Array-type connection structure and electronic devices

Abstract

This application discloses an array-type connection structure and an electronic device, belonging to the field of electronic devices. The array-type connection structure includes a bracket and multiple connection components. The bracket is used to fix multiple connection components arranged at intervals along its length, and no signal traces are provided in the bracket. Each connection component extends through the bracket. Each connection component has a connector interface on its first side, which includes multiple first signal terminals for connecting to a first electronic device located on the first side of the bracket. Multiple cables are directly connected to the second side of each connection component, each cable corresponding to a different second signal terminal of the connection component, and the cables are used to connect to a second electronic device located on the second side of the bracket. The bracket has heat dissipation holes, at least partially located between two adjacent connection components. The array-type connection structure provided in this application provides excellent heat dissipation.

Description

[0001] This application claims priority to Chinese Patent Application No. 202011492203.9, filed on December 17, 2020, entitled “Array-type Connection Structure and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic devices, and more particularly to array-type connection structures and electronic devices. Background Technology

[0003] Within a data center, there are numerous servers housed in server racks. A server primarily consists of a chassis and various electronic components. These electronic components are installed within the chassis and electrically interconnected as needed to form the server unit.

[0004] In related technologies, electronic components mainly include chipsets and multiple hard drives arranged in an array. To organize the arrangement of electronic components, the chipset is not directly electrically connected to each hard drive via cables. Instead, the hard drives are typically placed on one side of the chassis, and the chipset on the other side, connected by a backplane. The backplane is a printed circuit board (PCB), with connectors on both sides. The hard drives are plugged into connectors on one side of the backplane, and the chipset is connected to connectors on the other side of the backplane via cables.

[0005] However, because there is a backplane between the chipset and the hard drive, the backplane will block the heat dissipation airflow between the chipset and the hard drive, resulting in a significant reduction in heat dissipation. At the same time, since the hard drive and chipset are connected through the backplane, there will be a significant signal loss. Summary of the Invention

[0006] This application provides an array-type connection structure and electronic device to solve the problem of poor heat dissipation. The technical solution is as follows:

[0007] Firstly, an array-type connection structure is provided, comprising a bracket and multiple connection components. The bracket does not contain signal traces and does not transmit signals. The bracket is used to fix the multiple connection components, which are arranged sequentially at intervals along the length of the bracket, with each connection component penetrating the bracket. Each connection component has a connector interface on its first side, containing multiple first signal terminals. The connector interface is used for direct insertion into a first electronic device located on the first side of the bracket; that is, the first electronic device can be directly inserted into the connection interface to electrically connect with the multiple first signal terminals inside the connector interface. Multiple cables are directly connected to the second side of each connection component. These cables are electrically connected one-to-one with multiple second signal terminals of the connection component, and are used to connect to a second electronic device located on the second side of the bracket. At least a portion of the multiple second signal terminals are electrically connected one-to-one with at least a portion of the multiple first signal terminals inside the connection component. In other words, the first electronic device and the second electronic device are directly connected through the connection components and the cables. The bracket has heat dissipation holes, which are at least partially located between two adjacent connecting components. This design allows the heat dissipation holes to serve as airflow channels, enabling airflow to pass between the first and second sides of the bracket, thereby carrying away the heat generated by the first and second electronic devices during operation and improving the heat dissipation effect of the array-type connecting structure.

[0008] The array-type connection structure provided in this application embodiment has at least the following effects:

[0009] After the first electronic device located on the first side of the bracket and the second electronic device located on the second side of the bracket are connected together by the connecting component and the cable, the signal loss is very small because no transition is required between the first and second electronic devices. During the movement of the first and second electronic devices, airflow can pass through the bracket via the heat dissipation holes and circulate between the first and second sides of the bracket to carry away the heat generated by the first and second electronic devices during operation, thereby achieving heat dissipation for the first and second electronic devices. In other words, the airflow is not obstructed by the bracket, allowing the first and second electronic devices to receive sufficient heat dissipation.

[0010] As an exemplary embodiment, the bracket includes an outer frame and an inner strip. The outer frame includes a first side, a second side, a third side, and a fourth side connected sequentially. The first side and the third side are opposite to each other and extend along the length direction of the outer frame. The second side and the fourth side are opposite to each other. The connecting component is connected to the first side, thereby enabling the connecting component to be connected to the outer frame. The inner strip is located between the first side and the third side, and is away from the first side of the outer frame, i.e., close to the third side of the outer frame. The inner strip extends along the length direction of the outer frame, such that the first end of the inner strip is connected to the second side, and the second end of the inner strip is connected to the fourth side. The inner strip is connected to the connecting component, thereby increasing the connection base of the connecting component on the bracket, so that the connecting component can be more securely connected to the bracket, ensuring the reliability of the array-type connection structure. The heat dissipation hole is located in at least one location in the region between the inner strip and the first side, or in the region between the inner strip and the third side. This design ensures that at least one side of the inner plate has the heat dissipation through hole, thereby guaranteeing the flow area of ​​the heat dissipation through hole.

[0011] As an exemplary embodiment, the heat dissipation through-hole includes a first sub-through-hole and a second sub-through-hole. The first sub-through-hole is located between one side of the inner slat along its length and the first side of the outer frame, and the second sub-through-hole is located between the other side of the inner slat along its length and the third side of the outer frame. That is, the first and second sub-through-holes are located on opposite sides of the inner slat. This design ensures sufficient flow area for the bracket, thereby facilitating airflow between the first and second sides of the bracket and improving the heat dissipation performance of the array-type connection structure.

[0012] As an exemplary embodiment, the outer frame has a plurality of first mounting holes on its first side, with each first mounting hole arranged at intervals along the length of the outer frame. This design facilitates the installation of the connecting component on the first side of the outer frame via the first mounting holes, allowing the connecting component to be easily and securely connected to the outer frame. The inner strip has a plurality of second mounting holes, with each second mounting hole arranged at intervals along the length of the inner strip. Based on the same principle as the first mounting holes, this design facilitates the installation of the connecting component on the inner strip via the second mounting holes, allowing the connecting component to be easily and securely connected to the inner strip. Furthermore, since the connecting component is connected to both the first side of the outer frame and the inner strip, using the first side of the outer frame and the inner strip as mounting bases allows the connecting component to be securely installed on the bracket.

[0013] As an exemplary embodiment, the bracket further includes a first reinforcing rib and a second reinforcing rib. The first reinforcing rib is connected between one side of the inner slat along its length and the first side. The second reinforcing rib is connected between the other side of the inner slat along its length and the third side. Thus, the first and second reinforcing ribs are located on opposite sides of the inner slat. This design reinforces the opposite sides of the inner slat with the first and second reinforcing ribs, ensuring a stable connection of the inner slat within the outer frame and improving the stability of the connection assembly on the bracket.

[0014] As an exemplary embodiment, the bracket includes an outer frame, which includes a first side, a second side, a third side, and a fourth side connected sequentially. The first side and the third side are opposite to each other and extend along the length of the outer frame. The second side and the fourth side are opposite to each other. The connecting component is connected to the first side, thereby enabling the connection of the connecting component on the outer frame. The heat dissipation hole is located between the first side, the second side, the third side, and the fourth side. This design omits the inner plate strip, the first reinforcing rib, and the second reinforcing rib, further increasing the flow area of ​​the heat dissipation hole, thereby facilitating airflow between the first and second sides of the bracket and improving the heat dissipation performance of the array-type connection structure.

