Device for a vehicle for communicating with a mobile device

Abstract

A device (10) for a vehicle (1) for communicating with a mobile device in order to activate a function of the vehicle (1), in particular in accordance with the communication, has an electrically conductive communication component (61) for transmitting and / or receiving a communication signal by means of which the communication is provided, a processing assembly (65) for receiving the communication signal, at least one connection (RX+, RX-) for electrically connecting the processing assembly (65) to the communication component (61), wherein, in addition to the at least one connection (RX+, RX-), a device (Rd) for resistive attenuation is electrically connected to the communication component (61).

Description

Technical Field

[0001] This invention relates to a vehicle device for communicating with mobile devices. The invention also relates to a door handle and its use. Background Technology

[0002] It is known from existing technology that in a vehicle, a user's activation action can be used to activate the vehicle's functions. Such an activation action could be, for example, placing a hand near a vehicle door handle to unlock and / or lock the vehicle. It is also known that such activation actions can trigger authentication using a mobile device, such as an identification transmitter. Authentication is typically achieved through wireless communication between the vehicle and the mobile device.

[0003] However, in this situation, the following problem often arises: interference can reduce communication reliability. The cause of interference may be electromagnetic radiation (i.e., EMV interference), such as electromagnetic radiation caused by external radio transmitters. Summary of the Invention

[0004] The objective of this invention is to at least partially eliminate the aforementioned disadvantages. In particular, the objective of this invention is to further improve communication reliability and / or further improve the reduction of interference effects.

[0005] Other features and details of the invention are derived from the respective dependent claims, description, and figures. The features and details described herein with respect to the device of the invention are also applicable in relation to the door handle of the invention and its intended use, and vice versa; therefore, the disclosures regarding various aspects of the invention are always cross-referenced or can be cross-referenced.

[0006] This task is accomplished, in particular, by means of a device for a vehicle that communicates with a mobile device, especially for activating vehicle functions based on communication.

[0007] The device according to the invention may have at least one of the following components: -Especially conductive communication components, -Especially electronic processing components, which are used to send and / or receive, in particular, electrical communication signals via the communication component to provide communication by means of the communication signals. - At least one terminal for sending and / or receiving the communication signal, which electrically connects the processing component to the communication component.

[0008] The processing component can perform the transmission and / or reception of communication signals through the communication component. In other words, the processing component can send communication signals to and / or receive communication signals from the communication component. The communication signal can, for example, be output by the processing component via the at least one connection port to be sent to and received from the communication component. The communication signal can also be implemented in the form of an electrical signal, such as voltage or current, with a specific communication frequency. Here, the output of the communication signal can cause an electric field and / or magnetic field to be generated at the communication component. The (received) communication signal can also be influenced and, in particular, modulated by a mobile device used for communication, in order to transmit information such as verification data via communication.

[0009] Alternatively, the processing component may be electrically connected to the communication component via a filter device for transmitting and / or receiving communication signals. The filter device may be disposed, for example, between the at least one terminal and the communication component, particularly integrated into at least one electrical transmission path. Specifically, the circuitry of the filter device can therefore be electrically connected between the processing component and the communication component. Here, the filter device may have at least one high-pass device and at least one low-pass device. The at least one high-pass device and at least one low-pass device may form at least one bandpass filter to at least reduce, i.e., particularly attenuate, frequencies outside the intended frequency range for communication signals in order to improve reception reliability. For example, the low-pass and / or high-pass devices may each have at least one RC element or LC element.

[0010] It can be specified that the filter device has at least one or exactly one RC filter and / or at least one or exactly one LC filter and / or bandpass filter and / or Wien filter. In particular, the filter device can provide a bandpass filter by means of RC filters and / or LC filters, i.e., by a connection of RC filters and / or LC filters. In other words, the filter device can be designed as a bandpass filter, preferably an RC filter and / or an LC filter, and most preferably a Wien filter. For example, the filter device can have at least one high-pass device (especially a first-order LC filter or RC filter) and at least one low-pass device (especially in the form of a first-order LC filter or RC filter). The high-pass and low-pass devices can be combined in pairs to form a bandpass filter, especially a second-order LC filter and / or RC filter. The bandpass filter, especially the Wien filter, can be arranged symmetrically in the filter device. In this case, the RC element specifically refers to a circuit with an ohmic resistor (R) and a capacitor (C). Correspondingly, the LC element refers to a circuit with a coil or inductor and a capacitor. Accordingly, the LC filter has at least one LC element, and the RC filter has at least one RC element.

[0011] The frequency range to be used for communication signals and / or communication may have at least one communication frequency and is hereinafter also referred to as the communication frequency range. For example, 13.56 MHz may be specified as the communication frequency for near-field communication.

[0012] According to the invention, in particular, a device for resistance attenuation, especially an attenuation resistor, is electrically connected to the communication component, except for at least one terminal. This has the advantage that interfering oscillations in the communication component can be attenuated by the device. Resistance attenuation here can refer to attenuation achieved by a device in the form of an attenuating element, and therefore especially to attenuation of the signal amplitude, which differs in frequency from at least one communication frequency prescribed for the communication signal. In this case, resistance attenuation can therefore mean that the attenuation is caused by the resistance of the device.

[0013] It is also possible that the communication component is designed as an antenna for near-field communication, preferably an NFC loop antenna, thus enabling the communication in the form of near-field communication. This has the advantage of allowing secure and reliable communication in the vicinity of the device. For example, the communication can be used for the exchange of authentication information between a mobile device and a vehicle safety system, particularly to determine whether the mobile device is authorized to trigger vehicle functions by having the vehicle check the authentication information (authentication). This near-field communication ensures that communication can only occur within a maximum distance from the vehicle.

[0014] Therefore, this communication component is advantageously suited for providing or performing near-field communication such as NFC (Near Field Communication) or RFID (Radio Frequency Identification). The communication device is designed, for example, as an antenna, particularly an NFC antenna, which can be at least partially disposed on some or all layers of the circuit board of the device of the present invention. The communication component portions on different layers can be electrically connected to each other via via contacts to provide a loop (e.g., an NFC loop) across multiple layers. Thus, this communication component allows the device of the present invention to provide communication functionality. The communication component can be implemented in the form of printed wires and can extend particularly at the outer edge of the circuit board or layer.

[0015] Further advantages can be obtained within the scope of this invention if the communication component is designed with a fundamentally symmetrical geometry, particularly a ring shape. Geometric symmetry results in reduced communication interference, especially by reducing localized oscillations on the communication component. Of course, in this case, there is no need to worry about slight deviations from exact symmetry for a symmetrical design, where such deviations are unavoidable, for example, possibly stemming from manufacturing conditions and / or the arrangement on different layers and / or the arrangement of other components on the circuit board.

