Process gas suction structure and exhaust gas treatment device

Abstract

Provided is a processing gas suction structure and exhaust gas treatment device capable of preventing generation of a product from a processing gas due to a decrease in temperature. The processing gas suction structure (100) includes: a double-layer pipe structure body (101); and a heating device (102) that heats the double-layer pipe structure body (101). The double-layer pipe structure body (101) includes: a processing gas flow path portion (105) through which a processing gas flows; and a partition portion (106) that is disposed on the outer side of the processing gas flow path portion (105).

Description

Technical Field

[0001] This invention relates to a gas intake structure and an exhaust gas treatment device. Background Technology

[0002] Vacuum pump units are widely used as manufacturing equipment in semiconductors, liquid crystal displays, solar panels, and LEDs. In these manufacturing processes, a vacuum pump is connected to a vacuum chamber, and the pump is used to draw in the process gas introduced into the vacuum chamber.

[0003] The gas drawn in by the vacuum pump may contain harmful flammable gases such as silane (SiH4), dichlorosilane (SiH2Cl2), and ammonia (NH3), or halogen-based, difficult-to-decompose gases such as NF3, ClF3, SF6, CHF3, C2F6, and CF4. Therefore, such gases cannot be directly released into the atmosphere. Conventionally, vacuum pump devices have included a decontamination unit (an example of an exhaust gas treatment device) downstream of the vacuum pump to treat the drawn-in gas. Known methods for gas decontamination include wet methods, which remove foreign matter and water-soluble components by contacting the gas with a liquid, and combustion methods, which involve burning the gas.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-211100

[0007] The technical problem that the invention aims to solve

[0008] In wet scrubbing apparatuses, a drop in temperature may cause byproducts to form from the treated gas in the intake section, which then adheres to the intake section. This can lead to malfunctions in the scrubbing apparatus and reduced treatment efficiency of the treated gas. Summary of the Invention

[0009] Therefore, the object of the present invention is to provide a structure and an exhaust gas treatment device that can prevent the intake of processed gas containing byproducts due to temperature drop.

[0010] Technical means for solving technical problems

[0011] In one embodiment, a gas intake structure is provided, applicable to an exhaust gas treatment apparatus for rendering the gas harmless by contacting it with a liquid. The gas intake structure includes: a double-walled tube structure; and a heating device for heating the double-walled tube structure. The double-walled tube structure includes: a gas flow path for the gas to flow through; and a partition disposed outside the gas flow path.

[0012] In one embodiment, the processing gas intake structure includes a wall structure connected to the double-walled tube structure, and the heating device includes: a first heating structure for heating a first heating space formed between the processing gas flow path and the partition; and a second heating structure for heating a second heating space formed between the partition and the wall structure.

[0013] In one embodiment, the first heating structure includes at least one of a first inactive gas supply structure and a heater disposed in the first heating space, wherein the first inactive gas supply structure supplies heated inactive gas to the first heating space, and the second heating structure includes at least one of a second inactive gas supply structure and a heater disposed in the second heating space, wherein the second inactive gas supply structure supplies heated inactive gas to the second heating space.

[0014] In one embodiment, the double-walled tube structure includes: a throttling section for throttling the flow path of inactive gas supplied from the first inactive gas supply structure through the first heating space; and a throttling section for throttling the flow path of inactive gas supplied from the second inactive gas supply structure through the second heating space.

[0015] In one embodiment, a gas intake structure is provided, applicable to an exhaust gas treatment device for rendering the gas harmless by contacting it with a liquid. The gas intake structure includes: an annular flow path structure; and a heating device for heating the annular flow path structure, the annular flow path structure comprising: a gas flow path for the gas to flow through; and an annular serrated flow path disposed outside the gas flow path.

[0016] In one embodiment, the serrated flow path includes: a first annular protrusion formed on the outer surface of the processing gas flow path; and a second annular protrusion extending toward the outer surface of the processing gas flow path.

[0017] In one embodiment, the heating device includes an inactive gas supply structure that supplies heated inactive gas to the serrated flow path.

[0018] In one embodiment, an exhaust gas treatment apparatus is provided, comprising: an intake housing having the aforementioned gas intake structure; and a liquid film forming portion forming a liquid film on the inner wall surface of the intake housing.

[0019] The effects of the invention

[0020] The process gas intake structure is equipped with a heating device for heating the double-walled tube structure. Therefore, the process gas intake structure can prevent the generation of byproducts from the process gas due to temperature drop. Attached Figure Description

[0021] Figure 1 This is a diagram illustrating one embodiment of an exhaust gas treatment device.

[0022] Figure 2 It is a cross-sectional view showing the structure for processing gas intake.

[0023] Figure 3 This is a diagram showing the flow of inert gas supplied to the double-walled tube structure.

[0024] Figure 4 This diagram illustrates the effect of a double-layered pipe structure with a throttling section.

[0025] Figure 5 This is a diagram illustrating other embodiments of the heating device.

[0026] Figure 6 This is a diagram illustrating another embodiment of the gas intake structure.

[0027] Figure 7 This diagram illustrates the flow of high-temperature, inactive gas supplied to the serrated flow path.

