A communication device and a communication system

Abstract

A communication device and a communication system, the communication device comprising a frame, the frame having a first inner wall and a second inner wall arranged oppositely; a connecting plate is arranged in the frame, one side of the connecting plate faces the first inner wall, and the other side of the connecting plate faces the second inner wall; the connecting plate is provided with a first insertion slot and a second insertion slot extending along the depth direction of the frame; the first insertion slot and the second insertion slot are located on the two sides of the connecting plate, and the first inner wall is provided with a first inner wall insertion slot corresponding to the first insertion slot, each pair of corresponding first insertion slot and first inner wall insertion slot forms a first insertion pair; the second inner wall is provided with a second inner wall insertion slot corresponding to the second insertion slot, and each pair of corresponding second insertion slot and second inner wall insertion slot forms a second insertion pair. The communication device changes the structure of the first insertion pair and the second insertion pair, so that the size of the single board can be larger, so as to expand the circuit board area of the single board, thereby improving the space utilization and the single board density.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a communication device and communication system. Background Technology

[0002] With the rapid development of the Internet, computer rooms and data centers have been built on a large scale, and communication equipment such as large chassis switches, firewalls, and storage devices play a vital role as core equipment.

[0003] When using current communication equipment, two half-width boards or one full-width board can be selectively installed in one slot of the chassis. Because the same slot needs to accommodate both half-width and full-width boards simultaneously, the internal structure of the chassis is relatively complex, resulting in a small space occupied by the slots within the chassis, low space utilization, and an inability to increase board density.

[0004] Therefore, improving the space utilization and board density of communication equipment is an urgent problem to be solved. Summary of the Invention

[0005] This application provides a communication device and a communication system to improve the space utilization and single-board density of the communication device.

[0006] Firstly, this application provides a communication device applied in a communication system, comprising a frame. In practical applications, one side of the frame serves as a plug-in end, facilitating the insertion of a single board into the frame along its depth direction. Regarding the frame structure, specifically, the frame has a first inner wall and a second inner wall arranged opposite to each other, their arrangement forming a first direction. A connecting plate is also provided within the frame, with one side facing the first inner wall and the other side facing the second inner wall. Specifically, the connecting plate has a first plug-in slot and a second plug-in slot on each side. The first plug-in slot corresponds one-to-one with the first inner wall plug-in slot on the first inner wall of the frame, forming a first plug-in pair, and the second plug-in slot corresponds one-to-one with the second inner wall plug-in slot on the second inner wall of the frame, forming a second plug-in pair. It is worth noting that both the first and second plug-in pairs are used for inserting single boards. During assembly, two single boards are respectively inserted into the first and second plug-in pairs. After the single board is assembled into the frame, along the arrangement direction of the first inner wall and the second inner wall, the sum of the lengths of the two single boards inserted into the first insertion pair and the second insertion pair is greater than the distance between the insertion slot of the first inner wall and the insertion slot of the second inner wall.

[0007] The communication device provided in this application modifies the structure of the first and second plug pairs, allowing for a larger single-board size inserted into the first and second plug pairs, thereby increasing the circuit board area. Based on this, the sum of the circuit board areas of the two half-width single boards plugged into the first and second plug pairs in the communication device provided in this application can be greater than the area of ​​the circuit board within a full-width single board, thus improving the space utilization and single-board density of the communication device.

[0008] In one specific implementation, the connecting plate has a centerline extending along a second direction; the second direction is perpendicular to the first direction and perpendicular to the depth direction of the frame; the first insertion slot extends beyond the centerline along the first direction, and the second insertion slot extends beyond the centerline along the first direction. For example, the first inner wall and the second inner wall are respectively the side walls of the frame for specific illustration. In a specific configuration, the first insertion pair and the second insertion pair are arranged along the direction perpendicular to the bottom of the frame, and the vertical projections of the first insertion pair and the second insertion pair onto the bottom of the frame overlap. Specifically, the communication device provided in this application staggers and overlaps the first insertion pair and the second insertion pair in the direction perpendicular to the bottom of the frame, so that the projections of the first insertion pair and the second insertion pair onto the plane perpendicular to the first direction and the depth direction of the frame overlap. This facilitates improved space utilization and single-board density of the communication device.

