A power chip packaging structure

Abstract

The application relates to the field of chip packaging structures, in particular to a power supply chip packaging structure which comprises a packaging shell, rotating plates, a water outlet pipe and a water inlet pipe; the top of the packaging shell is movably connected with the rotating plates; the front end of the packaging shell is internally provided with the water inlet pipe; the rear end of the packaging shell is internally provided with the water outlet pipe; a positioning hole is formed in the top outer wall of the packaging shell; a chip mounting frame is fixedly connected to the bottom inner wall of the packaging shell; and the chip mounting frame is internally provided with a chip main body; pins are arranged on the two sides of the packaging shell; two groups of rotating plates are movably connected on the packaging shell through the arrangement of the protective shells; the protective shells are arranged on the rotating plates; the protective shells are insulators; the protective shells are covered with the bonding material; the breakage of the bonding material is prevented; the chip packaging circuit is prevented from being broken; meanwhile, the rotating plates and the packaging structure form a detachable structure; and the chip main body connecting points in the interior are convenient to overhaul.

Description

Technical Field

[0001] This invention relates to the field of chip packaging structure, specifically a power chip packaging structure. Background Technology

[0002] The housing used to mount semiconductor integrated circuit chips serves to place, fix, seal, and protect the chips, as well as enhance their electrothermal performance. It also acts as a bridge between the internal world of the chip and the external circuitry. The contacts on the chip are connected to the pins of the package housing by wires, and these pins are then connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role in CPUs and other LSI integrated circuits.

[0003] Existing power chip packaging structures have the following main problems: 1. Before packaging, the chip body needs to be fixed and soldered to the pins using bonding materials, and then the chip and pins are fixed by the package shell. During the soldering process, the bonding materials may easily break due to their thinness, leading to open circuits; 2. The chip body often generates heat during operation. Currently, air cooling is used to dissipate heat from the chip package, but this heat dissipation effect is not significant for the heat generated by the chip body itself. Therefore, we propose a power chip packaging structure. Summary of the Invention

[0004] In view of the problems of easy breakage and solder joints in the bonding materials and unsatisfactory heat dissipation of the chip body in the prior art, the present invention provides a power chip packaging structure.

[0005] The technical solution adopted by the present invention to solve its technical problem is: a power chip packaging structure, including a packaging shell, a rotating plate, a water outlet pipe and a water inlet pipe;

[0006] A rotating plate is movably connected to the top of the encapsulation shell, a water inlet pipe is provided on the inner side of the front end of the encapsulation shell, and a water outlet pipe is provided on the inner side of the rear end of the encapsulation shell.

[0007] The top outer wall of the package housing is provided with a positioning hole, and a chip mounting frame is fixedly connected to the bottom inner wall of the package housing. A chip body is provided inside the chip mounting frame.

[0008] The package shell has pins on both sides, the chip body has a sandwich layer on top, the rotating plate has a protective shell fixedly connected to the bottom, and a bonding material is provided between the chip body and the pins.

[0009] Specifically, a rotating pin is provided between the outer casing and the rotating plate outer casing.

[0010] Specifically, a connecting pipe is provided between the water inlet pipe and the water outlet pipe, a rotating shaft is movably sleeved on the inner side wall of the connecting pipe, an impeller is fixedly sleeved on the outer side wall of the front end of the rotating shaft, and a guide fan blade is fixedly sleeved on the outer side wall of the rear end of the rotating shaft.

[0011] Specifically, positioning grooves are provided on the bottom outer wall of the rotating plate and the top outer wall of the encapsulation shell at positions corresponding to the pins.

[0012] Specifically, the interlayer has a hollow structure and is filled with coolant.

[0013] Specifically, the protective shell is made of insulating material.

[0014] The beneficial effects of this invention are:

[0015] (1) The power chip packaging structure of the present invention includes a protective shell, two sets of rotating plates are rotatably connected on the packaging shell, and a protective shell is set on the rotating plates. The protective shell itself is an insulator and covers the bonding material to prevent breakage due to the bonding material being too thin, thus preventing the chip packaging from being open-circuited. At the same time, the rotating plate and the packaging structure form a detachable structure, which facilitates the inspection and maintenance of the internal chip body connection points.

