Wafer processing apparatus with rotatable table

Abstract

The present disclosure relates to a wafer processing apparatus for processing wafers, the apparatus having a rotatable table provided with a support configured and arranged to support a removable holder for holding a plurality of wafers. A drive assembly can be provided to provide the rotatable table with a rotational motion about a vertical axis perpendicular to the table; and a supply line can be configured and arranged to supply the rotatable table with a utility. The drive assembly can be controlled and configured to generate rotational motion of the table in both clockwise and counter-clockwise directions to avoid breakage of the supply line.

Description

Technical Field

[0001] This disclosure generally relates to a wafer processing apparatus for processing wafers. The apparatus includes a rotatable stage provided with a support configured and arranged to removably support a holder for holding a plurality of wafers; and a drive assembly for providing rotational movement to the rotatable stage about a substantially vertical axis substantially perpendicular to the stage. Background Technology

[0002] Wafer cassettes, such as front-opening wafer cassettes (FOUPs) or wafer boats, can be used as holders to hold or move multiple wafers within or to a wafer processing apparatus. The wafer processing apparatus may include a rotatable stage with supports configured and arranged to removably support the holders, thereby enabling the removable holders to be moved by rotation.

[0003] It may be necessary to provide the rotating stage with utility such as fluid or electricity. Summary of the Invention

[0004] This summary is provided to introduce some concepts in a simplified form. These concepts are further described in detail in the following description of exemplary embodiments. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0005] The object of the present invention is to provide a wafer processing apparatus having an improved manner of providing utility for a rotatable stage.

[0006] To this end, a wafer processing apparatus for processing wafers can be provided, the apparatus comprising a rotatable stage having a support configured and arranged to removably support holders for holding a plurality of wafers; and a drive assembly for providing rotational movement to the rotatable stage about a substantially vertical axis substantially perpendicular to the stage. The apparatus may be provided with supply lines to provide utility to the rotatable stage. The drive assembly can be controlled and configured to generate rotational movement of the stage in both clockwise and counterclockwise directions to prevent breakage of the supply lines.

[0007] In order to summarize the present invention and the advantages obtained relative to the prior art, certain objects and advantages of the present invention have been described above. It should be understood, of course, that not all of these objects or advantages can necessarily be achieved according to any particular embodiment of the present invention. Therefore, for example, those skilled in the art will recognize that the present invention may be implemented or performed in a manner that achieves or optimizes one or more advantages taught or suggested herein, without necessarily achieving other objects or advantages taught or suggested herein.

[0008] Various embodiments are claimed in the dependent claims, and these embodiments will be further illustrated with reference to the examples shown in the accompanying drawings. These embodiments may be combined or applied separately from each other.

[0009] All of these embodiments are within the scope of the invention disclosed herein. These and other embodiments will become apparent to those skilled in the art from the following detailed description of certain embodiments, with reference to the accompanying drawings. The invention is not limited to any particular embodiment disclosed. Attached Figure Description

[0010] It should be understood that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be enlarged relative to other elements to aid in understanding the embodiments illustrated in this disclosure.

[0011] Figure 1 A schematic top view / perspective view of an example of a wafer processing apparatus according to an embodiment is shown;

[0012] Figure 2 It shows Figure 1 A schematic top / perspective view of the housing manipulation space of an example of a chip processing device;

[0013] Figure 3 It shows Figure 1 A schematic side view of an example;

[0014] Figure 4 Depicting Figures 1 to 3 A portion of the cartridge memory turntable 18;

[0015] Figure 5 A perspective view of a wafer processing apparatus according to an embodiment is shown; and

[0016] Figure 6 It shows according to Figure 5 A schematic top view of an example of a chip processing device. Detailed Implementation

[0017] In this application, similar or corresponding features are indicated by similar or corresponding reference numerals. The description of various embodiments is not limited to the examples shown in the figures, and the reference numerals used in the detailed description and claims are not intended to limit the description of the embodiments, but are included to illustrate the embodiments by reference to the examples shown in the figures.