[0009] In one specific implementation scheme, the first insertion slot and the second insertion slot are arranged alternately along the second direction. This facilitates the rational planning of the single-board position and makes full use of the internal space of the chassis.

[0010] In one specific implementation, the system further includes a single board and a backplate. The frame has a mating surface, and the single board can selectively mat to either a first mating pair or a second mating pair from the mating surface. Specifically, the single board includes a first circuit board and components and a first connector disposed on the same side of the first circuit board. The first connector has a connecting end located on the side of the first connector opposite to the mating surface. The backplate is disposed on the frame and located on the side of the connecting board opposite to the mating surface of the frame. The backplate includes a second circuit board with a placement surface. The placement surface has a plurality of second connectors for connecting to the first connector of the single board inserted into the first mating pair or the second mating pair. This facilitates the mating connection between the single board and the backplate.

[0011] In one specific implementation, the first connector is located at one end of the first circuit board near the first and / or second insertion slot. This facilitates the centralized deployment of the second connectors on the backplane, reduces the area of ​​the second circuit board within the backplane, and shortens signal length, reduces losses, and increases signal transmission rate.

[0012] In one specific implementation, the placement surface is parallel to the insertion surface of the chassis, and the connection end of the second connector faces the insertion surface of the chassis. Each second connector is sequentially embedded in the first insertion slot and the second insertion slot. The second connectors on the backplate can be centrally arranged, thereby reducing the area of ​​the second circuit board. It should be understood that reducing the size of the second circuit board on the backplate can reduce costs, increase ventilation area, and improve heat dissipation capacity.

[0013] In one specific implementation, the placement surface is perpendicular to the insertion surface of the chassis, and the placement surface includes a first placement surface and a second placement surface; both the first placement surface and the second placement surface are provided with a plurality of second connectors, and the second connectors located on the first placement surface are used to connect with the first connector of the single board inserted into the first insertion pair, and the second connectors located on the second placement surface are used to connect with the first connector of the single board inserted into the second insertion pair. The insertion surface of the chassis and the planes opposite to the insertion surfaces form an air flow channel for the chassis. The first placement surface and the second placement surface of the back plate are parallel to the air flow direction within the chassis, which can improve the air flow effect within the chassis, thereby improving the heat dissipation effect.

[0014] Secondly, this application provides a communication system including the communication device described in any of the above claims. In the above technical solutions, the communication device modifies the structure of the first plug pair and the second plug pair, allowing the size of the single board inserted into the first plug pair and the second plug pair to be larger, thereby increasing the circuit board area of ​​the single board. Based on this, the sum of the circuit board areas of the two half-width single boards inserted into the first plug pair and the second plug pair in the communication device provided by this application can be greater than the area of ​​the circuit board within a full-width single board, thereby increasing the communication device's overall single board density. Attached Figure Description

[0015] Figure 1 This is a structural block diagram of existing communication equipment;

[0016] Figure 2 This is another structural block diagram of existing communication devices;

[0017] Figure 3 A structural block diagram of a communication device provided in an embodiment of this application;

[0018] Figure 4 This is a structural block diagram of the chassis in the communication device provided in the embodiments of this application;

[0019] Figure 5 A schematic diagram illustrating the fit between the chassis and the half-width single board provided in an embodiment of this application;

[0020] Figure 6 Another schematic diagram illustrating the fit between the chassis and the half-width single board provided in an embodiment of this application;

[0021] Figure 7 This is a structural block diagram of the backplane in a communication device provided in an embodiment of this application;

[0022] Figure 8 A schematic diagram illustrating the fit between the chassis and the backplate provided in an embodiment of this application;

[0023] Figure 9 Another structural block diagram of the backplane in the communication device provided in the embodiments of this application;

[0024] Figure 10 This is another schematic diagram illustrating the fit between the chassis and the backplate provided in an embodiment of this application;

[0025] Figure 11 This is another schematic diagram of the fit between the chassis and the half-width single board provided in an embodiment of this application. Detailed Implementation

[0026] The communication equipment provided in this application embodiment is applied to common communication systems. Specifically, the communication equipment provided in this application embodiment can be applied to any multi-service board chassis system, as well as to various fields such as wireless, fixed network, switching, industrial control, and computing, and can even be applied to systems using fifth-generation mobile communication technology and sixth-generation mobile communication technology.

