Jump and sway measurement fixture

Abstract

A fixture is provided. The fixture includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, is rotatable about an axis of rotation, and is configured to slidably seat a susceptor assembly for rotation about the axis of rotation. The first sensor is fixed relative to the base, is radially offset from the axis of rotation, and is configured to determine an out-of-position runout of the susceptor assembly. The second sensor is fixed relative to the first sensor, is axially offset from the first sensor, and is configured to determine an out-of-position wobble of the susceptor assembly. Fixture arrangements and methods of determining out-of-position runout and out-of-position wobble of a susceptor assembly for a semiconductor processing system are also described.

Description

Technical Field

[0001] This disclosure generally relates to semiconductor processing systems. More specifically, this disclosure relates to manufacturing semiconductor processing systems, such as semiconductor processing systems for depositing films onto substrates. Background Technology

[0002] Semiconductor processing systems are commonly used to deposit films onto substrates, such as in the fabrication of very large-scale integrated circuits. In such systems, film deposition is typically achieved by supporting the substrate within a reaction chamber and allowing a precursor gas to flow through the chamber and across the substrate. The reaction chamber typically maintains the substrate in an environment conducive to film deposition while the precursor gas flows through it. The substrate is usually supported by a pedestal assembly that positions the substrate on a shaft-driven base, and the pedestal assembly rotates within the reaction chamber as the precursor gas flows through the substrate to promote uniformity of the film deposited on the substrate.

[0003] In some semiconductor processing apparatuses, film uniformity can be affected by the runout and / or oscillation of the pedestal assembly during rotation relative to the surrounding reaction chamber structure. For example, in some semiconductor processing systems, excessive runout—radial displacement of a point located on the outer periphery of the pedestal assembly during rotation relative to the surrounding reaction chamber structure—can limit the uniformity of the film deposited onto the substrate supported by the pedestal. In some semiconductor processes, excessive oscillation—axial displacement of a point located on the surface of the pedestal assembly during rotation relative to the surrounding reaction chamber structure—can also limit the uniformity of the film deposited onto the substrate supported by the pedestal assembly.

[0004] During system-level installation and qualification, runout and wobble can be controlled through part-level manufacturing tolerances and in-situ adjustment of the base assembly. For example, part-level manufacturing tolerances typically ensure that each component selected for a particular base assembly conforms to specific predetermined manufacturing tolerances, thereby ensuring that once the base is assembled in the reaction chamber, no single component individually transmits excessive runout and / or wobble to the base assembly. Once the base assembly is assembled in the reaction chamber, in-situ qualification of the base assembly typically allows the runout and / or wobble of the base assembly to be adjusted within predetermined limits. Base assembly adjustment is typically able to limit runout and / or wobble, where the superposition of part tolerances allows for successful adjustment of the assembled parts.

[0005] Such semiconductor processing systems and methods of manufacturing semiconductor processing systems are generally suitable for their intended purposes. However, there is still a need in the art for improved fixtures, fixture arrangements, and methods for determining the runout and oscillation of the base assembly for the semiconductor processing system. This disclosure provides a solution to this need. Summary of the Invention

[0006] A fixing device is provided. The fixing device includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, rotatable about a rotation axis, and configured to slidably mount a base assembly for rotation about the rotation axis. The first sensor is fixed relative to the base, radially offset from the rotation axis, and configured to determine the off-center runout of the base assembly. The second sensor is fixed relative to the first sensor, axially offset from the first sensor, and configured to determine the off-center oscillation of the base assembly.

[0007] In some examples, the first sensor may be a first non-contact sensor, and the second sensor may be a second non-contact sensor.

[0008] In some examples, the first sensor may include a first laser displacement sensor, and the second sensor may include a second laser displacement sensor.

[0009] In some examples, at least one of the first laser displacement sensor and the second laser displacement sensor may have a spot size between about 120 micrometers and about 1300 micrometers.

[0010] In some examples, at least one of the first laser displacement sensor and the second laser displacement sensor may include (a) a visible illumination source, (b) a red illumination source, or (c) a 655 nm illumination source.

[0011] In some examples, the fixing device may include at least one handle that extends laterally from the base and is radially offset from the axis of rotation.

[0012] In some examples, the fixing device may include a base that is fixed to the base and radially offset from the axis of rotation. One or more of the first and second sensors may be fixed to the base.

[0013] In some examples, the fixing device may include a bracket for securing at least one of the first and second sensors to the base. The bracket may define (a) a runout surface substantially perpendicular to the axis of rotation, or (b) a swing surface substantially parallel to the axis of rotation.

[0014] In some examples, the base may be a first base for securing the first sensor to the base, and the securing device may include a first bracket, a second base, and a second bracket. The first bracket secures the first sensor to the first base, may define a wobbling surface substantially orthogonal to the axis of rotation, and may support the first sensor thereon. The second base is secured to the base, may be circumferentially offset from the first sensor about the axis of rotation, and may secure the second sensor to the base. The second bracket secures the second sensor to the second base, may define a wobbling surface substantially parallel to the axis of rotation, and may support the second sensor on the wobbling surface.

