices A with different bottom shapes (such as a protruding or non-protruding rear lens). The awn structure has friction, which helps to fix the recording device.

[0110] Alternatively, the number of grooves 135 is two, respectively disposed at both ends of the first surface F1.

[0111] For example, but not limited to, the thickness of the portion of the central region of the substrate 131 where the groove 135 is not provided is the same as the thickness of the region of the substrate 131 where the groove 135 is provided.

[0112] Optionally, the interference device 1 further includes a wireless charging module 40 for wirelessly charging the electronic device A.

[0113] Optionally, a third receiving groove 134 is provided on the second surface F2 of the substrate 131 in the central region where the groove 135 is not provided, for accommodating the coil 401 of the wireless charging module 40. This makes the interference device 1 more compact and thinner.

[0114] In this embodiment, a plurality of first positioning posts Z1 and a plurality of second positioning posts Z2 are further formed on the second surface F2 of the substrate 131. The plurality of second positioning posts Z2 are located in the central region of the second surface F2. The plurality of first positioning posts Z1 are located in the two end regions of the second surface F2. The height of the plurality of first positioning posts Z1 is less than the height of the plurality of second positioning posts Z2. The plurality of first positioning posts Z1 have locking holes K3. The lower shell 14 is provided with a plurality of through holes 142. When the upper shell 13 and the lower shell 14 are installed, screws 145 are inserted into the through holes 142 on the lower shell 14 and locked and fixed with the locking holes K3.

[0115] Optionally, a protrusion 143 is formed on the surface of the lower shell 14 facing the upper shell 13. When the lower shell 14 and the upper shell 13 are installed together, the plurality of first positioning posts Z1 and the plurality of second positioning posts Z2 all abut against the protrusion 143, and a limiting groove 144 is formed above the through hole 142 of the lower shell 14. The opening diameter of the limiting groove 144 is larger than the opening diameter of the through hole 142 of the lower shell 14. The limiting groove 144 is used to receive the end of the first positioning post Z1.

[0116] Optionally, a groove (not shown) is provided on the side of the lower shell 14 opposite to the upper shell 13. A through hole 142 on the lower shell 14 extends into the groove. An anti-slip pad 146 is provided in the groove to prevent slippage when the interference device 1 is placed flat on an object such as a table.

[0117] In this embodiment, the interference device 1 further includes a main board 30 located between the upper shell 13 and the lower shell 14. The main board 30 is electrically connected to the sub-board 205 and is used to drive the interference signal generating module 20 to emit a first signal. The edge region of the main board 30 includes multiple through holes 300. The multiple first positioning posts Z1 and the multiple second positioning posts Z2 are respectively used to pass through the through holes 300 on the main board 30 and abut against the lower shell 14.

[0118] Optionally, a plurality of locking structures 138 are further formed on the second surface F2 of the substrate 131, located around the plurality of second positioning posts Z2, and the locking structures 138 are used to fix the motherboard 30.

[0119] For example, but not limited to, the locking structure 138 is a protruding structure, and a hook G is formed at one end away from the substrate 131. The hook G is used to fasten the motherboard 30 onto the substrate 131.

[0120] In this embodiment, the length of the jamming device 1 is, for example, no more than 22 cm, and the width is, for example, no more than 12 cm. The jamming device 1 can, for example, only jam a single mobile phone. In other words, the jamming device 1 can only jam one mobile phone at a time. However, alternatively, in other embodiments, the jamming device 1 can be of other suitable sizes and capable of jamming multiple electronic devices.

[0121] The interference device 1 described in this application is a novel interference device with a completely new structure. It can place an electronic device A on it and interfere with the electronic device A to meet different customized needs. It can also interfere with a specific electronic device A to achieve the functions of preventing recording and eavesdropping.

[0122] It should be noted that the interference device 1 with the novel structure described above is not limited to the form described in the specific embodiments above, and may also have other variations. Any technical solutions of various embodiments that can be easily conceived by those skilled in the art based on the technical content described in this application should fall within the protection scope of this application.