[0015] As an exemplary embodiment, the outer frame has a third mounting hole on its first side, and the third mounting holes are arranged at intervals along the length of the outer frame. This design facilitates the installation of the connecting component on the first side of the outer frame via the third mounting holes, allowing the connecting component to be easily and securely connected to the outer frame. Furthermore, since the inner strip is omitted, only the third mounting holes need to be provided on the first side of the outer frame, saving materials and contributing to cost control.

[0016] In one exemplary embodiment, the orthographic projection of the connecting component on the bracket is at least partially located within the heat dissipation through-hole. That is, the connecting component partially obstructs the heat dissipation through-hole. This design ensures that airflow passes through the heat dissipation through-hole and simultaneously through the connecting component, thereby enabling the airflow to dissipate heat not only from the first and second electronic devices but also from the connecting component, further improving the heat dissipation performance of the array-type connecting structure. Alternatively, there is a gap between the connecting component and the edge of the adjacent heat dissipation through-hole. That is, the connecting component and the heat dissipation through-hole are spaced apart, and the connecting component does not obstruct the heat dissipation through-hole. This design ensures the flow area of ​​the heat dissipation through-hole, thereby ensuring that the airflow can adequately dissipate heat from the first and second electronic devices.

[0017] As an exemplary embodiment, the connection assembly includes a housing and a connector. The housing is located on the second side of the bracket and connected to the bracket to achieve a connection and fixation between the connection assembly and the bracket. The second part of the connector is inserted into the housing, and the plurality of second signal terminals are located on the second part of the connector for electrical connection with the second electronic device via the cable. Thus, the connector uses the housing as a mounting base. Furthermore, since the second part of the connector is located on the second side of the bracket, this part of the connector can be easily electrically connected to the second electronic device via the cable. The first part of the connector is located outside the housing and on the first side of the bracket, and the plurality of first signal terminals are located on the first part of the connector for electrical connection with the first electronic device via the connector interface. This design allows the first part of the connector to be easily connected to the first electronic device. In other words, through the above design, the housing provides a mounting base for the connector, so that the two parts of the connector are located on the first and second sides of the bracket respectively, thereby enabling convenient connection of the first electronic device and the second electronic device respectively via the connector.

[0018] As an exemplary embodiment, the housing includes a first half-shell and a second half-shell. The first half-shell is connected to the bracket, thereby achieving a connection between the housing and the bracket. The second half-shell is detachably connected to the first half-shell, and a gap is provided between the second half-shell and the first half-shell to accommodate the connector, thereby enabling a secure installation of the connector through the first half-shell and the second half-shell.

[0019] As an exemplary embodiment, the connector includes a first sub-connector. The first sub-connector includes a first lead portion and a first socket portion. The first lead portion is located within the gap, and the plurality of second signal terminals are located within the first lead portion. The first socket portion extends out of the gap and is located on a second side of the bracket. The plurality of first signal terminals are located within the first socket portion, and the first socket portion is used to connect to the first electronic device. The first signal terminals are disposed within the first socket portion, and by inserting the first electronic device into the first socket portion, an electrical connection between the first electronic device and the first signal terminals can be achieved. The second signal terminals are disposed within the first lead portion. Since the second signal terminals are electrically connected to both the first signal terminals and the cable, an electrical connection between the cable and the first electronic device is achieved. After the cable and the second electronic device are electrically connected, an electrical connection between the second electronic device and the first electronic device can be achieved.

[0020] As an exemplary embodiment, the first sub-connector further includes a first locking tooth located between the first lead portion and the first socket portion. The first locking tooth engages with the first half-shell and the second half-shell respectively, thereby achieving a stable connection between the first sub-connector and the first half-shell through the first locking tooth.

[0021] As an exemplary embodiment, the first sub-connector further includes a positioning pin located at the first socket portion. One end of the positioning pin is connected to the first socket portion, and the other end extends away from the first lead portion and is inserted into the bracket. This design allows the positioning pin to directly position the first sub-connector and the bracket, ensuring accurate installation between them and facilitating the insertion of electronic devices into the first sub-connector.

[0022] As an exemplary embodiment, the connector further includes a second sub-connector. The second sub-connector is spaced apart from the first sub-connector and includes a second lead portion and a second socket portion. The second lead portion is located within the gap and is electrically connected to the first lead portion. The second socket portion extends out of the gap and is located on a second side of the bracket. The second socket portion is used to connect to the second electronic device. Because the second lead portion is electrically connected to the first lead portion, the second lead portion can lead a portion of the signal from the first signal terminal to the second socket portion and transmit it to the second electronic device through the second socket portion. This allows for more diverse ways of connecting the first and second electronic devices, facilitating the overall wiring of the array-type connection structure.

[0023] As an exemplary embodiment, the second side of the connection assembly further has a plurality of third signal terminals. The plurality of third signal terminals are located at the first lead portion, and at least a portion of the third signal terminals are electrically connected one-to-one with at least a portion of the first signal terminals inside the connection assembly. The plurality of third signal terminals are connected to the second lead portion. That is, the first signal terminals can transmit all electrical signals of the first electronic device, the second signal terminals transmit a portion of these electrical signals and transmit them to the second electronic device via the cable, and the third signal terminals transmit another portion of these electrical signals and transmit them to the second electronic device via the second connector portion.

[0024] In one exemplary embodiment, the first sub-connector is a high-speed connector, and the second sub-connector is a low-speed connector. In this way, high-speed signals between the first electronic device and the second electronic device are transmitted through the first sub-connector, and low-speed signals between the first electronic device and the second electronic device are transmitted through the second sub-connector.

[0025] As an exemplary embodiment, the second sub-connector further includes a second locking tooth located between the second lead portion and the second socket portion. The second locking tooth engages with the first half-shell and the second half-shell respectively, thereby achieving a stable connection between the second sub-connector and the first half-shell through the second locking tooth.

[0026] Secondly, an electronic device is also provided, including a frame, an array-type connection structure, a fan assembly, a first electronic device, and a second electronic device. The array-type connection structure is the same as described in the first aspect, and its support is connected to the frame. The array-type connection structure has all the beneficial effects of the array-type connection structure described in the first aspect, enabling both electrical connection between the first and second electronic devices and ventilation and heat dissipation between them. The fan assembly is connected to the frame, arranged opposite to the array-type connection structure, and located on the second side of the support. The fan assembly generates airflow between the first and second sides of the support, flowing from the first to the second side to remove heat, thus achieving a heat dissipation effect. Multiple first electronic devices are located on the first side of the support and are electrically connected to the connector interface of the connection assembly. Multiple second electronic devices are located on the second side of the support and are electrically connected to the cable.

[0027] The electronic device provided in this application embodiment has at least the following effects:

[0028] After the first and second electronic devices are connected together via an array-like connection structure, they can operate normally. During this process, the fan assembly generates airflow that flows between adjacent connecting components through the heat dissipation holes, passing from the first side of the bracket to the second side, thus carrying away the heat generated by the first and second electronic devices during operation and achieving heat dissipation. In other words, the airflow is not separated by the bracket, allowing it to effectively dissipate heat from the first electronic device located on the first side of the bracket and the second electronic device located on the second side, ensuring the effective heat dissipation of the electronic device. Attached Figure Description

[0029] Figure 1 This is a schematic diagram illustrating the use of the array-type connection structure provided in the embodiments of this application;

[0030] Figure 2 Provided for the embodiments of this application Figure 1 View from direction A;

[0031] Figure 3 This is a schematic diagram of an array-type connection structure provided in an embodiment of this application;

[0032] Figure 4 This is a schematic diagram of another array-type connection structure provided in an embodiment of this application;

[0033] Figure 5 An exploded view of the connection component provided in the embodiments of this application;

[0034] Figure 6 An exploded view of the connection component provided in the embodiments of this application;

[0035] Figure 7 This is a schematic diagram of the structure of the second sub-connector provided in an embodiment of this application;

[0036] Figure 8 An electronic device provided in the embodiments of this application.