[0015] In some examples, the turntable may include a lower member, an intermediate member, and an upper member. The lower member may be fixed to a base and has a bearing assembly. The intermediate member may be rotatably supported on the lower member by the bearing assembly and may have a stop portion arranged along the axis of rotation. The upper member may be fixed to the intermediate member and may have a sleeve portion extending about the axis of rotation and axially extending from the stop portion.

[0016] In some examples, the turntable may include a first elastic member and a second elastic member. The first elastic member may be located in a sleeve portion of the upper member, may extend about an axis of rotation, and may be axially offset from the lower member. The second elastic member may be located in a sleeve portion, may extend about an axis of rotation, may be axially offset from the first elastic member, and may be arranged along the axis of rotation on the side of the first elastic member opposite to the lower member.

[0017] In some examples, the intermediate member may be (a) bound within the upper member of the turntable, or (b) bound between the lower and upper members of the turntable.

[0018] In some examples, the base assembly is slidably housed in a turntable and can rotate therein relative to the base about an axis of rotation.

[0019] In some examples, the base assembly may include a bracket. The bracket may be arranged along the axis of rotation. The bracket may be axially positioned between the second sensor and the turntable.

[0020] In some examples, the base assembly may include a base. The base may be arranged along the axis of rotation. The base may be axially offset from the turntable. The base may be radially overlapped by a first sensor. The base may be axially overlapped by a second sensor.

[0021] In some examples, the base assembly may include a shaft having a lower end and an upper end. The lower end of the shaft is slidably received within a turntable. The upper end of the shaft may be positioned between the second sensor and the turntable.

[0022] In some examples, the fixing device may include a controller. The controller may be configured to communicate with a first sensor and a second sensor. The controller may be configured to communicate with a non-transitory machine-readable memory. The controller may respond to instructions recorded in the memory to receive multiple radial displacement measurements of the base assembly from the first sensor, multiple axial displacement measurements of the base assembly from the second sensor, determine off-center runout of the base assembly using the multiple radial displacement measurements received from the first sensor, and determine off-center oscillation of the base assembly using the multiple axial displacement measurements received from the second sensor.

[0023] A fixing device arrangement is provided. This fixing device arrangement includes a fixing device and a base assembly as described above. A first sensor is a first non-contact sensor, and a second sensor is a second non-contact sensor. The first sensor includes a first laser displacement sensor, and the second sensor includes a second laser displacement sensor. The base assembly is slidably disposed in a turntable, rotatable therein relative to a base about a rotation axis, and includes a shaft, a bracket, and a base. The shaft has a lower end slidably received in the turntable and an upper end disposed between the second sensor and the turntable. The bracket is arranged along the rotation axis, axially located between the second sensor and the turntable, and fixed to the upper end of the shaft. The base is arranged along the rotation axis, axially offset from the turntable, fixed to the upper end of the shaft by the bracket, radially overlapping the first sensor, and axially overlapping the second sensor.

[0024] A method is provided for determining the off-center runout and off-center oscillation of a base assembly for a semiconductor processing system. The method includes: slidably mounting the base assembly in a turntable for rotation about a rotation axis at a fixing device as described above; determining the off-center runout of the base assembly using a first sensor; and determining the off-center oscillation of the base assembly using a second sensor. The off-center runout is compared to a predetermined off-center runout value, and when the off-center runout exceeds the predetermined off-center runout value, the base assembly is reworked; the off-center oscillation is compared to a predetermined off-center oscillation value, and when the off-center oscillation value exceeds the predetermined off-center oscillation value, the base assembly is reworked; and when (a) the off-center runout is below the predetermined off-center runout value and (b) the off-center oscillation is below the predetermined off-center oscillation value, the base assembly is disassembled.

[0025] In some examples, the method may include reassembling a base assembly within a semiconductor processing apparatus, determining in-situ runout of the base assembly, and determining in-situ oscillation of the base assembly. The in-situ runout may be compared to a predetermined in-situ runout value, and the base assembly is reworked when the in-situ runout exceeds the predetermined in-situ runout value. The in-situ oscillation may be compared to a predetermined in-situ oscillation value, and the base assembly is reworked when the in-situ oscillation value exceeds the predetermined in-situ oscillation value.

[0026] This invention summary is provided to introduce some concepts in a simplified form. These concepts are further described in detail in the following detailed description of exemplary embodiments disclosed. This invention summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter. Attached Figure Description

[0027] These and other features, aspects, and advantages of the invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate and not limit the invention.

[0028] Figure 1This is a schematic diagram of a fixing device constructed according to the present invention, showing a base assembly rotatably mounted in a turntable having a first sensor and a second sensor for determining the in-situ runout and in-situ oscillation of the base assembly.

[0029] Figure 2 yes Figure 1 A schematic diagram of the fixing device shows first and second sensors fixed relative to the frame, and the in-situ runout and oscillation of the base assembly are determined using radial and axial displacement measurements of the base assembly;

[0030] Figure 3 It is based on an example Figure 1 A schematic diagram of the fixing device shows a first base supporting a first sensor and a second base supporting a second sensor, used to determine off-center runout and off-center sway using the first and second sensors;

[0031] Figure 4 It is based on another example. Figure 1 A schematic diagram of the fixing device shows a controller configured to communicate with a first sensor and a second sensor to calculate the off-center runout and off-center sway of the base assembly using radial and axial measurements received from the first sensor and the second sensor, respectively.

