Composite material layup system and method

Abstract

Composite layup placement systems and methods are disclosed. A system for placing a composite layup, the system including a transfer end effector and a placement end effector, the transfer end effector movable relative to a carrier transfer device configured to convey a layup carrier supporting a composite layup, the placement end effector movable relative to the transfer end effector and a forming tool. The transfer end effector is configured to remove the layup carrier supporting the composite layup from the carrier transfer device and position the layup carrier for removal by the placement end effector. The placement end effector is configured to remove the layup carrier from the transfer end effector and apply the composite layup to the forming tool.

Description

Technical Field

[0001] This disclosure generally relates to the manufacture of composite structures, and more specifically, to systems and methods for transferring and placing composite material layups during the ply-by-ply formation of the composite structure. Background Technology

[0002] Molded composite structures are commonly used in applications requiring lightweight and high strength, such as aircraft and vehicles. These applications typically utilize contoured parts that must be molded and then cured. The conventional formation of composite structures, especially relatively large ones or those with complex contours, requires significant manual labor before curing. For example, composite fiber layups (e.g., pre-impregnated fiber layups or dry fabrics) are placed by hand over a forming tool or mandrel. The part is then typically cured by heating. The resulting part conforms to the shape of the forming tool. However, the manual laying of fiber layups is both time-consuming and labor-intensive.

[0003] Several known composite material manufacturing processes attempt to automate the forming operations. As an example, the overhang forming process involves heating a laminate of pre-impregnated fiber layups (“composite charge”) and applying pressure around a mandrel using a vacuum bag. However, this approach has limited success with thick laminates or more complex shapes. As another example, a compactor can be used to press the composite charge onto a tool surface during manufacturing. However, this method typically requires manual forming after compaction once the tool surface and the resulting structural profile are formed. Therefore, while these methods may be effective for forming relatively small and thin composite structures or those with relatively simple shapes, they can be inefficient when applied to forming large composite structures or those with more complex shapes.

[0004] Therefore, those skilled in the art continue their research and development work in the field of composite material manufacturing, and more specifically, continue to focus on the manufacture of relatively large and / or relatively complex composite structures. Summary of the Invention

[0005] Examples of a system for placing composite plies, an apparatus for transferring composite plies, an apparatus for placing composite plies, and a method for placing composite structures are disclosed. The following is a non-exhaustive list of examples that may or may not be claimed based on the subject matter of this disclosure.

[0006] In one example, the system includes a transfer end effector and a placement end effector movable relative to a carrier transfer device configured to deliver a ply carrier supporting a composite material ply. The placement end effector is movable relative to the transfer end effector and a forming tool. The transfer end effector is configured to remove the ply carrier supporting the composite material ply from the carrier transfer device and position the ply carrier for removal by the placement end effector. The placement end effector is configured to remove the ply carrier from the transfer end effector and apply the composite material ply to the forming tool.

[0007] In one example, the transfer device includes a magnetic chuck comprising a magnetic chuck support member, a magnet coupled to the magnetic chuck support member, a magnetic chuck flexibility member coupled to the magnetic chuck support member, and a magnetic chuck actuator coupled to the magnetic chuck support member and the magnet. The magnetic chuck flexibility member is configured to contact a layup carrier supporting the composite material layup. The magnetic chuck actuator is configured to selectively move the magnet relative to the magnetic chuck support member and the magnetic chuck flexibility member to magnetically engage or magnetically disengage the layup carrier.

[0008] In one example, the placement device includes a vacuum chuck, which includes a vacuum stage and a vacuum chuck flexibility 358 coupled to the vacuum stage 344. The vacuum chuck flexibility is configured to contact a layup carrier supporting the composite material layup. The vacuum stage is configured to selectively apply a holding vacuum to the layup carrier via the vacuum chuck flexibility.

[0009] In one example, the method includes the following steps: (1) magnetically bonding a ply carrier to support the composite ply; (2) reorienting the ply carrier; (3) applying a holding vacuum to the ply carrier; (4) magnetically detaching the ply carrier; (5) applying the composite ply onto a forming tool; (6) stopping the holding vacuum on a selected portion of the ply carrier; and (7) releasing the composite ply from the ply carrier.

[0010] Other examples of the disclosed systems, devices, and methods will become apparent from the following detailed description and accompanying drawings. Attached Figure Description

[0011] Figure 1 This is a schematic front view of an example of a system for placing composite material layups; Figure 2 This is a schematic perspective view of an example of the system; Figure 3 This is a schematic perspective view of an example of a system's transfer end effector; Figure 4 This is a schematic plan view of an example of a transfer end effector; Figure 5 This is a schematic perspective view of an example of a transfer device, depicting the transfer end effector in a pick-up orientation; Figure 6 This is a schematic front view of an example of a system's transfer equipment and carrier transfer device, depicting a transfer end effector in a pick-up orientation; Figure 7 This is a schematic front view of an example of a transfer end effector; Figure 8 This is a schematic front view of an example of a magnetic chuck for a transfer end effector, depicting the magnetic chuck in a disengaged state. Figure 9 This is a schematic front view of an example of a magnetic chuck for a transfer end effector, depicting the magnetic chuck in an engaged state. Figure 10 This is a schematic perspective view of an example of a transfer device, depicting a reoriented layup carrier and a transfer end effector supporting the composite layup; Figure 11 This is a schematic perspective view of an example of a transfer device, depicting a transfer end effector in a transfer orientation; Figure 12 This is a schematic perspective view of a portion of an example of a transfer end effector; Figure 13 This is a schematic front view of the system as an example of a transfer end effector in a handover orientation and a placement end effector; Figure 14 This is a schematic perspective view of an example of the placement of an end effector in a system; Figure 15 This is a schematic perspective view of an example of placing an end effector; Figure 16 This is a schematic perspective view of an example of the placement of an end effector and a layup carrier; Figure 17 This is a schematic front view of an example of a vacuum stage where an end effector and a layup carrier are placed; Figure 18 This is a schematic plan view of an example of a vacuum stage where an end effector is placed; Figure 19 This is a schematic perspective view of an example of a flexible vacuum suction cup component for placing an end effector; Figure 20 This is a schematic front view of a partial cross-section of an example of an end effector placement; Figure 21 This is a schematic front view of an example of an end effector placement; Figure 22 yes Figure 22 A schematic front view of a partial cross-section of a portion of the end effector. Figure 23 This is a schematic front view of an example of an end effector placement; Figure 24 yes Figure 24 A schematic front view of a partial cross-section of a portion of the end effector. Figure 25 This is a schematic front view of an example of an end effector placement; Figure 26 yes Figure 26 A schematic front view of a partial cross-section of a portion of the end effector. Figure 27 This is a schematic front view of a portion of the transfer end effector and a portion of the layup carrier, depicting the first indexing device; Figure 28 yes Figure 28 A schematic front view of the cross-section of the first indexing device shown; Figure 29 This is a schematic front view of the cross-section of the second indexing device, depicting the alignment of the placement and transfer of the end effector; Figure 30 yes Figure 29 The figure shows a schematic front view of the cross-section of the second indexing device, which depicts the placement of the end effector indexed by the transfer end effector; Figure 31 This is a schematic perspective view of an example system, depicting the transfer end effector and placement end effector in the handover orientation; Figure 32 yes Figure 31 The schematic perspective view of the system shown depicts the placement end effector of applying a composite material layup supported by a layup carrier to the forming tool of the system. Figure 33 This is a schematic perspective view of an example system, depicting the transfer end effector and placement end effector in the handover orientation; Figure 34 yes Figure 33 The schematic perspective view of the system shown depicts the placement end effector of applying a composite material layup supported by a layup carrier to the forming tool of the system. Figure 35 This is a flowchart illustrating an example of a method for placing composite material layups; Figure 36 This is a schematic block diagram of an example of a system for manufacturing composite structures; Figure 37 It is used for manufacturing Figure 36 A schematic diagram of an example of the composite structure system shown; Figure 38 yes Figure 36 A schematic perspective view of an example of the layup carrier and carrier transfer device of the system shown; Figure 39 This is a schematic front view of an example of a layup carrier and carrier transfer device; Figure 40 This is a schematic plan view of an example of a vacuum stage for a carrier transfer device.

[0012] Figure 41 This is a schematic plan view of an example of the base plate of a plywood carrier; Figure 42 This is a flowchart illustrating an example of a method for manufacturing composite structures; Figure 43 It is a schematic diagram of an aircraft that includes at least one composite structure; Figure 44 yes Figure 43 A schematic diagram of an example of the wings of the aircraft shown; and Figure 45 It is a flowchart of aircraft manufacturing and maintenance methods. Detailed Implementation

[0013] The following detailed description refers to the accompanying drawings, which illustrate specific examples described in this disclosure. Other examples with different structures and operations do not depart from the scope of this disclosure. The same reference numerals may refer to the same features, elements, or components in different drawings. Throughout this disclosure, any one of a plurality of items may be referred to individually as an item, and the plurality of items may be collectively referred to as items and may be represented by the same reference numerals. Furthermore, as used herein, features, elements, components, or steps beginning with the word "a" or "an" should be understood to not exclude multiple features, elements, components, or steps, unless such exclusion is expressly stated.

[0014] The following are illustrative, non-exhaustive examples that may, but are not necessarily, claim protection under the subject matter of this disclosure. References to “example” herein mean that one or more features, structures, elements, components, characteristics, and / or operating steps described in connection with that example are included in at least one aspect, embodiment, and / or implementation of the subject matter of this disclosure. Therefore, the phrases “an example,” “another example,” “one or more examples,” and similar language throughout this disclosure may, but do not necessarily, refer to the same example. Furthermore, the subject matter characterizing any example may, but does not necessarily include the subject matter characterizing any other example. Moreover, the subject matter characterizing any example may, but does not necessarily, be combined with the subject matter characterizing any other example.

[0015] refer to Figures 1-34 By way of example, this disclosure relates to a system for placing composite material layups (referred to herein as "system" 300). References Figure 35 By way of example, this disclosure also relates to a method for placing composite material layups (referred to herein as "method" 1200). Generally referenced Figures 1-35 This disclosure also relates to a method for transferring composite material layups using a transfer device 400 and a method for placing composite material layups using a placement device 402.

[0016] Examples of system 300 and method 1200 enable the automated manufacturing of composite structure 102, and more specifically, enable the automated transfer and placement of at least one composite layup 106 over a forming tool 120 used to manufacture composite structure 102. Automation of the placement process can reduce processing time, labor and costs, and / or reduce process variations (e.g., human error) that could lead to undesirable inconsistencies in the finished composite structure compared to conventional composite manufacturing. Specifically, system 300 and method 1200 enable the fabrication of composite structure 102 through layup-by-lay application (e.g., lamination). Lap-by-lay application facilitates the manufacture of large composite structures, thick composite structures, and / or composite structures with complex shapes. Lap-by-lay application can also reduce buckling or wrinkling of the layups within the composite structure compared to conventional composite manufacturing.

[0017] Typically, a composite layup (e.g., composite layup 106) comprises a single layer (e.g., one layer thickness) of a composite material. The composite material can take the form of any of a variety of suitable types of composite materials having any of a variety of layup angles. In one or more examples, composite layup 106 is formed by laminating multiple layers of a unidirectional composite tape pre-impregnated with a resin matrix. In this disclosure, unless explicitly stated otherwise, the phrase "composite layup" refers to at least one layup of a composite material. Composite layup 106 may also be referred to as a composite patch or composite charge.

[0018] refer to Figure 1 , Figure 2 and Figures 31-34 These figures schematically illustrate examples of system 300. In one or more examples, system 300 includes a device for transferring composite plies (referred to herein as transfer device 400) and a device for placing composite plies (referred herein as placement device 402).

[0019] In one or more examples, system 300 includes a transfer end effector 302. The transfer end effector 302 may be a component of transfer device 400 or may form part of transfer device 400. The transfer end effector 302 is movable relative to carrier transfer device 110. Carrier transfer device 110 is configured to transfer a ply carrier 104 supporting composite ply 106. System 300 also includes a placement end effector 304. The placement end effector 304 may be a component of placement device 402 or may form part of placement device 402. The placement end effector 304 is movable relative to transfer end effector 302 and forming tool 120. The transfer end effector 302 is configured to remove the ply carrier 104 supporting composite ply 106 from carrier transfer device 110 and position the ply carrier 104 for removal by placement end effector 304. The placement end effector 304 is configured to remove the layup carrier 104 from the transfer end effector 302 and apply the composite layup 106 to the forming tool 120.

[0020] Brief Reference Figure 42 , Figure 42 An example of a layup carrier 104 and carrier transfer device 110 is schematically shown. The layup carrier 104 is configured to receive a composite layup 106 thereon. For example, the layup carrier 104 includes a layup support surface 108. The layup support surface 108 is configured to support the composite layup 106. Once at least one composite layup 106 is formed on the layup carrier 104, the layup carrier 104 facilitates the sequential transfer of the composite layup 106 through the system 300.

[0021] In one or more examples, system 300 includes a carrier transfer device 110. The carrier transfer device 110 is configured to transfer the ply layup carrier 104. For example, the carrier transfer device 110 includes or takes the form of a moving platform that supports the ply layup carrier 104 and moves the ply layup carrier 104 to a position relative to the transfer device 400 and / or the transfer end effector 302, such as... Figure 1 and Figure 2 As shown in the image.

[0022] In one or more examples, the layup carrier 104 includes a base plate 124 and a film 126 located on the base plate 124. In these examples, the film 126 forms a layup support surface 108. In other examples, the layup carrier 104 may not include the film 126. In these examples, the base plate 124 forms the layup support surface 108.

[0023] A base plate 124 provides a support structure for manufacturing the composite layup 106. Typically, the base plate 124 is relatively thin and substantially flat, or at least has a substantially flat surface to which the film 126 is attached or forms a layup support surface 108. In one or more examples, the base plate 124 is made of a flexible material. In one or more examples, the base plate 124 is made of an elastic material. The base plate 124 facilitates the transfer and application of the composite layup 106 to the forming tool 120. In one or more examples, the base plate 124 is capable of deforming during the application (e.g., stamping) of the composite layup 106 to the forming tool 120 and then returning to its original (e.g., substantially flat) shape. Therefore, in production, the base plate 124 can be reused to apply multiple composite layups 106, thereby reducing equipment and material costs.

[0024] In one or more examples, the base plate 124 is made of a metallic material. As an example, the base plate 124 comprises a sheet of metal or takes the form of a sheet of metal, such as a spring steel sheet. In other examples, the base plate 124 may be made of any other suitable material. In one or more examples, the base plate 124 is made of a material that is sufficiently flexible and resilient to allow the base plate 124 to be shaped during the application of the composite layup 106 to the forming tool 120.

[0025] Film 126 provides a contact surface on which composite layup 106 is supported. In one or more examples, composite material is laid on film 126 during the fabrication of composite layup 106. Typically, film 126 is a relatively thin and flexible sheet of material covering base plate 124. Film 126 facilitates the fabrication of composite layup 106 and its application and formation over forming tool 120. Film 126 provides a working surface on which composite layup 106 is formed and / or temporarily held. Film 126 is deformable during the application and formation of composite layup 106 over forming tool 120. After composite layup 106 is formed over forming tool 120, film 126 is also removeable from composite layup 106.

[0026] Typically, the film 126 has surface properties that allow the composite layup 106 to temporarily adhere to the resin matrix, thereby holding the composite layup 106 on the layup support surface 108, but allowing the film 126 to be removed from the composite layup 106 after it has been formed over the forming tool 120. The film 126 also provides protection for the composite layup 106 during application to and formation over the forming tool 120. The film 126 further provides stability to the composite layup 106.

