Detection system, detection method and detection device

Abstract

The application discloses a detection system, a detection method and a detection device. The detection system is applied to a semiconductor detection device including at least one optical element. The detection system includes a detection device and a processing device. The detection device is used to acquire an optical signal formed by processing light rays in an optical path of the semiconductor detection device by the at least one optical element. The processing device is used to determine a use state of the at least one optical element based on the optical signal formed by processing the light rays in the optical path of the semiconductor detection device by the at least one optical element. The use state of the at least one optical element is determined to improve the use rate of the optical element and the service life of the optical element under the premise of ensuring the detection accuracy of the semiconductor detection device.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a detection system, a detection method, and a detection device. Background Technology

[0002] With societal progress, communication technology is receiving increasing attention. To facilitate daily life, people demand that semiconductor communication products become smaller, lighter, and more powerful. This requires semiconductor chips to have "small bodies and big functions," which inevitably demands higher testing accuracy from the semiconductor industry, especially the semiconductor testing industry.

[0003] However, semiconductor testing equipment typically includes several optical components. During use, prolonged exposure to high-power light inevitably damages these components. Damage to even one component can affect the overall testing accuracy of the entire system. Furthermore, in practical applications, multiple optical components may fail simultaneously. Crucially, optical components in the semiconductor industry are generally expensive and difficult to replace, sometimes requiring specialized technicians to spend considerable time and effort on repeated adjustments. Therefore, improving the utilization rate of optical components and extending their lifespan while maintaining the testing accuracy of semiconductor testing equipment has become a pressing technical challenge for the industry. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides a detection system, detection method, and detection equipment to improve the utilization rate of optical components in semiconductor detection equipment while ensuring the detection accuracy of the semiconductor detection equipment, thereby increasing the service life of the optical components.

[0005] To achieve the above objectives, the technical solution proposed in this application is as follows:

[0006] A detection system is applied to a semiconductor detection device, the semiconductor detection device including at least one optical element, the detection system comprising:

[0007] The detection device is used to acquire the optical signal formed by the processing of light in the optical path of the semiconductor detection device by the at least one optical element;

[0008] A processing device is used to determine the usage status of the at least one optical element by processing the light in the optical path of the semiconductor detection device based on the optical signal formed by the at least one optical element.

[0009] Optionally, the semiconductor detection device includes at least two optical elements, and the detection apparatus includes at least two optical signal detection elements. The optical signal detection elements correspond one-to-one with the optical elements and are used to acquire the optical signals formed by the corresponding optical elements processing the light in the optical path of the semiconductor detection device.

[0010] Optionally, the processing device is used to determine the usage status of the optical element based on preset parameters of the optical signal formed by processing the light in the optical path of the semiconductor detection device using the optical element;

[0011] The preset parameters include optical power, light spot uniformity, light spot roundness, and light spot M. 2 At least one of the factors.

[0012] Optionally, the processing device is also used to upload the usage status of the at least one optical element to a server.

[0013] Optionally, the detection system further includes:

[0014] A display device is used to display the usage status of the optical element.

[0015] Optionally, the processing device is further configured to issue a first prompt message when the usage state of the optical element meets a first preset condition.

[0016] Optionally, the first preset condition includes: at least one of the at least one optical element has optical damage.

[0017] Optionally, the detection system further includes:

[0018] An adjustment device is used to adjust the position of the optical element that has suffered optical damage, which is irradiated by light in the optical path, until the optical signal formed by the optical element that has suffered optical damage processing the light in the optical path meets a second preset condition.

[0019] Optionally, the adjustment device includes at least one adjustment element, which corresponds one-to-one with the optical element and is used to adjust the position of the corresponding optical element illuminated by the light in the optical path.

[0020] Optionally, the detection system further includes:

[0021] An alarm device that issues a prompt message when the usage status of at least one optical element meets a third preset condition.

[0022] A semiconductor testing device includes: a laser, at least one optical element, and a testing system as described in any one of the above claims, wherein the testing system is configured to acquire an optical signal formed by processing a laser emitted by the laser by the at least one optical element, and to determine the usage status of the at least one optical element based on the optical signal formed by processing the laser emitted by the laser by the at least one optical element.

[0023] A detection method, applied to a detection system, the detection method comprising:

[0024] Based on the optical signal generated by at least one optical element in the semiconductor detection equipment acquired by the detection device, the usage status of the at least one optical element is determined. The optical signal generated by the optical element is the optical signal generated by the optical element processing the light in the optical path of the semiconductor detection equipment.

[0025] Compared with existing technologies, the above technical solution has the following advantages:

[0026] The detection system provided in this application is applied to semiconductor detection equipment, which includes at least one optical element. The detection system includes a detection device and a processing device. The detection device is used to acquire an optical signal formed by the processing of light in the optical path of the semiconductor detection equipment by the at least one optical element. The processing device is used to determine the usage status of the at least one optical element based on the optical signal formed by the processing of light in the optical path of the semiconductor detection equipment by the at least one optical element, so as to improve the utilization rate of the optical element and thus improve the service life of the optical element while ensuring the detection accuracy of the semiconductor detection equipment. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the detection system structure provided in one embodiment of this application;

[0029] Figure 2 A schematic diagram of the structure of the optical signal detection element acquiring the optical signal formed by the processing of light by the reflective optical element in the detection system provided in another embodiment of this application;

[0030] Figure 3A schematic diagram of the structure of the detection system provided in another embodiment of this application, in which the optical signal detection element acquires the optical signal formed by the processing of light by the transmissive optical element;

[0031] Figure 4 This is a schematic diagram of the structure of the detection system provided in another embodiment of the present application, in which the optical signal detection element acquires the optical signal formed by the processing of light by the reflective optical element;

[0032] Figure 5 A schematic diagram of the structure of the detection system provided in another embodiment of this application, in which the optical signal detection element acquires the optical signal formed by the processing of light by the transmissive optical element;

[0033] Figure 6 In another embodiment of the detection system provided in this application, the optical element processes the optical power density curve of the optical signal formed by light rays;

[0034] Figure 7 In another embodiment of the present application, the detection device acquires a light spot pattern of the light signal formed by the processing of light by the optical element, wherein the X direction is defined as the long side direction of the light spot and the Y direction is defined as the short side direction of the light spot.

[0035] Figure 8 for Figure 7 A magnified view of a portion of the light spot shown;

[0036] Figure 9 for Figure 7 The diagram shows the light signal intensity distribution curve of the light spot at position X = a along its short side in the long side direction;

[0037] Figure 10 for Figure 7 The light spot shown is a curve illustrating the light signal intensity distribution along its long side.

[0038] Figures 11(a) and 11(b) are schematic diagrams of the maximum inscribed circle obtained from the spot image of the light signal formed by the optical element processing light obtained by the detection device in the detection system provided by another embodiment of this application.

[0039] Figure 12 In another embodiment of the detection system provided in this application, a spot image of the light signal formed by the optical element processing light is obtained based on the detection device, and the spot is obtained in the M direction of its long side. 2 Factor distribution curve and M along its shorter side 2 Factor distribution curve;

[0040] Figure 13 This is a schematic diagram of the detection system structure provided in another embodiment of this application;

[0041] Figure 14 This is a schematic diagram of the detection system structure provided in yet another embodiment of this application;

[0042] Figure 15 This is a schematic diagram of a two-dimensional adjustment element adjusting the position of an optical element illuminated by light in a detection system provided in another embodiment of this application;

[0043] Figure 16 A schematic diagram of a rotating adjustment element adjusting the position of an optical element illuminated by light in a detection system provided in another embodiment of this application;

[0044] Figure 17 This is a schematic diagram of the detection system structure provided in another embodiment of this application;

[0045] Figure 18 This is a flowchart of a detection method provided in one embodiment of this application. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0047] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0048] Secondly, the present invention will be described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure will be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0049] As described in the background section, how to improve the utilization rate of optical components and thus extend their service life while ensuring the detection accuracy of semiconductor testing equipment has become a pressing technical problem in this industry.

[0050] The inventors discovered that while existing semiconductor testing equipment allows for manual inspection of optical components to detect damage and perform maintenance when damage occurs, the optical system, including the optical components, is covered by inner and outer sheet metal. In practical applications, when problems arise at the customer's site, the required maintenance time is typically 1-2 hours. Within such a short timeframe, it is impossible to disassemble the entire semiconductor testing equipment and manually inspect and maintain its internal optical components, making the repair of semiconductor testing equipment inconvenient and time-consuming.

