Surface profilometry system

Abstract

This application discloses a surface profile measurement system, comprising: a light source assembly; a confocal microscope assembly including an optical beam splitter; a pinhole device including an array of pinholes, the pinhole device being configured to allow uniform light from the optical beam splitter to pass through the pinhole device to an object under test; a set of incident optics for guiding the uniform light from the pinhole device to the object; and the pinhole device being configured to allow reflected light from the object to pass through the pinhole device to the optical beam splitter; a photodetector for receiving the reflected light from the beam splitter; and a set of detection optics for guiding the reflected light from the beam splitter to the photodetector; the photodetector can detect and resolve the three-dimensional morphology of the object's surface, thereby measuring the surface profile morphology of the object.

Description

Technical Field

[0001] This invention relates to the field of surface profile measurement, and particularly to a surface profile measurement system. Background Technology

[0002] The surface profile of an object is a crucial characteristic for assessing the quality of objects used in many tasks. Particularly in the semiconductor industry, the measurement and inspection of the surface profiles of semiconductor wafers, devices, or substrates are considered an integral part of quality control and quality assurance processes. A traditional method for measuring the surface profile of an object employs confocal microscopy (sensor) technology. Specifically, a confocal sensor is used to measure the height of multiple points on the object's surface, and the relative heights of these points on the surface are combined to estimate the object's surface profile. However, measuring each point on the surface one by one is extremely time-consuming, making the measurement of the surface profile slow. Furthermore, these arbitrary points cannot cover the entire area of ​​the surface, potentially excluding the relevant areas of interest for the surface profile.

[0003] In order to solve or eliminate at least one of the above problems and / or drawbacks, and to provide a more advanced surface profile measurement system. Summary of the Invention

[0004] The technical problem solved by this invention is to provide a surface profile measurement system.

[0005] The technical solution adopted by this invention to solve its technical problem is: a surface profile measurement system, which includes:

[0006] A light source assembly comprising a set of broadband light sources;

[0007] A confocal microscope assembly, comprising:

[0008] An optical beam splitter is used to guide a uniform beam of light from the broadband light source onto the surface of the object being measured.

[0009] A pinhole device comprising an array of pinholes, the pinhole device being configured to allow uniform light from the optical beam splitter to pass through the pinhole device to the object under test;

[0010] An incident optical assembly, including a chromatic aberration mirror assembly, is provided to guide uniform light from the pinhole device to the object under test and to produce a chromatic aberration in the uniform light passing through the incident optical assembly.

[0011] The pinhole device is configured to allow reflected light from the object to pass through the pinhole device to an optical beam splitter, the reflected light containing surface profile information based on chromatic aberration;

[0012] A photodetector assembly, comprising:

[0013] A photodetector is used to receive the reflected light from the optical beam splitter;

[0014] A set of detection optics is used to guide the reflected light from the optical beam splitter to the photodetector;

[0015] Since the spectrum of the light reflected from the surface of the object being measured contains the surface contour information of the object, the photodetector can detect and resolve the three-dimensional shape of the object's surface, thereby measuring the surface contour of the object.

[0016] Furthermore, the broadband light source includes:

[0017] An optical integrating sphere;

[0018] A group of light bulbs is arranged around an optical integrating sphere, which is configured to integrate the light energy from all of the light bulbs; and

[0019] An optical aperture guides the uniform light emitted from the group of bulbs away from the broadband light source.

[0020] Furthermore, the bulbs in this group are broadband white light sources, with a spectral range including red to blue light, or infrared to ultraviolet light.

[0021] Furthermore, the pinhole device includes one or more microlens arrays to work with the pinhole array, such that each pinhole in the pinhole array is paired with at least one first microlens in the microlens array, and the first microlens is configured to focus light from the optical beam splitter onto the individual pinhole.

[0022] Furthermore, the microlens array is positioned on one or both sides of the pinhole device.

[0023] Furthermore, the confocal microscope assembly includes a drive mechanism for planarly moving the pinhole device.

[0024] Furthermore, the drive mechanism is configured to move the pinhole device planarly along the X-axis and / or Y-axis.

[0025] Furthermore, this set of incident optical components includes:

[0026] An objective lens is used to focus light onto an object;

[0027] A second lens barrel for focusing the reflected light from the object onto the pinhole device; and

[0028] A chromatic aberration lens is disposed between the second lens barrel and the objective lens to create chromatic aberration in the light.

[0029] Furthermore, the objective lens and the chromatic aberration lens system are integrated into a single lens assembly.

[0030] Furthermore, the photodetector assembly is a hyperspectral imaging assembly configured to measure the surface morphology of the object, as well as the thickness and surface morphology of the multilayer thin film.

[0031] Furthermore, the hyperspectral imaging component is a single-shot hyperspectral imaging component, capable of measuring the upper surface contour, multilayer film thickness, and surface morphology of the object with a single image.

[0032] Furthermore, the single-shot hyperspectral imaging component includes:

[0033] The photodetector includes a hyperspectral camera;

[0034] An aperture device, wherein the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera;

[0035] A wavelength separation device is disposed between the aperture device and the hyperspectral camera and is used to separate the spectrum of the reflected light;

[0036] This set of detection optical components includes:

[0037] A relay lens is disposed between the optical beam splitter and the aperture device;

[0038] A collimator is positioned between the aperture device and the wavelength separation device.

[0039] A first imaging lens is disposed between the wavelength separation device and the hyperspectral camera and is used to focus the reflected light onto the hyperspectral camera.

[0040] Furthermore, the aperture device includes an array of second pinholes or a slit aperture.

[0041] Furthermore, the aperture device includes an array of second pinholes and an array of second microlenses paired with the array of second pinholes, such that each pinhole is paired with a second microlens, wherein the second microlens is configured to focus the reflected light from the optical beam splitter onto the individual second pinhole.

[0042] Furthermore, the wavelength separation device includes a grating for causing diffraction of reflected light from the surface of the object under test to perform wavelength resolution, or an optical prism for causing dispersion of reflected light from the surface of the object under test to perform wavelength resolution.

[0043] Furthermore: among them

[0044] The light source assembly includes the broadband light source and an optical illumination device for uniformly guiding uniform light from the broadband light source to the confocal microscope system;

[0045] This confocal microscope assembly includes:

[0046] The optical beam splitter and the set of incident optical components;

[0047] The pinhole device includes a pinhole array and one or more arrays of first microlenses coupled to the pinhole array, such that each first pinhole is fitted with at least one first microlens, wherein the first microlens is used to focus light from the optical beam splitter into the individual first pinhole; and

[0048] A drive mechanism for moving the pinhole device along the X-axis and Y-axis planes;

[0049] as well as

[0050] The photodetector assembly includes a color camera used to measure the surface profile of the object.

[0051] Furthermore: among them

[0052] The light source assembly includes the broadband light source and an optical illumination device for uniformly guiding a uniform light beam from the broadband light source.

[0053] This confocal microscope assembly includes:

[0054] The optical beam splitter and the group of incident optical components; and

[0055] The pinhole device includes the pinhole array and the pinhole array coupled with it. The pinhole array includes one or more arrays of first microlenses, such that each pinhole is coupled with at least one first microlens, wherein the first microlens is used to focus light from the optical beam splitter into each of the other first pinholes; and

[0056] This photodetector is a single-shot hyperspectral imaging unit configured to measure the surface profile, multilayer film thickness, and surface contour of an object. The single-shot hyperspectral imaging unit includes:

[0057] A hyperspectral camera; and

[0058] An aperture device, wherein reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera, the aperture device including an array of pinholes and an array of second microlenses matched with the array of pinholes, such that each pinhole is matched with a second microlens, the second microlenses being configured to focus the reflected light from the optical beam splitter into the individual second pinhole.