[0027] In one or more examples, film 126 is made of a plastic material, such as a thermoplastic material. As an example, film 126 includes or comprises a polyethylene sheet, such as a yellow polyethylene sheet. In one or more examples, film 126 is made of fluorinated ethylene propylene (FEP) or ethylene tetrafluoroethylene (ETFE). In one or more examples, film 126 is a release film, such as a polyester release film with high modulus and low elongation, which provides a substantially flat contact surface compatible with most resin systems and adhesives. In one or more examples, film 126 is made of metal foil. In other examples, film 126 may be made of any other suitable material.

[0028] In one or more examples, film 126 may be processed to alter the physical and / or chemical properties of its material and / or surface. As an example, film 126, such as a plastic material or polyethylene, may be heat-treated. As another example, film 126, such as a plastic material or polyethylene, may be corona-treated. As yet another example, film 126 may be both heat-treated and corona-treated.

[0029] Before the composite layup 106 is applied to the layup support surface 108, the film 126 is releasably attached to the base plate 124. The film 126 remains attached to the base plate 124 during the transfer of the composite layup 106 and during application of the composite layup 106 to the forming tool 120. After the composite layup 106 is applied to the forming tool 120, the film 126 is released from the base plate 124.

[0030] Now for reference Figures 3-11 , Figures 3-11 An example of a transfer device 400 and a transfer end effector 302 is schematically shown. In one or more examples, the base plate 124 is magnetic. The transfer end effector 302 includes a magnetic chuck 310. The magnetic chuck 310 is configured to magnetically engage the base plate 124 to remove the ply stack carrier 104 from the carrier transfer device 110 via the transfer end effector 302. The magnetic chuck 310 is further configured to magnetically disengage from the base plate 124 to remove the ply stack carrier 104 from the transfer end effector 302 by placing the end effector 304.

[0031] like Figures 3-7 As best shown, in one or more examples, the transfer end effector 302 includes a transfer frame 314. A magnetic chuck 310 is coupled to the transfer frame 314. The magnetic chuck 310 includes a magnetic chuck contact surface 318. Figure 4 , Figure 6 and Figure 7The magnetic chuck 310 is movable relative to the transfer frame 314 to position the magnetic chuck contact surface 318 into contact with the composite material layup 106 supported by the layup carrier 104, so as to transfer the end effector 302 (e.g., as shown in the image). Figure 6 (As shown) the layup carrier 104 is removed from the carrier transfer device 110.

[0032] The transfer frame 314 may include any rigid structure formed by one or more structural and / or non-structural frame members. The transfer frame 314 provides support for the magnetic chuck 310. The transfer end effector 302 may also include one or more connectors, couplings, and drive components (e.g., motors, actuators, etc.) configured to move the magnetic chuck 310 relative to the transfer frame 314 in one or more linear directions.

[0033] like Figure 3 and Figures 5-7 As best illustrated in the diagram, in one or more examples, the transfer end effector 302 includes a transfer actuator 348. The transfer actuator 348 is coupled to the transfer frame 314 and to the magnetic chuck 310. The transfer actuator 348 is configured to selectively drive and control the magnetic chuck 310 along a first axis of movement 352. Figure 3 and Figure 6 The movement relative to the transfer frame 314. In one or more examples, the transfer end effector 302 includes a plurality of transfer actuators 348, for example, transfer actuators located around the periphery of the transfer frame 314 and the magnetic chuck 310.

[0034] The transfer actuator 348 may include any of a variety of suitable types of selectively controlled actuators. In one or more examples, the transfer actuator 348 may include or take the form of a linear actuator, such as a pneumatic actuator, an electromechanical actuator, etc.

[0035] In one or more examples, the transfer end effector 302 also includes a transfer guide 350. The transfer guide 350 is coupled to the transfer frame 314 and to the magnetic chuck 310. The transfer guide 350 is configured to guide and assist the linear movement of the magnetic chuck 310 along a first movement axis 352.

[0036] like Figure 6As best shown, in one or more examples, movement of the magnetic chuck 310 relative to the transfer frame 314 along a first movement axis 352 in a first direction (e.g., downward) positions the magnetic chuck contact surface 318 to contact the composite material layup 106 supported by the layup carrier 104 for magnetic engagement with the layup carrier 104. Movement of the magnetic chuck 310 relative to the transfer frame 314 in a second direction opposite to the first direction (e.g., upward) along the first movement axis 352 removes the magnetically engaged magnetic chuck contact surface 318 from the carrier transfer device 110 for removal of the layup carrier 104 from the carrier transfer device 110.

[0037] like Figure 5 , Figure 6 , Figure 10 , Figure 11 and Figures 31-34 As shown, in one or more examples, system 300 includes a transfer support platform 306. The transfer support platform 306 may be a component of transfer device 400 or may form part of transfer device 400. The transfer frame 314 of transfer end effector 302 is coupled to the transfer support platform 306. Transfer end effector 302 may be positioned relative to transfer support platform 306 about a rotation axis 322 (…). Figure 3 and Figure 10 Rotate to position the layup carrier 104 to remove it from the transfer end effector 302 by placing the end effector 304.

[0038] The transfer support platform 306 may include any rigid structure formed by one or more structural and / or non-structural frame members. The transfer support platform 306 may also include one or more joints, connectors, and drive components (e.g., motors, actuators, etc.) configured to move the transfer end effector 302 in one or more linear directions and / or orient the transfer end effector 302 in multiple rotational orientations relative to the transfer support platform 306.

[0039] Now for reference Figure 7 , Figure 7 An example of a transfer end effector 302 is schematically shown, and reference is made to... Figure 8 and Figure 9 These schematically illustrate examples of a portion of the magnetic chuck 310 of the transfer end effector 302. In one or more examples, the magnetic chuck 310 includes a plurality of magnets 320. The magnets 320 are configured to magnetically engage the base plate 124 of the layup carrier 104 to remove the layup carrier 104 from the carrier transfer device 110 by the transfer end effector 302.

[0040] In one or more examples, magnet 320 is a permanent magnet. In one or more examples, magnet 320 is a rare-earth magnet, such as a neodymium magnet. In one or more examples, magnet 320 is an electromagnet.

[0041] While multiple magnets 320 are shown and described with respect to the illustrated example, in other examples, the magnetic chuck 310 may include a single magnet 320. Therefore, the use of various forms of magnets throughout this disclosure is not intended to limit or exclude examples having only one magnet. It should be understood that the number of magnets, the size of each magnet, the arrangement of the magnets, and / or the location of the magnets can depend on various factors, such as, but not limited to, the size and / or shape of the base plate 124 of the layup carrier 104.

[0042] In one or more examples, the magnetic chuck 310 includes a magnetic chuck support member 328. A magnet 320 is coupled to the magnetic chuck support member 328. The magnetic chuck support member 328 is coupled to and movable relative to the transfer frame 314. For example, a transfer actuator 348 and a transfer guide 350 are arranged between and coupled to the transfer frame 314 and the magnetic chuck support member 328, and are further configured to move the magnetic chuck support member 328 relative to the transfer frame 314 along a first movement axis 352.

[0043] The magnetic chuck support member 328 provides a support structure for the magnet 320. Typically, the magnetic chuck support member 328 is rigid and substantially flat, or at least has a substantially flat surface to which the magnet 320 is attached. In one or more examples, the magnetic chuck support member 328 forms a magnetic chuck contact surface 318. The magnetic chuck support member 328 may be made of any suitable material, including but not limited to metals, plastics, wood, composite materials, etc.

[0044] like Figure 8 and Figure 9 As shown, magnet 320 can be in a retracted position relative to magnetic chuck support member 328 (e.g., as shown). Figure 8 (as shown) and the extension position (e.g., as shown) Figure 9 The movement of magnet 320 relative to magnetic chuck support member 328 selectively positions magnet 320 to magnetically engage or disengage from the base plate 124 of layup carrier 104.

[0045] In one or more examples, the magnetic chuck 310 includes a magnetic chuck flexibility 330. The magnetic chuck flexibility 330 is coupled to the magnetic chuck support member 328 opposite to the transfer frame 314. In these examples, the magnetic chuck flexibility 330 forms a magnetic chuck contact surface 318. The magnet 320 is movable relative to the magnetic chuck flexibility 330 between a retracted position and an extended position. This movement of the magnet 320 relative to the magnetic chuck flexibility 330 selectively positions the magnet 320 for magnetic engagement or disengagement with the base plate 124 of the layup carrier 104.

[0046] The magnetic chuck flexible member 330 provides cushioning for contacting and protecting the composite layup 106 during removal and transfer of the layup carrier 104. Typically, the magnetic chuck flexible member 330 is substantially flat or at least has a substantially flat surface for contact with the layup carrier 104. The magnetic chuck flexible member 330 can be made of any suitable material, including but not limited to foam.

[0047] In one or more examples, the magnetic chuck flexible member 330 includes a plurality of magnetic openings 332. Each of the magnets 320 is located within a corresponding magnetic opening 332 of the magnetic chuck flexible member 330. Each of the magnets 320 is movable within a corresponding magnetic opening 332 to position the magnet 320 for magnetic engagement or disengagement with the base plate 124 of the layup carrier 104.

[0048] In one or more examples, the magnetic chuck 310 includes a spacer 374. The spacer 374 is located between the magnetic chuck support member 328 and the magnetic chuck flexibility member 330. For example, the spacer 374 is coupled to the magnetic chuck support member 328 opposite to the transfer frame 314, and the magnetic chuck flexibility member 330 is coupled to the spacer 374 opposite to the magnetic chuck support member 328. The magnet 320 is movable relative to the spacer 374 between a retracted position and an extended position. The spacer 374 includes a plurality of second magnet openings 376. Each of the second magnet openings 376 of the spacer 374 is aligned with and volutes a corresponding one of the magnet openings 332 of the magnetic chuck flexibility member 330. In these examples, when moved to the retracted position (e.g., as...), Figure 8 As shown, each of the magnets 320 is accommodated within a corresponding one in the second magnet opening 376.

[0049] In other examples (not shown), the magnetic chuck support member 328 may include a plurality of openings or recesses configured to receive the magnet 320 when the magnet 32 ​​is moved to the retracted position.

[0050] In one or more examples, the magnetic chuck 310 includes a magnetic chuck pad 336. The magnetic chuck pad 336 is coupled to the magnetic chuck flexibility 330 opposite to the magnetic chuck support member 328. In these examples, the magnetic chuck pad 336 forms a magnetic chuck contact surface 318.

[0051] The magnetic chuck pad 336 provides a protective surface that contacts the composite layup 106 during the removal and transfer of the layup carrier 104. Typically, the magnetic chuck pad 336 is a relatively thin and flexible sheet of material that covers and protects the flexible magnetic chuck member 330 and the magnet 320 from direct contact with the resin matrix of the composite layup 106. The magnetic chuck pad 336 may have surface properties that prevent the composite layup 106 from adhering to the magnetic chuck pad 336 via the resin matrix.

[0052] In one or more examples, the magnetic chuck 310 includes a plurality of magnetic chuck actuator rods 334 extending through the magnetic chuck support member 328 and coupled to a plurality of magnets 320. The magnetic chuck 310 also includes a magnetic chuck actuator 324 configured to selectively extend or retract the plurality of magnetic chuck actuator rods 334 relative to the magnetic chuck support member 328. The extension and retraction of the magnetic chuck actuator rods 334 move the plurality of magnets 320 between a magnetically engaged position and a magnetically disengaged position.

[0053] In one or more examples, each of the magnets 320 is coupled to a corresponding one of the magnetic chuck actuator rods 334. In one or more examples, more than one magnet 320 is coupled to the same magnetic chuck actuator rod 334. In one or more examples, the magnetic chuck 310 includes a plurality of rod holes 378 extending through the magnetic chuck support member 328. Each of the rod holes 378 is aligned with and volumetrically communicates with a corresponding one of the magnet openings 332 of the magnetic chuck flexibility member 330. Each of the magnetic chuck actuator rods 334 is positioned within and through a corresponding one of the rod holes 378. In one or more examples, the magnetic chuck 310 may include a bushing positioned within the rod hole 378 to guide and facilitate movement of the magnetic chuck actuator rod 334 within the rod hole 378.

[0054] In one or more examples, the magnetic chuck 310 includes an actuator drive component 380. The actuator drive component 380 is configured to transfer motion and power from the magnetic chuck actuator 324 to the magnetic chuck actuator rod 334. The actuator drive component 380 is coupled to the magnetic chuck actuator 324 and connected between the magnetic chuck actuators 324 and the magnetic chuck actuator rod 334. In one or more examples, the actuator drive component 380 provides structural support for the magnetic chuck actuator rod 334.

[0055] In one or more examples, the magnetic chuck actuator 324 includes at least one inflatable bladder or takes the form of at least one inflatable bladder. In these examples, the magnetic chuck actuator 324 is selectively inflated to retract the magnetic chuck actuator rod 334, and thus positions the magnet 320 in a magnetically disengaged position (e.g., removing the magnet 320 from the layup carrier 104), as... Figure 8 As shown. The magnetic chuck actuator 324 is selectively deflated to extend the magnetic chuck actuator rod 334, and thus positions the magnet 320 in a magnetically engaged position (e.g., moving the magnet 320 toward the layup carrier 104), as... Figure 9 As shown. In these examples, the actuator drive component 380 includes or takes the form of a panel component that is positioned relative to and coupled to the magnetic chuck support component 328 on and to the magnetic chuck actuator 324 (e.g., at least one inflatable bladder). The actuator drive component 380 provides an actuation surface on which the magnetic chuck actuator 324 operates to extend and retract the magnetic chuck actuator rod 334.

[0056] In one or more examples, the magnetic chuck actuator rod 334 is biased in the extended position, thus biasing the magnet 320 in the magnetically engaged position. For example, the magnetic chuck 310 may include at least one spring coupled to and between the actuator drive member 380 (e.g., panel member) and the magnetic chuck support member 328, such that when the magnetic chuck actuator 324 is de-energized (e.g., deflated), the magnetic chuck actuator rod 334 automatically and passively extends to position the magnet 320 in the magnetically engaged position.

[0057] It should be understood that the magnetic chuck actuator 324 is not limited to an inflatable component. The magnetic chuck actuator 324 may include any type or variety of selectively controlled actuators. In other examples, the magnetic chuck actuator 324 may include or take the form of a linear actuator, such as a pneumatic actuator, an electromechanical actuator, etc. In still other examples, the magnet 320 may be an electromagnet and the magnetic chuck actuator 324 may include a switching component configured to selectively energize (e.g., magnetize) and de-energize (e.g., demagnetize) the magnet 320.

[0058] Brief reference Figure 12 In one or more examples, the transfer end effector 302 includes a plurality of clamps 326. The clamps 326 are configured to hold the layup carrier 104 against the magnetic chuck contact surface 318 of the magnetic chuck 310. The clamps 326 provide auxiliary mechanisms (e.g., in addition to the magnet 320) to securely hold the layup carrier 104 in place during the layup transfer operation, such as... Figure 5, Figure 6 , Figure 10 and Figure 11 As shown in the diagram. In one example, clamp 326 is located around and engaged with the periphery of magnetic chuck support member 328. Clamp 326 is configured to engage the periphery of layup carrier 104 to clamp layup carrier 104 between clamp 326 and magnetic chuck contact surface 318. Clamp 326 can engage automatically, such as from controller 158 (…). Figure 36 Under the guidance of ).