[0051] In view of this, embodiments of this application provide a detection system applied to a semiconductor detection device, wherein the semiconductor detection device includes at least one optical element. Figure 1 A schematic diagram of the detection system structure provided in an embodiment of this application is shown, as follows: Figure 1 As shown, the detection system includes:

[0052] The detection device 10 is used to acquire the optical signal formed by the processing of light in the optical path of the semiconductor detection device by the at least one optical element;

[0053] The processing device 11 is used to determine the usage status of the at least one optical element by processing the light in the optical path of the semiconductor detection device based on the optical signal formed by the at least one optical element.

[0054] Optionally, in one embodiment of this application, the processing device may be a computer, but this application does not limit it and it depends on the specific circumstances.

[0055] Optionally, in one embodiment of this application, the optical element may include a beam splitter, a mirror, a polarizing lens, a prism, a reticle, or a filter, etc. This application does not limit the specific element and the choice depends on the circumstances.

[0056] It should be noted that the semiconductor detection device includes at least one optical element, wherein the optical element is disposed in the optical path of the semiconductor detection device and is used to reflect, refract, or transmit the light in the optical path to form the optical signal.

[0057] It should also be noted that during the use of the optical element, prolonged exposure to high-power light at the same point can cause optical damage. When optical damage occurs, the optical signal generated by the optical element processing the light in the optical path will change, thereby affecting the detection accuracy of the semiconductor detection equipment. Therefore, in this embodiment, the usage status of the optical element can be determined based on the optical signal generated by the optical element processing the light in the optical path.

[0058] Specifically, after the detection device acquires the optical signal formed by the processing of light in the optical path by the at least one optical element, the processing device determines the usage status of the at least one optical element based on the optical signal formed by the processing of light in the optical path by the at least one optical element acquired by the detection device. This is to improve the utilization rate of the optical element and thus increase its service life while ensuring the detection accuracy of the semiconductor detection equipment.

[0059] Since the semiconductor detection device typically includes more than one optical element, based on the above embodiments, in one embodiment of this application, the semiconductor detection device is described as including at least two optical elements. In this case, the detection device includes at least two optical signal detection elements, which correspond one-to-one with the optical elements and are used to acquire the optical signal formed by the corresponding optical element processing the light in the optical path of the semiconductor detection device.

[0060] It should be noted that, in this embodiment of the application, the semiconductor detection device has at least two optical elements, and the detection apparatus also has at least two optical signal detection elements, which correspond one-to-one with the optical elements. This allows the at least two optical signal detection elements to simultaneously acquire the optical signals formed by the processing of light in the optical path by their corresponding optical elements, thereby shortening the time for the detection apparatus to detect the optical signals formed by the processing of light by the at least two optical elements and improving the detection efficiency of the detection system. Furthermore, the processing apparatus determines the usage status of each optical element based on the optical signals acquired by each optical signal detection element and formed by the processing of light in the optical path by its corresponding optical element.

[0061] It should also be noted that the optical signal detection element may include at least one of an optical power meter, an image sensor (ChargeCoupled Device, CCD), and a beam quality analyzer, or at least one of other elements that can directly or indirectly acquire the optical signal formed by the optical element processing the light. This application does not limit this, and it depends on the specific circumstances.

[0062] In order to obtain the optical signal generated by the optical element through the optical signal detection element, the optical signal detection element needs to be placed in the transmission optical path of the optical signal generated by the optical element. However, this will inevitably block the transmission of the optical signal generated by the optical element, thereby affecting the normal operation of the optical element.

[0063] Therefore, based on any of the above embodiments, in one embodiment of this application, the detection device includes: an optical signal detection element and a control element. The optical signal detection element is used to acquire the optical signal formed by the optical element processing the light rays, and the control element is used to control the relative position of the optical signal detection element and the transmission optical path of the optical signal formed by the optical element processing the light rays. Specifically, the control element is fixedly connected to the optical signal detection element and is used to control whether the optical signal detection element is on the transmission optical path or not on the transmission optical path.

[0064] Optionally, in one embodiment of this application, when the optical signal detection element is located on the transmission optical path of the optical signal formed by the optical element processing the light, the optical signal formed by the optical element processing the light is perpendicularly irradiated onto the optical signal detection element, so as to improve the accuracy of obtaining the optical signal formed by the optical element processing the light using the optical signal detection element.

[0065] Specifically, in one embodiment of this application, such as Figure 2 As shown, the optical element is a reflective optical element 21, and the optical signal detection element 22 is located on the transmission optical path of the reflected optical signal formed by the light emitted by the laser 20 processed by the reflective optical element 21, and is fixedly connected to the control element 23; in another embodiment of this application, as Figure 3 As shown, the optical element is a transmissive optical element 31, and the optical signal detection element 22 is located on the transmission optical path of the transmissive optical element 31 that processes the transmitted light signal formed by the light emitted by the laser 20, and is fixedly connected to the control element 23.

[0066] Based on the above embodiments, in one embodiment of this application, when it is necessary to detect the optical element, the processing device is also communicatively connected to the control element and configured to control the control element based on the detection command, so that the control element can move the optical signal detection element to the transmission optical path of the optical element processing the optical signal formed by the light, so that the optical signal detection element can acquire the optical signal formed by the optical element processing the light.

[0067] Based on the above embodiments, in one embodiment of this application, the processing device generates a detection command based on user triggering to detect the usage status of the optical element when the user has a detection requirement; in another embodiment of this application, the processing element generates a detection command based on a preset time interval or preset frequency to periodically detect the usage status of the optical element. This application does not limit this, and it depends on the specific situation. It should be noted that the embodiments of this application do not limit the specific value of the preset time interval, and it can be set according to the user's needs and the lifespan of the optical element, etc.

[0068] Based on any of the above embodiments, in one embodiment of this application, when it is not necessary to detect the optical signal formed by the light source processed by the optical element or after the detection is completed, the processing device also generates a reset command to control the control element to move the optical signal detection element out of the transmission optical path of the optical element processing the optical signal formed by the light source, so that the optical signal detection element will not affect the transmission of the optical signal formed by the light source processed by the optical element, thereby not affecting the normal operation of the optical element.

[0069] Based on the above embodiments, in one embodiment of this application, the processing device generates a reset command based on user triggering, so as to remove the optical signal detection element from the transmission optical path of the optical element processing the optical signal when the user does not need to detect the optical signal formed by the light rays processed by the optical element or after the detection is completed; in another embodiment of this application, the processing device may also automatically generate a reset command after the detection is completed, so as to automatically remove the optical signal detection element from the transmission optical path of the optical element processing the optical signal formed by the light rays processed by the optical element after the detection is completed. This application does not limit this, and it depends on the specific situation.

[0070] To further reduce the impact of the optical signal detection element acquiring the optical signal generated by the optical element processing light on the normal operation of the optical element, in another optional embodiment of this application, the detection device includes: an optical signal detection element and a beam splitter. The beam splitter is disposed on the transmission optical path of the optical signal generated by the optical element processing light, splitting the optical signal into a first optical signal and a second optical signal. The first and second optical signals have different transmission directions. The first optical signal is used to detect the usage status of the optical element, while the second optical signal ensures the normal operation of the optical element. This achieves both detection of the usage status of the optical element and avoids affecting its normal operation. In this embodiment, the optical signal detection element is located on the transmission optical path of the first optical signal to acquire the first optical signal, thereby obtaining the optical signal generated by the optical element processing light.

[0071] Based on the above embodiments, in one embodiment of this application, during the process of the optical element processing the light rays to form an optical signal into a first optical signal and a second optical signal, the first optical signal is the reflected signal of the beam splitter and the second optical signal is the transmitted signal of the beam splitter. Optionally, the beam splitter is a beam splitter mirror, but this application does not limit it and it depends on the specific situation.

[0072] Optionally, in one embodiment of this application, such as Figure 4 As shown, the optical element is a reflective optical element 21. The beam splitter 40 divides the reflected light signal formed by the light rays processed by the reflective optical element 21 into a first light signal and a second light signal. The first light signal is the reflected signal of the beam splitter, and the second light signal is the transmitted signal of the beam splitter. The light signal detection element 22 is located on the transmission optical path of the first light signal. In another embodiment of this application, as shown... Figure 5 As shown, the optical element is a transmissive optical element 31. The beam splitter 40 divides the transmitted light signal formed by the light processed by the transmissive optical element 31 into a first light signal and a second light signal. The first light signal is the reflected signal of the beam splitter, and the second light signal is the transmitted signal of the beam splitter. The light signal detection element 22 is located on the transmission optical path of the first light signal.