[0028] Symbol Explanation

[0029] 10. Waste gas treatment device

[0030] 11. Chassis

[0031] 13 Drainage tray

[0032] 14 Leakage Sensor

[0033] 20 Suction housing

[0034] 21 Piping

[0035] 22 suction port

[0036] 23 Suction piping

[0037] 24 Outlet

[0038] 26 Liquid film forming section

[0039] 32 scrapers

[0040] 40 Liquid tank housing

[0041] 40a wall

[0042] 41 Water level gauge

[0043] 42a liquid tank

[0044] 42b liquid tank

[0045] 42c liquid tank

[0046] 43 Liquid discharge outlet

[0047] 44 Weir

[0048] 45 Filter

[0049] 46 Spray Nozzles

[0050] 461 First spray nozzle

[0051] 462 Second spray nozzle

[0052] 47 wall

[0053] 47a Opening

[0054] 48 Injectors

[0055] 48b injector

[0056] 51 Rinse Tank

[0057] 51a Flushing Tank

[0058] 51b Flushing Tank

[0059] 51c rinsing tank

[0060] 52 Spray Nozzle

[0061] 53 Injection Nozzle

[0062] 54 Injection Nozzle

[0063] 55 Spray Nozzle

[0064] 56 Spray Nozzle

[0065] 57 Rasch ring

[0066] 61 Fog eliminator

[0067] 63 Liquid flow path

[0068] 64 Flow Meter

[0069] 65 Overpressure exhaust port

[0070] 71 Liquid flow path

[0071] 72 Liquid flow path

[0072] 72a Liquid flow path

[0073] 81 pump

[0074] 82 Flow Meter

[0075] 83 Flowmeter

[0076] 84 Discharge valve

[0077] 99 Control Device

[0078] 100 Gas intake structure

[0079] 101 Double-layer tube structure

[0080] 101a Top section

[0081] 102 Heating device

[0082] 105 Gas Flow Path Section

[0083] 105a outer peripheral surface

[0084] 106 Divider

[0085] 106a outer peripheral surface

[0086] 108 Piping base

[0087] 110 Piping Structure

[0088] 115 Wall Structure 115

[0089] 115a outer peripheral surface

[0090] 115b Inner circumferential surface

[0091] 116 Flange portion

[0092] 117 Flange portion

[0093] 119 Sealing components

[0094] 120 First heating structure

[0095] 121 Second heating structure

[0096] 125 First gas supply pipe

[0097] 126 First Gas Circuit

[0098] 127 Gas Supply Source

[0099] 130 Second gas supply pipe

[0100] 131 Second Gas Circuit

[0101] 132 Gas supply source

[0102] 140A Throttling Section

[0103] 140B Throttling Section

[0104] 141 Throttling section

[0105] 150 heater

[0106] 200 Annular Flow Path Structure

[0107] 201 Gas Flow Path Section

[0108] 201a outer surface

[0109] 202 First annular protrusion

[0110] 203 Second annular protrusion

[0111] 205 Serrated Flow Path Section

[0112] 206 Flange portion

[0113] 207 Gas supply pipe

[0114] 208 Gas Circuit

[0115] 209 Gas Supply Source

[0116] 210 Heating device

[0117] Lf liquid film

[0118] Hs1 First Heating Space

[0119] Hs2 Second Heating Space Detailed Implementation

[0120] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or equivalent structural elements are labeled with the same reference numerals and repeated descriptions are omitted. The exhaust gas treatment apparatus of this embodiment is a wet exhaust gas treatment apparatus that renders the treated gas harmless by contacting the treated gas with a liquid, and can be used as one of the manufacturing equipment for, for example, semiconductors, liquid crystals, solar panels, or LEDs.

[0121] Figure 1 This diagram illustrates one embodiment of an exhaust gas treatment device. The exhaust gas treatment device 10 is designed to render the gas (treatment gas) from a vacuum pump harmless. The primary side (upstream side) of the exhaust gas treatment device 10 is connected to a vacuum pump (not shown). Furthermore, the exhaust gas treatment device of this embodiment can be used alone to render the gas from the vacuum pump harmless, or it can be used in conjunction with other exhaust gas treatment devices (e.g., purifying devices) such as combustion-type devices. For example, if the gas being vacuum-drawn by the vacuum pump contains only water-soluble components, the exhaust gas treatment device 10 can be used alone. Additionally, when used in conjunction with other exhaust gas treatment devices, it is preferable to connect the other exhaust gas treatment device to the downstream end of the exhaust gas treatment device 10.

[0122] like Figure 1 As shown, the exhaust gas treatment device 10 includes: an intake housing 20 for drawing in treatment gas from a vacuum pump (not shown), a liquid tank housing 40 connected to the intake housing 20, and a treatment housing 50 connected to the liquid tank housing 40. The liquid tank housing 40 and the treatment housing 50 may be an integral housing.

[0123] The treated gas drawn into the intake housing 20 is treated after passing through the liquid tank housing 40 and the treatment housing 50, and then discharged to the outside or further introduced into other waste gas treatment devices. The intake housing 20, the liquid tank housing 40, and the treatment housing 50 are disposed inside the housing 11, and a drain pan 13 is provided at the bottom of the housing 11. A leakage sensor 14 for detecting moisture is provided in the drain pan 13, and it is configured to monitor leakage from the internal structure of the device.

[0124] The exhaust gas treatment device 10 includes a control device 99 for controlling its various parts. The control device 99 includes, for example, a memory that stores various setting data and various programs, and a CPU that executes the programs stored in the memory.

[0125] In this embodiment, the suction housing 20 is integrally formed into a cylindrical shape. The shape of the suction housing 20 is not limited to a cylindrical shape, but can be any shape. The lower end (end side) of the suction housing 20 is disposed within the liquid tank housing 40. The opening at the lower end of the suction housing 20 constitutes an outlet 24, which discharges the treated gas from the suction housing 20 into the liquid tank housing 40.