[0059] Now for reference Figure 5 , Figure 6 , Figure 10 , Figure 11 and Figure 13 These illustrate an example of a ply transfer operation. Typically, a ply transfer operation utilizes a transfer device 400, and more specifically, a transfer end effector 302, to: (1) remove the ply carrier 104 from the carrier transfer device 110; (2) reposition and / or reorient the ply carrier 104 for transfer to the placement end effector 304; and (3) facilitate the removal of the ply carrier 104 by the placement end effector 304.

[0060] like Figure 5 and Figure 6 As shown, in the first stage of the layup transfer operation, the carrier transfer device 110 is used to position the layup carrier 104 relative to the transfer device 400, and the transfer end effector 302 is positioned in a pick-up orientation such that the carrier transfer device 110 is below the transfer end effector 302 and the magnetic chuck 310 faces the layup carrier 104. The magnetic chuck 310 is extended (e.g., moved toward the carrier transfer device 110 along a first movement axis 352) such that the magnetic chuck contact surface 318 contacts the composite layup 106. With the magnetic chuck contact surface 318 in contact with the composite layup 106, the magnetic chuck 310 magnetically engages the base plate 124 of the layup carrier 104 through the composite layup 106. With the magnetic chuck 310 magnetically engaged with the base plate 124 of the layup carrier 104, the magnetic chuck 310 is then retracted (e.g., moved away from the carrier transfer device 110 along the first movement axis 352), such that the layup carrier 104 is removed from the carrier transfer device 110. Fixture 326 ( Figure 12 It can also be joined to maintain the layup carrier 104.

[0061] like Figure 10 and 11 As shown, in the second stage of the layup transfer operation, with the magnetic chuck 310 magnetically engaged with the base plate 124 of the layup carrier 104, the transfer end effector 302 is repositioned in the transfer orientation, such that the layup carrier 104 is properly positioned for placement of the end effector 302. Figure 13 The end effector 302 is removed from the transfer end effector 302. In one or more examples, the transfer end effector 302 is removed about the rotation axis 322. Figure 10 Rotate approximately 180 degrees to flip the ply carrier 104. Therefore, when the transfer end effector 302 is in the transfer orientation (e.g., as...), Figure 11 and Figure 13 As shown), the base plate 124 of the layup carrier 104 is generally facing upwards, while the composite material layup 106 is facing downwards.

[0062] like Figure 13 As shown, in the third stage of the layup transfer operation, with the magnetic chuck 310 magnetically engaged with the base plate 124 of the layup carrier 104 and the transfer end effector 302 in the transfer orientation, the placement end effector 304 is positioned to engage the base plate 124 of the layup carrier 104. For example, the placement end effector 304 moves toward the transfer end effector 302, and thus toward the layup carrier 104 supporting the composite layup 106, such that the placement end effector 304 engages the base plate 124. The placement end effector 304 is then removed from the transfer end effector 302 to remove the layup carrier 104 and the composite layup 106 supported by the layup carrier 104 from the transfer end effector 302. With the layup carrier 104 removed from the transfer end effector 302 and supported by the placement end effector 304, the composite layup 106 is placed away from the placement end effector 304 to be applied to the forming tool 120.

[0063] Now for reference Figures 14-26 , Figures 14-26 An example of a placement end effector 304 is shown. In one or more examples, the placement end effector 304 includes a vacuum chuck 312. The vacuum chuck 312 is configured to selectively apply a holding vacuum to the base plate 124 to remove the layup carrier 104 from the transfer end effector 302 via the placement end effector 304. The vacuum chuck 312 is further configured to ( ) during the application of the composite layup 106 onto the forming tool 120 Figure 1 and Figure 2 Selectively remove the vacuum from the base plate 124 to remove the composite layup 106 from the layup carrier 104.

[0064] like Figure 17 , Figure 18 and Figure 41 As shown, in one or more examples, the base plate 124 includes a plurality of vacuum holes 128. The vacuum chuck 312 is configured to apply a maintaining vacuum through the plurality of vacuum holes 128 to hold the thin film 126 (… Figure 18 The film 126 attached to the base plate 124 and the composite material layup 106 attached to the film 126 are not on the base plate 124. Figure 17 As shown in the image.

[0065] like Figure 18 As shown, in one or more examples, during the removal of the layup carrier 104 from the transfer end effector 302 by placing the end effector 304 and applying the composite layup 106 onto the forming tool 120, the film 126 is releasably coupled to the base plate 124 via vacuum holding. In these examples, the base plate 124 facilitates vacuum movement through the base plate 124 and engages the film 126.

[0066] like Figures 14-17 As shown, in one or more examples, the vacuum chuck 312 includes a vacuum stage 344. The vacuum stage 130 may include a perforated top and a vacuum chamber in fluid communication with a vacuum source. The vacuum stage 344 is configured to apply a holding vacuum to the layup carrier 104. The application of the holding vacuum holds the base plate 124 on the vacuum stage 344 and holds the film 126 on the base plate 124. A plurality of vacuum holes 128 in the base plate 124 allow vacuum movement through the base plate 124. With the end effector 304 positioned in contact with the layup carrier 104, the vacuum stage 130 is in fluid communication with the plurality of vacuum holes 128.

[0067] In one or more examples, the vacuum stage 130 is configured to selectively apply a holding vacuum to select a portion of the layup carrier 104. During the removal of the layup carrier 104 from the transfer end effector 302 and the application of the composite layup 106 to the forming tool 120, the selective application of the holding vacuum temporarily holds the base plate 124 on the placement end effector 304. During the removal of the layup carrier 104 from the transfer end effector 302 and the application of the composite layup 106 to the forming tool 120, the selective application of the holding vacuum temporarily holds the film 126 on the base plate 124 and thus temporarily holds the composite layup 106 on the base plate 124. After the composite layup 106 is applied to the forming tool 120, the holding vacuum is selectively removed from the selected portion of the layup carrier 104 to release the film 126 and thus release the composite layup 106 from the base plate 124. During the process of transferring the layup carrier 104 back to the transfer end effector 302, selective removal of the vacuum releases the base plate 124 from the placement end effector 304.

[0068] In one or more examples, the placement end effector 304 includes parts and components (e.g., vacuum sources, vacuum ports, conduits, actuators, valves, etc.) capable of generating, applying, and selectively controlling a maintaining vacuum. The vacuum source (e.g., a vacuum pump) may be a component of system 300 or placement device 402. Alternatively, the vacuum source may be an integral part of the placement end effector 304. During the handover and placement operation, the vacuum stage 344 provides a maintaining vacuum, which is then applied to the diaphragm 126 through a plurality of vacuum holes 128 formed in the base plate 124.

[0069] Now for reference Figure 17 and Figure 18 , Figure 17 and 18 An example of a vacuum stage 344 on which an end effector 304 is placed is schematically shown. In one or more examples, the vacuum stage 344 includes a plurality of vacuum zones 382. Each vacuum zone 382 may include one or more vacuum orifices or vacuum ports 386. Figure 18 Vacuum orifices or vacuum ports 386 are in fluid communication with corresponding vacuum zones 382 and are configured to apply a vacuum within the corresponding vacuum zone 382. Each of the plurality of vacuum zones 382 is controllable to selectively apply a vacuum to the base plate 124 located above the corresponding vacuum zone 382. Figure 16 and Figure 41 The corresponding group of vacuum orifices 128 applies or removes a vacuum. For example, each of the plurality of vacuum zones 382 includes a valve 384 ( Figure 17 Valve 384 selectively opens or closes to control the application of vacuum to the corresponding vacuum zone 382. Vacuum zone 382 enables vacuum stage 344 to be positioned such that the base plate 124 ( Figure 16 and 17 ) is held on vacuum stage 344 and film 126 ( Figure 17 Vacuum is applied at the position maintained on the base plate 124. Vacuum zone 382 also enables vacuum stage 344 to stop applying vacuum to select areas of base plate 124, such as during the release film 126 and during composite layup 106 after composite layup 106 is applied to forming tool 120. Figure 1 and 2 The vacuum stage 344 and the plurality of vacuum holes 128 formed in the base plate 124 can be arranged to adequately distribute sufficient vacuum to hold the film 126 on the surface of the base plate 124 during the movement of the layup carrier 104.

[0070] like Figure 18As shown, in one or more examples, the vacuum stage 344 includes a plurality of lip seals 388. Each lip seal 388 is located between adjacent vacuum zones 382. For example, the lip seal 388 forms the outer boundary of the vacuum zones 382 and isolates each of the vacuum zones 382 from its adjacent counterpart. The plurality of lip seals 388 provide a sealing interface with the base plate 124 without affecting the surface flatness of the vacuum stage 344.

[0071] Brief reference Figure 38 In one or more examples, the layup carrier 104 also includes a gasket 136. The gasket 136 is attached to the substrate 124. Typically, the gasket 136 is a relatively thin sheet of material covering the substrate 124. For example, the gasket 136 is attached to and covers the surface of the substrate 124 and is located between the substrate 124 and the film 126. The gasket 136 can be attached to the substrate 124 by any of a variety of techniques, such as via adhesive bonding, mechanical fasteners, etc. In these examples, the film 126 is positioned on the gasket 136, and the gasket 136 provides a contact surface for applying the film 126 thereon.

[0072] In one or more examples, the gasket 136 may be maintained by vacuum permeation. The gasket 136 facilitates the distribution of the maintaining vacuum from the plurality of vacuum holes 128 of the substrate 124 to the membrane 126. The gasket 136 also prevents the membrane 126 from forming dents or wrinkles at the plurality of vacuum holes 128 in response to the application of the maintaining vacuum.

[0073] In one or more examples, the liner 136 is made of a porous plastic material, such as a porous thermoplastic. As one example, the liner 136 comprises or is in the form of a polypropylene sheet. As another example, the liner 136 comprises or is in the form of a high-density polyethylene sheet. As yet another example, the liner 136 is a piece of VYON® porous polymer fluidizing medium, commercially available from Porvair Filtration Group. In other examples, the liner 136 may be made of any other suitable material, such as a flexible material that allows vacuum to pass through the liner itself and can be used as a cutting surface.

[0074] Now for reference Figure 14 and Figure 15 In one or more examples, the placement of the end effector 304 includes a placement frame 342. A vacuum chuck 312 is coupled to the placement frame 342. The vacuum chuck 312 includes a vacuum chuck contact surface 346. In one or more examples, the surface of the vacuum stage 344 forms the vacuum chuck contact surface 346 (e.g., as shown in the image). Figure 15As shown). In one or more examples, as will be described in more detail herein, the surfaces of multiple vacuum cups 360 form vacuum suction cup contact surfaces 346 (e.g., as shown). Figure 14 (As shown). The vacuum chuck 312 is movable relative to the placement frame 342 to position the vacuum chuck contact surface 346 to contact the layup carrier 104 supporting the composite layup 106 for removal of the layup carrier 104 from the transfer end effector 302 by the placement end effector 304. The vacuum chuck 312 is movable relative to the placement frame 342 to position the layup carrier 104 for application of the composite layup 106 to the forming tool 120 by the placement end effector 304. Figure 1 and Figure 2 ).

[0075] The placement frame 342 may include any rigid structure formed by one or more structural and / or non-structural frame members. The placement frame 342 provides support for the vacuum chuck 312. The placement end effector 304 may also include one or more joints, connectors, and drive components (e.g., motors, actuators, etc.) configured to move the vacuum chuck 312 relative to the transfer frame 314 in one or more linear directions and / or rotational orientations.

[0076] In one or more examples, the vacuum chuck 312 may be linearly movable relative to the placement frame 342 along a second movement axis 390 to transfer and apply the layup carrier 104 via the placement end effector 304. In one or more examples, the vacuum chuck 312 may be pivotable relative to the placement frame 342 about a pivot axis 340 to orient the layup carrier 104 to apply the composite layup 106 to the forming tool 120 via the placement end effector 304.

[0077] In one or more examples, the placement end effector 304 includes a placement actuator 392. The placement actuator 392 is coupled to a placement frame 342 and to a vacuum chuck 312. The placement actuator 392 is configured to selectively drive and control movement of the vacuum chuck 312 relative to the placement frame 342 along a second movement axis 390 and / or about a pivot axis 340. In one or more examples, the placement end effector 304 includes a plurality of placement actuators 392, for example, at least one placement actuator 392 configured to linearly move the vacuum chuck 312 along the second movement axis 390 and at least one placement actuator 392 configured to pivot the vacuum chuck 312 about a pivot axis 340.

[0078] The placement actuator 392 may include any of a variety of suitable types of selectively controlled actuators. In one or more examples, the placement actuator 392 may include or take the form of a linear actuator or rotary actuator, such as a pneumatic actuator, an electromechanical actuator, a power screw and nut mechanism, a rack and pinion mechanism, etc.

[0079] In one or more examples, during a transfer operation, movement of the vacuum chuck 312 relative to the placement frame 342 along a second movement axis 390 in a first direction (e.g., downward) positions the vacuum chuck contact surface 346 to contact the base plate 124 of the layup carrier 104 for vacuum engagement with the layup carrier 104. Movement of the vacuum chuck 312 relative to the placement frame 342 along the second movement axis 390 in a second direction opposite to the first direction (e.g., upward) removes the vacuum chuck contact surface 346, which is engaged with the layup carrier 104 via vacuum, from the transfer end effector 302 for removal of the layup carrier 104 from the transfer end effector 302.

[0080] Similarly, in one or more examples, during the placement operation, movement of the vacuum chuck 312 relative to the placement frame 342 along the second movement axis 390 in a first direction (e.g., downward) places the composite layup 106 into contact with the forming tool 120. After the composite layup 106 is applied to the forming tool 120, movement of the vacuum chuck 312 relative to the placement frame 342 along the second movement axis 390 in a second direction opposite to the first direction (e.g., upward) removes the base plate 124 of the layup carrier 104 released from the composite layup 106 from the forming tool 120.

[0081] Furthermore, in one or more examples, during the placement operation, the movement of the vacuum chuck 312 relative to the placement frame 342 about the pivot axis 340 relative to the forming surface 118 of the forming tool 120 ( Figure 1 and Figure 2 ) Oriented layup carrier 104, and composite layup 106 oriented and held on layup carrier 104 for applying composite layup 106.

[0082] refer to Figure 1 , Figure 2 and Figures 31-34In one or more examples, system 300 includes a placement support platform 308. The placement support platform 308 may be a component of or form part of the placement device 402. A placement frame 342 of the placement end effector 304 is coupled to the placement support platform 308. The placement end effector 304 is movable relative to the placement support platform 308 to remove the layup carrier 104 from the transfer end effector 302. The placement end effector 304 is movable relative to the placement support platform 308 to position the layup carrier 104 to apply the composite layup 106 to the forming tool 120 via the placement end effector 304.

[0083] The placement support platform 308 may include any rigid structure formed by one or more structural and / or non-structural frame members. The placement support platform 308 may also include one or more joints, connectors, and drive components (e.g., motors, actuators, etc.) configured to move the placement end effector 304 in one or more linear directions and / or orient the placement end effector 304 relative to the placement support platform 308 in multiple rotational orientations.

[0084] In one or more examples, the vacuum chuck 312 includes a vacuum chuck support member 356. The vacuum chuck support member 356 is coupled to and movable relative to the placement frame 342. A vacuum stage 344 is coupled to the vacuum chuck support member 356. For example, a placement actuator 392 is arranged between and coupled to the placement frame 342 and the vacuum chuck support member 356, and is further configured to move the vacuum chuck support member 356 along a second movement axis 390 and / or about a pivot axis 340 relative to the placement frame 342.

[0085] The vacuum chuck support member 356 provides a support structure for the vacuum stage 344. Typically, the vacuum chuck support member 356 is rigid and provides a support structure for the vacuum stage 344 to which it is connected.