[0016] (2) The power chip packaging structure of the present invention includes a sandwich layer, which is a hollow structure and is filled with a sufficient amount of coolant. Water inlet pipes and water outlet pipes are installed at the front and rear ends of the sandwich layer, respectively. A connecting pipe is set between the water inlet pipe and the water outlet pipe. An impeller is set inside the connecting pipe, and a guide fan blade is set behind the impeller. The guide fan blade is driven to rotate by an external force, which causes the impeller to rotate accordingly (such as the fan in a computer providing rotational power to the guide fan blade). The rotation of the impeller allows the coolant in the sandwich layer to circulate, which dissipates heat from the chip body in the package shell. The protective shell is located at the bottom of the sandwich layer. When the chip body is working, the solder joints and pin solder joints of the chip body are prone to heat generation, which causes the bonding material to heat up as well. By cooling the protective shell, the bonding material in the protective shell is cooled down, which facilitates the heat dissipation of the chip packaging structure. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a schematic diagram of the overall structure of a power chip packaging structure provided by the present invention;

[0019] Figure 2 This is a schematic diagram of the connection structure between the chip body, mounting frame, interlayer, rotating plate, protective shell, and bonding material;

[0020] Figure 3 This is a schematic diagram of the connection structure between the inlet pipe, outlet pipe, and interlayer.

[0021] Figure 4 This is a schematic diagram of the connection structure between the chip and its pins;

[0022] Figure 5 This is a schematic diagram of a half-section of the connecting pipe.

[0023] Figure 6 for Figure 5 A frontal view of the structure.

[0024] In the diagram: 1. Encapsulation shell; 2. Positioning hole; 3. Pin; 4. Water inlet pipe; 5. Rotating shaft; 6. Connecting pipe; 7. Guide fan blade; 8. Protective shell; 9. Impeller; 10. Rotating plate; 11. Chip mounting frame; 12. Interlayer; 13. Bonding material; 14. Chip body; 15. Water outlet pipe. Detailed Implementation

[0025] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0026] like Figures 1-5 As shown, the power chip packaging structure of the present invention includes a packaging shell 1, a rotating plate 10, a water outlet pipe 15, and a water inlet pipe 4.

[0027] A rotating plate 10 is movably connected to the top of the encapsulation shell 1. A water inlet pipe 4 is provided on the inner side of the front end of the encapsulation shell 1, and a water outlet pipe 15 is provided on the inner side of the rear end of the encapsulation shell 1. A positioning hole 2 is opened on the outer wall of the top of the encapsulation shell 1. A chip mounting frame 11 is fixedly connected to the inner wall of the bottom of the encapsulation shell 1. A chip body 14 is provided on the inner side of the chip mounting frame 11. Pins 3 are provided on both sides of the encapsulation shell 1. Positioning grooves are opened on the outer wall of the bottom of the rotating plate 10 and the outer wall of the top of the encapsulation shell 1 at positions corresponding to the pins 3. A rotating pin is provided between the encapsulation shell 1 and the rotating plate 10. A protective shell 8 is fixedly connected to the bottom of the rotating plate 10. The protective shell 8 is made of insulating material.

[0028] First, the chip body 14 is placed in the chip mounting frame 11. Then, each pin 3 is installed in the positioning slot on the package shell 1 and fixed. Next, the bonding material 13 is soldered to the connection point between the chip body 14 and the pin 3 using a packaging machine to ensure that the soldering between each solder point is normal and that surface bridging does not occur. Then, the rotating plate 10 is pressed down so that the rotating plate 10 is stuck on the package shell 1. Because the bottom of the rotating plate 10 is fixedly connected to the protective shell 8, and the protective shell 8 itself is an insulating material, it will not affect the electrical signal transmission between the chip body 14 and the pin 3. At the same time, it can protect the bonding material 13 to prevent it from breaking due to the thinness of the bonding material 13 when subjected to external force. The structure of the rotating plate 10 also facilitates the later inspection and maintenance of the soldering points between the bonding material 13 and the chip body 14 and the pin 3.

[0029] A sandwich layer 12 is provided on the top of the chip body 14. A bonding material 13 is provided between the chip body 14 and the pin 3. A connecting pipe 6 is provided between the water inlet pipe 4 and the water outlet pipe 15. A rotating shaft 5 is movably sleeved on the inner side wall of the connecting pipe 6. An impeller 9 is fixedly sleeved on the outer side wall of the front end of the rotating shaft 5. A guide fan blade 7 is fixedly sleeved on the outer side wall of the rear end of the rotating shaft 5. The sandwich layer 12 is a hollow structure and is filled with coolant.

