Electrical device with heat dissipation structure using filler

Abstract

The present invention relates to an electrical apparatus including a printed circuit board (PCB) module housed in a case, and more particularly, to an electrical apparatus having a heat dissipation structure using a filler, which reduces heat generation outside the case while improving the heat dissipation efficiency of the PCB module by using the filler filled in the case, and a manufacturing method thereof.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0171349, filed with the Korean Intellectual Property Office on December 9, 2020, pursuant to Section 119 of 35 USC, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The following disclosure relates to an electrical device including a printed circuit board (PCB) module housed in a housing. More specifically, the present invention relates to an electrical device having a heat dissipation structure using a filler and a method of manufacturing the same, wherein the heat generation outside the housing is reduced by using a filler in the housing, while the heat dissipation efficiency of the PCB module is improved. Background Technology

[0004] Electrical equipment is increasingly trending towards miniaturization, lightweight design, and high capacity. In particular, chargers for mobile devices face stringent requirements for miniaturization, lightweight design, and high capacity. The following description is based on electrical equipment, with chargers as a representative example. However, the scope of this invention is not limited to chargers.

[0005] In recent years, due to the increased capacity and power consumption of mobile devices, there is a need to increase the capacity of batteries that power these devices and shorten charging times. As the output capacity of chargers increases to meet this requirement, the heat generated also increases. Typical electrical devices use the casing as a heat sink to dissipate internal heat to the outside, thereby reducing the temperature of internal components. However, in the case of electrical devices such as chargers, where users may come into contact with the casing, there are limitations to using the casing as a heat sink. It is necessary to lower the temperature of the casing surface in contact with the user and keep it below a certain level (e.g., 60 degrees Celsius) to prevent low-temperature burns.

[0006] Traditional chargers are large enough to dissipate heat through internal natural convection. However, this approach exposes internal components to excessive temperatures, which can shorten their lifespan, cause malfunctions, or even lead to damage. Furthermore, increasing charger capacity and miniaturizing the charger exacerbates the problem of excessive internal temperature due to increased heat generation from internal components, reduced spacing between components, and less space between components and the casing. This makes achieving both high-capacity and miniaturized chargers extremely difficult.

[0007] Furthermore, when heat dissipation is achieved by filling the miniaturized charger with a resin material that has high thermal conductivity, it is not easy to add the resin material into the injection nozzle due to the narrow space between the components and the PCB and the housing. Therefore, there is a problem that it is difficult to inject the resin material evenly into the housing, because cavitation is easily generated between the components, the PCB and the fluid, which leads to poor heat dissipation performance.

[0008] Furthermore, in the case of assembling components and PCBs, a resin material with high thermal conductivity is first injected into the housing of the unassembled components and PCBs, and then the components and PCBs are added to the housing to solve the above-mentioned problem. Since the components and PCBs are assembled in a state where the contact parts between the electrical terminals and the components and PCBs located in the housing are immersed in the resin material, or where the resin material is embedded therein, there is a problem that contact failure may occur due to the resin material at the contact parts between the components and PCBs and the terminals.

[0009] In addition, filling the charger with a resin material with high thermal conductivity is beneficial for heat dissipation, but it also increases the weight of the charger.

[0010] Furthermore, when the charger casing forms an internal space, there is a problem: even in areas where thermally conductive resin material is not needed, such as areas where no components or PCBs are placed inside the charger, filling with resin material can inhibit the weight reduction of the charger.

[0011] Furthermore, to meet the standard of not malfunctioning when dropped from a predetermined height, the charger should be lightweight and able to protect internal components and the PCB from drop impacts. However, there is a problem that it is difficult to reduce the size and weight of the charger because additional support components are required to secure and protect the components and PCB.

[0012] In addition, there is the problem that as the size of the charger decreases, it is difficult to ensure the separation distance between the components to ensure electrical insulation between the components. Summary of the Invention

[0013] The embodiments of the present invention aim to provide an electrical device with high reliability and high output density. More specifically, they aim to provide an electrical device that can have large capacity, small size and weight and prevent users from being burned at low temperatures. The device limits heat dissipation through the housing by dispersing the heat generated inside, while preventing the components from overheating, without the need for heat dissipation means such as heat sinks, cooling fans or water cooling channels.

[0014] Embodiments of the present invention aim to provide an electrical device that improves heat dissipation efficiency and disperses heat generated by components by forming a thermally conductive insulating filler in the area of ​​high-heat components (lower area of ​​the housing) on ​​a PCB module mounted in the housing. This prevents localized heat concentration at characteristic locations (e.g., high-heat-generating components), which could shorten component life or damage due to overheating. The filler also minimizes weight gain, reducing the overall weight. Compared to placing low-heat-generating components in the area where the user grips (upper area of ​​the housing) without or with minimal filler, filling the entire electrical device in the user-grip area suppresses heat transfer to that area (upper area of ​​the housing) and eliminates the need for a separate thermal shield to protect the user's grip area from low-temperature burns.

[0015] Embodiments of the present invention aim to provide electrical devices with high output density and minimized size and weight, which do not require separate fixing components through the curing filler supporting the PCB module, and can reduce the separation distance for insulation between components by using fillers with higher insulation properties than air.

[0016] Embodiments of the present invention aim to provide a highly reliable electrical device that prevents deterioration of thermal conductivity by preventing delamination or voids between components and fillers, even when components expand or contract through resin materials forming fillers containing adhesive components.