[0073] Specifically, in one embodiment of this application, the intensity ratio of the first optical signal to the second optical signal is 1:1000, so that the intensity of the first optical signal accounts for a very small proportion of the intensity of the optical signal formed by the optical element processing the light, so that the normal operation of the optical element is not affected when the optical signal detection element obtains the first optical signal to determine the usage status of the optical element.

[0074] Based on the above embodiments, in one embodiment of this application, the position of the beam splitter in the detection system is fixed, thereby avoiding the complex operation caused by adjusting the position of the beam splitter every time detection is performed, as well as the measurement error caused by the different positions of the optical element in different detection processes.

[0075] Optionally, based on the above embodiments, in one embodiment of this application, the beam splitter and the optical element are placed at a 45° angle to each other in the transmission direction of the optical signal formed by processing the light. That is, the angle between the surface of the beam splitter and the transmission direction of the optical signal formed by processing the light is 45°, so that the transmission direction of the second optical signal formed after the optical signal is transmitted through the beam splitter is the same as the transmission direction of the optical signal formed by processing the light, without changing the transmission direction of the main signal in the optical signal formed by processing the light, thus ensuring the normal operation of the optical element.

[0076] It should be noted that the performance parameters of the optical elements in processing the light rays to form optical signals are different, and the corresponding conditions for determining whether the optical elements have suffered optical damage are also different. Therefore, based on the above embodiments, in one embodiment of this application, the processing device is used to determine the usage status of the optical elements based on preset parameters of the optical signals formed by processing the light rays in the optical path of the semiconductor detection device using the optical elements;

[0077] The preset parameters include optical power, light spot uniformity, light spot roundness, and light spot M. 2 At least one of the factors.

[0078] Optionally, in one embodiment of this application, the preset parameter is optical power. When the optical element suffers different degrees of optical damage, the optical power value of the optical signal formed by processing the light rays is also different.

[0079] It should be noted that, in this embodiment, when the detection device includes an optical signal detection element and a control element, and the optical signal detection element is placed on the transmission optical path of the optical signal formed by the optical element processing the light under the control of the control element, the optical signal acquired by the optical signal detection element is the optical signal directly transmitted to the optical signal detection element after the optical element processes the light; when the detection device includes an optical signal detection element and a beam splitter, and the beam splitter is located on the transmission optical path of the optical signal formed by the optical element processing the light, the optical signal acquired by the optical signal detection element is the optical signal transmitted to the optical signal detection element after the optical element processes the light through reflection or transmission to the optical signal detection element.

[0080] Specifically, such as Figure 6 As shown, Figure 6 The optical power density curve is obtained based on the optical power value of the optical signal formed by the optical element processing the light obtained by the detection device. The horizontal axis represents the time the optical element is irradiated by light in the optical path, and the vertical axis represents the optical power value of the optical signal formed by the optical element processing the light. Therefore, in this embodiment, the usage state of the optical element can be determined based on the ratio between the optical power value of the optical signal formed by the optical element processing the light and its initial optical power value, or the attenuation rate of the optical power value of the optical signal formed by the optical element processing the light. When the ratio between the optical power value of the optical signal formed by the optical element processing the light and its initial optical power value is less than a first preset value, or when the attenuation rate of the optical power value of the optical signal formed by the optical element processing the light is not less than a second preset value, it indicates that the optical element has suffered optical damage and the detection accuracy of the semiconductor detection equipment cannot be guaranteed. This application does not limit the first and second preset values; they can be set according to user needs and the detection accuracy requirements of the semiconductor detection equipment.

[0081] Optionally, in another embodiment of this application, the preset parameter is the uniformity of the light spot. When the optical element suffers different degrees of optical damage, the size of the region satisfying the preset uniformity in the light spot that processes the light signal formed by the light is also different.

[0082] It should be noted that, in this embodiment, the detection device includes an optical signal detection element and a target element. The target element is located on the transmission optical path of the optical signal formed by the optical element processing the light rays. The optical signal acquired by the optical signal detection element is the optical signal formed when the optical element processes the light rays and illuminates the target element. Optionally, in one embodiment of this application, the optical signal detection element acquires the optical signal formed on the target object based on the scattered signal formed when the optical element processes the light rays and illuminates the target element. Optionally, in one embodiment of this application, the target element is a wafer, and the optical signal acquired by the optical signal detection element is the scattered light signal formed on the wafer when the optical element processes the light rays and illuminates the wafer. However, this application does not limit this and it depends on the specific circumstances.

[0083] Specifically, such as Figure 7 As shown, Figure 7 The detection device acquires a light spot pattern of the light signal formed by the optical element processing the light rays and illuminating the target element. Figure 8 for Figure 7 A magnified view of a portion of the image. Figure 7 In the light spot diagram shown, cross-sections are taken at various positions along the long side of the light spot, for example, along... Figure 8 The white line shown is used to extract the light spot. By repeating this process, the light signal intensity distribution curves at various positions along the long side of the light spot and along its short side can be obtained, as shown below. Figure 9 As shown, based on this, the light signal intensity distribution curve of the light spot along its long side can be further obtained, such as... Figure 10 As shown. The formula for beam uniformity is defined as:

[0084]

[0085] Among them, I max I represents the maximum optical signal intensity of the light spot. min The minimum light signal intensity of the light spot

[0086] As can be seen from the above formula, in Figure 10Having obtained the maximum light signal intensity of the light spot, the minimum light signal intensity satisfying the preset uniformity within the light spot can be obtained by setting the light spot uniformity, thereby obtaining the size of the region satisfying the preset uniformity within the light spot. Therefore, in this embodiment, the usage state of the optical element can be determined based on the length of the region satisfying the preset uniformity within the light spot formed by the optical element processing the light rays, and / or the width of the light spot region. When the length of the region satisfying the preset uniformity within the light spot formed by the optical element processing the light rays is less than a third preset value, and / or the width of the light spot region is greater than a fourth preset value, it indicates that the optical element has suffered optical damage and cannot guarantee the detection accuracy of the semiconductor detection device. This application does not limit the third and fourth preset values; they can be set according to user needs and the detection accuracy requirements of the semiconductor detection device.

[0087] Optionally, in another embodiment of this application, the preset parameter is the roundness of the light spot. When the optical element suffers different degrees of optical damage, the roundness of the light spot formed by processing the light rays is also different. Specifically, as shown in Figures 11(a) and 11(b), Figures 11(a) and 11(b) are images of the light spot obtained by the detection device after grayscale and binarization processing, with the energy concentration in the light spot taken as 1 / e. 2 The region is used to extract the light spot contour, and then the outer contour is fitted to obtain a schematic diagram of the maximum inscribed circle. Further, the obtained maximum inscribed circle is calculated to obtain the light spot roundness. The closer the roundness of the light spot formed by the optical element processing the light is to 1, the better the quality of the light signal. For example, the roundness of the light spot shown in Figure 11(a) is 0.81, and the roundness of the light spot shown in Figure 11(b) is 0.91. Therefore, in this embodiment, the usage state of the optical element can be determined based on the roundness of the light spot formed by the optical element processing the light. When the roundness of the light spot formed by the optical element processing the light is less than a fifth preset value, it indicates that the optical element has optical damage and cannot guarantee the detection accuracy of the semiconductor detection equipment. This application does not limit the fifth preset value; it can be set according to user needs and the detection accuracy requirements of the semiconductor detection equipment.

[0088] Optionally, in another embodiment of this application, the preset parameter is the light spot M. 2 Factor, when the optical element suffers varying degrees of optical damage, the light spot M that processes the light signal formed by the light rays. 2 The factors are also different. Specifically, for example... Figure 12 As shown, Figure 12To obtain a light spot image based on the light signal formed by the light source obtained by the detection device through the optical element, the M-shaped light spot is obtained in the direction of its long side. 2 Factor distribution curve and M along its shorter side 2 The factor distribution curve, further, is based on the M of the light spot along its long side. 2 The factor distribution curve can be used to obtain the M of the light spot along its long side. 2 Similarly, the factor is based on the M of the light spot in its short side direction. 2 The factor distribution curve can be used to obtain the M of the light spot in its short side direction. 2 factor.