[0126] An intake port 22 is formed near the upper end of the intake housing 20, and the intake port 22 is connected to a vacuum pump (not shown) via an intake pipe 23. The processing gas drawn into the intake housing 20 from the intake port 22 is guided into the liquid tank housing 40 through the outlet port 24.

[0127] A pipe heater (not shown) can be installed on the suction pipe 23 leading from the suction port 22 to the vacuum pump. As the process gas flows through the suction pipe 23, the pipe heater heats the suction pipe 23 to a specified temperature (e.g., 180°C). This pipe heater can be of various types, such as a jacketed heater. Such a pipe heater helps prevent the accumulation of foreign matter in the suction pipe 23 and the suction port 22. Additionally, a pressure gauge can be installed in the gas flow path of the suction housing 20 (e.g., the suction port 22, the suction pipe 23, etc.) to measure the pressure of the process gas, thereby monitoring for pipe blockage.

[0128] A liquid film forming section 26 is provided between the intake port 22 and the outlet port 24 of the intake housing 20. This liquid film forming section 26 is used to form a liquid film (wet wall) Lf on the inner wall surface of the intake housing 20. In this embodiment, the liquid film forming section 26 is provided to cover the entire circumference of the annular intake housing 20. By forming a liquid film Lf on the inner wall surface of the intake housing 20 through the liquid film forming section 26, foreign matter near the inner wall surface of the piping 21 is flushed away by the liquid film, thereby suppressing the accumulation of foreign matter such as reaction by-products on the piping 21. Hereinafter, reaction by-products will be referred to simply as products.

[0129] In this embodiment, a scraper 32 is provided at the upper end of the suction housing 20. The scraper 32 is always or at all times actuated, and mechanically scrapes off the products adhering to the inner wall surface of the suction housing 20. As a result, the scraper 32 suppresses the adhesion of products to the inner wall surface of the suction housing 20.

[0130] like Figure 1 As shown, the lower end of the suction housing 20 is disposed inside the liquid tank housing 40, and the outlet 24 of the suction housing 20 opens inside the liquid tank housing 40. The liquid tank housing 40 is a circulation tank used to store liquid and reuse the stored liquid for treatment in the exhaust gas treatment device 10.

[0131] The liquid tank housing 40 has a liquid tank 42a into which liquid, for example, is flushed away as a liquid film Lf, flows. The liquid tank 42a has a weir 44 located downstream of the liquid tank 42a, that is, on the processing housing 50 side relative to the outlet 24 of the suction housing 20. Downstream of the weir 44 are disposed liquid tanks 42b and 42c in the lower part of the processing housing 50, and a filter 45 is disposed between liquid tanks 42b and 42c.

[0132] Liquid flowing down from the outlet 24 of the suction housing 20 temporarily enters the liquid tank 42a. Then, the liquid stored in the liquid tank 42a overflows the weir 44 and flows into the liquid tank 42b, and then flows into the liquid tank 42c through the filter 45. A liquid outlet 43 is provided in the liquid tank 42c, and the liquid in the liquid tank 42c is discharged from the liquid outlet 43.

[0133] The liquid tank 42a includes a wall 40a surrounding the top, bottom, and sides, and a wall 47 separating the liquid tank 42a from the liquid tank 42b. An opening 47a is provided in the wall 47, connecting the liquid tank 42a and the liquid tank 42b, and the portion below the opening 47a of the wall 47 forms a weir 44. The liquid tank 42a is an overflow type where stored liquid overflows from the weir 44 into the liquid tank 42b, and the liquid level in the liquid tank 42a is stably maintained.

[0134] One or more spray nozzles 46 are provided in the liquid tank 42a. In this example, multiple spray nozzles 46 are provided, and these spray nozzles 46 are arranged at equal intervals around the piping 21 of the suction housing 20. Figure 1 The image shows two spray nozzles 46, but the number of spray nozzles 46 can be more than three.

[0135] Each spray nozzle 46 is located on the side of the intake housing 20 and positioned above the outlet 24. Each spray nozzle 46 is configured to fluidly communicate with the liquid flow path 72a and receive liquid supply from the liquid flow path 72a. Each spray nozzle 46 includes a first spray nozzle 461 that sprays liquid upward in a mist and a second spray nozzle 462 that sprays liquid downward in a mist.

[0136] The first spray nozzle 461 is configured to spray liquid upwards within the liquid tank 42a, thereby covering the walls of the liquid tank 42a and the outer surface of the suction housing 20 with liquid. The second spray nozzle 462 is configured to spray liquid around the outlet 24 at the lower end of the suction housing 20 within the liquid tank 42a. The second spray nozzle 462 may also be configured to further spray liquid onto the walls of the liquid tank 42a.

[0137] By spraying liquid in a mist form from each spray nozzle 46, the processing gas introduced into the liquid tank 42a can be brought into contact with the liquid and hydrolyzed. Furthermore, the hydrolysis products are knocked into the storage liquid by the mist-sprayed liquid. This prevents the products from floating in the liquid tank housing 40.

[0138] Furthermore, by spraying liquid in a mist form from each spray nozzle 46 into the entire liquid tank 42a, the entire interior of the liquid tank 42a (including the walls of the liquid tank 42a and the suction housing 20) can be covered with liquid. This allows the interfaces, which are the primary cause of product adhesion, to be completely covered with a liquid film, thereby inhibiting product adhesion to the walls of the liquid tank 42a and the suction housing 20. Since the first spray nozzle 461 sprays liquid upwards in a mist form, the top portion of the liquid tank housing 40 can also be effectively covered with liquid.