[0123] Through extensive analysis and research, the inventors discovered that if the interference signal generator 201 of the interference device 1 is in a prolonged operating state, it will cause both power consumption loss and a shortened lifespan. Furthermore, users are unsure whether the electronic device A is performing its interference function after being placed in the first receiving slot 12. Based on this, the inventors creatively proposed a further solution: adding a detection module 50 to the interference device 1. The detection module 50 is located in the receiving space 11 and is used to detect whether the electronic device A is placed in the first receiving slot 12. The processing module 302 of the interference device 1 controls whether the interference signal generator 20 starts operating, i.e., whether it starts transmitting a first signal to the first receiving slot 12, based on the detection result of the detection module 50.

[0124] Specifically, when the detection module 50 detects that electronic device A is placed in the first receiving slot 12, the detection module 50 outputs a corresponding detection signal to the processing module 302, and the interference signal generating module 20, under the drive and control of the processing module 302, begins to emit a first signal into the first receiving slot 12. Optionally, when the detection module 50 does not detect that electronic device A is placed in the first receiving slot 12, the interference signal generating module 20 does not work. Thus, the interference device 1 not only reduces power consumption but also extends its lifespan. In addition, an indicator module 60 can be added to the interference device 1. When the detection module 50 detects that electronic device A is placed in the first receiving slot 12, the processing module 302 controls the indicator module 60 to issue a corresponding prompt, so that the user can clearly know that the interference device 1 is in an audio interference state.

[0125] Please refer to further details. Figure 12 , Figure 12 This is a structural block diagram of one embodiment of the interference device 1 of this application. The processing module 302 includes a processing unit 3021, which is connected to the detection module 50. The processing unit 3021 is used to send a second signal to the interference signal generation module 20 when the detection signal is received, thereby controlling the interference signal generation module 20 to send the first signal. In this embodiment, the processing unit 3021 sends four second signals with frequencies F1, F2, F3, and F4, respectively. The second signals are, for example, square wave signals. The frequencies F1, F2, F3, and F4 are different from each other. However, in other embodiments, the processing unit 3021 may send two, three, five, or more second signals with different frequencies. The second signals may also be suitable signals such as sine wave signals; this application does not limit this.

[0126] Optionally, the processing unit 3021 includes any one or more of a processor or an oscillation circuit, wherein the processor or the oscillation circuit is used to generate the four second signals with different frequencies. Regardless of whether it is done through software, hardware, or a combination of both, all technical solutions capable of generating multiple second signals with different frequencies should fall within the protection scope of this application, and are not limited to the processor or oscillation circuit described herein.

[0127] Optionally, the processing module 302 further includes a driving unit 3022, which is connected between the processing unit 3021 and the interference signal generation module 20. The driving unit 3022 is used to amplify the four second signals with different frequencies and output the amplified second signals to the interference signal generation module 20, so as to drive the interference signal generation module 20 to output the four first signals with different frequencies into the first accommodating slot 12.

[0128] The motherboard 30 includes a circuit board 301, a processing module 302, a charging interface 303, a wireless charging driver circuit 304, a capacitor detection circuit 305, and a power management module 306. The charging interface 303 is located on the end of the circuit board 301 facing the upper shell 13. The processing module 302, the wireless charging driver circuit 304, the capacitor detection circuit 305, and the power management module 306 are located on the surface of the circuit board 301 facing away from the upper shell 13. However, this application does not limit the position of the components on the circuit board 301; for example, the processing module 302 may also be located on the surface of the circuit board 301 facing the upper shell 13.

[0129] It should be further explained that the processing module 302, wireless charging drive circuit 304, capacitor detection circuit 305, and power management module 306, etc., are in Figure 2 and Figure 10 The image shown is only represented by a box and does not depict the actual product form.

[0130] The detection module 50 includes a detection electrode 501 and a capacitance detection circuit 305. The detection electrode 501 is used to form a detection capacitance with the electronic device A. Optionally, the detection electrode 501 is disposed on the inner surface of the upper shell 13. The capacitance detection circuit 305 is used to drive the detection electrode 501 to perform capacitance sensing. For example, but not limited to, the detection module 50 achieves capacitance sensing by detecting self-capacitance or mutual capacitance. When the shell of the electronic device A is metal, the metal can interact with the detection electrode 501 to form a detection capacitance. When the shell of the electronic device A is not metal, the conductors inside the electronic device A interact with the detection electrode 501 to form a detection capacitance.

[0131] The detection electrode 501 is disposed, for example, on the inner surface of the upper shell 13 by means of attachment or other fixed method. The detection electrode 501 is, for example, but not limited to, a suitable conductive material such as copper sheet. The detection electrode 501 is connected to the capacitance detection circuit 305, for example, by a wire.