[0059] Furthermore, it also includes a drive mechanism that moves the pinhole device along the X-axis and Y-axis planes.

[0060] Furthermore: among them

[0061] The light source assembly includes the broadband light source and a cylindrical lens, which is used to focus the uniform light from the broadband light source into a single beam to linearly scan the object;

[0062] This confocal microscope assembly includes:

[0063] The optical beam splitter and the set of incident optical components;

[0064] The pinhole device includes a pinhole array arranged in a single row based on the linear scan and one or more first microlenses coupled to the single row of pinholes, such that each pinhole is coupled to at least one first microlens, and the first microlens is configured to focus light from the optical beam splitter into the individual first pinhole; and

[0065] A drive mechanism that moves the pinhole device parallel to the plane of the single row of pinholes; and

[0066] The photodetector assembly is a single-shot hyperspectral imaging assembly configured to measure the surface profile and subsurface profile of the object. The single-shot hyperspectral imaging assembly includes:

[0067] A hyperspectral camera; and

[0068] An aperture device, wherein reflected light from the beam splitter passes through the aperture device to the hyperspectral camera, the aperture device including a single row of pinholes for the linear scanning and a single row of second microlenses coupled to the single row of pinholes, such that each pinhole is coupled to a second microlens, and the second microlenses are configured to focus the reflected light from the optical beam splitter into the individual second pinhole.

[0069] Furthermore: among them

[0070] The light source assembly includes the broadband light source and a cylindrical lens, which is used to focus the uniform light from the broadband light source into a single beam to linearly scan the object;

[0071] This confocal microscope assembly includes:

[0072] The optical beam splitter and the set of incident optical components;

[0073] The pinhole device includes a pinhole array arranged in a single row based on the linear scan and one or more first microlenses coupled to the single row of pinholes, such that each pinhole is coupled to at least one first microlens, and the first microlens is configured to focus light from the optical beam splitter into the individual first pinhole; and

[0074] A drive mechanism that moves the pinhole device parallel to the plane of the single row of pinholes; and

[0075] The photodetector assembly is a single-shot hyperspectral imaging assembly configured to measure the surface profile and subsurface profile of the object. The single-shot hyperspectral imaging assembly includes:

[0076] A hyperspectral camera; and

[0077] An aperture device, wherein the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera, the aperture device including a slit aperture for the linear scanning.

[0078] Furthermore: among them

[0079] The light source assembly includes the broadband light source and an illumination device for uniformly guiding uniform light from the broadband light source;

[0080] This confocal microscope assembly includes:

[0081] The optical beam splitter and the group of incident optical components; and

[0082] The pinhole device is a Nipkoff disk containing the pinhole array; and

[0083] A drive mechanism for rotating the pinhole device along the Z-axis; and

[0084] The photodetector assembly is a single-shot hyperspectral imaging assembly configured to measure the surface profile and subsurface profile of the object. The single-shot hyperspectral imaging assembly includes:

[0085] A hyperspectral camera; and

[0086] An aperture device, wherein reflected light from an optical beam splitter passes through the aperture device to a hyperspectral camera, the aperture device comprising an array of pinholes and an array of microlenses matched with the pinholes, such that each pinhole is fitted with a second microlens, the second microlens being configured to focus the reflected light from the optical beam splitter into the individual second pinhole.

[0087] Furthermore, the Nipkoff disk includes one or more arrays of first microlenses to work with the pinhole array, such that each pinhole is fitted with at least one first microlens, which is used to focus light from the optical beam splitter into the individual first pinhole.

[0088] Furthermore, the first microlens of the array is disposed on one or both sides of the pinhole device.

[0089] Furthermore, the first pinhole is either round or square.

[0090] The beneficial effects of this invention are: the system and method are applicable to high-speed and accurate surface profile measurement, especially wavy or discontinuous surface profiles, and are therefore suitable for various applications, including high-speed automatic surface profile inspection of semiconductor wafers, integrated circuit loops and precision components. Attached Figure Description

[0091] Figure 1 This is an example schematic diagram of a surface profile measurement system according to some embodiments of this application, wherein the system has a color camera.

[0092] Figure 2 This is an example of a flowchart illustrating a method for measuring the contour of an object surface according to some embodiments of this application.

[0093] Figure 3 This is a first example schematic diagram of the pinhole device of the measurement system according to some embodiments of this application.

[0094] Figure 4 This is a second example schematic diagram of the pinhole device of the measurement system according to some embodiments of this application.

[0095] Figure 5 This is a third example schematic diagram of the pinhole device of the measurement system according to some embodiments of this application.

[0096] Figure 6 This is a schematic diagram illustrating an example of a light source for the measurement system according to some embodiments of this application.

[0097] Figure 7 This is an example schematic diagram of the spectral image of the object captured by the measurement system according to some embodiments of this application.

[0098] Figure 8 This is an example schematic diagram of a measurement system with another configuration architecture according to some embodiments of this application.

[0099] Figure 9 This is an example schematic diagram of another measurement system having a hyperspectral imaging component according to some embodiments of this application.

[0100] Figure 10 This is an example schematic diagram of a hyperspectral image of an object captured by a measurement system according to some embodiments of this application.

[0101] Figure 11 This is an example schematic diagram of another measurement system having a hyperspectral imaging component and configured for linear scanning according to some embodiments of this application.

[0102] Figure 12 This is an example schematic diagram of a hyperspectral image of an object captured by the measurement system using linear scanning according to some embodiments of this application.

[0103] Figure 13 This is an example schematic diagram of another measurement system having a hyperspectral imaging component and a Nipkoff disk according to some embodiments of this application.

[0104] Figure 14 This is a first example schematic diagram of the Nipkoff disk according to some embodiments of this application.

[0105] Figure 15 This is a second exemplary schematic diagram of the Nipkoff disk according to some embodiments of this application.

[0106] Figure 16 This is an example schematic diagram of another measurement system having a color camera according to some embodiments of this application.

[0107] The diagram is labeled as follows: 20, System; 30, Object; 32, Mechanically movable platform; 40, Spectral image; 50, Hyperspectral image; 100, Light source assembly; 110, Broadband light source; 112, Light; 114, Optical aperture; 116, Optical integrating sphere; 120, Kohler illumination device; 122, First tube lens; 200, Confocal microscope assembly; 210, Optical beam splitter; 220, Pinhole device; 222, First pinhole; 224, First microlens; 226, Nipkoff disk; 230, Incident optics assembly; 232, Objective lens; 234, Second tube lens; 236, Chromatic lens; 238, Second objective lens; 240, Drive. 250. Motion mechanism; 300. Transformation device; 302. Photodetector assembly; 310. Single-shot hyperspectral imaging assembly; 312. Photodetector; 314. Color camera; 315. Hyperspectral camera; 320. Detection optical assembly; 322. First imaging lens; 324. Collimator; 326. Relay lens; 330. Aperture device; 332. Second pinhole; 334. Second microlens; 336. Slit aperture; 340. Grating; 500. Observation device; 510. First optical beam splitter; 520. Second optical beam splitter; 530. Eyepiece; 540. Second imaging lens; 550. Camera; R, Red; G, Green; B, Blue. Detailed Implementation

[0108] For the sake of brevity and clarity, the description of embodiments of this disclosure, based on the drawings, pertains to a measurement system for the surface contours of an object. Various aspects of this disclosure are described in conjunction with the embodiments provided herein, and it should be understood that they are not intended to limit the disclosure to these embodiments. Rather, this disclosure is intended to encompass various variations, modifications, and equivalents of the embodiments described herein, which are included within the scope of this disclosure as defined in the appended claims. Furthermore, the detailed description below sets forth specific details to facilitate a thorough understanding of this disclosure. However, those skilled in the art will understand that this disclosure can be practiced without mentioning specific details and / or certain details of specific combinations of aspects of certain embodiments. Some examples do not describe known systems, methods, procedures, and components in detail to avoid unnecessarily obscuring aspects of the embodiments of this disclosure.

