Coil assembly

Abstract

A coil assembly is provided. The coil assembly includes a main body including an insulating substrate, and a coil part disposed on the insulating substrate, wherein the coil part includes a first upper pattern and a second upper pattern disposed apart from each other on one surface of the insulating substrate, a first lower pattern and a second lower pattern disposed apart from each other on the other surface of the insulating substrate, and a first via hole and a second via hole each passing through the insulating substrate and disposed adjacent to each other. An area of one end portion of the first via hole in contact with the first upper pattern is less than an area of one end portion of the second via hole in contact with the second upper pattern, and an area of the other end portion of the first via hole is greater than an area of the other end portion of the second via hole.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0172519, filed on December 10, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a coil assembly. Background Technology

[0003] As electronic devices become smaller and their performance levels improve, the coil components used in these devices also need to be miniaturized and perform at high performance. That is, coil components are becoming increasingly smaller, and even in this case, component characteristics such as inductance (Ls) and Q characteristics (quality factor) need to be ensured.

[0004] At the same time, in order to improve the Q characteristics, the number of coil turns must be increased, but there are limitations in increasing the number of coil turns due to the miniaturization of components. Summary of the Invention

[0005] One aspect of this disclosure is to provide a coil assembly with improved Q characteristics.

[0006] According to one aspect of this disclosure, a coil assembly includes: a body including an insulating substrate having a first surface and a second surface opposite to each other; and a coil portion disposed on the insulating substrate. The coil portion includes a first upper pattern and a second upper pattern disposed on the first surface of the insulating substrate and spaced apart from each other in a first direction, a first lower pattern and a second lower pattern disposed on the second surface of the insulating substrate and spaced apart from each other, and a first through-hole and a second through-hole each passing through the insulating substrate and disposed adjacent to each other in the first direction. The area of ​​the upper end of the first through-hole contacting the first upper pattern is smaller than the area of ​​the upper end of the second through-hole contacting the second upper pattern, and the area of ​​the lower end of the first through-hole is larger than the area of ​​the lower end of the second through-hole.

[0007] According to another aspect of this disclosure, a coil assembly includes: a body including an insulating substrate having a first surface and a second surface opposite to each other; and a coil portion disposed on the insulating substrate. The coil portion includes a plurality of upper patterns disposed on the first surface of the insulating substrate and spaced apart from each other in a first direction, a plurality of lower patterns disposed on the second surface of the insulating substrate and spaced apart from each other, and a plurality of through holes passing through the insulating substrate and each having an upper end portion and a lower end portion opposite to each other. The plurality of through holes includes through holes having a trapezoidal cross section and through holes having an inverted trapezoidal cross section alternately arranged in the first direction.

[0008] According to another aspect of this disclosure, a coil assembly includes: a body including an insulating substrate having a first surface and a second surface opposite to each other; and a coil portion disposed on the insulating substrate. The coil portion includes a first upper pattern and a second upper pattern disposed on the first surface of the insulating substrate and spaced apart from each other in a first direction, a first lower pattern and a second lower pattern disposed on the second surface of the insulating substrate and spaced apart from each other, and a first through-hole and a second through-hole each passing through the insulating substrate and disposed adjacent to each other in the first direction. The area of ​​the upper end of the first through-hole contacting the first upper pattern is smaller than the area of ​​the upper end of the second through-hole contacting the second upper pattern. The area of ​​the upper end of the first through-hole is smaller than the area of ​​the lower end of the first through-hole. Attached Figure Description

[0009] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which:

[0010] Figure 1 This is a schematic perspective view of a coil assembly according to an embodiment of the present disclosure;

[0011] Figure 2 It is a schematic diagram showing the connection relationship of the coil section;

[0012] Figure 3 It shows along Figure 1 A diagram showing the cross-section intercepted by line I-I';

[0013] Figure 4 It is a schematic representation of from Figure 1 A diagram showing the view viewed from above;

[0014] Figure 5 It is shown Figure 4 An enlarged view of part A in the diagram;

[0015] Figure 6 This is a schematic diagram illustrating a coil assembly according to another embodiment of the present disclosure; and

[0016] Figure 7 It is viewed from above. Figure 6 A schematic diagram. Detailed Implementation

[0017] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings. The terminology used in the exemplary embodiments is for the purpose of simply describing the exemplary embodiments and is not intended to limit the present disclosure. Unless otherwise stated, singular terms include plural forms. Terms such as “comprising,” “including,” “constructed as,” etc., in the specification are used to indicate the presence of features, quantities, steps, operations, elements, components, or combinations thereof, and do not exclude the possibility of combining or adding one or more features, quantities, steps, operations, elements, components, or combinations thereof. Furthermore, terms such as “set on,” “located on,” etc., may indicate that an element is located above or below an object, and do not necessarily mean that the element is above the object relative to the direction of gravity.

