Opto-electronic assembly of a communication system

Abstract

An optoelectronic assembly (102) includes an optical module assembly (104) comprising a fiber optic connector (300) and an optical engine (302) on an optical engine substrate (304). The fiber optic connector has a ferrule (320) that holds an optical fiber (322) optically coupled to the optical engine. The optical engine substrate includes an array of contacts (334) of optical engine contacts at its bottom (368). The optical module assembly includes a heat transfer element (306) thermally coupled to the optical engine. The optical module assembly includes a rear housing (308) configured to be coupled to a circuit board (110). The rear housing holds the heat transfer element in thermal contact with the optical engine. The optoelectronic assembly includes an inserter assembly (108) electrically connected to the array of contacts of the optical engine contacts, the inserter assembly having compressible inserter contacts (200) having separable mating interfaces (226, 228).

Description

Technical Field

[0001] The main topic of this article is communication systems. Background Technology

[0002] A continuing trend is towards smaller, lighter, and higher-performance communication components and higher-density systems, such as those used in Ethernet switches or other system components. Typically, a system comprises an electronic package connected to a circuit board, for example, via a receptacle connector. Electrical signals are routed between the electronic package and the circuit board. The signals then travel along traces on the circuit board to another component, such as a transceiver connector. Long electrical paths through the main circuit board degrade the system's electrical performance. Furthermore, losses occur between connector interfaces and along the electrical signal path within the transceiver. Traditional systems struggle to meet the signal and power output requirements from the electronic package.

[0003] A reliable communication system is still needed. Summary of the Invention

[0004] According to the present invention, an optoelectronic component is provided. The optoelectronic component includes an optical module assembly comprising a fiber optic connector and an optical engine on an optical engine substrate. The fiber optic connector has a collar that holds at least one optical fiber optically coupled to the optical engine. The optical engine substrate includes an array of contacts of optical engine contacts at its bottom. The optical engine contacts are coupled to the optical engine. The optical module assembly includes a heat transfer element thermally coupled to the optical engine. The optical module assembly includes a rear housing configured to be coupled to a circuit board. The rear housing includes a cavity that holds the heat transfer element, the optical engine, and the optical engine substrate. The rear housing holds the heat transfer element in thermal contact with the optical engine. The optoelectronic component includes an inserter assembly electrically connected to the array of contacts of the optical engine contacts. The inserter assembly includes an array of inserter contacts. The inserter contacts are compressible. Each inserter contact has an upper mating interface and a lower mating interface. The optoelectronic component includes a separable mating interface electrically connected to a corresponding optical engine contact. The lower mating interface of the inserter contact is configured to be electrically connected to a circuit board. Attached Figure Description

[0005] Figure 1 This is a top view of a communication system with optoelectronic components according to an exemplary embodiment.

[0006] Figure 2 This is an exploded, rear perspective view of an optoelectronic component according to an exemplary embodiment.

[0007] Figure 3 This is an exploded, front perspective view of an optoelectronic component according to an exemplary embodiment.

[0008] Figure 4This is a top perspective view of the inserter assembly according to an exemplary embodiment.

[0009] Figure 5 This is a bottom perspective view of the inserter assembly according to an exemplary embodiment.

[0010] Figure 6 This is an exploded view of an optical module assembly according to an exemplary embodiment.

[0011] Figure 7 This is a top perspective view of an optical module assembly according to an exemplary embodiment.

[0012] Figure 8 This is a bottom perspective view of an optical module assembly according to an exemplary embodiment.

[0013] Figure 9 This is a top view of an optical module assembly connected to a circuit board according to an exemplary embodiment.

[0014] Figure 10 This is an end view of an optical module assembly connected to a circuit board according to an exemplary embodiment.

[0015] Figure 11 This is a side view of an optical module assembly connected to a circuit board according to an exemplary embodiment. Detailed Implementation

[0016] Figure 1 This is a top view of a communication system 100 having an optoelectronic component 102 according to an exemplary embodiment. The optoelectronic component 102 includes one or more optical module components 104, which are connected via an inserter component 108 (in...). Figure 2 (As shown in the diagram) Electrically connected to circuit board 110. Electronic package 106 is electrically connected to circuit board 110. In an exemplary embodiment, compression hardware is used to mount optical module assembly 104 against inserter assembly 108 to electrically connect optical module assembly 104 to inserter assembly 108 and inserter assembly 108 to circuit board 110. For example, compression hardware, such as spring-loaded threaded fasteners, may be coupled to a pad or other support structure below circuit board 110. In an exemplary embodiment, communication system 100 includes a heat sink (not shown) configured to dissipate heat from electronic package 106 and / or optical module assembly 104.