[0139] Furthermore, by using the second spray nozzle 462 to spray liquid in a mist form from the area surrounding the outlet 24 of the suction housing 20, the products generated from the reaction between the treatment gas and the liquid near the outlet 24 of the suction housing 20 can fall into the storage liquid. This further suppresses the dispersion of products from the vicinity of the outlet 24 of the suction housing 20.

[0140] exist Figure 1 In the liquid tank 42a, an ejector 48 is arranged. The ejector 48 is a device that is driven by a driving liquid, draws in a quantity of liquid several times that of the driving liquid, and discharges the drawn-in liquid along with the driving liquid. The ejector 48 is positioned near the liquid surface in the liquid tank 42a, and the ejector 48 draws in the liquid and is set to discharge the liquid downstream (towards the liquid tank 42b). By drawing in and discharging the liquid through the ejector 48, the liquid in the liquid tank 42a is agitated. By agitating the liquid through the ejector 48, any products entering the liquid can be dissolved into the liquid, thereby preventing products from remaining or floating in the liquid. The ejector 48 is supplied with driving liquid, for example, from the liquid flow path 72a, draws in the liquid, and discharges it along with the driving liquid.

[0141] The treatment housing 50 is connected to the liquid tank housing 40, and further treats and discharges the treatment gas flowing into the liquid tank housing 40. The treatment housing 50 includes a rinsing tank 51a, a rinsing tank 51b, and a rinsing tank 51c. Rinsing tanks 51a and 51b are separated by a wall 50a, and rinsing tanks 51b and 51c are separated by a wall 50b. In this embodiment, liquid tanks 42b and 42c are respectively provided in the lower parts of rinsing tanks 51a and 51b.

[0142] Liquid tank 42b is configured to be separated from liquid tank 42a by wall 47, and liquid overflowing from weir 44 below opening 47a of wall 47 flows into liquid tank 42b. Downstream of liquid tank 42b is separated from liquid tank 42c by wall 50a, and liquid in liquid tank 42b flows to liquid tank 42c through filter 45 provided in opening of wall 50a.

[0143] Liquid tank 42c is separated from liquid tank 42b by wall 50a and is located downstream of liquid tank 42b. Liquid from liquid tank 42b flows into liquid tank 42c after foreign matter such as byproducts is removed by filter 45. An ejector 48b is provided in liquid tank 42c. The direction of ejector 48b is set to discharge liquid toward filter 45. By discharging liquid through ejector 48b, clogging of filter 45 is suppressed. In addition, a water level gauge 41 is provided in liquid tank 42c. Using the detection value of water level gauge 41 and through pump 81 and / or discharge valve 84 (described later), the water level in liquid tank 42c is controlled within a specified range (a range above a pre-set first threshold and below a second threshold).

[0144] The first-stage rinsing tank 51a has two spray nozzles 52 arranged side-by-side vertically and a spray nozzle or jet nozzle 53 positioned above the spray nozzles 52. The spray nozzles 52 are supplied with liquid from the liquid flow path 72b and spray the liquid downwards in a mist. The spray nozzle or jet nozzle 53 is supplied with liquid from the liquid flow path 72b and sprays the liquid downwards and upwards in a mist. Processing gas from the liquid tank 42a flows from bottom to top through the rinsing tank 51a and flows into the second-stage rinsing tank 51b near the upper end of the rinsing tank 51a.

[0145] The processing gas is hydrolyzed upon contact with the liquid atomized by the spray nozzles 52, 53, or spray nozzle 53 as it passes through the rinsing tank 51a. An overpressure vent 65 is provided at the top of the rinsing tank 51a. When excess pressure is applied inside the tank, the overpressure vent 65 releases the pressure inside the tank.

[0146] The second-stage rinsing tank 51b includes: a spray nozzle or jet nozzle 53, a spray nozzle 52 disposed below the spray nozzle or jet nozzle 53, and a jet nozzle 54 disposed below the spray nozzle 52. The spray nozzle 52 and spray nozzle or jet nozzle 53 are the same as those disposed in the first-stage rinsing tank 51a, and are supplied with liquid from the liquid flow path 72b. The jet nozzle 54 receives the liquid supply from the liquid flow path 72a and sprays the liquid in such a way that it impacts the liquid surface in the liquid tank 42c.

[0147] The processing gas from the rinsing tank 51a flows from top to bottom through the rinsing tank 51b and flows from the lower end of the rinsing tank 51b into the third-stage rinsing tank 51c. As the processing gas passes through the rinsing tank 51b, it comes into contact with the liquid being sprayed or sprayed by the spray nozzle 52, spray nozzle or jet nozzle 53, or jet nozzle 54, resulting in hydrolysis. Furthermore, the jetting of liquid from the jet nozzle 54 agitates the products floating on the surface of the liquid in the liquid tank 42c, causing the products to dissolve into the liquid.

[0148] The final stage of the rinsing tank 51c includes: two Raschig ring layers 57 arranged side by side, a spray nozzle 55 that sprays liquid in a mist from the Raschig ring layer 57 facing downwards, and a spray nozzle 56 that sprays liquid in a mist from the Raschig ring layer 57 facing upwards. A mist eliminator 61 is connected to the upper end of the rinsing tank 51c, and the treated gas is discharged from the exhaust port 62 through the mist eliminator 61.