[0017] Embodiments of the present invention aim to provide an electrical device that forms a heat transfer path to increase the heat dissipation area and reduce weight by providing an additional thermal conductor or thermally conductive coating between the unfilled area (upper area of ​​the housing) and the filled area (lower area of ​​the housing) of the components.

[0018] For reference, the purpose of this invention is not limited to the above-described purposes, and those skilled in the art will clearly understand other unmentioned purposes through the following description.

[0019] In one general aspect, an electrical device includes: a housing comprising a lower portion and sidewalls and having spaces formed therein; a printed circuit board (PCB) module housed within the interior space of the housing and including a plurality of components and a PCB on which the plurality of components are mounted; and a filler present in the interior space of the housing and made of a resin material, wherein the filler contacts the PCB module, contacts the lower portion of the housing, or contacts a portion of the lower portion and sidewalls of the housing.

[0020] The PCB module may include a first region and a second region. The first region includes a first component group, and the second region includes a second component group. The heat generation of the first component group may be greater than the heat generation of the second component group, and the area of ​​the filler in contact with the first region may be greater than the area of ​​the filler in contact with the second region.

[0021] The filler may not be in contact with the second region, but may be in contact with at least a portion of the first region.

[0022] The filler can contact 10% or more to 100% of the area of ​​the first region.

[0023] The filler can contact 20% or more to less than 90% of the area of ​​the first region.

[0024] The contact area between the filler and the shell can be more than 30% and less than 90% of the total area of ​​the shell.

[0025] The filler may include adhesive components and may contact both surfaces of the first region of the PCB.

[0026] The PCB may include at least one through-hole in the first region, such that the resin material forming the filler flows in a fluid state between one surface of the PCB and the other surface before being cured.

[0027] The PCB module can be housed in the housing along the length direction (Z-axis direction) of the PCB module. Compared with the second region, the first region can be formed closer to the lower side of the PCB module (negative direction of the Z-axis), and compared with the first component group included in the first region, the through hole can be formed closer to the lower side of the PCB module (negative direction of the Z-axis).

[0028] The maximum permissible temperature of the second component group can be higher than that of the first component group.

[0029] The first group of components may include at least one of a transformer and a semiconductor switch, and the second group of components may include a capacitor.

[0030] A heat transfer reinforcement may be provided between at least a portion of the first element group and the filler, the heat transfer reinforcement not being in direct contact with the filler.

[0031] The heat transfer reinforcement can be made of metal or a heat pad.

[0032] The thermal conductivity of the filler is 0.6 W / mk or higher.

[0033] The insulation breakdown voltage of the filler is 10kV / mm or higher.

[0034] The adhesion of the filler is 50 gf / 10 mm or more up to 1000 gf / 10 mm or less.

[0035] The specific gravity of the filler can be 3 or less.

[0036] The hardness of the filler is 80 or below in Shore A or Shore D.

[0037] The remaining amount of the filler at 800°C in thermogravimetric analysis (TGA) is 70% or more by weight.

[0038] The filler may include acrylic resin, epoxy resin, polyurethane resin, olefin resin, EVA resin or silicone resin.

[0039] The filler may include ceramic particles or carbon-based fillers.

[0040] Fillers may include thixotropic agents, diluents, dispersants, surface treatment agents, flame retardants, or coupling agents.

[0041] The filler may further include a coating area on the housing or PCB module with a resin material of a predetermined thickness.

[0042] The coating area can be formed on the upper side, which is higher than the filling height of the filler.

[0043] The heaviest component in the first component group may weigh more than the heaviest component in the second component group.

[0044] In another general aspect, the method of manufacturing the electrical device includes: (a) forming a filler by injecting resin material into the internal receiving space of the housing; (b) assembling a PCB module by accommodating the PCB module in the receiving space; and (c) recovering a portion of the injected resin material to form a coating area on the upper side (positive direction of the Z-axis) above the filling height of the filler.

[0045] In another general aspect, the method of manufacturing the electrical device includes: (a) assembling a PCB module by housing it in an internal housing space of a housing; (b) forming a filler by injecting resin material into the housing space; and (c) recovering a portion of the injected resin material to form a coating area on the upper side (positive direction of the Z-axis) above the filler height.

[0046] In another general aspect, a method of manufacturing electrical equipment includes: (a) forming a filler by injecting resin material into an internal receiving space of a housing; (b) assembling a PCB module by housing a PCB module in the receiving space; and (c) forming a coating area by tilting the housing at a predetermined angle in at least one direction such that resin material is applied to an upper side (positive direction of the Z-axis) at a predetermined thickness higher than the filling height of the filler.

[0047] In another general aspect, the method of manufacturing electrical equipment includes: (a) assembling a PCB module by housing it in an internal receiving space of a housing; (b) forming a filler by injecting a resin material into the receiving space; and (c) forming a coating area by tilting the housing at a predetermined angle in at least one direction such that the resin material is applied to an upper side (positive direction of the Z-axis) at a height higher than the filling height of the filler.

[0048] The PCB module may include a first region and a second region. The first region includes a first component group and is located on the lower side, and the second region includes a second component group and is located on the upper side. The filler height may be located on the side lower than the second region. Attached Figure Description

[0049] Figure 1 This is a perspective view of an electrical device according to an embodiment of the present invention.

[0050] Figure 2 This is a cross-sectional schematic diagram of an electrical device according to a first embodiment of the present invention.

[0051] Figure 3 This is a cross-sectional schematic diagram of an electrical device according to a second embodiment of the present invention.

[0052] Figure 4 This is a cross-sectional schematic diagram of an electrical device according to a third embodiment of the present invention.