[0017] In various embodiments, the electronic package 106 may be an integrated circuit assembly, such as an ASIC. However, the electronic package 106 may be another type of communication component. The electronic package 106 may be mounted to a main circuit board, such as circuit board 110. In various other embodiments, circuit board 110 may be a package substrate that can be coupled to a main circuit board (not shown). Optionally, the optical module assembly 104 may be disposed on multiple sides of circuit board 110. In the illustrated embodiment, the optical module assembly 104 is disposed on multiple sides of the electronic package 106, for example, on all four sides of the electronic package 106. In alternative embodiments, other arrangements are possible. In various embodiments, the optical module assembly 104 is individually clamped or compressed against inserter assembly 108, so that it can be individually serviced and can be individually removed from circuit board 110.

[0018] Figure 2 This is an exploded rear perspective view of the optoelectronic component 102 according to an exemplary embodiment. Figure 3 This is an exploded, front perspective view of an optoelectronic assembly 102 according to an exemplary embodiment. The optoelectronic assembly 102 includes an optical module assembly 104 and an inserter assembly 108. The inserter assembly 108 is used to electrically connect the optical module assembly 104 to a circuit board 110. The optoelectronic assembly 102 includes a pad 112 for securing the optical module assembly 104 to the circuit board 110.

[0019] The circuit board 110 includes a mounting area 114 on its upper surface 116. The mounting area 114 may be located within the electronic package 106 (e.g., Figure 1 (Shown) Near the mounting region 114. The circuit board 110 includes board contacts 120 at the mounting region 114. The board contacts 120 are arranged in an array, such as rows and columns. The board contacts 120 may be pads or traces of the circuit board 110. The board contacts 120 may be high-speed signal contacts, side-band signal contacts, ground contacts, or power contacts. In an exemplary embodiment, the circuit board 110 includes an alignment opening 122 adjacent to the mounting region 114. An inserter assembly 108 is coupled to the alignment opening 122 to orient the inserter assembly 108 relative to the circuit board 110. The alignment opening 122 may be keyed, for example, designed to be different sizes to orient the inserter assembly 108 relative to the circuit board 110. In an exemplary embodiment, the circuit board includes a mounting opening 124 adjacent to the mounting region 114. An optical module assembly 104 and / or a pad 112 are coupled to the circuit board 110 at the mounting opening 124.

[0020] A pad 112 is configured to attach to the lower surface 118 of a circuit board 110. The pad 112 includes a body 130 and a protrusion 132 extending from the top of the body 130. The protrusion 132 is received in a mounting opening 124. In the illustrated embodiment, the protrusion 132 is cylindrical. In alternative embodiments, the protrusion 132 may have other shapes. The protrusion 132 may have different sizes or different shapes to keyedly mate with the circuit board 110. In an exemplary embodiment, the protrusion 132 has a hole 134 extending therethrough. The hole 134 may be threaded to receive a threaded fastener of the optical module assembly 104.

[0021] Figure 4 This is a top perspective view of the inserter assembly 108 according to an exemplary embodiment. Figure 5 This is a bottom perspective view of an inserter assembly 108 according to an exemplary embodiment. The inserter assembly 108 includes an array of inserter contacts 200 held together by a support plate 202. The inserter assembly 108 includes an inserter frame 204 that holds the support plate 202 and the inserter contacts 200.

[0022] In an exemplary embodiment, the inserter frame 204 is a multi-piece frame having an upper frame member 206 and a lower frame member 208. A support plate 202 is sandwiched between the upper frame member 206 and the lower frame member 208. In the illustrated embodiment, the inserter frame 204 extends around the outer periphery of the inserter assembly 108, for example, along all four sides of the support plate 202. In alternative embodiments, the inserter frame 204 may have other shapes.