[0032] Figure 5 It is based on an example Figure 1 A cross-sectional side view of the turntable of the fixing device shows the intermediate member, which has a stop portion that is bound within the upper member and along the axis of rotation.

[0033] Figure 6 It is based on another example. Figure 1 A cross-sectional side view of the turntable of the fixing device shows an intermediate member having a stop portion that is bound between the upper and lower members of the turntable and along the axis of rotation.

[0034] Figure 7 This is a block diagram of a method for determining the off-center runout and off-center oscillation of a base assembly according to the present disclosure, illustrating the operation of a method according to an illustrative and non-limiting example; and

[0035] Figure 8 This is a block diagram of a method for determining the in-situ runout and in-situ oscillation of a base assembly according to the present disclosure, illustrating the operation of another illustrative and non-limiting example of the method.

[0036] It should be understood that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be enlarged relative to other elements to aid in understanding the embodiments illustrated in this disclosure. Detailed Implementation

[0037] Reference will now be made to the accompanying drawings, wherein the same reference numerals denote similar structural features or aspects of the subject matter. These are for purposes of explanation and illustration, and not limitation. Figure 1 A partial view of an example of a fixing device according to the present disclosure is shown, and is generally indicated by reference numeral 100. As will be described, Figure 2-8 Other embodiments of fixing means, fixing arrangements, and methods for determining displacement and oscillation in a base assembly for a semiconductor processing system, according to this disclosure or aspects thereof, are provided. The fixing means, fixing arrangements, and methods for determining displacement and oscillation in a base assembly for a component can be used to manufacture base assemblies for semiconductor processing systems, such as atmospheric chemical vapor deposition (CVD) systems using epitaxial technology to deposit films, although this disclosure is not limited to epitaxial technology or CVD semiconductor processing systems in general.

[0038] refer to Figure 1 The image shows a fixing device arrangement 102 including a fixing device 100 and a base assembly 10. The base assembly 10 includes a shaft 12, a bracket 14, and a base 16. The shaft 12 has a lower end portion 18 and a longitudinally opposed upper end portion 20. The lower end portion 18 of the shaft 12 is slidably received within the fixing device 100 and may have a locking groove 22 (e.g., Figure 4 (As shown). The upper end 20 of the shaft 12 has a support 24, on which the support 14 is fixedly mounted. The support 14 is rotatably fixed relative to the shaft 12 and a base 16 is mounted thereon. The base 16 is rotatably fixed relative to the support 14 and is configured to hold the membrane 28 (as shown) Figure 6 As shown, during the deposition process onto substrate 26, support substrate 26 (e.g.) Figure 6 (As shown). It is envisioned that the base assembly 10 may be shown and described as in U.S. Patent No. 6086680, published July 11, 2000, the contents of which are incorporated herein by reference in their entirety.

[0039] As described above, in some semiconductor processing systems, it may be desirable to limit in-situ runout and in-situ wobbling of the pedestal assembly during the deposition of a film onto a substrate supported by the pedestal assembly, for example, limiting in-situ runout 30 and / or in-situ wobbling 32 during the deposition of film 28 onto substrate 26 while simultaneously supported by pedestal assembly 10. Limiting in-situ runout and in-situ wobbling is typically achieved by adjusting and / or replacing components of the pedestal assembly, for example by adjusting the mounting of support 14 onto support 24 and / or the mounting of pedestal 16 onto support 14, which typically delays the identification of the semiconductor processing system in which the pedestal assembly has been mounted. As used herein, the term “runout” refers to the radial movement of a point located on the radially outer periphery of pedestal assembly 10 relative to the axis of rotation during rotation about the axis of rotation. As used herein, the term “wobbling” refers to the axial displacement of a point located on pedestal assembly 10 relative to the axis of rotation during rotation about the axis of rotation.

[0040] Unconstrained by theory, the applicant believes that the difficulty in in-situ adjustment of a given base assembly corresponds to the manufacturing variations of the various parts selected for the base assembly. Specifically, while each selected part can individually meet the tolerances controlling each part type, the cumulative tolerances of parts within a particular base assembly can sometimes cause the base assembly to exhibit in-situ runout and / or in-situ wobble exceeding predetermined in-situ runout and / or predetermined in-situ wobble values. Although the in-situ runout and in-situ wobble of the base assembly can generally be successfully adjusted after the base assembly is assembled within the semiconductor processing system, the need for such adjustment prolongs the installation and / or qualification of the semiconductor processing system in which the base assembly has already been assembled. Therefore, to simplify the qualification of the semiconductor processing system, a fixing device 100 is provided.

[0041] refer to Figure 2 The diagram illustrates a fixing arrangement 102 including a fixing device 100 and a base assembly 10. The fixing device 100 includes a base 104, a turntable 106, a first sensor 108, and a second sensor 110. The turntable 106 is supported on the base 104, rotatable about a rotation axis 112, and configured to slidably house the base assembly 10 therein for rotation R relative to the base 104 about the rotation axis 112. The first sensor 108 is fixed relative to the base 104, radially offset from the rotation axis 112, and configured to determine ground clearance 38 of the base assembly 10. The second sensor 110 is fixed relative to the base 104, axially offset from the first sensor 108 along the rotation axis 112, and configured to determine ground clearance 40 of the base assembly 10.