[0109] In the embodiments disclosed herein, the same, equal or similar components or corresponding materials appearing in different drawings are labeled with the same component number or symbol.

[0110] References to "one embodiment / example," "another embodiment / example," "some embodiments / examples," "some other embodiments / examples," etc., indicate that the described embodiments / examples may include a particular feature, structure, characteristic, property, component, or limiting element, but not every embodiment / example needs to include these particular features, structures, characteristics, properties, components, or limiting elements. Furthermore, the repeated use of "in one embodiment / example" or "in another embodiment / example" does not necessarily refer to the same embodiment / example.

[0111] The terms “comprising,” “including,” “having,” and similar expressions do not exclude other features / components / steps besides those listed in the embodiments. The definition of certain features / components / steps in different embodiments does not imply that combinations of these features / components / steps cannot be used in one embodiment.

[0112] As used herein, the term "a" means one or more. Unless otherwise specified, " / " is used in diagrams or text to represent "and / or". The term "group" is defined as a non-empty but finite set of components that, according to known mathematical definitions, mathematically represents at least one cardinal number (e.g., in this definition, a group corresponds to a unit, a single state, a single component group, or a group of components). The definition of a particular numerical value or a range of numerical values ​​is understood to include approximate numerical values ​​or approximate ranges. The use of "first", "second", etc., is for illustrative purposes only and is not intended to impose numerical requirements on such related terms.

[0113] Please refer to Figure 1In a representative or exemplary embodiment disclosed herein, a system 20 is used to measure the surface profile of an object 30. The system 20 includes a light source assembly 100, a confocal microscope assembly 200, and a photodetector assembly 300. The system 20 further includes a platform that supports the object 30 during the measurement. The platform can be configured to be displaceable, for example, translating the object 30 to measure different regions or the entire surface profile.

[0114] The light source assembly 100 includes a broadband light source 110, configured to emit a broadband uniform light beam with a continuous wavelength across a wide spectrum. For example, the broadband uniform light is white light covering the wavelengths of the visible color spectrum, and its spectrum can also be extended to the infrared and / or ultraviolet spectral bands.

[0115] The confocal microscope assembly 200 includes a set of incident optics 230, such as lenses and / or mirrors, for guiding the uniform light beam from the pinhole device 220 to the object 30 and through the incident optics 230, which can produce chromatic aberration due to the inclusion of chromatic aberration mirrors in the incident optics 230. Furthermore, the pinhole device 220 is configured to allow reflected light from the object 30 to pass through its first pinhole 222 to the optical beam splitter 210, the reflected light containing spectral information based on chromatic aberration based on the surface profile. More specifically, the first pinhole 222 only allows the reflected light beam focused on the surface of the object 30 to pass through, and this beam then passes through the optical beam splitter 210. The pinhole device 220 blocks all reflected light rays not focused on the object 30 so that these reflected rays do not enter the first pinhole 222.

[0116] The photodetector assembly 300 includes a photodetector 310 that receives the reflected light from the optical beamsplitter 210. The photodetector assembly 300 also includes a set of photodetectors 320 that guide the reflected light from the optical beamsplitter 210 to the photodetector 310. The photodetector 310 receives spectral information of the light reflected from various points on the surface of the object 30 under test, and performs surface profile measurements of the object 30 based on this spectral information. For example, if a specific spectrum is focused onto a point on the surface of the object 30, and its reflected light is focused and passes through a first pinhole 222, the wavelength information of this portion of the reflected light can be used to measure the height of that point. Similarly, the heights of various points spanning the surface profile of the object can also be measured simultaneously.

[0117] In the various implementation cases disclosed herein, Figure 2A method 400 for measuring the surface profile of an object 30 is shown, wherein the method 400 is performed via a system 20. The method 400 includes step 402, which guides uniform light from a broadband light source 110 to the object 30 via an optical beam splitter 210. The method 400 includes step 404, which allows the uniform light from the optical beam splitter 210 to pass through an array of first pinholes 222 of a pinhole device 220 to the object 30. The method 400 includes step 406, which guides the uniform light from the pinhole device 220 to the object 30 via a set of incident optics 230, and generates chromatic aberration as the uniform beam passes through the incident optics 230. The method 400 includes step 408, which allows reflected light from the object 30 to pass through the array of first pinholes 222 to the optical beam splitter 210, the reflected light containing spectral information of the surface profile based on the chromatic aberration. The method 400 includes step 410: guiding the reflected light from the optical beamsplitter 210 to the photodetector 310 via the set of detection optics 320. The method 400 includes step 412: receiving the reflected light from the optical beamsplitter 210 via the photodetector 310. The method 400 includes step 414: measuring the surface profile of the object 30 based on spectral information of the reflected light received by the photodetector 310, the spectral information representing the height across the surface profile.

[0118] As described above, the incident optics 230 transforms the uniform light beam projected from the pinhole device 220 onto the object 30 under test into a chromatic aberration beam, so that the reflected light from the object 30 contains spectral information, such as wavelength, based on the chromatic aberration. More specifically, the set of incident optics 230 causes axial or longitudinal chromatic aberration of the light, resulting in light of different wavelengths from these incident optics 230 being focused at different heights on the surface of the object 30. That is, due to the chromatic aberration, these different wavelengths of light are focused at different heights or depths of the object 30 relative to a reference plane along the surface profile. For example, red light (with a wavelength of approximately 620 nm to 720 nm) is focused at a lower height, blue light (with a wavelength of approximately 460 nm to 500 nm) is focused at a higher height, and green light (with a wavelength of approximately 500 nm to 570 nm) is focused at an intermediate height, all of which are relative to a reference plane.

[0119] Since the height of different points on the surface of the object being measured varies, light of different wavelengths is focused onto points at different heights on the surface profile of the object 30. Reflected light is reflected from the surface of the object 30, and this reflected light, in turn, becomes incident light along the same propagation path. These wavelengths of the reflected light focused on the object 30 pass through the pinhole device 220 to the optical beam splitter 210, while the wavelengths of the reflected light not focused on the object 30 are not focused on the first pinhole 222 and therefore cannot pass through it. In other words, the pinhole device 220 blocks all reflected light not focused on the object 30. Therefore, only the wavelengths of the reflected light reflected from the object 30 pass through the first pinhole 222 to the optical beam splitter 210. The reflected light is then imaged onto a conjugate plane of the pinhole device 220 and received by the photodetector 310. Only wavelengths of reflected light focused across different heights of the surface profile are reflected from the object 30 and received by the photodetector 310. These wavelengths represent the height of the point, and the surface profile can be measured in three dimensions based on these wavelengths. The color spectral image of the surface profile can accurately measure the three-dimensional height profile of the entire measured surface without vertical scanning or moving any part of the system 20.