[0027] The communication equipment currently used in the above scenarios, such as Figure 1 and Figure 2 As shown. Figure 1 In the communication device 001 shown, a backplate 02 is provided on the back of the chassis 01. Combined with... Figure 2 In the structure, the back panel 01 has a cutout area 011 for ventilation and heat dissipation. Furthermore, to accommodate both half-width and full-width single-board units 03 and 04, each full-width slot on the back panel 01 has two sets of back panel connectors 012 to support two half-width single-board units 03. However, dividing a full-width slot into half-width slots requires structural components between the two half-width slots to secure the two half-width single-board units 03. This results in a smaller space occupied by the slots within the frame 01, leading to lower space utilization of the frame 01.

[0028] like Figure 2 In the structure shown, the length L1' of the two half-width single boards 03 inserted into the half-width slot is less than the length L2' of the full-width single board 04 inserted into the full-width slot. Based on this, the sum of the circuit board areas in the two half-width single boards 03 is less than the area of ​​the circuit board in the full-width single board 04, and the single board density in the frame 01 is low.

[0029] In view of this, this application provides a communication device to improve the space utilization and single-board density of the communication device.

[0030] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0031] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0032] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0033] Figure 3 A structural block diagram of a communication device provided in an embodiment of this application is shown. Figure 3 The structure shown illustrates that the communication device 100 includes a chassis 1 and a backplane 2. The chassis 1 serves as a load-bearing structure, supporting the backplane 2 and other components. For example, the backplane 2 can be fixed to the chassis 1 using screws or similar structures. The backplane 2 acts as an adapter plate for transmitting signals from the half-width board 3. In use, the half-width board 3 can be inserted into the chassis 1 and connected to the backplane 2. The backplane 2 transmits the signals or current from the half-width board 3 to other devices via connected cables. Notably, the backplane 2 allows for connections between multiple half-width boards 3. Specifically, it enables connections with arbitrary topologies, such as star, partial point-to-point, or full interconnection.

[0034] Please continue to refer to this. Figure 3The frame 1 has a first inner wall A1 and a second inner wall A2 arranged opposite to each other, as well as a top inner wall B1 and a bottom inner wall B2 arranged opposite to each other. The first inner wall A1, the top inner wall B1, the second inner wall A2, and the bottom inner wall B2 are connected end-to-end to form a frame-shaped structure, which has space to accommodate the back panel 2 and the half-width single panel 3. The frame 1 has openings at both ends, which are named the first port and the second port for ease of description. It is worth noting that the first port and the second port form a gas flow channel within the frame 1.

[0035] To facilitate the description of the relative positions of frame 1, backplate 2, and half-width single plate 3, we assume an XYZ coordinate system, where directions X, Y, and Z are parallel to the three adjacent sides of frame 1, respectively. The plane containing the first port of frame 1 is the insertion surface of frame 1, which is parallel to plane XZ. Specifically, Figure 3 The opening observed along direction Y1 is the first port of frame 1, and correspondingly, the opening observed along direction Y2 is the second port on the back of frame 1. During assembly, back plate 2 can be inserted into frame 1 along direction Y2 from the second port, and half-width single plate 3 can be inserted into frame 1 along direction Y1 from the first port.