[0037] Legend:

[0038] 1. Bracket; 11. Heat dissipation through hole; 111. First sub-through hole; 112. Second sub-through hole; 12. Outer frame; 121. First side; 1211. First mounting hole; 1212. Third mounting hole; 1213. Lamp hole; 122. Second side; 123. Third side; 124. Fourth side; 13. Inner strip; 131. Second mounting hole; 14. First reinforcing rib; 15. Second reinforcing rib;

[0039] 2. Connecting assembly; 2a. First signal terminal; 2b. Second signal terminal; 2c. Third signal terminal; 21. Housing; 21a. Notch; 211. First half-shell; 212. Second half-shell; 22. Connector; 221. First sub-connector; 2211. First lead wire portion; 2212. First socket portion; 2213. First locking tooth; 2214. Positioning pin; 222. Second sub-connector; 2221. Second lead wire portion; 2222. Second socket portion; 2223. Second locking tooth;

[0040] 3. Cables;

[0041] 100. Frame; 200. Array connection structure; 300. Fan assembly; 500. First electronic component; 600. Second electronic component; 610. Motherboard; 620. Socket. Detailed Implementation

[0042] The terminology used in the implementation section of this application is for the purpose of explaining the embodiments of this application only, and is not intended to limit this application.

[0043] Within a data center, there are numerous servers housed in server racks. A server primarily consists of a chassis and various electronic components. The chassis provides the mounting base for these components, which are then installed within the racks and electrically interconnected as needed to perform their respective functions, thus forming the server assembly.

[0044] In related technologies, electronic components mainly include chipsets and multiple hard drives arranged in an array. To organize the arrangement of electronic components, the chipset is not directly electrically connected to each hard drive via cables. Instead, a backplane, which is a printed circuit board (PCB), is typically placed inside a frame. Connectors are located on the first and second sides of the backplane. The chipset is placed inside the frame on the first side of the backplane, and the hard drives are placed inside the frame on the second side of the backplane. The chipset is connected to the connector on the first side of the backplane via cables, and the hard drives are plugged into the connector on the second side of the backplane, thus enabling communication between the chipset and the backplane through the backplane.

[0045] However, because there is a backplate between the chipset and the hard drive, the backplate can block the airflow between the chipset and the hard drive, which greatly reduces the heat dissipation effect.

[0046] To address this technical problem, embodiments of this application disclose an array-type connection structure. Figure 1 This is a schematic diagram illustrating the use of this array-type connection structure, combined with... Figure 1 The array-type connection structure includes a bracket 1 and multiple connection components 2. The bracket 1 is used to fix multiple connection components 2 arranged at intervals along the length direction of the bracket 1, and no signal traces are provided in the bracket 1.

[0047] Figure 2 for Figure 1 The view from direction A shows the left side of bracket 1 as its second side and the right side of bracket 1 as its first side. (Combined) Figure 2 Each connecting component 2 extends through the bracket 1. Each connecting component 2 has a connector interface on its first side, including multiple first signal terminals 2a, for connection to a first electronic device 500 located on the first side of the bracket 1. Multiple cables 3 are directly connected to the second side of each connecting component 2, each cable 3 corresponding one-to-one with multiple second signal terminals 2b of the connecting component 2, for connection to a second electronic device 600 located on the second side of the bracket 1; at least a portion of the multiple second signal terminals 2b are electrically connected to at least a portion of the multiple first signal terminals 2a within the connecting component 2. The bracket 1 has heat dissipation holes 11, at least partially located between two adjacent connecting components 2.

[0048] The array-type connection structure provided in this application embodiment has at least the following effects:

[0049] After connecting the first electronic device 500 located on the first side of the bracket 1 and the second electronic device 600 located on the second side of the bracket 1 using the connecting component 2 and the cable, the signal loss is very small because no transition is required between the first electronic device 500 and the second electronic device 600. During the operation of the first electronic device 500 and the second electronic device 600, airflow can pass through the heat dissipation holes 11 through the bracket 1 and circulate between the first and second sides of the bracket 1 to carry away the heat generated by the first electronic device 500 and the second electronic device 600 during operation, thereby achieving heat dissipation for the first electronic device 500 and the second electronic device 600. In other words, the airflow is not blocked by the bracket 1, allowing the first electronic device 500 and the second electronic device 600 to receive sufficient heat dissipation.

[0050] In the above implementation, since no signal traces are installed in the bracket 1, the bracket 1 only serves to provide a mounting base for the connecting component 2. For example, the bracket 1 is a metal profile, which has higher strength compared to the backplate (printed circuit board) in related technologies. This allows for the arrangement of heat dissipation through-holes 11 with a larger flow area on the bracket 1, thereby improving heat dissipation performance.

[0051] Furthermore, multiple cables 3 are directly connected to the second side of the connecting component 2, meaning that the cables 3 are directly electrically connected to the second signal terminal 2b, for example, by soldering them together. In other words, there are no other connectors or similar components between the cables 3 and the second signal terminal 2b. This minimizes signal loss during transmission.

[0052] It should be noted that the array-type connection structure provided in this application embodiment can electrically connect and dissipate heat to the first electronic device 500 and the second electronic device 600 located on both sides of the bracket 1. In this embodiment, the first electronic device 500 is a hard disk, and the second electronic device 600 is a chipset. Of course, in other embodiments, the types of the first electronic device 500 and the second electronic device 600 are not limited to the chipset and hard disk exemplified above, but can also be other electronic devices, such as memory, network cards, etc., and this application does not impose any restrictions on this.

[0053] As mentioned above, the good heat dissipation of the array-type connection structure is achieved through the heat dissipation holes 11 on the bracket 1, so the bracket 1 is a relatively critical component. Therefore, the bracket 1 will be further introduced below.

[0054] Figure 3 This is a schematic diagram of an array-type connection structure provided in an embodiment of this application. Since the connection methods between each connecting component 2 and the support 1 are the same, in order to highlight the structure of the connecting component 2 and the support 1, Figure 3The first electronic component 500 and the second electronic component 600 are omitted, and only a connecting component 2 is retained.

[0055] See Figure 3 In this embodiment, the bracket 1 includes an outer frame 12 and an inner strip 13. The outer frame 12 includes a first side 121, a second side 122, a third side 123, and a fourth side 124 connected in sequence. The first side 121 and the third side 123 are opposite to each other and extend along the length direction of the outer frame 12. The second side 122 and the fourth side 124 are opposite to each other. The connecting component 2 is connected to the first side 121. Figure 3 In this design, the first side 121 of the outer frame 12 refers to the upper side, the second side 122 refers to the left side, the third side 123 refers to the lower side, and the fourth side 124 refers to the right side. The inner strip 13 is located between the first side 121 and the third side 123, and is away from the first side 121 of the outer frame 12. The inner strip 13 extends along the length of the outer frame 12, with its first end connected to the second side 122 and its second end connected to the fourth side 124. The connecting component 2 is connected to the inner strip 13. This design allows the connecting component 2 to be connected to both the first side 121 and the inner strip 13 of the outer frame 12 simultaneously, thus increasing the connection base of the connecting component 2 on the support 1 and enabling a more stable connection between the connecting component 2 and the support 1, thereby ensuring the reliability of the array-type connection structure.