[0023] In an exemplary embodiment, the inserter frame 204 includes an upper positioning pin 212 and a lower positioning pin 214. The upper positioning pin 212 extends upward from the upper frame member 206. The upper positioning pin 212 is used to position the optical module assembly 104 (e.g., ...) relative to the inserter assembly 108. Figure 2 (As shown). The upper locating pin 212 is received in an alignment feature, such as an opening, of the optical module assembly 104 to position the optical module assembly 104 relative to the inserter frame 204 and the inserter contact 200. The upper locating pin 212 can be held in the optical module assembly 104 by an interference fit. Optionally, the upper locating pin 212 may have different sizes or shapes to key-fit with the optical module assembly 104. The lower locating pin 214 extends downward from the lower frame member 208. The lower locating pin 214 is used relative to a circuit board (e.g., Figure 2(As shown) Positioning inserter assembly 108. A lower positioning pin 214 is received in alignment opening 122 to position inserter frame 204 and inserter contact 200 relative to circuit board 110. In alternative embodiments, other types of positioning features besides positioning pins 212, 214 may be used. The lower positioning pin 214 may be held in alignment opening 122 by an interference fit. Optionally, the lower positioning pin 214 may have different sizes or shapes to key-mate with alignment opening 122.

[0024] In an exemplary embodiment, the support plate 202 is a thin film having an upper surface 220 and a lower surface 222. The support plate 202 includes an opening 224 therethrough to hold corresponding inserter contacts 200. The support plate 202 is made of an insulating material, such as polyimide, to electrically isolate the inserter contacts 200 from each other.

[0025] Insertor contacts 200 are held by support plates 202. In an exemplary embodiment, insertor contacts 200 are compressible contacts, such as conductive polymer pillars. Each insertor contact 200 includes an upper mating interface 226 and a lower mating interface 228. The upper mating interface 226 is located above the upper surface 220 of the support plate 202, and the lower mating interface 228 is located below the lower surface 222 of the support plate 202. Insertor contacts 200 are compressible between the upper mating interface 226 and the lower mating interface 228. Optionally, the upper mating interface 226 and the lower mating interface 228 may be planar interfaces oriented parallel to each other. Optionally, the upper side 230 and the lower side 232 of the insertor contact 200 may be tapered. For example, the sides 230, 232 may not be oriented parallel to the upper mating interface 226 and the lower mating interface 228. The upper and lower portions of the insertor contact 200 may be conical, such as truncated cones. In alternative embodiments, other types of inserter contacts 200 may be used.

[0026] Figure 6 This is an exploded view of an optical module assembly 104 according to an exemplary embodiment. The optical module assembly 104 includes a fiber optic connector 300, an optical engine 302 on an optical engine substrate 304, a heat transfer element 306 thermally coupled to the optical engine 302, and a rear housing 308 holding other components together. The rear housing 308 is configured to be coupled to a circuit board 110 (e.g., using mounting hardware 310). Figure 2 (As shown). In an exemplary embodiment, mounting hardware 310 is compression hardware having a biasing element 312 (e.g., a spring) coupled to mounting hardware 310. Mounting hardware 310 is configured to be threadedly coupled to pad 112 (e.g., ...). Figure 2 (As shown).

[0027] The fiber optic connector 300 includes a ferrule 320 for retaining at least one optical fiber 322. The fiber optic connector 300 is configured to be coupled to an optical engine 302 such that the optical fiber 322 is optically coupled to the optical engine 302. In an exemplary embodiment, the fiber optic connector 300 includes a fiber strain relief element 324. The fiber strain relief element 324 provides strain relief for the optical fiber 322. The fiber strain relief element 324 may be overmolded onto the optical fiber 322.

[0028] An optical engine 302 is coupled to an optical engine substrate 304, for example, at the top 330 of the optical engine substrate 304. The optical engine 302 includes a photoelectric converter 332 for converting between optical signals and electrical signals. In an exemplary embodiment, the optical engine substrate 304 includes a contact array (e.g., optical engine contacts 334) at its bottom 335. Figure 8 (As shown). Optical engine contact 334 is connected to optical engine 302. Optical engine contact 334 is configured to be connected to inserter contact 200 (as shown). Figure 4 (As shown). The optical engine contact 334 may define a separable mating interface with the inserter assembly 108. In an exemplary embodiment, the optical engine substrate 304 includes an alignment feature 336 configured to align the optical engine substrate 304 with the inserter assembly 108. For example, the alignment feature 336 may be an opening through the optical engine substrate 304. The alignment feature 336 receives an upper positioning pin 212 (e.g., Figure 4 (As shown) to orient the optical engine substrate 304 and the inserter assembly 108. The alignment feature 336 may have different sizes to key with the upper positioning pin 212.