[0018] The terms “integrated into” and “combined into” not only indicate that elements are in direct and physical contact with each other, but also include a configuration in which another element is located between the elements such that the element is also in contact with the other element.

[0019] For ease of description, the dimensions and thicknesses of the elements shown in the accompanying drawings are indicated by way of example, and the exemplary embodiments in this disclosure are not limited thereto.

[0020] In the attached figures, the L direction is the second direction or length direction, the W direction is the first direction or width direction, and the T direction is the third direction or thickness direction.

[0021] In the description with reference to the accompanying drawings, the same reference numerals will be used to describe the same elements or elements corresponding to each other, and repeated descriptions will not be repeated.

[0022] In electronic devices, various types of electronic components can be used, and various types of coil components can be used between electronic components to remove noise, etc.

[0023] In other words, in electronic devices, coil assemblies can be used as power inductors, high-frequency inductors, general-purpose ferrite beads, high-frequency ferrite beads (e.g., suitable for the GHz band), common-mode filters, etc.

[0024] Figure 1 This is a perspective view schematically showing a coil assembly according to an embodiment of the present disclosure. Figure 2 It is a schematic diagram showing the connection relationship of the coil section. Figure 3 It shows along Figure 1 A diagram showing the cross section taken by line I-I'. Figure 4 It is a schematic representation of from Figure 1 A diagram showing the view viewed from above. Figure 5 It is shown Figure 4 A magnified view of part A in the diagram. Furthermore, Figure 4 It shows in Figure 1The upper part of the coil section is projected to show the structure of the coil section more clearly.

[0025] Reference Figures 1 to 5 According to a first embodiment of the present disclosure, the coil assembly 1000 may include a main body 100, a coil portion 200, and external electrodes 300 and 400.

[0026] The main body 100 can form the appearance of the coil assembly 1000 according to this embodiment, and the coil portion 200 is embedded in the main body 100.

[0027] The main body 100 can have a hexahedral shape as a whole.

[0028] based on Figure 1 The body 100 includes a first surface 101 and a second surface 102 opposite to each other in the length direction L, a third surface 103 and a fourth surface 104 opposite to each other in the width direction W, and a fifth surface 105 and a sixth surface 106 opposite to each other in the thickness direction T. Each of the first surface 101, second surface 102, third surface 103, and fourth surface 104 of the body 100 may correspond to a wall surface of the body 100 that connects the fifth surface 105 and the sixth surface 106. In the following description, the two end surfaces (first end surface and second end surface) of the body 100 may refer to the first surface 101 and the second surface 102 of the body 100, and the two side surfaces (first side surface and second side surface) of the body 100 may refer to the third surface 103 and the fourth surface 104 of the body 100. In addition, one surface of the body 100 may refer to the sixth surface 106 of the body 100, and the other surface of the body 100 may refer to the fifth surface 105 of the body 100. When the coil assembly 1000 according to this embodiment is mounted on a mounting substrate such as a printed circuit board, the sixth surface 106 of the body 100 can be used as a mounting surface.

[0029] For example, the body 100 may be configured such that the coil assembly 1000 according to this embodiment (in which the external electrodes 400 and 500, which will be described later, are formed) may have a length of 1.0 mm, a width of 0.5 mm, and a thickness of 0.6 mm, or a length of 1.6 mm, a width of 0.8 mm, and a thickness of 1.0 mm, or a length of 0.4 mm, a width of 0.2 mm, and a thickness of 0.23 mm, but is not limited thereto. Furthermore, since the above dimensions are merely design dimensions that do not reflect manufacturing errors, etc., they should be considered within the scope of this disclosure to the extent that they can be recognized as manufacturing errors.

[0030] The length of the coil assembly 1000 can refer to: the maximum value among the dimensions of a plurality of line segments that connect the two outermost boundary lines of the coil assembly 1000 opposite each other in the length direction L and parallel to the length direction L of the coil assembly 1000, obtained by optical microscopy or scanning electron microscopy (SEM) at the center portion of the coil assembly 1000 in the width direction W. Optionally, the length of the coil assembly 1000 can refer to: the arithmetic mean of at least two dimensions among the dimensions of a plurality of line segments that connect the two outermost boundary lines of the coil assembly 1000 opposite each other in the length direction L and parallel to the length direction L of the coil assembly 1000 shown in the cross-sectional image.