[0132] By adopting the above-mentioned capacitive detection method, the electronic device A can be detected relatively easily and with high detection accuracy. In addition, there is no need to make special selections for the material of the housing 10, as long as the material of the housing 10 is insulating.

[0133] However, through extensive experiments and research, the inventors discovered that the wires are prone to breakage during product installation and use, causing technical problems such as affecting product quality stability. Therefore, the inventors creatively proposed a new technical solution. This involves fabricating the detection electrode 501 on a flexible circuit board 502. One end of the flexible circuit board 502 with the detection electrode 501 is located on the inner surface of the upper shell 13, and the other end is connected to the capacitance detection circuit 305 on the side of the main board 30 facing the lower shell 14. The flexible circuit board 502 is more stable during product installation and use, and less prone to breakage, thereby improving the quality stability of the interference device 1.

[0134] The wireless charging module 40 includes the coil 401 and the wireless charging drive circuit 304. The wireless charging drive circuit 304 is electrically connected to the coil 401, and the two cooperate to achieve wireless charging of the electronic device A. The wireless charging module 40 can also be omitted in the interference device 1.

[0135] The processing module 302 is electrically connected to the interference signal generating module 20, the detection module 50, the power management module 306, and the indicator module 60, respectively. The power management module 306 is electrically connected to the charging interface 303, the detection module 50, and the wireless charging module 40, respectively. The power management module 306 receives an external power voltage through the charging interface 303 and converts the received external power voltage into a first power voltage. When operating, the power management module 306 provides the first power voltage to the processing unit 3021, and when the processing unit 3021 receives the detection signal, it begins to provide a second power voltage to the driving unit 3022, so that the driving unit 3022 starts working. The first power voltage is, for example, but not limited to, 3.3V, and the second power voltage is, for example, but not limited to, 12V.

[0136] When the detection module 50 does not detect that there is an electronic device A placed in the first receiving slot 12, the power management module 306 will not output the second power supply voltage to the drive unit 3022. This achieves the purpose of saving power consumption.

[0137] The power management module 306 is also used to provide a third power supply voltage to the wireless charging drive circuit 304. The third power supply voltage is, for example, but not limited to, 12V.

[0138] Optionally, the indicator module 60 includes a first indicator unit 601 and a second indicator unit 602. The first indicator unit 601 and the second indicator unit 602 are, for example, but not limited to, suitable indicator elements such as LEDs or displays. In this embodiment, the first indicator unit 601 is a power indicator, and the second indicator unit 602 is a working indicator. When the power management module 306 is connected to an external power supply, the first indicator unit 601 illuminates as a red light. When the wireless charging module 40 is working, the first indicator unit 601 switches from a red light to a blue light, that is, it switches from a first indicator state (e.g., but not limited to a red light) to a second indicator state (e.g., but not limited to a blue light).

[0139] The second indicator unit 602 issues a third indicator state after the processing unit 3021 receives the detection signal from the detection module 50, such as, but not limited to, a green light. When the detection module 50 does not detect that electronic device A is placed in the first receiving slot 12, the second indicator unit 602 issues a fourth indicator state, such as, but not limited to, an off state or a red light.

[0140] By setting the indicator module 60 and controlling the indicator module 60 to issue corresponding indicator states according to the detection results of the detection module 50, the user can clearly understand the various working states of the interference device 1.

[0141] Optionally, the indicator module 60 is disposed on a sub-board 205 of the signal interference generation module 20, and the indicator module 60 and the interference signal generator 201 are respectively disposed on opposite sides of the sub-board 205. The indicator module 60 is disposed adjacent to the charging interface 303, and the upper shell 13 is provided with openings K10 at positions corresponding to the indicator module 60 and the charging interface 303, respectively.

[0142] Because the interference device 1 of this application further includes a detection module 50, and when the detection module 50 detects that an electronic device A is placed in the first receiving slot 12, the interference signal generating module 20 of the interference device 1, for example, starts to emit four first sound wave signals of different frequencies into the first receiving slot 12 to interfere with the audio of the electronic device A, thereby achieving the function of preventing recording and eavesdropping. In this way, not only can power consumption be saved, but product lifespan can also be extended.