[0042] One or more of the first sensor 108 and the second sensor 110 may be non-contact sensors, such as optical sensors. In view of this disclosure, those skilled in the art will understand that the use of non-contact sensors limits (or eliminates) contamination of the base assembly 10, which could otherwise be caused by contact between the instrument or measuring instrument and the base assembly 10. In view of this disclosure, those skilled in the art will also understand that non-contact sensors also limit (or eliminate) the risk of contaminating the base assembly 10 with particles, such as metal particles, during the determination of the displacement runout 38 and displacement oscillation 32 of the base assembly 10, thereby limiting (or eliminating) the need to clean the base assembly 10 after the displacement runout 38 and displacement oscillation 40 of the base assembly 10 are determined.

[0043] One or more of the first sensor 108 and the second sensor 110 may include (a) a visible illumination source 114, (b) a red illumination source 116, or (c) a 655 nm illumination source 118. The use of such an illumination source simplifies the determination of dislocation runout 38 and dislocation oscillation 40 by allowing the user to visually confirm that both the first sensor 108 and the second sensor 110 remain optically coupled to the base assembly 10 during rotation about the rotation axis 112, thereby simplifying the technically required measurement of the spot size on the surface of the base assembly 10. This illumination source can also be eye-safe, limiting the risk of injury to the user during the determination of the dislocation runout 38 and oscillation 32 of the base assembly 10.

[0044] One or more of the first sensor 108 and the second sensor 110 may include a laser displacement sensor, such as the first laser displacement sensor 120 (e.g., Figure 3 (as shown) and / or the second laser displacement sensor 122 (as shown) Figure 3 (As shown). In some examples, either (or both) of the first laser displacement sensor 120 and / or the second laser displacement sensor 122 may have a spot size of approximately 1200 micrometers wide, allowing the determination of jump 30 and / or oscillation 32 without a computer, simplifying the use of the fixture 100. Examples of such laser displacement sensors include the IL-152 sensor, available from the Keyence Corporation of Itasca, Illinois.

[0045] According to some examples, either (or both) of the first laser displacement sensor 120 and / or the second laser displacement sensor 122 may have a spot size of approximately 120 micrometers. In such examples, the first laser displacement sensor 120 and / or the second laser displacement sensor 122 may be connected to a controller, such as controller 124 (e.g., Figure 4(As shown) This is used to determine the displacement runout 38 and displacement oscillation 40 of the base assembly 10, allowing for the automation of determining the displacement runout 38 and displacement oscillation 32 of the base assembly 10. Examples of such laser displacement sensors include the HK-152 sensor, which is also available from Keyence Corporation of Itasca, Illinois.

[0046] refer to Figure 3 According to one example, the fixing device 100 is shown as including a base 126 and a bracket 128. The base 126 is fixed to a base 104, radially offset from a rotation axis 112, and at least one of a first sensor 108 and a second sensor 110 is supported by the base 126. The bracket 128 is envisioned to fix at least one of the first sensor 108 and the second sensor 110 to the base 126. The bracket 128 is envisioned to define a jumping surface 130 or a oscillating surface 132, the jumping surface 130 being substantially orthogonal to the rotation axis 112, and the oscillating surface 132 being substantially parallel to the rotation axis 112. In view of this disclosure, those skilled in the art will understand that the use of the bracket 128 can simplify the setup and / or maintenance of the fixing device 100, for example, by adjusting the jumping surface 130 or the oscillating surface 132 to allow for the identification and / or authentication of the fixing device 100.

[0047] In the illustrated example, base 126 is a first base 126, bracket 128 is a first bracket 128, and the fixing device 100 also includes a second base 134 and a second bracket 136. The first base 126 is connected to the base 104, extends axially along the rotation axis 112, and supports the first sensor 108. In this respect, the first bracket 128 is connected to the first base 126, which in turn connects to the base 104 and defines a jumping surface 130. The jumping surface 130 is planar, orthogonal to the rotation axis 112, and supports the first sensor 108 thereon. It is envisioned that the first sensor 108 is supported on the jumping surface 130 such that the base assembly 10 and the first sensor 108 are in direct line of sight, for example, without any intermediate structure between the first sensor 108 and the base assembly 10. Given this disclosure, those skilled in the art will understand that direct line of sight limits the output power requirements of the first sensor 108, simplifying the off-center jumping 38 of the base assembly 10. Figure 1 The determination of (as shown).

[0048] The second base 134 is similar to the first base 126, but offset from the first base 126 about the rotation axis 112, and further has an axial height greater than that of the first base 126. In this respect, the second base 134 is connected to the base 104, extends axially along the rotation axis 112, and supports the second sensor 110. The second bracket 136 is connected to the second base 134, connected to the base 104 via the second base 134, and defines a swing surface 132. The swing surface 132 is planar, extends parallel to the rotation axis 112, and supports the second sensor 110 thereon. It is envisioned that the second sensor 110 is supported on the swing surface 132 such that the base assembly 10 and the second sensor 110 are in direct line of sight, for example, without any intermediate structure between the second sensor 110 and the base assembly 10. In view of this disclosure, those skilled in the art will also understand that the direct line of sight limits the output power requirements of the second sensor 110 and simplifies the swing 32 of the base assembly 10 (e.g., Figure 1 The determination of (as shown).