[0031] The thickness of the coil assembly 1000 can refer to: the maximum value among the dimensions of a plurality of line segments that connect the two outermost boundary lines of the coil assembly 1000 opposite each other in the thickness direction T and are parallel to the thickness direction T, obtained by referring to an image of the coil assembly 1000 at its central portion in the width direction W and in the length direction L-thickness direction T, as shown in the cross-sectional image obtained by an optical microscope or a scanning electron microscope (SEM). Alternatively, the thickness of the coil assembly 1000 can refer to: the arithmetic mean of at least two dimensions among the dimensions of a plurality of line segments that connect the two outermost boundary lines of the coil assembly 1000 opposite each other in the thickness direction T and are parallel to the thickness direction T, as shown in the cross-sectional image.

[0032] The width of the coil assembly 1000 can refer to the maximum value among multiple line segments that connect the two outermost boundary lines of the coil assembly 1000 in the width direction W and parallel to the width direction W, obtained by referring to an image of the coil assembly 1000 at its central portion in the length direction L and in the width direction W-thickness direction T, as shown in the cross-sectional image obtained by an optical microscope or a scanning electron microscope (SEM). Alternatively, the width of the coil assembly 1000 can refer to the arithmetic mean of at least two dimensions among multiple line segments that connect the two outermost boundary lines of the coil assembly 1000 in the width direction W and parallel to the width direction W, as shown in the cross-sectional image.

[0033] Optionally, the length, width, and thickness of the coil assembly 1000 can be measured using a micrometer. The micrometer measurement method involves setting the zero point using a metrological repeatability and reproducibility (R&R) micrometer, inserting the coil assembly 1000 according to this embodiment into the space between the tips of the micrometer, and rotating the measuring rod of the micrometer. Furthermore, when measuring the length of the coil assembly 1000 using the micrometer measurement method, the length of the coil assembly 1000 can refer to a single measurement or the arithmetic mean of multiple measurements. The same measurement method can also be applied to the width and thickness of the coil assembly 1000.

[0034] The main body 100 may include an insulating substrate 110, an upper cover layer 121 and a lower cover layer 122 respectively disposed on two opposing surfaces of the insulating substrate 110 in the thickness direction T, and side surface cover layers 131 and 132 respectively disposed on two opposing side surfaces of the insulating substrate 110 in the width direction W.

[0035] The coil portion 200, which will be described later, may be disposed on an insulating substrate 110, and the insulating substrate 110 may be a base substrate forming the coil portion 200. The insulating substrate 110 may be at least one of, for example, a ceramic substrate such as alumina (Al2O3), a glass substrate such as a glass plate, and a resin substrate including glass cloth. As an example, the insulating substrate 110 may include a copper-clad laminate (CCL), but the scope of this disclosure is not limited thereto. The thickness of the insulating substrate 110 may be, for example, greater than or equal to 10 μm and less than or equal to 50 μm, but is not limited thereto.

[0036] based on Figure 3 In the direction of the upper cover layer 121 and the lower cover layer 122 can be respectively disposed on the upper surface and the lower surface of the insulating substrate 110 to cover the upper patterns 211, 212, 213, 214 and 215 disposed on the upper surface of the insulating substrate 110 and the lower patterns 221, 222, 223 and 224 disposed on the lower surface of the insulating substrate 110. Based on Figure 3 In this embodiment, the fifth surface 105 and the sixth surface 106 of the main body 100 can be formed using the upper cover layer 121 and the lower cover layer 122, respectively, and the third surface 103 and the fourth surface 104 of the main body 100 can be formed using the side surface cover layers 131 and 132, respectively. That is, the insulating substrate 110 may not be exposed to the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the main body 110, and may only be exposed to the first surface 101 and the second surface 102 of the main body 100. Furthermore, as... Figure 3 As shown, side surface cover layers 131 and 132 may cover the left and right surfaces of each of the upper cover layer 121 and the lower cover layer 122, but this is merely an example. Therefore, the arrangement of the upper cover layer 121 and the lower cover layer 122, as well as the side surface cover layers 131 and 132, can be varied. As another example, side surface cover layers 131 and 132 may be formed first on the insulating substrate 110, and the upper cover layer 121 may be formed to cover the entire upper surface of each of the first side surface cover layer 131 and the second side surface cover layer 132. As another example, side surface cover layers 131 and 132 may be selectively removed in this disclosure.

[0037] Each of the upper cover layer 121, the lower cover layer 122, and the side surface cover layers 131 and 132 may comprise an insulating material including a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or may be formed using an insulating material in which at least one of glass fiber, inorganic filler, and organic filler is impregnated in these insulating resins. For example, the upper cover layer 121 may comprise, but is not limited to, an insulating material such as a prepreg, Ajinomoto Build-up Film (ABF), FR-4, bismaleimide triazine (BT) resin, photosensitive dielectric (PID), etc.