[0089] It should be noted that M 2 The M factor is an important indicator for measuring the quality of optical signals. It can be used to evaluate whether the spot shape of an optical signal in its long and short directions closely resembles a Gaussian spot. Specifically, the M factor of a Gaussian spot in its long and short directions... 2 All factors are equal to 1. Therefore, in this embodiment, the light spot that processes the light signal formed by the light rays according to the optical element can be M in the long side direction. 2 Factor and M in the direction of its short side 2 The factor is used to determine the usage status of the optical element. When the optical element processes the light signal formed by the light rays, the spot of the light signal is located in the M direction of its long side. 2 Factor or M in the direction of its shorter side 2 If the factor is greater than the sixth preset value, it indicates that the optical element has optical damage and the detection accuracy of the semiconductor detection equipment cannot be guaranteed. This application does not limit the sixth preset value, but it can be set according to the user's needs and the detection accuracy requirements of the semiconductor detection equipment.

[0090] Optionally, in other embodiments of this application, the preset parameters may further include optical power, spot uniformity, spot circularity, and spot M. 2 At least two of the factors are required, but this application does not limit this to any particular factor; the specific requirement depends on the circumstances.

[0091] Based on the above embodiments, in one embodiment of this application, such as Figure 13 As shown, the processing device 11 is also used to upload the usage status of the at least one optical element to the server 130 so as to monitor the usage status of the at least one optical element in real time.

[0092] Based on the above embodiments, in one embodiment of this application, the following continues... Figure 13As shown, the detection system further includes a display device 131 for displaying the usage status of the optical element. Specifically, the display device provides a visual representation of the usage status of the at least one optical element, making it convenient for the user to view.

[0093] Based on the above embodiments, in one embodiment of this application, the processing device is further configured to issue a first prompt message when the usage state of the optical element meets a first preset condition.

[0094] Optionally, in one embodiment of this application, the first preset condition includes: at least one of the at least one optical element has optical damage. Specifically, among the at least one optical element, when the preset parameter value of the optical signal formed by processing the light by one of the optical elements cannot guarantee the detection accuracy of the semiconductor detection device, it indicates that one optical element has optical damage. At this time, the processing device issues a first prompt message to indicate that one optical element has optical damage and to provide specific information about the optical element with optical damage. When the preset parameter value of the optical signal formed by processing the light by multiple optical elements cannot guarantee the detection accuracy of the semiconductor detection device, it indicates that multiple optical elements have optical damage. At this time, the processing device issues a first prompt message to indicate that multiple optical elements have optical damage and to provide specific information about the optical elements with optical damage.

[0095] However, optical components in the semiconductor industry are generally expensive and difficult to replace, sometimes requiring specialized technicians to spend a significant amount of time and effort on repeated adjustments. Therefore, based on any of the above embodiments, in one embodiment of this application, such as Figure 14 As shown, the detection system also includes:

[0096] Adjustment device 140, the adjustment device is used to adjust the position of the optical element that has optical damage and is irradiated by the light in the optical path until the optical signal formed by the optical element that has optical damage processing the light in the optical path meets the second preset condition.

[0097] Specifically, in one embodiment of this application, after the adjustment device adjusts the position of the optically damaged optical element illuminated by light in the optical path from the original illumination point to a new illumination point, the detection device re-detects the light signal formed by the optical element processing the light in the optical path based on the new illumination point. If the light signal formed by the optically damaged optical element processing the light in the optical path based on the new illumination point meets the second preset condition, it indicates that the light signal formed by the optically damaged optical element processing the light in the optical path based on the new illumination point can meet the detection accuracy requirements of the semiconductor detection device, and the adjustment stops. If the light signal formed by the optically damaged optical element processing the light in the optical path based on the new illumination point still does not meet the second preset condition, the adjustment continues until the light signal formed by the optically damaged optical element processing the light in the optical path meets the second preset condition, thereby improving the utilization rate of the optical element and thus increasing the service life of the optical element while ensuring the detection accuracy of the semiconductor detection device.

[0098] Based on the above embodiments, in one embodiment of this application, the adjusting device, under the control of an operator, adjusts the position of the optical element with optical damage that is irradiated by light in the optical path; in another embodiment of this application, the adjusting device, under the control of the processing device, adjusts the position of the optical element with optical damage that is irradiated by light in the optical path. This application does not limit this, and it depends on the specific circumstances.

[0099] Optionally, in one embodiment of this application, when the adjusting device, under the control of the processing device, adjusts the position of the optical element with optical damage that is irradiated by light in the optical path, the processing device is communicatively connected to the adjusting device and configured to generate an adjustment command based on the usage state of the optical element with optical damage. The adjustment command controls the adjusting device to adjust the position of the optical element with optical damage that is irradiated by light in the optical path, thereby improving the automation level of the detection system.

[0100] It should be noted that when the adjustment device adjusts the optically damaged optical element and searches through each irradiation position of the optical element, and fails to make the optical signal formed by the optical light processed by the optically damaged optical element meet the second preset condition, it indicates that there is optical damage at each irradiation position of the optical element. At this time, the processing device can also issue a prompt message to replace the optically damaged optical element.

[0101] It should also be noted that the second preset condition is different depending on the preset parameters of the optical element for processing the light signal formed by the light.

[0102] Optionally, in one embodiment of this application, if the preset parameter for the optical signal formed by the optical element processing the light is optical power, then the second preset condition may include: the ratio between the optical power value of the optical signal formed by the optical element processing the light and its initial optical power value is not less than a first preset value, or the attenuation rate of the optical power value of the optical signal formed by the optical element processing the light is less than a second preset value. This application does not limit the first preset value and the second preset value; they can be specifically set according to user needs and the detection accuracy requirements of the semiconductor detection equipment.

[0103] Optionally, in another embodiment of this application, if the preset parameter for the optical signal formed by the optical element processing the light is spot uniformity, then the second preset condition may include: the length of the region satisfying the preset uniformity in the spot of the optical signal formed by the optical element processing the light is not less than a third preset value, and / or, the width of the spot region of the optical signal formed by the optical element processing the light is not greater than a fourth preset value. This application does not limit the third and fourth preset values; they can be set according to user needs and the detection accuracy requirements of the semiconductor detection equipment.

[0104] Optionally, in another embodiment of this application, if the preset parameter for the optical signal formed by the optical element processing the light is the spot circularity, then the second preset condition may include: the spot circularity of the optical signal formed by the optical element processing the light is not less than a fifth preset value. This application does not limit the fifth preset value; it can be set according to user needs and the detection accuracy requirements of the semiconductor detection equipment.

[0105] Optionally, in another embodiment of this application, the preset parameter for the optical element to process the optical signal formed by the light rays is the light spot M. 2 If the factor is specified, the second preset condition may include: the light spot formed by the optical element processing the light rays has an M-value in its long side direction. 2 Factor and M in the direction of its short side 2 None of the factors are greater than the sixth preset value. This application does not limit the sixth preset value, which can be set according to the user's needs and the detection accuracy requirements of the semiconductor testing equipment.

[0106] Optionally, in other embodiments of this application, the preset parameters for the optical element to process the optical signal formed by the light rays include optical power, light spot uniformity, light spot circularity, and light spot M. 2 If at least two of the factors are present, the second preset condition may include at least two of the second preset conditions in the above embodiments. This application does not limit this, and it depends on the specific circumstances.

[0107] Based on the above embodiments, in one embodiment of this application, the adjustment device includes at least one adjustment element, which corresponds one-to-one with the optical element and is used to adjust the position of the corresponding optical element that is illuminated by the light in the optical path.

[0108] It should be noted that, since the semiconductor detection device includes at least one optical element, when at least one of the optical elements suffers optical damage, the adjustment device needs to include at least one adjustment element so that the adjustment element corresponds one-to-one with the optical element. This allows the at least one adjustment element to simultaneously adjust the position of the corresponding optically damaged optical element that is illuminated by the light in the optical path, thereby shortening the time required for the adjustment device to adjust the optically damaged optical element and improving the adjustment efficiency of the detection system.

[0109] Based on any of the above embodiments, in one embodiment of this application, the adjustment element is a two-dimensional adjustment element, and the adjustment element controls the optical element to move in a two-dimensional plane under the control of the processing device.