[0049] refer to Figure 4 The illustration shows a fixture 100 according to an example, which has a controller 124, a first handle 138, and a second handle 140. The first handle 138 extends laterally from a base 104 and is located radially offset from the axis of rotation 112 and adjacent to the first base 126. The second handle 140 is similar to the first handle 138, additionally offset from the first handle 138 about the axis of rotation 112, and further extends laterally from the base 104 at a location radially offset from the axis of rotation 112 and adjacent to the second base 134. Positioning the first handle 138 near the first base 126 and the second handle 140 near the second base 134 simplifies the operation of the fixture 100 because both the first handle 138 and the second handle 140 are close to the center of gravity of the fixture 100.

[0050] It is envisioned that the first handle 138 may be one of a pair of first handles 142, which are distributed on opposite sides of the first base 126 and radially offset from the axis of rotation 112. It is also envisioned that the second handle 140 may be one of a pair of second handles 144, which are distributed on opposite sides of the second base 134 and radially offset from the axis of rotation 112. In view of this disclosure, those skilled in the art will understand that the first handle 138, the second handle 140, the first handle pair 142, and / or the second handle pair 144 allow for a relatively thick base 104, which can limit the impact of vibrations in the surrounding environment on determining the displacement runout 38 and displacement sway 40 of the base assembly 10 using the fixing device 100. The first handle pair 142 and the second handle pair 144 also allow for lifting the fixing device 100 from a position near the turntable 106, which may require more than one person to lift and / or move the fixing device 100.

[0051] refer to Figure 5 The diagram shows a turntable 106. The turntable 106 includes a lower member 146, an intermediate member 148, and an upper member 150. The lower member 146 includes a bearing assembly 152 and is fixed relative to a base 104. The intermediate member 148 is rotatably supported on the lower member 146 by the bearing assembly 152 and has a stop portion 154 arranged along a rotation axis 112 and configured to receive the lower end 18 of a shaft 12 (e.g., ...). Figure 1 (As shown). The upper member 150 is rotatably fixed relative to the intermediate member 148, for example by one or more fasteners, and has a sleeve portion 156. The sleeve portion 156 extends about the axis of rotation 112 and extends axially from the stop portion 154 of the intermediate member 148 along the axis of rotation 112. In some examples, the turntable may have a crank for rotating the base assembly 10 about the axis of rotation 112.

[0052] The turntable 106 also includes a first elastic member 158 and a second elastic member 160. The first elastic member 158 is located in the sleeve portion 156 of the upper member 150 and extends about the axis of rotation 112. The first elastic member 158 is further axially offset from the stop portion 154 of the intermediate member 148. In some examples, the first elastic member 158 may be an O-ring. According to some examples, as a non-limiting example, the first elastic member 158 may be formed of an elastic material, such as rubber.

[0053] The second elastic member 160 is located in the sleeve portion 156 of the upper member 150 and extends about the rotation axis 112. The second elastic member 160 is further axially separated from the stop portion 154 of the intermediate member 148 by the first elastic member 158, and radially engages with the locking groove 22 defined in the lower end portion 18 of the shaft 12 (e.g., Figure 1 As shown, the base assembly 10 is rotatably fixed relative to the upper member 150 of the turntable 106 so that it rotates together with the upper member about the axis of rotation 112. In some examples, the second elastic member 160 may be an O-ring. According to some examples, as a non-limiting example, the second elastic member 160 may be formed of an elastic material, such as rubber. It is also conceivable, according to some examples, that the second elastic member 160 may be substantially identical to the first elastic member 158 before being assembled into the turntable 106.

[0054] like Figure 5 As shown, the intermediate member 148 can be restrained within the upper member 150 of the turntable 106. The restraint arrangement of the intermediate member 148 allows the upper member 150 to directly abut against the bearing assembly 152, limiting the base 16 (…). Figure 1The number of mechanical interfaces between (shown) and the limitation of recoil in the arrangement in which the drive module (e.g., drive module 36) is operably associated with the base assembly 10.

[0055] refer to Figure 6 The diagram illustrates a turntable 106 according to another example, in which an intermediate member 148 is constrained between an upper member 150 and a lower member 146. In such an example, the turntable 106 can be more easily manufactured, which can reduce costs in testing environments where higher levels of recoil are acceptable.

[0056] Continue to refer to Figure 4 The controller 124 includes a memory 162, a processor 164, a device interface 166, and a user interface 168. The device interface 166 operatively connects the processor 164 to the first sensor 108 and the second sensor 110, for example, via a wired or wireless link 170. The processor 164 is configured to communicate with the memory 162 and is operatively connected to the user interface 168 to control the displacement 38 of the base assembly 10. Figure 2 (as shown) and / or displacement swing 40 ( Figure 2 (As shown) is passed to the user. In some examples, memory 162 includes a non-transitory machine-readable medium on which multiple program modules 172 containing instructions are recorded. When read by controller 124, the instructions cause processor 164 to perform certain operations. These operations include a method 200 for determining the jerking and oscillation of the base assembly (e.g., Figure 7 The operation shown is as follows.