[0053] Figure 5 This is a cross-sectional schematic diagram of an electrical device according to a fourth embodiment of the present invention.

[0054] Figure 6 This is a cross-sectional schematic diagram of an electrical device according to a fifth embodiment of the present invention.

[0055] Figure 7 This is a cross-sectional schematic diagram of a method for manufacturing an electrical device according to a first embodiment of the present invention.

[0056] Figure 8 This is a cross-sectional schematic diagram of a method for manufacturing electrical equipment according to a second embodiment of the present invention.

[0057] Figure 9 and Figure 10 This is a cross-sectional schematic diagram of a method for manufacturing electrical equipment according to a third embodiment of the present invention. Detailed Implementation

[0058] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0059] -First Embodiment

[0060] Figure 1 An overall perspective view of an electrical device 1000 according to an embodiment of the present invention is shown. Figure 2 A cross-sectional schematic diagram of an electrical device 1000 according to a first embodiment of the present invention is shown.

[0061] As shown in the figure below, the direction in which the electrical equipment 1000 is coupled to the outlet is defined as the Z direction, the direction perpendicular to the Z direction is defined as the X direction, and the direction perpendicular to both the Z and X directions is defined as the Y direction. Furthermore, the Z direction is defined as the length direction of the electrical equipment 1000, the X direction as the width direction, and the Y direction as the thickness direction. Additionally, the positive direction of the Z-axis is defined as the top, the negative direction as the bottom, and the positive direction of the Y-axis is defined as one side, and the negative direction as the other side.

[0062] As shown in the figure, the electrical device 1000 includes a housing 100, a PCB module 200, and terminal pins 500. The housing 100 is fence-shaped, having a space formed therein, and its upper side (positive Z-axis direction) is opened to accommodate the PCB module 200. Furthermore, the terminal pins 500 are connected to the lower side (negative Z-axis direction) of the housing 100. Additionally, a cover 150 (see...) Figure 7 It can be attached to the upper opening surface of the housing 100 to seal the internal space of the housing 100.

[0063] Here, the housing 100 can be formed of an insulating resin material and can externally protect the components housed therein. Multiple insertion holes can be formed on the underside of the housing 100, and terminal pins 500 can be inserted into these insertion holes to be assembled into the underside of the housing 100. The terminal pins 500 can be formed in the form of at least a pair of rods, wherein their upper ends are inserted into and housed within the housing 100 and electrically connected to the PCB module 200, while their lower ends are exposed outside the housing 100. Here, the terminal pins 500 can be formed of a conductive metal material, and the lower ends exposed outside the housing 100 are configured as insertion sockets to receive external power and transmit external power to the PCB module 200 through the upper ends.

[0064] At this time, the electrical device 1000 of the present invention includes a filler 300 formed in the internal space in which the PCB module 200 is housed, and includes the following features to solve the above-mentioned problems.

[0065] The filler 300 can be formed by filling the internal space of the housing 100 with a resin material made of insulating resin material and then curing it. This resin material may include silicon as the main raw material, and may also include silane-treated aluminum hydroxide or quartz. The function of the filler 300 is to insulate between components mounted on the PCB module 200, securely fix the PCB module 200 to the housing 100, and dissipate heat from the components mounted on the PCB module 200 through thermal conduction via close contact with both the PCB module 200 and the housing 100, thereby cooling the components. In particular, the filler 300 can be configured to receive heat from the components mounted on the PCB module 200 through close contact with the PCB module 200, and to dissipate the received heat through the housing 100 via close contact with the inner surface of the housing 100.

[0066] Meanwhile, the electrical device 1000 of the present invention includes a configuration to prevent low-temperature burns to the user by minimizing the heat generated to the outside of the housing 100 while ensuring the cooling performance of the PCB module 200.

[0067] PCB module 200 may include: a first region A1, in which a first component group 210 is disposed, the first component group 210 including components with relatively high heat generation; and a second region A2, in which a second component group 220 is disposed, the second component group 220 including components with relatively low heat generation. The first component group 210 may include, for example, a transformer or a semiconductor switch, and the second component group 220 may include capacitors.

[0068] At this time, the filler 300 is filled in the internal space of the housing 100, and the area of ​​the filler 300 in contact with the first region A1 of the PCB module 200 may be larger than the area in contact with the second region A2. Therefore, by improving the heat dissipation efficiency of the first component group 210 disposed in the first region A1 and reducing the heat dissipation efficiency of the second component group 220, the heat generated by the second component group 220 is relatively lower than that of the first component group 210. Through the filler 300, the heat generated from the second component group 220 can be suppressed from being dissipated through the housing 100. In addition, the maximum permissible temperature of the second component group 220 can be configured to be higher than the maximum permissible temperature of the first component group 210. Therefore, the second component group 220 is configured to ensure durability during heat generation, even if heat is not radiated through the filler 300.