[0086] Now for reference Figure 16 , Figure 17 and Figure 19 In one or more examples, the vacuum suction cup 312 includes a vacuum suction cup flexible member 358. The vacuum suction cup flexible member 358 is coupled to the vacuum stage 344 opposite to the vacuum suction cup support member 356. The vacuum suction cup flexible member 358 can be maintained in a vacuum-permeable state. In one or more examples, the vacuum suction cup flexible member 358 forms a vacuum suction cup contact surface 346.

[0087] The vacuum chuck flexible member 358 provides cushioning for contact with the base plate 124 of the layup carrier 104 during the transfer of the layup carrier 104 from the transfer end effector 302 and the application of the composite layup 106 onto the forming tool 120. Typically, the vacuum chuck flexible member 358 is substantially flat or at least has a substantially flat surface for contact with the layup carrier 104. The magnetic chuck flexible member 330 can be made of any suitable material, including but not limited to foam.

[0088] In one or more examples, the vacuum suction cup flexible member 358 includes a plurality of vacuum holes 394. The vacuum suction cup 312 (e.g., vacuum stage 344) is configured to apply a holding vacuum through the plurality of vacuum holes 394 of the vacuum suction cup flexible member 358 to hold the base plate 124 of the layup carrier 104 onto the vacuum suction cup flexible member 358 and to hold the film 126 ( Figure 17 It is held on the base plate 124. Alternatively, the vacuum suction cup flexible member 358 can also be held for vacuum penetration.

[0089] Now for reference Figure 20 , Figure 20 An example of placement of the end effector 304 is schematically shown. In one or more examples, the vacuum chuck 312 includes a plurality of vacuum cups 360. The vacuum cups 360 are configured to apply a holding vacuum to the layup carrier 104 during the transfer of the layup carrier 104 and the placement of the composite layup 106 on the forming tool 120. In these examples, the surfaces of the vacuum cups 360 form a vacuum chuck contact surface 346.

[0090] In one or more examples, the vacuum cup 360 is coupled to and in fluid communication with the vacuum stage 344, such as by being coupled to a vacuum port 386. In one or more examples, each of the vacuum cups 360 is mounted on the vacuum stage 344 via a support. Alternatively, in one or more examples, the vacuum cup 360 forms part of the vacuum stage 344, such as replacing multiple vacuum ports 386 and / or vacuum zones 382. In other examples, the vacuum cup 360 is coupled to a vacuum chuck support member 356 and is coupled to and in fluid communication with a vacuum source. Therefore, the specific operating configurations of the vacuum stage 344 and the vacuum cup 360 are not intended to be limiting, and configurations other than those described and illustrated are also contemplated.

[0091] In one or more examples, each or more groups of vacuum cups 360 are controllable to selectively direct airflow onto the base plate 124 located above the respective vacuum cup 360. Figure 17 The corresponding set of vacuum orifices 128 of the vacuum cup 360 applies or removes a vacuum. For example, each or more sets of vacuum cups 360 are operatively connected to the corresponding valve 384. Figure 20The valve is selectively opened or closed to control the application of vacuum to one or more corresponding vacuum cups 360. Vacuum cups 360 are capable of applying vacuum at locations where it is necessary to hold the base plate 124 of the layup carrier 104 on the vacuum cup 360 and to hold the film 126 on the base plate 124. Vacuum cups 360 are also capable of stopping the vacuum to select areas of the base plate 124, such as after the composite layup 106 has been applied to the forming tool 120 and during the release of the film 126 and the composite layup 106. Figure 1 , Figure 2 and Figures 31-34 The vacuum cup 360 can be arranged to provide sufficient vacuum to hold the base plate 124 on the placement end effector 304 and to hold the film 126 on the surface of the base plate 124 during the movement of the layup carrier 104.

[0092] In one or more examples, each or at least some of the vacuum cups 360 are deformable, such as compressible, flexible, etc. The vacuum cups 360 may also be elastic, allowing them to deform and return to their original state. For example, the vacuum cups 360 may include or be in the form of bellows vacuum cups.

[0093] In one or more examples, the vacuum chuck 312 includes a forming member 362. The forming member 362 is coupled to the vacuum stage 344 (or the vacuum chuck support member 356) and is movable relative to the vacuum stage 344 and the plurality of vacuum cups 360. The forming member 362 can be in a retracted position (e.g., as shown in the image). Figures 21-24 (as shown) and the extension position (e.g., as shown) Figure 25 and Figure 26 Linear movement between (as shown). As will be described in more detail herein, forming member 362 can be used to generate curvature in the layup carrier 104 during the placement and application of composite layup 106 onto forming tool 120.

[0094] In one or more examples, the forming member 362 includes a plurality of vacuum cup openings 364. At least a portion of each of the plurality of vacuum cups 360 is located within a corresponding one of the plurality of vacuum cup openings 364 of the forming member 362. The vacuum cup openings 364 of the forming member 362 enable the forming member 362 to move relative to the vacuum cups 360 (e.g., as shown in the image). Figures 21-26 (As shown).

[0095] In one or more examples, the vacuum suction cup flexible member 358 is coupled to the forming member 362 opposite to the vacuum stage 344 (or vacuum suction cup support member 356). In one or more examples, the vacuum suction cup flexible member 358 includes a plurality of vacuum cup openings 396. The vacuum cup openings 396 of the vacuum suction cup flexible member 358 are aligned with and volute in communication with a corresponding one of the vacuum cup openings 364 of the forming member 362. At least a portion of each of the plurality of vacuum cups 360 is located within a corresponding one of the plurality of vacuum cup openings 396 of the vacuum suction cup flexible member 358. The vacuum cup openings 396 of the vacuum suction cup flexible member 358 allow the forming member 362 and the vacuum suction cup flexible member 358 to move relative to the vacuum cups 360 (e.g., as shown in the image). Figures 21-26 (As shown).

[0096] Now for reference Figures 21-26 , Figures 21-26 An example of placing the end effector 304 during the removal of the layup carrier 104 and the forming layup carrier 104 is illustrated schematically before placing the composite layup 106 on the forming tool 120.

[0097] like Figure 21 and Figure 22 As shown, in one or more examples, during a transfer operation (e.g., when the layup carrier 104 is removed from the transfer end effector 302), the forming member 362 is in a retracted position and the vacuum cup 360 is in an undeformed state. The placement end effector 304 is moved to place the vacuum suction cup contact surface 346 (e.g., the surface of the vacuum cup 360) into contact with the base plate 124 of the layup carrier 104.

[0098] like Figure 23 and Figure 24 As shown, during the handover operation, a holding vacuum is applied to the base plate 124 of the layup carrier 104 via vacuum cup 360 to remove the layup carrier 104 and hold it on the placement end effector 304. The application of the holding vacuum compresses or retracts the vacuum cup 360 (e.g., as...). Figure 24 (As shown). In one or more examples, the vacuum cup 360 is compressed or retracted substantially equally, thereby keeping the layup carrier 104 in a substantially flat configuration.

[0099] In some applications of the disclosed system 300 and method 1200, controlling the curvature of the layup carrier 104 and thus the curvature of the composite layup 106 may be beneficial or advantageous during the placement of the composite layup 106 onto the forming surface 118 of the forming tool 120. For example, the forming tool 120 may have a complex shape or a portion of the forming surface 118 may have curvature. Controlling the curvature of the layup carrier 104 (e.g., creating curvature therein) and thus the curvature of the composite layup 106 can increase the contact area between the composite layup 106 and the forming surface 118 when the composite layup 106 is applied (e.g., stamped) onto the forming tool 120.

[0100] In one or more examples, the forming member 362 includes a forming surface 366. In one or more examples, the forming surface 366 has a profile and is configured to create a profile or curvature in the layup carrier 104. For example, the forming surface 366 may have a profile or curve along one or more axes. In one example, the forming surface 366 is convex (e.g., as shown in the image). Figure 21 , Figure 23 and Figure 25 (As shown). In another example, the forming surface 366 is concave. In one or more examples, the forming surface 366 may be substantially flat and configured to hold the layup carrier 104 in a substantially flat configuration.

[0101] like Figure 25 and Figure 26 As shown, the forming member 362 can be used to form curvature in the layup carrier 104. In one or more examples, with the layup carrier 104 held on the vacuum cup 360, the forming member 362 is in a retracted position (e.g., as shown in the diagram). Figure 23 and Figure 24 (As shown) Move to the extended position until the vacuum cup contact surface 346 of the vacuum cup flexible member 358 contacts the base plate 124 of the layup carrier 104. The vacuum cup flexible member 358 is clamped between the forming surface 366 and the base plate 124 of the layup carrier 104 and compressed therebetween. The forming member 362 pushes the layup carrier 104 held by the vacuum cup 360. The contour shape of the forming surface 366 gives the layup carrier 104 a substantially similar contour. The vacuum cup 360 can extend in response to the creation of the contour in the layup carrier 104 while maintaining a vacuum to hold the layup carrier 104 on the placement end effector 304.

[0102] For example, such as Figure 26As shown, the convex profile of the forming surface 366 creates a convex profile in the layup carrier 104. In response to the forming force applied to the layup carrier 104 by the forming member 362, the vacuum cup 360 can extend a relatively small amount at a location with minimum curvature (e.g., near the end of the layup carrier 104). In response to the forming force applied to the layup carrier 104 by the forming member 362, the vacuum cup 360 can extend a relatively large amount at a location with maximum curvature (e.g., near the center of the layup carrier 104).

[0103] In one or more examples, the vacuum chuck 312 includes a forming actuator 368. The forming actuator 368 is disposed between and coupled to the vacuum stage 344 (or vacuum chuck support member 356) and the forming member 362. The forming actuator 368 is configured to selectively drive and control movement of the forming member 362 relative to the vacuum stage 344. In one or more examples, the vacuum chuck 312 includes a plurality of transfer actuators 348, for example, located around the periphery of the vacuum stage 344 and the forming member 362.

[0104] The forming actuator 368 may include any of a variety of suitable types of selectively controlled actuators. In one or more examples, the forming actuator 368 may include or take the form of a linear actuator, such as a pneumatic actuator, an electromechanical actuator, etc.

[0105] In one or more examples, the vacuum chuck 312 also includes a forming guide 404. The forming guide 404 is coupled to the vacuum stage 344 (or vacuum chuck support member 356) and to the forming member 362. The forming guide 404 is configured to guide and assist the linear movement of the forming member 362.

[0106] Now for reference Figure 13 and Figures 31-34 , Figure 13 and Figures 31-34 An example of a layup transfer and placement operation is shown. Typically, the layup transfer and placement operation utilizes placement device 402, and more specifically, placement end effector 304, to: (1) remove the layup carrier 104 from the transfer end effector 302; (2) reposition and / or reorient the layup carrier 104 to place the composite layup 106 onto the forming tool; and (3) apply the composite layup 106 onto the forming tool 120.

[0107] like Figure 13 , Figure 31 and Figure 32As shown, in the first stage of the layup transfer and placement operation, the transfer end effector 302 is used to position the layup carrier 104 relative to the placement device 402, and the placement end effector 304 is positioned in a transfer orientation such that the vacuum chuck 312 faces the base plate 124 of the layup carrier 104. The vacuum chuck 312 moves toward the layup carrier 104 such that the vacuum chuck contact surface 346 contacts the base plate 124 of the layup carrier 104 (e.g., as shown). Figure 13 (As shown). With the vacuum chuck contact surface 346 in contact with the base plate 124, the vacuum chuck 312 applies a maintaining vacuum to engage the base plate 124 of the layup carrier 104. After the vacuum chuck 312 engages with the base plate 124 of the layup carrier 104 via vacuum, the vacuum chuck 312 is then removed from the transfer end effector 302, causing the layup carrier 104 to be removed from the transfer end effector 302.

[0108] like Figure 32 and Figure 34 As shown, in the second stage of the layup transfer and placement operation, with the vacuum chuck 312 engaged with the base plate 124 of the layup carrier 104, the placement end effector 304 is repositioned in placement orientation such that the layup carrier 104 is properly positioned to place the composite layup 106 onto the forming surface 118 of the forming tool 120. The layup carrier 104 is oriented such that the composite layup 106 is substantially parallel to at least a portion of the forming surface 118 of the forming tool 120. In one or more examples, the placement end effector 304 is about a pivot axis 340 (… Figure 14 and Figure 15 Pivot to appropriately orient the ply carrier 104 (e.g., as...) Figure 32 (As shown). Therefore, with the placement end effector 304 in the placement orientation, the composite layup 106 faces the forming surface 118 of the forming tool 120 to which it will be applied.

[0109] In the third stage of the layup transfer operation, with the vacuum chuck 312 engaged with the base plate 124 of the layup carrier 104 and the placement end effector 304 in placement orientation, the placement end effector 304 moves to press the composite layup 106 against the forming surface 118 of the forming tool 120 and apply the composite layup 106. For example, the placement end effector 304 moves toward the forming tool 120, and thus the layup carrier 104 supporting the composite layup 106 moves toward the forming tool 120, such that the composite layup 106 engages with the forming tool 120. During application, the composite layup 106 is sandwiched between the forming surface 118 of the forming tool 120 and the base plate 124 of the layup carrier 104. The composite layup 106 adheres to a portion of the forming surface 118 via a resin matrix. The vacuum chuck 312 then selectively removes the vacuum maintained from selected portions of the layup carrier 104 to release the film 126, and thus release the composite layup 106. The composite layup 106 is adhered to a portion of the molding surface 118 via a resin matrix. The end effector 304 is then removed from the molding tool 120 to remove the empty layup carrier 104.

[0110] Now for reference Figure 27 and Figure 28 These schematically illustrate examples of the first indexing device 316. In one or more examples, the transfer end effector 302 includes a first portion of the first indexing device 316 configured to cooperate with a second portion of the first indexing device 316 located on the carrier transfer device 110. The alignment and engagement of the first and second portions of the first indexing device 316 enables indexing of the magnetic chuck 310 relative to the carrier transfer device 110 during a pick-up operation to remove the ply carrier 104 from the carrier transfer device 110 via the transfer end effector 302.

[0111] In one or more examples, a first portion of the first indexing device 316 includes or is in the form of a pin receiver 406. A second portion of the first indexing device 316 includes or is in the form of a positioning pin 408. The pin receiver 406 is coupled to a magnetic chuck 310, such as to a magnetic chuck support member 328. The positioning pin 408 is coupled to and protrudes from a carrier transfer device 110. The pin receiver 406 is configured to receive the positioning pin 408 when the transfer end effector 302 moves into position to remove the layup carrier 104 from the carrier transfer device 110. In these examples, the magnetic chuck flexibility 330 may include a pin opening aligned with the pin receiver 406, allowing the positioning pin 408 to pass through the magnetic chuck flexibility 330.

[0112] Now for reference Figure 29 and Figure 30These schematically illustrate examples of the second indexing device 338. In one or more examples, the transfer end effector 302 includes a first portion of the second indexing device 338. The placement end effector 304 includes a second portion of the second indexing device 338. The first and second portions of the second indexing device 338 are configured to cooperate. The alignment and engagement of the first and second portions of the second indexing device 338 enable the placement end effector 304 to be indexed relative to the transfer end effector 302 during a transfer operation to remove the ply carrier 104 from the transfer end effector 302 via the placement end effector 304.

[0113] In one or more examples, a first portion of the second indexing device 338 includes or takes the form of a pin receiver 406. A second portion of the second indexing device 338 includes or takes the form of a positioning pin 408. The pin receiver 406 is coupled to a magnetic chuck 310, such as to a magnetic chuck support member 328. The positioning pin 408 is coupled to and protrudes from a vacuum chuck 312, such as a vacuum stage 344 or a vacuum chuck support member 356. The pin receiver 406 is configured to receive the positioning pin 408 when the placement end effector 304 is moved into place to remove the layup carrier 104 from the transfer end effector 302. In these examples, the magnetic chuck flexibility 330 may include a pin opening aligned with the pin receiver 406, allowing the positioning pin 408 to pass through the magnetic chuck flexibility 330.