[0057] In some examples, instructions recorded in multiple program modules 172 may cause processor 164 to (a) receive multiple radial displacement measurements 42 of base assembly 10 from first sensor 108, and (b) receive multiple axial displacement measurements 44 of base assembly 10 from second sensor 110. The instructions may also cause controller 124 to (c) use the multiple radial displacement measurements 42 received from first sensor 108 to determine the displacement runout 38 of base assembly 10. Figure 2 (d) Using multiple axial displacement measurements 44 received from the second sensor 110, the off-center swing 40 of the base assembly 10 is determined. In some examples, the controller 124 may include a stand-alone computer suitable for the intended application or a handheld device including memory 162.

[0058] refer to Figure 7 A method 200 for determining the off-center runout and off-center oscillation of a base assembly is shown, for example, base assembly 10 ( Figure 1 The displacement jump 38 (as shown) Figure 2 (as shown) and off-position swing 40 ( Figure 2(As shown). Method 200 typically includes determining a semiconductor processing system, such as semiconductor processing system 34 ( Figure 1 (As shown) the off-center runout and off-center oscillation of the external base assembly. As shown in box 210, the base assembly is slidably mounted in a turntable for rotation about an axis of rotation, such as turntable 106 ( Figure 2 (As shown) is used for rotation around axis 112 ( Figure 2 (As shown) rotation. As shown in box 220, the off-center runout of the base assembly is determined when the base assembly is slidably positioned in the turntable of the fixed device to rotate about the axis of rotation. As shown in box 240, the off-center oscillation of the base assembly is determined when the base assembly is slidably positioned in the turntable to rotate about the axis of rotation. In some examples, the off-center runout and off-center oscillation can be determined to coincide with each other, i.e., simultaneously. In view of this disclosure, those skilled in the art will understand that by obtaining the radial and axial displacements required to determine the off-center runout and off-center oscillation, the simultaneous determination of the off-center runout and off-center oscillation limits noise.

[0059] As shown in box 230, the off-center runout of the base assembly is compared to a predetermined off-center runout value. As shown in arrows 232, boxes 234, and 236, when the off-center runout is higher than the predetermined off-center runout value, the base assembly is reworked and re-inspected. When the off-center runout is lower than the predetermined off-center runout value, the off-center wobbling of the base assembly is determined, as shown in arrow 238. In some examples, a first sensor, such as first sensor 108, may be used. Figure 2 (As shown) to determine displacement runout. According to some examples, this can be determined using multiple radial displacement measurements obtained from the base assembly during rotation about the axis of rotation, such as radial displacement measurement 42 (as shown). Figure 4 (As shown) to calculate displacement runout, thereby determining displacement runout. It is conceivable that reworking the base assembly may include adjusting the placement of components within the base assembly. It is also conceivable that reworking the base assembly may include altering the profile of one or more placement surfaces within the base assembly.

[0060] As shown in box 250, the off-center runout of the base assembly is compared with a predetermined off-center runout value. As shown in arrows 252, boxes 254, and 256, when the off-center runout is higher than the predetermined off-center runout value, the base assembly is reworked and re-inspected. When (a) the off-center runout is lower than the predetermined off-center runout value, and (b) the off-center runout is lower than the predetermined off-center runout value, the base assembly is removed from the fixture and disassembled for reassembly within the base assembly, as shown in arrows 258, boxes 260, and 270.

[0061] In some examples, a second sensor, such as second sensor 110, can be used. Figure 2(As shown) to determine the displacement oscillation. According to some examples, this can be determined using multiple axial displacement measurements acquired during the rotation of the base assembly about the axis of rotation, such as axial displacement measurement 44 (as shown). Figure 4 (As shown) to calculate the displacement sway, thereby determining the displacement sway. It is conceivable that the reworked base assembly may include adjusting the placement of components within the base assembly. It is also conceivable that the reworked base assembly may include altering the profile of one or more placement surfaces within the base assembly.

[0062] refer to Figure 8 Method 200 may further include determining in-situ runout and in-situ oscillation, i.e., after reassembly of the base assembly within the semiconductor processing system, as shown in box 280. The method may also include determining in-situ oscillation of the base assembly, i.e., after reassembly of the base assembly within the semiconductor processing system, as shown in box 290.

[0063] As shown in box 282, the in-situ runout of the base assembly is, for example, in-situ runout 30 ( Figure 1 The base assembly (as shown) is compared with a predetermined home runout value. When the home runout value is higher than the predetermined home runout value, the base assembly is adjusted and rechecked, as shown by arrows 284, 286, and 288. When the home runout is lower than the predetermined home runout value, the home oscillation of the base assembly is determined, as shown by box 290. In some examples, the predetermined displacement runout value may be equal to the predetermined home runout value.