[0018] Although certain embodiments and examples are disclosed below, those skilled in the art will understand that the invention extends beyond the specific disclosed embodiments and / or uses of the invention and their obvious modifications and equivalents. Therefore, the scope of the disclosed invention should not be limited to the specific disclosed embodiments described below. The illustrations presented herein are not intended to be actual views of any particular material, structure, or device, but are merely idealized representations used to describe embodiments of this disclosure.

[0019] As used herein, the term "wafer" can refer to any one or more underlying materials on which devices, circuits, or films can be formed. Wafers can be any material, including semiconductor materials such as silicon.

[0020] In the most general terms, this disclosure provides a wafer processing apparatus 10 for processing wafers, examples of which are shown in Figure 1-6 As shown in the diagram, device 10 may include a cassette manipulation space 26. The cassette manipulation space 26 may be provided with a cassette memory 14 configured to store a plurality of wafer cassettes 16 each containing a plurality of wafers. The cassette manipulation space 26 may be provided with a cassette manipulator 28 configured to transfer the wafer cassettes 16 between the cassette memory 14 and the wafer transfer location 24. The cassette manipulator 28 may be a single cassette manipulator 28.

[0021] The wafer processing apparatus 10 may include a wafer manipulation space 30. The wafer manipulation space 30 may be provided with a wafer manipulator 32 configured to transfer wafers between a wafer cassette 16 at a wafer transfer position 24 and a wafer boat at a wafer boat transfer position.

[0022] The wafer processing apparatus may include an inner wall 20 separating the cassette manipulation space 26 and the wafer manipulation space 30. The inner wall 20 may be provided with a wafer transfer opening 22 adjacent to the wafer transfer position 24 for transferring wafers from or to the wafer cassette 16 thereto. The cassette memory 14 may include two cassette memory turntables 18.

[0023] In one embodiment, the two memory cartridges 18 can be suspended above the inner wall 20 and the wafer manipulation space 30. By suspending the inner wall 20 and the wafer manipulation space 30, the footprint of the wafer processing apparatus 10 can be reduced. This means that the amount of expensive floor space required to house the wafer processing apparatus is reduced, and therefore the total cost of the wafer processing apparatus 10 is also reduced.

[0024] In one embodiment, the wafer processing apparatus 10 may be provided with a generally rectangular footprint having two opposing short sides defining a width 36 of the wafer processing apparatus 10 and two opposing long sides defining a length 38 of the wafer processing apparatus 10. The width 36 of the wafer processing apparatus 10 may be about 2.2 meters or less. The length 38 of the wafer processing apparatus 10 may be 5 meters or less, preferably 4 meters or less.

[0025] By having a basic rectangular footprint, multiple wafer processing units 10 can be arranged adjacent to each other, thereby making optimal use of the available floor space. There may be no unused space between adjacent wafer processing units with rectangular footprints. A width 36 of less than 2.2 meters is advantageous, considering interchangeability with other vertical batch furnace components, for example, from other manufacturers / brands. A length 38 of 5 meters or less, preferably 4 meters or less, is beneficial for reducing the total footprint.

[0026] In one embodiment, the cell memory 14 may be configured to store 20 to 60 wafer cassettes 16. In one embodiment, the wafer cassette 16 may be implemented as a front-opening wafer cassette (FOUP). FOUPs are considered standard wafer housings in the industry. Using FOUPs facilitates the interchangeability of wafer cassettes between the wafer processing equipment 10 and other wafer processing machines.

[0027] In one embodiment, two cassette memory trolleys 18, a cassette manipulator 28, and a wafer manipulator 32 may be disposed in the space between the bottom side 40 and the horizontal plane 42 of the wafer processing apparatus 10 at a height 44 approximately 2.8 meters above the bottom side 40. The wafer processing apparatus 10 may have a removable top cover 46 extending above the horizontal plane 42 at a height 44 approximately 2.8 meters above the bottom side 40. The top cover 46 may close a top opening 80 in the top wall 82 of the wafer processing apparatus 10 through which a wafer cassette 16 extends and is placed on the top platform 70 of at least one of the two cassette memory trolleys 18.