[0016] Within the scope of this invention, it can be specified that the device for resistance attenuation has an electrical connection to the communication component at a connection point, wherein the connection point is located on the axis of symmetry of the communication component. As previously described, the communication component can be symmetrically designed. Therefore, an axis of symmetry is proposed. Symmetry can be achieved, for example, in an axially symmetrical form, so that the communication component is geometrically self-mapping by reflection along a vertical axis on its axis of symmetry. Here, a virtual ground can be located, in particular, at the connection point on the axis of symmetry. The connection at the connection point has the advantage that it reliably provides resistance attenuation and thus reduces communication interference. Of course, there is no need to worry about slight connection deviations from this connection point.

[0017] Optionally, the means for providing resistive attenuation may be specified to have a resistor, in particular as an attenuation element, to attenuate signals of the communication component whose frequencies differ from at least one communication frequency, wherein the at least one communication frequency may be specified for the communication signal and particularly includes 13.56 MHz. This at least one communication frequency may here define a communication frequency range. The communication frequency range may also be located within the passband of the bandpass filter of the filter device used in the apparatus of the present invention. Attenuation of signals with frequencies outside the communication frequency range can mitigate the effects of interference radiation on the communication component. The resistor may be designed as a low-ohm resistor, for example, in the range of 50-100 ohms. Functionally, the resistive attenuation by means of this resistor can also attenuate interference oscillations caused when the location of the virtual ground on the communication component changes decisively due to the incident interference radiation.

[0018] Here, in principle, the parasitic oscillating circuit of a communication component is excited by interfering incident radiation, particularly interfering radiation, such as electromagnetic fields in the sense of EMC (electromagnetic compatibility) radiation. Therefore, oscillations, i.e., interference signals, will appear in the communication component, containing harmonic and non-harmonic oscillations at the communication frequency of the communication signal, thus interfering with communication. In this case, the harmonic oscillations can be oscillations whose frequency is an integer multiple of the communication frequency. It is also conceivable that non-harmonic oscillations can be attenuated by filter devices, but harmonic oscillations cannot be attenuated or are only insufficiently attenuated. Therefore, the processing component may also be susceptible to harmonic oscillation interference. Therefore, the use of devices for resistive attenuation, particularly in the form of attenuating resistors, is advantageous for further attenuating harmonic oscillations.

[0019] It is also conceivable that the device for resistive attenuation has an electrical connection to the communication component at the connection point, wherein the connection point is designed to be the center point of the communication component, preferably located substantially at half the length and / or the center of its geometry. This has the advantage that a dummy ground point can be provided at this location, where no attenuation occurs at the communication frequency by means of the device, but attenuation occurs at frequencies different from it. Instead of a dummy ground, a real ground can be provided at the connection point by the device to specifically guide away interference signals from the communication component.

[0020] It is also possible that the device for resistive attenuation has an electrical connection to the communication component at the connection point, wherein the connection point is essentially located at a virtual grounding point of the communication component. The virtual grounding can be defined such that, ideally (i.e., in the case of an ideal antenna and / or absolutely no interfering signals and / or no interfering transmissions and / or no signals outside the communication frequency at the communication component), no current flows during transmission and / or reception. Therefore, in non-ideal operating conditions, interfering signals can thus be attenuated by this device. Here, instead of a virtual grounding, a real grounding can be provided by the device at the connection point to specifically divert interfering signals from the communication component.

[0021] For example, a device for resistance attenuation can be specified to connect the communication component, in particular, directly to electrical ground, to attenuate the parasitic oscillation loop of the communication component. This can improve communication reliability.

[0022] Within the scope of this invention, it is also conceivable that the device for resistance attenuation may be constructed in the form of a resistor, particularly an ohmic resistor. Here, the resistor can also be placed as the sole electrical element between the connection point and ground on the communication component to achieve a technically simple structure.

[0023] It is also conceivable that the device for resistance attenuation is integrated as the sole component into the current path between the communication component and the electrical ground, and therefore preferably connected in series to the connection point on the communication component and the ground.

[0024] It is also conceivable that the device for resistive attenuation is electrically connected at a location on the communication component such that electrical signals on the communication component that deviate from the frequency range of the communication signal in terms of their frequency are attenuated and / or led to electrical ground by the device. These electrical signals can be understood here as interference signals because they are distinct from the communication signal. For example, the positioning (i.e., the connection point) on the communication component is performed by changing the position of the device while simultaneously measuring the interference signal. Here, the connection point can be selected at the minimum of the interference signal measurement variation curve. The interference signal can be generated, for example, by an external radio transmitter that emits radio signals, for example, within the desired interference range (e.g., at 2, 3, or 4 times the communication frequency).

[0025] It can also be specified that the processing component is designed to perform sending and / or receiving to provide communication in the form of near-field communication, and preferably has NFC receiver electronics to evaluate the communication signal for reception, wherein the communication frequency of the received communication signal is preferably different from the frequency of at least one parasitic oscillation loop of the communication component. Therefore, the means for resistance attenuation can be designed to precisely reduce the frequency of the parasitic oscillation loop. The parasitic oscillation loop can here be determined by the antenna design and therefore cannot be avoided from the outset. The NFC receiver electronics can have at least one integrated circuit and / or microcontroller and / or processor. Here, the NFC receiver electronics can also be designed as a single component, which is also provided, for example, in the form of an NFC driver module.

[0026] Furthermore, it is advantageous that the at least one terminal has at least two or exactly two terminals for receiving communication signals. Here, the processing component can be designed to perform reception and, in particular, transmission symmetrically, such that the received communication signals are preferably symmetrically present on the at least two or exactly two terminals. The terminals can be implemented as terminals of the processing component and thus serve as input terminals for communication signals. It is particularly advantageous that the NFC receiver electronics are suitable for symmetrical control of the communication components. Symmetrical control can refer to the symmetrical reception and / or symmetrical transmission of communication signals, especially accompanied by the symmetrical transmission of communication signals to the terminals of the processing component. Therefore, interference can be further reduced.

[0027] Advantageously, the invention can specify the provision of a multi-layer circuit board, wherein the communication component is arranged on multiple layers of the circuit board and extends through all layers, particularly (substantially) spaced at a certain distance from at least one grounding element and / or sensor element and / or shielding element. In this way, communication with external mobile devices can be provided, and in particular, the magnetic coupling (especially to ground) is kept constant by maintaining a constant distance. Interference can therefore be further reduced. Here, the grounding element can be a conductive surface or printed conductor extending on at least one layer or exactly one layer, and preferably has electrical grounding (i.e., ground potential). The constant distance to the grounding element can here represent the lateral distance of the communication component from the outer edge of the grounding element.