[0110] Optionally, based on the above embodiments, in one embodiment of this application, the adjusting element, under the control of the processing device, drives the optical element that has suffered optical damage to move in a preset plane along a first direction and / or a second direction, wherein the preset plane is parallel to the incident surface of the optical element, and the first direction and the second direction are perpendicular.

[0111] Specifically, in one embodiment of this application, such as Figure 15 As shown, Figure 15 This illustration shows a schematic diagram of a two-dimensional adjustment element provided in an embodiment of this application adjusting the position of an optical element that has suffered optical damage and is illuminated by the light. Within the preset plane, let the first direction be direction A, and the second direction be direction K, with direction A and direction K being perpendicular to each other. In this case, the optical element can be divided into different numbers of illuminating points along the first direction A and the second direction K, with different coordinates for each illuminating point, for example, as... Figure 15 As shown, the optical element is divided into 1-9 irradiable points, which is not limited in this application and depends on the specific situation. When the current irradiation point of the optical element is damaged by the light, the two-dimensional adjustment element, under the control of the processing device, drives the optical element to move in a preset plane along the first direction A and / or the second direction K to find a new irradiation point, so that the optical element processes the light signal formed by the light at the new irradiation point to meet the second preset condition, thus completing the point-changing operation.

[0112] Optionally, in one embodiment of this application, the two-dimensional adjustment element drives the optical element to translate upward along the first direction A to complete the point-switching operation. For example, as Figure 15 As shown, when damage occurs at the current illumination point 1 in the optical element, the two-dimensional adjustment element, under the control of the processing device, drives the optical element to move upward along the first direction A in a preset plane. At this time, the position of the optical element illuminated by the light moves from point 1 to point 4. The detection device re-detects whether the light signal formed by the optical element processing the light at the new illumination point 4 meets the second preset condition. If the light signal formed by the optical element processing the light at the new illumination point 4 meets the second preset condition, the adjustment is completed. Otherwise, the optical element continues to move, changing the position of the optical element illuminated by the light, until the light signal formed by the optical element processing the light at the new illumination point meets the second preset condition or all illumination points in the optical element are searched.

[0113] Optionally, in another embodiment of this application, the two-dimensional adjustment element drives the optical element to translate to the left along the second direction K to complete the point-changing operation. However, this application is not limited to this. In other embodiments of this application, the two-dimensional adjustment element may also drive the optical element to translate downward along the first direction A, or translate to the right along the second direction K, or simultaneously translate along the first direction A and the second direction K to complete the point-changing operation. This application is not limited to this, and it depends on the specific situation.

[0114] Based on any of the above embodiments, in one embodiment of this application, the adjusting element is a rotation adjusting element that drives the optical element to rotate under the control of the processing device.

[0115] Specifically, in one embodiment of this application, such as Figure 16 As shown, Figure 16 This illustration shows a schematic diagram of a rotation adjustment element provided in an embodiment of this application adjusting the position of an optical element that has suffered optical damage and is illuminated by the light. In this case, the optical element can be divided into different numbers of illuminating points according to the angle of the rotation direction (R direction), for example, as... Figure 16 As shown, the optical element is divided into 1-8 irradiable points, which is not limited in this application and depends on the specific situation. When the current irradiation point of the optical element illuminated by the light is damaged, the rotation adjustment element, under the control of the processing device, drives the optical element to rotate along the rotation direction R to find a new irradiation point, so that the optical element processes the light signal formed by the light at the new irradiation point to meet the second preset condition, thus completing the point-changing operation.

[0116] Optionally, in one embodiment of this application, the rotation adjustment element drives the optical element to rotate clockwise by a certain angle to complete the point-changing operation. For example, as... Figure 16 As shown, when damage occurs at the current illumination point 1 of the optical element, the rotation adjustment element drives the optical element to rotate clockwise by a certain angle. At this time, the position of the optical element illuminated by the light moves from point 1 to point 8. The detection device re-detects whether the light signal formed by the optical element processing the light at the new illumination point 8 meets the second preset condition. If the light signal formed by the optical element processing the light at the new illumination point 8 meets the second preset condition, the adjustment ends. If the light signal formed by the optical element processing the light at the new illumination point 8 still does not meet the second preset condition, the rotation adjustment element continues to drive the optical element to rotate clockwise by a certain angle until the light signal formed by the optical element processing the light at the new illumination point meets the second preset condition or all illumination points of the optical element are searched. Optionally, in another embodiment of this application, the rotation adjustment element drives the optical element to rotate counterclockwise by a certain angle to complete the point-changing operation. This application does not limit this, and it depends on the specific situation.

[0117] It should be noted that, during the process of the rotation adjustment element driving the optical element to rotate under the control of the processing device, this application does not limit the angle at which the rotation adjustment element drives the optical element to rotate each time, but depends on the specific situation.

[0118] Specifically, in one embodiment of this application, the adjustment element may include an electric optical adjustment mechanism, in which the optical element is fixed on a high-precision two-dimensional translation stage or a rotary translation stage. When optical damage occurs at a certain illumination point of the optical element in the semiconductor testing equipment, the entire adjustment process can be completed simply by pressing a button after pre-setting the translation distance or rotation angle required for the optical element with optical damage through the electric optical adjustment mechanism. Compared with the manual inspection and point replacement in the prior art, this saves time and cost, and the accuracy of electric adjustment is far superior to that of manual knob adjustment.

[0119] Based on the above embodiments, in one embodiment of this application, such as Figure 17 As shown, the detection system also includes:

[0120] An alarm device 170 issues a prompt message when the usage status of at least one optical element meets a third preset condition.

[0121] It should be noted that when the optical signal generated by the optical element at the current illumination point does not meet the second preset condition, the detection system can adjust the position of the optical element with optical damage that is illuminated by the light to a new illumination point using the adjustment device. However, the usable area of ​​the optical element is limited, meaning the number of positions within the optical element that can be illuminated by the light in the optical path is limited. When the ratio of the illumination point with optical damage to the total number of illuminable points in the optical element exceeds a certain preset value, it indicates that the lifespan of the optical element has reached its limit, and the optical element with optical damage must be replaced. Otherwise, it will not only affect the detection accuracy of the semiconductor detection equipment but also its normal operation. Therefore, the third preset condition is used to limit the ratio of the illumination point with optical damage to the total number of illuminable points in the optical element, or to limit the lifespan of the optical element.

[0122] Optionally, in one embodiment of this application, the third preset condition may be: the ratio of the number of irradiated points with optical damage to the total number of irradiable points in the optical element is not less than a seventh preset value, that is, the service life of the optical element is not less than the seventh preset value. Optionally, the seventh preset value may be 90%. However, this application does not limit the seventh preset value, and it may be set according to the user's needs and the detection accuracy requirements of the semiconductor testing equipment.

[0123] Specifically, based on the above embodiments, in one embodiment of this application, when the usage state of the at least one optical element meets the third preset condition, it indicates that the ratio of the irradiated points with optical damage to the total irradiable points in the at least one optical element is not less than a seventh preset value, that is, the service life of the at least one optical element is not less than the seventh preset value. At this time, the alarm device issues a prompt message to replace the at least one optical element. Optionally, in one embodiment of this application, when the adjusting device, by adjusting the optically damaged optical element and searching through each irradiated point in the optically damaged optical element, fails to make the optical signal formed by the optical light processed by the optically damaged optical element meet the second preset condition, it indicates that the service life of the optically damaged optical element has reached its limit, and the alarm device issues a prompt message to replace the optically damaged optical element.

[0124] Based on the above embodiments, in one embodiment of this application, if any optical element with optical damage reaches its life limit, the alarm device can also issue a reminder message for maintenance and upkeep of the entire semiconductor testing equipment.

[0125] In summary, in the detection system provided by this application embodiment, the detection device acquires an optical signal formed by processing light in the optical path of at least one optical element disposed in the optical path of the semiconductor detection equipment; the processing device determines the usage status of the at least one optical element based on the optical signal formed by processing light in the optical path by the at least one optical element acquired by the detection device, and controls the adjustment device to adjust the position of the optical element that has optical damage and is irradiated by light in the optical path, thereby improving the utilization rate of the optical element and thus improving the service life of the optical element while ensuring the detection accuracy of the semiconductor detection equipment.