[0036] Furthermore, the frame 1 is provided with a connecting plate 4 extending along the direction from the top inner wall B1 to the bottom wall B2 of the frame 1. One side of the connecting plate 4 faces the first inner wall A1, and the other side faces the second inner wall A2. To clearly show the positional relationship between the connecting plate 4 and the frame 1, the connecting plate 4 and the frame 1 are schematically separated by a dashed line. It should be understood that the separation position between the connecting plate 4 and the frame 1 is not limited to this, and will not be described further here.

[0037] Figure 4 for Figure 3 A schematic diagram of the observation frame 1 along the Y1 direction. For a clearer representation of the structure of the connecting plate 4, please refer to [reference needed]. Figure 4 The structure shown is such that the connecting plate 4 has a first insertion groove 41 on the side facing the first inner wall A1 and a second insertion groove 42 on the side facing the second inner wall A2. The first insertion groove 41 and the second insertion groove 42 extend along the Y direction. Figure 4 (Not shown in the diagram, i.e., extending in the vertical plane XZ direction). It should be noted that, schematically, the number of both the first insertion slot 41 and the second insertion slot 42 is set to four, and the first insertion slot 41 and the second insertion slot 42 are arranged alternately and superimposed in the Z direction. Of course, the number of the first insertion slot 41 and the second insertion slot 42 and their layout along the Z direction can be set according to requirements, and will not be elaborated here.

[0038] Please continue to refer to this. Figure 4The first inner wall A1 of the frame 1 is provided with a first inner wall insertion groove 11 corresponding to the first insertion groove 41, and the first inner wall insertion groove 11 and one first insertion groove 41 correspond to form a first insertion pair D1. Similarly, the second inner wall A2 of the frame 1 is provided with a second inner wall insertion groove 12 corresponding to the second inner wall insertion groove 42, and the second inner wall insertion groove 12 and one second insertion groove 42 correspond to form a second insertion pair D2. Figure 4 As can be seen from the structure shown, the first plug pair D1 and the second plug pair D2 are alternately stacked along the Z direction.

[0039] Please continue to refer to this. Figure 4 Specifically, both the first insertion slot 41 and the second insertion slot 42 extend beyond the centerline O of the frame 1 in the X direction, meaning the first insertion pair D1 and the second insertion pair D2 are offset in the Z direction. In other words, when the first insertion pair D1 and the second insertion pair D2 are projected along the Z direction onto the bottom inner wall B2 of the frame 1, their vertical projections onto the bottom inner wall B2 of the frame 1 overlap. Based on this, the sum of the length L1 of the first insertion pair D1 in the X direction and the length L2 of the second insertion pair D2 in the X direction is greater than the distance L3 between the first inner wall insertion slot 11 and the second inner wall insertion slot 12. It should be understood that L1 and L2 are the same size here, while L3 is the same as the length of a full-width single board in the X direction.

[0040] Figure 5 This is a schematic diagram of a frame 1 fully equipped with half-width single-plate 3. Of course, when using the frame 1 provided in this embodiment, half-width single-plate 3 can be inserted as needed. For example, Figure 6 for Figure 4 The diagram shows the structure of the frame 1 after assembling the half-width single-plate 3. Multiple half-width single-plates 3 are arranged along the Z-direction of the frame 1. Specifically, as shown... Figure 6 As shown in the structure, during assembly, the two half-width single boards 3 are respectively inserted into the first insertion pair D1 and the second insertion pair D2.

[0041] Here Figure 6 Taking the half-width board 3 shown as an example, which is plugged into the first plug-in pair D1, the structure of the half-width board 3 will be specifically described. The first circuit board 31 inside the half-width board 3 is provided with components 32 and a first connector 33. The first connector 33 is located on the side of the first circuit board 31 near the first plug-in slot 41, and the connection end of the first connector 33 faces the second port of the frame 1.