[0028] Furthermore, the communication component can be designed to perform verification via communication upon being triggered by the detection of an activation action within the sensor's detection area, and preferably to activate vehicle functions, particularly unlocking and / or locking, based on the verification. For this purpose, the communication component, along with the sensor and / or shielding and / or grounding components, can be electrically connected to the same processing device as the apparatus of the present invention.

[0029] It may also be advantageous within the scope of this invention that the device is designed as a sensor and communication device to detect activation in at least one detection area in addition to providing communication. Preferably, at least one conductive sensor element is provided for capacitance detection within this detection area, wherein the sensor element can be electrically connected to a processing device so that the processing device can detect activation based on the detection. For this purpose, the processing device evaluates, for example, the capacitance change provided by the sensor element based on charge migration.

[0030] Alternatively, the (electronic) processing device may be arranged on a circuit board and electrically connected to the sensor for charge migration, in order to evaluate the variable capacitance, particularly based on charge migration, and thereby control capacitance detection. In other words, capacitance detection and / or probing can be performed such that the variable capacitance is determined by the processing device. The variable capacitance is provided, in particular, by the sensor and is specific to changes within the detection area. Therefore, such capacitance detection can lead to the detection of activation actions. It is also possible that the processing device is connected to at least one other (second) sensor of the device of the invention, so that charge migration is also performed and evaluated here for capacitance detection. The processing device can also, for example, control the shielding via charge migration.

[0031] To provide detection in a compact and space-saving design using the device according to the invention, the device can have a multi-layered circuit board on which at least one, particularly conductive, sensor element is provided for capacitance detection within the detection area. This sensor element can be suited for capacitance detection such that it can (through appropriate electrical control) provide an electric field, and / or it provides an environment-dependent variable capacitance relative to the vehicle's surrounding environment and / or in conjunction with the vehicle's electrical ground or mating electrodes. The electrical control of the sensor element can be performed by the processing means of the device of the invention (e.g., a microcontroller, integrated circuit, etc.), for example, through repeated charge migration. It can also be specified that detection by means of the sensor element and communication by means of a communication component are performed or controlled in a time-alternating manner.

[0032] By designing the device of the present invention as a sensor and communication device, the device, and particularly its circuit board, can have multiple electronic components for not only detection within at least one detection area but also communication, particularly near-field communication. Thus, the device can provide a compact and individually operable module that can comfortably offer multiple functions, for example, for a door handle. Specifically, the communication can involve radio or wireless communication, thus creating corresponding communication fields (electric and / or magnetic fields). Therefore, the different fields used for sensor detection and communication may interfere with each other, so other measures such as reliable shielding may also be meaningful.

[0033] The device according to the invention can be designed to provide at least one of the following functions: - Detect at least one activation action such as user proximity and / or touch and / or gesture and / or tactile operation. - Communication, preferably radio communication such as near-field communication, especially communication with mobile devices such as ID transmitters and / or smartphones and / or the like, preferably for authentication. - Activate vehicle functions, particularly safety-related vehicle functions, such as unlocking and / or locking, or movement of vehicle moving parts such as covers, based on the detection.

[0034] For example, when the detection result is positive, i.e., proximity and / or touch and / or operation and / or gesture has been detected, vehicle functions can be activated, for example, through the electrical signal output of the device. This mobile device can be designed separately from the vehicle and is suitable, for example, for carrying by a person (e.g., in a pocket).

[0035] The detection of the activation action can also be used to activate the vehicle's (first) function based on the detection. It can also be specified to detect at least one second activation action to activate at least one (second or additional) function of the vehicle, wherein these functions are different from each other.

[0036] The vehicle's activatable (first and / or at least second) function is, for example, at least one of the following: - Lock the vehicle. -Vehicle unlocked - The initiation of the opening and / or closing movement of moving parts of the vehicle, particularly the front, rear, or side covers (e.g., side doors or trunk lid), wherein the movement is preferably performed by motorization. -Activation of vehicle lighting devices - Startup verified via vehicle communication. - Initiation of communication using communication components.

[0037] The first and at least the second functions can also be different functions among those described above. Thus, for example, it is possible that the detection of the first activation action triggers the activation of a different vehicle function than the detection of the second activation action. For example, "detecting proximity to the first outer side of the door handle" might trigger locking, while "detecting proximity to the second outer side of the door handle" might trigger unlocking. The second outer side could be facing the door handle slot, while the first outer side could be facing away from the door handle slot (or vice versa). This allows the vehicle user to conveniently and easily operate the functions.

[0038] It is also possible that communication via communication components is triggered by detecting the activation action before the vehicle function is activated. Then, the activation of the function may also depend on communication, for example, based on successful verification via communication.

[0039] The at least one sensor may further include at least two sensors, each designed to perform capacitance detection in its own detection region. Therefore, a second sensor or other sensors may be provided in addition to the first sensor. For example, each sensor may be designed as a sensor electrode. Here, the sensors may be designed to perform capacitance detection in different detection regions, which may also be of different sizes. The first sensor may perform detection, for example, in a first detection region on a first outer side, and the second sensor may perform detection in a second detection region on a second outer side of the door handle. Accordingly, different sensors may also be designed to detect different activation actions to activate different functions.

[0040] Within the scope of this invention, it is also conceivable to provide at least two shielding elements for shielding capacitive detection of at least one sensor element, wherein the shielding elements may be arranged on different layers of the circuit board of the device according to the invention, wherein one of the shielding elements on the first layer preferably surrounds the sensor element, particularly mainly or completely surrounding it, in order to provide shielding in different directions. Therefore, to improve detection, at least two shielding elements may be provided for shielding.

[0041] The multi-layer design of the circuit board offers a further advantage: shielding elements can be arranged on multiple layers, thus enabling a three-dimensional arrangement of the shielding elements. Therefore, the shielding can be flexibly adapted to the detection area and structure of the sensor. The specific three-dimensional design of the shielding elements on the circuit board also allows for adjustment of the shielding, i.e., determining different orientations to achieve the desired shielding. Therefore, the shielding can also be produced three-dimensionally through the shielding elements, and, with a particular advantage, is can-shaped. Thus, the shielding can reliably confine capacitance detection to the detection area.

[0042] Furthermore, the shield may be arranged on the circuit board in such a way that its geometry is adjusted, and in particular, the shield is adapted to the detection area of ​​the sensor. For example, the geometry of the shield may at least partially adapt to and / or at least partially correspond to the geometry of the detection area.

[0043] The shielding can be provided for the first sensor element via a shielding element, but may also optionally be provided for at least another sensor element of the device of the invention. If the detection areas of the sensor elements are different, the shielding for each sensor element will also be different. For each of these different shields, its own shielding element can be provided on a circuit board. It is also possible to specify at least one shielding element for generating shielding for more than one sensor element.