[0028] By ensuring that the two memory cartridge turntables 18, cartridge manipulator 28, and wafer manipulator 32 are kept below a height of approximately 2.8 meters 44, these components remain within operator reach for maintenance and can be transported through a standard cleanroom door in their normal operating position. Furthermore, these components can be transported in their assembled state without needing to be disassembled for transport in standard-sized containers. This means that the wafer processing equipment 10 can be transported as a whole and therefore assembled at the manufacturer's facility. Consequently, extensive on-site assembly is eliminated, reducing the cost of installing the wafer processing equipment 10.

[0029] In one embodiment, the wafer processing apparatus 10 may further include at least one cassette entry / exit port 48. The at least one cassette entry / exit port 48 provides an entry point into and out of the wafer processing apparatus 10 for exchanging wafer cassettes 16 between the wafer processing apparatus 10 and the outside world. The at least one cassette entry / exit port 48 may be disposed in a wall 84 defining a cassette manipulation space 26. The wall 84 may be located at or near the short side of the basic rectangular occupancy space of the wafer processing apparatus 10. A cassette manipulator 28 may be configured to transfer wafer cassettes 16 between the cassette memory 14, the wafer transfer location 24, and the at least one cassette entry / exit port 48. Such a cassette manipulator 28 can manipulate all wafer cassettes transferred within the cassette manipulation space 26. By using only one cassette manipulator 28, the space otherwise occupied by additional cassette manipulators can be used for other purposes. Therefore, the size of the wafer processing apparatus 10 can be further reduced, or the wafer processing apparatus 10 can store even more wafer cassettes 16.

[0030] In one embodiment, the cassette manipulator 28 may be provided with a cassette manipulator arm 50 and a lifting mechanism 52, the lifting mechanism 52 being configured to reach the wafer cassette 16 at different vertical heights within the cassette memory 14. In one embodiment, the wafer processing apparatus 10 may further include a cassette door opening device 54. The cassette door opening device 54 may be placed at or near the wafer transport position 24. The cassette door opening device may be configured to open the door of the wafer cassette 16 placed at the wafer transport position 24. The cassette door opening device 54 can therefore automatically open the door of the wafer cassette 16 placed at the wafer transport position 24.

[0031] The wafer processing equipment 10 can be part of a production process within a cleanroom. Therefore, the wafer cassettes 16 supplied to the wafer processing equipment 10 and from it can be used in other wafer processing machines. The ability to automatically open the doors of these wafer cassettes 16 allows the use of wafer cassettes equipped with these doors. This increases the interchangeability of the wafer cassettes 16 between the wafer processing equipment 10 and these other wafer processing machines.

[0032] In one embodiment, the wafer processing apparatus 10 may further include processing chambers 56, 58 configured to process wafers.

[0033] In one embodiment, each memory cassette 18 serving as a rotatable stage may include multiple platforms 70. Each platform 70 may support multiple wafer cassettes 16, each serving as a removable holder for holding multiple wafers outside the processing chambers 56, 58. The wafer cassettes 16 may be front-opening wafer cassettes (FOUPs).

[0034] Figure 4 Depicting Figures 1 to 3This is part of a cassette memory turntable 18. The cassette memory turntable 18, serving as a rotatable stage, may include a central vertical frame 71 supporting multiple platforms 70. The central vertical frame 71 and the platforms 70 are rotatable about a fundamental vertical axis perpendicular to the stage. The platforms 70 may support multiple wafer cassettes (not shown). The fundamental vertical axis may be offset from the center relative to the wafers supported on the stage.

[0035] Each cassette memory turntable 18 may also include a drive assembly 72 mounted on a fixed frame 74. The drive assembly 72 is operatively connected to a central vertical frame 71 via drive wheels and a drive belt 73 for driving the central vertical frame 71, with the multiple platforms 70 surrounding a basic vertical axis.