[0149] The Raschig ring layer 57, used to prevent mist formation, is formed by stacking multiple resin rings. The spray nozzle 55 receives liquid from the liquid flow path 72b and sprays the liquid in a mist towards the lower Raschig ring layer 57. The spray nozzle 56 receives fresh water (e.g., tap water) from the liquid flow path 63 and sprays the liquid in a mist towards the upper Raschig ring layer 57. A flow meter 64 is provided in the liquid flow path 63, and the amount of fresh water supplied to the spray nozzle 56 is controlled based on the flow meter's readings.

[0150] The mist eliminator 61 has one or more baffles that remove moisture from the mist-like processing gas and discharge the processing gas in a gaseous state. The processing gas from the rinsing tank 51b flows from bottom to top through the rinsing tank 51c and comes into contact with the liquid sprayed in a mist-like state by the spray nozzles 55 and 56 for further hydrolysis. After the mist eliminator 61 returns to a gaseous state, it is discharged from the outlet 62.

[0151] The exhaust gas treatment apparatus 10 of this embodiment includes a pump 81, which pressurizes the liquid discharged from the liquid outlet 43 of the liquid tank 42c. A removal mechanism (not shown) for removing foreign matter or other contaminants contained in the liquid may also be provided in the liquid flow paths 71 and 72 connected to the pump 81. The pump 81 supplies the liquid discharged from the liquid outlet 43 to the spray nozzles 46 and 52 and the injection nozzle 54 via the liquid flow paths 72 and 72a.

[0152] Pump 81 supplies liquid discharged from liquid outlet 43 to spray nozzles 52, 53, 55, and 56 via liquid flow paths 72 and 72b. Additionally, pump 81 supplies liquid discharged from liquid outlet 43 to the liquid film forming section 26 of the suction housing 20 via liquid flow paths 72 and 72c. By reusing the liquid stored in liquid tanks 42a-42c in this way, operating costs can be reduced, and environmental protection is beneficial.

[0153] Additionally, a flow meter 83 is installed in the liquid flow path 72c. By controlling the pump 81 based on the detection results of the flow meter 83, the flow rate of the liquid to the liquid film forming section 26 can be adjusted, thereby appropriately controlling the thickness of the liquid film Lf, etc. For example, controlling the thickness of the liquid film Lf can suppress pressure loss of the processed gas and suppress the dispersion of products. Furthermore, in addition to detecting flow rate, the flow meter 83 can also be a flow control valve with flow rate control function. For example, a CLC (Closed Loop Controller) can be used, which automatically controls the flow control valve based on the flow meter's detection value to make the flow rate reach the set value. Alternatively, a flow meter 82 can be installed in the liquid flow path 72 to monitor and control the overall flow rate of the liquid from the pump 81. The flow meter 82, like the flow meter 83, can have the function of controlling flow rate.

[0154] Furthermore, the liquid discharged from the liquid outlet 43 by the pump 81 is discharged to the outside of the waste gas treatment device 10 via the liquid flow path 71 according to the opening and closing of the discharge valve 84 provided in the liquid flow path 71. In one example, during the treatment of the gas, the pump 81 is always running to circulate the liquid, and the opening and closing of the discharge valve 84 is controlled based on the detection value of the water level gauge 41 provided in the liquid tank 42c, so that the water level in the liquid tank 42c is within a specified range (a range above a pre-set first threshold and below a second threshold).

[0155] According to the above-described embodiment, since the outlet 24 is separated from the liquid surface of the liquid tank 42a, the pressure loss of the processed gas flowing out of the outlet 24 can be suppressed, the flow rate of the processed gas can be increased, and thus the processing speed of the waste gas treatment device can be improved. Furthermore, since the distance between the outlet 24 and the liquid surface of the stored liquid is close, the dispersion of generated substances into the surrounding environment can be suppressed.

[0156] Furthermore, according to this embodiment, since the liquid tank 42a is an overflow type liquid tank, the height of the liquid level directly below the outlet 24 can be stabilized, thereby suppressing the increase in pressure loss of the processed gas and the dispersion of the generated products.

[0157] According to this embodiment, by spraying liquid in a mist form into the entire structure above the liquid surface of the liquid tank 42a through the spray nozzle 46, the interface within the liquid tank 42a is covered by liquid, thus suppressing the adhesion of products to the structure within the liquid tank 42a. Furthermore, since liquid is also sprayed in a mist form around the outlet 24 of the suction housing 20 through the spray nozzle 46, products generated by the reaction between the processing gas and liquid near the outlet 24 of the suction housing 20 can fall into the storage liquid. This suppresses the dispersion of products from the vicinity of the outlet 24 of the suction housing 20. Additionally, since the liquid film Lf formed by the liquid film forming portion 26 of the suction housing 20 flows out from the outlet 24, the dispersion of products in the outlet 24 can also be suppressed.

[0158] When the temperature inside the intake housing 20 is low, the treated gas drawn into the intake housing 20 may generate byproducts due to the temperature drop. When these byproducts adhere to the inside of the intake housing 20, the exhaust gas treatment device 10 may malfunction or the treatment efficiency of the treated gas may decrease.

[0159] Therefore, the intake housing 20 of the exhaust gas treatment device 10 includes a treated gas intake structure 100 disposed on the upper part of the intake housing 20. The treated gas intake structure 100 can be applied to the exhaust gas treatment device 10 for rendering the treated gas harmless by contacting it with a liquid. Hereinafter, the structure of the treated gas intake structure 100 will be described with reference to the accompanying drawings.