[0069] As a specific example, the filler 300 can be configured to contact at least a portion of the first region A1 and not contact the second region A2. Furthermore, the filler 300 can preferably contact 10% or more and 100% or less of the area of ​​the first region A1, more preferably 20% or more and 90% or less. This is because if the contact area with the first region A1 is too narrow, the heat dissipation performance of the PCB module 200 may deteriorate, while if the contact area is too wide, the external heat suppression effect of the housing 100 will deteriorate. Furthermore, the first region A1 is configured on the lower side of the housing 100 where it does not contact the user's hand, and the second region A2 is configured on the upper side of the housing 100 where it contacts the user's hand. This prevents the gripping portion of the housing 100 from being burned by the user due to low-temperature heat radiation generated by the filler 300. Additionally, the filler 300 is configured such that the contact area with the inner surface of the housing 100 is 30% or more and 90% or less of the total area of ​​the housing 100. Therefore, the filler 300 can be configured to minimize heat generation from the gripping portion, which is primarily contacted by the user's hand rather than the exterior of the housing 100, while maintaining the heat dissipation performance of the PCB module 200. Furthermore, the filler 300 can be configured to include an adhesive component and can contact one surface (positive Y-axis direction) or the other surface (negative Y-axis direction) or both surfaces of the first region A1 of the PCB module 200. This is to prevent gaps or spaces that may appear when the PCB module 200 and the filler 300 are separated from each other due to the expansion of the PCB module 200 during heating and its contraction during cooling. Additionally, the heaviest component in the first component group 210 can be heavier than the heaviest component in the second component group 220. This is to make the weight of the first region A1 greater than the weight of the second region A2, so that it can withstand a relatively high impact from the lower side of the electrical equipment onto the ground during a drop test.

[0070] Meanwhile, the filler 300 or the electrical equipment 1000 using the filler 300 may have one or more physical characteristics described later. Each physical characteristic described below is independent, and one physical characteristic does not take precedence over another; the filler 300 may satisfy at least one, two, or more of the physical characteristics described below.

[0071] As an example, filler 300 may be formed of a thermally conductive resin and may have a thermal conductivity of about 0.5 W / mK or higher, about 1.0 W / mK or higher, about 1.5 W / mK or higher, about 2 W / mK or higher, 3 W / mK or higher, or 4 W / mK or higher. Furthermore, thermal conductivity may be 50 W / mK or lower, 45 W / mK or lower, 40 W / mK or lower, 35 W / mK or lower, 30 W / mK or lower, 25 W / mK or lower, 20 W / mK or lower, 15 W / mK or lower, 10 W / mK or lower, 5 W / mK or lower, 4.5 W / mK or lower, or about 4.0 W / mK or lower. The thermal conductivity of filler 300 is a value measured according to, for example, ASTM D5470 or ISO 22007-2 standards. There are no particular limitations on the method used to set the thermal conductivity of filler 300 within the above ranges. As an example, the thermal conductivity of filler 300 can be adjusted by the type of resin used in filler 300 and / or the filler used. For example, among resin components commonly used as adhesives, acrylic resins, polyurethane resins, and silicone resins have similar thermal conductivity; epoxy resins are known to have superior thermal conductivity compared to the aforementioned resins; and olefin resins are known to have higher thermal conductivity than epoxy resins. Therefore, if necessary, a resin with excellent thermal conductivity can be selected from these resins. However, in general, it is difficult to guarantee the desired thermal conductivity using only resin components; as described later, a method can also be adopted to include filler components with excellent thermal conductivity in an appropriate proportion in filler 300.

[0072] Filler 300 can be an electrically insulating filler. In the above structure, because the filler exhibits electrical insulating properties, the performance of the PCB module can be maintained, and its stability can be guaranteed. The insulation breakdown voltage of the electrically insulating filler, measured according to ASTM D149 standard, can be approximately 3 kV / mm or higher, approximately 5 kV / mm or higher, approximately 7 kV / mm or higher, 10 kV / mm or higher, 15 kV / mm or higher, or 20 kV / mm or higher. As the insulation breakdown voltage value increases, the filler exhibits excellent insulation performance. There is no particular limitation on the insulation breakdown voltage value, but considering the composition of the filler, it can be approximately 50 kV / mm or lower, 45 kV / mm or lower, 40 kV / mm or lower, 35 kV / mm or lower, or 30 kV / mm or lower. The above-mentioned insulation breakdown voltage can also be controlled by adjusting the insulating properties of the resin composition of the filler. For example, the insulation breakdown voltage can be adjusted by applying insulating filler to the filler. Generally speaking, in thermally conductive fillers, the ceramic filler described later is considered to be the component that can guarantee insulation performance.

[0073] Considering the effective fixation of the PCB module 200, and its impact and vibration resistance during module use, the filler 300 can have appropriate adhesive strength. In one example, the adhesive strength of the filler can be approximately 1000 gf / 10 mm or less, approximately 950 gf / 10 mm or less, approximately 900 gf / 10 mm or less, approximately 850 gf / 10 mm or less, approximately 800 gf / 10 mm or less, approximately 750 gf / 10 mm or less, approximately 700 gf / 10 mm or less, approximately 650 gf / 10 mm or less, or approximately 600 gf / 10 mm or less. In another example, the adhesive strength of the filler 300 can be 50 gf / 10 mm or more, approximately 60 gf / 10 mm or more, approximately 70 gf / 10 mm or more, or approximately 80 gf / 10 mm or more. The adhesion force can be a value measured by a peel speed of approximately 300 mm / min and a peel angle of 180 degrees. Furthermore, the adhesion force can be the adhesion force of the housing 100 in contact with the filler. This adhesion force can be ensured, for example, by configuring the filler 300 with an adhesive layer. That is, the adhesion forces exhibited by known adhesive materials are well-known, and materials can be selected taking this adhesion force into account.

[0074] The specific gravity of filler 300 is 5 or less. In another example, the specific gravity could be 4.5 or less, 4 or less, 3.5 or less, or 3 or less. Fillers with such a range of specific gravities are advantageous for manufacturing lighter electrical equipment 1000. The lower the specific gravity, the easier it is to reduce the weight of the module. Therefore, there is no particular limitation on the lower limit of the specific gravity. For example, the specific gravity could be approximately 1.5 or more, or 2 or more. The components added to the filler can be adjusted so that the filler exhibits a specific gravity within the range described above. For example, methods can be used to ensure the required thermal conductivity even at the lowest possible specific gravity when adding thermally conductive fillers, i.e., fillers with low specific gravity themselves, or fillers with surface treatments.