[0114] In one or more examples, the first portion of the first indexing device 316 and the first portion of the second indexing device 338 are the same components of the transfer end effector 302. In other words, the pin receiver 406 of the magnetic chuck 310 is configured to receive the positioning pin 408 of the carrier transfer device 110 during pickup and to receive the positioning pin 408 of the placement end effector 304 during transfer.

[0115] It is understood that system 300 may include a plurality of (e.g., at least two) first indexing devices 316 for properly indexing and transferring end effector 302 relative to carrier transfer device 110 and a plurality of (e.g., at least two) second indexing devices 338 for properly indexing and placing end effector 304 relative to transfer end effector 302.

[0116] Now for reference Figure 3 and Figures 27-30The system 300 can also be configured to accommodate and correct minor misalignments during indexing of the transfer end effector 302 to the carrier transfer device 110 using the first indexing device 316 and during indexing of the placement end effector 304 to the transfer end effector 302 using the second indexing device 338. In one or more examples, the magnetic chuck 310 is configured to move relative to the transfer frame 314 along a floating axis 354. The floating axis 352 is generally perpendicular to the first movement axis 352. Figure 3 For example, the transfer actuator 348 and transfer guide 350 of the transfer end effector 302 have small degrees of freedom of movement and are configured such that the magnetic chuck 310 can move relative to the transfer frame 314 along a floating axis. The movement of the magnetic chuck 310 relative to the transfer frame 314 along the floating axis 354 facilitates the indexing of the transfer end effector 302 relative to the carrier transfer device 110. The movement of the magnetic chuck 310 relative to the transfer frame 314 along the floating axis 354 also facilitates the indexing of the transfer end effector 302 relative to the placement end effector 304.

[0117] In addition, the first indexing device 316 ( Figure 27 and Figure 28 ) and second indexing device 338 ( Figure 29 and Figure 30 The magnetic chuck 310 is configured to move relative to the transfer frame 314 during indexing. For example, the pin receiver 406 includes a tapered opening for receiving the positioning pin 408 and forming a tapered indexing surface. Figure 29 As best shown, if a slight misalignment exists during the initial positioning of the end effector 302, the locating pin 408 engages a portion of the tapered indexing surface. As the locating pin 408 is further received by the pin receiver 406, the locating pin 408 applies a force to the tapered indexing surface, and the magnetic chuck 310 responds to this force by moving along the floating axis 354 to coaxially align the pin receiver 406 and the locating pin 408, as shown. Figure 28 and Figure 30 As shown in the best example.

[0118] refer to Figure 35 , Figure 35 An example of a method 1200 for placing composite material layups 106 is shown. The method 1200 is implemented using system 300, as follows: Figures 1-34 As shown.

[0119] In one or more examples, method 1200 includes the steps of magnetically bonding a layup carrier 104 and supporting a composite layup 106 (block 1202). For example, carrier transfer device 110 is loaded with a layup carrier 104 supporting the composite layup 106 (e.g., as shown in the image). Figure 38(As shown). The carrier transfer device 110 and the transfer end effector 302 are positioned relative to each other to pick up and remove the layup carrier 104 (e.g., as shown). Figure 6 (As shown). The magnetic chuck 310 is indexed and moved to contact the layup carrier 104 and / or the composite layup 106 supported on the layup carrier 104 (e.g., as shown). Figure 27 and Figure 28 (As shown). The magnetic chuck actuator 324 positions the magnet 320 to magnetically engage with the base plate 124 of the layup carrier 104 (e.g., as shown). Figures 7-9 (As shown).

[0120] In one or more examples, method 1200 includes the step of reorienting the layup carrier 104 (block 1204). For example, a transfer end effector 302 picks up and removes (e.g., lifts) the layup carrier 104 and the composite layup 106 supported on the layup carrier 104 from the carrier transfer device 110. The transfer end effector 302 rotates about the axis of rotation 322 to flip the layup carrier 104 such that the placement end effector 304 can access the base plate 124 (e.g., as shown in the image). Figure 10 , Figure 11 , Figure 31 and Figure 33 (As shown).

[0121] In one or more examples, method 1200 includes the step of applying a maintaining vacuum to the layup carrier 104 (block 1206). For example, the transfer end effector 302 and the placement end effector 304 are positioned relative to each other for the transfer of the layup carrier 104 (e.g., as shown in the image). Figure 31 and Figure 33 (As shown). The vacuum chuck 312 is indexed and moved to contact the base plate 124 of the layup carrier 104 (e.g., as shown). Figure 13 , Figure 29 and Figure 30 (As shown). The vacuum chuck 312 applies a maintaining vacuum to the layup carrier 104 using a vacuum stage 344 or multiple vacuum cups 360.

[0122] In one or more examples, method 1200 includes the step of magnetically disengaging the ply carrier 104 (block 1208). For example, a magnetic chuck actuator 324 positions the magnet 320 to magnetically disengage from the base plate 124 of the ply carrier 104 (e.g., as shown in the image). Figures 7-9 (As shown). The placement end effector 304 picks up and removes (e.g., lifts up) the layup carrier 104 and the composite layup 106 supported on the layup carrier 104 from the transfer end effector 302.

[0123] In one or more examples, method 1200 includes the step of applying a composite layup 106 to a forming tool 120 (block 1210). For example, an end effector 304 is positioned relative to the forming tool 120 to place (e.g., apply) the layup carrier 104 (e.g., as shown in the image). Figure 32 and Figure 34 (As shown). The end effector 304 moves the composite layup 106 into contact with the forming surface 118 of the forming tool 120 and presses (e.g., stamps) the layup carrier 104 onto the forming surface 118 and thus presses (e.g., stamps) the composite layup 106 onto the forming surface 118.

[0124] It is understandable that the construction of the vacuum suction cup 312, such as the use of the vacuum stage 344 or the vacuum cup 360, can depend on various manufacturing factors, such as the composite structure 102 being manufactured. Figure 36 The type of composite layup 106, the size and / or shape of the forming tool 120, etc. As an example, a vacuum stage 344 can be used to place the composite layup 106 on the forming tool 120, wherein a portion of the forming surface 118 on which the composite layup 106 is placed is typically flat (e.g., as shown in the image). Figure 34 (As shown). As another example, the vacuum cup 360 can be used to place the composite layup 106 on the forming tool 120, wherein a portion of the forming surface 118 on which the composite layup 106 is placed has a contour (e.g., as shown). Figure 32 (As shown).

[0125] In one or more examples, method 1200 includes the step of forming curvature in the layup carrier 104 and thus in the composite layup 106 using a forming member 362. It will be understood that the shape and / or degree of curvature of the profile formed using the forming member 362 can depend on various factors, such as the composite structure 102 being manufactured ( Figure 36 The type of composite layup 106, the size and / or shape of the forming tool 120, etc. The curvature forming step is performed before the step of applying the composite layup 106 to the forming tool 120 (box 1210).

[0126] In one or more examples, method 1200 includes the step of stopping the holding vacuum on selected portions of the layup carrier 104 (block 1212). For example, composite layup 106 is pinned to forming tool 120 via a resin matrix. Vacuum chuck 312 selectively stops (e.g., removes) the holding vacuum from selected portions of the layup carrier 104 to release film 126 from base plate 124 and composite layup 106 attached (e.g., adhered to via resin matrix) to film 126, while selectively applying (e.g., maintaining) holding vacuum to selected different portions of the layup carrier 104 to hold base plate 124 on vacuum chuck 312.

[0127] In one or more examples, method 1200 includes the step of releasing the composite layup 106 from the layup carrier 104 (block 1214). For example, the end effector 304 is moved away from the forming tool 120 to retain the layup carrier 104 (e.g., base plate 124) and leave the composite layup 106 with the attached film 126 on the forming tool 120.

[0128] In one or more examples, method 1200 includes the step of returning the layup carrier 104. For example, transfer end effector 302 and placement end effector 304 are positioned relative to each other to transfer the layup carrier 104 back to transfer end effector 302. Magnetic chuck actuator 324 positions magnet 320 to magnetically engage with base plate 124 of layup carrier 104. Vacuum chuck 312 selectively deactivates (e.g., removes) the holding vacuum from layup carrier 104 to release layup carrier 104. Carrier transfer device 110 and transfer end effector 302 are positioned relative to each other to return layup carrier 104 to carrier transfer device 110. Carrier transfer device 110 is reloaded with another composite layup 106 supported on layup carrier 104.

[0129] In one or more examples, the above operations are repeated multiple times to transfer and place any number of composite material layups 106.

[0130] Now for reference Figures 36-41 By way of example, this disclosure further relates to a system for manufacturing composite structures (referred to herein as "system" 100). References Figure 42 By way of example, this disclosure further relates to a method of manufacturing a composite structure. This disclosure also relates to a composite structure 102 manufactured using system 300 and / or system 100 or according to method 1200 and / or method 1000.

[0131] Examples of system 100 and method 1000 enable the automated manufacturing of composite structure 102, and more specifically, the automated manufacturing of at least one composite layup 106 and the formation of at least one composite layup 106 over a forming tool 120 used to manufacture composite structure 102. Automation of the manufacturing process can reduce processing time, labor and costs, and / or reduce process variations (e.g., human error) that could lead to undesirable inconsistencies in the finished composite structure compared to conventional composite manufacturing. System 100 and method 1000 are also capable of applying and forming composite materials ply-by-ply to manufacture composite structure 102. Ply-by-ply formation facilitates the manufacture of large composite structures, thick composite structures, and / or composite structures with complex shapes. Ply-by-ply formation can also reduce buckling or wrinkling of the layups within the composite structure compared to conventional composite manufacturing.

[0132] refer to Figure 36 and Figure 37 These illustrations schematically depict examples of the disclosed system 100. System 100 includes multiple subsystems that facilitate and correspond to different manufacturing operations associated with the manufacture of the composite structure 102. The subsystems of system 100 are interconnected and cooperate to automate at least a portion of the manufacturing process. Throughout this disclosure, the subsystems of the disclosed system 100 may be referred to as the "system" itself or as stations in which one or more manufacturing operations occur.

[0133] Examples of the system 100 and method 1000 described herein utilize multiple semi-automatic or automated subsystems to perform ply-by-ply formation and compaction of individual composite plies 106 on a forming tool 120. Ply-by-ply formation refers to laying the composite plies 106 onto the forming tool 120 in a predetermined sequence and / or predetermined ply angle, and compacting the composite plies 106 individually onto the forming tool 120 after laying each composite ply 106 or after laying more than one composite ply 106.

[0134] In one or more examples, system 100 includes a lamination system 112 (e.g., a lamination subsystem or station), a transfer and placement system 300 (also collectively referred to herein as a transfer system or placement system (e.g., a transfer and placement subsystem or station)), and a forming system 122 (e.g., a forming subsystem or station). In one or more examples, system 100 also includes a trimming system 114 (e.g., a trimming subsystem or station) and a waste removal system 142 (e.g., a waste removal subsystem of a station). In one or more examples, system 100 further includes a film removal system 160 (e.g., a film removal subsystem or station). In one or more examples, system 100 additionally includes a carrier preparation system 162 (e.g., a carrier preparation subsystem or station). In one or more examples, system 100 also includes a positioning system 144 (e.g., a positioning subsystem).

[0135] Typically, the layup carrier 104 is movable relative to any individual subsystem or station of system 100. Once at least one composite layup 106 is formed on the layup carrier 104, the layup carrier 104 facilitates the sequential transfer of the composite layup 106 to the various subsystems or stations of system 100. The carrier transfer device 110 supports the layup carrier 104 and moves the layup carrier 104 between subsystems of system 100 that perform the composite layup manufacturing operations of the composite material manufacturing process.

[0136] In one or more examples, system 100 includes a tool transfer device 146. The tool transfer device 146 is configured to transfer the forming tool 120. For example, the tool transfer device 146 includes or takes the form of a moving platform that supports the forming tool 120 and moves the forming tool 120 between subsystems of system 100 that perform composite structure manufacturing operations in the composite material manufacturing process.

[0137] refer to Figures 38-41 , Figures 38-41 Examples of carrier transfer device 110 and layup carrier 104 are schematically illustrated. In one or more examples, film 126 is releasably coupled to base plate 124 via vacuum holding. In these examples, base plate 124 facilitates vacuum movement through layup carrier 104 and engagement of film 126. For example, carrier transfer device 110 includes vacuum stage 130 (e.g., Figures 38-40 And the base plate 124 includes a plurality of vacuum holes 128 (e.g., Figure 41 Multiple vacuum holes 128 allow vacuum movement through the base plate 124. With the layup carrier 104 positioned on the carrier transfer device 110, the vacuum stage 130 is in fluid communication with the multiple vacuum holes 128. The vacuum stage 130 includes a perforated top and a vacuum chamber in fluid communication with a vacuum source. The vacuum stage 130 is configured to apply a holding vacuum to the multiple vacuum holes 128 of the base plate 124 to temporarily hold and retain the film 126 on the base plate 124.

[0138] In one or more examples, the carrier transfer device 110 includes parts and components (e.g., vacuum sources, vacuum ports, conduits, actuators, valves, etc.) capable of generating, applying, and selectively controlling a vacuum. The vacuum source (e.g., a vacuum pump) may be a component of system 100 or part of a subsystem of system 100 (e.g., positioning system 144). Alternatively, the vacuum source may be an integral part of the carrier transfer device 110. In production, a vacuum stage 130 provides a maintaining vacuum, which is then applied to the diaphragm 126 through a plurality of vacuum holes 128 formed in a base plate 124.

[0139] refer to Figure 39 and Figure 40In one or more examples, the vacuum stage 130 includes a plurality of vacuum zones 204. Each of the plurality of vacuum zones 204 is controllable to selectively direct vacuum onto a set of corresponding vacuum holes 128 located above the respective vacuum zone 204. Figure 41 Vacuum is applied and removed. For example, each of the plurality of vacuum zones 204 includes a valve 206 that selectively opens or closes to control the application of vacuum to the corresponding vacuum zone 204. Vacuum zones 204 enable vacuum stage 130 to apply vacuum where it is necessary to hold the film 126 on the substrate 124. Vacuum zones 204 also enable vacuum stage 130 to stop applying vacuum to select areas of substrate 124, such as during the removal of waste residue from composite layup 106 after trimming operations. Vacuum stage 130 and a plurality of vacuum holes 128 formed in substrate 124 are arranged to adequately distribute sufficient holding vacuum to hold the film 126 on the surface of substrate 124 during the movement of layup carrier 104 through system 100.

[0140] In one or more examples, the vacuum stage 130 includes a plurality of lip seals 208. Each lip seal 208 is located between adjacent vacuum zones 204. For example, the lip seal 208 forms the outer boundary of the vacuum zones 204 and isolates each of the vacuum zones 204 from its adjacent counterpart. The plurality of lip seals 208 provide a sealing interface with the base plate 124 without affecting the surface flatness of the vacuum stage 130.

[0141] refer to Figure 38 , Figure 40 and Figure 41 In one or more examples, system 100 includes an indexing structure 140. The indexing structure 140 is configured to operably position the ply carrier 104 at a designated location on the carrier transfer device 110. In one or more examples, the indexing structure 140 includes mating components located on the base plate 124 of the carrier transfer device 110 and the ply carrier 104. For example, as... Figure 40 and Figure 41 As shown, the carrier transfer device 110 includes at least one indexing pin 200 (e.g., at least two indexing pins 200) and the base plate 124 includes at least one indexing hole 202 corresponding to the indexing pin 200 (e.g., at least two indexing holes 202). The indexing pin 200 and the indexing hole 202 cooperate to position the layup carrier 104 on the carrier transfer device 110.