[0160] Figure 2 This is a cross-sectional view showing the structure for inhaling the treated gas. Furthermore, in Figure 2 The illustrations of the suction tubing 23 and the scraper 32 are omitted in the text. Figure 2 As shown, the processing gas intake structure 100 includes a double-walled tube structure 101 and a heating device 102 for heating the double-walled tube structure 101. The double-walled tube structure 101 includes a processing gas flow path 105 for processing gas introduced from the intake port 22 and a partition 106 disposed outside the processing gas flow path 105.

[0161] The processing gas flow path 105 and the partition 106 are both cylindrical. The partition 106 surrounds the processing gas flow path 105, and the processing gas flow path 105 and the partition 106 are arranged concentrically.

[0162] The gas intake structure 100 includes a piping structure 110, which has an intake port 22 and a piping base 108. The piping structure 110 is connected to a double-walled pipe structure 101 and is positioned above the double-walled pipe structure 101. In this state, the piping structure 110 is connected to the double-walled pipe structure 101.

[0163] The gas intake structure 100 includes a wall structure 115 connected to a double-walled pipe structure 101. The wall structure 115 is positioned below the double-walled pipe structure 101. Therefore, the double-walled pipe structure 101 is positioned between the piping structure 110 and the wall structure 115. Figure 1 The liquid film forming part 26 shown is disposed on the wall structure 115, and the liquid film Lf is formed on the inner peripheral surface of the wall structure 115.

[0164] An annular sealing member (e.g., a gasket) 119 is disposed between the double-walled tube structure 101 and the wall structure 115. More specifically, the double-walled tube structure 101 (more specifically, the partition 106) has a flange 116 extending outward from its outer peripheral surface 106a, and the wall structure 115 has a flange 117 extending outward from its outer peripheral surface 115a. The sealing member 119 is disposed between the flange 116 of the double-walled tube structure 101 and the flange 117 of the wall structure 115.

[0165] The heating device 102 includes a first heating structure 120 and a second heating structure 121. The first heating structure 120 heats an annular first heating space Hs1 formed between the processing gas flow path section 105 and the partition section 106, and the second heating structure 121 heats an annular second heating space Hs2 formed between the partition section 106 and the wall structure 115. The second heating space Hs2 is disposed outside the first heating space Hs1.

[0166] In this embodiment, the first heating structure 120 and the second heating structure 121 have the same structure. The first heating structure 120 and the second heating structure 121 are respectively inert gas supply structures for supplying an inert gas (e.g., nitrogen (N2) gas) heated to a specified temperature (e.g., 180°C) to the double-layer tube structure 101.

[0167] According to this embodiment, the processing gas intake structure 100 is equipped with a heating device 102 for heating the double-layer tube structure 101. Therefore, the processing gas intake structure 100 can prevent the generation of products from the processing gas due to temperature drop.

[0168] The first heating structure 120 includes: a first gas supply pipe 125 connected to the first heating space Hs1, a first gas line 126 connected to the first gas supply pipe 125, and a gas supply source 127 that supplies heated inactive gas to the first heating space Hs1 through the first gas line 126 and the first gas supply pipe 125.

[0169] Similarly, the second heating structure 121 includes: a second gas supply pipe 130 communicating with the second heating space Hs2, a second gas line 131 connected to the second gas supply pipe 130, and a gas supply source 132 supplying heated inactive gas to the second heating space Hs2 through the second gas line 131 and the second gas supply pipe 130. The gas supply source 127 and the gas supply source 132 may also be common supply sources.

[0170] In this embodiment, the first gas supply pipe 125 is disposed above the second gas supply pipe 130 and connected to the upper part of the partition 106. The second gas supply pipe 130 is disposed below the first gas supply pipe 125 and connected to the lower part of the partition 106 (more specifically, the flange 116).

[0171] Figure 3 This is a diagram showing the flow of inert gas supplied to the double-walled tube structure. (Example) Figure 3 As shown, the high-temperature inert gas supplied to the first heating space Hs1 by the first heating structure 120 (i.e., the first inert gas supply structure) flows downward along the outer peripheral surface 105a of the processing gas flow path 105 and passes through the processing gas flow path 105. The inert gas flowing in this way comes into contact with the processing gas flow path 105 and the partition 106, thereby maintaining the surface temperature of the processing gas flow path 105 and the partition 106 at a high temperature.

[0172] like Figure 3 As shown, the double-layer tube structure 101 includes throttling sections 140A and 140B, which throttle the flow of inactive gas supplied from the first heating structure 120 through the first heating space Hs1. Throttling section 140A is a lower-side throttling section located at the lower end of the partition 106. Throttling section 140B is an upper-side throttling section located above throttling section 140A. In this specification, there may be instances where the lower-side throttling section 140A and the upper-side throttling section 140B are not distinguished and are simply referred to as throttling section 140.

[0173] In this embodiment, although two throttling sections 140A and 140B are provided, in one embodiment one throttling section 140 may be provided, and in other embodiments three or more throttling sections 140 may be provided.

[0174] Throttling sections 140A and 140B are each annular in shape and extend from the partition section 106 toward the processing gas flow path section 105. The flow path of the inactive gas in the first heating space Hs1 becomes smaller at a position adjacent to the outer peripheral surface 105a of the processing gas flow path section 105.