[0056] The heat dissipation hole 11 is located at least once in the region between the inner plate 13 and the first side 121, or in the region between the inner plate 13 and the third side 123. This design ensures that at least one side of the inner plate 13 has a heat dissipation hole 11, thereby guaranteeing the area of ​​the heat dissipation hole 11 for overcurrent.

[0057] In this embodiment, the heat dissipation through-hole 11 includes a first sub-through-hole 111 and a second sub-through-hole 112. The first sub-through-hole 111 is located between one side of the inner plate slat 13 along its length and the first side 121 of the outer plate frame 12. The second sub-through-hole 112 is located between the other side of the inner plate slat 13 along its length and the third side 123 of the outer plate frame 12. This design ensures that the first sub-through-hole 111 and the second sub-through-hole 112 are located on opposite sides of the inner plate slat 13, thus guaranteeing the flow area of ​​the bracket 1. This facilitates airflow between the first and second sides of the bracket 1, thereby improving the heat dissipation performance of the array-type connection structure.

[0058] In the above implementation, the outer frame 12 and the inner strip 13 provide a stable mounting base for the connecting assembly 2. The heat dissipation through-hole 11 is divided into a first sub-through-hole 111 and a second sub-through-hole 112, and these are arranged on opposite sides of the inner strip 13. This maximizes the utilization of the area between the outer frame 12 and the inner strip 13, ensuring sufficient flow area for the heat dissipation through-hole 11. It is easy to understand that since the inner strip 13 and the outer frame 12 are located in the same plane, with a fixed area of ​​the outer frame 12, a larger area of ​​the inner strip 13 results in better connection stability for the connecting assembly 2, but also occupies a larger area of ​​the heat dissipation through-hole 11. Therefore, to ensure the connection stability between the bracket 1 and the connecting assembly 2, the area of ​​the inner strip 13 should be increased accordingly; conversely, to ensure sufficient flow area for the heat dissipation through-hole 11, the area of ​​the inner strip 13 should be decreased accordingly. This application does not impose any restrictions on this.

[0059] For example, the first side 121, the third side 123 of the outer frame 12 and the inner strip 13 are parallel to each other, that is, they all extend along the length direction of the bracket 1. This design facilitates the sequential and spaced arrangement of the connecting components 2 along the length direction of the bracket 1. Of course, the first side 121, the third side 123 of the outer frame 12 and the inner strip 13 can also have an angle, which can be adjusted according to actual needs, and this disclosure does not limit this.

[0060] For example, the connecting component 2 is a long strip structure. One end of the connecting component 2 in the length direction is connected to the first side 121 of the outer frame 12, and the other end of the connecting component 2 in the length direction is connected to the inner strip 13. In other embodiments, the connecting component 2 can also be a square structure or a circular structure, etc. If the connecting component 2 is a square structure, then the opposite two sides of the connecting component 2 are connected to the first side 121 of the outer frame 12 and the inner strip 13, respectively. If the connecting component 2 is a circular structure, then the opposite two ends of the connecting component 2 in the radial direction are connected to the first side 121 of the outer frame 12 and the inner strip 13, respectively. This application does not impose any limitations on this.

[0061] As mentioned above, the outer frame 12 and inner strip 13 provide the mounting base for the connecting assembly 2. To achieve the connection of the connecting assembly 2 on the outer frame 12 and inner strip 13, please refer to... Figure 3 In this embodiment, the first side 121 of the outer frame 12 has a plurality of first mounting holes 1211, and the first mounting holes 1211 are arranged sequentially at intervals along the length of the outer frame 12. This design facilitates the installation of the connecting component 2 on the first side 121 of the outer frame 12 through the first mounting holes 1211, so that the connecting component 2 can be easily and securely connected to the outer frame 12.

[0062] The inner slat 13 has a plurality of second mounting holes 131, which are arranged at intervals along the length of the inner slat 13. Based on the same principle as the first mounting hole 1211, this design facilitates the installation of the connecting component 2 on the inner slat 13 through the second mounting holes 131, so that the connecting component 2 can be easily and securely connected to the inner slat 13.

[0063] In the above implementation, since the connecting component 2 is connected to the first side 121 of the outer frame 12 and the inner strip 13 respectively, and the inner strip 13 is far away from the first side 121 of the outer frame 12, the connecting component 2 can be stably installed on the bracket 1 by using the first side 121 of the outer frame 12 and the inner strip 13 as the installation base.

[0064] For example, the first mounting hole 1211 and the second mounting hole 131 can be used to receive screws. In this case, two matching screw holes are correspondingly provided on the outer wall of the connecting assembly 2. When installing the connecting assembly 2 onto the bracket 1, one screw hole on the connecting assembly 2 is aligned with the first mounting hole 1211, and the other screw hole is aligned with the second mounting hole 131. After alignment, two screws are passed through the first mounting hole 1211 and the second mounting hole 131 respectively, so that the two screws are screwed into the corresponding screw holes, thereby achieving a stable connection of the connecting assembly 2 on the bracket 1 by screws.

[0065] Exemplarily, in other embodiments, the first mounting hole 1211 and the second mounting hole 131 can also be used to accommodate locking pins. In this case, two matching locking pins are correspondingly provided on the outer wall of the connecting component 2. When the connecting component 2 is installed on the bracket 1, one locking pin on the connecting component 2 is inserted into the first mounting hole 1211, and the other locking pin is inserted into the second mounting hole 131, thereby achieving a stable connection of the connecting component 2 on the bracket 1 through the cooperation of the locking pins, the first mounting hole 1211, and the second mounting hole 131.

[0066] It should be noted that the quantity correspondence between the connecting component 2 and the first mounting hole 1211 and the second mounting hole 131 can be other than the one-to-one correspondence mentioned above. For example, one connecting component 2 may correspond to two first mounting holes 1211 and two second mounting holes 131. This application does not limit this.

[0067] In this embodiment, a plurality of lamp holes 1213 are provided on the first side 121 of the outer frame 12, and the lamp holes 1213 are arranged sequentially at intervals along the length of the outer frame 12. The array-type connection structure also includes indicator lights, which are snapped into the lamp holes 1213 and electrically connected to the connection component 2 to display the working status of the connection component 2.

[0068] In other embodiments, the position of the lamp hole 1213 can be adjusted according to actual needs, such as being located on the second side 122 of the outer frame 12, etc., and this application does not limit it in this regard.

[0069] For example, the indicator light is a light-emitting diode.

[0070] Because the inner plate slat 13 is located inside the outer plate frame 12, and has heat dissipation holes 11 on both sides, and is only connected to the outer plate frame 12 at both ends, there is a certain potential for connection stability. To solve this problem, see [reference needed]. Figure 3 In this embodiment, the bracket 1 further includes a first reinforcing rib 14 and a second reinforcing rib 15. The first reinforcing rib 14 is connected between one side of the inner strip 13 along its length and the first side 121, and the second reinforcing rib 15 is connected between the other side of the inner strip 13 along its length and the third side 123.

[0071] The first reinforcing rib 14 and the second reinforcing rib 15 are located on opposite sides of the inner strip 13, respectively. The first reinforcing rib 14 and the second reinforcing rib 15 can reinforce the opposite sides of the inner strip 13, thereby making the inner strip 13 firmly connected to the outer frame 12, and thus improving the connection stability of the connecting assembly 2 on the bracket 1.