[0044] The shielding element on the first layer is also referred to as the first shielding element for easier configuration, wherein a second shielding element on the second layer and / or a third shielding element on the third layer and / or a fourth shielding element on the fourth layer may also be specified.

[0045] The shielding components can be electrically connected across layers, thus forming a unique shielding device. Each shielding component is provided, in particular, in the form of a conductive surface and / or printed wires, and the electrical connections of the shielding components are provided, in particular, in the form of via contacts.

[0046] It can be specified that the sensor element and / or the shielding element and / or the (electrical) grounding element are formed on the circuit board via printed wires and / or conductor surfaces. These elements may, for example, have a thickness in the range of 0.1 mm to 0.9 mm.

[0047] Multilayer circuit boards (so-called "stacked circuit boards") can also offer the benefits of increased packaging density and / or improved generation of electric and / or magnetic fields. Especially when there may be more than one detection area for different sides of the device and / or near-field communication is also provided by the device, the use of multiple layers simplifies the orientation of the fields used for sensor devices and / or shielding and / or communication. These layers of the circuit board can also be referred to as film layers. Multilayer circuit boards can have at least four layers or exactly four layers, which are firmly bonded to each other.

[0048] It can be further advantageously specified that the (electronic) processing device is electrically connected to a shield to operate the shield (or at least one of the shields) to provide active shielding, wherein the potential of the shield is adjusted according to the potential of the sensor. In other words, the potential of the shield follows the potential of the sensor. The processing device can therefore be designed to actively adjust the potential of the shield. The potential of the shield can, for example, be adjusted according to the potential of the sensor.

[0049] It can also be specified that the communication components are arranged at a substantially constant distance (in the lateral direction) from the electrical ground on the circuit board. The ground is provided, for example, as a printed conductor and / or a conductive surface. Here, at least one outer edge of the ground can have a direction parallel to the communication components (viewed in a top view along the axial direction). The ground can extend on one layer, while the communication components can extend across multiple layers of the circuit board. Even if a portion of the communication device and the ground are located on different layers, they can still maintain a distance from each other. Here, this distance refers to the lateral distance, i.e., only in a plane defined by these directions. The (axial) distance resulting from the partial arrangement of the ground and the communication device on different layers can always be disregarded here. Multiple layers of the circuit board are arranged, for example, overlapping or bonded in the axial direction.

[0050] Within the scope of this invention, it is preferable to specify that, in order to receive communication signals, the processing component is electrically connected to the communication component via a filter device. Therefore, the filter device can be connected between the communication component and the processing component to filter the received communication signals (before the processing component performs evaluation). The filter device preferably has a high-pass device and a low-pass device to form a band-pass filter, so as to reduce frequencies outside the communication signal frequency range for communication purposes. Here, the filter device can be integrated into the electrical transmission path for transmitting the communication signal from the communication component to the processing component. In the case of symmetrical transmission and / or reception of communication signals, two transmission paths can also be correspondingly provided for the respective terminals of the processing component. The filter device can provide additional reduction of interference oscillations before they adversely affect the processing component's evaluation of the communication signal upon reception.

[0051] Within the scope of this invention, it can be advantageously specified that the filter device has a Wien filter as a bandpass filter. This has the benefit that the Wien filter can have a steeper bandpass curve than other filters conventionally used, thus resulting in better interference filtering.

[0052] The design of Wien filters is well-known, for example, from the structure of Wien-Robinson bridges or Wien bridge sine wave oscillators. Wien filters are disclosed, for instance, as Wien bandpass filters (or Wien-Robinson bandpass filters) in the document *Electrical Engineering Handbook* (Kories, Harri Deutsch, 3rd edition, 1998). Here, it can be a cascade of low-pass and high-pass filters, which may have the same threshold frequency.

[0053] Alternatively, within the scope of this invention, a bandpass filter may be provided as a first bandpass filter, and a second bandpass filter may be designed symmetrically to the first bandpass filter. The bandpass filters may be electrically connected to different terminals to filter the received communication signals symmetrically at the terminals. In other words, a bandpass filter may be provided for each transmission path, and for this purpose, it may be integrated into the respective transmission path. The bandpass filters may have the same design, for example, all in the form of Wien filters.

[0054] It is also conceivable that the device of the present invention is suitable for installation on a vehicle component, preferably for generating a detection area and / or performing communication in a region of the vehicle component. The vehicle component is, for example, a door handle according to the present invention housing the device, or a door, hood, bumper, or sill of the vehicle.

[0055] The device according to the invention can also be designed as a separately operable module, which can be installed as a single component on a vehicle and / or vehicle parts. For this purpose, the device can have positioning means such as grooves or geometric adaptations, which allows for clear installation on the vehicle. The positioning means can be designed simultaneously or alternatively as a fixing mechanism such as a locking element, clip, or adhesive. The device can be installed on a part of the vehicle, such as a door and / or door handle and / or rear cover and / or front cover. For example, for installation, fixing by means of a fixing mechanism and positioning by means of a positioning means can be performed.

[0056] The device according to the invention can be advantageously integrated into a vehicle door handle, preferably into the exterior door handle. Therefore, the device can be designed for communication and / or detection in the door handle area. The device can be integrated into the door handle so that it is mounted on the vehicle, particularly the door, via the door handle.

[0057] It is also advantageous for the vehicle to be designed as a motor vehicle, preferably a passenger car, and especially as a hybrid or electric vehicle, preferably equipped with a high-voltage onboard power supply and / or an electric motor and / or an internal combustion engine. It may also be feasible for the vehicle to be designed as a fuel cell vehicle and / or a semi-autonomous or autonomous vehicle.

[0058] The vehicle advantageously incorporates a security system that allows authentication, for example, through communication with a mobile device such as an identification transmitter (ID transmitter, electronic key) or smartphone. Based on this communication and / or authentication, at least one function of the vehicle can be activated. If authentication by the mobile device is required for this, the function can be a security-related function, such as unlocking the vehicle or allowing engine start. Therefore, the security system can also be designed as a passive access system, initiating authentication and / or function activation upon detecting the proximity of a mobile device to the vehicle without requiring active manual operation by the mobile device. For this purpose, for example, a wake-up signal is repeatedly emitted by the security system, which the mobile device can receive upon proximity and subsequently trigger authentication. Proximity can also be identified by detecting activation actions by the device of the present invention. This functionality can also involve the activation of vehicle lighting and / or the operation (opening and / or closing) of covers (e.g., front or rear or side covers or doors). For example, vehicle lighting can be automatically activated upon detecting proximity and / or a cover can be operated upon detecting a user gesture.