[0038] At least one of the following can be used as an inorganic filler: silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3).

[0039] Organic fillers may include at least one of the following: acrylonitrile-butadiene-styrene (ABS), cellulose acetate, nylon, polymethyl methacrylate (PMMA), polybenzimidazole, polycarbonate, polyethersulfone, polyetheretherketone (PEEK), polyetherimide (PEI), polyethylene, polylactic acid, polyoxymethylene, polyphenylene ether, polyphenylene sulfide, polypropylene, polystyrene, polyvinyl chloride, ethylene-vinyl acetate, polyvinyl alcohol, polyethylene oxide, epoxy resin, and polyimide.

[0040] Each of the upper cover layer 121, the lower cover layer 122, and the side surface cover layers 131 and 132 may be formed by laminating insulating films, or by applying insulating paste and then curing it, but is not limited thereto.

[0041] The relative permeability (μ) of each of the insulating substrate 110, the upper cover layer 121, the lower cover layer 122, and the side surface cover layers 131 and 132 r The relative permeability (μ) of the entire body 100 can be less than 1. In this case, due to the relative permeability (μ) of the entire body 100, r The value can be less than 1, so the coil assembly 1000 according to this embodiment can be used as a high-frequency inductor (HF inductor).

[0042] The coil portion 200 may be disposed on the insulating substrate 110. Specifically, the coil portion 200 may be disposed on the insulating substrate 110 and embedded in the main body 100 to exhibit the characteristics of the coil assembly. For example, when the coil assembly 1000 according to this embodiment is used as a power inductor, the coil portion 200 may be used to stabilize the power supply of an electronic device by storing the electric field as a magnetic field and maintaining the output voltage.

[0043] The coil portion 200 may include: upper patterns 211, 212, 213, 214 and 215, which are spaced apart from each other on a first surface (e.g., upper surface) of the insulating substrate 110; lower patterns 221, 222, 223 and 224, which are spaced apart from each other on a second surface (e.g., lower surface) of the insulating substrate 110; and vias V1-1, V2-1, V3-1, V4-1, V5-1, V1-2, V2-2, V3-2, V4-2 and V5-2, which pass through the insulating substrate 110 and are spaced apart from each other.

[0044] Specifically, refer to Figure 2 ,based on Figure 2 As shown in the reference direction, vias V1-1, V2-1, V3-1, V4-1, and V5-1 disposed on one of two opposing segments in the longitudinal direction L of the insulating substrate 110 may be spaced apart from each other in the width direction W. Vias V1-2, V2-2, V3-2, V4-2, and V5-2 disposed on the other of the two opposing segments in the longitudinal direction L of the insulating substrate 110 may be spaced apart from each other in the width direction W. Upper patterns 211, 212, 213, 214, and 215 may be disposed on the upper surface of the insulating substrate 110 and spaced apart from each other in the width direction W, and each of the upper patterns 211, 212, 213, 214, and 215 extending in the longitudinal direction L may have a first end and a second end opposing each other in the longitudinal direction L. Lower patterns 221, 222, 223, and 224 may be spaced apart from each other on the lower surface of the insulating substrate 110, and each of the lower patterns 221, 222, 223, and 224 extending in one direction may have a first end and a second end opposite to each other in one direction. (Refer to...) Figure 1 and Figure 2The lower patterns 221, 222, 223, and 224 may be spaced apart in a generally width direction. In via V1-1, the first end (upper end) is connected to contact the first end of the first upper pattern 211, and the second end (lower end) is connected to contact the first lead-out pattern 231. In via V1-2, the first end (upper end) is connected to contact the second end of the first upper pattern 211, and the second end (lower end) is connected to contact the second end of the first lower pattern 221. In via V2-1, the first end (upper end) is connected to contact the first end of the second upper pattern 212, and the second end (lower end) is connected to contact the first end of the first lower pattern 221. In via V2-2, the first end (upper end) is connected to contact the second end of the second upper pattern 212, and the second end (lower end) is connected to contact the second end of the second lower pattern 222. In via V3-1, the first end (upper end) is connected to contact the first end of the third upper pattern 213, and the second end (lower end) is connected to contact the first end of the second lower pattern 222. In via V3-2, the first end (upper end) is connected to contact the second end of the third upper pattern 213, and the second end (lower end) is connected to contact the second end of the third lower pattern 223. In via V4-1, the first end (upper end) is connected to contact the first end of the fourth upper pattern 214, and the second end (lower end) is connected to contact the first end of the third lower pattern 223. In via V4-2, the first end (upper end) is connected to contact the second end of the fourth upper pattern 214, and the second end (lower end) is connected to contact the second end of the fourth lower pattern 224. In via V5-1, the first end (upper end) is connected to contact the first end of the fifth upper pattern 215, and the second end (lower end) is connected to contact the first end of the fourth lower pattern 224. In via V5-2, the first end (upper end) is connected to contact the second end of the fifth upper pattern 215, and the second end (lower end) is connected to contact the second lead-out pattern 232. The first lead-out pattern 231 may be exposed on the first surface 101 of the body 100 to connect to the first external electrode 300, which will be described later. The second lead-out pattern 232 may be exposed on the second surface 102 of the body 100 to connect to the second external electrode 400, which will be described later. Thus, the upper patterns 211, 212, 213, 214 and 215, the lower patterns 221, 222, 223 and 224, and the vias V1-1, V2-1, V3-1, V4-1, V5-1, V1-2, V2-2, V3-2, V4-2 and V5-2 can be used as a single solenoid coil connected in series between the first external electrode 300 and the second external electrode 400.