[0120] Since the pinhole device 220 blocks most of the light incident on its surface, i.e., the area surrounding the first pinhole 222, the pinhole device 220 may include appropriate optical components to minimize or prevent light reflection. For example, light incident on the top surface of the pinhole device 220 may be reflected back to the optical beam splitter 210 and merged with the reflected light from the object 30, potentially affecting the accuracy of the surface profile measurement. These optical components can facilitate focusing light into the first pinhole 222, thereby improving spectral imaging and the measurement of the surface profile.

[0121] like Figure 3As shown, the pinhole device 220 may include an array of one or more first microlenses 224, which are paired with the array of first pinholes 222. For example, the pinhole device 220 includes a first array of first microlenses 224 disposed on top of the first pinholes 222, such that each first pinhole 222 is paired with one of the first microlenses 224 in the first array, and the first microlenses 224 in the first array are configured to focus light from the optical beam splitter 210 into the individual first pinhole 222. The pinhole device 220 may optionally include a second array of first microlenses 224 disposed below the first pinholes 222, such that each first pinhole 222 is paired with one of the first microlenses 224 in the second array, and the first microlenses 224 in the second array are configured to focus reflected light from the object 30 into the individual first pinhole 222. The arrays of first pinholes 222 and first microlenses 224 may be formed separately and combined together, or they may be integrated into a single unit.

[0122] Each of the first pinholes 222 is paired with at least one of the first microlenses 224, and they work together to focus light into the center of the individual first pinhole 222. The first microlenses 224 are specifically matched with the first pinholes 222 so that their central focal points are aligned, thereby focusing the light incident on the first microlenses 224 into the first pinhole 222. In this way, more light energy is concentrated on one or both sides of the pinhole device 220, and the amount of light guided into each first pinhole 222 is increased, thereby improving light efficiency, as conventional confocal microscopes have very low light efficiency. The curved surfaces of the first microlenses 224 can deflect and remove unwanted light incident on their surfaces, thereby improving the quality of light passing through the first pinhole 222.

[0123] like Figure 3 As shown, the first microlenses 224 are arranged together such that they are in contact with each other or have some gaps between them. Since the diameter of the first pinhole 222 is smaller than the diameter of the first microlenses 224, gaps exist between the first pinholes 222. As shown in Figure 4, these gaps are represented by two perpendicular distances P1 and P2, for example, along the X-axis and Y-axis, respectively. By projecting the first pinhole 222 onto the object 30, the first pinhole 222 corresponds to a plurality of independent points on the surface profile of the object 30, and the gaps or distances P1 and P2 between the first pinholes 222 correspond to the intervals between these independent points.

[0124] One advantage of the first pinhole 222 is that it allows for the simultaneous measurement of the height of independent points on the surface profile. These independent points are distributed over at least one sampling area, or in some examples, over approximately the entire area of ​​the surface profile, enabling the system 20 to perform rapid sampling measurements of the sampling area. It should be noted that the number of these independent points depends on the number of the first pinholes 222, such that a larger number of the first pinholes 222 can increase the sampling area to be measured and / or improve the measurement resolution. High-speed sampling measurements of these independent points on the sampling area are beneficial for various practical applications, especially those requiring rapid inspection of a batch of objects 30.

[0125] Since the pinhole device 220 remains stationary during sampling and measurement, the gaps between these individual points are not imaged and measured. To address this, in some embodiments, the confocal microscope assembly 200 may include a drive mechanism 240 for planarly moving the pinhole device 220. Figure 5 As shown, the drive mechanism 240 can be configured to move the pinhole device 220 along the X-axis and / or Y-axis plane. Alternatively, the drive mechanism 240 can be configured to rotate the pinhole device 220 about the Z-axis plane so that the pinhole device 220 remains in the XY plane during rotation. For example, the drive mechanism 240 includes a driver such as a motor or a piezoelectric actuator.

[0126] As the pinhole device 220 moves along the XY plane, the first pinhole 222 and the corresponding point on the surface profile move across the surface profile, allowing light to reach and scan a continuous surface area and substantially the entire surface profile. Substantially all areas of the surface profile can be seamlessly scanned and measured, thus eliminating the risk of excluding areas of interest from the surface profile. Therefore, more detailed measurements of the surface profile can be obtained, resulting in higher quality inspection of the object 30.

[0127] exist Figure 1 In the illustrated embodiment, the system 20 includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300 as described above. The light source assembly 100 includes a broadband light source 110, configured to emit broadband uniform light, such as white light. Figure 6As shown, the broadband light source 110 includes a set of lights 112. The lights 112 can be incandescent lamps or broadband white light-emitting diodes. For example, the incandescent lamp is a halogen lamp, such as a tungsten filament halogen lamp. The lights 112 can be low-power, such as 50 watts, to reduce wasted heat generated by using the system 20. The low-power lights 112 can eliminate the need for fans in cooling equipment, thereby reducing mechanical vibration and power consumption. However, the light source assembly 100 may include a small heat sink to remove any heat generated by the broadband light source 110.

[0128] The broadband light source 110 includes an optical aperture 114 for guiding the uniform light emitted from the light source 112 away from the broadband light source 110. The optical aperture 114 may be circular and configured to control the beam diameter emitted from the broadband light source 110 to the confocal microscope assembly 200. The broadband light source 110 may include an optical integrating sphere 116 configured to integrate the light energy from the light sources 112. The optical integrating sphere 116, known as an Ulbricht sphere, is an optical component having a hollow cavity and an internal reflective coating for uniformly scattering light and reducing light loss. Figure 6 As shown, the group of lights 112 is arranged around the optical integrating sphere 116 so that light from the group of lights 112 is guided into the hollow sphere and toward the internal reflective coating of the optical integrating sphere 116, so that the internal reflective coating reflects the light to the optical aperture 114.

[0129] The broadband light source 110 may include an optical bandpass filter configured to filter out light outside a predetermined wavelength range. The optical bandpass filter is positioned between the group of lights 112 and the optical integrating sphere 116, for example, in the optical aperture 114. For example, the optical bandpass filter may include a dichroic filter or a dielectric mirror. The predetermined wavelength range may correspond to the visible light spectrum, or the region from red to blue light, and the optical bandpass filter allows all visible light to pass through and exit the optical aperture 114. Unwanted light outside the visible light spectrum, such as infrared and ultraviolet light, is blocked by the optical bandpass filter. It should be noted that infrared light is hotter than visible light; by blocking infrared light, less heat is transferred from the optical aperture 114, thereby mitigating thermal damage to the confocal microscope assembly 200.

[0130] The uniform light from the broadband light source 110 can propagate through the optical aperture 114 directly to the confocal microscope assembly 200. Alternatively, the light source assembly 110 may include a Kohler illumination device with one or more lenses disposed between the broadband light source 110 and the confocal microscope assembly 200. Illumination device 120. The Kohler illumination device 120 provides parallel and uniform light to the confocal microscope assembly 200.

[0131] The confocal microscope assembly 200 includes the optical beam splitter 210, the pinhole device 220, and the incident optics assembly 230 as described above. The incident optics assembly 230 includes an objective lens 232 for focusing light onto the object 30, and a second tube lens 234 for focusing reflected light from the object 30 onto the pinhole device 220. The incident optics assembly 230 further includes a chromatic aberration lens 236 disposed between the objective lens 232 and the second tube lens 234 to induce chromatic aberration in the light. The chromatic aberration lens 236 is designed to have specific chromatic aberration characteristics and good linearity. Different chromatic aberration lenses 236 can be used depending on the desired measurement range and resolution. Alternatively, the chromatic aberration lens 236 can be integrated with the objective lens 232 into a single lens assembly. With color difference, light of different wavelengths can be clearly separated, and the different heights of the surface profile can be clearly distinguished, so that the surface profile can be three-dimensionally imaged and measured.