[0036] The device may be equipped with a supply line 76 to supply utility to the central vertical frame 71 and platform 70. The drive assembly 72 may be controlled and configured to generate rotational movement of the central vertical frame 71 and platform 70 in a clockwise and / or counterclockwise direction 77 to prevent breakage of the supply line 76.

[0037] According to one embodiment, the drive assembly 72 can be controlled and configured to generate rotational movement in at least one of clockwise and counterclockwise directions 77 at a maximum first angle. The maximum first angle can be, for example, 180 to 260 degrees, preferably 270 degrees. After this rotation, the supply line 76 can be stretched to its maximum, such that the direction of rotation may need to be changed.

[0038] Therefore, the drive assembly 72 can be controlled and configured to change the direction of rotation to a direction other than said one of the clockwise and counterclockwise directions. The drive assembly 72 can be controlled and configured to generate a rotational movement at a second angle in a direction other than said one of the clockwise and counterclockwise directions. The second angle can be, for example, 180 degrees to 260 degrees, preferably 270 degrees, in a direction other than said one of the clockwise and counterclockwise directions. After this movement, the supply line 76 can be stretched to its maximum, so that the direction of rotation may need to be changed again. The drive assembly can be controlled and configured to change the direction of rotation to said one of the clockwise and counterclockwise directions again.

[0039] According to one embodiment, the utility may be fluid. The supply line 76 may be hollow and is constructed and arranged to supply fluid from the equipment's fluid supply source to the worktable.

[0040] According to one embodiment, the fluid may be a purge gas, and a supply line may be connected to a purge gas supply source for the device. The device may be equipped with a cassette memory turntable 18 serving as a rotatable stage. The cassette memory turntable may include multiple platforms 70 configured and arranged to support multiple wafer cassettes. A supply line may be operatively connected to a plug 75 to provide purge gas to cassettes (e.g., FOUPs) supported on the platforms 70, thereby purging the wafers within the cassettes when they are supported on the platforms 70.

[0041] According to one embodiment, the supply line 76 may include a flexible material that allows rotational movement.

[0042] According to one embodiment, the supply line 76 can be coiled to allow rotational movement.

[0043] According to one embodiment, the fluid may be a coolant, and the supply line 76 may be operatively connected to a coolant supply source for the device. Water may be used as the coolant in the device, and the supply line 76 may be operatively connected to a water cooler.

[0044] According to one embodiment, the utility may be electricity, and the supply line 76 may include a metal core to supply power from the device's power source to the worktable. Similarly, electrical data signals can be transmitted between the rotary table and the controller via the supply line 76 with the metal core.

[0045] Alternatively, supply line 76 can be used for optical data transmission between the rotatable stage and the controller. Therefore, an optical transmission core can be supplied to supply line 76.

[0046] In one embodiment, an example is shown in Figure 5 and 6 As shown, the wafer processing apparatus 10 may have a generally rectangular footprint, having two opposing short sides 66 defining the width of the wafer processing apparatus and two opposing long sides 68 defining the length of the apparatus. The wafer processing apparatus 10 may also include at least one cartridge in / out port 48, which may be arranged at one of the short sides 66 of the wafer processing apparatus 10. Preferably, the wafer processing apparatus includes two cartridge in / out ports 48, which may be arranged adjacent to each other.

[0047] The wafer processing apparatus 10 may further include a cell memory 14 configured to store a plurality of substrate cassettes, each comprising a wafer. The apparatus may include a cell door opening device 54 and a cell manipulator 62 configured to transfer substrate cassettes between a cell in / out port 48, the cell memory 14, and the door opening device 54. The cell memory 14 may be implemented as a cell memory turntable 18. Figure 1 and 2As shown, the wafer processing apparatus 10 may include one or more cassette memory carts 18. The wafer processing apparatus 10 may also include a wafer manipulator 64 configured to transfer wafers between the cassette in the door opening device 54 and the boat 12b in the wafer boat processing apparatus 11.