[0175] like Figure 3As shown, the high-temperature inert gas supplied to the second heating space Hs2 via the second heating structure 121 (i.e., the second inert gas supply structure) flows downward along the inner peripheral surface 115b of the wall structure 115 and passes through the partition 106. The inert gas flowing in this way contacts the partition 106 and the wall structure 115, thereby maintaining the surface temperature of the partition 106 and the wall structure 115 at a high temperature. In particular, a liquid film Lf (see reference) is formed on the inner peripheral surface 115b of the wall structure 115. Figure 1 Therefore, the temperature of the wall structure 115 may decrease. By bringing a high-temperature inactive gas into contact with the wall structure 115, the second heating structure 121 is able to maintain the surface temperature of the wall structure 115 at a high temperature.

[0176] The double-walled tube structure 101 includes a throttling section 141 that restricts the flow of inactive gas supplied from the second heating structure 121 through the second heating space Hs2. The throttling section 141 has an annular shape and extends from the partition 106 toward the wall structure 115. The flow path of the inactive gas in the second heating space Hs2 narrows at a position adjacent to the inner circumferential surface 115b of the wall structure 115. In this embodiment, only one throttling section 141 is provided; however, in one embodiment, two or more throttling sections 141 may be provided.

[0177] Figure 4 This diagram illustrates the effect of the double-walled tube structure with throttling sections. As described above, by forming throttling sections 140 and 141, the cross-sectional area of ​​the flow path for the inactive gas is reduced, resulting in a vigorous downward flow of the inactive gas. When the flow velocity of the inactive gas is low, it may flow downward in a non-uniform manner in the circumferential direction of the double-walled tube structure 101. That is, the inactive gas may flow actively only in specific areas in the circumferential direction of the double-walled tube structure 101, while flowing almost nothing in other areas. Such non-uniform flow of the inactive gas may contribute to a decrease in the temperature of the intake casing 20.

[0178] In this embodiment, the throttling sections 140A and 140B disposed in the first heating space Hs1 and the throttling section 141 disposed in the second heating space Hs2 respectively reduce the cross-sectional area of ​​the flow path of the inactive gas. Therefore, the process gas intake structure 100 can make the inactive gas flow violently, and as a result, it can reliably prevent the inactive gas from flowing downward in a non-uniform state in the circumferential direction of the double-layer tube structure 101.

[0179] like Figure 4As shown, inactive gas flows violently through the gap between the lower end throttling section 140A and the outer peripheral surface 105a of the processing gas flow path section 105 to the liquid film Lf located below the top portion 101a of the double-layer pipe structure 101. This inactive gas has an annular shape and extends in a curtain-like manner, forming on the outside of the processing gas flowing in the processing gas flow path section 105. Therefore, the flow of the curtain-like inactive gas hinders the flow of the processing gas to the radially outer side of the processing gas flow path section 105. As a result, the processing gas through the processing gas flow path section 105 flows smoothly downwards along the piping 21 without diffusion.

[0180] Similarly, the inactive gas passing through the gap between the inner peripheral surface 115b of the wall structure 115 and the throttling section 141 flows violently to the liquid film Lf located below the throttling section 141. This flowing inactive gas has an annular shape and extends in a curtain-like manner, forming a ring around the active gas passing through the gap between the lower end throttling section 140A and the outer peripheral surface 105a of the processed gas flow path 105. Therefore, it is possible to more reliably prevent the processed gas from flowing outward in the radial direction of the processed gas flow path 105.

[0181] According to this embodiment, the heating device 102 can form a double-layered curtain-like flow of inactive gas formed on the outside of the processing gas flow path 105. Therefore, it can not only heat the double-layered tube structure 101, but also reliably prevent the diffusion of the processing gas through the processing gas flow path 105.

[0182] like Figure 4 As shown, the top portion 101a of the double-layer tube structure 101 is positioned adjacent to the liquid film Lf, thus the temperature of this top portion 101a is particularly reduced. According to this embodiment, as... Figure 4 As indicated by the arrow, the heating device 102 can allow not only the inactive gas in the first heating space Hs1, but also the inactive gas in the second heating space Hs2 to come into contact with the top portion 101a of the double-walled tube structure 101. Therefore, the heating device 102 can prevent the temperature of the top portion 101a from decreasing.

[0183] Figure 5 This is a diagram illustrating other embodiments of the heating device. (e.g.) Figure 5As shown, the heating device 102 may also include a heater 150 disposed in the first heating space Hs1. The heater 150 is not particularly limited as long as it can heat the double-walled tube structure 101 to a predetermined temperature (e.g., 180°C). For example, the heater 150 may be a box heater or a plate heater. When using a box heater, multiple heaters 150 may be arranged at equal intervals along the circumference of the processed gas flow path 105. When using a plate heater, the heater 150 may be arranged around the processed gas flow path 105.

[0184] The heater 150, disposed in the first heating space Hs1, can heat the double-layer tube structure 101 (i.e., the process gas flow path 105 and the partition 106). In this embodiment, the heater 150 is disposed adjacent to the process gas flow path 105, thus enabling aggressive heating of the process gas flow path 105. In one embodiment, the heating device 102 may include both the first inactive gas supply structure 120 and the heater 150, provided that a high-temperature inactive gas can pass through the first heating space Hs1.

[0185] Although not shown, the heating device 102 may also include a heater disposed in the second heating space Hs2. Even in this case, as long as the high-temperature inert gas can pass through the second heating space Hs2, the heating device 102 may include both the second inert gas supply structure 121 and the heater (shown).

[0186] Figure 6 This is a diagram illustrating other embodiments of the gas intake structure. (See diagram for example.) Figure 6 As shown, the processing gas intake structure 100 includes an annular flow path structure 200 for the flow of high-temperature inactive gas and a heating device 210 for heating the annular flow path structure 200. The annular flow path structure 200 includes a processing gas flow path section 201 for the flow of processing gas and an annular serrated flow path section 205 disposed outside the processing gas flow path section 201.