[0059] It is feasible to provide a first sensor element for capacitance detection in a first detection area on the circuit board of the device of the present invention. Furthermore, it can be specified that a second sensor element for capacitance detection in a second detection area, different from the first detection area, is arranged on the circuit board. Each sensor element can be designed as a capacitance sensor, so the detection is based on a change in capacitance provided by the sensor element. In this case, a single sensor element can be understood as an electrode that forms a variable capacitance relative to the vehicle's surrounding environment. For this purpose, it is not necessary to provide separate pairing electrodes. For example, the vehicle's ground potential can also be considered as a pairing electrode to form an imaginary capacitor with variable capacitance. Thus, a first activation action in the first detection area causes a change in capacitance provided by the first sensor element. A second activation action in the second detection area correspondingly causes a change in capacitance provided by the second sensor element.

[0060] The second sensor can be designed to at least partially cover the same area as the first sensor. Furthermore, the second and first sensors can be arranged (alternately) on different layers of the circuit board. In addition to this axially offset arrangement on different layers, the sensors within their respective layers can be laterally offset from each other. Therefore, offset positioning means that the sensors are positioned differently within the plane of their respective layers, so that the sensors do not overlap. Thus, although the sensors themselves are designed to cover the same area, they do not overlap in the same way. In this way, the impact of the first activation action on the detection of the second sensor can be reduced (and / or vice versa).

[0061] Optionally, the processing device can be arranged in a region of the circuit board, particularly on the first layer, which extends face-to-face with an electrical ground plane, particularly on the second layer. Therefore, it is specified that the processing device is shielded from at least one detection region by the ground plane to further improve detection and / or achieve interference removal for the processing device.

[0062] Alternatively, the communication component can be arranged on multiple layers of a circuit board, preferably extending across at least two, four, or all layers and / or spaced (laterally) from the sensor components and / or shielding, to provide near-field communication with a mobile device. Near-field communication can be provided in conjunction with an external mobile device. In this case, the vehicle component can be designed as an exterior door handle. Thus, for example, if the mobile device is designed as a smartphone, it simply needs to be attached to the device or exterior door handle for verification to achieve near-field communication. Alternatively, the door handle can also be designed as an interior door handle for near-field communication within the vehicle interior.

[0063] It can be specified that, especially upon triggering an activation action (successful) detection, the communication component is used for verification via near-field communication. For example, in this case, the vehicle's processing unit and / or controller recognizes a successful detection and triggers verification via the communication component. Therefore, based on the verification, vehicle functions, particularly unlocking and / or locking, can be activated. For example, a user carries a mobile device when performing the activation action. The user's activation action indicates that they wish to activate a vehicle function. However, this function may be a security-related function requiring verification by the user via a mobile device. Therefore, the activation action detection of the device of the present invention can trigger a verification process, which is subsequently provided by the device via communication, particularly near-field communication. Then, the vehicle's processing unit and / or controller can also recognize the successful verification and subsequently activate the vehicle function. For communication, the device's processing components, such as NFC circuitry, can be controlled by the vehicle's processing unit and / or controller.

[0064] It can be specified that processing components and / or processing devices are provided in the device according to the invention, which are used individually or jointly for evaluating the detection and / or for detecting activation actions and / or for receiving and / or transmitting during communication, especially near-field communication. The processing components and processing devices can be designed as separate microcontrollers or integrated circuits (ICs). For example, the processing device can be dedicated to detection, while the processing component can be dedicated to near-field communication. Alternatively, the processing components and processing devices may be jointly designed as an IC.

[0065] Alternatively, the processing component can be part of a processing device such as a microcontroller or IC. This processing component and / or processing device may have an interface with other vehicle electronics, particularly controllers. For example, the processing device can send a signal to the vehicle electronics indicating successful detection. Receiving this signal can trigger verification, which the vehicle electronics then initiates through another interface with the processing component.

[0066] The subject of this invention is also a door handle for a vehicle, which incorporates the device of this invention as a vehicle component. Therefore, the door handle of this invention provides the same advantages as those detailed regarding the device of this invention.

[0067] Protection is also required for the use of the device according to the invention, particularly for use in vehicles communicating with mobile devices. In this case, it is possible to install a mobile device outside the vehicle in order to activate vehicle functions via communication. Therefore, the use of the invention brings the same advantages as detailed with respect to the device of the invention. Attached Figure Description

[0068] Other advantages, features, and details of the present invention are derived from the following detailed description of embodiments of the invention with reference to the accompanying drawings. Here, the features mentioned in the claims and specification may be important to the invention individually or in any combination, wherein: Figure 1 A side view schematic diagram of a vehicle having the device according to the invention is shown. Figure 2 Show Figure 1 A cross-sectional schematic diagram of a vehicle with a door handle equipped with the device of the present invention, corresponding to a perspective top view of the vehicle. Figure 3 Show Figure 2 An enlarged side view of the device of the present invention. Figure 4-7 Show Figure 2 and Figure 3 Cross-sectional schematic diagrams of different layers of the device of the present invention. Figure 8 The circuit diagrams of the various parts of the device of the present invention are shown. Detailed Implementation

[0069] In the following figures, the same reference numerals are used for the same technical features even in different embodiments.

[0070] Figure 1 A vehicle 1 is shown having a door handle 5 according to the invention. The door handle 5 can be incorporated into a vehicle component 5 having a device 10 according to the invention.

[0071] The door handle 5 is fixed to the door 2 of the vehicle 1 so that the door 2 can be opened by manual operation. For this purpose, the user can reach in... Figure 2 The door handle 5 is pulled into the door handle slot 7 shown. The opening process requires unlocking the door 2. For this purpose, the "hand-in-hand door handle slot 7" can be detected as an activation action to activate verification and, if verification is successful, activate unlocking as a function of vehicle 1. When the "proximity detection area 51" is detected as an activation action, locking can be activated as another function of vehicle 1. Of course, these are just examples of functions and activation actions. In the case of a concealed door handle 5, the function of vehicle 1 could be, for example, an automatically performed opening process itself. It is also conceivable that the device 10 of the present invention could be arranged in the rear or front region, thus functioning to open the cover 6 of vehicle 1.

[0072] Figure 1 A side view of vehicle 1 is shown, illustrating the mutually orthogonal directions x and y. Figure 2 The perspective top view of vehicle 1, corresponding to the mutually orthogonal directions x and z shown, was used. Figure 2 (as well as Figure 3 The view in the diagram corresponds to the side perspective view of the door handle 5 or the device 10 of the present invention and layers 21, 22, 23, 24. And... Figure 4-7 The diagram shows a cross-sectional view of device 10, which is derived from a top perspective view of device 10, and therefore corresponds to... Figure 1 The image shows a side view of vehicle 1. The geometric relationships discussed within the scope of this invention (e.g., the same design and positioning of the shielding and sensor elements 40, 31 and the ground planes 45 of the different layers 21, 22, 23, 24) can be described here with respect to this hypothetical top view of the device 10 of the invention. This top view can be defined as looking toward the axis z, which is orthogonal to the longest extension dimension of layers 21, 22, 23, 24 or to the lateral x and y axes.