[0030] The packaged chip is mounted on the corresponding PCB board. Flux is used to fix the chip package to the corresponding mounting area on the PCB board. Then, the pin 3 is soldered to the connection point of the mounting area. The PCB is then installed on the computer. During use, the rotation of the cooling fan in the computer drives the corresponding guide fan blade 7 to rotate. Since the inner side of the guide fan blade 7 is fixedly sleeved with the rotating shaft 5, and the outer wall of the front end of the rotating shaft 5 is fixedly sleeved with the impeller 9, the distance between the impeller 9 and the bottom of the connecting pipe 6 is smaller than the distance between the impeller 9 and the top of the connecting pipe 6, so that the coolant in the interlayer 12 can flow out along the outlet pipe 15 and flow back into the interlayer 12 through the inlet pipe 4, carrying away the heat generated in the package shell 1, which facilitates the heat dissipation of the chip package structure.

[0031] Working principle:

[0032] Packaging process:

[0033] The chip body 14 is installed in the chip mounting frame 11. Then, each set of pins 3 is inserted into the limiting groove of the package shell 1 for installation. The bonding material 13 is soldered to the soldering point of the chip body 14 and the pins 3 by the packaging machine. Then, the rotating plate 10 is covered. The bonding material 13 is protected by the protective shell 8 at the bottom of the rotating plate 10 to prevent it from breaking. At the same time, the rotating plate 10 is easy to open for inspection of the connection point between the chip body 14, the pins 3 and the bonding material 13.

[0034] Heat dissipation process:

[0035] When the chip packaging is in operation, in order to prevent the high temperature generated by the chip during long-term operation from damaging the chip, the cooling fan built into the computer blows the guide fan blade 7. Since the guide fan blade 7 and the impeller 9 are coaxial with the rotating shaft 5, when the guide fan blade 7 rotates, it will drive the impeller 9 to rotate, and the coolant will be reciprocated and circulated. The coolant in the jacket 12 enters and exits the jacket 12 through the water outlet pipe 15 and the water inlet pipe 4, which facilitates heat dissipation inside the chip package.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A power chip packaging structure, characterized in that: It includes a housing (1), two sets of rotating plates (10), a water outlet pipe (15), and a water inlet pipe (4); The top of the encapsulation shell (1) is movably connected to two sets of rotating plates (10), the inner side of the front end of the encapsulation shell (1) is provided with the water inlet pipe (4), and the inner side of the rear end of the encapsulation shell (1) is provided with the water outlet pipe (15). The top outer wall of the encapsulation shell (1) is provided with a positioning hole (2), and the bottom inner wall of the encapsulation shell (1) is fixedly connected with a chip mounting frame (11), and a chip body (14) is provided inside the chip mounting frame (11). The packaging shell (1) has pins (3) on both sides, the chip body (14) has a sandwich layer (12) on top, the rotating plate (10) has a protective shell (8) fixedly connected to the bottom, and a bonding material (13) is provided between the chip body (14) and the pins (3). The protective shell (8) is made of insulating material, and the protective shell (8) is located at the bottom of the interlayer (12) and covers the bonding material (13); The interlayer (12) is a hollow structure, and the interior of the interlayer (12) is filled with coolant; A connecting pipe (6) is provided between the water inlet pipe (4) and the water outlet pipe (15). A rotating shaft (5) is movably sleeved on the inner side wall of the connecting pipe (6). An impeller (9) is fixedly sleeved on the outer side wall of the front end of the rotating shaft (5). A guide fan blade (7) is fixedly sleeved on the outer side wall of the rear end of the rotating shaft (5). The guide fan blade (7) is used to drive the impeller (9) to rotate via the rotating shaft (5) under the drive of external airflow. The distance between the impeller (9) and the bottom of the connecting pipe (6) is smaller than the distance between the impeller (9) and the top of the connecting pipe (6), so that the coolant in the jacket (12) can flow out along the outlet pipe (15) and flow back into the jacket (12) via the inlet pipe (4).

2. The power chip packaging structure according to claim 1, characterized in that: A rotating pin is provided between the encapsulation shell (1) and the rotating plate (10).

3. The power chip packaging structure according to claim 1, characterized in that: The bottom outer wall of the rotating plate (10) and the top outer wall of the encapsulation shell (1) are provided with positioning grooves corresponding to the pins (3).

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