[0075] It is also advantageous for filler 300 to exhibit appropriate hardness. For example, if the filler is too hard, it may become too brittle, which could adversely affect reliability. Furthermore, by adjusting the hardness of the filler, impact and vibration resistance can be ensured, as well as product durability. For example, fillers can have hardnesses below 100, 99 or less, 98 or less, 95 or less, or 93 or less in Shore A, and below 80, about 70 or less, about 65 or less, or about 60 or less in Shore D. There is no particular limitation on the lower limit of hardness. For example, the hardness of Shore A can be 60 or more, or the hardness of Shore D can be 5 or more, or about 10 or more. The hardness of fillers is generally affected by the type or proportion of filler included in the filler; when an excessive amount of filler is included, the hardness usually increases. However, since silicone resins generally exhibit lower hardness than other resins such as epoxy or polyurethane, the resin composition included in the filler also affects the hardness.

[0076] The filler 300 can have a 5% weight loss temperature of 400°C or higher in thermogravimetric analysis (TGA), or a residual amount of 70% or more by weight at 800°C. Due to these characteristics, the stability of the PCB module 200 at high temperatures can be further improved. In another example, the residual amount at 800°C can be approximately 75% or more by weight, approximately 80% or more by weight, approximately 85% or more by weight, or approximately 90% or more by weight. In another example, the residual amount at 800°C can be approximately 99% or less by weight. Thermogravimetric analysis (TGA) can be performed in the range of 25°C to 800°C at a depth of 60 cm⁻¹. 3 Measurements were taken in a nitrogen (N2) atmosphere at a heating rate of 20 °C / min. Thermogravimetric analysis (TGA) results can also be obtained by adjusting the composition of the filler. For example, the residue at 800 °C is generally affected by the type or proportion of filler; when an excessive amount of filler is included, the residue will increase. However, because silicone-based resins generally have higher heat resistance than other resins (such as epoxy or polyurethane), the residue will be higher, and the resin composition included in the filler also affects its hardness.

[0077] The type of filler 300 is not particularly limited, provided it can effectively fix the PCB module 200 and impart the aforementioned physical properties as needed; all known curable resin materials can be used. Examples of usable materials include acrylic resins, epoxy resins, polyurethane resins, olefin resins, polyurethane resins, ethylene-vinyl acetate (EVA) resins, or silicone resins. Therefore, the filler can include the aforementioned resins. The filler can include the resin that is the main component of the resin composition. That is, in the total resin composition included in the filler, acrylic resins, epoxy resins, polyurethane resins, olefin resins, polyurethane resins, ethylene-vinyl acetate (EVA) resins, or silicone resins, by weight, can include about 70% or more, about 75% or more, about 80% or more, about 85% or more, or about 90% or more. This proportion can be about 99% or less, or about 95% or less.

[0078] The filler 300 may include fillers considering the aforementioned thermal conductivity, insulation, heat resistance (TGA analysis), or specific gravity. Thermal conductivity within the aforementioned range can be ensured by using a suitable filler. In one example, the filler may be a thermally conductive filler. In this application, the term thermally conductive filler refers to a material having a thermal conductivity of about 1 W / mK or higher, about 5 W / mK or higher, about 10 W / mK or higher, or about 15 W / mK or higher. The thermal conductivity of the thermally conductive filler may be about 400 W / mK or less, about 350 W / mK or less, or about 300 W / mK or less. There are no particular limitations on the type of thermally conductive filler that can be used, but ceramic fillers may be applied considering factors such as insulation performance. For example, ceramic particles such as alumina, aluminum nitride (AlN), boron nitride (BN), silicon nitride, SiC, ZnO, or BeO may be used. Furthermore, carbon fillers such as graphite may also be considered, provided that the insulation performance of the filler can be guaranteed. There are no particular limitations on the form or proportion of fillers included, and they can be selected taking into account the viscosity of the resin composition, the possibility of precipitation in the filler, the required thermal resistance or thermal conductivity, insulation, filling effect, or dispersibility. Generally, as the filler size increases, the viscosity of the resin composition increases, and the possibility of filler precipitation in the filler increases. Furthermore, as the filler size decreases, the thermal resistance tends to increase. Therefore, considering these points, an appropriate type of filler can be selected, and two or more types of fillers can be used if necessary. In addition, considering the filler loading, spherical fillers are advantageous, but needle-shaped or plate-shaped fillers can also be used considering the formation or conductivity of the network [Zhou Yujie 1]. In one example, the filler may include a thermally conductive filler with an average particle diameter between 0.001 μm and 80 μm. In another example, the average particle diameter of the filler may be 0.01 μm or more, 0.1 μm or more, 0.5 μm or more, 1 μm or more, 2 μm or more, 3 μm or more, 4 μm or more, 5 μm or more, or approximately 6 μm or more. In another example, the average particle diameter of the filler may be approximately 75 μm or less, approximately 70 μm or less, approximately 65 μm or less, approximately 60 μm or less, approximately 55 μm or less, approximately 50 μm or less, approximately 45 μm or less, approximately 40 μm or less, approximately 35 μm or less, approximately 30 μm or less, approximately 25 μm or less, approximately 20 μm or less, approximately 15 μm or less, approximately 10 μm or less, or approximately 5 μm or less.