[0073] like Figure 2 As shown, the door handle 5 has a device 10 according to the invention, which is used to detect activation in the detection area 51, particularly when the door handle 5 is mounted on the door 2. The function of the vehicle 1 can be activated by the device 10 based on the detection.

[0074] Device 10 may have in Figure 3 The multilayer circuit board 20 is shown in further detail. At least one conductive sensor element 31 is disposed on the first layer 21 of the circuit board 20 for capacitance detection within the detection area 51. The detection area 51 may be implemented as a first detection area 51 extending outside the vehicle 1 in a first outer region of the door handle 5. A second detection area 52 may also extend in a region of the door handle recess 7 or a second outer region of the door handle 5. The second outer region may face the door handle recess 7 and the first outer region may face away from the door handle recess 7 (see [reference]). Figure 2Therefore, it is feasible to provide a sensor 31 on the circuit board 20 for capacitance detection within the detection area 51, which is the first detection area 51, as the first sensor 31. Furthermore, a second sensor 32 of the device 10 can also be provided on the fourth layer 24, and the second sensor also performs capacitance detection in the second detection area 52. This allows for the detection of different activation actions. The respective sensor elements 31 and 32 can be designed as capacitive sensors, such that detection is based on changes in capacitance provided by the respective sensor elements 31 and 32. The individual sensor elements 31 and 32 can be understood here as electrodes forming a variable capacitance relative to the environment surrounding the vehicle 1. For this purpose, the ground potential of the vehicle 1 can be considered as paired electrodes to form an imaginary capacitor with variable capacitance. Thus, a first activation action in the first detection area 51 causes a change in capacitance provided by the first sensor element 31. A second activation action in the second detection area 52 correspondingly causes a change in capacitance provided by the second sensor element 32.

[0075] To improve detection, such as Figure 3 As shown, at least two shielding elements 40 can be used to shield 41 for detection. In this case, the shielding elements 40 are arranged on different layers 21, 22, 23, 24 of the circuit board 20, wherein one of the shielding elements 40 surrounds the (first) sensor element 31 on the first layer 21 to provide shielding 41 in different directions x, y, z. Figure 3 The shield 41 is shown in a "canister shape," which can be created by the arrangement of the shielding members 40 shown. The shielding members 40 can be distributed on layers 21, 22, 23, and 24 such that the shield 41 defines the detection area 51 in three mutually orthogonal directions x, y, and z, and in a plane xy (e.g., Figure 4 The detection area 51 is mainly or completely surrounded by the area shown.

[0076] like Figure 4 As shown, the shielding element 40 on the first layer 21 can mainly, or perhaps even completely (not shown) surround the sensor element 31. Figure 4 Specifically, the sensor element 31 is primarily, i.e., partially, surrounded by the shield 40. For this purpose, the shield 40 has a notch 42 to prevent short-circuit currents, particularly caused by interaction with the communication component 61 during operation for communication, especially NFC communication. The notch 42 may be designed to be electrically insulating to avoid such interference, especially during communication. This ensures that the electric field generated by the sensor element 31 is reliably aligned with the detection area 51. To further improve detection in the detection area 51, according to... Figure 5One of the shielding elements 40 on the second layer 22 can be configured to cover the sensor element 31 on the first layer 21 in the same way. The shielding element 40 on the second layer 22 can be arranged, at least partially, relative to the sensor element 31 on the first layer in a manner that covers and positions it identically. In this case, identical position obviously only relates to the directions x and y. Therefore, when looking towards... Figure 5 In the hypothetical top view of layer 22 and layer 21 below it, the sensor 31 behind the shield 40 on the second layer 22 is no longer visible when layers 21 and 22 are partially transparent, at least for the portion of the shield 40 that is covered by the same arrangement.

[0077] according to Figure 5 The grounding 45 may also extend in a planar manner on the second layer 22 adjacent to the shielding member 40 on the second layer 22, particularly parallel to the area 28 for arranging electronic components on the first layer 21 and / or parallel to one of the shielding members 40 on the third layer 23. The grounding surface 45 may have a notch for the sensor element 31 on the first layer or the corresponding shielding member 40 on the second layer 22. Furthermore, the grounding 45 can be used for interference removal of electronic components in the area 28 of the first layer 21. In addition, the area of ​​the grounding 45 around the notch may be designed to cover the same and / or be in the same position as the shielding member 40 on the first layer 21.

[0078] Figure 6 One of the shielding elements 40 shown on the third layer 23 extends in a planar form on one side relative to the sensor element 31 on the first layer 21 to provide shielding 41 on one side. Furthermore, the shielding element 40 shown extends further in the x-direction to simultaneously provide shielding 41 for... Figure 7 The second sensor element 32 is located in the shield 40. The shield 40 and the second sensor element 32 therefore have a longer extension dimension than the first sensor element 31.

[0079] exist Figure 7 The sensor 31 of the first layer 21 is shown in dashed lines to indicate the position of the sensor 31 below the fourth layer 24. To at least mitigate the impact of the first activation action on the detection of the second sensor 32, the sensors 31 and 32 may be specified as follows: Figure 7Although at least partially designed to overlap each other, the sensors 31 and 32 are staggered in their positioning. In other words, besides being staggered (in the z-axis) on different layers 21 and 24 of the circuit board 20, the sensors 31 and 32 are also specified to be staggered relative to each other (in the x-direction) within their respective layers 21 and 24. Therefore, although the second sensor 32 is at least partially constructed to overlap the first sensor 31, it is not arranged to overlap (or be in the same position). In a hypothetical top view of the sensors 31 and 32 along the z-axis, the first sensor 31 would at least partially overlap the second sensor 32 without staggered positioning. However, this overlap is eliminated (at least partially) in the specified staggered positioning. This staggered positioning can also be understood as the overlapping areas 35 of the sensors 31 and 32 being staggered in the x-direction. Figure 7 As shown by the dashed lines, the first sensor element 31 is staggered relative to the second sensor element 32 by an offset B, and therefore is not covered. Specifically, in the illustration, sensor elements 31 and 32 both have the same linear structure, wherein the lines do not overlap due to their staggered positioning. These lines are arranged here as part of the structure 36 of sensor elements 31 and 32, spaced apart from each other by a distance A. The offset B is approximately or exactly half of the distance A.