[0042] It is worth noting that the half-width board 3 inserted into the second plug pair D2 has the same structure as the half-width board 3 inserted into the first plug pair D1, the only difference being that the insertion directions of the two half-width boards 3 are opposite. Here, it is stipulated that the half-width board 3 inserted into the first plug pair D1 is a forward insertion, meaning that the components 32 and the first connector 33 within the half-width board 3 are located on the side of the first circuit board 31 facing the top inner wall B1. Correspondingly, the half-width board 3 inserted into the second plug pair D2 is a reverse insertion. This forward and reverse insertion design of the first plug pair D1 and the second plug pair D2 can save internal space in the frame 1, thereby increasing the board density within the frame 1.

[0043] Please continue to refer to this. Figure 6 In the structure shown, the length of the half-width single plate 3 is L4, and L4 equals Figure 4 In the case of L1 or L2. Clearly, the sum of the lengths L4 of the two half-width single-panel 3s is greater than... Figure 4 In this context, L3 means that the sum of the lengths L4 of the two half-width boards 3 is greater than the dimension of a full-width board in the X direction. Specifically, this structural design increases the area of ​​the first circuit board 31 within the gray region S of the two half-width boards 3, allowing for the placement of more components and expansion of the wiring area on the first circuit board 31. This, in turn, increases the board density within the chassis 1 and improves the space utilization within the chassis 1. Of course, to facilitate the smooth insertion of the half-width board 3 into the first plug pair D1 or the second plug pair D2, for example, the length L4 of the half-width board 3 can be designed to be greater than that of a full-width board. Figure 4 The L1 and L2 shown in the diagram are slightly smaller.

[0044] It is worth noting that, such as Figure 6 In the structure shown, the first insertion slot 41 and the second insertion slot 42 are arranged alternately in the Z direction to form an S-shaped structure. The first connectors 33 on the two half-width single boards 3 are located close to the first insertion slot 41 or the second insertion slot 42. In other words, the first connectors 33 in this structure are concentrated in the middle area of ​​the frame 1, which facilitates the installation of the back plate 2.

[0045] When setting the structure of backplate 2, it can be set as follows: Figure 7 The structure shown includes a backplate 2 comprising a second circuit board 21 having a placement surface M parallel to the plane XZ. The placement surface M is provided with a second connector for connecting to the half-width single board 3. The second connector is shown as a second connector 22a and a second connector 22b.

[0046] When the backplate 2 is assembled to the frame 1, the placement surface M faces the second port of the frame 1, the second connector 22a is embedded in the first insertion slot 41 of the connecting plate 4, and the second connector 22b is embedded in the second insertion slot 42 of the connecting plate 4, forming as shown in the figure. Figure 8 The structure shown is such that, due to the relatively concentrated distribution of the second connectors 22a and 22b, as... Figure 8 As shown in the diagram, the second circuit board 21 can be arranged in a strip shape. The centralized distribution structure of the second connectors 22a and 22b can effectively reduce the area of ​​the second circuit board 21 within the back panel 2, and also reduce the routing length of the signal lines within the second circuit board 21, thereby reducing the loss of the communication equipment, reducing the equipment manufacturing cost, and improving the signal transmission rate of the communication equipment. Furthermore, when the area of ​​the second circuit board 21 within the back panel 2 is reduced, the ventilation area and heat dissipation capacity of the chassis 1 can also be increased.

[0047] Of course, backplate 2 can also be as follows: Figure 9 The structure is shown. The backplate 2 includes a second circuit board 21, which has a first placement surface M1 and a second placement surface M2 parallel to the plane YZ. The first placement surface M1 is provided with a second connector 22a for connecting to the half-width single board 3; the second placement surface M2 is provided with a second connector 22b for connecting to the half-width single board 3. It should be understood that, due to the viewing angle, the second connector 22a is shown as a dashed line here.