[0079] Taking into account the characteristics of the filler, the ratio of filler included in filler 300 can be selected to ensure the aforementioned characteristics, such as thermal conductivity and insulation properties. For example, the filler may be included in the range of about 50 to 2000 parts by weight of 100 parts by weight based on the resin composition of the filler. In another example, the weight portion of the filler may be about 100 parts by weight or more, about 150 parts by weight or more, about 200 parts by weight or more, about 250 parts by weight or more, about 300 parts by weight or more, about 350 parts by weight or more, about 400 parts by weight or more, about 500 parts by weight or more, about 550 parts by weight or more, about 600 parts by weight or more, or about 650 parts by weight or more.

[0080] The filler 300 may further include a viscosity modifier to adjust the viscosity as necessary, for example, to increase or decrease the viscosity or to adjust the viscosity according to shear force, such as a thixotropic agent, diluent, dispersant, surface treatment agent or coupling agent.

[0081] Thixotropic agents can effectively perform the manufacturing process of electrical equipment by adjusting the viscosity according to the shear force of the resin composition. Examples of usable thixotropic agents include fumed silica.

[0082] Diluents or dispersants are commonly used to reduce the viscosity of resin compositions, and any of the various types known in the art can be used without limitation, as long as they can exhibit the aforementioned effects.

[0083] Surface treatment agents are used to treat the introduced fillers, and any of the various types known in the art can be used without limitation, as long as they can exhibit the aforementioned effects.

[0084] Coupling agents can be used, for example, to improve the dispersibility of thermally conductive fillers such as alumina, and any of the various types known in the art can be used without limitation, as long as they can exhibit the aforementioned effects.

[0085] -Second Embodiment

[0086] Figure 3 A cross-sectional schematic diagram of an electrical device 1000 according to a second embodiment of the present invention is shown.

[0087] As shown in the figure, the electrical equipment 1000 includes a housing 100, a PCB module, filler 300, and terminal pins 500. The PCB module 200 includes: a first region A1 (see...) Figure 2 The first component group 210 is provided in this area; and the second area A2 (see Figure 2A second component group 220 is provided in this area. Since the electrical device 1000 according to this embodiment has a similar configuration and coupling structure to the electrical device 1000 of the first embodiment described above, only the differences will be described in detail below.

[0088] According to this embodiment, the PCB module 200 may have one or more through holes 250, which penetrate from one surface (hereinafter referred to as one surface) of the PCB module 200 in the thickness direction to another surface (hereinafter referred to as another surface) in the thickness direction, so as to allow the resin material of the filler 300 to flow. The resin material injected into the housing 100 through the through hole 250 can quickly and uniformly fill one surface and the other surface of the PCB module 200. The through hole 250 may be formed at a position corresponding to the formation of the filler 300, preferably in the first region A1 of the PCB module 200. More preferably, the through hole 250 may be formed at a position lower than the first component group 210 disposed in the first region A1. Due to the first component group 210, when the injection of the resin material is delayed or a space is formed under the first component group 210, the resin material introduced to the side opposite to the side where the first component group 210 is mounted can be introduced to the lower part of the side where the first component group 210 is mounted through the through hole 250.

[0089] -Third and Fourth Embodiments

[0090] Figure 4 A cross-sectional schematic diagram of an electrical device 1000 according to a third embodiment of the present invention is shown, and Figure 5 A cross-sectional schematic diagram of an electrical device 1000 according to a fourth embodiment of the present invention is shown.

[0091] As shown in the figure, the electrical equipment 1000 includes a housing 100, a PCB module, filler 300, and terminal pins 500. The PCB module 200 includes: a first region A1 (see...) Figure 2 The first component group 210 is provided in this area; and the second area A2 (see Figure 2 A second element group 220 is provided in this area. Since the electrical device 1000 according to this embodiment has a similar configuration and connection structure to the electrical device 1000 of the first embodiment described above, only the differences will be described in detail below.

[0092] The electrical device 1000 according to this embodiment may further include a heat transfer reinforcement 400 to more effectively dissipate heat transferred from the filler 300 from the PCB module 200. The heat transfer reinforcement 400 may be, for example, a panel or thermal pad made of a metal material. The heat transfer reinforcement 400 may be disposed between the inner surface of the housing 100 and the filler 300, such as... Figure 4The third embodiment shown, and as Figure 5 In the fourth embodiment shown, the housing 100 may have an outer shell 110 and an inner shell 120, and a heat transfer reinforcement 400 may be disposed between the outer shell 110 and the inner shell 120. The heat transfer reinforcement 400 may be configured to reduce the external temperature of the housing by dissipating heat from the filler 300 to radiate heat, while suppressing heat transfer to the outside of the housing 100 or the outer shell 110.

[0093] When the filler 300 contacts 10-50% of the first region A1, a heat transfer reinforcement 400 is provided to further maximize the heat dissipation effect.

[0094] - Fifth Embodiment

[0095] Figure 6 This is a cross-sectional schematic diagram of the electrical equipment 1000 according to the fifth embodiment of the present invention.

[0096] As shown in the figure, the electrical equipment 1000 includes a housing 100, a PCB module, filler 300, and terminal pins 500. The PCB module 200 includes: a first region A1 (see...) Figure 2 The first component group 210 is provided in this area; and the second area A2 (see Figure 2 A second element group 220 is provided in this area. Since the electrical device 1000 according to this embodiment has a similar configuration and connection structure to the electrical device 1000 of the first embodiment described above, only the differences will be described in detail below.