[0142] Refer again Figure 37The subsystems of system 100 are typically arranged within a manufacturing environment in an operational sequence relative to each other. In one or more examples, lamination system 112 is sequentially associated with carrier preparation system 162. In one or more examples, trimming system 114 is sequentially associated with lamination system 112. In one or more examples, waste removal system 142 is sequentially associated with trimming system 114. In one or more examples, transfer and placement system 300 is sequentially associated with waste removal system 142. In one or more examples, forming system 122 is sequentially associated with transfer and placement system 300. In one or more examples, film removal system 160 is sequentially associated with forming system 122.

[0143] It should be recognized that not every subsystem is necessary, or that some subsystems may not be used in every implementation of the disclosed system 100. For example, in some implementations, the carrier preparation system 162, trimming system 114, and / or waste removal system 142 may not be used in the fabrication of the composite structure 102, and therefore may not be included as subsystems within system 100. Thus, in one or more examples, the transfer and placement system 300 is sequentially associated with the lamination system 112.

[0144] In one or more examples, carrier transfer device 110 conveys layup carrier 104 to carrier preparation system 162 to prepare layup carrier 104. In one or more examples, carrier transfer device 110 conveys layup carrier 104 from carrier preparation system 162 to lamination system 112 to apply composite layup 106 to layup carrier 104. In one or more examples, carrier transfer device 110 conveys layup carrier 104 and composite layup 106 supported on layup carrier 104 from lamination system 112 to trimming system 114 to cut composite layup 106. In one or more examples, carrier transfer device 110 conveys layup carrier 104 and composite layup 106 supported on layup carrier 104 from trimming system 114 to waste removal system 142 to remove residue (e.g., waste composite) from layup carrier 104 after cutting. In one or more examples, carrier transfer device 110 transfers layup carrier 104 and composite layup 106 supported on layup carrier 104 from trimming system 114 to transfer and placement system 300 to apply composite layup 106 onto forming tool 120.

[0145] In one or more examples, the tool transfer device 146 conveys the forming tool 120 to the transfer and placement system 300 to apply the composite layup 106 onto the forming tool 120. In one or more examples, the tool transfer device 146 conveys the forming tool 120 and the composite layup 106 applied to the forming tool 120 from the transfer and placement system 300 to the forming system 122 to form and compact the composite layup 106 over the forming tool 120. In one or more examples, the tool transfer device 146 conveys the forming tool 120 and the composite layup 106 formed over the forming tool 120 from the forming system 122 to the film removal system 160 to remove the film 126 from the composite layup 106.

[0146] Positioning system 144 can be any suitable system that guides carrier transfer device 110 and tool transfer device 146 along a predetermined workflow or path. In one or more examples, positioning system 144 is configured to selectively position carrier transfer device 110 relative to various subsystems or workstations of system 100 (e.g., carrier preparation system 162, lamination system 112, trimming system 114, waste removal system 142, and transfer and placement system 300). In one or more examples, positioning system 144 is configured to selectively position tool transfer device 146 relative to various subsystems or workstations of system 100 (e.g., transfer and placement system 300, forming system 122, and film removal system 160).

[0147] In one or more examples, such as Figure 38 As shown, the positioning system 144 includes a rail assembly 168 or similar conveyor assembly that physically guides the carrier transfer device 110 and the tool transfer device 146 through the system 100. In these examples, the carrier transfer device 110 and the tool transfer device 146 may include a trolley, pallet, carriage, or similar platform configured to travel along the rail assembly 168. Thus, in these examples, the positioning system 144, the carrier transfer device 110, and the tool transfer device 146 include cooperating parts and components (e.g., drive motors, tracks, actuators, gears, wheels, sensors, etc.) capable of selectively controlling the transport of the carrier transfer device 110 and the tool transfer device 146 along the positioning system 144.

[0148] In one or more examples, positioning system 144 includes a linear carrier guide. The linear carrier guide is configured to operatively translate carrier transfer device 110 through a subsystem or workstation of system 100, for example, along a linear workflow path. For example, a portion of guide rail assembly 168 dedicated to conveying carrier transfer device 110 is a linear segment with discrete ends.

[0149] In one or more examples, positioning system 144 includes a linear tool guide. The linear tool guide is configured to operatively translate tool transfer device 146 through a subsystem or workstation of system 100, for example, along a linear workflow path. For example, a portion of guide rail assembly 168 dedicated to conveying tool transfer device 146 is a linear segment with discrete ends.

[0150] In one or more examples, positioning system 144 includes a closed-loop carrier guide. The closed-loop carrier guide is configured to operatively circulate carrier transfer device 110, for example, along a continuous workflow path through a subsystem or workstation of system 100. For example, a portion of guide rail assembly 168 dedicated to conveying carrier transfer device 110 is a continuous loop.

[0151] In one or more examples, positioning system 144 includes a closed-loop tool guide. The closed-loop tool guide is configured to operatively circulate tool transfer device 146, for example, along a continuous workflow path through a subsystem or workstation of system 100. For example, a portion of guide rail assembly 168 dedicated to conveying tool transfer device 146 is a continuous loop.

[0152] In any example configuration of the positioning system 144 described above (e.g., using a translational workflow or a continuous workflow), the positioning system 144 includes an access area capable of loading and unloading the carrier transfer device 110 and the tool transfer device 146.

[0153] In one or more examples, system 100 utilizes a plurality of carrier transfer devices 110. Each of the plurality of carrier transfer devices 110 transfers a corresponding one of a plurality of plywood carriers 104 through system 100. Therefore, in production, multiple operations can be performed simultaneously on different plywood carriers among the plurality of plywood carriers 104, thereby reducing cycle time. Similarly, in one or more examples, system 100 utilizes a plurality of tool transfer devices 146. Each of the plurality of tool transfer devices 146 transfers a corresponding one of a plurality of forming tools 120 through system 100. Therefore, in production, multiple operations can be performed simultaneously on different forming tools among the plurality of forming tools 120, thereby reducing cycle time.

[0154] Now for reference Figure 41 , Figure 41 The system 100 (e.g., is shown) is used. Figure 36 and Figure 37 An example of a method 1000 for manufacturing composite structure 102 (shown in the figure).

[0155] In one or more examples, method 1000 includes the step of preparing a layup carrier 104 using a carrier preparation system 162 (box 1002). Method 1000 includes the step of selectively applying a holding vacuum using a carrier transfer device 110 to hold a film 126 on a substrate 124 (box 1004). Method 1000 includes the step of transferring the layup carrier 104 to a lamination system 112 using the carrier transfer device 110 (box 1006). Method 1000 includes the step of selectively applying a composite layup 106 to the layup support surface 108 of the layup carrier 104 using the lamination system 112 (box 1008). Method 1000 includes the step of transferring the layup carrier 104 from the lamination system 112 to a trimming system 114 using the carrier transfer device 110 (box 1010). Method 1000 includes the step of selectively cutting the composite layup 106 into a predetermined shape using the trimming system 114 (box 1012). Method 1000 includes the step of selectively cutting at least one layer of composite layup 106 (box 1012) followed by the step of removing residue of at least one layer of composite layup 106 from the layup support surface 108 using a waste removal system 142 (box 1014). Method 1000 includes the step of transferring a layup carrier 104 from a trimming system 114 to a transfer and placement system 300 using a carrier transfer device 110 (box 1016). Method 1000 includes the step of removing the layup carrier 104 from the carrier transfer device 110 (box 1018) and the step of reorienting (e.g., rotating) the layup carrier 104 using a transfer device 400 of the transfer and placement system 300 (box 1022). Method 1000 includes the step of maintaining a vacuum using a placement device 402 of the transfer and placement system 300 to hold the film 126 on the substrate 124 (box 1020).

[0156] In one or more examples, method 1000 includes the step of conveying forming tool 120 to transfer and placement system 300 using tool transfer device 146 (block 1024). Method 1000 includes the step of applying composite layup 106 to at least a portion of forming surface 118 of forming tool 120 using placement device 402 of transfer and placement system 300 (block 1026). For example, layup carrier 104 is positioned at a predefined location along forming tool 120 according to a predetermined layup sequence. Layup carrier 104 is oriented such that composite layup 106 is parallel to at least a portion of forming surface 118 of forming tool 120. Layup carrier 104 is pressed against forming tool 120 to compress composite layup 106 against a portion of forming surface 118 of forming tool 120. In one or more examples, layup carrier 104 may deform when pressed against forming tool 120, thereby allowing composite layup 106 to be applied to a larger portion of contour forming surface 118.

[0157] In one or more examples, method 1000 includes the steps of releasing film 126 from base plate 124 after applying composite layup 106 to at least a portion of forming surface 118 of forming tool 120 (block 1026) and removing layup carrier 104 (e.g., base plate 124) from forming tool 120 using placement device 402 of transfer and placement system 300. For example, method 1000 includes the step of selectively removing the maintaining vacuum to release film 126 from base plate 124 while holding base plate 124 using placement device 402 of transfer and placement system 300 (block 1028). After composite layup 106 is applied to forming tool 120, composite layup 106 is coupled (e.g., adhered or pinned) to forming surface 118 and film 126 is held coupled (e.g., adhered or pinned) to composite layup 106 by the resin matrix of composite layup 106.

[0158] In one or more examples, method 1000 includes the step of transferring forming tool 120 from transfer and placement system 300 to forming system 122 using tool transfer device 146 (box 1030). Method 1000 includes the step of forming composite material layup 106 over at least a portion of forming surface 118 of forming tool 120 using forming system 122 (box 1032). Method 1000 includes the step of removing film 126 from composite material layup 106 using film removal system 160 (box 1034). The step of removing film 126 is performed after the step of forming composite material layup 106 (box 1032) (box 1034).

[0159] In one or more examples, method 1000 includes the step of returning the layup carrier 104 (e.g., base plate 124) to the carrier transfer device 110 using the transfer and placement system 300 (box 1036). The step of returning the layup carrier 104 is performed after the step of applying the composite layup 106 to the forming tool 120 (box 1026) (box 1036).

[0160] In one or more examples, the above operations are repeated multiple times to fully form the composite structure 102 (box 1038), at which point the process terminates. In one or more examples, multiple composite material layups 106 are sequentially fabricated and applied to and formed over the forming tool 120 according to a layup-by-layup sequence. For example, a first layer of the multiple composite material layups 106 is applied to and formed over a first portion of the forming tool 120. During a second iteration of the above process, a second layer of the multiple composite material layups 106 is applied to and formed over a second portion of the forming tool 120. This iterative process is repeated until the composite structure 102 is formed.

[0161] In one or more examples, the forming tool 120 may be located simultaneously at both the transfer and placement system 300 and the forming system 122. For example, a first portion of the forming tool 120 may be transferred to the transfer and placement system 300 to apply a first layer of a plurality of composite layups 106. While a second portion of the forming tool 120 is transferred to the transfer and placement system 300, the first portion of the forming tool 120 may then be transferred to the forming system 122. While the first layer of the composite layup 106 is formed over the forming tool 120, a second layer of the composite layup 106 may be applied to the second portion of the forming tool 120. Thus, the steps of applying the second layer of the composite layup 106 (box 1026) and forming the first layer of the composite layup 106 (box 1032) are performed simultaneously, thereby reducing cycle time.

[0162] In one or more examples, the step of transferring the plywood carrier (e.g., blocks 1006, 1010, and 1016) includes the step of operatively translating the carrier transfer device 110 between the carrier preparation system 162, lamination system 112, trimming system 114 (where applicable), waste removal system 142 (where applicable), and transfer and placement system 300. In one or more examples, the step of transferring the plywood carrier (e.g., blocks 1006, 1010, and 1016) includes the step of operatively circulating the carrier transfer device 110 through the carrier preparation system 162, lamination system 112, trimming system 114 (where applicable), waste removal system 142 (where applicable), and transfer and placement system 300.

[0163] In one or more examples, the step of transferring the forming tool 120 (e.g., boxes 1024 and 1030) includes the step of operatively translating the tool transfer device 146 between the transfer and placement system 300, the forming system 122, and the film removal system 160. In one or more examples, the step of transferring the forming tool 120 (e.g., boxes 1024 and 1030) includes the step of operatively circulating the tool transfer device 146 through the transfer and placement system 300, the forming system 122, and the film removal system 160.

[0164] refer to Figure 36 In one or more examples, system 100 includes controller 158. In one or more examples, controller 158 is configured to control the operation of system 100 and / or implement the operational steps of method 1000. In one or more examples, controller 158 is configured to control the operation of system 300 and / or implement the operational steps of method 1200.

[0165] The controller 158 communicates with and is programmed to control the operation of at least one of the carrier transfer device 110, tool transfer device 146, positioning system 144, carrier preparation system 162, lamination system 112, trimming system 114, waste removal system 142, transfer and placement system 300, forming system 122, and film removal system 160. In one or more examples, the on-demand fabrication, transfer, application, and formation of the composite material layup 106 is facilitated by the controller 158. The controller 158 can be any device capable of facilitating communication between itself and the various subsystems of system 100. For example, the controller 158 can be a computer workstation, a programmable logic controller (PLC), a mobile device, or other electronic controller.

[0166] In one or more examples, one or more components, devices, or subsystems of system 100 and / or system 300 may include a dedicated controller that communicates with and receives instructions from controller 158.

[0167] In one or more examples, controller 158 is programmed to track multiple composite material layups 106 manufactured during the fabrication of composite structure 102. For example, controller 158 tracks which of the multiple composite material layups 106 is manufactured, applied, and formed during the composite structure fabrication process according to the layup sequence. In one or more examples, controller 158 is programmed to track multiple layup carriers 104 and / or carrier transfer devices 110 flowing through system 100. In one or more examples, controller 158 is programmed to track multiple forming tools 120 and / or tool transfer devices 146 flowing through system 100.

[0168] In one or more examples, system 100 is configured to perform multiple operations substantially simultaneously or concurrently. For example, while transferring and applying a second composite layup 106 onto a forming tool 120 (e.g., the same forming tool in a translational workflow or different forming tools in a continuous workflow), a third composite layup 106 may be cut, and a fourth composite layup 106 may be laid, a first composite layup 106 may be formed over the forming tool 120. Thus, more than one carrier transfer device 110 and therefore more than one composite layup 106 can be moved through system 100 simultaneously, and more than one forming tool 120 and therefore more than one composite structure 102 can be moved through system 100 simultaneously.

[0169] In one or more examples, controller 158 is programmed to control more than one subsystem and therefore perform more than one operation simultaneously or in parallel. In one or more examples, controller 158 is programmed to control all subsystems and therefore perform all operations simultaneously or in parallel.

[0170] Now for reference Figures 43-45 Examples of system 100, system 300, method 1000, and method 1200 can be compared with aircraft manufacturing and maintenance method 1100 (e.g., Figure 45 (as shown in the flowchart) and aircraft 700 (as shown in the flowchart) Figure 43 (Illustratively shown) Used in connection with or in the context of this invention. The composite structure 102 manufactured using system 100 or according to method 1000 can be any of the structure, component, sub-component, part, component, or any other part of the aircraft 700, such as the airframe, interior, and one or more advanced systems. For example, the composite structure 102 can be any of the aircraft spars, wing sections, fuselage sections, internal panels, external skin panels, etc.