[0072] For example, the first reinforcing rib 14 and the second reinforcing rib 15 are perpendicular to the inner slat 13 to facilitate the arrangement of the connecting assembly 2 and to avoid mutual interference between the first reinforcing rib 14 and the second reinforcing rib 15 and the connecting assembly 2. It is easy to understand that if the first side 121, the third side 123 of the outer frame 12 and the inner slat 13 are parallel to each other, then the first reinforcing rib 14 and the second reinforcing rib 15 are perpendicular to the first side 121, the third side 123 and the inner slat 13 of the outer frame 12, respectively.

[0073] For example, the outer frame 12, inner strip 13, first reinforcing rib 14 and second reinforcing rib 15 are integral structural components. The three can be manufactured based on metal plates by stamping and forming. This not only improves the manufacturing efficiency of the bracket 1 and reduces the manufacturing cost of the bracket 1, but also ensures the structural integrity of the bracket 1, thereby improving the structural strength.

[0074] Figure 4 This is a schematic diagram of another array-type connection structure provided in an embodiment of this application. The connection component 2 of this array-type connection structure and... Figure 3 The connecting component 2 of the array-type connection structure shown is the same; the main difference lies in the bracket 1. Based on... Figure 3 For the same reason, Figure 4 The first electronic component 500 and the second electronic component 600 are omitted, and only a connecting component 2 is retained.

[0075] See Figure 4 In this embodiment, the bracket 1 includes an outer frame 12, which includes a first side 121, a second side 122, a third side 123, and a fourth side 124 connected in sequence. The first side 121 and the third side 123 are opposite to each other and extend along the length of the outer frame 12, while the second side 122 and the fourth side 124 are opposite to each other. Figure 4 In this design, the first side 121 of the outer frame 12 refers to the upper side, the second side 122 refers to the left side, the third side 123 refers to the lower side, and the fourth side 124 refers to the right side. The connecting assembly 2 is connected to the first side 121. A heat dissipation hole 11 is located between the first side 121, the second side 122, the third side 123, and the fourth side 124. The heat dissipation hole 11 is elongated, and its length is parallel to that of the outer frame 12. This design eliminates the need for the inner strip 13, the first reinforcing rib 14, and the second reinforcing rib 15, further increasing the flow area of ​​the heat dissipation hole 11. This facilitates airflow between the first and second sides of the support 1, thereby improving the heat dissipation performance of the array-type connection structure.

[0076] In the above implementation, the heat dissipation through hole 11 is designed as a whole through hole. The heat dissipation through hole 11 is completely arranged inside the outer plate frame 12. Except for the connecting component 2, it will not be blocked by other components, thus ensuring the maximum design of the flow area of ​​the heat dissipation through hole 11.

[0077] For example, the first side 121 and the third side 123 of the outer frame 12 are parallel to each other, that is, they both extend along the length direction of the bracket 1. This design facilitates the sequential and spaced arrangement of the connecting components 2 along the length direction of the bracket 1. Of course, the first side 121 and the third side 123 of the outer frame 12 can also have an angle, which can be adjusted according to actual needs, and this disclosure does not limit this.

[0078] As mentioned above, the outer frame 12 provides the mounting base for the connecting component 2. To achieve the connection of the connecting component 2 on the outer frame 12, please refer to... Figure 4 In this embodiment, the first side 121 of the outer frame 12 has third mounting holes 1212, and the third mounting holes 1212 are arranged sequentially at intervals along the length of the outer frame 12. This design facilitates the installation of the connecting component 2 on the first side 121 of the outer frame 12 through the third mounting holes 1212, allowing the connecting component 2 to be easily and securely connected to the outer frame 12. Furthermore, since the inner strip 13 is omitted, only the third mounting holes 1212 need to be provided on the first side 121 of the outer frame 12, saving materials and contributing to cost control.

[0079] In the above implementation, the way the connecting component 2 is installed through the third mounting hole 1212 is the same as that of the first mounting hole 1211 and the second mounting hole 131 mentioned above, and will not be repeated here.

[0080] It should be noted that since only the first side 121 of the outer frame 12 is connected to the connecting component 2, appropriately increasing the width of the first side 121 of the outer frame 12 can be more conducive to the stable installation of the connecting component 2 on the bracket 1.

[0081] In addition, the quantity correspondence between the connecting component 2 and the third mounting hole 1212 can be other than the one-to-one correspondence mentioned above, such as one connecting component 2 corresponding to two third mounting holes 1212, etc. This application does not limit this.

[0082] For example, to facilitate the installation of the connecting component 2 on the bracket 1, the first mounting hole 1211, the second mounting hole 131, and the third mounting hole 1212 are elongated, slotted holes, allowing the connecting component 2 some room for adaptive adjustment during installation on the bracket 1. It is easy to understand that if there is a dimensional deviation in the bracket 1 or the connecting component 2, the relative position of the connecting component 2 on the bracket 1 can be finely adjusted through the elongated, slotted holes.

[0083] As can be seen from the foregoing, the embodiments of this application provide two types of brackets 1, Figure 3 The bracket 1 shown has strong structural strength and can more stably support the connecting component 2. Figure 4 The bracket 1 shown has a larger heat dissipation hole 11, which has a larger flow area and thus provides better heat dissipation. In other words, both types of brackets 1 enable the array connection structure to have heat dissipation functionality. Figure 3 The bracket 1 shown provides a more secure mounting for the connecting component 2. Figure 4 The bracket 1 shown can better facilitate airflow.

[0084] In this embodiment, the orthographic projection of the connecting component 2 on the bracket 1 is at least partially located within the heat dissipation hole 11. This design ensures that the airflow can simultaneously flow through the connecting component 2 while passing through the heat dissipation hole 11, thereby enabling the airflow to dissipate heat not only for the first electronic device 500 and the second electronic device 600, but also for the connecting component 2, further improving the heat dissipation performance of the array-type connecting structure.

[0085] In other embodiments, there is a gap between the connecting component 2 and the edge of the adjacent heat dissipation hole 11. That is, the connecting component 2 and the heat dissipation hole 11 are spaced apart from each other, and the connecting component 2 does not block the heat dissipation hole 11. This design can ensure the flow area of ​​the heat dissipation hole 11, thereby ensuring that the airflow can fully dissipate heat from the first electronic device 500 and the second electronic device 600.

[0086] The previous section mainly introduced bracket 1; the following section will introduce connecting component 2.

[0087] See also Figure 4 In this embodiment, the connecting component 2 includes a housing 21 and a connector 22. The housing 21 is located on the second side of the bracket 1 and is connected to the bracket 1 to achieve a connection and fixation between the connecting component 2 and the bracket 1.

[0088] The second part of connector 22 is inserted into housing 21, and multiple second signal terminals 2b are located on the second part of connector 22 for electrical connection with the second electronic device 600 via cable 3. Thus, connector 22 uses housing 21 as its mounting base. Furthermore, since the second part of connector 22 is located on the second side of bracket 1, this part of connector 22 can be easily electrically connected to the second electronic device 600 via cable 3. The first part of connector 22 is located outside housing 21 and on the first side of bracket 1, and multiple first signal terminals 2a are located on the first part of connector 22 for electrical connection with the first electronic device 500 via connector 22 interface. This design allows the first part of connector 22 to be easily connected to the first electronic device 500.

[0089] In the above implementation, the housing 21 provides a mounting base for the connector 22, so that the two parts of the connector 22 are located on the first side and the second side of the bracket 1 respectively, thereby enabling the first electronic device 500 and the second electronic device 600 to be conveniently connected through the connector 22 respectively.