[0143] The detection technology solution of adding the detection module 50 described above is not limited to the interference device 1 with the novel structure described above, but can also be applied to interference devices with other embodiments or other structures. For example, the housing space of the interference device does not include a second receiving slot for accommodating the interference signal generation module, and the interference device includes another independent housing space for accommodating the interference signal generation module. Interference devices with such structures can all incorporate this detection technology solution of the detection module 50. Therefore, all modifications and embodiments that are easily conceived by those skilled in the art based on the core technical concept of this application should fall within the protection scope of this application.

[0144] Please continue reading. Figure 12 Optionally, the interference device 1 further includes a rechargeable battery 70, which is disposed, for example, between the motherboard 30 and the lower casing 14. The rechargeable battery 70 is capable of storing electrical energy, so that it can be used for power supply when there is no external power supply voltage.

[0145] Please see Figure 13 , Figure 13 This is a structural block diagram of another embodiment of the interference device 1. Figure 12 The main difference in the implementation method is that, in this implementation method, the interference device 1 does not include the detection module 50. Accordingly, when the interference device 1 is working, the power management module 306 continuously provides a first power supply voltage to the processing unit 3201 and continuously provides a second power supply voltage to the driving unit 3022, which is also possible. Figure 13 and Figure 12 The working relationship of the parts that are the same or similar in the implementation method will not be described again here.

[0146] Please see Figures 14 to 17 , Figure 14 This is a three-dimensional structural diagram of the second embodiment of the interference device of this application. Figure 15 for Figure 14 A schematic diagram of the exploded structure of the interference device. Figure 16 This is a three-dimensional structural diagram of the upper shell of the interference device. Figure 17 This is a partial structural diagram of the interference signal generation module. The interference device 2 has the same main structure as the interference device 1, and the similar or identical parts will not be described in detail here. The main differences between the two are described below.

[0147] First, the detection module 50 is an infrared detection module. The infrared detection module is disposed in the receiving space 11 and is used to emit infrared rays into the first receiving slot 12 and receive infrared rays returned from the first receiving slot 12, in order to detect whether electronic device A is placed in the first receiving slot 12. The processing module (not shown) is used to control whether the interference signal generating module 20 sends a first signal to the first receiving slot 12 according to the detection result output by the infrared detection module.

[0148] When the infrared detection module detects that an electronic device A is placed in the first accommodating slot 12, the infrared detection module sends a corresponding detection signal to the processing module. The processing module controls the interference signal generation module 20 to start sending the first signal to the first accommodating slot 12 according to the detection signal, so as to interfere with the electronic device A in the first accommodating slot 12.

[0149] Optionally, an infrared transmission plate 139 is provided on the housing 10 in the area corresponding to the infrared detection module. For example, but not limited to, the infrared transmission plate 139 is provided in the middle area of ​​the upper housing 13. The infrared transmission plate 139 is capable of transmitting infrared light. Optionally, the infrared detection module includes, for example, an infrared emitting device (not shown) and an infrared receiving device (not shown). The infrared light emitted by the infrared emitting device passes through the infrared transmission plate 139 and enters the first receiving slot 12. The infrared receiving device receives the infrared light returning from the first receiving slot 12 through the infrared transmission plate 139 and converts the received infrared light into a corresponding electrical signal to detect whether an electronic device A is placed in the first receiving slot 12.

[0150] Second, the third receiving slot 134 for accommodating the coil 401 of the wireless charging module 40 in the interference device 2 is disposed on the main board 30. Optionally, the third receiving slot 134 is directly opposite the infrared transmission plate 139. However, alternatively, the third receiving slot 134 may also be disposed on one side of the inner surface of the upper shell 13.

[0151] Optionally, the infrared detection module is disposed on the surface of the coil 401 of the wireless charging module 40 facing the infrared transmission plate 139. For example, the infrared detection module is located at the center of the coil 401 of the wireless charging module 40.

[0152] Third, the interference signal generating module 20 does not have a positioning frame 203 and a mesh screen 204, and the side of the interference signal generator 201 used to emit the first acoustic signal is tilted towards the center line L-L' of the first receiving groove 12 along its length direction. The tilt angle range is, for example, but not limited to, 15 degrees to 30 degrees. The tilt angle can be, for example, 15 degrees. That is, the acute angle between the center line L1-L1' of the interference signal generator 201 along its height direction and the center line L-L' of the first receiving groove 12 along its length direction is 15 degrees. It should be noted that, in order to better illustrate the tilt angle, the center line L-L' of the first receiving groove 12 along its length direction has been translated accordingly. However, the structure of the interference signal generating module 20 of the interference device 2 can be exactly the same as the structure of the interference signal generating module 20 of the interference device 1.