[0132] The photodetector assembly 300 includes the photodetector 310 as described above and the detection optical assembly 320. The detection optical assembly 320 may include a first imaging lens 322 for guiding the reflected light from the optical beam splitter 210 to the photodetector 310. The photodetector 310 may include a color camera 312, which is an image sensor with red-green-blue (RGB) color, such as a CCD or CMOS image sensor. The first imaging lens 322 is configured to focus the reflected light containing the spectral information onto the image sensors of the color camera 312, thereby imaged the spectral information of the reflected light from the surface contour of the object 30 onto the color camera.

[0133] The color camera 312 operates within a spectral range that covers the visible light spectrum and optionally extends to the infrared and / or ultraviolet spectra. For example, the operating spectral range of the color camera 312 may be approximately 380 nm to 1000 nm. An infrared filter may be incorporated into the color camera 312 to exclude infrared and / or near-infrared light. As described above, based on the precise spectral information and wavelength of the reflected light, different heights or depths across the surface profile are imaged in different colors, and the captured spectral image of the surface profile allows for precise measurement of the three-dimensional surface profile, where different heights across the surface profile are represented by different spectral colors in the spectral image. Figure 7 shows an example of an RGB spectral image 40, which includes the corrected RGB curve of the object 30 captured by the color camera 312. The system 20 can be integrated or coupled with an image processing module to generate the surface profile of the object 30 based on the spectral image 40. More specifically, the image processing module calculates the surface profile of the object 30 based on the spectral image 40 received by the photodetector 310, where the color or wavelength of each point (corresponding to the first pinhole 222) represents the height of that point on the surface profile. All points together represent the height variation across the entire surface profile.

[0134] In one embodiment, the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300 are arranged as shown in the first figure. When the system 20 is in use, uniform light from the light source assembly 100 passes through the optical beamsplitter 210 to the object 30, is reflected from the object 30 back to the optical beamsplitter 210, and the optical beamsplitter 210 reflects the light to the photodetector assembly 300. Since the optical beamsplitter 210 is configured to transmit and reflect light (preferably proportionally), the system 20 can have other configuration architectures. As shown in the embodiment of the eighth figure, when the system 20 is in use, light from the light source assembly 100 reaches the optical beamsplitter 210, is reflected to the object 30, is reflected from the object 30 back to the optical beamsplitter 210, and passes through the optical beamsplitter 210 to the photodetector assembly 300.

[0135] In summary, Figure 1 and Figure 8In the illustrated embodiment, the system 20 includes a light source assembly 100, a confocal microscope assembly 200, and a photodetector assembly 300, configured to measure the surface profile of the object 30. The light source assembly 100 includes a broadband light source 110 and a Kohler illumination device 120. The confocal microscope assembly 200 includes an optical beam splitter 210, a pinhole device 220 with a pinhole array, and first microlenses 224 associated with one or more arrays of the pinhole array. The confocal microscope assembly 200 further includes a set of incident optics 230 and a drive mechanism 240 for moving the pinhole device 220 along the X-axis and Y-axis planes. The incident optics 230 include an objective lens 232, a second barrel lens 234, and a chromatic aberration lens 236. The photodetector assembly 300 includes the photodetector 310 having the color camera, and further includes the set of detection optics 320 having a first imaging lens 322 that focuses the reflected light onto the color camera 312.

[0136] exist Figure 9 In the illustrated embodiment, system 20 is substantially similar to the embodiment of the first figure, except for the photodetector assembly 300. The descriptions of various aspects of the embodiment of the first figure above can be applied in the same or similar manner to the embodiments shown above. Figure 9 The embodiments are as follows, and vice versa. The photodetector 310 includes a hyperspectral camera 314, and the photodetector assembly 300 can be used as a one-shot hyperspectral imaging assembly 302. The hyperspectral camera 314 can capture the spectral information of the reflected light in greater detail and obtain the hyperspectral information of the surface profile. Furthermore, the hyperspectral camera 314 is a one-shot or single-shot hyperspectral camera, capturing only one image to obtain the hyperspectral information of the surface profile. The hyperspectral camera 314 can capture the hyperspectral information in full color or monochrome. For example, the hyperspectral camera 314 is a high-resolution full-color or monochrome camera.

[0137] Normal spectral imaging or multispectral imaging typically captures and processes images using three broad spectral bands corresponding to RGB colors, because the human eye can see most of the colors of visible light within these three broad spectral bands. Hyperspectral imaging can capture and process images of the electromagnetic spectrum from infrared to ultraviolet, or even including X-rays. Compared to the typical RGB bands, hyperspectral imaging divides the electromagnetic waves into more bands and covers a wide wavelength range with fine wavelength resolution. Normal spectral imaging measures separated RGB spectral bands, but conversely, hyperspectral imaging measures multiple consecutive spectral bands. The hyperspectral camera 314 can capture and process images of the object 30 within a very large number of fine wavelengths, and the hyperspectral information can be split into a very large number of colors corresponding to these fine wavelengths.

[0138] The single-shot hyperspectral imaging assembly 302 includes an aperture device 330 through which reflected light from the optical beam splitter 210 passes to the hyperspectral camera 314. The aperture device 330 includes at least one aperture or an opening to allow light to pass through. The single-shot hyperspectral imaging assembly 302 includes a wavelength differentiation device disposed between the aperture device 330 and the hyperspectral camera 314 to separate the reflected light, thereby allowing for clearer differentiation of the reflected light through spectral information such as wavelength. The wavelength differentiation device may be a grating that diffracts the reflected light or an optical prism that scatters the reflected light.

[0139] In such Figure 9In the single-shot hyperspectral imaging assembly 302 shown, the detection optics 320 includes a first imaging lens 322, which is positioned in front of the hyperspectral camera 314 and behind the grating 340. The first imaging lens 322 is configured to focus the reflected light from the grating 340 onto the image sensor of the hyperspectral camera 314, so that the spectral information of the reflected light from the surface contour of the object 30 is imaged onto the hyperspectral camera 314. The detection optics 320 further includes a collimator 324, positioned between the aperture device 330 and the grating 340. The collimator 324 is a device, such as a curved lens or mirror, that narrows the light beam and aligns it to a specific direction. It should be noted that the collimator 324 aligns the reflected light from the aperture device 330 with the grating 340, which more clearly distinguishes the light into its continuous wavelength spectrum. The detection optics 320 may further include a relay lens 326 disposed between the optical beam splitter 210 and the aperture device 330. The relay lens 326 is configured to project the surface profile image formed on the pinhole device 220 onto the aperture device 330 via the optical beam splitter 210.

[0140] Based on the spectral information of the reflected light, the first imaging lens 322 projects the diffracted wavelength of the reflected light into the hyperspectral camera 314 at separate wavelengths. Due to the effect of the first microlenses 224 increasing the amount of light guided to the first pinhole 222, image sensitivity is improved, and the full spectrum of the surface profile of the object 30 is imaged by the hyperspectral camera 314. Figure 10 This example illustrates a hyperspectral image 50 of an object 30 captured by the single-shot hyperspectral imaging component 302. The system 20 can be integrated or coupled with an image processing module to generate the surface profile of the object 30 based on the hyperspectral image 50. Because it is a full-spectral 3D surface profile, in addition to the surface profile, the subsurface profiles and multilayer thicknesses of the object 30 surface can be precisely measured and inspected. Hyperspectral imaging can therefore measure the full spectrum of the surface profile in detail at high resolution, and the system 20 has wide applications in various fields, not limited to online inspection and the semiconductor, electronics, precision engineering, optics, biomedical agriculture, and food industries.