[0090] For example, when the first electronic device 500 is a hard disk, the connector 22 is an SFF-8639 hard disk connector 22. When the first electronic device 500 is another electronic device, the type of connector 22 changes accordingly. For example, when the first electronic device 500 is memory, the connector 22 is a connector 22 adapted for memory insertion.

[0091] For example, the housing 21 is an elongated structural member that extends along the length direction perpendicular to the bracket 1. When the bracket 1 includes the inner plate 13, one end of the housing 21 is connected to the first side 121 of the outer frame 12, and the other end of the housing 21 is connected to the inner plate 13. When the bracket 1 does not include the inner plate 13, one end of the housing 21 is connected to the first side 121 of the outer frame 12, and the other end of the housing 21 is suspended or connected to the third side 123 of the outer frame 12. Furthermore, screw holes, locking pins, and other components for engaging with the first mounting hole 1211, the second mounting hole 131, and the third mounting hole 1212 are provided on the housing 21.

[0092] Optionally, the outer wall of the housing 21 has a notch 21a, the recess direction of which is the same as the arrangement direction of each connecting component 2. This design reduces the obstruction of the heat dissipation holes 11 by the housing 21, ensuring the flow area of ​​the heat dissipation holes 11, thereby improving the heat dissipation effect of the array-type connection structure.

[0093] Of course, providing a notch 21a on the housing 21 will occupy the installation space of the connector 22 within the housing 21. Therefore, in other embodiments, if a larger installation space is required for the connector 22, the notch 21a may not be provided. This application does not impose any limitations on this.

[0094] Furthermore, the shape of the notch 21a can be adjusted according to actual needs, such as square, elliptical, etc., and this application does not impose any restrictions on it.

[0095] Figure 5 An exploded view of connecting component 2, combined with Figure 5 In this embodiment, the housing 21 includes a first half-shell 211 and a second half-shell 212. The first half-shell 211 is connected to the bracket 1, thereby realizing the connection between the housing 21 and the bracket 1. The second half-shell 212 is detachably connected to the first half-shell 211, and there is a gap 'a' between the second half-shell 212 and the first half-shell 211 for accommodating the connector 22, thereby enabling a secure installation of the connector 22 through the first half-shell 211 and the second half-shell 212.

[0096] In the above implementation, the first half-shell 211 and the second half-shell 212 are detachable from each other. During assembly, the connector 22 is placed between the first half-shell 211 and the second half-shell 212, and the first half-shell 211 and the second half-shell 212 are connected together to form a gap a that can accommodate the connector 22, so that the connector 22 can be securely clamped between the first half-shell 211 and the second half-shell 212. Then, the first half-shell 211 is connected to the bracket 1, thereby realizing the overall installation of the connecting assembly 2.

[0097] For example, the first half-shell 211 and the second half-shell 212 are also long strip-shaped structural members. The first half-shell 211 and the second half-shell 212 are arranged side by side. One end of the first half-shell 211 is connected to one end of the second half-shell 212 by screws, and the other end of the first half-shell 211 is connected to the other end of the second half-shell 212 by screws, so as to realize the detachable connection between the first half-shell 211 and the second half-shell 212.

[0098] In other embodiments, for example, the housing 21 is a one-piece structure, in which case the housing 21 is provided with a socket into which the connector 22 is inserted. This design allows the housing 21 to have higher structural strength, thereby improving the reliability of the connection assembly 2.

[0099] See also Figure 5 In this embodiment, connector 22 includes a first sub-connector 221.

[0100] The first sub-connector 221 includes a first lead portion 2211 and a first socket portion 2212. The first lead portion 2211 is located within the gap a, and a plurality of second signal terminals 2b are located in the first lead portion 2211. The first socket portion 2212 extends out of the gap a and is located on the second side of the bracket 1. A plurality of first signal terminals 2a are located in the first socket portion 2212. The first socket portion 2212 is used to connect to the first electronic device 500.

[0101] With this design, the first signal terminal 2a is located in the first socket portion 2212. By inserting the first electronic device 500 into the first socket portion 2212, an electrical connection between the first electronic device 500 and the first signal terminal 2a can be achieved. The second signal terminal 2b is located in the first lead portion 2211. Since the second signal terminal 2b is electrically connected to both the first signal terminal 2a and the cable 3, an electrical connection between the cable 3 and the first electronic device 500 is achieved. After the cable 3 and the second electronic device 600 are electrically connected, an electrical connection between the second electronic device 600 and the first electronic device 500 can be achieved.

[0102] See also Figure 5 In this embodiment, the first sub-connector 221 further includes a first locking tooth 2213, which is located between the first lead portion 2211 and the first socket portion 2212. The first locking tooth 2213 engages with the first half-shell 211 and the second half-shell 212 respectively, thereby achieving a stable connection between the first sub-connector 221 and the first half-shell 212 through the first locking tooth 2213.

[0103] For example, the first locking tooth 2213 includes two sets of protruding ridges, which are located on the side of the first sub-connector 221 facing the first half-shell 211 and the side facing the second half-shell 212, respectively. Each set of protruding ridges includes two parallel protruding ridges. The first half-shell 211 and the second half-shell 212 are each provided with two parallel protruding ridges. The four corresponding protruding ridges are staggered and engaged together to achieve the positioning of the first sub-connector 221 between the first half-shell 211 and the second half-shell 212.

[0104] In the above implementation, the first sub-connector 221 and the housing 21 are positioned by the first locking tooth 2213. Since the housing 21 and the bracket 1 are positioned together, the first sub-connector 221 and the bracket 1 can be positioned together, which facilitates the insertion of the first electronic device 500 and the first sub-connector 221.

[0105] However, since the positioning and installation between connector 22 and bracket 1 are indirectly achieved through housing 21, the installation tolerance between connector 22 and housing 21, and the installation tolerance between housing 21 and bracket 1, will affect the positioning accuracy between connector 22 and bracket 1. To solve this technical problem, for example, the first sub-connector 221 further includes a positioning pin 2214. The positioning pin 2214 is located in the first socket portion 2212. One end of the positioning pin 2214 is connected to the first socket portion 2212, and the other end of the positioning pin 2214 extends away from the first lead portion 2211 and is inserted into bracket 1. This design allows the first sub-connector 221 to achieve direct positioning with bracket 1 through the positioning pin 2214, ensuring the installation accuracy between the first sub-connector 221 and bracket 1, thereby facilitating the insertion between the first electronic device 500 and the first sub-connector 221.

[0106] For example, the positioning pin 2214 is located at the top or bottom of the first socket portion 2212. If the first socket portion 2212 has two positioning pins 2214, then the two positioning pins 2214 are located at the top and bottom of the first socket portion 2212, respectively. This design enables a more stable positioning and installation between the first sub-connector 221 and the bracket 1.

[0107] Of course, in order to match the positioning pin 2214, the bracket 1 has matching positioning holes, which correspond one-to-one with the positioning pin 2214.

[0108] In this embodiment, connector 22 further includes a second sub-connector 222.

[0109] The second sub-connector 222 is spaced apart from the first sub-connector 22. The second sub-connector 222 includes a second lead portion 2221 and a second socket portion 2222. The second lead portion 2221 is located in the gap a and is electrically connected to the first lead portion 2211. The second socket portion 2222 extends out of the gap a and is located on the second side of the bracket 1. The second socket portion 2222 is used to connect to the second electronic device 600.