[0153] However, alternatively, the interference signal module 20 can also adopt the structure of the interference signal module 20 in the interference device 1, which is also acceptable.

[0154] Please see Figures 18 to 22 , Figure 18 This is a three-dimensional structural diagram of the third embodiment of the interference device of this application. Figure 19 for Figure 18 The diagram shows the explosive structure of the interference device. Figure 20 for Figure 18 A three-dimensional structural diagram of the upper shell of the interference device shown. Figure 21 for Figure 18 The diagram shows the structure of the pressure plate of the interference device. Figure 22 for Figure 18 The diagram shows the structure of the support pad for the interference device. The interference device 3 has a largely similar structure to interference device 1; similarities and differences will not be elaborated further. The main differences between the two are described below.

[0155] First, structurally, the inner wall 1321 of the upper shell 13 does not have the opening K, but rather a plurality of through holes K1. The interference signal generating module 20 is located behind the inner wall 1321. Furthermore, the outer wall 1322 does not include the second part B2 (see...). Figure 3 The lower shell 14 includes a base 148 and sidewalls 149 extending from the base 148 toward the upper shell 13. The sidewalls 149 of the lower shell 14 match the outer sidewalls 1322 of the upper shell 13 to form the receiving space 11.

[0156] Second, the detection module 50 is a mechanical detection module. The mechanical detection module includes a mechanical switch 505, disposed on the surface of the motherboard 30 facing the upper shell 13. The number of mechanical switches is at least one. In this embodiment, the number of mechanical switches 505 is two. Of course, the number of mechanical switches 505 can also be three, four, or even more.

[0157] Third, an opening K4 is formed in the groove 135 of the upper shell 13, extending into the receiving space 11. A support structure 136 is provided in the groove 135, and a protrusion T is provided on the support structure 136 facing the opening K4. The protrusion T is used to press and trigger the mechanical switch 505 when an electronic device A is placed in the first receiving groove 12. Optionally, the support structure 136 includes a support pad 1361 and a pressure plate 1362, and the protrusion T is provided on the pressure plate 1362 facing the opening K4. Further optionally, the mechanical switch 505 is located in the opening K4 and has a predetermined distance from the protrusion T.

[0158] Fourth, the pressure plate 1362 has four positioning posts Z5 further formed on the side surface facing the lower shell 14. Positioning holes K5 are formed in the groove 135 to mate with the four positioning posts Z5. A screw 1363 passes through the positioning holes K5 and locks with the locking holes in the positioning posts Z5, thereby fixing the support structure 136 in the groove 135. Optionally, the support structure 136 can move up and down relative to the groove 135.

[0159] During operation, the processing module 302 controls the interference signal generating module 20 to send the first signal to the first receiving slot 12 based on whether the mechanical switch 505 is triggered by the protrusion T. When the mechanical switch 505 is triggered by the protrusion T of the pressure plate 1362, the detection module 50 detects that electronic device A is placed in the first receiving slot 12 and sends a corresponding detection signal to the processing module 302. The processing module 302 then controls the interference signal generating module 20 to start sending the first signal to the first receiving slot 12 based on the detection signal, in order to interfere with electronic device A in the first receiving slot 12.

[0160] Preferably, the support pad 1361 has a wheat awn structure, and the channels in the wheat awn structure are capable of transmitting the first signal. The wheat awn structure is, for example, but not limited to, a wheat awn array structure.

[0161] In this embodiment, when the electronic device A is placed in the first receiving slot 12, the pressing trigger of the protrusion T on the mechanical switch 505 is a positive pressure trigger.

[0162] Please see Figures 23 to 25 , Figure 23 This is a three-dimensional structural diagram of the fourth embodiment of the interference device of this application. Figure 24 for Figure 22 The diagram shows the explosive structure of the interference device. Figure 25 for Figure 23 The diagram shows a three-dimensional structural representation of the upper shell of the interference device. The interference device 4 has a largely similar structure to interference device 1; any similarities or differences will not be elaborated upon here. The main differences between the two are described below.