[0080] In the illustrated example, shielding elements 40 on different layers 21, 22, 23, 24 are connected to each other via via contacts 25, thus being set to have the same potential. Alternatively, shielding elements 40 on different layers 21, 22, 23, 24 can also be designed to be electrically isolated from each other so that they have different potentials. A hybrid form consisting of separated and connected shielding elements 40 is also conceivable. However, the connection by means of via contacts 25 has the advantage that it is only necessary to electrically connect the shielding element 40 to the processing device 29 to make the shielding element 40 work to provide active shielding 41, at which time the potential of the shielding element 40 is adjusted based on the potential of sensor elements 31 and / or 32. The processing device 29 and / or processing assembly 65 for near-field communication can be arranged in region 28, especially according to Figure 4 On the first layer 21. This area can extend relative to the ground surface 45, particularly on the second layer 22.

[0081] exist Figure 4-7The diagram also shows that the communication component 61 can be arranged on layers 21, 22, 23, and 24 of the circuit board 20, and preferably extends on all layers 21, 22, 23, and 24 spaced apart from the sensor components and shielding components 31 and 40. In this case, the communication component 61 is not shown in its specific design on each layer 21, 22, 23, and 24, but is only schematically shown by dashed lines. Here, the communication component 61 can be formed along this line, but on different layers 21, 22, 23, and 24. In other words, the communication component 61 can be interrupted on one layer 21, 22, 23, and 24 and continue as a printed conductor on another layer 21, 22, 23, and 24 via a via contact 25 in this lateral position. The communication component 61 can be designed as a near-field antenna to provide near-field communication with mobile devices outside the vehicle 1. This near-field communication can be used for verification triggered by an activation action detection ground.

[0082] Figure 8 An exemplary design for a communication component 61, particularly an NFC antenna, for near-field communication is shown. In this case, the device 10 is therefore designed not only as a sensor device 10 but also as a communication device 10, where the communication component 61 can be operated via a processing component 65 as a communication interface.

[0083] The communication component 61 is designed as a loop antenna or a frame antenna (so-called a loop) and can be used to transmit and / or receive signals for near-field communication with a mobile device. Coupling between the communication device 10 and the mobile device can occur at the operating frequency of the communication component 61, which is 13.56 MHz. Accordingly, the communication component 61 can be designed to generate a magnetic field to communicate with the mobile device and thereby establish an inductive coupling with the mobile device. Therefore, the NFC antenna 61 can also be understood as an NFC coil. The communication component 61 can advantageously be designed as a wire loop on the circuit board 20. However, Figure 8 The shape shown does not extend continuously on the single layer of circuit board 20 in this manner. Instead, the shape is interrupted at certain points by via contacts 25 and continues on another layer from that interruption. If the routes of the communication components 61 on all layers 21, 22, 23, and 24 are concentrated in a single plane, then... Figure 8 The route map shown.

[0084] exist Figure 8As clearly seen, the communication component 61 shown is geometrically symmetrical (with respect to the corresponding axis of symmetry S, passing through point V). This geometric symmetry reduces interference. Simultaneously, the communication component 61 can operate according to electrical symmetry, where the drive and / or signal control can be performed symmetrically or differentially at RX+ and RX- via two branches through the processing component 65 (unlike operation where one of the terminals of the communication component 61 is grounded). Therefore, advantageously, an electrical signal, particularly a voltage not equal to 0 volts, containing near-field communication information can be measured at each of the two terminals RX+ and RX-. The voltages at terminals RX+ and RX- can be symmetrical and therefore have equal amplitudes. The processing component 65 is designed, for example, as an NFC receiver or transceiver.

[0085] In the symmetrical design shown, the virtual ground can be located exactly or substantially at the center point V of the communication component 61. For example... Figure 8 As shown, the center point V can be located at half the length of the communication component 61 or at its center. Depending on the antenna design, it may be feasible to have no current flow due to the tap at the point V, which is associated with grounding, in the case of an ideal antenna. Therefore, this point V is referred to below as a virtual ground.

[0086] Interference in the form of electromagnetic radiation can be reduced through geometric and electrical symmetry. However, interference still exists, causing the parasitic oscillating circuit of communication component 61 to vibrate. In this case, harmonic and non-harmonic oscillations may occur, where non-harmonic oscillations may be reduced by means of processing component 65 and / or by filter device 70. However, harmonic oscillations are still interfering and will adversely affect reception during near-field communication using communication component 61.

[0087] A resistor attenuation can be installed at the (ideal) virtual ground V location to further reduce interference caused by interference radiation, especially EMC radiation, during near-field communication reception. Specifically, at this location, an ohmic resistor or an impedance can be used as the attenuation resistor Rd connecting the communication unit 61 to the ground potential. This attenuation resistor Rd can be designed as a low-ohmic resistor, for example, in the range of 50-100 ohms. Functionally, the resistor attenuation by the attenuation resistor Rd can also attenuate interfering oscillations when the virtual ground location on the communication component 61 changes due to interference.

[0088] Furthermore, to further stabilize the system, it can be specified that the communication component 61 is arranged on the circuit board 20 at least primarily parallel to the outer edge and / or at a constant distance from the electrical ground 45, particularly the ground plane 45. Figure 5 In this configuration, grounding 45 is formed in the form of a conductor surface with grounding potential. Figure 5The constant distance between ground plane 45 and communication component 61 can also be seen. This ensures that the magnetic coupling from communication component 61 to ground plane 45 is the same at every point.

[0089] Furthermore, a second-order bandpass filter, particularly a so-called Wien filter, can be used in filter device 70, which achieves improved interference filtering due to its very steep bandpass curve. The Wien filter is a special type of on / off RC bandpass filter, also known as the frequency determination circuit in a Wien-Robinson generator.

[0090] Figure 8 The filter device 70 is shown to consist of at least one high-pass device 71 (particularly a first-order RC filter) and at least one low-pass device 72 (particularly also in the form of a first-order RC filter). The high-pass and low-pass devices 71 and 72 can be combined in pairs to form a band-pass filter, particularly a second-order RC filter. This band-pass filter, particularly a Wien filter, can be symmetrically arranged in the filter device 70.

[0091] Specifically, a resistor R1 and a capacitor C1 can be connected in series. Optionally, another resistor R3 can be provided, which forms an additional voltage divider with R1. In addition, a resistor R2 and a capacitor C2 can be connected in parallel.

[0092] exist Figure 8 It can also be seen that the filter device 70 has bandpass filters symmetrically for terminals RX+ and RX-. Possible values ​​for the respective resistors R1 are in the range of 1-10 kΩ, for R3 1-5 kΩ, for capacitor C1 1-20 pF, for R2 100-500 Ω, and for C2 10-40 pF. Therefore, the filter device 70 can provide at least one bandpass filter, which causes a significant attenuation of the signal from the communication component 61 in the 100-160 MHz range.

[0093] The above explanation of the embodiments describes the present invention only within the scope of examples. Obviously, the various features of the embodiments can be freely combined with each other as long as they are technically meaningful, without exceeding the scope of the present invention.