[0097] The filler 300 further includes a coating region 350 in which resin material is applied to the inner surface of the housing 100 or PCB module 200 at a predetermined thickness. The coating region 350 can be formed on an upper side higher than the filler height of the filler 300, minimizing heat transfer to the outside of the housing 100 or lowering the heat dissipation temperature by dispersing and dissipating heat from the filler 300 through the coating region 350. One advantage is simplified manufacturing process and reduced manufacturing costs, while achieving the same effects as the heat transfer reinforcement 400 in the third and fourth embodiments described above through the coating region 350.

[0098] Hereinafter, a method for manufacturing the electrical device of the present invention configured as described above will be described with reference to the accompanying drawings.

[0099] Figure 7 A cross-sectional schematic diagram illustrating a method for manufacturing an electrical device according to a first embodiment of the present invention is shown.

[0100] First, such as Figure 7As shown in Figure A, the step of accommodating a PCB module 200 within a body 110 of a housing 100 having an open upper portion and forming an internal space is performed. The PCB module 200 is divided into a first region where a first component group 210 is mounted, and a second region where a second component group 220 is mounted. The PCB module can be accommodated such that the first region is located at the lower side. Furthermore, when the PCB module 200 is accommodated, the lower end of the PCB module 200 can be electrically connected to a terminal pin 500.

[0101] Next, as Figure 7 As shown in Figure B, the step of forming filler 300 by injecting resin material into the body 110 containing PCB module 200 is performed. Filler 300 can be formed to contact the first region but not the second region, and specific implementations can follow the above embodiments.

[0102] Next, as Figure 7 As shown in Figure C, the step of forming a coating region 350 on the upper side, higher than the filling height of the filler 300, by recovering a portion of the resin material is performed. At this time, if the resin material is injected and immediately recovered, the thickness of the coating region 350 may be too thin, or the coating region 350 may not be formed. Therefore, it is preferable to recover the resin material after a certain period of time, but before the resin material cures. After the coating region 350 is formed, the cover 150 is attached to the upper opening of the body 110 to seal the internal space of the body 110.

[0103] Figure 8 This is a cross-sectional schematic diagram illustrating a method for manufacturing an electrical device according to a second embodiment of the present invention.

[0104] First, such as Figure 8 As shown in Figure A, the step of forming filler 300 is performed by injecting resin material into the body 110 of the housing 100, which has an open upper portion and forms an internal space.

[0105] Next, as Figure 8 As shown in Figure B, the step of accommodating the PCB module 200 within the body 110 having the filler 300 is performed. The PCB module 200 is divided into: a first region where a first component group 210 is mounted; and a second region where a second component group 220 is mounted, and the PCB module can be accommodated such that the first region is located on the lower side. Furthermore, when the PCB module 200 is accommodated, the lower end of the PCB module 200 can be electrically connected to the terminal pin 500. At this time, the filler 300 can be configured to contact the first region but not the second region, and specific implementations can follow the above embodiments.

[0106] Next, as Figure 8As shown in Figure C, the step of forming a coating region 350 on the upper side, higher than the filling height of the filler 300, is performed by recovering a portion of the resin material. At this time, if the resin material is injected and immediately recovered, the thickness of the coating region 350 may be too thin, or the coating region 350 may not be formed. Therefore, it is preferable to recover the resin material after a certain period of time, but before the resin material has completely cured. After the coating region 350 is formed, the cover 150 is attached to the upper opening of the body 110 to seal the internal space of the body 110.

[0107] Figure 9 and Figure 10 A cross-sectional schematic diagram of a method for manufacturing an electrical device according to a third embodiment of the present invention is shown.

[0108] First, such as Figure 9 As shown in Figure A, the step of accommodating a PCB module 200 within a body 110 of a housing 100 having an open upper portion and forming an internal space is performed. The PCB module 200 is divided into a first region where a first component group 210 is mounted, and a second region where a second component group 220 is mounted. The PCB module can be accommodated such that the first region is located at the lower side. Furthermore, when the PCB module 200 is accommodated, the lower end of the PCB module 200 can be electrically connected to a terminal pin 500.

[0109] Next, as Figure 9 As shown in Figure B, the step of forming filler 300 by injecting resin material into the body 110 housing the PCB module 200 is performed. Filler 300 can be formed to contact the first region but not the second region, and specific embodiments can follow the embodiments described above.

[0110] In this embodiment, a configuration is described in which the PCB module 200 is pre-accommodated in the housing 100 and then filled with resin material. However, as in the second embodiment described above, the housing 100 may be pre-filled with resin material and then may accommodate the PCB module 200.

[0111] Next, as Figure 10 As shown in C and 10D, the step of forming the coating region 350 by tilting the shell 100 filled with resin material to one side or the other in the Y direction is performed, wherein a predetermined thickness is applied to the upper side that is higher than the filling height of the filler 300. At this time, in order to prevent the coating region 350 from being too thin or from not being formed, it is preferable to perform the step of forming the coating region 350 by changing the tilt angle to the original assembly position perpendicular to the bottom surface or the other side after a certain period of time after tilting the shell 100, but before the resin material cures.

[0112] Next, as Figure 10As shown in E, after the coating area 350 is formed, the cover 150 is attached to the upper opening of the body 110 to seal the interior space of the body 110.

[0113] The electrical equipment of the present invention, having the configuration described above, can prevent heat from concentrating on specific components and improve durability by dispersing heat through the filler to prevent damage to the components or shorten their lifespan.