[0048] Multiple wafer processing units 10 can be placed adjacent to each other by having a basic rectangular footprint and by arranging the cassette inlet / outlet ports 48 at the short side 66 of the unit 10. Cassettes containing wafers to be processed can be conveyed to and from the unit at the short side 66 of the vertical batching furnace 10. Other components of the assembly 10 can be cascaded behind the inlet / outlet ports 48, allowing the wafer processing unit 10 to have a certain maximum width. A width of less than 1100 mm is advantageous considering interchangeability with other vertical batching furnace assemblies.

[0049] This disclosure also provides a wafer processing apparatus 10, which includes a processing chamber 56 for processing wafers housed in a wafer boat, and a wafer boat maneuvering device 11 according to this disclosure. The wafer boat maneuvering device 11 is located below the processing chamber 56 and is provided with a wafer boat elevator 40 configured to transport a wafer boat 12 from the wafer boat maneuvering device 11 to the processing chamber 56 and vice versa.

[0050] The effects and advantages of the chip processing apparatus have been described in the Summary of the Invention section, and these effects and advantages are incorporated herein by reference.

[0051] Finally, this disclosure provides a method for manipulating the wafer boat 12. The method includes:

[0052] A wafer processing apparatus 10 is provided, including a processing chamber 56 and a wafer boat maneuvering device 11 located below the processing chamber 56;

[0053] A first wafer boat 12a loaded with wafers is provided for the support surface of the first wafer boat, and a second wafer boat 12b loaded with wafers is provided for the support surface of the second wafer boat;

[0054] The first wafer boat 12a is vertically loaded from the first wafer boat support surface in the loading / receiving position into the processing chamber 56; and

[0055] The wafer housed in the first wafer boat 12a is processed in the processing chamber 56, while:

[0056] The second wafer boat 12b on the second wafer boat support surface is cooled at a cooling location;

[0057] After cooling, the rotatable stage 34 is rotated to the position where the second wafer boat support surface is in the transfer position;

[0058] Transferring wafers to and / or from the second wafer boat 12b; and

[0059] After the transfer, the rotatable stage 34 is rotated to the position where the first wafer boat support surface is in the loading / receiving position.

[0060] The effects and advantages of this method have been described in the Summary of the Invention section, and these effects and advantages are inserted here by reference.

[0061] In one embodiment, the method may further include:

[0062] Receive the first wafer boat 12a from the processing chamber 56 on the first wafer boat support surface 18; and

[0063] The rotatable stage 34 is then rotated to a rotational position where the second wafer boat support surface is in the loading / receiving position.

[0064] The device may have a cassette memory 60 and a cassette manipulator 62 configured to transfer a wafer cassette between the cassette memory and a wafer transfer position, and a wafer manipulator 64 configured to transfer a wafer between a wafer cassette at the wafer transfer position and a wafer boat 12b at the wafer boat transfer position.

[0065] The rotatable stage 34 can be constructed and arranged to support boats 12a and 12b at a wafer boat transfer position. The device may have a wafer boat lift position, and the rotatable stage 34 can be constructed and arranged to rotate boats 12a and 12b from the wafer boat transfer position to the wafer boat lift position. The device may be provided with supply lines to supply utility to the rotatable stage 34. The supply lines may be coiled and / or made of flexible material to allow rotation. The utility may be cooling water. The device may include a drive assembly controlled and configured to generate rotational movement of the stage 34 in two directions, such as clockwise and / or counterclockwise, to prevent breakage of the supply lines.

[0066] The device may include a processing chamber 56 configured and arranged to process multiple wafers supported in wafer boats 12a and 12b. A wafer boat lift 40 may transfer the wafer boats 12a and 12b between the wafer boat lift position and the processing chamber 56.