[0171] Figure 43 An example of an aircraft 700 is schematically shown. The aircraft 700 includes multiple advanced systems 800. Examples of advanced systems 800 include one or more of a propulsion system 810, an electrical system 802, a hydraulic system 804, and an environmental control (“environment”) system 806. In other examples, the aircraft 700 may include any number of other types of systems, such as communication systems, flight control systems, guidance systems, weapon systems, etc.

[0172] The aircraft 700 includes at least one composite structure 102. The composite structure 102 is manufactured at least in part using system 100 and / or method 1000. The aircraft 700 may include multiple components, including fuselage 710, airframe 720, airframe tube 730, interior 808, wing 740 and / or stabilizer 750.

[0173] In one or more examples, the composite structure 102 includes at least one composite material layup 106, such as multiple composite material layups 106. The composite structure 102 can form a composite part or portion of any suitable component of the aircraft 700. As an example, and as... Figure 43 As shown, the aircraft 700 includes a skin segment 790 that covers and / or forms the outer surface of any suitable part of the aircraft 700 and / or a plurality of longitudinal beams 770 that, together with a plurality of frames, can support the inner surface of the skin segment 790.

[0174] Figure 44An example of a wing 740 is schematically shown. In one or more examples, the wing 740 includes a plurality of wing spars 742 that may extend along the length of the wing 740. The wing 740 may also include a plurality of spars 744, which may also be referred to herein as ribs. The wing spars 742 and spars 744 may together form and / or define at least a portion of an internal support structure 746 for the wing 740, which may support the inner surface 748 of a skin section 790 covering the wing 740. The skin section 790 may also be referred to herein as a wing skin section.

[0175] Within the scope of this disclosure, skin segments 790 (e.g., wing skin or fuselage skin), longitudinal beams 770 (e.g., fuselage longitudinal beams), frames (e.g., multi-piece frames or one-piece frames), wing longitudinal beams 742, wing spars 744, internal support structures 746, floor beams, internal panels, or various other components may be formed at least partially or even entirely of composite material layups and / or may be composite parts that can be formed using the systems 100, 300, 1000, and / or 1200 disclosed herein.

[0176] refer to Figure 45 During pre-production, method 1100 includes the specification and design of aircraft 700 (box 1102) and material procurement (box 1104). During the production of aircraft 700, the manufacturing of components and sub-assemblies of aircraft 700 (box 1106) and system integration (box 1108) are carried out. Subsequently, aircraft 700 is certified and delivered (box 1110) for service (box 1112). Routine maintenance and overhaul (box 1114) includes modification, reconfiguration, refurbishment, etc., of one or more systems of aircraft 700. For example, the composite structure 102 manufactured according to method 1000 can be produced during material procurement (box 1104), component and sub-assembly manufacturing (box 1106), and / or maintenance and overhaul (box 1114).

[0177] Figure 45 Each process of method 1100 shown may be performed or implemented by a system integrator, a third party, and / or an operator (e.g., a customer). For the purposes of this specification, a system integrator may include, but is not limited to, any number of spacecraft manufacturers and major system subcontractors; a third party may include, but is not limited to, any number of distributors, subcontractors, and suppliers; and an operator may be an airline, leasing company, military entity, service organization, etc.

[0178] Examples of the aircraft 700, composite structure 102, system 100, system 300, method 1000, and method 1200 shown and described herein can be found in... Figure 45This is employed during any one or more stages of the manufacturing and maintenance method 1100 shown in the flowchart. In one example, embodiments of system 100, system 300, method 1000, and method 1200 may form part of component and sub-component manufacturing (block 1106) and / or system integration (block 1108). For example, a composite structure 102 manufactured using embodiments of the disclosed system 100, system 300, method 1000, and method 1200 may correspond to component and sub-component manufacturing (block 1106) and may be used in a manner similar to that of a component or sub-component prepared when the aircraft 700 is put into service (block 1112). Moreover, embodiments of the disclosed system 100, system 300, method 1000, and method 1200 may be used during system integration (block 1108) and certification and delivery (block 1110). Similarly, implementations of the disclosed system 100, system 300, method 1000, and method 1200 may be utilized, for example, but not limited to, when the aircraft 700 is put into service (box 1112) and during maintenance and overhaul (box 1114).

[0179] Therefore, refer to Figures 1-44 It also discloses a method for manufacturing an aircraft 700 using system 100 and / or system 300. Figure 43 The method is part of the method. A part of the aircraft 700 manufactured according to method 1000 or method 1200 is also disclosed.

[0180] Although aerospace examples are shown, the examples and principles disclosed herein can be applied to other industries, such as the automotive, aerospace, construction, and other design and manufacturing sectors. Therefore, in addition to aircraft, the examples and principles disclosed herein can also be applied to systems for disinfecting the interiors of other types of transportation (e.g., land vehicles, marine vehicles, space vehicles, etc.) and freestanding structures.

[0181] As used herein, a system, device, apparatus, structure, article, element, component, or hardware "constructed to" perform a specified function is indeed capable of performing the specified function without any changes, rather than merely having the potential to perform the specified function after further modification. In other words, a system, device, apparatus, structure, article, element, component, or hardware "constructed to" perform the specified function is specifically selected, created, implemented, utilized, programmed, and / or designed for the purpose of performing the specified function. As used herein, "constructed to" indicate existing characteristics of the system, device, structure, article, element, component, or hardware that enable the system, device, structure, article, element, component, or hardware to perform the specified function without further modification. For the purposes of this disclosure, a system, device, apparatus, structure, article, element, component, or hardware described as "constructed to" perform a particular function may additionally or alternatively be described as "adapted" and / or "operable to" perform that function.

[0182] Unless otherwise stated, the terms “first,” “second,” “third,” etc., are used merely as identifiers in this document and are not intended to impose any order, position, or hierarchy requirements on the items referred to by these terms. Furthermore, references to items such as “second” do not require or exclude the existence of items such as “first” or lower-numbered items and / or items such as “third” or higher-numbered items.

[0183] As used herein, the phrase “at least one” when used with a list of items means that different combinations of one or more of the listed items may be used, and it may be necessary to have only one of each item in the list. For example, “at least one of items A, B, and C” may include, but is not limited to, item A or items A and B. This example may also include items A, B, and C, or items B and C. In other examples, “at least one” may be, for example, but not limited to, two items from item A, one item from item B, and ten items from item C; four items from item B and seven items from item C; and other suitable combinations.

[0184] For the purposes of this disclosure, the terms "coupled," "coupling," and similar terms mean that which are connected, linked, fastened, attached, joined, placed in communication, or otherwise associated with each other (e.g., mechanically, electrically, fluidly, optically, electromagnetically). In various examples, elements may be directly or indirectly associated. As one example, element A may be directly associated with element B. As another example, element A may be indirectly associated with element B, for example, via another element C. It is understood that not all associations between the various disclosed elements must be represented. Therefore, connections other than those shown in the figures may also exist.

[0185] As used herein, the term "about" means or indicates a condition that is close to, but not exactly, the condition that still performs the desired function or achieves the desired result. As an example, the term "about" means a condition within an acceptable predetermined tolerance or accuracy, such as a condition within 10% of the stated condition. However, the term "about" does not exclude a condition that is exactly the stated condition. As used herein, the term "substantially" means a condition that is substantially the condition that performs the desired function or achieves the desired result.

[0186] The above-mentioned Figure 36 In this text, boxes may represent functional elements, features, or components thereof, and the lines connecting the boxes do not necessarily imply any specific structure. Therefore, the illustrated structures can be modified, added to, and / or omitted. Furthermore, those skilled in the art will understand that, not only those mentioned above... Figures 1-34 , Figures 36-41 , Figure 43 and Figure 44 All elements, features, and / or components described and illustrated herein must be included in each example, and not all elements, features, and / or components not described herein must be described in every illustrative example. Therefore, Figures 1-34 , Figures 36-41 , Figure 43 and Figure 44 Some of the elements, features, and / or components described and illustrated herein may be combined in various ways without needing to include Figures 1-34 , Figures 36-41 , Figure 43 and Figure 44 Other features described and illustrated in the accompanying drawings and / or disclosures, even if one or more such combinations are not expressly stated herein. Similarly, additional features, not limited to the examples presented, may be combined with some or all of the features shown and described herein. Unless otherwise expressly stated, the features mentioned above... Figures 1-34 , Figures 36-41 , Figure 43 and Figure 44 The schematic diagrams depicting the examples are not intended to imply structural limitations regarding the illustrative examples. On the contrary, while an illustrative structure is indicated, it should be understood that this structure can be modified where appropriate. Therefore, modifications, additions, and / or omissions can be made to the illustrated structures. Furthermore, in Figures 1-34 , Figures 36-41 , Figure 43 and Figure 44 In each of these, elements, features, and / or components used for similar or at least substantially similar purposes are labeled with the same number, and these elements, features, and / or components may be referred to herein without reference. Figures 1-34 , Figures 36-41 , Figure 43 and Figure 44 Let's discuss each of them in detail. Similarly, in... Figures 1-34 , Figures 36-41 , Figure 43 and Figure 44 Each of these may not label all elements, features, and / or parts, but for consistency, the accompanying figure labels may be used herein.

[0187] The above-mentioned Figure 35 , Figure 42 and Figure 45 In this context, boxes may represent operations, steps, and / or parts thereof, and the lines connecting the boxes do not imply any particular order or dependency between the operations or their parts. It is understood that it is not necessary to represent all dependencies between the various publicly disclosed operations. Figure 35 , Figure 42 and Figure 45 The accompanying disclosure describing the operations of the methods set forth herein should not be construed as requiring a specific sequence of operations to be performed. Rather, while an illustrative order is indicated, it should be understood that the sequence of operations can be modified where appropriate. Therefore, the operations shown can be modified, added to, and / or omitted, and some operations can be performed in a different order or simultaneously. Furthermore, those skilled in the art will understand that not all described operations need to be performed.

[0188] Furthermore, references to features, advantages, or similar language used throughout this specification do not imply that all features and advantages achievable through the examples disclosed herein should be or are present in any single example. Rather, references to features and advantages are to be understood as meaning that a particular feature, advantage, or characteristic described in conjunction with an example is included in at least one example. Therefore, the discussion of features, advantages, and similar language used throughout this disclosure may, but does not necessarily, refer to the same example.

[0189] Furthermore, this disclosure includes embodiments pursuant to the following provisions: Clause 1. A system (300) for placing a composite material layup (106), the system (300) comprising: A transfer end effector (302) movable relative to a carrier transfer device (110), the carrier transfer device being configured to transfer a layup carrier (104) supporting the composite material layup (106); and The placement end effector (304) is movable relative to the transfer end effector (302) and the forming tool (120). in: The transfer end effector (302) is configured to remove the ply carrier (104) supporting the composite ply (106) from the carrier transfer device (110) and position the ply carrier (104) for removal by the placement end effector (304); and The placement end effector (304) is configured to remove the layup carrier (104) from the transfer end effector (302) and apply the composite layup (106) to the forming tool (120).

[0190] Clause 2. The system (300) according to Clause 1 further includes the layup carrier (104), wherein the layup carrier (104) comprises: Base plate (124); and A thin film (126) is located on the base plate (124) and forms a layup support surface (108) for the composite material layup (106).

[0191] Clause 3. The system (300) as described in Clause 2, wherein: The base plate (124) is magnetic; The transfer end effector (302) includes a magnetic chuck (310); The magnetic chuck (310) is configured to magnetically engage the base plate (124) to remove the layup carrier (104) from the carrier transfer device (110) via the transfer end effector (302); and The magnetic chuck (310) is further configured to magnetically detach from the base plate (124) to remove the layup carrier (104) from the transfer end effector (302) by the placement end effector (304).

[0192] Clause 4. The system (300) described in Clause 2 or 3, wherein: The placement end effector (304) includes a vacuum suction cup (312); and The vacuum chuck (312) is configured to selectively apply a holding vacuum to the base plate (124) to remove the layup carrier (104) from the transfer end effector (302) by the placement end effector (304).

[0193] Clause 5. The system (300) as described in Clause 4, wherein: The base plate (124) includes a plurality of vacuum holes (128); and The vacuum chuck (312) is further configured to apply the holding vacuum through the plurality of vacuum holes (128) to hold the film (126) on the base plate (124).

[0194] Clause 6. The system (300) described in any one of Clauses 1-5, wherein: The transfer end effector (302) includes: Transfer framework (314); and A magnetic chuck (310) is attached to the transfer frame (314) and includes a magnetic chuck contact surface (318); and The magnetic chuck (310) is movable relative to the transfer frame (314) to position the magnetic chuck contact surface (318) in contact with the composite material layup (106) supported by the layup carrier (104) for removal of the layup carrier (104) from the carrier transfer device (110) by the transfer end effector (302).

[0195] Clause 7. The system (300) according to Clause 6, wherein the magnetic chuck (310) further comprises: A magnetic chuck support member (328), which is connected to the transfer frame (314) and movable relative to the transfer frame (314); and Multiple magnets (320) are connected to the magnetic chuck support member (328).

[0196] Clause 8. The system (300) according to Clause 7, wherein the magnetic chuck (310) further includes a magnetic chuck flexible member (330) connected to the magnetic chuck support member (328) relative to the transfer frame (314).

[0197] Clause 9. The system (300) according to Clause 8, wherein the magnetic chuck (310) further includes a magnetic chuck pad (336) coupled to the magnetic chuck flexible member (330).

[0198] Clause 10. The system (300) according to Clause 8 or 9, wherein the plurality of magnets (320) are movable relative to the magnetic chuck support member (328).

[0199] Clause 11. The system (300) as described in Clause 10, wherein: The magnetic chuck flexible component (330) includes multiple magnet openings (332); and Each of the plurality of magnets (320) is located within a corresponding one of the plurality of magnet openings (332) of the magnetic chuck flexible member (330).

[0200] Clause 12. The system (300) according to Clause 10, wherein the magnetic chuck (310) further comprises: A plurality of magnetic chuck actuator rods (334) extending through the magnetic chuck support member (328) and connected to the plurality of magnets (320); and A magnetic chuck actuator (324) is configured to selectively extend or retract the plurality of magnetic chuck actuator rods (334) relative to the magnetic chuck support member (328) to move the plurality of magnets (320).

[0201] Clause 13. The system (300) according to any one of Clauses 6-12, wherein the transfer end effector (302) further includes a plurality of clamps (326) configured to hold the layup carrier (104) against the magnetic chuck contact surface (318) of the magnetic chuck (310).

[0202] Clause 14. The system (300) according to any one of Clauses 6-13 further includes a transfer support platform (306) connected to the transfer frame (314) of the transfer end effector (302). The transfer end effector (302) is rotatable relative to the transfer support platform (306) about a rotation axis (322) to position the layup carrier (104) so ​​that it can be removed from the transfer end effector (302) by the placement end effector (304).

[0203] Clause 15. The system (300) described in any one of Clauses 6-14, wherein: The transfer end effector (302) further includes: A transfer actuator (348) is coupled to the transfer frame (314) and to the magnetic chuck (310); and A transfer guide (350) is connected to the transfer frame (314) and to the magnetic chuck (310). The transfer actuator (348) is configured to control the movement of the magnetic chuck (310) relative to the transfer frame (314) along a first movement axis (352); The transfer guide (350) is configured to guide the movement of the magnetic chuck (310) along the first moving axis (352); and The transfer guide (350) is further configured such that the magnetic chuck (310) can move relative to the transfer frame (314) along a floating axis (354) perpendicular to the first moving axis (352).

[0204] Clause 16. The system (300) according to any one of Clauses 6-15, wherein the transfer end effector (302) includes a first portion of a first indexing device (316) configured to cooperate with a second portion of the first indexing device (316) located on the carrier transfer device (110) to index the magnetic chuck (310) relative to the carrier transfer device (110).