[0064] As shown in box 292, the in-situ oscillation of the base assembly is, for example, in-situ oscillation 32 ( Figure 1 The base assembly is compared with a predetermined in-situ wobble value. When the in-situ wobble value is higher than the predetermined in-situ wobble value, the base assembly is adjusted and re-checked, as shown by arrows 294, 296, and 298. As shown by arrows 291 and 293, when the in-situ wobble is lower than the predetermined in-situ wobble value, the semiconductor processing system is qualified for production. It is worth noting that the base assembly can be reworked to address excessive displacement runout and / or displacement wobble found when placed in the fixture, for example by adjusting the profile of the support 24 (e.g., ...). Figure 1 (As shown), this reduces the likelihood of needing to adjust for excessive in-situ bounce and / or in-situ oscillation. In some examples, the predetermined off-situ oscillation value can be equivalent to the predetermined in-situ oscillation value.

[0065] The specific embodiments shown and described are illustrative of the invention and its best mode, and are not intended to limit the scope of these aspects and embodiments in any way. In fact, for the sake of brevity, conventional manufacturing, connection, preparation, and other functional aspects of the system may not be described in detail. Furthermore, the connecting lines shown in the figures are intended to represent exemplary functional relationships and / or physical connections between various elements. Many alternative or additional functional relationships or physical connections may exist in the actual system, and / or may not exist in some embodiments.

[0066] It should be understood that the configurations and / or methods described herein are exemplary in nature, and these specific embodiments or examples should not be considered limiting, as many variations are possible. The particular routines or methods described herein may represent one or more of any number of processing strategies. Therefore, the various actions shown may be performed in the order shown, in another order, or in some cases omitted.

[0067] The subject matter of this disclosure includes all novel and non-obvious combinations and sub-combinations of the various processes, systems and configurations disclosed herein, as well as any and all equivalents thereof.

[0068] List of reference numerals

[0069] 10 base components

[0070] 12-axis

[0071] 14 supports

[0072] 16 bases

[0073] 18 (lower end of shaft)

[0074] 20 (shaft) upper end

[0075] 22 locking slots

[0076] 24-piece bracket

[0077] 26 substrate

[0078] 28 membrane

[0079] 30 in-situ pulsation

[0080] 32 In-situ oscillation

[0081] 34 Semiconductor Processing System

[0082] 36 driver modules

[0083] 38 Displacement jump

[0084] 40 Displacement Jump

[0085] 42 Radial Displacement Measurement

[0086] 44 Axial Displacement Measurement

[0087] 100 Fixtures

[0088] 102 Fixture Arrangement

[0089] 104 base

[0090] 106 turntable

[0091] 108 First Sensor

[0092] 110 Second Sensor

[0093] 112 axis of rotation

[0094] 114 visible light sources

[0095] 116 red light source

[0096] 118 655 nm lighting source

[0097] 120 First Laser Displacement Sensor

[0098] 122 Second Laser Displacement Sensor

[0099] 124 controller

[0100] 126 First base

[0101] 128 First Bracket

[0102] 130-degree surface vibration

[0103] 132 Oscillating Surface

[0104] 134 Second Base

[0105] 136 Second Bracket

[0106] 138 First Handset

[0107] 140 second handle

[0108] 142 First Handle Pair

[0109] 144 Second Handle Pair

[0110] 146 Lower Components

[0111] 148 intermediate components

[0112] 150 Upper Components

[0113] 152 bearing assembly

[0114] 154 Stop section

[0115] 156 sleeve section

[0116] 158 First elastic member

[0117] 160 Second elastic member

[0118] 162 memory

[0119] 164 processor

[0120] 166 device interface

[0121] 168 User Interface

[0122] 170 link

[0123] 172 program modules

[0124] 200 methods

[0125] 210 frames

[0126] 220 frames

[0127] 230 frames

[0128] 232 arrow

[0129] 234 frames

[0130] 236 arrows

[0131] 238 arrows

[0132] 240 frames

[0133] 250 frames

[0134] 252 arrows

[0135] 254 frames

[0136] 256 arrows

[0137] 258 arrows

[0138] 260 frames

[0139] 270 frames

[0140] 280 frames

[0141] 282 frames

[0142] 284 arrows

[0143] 286 frames

[0144] 288 arrows

[0145] 281 arrows

[0146] 290 frames

[0147] 292 frames

[0148] 294 arrows

[0149] 296 frames

[0150] 298 arrows

[0151] 291 arrows

[0152] 293 frames

Claims

1. A fixing device for determining runout and sway in a base assembly, comprising: Base; A turntable, supported on a base and rotatable about a rotation axis, is configured to slidably house a base assembly therein for rotation about the rotation axis; A first sensor, fixed relative to the base and radially offset from the axis of rotation, is configured to determine the displacement runout of the base assembly; and A second sensor, fixed relative to and axially offset from the first sensor, is configured to determine the off-center sway of the base assembly. The turntable includes: The lower component has a bearing device fixed to the base; An intermediate member, rotatably supported on a lower member by a bearing assembly, and having a stop portion arranged along the axis of rotation; and The upper component is fixed to the intermediate component by a sleeve portion that extends about the axis of rotation and extends axially from the stop portion of the intermediate component. The base assembly is releasably rotatably fixed relative to the upper member of the turntable.

2. The fixing device according to claim 1, wherein, The first sensor is a first non-contact sensor, and the second sensor is a second non-contact sensor.

3. The fixing device according to claim 1, wherein, The first sensor includes a first laser displacement sensor, and the second sensor includes a second laser displacement sensor.