[0126] This application also provides a semiconductor testing device, such as... Figures 2-5 As shown, the semiconductor testing equipment includes a laser, at least one optical element, and a testing system. The at least one optical element is located in the optical path of the laser, processes the light in the optical path, and outputs an optical signal. The testing system is the testing system provided in any of the above embodiments, used to acquire the optical signal formed by the processing of the laser emitted by the laser by the at least one optical element, and based on the optical signal formed by the processing of the laser emitted by the laser by the at least one optical element, determine the usage status of the at least one optical element. This improves the utilization rate of the optical element while ensuring the testing accuracy of the semiconductor testing equipment, thereby increasing the service life of the optical element. Since the specific implementation process of the testing system has been described in detail in the above embodiments, it will not be repeated here.

[0127] Furthermore, this application also provides a detection method applied to the detection system provided in any of the above embodiments, the detection method comprising:

[0128] Based on the optical signal generated by at least one optical element in the semiconductor detection equipment acquired by the detection device, the usage status of the at least one optical element is determined. The optical signal generated by the optical element is the optical signal generated by the optical element processing the light in the optical path of the semiconductor detection equipment.

[0129] It should be noted that the semiconductor detection device includes at least one optical element, wherein the optical element is disposed in the optical path of the semiconductor detection device and is used to reflect, refract, or transmit the light in the optical path to form the optical signal.

[0130] It should also be noted that during the use of the optical element, prolonged exposure to high-power light at the same point can cause optical damage. When optical damage occurs, the optical signal generated by the optical element processing the light in the optical path will change, thus affecting the detection accuracy of the semiconductor detection equipment. Therefore, this detection method can determine the usage status of the optical element based on the optical signal generated by the optical element processing the light in the optical path. In other words, the usage status of the optical element can reflect the quality of the optical signal generated by the optical element processing the light in the optical path, thereby improving the utilization rate of the optical element and extending its service life while ensuring the detection accuracy of the semiconductor detection equipment.

[0131] Based on the above embodiments, in one embodiment of this application, such as Figure 18 As shown, the detection method includes:

[0132] Step S1: The detection device in the detection system acquires the optical signal formed by the processing of light in the optical path of the semiconductor detection device by at least one optical element.

[0133] Since the semiconductor detection device typically includes more than one optical element, based on the above embodiments, in one embodiment of this application, the semiconductor detection device is described as including at least two optical elements. In this case, the detection device includes at least two optical signal detection elements, which correspond one-to-one with the optical elements and are used to acquire the optical signal formed by the corresponding optical element processing the light in the optical path of the semiconductor detection device.

[0134] It should be noted that, in this embodiment of the application, the semiconductor detection device has at least two optical elements, and the detection apparatus also has at least two optical signal detection elements, which correspond one-to-one with the optical elements. This allows the at least two optical signal detection elements to simultaneously acquire the optical signals formed by the processing of light in the optical path by their corresponding optical elements, thereby shortening the time for the detection apparatus to detect the optical signals formed by the processing of light by the at least two optical elements and improving the detection efficiency of the detection system. Furthermore, this detection method can determine the usage status of each optical element based on the optical signals acquired by each optical signal detection element and formed by the processing of light in the optical path by its corresponding optical element.

[0135] In order to obtain the optical signal generated by the optical element through the optical signal detection element, the optical signal detection element needs to be placed in the transmission optical path of the optical signal generated by the optical element. However, this will inevitably block the transmission of the optical signal generated by the optical element, thereby affecting the normal operation of the optical element.

[0136] Therefore, based on any of the above embodiments, in one embodiment of this application, the detection device includes: an optical signal detection element and a control element. The optical signal detection element is used to acquire the optical signal formed by the optical element processing the light rays, and the control element is used to control the relative position of the optical signal detection element and the transmission optical path of the optical signal formed by the optical element processing the light rays. Specifically, the control element is fixedly connected to the optical signal detection element and is used to control whether the optical signal detection element is on the transmission optical path or not on the transmission optical path.

[0137] Based on the above embodiments, in one embodiment of this application, when it is necessary to detect the optical element, the detection method includes: controlling the control element based on a detection command, so that the control element can move the optical signal detection element to the transmission optical path of the optical element processing the optical signal formed by the light, so that the optical signal detection element can acquire the optical signal formed by the optical element processing the light.

[0138] Based on the above embodiments, in one embodiment of this application, the detection method includes: generating a detection command based on user triggering, so as to detect the usage status of the optical element when the user has a detection requirement; in another embodiment of this application, the detection method includes: generating a detection command based on a preset time interval or a preset frequency, so as to periodically detect the usage status of the optical element. This application does not limit this, and it depends on the specific situation. It should be noted that the embodiments of this application do not limit the specific value of the preset time interval, and it can be set by the user according to the needs and lifespan of the optical element.

[0139] Based on the above embodiments, in one embodiment of this application, when it is not necessary to detect the optical signal formed by the optical element processing the light or after the detection is completed, the detection method further includes: controlling the control element based on a reset command to move the optical signal detection element out of the transmission optical path of the optical element processing the optical signal formed by the light, so that the optical signal detection element will not affect the transmission of the optical signal formed by the optical element processing the light, thereby not affecting the normal operation of the optical element.

[0140] Based on the above embodiments, in one embodiment of this application, the detection method includes: generating a reset command based on user triggering, so as to remove the optical signal detection element from the transmission optical path of the optical element processing the optical signal when the user does not need to detect the optical signal formed by the light source or after the detection is completed; in another embodiment of this application, the detection method can also automatically generate a reset command after the detection is completed, so as to automatically remove the optical signal detection element from the transmission optical path of the optical element processing the optical signal after the detection is completed. This application does not limit this, and it depends on the specific situation.

[0141] To further reduce the impact of the optical signal detection element acquiring the optical signal generated by the optical element processing light on the normal operation of the optical element, in another optional embodiment of this application, the detection device includes: an optical signal detection element and a beam splitter. The beam splitter is disposed on the transmission optical path of the optical signal generated by the optical element processing light, splitting the optical signal into a first optical signal and a second optical signal. The first and second optical signals have different transmission directions. The first optical signal is used to detect the usage status of the optical element, while the second optical signal ensures the normal operation of the optical element. This achieves both detection of the usage status of the optical element and avoids affecting its normal operation. In this embodiment, the optical signal detection element is located on the transmission optical path of the first optical signal to acquire the first optical signal, thereby obtaining the optical signal generated by the optical element processing light.

[0142] Specifically, in one embodiment of this application, the intensity ratio of the first optical signal to the second optical signal is 1:1000, so that the intensity of the first optical signal accounts for a very small proportion of the intensity of the optical signal formed by the optical element processing the light, so that the normal operation of the optical element is not affected when the optical signal detection element obtains the first optical signal to determine the usage status of the optical element.

[0143] Optionally, based on the above embodiments, in one embodiment of this application, the beam splitter and the optical element are placed at a 45° angle to each other in the transmission direction of the optical signal formed by processing the light. That is, the angle between the surface of the beam splitter and the transmission direction of the optical signal formed by processing the light is 45°, so that the transmission direction of the second optical signal formed after the optical signal is transmitted through the beam splitter is the same as the transmission direction of the optical signal formed by processing the light, without changing the transmission direction of the main signal in the optical signal formed by processing the light, thus ensuring the normal operation of the optical element.

[0144] Step S2: Based on the preset parameters of the optical signal formed by the light rays in the optical path obtained by the detection device, determine the usage status of the at least one optical element.

[0145] It should be noted that the performance parameters of the optical elements in processing the light rays to form optical signals are different, and the corresponding conditions for determining whether the optical elements have suffered optical damage are also different. Therefore, based on the above embodiments, in one embodiment of this application, the detection method determines the usage status of the optical element based on the preset parameters of the optical signals formed by the optical elements processing the light rays in the optical path, obtained by the detection device.

[0146] The preset parameters include optical power, light spot uniformity, light spot roundness, and light spot M. 2 At least one of the factors.

[0147] Optionally, in one embodiment of this application, the preset parameter is optical power. When the optical element suffers different degrees of optical damage, the optical power value of the optical signal it processes also varies. Therefore, this detection method can determine the usage status of the optical element based on the ratio between the optical power value of the optical signal processed by the optical element and its initial optical power value, or the attenuation rate of the optical power value of the optical signal processed by the optical element. When the ratio between the optical power value of the optical signal processed by the optical element and its initial optical power value is less than a first preset value, or when the attenuation rate of the optical power value of the optical signal processed by the optical element is not less than a second preset value, it indicates that the optical element has suffered optical damage and the detection accuracy of the semiconductor detection device cannot be guaranteed. This application does not limit the first and second preset values; they can be set according to user needs and the detection accuracy requirements of the semiconductor detection device.