[0163] First, the detection module 50 is a mechanical detection module. The mechanical detection module includes a mechanical switch 505, disposed on the surface of the motherboard 30 facing the upper shell 13. The number of mechanical switches 505 is at least one. In this embodiment, the number of mechanical switches 505 is four. Of course, the number of mechanical switches 505 can also be two, three, or even more.

[0164] Second, the upper shell 13 has openings K8 at the bottom of both ends of the first receiving groove 12, and a support structure 136 rotatably connected to the upper shell 13 is formed on one side of the opening K8, the support structure 136 covering the opening K8. The support structure 136 has a protrusion (not shown) on the surface facing the lower shell 14, the protrusion being used to press and trigger the mechanical switch 505 when an electronic device A is placed in the first receiving groove 12.

[0165] Optionally, the support structure 136 includes a support pad 1361 and a pressure plate 1362. The pressure plate 1362 is located between the opening K8 and the support pad 1361, and is rotatably connected to the upper shell 13. Preferably, the pressure plate 1362 is hinged at the opening K8 and rotatably connected to the upper shell 13, i.e., a pivot connection. The pressure plate 1362 has a protrusion facing the opening K8, which is used to press and trigger the mechanical switch 505 when electronic device A is placed in the first receiving groove 12. Optionally, the support pad 1361 provides support and / or anti-slip for electronic device A. Preferably, the support pad 1361 has a awn structure, and the gaps in the awn structure can transmit a first signal. The awn structure is, for example, but not limited to, an awn array structure.

[0166] During operation, the processing module 302 controls the interference signal generating module 20 to send the first signal to the first receiving slot 12 based on whether the mechanical switch 505 is pressed and triggered. When the mechanical switch 505 is pressed and triggered by the protrusion of the pressure plate 1362, the detection module 50 detects that electronic device A is placed in the first receiving slot 12 and sends a corresponding detection signal to the processing module 302. The processing module 302 then controls the interference signal generating module 20 to start sending the first signal to the first receiving slot 12 based on the detection signal, so as to interfere with electronic device A in the first receiving slot 12.

[0167] In this embodiment, when the electronic device A is placed in the first receiving slot 12, the pressing trigger of the protrusion T on the mechanical switch 505 is a slanted pressing trigger, similar to the principle of a guillotine.

[0168] Please see Figure 26 , Figure 26 This is an exploded view of the fifth embodiment of the interference device of this application. The interference device 5 has a generally similar structure to the interference device 1, and the similarities between the two will not be described again here. The main differences between the two are described below.

[0169] First, the interference signal generating module 20 includes an interference signal generator 201, a partition 202, and a reflective structure 206. The partition 202 is exposed at the opening K of the inner sidewall 1321. The reflective structure 206 is disposed in the second receiving groove 110 and located behind the partition 202.

[0170] Second, the interference signal generator 201 is disposed on one end surface of the motherboard 30 facing the second receiving slot 110. The interference signal generator 201 emits a first signal into the second receiving slot 110, which is reflected by the reflecting structure 206 and then emitted into the first receiving slot 12.

[0171] Optionally, the reflective structure 206 has an inclined portion 2061, which allows a first signal incident thereon to exit toward the first receiving groove 12.

[0172] In this embodiment, the reflection structure 206 is provided in the second accommodating groove 110, which allows the interference signal generator 201 to be mounted on the motherboard 30. The height of the reflection structure 206 can be less than the height of the interference signal generating module 20. Therefore, the height of the second accommodating groove 110 can be reduced accordingly, thereby reducing the overall thickness of the interference device 5.

[0173] In the embodiments described above, the features and structures can be combined in any suitable manner in one or more implementations. Those skilled in the art will readily conceive of combining the technical solutions of different embodiments to obtain more embodiments based on the embodiments described above. For example, the housing 10 structure of the interference device 3 in the third embodiment can also be applied to other implementations.

[0174] It should be reiterated that the focus of this application is:

[0175] First, this application provides a novel interference device 1, 2, 3, 4, 5, the overall structure of which is not found in the prior art;

[0176] Secondly, this application also provides an interference device with a detection module 50. The structure of the interference device with detection function is not limited to the new interference devices 1, 2, 3, 4, and 5 described in this application. It can also be other suitable interference devices. All feasible embodiments that can detect whether an electronic device A is placed on the interference device and, when the electronic device A is detected, the processing module 302 starts to control the interference signal generation module 20 to send a first signal to interfere with the electronic device should fall within the protection scope of this application.