4. The fixing device according to claim 3, wherein, At least one of the first laser displacement sensor and the second laser displacement sensor has a spot size between 120 micrometers and 1300 micrometers.

5. The fixing device according to claim 3, wherein, At least one of the first laser displacement sensor and the second laser displacement sensor has (a) a visible illumination source, (b) a red illumination source, or (c) a 655 nm illumination source.

6. The fixing device according to claim 1 further includes at least one handle that extends laterally from the base and is radially offset from the axis of rotation.

7. The fixing device according to claim 1 further includes a base fixed to the base and radially offset from the axis of rotation, wherein at least one of the first sensor and the second sensor is fixed to the base.

8. The fixing device according to claim 7, further comprising a bracket for fixing at least one of the first sensor and the second sensor to the base, the bracket (a) defining a runout surface perpendicular to the axis of rotation, or (b) defining a swing surface parallel to the axis of rotation.

9. The fixing device according to claim 7, wherein, The base is a first base for fixing the first sensor to the base, and the fixing device further includes: A first bracket that secures a first sensor to a first base, the first bracket having a runout surface that supports the first sensor and is perpendicular to the axis of rotation; A second base, which is fixed to the base and offset circumferentially from the first sensor about a rotation axis, the second base fixing the second sensor to the base; and The second bracket secures the second sensor to the second base and defines a swing surface parallel to the axis of rotation, on which the second sensor is supported.

10. The fixing device according to claim 1, wherein, The turntable also includes: A first elastic member, located within the sleeve portion of the upper member and extending about the axis of rotation, is axially offset from the lower member; and The second elastic member is located in the sleeve portion of the upper member and extends about the axis of rotation. The second elastic member is axially offset from the first elastic member on the side of the first elastic member opposite to the lower member along the axis of rotation.

11. The fixing device according to claim 1, wherein, The intermediate component is either bound within the upper component or bound between the lower and upper components of the turntable.

12. The fixing device of claim 1 further includes a base assembly slidably received in the turntable and rotatable therein relative to the base about the axis of rotation.

13. The fixing device according to claim 12, wherein, The base assembly includes a bracket arranged along the rotation axis and axially located between the second sensor and the turntable.

14. The fixing device according to claim 12, wherein, The base assembly includes a base arranged along the rotation axis and axially offset from the turntable, the base being radially overlapped by the first sensor and the base being axially overlapped by the second sensor.

15. The fixing device according to claim 12, wherein, The base assembly includes a shaft having a lower end and an upper end, the lower end of the shaft being slidably received in the turntable, and the upper end of the shaft being disposed between the second sensor and the turntable.

16. The fixing device of claim 12, further comprising a controller configured to communicate with the first sensor and the second sensor, the controller being further configured to communicate with a non-transitory machine-readable storage device to: Multiple radial displacement measurements of the base assembly are received from the first sensor; Receive multiple axial displacement measurements of the base assembly from the second sensor; The off-center runout of the base assembly is determined using multiple radial displacement measurements received from the first sensor; and Multiple axial displacement measurements received from a second sensor are used to determine the off-center sway of the base assembly.

17. A fixing device for determining the runout and sway of a base assembly, comprising: The fixing device as claimed in claim 1, wherein the first sensor is a first non-contact sensor, wherein the second sensor is a second non-contact sensor, wherein the first sensor includes a first laser displacement sensor, and wherein the second sensor includes a second laser displacement sensor; and A base assembly, slidably disposed in the turntable and rotatable therein relative to the base about the axis of rotation, the base assembly comprising: A shaft having a lower end and an upper end, the lower end of the shaft being slidably accommodated in a turntable, and the upper end of the shaft being arranged between a second sensor and the turntable; A bracket arranged along the axis of rotation and axially located between the second sensor and the turntable, the bracket being fixed to the upper end of the shaft; and A base arranged along the axis of rotation and offset axially from the turntable is fixed to the upper end of the shaft by a bracket. The base is radially overlapped by a first sensor and axially overlapped by a second sensor.

18. A method for determining the off-center runout and off-center oscillation of a base assembly, comprising: At the fixing device as described in claim 1 The base assembly is slidably mounted in the turntable to rotate about the axis of rotation; The first sensor is used to determine the displacement runout of the base assembly; The second sensor is used to determine the off-center sway of the base assembly; The displacement runout is compared with a predetermined displacement runout value, and the base assembly is reworked when the displacement runout exceeds the predetermined displacement runout value; The displacement sway is compared with a predetermined displacement sway value, and when the displacement sway exceeds the predetermined displacement sway value, the base assembly is reworked; and When (a) the displacement runout is lower than the predetermined displacement runout value and (b) the displacement swing is lower than the predetermined displacement swing value, the base assembly is disassembled.

19. The method of claim 18, further comprising: Reassemble the base assembly within a semiconductor processing device; Determine the in-situ runout of the base assembly; Determine the in-situ oscillation of the base assembly; The in-situ runout is compared with a predetermined in-situ runout value, and the base assembly is adjusted when the in-situ runout exceeds the predetermined in-situ runout value; as well as The in-situ oscillation is compared with a predetermined in-situ oscillation value, and the base assembly is adjusted when the in-situ oscillation exceeds the predetermined in-situ oscillation value.

Images