[0029] The heat transfer element 306 is configured to be thermally coupled to the optical engine 302 to dissipate heat from the optical engine 302. In an exemplary embodiment, the heat transfer element 306 includes a thermal bridge. The heat transfer element 306 includes a stack of plates that are individually movable relative to each other to conform to the optical engine 302. The plates are held together in a frame 340. In an exemplary embodiment, the heat transfer element 306 may be a heat sink configured for air cooling. For example, the heat transfer element 306 may include heat dissipation fins with airflow channels between the fins. In various other embodiments, the heat transfer element 306 may be thermally coupled to another component, such as a liquid cooling module or another heat sink.

[0030] In an exemplary embodiment, the rear housing 308 is made of a metallic material. Optionally, the rear housing 308 may be die-cast. The rear housing 308 includes a body 350 forming a cavity 352. The rear housing 308 has an opening 360 at its top. The body 350 surrounds the opening 360. The cavity 352 receives a heat transfer element 306, an optical engine 302, an optical engine substrate 304, and a fiber optic connector 300. In an exemplary embodiment, the rear housing 308 includes a ledge 354 surrounding the cavity 352. The ledge 354 captures the heat transfer element 306 and / or the optical engine substrate 304. The ledge 354 can be pressed downward against the heat transfer element 306 and / or the optical engine substrate 304. The rear housing 308 includes a mounting protrusion 356 having an opening 358. The mounting protrusion 356 can be mounted to a circuit board 110. The opening 358 receives mounting hardware 310. A biasing element 312 is coupled to and pressed down against the mounting protrusion 356 to hold the heat transfer element 306 in thermal contact with the optical engine 302. The biasing element 312 presses down against the mounting protrusion 356 to compress the inserter contact 200. In an exemplary embodiment, the rear housing 308 includes heat dissipation fins 362 with airflow channels 364 between them. The heat dissipation fins 362 dissipate heat from the rear housing 308.

[0031] Figure 7 This is a top perspective view of the optical module assembly 104 according to an exemplary embodiment. Figure 8 This is a bottom perspective view of the optical module assembly 104 according to an exemplary embodiment. Figure 7 and Figure 8 An assembled optical module assembly 104 is shown. A heat transfer element 306, an optical engine 302, an optical engine substrate 304, and a fiber optic connector 300 are received in a cavity 352 of a rear housing 308. The fiber optic connector 300 extends from the rear housing 308. The heat transfer element 306 extends through an opening 360 to the outside of the rear housing 308.

[0032] In an exemplary embodiment, the rear housing 308 includes an opening 366 at its bottom 368. The optical engine substrate 304 is exposed at the bottom 368 to interact with the inserter assembly 108 (e.g., Figure 4 (As shown) mating. An optical engine contact 334 is disposed at the bottom 335 of the optical engine substrate 304. The optical engine contact 334 can be a pad or baseline of the optical engine substrate 304. The optical engine contacts 334 are arranged in an array, such as in rows and columns. The optical engine contacts 334 can be high-speed signal contacts, side-band signal contacts, ground contacts, or power contacts. In an exemplary embodiment, the bottom portion of the cavity 352 is configured to receive the inserter assembly 108 to mate with the optical engine contact 334.

[0033] Figure 9This is a top view of the optical module assembly 104 connected to the circuit board 110. Figure 10 This is an end view of the optical module assembly 104 connected to the circuit board 110. Figure 11 This is a side view of the optical module assembly 104 connected to the circuit board 110. A pad 112 is located below the circuit board 110. The optical module assembly 104 is connected to the top of the circuit board 110. Mounting hardware 310 passes through the circuit board 110 and is threadedly connected to the pad 112. When the mounting hardware is tightened, the biasing element 312 is compressed. The biasing element 312 presses downward against the rear housing 308 to press the rear housing 308 downward toward the circuit board 110. The biasing element 312 presses downward against the rear housing 308 against the heat transfer element 306 to press the heat transfer element 306 against the optical engine 302. In an exemplary embodiment, the biasing element 312 presses downward against the rear housing 308 to compress the inserter contact 200 (e.g., ...). Figure 4 (As shown).