[0045] Two of the vias V1-1, V2-1, V3-1, V4-1, V5-1, V1-2, V2-2, V3-2, V4-2, and V5-2 that are adjacent to each other can be formed in a complementary manner. As an example, the area of ​​the first end of via V1-1 that contacts the first end of the first upper pattern 211 can be smaller than the area of ​​the first end of via V2-1 that contacts the first end of the second upper pattern 212, and the area of ​​the second end of via V1-1 can be larger than the area of ​​the second end of via V2-1. Furthermore, the cross-sectional area of ​​via V1-1 can increase from the first end to the second end, and the cross-sectional area of ​​via V2-1 can decrease from the first end to the second end. That is, vias V1-1 and V2-1 that are adjacent to each other in the width direction W on the insulating substrate 110 can be formed as a tapered tapered shape and an inverted tapered tapered shape, respectively.

[0046] Multiple vias can be formed in a single component by machining vias for forming vias on an insulating substrate and then filling the vias with a conductive material. Typically, all vias in a plurality of vias can be machined and formed on the upper surface of the insulating substrate, with all vias having an inverted tapered shape, or all vias in a plurality of vias can be machined and formed on the lower surface of the insulating substrate, with all vias having a tapered shape. As an example, when all vias in a plurality of vias have an inverted tapered shape, the maximum diameter of all vias can be set on the upper surface of the insulating substrate, which may inevitably reduce the number of vias that can be formed based on the dimension in the width direction W of the upper surface of the same insulating substrate. In this embodiment, when multiple vias are formed in the width direction W, the above problem can be solved by alternately forming vias with trapezoidal cross sections and vias with inverted trapezoidal cross sections. That is, based on the width of the same insulating substrate 110, a greater number of vias and vias can be formed, unlike in the prior art. As a result, a greater number of upper patterns can be formed based on the area of ​​one surface of the same insulating substrate 110, thereby increasing the total number of turns of the coil section 200. (Refer to...) Figure 3 The width of a via with a trapezoidal cross-section increases from the top end to the bottom end, while the width of a via with an inverted trapezoidal cross-section decreases from the top end to the bottom end.

[0047] Reference Figure 5The spacing S2 between the lower end of via V2-1 and the lower end of via V3-1 can be approximately equal to the spacing S1 between the upper end of via V2-1 and the upper end of via V3-1. Vias V2-1 with an inverted trapezoidal cross-section and via V3-1 with a trapezoidal cross-section can be positioned adjacent to each other in the width direction W. Furthermore, by making the spacing S1 between the upper ends of via V2-1 and the upper ends of via V3-1 approximately equal to the spacing S2 between the lower ends of via V2-1 and the lower ends of via V3-1, a greater number of vias can be provided based on the same cross-sectional area of ​​the insulating substrate 110.

[0048] Furthermore, the above description is based on vias V2-1 and V3-1, but the same description can also be applied to... Figure 2 The diagram shows other vias arranged adjacent to each other in the width direction W, as well as the upper and lower patterns connecting the vias.