[0114] Furthermore, the heat from the components will eventually radiate away through the housing. Therefore, if the heat transfer efficiency is increased, there is a risk of low-temperature burns or discomfort when the user directly contacts the housing of the electrical equipment due to excessively high temperatures. Therefore, according to the present invention, by forming a filler only in the area not primarily gripped by the user (the upper part of the housing), the thermal shielding performance of the area gripped by the user (the upper part of the housing) is improved, thereby enhancing heat dissipation performance and preventing low-temperature burns to the user.

[0115] Furthermore, since the filler contains adhesive components, the adhesiveness of the filler can be maintained even when the PCB module expands or contracts, thereby improving the heat dissipation efficiency of the PCB module due to heat conduction.

[0116] Furthermore, since the filler only fills a portion of the housing, the weight of the electrical equipment can be reduced.

[0117] Furthermore, while improving heat dissipation efficiency through the coating area of ​​the filler, the weight of electrical equipment can be reduced.

[0118] Furthermore, since the filler supports the PCB module, there is no need to provide a separate support device, which allows the electrical equipment to be lighter and smaller.

[0119] This invention is not limited to the embodiments described above. This invention can be applied to various fields and can be modified by those skilled in the art without departing from the scope of the invention as claimed in the claims. Therefore, these improvements and changes will be readily apparent to those skilled in the art and fall within the scope of this invention.

[0120] 1000: Electrical equipment

[0121] 100: Casing

[0122] 110: Outer shell; 120: Inner shell

[0123] 150: Cover

[0124] 200: PCB module

[0125] 210: First Component Group

[0126] 220: Second component group

[0127] 250: Through hole

[0128] 300: Filler

[0129] 350: Coated area

[0130] 400: Heat transfer reinforcement component

[0131] 500: Terminal pin

[0132] A1: First area A2: Second area

Claims

1. An electrical device, comprising: A housing, the housing including a lower portion and side walls, and forming a space within the housing; A PCB module, which is housed within the interior space of the housing and includes multiple components and a PCB on which the multiple components are mounted; A filler, located within the interior space of the housing, and made of a resin material; and Terminal pins are disposed on the outer surface of the lower part of the housing; The PCB module includes a first region and a second region. The first region includes a first component group, and the second region includes a second component group. The heat generation of the second component group is less than that of the first component group. Compared to the second region, the first region is formed closer to the lower side of the PCB module, and the second region is formed at a position corresponding to the user contact area of ​​the housing; The filler is disposed in the lower part of the housing to cover one surface and another surface of the PCB module that are parallel to and opposite to the sidewall in the first region, and The filler exposes one and another surface of the PCB in the second region of the PCB module.

2. The electrical device of claim 1, wherein the filler does not contact the second region but contacts at least a portion of the first region.

3. The electrical device of claim 2, wherein the filler is in contact with 10% to 100% of the area of ​​the first region.

4. The electrical device of claim 2, wherein the filler is in contact with 20% to 90% of the area of ​​the first region.

5. The electrical equipment according to claim 1, wherein the contact area between the filler and the housing is 30% to 90% of the total area of ​​the housing.

6. The electrical device of claim 1, wherein the filler comprises an adhesive component and contacts two surfaces of the first region of the PCB.

7. The electrical equipment according to claim 1, wherein the maximum permissible temperature of the second component group is higher than the maximum permissible temperature of the first component group.

8. The electrical apparatus of claim 1, wherein the first group of components comprises at least one of a transformer and a semiconductor switch, and the second group of components comprises a capacitor.

9. The electrical device according to claim 1, wherein at least a portion of the first element group that is not in direct contact with the filler is provided with a heat transfer reinforcement between itself and the filler.

10. The electrical equipment according to claim 9, wherein the heat transfer reinforcement is a metallic material or a thermal pad.

11. The electrical device according to claim 1, wherein the thermal conductivity of the filler is greater than or equal to 0.6 W / mk.

12. The electrical device according to claim 1, wherein the adhesive force of the filler is from 50 gf / 10 mm to 1000 gf / 10 mm.

13. The electrical equipment according to claim 1, wherein the specific gravity of the filler is less than or equal to 3.

14. The electrical equipment according to claim 1, wherein the filler comprises acrylic resin, epoxy resin, polyurethane resin, olefin resin, EVA resin or silicone resin.

15. The electrical device of claim 1, wherein the filler further comprises a coating area on the housing or the PCB module having a resin material of a predetermined thickness applied.

16. The electrical device of claim 15, wherein the coating region is formed on an upper side higher than the filling height of the filler.

17. The electrical device according to claim 1, wherein the heaviest element in the first group of elements weighs more than the heaviest element in the second group of elements.

18. An electrical device comprising: A housing, the housing including a lower portion and side walls, and forming a space within the housing; A PCB module, which is housed within the interior space of the housing and includes multiple components and a PCB on which the multiple components are mounted; A filler, located within the interior space of the housing, and made of a resin material; and Terminal pins are disposed on the outer surface of the lower part of the housing; The PCB module is disposed in the lower part of the housing and includes a first region and a second region. A first component group is installed in the first region, and a second component group is included in the second region. The heat generation of the second component group is less than that of the first component group. Compared to the second region, the first region is formed closer to the lower side of the PCB module, and the second region is formed at a position corresponding to the user contact area of ​​the housing; The PCB has through holes in the first region, and The filler covers the first area of ​​the PCB module and fills the through-hole.

19. The electrical device of claim 18, wherein the PCB module is housed within the housing along its length. Compared to the first group of components included in the first region, the via is formed closer to the bottom of the PCB module.

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