[0148] It should be noted that, in this embodiment, when the detection device includes an optical signal detection element and a control element, and the optical signal detection element is placed on the transmission optical path of the optical signal formed by the optical element processing the light under the control of the control element, the optical signal acquired by the optical signal detection element is the optical signal directly transmitted to the optical signal detection element after the optical element processes the light; when the detection device includes an optical signal detection element and a beam splitter, and the beam splitter is located on the transmission optical path of the optical signal formed by the optical element processing the light, the optical signal acquired by the optical signal detection element is the optical signal transmitted to the optical signal detection element after the optical element processes the light through reflection or transmission to the optical signal detection element.

[0149] Optionally, in another embodiment of this application, the preset parameter is spot uniformity. When the optical element suffers different degrees of optical damage, the size of the region satisfying the preset uniformity in the spot of the light signal formed by processing the light also varies. Therefore, this detection method can determine the usage status of the optical element based on the length of the region satisfying the preset uniformity in the spot of the light signal formed by processing the light, and / or the width of the spot region. When the length of the region satisfying the preset uniformity in the spot of the light signal formed by processing the light is less than a third preset value, and / or the width of the spot region is greater than a fourth preset value, it indicates that the optical element has suffered optical damage and the detection accuracy of the semiconductor detection device cannot be guaranteed. This application does not limit the third and fourth preset values; they can be set according to user needs and the detection accuracy requirements of the semiconductor detection device.

[0150] It should be noted that, in this embodiment, the detection device includes an optical signal detection element and a target element. The target element is located on the transmission optical path of the optical signal formed by the optical element processing the light rays. The optical signal acquired by the optical signal detection element is the optical signal formed when the optical element processes the light rays and illuminates the target element. Optionally, in one embodiment of this application, the optical signal detection element acquires the optical signal formed on the target object based on the scattered signal formed when the optical element processes the light rays and illuminates the target element. Optionally, in one embodiment of this application, the target element is a wafer, and the optical signal acquired by the optical signal detection element is the scattered light signal formed on the wafer when the optical element processes the light rays and illuminates the wafer. However, this application does not limit this and it depends on the specific circumstances.

[0151] Optionally, in another embodiment of this application, the preset parameter is the spot roundness. When the optical element suffers different degrees of optical damage, the spot roundness of the light signal it processes also varies. Therefore, this detection method can determine the usage status of the optical element based on the spot roundness of the light signal it processes. When the spot roundness of the light signal it processes is less than a fifth preset value, it indicates that the optical element has suffered optical damage, and the detection accuracy of the semiconductor detection device cannot be guaranteed. This application does not limit the fifth preset value; it can be set according to user needs and the detection accuracy requirements of the semiconductor detection device.

[0152] Optionally, in another embodiment of this application, the preset parameter is the light spot M. 2 Factor, when the optical element suffers varying degrees of optical damage, the light spot M that processes the light signal formed by the light rays. 2 The factors are also different. Therefore, this detection method can determine the M value of the light spot formed by the light rays processed by the optical element in its long side direction. 2 Factor and M in the direction of its short side 2 The factor is used to determine the usage status of the optical element. When the optical element processes the light signal formed by the light rays, the spot of the light signal is located in the M direction of its long side. 2 Factor or M in the direction of its shorter side 2 If the factor is greater than the sixth preset value, it indicates that the optical element has optical damage and the detection accuracy of the semiconductor detection equipment cannot be guaranteed. This application does not limit the sixth preset value, but it can be set according to the user's needs and the detection accuracy requirements of the semiconductor detection equipment.

[0153] Optionally, in other embodiments of this application, the preset parameters may further include optical power, spot uniformity, spot circularity, and spot M. 2 At least two of the factors are required, but this application does not limit this to any particular factor; the specific requirement depends on the circumstances.

[0154] Based on the above embodiments, in one embodiment of this application, the detection method issues a first prompt message when the usage state of the optical element meets a first preset condition. Optionally, in one embodiment of this application, the first preset condition includes: at least one of the at least one optical element has optical damage. In this case, the detection method issues a prompt message indicating that at least one optical element has optical damage, and provides specific information about the optical element with optical damage.

[0155] It should be noted that optical components in the semiconductor industry are generally expensive and difficult to replace, sometimes requiring specialized technicians to spend a significant amount of time and effort on repeated adjustments. Therefore, continuing as... Figure 18 As shown, the detection method also includes:

[0156] Step S3: Based on the usage status of the at least one optical element, control the adjustment device in the detection system to adjust the position of the optical element with optical damage that is irradiated by the light in the optical path.

[0157] Optionally, in one embodiment of this application, the detection method generates an adjustment command based on the usage status of the at least one optical element. The adjustment command controls the adjustment device to adjust the position of the optical element with optical damage that is irradiated by light in the optical path, thereby improving the automation level of the detection system.

[0158] In other embodiments of this application, the position of the optical element that has suffered optical damage and is irradiated by the light in the optical path can also be adjusted by the operator through the adjustment device to perform a point-changing operation. This application does not limit this, and it depends on the specific situation.

[0159] Specifically, in one embodiment of this application, after the adjustment device adjusts the position of the optically damaged optical element illuminated by light in the optical path from the original illumination point to a new illumination point, the detection device re-detects the light signal formed by the optical element processing the light in the optical path based on the new illumination point. If the light signal formed by the optically damaged optical element processing the light in the optical path based on the new illumination point meets the second preset condition, it indicates that the light signal formed by the optically damaged optical element processing the light in the optical path based on the new illumination point can meet the detection accuracy requirements of the semiconductor detection device, and the adjustment stops. If the light signal formed by the optically damaged optical element processing the light in the optical path based on the new illumination point still does not meet the second preset condition, the adjustment continues until the light signal formed by the optically damaged optical element processing the light in the optical path meets the second preset condition. This improves the utilization rate of the optical element and thus extends the service life of the optical element while ensuring the detection accuracy of the semiconductor detection device.

[0160] It should be noted that the preset parameters for processing the light signals formed by the optical elements are different, and the corresponding second preset conditions are also different.

[0161] Optionally, in one embodiment of this application, if the preset parameter for the optical signal formed by the optical element processing the light is optical power, then the second preset condition may include: the ratio between the optical power value of the optical signal formed by the optical element processing the light and its initial optical power value is not less than a first preset value, or the attenuation rate of the optical power value of the optical signal formed by the optical element processing the light is less than a second preset value. This application does not limit the first preset value and the second preset value; they can be specifically set according to user needs and the detection accuracy requirements of the semiconductor detection equipment.

[0162] Optionally, in another embodiment of this application, if the preset parameter for the optical signal formed by the optical element processing the light is spot uniformity, then the second preset condition may include: the length of the region satisfying the preset uniformity in the spot of the optical signal formed by the optical element processing the light is not less than a third preset value, and / or, the width of the spot region of the optical signal formed by the optical element processing the light is not greater than a fourth preset value. This application does not limit the third and fourth preset values; they can be set according to user needs and the detection accuracy requirements of the semiconductor detection equipment.

[0163] Optionally, in another embodiment of this application, if the preset parameter for the optical signal formed by the optical element processing the light is the spot circularity, then the second preset condition may include: the spot circularity of the optical signal formed by the optical element processing the light is not less than a fifth preset value. This application does not limit the fifth preset value; it can be set according to user needs and the detection accuracy requirements of the semiconductor detection equipment.

[0164] Optionally, in another embodiment of this application, the preset parameter for the optical element to process the optical signal formed by the light rays is the light spot M. 2 If the factor is specified, the second preset condition may include: the light spot formed by the optical element processing the light rays has an M-value in its long side direction. 2 Factor and M in the direction of its short side 2 None of the factors are greater than the sixth preset value. This application does not limit the sixth preset value, which can be set according to the user's needs and the detection accuracy requirements of the semiconductor testing equipment.

[0165] Optionally, in other embodiments of this application, the preset parameters for the optical element to process the optical signal formed by the light rays include optical power, light spot uniformity, light spot circularity, and light spot M. 2 If at least two of the factors are present, the second preset condition may include at least two of the second preset conditions in the above embodiments. This application does not limit this, and it depends on the specific circumstances.