[0049] At least one of the upper patterns 211, 212, 213, 214 and 215, the lower patterns 221, 222, 223 and 224, the vias V1-1, V2-1, V3-1, V4-1, V5-1, V1-2, V2-2, V3-2, V4-2 and V5-2, and the lead-out patterns 231 and 232 may include one or more conductive layers. For example, when the upper patterns 211, 212, 213, 214, and 215 and vias V1-1, V2-1, V3-1, V4-1, V5-1, V1-2, V2-2, V3-2, V4-2, and V5-2 are deposited on the upper surface of the insulating substrate 110, the upper patterns 211, 212, 213, 214, and 215 and the vias V1-1, V2-1, V3-1, V4-1, V5-1, V1-2, V2-2, V3-2, V4-2, and V5-2 may include a first conductive layer formed by vapor deposition, such as electroless plating or sputtering, and a second conductive layer disposed on the first conductive layer. The first conductive layer may be a seed layer for forming the second conductive layer by depositing it on the insulating substrate 110. The second conductive layer may be an electroplated layer. Here, the electroplated layer may have a single-layer structure or a multi-layer structure. The multilayer electroplated layer may have a conformal film structure in which one electroplated layer is covered by another electroplated layer, or it may have a form in which one electroplated layer is only stacked on one side of an electroplated layer. The seed layers of patterns 211, 212, 213, 214 and 215 and the seed layers of vias V1-1, V2-1, V3-1, V4-1, V5-1, V1-2, V2-2, V3-2, V4-2 and V5-2 may be formed integrally, such that no boundary is formed between them, but is not limited thereto.

[0050] Each of the upper patterns 211, 212, 213, 214 and 125, the lower patterns 221, 222, 223 and 224, the vias V1-1, V2-1, V3-1, V4-1, V5-1, V1-2, V2-2, V3-2, V4-2 and V5-2, and the lead-out patterns 231 and 232 may include, but is not limited to, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) or alloys thereof.

[0051] The first external electrode 300 and the second external electrode 400 are disposed on the sixth surface 106 of the body 100 at a distance from each other. The first external electrode 300 and the second external electrode 400 extend to the first surface 101 and the second surface 102 of the body 100, respectively, and are connected to contact the lead-out patterns 231 and 232 exposed on the first surface 101 and the second surface 102 of the body 100, respectively.

[0052] The first external electrode 300 and the second external electrode 400 can be formed as a single-layer structure or a multi-layer structure. For example, each of the first external electrode 300 and the second external electrode 400 may include a first layer containing copper (Cu), a second layer disposed on the first layer and containing nickel (Ni), and a third layer disposed on the second layer and containing tin (Sn). The first external electrode 300 and the second external electrode 400 can be formed by plating, paste printing, etc. As a non-limiting example, each of the first external electrode and the second external electrode may include: a first layer formed by directly coating a conductive paste containing conductive powder onto a body and curing or sintering the conductive paste; and a second layer formed by electroplating using the first layer as a seed layer.

[0053] The first external electrode 300 and the second external electrode 400 may include, but are not limited to, conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof.

[0054] In the coil assembly 1000 according to this embodiment, for example, vias V1-1 having a trapezoidal cross-sectional shape and vias V2-1 having an inverted trapezoidal cross-sectional shape are arranged to be adjacent to each other in the width direction W. As a result, for an insulating substrate 110 of the same width, a greater number of vias can be provided. Therefore, the coil assembly 1000 according to this embodiment can increase the total number of turns of the coil portion 300, thereby improving the Q characteristics and inductance (Ls) characteristics.

[0055] Figure 6 This is a schematic diagram illustrating a coil assembly according to another embodiment of the present disclosure. Figure 7 It is a schematic representation of the view from above. Figure 6A diagram showing the view. Furthermore... Figure 7 It shows in Figure 6 The upper part of the coil section is projected to show the structure of the coil section more clearly.

[0056] Reference Figures 1 to 5 as well as Figure 6 and Figure 7 Compared to the lower patterns 221, 222, 223, and 224 of the coil assembly 1000 according to the first embodiment of this disclosure, the coil assembly 2000 according to another embodiment of this disclosure has lower patterns 221, 222, 223, and 224 with different shapes. Therefore, in describing this embodiment, only the shapes of the lower patterns 221, 222, 223, and 224 that are different from those in the first embodiment of this disclosure will be described. For the remaining construction of this embodiment, the description of the first embodiment of this disclosure can be applied as is.