[0141] exist Figure 9In the illustrated embodiment, the aperture device 330 includes an array of second pinholes 332 similar to the first pinhole 222 of the pinhole device 220. The aperture device 330 may further include an array of second microlenses 224 paired with the array of second pinholes 332. Specifically, the aperture device 330 includes the array of second microlenses 224 disposed in front of the second pinholes 332, i.e., between the optical beam splitter 210 and the second pinholes 332, for example, one second microlens 224 paired with each second pinhole 332. The array of second pinholes 332 and the array of second microlenses 224 may be formed separately and coupled together, or they may be integrated into a single unit. Each second pinhole 332 is paired with one second microlens 224, and they cooperate to focus light onto the center of the individual second pinhole 332.

[0142] In summary, Figure 9 In the illustrated embodiment, the system 20 includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300. The photodetector assembly 300 is a single-shot hyperspectral imaging assembly 302, configured to measure the surface profile and subsurface profile including multilayer film thickness of the object 30. The light source assembly 100 includes the broadband light source 110 and the Kohler illumination device 120. The confocal microscope assembly 200 includes the optical beam splitter 210, the pinhole device 220 having the pinhole array, and the first microlens 224 coupled to one or more arrays of the pinhole array. The confocal microscope assembly 200 further includes the incident optics 230 and the drive mechanism 240 for moving the pinhole device 220 along the X-axis and Y-axis planes. However, the system 20 can exclude or stop the drive mechanism 240 to perform rapid sampling measurements of the object 30. The incident optics 230 includes the objective lens 232, the second barrel lens 234, and the chromatic aberration lens 236. The single-shot hyperspectral imaging assembly 302 includes the photodetector 310 with the hyperspectral camera 314, the aperture device 330 with an array of first microlenses 234 coupled with the array of the second pinhole 332, and the wavelength differentiation device. The single-shot hyperspectral imaging assembly 302 further includes the set of detection optics 320 with the relay lens 326, the collimator 324, and the first imaging lens 322.

[0143] exist Figure 1 and Figure 9 In one embodiment, the system 20 is configured to scan the 2D area of ​​the surface contour of the object 30. Specifically, the array of the first pinholes 222 of the pinhole device 220 is arranged across a 2D plane. Figure 11In one embodiment, the system 20 is configured to perform a linear scan of the surface contour of the object 30. (The above...) Figure 1 and Figure 9 The various aspects can be similarly or analogously applied to the embodiments of Figure 11, and vice versa. Figure 11 In some embodiments, the first pinhole 222 and similarly the first microlenses 224 can be arranged in a single row (one-dimensional arrangement) to replace the two-dimensional array of first pinholes 222. Similarly, for the pinhole device 220, the second pinhole 332 and similarly the first microlenses 224 can be arranged in a single row (one-dimensional arrangement) to replace the two-dimensional array of second pinholes 332. Alternatively, the single row of second pinholes 332 can be as follows: Figure 11 The one-dimensional slit aperture 336 shown is used instead.

[0144] Alternatively, the optical aperture 114 of the broadband light source 110 may be a linear aperture corresponding to the single row of first pinholes 222 / second pinholes 332. The Kohler illumination device 120 may also replace this with a first barrel lens 122 that focuses the broadband beam into a linear beam. The drive mechanism 240 for planarly moving the pinhole device 220 may be configured to move the pinhole device 220 in a direction parallel to the single row of first pinholes 222, to cover the gaps or spacing between the first pinholes 222. For example, the row of first pinholes 222 may be arranged across the surface profile along the X-axis, and the drive mechanism 240 may be configured to move the pinhole device 220 along this X-axis. The drive mechanism 240, in conjunction with a movable platform supporting the object 30, measures the entire surface profile of the object 30. For example, the drive mechanism 240 moves the first pinholes 222 along the X-axis while the platform moves the object 30 along the Y-axis. As the linear beam of light moves across the surface profile, the photodetector 310 (e.g., the color camera 312 or the hyperspectral camera 314) captures a line of spectrum at a time. Figure 12 This example illustrates a hyperspectral image of the object 30 in the form of a continuous spectrum, captured by the hyperspectral camera 314.

[0145] In summary, Figure 11In one embodiment, the system 20 is configured to linearly scan the object 30 and includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300, which is the single-shot hyperspectral imaging assembly 302. The light source assembly 100 includes the broadband light source 110 and the first telescope lens 122. The first telescope lens 122 focuses the uniform light from the broadband light source 110 into a linear beam for linearly scanning the object 30. The confocal microscope assembly 200 includes the optical beam splitter 210, the pinhole device 220 having a single-row pinhole array for linear scanning, and microlenses 234 arranged in conjunction with one or more arrays of the single-row pinhole array. The confocal microscope assembly 200 further includes the set of incident optics 230 and the drive mechanism 240. The drive mechanism 240 is used to planarly move the pinhole device 220 parallel to the single-row first pinhole 222, for example, along the X-axis. The incident optics 230 includes the objective lens 232, the second barrel lens 234, and the chromatic aberration lens 236. The single-shot hyperspectral imaging assembly 302 includes the photodetector 310 of the hyperspectral camera 314, the aperture device 330 with the slit aperture 336 for linear scanning, and the wavelength separation device. Alternatively, the aperture device 330 includes a single row of second pinholes 332 for linear scanning and a single row of second microlenses 224 paired with the single row of second pinholes 332. The single-shot hyperspectral imaging assembly 302 further includes a set of detection optics 320, which includes a relay lens 326, a collimator 324, and a first imaging lens 322.

[0146] exist Figure 13 In the illustrated embodiment, apart from the pinhole device 220, the system 20 is generally similar to... Figure 9 The illustrated embodiment. However, the above... Figure 1 , Figure 9 and Figure 11 The aspects of the illustrated embodiments can be applied in the same or similar way to... Figure 13 The embodiments are as follows, and vice versa. In Figure 13In one embodiment, the pinhole device 220 is a Nipkow disk 226. The Nipkow disk 226 is a scanning disk with equidistant, circular or square first pinholes 222. The drive mechanism 240 is configured to rotate the Nipkow disk 226 about the Z-axis plane. Preferably, the first pinholes 222 are positioned from an outer radial point of the Nipkow disk 226 toward its center to form a single-turn spiral, facilitating the sequential scanning of the first pinholes 222 in a circular pattern as the drive mechanism 240 rotates the Nipkow disk 226. As described above, when the Nipkow disk 226 rotates, the points corresponding to the first pinholes 222 on the surface contour of the object 30 are moved and pass through the surface contour, thereby scanning and measuring a continuous surface area of ​​the surface contour.

[0147] exist Figure 14 In one embodiment, the Nipkoff disk 226 further includes a first array of first microlenses 224 disposed on top of the first pinhole 222. For example... Figure 15 As shown, the Nipkoff disk 226 may further include a second array of first microlenses 224 disposed below the first pinhole 222, i.e., the array of first pinholes 222 is located between the first array and the second array of first microlenses 224. Each first pinhole 222 is paired with at least one first microlens 224, and the first microlens 224 is configured to focus light into the individual first pinhole 222.