[0177] In the above embodiments, the interference devices 1, 2, 3, 4, and 5 can all use acoustic interference to achieve the function of preventing eavesdropping and recording on electronic device A, or they can use any other suitable interference method such as electromagnetic interference. Therefore, the first signal is not limited to the first acoustic signal, but can also be any other suitable signal such as an electromagnetic signal. That is, in addition to using audio interference, electromagnetic interference or other methods can also be used to achieve the effect of preventing eavesdropping and recording on electronic device A.

[0178] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An interference device, characterized in that, include: The housing has an internal receiving space and a first receiving groove on one side of the outer side of the housing, wherein the first receiving groove is used to place an electronic device; An interference signal generating module is used to send a first sound wave signal to the first accommodating slot, wherein the first sound wave signal includes at least two first sound wave signals of different frequencies, and the at least two first sound wave signals of different frequencies are mixed to generate a second sound wave signal that can be heard by the human ear, and the second sound wave signal is a difference frequency signal generated by the two first sound wave signals of different frequencies. A detection module, disposed in the receiving space, is used to detect whether an electronic device is placed in the first receiving slot; and A processing module, disposed in the receiving space, is used to control whether the interference signal generating module emits the first acoustic signal into the first receiving slot according to the detection result output by the detection module. The interference signal generation module includes at least two interference signal generators, each of which is used to emit the first acoustic signal, and the frequencies of the first acoustic signals emitted by the two interference signal generators are different; the first acoustic signal is an ultrasonic signal; and the two interference signal generators are located on the same side of the first accommodating slot.

2. The interference device as described in claim 1, characterized in that, When the detection module detects that an electronic device is placed in the first accommodating slot, the detection module sends a corresponding detection signal to the processing module. The processing module controls the interference signal generating module to start sending the first sound wave signal to the first accommodating slot according to the detection signal. The at least two first sound wave signals with different frequencies can generate a second sound wave signal that can be heard by the human ear after mixing, so as to perform audio interference on the electronic device in the first accommodating slot.

3. The interference device as described in claim 2, characterized in that, When the detection module does not detect that there is an electronic device placed in the first accommodating slot, the interference signal generating module will not emit the first acoustic signal.

4. The interference device as described in claim 2, characterized in that, The processing module includes a processing unit connected to the detection module. The processing unit is used to send at least two square wave signals with different frequencies to the interference signal generation module when the detection signal is received, so as to control the interference signal generation module to send the first acoustic wave signal.

5. The interference device as described in claim 4, characterized in that, The processing unit includes any one or more of a processor or an oscillation circuit, wherein the processor or the oscillation circuit is used to generate the at least two square wave signals with different frequencies.

6. The interference device as described in claim 4, characterized in that, The processing module further includes a driving unit connected between the processing unit and the interference signal generation module. The driving unit is used to amplify the at least two square wave signals with different frequencies and output the amplified square wave signals to the interference signal generation module, so as to drive the interference signal generation module to output the at least two first acoustic wave signals with different frequencies into the first accommodating slot.

7. The interference device as described in claim 6, characterized in that, The interference device further includes a power management module, which is connected to the processing unit and the driving unit respectively. The power management module is used to output a first power supply voltage to the processing unit and a second power supply voltage to the driving unit. When the processing unit receives a detection signal from the detection module, it controls the power management module to start outputting the second power supply voltage to the driving unit so that the driving unit starts to work.

8. The interference device as described in claim 7, characterized in that, When the detection module does not detect that there is an electronic device placed in the first accommodating slot, the power management module will not output the second power supply voltage to the drive unit.

9. The interference device as described in claim 7, characterized in that, The power management module is used to receive power voltage from an external source through a charging interface and convert the external power voltage into a first power voltage. When the power management module is working, it provides the first power voltage to the processing unit, and when the processing unit receives the detection signal, it starts to provide the second power voltage to the driving unit.

10. The interference device as claimed in claim 1, characterized in that, The interference signal generating module is placed in the receiving space, which is connected to the first receiving slot. The first acoustic signal emitted by the interference signal generating module can be emitted from the receiving space into the first receiving slot.

11. The interference device as described in claim 10, characterized in that, The interference signal generating module emits first acoustic signals from opposite sides of the first accommodating slot along its length into the first accommodating slot.