[0057] According to another embodiment of this disclosure, lower patterns 221, 222, 223, and 224 may have linewidths that increase or decrease from one end to the other. As an example, the linewidth of the first lower pattern 221 may increase from one end connected to the lower end of via V2-1 to the other end connected to the lower end of via V1-2. The linewidth of the second lower pattern 222 may decrease from one end connected to the lower end of via V3-1 to the other end connected to the lower end of via V2-2. The linewidth of the third lower pattern 223 may increase from one end connected to the lower end of via V4-1 to the other end connected to the lower end of via V3-2. The linewidth of the fourth lower pattern 224 may decrease from one end connected to the lower end of via V5-1 to the other end connected to the lower end of via V4-2. As another example, in... Figure 6 and Figure 7 In the middle, lower patterns 221, 222, 223, and 224 include two pad portions connected to the via and a line portion extending between the pad portions. In this case, the line width of lower patterns 221, 222, 223, and 224 may refer to the line width of the line portion, and the line width of lower patterns 221, 222, 223, and 224 may vary similarly as described above. In other words, at least a portion of each of the plurality of lower patterns 221, 222, 223, and 224 may have an increased or decreased line width. Furthermore, here, when the direction from one end of the first lower pattern 221 toward the other end of the first lower pattern 221 is defined as the line direction, the line width of the first lower pattern 221 may refer to the dimension of the first lower pattern in the direction perpendicular to the line direction. The same definition can be applied to the line width of the second to fourth lower patterns. In contrast, according to Figures 1 to 5In the illustrated embodiment, at least a portion of each of the lower patterns 221, 222, 223, and 224 may have substantially the same linewidth along the line direction. Here, those skilled in the art will understand that the expression "substantially the same" or "substantially equal" means identical by allowing for process errors, positional deviations, and / or measurement errors that may occur during the manufacturing process.

[0058] When vias V1-1, V2-1, V3-1, V4-1, V5-1, V1-2, V2-2, V3-2, V4-2, and V5-2 are arranged in the width direction W, in addition to the characteristic that vias with trapezoidal cross-sections are adjacent to vias with inverted trapezoidal cross-sections in the width direction W as in the first embodiment of this disclosure, this embodiment may also have the characteristic of increasing and decreasing linewidths of lower patterns 221, 222, 223, and 224 that connect the vias and are spaced apart from each other in the width direction W. Therefore, based on the area of ​​the lower surface of the same insulating substrate 110, the coil assembly 2000 according to this embodiment can increase the formation area of ​​lower patterns 221, 222, 223, and 224. As a result, the conductor assembly disposed on the insulating substrate 110 having the same volume can be increased, thereby improving the DC resistance (Rdc) characteristics.

[0059] As described above, the Q characteristics can be easily improved according to the embodiments of this disclosure.

[0060] Although exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and changes may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. A coil assembly, comprising: A body comprising an insulating substrate and side surface cover layers, the insulating substrate having a first surface and a second surface facing each other in a third direction and two side surfaces facing each other in a first direction perpendicular to the third direction, and the side surface cover layers being respectively disposed on the two side surfaces of the insulating substrate, wherein an interface exists between the side surface cover layers and the two side surfaces of the insulating substrate; and The coil portion is disposed on the insulating substrate. The coil portion includes a first upper pattern and a second upper pattern disposed on the first surface of the insulating substrate and spaced apart from each other in the first direction, a first lower pattern and a second lower pattern disposed on the second surface of the insulating substrate and spaced apart from each other, and a first through hole and a second through hole, each passing through the insulating substrate and disposed adjacent to each other in the first direction. Wherein, the area of ​​the upper end of the first via that contacts the first upper pattern is smaller than the area of ​​the upper end of the second via that contacts the second upper pattern, and The area of ​​the lower end of the first via is greater than the area of ​​the lower end of the second via.

2. The coil assembly according to claim 1, wherein, The area of ​​the upper end of the first via is smaller than the area of ​​the lower end of the first via.

3. The coil assembly according to claim 2, wherein, The cross-sectional area of ​​the first via increases from the upper end of the first via to the lower end of the first via.

4. The coil assembly according to claim 2, wherein, The area of ​​the upper end of the second via is greater than the area of ​​the lower end of the second via.

5. The coil assembly according to claim 4, wherein, The cross-sectional area of ​​the second via decreases from the upper end of the second via to the lower end of the second via.

6. The coil assembly according to any one of claims 1-5, wherein, The distance between the upper end of the first via and the upper end of the second via is substantially equal to the distance between the lower end of the first via and the lower end of the second via.

7. The coil assembly according to any one of claims 1-5, wherein, The upper end of the first via and the upper end of the second via are respectively in contact with the first end of the first upper pattern and the first end of the second upper pattern. Wherein, the lower end of the second via is in contact with the first end of the first lower pattern. The coil portion further includes a third through-hole, which passes through the insulating substrate and connects the second end of the first upper pattern and the second end of the first lower pattern. Wherein, the area of ​​the upper end of the third via connected to the second end of the first upper pattern is smaller than the area of ​​the lower end of the second end connected to the first lower pattern.

8. The coil assembly according to claim 7, wherein, The line width of the first lower pattern increases from the first end side connected to the lower end of the second via to the second end side connected to the lower end of the third via.