[0148] In summary, Figures 13 to 15In one embodiment, the system 20 includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300. The photodetector assembly 300 is the single-shot hyperspectral imaging assembly 302. The light source assembly 100 includes the broadband light source 110 and the Kohler illumination device 120. The confocal microscope assembly 200 includes the optical beam splitter 210 and the pinhole device 220. The pinhole device 220 is a Nipkoff disk 226 having the pinhole array. The Nipkoff disk 226 may further include first microlenses 224 that are coupled to one or more arrays of the pinhole array. The confocal microscope assembly 200 further includes a set of incident optics 230 and a drive mechanism 240 for rotating the pinhole device 220 along the Z-axis. The set of incident optics 230 includes an objective lens 232, a second barrel lens 234, and a chromatic aberration lens 236. The single-shot hyperspectral imaging assembly 302 includes a photodetector 310 with the hyperspectral camera 314, an aperture device 330 with the second pinhole 332 array, an array of second microlenses 224 in conjunction with the second pinhole 332 array, and a wavelength separation device. The single-shot hyperspectral imaging assembly 302 further includes a set of detection optics 320, which includes a relay lens 326, a collimator 324, and a first imaging lens 322.

[0149] exist Figure 16 In one embodiment, the system 20 includes the light source assembly 100, the confocal microscope assembly 200, and the photodetector assembly 300 as described above. The light source assembly 100 includes the broadband light source 220 and the Kohler illumination device 120. Although it can be understood that the photodetector assembly 300 may be the single-shot hyperspectral imaging assembly 302, the photodetector assembly 300 includes the color camera 312 and the first imaging lens 322.

[0150] The confocal microscope assembly 200 includes an optical beam splitter 210, a pinhole device 220 in the form of a Nipkoff disk 226, and a drive mechanism 240 for rotating the Nipkoff disk 226. The confocal microscope assembly 200 further includes a second tube lens 234, a chromatic aberration lens 236, and an objective lens 232 for cooperating in chromatic focusing of light onto the object 30. The object 30 is supported on a movable, mechanically movable platform 32. For example, the mechanically movable platform 32 is coupled to or integrated with actuators such as motors and piezoelectric actuators. These actuators can move the mechanically movable platform 32 along at least one of the XYZ axes and / or rotate the mechanically movable platform 32 about at least one of the XYZ axes.

[0151] exist Figure 16In the illustrated embodiment, the incident optics assembly 230 includes a first objective lens 232 and a second objective lens 238. The confocal microscope assembly 200 further includes a switching device or stage 250 supporting the first objective lens 232 and the second objective lens 238. The switching device 250 may include a driver, such as a motor or piezoelectric driver, and may be operable between the first objective lens 232 and the second objective lens 238. For example, the first objective lens 232 may have a higher magnification while the second objective lens 238 has a lower magnification. Furthermore, the incident optics assembly 230 may include multiple objectives, which can be switched between each other via the switching device 250, wherein these objectives may have different magnifications to facilitate selection of measurement performance.

[0152] Although the three-dimensional surface profile measurement system 20 is mainly used for online high-speed measurement and inspection, it can also be used as a stand-alone measurement system for sampling measurement. Figure 16 Example of this independent measurement system 20.

[0153] As described above, the system 20 includes the broadband light source 110, the Kohler illumination device 120, and the optical beam splitter 210. The optical beam splitter 210 guides uniform illumination light to the surface of the Nipkoff disk 226. Some light is blocked by the Nipkoff disk 226, while some light passes through the first pinhole 222 of the Nipkoff disk 226. The light from the first pinhole 222 passes through the second barrel lens 234, the chromatic aberration lens 236, and finally is focused by the objective lens 232 onto the surface of the object 30 mounted on the mechanically movable platform 32.

[0154] An observation device 500 is positioned between the objective lens 232 and the second lens barrel 234 to observe and select the area of ​​the surface profile to be examined. The observation device 500 includes a first optical beam splitter 510, a second optical beam splitter 520, an eyepiece 530, a second imaging lens 540, and a camera 550. The surface profile of the object 30 is imaged through the objective lens 232 and reflected by the first and second optical beam splitters 510 and 520. The image can be imaged through the second imaging lens 540 and the camera 550. The image of the object 30 can also be observed directly through the eyepiece 530 with the naked eye. The observation device 500 can be moved in for observation and moved out for three-dimensional surface profile measurement.

[0155] As described in the various embodiments above, the system 20 and method 400 measure the surface profile of the object 30 by capturing a single image of the surface profile and generating the surface profile of the object 30 using spectral analysis. The light source assembly 100 provides uniform broadband light to the confocal microscope assembly 200 and the photodetector assembly 300 to image the object 30. The confocal microscope assembly 200 generates and collects spectral information of the surface profile, and the photodetector assembly 300 records spectral information of the spectral image of the surface profile. The system 20 can be integrated or coupled with an image processing module to generate the surface profile of the object 30 based on the spectral image, such as the spectral image 40 or the hyperspectral image 50 described above. For example, the hyperspectral image 50 can be used to examine the subsurface profiles and surface layer thickness of the object 30, in addition to the surface profile.

[0156] This spectral analysis is based on the chromatic aberration principle of broadband uniform light passing through the confocal microscope assembly 200. This chromatic aberration of the uniform light produces spectral information representing the height of the surface profile with more distinct wavelengths, and the surface profile can be accurately measured according to these wavelengths without the need for vertical scanning. Compared to slow, traditional point-to-point measurement methods, this system 20 achieves high-speed surface profile measurement due to the pinhole device 220, such as the Nipkoff disk 226. The entire surface of the object 30 can be seamlessly scanned and measured, thereby eliminating the risk of excluding areas of interest from the object 30 and enabling higher-quality inspection of the object 30.

[0157] Therefore, the system 20 and method 40 are applicable to high-speed and accurate surface profile measurement, especially wavy or discontinuous surface profiles, thus making them suitable for a variety of applications, including high-speed automatic surface profile inspection of semiconductor wafers, integrated circuit loops and precision components.

[0158] Referring to the figures, embodiments of the system 20 and method 400 for measuring the surface profile of an object, as disclosed herein, are described in detail above. These embodiments are not intended to limit the disclosure to specific representative examples, but are merely illustrative examples of non-limiting nature. This disclosure addresses at least one of the problems and deficiencies of the aforementioned known art. While only some embodiments are disclosed herein, those skilled in the art will understand that various changes and / or modifications can be made to the disclosed embodiments without departing from the scope of this disclosure. Therefore, the scope of this disclosure and the appended claims are not limited to the embodiments disclosed herein.