[0110] Since the second lead portion 2221 is electrically connected to the first lead portion 2211, the second lead portion 2221 can lead part of the signal from the first signal terminal 2a to the second socket portion 2222, and then transmit it to the second electronic device 600 through the second socket portion 2222. This makes the way the connecting assembly 2 connects the first electronic device 500 and the second electronic device 600 more diverse, which is beneficial for the overall wiring of the array-type connection structure.

[0111] In this embodiment, the second side of the connecting component 2 also has a plurality of third signal terminals 2c. The plurality of third signal terminals 2c are located in the first lead portion 2211, and at least a portion of the third signal terminals 2c are electrically connected to at least a portion of the first signal terminals 2a in a one-to-one correspondence inside the connecting component 2. The plurality of third signal terminals 2c are connected to the second lead portion 2221.

[0112] In other words, the first signal terminal 2a can transmit all the electrical signals of the first electronic device 500, the second signal terminal 2b transmits a portion of the electrical signals and transmits them to the second electronic device 600 through the cable 3, and the third signal terminal 2c transmits another portion of the electrical signals and transmits them to the second electronic device 600 through the second socket 2222.

[0113] For example, the first sub-connector 221 is a high-speed connector 22, and the first lead portion 2211 and the first socket portion 2212 are an integral structural component, interconnected. The second sub-connector 222 is a low-speed connector 22, and the second lead portion 2221 and the second socket portion 2222 are interconnected. The first socket portion 2212 is connected to the first electronic device 500 (hard disk) for transmitting data signals from the first electronic device 500. The second socket portion 2222 is connected to the second electronic device 600 (chipset) for transmitting current and control signals from the second electronic device 600. For example, the power supply current to power the hard disk and indicator lights, and the chipset control signals to control the hard disk and indicator lights. The first socket portion 2212 and the second socket portion 2222 are interconnected through a lead between the first lead portion 2211 and the second lead portion 2221.

[0114] Optionally, the second electronic device 600 is connected to the motherboard 610, which is a printed circuit board (PCB). The motherboard 610 has a socket 620, which is soldered onto the motherboard 610 and electrically connected to the second electronic device 600 through internal traces. Exemplarily, the socket 620 is a female connector, and the second plug portion 2222 is a male connector. The second plug portion 2222 is plugged into the socket 620, thereby achieving an electrical connection between the second plug portion 2222 and the second electronic device 600.

[0115] In this embodiment, the second sub-connector 222 further includes a second locking tooth 2223, which is located between the second lead portion 2221 and the second socket portion 2222. The second locking tooth 2223 engages with the first half-shell 211 and the second half-shell 212 respectively, thereby achieving a stable connection between the second sub-connector 222 and the first half-shell 211 and the second half-shell 212 through the second locking tooth 2223.

[0116] For example, the second locking tooth 2223 includes an outer flange that is perpendicular to the extension direction of the second insertion portion 2222. Both the first and second locking housings are provided with corresponding inner flanges, the top surface of which abuts against the bottom surface of the outer flange to achieve positioning of the first sub-connector 221 between the first housing 21 and the second housing 21.

[0117] Figure 8 An electronic device provided in the embodiments of this application, combined with Figure 8 The electronic device includes a frame 100, an array connection structure 200, a fan assembly 300, a first electronic device 500, and a second electronic device 600.

[0118] Array-type connection structure 200 Figure 1-7 The array-type connection structure shown has a support 1 connected to the frame 100. The array-type connection structure 200 has... Figure 1-7 All the beneficial effects of the array-type connection structure shown are that it enables electrical connection between the first electronic device 500 and the second electronic device 600, and also improves the ventilation and heat dissipation of the first electronic device 500 and the second electronic device 600.

[0119] The fan assembly 300 is connected to the frame 100 and is arranged opposite to the array connection structure 200, with the fan assembly 300 located on the second side of the bracket 1. The fan assembly 300 can generate airflow between the first and second sides of the bracket 1, with the airflow flowing from the first side to the second side of the bracket 1 to carry away heat, thereby achieving a heat dissipation effect.

[0120] The first electronic device 500 is located on the first side of the bracket 1 and is directly electrically connected to the connector interface. The second electronic device 600 is located on the second side of the bracket 1 and is electrically connected to the connecting assembly 2 via the cable 3. With this design, the airflow generated by the fan assembly 300 can carry away the heat generated by the first electronic device 500 and the second electronic device 600, thereby achieving heat dissipation for the first electronic device 500 and the second electronic device 600.

[0121] The electronic device provided in this application embodiment has at least the following effects:

[0122] After the first electronic device 500 and the second electronic device 600 are connected together by the array connection structure 200, the first electronic device 500 and the second electronic device 600 can operate normally. During this process, the fan assembly 300 generates airflow, which can flow between two adjacent connecting components 2 through the heat dissipation holes 11, that is, from the first side of the bracket 1 through the second side of the bracket 1, to carry away the heat generated by the first electronic device 500 and the second electronic device 600 during operation, thereby achieving heat dissipation for the first electronic device 500 and the second electronic device 600. In other words, the airflow is not separated by the bracket 1, allowing the airflow to fully dissipate heat from the first electronic device 500 located on the first side of the bracket 1 and the second electronic device 600 located on the second side of the bracket 1, ensuring the heat dissipation effect of the electronic equipment.

[0123] Since cable 3 is located on the second side of bracket 1, it may obstruct airflow. To address this issue, in this embodiment, after connecting to the connecting component 2, cable 3 is bent downwards towards the bracket 1. Then, along the length of bracket 1, a portion extends towards one end of bracket 1, and another portion extends towards the other end. After reaching the inner wall of the frame 100, it is bent again and extends away from bracket 1 along the inner wall of frame 100 to connect to the desired second electronic device 600. This design avoids the heat dissipation holes 11 on bracket 1, thereby preventing cable 3 from obstructing airflow.

[0124] In other embodiments, after being connected to the connecting component 2, the cable 3 is bent upwards towards the bracket 1. Then, along the length of the bracket 1, a portion extends towards one end of the bracket 1, and another portion extends towards the other end. After reaching the inner wall of the frame 100, it is bent again and extends downwards along the inner wall of the frame 100. After reaching the bottom of the frame 100, it extends away from the bracket 1 along the inner wall of the frame 100 to connect to the desired second electronic device 600. This design also avoids the heat dissipation holes 11 on the bracket 1, thereby preventing the cable 3 from obstructing airflow.

[0125] For example, cable 3 is a flat cable to facilitate bending and thus better cabling. The speed is selected according to actual needs, such as 25Gbps, 32Gbps, 56Gbps, etc., and this application does not limit it.

[0126] In this embodiment, the second electronic device 600 located on the second side of the bracket 1 is a chipset, such as a load balancer switch (LSW) chip, a central processing unit (CPU) chip, a graphics processing unit (GPU) chip, etc. The first electronic device 500 located on the first side of the bracket 1 is a hard drive, such as an NVMe (NVM Express) hard drive.

[0127] The above specific embodiments further illustrate the purpose, technical solution and beneficial effects of this application. It should be understood that the above are only specific embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solution of this application should be included within the scope of protection of this application.