9. The coil assembly according to any one of claims 1-5, wherein, The body has a first surface, a first end surface, and a second end surface. The first surface of the body faces the second surface of the insulating substrate. The first end surface and the second end surface are each connected to the first surface of the body and are opposite to each other in a second direction perpendicular to the first direction and the third direction. The two ends of the coil portion are exposed to the first end surface and the second end surface of the main body, respectively.

10. The coil assembly of claim 9, further comprising a first external electrode and a second external electrode, the first external electrode and the second external electrode being disposed spaced apart from each other on the first surface of the body and extending to the first end surface and the second end surface of the body, respectively, to be connected to the two ends of the coil portion.

11. The coil assembly according to any one of claims 1-5, wherein, The insulating substrate includes at least one of an alumina substrate, a glass substrate, and a resin substrate comprising glass cloth.

12. A coil assembly, comprising: A body comprising an insulating substrate and side surface cover layers, the insulating substrate having a first surface and a second surface facing each other in a third direction and two side surfaces facing each other in a first direction perpendicular to the third direction, and the side surface cover layers being respectively disposed on the two side surfaces of the insulating substrate, wherein an interface exists between the side surface cover layers and the two side surfaces of the insulating substrate; and The coil portion is disposed on the insulating substrate. The coil portion includes a plurality of upper patterns spaced apart from each other on the first surface of the insulating substrate and in the first direction, a plurality of lower patterns spaced apart from each other on the second surface of the insulating substrate, and a plurality of through holes passing through the insulating substrate and each having an upper end and a lower end opposite to each other. The plurality of vias includes vias with trapezoidal cross-sections and vias with inverted trapezoidal cross-sections that are alternately arranged in the first direction.

13. The coil assembly according to claim 12, wherein, The width of the via with a trapezoidal cross-section increases from the upper end of the via to the lower end of the via, and The width of the via with the inverted trapezoidal cross-section decreases from the upper end of the via to the lower end of the via.

14. The coil assembly of claim 12, wherein, The spacing between the upper ends of adjacent vias in the first direction is substantially equal to the spacing between the lower ends of adjacent vias.

15. The coil assembly according to claim 12, wherein, The plurality of vias includes a plurality of first vias and a plurality of second vias. The plurality of first vias are respectively connected to a first end of the plurality of upper patterns, and the plurality of second vias are respectively connected to a second end of the plurality of upper patterns opposite to the first end of the plurality of upper patterns. Wherein, at least some of the lower ends of the plurality of first vias are connected to the first ends of the plurality of lower patterns, and at least some of the lower ends of the plurality of second vias are connected to the second ends of the plurality of lower patterns opposite to the first ends of the plurality of lower patterns.

16. The coil assembly of claim 15, further comprising a first lead pattern and a second lead pattern, wherein one of the lower ends of the plurality of first vias is connected to the first lead pattern, and one of the lower ends of the plurality of second vias is connected to the second lead pattern.

17. The coil assembly of claim 16, further comprising a first external electrode and a second external electrode, the first external electrode and the second external electrode being disposed on the outer surface of the body and respectively connected to the first lead-out pattern and the second lead-out pattern, such that the first lead-out pattern, the plurality of first vias and the plurality of second vias, the plurality of upper patterns and the plurality of lower patterns and the second lead-out pattern are connected in series as a single coil between the first external electrode and the second external electrode.

18. The coil assembly according to any one of claims 12-17, wherein, At least a portion of each of the plurality of lower patterns has substantially the same line width along the opposite directions of the two ends of each of the plurality of lower patterns.

19. The coil assembly according to any one of claims 12-17, wherein, At least a portion of each of the plurality of lower patterns has an increased or decreased line width.

20. A coil assembly, comprising: A body comprising an insulating substrate and side surface cover layers, the insulating substrate having a first surface and a second surface facing each other in a third direction and two side surfaces facing each other in a first direction perpendicular to the third direction, and the side surface cover layers being respectively disposed on the two side surfaces of the insulating substrate, wherein an interface exists between the side surface cover layers and the two side surfaces of the insulating substrate; and The coil portion is disposed on the insulating substrate. The coil portion includes a first upper pattern and a second upper pattern disposed on the first surface of the insulating substrate and spaced apart from each other in the first direction, a first lower pattern and a second lower pattern disposed on the second surface of the insulating substrate and spaced apart from each other, and a first through hole and a second through hole, each passing through the insulating substrate and disposed adjacent to each other in the first direction. Wherein, the area of ​​the upper end of the first via that contacts the first upper pattern is smaller than the area of ​​the upper end of the second via that contacts the second upper pattern, and Wherein, the area of ​​the upper end of the first via is smaller than the area of ​​the lower end of the first via.

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