[0048] like Figure 10 As shown, when the backplate 2 is assembled to the frame 1, the backplate 2 enters the interior of the frame 1 from the second port and is located on the side of the connecting frame 4 facing the second port. Specifically, the first placement surface M1 of the backplate 2 faces the first inner wall A1 of the frame 1, and the second placement surface M2 faces the second inner wall A2 of the frame 2. The second connector 22a corresponds to the first insertion slot 41 of the connecting plate 4, and the second connector 22b corresponds to the second insertion slot 42 of the connecting plate 4. In this structure, the backplate 2 is an orthogonal backplate, that is, the first placement surface M1 and the second placement surface M2 of the backplate 2 are perpendicular to the first port and the second port of the frame 1. It should be noted that the orthogonal arrangement of the backplate 2 and the frame 1 can further increase the ventilation area of ​​the frame 1, thereby improving the heat dissipation effect of the frame 1.

[0049] It should be understood that in the above structures, the first inner wall A1 and the second inner wall A2 are shown as the side walls of the frame 1. Of course, the first inner wall A1 and the second inner wall A2 can also be arranged along the top to bottom direction of the frame 1, that is, the second inner wall A2 serves as the top inner wall of the frame 1, and the first inner wall A1 serves as the bottom inner wall of the frame 1, as specifically... Figure 11 As shown in the structure, multiple half-width single plates 3 can be arranged laterally along the frame 1.

[0050] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A communication device, characterized in that, Includes a frame, the frame having a first inner wall and a second inner wall disposed opposite to each other, and the first inner wall and the second inner wall being arranged along a first direction; The frame is provided with a connecting plate, one side of which faces the first inner wall and the other side faces the second inner wall. The connecting plate has at least one first insertion slot and at least one second insertion slot extending along the depth direction of the frame. The first and second insertion slots are located on opposite sides of the connecting plate, and the first inner wall has first inner wall insertion slots corresponding one-to-one with the first insertion slots, each pair of corresponding first insertion slots forming a first insertion pair. The second inner wall has second inner wall insertion slots corresponding one-to-one with the second insertion slots. Each pair of the second insertion slots and the second inner wall insertion slots form a second insertion pair; the first insertion slots and the second insertion slots are alternately stacked in the second direction, and the first insertion pairs and the second insertion pairs adjacent in the second direction are respectively used for inserting single boards in opposite directions; in the first direction, the sum of the length of the single board corresponding to the first insertion pair and the length of the single board corresponding to the second insertion pair is greater than the distance between the first inner wall insertion slot and the second inner wall insertion slot, and the second direction is perpendicular to the first direction and perpendicular to the depth direction of the frame.

2. The communication device as described in claim 1, characterized in that, The connecting plate has a center line that extends along the second direction; the first insertion slot extends beyond the center line along the first direction, and the second insertion slot extends beyond the center line along the first direction.

3. The communication device as described in claim 1, characterized in that, It also includes a single board, the frame having a plug-in surface, the single board being selectively plugged into the first plug pair or the second plug pair from the plug-in surface; the single board includes a first circuit board and components and a first connector disposed on the first circuit board, the first connector having a connection end located on the side of the first connector opposite to the plug-in surface.

4. The communication device as described in claim 3, characterized in that, The first connector is located at one end of the first circuit board near the first insertion slot and / or the second insertion slot.

5. The communication device as described in claim 4, characterized in that, It also includes a backplate, which is disposed on the frame and located on the side of the connecting plate opposite to the insertion surface of the frame; the backplate includes a second circuit board, which has a placement surface and a plurality of second connectors, which are used to connect to a first connector of the single board inserted into the first insertion pair or the second insertion pair.

6. The communication device as described in claim 5, characterized in that, The placement surface is parallel to the insertion surface of the frame, and the connection end of the second connector faces the insertion surface of the frame. Each second connector is sequentially embedded in the first insertion slot and the second insertion slot.

7. The communication device as described in claim 5, characterized in that, The placement surface is perpendicular to the insertion surface of the frame, and the placement surface includes a first placement surface and a second placement surface; both the first placement surface and the second placement surface are provided with a plurality of second connectors, and the second connectors located on the first placement surface are used to connect with the first connector of the single board inserted into the first insertion pair, and the second connectors located on the second placement surface are used to connect with the first connector of the single board inserted into the second insertion pair.

8. A communication system, characterized in that, Includes the communication device as described in any one of claims 1 to 7.

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