[0094] List of reference numerals 1 vehicle 2 doors 5 door handles, vehicle parts 6 Rear Cover 7 door handle grooves 10. Devices, sensor devices and / or communication devices 20 circuit boards 21 First Floor 22 Second layer 23 Third Floor 24 Fourth Floor 25 Through-hole Contact Section 28 Electronic Components Area 29 processing units 31 sensor devices, first sensor device 32 Second sensor device 35 covers the same area 36-part structure, linear structure 40 shielding components 41 shielding 42 gaps 45 grounding Detection Area 51, First Detection Area 52 Second Detection Area 61 Communication components, antennas, NFC loop 65 processing components 70 filter device 71 Qualcomm device 72 Low-pass device x is the first direction, horizontal. y is the second direction, horizontal. z Third direction, axial Floors 21, 22, 23, and 24 Distance A, minimum distance B offset C capacitor R resistor Rd attenuation resistor RX terminal V Virtual Grounding S-axis of symmetry

Claims

1. A device (10) for communicating with a mobile device to activate the functions of a vehicle (1) according to the communication, comprising: - Conductive communication component (61). - A processing component (65) for sending and / or receiving communication signals through the communication component (61) to provide the communication through the communication signals. - At least one terminal (RX+, RX-) for receiving the communication signal, which electrically connects the processing component (65) to the communication component (61). in, The processing component (65) is electrically connected to the communication component (61) via a filter device (70) in order to receive the communication signal. The filter device (70) includes a first resistor (R1), a first capacitor (C1), and a third resistor (R3). The first resistor (R1) and the first capacitor (C1) are connected in series. The third resistor (R3) is connected in series with the first resistor (R1) and forms an additional voltage divider with the first resistor (R1). The filter device (70) includes a second resistor (R2) and a second capacitor (C2) connected in parallel. The device (10) is designed as a sensor and communication device to detect activation actions in a detection area (51) in addition to providing communication. At least one conductive sensor element (31) is provided for capacitance detection in the detection area (51). The sensor element (31) is electrically connected to a processing device (29) so that the processing device (29) detects the activation action based on the detection.

2. The device (10) according to claim 1, characterized in that, The communication component (61) is designed as a near-field communication antenna, so that the communication is implemented in the form of near-field communication.

3. The device (10) according to claim 2, characterized in that, The near-field communication antenna is an NFC loop antenna.

4. The apparatus (10) according to any one of claims 1-3, characterized in that, The communication component (61) is designed to be geometrically symmetrical.

5. The device (10) according to claim 4, characterized in that, The communication component (61) is designed in a ring shape.

6. The apparatus (10) according to claim 1, characterized in that, In addition to the at least one terminal (RX+, RX-), a device (Rd) for resistance attenuation is also electrically connected to the communication component (61).

7. The apparatus (10) according to claim 6, characterized in that, The device (Rd) for resistance attenuation has an electrical connection to the communication component (61) at a connection point (V), wherein the connection point (V) is located on the axis of symmetry (S) of the communication component (61), and / or The device (Rd) for resistive attenuation has a resistor to attenuate signals on the communication component (61) at frequencies different from at least one communication frequency, wherein the communication frequency is specified for the communication signal and includes 13.56 MHz, and / or The device (Rd) for resistance attenuation has an electrical connection to the communication component (61) at a connection point (V), wherein the connection point (V) is designed to be the center point (V) of the communication component (61), at half the length of the communication component (61) and / or at the center of its geometry, and / or The device (Rd) for resistance attenuation has an electrical connection to the communication component (61) at the connection point (V) of the communication component (61), wherein the connection point (V) is located at the virtual ground (V) of the communication component (61).

8. The apparatus (10) according to claim 6 or 7, characterized in that, The device (Rd) for resistance attenuation connects the communication component (61) directly to electrical ground (45) to provide attenuation of the parasitic oscillation loop of the communication component (61), and / or The device (Rd) for resistance attenuation is formed in the form of a resistor, and / or The device (Rd) for resistance attenuation is electrically connected to the communication component (61) at a position (V) where an electrical signal of the communication component (61) whose frequency does not match the frequency range of the communication signal is attenuated by the device (Rd) and / or led to the electrical ground (45).

9. The apparatus (10) according to claim 1, characterized in that, The processing component (65) is designed to perform sending and / or receiving to provide communication in the form of near-field communication and has NFC receiver electronics to evaluate the communication signal for reception, wherein the communication frequency of the received communication signal is different from the frequency of at least one parasitic oscillation loop of the communication component (61), and / or The at least one terminal (RX+, RX-) has at least two terminals (RX+, RX-) for receiving the communication signal, wherein the processing component (65) is designed to perform receiving and transmitting symmetrically, such that the received communication signal is symmetrically present at the at least two terminals (RX+, RX-), and / or A multi-layer circuit board (20) is provided, wherein the communication component (61) is arranged on multiple layers (21,22,23,24) of the circuit board (20) and extends at a distance from at least one grounding element and / or sensor element and / or shielding element (31,40) to provide communication with a mobile device other than the vehicle (1), and to verify via the communication in response to activation action detection in the detection area (51) of the sensor element (31), and to activate the function of the vehicle (1) based on the verification.

10. The apparatus (10) according to claim 9, characterized in that, The function of the vehicle (1) is to unlock and / or lock the vehicle (1).

11. The apparatus (10) according to claim 9, characterized in that, At least two shielding elements (40) are provided for shielding (41) for detection, wherein the shielding elements (40) are disposed at different layers (21, 22, 23, 24) of the circuit board (20), wherein one of the shielding elements (40) in the first layer (21) completely surrounds the sensor element (31) to provide shielding (41) in different directions.

12. The apparatus (10) according to claim 1, characterized in that, The filter device (70) has a high-pass device (71) and a low-pass device (72) to form a bandpass filter so as to at least reduce frequencies outside the frequency range of the communication signal for communication.

13. The apparatus (10) according to claim 1, characterized in that, The filter device (70) has an RC filter or an LC filter.

14. The apparatus (10) according to claim 12, characterized in that, The filter device (70) has a Wien filter as the bandpass filter.

15. The apparatus (10) according to claim 12 or 14, characterized in that, The bandpass filters (71, 72) are configured as the first bandpass filters, and the second bandpass filter is designed in a symmetrical manner with respect to the first bandpass filter. The first bandpass filter and the second bandpass filter are electrically connected to different terminals (RX+, RX-) respectively, so as to symmetrically filter the symmetrically received communication signals at the terminals (RX+, RX-).

16. A door handle (5) for a vehicle (1), the door handle (5) having a device (10) as a vehicle component according to any one of claims 1 to 15.

17. Use of the device (10) according to any one of claims 1 to 15 in a vehicle, the use including communication between the vehicle and a mobile device, wherein, The mobile device is located outside the vehicle (1) to activate the functions of the vehicle (1) via the communication.

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