Claims

1. An array connection structure, characterized by comprising: Includes a support (1) and multiple connecting components (2); The bracket (1) is used to fix the plurality of connecting components (2) arranged sequentially at intervals along the length direction of the bracket (1). No signal lines are provided in the bracket (1). The bracket (1) has heat dissipation holes (11). Each of the connecting components (2) extends through the bracket (1); Each of the connecting components (2) has a connector interface on its first side, the connector interface including a plurality of first signal terminals (2a) passing through the heat dissipation through-hole (11) for connection to a first electronic device (500) located on the first side of the bracket (1); Each of the connecting components (2) has a plurality of cables (3) directly connected to its second side. The plurality of cables (3) correspond one-to-one with a plurality of second signal terminals (2b) of the connecting component (2). The cables (3) are used to connect to a second electronic device (600) located on the second side of the bracket (1). At least a portion of the plurality of second signal terminals (2b) are electrically connected one-to-one with at least a portion of the plurality of first signal terminals (2a) inside the connecting component (2). The heat dissipation hole (11) is at least partially located between two adjacent connecting components (2), and the orthographic projection of the connecting component (2) on the bracket (1) is at least partially located within the heat dissipation hole (11).

2. The array-type connection structure according to claim 1, characterized in that, The bracket (1) includes an outer frame (12) and an inner strip (13); The outer frame (12) includes a first side (121), a second side (122), a third side (123) and a fourth side (124) connected in sequence. The first side (121) and the third side (123) are opposite to each other and extend along the length direction of the outer frame (12). The second side (122) and the fourth side (124) are opposite to each other. The connecting component (2) is connected to the first side (121). The inner strip (13) is located between the first side (121) and the third side (123) and is away from the first side (121). The inner strip (13) extends along the length direction of the outer frame (12). The first end of the inner strip (13) is connected to the second side (122), and the second end of the inner strip (13) is connected to the fourth side (124). The connecting component (2) is connected to the inner strip (13). The heat dissipation hole (11) is located in at least one of the regions between the inner plate strip (13) and the first side (121), or between the inner plate strip (13) and the third side (123).

3. The array-type connection structure according to claim 2, characterized in that, The heat dissipation through hole (11) includes a first sub-through hole (111) and a second sub-through hole (112); The first sub-through hole (111) is located between one side of the inner strip (13) along its length and the first side (121); The second sub-through hole (112) is located between the other side of the inner strip (13) along its length and the third side (123).

4. The array-type connection structure according to claim 2 or 3, characterized in that, The first side (121) has a plurality of first mounting holes (1211), and each of the first mounting holes (1211) is arranged sequentially at intervals along the length direction of the outer frame (12); The inner plate (13) has a plurality of second mounting holes (131), and each of the second mounting holes (131) is arranged sequentially at intervals along the length direction of the inner plate (13); The connecting component (2) is connected to the corresponding first mounting hole (1211) and second mounting hole (131) respectively.

5. The array-type connection structure according to any one of claims 2-4, characterized in that, The bracket (1) also includes a first reinforcing rib (14) and a second reinforcing rib (15); The first reinforcing rib (14) is connected between one side of the inner strip (13) along its length and the first side (121); The second reinforcing rib (15) is connected between the other side of the inner strip (13) along its length and the third side (123).

6. The array-type connection structure according to claim 1, characterized in that, The bracket (1) includes an outer frame (12), which includes a first side (121), a second side (122), a third side (123), and a fourth side (124) connected in sequence. The first side (121) and the third side (123) are opposite to each other and extend along the length of the outer frame (12). The second side (122) and the fourth side (124) are opposite to each other. The connecting component (2) is connected to the first side (121). The heat dissipation hole (11) is located between the first side (121), the second side (122), the third side (123) and the fourth side (124).

7. The array-type connection structure according to claim 6, characterized in that, The first side (121) has a third mounting hole (1212), and each of the third mounting holes (1212) is arranged at intervals along the length direction of the outer frame (12); The connecting component (2) is connected to the corresponding third mounting hole (1212).

8. The array-type connection structure according to any one of claims 1-7, characterized in that, The connection assembly (2) includes a housing (21) and a connector (22); The housing (21) is located on the second side of the bracket (1) and is connected to the bracket (1); The first part of the connector (22) is located outside the housing (21) and on the first side of the bracket (1). The plurality of first signal terminals (2a) are located in the first part of the connector (22). The second part of the connector (22) is inserted into the housing (21). The plurality of second signal terminals (2b) are located in the second part of the connector (22).

9. The array-type connection structure according to claim 8, characterized in that, The housing (21) includes a first half-shell (211) and a second half-shell (212); The first half-shell (211) is connected to the bracket (1); The second half-shell (212) is detachably connected to the first half-shell (211), and there is a gap (a) between the second half-shell (212) and the first half-shell (211) for accommodating the connector (22).

10. The array-type connection structure according to claim 9, characterized in that, The connector (22) includes a first sub-connector (221); The first sub-connector (221) includes a first lead portion (2211) and a first socket portion (2212). The first lead portion (2211) is located within the gap (a). The plurality of second signal terminals (2b) are located in the first lead portion (2211). The first socket portion (2212) extends out of the gap (a) and is located on the second side of the bracket (1). The plurality of first signal terminals (2a) are located in the first socket portion (2212). The first socket portion (2212) is used to connect to the first electronic device (500).

11. The array-type connection structure according to claim 10, characterized in that, The first sub-connector (221) also includes a first retaining tooth (2213); The first locking tooth (2213) is located between the first lead wire portion (2211) and the first insertion portion (2212), and the first locking tooth (2213) engages with the first half shell (211) and the second half shell (212) respectively.

12. The array-type connection structure according to claim 10 or 11, characterized in that, The first sub-connector (221) also includes a locating pin (2214); One end of the positioning pin (2214) is connected to the first insertion part (2212), and the other end of the positioning pin (2214) extends toward the bracket (1) and is inserted into the bracket (1).

13. The array-type connection structure according to any one of claims 10-12, characterized in that, The connector (22) also includes a second sub-connector (222); The second sub-connector (222) is spaced apart from the first sub-connector (221). The second sub-connector (222) includes a second lead portion (2221) and a second socket portion (2222). The second lead portion (2221) is located within the gap (a) and is electrically connected to the first lead portion (2211). The second socket portion (2222) extends out of the gap (a) and is located on the second side of the bracket (1). The second socket portion (2222) is used to connect to the second electronic device (600).

14. The array-type connection structure according to claim 13, characterized in that, The second side of the connection component (2) also has a plurality of third signal terminals (2c); The plurality of third signal terminals (2c) are located in the first lead portion (2211). At least a portion of the plurality of third signal terminals (2c) are electrically connected to at least a portion of the plurality of first signal terminals (2a) inside the connection assembly (2). The plurality of third signal terminals (2c) are connected to the second lead portion (2221).

15. The array-type connection structure according to claim 13 or 14, characterized in that, The first sub-connector (221) is a high-speed connector, and the second sub-connector (222) is a low-speed connector.

16. The array-type connection structure according to any one of claims 13-15, characterized in that, The second sub-connector (222) also includes a second retaining tooth (2223); The second locking tooth (2223) is located between the second lead portion (2221) and the second insertion portion (2222), and the second locking tooth (2223) engages with the first half shell (211) and the second half shell (212) respectively.

17. An electronic device, characterized in that, It includes a frame (100), an array connection structure (200), a fan assembly (300), a first electronic component (500), and a second electronic component (600); The array-type connection structure (200) is the array-type connection structure (200) according to any one of claims 1-16, and the support (1) of the array-type connection structure (200) is connected to the frame (100); The fan assembly (300) is connected to the frame (100), the fan assembly (300) is arranged opposite to the array connection structure (200), and the fan assembly (300) is located on the second side of the bracket (1); A plurality of the first electronic devices (500) are located on the first side of the bracket (1) and are electrically connected to the connector interface of the connecting assembly (2); Multiple second electronic devices (600) are located on the second side of the bracket (1) and are electrically connected to the cable (3).

Images