Claims

1. A surface profile measurement system, characterized in that: The system includes: A light source assembly comprising a set of broadband light sources; A confocal microscope assembly, comprising: An optical beam splitter is used to guide a uniform beam of light from the broadband light source onto the surface of the object being measured. A pinhole device comprising a first pinhole array, the pinhole device being configured to allow uniform light from the optical beam splitter to pass through the pinhole device to the object under test; An incident optical assembly including a chromatic aberration mirror group for guiding the uniform light from the pinhole device to the object under test and causing a chromatic aberration in the uniform light passing through the incident optical assembly; The pinhole device is configured to allow reflected light from the object under test to pass through the pinhole device to the optical beam splitter, the reflected light containing surface profile information based on the chromatic difference; A photodetector assembly, comprising: A photodetector is used to receive the reflected light from the optical beam splitter; A set of detection optics is used to guide the reflected light from the optical beam splitter to the photodetector; In this process, since the spectrum of the light reflected from the surface of the object being measured contains the surface contour information of the object, the photodetector detects and resolves the three-dimensional shape of the object's surface, thereby measuring the surface contour of the object. The broadband light source includes: An optical integrating sphere; A group of light bulbs is arranged around an optical integrating sphere, which is configured to integrate all the light energy from the group of light bulbs; and An optical aperture guides the uniform light emitted from the group of bulbs away from the broadband light source; The pinhole device includes one or more microlens arrays to work with the first pinhole array, such that each first pinhole in the first pinhole array is paired with at least one first microlens in the microlens array, and the first microlens is configured to focus light from the optical beam splitter onto the individual first pinhole. This set of incident optical components includes: An objective lens is used to focus light onto the object being measured. A second lens barrel for focusing the reflected light from the object onto the pinhole device; and A chromatic aberration lens is disposed between the second lens barrel and the objective lens to cause the light to produce the chromatic aberration. The photodetector assembly is a hyperspectral imaging assembly configured to measure the three-dimensional morphology of the object's surface, as well as the thickness and surface morphology of the multilayer thin film. The hyperspectral imaging component is a single-shot hyperspectral imaging component, configured to measure the multilayer film thickness and surface morphology of the object with a single photograph. The single-shot hyperspectral imaging component includes: The photodetector includes a hyperspectral camera; An aperture device, wherein the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera; A wavelength separation device is disposed between the aperture device and the hyperspectral camera and is used to separate the spectrum of the reflected light; This set of detection optical components includes: A relay lens is disposed between the optical beam splitter and the aperture device; A collimator is positioned between the aperture device and the wavelength separation device. A first imaging lens is disposed between the wavelength separation device and the hyperspectral camera and is used to focus the reflected light onto the hyperspectral camera.

2. The surface profile measurement system as described in claim 1, characterized in that: The bulbs in this group are white light components, and their spectral range includes red to blue light, or infrared to ultraviolet light.

3. The surface profile measurement system as described in claim 2, characterized in that: The microlens array is positioned on one or both sides of the pinhole device.

4. The surface profile measurement system according to any one of claims 1 to 3, characterized in that: The confocal microscope assembly includes a drive mechanism for planarly moving the pinhole device.

5. The surface profile measurement system as described in claim 4, characterized in that: The drive mechanism is configured to move the pinhole device planarly along the X-axis and / or Y-axis.

6. The surface profile measurement system as described in claim 5, characterized in that: The objective lens and the chromatic aberration lens are integrated into a single lens assembly.

7. The surface profile measurement system as described in claim 1, characterized in that: The aperture device includes an array of second pinholes or a slit aperture.

8. The surface profile measurement system as described in claim 7, characterized in that: The aperture device includes an array of second pinholes and an array of second microlenses paired with the array of second pinholes, such that each second pinhole is paired with a second microlens, wherein the second microlens is configured to focus the reflected light from the optical beam splitter onto the individual second pinhole.

9. The surface profile measurement system as described in claim 1, characterized in that: The wavelength separation device includes a grating for causing diffraction of reflected light from the surface of the object under test to perform wavelength resolution, or an optical prism for causing dispersion of reflected light from the surface of the object under test to perform wavelength resolution.

10. The surface profile measurement system as described in claim 1, characterized in that: in The light source assembly includes the broadband light source and an optical illumination device for uniformly guiding uniform light from the broadband light source to the confocal microscope system; This confocal microscope assembly includes: The optical beam splitter and the set of incident optical components; and a drive mechanism for moving the pinhole device along the X-axis and Y-axis planes; as well as The photodetector assembly includes a color camera used to measure the surface profile of the object.

11. The surface profile measurement system as described in claim 7, characterized in that: in The light source assembly includes the broadband light source and an optical illumination device for uniformly guiding a uniform light beam from the broadband light source. This confocal microscope assembly includes: The optical beam splitter and the set of incident optical components; The photodetector assembly is a single-shot hyperspectral imaging assembly configured to measure the surface profile and subsurface profile of the object under test. The single-shot hyperspectral imaging assembly includes: A hyperspectral camera; and An aperture device, wherein reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera, the aperture device including an array of second pinholes and an array of second microlenses matched with the array of second pinholes, such that each second pinhole is matched with a second microlens, the second microlenses being configured to focus the reflected light from the optical beam splitter into the individual second pinhole.

12. The surface profile measurement system as described in claim 11, characterized in that: It also includes a drive mechanism that drives the pinhole device along the X-axis and Y-axis planes.

13. The surface profile measurement system as described in claim 1, characterized in that: in The light source assembly includes the broadband light source and a cylindrical lens, which is used to focus the uniform light from the broadband light source into a single beam to linearly scan the object; This confocal microscope assembly includes: The optical beam splitter and the set of incident optical components; The pinhole device includes a first pinhole array arranged in a single row based on the linear scan and a first microlens coupled to one or more arrays of the first pinholes in the single row, such that each first pinhole is coupled to at least one first microlens, and the first microlens is configured to focus light from the optical beam splitter into the individual first pinhole. and A drive mechanism moves the pinhole device parallel to the plane of the first pinhole in the single row; as well as The photodetector assembly is a single-shot hyperspectral imaging assembly configured to measure the surface profile and subsurface profile of the object. The single-shot hyperspectral imaging assembly includes: A hyperspectral camera; and An aperture device is provided, wherein reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera. The aperture device includes a single row of second pinholes for linear scanning and a single row of second microlenses coupled to the single row of second pinholes, such that each second pinhole is coupled to a second microlens, and the second microlens is configured to focus the reflected light from the optical beam splitter into the individual second pinhole.

14. The surface profile measurement system as described in claim 1, characterized in that: in The light source assembly includes the broadband light source and a cylindrical lens, which is used to focus the uniform light from the broadband light source into a single beam to linearly scan the object; This confocal microscope assembly includes: The optical beam splitter and the set of incident optical components; The pinhole device includes a first pinhole array arranged in a single row based on the linear scan and a first microlens coupled to one or more arrays of the first pinholes in the single row, such that each first pinhole is coupled to at least one first microlens, and the first microlens is configured to focus light from the optical beam splitter into the individual first pinhole. and A drive mechanism moves the pinhole device parallel to the plane of the first pinhole in the single row; as well as The photodetector assembly is a single-shot hyperspectral imaging assembly configured to measure the surface profile and subsurface profile of the object. The single-shot hyperspectral imaging assembly includes: A hyperspectral camera; and An aperture device, wherein the reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera, the aperture device including a slit aperture for the linear scanning.

15. The surface profile measurement system as described in claim 1, characterized in that: in The light source assembly includes the broadband light source and an illumination device for uniformly guiding uniform light from the broadband light source; This confocal microscope assembly includes: The optical beam splitter and the group of incident optical components; and The pinhole device is a Nipkoff disk containing the pinhole array; and A drive mechanism for rotating the pinhole device along the Z-axis; as well as The photodetector assembly is a single-shot hyperspectral imaging assembly configured to measure the surface profile and subsurface profile of the object. The single-shot hyperspectral imaging assembly includes: A hyperspectral camera; and An aperture device, wherein reflected light from the optical beam splitter passes through the aperture device to the hyperspectral camera, the aperture device including an array of second pinholes and an array of second microlenses matched with the array of second pinholes, such that each second pinhole is matched with a second microlens, the second microlenses being configured to focus the reflected light from the optical beam splitter into the individual second pinhole.

16. The surface profile measurement system as described in claim 15, characterized in that: The Nipkoff disk includes one or more arrays of first microlenses to work with the array of first pinholes, such that each first pinhole is fitted with at least one first microlens, which is used to focus light from the optical beam splitter into the individual first pinhole.

17. The surface profile measurement system as described in claim 16, characterized in that: The first microlens of the microlens array is placed on one or both sides of the pinhole device.

18. The surface profile measurement system according to any one of claims 15 to 17, characterized in that: The first pinhole is either round or square.

Images