[0067] In one embodiment, a rotatable stage can be constructed and arranged to support and rotate a wafer boat 12a, 12b having multiple wafers within a processing chamber 54. The rotatable stage can rotate about an axis perpendicular to the stage. This axis can pass substantially through the center of the wafers supported on the stage. The device may be provided with supply lines to supply utility to the rotatable stage. The supply lines may be power cables supplying power to an electric heater. The supply lines may be coiled and / or made of a flexible material to allow rotation. The device may include a drive assembly controlled and configured to generate rotational movement of the wafer boat in a clockwise and / or counterclockwise direction to avoid breakage of the supply lines.

[0068] Although illustrative embodiments of the invention have been described above in part with reference to the accompanying drawings, it should be understood that the invention is not limited to these embodiments. By studying the drawings, the disclosure, and the appended claims, those skilled in the art will understand and implement variations of the disclosed embodiments in practicing the claimed invention.

[0069] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. Therefore, the appearance of the phrase "in one embodiment" or "in one embodiment" throughout this specification does not necessarily refer to the same embodiment.

[0070] Furthermore, it should be noted that one or more specific features, structures, or characteristics in the various embodiments described above can be used and implemented independently of each other, and can be combined in any suitable manner to form new, undescribed embodiments. The reference numerals used in the detailed description and claims do not limit the description of the embodiments, nor do they limit the claims. The reference numerals are for clarification only.

Claims

1. A wafer processing apparatus for processing wafers, comprising: A rotatable stage is provided with a support member that is constructed and arranged to support a removable holder for holding multiple wafers; as well as A drive assembly is provided to provide rotational movement to a rotatable stage about a substantially vertical axis substantially perpendicular to the rotatable stage; wherein the device is provided with supply lines to provide utility to the rotatable stage, and the drive assembly is controlled and configured to generate rotational movement of the rotatable stage in both clockwise and counterclockwise directions to prevent breakage of the supply lines. The utility is fluid, and the supply line is hollow and configured and arranged to supply fluid from the fluid supply source of the device to the rotatable worktable; Wherein, the fluid is purge gas, and the supply line is connected to the purge gas supply source of the device; and The device includes a cassette memory, comprising a rotatable stage as a cassette memory turntable, the cassette memory turntable being constructed and arranged to support a plurality of wafer cassettes, and the supply lines being operatively connected to plugs to provide purge gas to the cassettes.

2. The device according to claim 1, wherein, The drive component is controlled and configured to generate rotational motion at a first angle in one of the clockwise and counterclockwise directions.

3. The device according to claim 2, wherein, The drive component is controlled and configured to change the direction of rotation to another direction other than the clockwise or counterclockwise direction when the rotational movement in one of the clockwise and counterclockwise directions reaches the first angle.

4. The device according to claim 2, wherein, The drive component is controlled and configured to generate rotational motion in a direction other than one of the clockwise and counterclockwise directions at a second angle equal to but opposite to the first angle.

5. The device according to claim 4, wherein, The drive component is controlled and configured to change the rotation direction back to one of the clockwise and counterclockwise directions when the rotational movement in the other direction besides the clockwise and counterclockwise directions reaches the second angle.

6. The device according to claim 1, wherein, The supply line is coiled to allow for rotational movement.

7. The device according to claim 1, wherein, The supply line includes a flexible material to allow for rotational movement.

8. The device according to claim 1, wherein, The device includes a processing chamber configured and arranged to process multiple wafers supported in a wafer boat.

9. The device according to claim 8, wherein, The rotatable worktable is constructed and arranged to support and rotate the wafer boat within the processing chamber.

10. The device according to claim 8, wherein, The rotatable stage is constructed and arranged to support and rotate multiple wafers outside the processing chamber.

11. The device according to claim 1, wherein, The rotatable stage can rotate about a fundamental vertical axis perpendicular to the rotatable stage, wherein the fundamental vertical axis is off-center relative to the wafer supported on the rotatable stage.

12. The device according to claim 1, wherein, The rotatable stage can rotate about a generally vertical axis perpendicular to the rotatable stage, wherein the vertical axis passes substantially through the center of the wafer supported on the rotatable stage.

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