[0187] A wall structure 115 is formed on the outer side of the processing gas flow path 201. The processing gas flow path 201 and the wall structure 115 are both cylindrical, and the wall structure 115 surrounds the processing gas flow path 201. The processing gas flow path 201 and the wall structure 115 are arranged concentrically.

[0188] The serrated flow path 205 includes a first annular protrusion 202 formed on the outer surface 201a of the processing gas flow path 201 and a second annular protrusion 203 extending toward the outer surface 201a of the processing gas flow path 201. The first annular protrusion 202 and the second annular protrusion 203 are arranged concentrically with each other. The second annular protrusion 203 is disposed above the first annular protrusion 202.

[0189] The annular flow path structure 200 has a flange portion 206 that can be connected to the flange portion 117 of the wall structure 115, and a second annular protrusion 203 is connected to the flange portion 206 and extends toward the outer surface 201a. In one embodiment, the second annular protrusion 203 may also be formed on the inner peripheral surface 115b of the wall structure 115 disposed on the outer side of the processing gas flow path portion 201.

[0190] The heating device 210 includes a heating structure (in this embodiment, an inactive gas supply structure) 102 that supplies heated inactive gas (e.g., nitrogen (N2) gas) to the serrated flow path section 205. Figure 6 As shown, the inactive gas supply structure 102 includes: a gas supply pipe 207 connected to the serrated flow path section 205, a gas line 208 connected to the gas supply pipe 207, and a gas supply source 209 that supplies heated inactive gas to the serrated flow path section 205 through the gas line 208 and the gas supply pipe 207.

[0191] Figure 7 This diagram illustrates the flow of a high-temperature inactive gas supplied to the serrated flow path. The first annular protrusion 202 and the second annular protrusion 203 each have an annular shape, and the second annular protrusion 203 and the first annular protrusion 202 are arranged sequentially in the flow direction of the inactive gas.

[0192] Therefore, the inactive gas introduced into the serrated flow path 205 swirls around the processed gas flow path 201 and flows into the gap between the second annular protrusion 203 and the first annular protrusion 202. This gap is an annular space formed between the processed gas flow path 201 and the wall structure 115. The inactive gas flowing into this space heats the processed gas flow path 201 and the wall structure 115 while swirling and flowing downwards towards the second annular protrusion 203 and the first annular protrusion 202.

[0193] like Figure 7 As shown, the inactive gas flows violently through the second annular protrusion 203 and the first annular protrusion 202 to the liquid film Lf located below the process gas flow path 201. The inactive gas flowing in this way has an annular shape and extends in a curtain-like manner. Figure 6 and Figure 7In the embodiment shown, the process gas intake structure 100 can also prevent the generation of byproducts from the process gas due to temperature reduction.

[0194] The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments and can be modified in various ways within the scope of the technical concept described in the patent claims.

Claims

1. A gas intake structure for treating gas, applicable to an exhaust gas treatment device for rendering the gas harmless by contacting it with a liquid, characterized in that, have: Double-layered tubular structure; and A heating device that heats the double-walled tube structure. The double-layer tube structure comprises: A processing gas flow path section, which supplies the processing gas with flow; and A partition is disposed on the outside of the processing gas flow path. The gas intake structure further includes a wall structure connected to the double-layer tube structure. The heating device includes: A first heating structure heats a first heating space formed between the processed gas flow path and the partition; and A second heating structure heats a second heating space formed between the partition and the wall structure. The first heating structure includes at least one of a first inert gas supply structure and a heater disposed in the first heating space, wherein the first inert gas supply structure supplies heated first inert gas to the first heating space. The second heating structure includes at least one of a second inactive gas supply structure and a heater disposed in the second heating space, wherein the second inactive gas supply structure supplies heated second inactive gas to the second heating space. The double-layer tube structure also features: A first throttling section throttles the flow path of the first inactive gas supplied from the first inactive gas supply structure through the first heating space; and A second throttling section that throttles the flow path of the second inactive gas supplied from the second inactive gas supply structure through the second heating space. The first throttling section forms the flow of the first inactive gas, which has an annular shape and extends in a curtain-like manner, surrounding the processed gas flowing in the processed gas flow path section. The second throttling section forms a flow of the second inactive gas, which has an annular shape in a manner that surrounds the flow of the first inactive gas and extends in a curtain-like manner.

2. A gas intake structure for treating gas, applicable to an exhaust gas treatment device for rendering the gas harmless by contacting it with a liquid, characterized in that, have: Annular flow path structure; and A heating device that heats the annular flow path structure. The annular flow path structure includes: A processing gas flow path section, which supplies the processing gas with flow; and An annular, serrated flow path is disposed on the outer side of the processed gas flow path. The serrated flow path section includes: A first annular protrusion is formed on the outer surface of the processing gas flow path. as well as The second annular protrusion extends toward the outer surface of the processing gas flow path. The serrated flow path section forms a swirling flow of inactive gas in a manner that surrounds the processed gas flow path section.

3. The gas intake structure according to claim 2, characterized in that, The heating device includes an inactive gas supply structure that supplies heated inactive gas to the serrated flow path.

4. A waste gas treatment device, characterized in that, have: Inhalation housing, the inhalation housing having the gas inhalation structure according to any one of claims 1 to 3; and A liquid film forming section forms a liquid film on the inner wall surface of the suction housing.

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