[0205] Clause 17. The system (300) described in Clause 1 or 2, wherein: The placement end effector (304) includes: Placement frame (342); and A vacuum suction cup (312), the vacuum suction cup being connected to the placement frame (342) and including a vacuum suction cup contact surface (346); and The vacuum chuck (312) is movable relative to the placement frame (342) to position the vacuum chuck contact surface (346) to contact the layup carrier (104) supporting the composite layup (106) for removing the layup carrier (104) from the transfer end effector (302) by the placement end effector (304) and positioning the layup carrier (104) to apply the composite layup (106) to the forming tool (120) by the placement end effector (304).

[0206] Clause 18. The system (300) according to Clause 17, wherein the vacuum chuck (312) further includes a vacuum stage (344) configured to apply a holding vacuum to the layup carrier (104).

[0207] Clause 19. The system (300) according to Clause 18, wherein the vacuum stage (344) is configured to apply the maintaining vacuum to select a portion of the layup carrier (104).

[0208] Clause 20. The system (300) as described in Clause 19, wherein: The vacuum suction cup (312) further includes a vacuum suction cup support member (356) connected to the placement frame (342) and movable relative to the placement frame (342); and The vacuum stage (344) is connected to the vacuum suction cup support member (356).

[0209] Clause 21. The system (300) as described in Clause 20, wherein: The vacuum suction cup (312) further includes a flexible vacuum suction cup member (358) connected to the vacuum stage (344) opposite to the vacuum suction cup support member (356); and The flexible vacuum suction cup component (358) can be maintained by vacuum penetration.

[0210] Clause 22. The system (300) according to Clause 19, wherein the vacuum suction cup (344) further includes a plurality of vacuum cups (360) connected to and in fluid communication with the vacuum stage (344).

[0211] Clause 23. The system (300) according to Clause 22, wherein each of the plurality of vacuum cups (360) is deformable.

[0212] Clause 24. The system (300) according to Clause 22, wherein the vacuum chuck (344) further includes a forming member (362) coupled to the vacuum stage (344) and movable relative to the vacuum stage (344) and the plurality of vacuum cups (360).

[0213] Clause 25. The system (300) according to Clause 24, wherein the vacuum chuck (344) further includes a vacuum chuck flexible member (358) connected to the forming member (362) opposite to the vacuum stage (344).

[0214] Clause 26. The system (300) as described in Clause 24, wherein: The forming component (362) includes a plurality of vacuum cup openings (364); and Each of the plurality of vacuum cups (360) is located within a corresponding one of the plurality of vacuum cup openings (364) of the forming member (362).

[0215] Clause 27. The system (300) as described in Clause 24, wherein: The forming member (362) includes a forming surface (366); and The shaped surface (366) has a contour.

[0216] Clause 28. The system (300) as described in Clause 24, wherein: The vacuum chuck (312) further includes a forming actuator (368) coupled to the vacuum stage (344) and coupled to the forming member (362); and The forming actuator (368) is configured to control the movement of the forming member (362) relative to the vacuum stage (344).

[0217] Clause 29. The system (300) according to Clause 17, wherein the vacuum chuck (312) is pivotable about a pivot axis (340) relative to the placement frame (342) to orient the layup carrier (104) so ​​that the composite layup (106) is applied to the forming tool (120) by the placement end effector (302).

[0218] Clause 30. The system (300) according to Clause 17 further includes a placement support platform (308) of the placement frame (342) coupled to the placement end effector (304), wherein the placement end effector (304) is movable relative to the placement support platform (308) to position the layup carrier (104) to apply the composite layup (104) to the forming tool (120) via the placement end effector (304).

[0219] Clause 31. The system (300) as described in Clause 17, wherein: The placement end effector (304) further includes a placement actuator (370) coupled to the placement frame (342) and the vacuum chuck (312); and The placement actuator (370) is configured to control the movement of the vacuum chuck (312) relative to the placement frame (342).

[0220] Clause 32. The system (300) as described in Clause 17, wherein: The transfer end effector (302) includes a first part of the second indexing device (338); The placement end effector (304) includes a second portion of the second indexing device (338); and The first and second portions of the second indexing device (338) are configured to cooperate to index the placement end effector (304) relative to the transfer end effector (302).

[0221] Clause 33. A method (1000) for placing the composite material layup (106) using the system (300) according to Clause 1.

[0222] Clause 34. A transfer device (400), comprising: Magnetic chuck (310), comprising: Magnetic chuck support component (328); A magnet (320) is connected to the magnetic chuck support member (328). A flexible magnetic chuck member (330) is connected to the magnetic chuck support member (328); and A magnetic chuck actuator (324) is connected to the magnetic chuck support member (328) and the magnet (320). in: The magnetic chuck flexible component (330) is configured as a layup carrier (104) for contact-supporting composite material layup (106); Ning Que The magnetic chuck actuator (324) is configured to selectively move the magnet (320) relative to the magnetic chuck support member (328) and relative to the magnetic chuck flexible member (330) to magnetically engage or magnetically disengage from the layup carrier (104).

[0223] Clause 35. A method for transferring the composite material layup (106) using the transfer device (400) as described in Clause 34.

[0224] Clause 36. A placement device (402), comprising: Vacuum suction cup (312), including: Vacuum stage (344); and A flexible vacuum suction cup component (358) is connected to the vacuum stage (344). in: The vacuum suction cup flexible member (358) is configured as a layup carrier (104) for contact-supporting composite material layup (106); and The vacuum stage (344) is configured to selectively apply a holding vacuum to the layup carrier (104) via the vacuum suction cup flexible member (358).

[0225] Clause 37. A method for placing the composite material layup (106) using the placement device (402) as described in Clause 36.

[0226] Clause 38. A method (1200) for placing a composite material layup (106), the method (1200) comprising: Magnetically bonded to the layup carrier (104) supporting the composite material layup (106). Reorient the layup carrier (104); A holding vacuum is applied to the layup carrier (104); Magnetic detachment from the ply carrier (104); The composite material layup (106) is applied to the forming tool (120); Stop maintaining the vacuum on a selected portion of the layup carrier (104); and Release the composite material layup (106) from the layup carrier (104).

[0227] Clause 39. A system (300) for placing a composite material layup (106), the system (300) comprising: Transfer equipment (400); Placement device (402); and Controller (158), which communicates with and is programmed to: The transfer device (400) is used to magnetically bond the layup carrier (104) supporting the composite material layup (106). The transfer device (400) is used to reorient the layup carrier (104); A holding vacuum is applied to the layup carrier (104) using the placement device (402); The transfer device (400) is used to magnetically detach the layup carrier (104). The composite material layup (106) is applied to the forming tool (120) using the placement device (402); Using the placement device (402), the maintaining vacuum on a selected portion of the layup carrier (104) is stopped; and The composite material layup (106) is released from the layup carrier (104) using the placement device (402).

[0228] Clause 40. A manufacturing system (100) for manufacturing a composite structure (102), said system (100) comprising: A layup carrier (104) includes a layup support surface (108) configured to support at least one composite material layup (106). Carrier transfer device (110), the carrier transfer device being configured to transfer the layup carrier (104). A lamination system (112) configured to selectively apply the at least one composite layup (106) to the layup support surface (108) of the layup carrier (104). A transfer system (300) configured to remove the layup carrier (104) from the carrier transfer device (110) and apply the at least one composite material layup (106) to at least a portion of the forming surface (118) of the forming tool (120), wherein the transfer system (300) comprises: The transfer end effector (302) and placement end effector (304) as described in Clause 1; and A forming system (122) configured to form the at least one composite material layup (106) over at least a portion of the forming surface (118) of the forming tool (120).

[0229] Clause 41. A method (1000) for manufacturing a composite structure (102), said method (1000) comprising the following steps: The layup carrier (104) is transferred to the lamination system (112) using the carrier transfer device (110). At least one composite layup (106) is selectively applied to the layup support surface (108) of the layup carrier (104) using the lamination system (112); The carrier transfer device (110) is used to transfer the layup carrier (104) from the lamination system (112) to the transfer system (300). The transfer system (300) removes the layup carrier (104) from the carrier transfer device (110) and applies the at least one composite material layup (106) to at least a portion of the forming surface (118) of the forming tool (120), the transfer system (300) comprising: The transfer end effector (302) and placement end effector (304) as described in Clause 1; and The forming system (122) is used to form the at least one composite material layup (106) over at least a portion of the forming surface (118) of the forming tool (120).

[0230] The features, advantages, and characteristics described in one example can be combined in any suitable manner in one or more other examples. Those skilled in the art will recognize that the examples described herein can be practiced without the presence of one or more specific features or advantages of a particular example. In other instances, additional features and advantages that may not be present in all examples may be recognized in certain instances. Furthermore, while various examples of system 100, system 300, method 1000, and method 1200 have been shown and described, modifications will occur to those skilled in the art upon reading the specification. This application includes all such modifications and is limited only by the scope of the appended claims.

Claims

1. A system (300) for placing a composite material layup (106), the system (300) comprising: A transfer end effector (302) movable relative to a carrier transfer device (110), the carrier transfer device being configured to transfer a layup carrier (104) supporting the composite material layup (106); and The placement end effector (304) is movable relative to the transfer end effector (302) and the forming tool (120). in: The transfer end effector (302) includes a magnetic chuck (310) configured to magnetically engage the layup carrier (104) to support the composite layup (106), remove the layup carrier (104) from the carrier transfer device (110), and position the layup carrier (104) for removal by the placement end effector (304); and The placement end effector (304) is configured to remove the layup carrier (104) from the transfer end effector (302) and apply the composite layup (106) to the forming tool (120).

2. The system (300) according to claim 1, further comprising the layup carrier (104), wherein, The layup carrier (104) includes: Base plate (124); and A thin film (126) is located on the base plate (124) and forms a layup support surface (108) for the composite material layup (106).

3. The system (300) according to claim 2, wherein: The base plate (124) is magnetic; The magnetic chuck (310) is configured to magnetically engage the base plate (124) to remove the ply carrier (104) from the carrier transfer device (110) via the transfer end effector (302); and The magnetic chuck (310) is further configured to magnetically detach from the base plate (124) to remove the layup carrier (104) from the transfer end effector (302) by the placement end effector (304).

4. The system (300) according to claim 2 or 3, wherein: The placement end effector (304) includes a vacuum suction cup (312); and The vacuum chuck (312) is configured to selectively apply a holding vacuum to the base plate (124) to remove the layup carrier (104) from the transfer end effector (302) by the placement end effector (304).

5. The system (300) according to claim 1 or 2, wherein: The transfer end effector (302) includes: Transfer framework (314); and A magnetic chuck (310) is attached to the transfer frame (314) and includes a magnetic chuck contact surface (318); and The magnetic chuck (310) is movable relative to the transfer frame (314) to position the magnetic chuck contact surface (318) in contact with the composite material layup (106) supported by the layup carrier (104) to remove the layup carrier (104) from the carrier transfer device (110) by the transfer end effector (302).

6. The system (300) of claim 5, wherein, The magnetic chuck (310) further includes: A magnetic chuck support member (328), which is connected to the transfer frame (314) and movable relative to the transfer frame (314); and Multiple magnets (320) are connected to the magnetic chuck support member (328).

7. The system (300) of claim 6, wherein, The magnetic chuck (310) further includes a magnetic chuck flexible member (330) that is connected to the magnetic chuck support member (328) relative to the transfer frame (314).

8. The system (300) according to claim 5 further includes a transfer support platform (306) connected to the transfer frame (314) of the transfer end effector (302). in, The transfer end effector (302) is rotatable relative to the transfer support platform (306) about a rotation axis (322) to position the layup carrier (104) so ​​as to remove the layup carrier from the transfer end effector (302) by means of the placement end effector (304).

9. The system (300) according to claim 5, wherein: The transfer end effector (302) further includes: A transfer actuator (348) is coupled to the transfer frame (314) and to the magnetic chuck (310); and A transfer guide (350) is connected to the transfer frame (314) and to the magnetic chuck (310). The transfer actuator (348) is configured to control the movement of the magnetic chuck (310) relative to the transfer frame (314) along a first movement axis (352); The transfer guide (350) is configured to guide the movement of the magnetic chuck (310) along the first moving axis (352); and The transfer guide (350) is further configured such that the magnetic chuck (310) can move relative to the transfer frame (314) along a floating axis (354) perpendicular to the first moving axis (352).

10. The system (300) according to claim 5, wherein, The transfer end effector (302) includes a first portion of a first indexing device (316) configured to cooperate with a second portion of the first indexing device (316) located on the carrier transfer device (110) to index the magnetic chuck (310) relative to the carrier transfer device (110).

11. The system (300) according to claim 1 or 2, wherein: The placement end effector (304) includes: Placement frame (342); and A vacuum suction cup (312) is attached to the placement frame (342) and includes a vacuum suction cup contact surface (346); and The vacuum chuck (312) is movable relative to the placement frame (342) to position the vacuum chuck contact surface (346) to contact the layup carrier (104) supporting the composite layup (106) to remove the layup carrier (104) from the transfer end effector (302) by the placement end effector (304) and to position the layup carrier (104) to apply the composite layup (106) to the forming tool (120) by the placement end effector (304).

12. The system (300) according to claim 11, further comprising a placement support platform (308) connected to the placement frame (342) of the placement end effector (304), wherein, The placement end effector (304) is movable relative to the placement support platform (308) to position the layup carrier (104) so ​​as to apply the composite material layup (106) to the forming tool (120) via the placement end effector (304).

13. A method (1000) for placing the composite material layup (106) using the system (300) according to claim 1, the method comprising: The layup carrier (104) supporting the composite material layup (106) is transferred by the carrier transfer device (110). The end effector (304) is moved relative to the transfer end effector (302) and the forming tool (120); The layup carrier (104) is magnetically engaged using a magnetic chuck (310) to support the composite material layup (106), the layup carrier (104) is removed from the carrier transfer device (110), and the layup carrier (104) is positioned for removal by the placement end effector (304); and The placement end effector (304) removes the layup carrier (104) from the transfer end effector (302) and applies the composite layup (106) to the forming tool (120).

14. A manufacturing system (100) for manufacturing a composite structure (102), the manufacturing system (100) comprising: A layup carrier (104) includes a layup support surface (108) configured to support at least one composite material layup (106). Carrier transfer device (110), the carrier transfer device being configured to transfer the layup carrier (104). A lamination system (112) configured to selectively apply the at least one composite layup (106) to the layup support surface (108) of the layup carrier (104). A transfer system configured to remove the layup carrier (104) from the carrier transfer device (110) and apply the at least one composite layup (106) to at least a portion of the forming surface (118) of the forming tool (120), wherein the transfer system comprises: The transfer end effector (302) and placement end effector (304) according to claim 1; and A forming system (122) configured to form the at least one composite material layup (106) over at least a portion of the forming surface (118) of the forming tool (120).

15. A method (1000) for manufacturing a composite structure (102), the method (1000) comprising the following steps: The layup carrier (104) is transferred to the lamination system (112) using the carrier transfer device (110). At least one composite layup (106) is selectively applied to the layup support surface (108) of the layup carrier (104) using the lamination system (112). The carrier transfer device (110) is used to transfer the layup carrier (104) from the lamination system (112) to the transfer system; The transfer system removes the layup carrier (104) from the carrier transfer device (110) and applies the at least one composite material layup (106) to at least a portion of the forming surface (118) of the forming tool (120), the transfer system comprising: The transfer end effector (302) and placement end effector (304) according to claim 1; and The forming system (122) is used to form the at least one composite material layup (106) over at least a portion of the forming surface (118) of the forming tool (120).

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