12. The interference device as described in claim 10, characterized in that, The receiving space includes a second receiving slot, and there is at least one second receiving slot, which is located next to the first receiving slot. The first receiving slot is connected to the second receiving slot, and the first acoustic signal emitted by the interference signal generating module is emitted from the second receiving slot into the first receiving slot.

13. The interference device as described in claim 12, characterized in that, The second receiving groove is higher than the bottom surface of the first receiving groove in the height direction. The bottom surface is one side surface of the housing and is used to support the electronic device.

14. The interference device as described in claim 13, characterized in that, The interference signal generating module is disposed in the second accommodating slot, and the side of the interference signal generating module that emits the first acoustic signal faces the first accommodating slot.

15. The interference device as described in claim 14, characterized in that, The receiving space includes two second receiving slots, which are respectively disposed on opposite sides of the first receiving slot, and each second receiving slot is provided with an interference signal generating module.

16. The interference device as described in claim 15, characterized in that, The interference signal generator is used to convert an electrical signal into a first acoustic signal, wherein the first acoustic signal is an acoustic signal with a preset frequency.

17. The interference device according to any one of claims 1-16, characterized in that, The detection module includes a capacitive detection module, which detects whether an electronic device is placed in the first accommodating slot by means of self-capacitance or mutual capacitance.

18. The interference device as claimed in claim 17, characterized in that, The capacitive detection module includes a capacitance detection circuit and a detection electrode. The detection electrode is used to form a detection capacitance with the electronic device. The capacitance detection circuit is connected to the detection electrode and is used to drive the detection electrode to perform capacitance sensing.

19. The interference device as described in claim 18, characterized in that, The housing includes an upper shell and a lower shell, which cooperate to form the receiving space. The first receiving groove is formed on the upper outer side of the upper shell, and the detection electrode is disposed on the inner surface of the upper shell.

20. The interference device as described in claim 19, characterized in that, The interference device further includes a motherboard disposed in the containment space, located between the upper shell and the lower shell. The motherboard includes the capacitance detection circuit and the processing module. The detection electrode is disposed on a flexible circuit board. One end of the flexible circuit board with the detection electrode is disposed on the inner surface of the upper shell, and the other end of the flexible circuit board is connected to the capacitance detection circuit on the side of the motherboard facing the lower shell.

21. The interference device as described in claim 19, characterized in that, The upper shell has second receiving grooves formed at opposite ends and on the inner side facing the lower shell, and the first receiving groove is located between the oppositely arranged second receiving grooves.

22. The interference device as claimed in claim 1, characterized in that, The electronic device placed in the first accommodating slot is a mobile phone, and the interference device is used to interfere with the audio of a single mobile phone.

23. The interference device as described in claim 16, characterized in that, Each of the aforementioned interference signal generation modules includes four interference signal generators, which respectively emit first acoustic wave signals of different frequencies.

24. The interference device as described in claim 14, characterized in that, A plurality of through holes are provided between the first receiving groove and the second receiving groove, and the first acoustic signal is emitted from the second receiving groove through the plurality of through holes into the first receiving groove.

25. The interference device as described in claim 21, characterized in that, The upper shell includes a substrate, a top plate, an inner sidewall, and an outer sidewall. The inner sidewall extends from the edge of the substrate in a direction opposite to the lower shell. The outer sidewall is located around the inner sidewall. The top plate is higher than the substrate in the height direction opposite to the lower shell and is located on opposite sides of the substrate, connecting the inner sidewall and the outer sidewall. The top plate forms a second receiving groove in the space below the lower shell facing the lower shell, and the substrate forms a first receiving groove in the space above the lower shell facing away from the lower shell.

26. The interference device as described in claim 25, characterized in that, The substrate, top plate, inner sidewall, and outer sidewall are an integral structure.

27. The interference device as claimed in claim 7, characterized in that, The interference device further includes a wireless charging module, a first indicator unit, and a second indicator unit. When the power management module is connected to an external power supply voltage, the first indicator unit issues a first indicator state. When the wireless charging module is working, the first indicator unit switches the first indicator state to a second indicator state. The second indicator unit issues a third indicator state after the processing unit receives the detection signal from the detection module.

28. The interference device as claimed in claim 1, characterized in that, The at least two first sound wave signals with different frequencies are sound wave signals that are inaudible to the human ear. After mixing, they can generate a second sound wave signal that is audible to the human ear.

Images