[0166] Based on the above embodiments, in one embodiment of this application, the adjustment device includes at least one adjustment element, which corresponds one-to-one with the optical element and is used to adjust the position of the corresponding optical element that is illuminated by the light in the optical path.

[0167] It should be noted that, since the semiconductor detection device includes at least one optical element, when at least one of the optical elements suffers optical damage, the adjustment device needs to include at least one adjustment element so that the adjustment element corresponds one-to-one with the optical element. This allows the at least one adjustment element to simultaneously adjust the position of the corresponding optically damaged optical element that is illuminated by the light in the optical path, thereby shortening the time required for the adjustment device to adjust the optically damaged optical element and improving the adjustment efficiency of the detection system.

[0168] Based on the above embodiments, in one embodiment of this application, when the adjustment device adjusts the optically damaged optical element and searches through each irradiation position of the optical element, and fails to make the optically damaged optical element process the light signal formed by the light to meet the second preset condition, it indicates that there is optical damage at each irradiation position of the optical element, that is, the lifespan of the optical element has reached its limit. The detection method can also issue a prompt message to replace the optically damaged optical element.

[0169] Based on the above embodiments, in one embodiment of this application, when the lifespan of any one of the at least one optical element that has suffered optical damage reaches its upper limit, the detection method can also issue a reminder message for maintenance and upkeep of the entire semiconductor detection equipment.

[0170] In summary, the detection method provided in this application involves processing the light signal formed by light rays in the optical path of a semiconductor detection device using at least one optical element disposed in the optical path, which is obtained by the detection device, to determine the usage status of the at least one optical element. Furthermore, based on the usage status of the at least one optical element, the position of the optical element that has suffered optical damage and is irradiated by light rays in the optical path is adjusted. This improves the utilization rate of the optical element and thus extends its service life while ensuring the detection accuracy of the semiconductor detection device.

[0171] The various parts of this manual are described in a combination of parallel and progressive methods. Each part focuses on the differences between the other parts, and the same or similar parts can be referred to each other.

[0172] The features described above regarding the disclosed embodiments can be substituted or combined with each other to enable those skilled in the art to implement or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A detection system, characterized in that, An application in semiconductor testing equipment, the semiconductor testing equipment including at least one optical element, the optical element including a beam splitter, a mirror, a polarizing lens, a prism, a reticle, or a filter, the testing system comprising: The detection device is used to acquire the optical signal formed by the processing of light in the optical path of the semiconductor detection device by the at least one optical element; A processing device is used to determine the usage status of the at least one optical element by processing the light in the optical path of the semiconductor detection device based on the optical signal formed by the at least one optical element. An adjustment device is used to automatically adjust the position of the optical element with optical damage that is irradiated by the light in the optical path after the processing device determines that optical damage has occurred based on the light signal, and to continue adjusting based on the processing device's judgment of the reacquired light signal until the light signal formed by the optical element with optical damage processing the light in the optical path meets a second preset condition, so that the light signal formed by the optical element with optical damage processing the light in the optical path based on the new irradiation point can meet the detection accuracy requirements of the semiconductor detection device. The detection device includes an optical signal detection element and a control element. The optical signal detection element is used to acquire the optical signal formed by the optical element processing the light rays. The control element is used to control the relative position of the optical signal detection element and the transmission optical path of the optical signal formed by the optical element processing the light rays. The control element is fixedly connected to the optical signal detection element and is used to control whether the optical signal detection element is on the transmission optical path or not on the transmission optical path. The processing device is used to determine the usage status of the optical element based on preset parameters of the optical signal formed by processing the light in the optical path of the semiconductor detection device using the optical element; The preset parameters include optical power, light spot uniformity, light spot roundness, and light spot M. 2 At least one of the factors; the processing device is specifically configured to perform at least one of the following: When the ratio between the optical power value of the optical signal formed by the optical element processing the light and its initial optical power value is less than a first preset value, or when the attenuation rate of the optical power value of the optical signal formed by the optical element processing the light is not less than a second preset value, it is determined that the optical element has optical damage. When the length of the light spot in the light signal formed by the light source processed by the optical element is less than a third preset value, and / or the width of the light spot area is greater than a fourth preset value, it is determined that the optical element has optical damage. When the circularity of the light spot formed by the optical element processing the light is less than a fifth preset value, it is determined that the optical element has optical damage. When the optical element processes the light signal formed by the light, the light spot has an M2 factor in its long side direction or an M factor in its short side direction. 2 If the factor is greater than the sixth preset value, it is determined that the optical element has optical damage.

2. The detection system according to claim 1, characterized in that, The semiconductor detection device includes at least two optical elements, and the detection apparatus includes at least two optical signal detection elements. The optical signal detection elements correspond one-to-one with the optical elements and are used to acquire the optical signals formed by the corresponding optical elements processing the light in the optical path of the semiconductor detection device.

3. The detection system according to claim 1, characterized in that, The processing device is also used to upload the usage status of the at least one optical element to the server.

4. The detection system according to claim 1, characterized in that, The detection system also includes: A display device is used to display the usage status of the optical element.

5. The detection system according to claim 1, characterized in that, The processing device is also used to issue a first prompt message when the usage state of the optical element meets the first preset condition.

6. The detection system according to claim 5, characterized in that, The first preset condition includes: at least one of the at least one optical element has optical damage.

7. The detection system according to claim 6, characterized in that, The adjustment device includes at least one adjustment element, which corresponds one-to-one with the optical element and is used to adjust the position of the corresponding optical element that is illuminated by the light in the optical path.

8. The detection system according to claim 1, characterized in that, Also includes: An alarm device that issues a prompt message when the usage status of at least one optical element meets a third preset condition.

9. A semiconductor testing device, characterized in that, include: A laser, at least one optical element, and a detection system according to any one of claims 1-8, wherein the detection system is configured to acquire an optical signal formed by processing a laser emitted by the laser by the at least one optical element, and to determine the usage status of the at least one optical element based on the optical signal formed by processing the laser emitted by the laser by the at least one optical element.

10. A detection method, characterized in that, Applications in detection systems include: Based on the optical signal generated by at least one optical element in the semiconductor detection equipment acquired by the detection device, the usage status of the at least one optical element is determined. The optical signal generated by the optical element is the optical signal generated by the optical element processing the light in the optical path of the semiconductor detection equipment. The optical element includes a beam splitter, a mirror, a polarizing lens, a prism, a reticle, or a filter. Based on the usage status of the at least one optical element, the adjustment device in the control detection system automatically adjusts the position of the optical element with optical damage that is irradiated by the light in the optical path until the optical signal formed by the optical element with optical damage processing the light in the optical path meets the second preset condition, so that the optical signal formed by the optical element with optical damage processing the light in the optical path based on the new irradiation point can meet the detection accuracy requirements of the semiconductor detection equipment. The detection device includes an optical signal detection element and a control element. The optical signal detection element is used to acquire the optical signal formed by the optical element processing the light rays. The control element is used to control the relative position of the optical signal detection element and the transmission optical path of the optical signal formed by the optical element processing the light rays. The control element is fixedly connected to the optical signal detection element and is used to control whether the optical signal detection element is on the transmission optical path or not on the transmission optical path. Determining the usage status of at least one optical element based on the optical signal generated by at least one optical element in the semiconductor detection equipment acquired by the detection device includes: determining the usage status of the optical element based on preset parameters of the optical signal generated by the optical element processing the light in the optical path of the semiconductor detection equipment; The preset parameters include optical power, light spot uniformity, light spot roundness, and light spot M. 2 At least one of the factors; the processing device is specifically configured to perform at least one of the following: When the ratio between the optical power value of the optical signal formed by the optical element processing the light and its initial optical power value is less than a first preset value, or when the attenuation rate of the optical power value of the optical signal formed by the optical element processing the light is not less than a second preset value, it is determined that the optical element has optical damage. When the length of the light spot in the light signal formed by the light source processed by the optical element is less than a third preset value, and / or the width of the light spot area is greater than a fourth preset value, it is determined that the optical element has optical damage. When the circularity of the light spot formed by the optical element processing the light is less than a fifth preset value, it is determined that the optical element has optical damage. When the optical element processes the light signal formed by the light, the light spot is located at M along its long side direction. 2 Factor or M in the direction of its shorter side 2 If the factor is greater than the sixth preset value, it is determined that the optical element has optical damage.

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