Claims

1. A photoelectric component (102), comprising: An optical module assembly (104) includes a fiber optic connector (300) and an optical engine (302) on an optical engine substrate (304). The fiber optic connector has a ferrule (320) that holds at least one optical fiber (322) optically coupled to the optical engine. The optical engine substrate includes an array of contacts (334) at its bottom (368) that are coupled to the optical engine. The optical module assembly includes a heat transfer element (306) thermally coupled to the optical engine. The optical module assembly includes a rear housing (308) configured to be coupled to a circuit board (110). The rear housing includes a cavity (352) that holds the heat transfer element, the optical engine, and the optical engine substrate. The rear housing holds the heat transfer element in thermal contact with the optical engine. The rear housing has an opening (360) at its top. An inserter assembly (108) is electrically connected to an array of contacts of the optical engine contacts. The inserter assembly includes an array of inserter contacts (200) that are compressible. Each inserter contact has an upper mating interface (226) and a lower mating interface (228). The upper mating interface defines a separable mating interface electrically connected to a corresponding optical engine contact. The lower mating interface of the inserter contact is configured to be electrically connected to the circuit board.

2. The optoelectronic assembly (102) of claim 1, wherein, When the rear housing is attached to the circuit board (110), the rear housing (308) compresses the inserter contact (200).

3. The optoelectronic assembly (102) of claim 1, wherein, The optical module assembly (104) includes compression hardware configured to be coupled to the circuit board (110), the compression hardware including a biasing element (312) that presses the rear housing (308) downward toward the circuit board.

4. The optoelectronic assembly (102) of claim 3, wherein, The bias element (312) presses the rear shell (308) down against the heat transfer element (306) to press the heat transfer element against the optical engine (302).

5. The optoelectronic assembly (102) of claim 1, wherein, The heat transfer element (306) includes a thermal interface that engages the upper surface of the optical engine (302).

6. The optoelectronic component (102) as described in claim 1, wherein, The optical engine substrate (304) includes an alignment feature (336), and the inserter assembly (108) includes an alignment feature that mates with the alignment feature of the optical engine substrate to orient the optical engine contact (334) and the inserter contact (200).

7. The optoelectronic component (102) of claim 1, wherein the optical engine (302) includes a photoelectric converter (332).

8. The optoelectronic assembly (102) of claim 1, wherein, The optical module assembly (104) further includes an optical fiber strain relief member (324) for providing strain relief for the at least one optical fiber (322), the optical fiber strain relief member being received in the cavity (352) and coupled to the optical engine substrate (304).

9. The optoelectronic assembly (102) of claim 1, wherein the inserter assembly (108) includes an inserter frame (204) received in the cavity (352) and the inserter frame is coupled to the optical engine substrate (304).

10. The optoelectronic assembly (102) of claim 9, wherein the inserter frame (204) includes a positioning pin and the optical engine substrate (304) includes an alignment opening (122) that receives the positioning pin to orient the inserter assembly (108) relative to the optical engine substrate.

11. The optoelectronic assembly (102) of claim 1 further includes a pad (112) configured to be coupled to a lower surface (118) of the circuit board (110), the rear housing (308) being coupled to the pad using mounting hardware, and the circuit board (110) being held between the pad and the rear housing.

12. The optoelectronic assembly (102) of claim 1, wherein, The heat transfer element (306) includes a thermal bridge having a plurality of plates arranged in a plate stack, the plates being able to move independently to conform to the optical engine.

13. The optoelectronic component (102) of claim 1, wherein the heat transfer element (306) includes heat transfer fins and has airflow channels between the heat transfer fins.

14. The optoelectronic assembly (102) of claim 1, wherein the rear housing (308) includes heat transfer fins extending from the outer surface of the rear housing, and airflow channels are provided between the heat transfer fins.

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